Machining head of laser machining device and laser machining apparatus

Abstract

To provide a machining head of a laser beam machining device and the laser beam machining device in which impact force hardly acts on a condenser lens and positional deviation hardly occurs even when the impact force acts on the machining head.SOLUTION: A machining head of a laser beam machining device includes a fixing holder 30 to which condenser lenses 33 and 34 for condensing a laser beam L on a workpiece are fixed, and a cover member 40 which is detachably attached to the fixing holder 30 by magnets 32 and 42 and protects the condenser lenses 33 and 34.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a processing head of a laser processing device and a laser processing device. [Background technology]

[0002] The laser processing device described in Patent Document 1 is disclosed as having a mechanism for protecting the processing head from impact. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 2916603 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the focusing lens of a laser processing device is an expensive component. Furthermore, since the laser processing device needs to focus the laser beam at a predetermined position on the workpiece to be processed, the focusing lens is precisely aligned. Therefore, if an impact is applied to the laser processing device, the focusing lens needs to be protected so that it does not become displaced and is less susceptible to the impact force. The laser processing device of Patent Document 1 has room for improvement in protecting the focusing lens.

[0005] Therefore, the present disclosure provides a processing head for a laser processing device and a laser processing device in which, even when an impact force acts on the processing head, the impact force is less likely to act on the focusing lens and positional displacement is less likely to occur. [Means for solving the problem]

[0006] A processing head of a laser processing apparatus according to one aspect of the present invention includes: a fixed holder to which a condenser lens for condensing the laser light onto the workpiece is fixed; and a cover member that is detachably attached to the fixed holder by a magnet and protects the condenser lens. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a processing head for a laser processing device and a laser processing device in which, even if an impact force acts on the processing head, the impact force is less likely to act on the focusing lens and positional displacement is less likely to occur. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram of a laser processing device according to this embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the processing head of the laser processing device according to this embodiment. [Figure 3] FIG. 3 is a schematic diagram showing the machining head when a workpiece collides with region H of the machining head from the direction H1 in FIG. [Figure 4] FIG. 4 is a schematic diagram showing the machining head when a workpiece collides with region H of the machining head from the direction H2 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] FIG. 1 is a schematic diagram of a laser processing apparatus 1 according to this embodiment. As shown in FIG. 1, the laser processing apparatus 1 is used in a mode in which a laser beam L is irradiated onto a workpiece W fixed to a stage 100. The stage 100 shown in FIG. 1 has a fixed stage 101 and a movable stage 102, and the movable stage 102 moves on the fixed stage 101 in the left-right and depth directions of the paper surface of FIG. 1, thereby moving the workpiece W to be processed. The laser processing apparatus 1 in this embodiment is able to irradiate the workpiece W with laser beam L and weld the workpiece W. It should be noted that the uses of the laser processing apparatus 1 according to the present disclosure are not limited to those described above. For example, the laser processing apparatus 1 according to the present disclosure may be used as a laser cutting machine that cuts the workpiece W, or as a coating stripping device that strips the surface coating of a coated wire.

[0010] The illustrated laser processing apparatus 1 emits laser light L downward. The laser processing apparatus 1 has an oscillator 10 and a processing head 20. The oscillator 10 oscillates the laser light L to be irradiated onto the workpiece W. The processing head 20 adjusts the focusing range of the laser light L oscillated by the oscillator 10 and can guide the laser light L to the workpiece W. In the following description, the emission direction of the laser light L may be referred to as the optical axis L1. Note that the laser processing apparatus 1 in this embodiment may have a mechanism for adjusting the irradiation direction of the laser light L, such as a galvano optical system, between the oscillator 10 and the processing head 20.

[0011] Next, the processing head 20 of the laser processing device 1 according to this embodiment will be described in detail with reference to Fig. 2. Fig. 2 is a cross-sectional view of the processing head 20 of the laser processing device 1 according to this embodiment.

[0012] As shown in FIG. 2, the processing head 20 has a fixed holder 30 and a cover member 40. The fixed holder 30 is fixed to the oscillator 10 and is a cylindrical member having a light guide path K therein through which the laser light L passes. A hollow space extending in the vertical direction is provided inside the fixed holder 30. This hollow space extending in the vertical direction constitutes the light guide path K. The light guide path K is provided continuously from the oscillator 10. The cover member 40 is provided below the fixed holder 30 and is a member attached in close contact with the fixed holder 30. The cover member 40 is configured to be detachable from the fixed holder 30.

[0013] The fixed holder 30 includes a holder body 31, a first magnet 32, a first condenser lens 33, a second condenser lens 34, and a protective window 36. The holder body 31 is a cylindrical member with a central axis extending in the vertical direction. The holder body 31 has a recess 31a that can be fitted with the cover member 40. The recess 31a is provided near the outer periphery of the lower surface of the holder body 31. The recess 31a is fitted with a protrusion 41a provided on the cover member 40 (described later) using a spigot structure, and is configured to be able to fix the fixed holder 30 and the cover member 40 together. A downwardly protruding mount portion 35 is provided on the lower surface of the holder body 31. The mount portion 35 is provided coaxially with the light guide path K. A thread groove is provided on the inner peripheral surface of the mount portion 35. The first magnet 32 ​​is provided on the lower surface of the holder main body 31. The first magnet 32 ​​is provided on the inner diameter side of the recess 31a. A plurality of first magnets 32 are provided in the circumferential direction of the cover member 40. The first condenser lens 33 and the second condenser lens 34 are fixed to the inner peripheral surface of the holder body 31. The first condenser lens 33 and the second condenser lens 34 condense the laser light L oscillated by the oscillator 10 to an arbitrary condensed beam diameter. The first condenser lens 33 and the second condenser lens 34 are provided coaxially. The protective window 36 is fixed by being screwed into a threaded groove on the outer peripheral surface of the mounting portion 35. The protective window 36 is provided below the second focusing lens 34 so as to cover the hole on the inner peripheral surface of the holder main body 31. The protective window 36 prevents dust from entering from the outside and from adhering to the second focusing lens 34.

[0014] The cover member 40 has a cover body 41, a second magnet 42, and a nozzle head 43. The cover body 41 is a cup-shaped member that opens upward. A protrusion 41a that can be fitted to the fixed holder 30 is provided on the upper surface of the cover body 41 that faces the lower surface of the fixed holder 30. The protrusion 41a is fitted into a recess 31a provided in the fixed holder 30 by a spigot structure. This allows the cover member 40 to be attached to the fixed holder 30 in a predetermined orientation. An inner wall portion 41b of the cup-shaped cover member 40 forms a gas chamber G between itself and the fixed holder 30. When the laser light L is irradiated, a non-volatile gas is introduced into the gas chamber G through an introduction path 44. A through-hole 45 that penetrates in the vertical direction is provided in the bottom of the cover main body 41. The through-hole 45 is provided coaxially with the light guide path K. The laser light L emitted from the oscillator 10 passes through this through-hole 45.

[0015] The second magnet 42 is embedded in the upper surface of the cover main body 41. The second magnet 42 is provided in a direction facing the fixed holder 30. A plurality of second magnets 42 are provided in the circumferential direction of the cover member 40. The second magnets 42 are provided so as to attract the first magnet 32 ​​to each other.

[0016] The nozzle head 43 is attached to a through-hole 45 of the cover body 41. The nozzle head 43 has a floating head 43a and a support portion 43b. The support portion 43b detachably supports the floating head 43a and is fixed to the cover body 41. The cylindrical support portion 43b is fixed to the through-hole 45 of the cover body 41. The position of the support portion 43b relative to the cover body 41 can be adjusted by a positioning mechanism (not shown). The inner surface of the support portion 43b is a conical surface whose diameter increases upward. The outer peripheral surface of the floating head 43a is a conical surface whose diameter decreases downward to correspond to the inner surface of the support portion 43. The floating head 43a is pressed downward by its own weight, and the outer peripheral surface of the floating head 43a comes into contact with the inner peripheral surface of the support portion 43b, so that the relative positions of the floating head 43a and the support portion 43b are stably maintained. During laser processing, the floating head 43a is pressed against the support portion 43b by the gas pressure in the gas chamber G. The floating head 43a is provided with an emission hole 43a1 that penetrates in the vertical direction. The emission hole 43a1 is provided so that the laser light L can pass through.

[0017] In this embodiment, the first magnet 32 ​​and the second magnet 42 are arranged so as to attract each other. Therefore, the fixed holder 30 and the cover member 40 are fixed to each other by the magnetic attraction force of the first magnet 32 ​​and the second magnet 42. As described above, a plurality of first magnets 32 and a plurality of second magnets 42 are provided, and the first magnets 32 and the second magnets 42 are provided in equal numbers and arranged at equal intervals on the circumference of the fixed holder 30 and the cover member 40. As a result, at a position where a certain first magnet 32 ​​and a certain second magnet 42 face each other, all of the first magnets 32 face one of the second magnets 42. In the following description, a pair of facing first magnets 32 and second magnets 42 may be collectively referred to as a magnet unit 50.

[0018] When the fixed holder 30 and the cover member 40 are fixed together, they are fitted together by means of a spigot structure, so that the relative positions of the two can be determined with high positional accuracy.

[0019] In this embodiment, the fixed holder 30 and the cover member 40 can be detached even after they have been fixed together. To release the fixed holder 30 and the cover member 40 from each other, a force greater than the magnetic force acting between all of the magnet units 50 is applied to the cover member 40 to release the fixation.

[0020] Incidentally, when using the laser processing device 1, care must be taken to prevent the workpiece W from colliding with the processing head 20. Even if the workpiece W collides with the processing head 20, it is desirable that the collision does not affect the condenser lens from the viewpoint of maintenance and cost. The behavior of the processing head 20 of the laser processing device 1 according to the present disclosure when a workpiece W collides with it will be described with reference to Fig. 3. Fig. 3 is a schematic diagram showing the processing head 20 when the workpiece W collides with the region H of the processing head 20 from the H1 direction (horizontal direction) in Fig. 2.

[0021] First, referring to FIG. 3, a case where a workpiece W collides with region H of the processing head 20 from the direction H1 shown in FIG. 2 will be described. When the workpiece W collides with the processing head 20 of the laser processing apparatus 1 according to this embodiment with a force greater than the magnetic force acting between the magnet units 50, the fixed state of the magnet unit 50 (referred to as magnet unit 50A) closest to the collision region H is released. At this time, the cover member 40 swings like a pendulum, with the recessed portion 31a and the protruding portion 41a (referred to as recessed portion 31A and protruding portion 41A, respectively) located farthest from the collision region H as fulcrums. At this time, the fixed state of the multiple magnet units 50 is released in order of proximity to region H. Finally, the engagement between the recessed portion 31A and the protruding portion 41A is released, and the fixed state between the fixed holder 30 and the cover member 40 is released, and the cover member 40 is detached from the fixed holder 30.

[0022] Thus, according to the processing head 20 of the laser processing apparatus 1 according to the present disclosure, the cover member 40 is attached to the fixed holder 30 by the magnet unit 50, so that even if an object such as the workpiece W collides with the processing head 20, the condenser lenses 33, 34 can be protected by the cover member 40. Furthermore, even if an impact force acts on the processing head 20, the cover member 40 can be easily removed, absorbing the impact force and making it less likely for the impact force to act on the condenser lenses 33, 34.

[0023] Furthermore, even if an impact force acts on the processing head 20 and the cover member 40 comes off, the condenser lenses 33, 34 are fixed to the fixed holder 30, so the positions of the condenser lenses 33, 34 relative to the fixed holder 30 do not change, and no displacement occurs in the optical system of the laser processing device 1. As a result, even if an impact force acts on the processing head 20, the impact force is unlikely to act on the condenser lenses 33, 34 and they are unlikely to be displaced.

[0024] In the processing head 20 of the laser processing apparatus 1 according to the present disclosure, the fixed holder 30 and the cover member 40 may be aligned by a fitting structure. According to the above configuration, the detached cover member 40 can be easily reattached to the predetermined position of the fixed holder 30 with a simple structure.

[0025] Furthermore, in the processing head 20 of the laser processing apparatus 1 according to the present disclosure, a cover member 40 is attached to the lower part of the fixed holder 30, and the magnet units 50 (magnets) may be provided on at least one of the lower surface of the fixed holder 30 and the upper surface of the cover member 40 at multiple locations on the circumference of a circle centered on the optical axis L1 of the condenser lenses 33, 34. According to the above configuration, it is possible to provide the processing head 20 of the laser processing apparatus 1 with a simple structure that can reduce the risk of damage when the processing head 20 collides with other objects.

[0026] Furthermore, in the processing head 20 of the laser processing apparatus 1 according to the present disclosure, the cover member 40 is attached to the lower part of the fixed holder 30, and the magnet may be embedded in at least one of the lower surface of the fixed holder 30 and the upper surface of the cover member 40 in a non-contact state. According to the above configuration, the magnets provided on the fixed holder 30 and the cover member 40 do not come into contact with each other, thereby suppressing dust generation due to contact between the magnets. Furthermore, because the magnets do not come into contact with each other, the fixed holder 30 and the cover member 40 are easily separated in the event of impact interference. This makes it possible to provide a processing head 20 in which, even if an impact force is applied to the processing head 20, the impact force is less likely to act on the condenser lenses 33, 34 and the condenser lenses 33, 34 are less likely to become displaced.

[0027] In the processing head 20 of the laser processing apparatus 1 according to the present disclosure, the cover member 40 may include a nozzle head 43 having a through hole through which the laser light focused by the focusing lens is emitted. According to the above configuration, the focused laser light L can be more accurately emitted from the laser processing apparatus 1.

[0028] Next, a case where the workpiece W collides with the area H of the machining head 20 from the direction H2 shown in Fig. 2 will be described with reference to Fig. 4. Fig. 4 is a schematic diagram showing the machining head 20 when the workpiece W collides with the area H of the machining head 20 from the direction H2 (vertical direction) in Fig. 2. In this embodiment, the nozzle head 43 provided on the cover member 40 has a floating head 43a in which an emission hole 43a1 is provided, and a support part 43b that detachably supports the floating head 43a and is fixed to the cover body 41. With the above configuration, even if the workpiece W collides from the direction H2 shown in FIG. 2, the floating head 43a detaches from the support part 43b as shown in FIG. 4, so that no impact force acts on the condenser lenses 33, 34 and no positional displacement occurs.

[0029] Furthermore, in the processing head 20 of the laser processing apparatus 1 according to the present disclosure, a gas chamber G into which assist gas discharged from the emission hole 43a1 is introduced may be provided between the nozzle head 43 and the fixed holder 30. With this configuration, the floating head 43a can be pressed against the support portion 43b by gas pressure. This makes it possible to prevent the floating head 43a from shifting in position relative to the support portion 43b when irradiating the laser light L.

[0030] In the processing head 20 of the laser processing apparatus 1 according to the present disclosure, the floating head 43a may have a downwardly conical cone shape, and the main body (cover main body 41) may have a bottomless, cone-shaped support surface that supports the floating head 43a. According to the above configuration, the floating head 43a can be easily supported when irradiating the laser light L.

[0031] Although the coating stripping method according to the present embodiment has been described above, the present disclosure is not limited to the above-described embodiment. For example, one of the first magnet 32 ​​and the second magnet 42 may be composed of a magnetic material rather than a magnet. In this case, the magnetic attraction force is weaker than when both the first magnet 32 ​​and the second magnet 42 are composed of magnets. This makes it easier for the fixed holder 30 and the cover member 40 to be released from the fixed position. Therefore, even if an impact force is applied to the machining head 20, it is possible to provide a machining head 20 in which the condenser lenses 33, 34 are less likely to be affected by the impact force and are less likely to become displaced.

[0032] Furthermore, when one of the first magnet 32 ​​and the second magnet 42 is not a magnet but is made of a magnetic material made of metal, the magnetic material may be provided on the entire lower surface of the fixed holder 30 or the entire upper surface of the cover member 40. This eliminates the need to face the first magnet 32 ​​and the second magnet 42 when fixing the fixed holder 30 and the cover member 40 together, improving the ease of assembly of the fixed holder 30 and the cover member 40. [Explanation of symbols]

[0033] 1. Laser processing equipment 10. Oscillators 20 Processing head 30 Fixed holder 31 Holder body 31, 31A, 31a recess 32 First magnet 33 First condenser lens 33,34 Condenser lens 34 Second focusing lens 35 Attached part 36 Protective Window 40 Cover member 41 Cover body 41, 41A, 41a convex part 41b Inner wall 42 Second magnet 43 Nozzle head 43,43b Support part 43a Floating Head 43a1 Output hole 44 Introductory path 45 through holes 50 Magnet Unit 100 stages 101 Fixed Stage 102 Moving Stage L1 optical axis

Claims

1. a fixed holder to which a condenser lens for condensing the laser light onto the workpiece is fixed; a cover member that is detachably attached to the fixed holder by a magnet and protects the condenser lens,

2. The processing head of the laser processing device according to claim 1 , wherein the fixed holder and the cover member are aligned by a fitting structure.

3. The cover member is attached to a lower portion of the fixed holder, 3. The processing head of a laser processing device according to claim 1, wherein the magnets are provided on at least one of the lower surface of the fixed holder and the upper surface of the cover member at multiple locations on a circle centered on the optical axis of the focusing lens.

4. The cover member is attached to a lower portion of the fixed holder, 3. The processing head of the laser processing device according to claim 1, wherein the magnet is embedded in at least one of the lower surface of the fixed holder and the upper surface of the cover member in a non-contact state.

5. 3. The processing head of the laser processing device according to claim 1, wherein the cover member is provided with a nozzle head having a through hole through which the laser light focused by the focusing lens is emitted.

6. the cover member has a main body and the nozzle head, 6. The processing head of the laser processing device according to claim 5, wherein the nozzle head comprises: a floating head in which the through hole is provided; and a support part that detachably supports the floating head and is fixed to the main body part.

7. The machining head according to claim 6 , further comprising a gas chamber provided between the nozzle head and the fixed holder, into which the assist gas discharged from the through-hole is introduced.

8. The floating head has a downwardly convex cone shape. The machining head according to claim 6 , wherein the main body portion has a support surface in the shape of a mortar with a bottom that supports the floating head.

9. The machining head according to claim 1 or 2 a laser oscillator that generates laser light; a light guide portion that guides the laser light generated by the laser oscillator to a processing head; A laser processing device comprising:

Images