Processing system and inspection system

Abstract

To provide a processing system capable of properly processing an object.MEANS: A processing system for processing an object by processing light comprises inspection equipment for performing a foreign matter inspection in an area subjected to the inspection on a surface of the object, and an irradiation device for applying the processing light to the area subjected to the inspection.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to, for example, a processing system capable of processing an object with processing light and an inspection system for inspecting an object. [Background technology]

[0002] As a processing system capable of processing an object, Patent Document 1 describes a processing system that forms a structure by irradiating the surface of an object with processing light. This type of processing system is required to process the object appropriately. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 4,994,639 Summary of the Invention

[0004] According to a first aspect, there is provided a processing system for processing an object with processing light, the processing system comprising an inspection device for inspecting for foreign matter in an inspection area on the surface of the object, and an irradiation device for irradiating the inspection area with processing light.

[0005] According to a second aspect, there is provided a processing system for processing an object with processing light, the processing system comprising an inspection device for inspecting defects on the surface of the object in an inspection area on the surface of the object, and an irradiation device for irradiating the inspection area with processing light.

[0006] According to a third aspect, there is provided a processing system for processing an object with processing light, the processing system comprising: a foreign matter removal device for removing foreign matter within at least a portion of the surface of the object; and an irradiation device for irradiating processing light onto at least a portion of the surface of the object.

[0007] According to a fourth aspect, there is provided an inspection system comprising a light receiving device that receives light from a surface of an object having a structure formed on its surface that changes aerodynamic characteristics, and an evaluation device that evaluates the features of the structure formed on the surface of the object using design information regarding the features of the structure and output information from the light receiving device.

[0008] According to a fifth aspect, a processing system for processing an object with processing light is provided, which includes an irradiation device that irradiates a first area on the object with processing light, and a position measurement device that measures the position of the first area on the object irradiated with the processing light, and the irradiation device irradiates a second area on the object that is different from the first area using the position measurement result of the first area by the position measurement device. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view schematically showing the overall structure of a processing system according to a first embodiment. [Figure 2] 2(a) and 2(b) are cross-sectional views each showing a schematic view of processing of a coating film formed on the surface of an object to be processed. [Figure 3] Figure 3(a) is a cross-sectional view schematically showing a light irradiation device provided in the processing system of the first embodiment, and Figures 3(b) and 3(c) are each a cross-sectional view showing the configuration of a light source system provided in the light irradiation device. [Figure 4] FIG. 4 is a cross-sectional view showing an imaging device provided in the foreign matter measuring device. [Figure 5] FIG. 5 is a cross-sectional view showing a light receiving device provided in the foreign matter measuring device. [Figure 6] FIG. 6(a) is a cross-sectional view showing a cross section of the riblet structure formed by the processing device of the first embodiment, and FIG. 6(b) is a perspective view showing the riblet structure formed by the processing device of the first embodiment. [Figure 7]Figures 7(a) and 7(b) are front views showing an aircraft, which is an example of an object to be processed on which a riblet structure is formed, and Figure 7(c) is a side view showing an aircraft, which is an example of an object to be processed on which a riblet structure is formed. [Figure 8] FIG. 8 is a plan view showing a plurality of processing shot areas set on the surface of a coating film. [Figure 9] FIG. 9 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 10] Figure 10(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 10(b) is a plan view showing the surface of a paint film during one step of the processing operation shown in Figure 10(a). [Figure 11] FIG. 11 is a plan view showing the scanning locus of the processing light (that is, the movement locus of the target irradiation area) during the period in which the scanning operation and the stepping operation are repeated. [Figure 12] FIG. 12 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 13] Figure 13(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 13(b) is a plan view showing the surface of a paint film on which one step of the processing operation shown in Figure 13(a) is being performed. [Figure 14] FIG. 14 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 15] FIG. 15 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 16] FIG. 16 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 17] FIG. 17 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 18] FIG. 18 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 19] FIG. 19 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 20] FIG. 20 is a plan view showing two processing shot areas set on a coating film. [Figure 21] FIG. 21 is a plan view showing the movement locus of a target irradiation area due to a processing operation performed on a certain processing shot area. [Figure 22] FIG. 22 is a cross-sectional view schematically showing the overall structure of the processing system of the second embodiment. [Figure 23] FIG. 23 is a plan view showing three processing shot areas set on a coating film. [Figure 24] FIG. 24 is a plan view showing the movement locus of a target irradiation area due to a processing operation performed on a certain processing shot area. [Figure 25] FIG. 25 is a cross-sectional view schematically showing the overall structure of the processing system of the third embodiment. [Figure 26] FIG. 26 is a plan view showing a processed area on the surface of a coating film. [Figure 27] FIG. 27 is a plan view showing the surface of a coating film on which eight processing shot areas are set. [Figure 28] FIG. 28 is an enlarged plan view showing a part of the eight processed shot areas shown in FIG. [Figure 29] FIG. 29 is a plan view showing an example of the positional relationship between the position measurement device and the light irradiation device. [Figure 30] FIG. 30 is a plan view showing a coating film on which a plurality of processed regions are formed. [Figure 31] FIG. 31 is a cross-sectional view showing the structure of a processing system including a position measuring device for performing the third measurement operation. [Figure 32]Figure 32(a) is a plan view showing measurement light scanning the riblet structure along a direction perpendicular to the extension direction of the concave structures and convex structures that make up the riblet structure, and Figure 32(b) is a plan view showing measurement light scanning the riblet structure along a direction that is not perpendicular to but intersects with the extension direction of the concave structures and convex structures that make up the riblet structure. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, with reference to the drawings, embodiments of a processing system, an inspection system, a processing method, an inspection method, a control device, and a computer program will be described. Hereinafter, embodiments of a processing system, an inspection system, a processing method, an inspection method, a control device, and a computer program will be described using a processing system SYS that performs a processing operation of processing a coating film SF formed on the surface of a processing object S using processing light EL. However, the present invention is not limited to the embodiments described below.

[0011] In the following description, the positional relationships of the various components that make up the machining system SYS will be explained using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are assumed to be horizontal (i.e., predetermined directions within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-and-down direction). The rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. The XY plane may also be assumed to be horizontal.

[0012] (1) Machining system SYSa of the first embodiment First, a machining system SYS of a first embodiment (hereinafter, the machining system SYS of the first embodiment will be referred to as a "machining system SYSa") will be described.

[0013] (1-1) Structure of the processing system SYSa First, the structure of the machining system SYSa of the first embodiment will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view that schematically shows the structure of the machining system SYSa of the first embodiment.

[0014] As shown in FIG. 1, the processing system SYS processes a coating film SF formed (e.g., applied) on the surface of a workpiece S. The workpiece S may be, for example, a metal, an alloy (e.g., duralumin, etc.), a resin (e.g., CFRP (Carbon Fiber Reinforced Plastic), etc.), glass, or an object made of any other material. The coating film SF is a film of paint covering the surface of the workpiece S. For this reason, the coating film SF may also be referred to as a paint layer. The workpiece S serves as a substrate for the coating film SF. The thickness of the coating film SF is, for example, several tens of micrometers to several hundreds of micrometers, but may be any other size. The paint constituting the coating film SF may include, for example, a resin-based paint, or may include other types of paint. The resin paint may include, for example, at least one of acrylic paint (e.g., paint containing acrylic polyol), polyurethane paint (e.g., paint containing polyurethane polyol), polyester paint (e.g., paint containing polyester polyol), vinyl paint, fluorine-based paint (e.g., paint containing fluorine-based polyol), silicone-based paint, and epoxy-based paint.

[0015] FIG. 1 shows an example in which the processing system SYSa (particularly, a processing device 1, described below, provided in the processing system SYSa) is disposed on a workpiece S having a surface along a horizontal plane (i.e., the XY plane). However, the processing system SYSa is not necessarily disposed on a workpiece S having a surface along a horizontal plane. For example, as will be described in detail later with reference to FIG. 7 etc., the processing system SYSa may be disposed on a workpiece S having a surface intersecting the horizontal plane. The processing system SYSa may be disposed so as to be suspended from the workpiece S. In this case, the X-axis direction and the Y-axis direction may be defined, for convenience, as directions along (typically parallel directions) the surface of the workpiece S, and the Z-axis direction may be defined, for convenience, as a direction intersecting (typically perpendicular direction) the surface of the workpiece S.

[0016] The processing system SYSa irradiates the coating film SF with processing light EL to process the coating film SF. The processing light EL may be any type of light as long as it can process the coating film SF when irradiated onto the coating film SF. As an example, the processing light EL may be laser light. Furthermore, the processing light EL may be light of any wavelength as long as it can process the coating film SF when irradiated onto the coating film SF. In the first embodiment, an example will be described in which the processing light EL is invisible light (for example, at least one of infrared light and ultraviolet light). That is, in the first embodiment, an example will be described in which the processing light EL is at least one of light with a wavelength included in a wavelength band shorter than the wavelength band of visible light and light with a wavelength included in a wavelength band longer than the wavelength band of visible light. However, the processing light EL may be visible light.

[0017] Here, the processing of the coating film SF using the processing light EL will be described with reference to Figures 2(a) and 2(b). Figures 2(a) and 2(b) are cross-sectional views each showing a schematic diagram of the processing of the coating film SF formed on the surface of the processing target S.

[0018] As shown in FIG. 2(a), the processing system SYSa irradiates a target irradiation area EA set on the surface of the coating film SF with processing light EL. The target irradiation area EA is an area onto which the processing system SYSa is scheduled to irradiate the processing light EL. As shown in FIG. 2(a), when the processing light EL is irradiated onto the target irradiation area EA, a portion of the coating film SF overlapping the target irradiation area EA (i.e., the coating film located on the -Z side of the target irradiation area EA) is evaporated by the processing light EL. At this time, not all of the coating film SF overlapping the target irradiation area EA in the thickness direction of the coating film SF evaporates. In other words, while a portion of the coating film SF overlapping the target irradiation area EA in the thickness direction of the coating film SF (specifically, a portion of the coating film SF relatively close to the target irradiation area EA) evaporates, the other portion of the coating film SF overlapping the target irradiation area EA (specifically, a portion of the coating film SF relatively far from the target irradiation area EA) does not evaporate. In other words, the coating film SF evaporates only to the extent that the workpiece S is not exposed from the coating film SF. For this reason, the characteristics of the processing light EL may be set to desired characteristics that evaporate the coating film SF only to the extent that the workpiece S is not exposed from the coating film SF. The characteristics of the processing light EL may be set to desired characteristics that do not affect the workpiece S when irradiated with the processing light EL. The characteristics of the processing light EL may be set to desired characteristics that affect only the coating film SF when irradiated with the processing light EL. The characteristics of the processing light EL may include at least one of the wavelength of the processing light EL, the amount of energy per unit time and / or per unit area transmitted from the processing light EL to the surface of the coating film SF, the intensity distribution of the processing light EL on the surface of the coating film SF, the irradiation time of the processing light EL on the surface of the coating film SF, and the size of the processing light EL on the surface of the coating film SF (for example, the spot diameter or area).

[0019] At this time, the energy (i.e., intensity) of the processing light EL irradiated onto the coating film SF is determined so that irradiation of the processing light EL does not affect the work-piece S. The energy of the processing light EL is determined so that irradiation of the processing light EL does not penetrate the coating film SF and reach the work-piece S. In other words, the energy of the processing light EL is determined so that irradiation of the processing light EL affects only the coating film SF.

[0020] As a result, the coating film SF is removed in the areas where it has evaporated. On the other hand, the coating film SF remains intact in the areas where it has not evaporated. That is, as shown in FIG. 2(b), the coating film SF is partially removed in the areas irradiated with the processing light EL. As a result, as shown in FIG. 2(b), the thickness of the coating film SF is thinner in the areas irradiated with the processing light EL compared to the areas not irradiated with the processing light EL. In other words, as shown in FIG. 2(b), on the surface of the workpiece S, there exists a coating film SF that remains relatively thick because it is not irradiated with the processing light EL, and a coating film SF that has become relatively thin because it is irradiated with the processing light EL. That is, the thickness of the coating film SF is at least partially adjusted by irradiation with the processing light EL. Irradiation with the processing light EL removes a portion of the coating film SF in the thickness direction (the Z-axis direction in the example shown in FIG. 2(b)). As a result, a recess (in other words, a groove) C corresponding to the area where the coating film SF is relatively thin is formed on the surface of the coating film SF. Therefore, the "operation of processing the coating film SF" in the first embodiment includes at least one of the operations of adjusting the thickness of the coating film SF, removing a portion of the coating film SF, and forming a recess C in the coating film SF.

[0021] The coating film SF evaporates by absorbing the processing light EL. That is, the coating film SF is removed, for example, by photochemical decomposition, when the energy of the processing light EL is transmitted to the coating film SF. Note that when the processing light EL is laser light, the phenomenon in which the energy of the processing light EL is transmitted to the coating film SF and the coating film SF is photochemically decomposed and removed is sometimes referred to as laser ablation. For this reason, the coating film SF contains a material capable of absorbing the processing light EL. Specifically, for example, the coating film SF may contain a material whose absorptance for the processing light EL (for example, when the processing light EL is invisible light, its absorptance for light in a wavelength band including wavelengths different from the wavelength band of visible light) is equal to or greater than a predetermined first absorption threshold. Conversely, light in a wavelength band whose absorptance by the coating film SF is equal to or greater than a predetermined first absorption threshold may be used as the processing light EL.

[0022] The material constituting the coating film SF may contain a colorant (specifically, for example, at least one of a pigment and a dye). When the coating film SF contains a colorant, the colorant may be a colorant that exhibits a desired color when irradiated with visible light. As a result, the coating film SF containing such a colorant exhibits the desired color. In this case, the colorant may have a property such that the absorptance of light in a first wavelength band, which includes wavelengths in the visible light wavelength band that are reflected by the coating film SF and recognized by humans as light of the desired color, is different from the absorptance of light in a second wavelength band of visible light that is different from the first wavelength band, so that the coating film SF exhibits the desired color. For example, the colorant may have a property such that the absorptance of light in the first wavelength band is smaller than the absorptance of light in the second wavelength band. For example, the dye may have the property that its absorptance for light in a first wavelength band is equal to or less than a predetermined second absorption threshold (wherein the second absorption threshold is smaller than the first absorption threshold) and equal to or greater than a predetermined third absorption threshold (wherein the third absorption threshold is larger than the second absorption threshold). An example of a dye that can adequately absorb invisible processed light EL while exhibiting a desired color is a near-infrared absorbing dye (e.g., tetrafluoroboronated 4-((E)-2-{(3E)-2-chloro-3-[2-(2,6-diphenyl-4H-thiopyran-4-ylidene)ethylidene]cyclohex-1-en-1-yl}vinyl)-2,6-diphenylthiopyrylium) manufactured by Spectrum Info, located in Kyiv, Ukraine. Note that if the coating film SF is transparent, it need not contain a dye.

[0023] If the coating film SF contains a pigment, the pigment may be transparent to visible light. As a result, the coating film SF containing such a pigment becomes a transparent film (so-called clear coat). Note that the term "transparent film" here may also mean a film that allows light in at least a portion of the visible light wavelength band to pass through. In this case, the pigment may have the property of not absorbing much visible light (i.e., reflecting it to a certain extent) so that the coating film SF is transparent. For example, the pigment may have the property of having a visible light absorption rate that is less than a predetermined fourth absorption threshold. An example of a dye that can adequately absorb invisible processed light EL while being transparent to visible light is a near-infrared absorbing dye manufactured by Spectrum Info (one example is tetrafluoroboronated 6-chloro-2-[(E)-2-(3-{(E)-2-[6-chloro-1-ethylbenzo[cd]indol-2(1H)-ylidene]ethylidene}-2-phenyl-1-cyclopenten-1-yl)ethenyl]-1-ethylbenzo[cd]indolium).

[0024] 1 , in order to process the coating film SF, the processing system SYSa includes a processing device 1, a control device 2, a foreign matter measuring device 31, a foreign matter removing device 32, and a display 4. Furthermore, the processing device 1 includes a light irradiation device 11, a drive system 12, a storage device 13, a support device 14, a drive system 15, an exhaust device 16, and a gas supply device 17.

[0025] The light irradiation device 11 can irradiate the coating film SF with processing light EL under the control of the control device 2. In order to irradiate the coating film SF with processing light EL, the light irradiation device 11 includes a light source system 111 that can emit the processing light EL and an optical system 112 that guides the processing light EL emitted from the light source system 111 to the coating film SF, as shown in Fig. 3(a), which is a cross-sectional view schematically showing the structure of the light irradiation device 11.

[0026] The light source system 111 simultaneously emits, for example, multiple beams of processing light EL. However, the light source system 111 may also emit a single beam of processing light EL. In this case, the light irradiation device 11 may also emit a single beam of processing light EL. To emit multiple beams of processing light EL, the light source system 111 includes multiple light sources 1111, as shown in FIG. 3(b), a cross-sectional view schematically illustrating an example of the structure of the light source system 111. The multiple light sources 1111 are arranged in a row at equal intervals. Each light source 1111 emits pulsed light as the processing light EL. A shorter emission time width of the pulsed light (hereinafter referred to as the "pulse width") improves processing accuracy (e.g., the formation accuracy of the riblet structure described below). Therefore, each light source 1111 may emit pulsed light with a relatively short pulse width as the processing light EL. For example, each light source 1111 may emit pulsed light with a pulse width of 1000 nanoseconds or less as the processing light EL. For example, each light source 1111 may emit pulsed light having a pulse width on the order of picoseconds as the processing light EL, or may emit pulsed light having a pulse width on the order of femtoseconds as the processing light EL. Alternatively, as shown in FIG. 3(c), which is a cross-sectional view schematically illustrating another example of the structure of the light source system 111, the light source system 111 may include a single light source 1111 and a splitter 1112 that splits the light from the single light source 1111 into multiple processing light EL. The multiple exits from which the multiple processing light EL branched by the splitter 1112 are respectively output are arranged in a row at equal intervals. Examples of the splitter 1112 include at least one of an optical fiber coupler, a waveguide splitter, a lens array, a diffractive optical element, and a spatial light modulator.

[0027] The optical system 112 includes a focus lens 1121, a galvanometer mirror 1122, and an fθ lens 1123. The processing light EL is irradiated onto the coating film SF via the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123.

[0028] The focus lens 1121 is composed of one or more lenses and is an optical element for adjusting the convergence position BF of the multiple processing light beams EL (in other words, the light collection position or irradiation position in the optical axis direction, i.e., the focal position of the optical system 112) by adjusting the position of at least some of the lenses along the optical axis direction. The galvanometer mirror 1122 deflects the multiple processing light beams EL so that they scan the surface of the coating film SF (i.e., multiple target irradiation areas EA onto which the multiple processing light beams EL are respectively irradiated move on the surface of the coating film SF). In other words, the galvanometer mirror 1122 can function as an irradiation position changing device that changes the irradiation positions of the multiple processing light beams EL on the coating film SF relative to the light irradiation device 11. The galvanometer mirror 1122 may also cause the multiple processing light beams EL emitted by the optical system 112 to sweep the surface of the coating film SF. The galvanometer mirror 1122 includes an X-scanning mirror 1122X and a Y-scanning mirror 1122Y. The X-scan mirror 1122X reflects the multiple processing light beams EL toward the Y-scan mirror 1122Y. The X-scan mirror 1122X can swing or rotate in the θY direction (i.e., the rotation direction around the Y-axis). By swinging or rotating the X-scan mirror 1122X, the multiple processing light beams EL scan the surface of the coating film SF along the X-axis direction. By swinging or rotating the X-scan mirror 1122X, the multiple target irradiation areas EA move along the X-axis direction on the coating film SF. The X-scan mirror 1122X changes the relative positional relationship between the multiple target irradiation areas EA and the coating film SF along the X-axis direction. The Y-scan mirror 1122Y reflects the multiple processing light beams EL toward the fθ lens 1123. The Y-scan mirror 1122Y can swing or rotate in the θX direction (i.e., the rotation direction around the X-axis). By swinging or rotating the Y-scan mirror 1122Y, the multiple processing light beams EL scan the surface of the coating film SF along the Y-axis direction. The Y-scanning mirror 1122Y swings or rotates, causing the multiple target irradiation areas EA to move along the Y-axis direction on the coating film SF. The Y-scanning mirror 1122Y changes the relative positional relationship along the Y-axis direction between the multiple target irradiation areas EA and the coating film SF. The fθ lens 1123 is an optical element for focusing the multiple processing light beams EL from the galvanometer mirror 1122 onto the coating film SF.

[0029] The fθ lens 1123 is the terminal optical element located closest to the light exit side of the optical system 112 among the optical elements included in the optical system 112 (in other words, closest to the coating film SF or located at the end of the optical paths of the multiple processing lights EL). However, the optical system 112 may also include an optical element (e.g., a cover lens) located closer to the light exit side than the fθ lens 1123. The fθ lens 1123 may be configured to be detachable from the optical system 112. As a result, after removing the old fθ lens 1123 from the optical system 112, it is possible to attach another fθ lens 1123 to the optical system 112. However, if the optical system 112 includes an optical element (e.g., a cover lens) located closer to the exit side than the fθ lens 1123, the optical element becomes the terminal optical element, and the optical element may be configured to be detachable from the optical system 112.

[0030] The directions of travel of the multiple processing lights EL from the optical system 112 are, for example, parallel to each other. As a result, in the first embodiment, the coating film SF is simultaneously irradiated with multiple processing lights EL traveling in parallel to each other. In other words, multiple target irradiation areas EA are simultaneously set on the coating film SF. This improves throughput for processing the coating film SF compared to when a single processing light EL is irradiated onto the coating film SF. Note that the directions of travel of the multiple processing lights EL from the optical system 112 do not have to be parallel to each other.

[0031] 1, the drive system 12, under the control of the control device 2, moves the light irradiation device 11 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed). That is, the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. When the relative positional relationship between the light irradiation device 11 and the coating film SF is changed, the relative positional relationship between the coating film SF and multiple target irradiation areas EA onto which multiple processing lights EL are respectively irradiated also changes. Therefore, it can be said that the drive system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the target irradiation areas EA and the coating film SF.

[0032] The drive system 12 may move the light irradiation device 11 along the surface of the coating film SF. In the example shown in FIG. 1, the surface of the coating film SF is a plane parallel to at least one of the X-axis and the Y-axis, so the drive system 12 may move the light irradiation device 11 along at least one of the X-axis and the Y-axis. As a result, the target irradiation area EA on the coating film SF moves along at least one of the X-axis and the Y-axis. In other words, the range over which the light irradiation device 11 can irradiate the processing light EL is changed. The drive system 12 may move the light irradiation device 11 along the thickness direction of the coating film SF (i.e., the direction intersecting the surface of the coating film SF). In the example shown in FIG. 1, the thickness direction of the coating film SF is along the Z-axis, so the drive system 12 may move the light irradiation device 11 along the Z-axis direction. The drive system 12 may move the light irradiation device 11 along at least one of the X-axis, Y-axis, and Z-axis, as well as at least one rotational direction of the θX direction, the θY direction, and the θZ direction.

[0033] The light irradiation device 11 is attached to the drive system 12 via an attachment member 19. The drive system 12 supports the light irradiation device 11 via the attachment member 19. The drive system 12 moves the light irradiation device 11 attached to the attachment member 19. In other words, the drive system 12 moves the light irradiation device 11 together with the attachment member 19. However, the light irradiation device 11 may be attached to the drive system 12 without the attachment member 19.

[0034] The accommodation device 13 includes a ceiling member 131 and a partition member 132. The ceiling member 131 is disposed on the +Z side of the light irradiation device 11. The ceiling member 131 is a plate-shaped member extending along the XY plane. The ceiling member 131 supports the drive system 12 via a support member 133. A partition member 132 is disposed on (or near) the outer edge of the -Z side surface of the ceiling member 131. The partition member 132 is a tubular (e.g., cylindrical or rectangular tubular) member extending from the ceiling member 131 toward the -Z side. The space surrounded by the ceiling member 131 and the partition member 132 forms an accommodation space SP for accommodating the light irradiation device 11 and the drive system 12. Therefore, the drive system 12 moves the light irradiation device 11 within the accommodation space SP. Furthermore, the accommodation space SP includes a space between the light irradiation device 11 and the coating film SF (particularly, a space including the optical path of the processing light EL). More specifically, the accommodation space SP includes the space between the final optical element (for example, the fθ lens 1123) included in the light irradiation device 11 and the coating film SF (particularly, the space including the optical path of the processing light EL).

[0035] The ceiling member 131 and the partition member 132 are each capable of blocking the processing light EL. That is, the ceiling member 131 and the partition member 132 are each opaque to the wavelength of the processing light EL. As a result, the processing light EL propagating within the storage space SP does not leak out to the outside of the storage space SP (i.e., outside the storage device 13). The ceiling member 131 and the partition member 132 may each be a member capable of attenuating the processing light EL. That is, the ceiling member 131 and the partition member 132 may each be translucent to the wavelength of the processing light EL. Furthermore, the ceiling member 131 and the partition member 132 are each a member that does not transmit (i.e., can block) unnecessary substances generated by irradiation with the processing light EL. An example of unnecessary substances is at least one of the vapor and fumes of the coating film SF. As a result, unnecessary substances generated within the storage space SP do not leak out to the outside of the storage space SP (i.e., outside the storage device 13).

[0036] An end 134 of the partition member 132 (specifically, the end on the coating film SF side, or the -Z side end in the example shown in FIG. 1 ) can come into contact with the surface of the coating film SF. When the end 134 comes into contact with the coating film SF, the storage device 13 (i.e., the ceiling member 131 and the partition member 132) cooperates with the coating film SF to maintain the airtightness of the storage space SP. When the end 134 comes into contact with the coating film SF, its shape (particularly the shape of the contact surface of the end 134 that comes into contact with the coating film SF (the surface on the -Z side in the example shown in FIG. 1 )) can change depending on the shape of the surface of the coating film SF; the same applies below). For example, when the end 134 comes into contact with a coating film SF with a flat surface, the shape of the end 134 becomes flat, just like the coating film SF. For example, when the end 134 comes into contact with a coating film SF with a curved surface, the shape of the end 134 becomes curved, just like the coating film SF. As a result, the sealing performance of the accommodation space SP is improved compared to when the end 134 cannot change its shape according to the shape of the surface of the coating film SF. An example of the shape-changeable end 134 is an end 134 made of an elastic material such as rubber (in other words, a flexible material). Note that the shape-changeable end 134 may be, for example, a bellows-shaped end having an elastic structure.

[0037] The end 134 may be capable of adhering to the coating film SF while in contact with the coating film SF. For example, the end 134 may be provided with an adsorption mechanism that allows it to be adsorbed to the coating film SF. When the end 134 is adhered to the coating film SF, the airtightness of the storage space SP is further improved compared to when the end 134 is not adhered to the coating film SF. However, the end 134 does not have to be capable of adhering to the coating film SF. Even in this case, as long as the end 134 is in contact with the coating film SF, the airtightness of the storage space SP is still maintained to an appropriate degree.

[0038] The partition member 132 is a member that can expand and contract along the Z-axis direction by a drive system (e.g., an actuator) (not shown) that operates under the control of the control device 2. For example, the partition member 132 may be a bellows-shaped member (so-called bellows). In this case, the partition member 132 can expand and contract by the expansion and contraction of the bellows portion. Alternatively, for example, the partition member 132 may include a telescopic pipe in which a plurality of hollow cylindrical members having different diameters are combined. In this case, the partition member 132 can expand and contract by the relative movement of the plurality of cylindrical members. The state of the partition member 132 can be set to at least a first extended state in which the partition member 132 expands along the Z-axis direction, thereby making the length in the Z-axis direction relatively long, and a first contracted state in which the partition member 132 contracts along the Z-axis direction, thereby making the length in the Z-axis direction relatively short.

[0039] When the partition member 132 is in the first extended state, the end 134 is in a first contact state in which it can come into contact with the coating film SF. On the other hand, when the partition member 132 is in the first contracted state, the end 134 is in a first non-contact state in which it does not come into contact with the coating film SF. In other words, when the partition member 132 is in the first contracted state, the end 134 is in the first non-contact state in which it is separated from the coating film SF on the +Z side. Note that the configuration for switching the state of the end 134 between the first contact state and the first non-contact state is not limited to a configuration that expands and contracts the partition member 132. For example, the state of the end 134 may be switched between the first contact state and the first non-contact state by configuring the storage device 13 itself to be movable along the ±Z directions.

[0040] The accommodation device 13 further includes a detection device 135. The detection device 135 detects unwanted substances in the accommodation space SP (i.e., substances generated by irradiation with the processing light EL). As will be described in detail later, the detection result of the detection device 135 is referred to by the control device 2 when changing the state of the partition member 132 from the first extended state to the first contracted state.

[0041] The support device 14 supports the storage device 13. Because the storage device 13 supports the drive system 12 and the light irradiation device 11, the support device 14 essentially supports the drive system 12 and the light irradiation device 11 via the storage device 13. In order to support the storage device 13, the support device 14 is equipped with a beam member 141 and a plurality of leg members 142. The beam member 141 is arranged on the +Z side of the storage device 13. The beam member 141 is a beam-shaped member extending along the XY plane. The beam member 141 supports the storage device 13 via support members 143. A plurality of leg members 142 are arranged on the beam member 141. The leg members 142 are rod-shaped members extending from the beam member 141 toward the -Z side.

[0042] An end 144 of the leg member 142 (specifically, an end on the coating film SF side, or in the example shown in FIG. 1, an end on the -Z side) can come into contact with the surface of the coating film SF. As a result, the support device 14 is supported by the coating film SF (i.e., by the workpiece S). That is, the support device 14 supports the storage device 13 with the end 144 in contact with the coating film SF (in other words, with the support device 14 supported by the coating film SF). When the end 144 comes into contact with the coating film SF, similar to the end 134 of the storage device 13, the shape of the end 144 (particularly, the shape of the contact surface of the end 144 that comes into contact with the coating film SF (in the example shown in FIG. 1, the surface on the -Z side); the same applies below) may be able to change depending on the shape of the surface of the coating film SF. The end 144 may be able to adhere to the coating film SF when in contact with the coating film SF. For example, the end 144 may be provided with an adsorption mechanism that can adsorb to the coating film SF. When the end 144 is attached to the coating film SF, the stability of the support device 14 is improved compared to when the end 144 is not attached to the coating film SF. However, the end 144 does not have to be able to be attached to the coating film SF.

[0043] The beam member 141 is a member that can extend and retract along at least one of the X-axis and Y-axis (or along any direction along the XY plane) by the drive system 15 that operates under the control of the control device 2. For example, the beam member 141 may include a telescopic pipe in which multiple tubular members with different diameters are combined. In this case, the beam member 141 can extend and retract by the relative movement of the multiple tubular members.

[0044] The leg member 142 is a member that can be extended and retracted along the Z-axis direction by the drive system 15 that operates under the control of the control device 2. For example, the leg member 142 may include a telescopic pipe that combines multiple tubular members with different diameters. In this case, the leg member 142 can be extended and retracted by relative movement of the multiple tubular members. The state of the leg member 142 can be set to at least a second extended state in which the leg member 142 extends along the Z-axis direction, thereby making the length in the Z-axis direction relatively long, and a second contracted state in which the leg member 142 contracts along the Z-axis direction, thereby making the length in the Z-axis direction relatively short. When the leg member 142 is in the second extended state, the end portion 144 is in a second contact state in which it can come into contact with the coating film SF. On the other hand, when the leg member 142 is in the second contracted state, the end portion 144 is in a second non-contact state in which it does not come into contact with the coating film SF. In other words, when the leg member 142 is in the second contracted state, the end portion 144 is in the second non-contact state in which it is separated from the coating film SF on the +Z side.

[0045] The drive system 15, under the control of the control device 2, moves the support device 14 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed). That is, the drive system 15 moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the support device 14 and the coating film SF. Because the support device 14 supports the storage device 13, the drive system 15 essentially moves the storage device 13 relative to the coating film SF by moving the support device 14. That is, the drive system 15 essentially moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the storage device 13 and the coating film SF. Furthermore, the storage device 13 supports the light irradiation device 11 via the drive system 12. Therefore, the drive system 15 essentially moves the support device 14 so as to move the light irradiation device 11 relative to the coating film SF. That is, the drive system 15 can move the support device 14 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. In other words, the drive system 15 can move the support device 14 relative to the coating film SF so as to change the relative positional relationship between the multiple target irradiation areas EA and the coating film SF.

[0046] The drive system 15 extends and retracts the beam members 141 under the control of the control device 2 in order to move the support device 14. Furthermore, the drive system 15 extends and retracts the plurality of leg members 142 under the control of the control device 2 in order to move the support device 14. The manner in which the drive system 15 moves the support device 14 will be described in detail later with reference to Figures 8 to 19.

[0047] The exhaust device 16 is connected to the accommodation space SP via an exhaust pipe 161. The exhaust device 16 can exhaust gas from the accommodation space SP. In particular, by exhausting the gas from the accommodation space SP, the exhaust device 16 can suck unnecessary substances generated by irradiation of the processing light EL from the accommodation space SP to the outside of the accommodation space SP. In particular, if this unnecessary substance is present in the optical path of the processing light EL, it may affect the irradiation of the processing light EL onto the coating film SF. For this reason, the exhaust device 16 particularly sucks the unnecessary substances together with the gas from the space including the optical path of the processing light EL between the final optical element of the optical system 112 and the coating film SF. The unnecessary substances sucked from the accommodation space SP by the exhaust device 16 are discharged to the outside of the processing apparatus 1 via a filter 162. The filter 162 adsorbs the unnecessary substances. Note that the filter 162 may be detachable or replaceable.

[0048] The gas supply device 17 is connected to the accommodation space SP via an intake pipe 171. The gas supply device 17 can supply gas to the accommodation space SP. The gas to be supplied to the accommodation space SP can be at least one of the atmosphere, CDA (clean dry air), and an inert gas. An example of the inert gas is nitrogen gas. In the first embodiment, the gas supply device 17 supplies CDA. Therefore, the accommodation space SP becomes a space purged with CDA. At least a portion of the CDA supplied to the accommodation space SP is sucked in by the exhaust device 16. The CDA sucked in from the accommodation space SP by the exhaust device 16 passes through a filter 162 and is discharged to the outside of the processing system SYSa.

[0049] The gas supply device 17 particularly supplies a gas such as CDA to the optical surface 1124 on the accommodation space SP side of the fθ lens 1123 shown in FIG. 3 (i.e., the optical surface on the accommodation space SP side of the final optical element of the optical system 112). Because the optical surface 1124 faces the accommodation space SP, it may be exposed to unwanted substances generated by irradiation with the processing light EL. As a result, the unwanted substances may adhere to the optical surface 1124. Furthermore, because the processing light EL passes through the optical surface 1124, the unwanted substances adhered to the optical surface 1124 may be burned (i.e., fixed) by the processing light EL passing through the optical surface 1124. The unwanted substances that have adhered (or even fixed) to the optical surface 1124 may contaminate the optical surface 1124 and affect the characteristics of the processing light EL. Therefore, supplying a gas such as CDA to the optical surface 1124 prevents the optical surface 1124 from coming into contact with the unwanted substances. This prevents dirt from adhering to the optical surface 1124. Therefore, the gas supply device 17 also functions as an adhesion prevention device that prevents dirt from adhering to the optical surface 1124. Furthermore, even if dirt has adhered (or even become stuck) to the optical surface 1124, the dirt may be removed (e.g., blown away) by the CDA supplied to the optical surface 1124. Therefore, the gas supply device 17 may also function as an adhesion prevention device that removes dirt adhering to the optical surface 1124.

[0050] The control device 2 controls the overall operation of the processing system SYSa. In particular, the control device 2 controls the light irradiation device 11, the drive system 12, the storage device 13, and the drive system 15 so that recesses C having desired shapes are formed at desired positions, as will be described in detail later.

[0051] The control device 2 may include, for example, a CPU (Central Processing Unit) (or a GPU (Graphics Processing Unit) in addition to or instead of the CPU) and a memory. The control device 2 functions as a device that controls the operation of the machining system SYSa by the CPU executing a computer program. This computer program is a computer program for causing the control device 2 (e.g., the CPU) to perform (i.e., execute) the operations to be performed by the control device 2, which will be described later. In other words, this computer program is a computer program for causing the control device 2 to function so as to cause the machining system SYSa to perform the operations to be performed later. The computer program executed by the CPU may be recorded in a memory (i.e., a recording medium) included in the control device 2, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control device 2. Alternatively, the CPU may download the computer program to be executed from a device external to the control device 2 via a network interface.

[0052] The control device 2 does not have to be provided inside the machining system SYSa, and may be provided outside the machining system SYSa as a server or the like. In this case, the control device 2 and the machining system SYSa may be connected via a wired and / or wireless network (or a data bus and / or a communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an Ethernet (registered trademark) interface, such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a radio wave network is a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)). The wireless network may be an infrared network. A network using optical communication may be used as the wireless network. In this case, the control device 2 and the machining system SYSa may be configured to be able to send and receive various information via the network. The control device 2 may also be able to send information such as commands and control parameters to the machining system SYSa via the network. The machining system SYSa may include a receiving device that receives information such as commands and control parameters from the control device 2 via the network. Alternatively, a first control device that performs part of the processing performed by the control device 2 may be provided inside the machining system SYSa, while a second control device that performs another part of the processing performed by the control device 2 may be provided outside the machining system SYSa.

[0053] The recording medium for recording the computer program executed by the CPU may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), or other optical disk, a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, or any other medium capable of storing a program. The recording medium may also include a device capable of recording the computer program (e.g., a general-purpose device or a dedicated device in which the computer program is implemented in an executable state in at least one of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 2 (i.e., a computer) when the control device 2 (i.e., a computer) executes the computer program, or by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 2, or may be realized in a form in which the logical processing block and a partial hardware module that realizes some of the hardware elements are mixed.

[0054] The foreign matter measuring device 31 measures foreign matter on the surface of the coating film SF under the control of the control device 2. Specifically, the foreign matter measuring device 31 measures foreign matter in an area of ​​the surface of the coating film SF that is included in the measurement range of the foreign matter measuring device 31 (hereinafter referred to as the "measurement area AMA") under the control of the control device 2. Note that the foreign matter measuring device 31 may measure foreign matter on the surface of the coating film SF regardless of control by the control device 2.

[0055] If foreign matter is present on the surface of the coating film SF, the foreign matter may prevent at least a portion of the processing light EL from being irradiated onto the coating film SF. In other words, if foreign matter is present on the surface of the coating film SF, at least a portion of the processing light EL may not be properly irradiated onto the coating film SF. As a result, proper processing of the coating film SF by irradiation with the processing light EL may be hindered. In other words, the foreign matter may prevent proper processing of the coating film SF by irradiation with the processing light EL. Therefore, the presence (typically, adhesion) of foreign matter on the surface of the coating film SF corresponds to a specific example of an abnormal event that may hinder proper processing of the coating film SF by irradiation with the processing light EL. Examples of such foreign matter include dirt, dust, dirt, fine particles, moisture, and at least one of the fumes described above.

[0056] The foreign matter measuring device 31 may be a measuring device capable of measuring the surface state of the coating film SF. In other words, the foreign matter measuring device 31 may be a measuring device capable of measuring foreign matters on the surface of the coating film SF by measuring the surface state of the coating film SF. This is because the surface state of the coating film SF in which foreign matters are present is different from the surface state of the coating film SF in which foreign matters are not present.

[0057] The foreign matter measuring device 31 is attached to the mounting member 19 to which the light irradiation device 11 is attached. Therefore, the foreign matter measuring device 31 also moves in accordance with the movement of the light irradiation device 11 by the drive system 12. In other words, the foreign matter measuring device 31 moves together with the light irradiation device 11 relative to the coating film SF. As a result, the measurement area AMA in which the foreign matter measuring device 31 measures foreign matters also moves on the coating film SF. Therefore, the foreign matter measuring device 31 can measure foreign matters in the measurement area AMA, which can be set to a desired area on the coating film SF. However, the foreign matter measuring device 31 does not have to be attached to the mounting member 19. The foreign matter measuring device 31 does not have to be attached to the mounting member 19. The foreign matter measuring device 31 may be attached to a member different from the mounting member 19. The foreign matter measuring device 31 may be attached to the light irradiation device 11. The foreign matter measuring device 31 may be movable independently of the light irradiation device 11. The foreign matter measuring device 31 does not have to be movable.

[0058] The measurement results of the foreign matter measuring device 31 (hereinafter referred to as "foreign matter measurement information") are output to the control device 2. The control device 2 performs a foreign matter inspection operation on the measurement area AMA based on the foreign matter measurement information. In other words, the control device 2 performs a foreign matter inspection operation on the measurement area AMA together with the foreign matter measuring device 31. For this reason, an apparatus (or a system) including the foreign matter measuring device 31 and the control device 2 may be referred to as an inspection apparatus or an inspection system that performs a foreign matter inspection operation. In this case, the measurement area AMA may also be referred to as an inspection area.

[0059] The control device 2 may perform a foreign matter detection operation as at least a part of the foreign matter inspection operation. That is, the control device 2 may determine whether or not a foreign matter is present in the measurement area AMA based on the foreign matter measurement information. The control device 2 may determine whether or not an abnormal event (particularly an abnormal event that a foreign matter is present on the surface of the coating film SF) has occurred in the measurement area AMA based on the foreign matter measurement information. In this case, the foreign matter measuring device 31 may perform a measurement operation to measure the presence or absence of a foreign matter in the measurement area AMA. That is, the foreign matter measuring device 31 may perform a measurement operation to acquire foreign matter measurement information that can be used to determine the presence or absence of a foreign matter in the measurement area AMA.

[0060] If a foreign object is present in the measurement area AMA, the control device 2 may calculate the characteristics of the foreign object (in other words, the state or characteristics of the foreign object) based on the foreign object measurement information. That is, the control device 2 may perform a characteristic calculation operation to calculate the characteristics of the foreign object as at least a part of the foreign object inspection operation. For example, the control device 2 may calculate the shape of the foreign object, which is an example of the characteristics of the foreign object, based on the foreign object measurement information. The shape of the foreign object may include the two-dimensional shape of the foreign object (e.g., the shape in a plane along the XY plane) or the three-dimensional shape of the foreign object. For example, the control device 2 may calculate the size of the foreign object, which is an example of the characteristics of the foreign object, based on the foreign object measurement information. The size of the foreign object may include at least one of the size of the foreign object in the X-axis direction, the size of the foreign object in the Y-axis direction, and the size of the foreign object in the Z-axis direction. In this case, the foreign object measuring device 31 may perform a measurement operation to measure the characteristics of the foreign object present in the measurement area AMA. That is, the foreign object measuring device 31 may perform a measurement operation to acquire foreign object measurement information that can be used to calculate the characteristics of the foreign object in the measurement area AMA.

[0061] If foreign matter is present in the measurement area AMA, the control device 2 may identify the number of foreign matter based on the foreign matter measurement information. That is, the control device 2 may perform a counting operation to calculate the number of foreign matter as at least a part of the foreign matter inspection operation. In this case, the foreign matter measuring device 31 may perform a measurement operation to measure the number of foreign matter present in the measurement area AMA. That is, the foreign matter measuring device 31 may perform a measurement operation to acquire foreign matter measurement information that can be used to calculate the number of foreign matter in the measurement area AMA.

[0062] The control device 2 may perform a foreign substance inspection operation based on the foreign substance measurement information and feature information regarding the surface features of the coating film SF (particularly, the features of the measurement area AMA on the surface of the coating film SF). For example, if no foreign substance is present in the measurement area AMA, the actual features of the measurement area AMA indicated by the foreign substance measurement information should match the design features (or ideal features) of the measurement area AMA indicated by the feature information. On the other hand, if a foreign substance is present in the measurement area AMA, it is highly likely that the actual features of the measurement area AMA indicated by the foreign substance measurement information will not match the design features (or ideal features) of the measurement area AMA indicated by the feature information. For this reason, the control device 2 may perform a foreign substance inspection operation by comparing the foreign substance measurement information with the feature information.

[0063] The foreign matter measuring device 31 may be any measuring device as long as it can acquire foreign matter measurement information that can be used in foreign matter inspection operations. For example, the foreign matter measuring device 31 may be capable of measuring the surface of the coating film SF in a non-contact manner. An example of a measuring device capable of measuring the surface of the coating film SF in a non-contact manner is a measuring device that can optically measure the surface of the coating film SF. Another example of a measuring device capable of measuring the measurement area AMA in a non-contact manner is a measuring device that measures the coating film SF using at least one of sound waves and radio waves.

[0064] The foreign matter measuring device 31 may include an imaging device (i.e., a camera) 311 capable of capturing an image of the surface of the coating film SF, as an example of a measuring device capable of optically measuring the surface of the coating film SF. For example, FIG. 4 is a cross-sectional view showing the foreign matter measuring device 31 including the imaging device 311. Note that the imaging device 311 here refers to a device capable of capturing an image of the surface condition of the coating film SF using an imaging element in which light-receiving elements (i.e., light-receiving devices) capable of receiving light from the surface of the coating film SF are regularly arranged. Examples of imaging elements include at least one of a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor. In this case, the control device 2 may perform foreign matter inspection operations by analyzing the image captured by the imaging device 311. Note that when the foreign matter measuring device 31 includes the imaging device 311, the area of ​​the surface of the coating film SF included in the imaging range of the imaging device 311 may be the measurement area AMA.

[0065] The foreign matter measuring device 31 may include a light-receiving device 312 capable of receiving light from the surface of the coating film SF as an example of a measuring device capable of optically measuring the surface of the coating film SF. For example, FIG. 5 is a cross-sectional view showing the foreign matter measuring device 31 including the light-receiving device 312. Here, when foreign matter is present on the surface of the coating film SF, the foreign matter inspection light irradiated onto the surface of the coating film SF (particularly, the foreign matter) is more likely to be scattered and / or diffracted by the surface of the coating film SF than when no foreign matter is present on the surface of the coating film SF. In this case, the scattered light scattered by the surface of the coating film SF and / or the diffracted light diffracted by the surface of the coating film SF are more likely to travel in a direction different from the direction in which the specularly reflected light of the foreign matter inspection light travels. Therefore, the scattered light and / or diffracted light may contain information about the foreign matter. For this reason, the foreign matter measuring device 31 may include a light-receiving device 312 capable of receiving at least one of the scattered light scattered by the surface of the coating film SF and the diffracted light diffracted by the surface of the coating film SF, as shown in FIG. 5. In this case, the control device 2 may calculate the characteristics (e.g., intensity) of the scattered light and / or diffracted light from the light reception results of the light receiving device 312, and perform a foreign substance inspection operation based on the calculated characteristics of the scattered light and / or diffracted light. Note that if the foreign substance measuring device 31 includes the light receiving device 312, the area on the surface of the coating film SF that is irradiated with light for foreign substance inspection (i.e., the area from which the scattered light and / or diffracted light is emitted) may be the measurement area AMA.

[0066] 1, the foreign matter removal device 32 removes foreign matter present on the surface of the coating film SF under the control of the control device 2. That is, the foreign matter removal device 32 performs a foreign matter removal operation to remove foreign matter under the control of the control device 2. Specifically, the foreign matter removal device 32 removes foreign matter in an area of ​​the surface of the coating film SF that is included in a removal range in which the foreign matter removal device 32 can perform the foreign matter removal operation (hereinafter referred to as the "removal area RA"). Note that the foreign matter removal device 32 may remove foreign matter present on the surface of the coating film SF regardless of the control by the control device 2.

[0067] The removal area RA may coincide with the measurement area AMA described above. That is, the foreign matter measuring device 31 and the foreign matter removal device 32 may be aligned so that the removal area RA and the measurement area AMA coincide. Alternatively, the removal area RA may partially overlap with the measurement area AMA described above. That is, the foreign matter measuring device 31 and the foreign matter removal device 32 may be aligned so that the removal area RA and the measurement area AMA partially overlap. Alternatively, the removal area RA may not overlap with the measurement area AMA described above. That is, the foreign matter measuring device 31 and the foreign matter removal device 32 may be aligned so that the removal area RA and the measurement area AMA do not overlap. Note that FIG. 1 shows an example in which the removal area RA and the measurement area AMA coincide.

[0068] The foreign matter removal device 32 is attached to the mounting member 19 to which the light irradiation device 11 is attached. Therefore, the foreign matter removal device 32 also moves in accordance with the movement of the light irradiation device 11 by the drive system 12. That is, the foreign matter removal device 32 moves together with the light irradiation device 11 relative to the coating film SF. As a result, the removal area RA in which the foreign matter removal device 32 removes foreign matter also moves on the coating film SF. Therefore, the foreign matter removal device 32 can remove foreign matter present in the removal area RA, which can be set to a desired area on the coating film SF. However, the foreign matter removal device 32 does not have to be attached to the mounting member 19. The foreign matter removal device 32 may be attached to a member other than the mounting member 19. The foreign matter removal device 32 may be attached to the light irradiation device 11. The foreign matter removal device 32 may be movable independently of the light irradiation device 11. The foreign matter removal device 32 may be movable independently of the foreign matter measurement device 31. The foreign matter removal device 32 does not have to be movable.

[0069] The foreign matter removal device 32 may include any device as long as it can remove foreign matter. For example, the foreign matter removal device 32 may remove foreign matter from the removal area RA by supplying a fluid to the removal area RA.

[0070] Specifically, for example, the foreign matter removal device 32 may remove foreign matter from the removal area RA by supplying gas, which is an example of a fluid, to the removal area RA. More specifically, for example, the foreign matter removal device 32 may blow gas onto the removal area RA. In this case, the foreign matter in the removal area RA is blown away by the gas blown onto the removal area RA. As a result, the foreign matter is removed from the removal area RA.

[0071] Alternatively, for example, the foreign matter removal device 32 may remove foreign matter from the removal area RA by supplying a liquid, which is an example of a fluid, to the removal area RA in addition to or instead of a gas. More specifically, for example, the foreign matter removal device 32 may spray (or eject) a liquid onto the removal area RA. In this case, the foreign matter in the removal area RA is washed away by the liquid sprayed onto the removal area RA. As a result, the foreign matter is removed from the removal area RA. Alternatively, depending on the type of foreign matter or the degree of adhesion of the foreign matter to the coating film SF, the foreign matter removal device 32 may supply a cleaning liquid (e.g., a liquid containing a cleaning agent such as a surfactant) to the removal area RA and then supply a liquid (e.g., water) to the removal area RA to wash away the cleaning liquid. When a cleaning liquid is used in this way, foreign matter that is difficult to remove with water or foreign matter that is relatively firmly attached to the coating film SF is more likely to be removed than when a cleaning liquid is not used. Furthermore, depending on the type of foreign matter or the degree of adhesion of the foreign matter to the coating film SF, a treatment to promote removal of the foreign matter may be performed on the portion of the surface of the coating film SF to which the liquid has been supplied (typically, the removal area RA) after or in parallel with the supply of the liquid or cleaning solution to the removal area RA. The treatment to promote removal of the foreign matter may include at least one of ultrasonic cleaning treatment by irradiating the coating film SF with ultrasonic waves, bubble cleaning by generating bubbles (e.g., microvalves) in the liquid, wiping treatment by wiping the surface of the coating film SF with a wiping member such as a piece of cloth, brushing treatment by peeling off foreign matter from the surface of the coating film SF with a number of thin rod-shaped members (e.g., brushes), and polishing treatment by polishing the surface of the coating film SF with a polishing member such as a polishing pad.

[0072] The foreign matter removal device 32 may spray solid matter (for example, minute solid particles) onto the removal area RA. At this time, the solid particles may be sprayed onto the removal area RA together with a fluid (gas or liquid).

[0073] However, when foreign matter is removed using a liquid, if the liquid remains on the coating film SF, the liquid may interfere with proper processing of the coating film SF. In other words, the remaining liquid may become new foreign matter. Therefore, after the foreign matter is removed using a liquid, a process may be performed to remove the liquid from the surface of the coating film SF, and then the coating film SF may be processed. Examples of processes for removing the liquid from the surface of the coating film SF include at least one of a process of drying the surface of the coating film SF that has been coated with the liquid, and a process of blowing gas onto the coating film SF to blow away the liquid on the coating film SF. The specific flow of the foreign matter inspection operation using the foreign matter measuring device 31 and the foreign matter removal operation using the foreign matter removal device 32 will be described in detail later, so a detailed description thereof will be omitted here.

[0074] The display 4 is a display device capable of displaying a desired image under the control of the control device 2. For example, the display 4 may display information related to the machining system SYSa. For example, the display 4 may display information related to the workpiece S. For example, the display 4 may display information related to the coating film SF. For example, the display 4 may display information related to at least one of a machining operation, a foreign substance inspection operation, and a foreign substance removal operation.

[0075] The display 4 does not have to be provided inside the processing system SYSa. For example, the display 4 may be provided outside the processing system SYSa as an external display. In this case, the display 4 and the processing system SYSa may be connected via a wired and / or wireless network (or a cable, a data bus, and / or a communication line). In this case, the control device 2 may be configured to be able to transmit and receive various information (i.e., input and output) to and from the display 4 via the network. The display 4 may include a transmitting / receiving unit (i.e., an input / output unit) that transmits and receives information to and from the control device 2 (and further to and from other devices included in the processing system SYS, either via or without the control device 2), and a display unit that displays images.

[0076] (1-2) Specific examples of operations by the processing system SYSa (1-2-1) Specific examples of structures formed by the processing system SYSa As described with reference to FIG. 2, in the first embodiment, the processing system SYSa forms a recess C in the coating film SF. The recess C is formed in a portion of the coating film SF that is actually irradiated with the processing light EL. Therefore, by appropriately setting the position on the coating film SF where the processing light EL is actually irradiated (i.e., the position where the target irradiation area EA that is scheduled to be irradiated with the processing light EL is set), the recess C can be formed at a desired position on the coating film SF. In other words, it is possible to form a structure made of the coating film SF on the workpiece S.

[0077] Specifically, as described above, the processing system SYSa uses at least one of the galvanometer mirror 1122 and the drive system 12 to move the surface of the coating film SF to the target irradiation area EA. While the target irradiation area EA moves across the surface of the coating film SF, the processing system SYSa irradiates the processing light EL at a timing when the target irradiation area EA overlaps with an area on the surface of the coating film SF that should actually be irradiated with the processing light EL (i.e., an area to be processed). Meanwhile, while the target irradiation area EA moves across the surface of the coating film SF, the processing system SYSa does not irradiate the processing light EL at a timing when the target irradiation area EA does not overlap with an area on the surface of the coating film SF that should actually be irradiated with the processing light EL (i.e., an area that should not be processed). In other words, while the target irradiation area EA moves across the surface of the coating film SF, the processing system SYSa does not irradiate the processing light EL at a timing when the target irradiation area EA overlaps with an area on the surface of the coating film SF that should not actually be irradiated with the processing light EL (i.e., an area that should not be processed). As a result, a structure (that is, a pattern structure) is formed on the processing object S by the coating film SF according to the pattern (or distribution) of the area of ​​the coating film SF that is actually irradiated with the processing light EL.

[0078] In the first embodiment, the machining system SYSa forms a riblet structure, which is an example of a structure formed by such a coating film SF, on the workpiece S under the control of the control device 2. The riblet structure is a structure that can reduce the resistance of the surface of the coating film SF to a fluid (particularly, frictional resistance and turbulent frictional resistance). The resistance of the surface of the workpiece S on which the riblet structure is formed to a fluid is smaller than the resistance of the surface of the workpiece S on which the riblet structure is not formed to a fluid. Therefore, the riblet structure can also be said to be a structure that can reduce the resistance of the surface of the workpiece S to a fluid. In other words, the riblet structure can also be said to be a structure that can change the aerodynamic characteristics of the workpiece S. Note that the fluid referred to here may be any medium (gas or liquid) that flows relative to the surface of the coating film SF. For example, a medium flowing relative to a stationary workpiece S and stationary media distributed around a moving workpiece S are both examples of a fluid.

[0079] An example of a riblet structure is shown in Figures 6(a) and 6(b). As shown in Figures 6(a) and 6(b), the riblet structure is a structure in which, for example, recessed structures CP1 (i.e., recessed structures CP1 formed linearly so as to extend along the first direction) formed by continuously forming recesses C along a first direction (in the example shown in Figures 6(a) and 6(b), the Y-axis direction) are arranged in multiple positions along a second direction (in the example shown in Figures 6(a) and 6(b), the X-axis direction) intersecting the first direction. In other words, the riblet structure is a structure in which, for example, multiple recessed structures CP1 extending along the first direction have a periodic direction in the second direction intersecting the first direction. Between two adjacent recessed structures CP1, there is substantially a convex structure CP2 protruding from the surroundings. Therefore, the riblet structure can also be said to be a structure in which, for example, a plurality of convex structures CP2 extending linearly along a first direction (e.g., the Y-axis direction) are arranged along a second direction (e.g., the X-axis direction) intersecting the first direction. In other words, the riblet structure can also be said to be a structure in which, for example, a plurality of convex structures CP2 extending along a first direction have a periodic direction in a second direction intersecting the first direction. The riblet structures shown in Figures 6(a) and 6(b) are periodic structures. Note that the riblet structure may also be a non-periodic structure.

[0080] The distance between two adjacent concave structures CP1 (i.e., the arrangement pitch P1 of the concave structures CP1) is, for example, several microns to several hundred microns, but may be other sizes. Furthermore, the depth D of each concave structure CP1 (i.e., the depth in the Z-axis direction) is, for example, several microns to several hundred microns, but may be other sizes. The depth D of each concave structure CP1 may be equal to or less than the arrangement pitch P1 of the concave structures CP1. The depth D of each concave structure CP1 may be equal to or less than half the arrangement pitch P1 of the concave structures CP1. The shape of a cross section including the Z-axis of each concave structure CP1 (specifically, a cross section along the XZ plane) is a bowl-shaped curved shape, but may also be a triangle, a rectangle, or a polygon with pentagons or more sides.

[0081] The distance between two adjacent convex structures CP2 (i.e., the arrangement pitch P2 of the convex structures CP2) is, for example, several microns to several hundred microns, but may be other sizes. Furthermore, the height H of each convex structure CP2 (i.e., the height in the Z-axis direction) is, for example, several microns to several hundred microns, but may be other sizes. The height H of each convex structure CP2 may be equal to or less than the arrangement pitch P2 of the convex structures CP2. The height H of each convex structure CP2 may be equal to or less than half the arrangement pitch P2 of the convex structures CP2. The shape of a cross section including the Z-axis of each convex structure CP2 (specifically, a cross section along the XZ plane) is a mountain shape with curved slopes, but may also be a triangle, a rectangle, or a polygon with pentagons or more. Furthermore, each convex structure CP2 may have a ridge line.

[0082] The riblet structure itself formed by the machining system SYSa may be an existing riblet structure, such as that described in Chapter 5 of the "Mechanical Engineering Handbook: Basics, α4 Fluid Engineering" edited by the Japan Society of Mechanical Engineers, and therefore a detailed explanation of the riblet structure itself will be omitted.

[0083] As described above, such a riblet structure can reduce the resistance to a fluid on the surface of the workpiece S on which the riblet structure is formed. As described above, the riblet structure can reduce the resistance to a fluid on the surface of the workpiece S on which the riblet structure is formed. Therefore, the workpiece S may be an object (e.g., a structure) for which it is desired to reduce the resistance to a fluid. For example, the workpiece S may include an object (i.e., a mobile object) that is movable so that at least a portion of it moves through a fluid (e.g., at least one of a gas and a liquid). Specifically, for example, as shown in FIGS. 7(a) to 7(c), the workpiece S may include the body of an aircraft PL (e.g., at least one of a fuselage PL1, a main wing PL2, a vertical tail PL3, and a horizontal tail PL4). In this case, as shown in FIGS. 7(a) and 7(c), the processing apparatus 1 (or the processing system SYSa, the same applies hereinafter in this paragraph) may be self-supported on the body of the aircraft PL by a support device 14. Alternatively, because the end portions 144 of the leg members 142 of the support device 14 can be attached to the paint film SF, the processing device 1 may be attached to the fuselage of the aircraft PL so as to be suspended (i.e., hanging) from the fuselage of the aircraft PL by the support device 14, as shown in FIG. 7(b). Furthermore, because the end portions 144 of the leg members 142 of the support device 14 can be attached to the paint film SF and the end portions 134 of the partition members 132 of the storage device 13 can be attached to the paint film SF, the processing device 1 can stand on its own on the paint film SF even when the surface of the paint film SF is facing upward and inclined relative to the horizontal. Furthermore, even when the surface of the paint film SF is facing downward and inclined relative to the horizontal, the processing device 1 can be attached to the paint film SF so as to be suspended from the paint film SF. In either case, the light irradiation device 11 can be moved along the surface of the aircraft PL by the drive system 12 and / or by movement of the support device 14. Therefore, the processing system SYSa can form a riblet structure using a paint film SF even on a workpiece S such as an aircraft fuselage (i.e., a workpiece S with a curved surface, a surface that is inclined relative to the horizontal plane, or a surface that faces downward).

[0084] In addition, for example, the workpiece S may include an automobile body or an aerodynamic part. For example, the workpiece S may include the hull of a ship. For example, the workpiece S may include the body of a rocket. For example, the workpiece S may include a turbine (e.g., at least one of a water turbine and a wind turbine, etc., particularly a turbine blade thereof). For example, the workpiece S may include a component constituting an object that is movable so that at least a portion of it moves through a fluid. For example, the workpiece S may include an object at least a portion of which is fixed within a flowing fluid. Specifically, for example, the workpiece S may include a bridge girder installed in a river or the sea. For example, the workpiece S may include a pipe through which a fluid flows. In this case, the inner wall of the pipe may be the surface of the workpiece S described above.

[0085] Note that an example of the workpiece S given here is a relatively large object (for example, an object having a size on the order of several meters to several hundred meters). In this case, as shown in FIGS. 7(a) to 7(c), the size of the light irradiation device 11 is smaller than the size of the workpiece S. However, the workpiece S may be an object of any size. For example, the workpiece S may be an object having a size on the order of kilometers, centimeters, millimeters, or micrometers.

[0086] The characteristics of the above-described riblet structure may be set to appropriate characteristics that appropriately achieve a friction reduction effect, depending on the type of object the workpiece S is. In other words, the characteristics of the above-described riblet structure may be optimized to appropriately achieve a friction reduction effect, depending on the type of object the workpiece S is. More specifically, the characteristics of the riblet structure may be set to appropriate characteristics that appropriately achieve a friction reduction effect, depending on at least one of the type of fluid distributed around the workpiece S during use (i.e., during operation), the relative speed of the workpiece S with respect to the fluid, and the shape of the workpiece S. Furthermore, the characteristics of the above-described riblet structure may be set to appropriate characteristics that appropriately achieve a friction reduction effect, depending on the type of object the workpiece S is and on which part of the object the riblet structure is formed. For example, if the workpiece S is the airframe of an aircraft PL, the characteristics of the riblet structure formed on the fuselage PL1 may be different from the characteristics of the riblet structure formed on the main wing PL2.

[0087] The characteristics of the riblet structure may include the size of the riblet structure. The size of the riblet structure may include at least one of the arrangement pitch P1 of the concave structures CP1, the depth D of each concave structure CP1, the arrangement pitch P2 of the convex structures CP2, the height H of each convex structure CP2, etc. The characteristics of the riblet structure may include the shape of the riblet structure (for example, the shape of a cross section including the Z axis (specifically, a cross section along the XZ plane)). The characteristics of the riblet structure may include the extension direction of the riblet structure (i.e., the extension direction of the concave structures CP1). The characteristics of the riblet structure may include the formation position of the riblet structure.

[0088] As an example, if the workpiece S is the fuselage of an aircraft that flies at an altitude of 10 km and a speed of 1000 km / h during cruising, the arrangement pitch P1 of the concave structure CP1 (i.e., the arrangement pitch P2 of the convex structure CP2) may be set to, for example, approximately 78 micrometers.

[0089] (1-2-2) Processing flow Next, the flow of processing operations for forming the riblet structure will be described with reference to FIGS.

[0090] First, as described above, the multiple processing beams EL are deflected by the galvanometer mirror 1122. To form a riblet structure, the galvanometer mirror 1122 deflects the multiple processing beams EL so as to alternately repeat a scanning operation in which multiple target irradiation areas EA are moved along the Y-axis direction on the surface of the coating film SF and each of the multiple processing beams EL is irradiated onto a corresponding target irradiation area EA at a desired timing, and a stepping operation in which the multiple target irradiation areas EA are moved by a predetermined amount at least along the X-axis direction on the surface of the coating film SF. In this case, the Y-axis may be referred to as the scanning axis, and the X-axis may be referred to as the stepping axis.

[0091] Here, there is a limit to the size of the area on the surface of the coating film SF that can be scanned with multiple processing beams EL by controlling the galvanometer mirror 1122 while the light irradiation device 11 is stationary relative to the coating film SF. Therefore, in the first embodiment, as shown in Fig. 8, the control device 2 sets multiple processing shot areas SA on the surface of the coating film SF (particularly, the area of ​​the coating film SF where the riblet structure is to be formed). Each processing shot area SA corresponds to an area on the coating film SF that can be scanned with multiple processing beams EL by controlling the galvanometer mirror 1122 while the light irradiation device 11 is stationary relative to the coating film SF. The shape of each processing shot area SA is rectangular, but the shape is arbitrary.

[0092] The control device 2 controls the light irradiation device 11 to irradiate a portion of one processing shot area SA (e.g., SA1) with multiple beams of processing light EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the one processing shot area SA (SA1). The control device 2 then controls at least one of the drive systems 12 and 15 to move the light irradiation device 11 relative to the coating film SF, thereby positioning the light irradiation device 11 at a position where it can irradiate another processing shot area SA (e.g., SA2) with multiple beams of processing light EL. The control device 2 then controls the light irradiation device 11 to irradiate the other processing shot area SA (SA2) with multiple beams of processing light EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the other processing shot area SA. The control device 2 repeats the following operations for all processing shot areas SA1 to SA16, thereby forming a riblet structure.

[0093] The following explanation will be continued using the example of the operation of forming a riblet structure in the processing shot areas SA1 to SA4 shown in Figure 8. Note that the following explanation will be given using an example in which two processing shot areas SA adjacent along the X-axis direction are located within the storage space SP. However, the same operation is performed even when any number of processing shot areas SA are located within the storage space SP. Furthermore, the operation of forming a riblet structure shown below is merely an example, and the processing system SYS may form a riblet structure by performing an operation different from the operation shown below. In short, the processing system SYS may perform any operation as long as it can irradiate the workpiece S with multiple processing light EL and form a riblet structure on the workpiece S.

[0094] As shown in FIG. 9 , first, the control device 2 controls the drive system 15 to move the support device 14 relative to the coating film SF so that the accommodation device 13 is located at the first accommodation position where the processing shot areas SA1 and SA2 are located within the accommodation space SP. That is, the control device 2 moves the accommodation device 13 supported by the support device 14 so that the processing shot areas SA1 and SA2 are covered by the accommodation device 13. Furthermore, the control device 2 controls the drive system 12 to move the light irradiation device 11 relative to the coating film SF so that the light irradiation device 11 is located at the first irradiation position where it can irradiate the processing shot area SA1 with multiple processing beams EL. After the accommodation device 13 is located at the first accommodation position and the light irradiation device 11 is located at the first irradiation position, the partition member 132 is in a first extended state. Therefore, the end 134 of the partition member 132 contacts and adheres to the coating film SF. Similarly, the multiple leg members 142 are in a second extended state. Therefore, the ends 144 of the multiple leg members 142 contact and adhere to the paint film SF.

[0095] 10(a) and 10(b), the control device 2 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the processing shot area SA1 is scanned with a plurality of beams of processing light EL. Specifically, to perform the above-described scanning operation, the control device 2 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that a region within the processing shot area SA1 is scanned with a plurality of beams of processing light EL along the Y-axis direction. While the scanning operation is being performed, the light source system 111 emits a plurality of beams of processing light EL. Then, to perform the above-described stepping operation, the control device 2 rotates at least the X-scanning mirror 1122X of the galvanometer mirror 1122 by a unit step amount. While the stepping operation is being performed, the light source system 111 does not emit a plurality of beams of processing light EL. Then, to perform the above-described scanning operation, the control device 2 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that a region within the processing shot area SA1 is scanned with a plurality of beams of processing light EL along the Y-axis direction. In this way, the control device 2 controls the galvanometer mirror 1122 so that the entire processing shot area SA1 (or a part of the processing shot area SA1 where the riblet structure is to be formed) is scanned with a plurality of processing lights EL by alternately repeating the scanning operation and the stepping operation. Note that a plurality of processing lights EL may be emitted while the stepping operation is being performed.

[0096] That is, in the first embodiment, as shown in FIG. 11, which is a plan view showing the scanning trajectory of the processing light EL (i.e., the movement trajectory of the target irradiation area EA) during the period in which the scanning operation and the stepping operation are repeated, the processing apparatus 1 sequentially performs scanning operations on multiple scan areas SCA set within the processing shot area SA. FIG. 11 shows an example in which six scan areas SCA#1 to SCA#6 are set within the processing shot area SA. Each scan area SCA is an area scanned by multiple processing light beams EL irradiated in one scanning operation (i.e., a series of scanning operations without stepping operations). Each scan area SCA is an area through which multiple target irradiation areas EA move in one scanning operation. In this case, in one scanning operation, the target irradiation area EA moves from the scan start position SC_start of each scan area SCA to the scan end position SC_end. Such a scan area SCA is typically an area extending along the Y-axis direction (i.e., the scanning direction of the multiple processing light beams EL). The multiple scan areas SCA are arranged along the X-axis direction (i.e., the direction intersecting the scanning direction of the multiple processing light beams EL).

[0097] In this case, the processing system SYSa starts a scan operation, for example, from one scan area SCA located furthest on the +X side or furthest on the -X side among multiple scan areas SCA set in a certain processing shot area SA. For example, FIG. 11 shows an example in which the processing system SYSa starts a scan operation from a scan area SCA#1 located furthest on the -X side. In this case, the control device 2 controls the galvanometer mirror 1122 so that the processing light EL can be irradiated to a scan start position SC_start#1 of the scan area SCA#1 (e.g., the -Y side end of the scan area SCA#1 or its vicinity). In other words, the control device 2 controls the galvanometer mirror 1122 so that the target irradiation area EA is set at the scan start position SC_start#1 of the scan area SCA#1. Then, the processing system SYSa performs a scan operation on the scan area SCA#1. Specifically, the control device 2 controls the galvanometer mirror 1122 so that multiple target irradiation areas EA move from the scan start position SC_start#1 of the scan area SCA#1 toward the scan end position SC_end#1 of the scan area SCA#1 (for example, the +Y end of the scan area SCA#1 or its vicinity). Furthermore, the control device 2 controls the light irradiation device 11 so that multiple processing light beams EL are irradiated onto the corresponding target irradiation areas EA at desired timing. As a result, the scan area SCA#1 is scanned by multiple processing light beams EL. Note that, for simplicity of illustration, FIG. 11 shows the movement trajectory of one target irradiation area EA within each scan area SCA, but in reality, multiple target irradiation areas EA move within each scan area SCA. That is, for simplicity of illustration, FIG. 11 shows the scanning trajectory of one processing light beam EL within each scan area SCA, but in reality, each scan area SCA is scanned by multiple processing light beams EL.

[0098] After completing the scan operation for scan area SCA#1, the processing system SYSa performs a step operation to perform a scan operation for another scan area SCA different from scan area SCA#1. Specifically, the control device 2 controls the galvanometer mirror 1122 so that the processing light EL can be irradiated onto the scan start position SC_start#2 (e.g., the -Y side end of scan area SCA#2 or its vicinity) of scan area SCA#2 adjacent to scan area SCA#1 along the X-axis direction. That is, the control device 2 controls the galvanometer mirror 1122 so that the target irradiation area EA is set at the scan start position SC_start#2 of scan area SCA#2. As a result, as shown in FIG. 11 , the target irradiation area EA moves along both the X-axis and Y-axis directions. At this time, the movement amount of the target irradiation area EA in the X-axis direction may be the same as the size of the scan area SCA in the X-axis direction. The movement amount of the target irradiation area EA in the Y-axis direction may be the same as the size of the scan area SCA in the Y-axis direction.

[0099] Thereafter, the processing system SYSa performs a scan operation on the scan area SCA#2. Specifically, the control device 2 controls the galvanometer mirror 1122 so that the multiple target irradiation areas EA move from the scan start position SC_start#2 of the scan area SCA#2 toward the scan end position SC_end#2 of the scan area SCA#2 (for example, the +Y side end of the scan area SCA#2 or its vicinity). Furthermore, the control device 2 controls the light irradiation device 11 so that the multiple processing light beams EL are each irradiated onto the corresponding target irradiation areas EA at the desired timing. As a result, the scan area SCA#2 is scanned with the multiple processing light beams EL.

[0100] Thereafter, the same operation is repeated until the scanning operation for the scan areas SCA#3 to SCA#6 is completed.

[0101] In the example shown in FIG. 11, the scanning direction of the processing light EL by the scanning operation is fixed in the +Y-axis direction. The movement direction of the target irradiation area EA by the scanning operation is fixed in the +Y-axis direction. In other words, in the example shown in FIG. 11, the scanning directions of the processing light EL by the scanning operation performed multiple times within the processing shot area SA (i.e., the movement direction of the target irradiation area EA, the same applies below) are the same. The scanning directions of the multiple processing light EL that scan the multiple scan areas SCA are the same. The movement directions of the target irradiation area EA within the multiple scan areas SCA are the same. Specifically, the scanning direction of the processing light EL by the scanning operation performed on scan area SCA#1, the scanning direction of the processing light EL by the scanning operation performed on scan area SCA#2, ..., the scanning direction of the processing light EL by the scanning operation performed on scan area SCA#6 are the same.

[0102] By repeating such scanning and stepping operations, a riblet structure is formed in the processing shot area SA1. Note that, as shown in Figures 10(a) and 10(b), the width of the area scanned by the processing light EL (i.e., the width of the processing shot area SA, particularly the width in the X-axis direction) is larger than the width of the light irradiation device 11 (particularly the width in the X-axis direction).

[0103] During the process of repeating such scanning and stepping operations, the position of the target irradiation area EA may be shifted due to the operation of the galvanometer mirror 1122. For example, as the galvanometer mirror 1122 continues to operate, the temperature of the galvanometer mirror 1122 may change (typically, increase). When the temperature of the galvanometer mirror 1122 changes, the characteristics of the galvanometer mirror 1122 may change compared to before the temperature change. As a result, the position of the target irradiation area EA relative to the galvanometer mirror 1122 may change (i.e., the position of the target irradiation area EA may be shifted). Such a positional shift of the target irradiation area EA may hinder proper processing of the coating film SF. Therefore, the control device 2 may control the drive system 12 to move the light irradiation device 11 relative to the coating film SF so as to reduce the positional shift of the target irradiation area EA (i.e., to move the target irradiation area EA closer to its original position).

[0104] The control device 2 controls the drive system 15 so that the multiple leg members 142 remain in the second extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the ends 144 of the multiple leg members 142 continue to adhere to the coating film SF. This improves the stability of the support device 14, reducing the possibility that the target irradiation area EA of the processing light EL will unintentionally shift on the coating film SF due to instability of the support device 14. However, as long as the support device 14 can stand on its own on the coating film SF (or can be attached to the coating film SF so as to hang from the coating film SF) for at least part of the period while the light irradiation device 11 is irradiating the processing light EL, some of the multiple leg members 142 may be in the second contracted state.

[0105] The control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the end 134 of the partition member 132 continues to adhere to the coating film SF. As a result, the storage space SP is maintained airtight, so that the processing light EL propagating within the storage space SP does not leak out to the outside of the storage space SP (i.e., outside the storage device 13). Furthermore, unnecessary substances generated within the storage space SP do not leak out to the outside of the storage space SP (i.e., outside the storage device 13).

[0106] It is possible that at least a portion of the end 134, which should be attached to the coating film SF, may become detached from the coating film SF due to some factor. If the light irradiation device 11 continues to irradiate the processing light EL in this case, at least one of the processing light EL and the unnecessary material may leak out of the storage device 13. Therefore, the control device 2 may control the light irradiation device 11 to stop irradiating the processing light EL when it detects that at least a portion of the end 134 has become detached from the coating film SF while the light irradiation device 11 is irradiating the processing light EL.

[0107] 12, the control device 2 controls the drive system 12 so that the light irradiation device 11 moves from the first irradiation position to the second irradiation position where the light irradiation device 11 can irradiate the processing shot area SA2 with a plurality of beams of processing light EL. While the light irradiation device 11 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0108] 13(a) and 13(b), the control device 2 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that a plurality of processing light beams EL scan the processing shot area SA2. Specifically, the control device 2 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that a plurality of processing light beams EL scan the entire processing shot area SA2 (or a partial area of ​​the processing shot area SA2 where a riblet structure should be formed) by alternately repeating the above-described scanning operation and the above-described stepping operation. As a result, a riblet structure is formed in the processing shot area SA2. Note that the plurality of recessed structures CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as to be continuously connected to each of the plurality of recessed structures CP1 constituting the riblet structure in the processing shot area SA2 (or other processing shot areas SA) adjacent to the processing shot area SA1. Alternatively, the multiple recessed structures CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as not to be connected to each of the multiple recessed structures CP1 constituting the riblet structure in the processing shot area SA2. For example, the continuous length of one recessed structure CP1 formed as a result of scanning the processing shot area SA with the processing light EL depends on the size of the processing shot area SA (particularly the size in the Y-axis direction, which is the scanning direction of the processing light EL). Therefore, when the size of the processing shot area SA is large enough to realize a continuous length that allows the riblet structure to perform the above-mentioned function, the multiple recessed structures CP1 constituting the riblet structure in the processing shot area SA1 may be formed so as not to be connected to each of the multiple recessed structures CP1 constituting the riblet structure in the processing shot area SA2. As an example, if the processing target S is an aircraft, the continuous length that allows the riblet structure to perform the above-mentioned function is calculated to be approximately several millimeters based on the airspeed and the frequency of turbulence phenomena when the aircraft is in use (typically, during cruising).Therefore, when a processed shot area SA having a size in the Y-axis direction larger than approximately several mm can be set on the surface of the paint film SF, the multiple recessed structures CP1 that constitute the riblet structure in the processed shot area SA1 may be formed so as not to be connected to each other and the multiple recessed structures CP1 that constitute the riblet structure in the processed shot area SA2.

[0109] When a riblet structure is formed in the processing shot area SA2, there are no processing shot areas SA in which a riblet structure has not yet been formed remaining in the storage space SP. Therefore, simply moving the light irradiation device 11 within the storage space SP using the drive system 12 does not allow the light irradiation device 11 to irradiate multiple processing light beams EL onto the processing shot areas SA in which a riblet structure has not yet been formed and form a riblet structure. Therefore, when there are no processing shot areas SA in which a riblet structure has not yet been formed remaining in the storage space SP, the control device 2 controls the drive system 15 by moving the support device 14 (i.e., by moving the storage device 13) so that a processing shot area SA in which a riblet structure has not yet been formed is newly positioned within the storage space SP.

[0110] 14 , the control device 2 first controls a drive system (not shown) that expands and contracts the partition member 132 so that the state of the partition member 132 switches from a first extended state to a first contracted state. As a result, the end 134 of the partition member 132 moves away from the coating film SF. Note that while the support device 14 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL. Therefore, even if the end 134 moves away from the coating film SF, there is no possibility that at least one of the processing light EL and the unnecessary material will leak out of the storage device 13.

[0111] However, although the unnecessary substances present in the storage space SP are sucked out of the storage space SP by the exhaust device 16 described above, there is a possibility that, due to some factor, not all of the unnecessary substances present in the storage space SP are sucked out by the exhaust device 16 (i.e., the unnecessary substances remain in the storage space SP). In this case, when the end portion 134 separates from the coating film SF, the unnecessary substances may leak out of the storage device 13. For this reason, the control device 2 may determine whether to switch the partition member 132 from the first extended state to the first contracted state based on the detection result of the detection device 135 that detects the unnecessary substances in the storage space SP. If unnecessary substances remain in the storage space SP, the control device 2 may not switch the partition member 132 from the first extended state to the first contracted state. In this case, the exhaust device 16 continues to suck out the unnecessary substances remaining in the storage space SP. On the other hand, if no unnecessary substances remain in the storage space SP, the control device 2 may switch the partition member 132 from the first extended state to the first contracted state.

[0112] Furthermore, the control device 2 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the paint film SF as the support device 14 moves (in particular, as described below, the contracted beam member 141 expands) switches from the second extended state to the second contracted state. The leg members 142 that move relative to the paint film SF as the contracted beam member 141 expands are typically the leg members 142 located forward in the movement direction of the support device 14 (i.e., the movement direction of the storage device 13). In the example shown in FIG. 14 , the support device 14 moves toward the +X side, and the leg member 142 located forward in the movement direction of the support device 14 is the leg member 142 located forward in the movement direction of the support device 14. Hereinafter, the leg member 142 located forward in the movement direction of the support device 14 will be referred to as the “front leg member 142.” As a result, the end 144 of the front leg member 142 moves away from the paint film SF.

[0113] 15, the control device 2 controls the drive system 15 to move the accommodation device 13 from the first accommodation position to the second accommodation position where the processing shot areas SA3 and SA4 are located within the accommodation space SP. Specifically, the control device 2 controls the drive system 15 to extend the beam member 141 along the movement direction of the support device 14. As a result, the beam member 141 extends while supporting the accommodation device 13 (and further while supporting the light irradiation device 11 supported by the accommodation device 13). Furthermore, in parallel with the movement of the support device 14, the control device 2 controls the drive system 12 to move the light irradiation device 11 from the second irradiation position to the third irradiation position where the light irradiation device 11 can irradiate the processing shot area SA3 with multiple beams of processing light EL. As such, in the first embodiment, the support device 14 is self-propelled while being supported by the workpiece S. For this reason, the support device 14 may be referred to as a self-propelled device.

[0114] While the support device 14 is moving (i.e., while the contracted beam member 141 is expanding), the control device 2 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first contracted state. As a result, contact between the end 134 of the partition member 132 and the coating film SF does not hinder the movement of the support device 14 (i.e., the movement of the storage device 13). Furthermore, contact between the end 134 and the coating film SF during the movement of the support device 14 does not damage the coating film SF. However, if contact between the end 134 and the coating film SF does not hinder the movement of the support device 14, at least a portion of the end 134 may be in contact with the coating film SF for at least a portion of the period during which the support device 14 is moving. If the coating film SF is not damaged by contact between the end portion 134 and the coating film SF while the support device 14 is moving, at least a portion of the end portion 134 may be in contact with the coating film SF during at least part of the period during which the support device 14 is moving.

[0115] Furthermore, while the support device 14 is moving, the control device 2 controls the drive system 15 so that the front leg members 142 remain in the second contracted state. As a result, contact between the end 144 of the front leg members 142 and the coating film SF does not hinder the movement of the support device 14 (i.e., the movement of the storage device 13). Furthermore, contact between the end 144 and the coating film SF during the movement of the support device 14 does not damage the coating film SF. However, if contact between the end 144 and the coating film SF does not hinder the movement of the support device 14, at least a portion of the end 144 may be in contact with the coating film SF for at least a portion of the time the support device 14 is moving. If contact between the end 144 and the coating film SF does not damage the coating film SF during the movement of the support device 14, at least a portion of the end 144 may be in contact with the coating film SF for at least a portion of the time the support device 14 is moving.

[0116] Furthermore, while the support device 14 is moving, the control device 2 controls the drive system 15 so that the leg members 142 other than the front leg member 142 among the plurality of leg members 142 are maintained in the first extended state. As a result, even if the end 144 of the front leg member 142 separates from the paint film SF, the end 144 of the leg members 142 other than the front leg member 142 remains in contact with the paint film SF. Therefore, the support device 14 remains free-standing on the paint film SF (or can be attached to the paint film SF so as to hang down from the paint film SF), just as in the case where all the end portions 144 of the plurality of leg members 142 are in contact with the paint film SF.

[0117] Furthermore, while the support device 14 is moving, the control device 2 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0118] After the storage device 13 is placed in the second storage position, as shown in FIG. 16 , the control device 2 controls a drive system (not shown) that extends and contracts the partition member 132 so that the partition member 132 switches from the first contracted state to the first extended state. As a result, the end 134 of the partition member 132 comes into contact with and adheres to the paint film SF. Furthermore, the control device 2 controls the drive system 15 so that the front leg member 142 switches from the second contracted state to the second extended state. As a result, the end 144 of the front leg member 142 comes into contact with and adheres to the paint film SF. Here, the extension operation of the partition member 132 and the extension operation of the front leg member 142 may be performed simultaneously or with a time lag.

[0119] Thereafter, as shown in FIG. 17 , the control device 2 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the paint film SF as the support device 14 moves (particularly, as will be described later, as the extended beam member 141 contracts) is switched from the second extended state to the second contracted state. The leg member 142 that moves relative to the paint film SF as the extended beam member 141 contracts is typically the leg member 142 located on the rear side of the movement direction of the support device 14 among the multiple leg members 142. In the example shown in FIG. 17 , the leg member 142 located on the rear side of the movement direction of the support device 14 is the leg member 142 located on the −X side. Hereinafter, the leg member 142 located on the rear side of the movement direction of the support device 14 will be referred to as the “rear leg member 142.” As a result, the end 144 of the rear leg member 142 moves away from the paint film SF.

[0120] Thereafter, as shown in FIG. 18, the control device 2 controls the drive system 15 so that the beam members 141 that have been extended along the movement direction of the support device 14 contract.

[0121] After the beam member 141 has been contracted, the control device 2 controls the drive system 15 so that the rear leg member 142 switches from the second contracted state to the second extended state, as shown in Figure 19. As a result, the end 144 of the rear leg member 142 comes into contact with and adheres to the paint film SF.

[0122] Thereafter, the control device 2 controls the light irradiation device 11 so that the multiple processing light beams EL scan the processing shot areas SA3 and SA4 in the same manner as when the multiple processing light beams EL scan the processing shot areas SA1 and SA2. Similar operations are repeated thereafter, so that the multiple processing light beams EL are irradiated onto the surface of the coating film SF (particularly, the area of ​​the coating film SF where the riblet structure is to be formed). As a result, a riblet structure is formed on the workpiece S by the coating film SF.

[0123] (1-2-3) Foreign substance inspection and removal operations As described above, the foreign matter measuring device 31 and the control device 2 perform a foreign matter inspection operation. In the first embodiment, the foreign matter measuring device 31 and the control device 2 perform a foreign matter inspection operation on a target area on the surface of the coating film SF before a processing operation is performed on the target area. In other words, the processing device 1 performs a processing operation on a target area on the surface of the coating film SF after a foreign matter inspection operation is performed on the target area. The processing device 1 performs a processing operation on an inspected area on the surface of the coating film SF where a foreign matter inspection operation has been performed. The processing device 1 does not need to perform a processing operation on an uninspected area on the surface of the coating film SF where a foreign matter inspection operation has not been performed. However, the processing device 1 may perform a processing operation on at least a part of an uninspected area on the surface of the coating film SF where a foreign matter inspection operation has not been performed.

[0124] For example, the foreign matter measuring device 31 and the control device 2 may perform a foreign matter inspection operation on one of the multiple processing shot areas SA before performing a processing operation on that one processing shot area SA. In other words, the processing device 1 may perform a processing operation on one processing shot area SA after performing a foreign matter inspection operation on that one processing shot area SA. The processing device 1 may perform a processing operation on a processing shot area SA on the surface of the coating film SF for which a foreign matter inspection operation has been performed. The processing device 1 does not need to perform a processing operation on a processing shot area SA for which a foreign matter inspection operation has not been performed.

[0125] For example, the foreign substance measuring device 31 and the control device 2 may perform a foreign substance inspection operation on a region within one processing shot area SA before performing a processing operation on that region within one processing shot area SA. In other words, the processing device 1 may perform a processing operation on a region within one processing shot area SA after performing a foreign substance inspection operation on that region within one processing shot area SA. The processing device 1 may perform a processing operation on an inspected region within one processing shot area SA where a foreign substance inspection operation has been performed. The processing device 1 does not need to perform a processing operation on an uninspected region within one processing shot area SA where a foreign substance inspection operation has not been performed.

[0126] The foreign matter measuring device 31 and the light irradiation device 11 may be aligned so as to realize a state in which a foreign matter inspection operation is performed before a processing operation is performed. Specifically, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned based on the movement direction of the light irradiation device 11. Since the target irradiation area EA moves when the light irradiation device 11 moves, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned based on the movement direction of the target irradiation area EA.

[0127] For example, Fig. 20 is a plan view showing two processed shot areas SA#1 and SA#2 set on the coating film SF. In particular, Fig. 20 shows an example in which the two processed shot areas SA#1 and SA#2 are aligned along the X-axis direction, and the processed shot area SA#2 is set on the +X side of the processed shot area SA#1. Here, when the light irradiation device 11 performs processing operations on the processed shot areas SA#1 to SA#2 in this order, the light irradiation device 11 moves from above the processed shot area SA#1 toward above the processed shot area SA#2. In other words, the light irradiation device 11 moves along the X-axis direction and toward the +X side relative to the coating film SF. Furthermore, in accordance with the movement of the light irradiation device 11, the target irradiation area EA also moves along the X-axis direction and toward the +X side. In this case, as shown in Fig. 20, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned so that they are aligned along the X-axis direction (i.e., the movement direction of the light irradiation device 11, which is the movement direction of the target irradiation area EA). Furthermore, as shown in Fig. 20, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned so that the foreign matter measuring device 31 is located on the +X side of the light irradiation device 11 (i.e., the front side in the movement direction of the light irradiation device 11, which is the front side in the movement direction of the target irradiation area EA). As a result, as shown in Fig. 20, the area on the coating film SF where the processing operation is performed and the area on the coating film SF where the foreign matter inspection operation is performed are aligned along the X-axis direction (i.e., the movement direction of the light irradiation device 11, which is the movement direction of the target irradiation area EA). 20, an area where a foreign substance inspection operation is performed is located on the +X side of the area where a processing operation is performed (i.e., the front side in the movement direction of the light irradiation device 11, and the front side in the movement direction of the target irradiation area EA). Note that the area where a processing operation is performed in FIG. 20 is typically an area where the light irradiation device 11 irradiates processing light EL (in the example shown in FIG. 20, an area that at least partially includes the processing shot area SA#1). The area where a foreign substance inspection operation is performed in FIG. 20 is typically an area where at least a portion of the measurement area AMA is set (in the example shown in FIG. 20, an area that at least partially includes the processing shot area SA#2).As a result, the foreign matter measuring device 31 can perform a foreign matter inspection operation on the processed shot area SA#2 before the processing apparatus 1 performs a processing operation on the processed shot area SA#2. The processing apparatus 1 can perform a processing operation on the processed shot area SA#1 after the foreign matter measuring device 31 performs a foreign matter inspection operation on the processed shot area SA#1. This makes it possible to realize a state in which a foreign matter inspection operation is performed before a processing operation is performed.

[0128] 20 , the foreign matter measuring device 31 may perform a foreign matter inspection operation on the processing shot area SA#2 during at least a portion of the period when the processing apparatus 1 is performing a processing operation on the processing shot area SA#1. That is, the processing operation on one area on the coating film SF by the processing apparatus 1 and the foreign matter inspection operation on another area on the coating film SF by the foreign matter measuring device 31 may be performed in parallel. However, the processing operation on one area on the coating film SF by the processing apparatus 1 and the foreign matter inspection operation on the other area on the coating film SF by the foreign matter measuring device 31 do not have to be performed in parallel. For example, the foreign matter measuring device 31 may perform a foreign matter inspection operation during at least a portion of the period when the processing apparatus 1 is not performing a processing operation (that is, the period when the processing light EL is not irradiated onto the coating film SF).

[0129] 20 , the light irradiation device 11 and the foreign matter measuring device 31 do not have to be aligned along the X-axis, and the foreign matter measuring device 31 does not have to be positioned on the +X side of the light irradiation device 11, as long as the area where the processing operation is performed and the area where the foreign matter inspection operation is performed are aligned along the X-axis, and the area where the foreign matter inspection operation is performed is located on the +X side of the area where the processing operation is performed. In other words, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned so that the area where the processing operation is performed and the area where the foreign matter inspection operation is performed are aligned along the X-axis, and the area where the foreign matter inspection operation is performed is located on the +X side of the area where the processing operation is performed. Even in this case, it is possible to achieve a state where the foreign matter inspection operation is performed before the processing operation is performed.

[0130] Alternatively, for example, FIG. 21 is a plan view showing the movement trajectory of the target irradiation area EA due to a processing operation performed on a certain processing shot area SA. As shown in FIG. 21 (and further as already described with reference to FIG. 11), within the processing shot area SA, the target irradiation area EA moves along the Y-axis direction from the -Y side to the +Y side by a scanning operation. In this case, as shown in FIG. 21, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned so that they are aligned along the Y-axis direction (i.e., the movement direction of the target irradiation area EA). Furthermore, as shown in FIG. 21, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned so that the foreign matter measuring device 31 is located on the +Y side of the light irradiation device 11 (i.e., forward in the movement direction of the target irradiation area EA). As a result, as shown in FIG. 21, the area on the coating film SF where the processing operation is performed and the area on the coating film SF where the foreign matter inspection operation is performed are aligned along the Y-axis direction (i.e., the movement direction of the target irradiation area EA). Furthermore, as shown in FIG. 21, an area where a foreign substance inspection operation is performed is located on the +Y side of the area where a processing operation is performed (i.e., forward in the movement direction of the target irradiation area EA). The area where a processing operation is performed in FIG. 21 is typically an area where the target irradiation area EA is set. The area where a foreign substance inspection operation is performed in FIG. 21 is typically an area where at least a portion of the measurement area AMA is set. As a result, the foreign substance measuring device 31 can perform a foreign substance inspection operation on a region within the processing shot area SA before the processing device 1 performs a processing operation on the region within the processing shot area SA (specifically, before irradiating the region with processing light EL). This makes it possible to realize a state where a foreign substance inspection operation is performed before a processing operation is performed.

[0131] In the example shown in Figure 21, the foreign matter measuring device 31 may perform a foreign matter inspection operation on another area within a processing shot area SA during at least part of the period when the processing device 1 is performing a processing operation on one area within the same processing shot area SA.

[0132] 21 , the light irradiation device 11 and the foreign matter measuring device 31 do not have to be aligned along the Y axis, and the foreign matter measuring device 31 does not have to be positioned on the +Y side of the light irradiation device 11, as long as the area where the processing operation is performed and the area where the foreign matter inspection operation is performed are aligned along the Y axis and the area where the foreign matter inspection operation is performed is located on the +Y side of the area where the processing operation is performed. In other words, the foreign matter measuring device 31 and the light irradiation device 11 may be aligned so that the area where the processing operation is performed and the area where the foreign matter inspection operation is performed are aligned along the Y axis and the area where the foreign matter inspection operation is performed is located on the +Y side of the area where the processing operation is performed. Even in this case, it is possible to achieve a state where the foreign matter inspection operation is performed before the processing operation is performed.

[0133] 20 and 21 show an example in which the direction in which the light irradiation device 11 moves (X-axis direction in FIG. 20) to start a processing operation on one processing shot area SA after the processing operation on another processing shot area SA is different from the direction in which the target irradiation area EA moves during the scanning operation within the processing shot area SA (Y-axis direction in FIG. 21). However, the direction in which the light irradiation device 11 moves (Y-axis direction in FIG. 21) to start a processing operation on another processing shot area SA after the processing operation on one processing shot area SA is completed may be the same as the direction in which the target irradiation area EA moves during the scanning operation within the processing shot area SA. In this case, in both the situation shown in FIG. 20 and the situation shown in FIG. 21, it is possible to realize a state in which a foreign substance inspection operation is performed before a processing operation is performed.

[0134] Alternatively, the processing system SYSa may include multiple foreign matter measuring devices 31 that are positioned differently relative to the light irradiation device 11. In this case, a first foreign matter measuring device 31 among the multiple foreign matter measuring devices 31 may be aligned with the light irradiation device 11 along the movement direction of the light irradiation device 11 and disposed forward of the light irradiation device 11 in the movement direction of the light irradiation device 11. For example, the first foreign matter measuring device 31 may be aligned with the light irradiation device 11 along the X-axis direction and disposed on the +X side of the light irradiation device 11. On the other hand, a second foreign matter measuring device 31 among the multiple foreign matter measuring devices 31 may be aligned with the light irradiation device 11 along the movement direction of the target irradiation area EA and disposed forward of the light irradiation device 11 in the movement direction of the target irradiation area EA. For example, the second foreign matter measuring device 31 may be aligned with the light irradiation device 11 along the Y-axis direction and disposed on the +Y side of the light irradiation device 11. Even in this case, in both the situation shown in Figure 20 and the situation shown in Figure 21 (i.e., when the movement direction of the light irradiation device 11 and the movement direction of the target irradiation area EA are different), it is possible to realize a state in which a foreign matter inspection operation is performed before a processing operation is performed.

[0135] The control device 2 may control the processing device 1 based on the results of the foreign matter inspection operation. For example, if the foreign matter inspection operation determines that no foreign matter is present in a certain region of the surface of the coating film SF, the control device 2 may control the processing device 1 to start the processing operation on that certain region. On the other hand, for example, if the foreign matter inspection operation determines that a foreign matter is present in a certain region of the surface of the coating film SF, the control device 2 may control the processing device 1 not to start the processing operation on that certain region. In other words, if the foreign matter inspection operation determines that a foreign matter is present in a certain region of the surface of the coating film SF, the control device 2 may temporarily stop the processing device 1.

[0136] If the foreign matter inspection operation determines that a foreign matter is present in a certain region on the surface of the coating film SF, the control device 2 may control the foreign matter removal device 32 to remove the foreign matter from the certain region (i.e., perform a foreign matter removal operation on the certain region) based on the results of the foreign matter inspection operation. That is, the foreign matter removal device 32 may remove the foreign matter from the certain region in which the foreign matter inspection operation determined that the foreign matter is present. As described above, when the foreign matter removal device 32 removes the foreign matter, an abnormal event that could hinder proper processing of the certain region by irradiating the processing light EL is resolved. Therefore, the control device 2 may control the processing device 1 to start a processing operation on the certain region after the foreign matter removal device 32 removes the foreign matter from the certain region. Note that the foreign matter removal device 32 may also be referred to as a elimination device for resolving the abnormal event because it resolves the abnormal event by removing the foreign matter.

[0137] In this way, if the foreign matter inspection operation reveals the presence of a foreign matter in a certain region of the surface of the coating film SF, the foreign matter removal device 32 performs the foreign matter removal operation before performing the processing operation. In other words, the processing device 1 performs the processing operation after performing the foreign matter removal operation. Specifically, the foreign matter removal device 32 performs the foreign matter removal operation on a certain target region on the surface of the coating film SF before performing the processing operation on that target region. In other words, the processing device 1 performs the processing operation on that target region after performing the foreign matter removal operation on that target region on the surface of the coating film SF. The processing device 1 performs the processing operation on a removed region on the surface of the coating film SF where the foreign matter removal operation has been performed. The processing device 1 does not need to perform the processing operation on an unremoved region on the surface of the coating film SF where the foreign matter removal operation has not been performed.

[0138] The foreign matter removal device 32 and the light irradiation device 11 may be aligned so as to realize a state in which the foreign matter removal operation is performed before the processing operation. Specifically, the foreign matter removal device 32 and the light irradiation device 11 may be aligned according to the same criteria as the criteria for aligning the foreign matter measurement device 31 and the light irradiation device 11. Specifically, the foreign matter removal device 32 and the light irradiation device 11 may be aligned so that they are aligned along the movement direction of the light irradiation device 11 and / or the target irradiation area EA. The foreign matter removal device 32 and the light irradiation device 11 may be aligned so that the foreign matter removal device 32 is located forward of the light irradiation device 11 in the movement direction of the light irradiation device 11 and / or the target irradiation area EA. The area on the coating film SF where the processing operation is performed and the area on the coating film SF where the foreign matter removal operation is performed may be aligned along the movement direction of the light irradiation device 11 and / or the target irradiation area EA. The area where the foreign substance removal operation is performed may be located forward of the area where the processing operation is performed in the movement direction of the light irradiation device 11 and / or the target irradiation area EA.

[0139] Alternatively, the processing system SYSa may include a plurality of foreign matter removal devices 32 whose relative positions with respect to the light irradiation device 11 are different. In this case, a first foreign matter removal device 32 of the plurality of foreign matter removal devices 32 may be aligned with the light irradiation device 11 along the movement direction of the light irradiation device 11 and disposed further forward than the light irradiation device 11 in the movement direction of the light irradiation device 11. On the other hand, a second foreign matter removal device 32 of the plurality of foreign matter removal devices 32 may be aligned with the light irradiation device 11 along the movement direction of the target irradiation area EA and disposed further forward than the light irradiation device 11 in the movement direction of the target irradiation area EA. Even in this case, a state in which the foreign matter removal operation is performed before the processing operation can be realized in both the situation shown in FIG. 20 and the situation shown in FIG. 21 (i.e., when the movement direction of the light irradiation device 11 and the movement direction of the target irradiation area EA are different).

[0140] To determine whether the foreign matter has been removed by the foreign matter removal device 32, the control device 2 may control the foreign matter measurement device 31 to perform a foreign matter inspection operation on the one area again after the foreign matter removal device 32 has performed the foreign matter removal operation on the one area and before starting the processing operation on the one area. If it is determined that the foreign matter has been removed from the one area by the foreign matter inspection operation performed again on the one area, the control device 2 may control the processing device 1 to start the processing operation on the one area. On the other hand, if it is determined that the foreign matter has not yet been removed from the one area by the foreign matter inspection operation performed again on the one area, the control device 2 may control the foreign matter removal device 32 to remove the foreign matter from the one area.

[0141] Even if the foreign matter inspection operation reveals the presence of a foreign matter in a region on the surface of the coating film SF, the control device 2 may control the processing device 1 to start the processing operation without removing the foreign matter from the region, depending on the characteristics of the foreign matter. For example, if the size of the foreign matter present in the region is less than a predetermined size, the control device 2 may control the processing device 1 to start the processing operation without removing the foreign matter from the region. This is because the smaller the size of the foreign matter, the less likely it is that the foreign matter will interfere with proper processing of the region by irradiating it with the processing light EL. Therefore, if the size of the foreign matter is small enough not to interfere with proper processing of the region by irradiating it with the processing light EL, the processing device 1 should be able to process the region without being affected by the foreign matter. Therefore, the predetermined size, which is the threshold value compared with the size of the foreign matter, may be set to an appropriate value that can distinguish, based on size, between foreign matters that interfere with proper processing of the region by irradiating it with the processing light EL and foreign matters that do not interfere with proper processing of the region by irradiating it with the processing light EL. When starting a processing operation without removing foreign matter from one area, the processing device 1 may process the coating film SF together with the foreign matter. That is, the processing device 1 may process the coating film SF by irradiating the foreign matter together with the coating film SF with the processing light EL. In this case, the foreign matter may be evaporated by irradiation with the processing light EL, or may be burned by irradiation with the processing light EL.

[0142] The control device 2 may control the display 4 to display information about the foreign substance inspection operation. For example, the control device 2 may control the display 4 to display information about the results of the foreign substance inspection operation. For example, the control device 2 may control the display 4 to display information indicating whether a foreign substance was detected by the foreign substance inspection operation. If a foreign substance is detected by the foreign substance inspection operation, the control device 2 may control the display 4 to display a warning indicating that the machining operation cannot be started due to the foreign substance. For example, the control device 2 may control the display 4 to display information about the location (i.e., the position on the coating film SF) where the foreign substance was detected by the foreign substance inspection operation. For example, the control device 2 may control the display 4 to display information about the characteristics of the foreign substance detected by the foreign substance inspection operation. When information about the foreign substance inspection operation is displayed on the display 4, the operator of the machining system SYSa can understand, from the display results on the display 4, where and what type of foreign substance is present on the surface of the coating film SF. In this case, the operator may remove the foreign substance themselves. In other words, the foreign substance removal device 32 does not necessarily have to remove the foreign substance.

[0143] The control device 2 may control the display 4 to display information related to the foreign substance removal operation. For example, the control device 2 may control the display 4 to display information related to the result of the foreign substance removal operation. For example, the control device 2 may control the display 4 to display information indicating whether or not the foreign substance has been removed by the foreign substance removal operation. If the foreign substance has been removed by the foreign substance removal operation, for example, the control device 2 may control the display 4 to display information notifying the operator that a processing operation will be started because the foreign substance has been removed. If the foreign substance has not been removed by the foreign substance removal operation, for example, the control device 2 may control the display 4 to display a warning indicating that the processing operation cannot be started because the foreign substance could not be removed.

[0144] (1-4) Technical effects of the processing system SYSa As described above, the processing system SYSa of the first embodiment can form a riblet structure from the coating film SF on the surface of the workpiece S by irradiating the processing light EL onto the workpiece S (especially the coating film SF formed on the surface of the workpiece S). Therefore, the processing system SYSa can form a riblet structure relatively easily and in a relatively short time, compared to a processing device that forms a riblet structure by scraping away the surface of the workpiece S with a cutting tool such as an end mill.

[0145] Furthermore, the processing system SYSa can simultaneously irradiate a plurality of processing light beams EL to form a plurality of recessed structures CP1, thereby improving the throughput for forming the riblet structure compared to a processing device that can only form a single recessed structure CP1 at a time by irradiating a single processing light beam EL.

[0146] Furthermore, the processing system SYSa can scan the coating film SF at a relatively high speed by deflecting a plurality of processing light beams EL with the galvanometer mirror 1122. This improves the throughput for forming the riblet structure.

[0147] Furthermore, instead of directly processing the workpiece S, the processing system SYSa can form a riblet structure on the surface of the workpiece S by processing the coating film SF formed on the surface of the workpiece S. Therefore, compared to a processing system that forms a riblet structure by newly adding (e.g., attaching) a special material for forming the riblet structure to the surface of the workpiece S (i.e., the surface of the coating film SF), it is possible to avoid an increase in the weight of the workpiece S due to the formation of the riblet structure.

[0148] Furthermore, because the processing system SYSa does not directly process the workpiece S, it can relatively easily re-form the riblet structure. Specifically, when re-forming the riblet structure, the riblet structure formed by the coating film SF is first peeled off, and then a new coating film SF is applied. The processing system SYSa can then process the newly applied coating film SF to form a new riblet structure. Therefore, deterioration of the riblet structure (for example, damage, etc.) can be dealt with relatively easily by re-forming the riblet structure.

[0149] Furthermore, because the processing system SYSa does not directly process the workpiece S, it can form riblet structures on the surface of the workpiece S that is difficult to process directly or that does not originally have riblet structures formed on it. In other words, if the processing system SYSa processes the coating film SF after the coating film SF is applied to the surface of the workpiece S, it is possible to form riblet structures relatively easily.

[0150] In addition, when the coating film SF is applied to the workpiece S and then processed, the operation of processing the workpiece S may include an operation of applying (i.e., forming) the coating film SF to the workpiece S and an operation of processing the coating film SF (e.g., partially removing the coating film SF). The operation of applying the coating film SF to the workpiece S may be performed by the processing system SYSa. In this case, the processing system SYSa may be equipped with a coating device for applying the coating film SF to the workpiece S. Alternatively, the operation of applying the coating film SF to the workpiece S may be performed outside the processing system SYSa. For example, the operation of applying the coating film SF to the workpiece S may be performed by a coating device outside the processing system SYSa.

[0151] Furthermore, the processing system SYSa can form a riblet structure using a coating film SF. The coating film SF usually has relatively high durability against the external environment (for example, at least one of heat, light, and wind). Therefore, the processing system SYSa can relatively easily form a riblet structure with relatively high durability.

[0152] Furthermore, in the first embodiment, the optical path of the processing light EL between the final optical element of the optical system 112 and the coating film SF is included within the accommodation space SP. Therefore, compared to a processing system in which the optical path of the processing light EL is not included in the accommodation space SP (i.e., is open to an open space), it is possible to appropriately prevent the processing light EL irradiated onto the coating film SF (or the scattered light or reflected light of the processing light EL from the coating film SF, etc.) from propagating to the surroundings of the processing system SYSa (in other words, scattering). Furthermore, it is possible to appropriately prevent unnecessary substances generated by irradiation of the processing light EL from propagating to the surroundings of the processing system SYSa (in other words, scattering).

[0153] Furthermore, in the first embodiment, the light irradiation device 11 is supported by a support device 14 that is movable over the coating film SF. Therefore, the processing system SYSa can relatively easily process a coating film SF that extends over a relatively wide area. In other words, the processing system SYSa can form a riblet structure using the coating film SF over a relatively wide area on the surface of the workpiece S. Furthermore, because the processing system SYSa does not need to move the workpiece S, it can relatively easily form a riblet structure even on the surface of a relatively large or heavy workpiece S.

[0154] Furthermore, the processing system SYSa can use the exhaust device 16 to suck out unwanted substances generated by the irradiation of the processing light EL to the outside of the accommodation space SP. Therefore, the irradiation of the processing light EL onto the coating film SF is hardly hindered by unwanted substances. This improves the irradiation accuracy of the processing light EL compared to a processing system that does not have the exhaust device 16 (i.e., where the irradiation of the processing light EL onto the coating film SF may be hindered by unwanted substances). As a result, the formation accuracy of the riblet structure is improved.

[0155] Furthermore, the processing apparatus 1 can use the gas supply device 17 to prevent dirt from adhering to the optical surface 1124 (i.e., the optical surface on the storage space SP side of the terminal optical element of the optical system 112). Therefore, compared to a processing apparatus not equipped with the gas supply device 17, there is less chance that the irradiation of the processing light EL onto the coating film SF will be hindered by dirt that has adhered to the optical surface 1124. This improves the irradiation accuracy of the processing light EL. As a result, the formation accuracy of the riblet structure improves.

[0156] Furthermore, in the first embodiment, the processing system SYSa can perform a foreign matter inspection operation on the surface of the coating film SF using the foreign matter measurement device 31. Therefore, compared to when the foreign matter inspection operation is not performed, the possibility that a foreign matter will interfere with proper processing of the coating film SF by irradiating it with the processing light EL is reduced. Specifically, if the foreign matter inspection operation determines that a foreign matter is present, the processing operation is not started. Therefore, compared to when the processing operation is started even if it is determined that a foreign matter is present, the possibility that a foreign matter will interfere with proper processing of the coating film SF by irradiating it with the processing light EL is reduced.

[0157] Furthermore, the processing system SYSa can remove foreign matter from the surface of the coating film SF using the foreign matter removal device 32. Therefore, even if it is determined that foreign matter is present, the processing system SYSa can properly process the coating film SF without being affected by the foreign matter.

[0158] Furthermore, even if it is determined that a foreign object is present, the machining system SYSa can start a machining operation without removing the foreign object depending on the characteristics of the foreign object. Therefore, the execution of the machining operation is not excessively restricted due to the presence of the foreign object. Therefore, the throughput of the machining system SYSa is improved compared to when the machining operation is not started unless the foreign object is removed regardless of the characteristics of the foreign object.

[0159] (1-5) Modified example of processing system SYSa The processing system SYSa may not be equipped with the foreign matter measurement device 31. In other words, the processing system SYSa may not need to perform a foreign matter inspection operation. In this case, the control device 2 may control the foreign matter removal device 32 to perform a foreign matter removal operation without using the results of the foreign matter inspection operation. For example, the control device 2 may control the foreign matter removal device 32 to perform a foreign matter removal operation on the entire surface of the coating film SF. The control device 2 may also control the foreign matter removal device 32 to perform a foreign matter removal operation on an area of ​​the surface of the coating film SF where a processing operation is performed (particularly, an area irradiated with processing light EL). The control device 2 may also control the foreign matter removal device 32 to perform a foreign matter removal operation on an area of ​​the surface of the coating film SF where a foreign matter actually exists (however, because a foreign matter inspection operation is not performed, it cannot be determined whether a foreign matter exists in that area). The control device 2 may control the foreign matter removal device 32 to perform a foreign matter removal operation on an area of ​​the surface of the coating film SF where no foreign matter actually exists (however, because a foreign matter inspection operation is not performed on that area, it cannot be determined whether or not a foreign matter exists in that area). In this case, the control device 2 may consider that no foreign matter exists in the area of ​​the surface of the coating film SF where the foreign matter removal operation has been performed, and control the processing device 1 to perform a processing operation on the area where the foreign matter removal operation has been performed.

[0160] The processing system SYSa does not need to be equipped with the foreign matter removal device 32. In this case, if the foreign matter inspection operation reveals that a foreign matter is present in one region of the surface of the coating film SF, the operator of the processing system SYSa may remove the foreign matter.

[0161] The foreign matter measuring device 31 may measure defects occurring on the surface of the paint film SF in addition to or instead of foreign matters. Specifically, the foreign matter measuring device 31 may measure defects occurring in the measurement area AMA. In particular, in the first embodiment, the foreign matter measuring device 31 may measure defects occurring on the surface of the paint film SF before the riblet structure is formed (i.e., defects in the paint film SF itself). Examples of such defects in the paint film SF itself include at least one of at least partial peeling of the paint film SF, at least partial thickness unevenness of the paint film SF, unintentional depressions (e.g., dents) occurring on at least a portion of the surface of the paint film SF, and unintentional protrusions occurring on at least a portion of the surface of the paint film SF. However, as will be described in detail later in the second embodiment, the foreign matter measuring device 31 may also measure defects occurring on the surface of the paint film SF after the riblet structure is formed (i.e., at least one of defects in the paint film SF itself and defects in the riblet structure formed on the surface of the paint film SF). When the foreign matter measuring device 31 measures defects, the foreign matter measuring device 31 may be referred to as a defect measuring device. Alternatively, the processing system SYSa may include, in addition to or instead of the foreign matter measuring device 31, a defect measuring device for measuring defects occurring on the surface of the coating film SF.

[0162] If a defect occurs on the surface of the coating film SF, at least a portion of the processing light EL may not be irradiated properly onto the coating film SF. As a result, this may hinder proper processing of the coating film SF by irradiating it with the processing light EL. In other words, the defect may hinder proper processing of the coating film SF by irradiating it with the processing light EL. For this reason, the occurrence of a defect on the surface of the coating film SF corresponds to a specific example of an abnormal event that may hinder proper processing of the coating film SF by irradiating it with the processing light EL.

[0163] The foreign matter measuring device 31 may measure defects by performing the same operations as when measuring foreign matters. This is because, just as the surface state of the coating film SF differs between when a foreign matter is present and when a foreign matter is not present, the surface state of the coating film SF differs between when a defect is present and when no defect is present. Therefore, a detailed description of the operation of measuring defects by the foreign matter measuring device 31 will be omitted.

[0164] When the foreign matter measuring device 31 measures defects, the control device 2 may perform a defect inspection operation on the measurement area AMA based on the measurement results of the foreign matter measuring device 31 (which were referred to as "foreign matter measurement information" in the above description, but will be referred to as "defect measurement information" here). The defect inspection operation differs from the foreign matter inspection operation, which is an operation that targets foreign matters, in that the defect inspection operation targets defects. The content of the defect inspection operation may be the same as the content of the foreign matter inspection operation, which targets foreign matters, except that the target of the operation is defects. For example, the control device 2 may perform a defect detection operation to determine whether or not a defect has occurred in the measurement area AMA. For example, the control device 2 may calculate the characteristics of the defects (i.e., the state of the defects, e.g., at least one of the shape and size of the defects). For example, the control device 2 may calculate the number of defects. The control device 2 may perform the defect inspection operation based on the defect measurement information and feature information regarding the surface features of the coating film SF. For this reason, a detailed description of the defect inspection operation will be omitted.

[0165] When the foreign matter measuring device 31 measures defects, the foreign matter removal device 32 may perform a defect repair operation to repair the defects. Specifically, the foreign matter removal device 32 may repair defects occurring in the removal area RA (however, in this case, the removal area may also be referred to as a repair area). Note that when the foreign matter removal device 32 repairs defects, the foreign matter removal device 32 may also be referred to as a defect repair device. Alternatively, the processing system SYSa may include a defect repair device for repairing defects occurring on the surface of the coating film SF in addition to or instead of the foreign matter removal device 32.

[0166] The defect repair operation may include any operation as long as it is capable of repairing the defect. In other words, the foreign matter removal device 32 may be any device as long as it is capable of repairing the defect. For example, the foreign matter removal device 32 may repair the defect by adding a material (e.g., filling with a repair filler (e.g., putty)) to at least a portion of the surface of the coating film SF so that the surface condition of the coating film SF is ideal. For example, the foreign matter removal device 32 may repair the defect by removing (e.g., scraping off) at least a portion of the surface of the coating film SF so that the surface condition of the coating film SF is ideal.

[0167] (2) Machining system SYSb of the second embodiment Next, a machining system SYS of a second embodiment (hereinafter, the machining system SYS of the second embodiment will be referred to as a "machining system SYSb") will be described.

[0168] (2-1) Structure of the machining system SYSb First, the structure of the machining system SYSb of the second embodiment will be described with reference to Fig. 22. Fig. 22 is a cross-sectional view that schematically shows the overall structure of the machining system SYSb of the second embodiment.

[0169] 22, the processing system SYSb of the second embodiment differs from the processing system SYSa of the first embodiment in that it includes a defect measurement device 33b and a defect repair device 34b. Other features of the processing system SYSb may be the same as other features of the processing system SYSa. However, the processing system SYSb does not necessarily have to include the foreign matter measurement device 31 and the foreign matter removal device 32.

[0170] The defect measurement device 33b measures defects occurring on the surface of the coating film SF under the control of the control device 2. Specifically, the defect measurement device 33b measures defects occurring in an area of ​​the surface of the coating film SF that is included in the measurement range of the defect measurement device 33b (hereinafter referred to as the "measurement area DMA") under the control of the control device 2. Note that the defect inspection device 33b may measure defects occurring on the surface of the coating film SF regardless of the control by the control device 2.

[0171] The defect measurement device 33b may measure defects that occur on the surface of the coating film SF before the riblet structure is formed by the processing operation (i.e., defects in the coating film SF itself). An example of a defect in the coating film SF itself has already been described in the modified example of the first embodiment above.

[0172] The defect measurement device 33b may measure defects occurring on the surface of the paint film SF after the riblet structure has been formed by the processing operation. Defects occurring on the surface of the paint film SF after the riblet structure has been formed include at least one of defects in the paint film SF itself and defects in the riblet structure formed on the surface of the paint film SF. Defects in the riblet structure include defects in the characteristics (i.e., features) of the riblet structure. The characteristics of the riblet structure may include at least one of the formation position of the riblet structure, the cross-sectional shape of the riblet structure, the height of the riblet structure (specifically, at least one of the height H of the convex structures CP2 and the depth D of the concave structures CP1 described above), and the arrangement pitch of the riblet structure (specifically, at least one of the arrangement pitch P2H of the convex structures CP2 and the arrangement pitch P1 of the concave structures CP1 described above). A defect in the characteristics of the riblet structure may refer to a state in which the difference (i.e., error) between the actual characteristics of the riblet structure and the design characteristics (i.e., ideal characteristics) exceeds a tolerance. For example, a defect in the formation position of a riblet structure may mean a state in which the difference between the actual formation position of the riblet structure and the designed formation position exceeds a first tolerance. For example, a defect in the cross-sectional shape of a riblet structure may mean a state in which the difference between the actual cross-sectional shape of the riblet structure and the designed cross-sectional shape exceeds a second tolerance. For example, a defect in the formation position of a riblet structure may mean a state in which the difference between the actual height of the riblet structure and the designed height exceeds a third tolerance. For example, a defect in the arrangement pitch of a riblet structure may mean a state in which the difference between the actual arrangement pitch of the riblet structure and the designed arrangement pitch exceeds a fourth tolerance.

[0173] A riblet structure having such defects can be considered to have lower quality than a riblet structure without defects. Therefore, the operation of measuring defects occurring in a riblet structure can be considered to be substantially equivalent to the operation of measuring the quality of the riblet structure. In this case, the defect measurement device 33b can be referred to as a quality measurement device.

[0174] The defect measuring device 33b may be a measuring device capable of measuring the surface state of the coating film SF. In other words, the defect measuring device 33b may be a measuring device capable of measuring defects occurring on the surface of the coating film SF by measuring the surface state of the coating film SF. This is because the surface state of the coating film SF where a defect has occurred is different from the surface state of the coating film SF where no defect has occurred.

[0175] The defect measurement device 33b is attached to the mounting member 19 to which the light irradiation device 11 is attached. Therefore, the defect measurement device 33b also moves in accordance with the movement of the light irradiation device 11 by the drive system 12. In other words, the defect measurement device 33b moves relative to the coating film SF together with the light irradiation device 11. As a result, the measurement area DMA where the defect measurement device 33b measures defects also moves on the coating film SF. Therefore, the defect measurement device 33b can measure defects occurring in the measurement area DMA that can be set to a desired area on the coating film SF. However, the defect measurement device 33b does not have to be attached to the mounting member 19. The defect measurement device 33b may be attached to a member different from the mounting member 19. The defect measurement device 33b may be attached to the light irradiation device 11. The defect measurement device 33b may be movable independently of the light irradiation device 11. The defect measurement device 33b does not have to be movable.

[0176] The measurement results of the defect measurement device 33b (hereinafter referred to as "defect measurement information") are output to the control device 2. The control device 2 performs a defect inspection operation on the measurement area DMA based on the defect measurement information. In other words, the control device 2 performs a defect inspection operation on the measurement area DMA together with the defect measurement device 33b. For this reason, an apparatus (or a system) including the defect measurement device 33b and the control device 2 may be referred to as an inspection device or an inspection system that performs a defect inspection operation. In this case, the measurement area DMA may be referred to as the area to be inspected. As mentioned above, the operation of measuring defects occurring in the riblet structure may be considered equivalent to the operation of measuring the quality of the riblet structure. In this case, the defect inspection operation performed by the control device 2 may be considered to be substantially equivalent to a quality inspection operation that inspects the quality of the riblet structure (i.e., a quality judgment operation that determines whether the processing quality of the processing operation to form the riblet structure is good or not). In other words, the defect inspection operation performed by the control device 2 may be considered equivalent to an evaluation operation that evaluates the characteristics (features) of the riblet structure. For this reason, the control device 2 may be referred to as an evaluation device.

[0177] The control device 2 may perform a defect detection operation as at least a part of the defect inspection operation. That is, the control device 2 may determine whether or not a defect has occurred in the measurement area DMA based on the defect measurement information. The control device 2 may determine whether or not an abnormal event (particularly an abnormal event that a defect has occurred on the surface of the coating film SF) has occurred in the measurement area DMA based on the defect measurement information. In this case, the defect measurement device 33b may perform a measurement operation to measure the presence or absence of a defect in the measurement area DMA. That is, the defect measurement device 33b may perform a measurement operation to acquire defect measurement information that can be used to determine the presence or absence of a defect in the measurement area DMA.

[0178] If a defect is present in the measurement area DMA, the control device 2 may calculate the characteristics of the defect (in other words, the state or characteristics of the defect) based on the defect measurement information. That is, the control device 2 may perform a characteristic calculation operation to calculate the characteristics of the defect as at least a part of the defect inspection operation. For example, the control device 2 may calculate the shape of the defect, which is an example of the characteristics of the defect, based on the defect measurement information. The shape of the defect may include the two-dimensional shape of the defect (e.g., the shape in a plane along the XY plane) or the three-dimensional shape of the defect. Note that the control device 2 may calculate the shape of the area on the coating film SF where the defect occurs (e.g., the shape in a plane along the surface of the coating film SF) as the shape of the defect. For example, the control device 2 may calculate the size of the defect, which is an example of the characteristics of the defect, based on the defect measurement information. The size of the defect may include at least one of the size of the defect in the X-axis direction, the size of the defect in the Y-axis direction, and the size of the defect in the Z-axis direction. Note that the control device 2 may calculate the size of the area on the coating film SF where the defect occurs as the size of the defect. For example, based on the defect measurement information, the control device 2 may calculate, as an example of the characteristics of the defect, the difference between the characteristics of the riblet structure in which the defect occurs and the design characteristics (i.e., the deviation (error) of the actual characteristics of the riblet structure from the allowable value). In this case, the defect measurement device 33b may perform a measurement operation to measure the characteristics of the defect present in the measurement area DMA. In other words, the defect measurement device 33b may perform a measurement operation to acquire defect measurement information that can be used to calculate the characteristics of the defect in the measurement area DMA.

[0179] If defects exist in the measurement area DMA, the control device 2 may identify the number of defects based on the defect measurement information. That is, the control device 2 may perform a number calculation operation to calculate the number of defects as at least a part of the defect inspection operation. In this case, the defect measurement device 33b may perform a measurement operation to measure the number of defects existing in the measurement area DMA. That is, the defect measurement device 33b may perform a measurement operation to acquire defect measurement information that can be used to calculate the number of defects in the measurement area DMA.

[0180] The control device 2 may perform a defect inspection operation based on the defect measurement information and feature information regarding the surface features of the coating film SF (particularly, the features of the measurement area DMA on the surface of the coating film SF). For example, if no defects occur in the measurement area DMA, the actual features of the measurement area DMA indicated by the defect measurement information should match the design features (or ideal features) of the measurement area DMA indicated by the feature information. On the other hand, for example, if a defect occurs in the measurement area DMA, it is highly likely that the actual features of the measurement area DMA indicated by the defect measurement information will not match the design features (or ideal features) of the measurement area DMA indicated by the feature information. For this reason, the control device 2 may perform a defect inspection operation by comparing the defect measurement information with the feature information.

[0181] The control device 2 may perform a defect inspection operation based on the defect measurement information and design information related to the design characteristics of the riblet structure (i.e., features, e.g., at least one of the shape, size, and arrangement such as pitch and spacing). For example, if no defects occur in the measurement area DMA, the actual state of the surface of the coating film SF indicated by the defect measurement information (more specifically, the actual characteristics of the riblet structure formed on the surface of the coating film SF) should match the design characteristics of the riblet structure indicated by the design information. On the other hand, if a defect occurs in the measurement area DMA, for example, the actual characteristics of the riblet structure indicated by the defect measurement information are likely to differ from the design characteristics of the riblet structure indicated by the design information. For this reason, the control device 2 may perform a defect inspection operation by comparing the defect measurement information with the design information. When the design information is used in the defect inspection operation in this way, the control device 2 can more appropriately inspect the riblet structure for defects compared to when the design information is not used in the defect inspection operation. That is, the control device 2 can more appropriately inspect the processing quality of the riblet structure. In other words, the control device 2 can more appropriately evaluate the characteristics (features) of the riblet structure.

[0182] The defect measurement device 33b may be any measurement device as long as it can acquire defect measurement information usable for defect inspection operations. For example, the defect measurement device 33b may be capable of measuring the surface of the coating film SF in a non-contact manner. An example of a measurement device capable of measuring the surface of the coating film SF in a non-contact manner is a measurement device that can optically measure the surface of the coating film SF. Another example of a measurement device capable of measuring the measurement region DMA in a non-contact manner is a measurement device that measures the coating film SF using at least one of sound waves and radio waves.

[0183] As mentioned above, the above-described foreign matter measuring device 31 may also be a measuring device capable of measuring the surface of the coating film SF in a non-contact manner. Therefore, the defect measuring device 33b may be a measuring device similar to the foreign matter measuring device 31. For example, the defect measuring device 33b may include an imaging device (i.e., a camera) 311 capable of capturing an image of the surface of the coating film SF, similar to the foreign matter measuring device 31 (see FIG. 4 ). In this case, the control device 2 may perform a defect inspection operation by analyzing the image captured by the imaging device 311. When the defect measuring device 33b includes the imaging device 311, the area of ​​the surface of the coating film SF that is included in the imaging range of the imaging device 311 may be the measurement area DMA. Alternatively, the defect measuring device 33b may include a light receiving device 312 capable of receiving light from the surface of the coating film SF (especially, at least one of scattered light scattered on the surface of the coating film SF and diffracted light diffracted on the surface of the coating film SF), similar to the foreign matter measuring device 31 (see FIG. 5 ). As with the case where a foreign substance is present on the surface of the coating film SF, when a defect occurs on the surface of the coating film SF, the scattered light scattered on the surface of the coating film SF and / or the diffracted light diffracted on the surface of the coating film SF are more likely to travel in a direction different from the direction of the specularly reflected light of the inspection light. Therefore, the scattered light and / or the diffracted light may contain information about the defect. In this case, the control device 2 may calculate the characteristics (e.g., intensity) of the scattered light and / or the diffracted light from the light reception results of the light receiving device 312 and perform the defect inspection operation based on the calculated characteristics of the scattered light and / or the diffracted light. When the defect measurement device 33b includes the light receiving device 312, the area on the surface of the coating film SF irradiated with the light for defect inspection (i.e., the area from which the scattered light and / or the diffracted light is emitted) may be the measurement area DMA.

[0184] The defect repair device 34b repairs defects occurring on the surface of the coating film SF under the control of the control device 2. That is, the defect repair device 34b performs a defect repair operation to repair defects under the control of the control device 2. Specifically, the defect repair device 34b repairs defects occurring in an area of ​​the surface of the coating film SF that is included in the repair range where the defect repair device 34b performs the defect repair operation (hereinafter referred to as the "repair area PA"). Note that the defect repair device 34b may also repair defects occurring on the surface of the coating film SF regardless of the control by the control device 2.

[0185] The repair area PA may coincide with the measurement area DMA described above. That is, the defect measuring device 33b and the defect repair device 34b may be aligned so that the repair area PA and the measurement area DMA coincide. Alternatively, the repair area PA may partially overlap with the measurement area DMA described above. That is, the defect measuring device 33b and the defect repair device 34b may be aligned so that the repair area PA and the measurement area DMA partially overlap. Alternatively, the repair area PA may not overlap with the measurement area DMA described above. That is, the defect measuring device 33b and the defect repair device 34b may be aligned so that the repair area PA and the measurement area DMA do not overlap. Note that FIG. 22 shows an example in which the repair area PA and the measurement area DMA coincide.

[0186] The defect repair device 34b is attached to the mounting member 19 to which the light irradiation device 11 is attached. Therefore, the defect repair device 34b also moves in accordance with the movement of the light irradiation device 11 by the drive system 12. That is, the defect repair device 34b moves together with the light irradiation device 11 relative to the coating film SF. As a result, the repair area PA in which the defect repair device 34b repairs defects also moves on the coating film SF. Therefore, the defect repair device 34b can remove defects present in the repair area PA, which can be set to a desired area on the coating film SF. However, the defect repair device 34b does not have to be attached to the mounting member 19. The defect repair device 34b may be attached to a member different from the mounting member 19. The defect repair device 34b may be attached to the light irradiation device 11. The defect repair device 34b may be movable independently of the light irradiation device 11. The defect repair device 34b may be movable independently of the defect measurement device 33b. The defect repair device 34b does not have to be movable.

[0187] The defect repair device 34b may include any device as long as it is capable of repairing defects. For example, the defect repair device 34b may repair defects by adding material to at least a portion of the surface of the paint film SF (for example, by filling a repair filler (e.g., putty)) so that the surface condition of the paint film SF becomes ideal. For example, the defect repair device 34b may repair defects by removing (for example, scraping off) at least a portion of the surface of the paint film SF so that the surface condition of the paint film SF becomes ideal. For example, the defect repair device 34b may repair defects by adding material to at least a portion of the riblet structure (for example, by filling a repair filler (e.g., putty)) so that the characteristics of the riblet structure become design characteristics. For example, the defect repair device 34b may repair defects by removing (for example, scraping off) at least a portion of the riblet structure so that the characteristics of the riblet structure become design characteristics.

[0188] Furthermore, when a defective riblet structure is repaired, the quality of the riblet structure should improve, and therefore, the operation of repairing defects in the riblet structure may be considered to be substantially equivalent to the operation of improving the quality of the riblet structure (i.e., the processing quality due to the processing operation).

[0189] Furthermore, considering that the riblet structure is formed by irradiating the processing light EL, it should be possible to repair defects (particularly defects in the riblet structure) occurring on the surface of the coating film SF by irradiating the processing light EL. For this reason, the control device 2 may repair defects (particularly defects in the riblet structure) by controlling the processing device 1 in addition to or instead of the defect repair device 34b. In other words, the control device 2 may control the processing device 1 to irradiate the surface of the coating film SF with the processing light EL to repair defects (particularly defects in the riblet structure). When defects are repaired using the processing device 1 in this way, the processing system SYSb does not need to be equipped with the defect repair device 34b.

[0190] (2-2) Defect inspection and repair operations Next, a specific flow of a defect inspection operation using the defect measurement device 34b and a defect repair operation using the defect repair device 34b will be described.

[0191] As described above, the defect measurement device 33b and the control device 2 perform a defect inspection operation. In the second embodiment, the defect measurement device 33b and the control device 2 perform a defect inspection operation on a target area on the surface of the coating film SF after a processing operation on the target area has been performed. The defect measurement device 33b and the control device 2 perform a defect inspection operation on a processed area on the surface of the coating film SF where a processing operation has been performed. The defect measurement device 33b and the control device 2 do not need to perform a defect inspection operation on an unprocessed area on the surface of the coating film SF where no processing operation has been performed. As a result, the defect measurement device 33b and the control device 2 can properly inspect not only defects in the coating film SF itself, but also defects in the riblet structure formed by the processing operation. In other words, the defect measurement device 33b and the control device 2 can properly inspect the quality of the riblet structure formed by the processing operation. The defect measurement device 33b and the control device 2 can properly evaluate the characteristics of the riblet structure formed by the processing operation.

[0192] For example, the defect measurement device 33b and the control device 2 may perform a defect inspection operation on one of the processing shot areas SA after a processing operation has been performed on that one processing shot area SA among the multiple processing shot areas SA. The defect measurement device 33b and the control device 2 may perform a defect inspection operation on a processing shot area SA on the surface of the coating film SF on which a processing operation has been performed. The defect measurement device 33b and the control device 2 may not perform a defect inspection operation on a processing shot area SA on the surface of the coating film SF on which a processing operation has not been performed.

[0193] For example, the defect measurement device 33b and the control device 2 may perform a defect inspection operation on a portion of one processing shot area SA after a processing operation on that portion has been performed. The defect measurement device 33b and the control device 2 may perform a defect inspection operation on a processed portion of one processing shot area SA where a processing operation has been performed. The defect measurement device 33b and the control device 2 may not perform a defect inspection operation on an unprocessed portion of one processing shot area SA where a processing operation has not been performed.

[0194] The defect measuring device 33b and the light irradiation device 11 may be aligned so as to realize a state in which a defect inspection operation is performed after a processing operation is performed. Specifically, the defect measuring device 33b and the light irradiation device 11 may be aligned based on the movement direction of the light irradiation device 11. Since the target irradiation area EA moves when the light irradiation device 11 moves, the defect measuring device 33b and the light irradiation device 11 may be aligned based on the movement direction of the target irradiation area EA.

[0195] For example, FIG. 23 is a plan view showing three processed shot areas SA#1 to SA#3 set on the coating film SF. In particular, FIG. 23 shows an example in which the three processed shot areas SA#1 to SA#3 are aligned along the X-axis direction, with processed shot area SA#2 set on the +X side of processed shot area SA#1, and processed shot area SA#3 set on the +X side of processed shot area SA#2. Here, when the light irradiation device 11 performs processing operations on the processed shot areas SA#1 to SA#3 in this order, the light irradiation device 11 moves from above the processed shot area SA#1 to above the processed shot area SA#2, and then moves from above the processed shot area SA#2 toward the processed shot area SA#3. In other words, the light irradiation device 11 moves along the X-axis direction and toward the +X side relative to the coating film SF. Furthermore, in accordance with the movement of the light irradiation device 11, the target irradiation area EA also moves along the X-axis direction and toward the +X side. In this case, as shown in Fig. 23, the defect measuring device 33b and the light irradiation device 11 may be aligned so that the defect measuring device 33b and the light irradiation device 11 are aligned along the X-axis direction (i.e., the movement direction of the light irradiation device 11, the movement direction of the target irradiation area EA). Furthermore, as shown in Fig. 23, the defect measuring device 33b and the light irradiation device 11 may be aligned so that the defect measuring device 33b is located on the -X side of the light irradiation device 11 (i.e., the rear side in the movement direction of the light irradiation device 11, the rear side in the movement direction of the target irradiation area EA). As a result, as shown in Fig. 23, the area on the coating film SF where the processing operation is performed and the area on the coating film SF where the defect inspection operation is performed are aligned along the X-axis direction (i.e., the movement direction of the light irradiation device 11, the movement direction of the target irradiation area EA). 23, an area where a defect inspection operation is performed is located on the -X side of the area where the processing operation is performed (i.e., the rear side in the movement direction of the light irradiation device 11, and the rear side in the movement direction of the target irradiation area EA). Note that the area where the processing operation is performed in Fig. 23 is typically an area where the light irradiation device 11 irradiates processing light EL (an area that at least partially includes the processing shot area SA#2 in the example shown in Fig. 23).23, the area where the defect inspection operation is performed is typically an area where at least a portion of the measurement area DMA is set (in the example shown in FIG. 23, an area that at least partially includes the processed shot area SA#1). As a result, the defect measurement device 33b can perform a defect inspection operation on the processed shot area SA#1 after the processing device 1 performs a processing operation on the processed shot area SA#1. This makes it possible to realize a state in which a defect inspection operation is performed after a processing operation is performed.

[0196] In the example shown in FIG. 23 , the defect measurement device 33b may perform a defect inspection operation on the processing shot area SA#1 during at least a portion of the period during which the processing apparatus 1 is performing a processing operation on the processing shot area SA#2. That is, the processing operation on one area on the coating film SF by the processing apparatus 1 and the defect inspection operation on another area on the coating film SF by the defect measurement device 33b may be performed in parallel. However, the processing operation on one area on the coating film SF by the processing apparatus 1 and the defect inspection operation on the other area on the coating film SF by the defect measurement device 33b do not have to be performed in parallel. For example, the defect measurement device 33b may perform a defect inspection operation during at least a portion of the period during which the processing apparatus 1 is not performing a processing operation (i.e., the period during which the processing light EL is not irradiated onto the coating film SF). As an example, the defect measurement device 33b may perform a defect inspection operation during periodic maintenance of the coating film SF (particularly, periodic maintenance of the riblet structure).

[0197] 23 , as long as the area where the processing operation is performed and the area where the defect inspection operation is performed are aligned along the X-axis direction and the area where the defect inspection operation is performed is located on the −X side of the area where the processing operation is performed, the light irradiation device 11 and the defect measurement device 33b do not have to be aligned along the X-axis direction, and the defect measurement device 33b does not have to be located on the −X side of the light irradiation device 11. In other words, the defect measurement device 33b and the light irradiation device 11 may be aligned so that the area where the processing operation is performed and the area where the defect inspection operation is performed are aligned along the X-axis direction and the area where the defect inspection operation is performed is located on the −X side of the area where the processing operation is performed. Even in this case, it is possible to achieve a state where the defect inspection operation is performed after the processing operation.

[0198] Alternatively, for example, FIG. 24 is a plan view showing the movement trajectory of the target irradiation area EA due to a processing operation performed on a certain processing shot area SA. As shown in FIG. 24 (and as already described with reference to FIG. 11), within the processing shot area SA, the target irradiation area EA moves along the Y-axis direction from the -Y side to the +Y side by a scanning operation. In this case, as shown in FIG. 24, the defect measurement device 33b and the light irradiation device 11 may be aligned so that they are aligned along the Y-axis direction (i.e., the movement direction of the target irradiation area EA). Furthermore, as shown in FIG. 24, the defect measurement device 33b and the light irradiation device 11 may be aligned so that the defect measurement device 33b is located on the -Y side of the light irradiation device 11 (i.e., behind the light irradiation device 11 in the movement direction of the target irradiation area EA). As a result, as shown in FIG. 24, the area on the coating film SF where the processing operation is performed and the area on the coating film SF where the defect inspection operation is performed are aligned along the Y-axis direction (i.e., the movement direction of the target irradiation area EA). Furthermore, as shown in FIG. 24, an area where a defect inspection operation is performed is located on the -Y side of the area where a processing operation is performed (i.e., rearward in the movement direction of the target irradiation area EA). The area where a processing operation is performed in FIG. 24 is typically an area where the target irradiation area EA is set. The area where a defect inspection operation is performed in FIG. 24 is typically an area where at least a part of the measurement area DMA is set. As a result, the defect measurement device 33b can perform a defect inspection operation on one area in the processing shot area SA after the processing device 1 performs a processing operation on that area (specifically, after irradiating it with processing light EL). This makes it possible to realize a state where a defect inspection operation is performed after a processing operation is performed.

[0199] In the example shown in Figure 24, the defect measurement device 33b may perform a defect inspection operation on another area within the processing shot area SA during at least part of the period when the processing device 1 is performing a processing operation on one area within the processing shot area SA.

[0200] 24, as long as the area where the processing operation is performed and the area where the defect inspection operation is performed are aligned along the Y-axis direction and the area where the defect inspection operation is performed is located on the -Y side of the area where the processing operation is performed, the light irradiation device 11 and the defect measurement device 33b do not have to be aligned along the Y-axis direction, and the defect measurement device 33b does not have to be located on the -Y side of the light irradiation device 11. In other words, the defect measurement device 33b and the light irradiation device 11 may be aligned so that the area where the processing operation is performed and the area where the defect inspection operation is performed are aligned along the Y-axis direction and the area where the defect inspection operation is performed is located on the -Y side of the area where the processing operation is performed. Even in this case, it is possible to achieve a state where the defect inspection operation is performed after the processing operation.

[0201] 23 and 24 show an example in which the direction in which the light irradiation device 11 moves after the processing operation on one processing shot area SA is completed and in which the processing operation on another processing shot area SA is started (the X-axis direction in FIG. 23) is different from the direction in which the target irradiation area EA moves during the scanning operation within the processing shot area SA (the Y-axis direction in FIG. 24). However, the direction in which the light irradiation device 11 moves after the processing operation on one processing shot area SA is completed and in which the processing operation on another processing shot area SA is started may be the same as the direction in which the target irradiation area EA moves during the scanning operation within the processing shot area SA. In this case, in both the situation shown in FIG. 23 and the situation shown in FIG. 24, it is possible to realize a state in which a defect inspection operation is performed after a processing operation.

[0202] Alternatively, the processing system SYSb may include multiple defect measurement devices 33b whose relative positions with respect to the light irradiation device 11 are different. In this case, a first defect measurement device 33b among the multiple defect measurement devices 33b may be aligned with the light irradiation device 11 along the movement direction of the light irradiation device 11 and disposed behind the light irradiation device 11 in the movement direction of the light irradiation device 11. For example, the first defect measurement device 33b may be aligned with the light irradiation device 11 along the X-axis direction and disposed on the -X side of the light irradiation device 11. On the other hand, a second defect measurement device 33b among the multiple defect measurement devices 33b may be aligned with the light irradiation device 11 along the movement direction of the target irradiation area EA and disposed behind the light irradiation device 11 in the movement direction of the target irradiation area EA. For example, the second defect measurement device 33b may be aligned with the light irradiation device 11 along the Y-axis direction and disposed on the -Y side of the light irradiation device 11. Even in this case, in both the situation shown in Figure 23 and the situation shown in Figure 24 (i.e., when the movement direction of the light irradiation device 11 and the movement direction of the target irradiation area EA are different), it is possible to realize a state in which a defect inspection operation is performed after a processing operation.

[0203] 23 and 24 show the positional relationship between the light irradiation device 11 and the defect measurement device 33b, as well as the positional relationship between the light irradiation device 11 and the foreign substance measurement device 31 described in FIGS. 20 and 21 (i.e., the positional relationship between the area where the processing operation is performed and the area where the foreign substance inspection operation is performed). As shown in FIGS. 23 and 24, the defect measurement device 33b and the foreign substance measurement device 31 may be arranged along the X-axis direction (i.e., the movement direction of the light irradiation device 11 and the movement direction of the target irradiation area EA) so as to sandwich the light irradiation device 11 therebetween. Furthermore, the area where the defect inspection operation is performed and the area where the foreign substance inspection operation is performed may be arranged along the X-axis direction (i.e., the movement direction of the light irradiation device 11 and the movement direction of the target irradiation area EA) so as to sandwich the area where the processing operation is performed therebetween. As a result, a state is realized in which the foreign substance inspection operation is performed before the processing operation and the defect inspection operation is performed after the processing operation. In other words, a state is realized in which the foreign substance inspection operation, the processing operation, and the defect inspection operation are performed in this order for a certain area on the coating film SF.

[0204] However, the defect measuring device 33b and the control device 2 may perform a defect inspection operation on a target area on the surface of the coating film SF before performing a processing operation on the target area. In other words, the processing device 1 may perform a processing operation on a target area on the surface of the coating film SF after performing a defect inspection operation on the target area. Such a defect inspection operation may be considered to be substantially equivalent to the defect inspection operation performed by the foreign matter measuring device 31 and the control device 2 described in the modification of the first embodiment.

[0205] If the defect inspection operation reveals that a defect has occurred in a certain region of the surface of the coating film SF, the control device 2 may control the defect repair device 34b to repair the defect that has occurred in the certain region (i.e., perform a defect repair operation on the certain region) based on the results of the defect inspection operation. In other words, the defect repair device 34b may repair the defect in the certain region that has been revealed to have a defect by the defect inspection operation based on the results of the defect inspection operation. When the defect repair device 34b repairs the defect, the abnormal event of a defect occurring on the surface of the coating film SF is resolved. For this reason, the defect repair device 34b may also be referred to as a elimination device for resolving the abnormal event.

[0206] As described above, because the defect inspection operation is performed after the processing operation, the defect repair device 34b performs the defect repair operation after the processing operation. In other words, after the processing operation is performed on a target area on the surface of the coating film SF, the defect repair device 34b performs the defect repair operation on that target area as necessary. The defect repair device 34b and the light irradiation device 11 may be aligned to achieve a state in which the defect removal operation is performed after the processing operation. Specifically, the defect repair device 34b and the light irradiation device 11 may be aligned according to the same criteria as the criteria for aligning the defect measurement device 33b and the light irradiation device 11. Specifically, the defect repair device 34b and the light irradiation device 11 may be aligned so that they are aligned along the movement direction of the light irradiation device 11 and / or the target irradiation area EA. The defect repair device 34b and the light irradiation device 11 may be aligned so that the defect repair device 34b is located behind the light irradiation device 11 in the movement direction of the light irradiation device 11 and / or the target irradiation area EA. The area on the coating film SF where the processing operation is performed and the area on the coating film SF where the defect repair operation is performed may be aligned along the movement direction of the light irradiation device 11 and / or the target irradiation area EA. The area where the defect repair operation is performed may be located behind the area where the processing operation is performed in the movement direction of the light irradiation device 11 and / or the target irradiation area EA.

[0207] Alternatively, the processing system SYSb may include a plurality of defect repair devices 34b whose relative positions with respect to the light irradiation device 11 are different. In this case, a first defect repair device 34b of the plurality of defect repair devices 34b may be aligned with the light irradiation device 11 along the movement direction of the light irradiation device 11 and disposed behind the light irradiation device 11 in the movement direction of the light irradiation device 11. On the other hand, a second defect repair device 34b of the plurality of defect repair devices 34b may be aligned with the light irradiation device 11 along the movement direction of the target irradiation area EA and disposed behind the light irradiation device 11 in the movement direction of the target irradiation area EA. Even in this case, a state in which a defect repair operation is performed after a processing operation can be realized in both the situation shown in FIG. 23 and the situation shown in FIG. 24 (that is, when the movement direction of the light irradiation device 11 and the movement direction of the target irradiation area EA are different).

[0208] If the defect inspection operation reveals that a defect has occurred in a certain region on the surface of the coating film SF, the control device 2 may control the processing device 1 to repair the defect that has occurred in the certain region (i.e., to perform a defect repair operation on the certain region) based on the results of the defect inspection operation. This is because, as described above, defects can also be repaired by irradiating the coating film SF with processing light EL. Therefore, the processing device 1 may irradiate the certain region, in which a defect has been found to have occurred by the defect inspection operation, with processing light EL so as to repair the defect.

[0209] To determine whether the defect has been repaired by the defect repair device 34b and / or the processing device 1, the control device 2 may control the defect measurement device 33b to perform a defect inspection operation on the one area again after the defect repair device 34b and / or the processing device 1 has performed the defect repair operation on the one area. If the defect inspection operation performed again on the one area determines that the defect in the one area has not yet been repaired (i.e., the defect still exists), the control device 2 may control the defect repair device 34b and / or the processing device 1 to repair the defect in the one area.

[0210] Depending on the content of the defect repair operation, the control device 2 may control the processing device 1 to perform a processing operation on the area where the defect repair operation has been performed (i.e., to form a riblet structure) after the defect repair operation has been performed. For example, as described above, the defect repair device 34b may perform an operation of filling the surface of the coating film SF with a filler material (e.g., putty, etc.) as the defect repair operation. In this case, the defect repair device 34b may fill the surface of the coating film SF with the filler material so that the surface of a new layer formed on the coating film SF by the filler material is flat. Thereafter, the processing device 1 may perform a processing operation on the surface of the new layer formed on the coating film SF by the filler material. In other words, the processing device 1 may form a riblet structure on the surface of the new layer formed on the coating film SF by the filler material.

[0211] The control device 2 may control the display 4 to display information about the defect inspection operation. For example, the control device 2 may control the display 4 to display information about the results of the defect inspection operation. For example, the control device 2 may control the display 4 to display information indicating whether or not a defect was detected by the defect inspection operation. For example, the control device 2 may control the display 4 to display information about the quality of the riblet structure determined by the defect inspection operation (i.e., the evaluation results of the characteristics of the riblet structure). For example, the control device 2 may control the display 4 to display information about the location (i.e., the position on the coating film SF) where a defect was detected by the defect inspection operation. For example, the control device 2 may control the display 4 to display information about the characteristics of a defect detected by the defect inspection operation. When information about the defect inspection operation is displayed on the display 4, the operator of the machining system SYSb can understand, from the display results on the display 4, where and what type of defect has occurred on the surface of the coating film SF. In this case, the operator may repair the defect themselves. In other words, the defect repair device 34b does not necessarily repair the defect.

[0212] The control device 2 may control the display 4 to display information regarding the defect repair operation. For example, the control device 2 may control the display 4 to display information regarding the result of the defect repair operation. For example, the control device 2 may control the display 4 to display information indicating whether the defect was repaired by the defect repair operation. If the defect was not repaired by the defect repair operation (i.e., the defect still exists despite the defect repair operation being performed), for example, the control device 2 may control the display 4 to display a warning indicating that the defect could not be repaired.

[0213] The control device 2 may control at least one of the defect repair device 34b and the processing device 1 so that the defect repair operation is performed regardless of the defect inspection operation.

[0214] (2-3) Technical effects of the processing system SYSb The machining system SYSb of the second embodiment described above can achieve the same effects as those achieved by the machining system SYSa of the first embodiment described above. Furthermore, in the second embodiment, the machining system SYSa can perform a defect inspection operation on the surface of the coating film SF using the defect measurement device 33b. Therefore, compared to a case where a defect inspection operation is not performed, the machining system SYSb can improve the quality of the riblet structure that is ultimately formed on the coating film SF through the defect inspection operation (and further, a defect repair operation, if necessary).

[0215] (2-4) Modified example of machining system SYSb The processing system SYSa does not have to be equipped with the defect repair device 34b. In this case, if the defect inspection operation reveals that a defect has occurred in one region of the surface of the coating film SF, the operator of the processing system SYSb may repair the defect.

[0216] (3) Machining system SYSc of the third embodiment Next, a machining system SYS of a third embodiment (hereinafter, the machining system SYS of the third embodiment will be referred to as a "machining system SYSc") will be described.

[0217] (3-1) Structure of the machining system SYSc First, the structure of the machining system SYSc of the third embodiment will be described with reference to Fig. 25. Fig. 25 is a cross-sectional view that schematically shows the overall structure of the machining system SYSc of the third embodiment.

[0218] As shown in FIG. 25, the processing system SYSc of the third embodiment differs from the processing system SYSa of the first embodiment or the processing system SYSb of the second embodiment in that it includes a processing apparatus 1c instead of the processing apparatus 1. Other features of the processing system SYSc may be the same as other features of the processing system SYSa or SYSb. However, the processing system SYSc may not include at least one of the foreign matter measuring apparatus 31, foreign matter removal apparatus 32, defect measuring apparatus 33b, and defect repair apparatus 34b. For simplicity of illustration, FIG. 25 shows an example of the processing system SYSc that does not include the foreign matter measuring apparatus 31, foreign matter removal apparatus 32, defect measuring apparatus 33b, and defect repair apparatus 34b.

[0219] The processing apparatus 1c differs from the processing apparatus 1 in that it further includes a position measurement device 18c. Other features of the processing apparatus 1c may be the same as other features of the processing apparatus 1.

[0220] The position measuring device 18c measures the relative positional relationship between the coating film SF and the light irradiation device 11. That is, the position measuring device 18c measures the relative positional relationship between the workpiece S and the light irradiation device 11. In the first embodiment, the position measuring device 18c measures the position of the coating film SF relative to the light irradiation device 11. That is, the position measuring device 18c measures the position of the workpiece S relative to the light irradiation device 11.

[0221] In order to measure the position of the coating film SF relative to the light irradiation device 11 (i.e., the position of the work-piece S, the same applies below), the position measuring device 18c may measure the coating film SF. That is, the position measuring device 18c may measure the work-piece S. In this case, the position measuring device 18c may be called an object measuring device because it measures an object including at least one of the coating film SF and the work-piece S.

[0222] The position measurement device 18c may be disposed at a fixed position with respect to the light irradiation device 11 (particularly, the optical system 112). The position measurement device 18c may be disposed at a position where its relative position with respect to the light irradiation device 11 is fixed. The position measurement device 18c may be disposed at a position where the relative position between the light irradiation device 11 and the position measurement device 18c does not change even if the drive system 12 moves the light irradiation device 11. For example, FIG. 25 shows an example in which the position measurement device 18c is attached to a mounting member 19 to which the light irradiation device 11 is attached. However, the position measurement device 18c may be attached to a member different from the mounting member 19. For example, the position measurement device 18c may be attached to the light irradiation device 11.

[0223] When the position measurement device 18c is disposed at a fixed position relative to the light irradiation device 11, the output from the position measurement device 18c (i.e., the measurement result of the position measurement device 18c) includes information about the position of the coating film SF relative to the light irradiation device 11. Specifically, the measurement result of the position measurement device 18c includes information about the position of the coating film SF relative to the position measurement device 18c. In other words, the measurement result of the position measurement device 18c includes information about the position of the coating film SF in the measurement coordinate system of the position measurement device 18c. Here, when the position measurement device 18c is disposed at a fixed position relative to the light irradiation device 11, the information about the position of the coating film SF relative to the position measurement device 18c essentially includes information about the position of the coating film SF relative to the light irradiation device 11, which is disposed at a fixed position relative to the position measurement device 18c. Therefore, the control device 2 can appropriately identify the position of the coating film SF relative to the light irradiation device 11.

[0224] The position measurement device 18c may be any type of measurement device as long as it is capable of measuring the coating film SF. For example, the position measurement device 18c may include an imaging device (i.e., a camera) capable of capturing an image of an object such as the coating film SF. The position measurement device 18c may include an irradiation device that irradiates the coating film SF with measurement light that draws a predetermined pattern on the coating film SF, and an imaging device that captures the pattern drawn on the coating film SF by the measurement light. In this way, the position measurement device 18c may be a measurement device that measures the coating film SF using a non-contact method (for example, at least one of a light detection method, an acoustic wave detection method, and an electric wave detection method).

[0225] The processing device 1c may be equipped with a plurality of position measurement devices 18c. In this case, the measurement axes (for example, in an optical measurement method such as an imaging method, typically the optical axes) of the plurality of position measurement devices 18c may be in a mutually intersecting (or twisted) relationship, or may be mutually parallel (or coaxial).

[0226] The control device 2 may control the drive system 12 based on the measurement results of the position measurement device 18c. That is, the control device 2 may control the drive system 12 to change the relative position between the coating film SF and the light irradiation device 11 based on the measurement results of the position measurement device 18c. Specifically, the control device 2 may acquire information regarding the relative positional relationship between the coating film SF and the light irradiation device 11 based on the measurement results of the position measurement device 18c, and control the drive system 12 based on the information regarding the relative positional relationship between the coating film SF and the light irradiation device 11. Note that if the position measurement device 18c is equipped with an imaging device, the control device 2 may control the drive system 12 using visual servoing based on the measurement results of the position measurement device 18c (i.e., images captured by the imaging device). Note that visual servoing may also be referred to as vision servoing.

[0227] The control device 2 may change the relative position between the coating film SF and the light irradiation device 11 based on the measurement results of the position measurement device 18c so that the processing light EL is irradiated onto a desired processing shot area SA on the coating film SF. For example, the control device 2 may change the relative position between the coating film SF and the light irradiation device 11 based on the measurement results of the position measurement device 18c so that the processing light EL is irradiated onto a desired area portion within the desired processing shot area SA on the coating film SF. Because the processing light EL is irradiated onto the target irradiation area EA, the operation of changing the relative position between the coating film SF and the light irradiation device 11 may be considered equivalent to the operation of changing the position of the target irradiation area EA on the coating film SF.

[0228] (3-2) Measurement operation by the position measurement device 18c Next, a description will be given of a measurement operation performed by the position measurement device 18c to measure the relative positional relationship between the coating film SF and the light irradiation device 11. In the third embodiment, the position measurement device 18c can perform at least one of a first measurement operation, a second measurement operation, and a third measurement operation. Therefore, the first measurement operation to the third measurement operation will be described below in order.

[0229] (3-2-1) First measurement operation The first measurement operation is an operation for measuring the relative positional relationship between the coating film SF and the light irradiation device 11 by measuring the position of a processed area FA1 on the surface of the coating film SF that has been processed by the processing operation. In other words, the first measurement operation is an operation for measuring the relative positional relationship between the coating film SF and the light irradiation device 11 by measuring the position of a processed area FA1 on the surface of the coating film SF that has had a riblet structure formed by the processing operation.

[0230] Specifically, FIG. 26 is a plan view showing a processed area FA1 on the surface of the coating film SF. As shown in FIG. 26, before the processing operation is completed, the surface of the coating film SF typically includes not only the processed area FA1 but also an unprocessed area FA2 that has not yet been processed by the processing operation (i.e., a riblet structure has not yet been formed). The processed area FA1 and the unprocessed area FA2 are typically adjacent to each other in a predetermined positional relationship. Therefore, the operation of measuring the position of the processed area FA1 can be considered substantially equivalent to the operation of measuring the position of the unprocessed area FA2. The operation of measuring the position of the processed area FA1 can be considered substantially equivalent to the operation of measuring the position of the unprocessed area FA2 in addition to the position of the processed area FA1. Therefore, the control device 2 can identify the position of the unprocessed area FA2 (specifically, the position of the unprocessed area FA2 relative to the light irradiation device 11) based on the results of the first measurement operation that measures the position of the processed area FA1. As a result, the control device 2 can change the relative position between the coating film SF and the light irradiation device 11 based on the measurement result of the position of the processed area FA1 so that the processing light EL is irradiated onto at least a part of the unprocessed area FA2. In other words, the control device 2 can change the relative position between the coating film SF and the light irradiation device 11 so that the target irradiation area EA moves within the unprocessed area FA2.

[0231] The processed area FA1 and the unprocessed area FA2 are normally in a predetermined positional relationship in which they are adjacent to each other via a boundary B between the processed area FA1 and the unprocessed area FA2. In other words, the processed area FA1 and the unprocessed area FA2 are normally in a predetermined positional relationship in which the boundary of the processed area FA1 that forms the boundary B overlaps with the boundary of the unprocessed area FA2 that forms the same boundary B. For this reason, the position measurement device 18c may measure the position of the boundary B to measure the position of the processed area FA1.

[0232] The processed area FA1 and the unprocessed area FA2 have different characteristics (e.g., optical characteristics). The position measurement device 18c may measure the position of the processed area FA1 by utilizing the difference between the characteristics of the processed area FA1 and the characteristics of the unprocessed area FA2. For example, if the position measurement device 18c is equipped with an imaging device, the measurement result of the position measurement device 18c (i.e., the image captured by the imaging device) will show the processed area FA1 and the unprocessed area FA2 in an optically distinguishable state. Therefore, the control device 2 can identify the position of the processed area FA1 by analyzing the measurement result of the position measurement device 18c (e.g., by performing image analysis).

[0233] A specific example of an operation for changing the relative positional relationship between the coating film SF and the light irradiation device 11 based on the measurement results of the position of the processed area FA1 will be described with reference to Fig. 27. Fig. 27 is a plan view showing the surface of the coating film SF on which eight processed shot areas SA#1 to SA#8 are set. The eight processed shot areas SA#1 to SA#8 are set so that processed shot areas SA#1 to SA#4 are arranged in this order along the X-axis direction, processed shot areas SA#5 to SA#8 are arranged in this order along the X-axis direction, and processed shot areas SA#5 to SA#8 are adjacent to the +Y side of processed shot areas SA#1 to SA#4, respectively.

[0234] The processing apparatus 1 performs processing operations on these eight processing shot areas SA#1 to SA#8 in this order. In the example shown in FIG. 27, processing shot areas SA#1 to SA#5 are processed areas FA1 where processing operations have already been performed. On the other hand, processing shot areas SA#6 to SA#8 are unprocessed areas FA2 where processing operations have not yet been performed. In this case, the processing apparatus 1 next performs processing operations on processing shot area SA#6. Here, a first measurement operation performed when performing a processing operation on processing shot area SA#6 will be described. However, the first measurement operation performed when performing a processing operation on processing shot areas SA other than processing shot area SA#6 may also be performed in the same manner as the first measurement operation performed when performing a processing operation on processing shot area SA#6.

[0235] In this case, as shown in FIG. 27 , the position measurement device 18c measures, for example, the position of the boundary B between the processed area FA1 and the unprocessed area FA2. The boundary B between the processed area FA1 and the unprocessed area FA2 includes the boundary between the processed shot area SA#6 and the processed shot areas SA#2 and SA#5, the boundary between the processed shot area SA#7 and the processed shot area SA#3, and the boundary between the processed shot area SA#8 and the processed shot area SA#8. Considering that the next processing operation will be performed on the processed shot area SA#6, the position measurement device 18c may particularly measure the position of the boundary between the processed shot area SA#6 and the processed shot areas SA#2 and SA#5. As a result, the control device 2 can identify the position of the processed shot area SA#6 where the next processing operation will be performed based on the measurement result of the position measurement device 18c. Therefore, the control device 2 can change the relative position between the coating film SF and the light irradiation device 11 so that the light irradiation device 11 is positioned so that the processing shot area SA#6 can be irradiated with the processing light EL. Thereafter, after the light irradiation device 11 is positioned at a position where it can irradiate the processing shot area SA#6 with the processing light EL, the processing device 1 starts the processing operation on the processing shot area SA#6.

[0236] 27, the measurement range IA of the position measuring device 18c may be set to be wider than the processing shot area SA. The measurement range IA of the position measuring device 18c may be set to include the processing shot area SA. In this case, the control device 2 can appropriately identify the position of the processing shot area SA where the next processing operation will be performed, based on the measurement result of the position measuring device 18c.

[0237] The processed area FA1 and unprocessed area FA2, which are adjacent to each other across the boundary B, may have the same shape and size. More specifically, the area to be processed next in the unprocessed area FA2 (e.g., a certain processing shot area SA) may have the same shape and size as an adjacent area (e.g., a certain processing shot area SA) in the processed area FA1 that is adjacent to the area to be processed across the boundary B. For example, assuming that processing shot areas SA#1 to SA#4 are not set in the example shown in FIG. 27, the processing shot area SA#6 in the unprocessed area FA2 that is to be processed next has the same shape and size as the processing shot area SA#5 in the processed area FA1 that is adjacent to the processing shot area SA#6 across the boundary B. However, the unprocessed area FA2 may be smaller than the processed area FA1 that is adjacent to the unprocessed area FA2 across the boundary B. More specifically, the next planned processing area (e.g., a certain processing shot area SA) in the unprocessed area FA2 where the processing operation is to be performed may be smaller than an adjacent area (e.g., a certain processing shot area SA) in the processed area FA1 that is adjacent to the planned processing area across the boundary B. For example, in the example shown in Fig. 27, the next planned processing shot area SA#6 in the unprocessed area FA2 where the processing operation is to be performed is smaller than the area in the processed area FA1 that includes the processing shot areas SA#2 and SA#5 that are adjacent to the processing shot area SA#6 across the boundary B.

[0238] After the processing operation on the processing shot area SA#6 is started, the processing light EL is scanned over the processing shot area SA#6 by the galvanometer mirror 1122. As a result, as shown in FIG. 28, which is an enlarged plan view of the periphery of the processing shot area SA#6, the proportion of the processed area FA1 in the processing shot area SA#6 increases. In other words, the extent of the processed area FA1 on the surface of the coating film SF does not substantially move. Even when the processing operation is being performed on the processing shot area SA#6 in this manner, the position measurement device 18c may measure, for example, the position of the boundary B between the processed area FA1 and the unprocessed area FA2. In particular, the position measurement device 18c may measure the position of the boundary B between the processed area FA1 and the unprocessed area FA2 within the processing shot area SA#6. As a result, the control device 2 can identify the position of the unprocessed area FA2 within the processing shot area SA#6 based on the measurement results of the position measurement device 18c. Therefore, the control device 2 can change the relative position between the coating film SF and the light irradiation device 11 so that the light irradiation device 11 is positioned so that the processing light EL can be irradiated onto the unprocessed area FA2 within the processing shot area SA#6. Alternatively, considering that the irradiation position of the processing light EL within the processing shot area SA#6 (i.e., the position of the target irradiation area EA) is mainly controlled by the galvanometer mirror 1122, the control device 2 may control the galvanometer mirror 1122 so that the processing light EL is irradiated onto the unprocessed area FA2 within the processing shot area SA#6.

[0239] Alternatively, after the processing operation on the processing shot area SA#6 is started, the position within the processing shot area SA#6 to be next irradiated with the processing light EL should be adjacent to a portion on the movement direction side of the processed area FA1 that moves due to the scanning of the processing light EL (i.e., the portion on the front side in the movement direction, i.e., the portion FA1s in FIG. 28). Therefore, after the processing operation on the processing shot area SA#6 is started, the position measurement device 18c may measure the position of a portion on the movement direction side of the processed area FA1 that moves within the processing shot area SA#6, in addition to or instead of measuring the position of the boundary B. Even in this case, the control device 2 may change the relative position between the coating film SF and the light irradiation device 11 and / or control the galvanometer mirror 1122 based on the measurement result of the position measurement device 18c so that the processing light EL is irradiated onto the unprocessed area FA2 within the processing shot area SA#6 (particularly, the position to be next irradiated with the processing light EL).

[0240] Furthermore, after the processing operation for the processing shot area SA#6 is started, the processing light EL is actually irradiated within the processing shot area SA#6, so the position measurement device 18c can measure the irradiation position of the processing light EL. That is, the position measurement device 18c can measure the position of the target irradiation area EA onto which the processing light EL is irradiated. As a result, the control device 2 can identify the portion on the movement direction side (i.e., the portion on the forward side in the movement direction, i.e., the portion EAs in FIG. 28) of the target irradiation area EA (i.e., the irradiation position of the processing light EL) moving within the processing shot area SA#6. Here, the position within the processing shot area SA#6 to be next irradiated with the processing light EL should be adjacent to the portion EAs on the movement direction side of the target irradiation area EA (i.e., the irradiation position of the processing light EL). Therefore, after the processing operation for the processing shot area SA#6 is started, the position measurement device 18c may measure the position of the portion on the movement direction side of the processed area FA1 moving within the processing shot area SA#6, in addition to or instead of measuring the position of the boundary B. Even in this case, the control device 2 may change the relative position between the coating film SF and the light irradiation device 11 and / or control the galvanometer mirror 1122 based on the measurement results of the position measurement device 18c so as to irradiate the processing light EL onto the unprocessed area FA2 (particularly, the position where the processing light EL should be irradiated next) within the processing shot area SA#6.

[0241] Furthermore, when the position measurement device 18c measures the irradiation position of the processing light EL (i.e., the position of the target irradiation area EA), the control device 2 can determine whether the processing light EL is actually irradiated onto the unprocessed area FA2 in the processing shot area SA#6 (particularly, the position to be irradiated with the processing light EL now) based on the actual irradiation position of the processing light EL indicated by the measurement result of the position measurement device 18c. If it is determined that the processing light EL is not irradiated onto the unprocessed area FA2 in the processing shot area SA#6 (particularly, the position to be irradiated with the processing light EL now), the control device 2 may change the relative position between the coating film SF and the light irradiation device 11 and / or control the galvanometer mirror 1122 so that the processing light EL is irradiated onto the unprocessed area FA2 in the processing shot area SA#6 (particularly, the position to be irradiated with the processing light EL now).

[0242] In this way, the position measurement device 18c may measure the position of the processed shot area SA#6 (in particular, the position of the unprocessed area FA2 within the processed shot area SA#6) during at least a part of the period during which the processing operation is being performed on the processed shot area SA#6. On the other hand, when the processing operation on the processed shot area SA#6 is completed, the processing device 1 will then start the processing operation on the processed shot area SA#7. In this case, the position measurement device 18c may measure the position of the processed shot area SA#7 in advance during at least a part of the period during which the processing operation on the processed shot area SA#6 is being performed. In this case, the position measurement device 18c and the light irradiation device 11 may be aligned so as to realize a state in which a measurement operation is performed to measure the position of another processed shot area SA on which a processing operation is to be performed next after the first processed shot area SA before the processing operation on the first processed shot area SA is completed. For example, as shown in FIG. 29 , which illustrates an example of the positional relationship between the position measurement device 18c and the light irradiation device 11, the position measurement device 18c and the light irradiation device 11 may be aligned so that they are aligned along the X-axis direction (i.e., the movement direction of the light irradiation device 11, the direction in which the processing shot areas SA are aligned). Furthermore, as shown in FIG. 29 , the position measurement device 18c and the light irradiation device 11 may be aligned so that the position measurement device 18c is located on the +X side of the light irradiation device 11 (i.e., the front side in the movement direction of the light irradiation device 11). As a result, as shown in FIG. 29 , the area on the coating film SF where the first measurement operation is performed includes the area on the +X side of the area on the coating film SF where the processing operation is performed (i.e., the front side in the movement direction of the light irradiation device 11). The area where the measurement operation is performed in FIG. 29 typically includes at least a portion of the measurement range IA. Alternatively, as long as the region where the first measurement operation is performed includes a region on the +X side of the region where the processing operation is performed, the light irradiation device 11 and the position measurement device 18c do not have to be aligned along the X-axis direction, and the position measurement device 18c does not have to be disposed on the +X side of the light irradiation device 11. In other words, the position measurement device 18c and the light irradiation device 11 may be aligned so that the region where the first measurement operation is performed includes a region on the +X side of the region where the processing operation is performed.As a result, a state is realized in which a first measurement operation is performed to measure the position of another processing shot area SA on which a processing operation will be performed next after the first processing shot area SA before the processing operation on the first processing shot area SA is completed.

[0243] The above description describes an example in which one processed area FA1 and one processed area FA1 are formed on the surface of the coating film SF. However, depending on the processing operation, multiple processed areas FA1 may be formed on the surface of the coating film SF. Furthermore, depending on the processing operation, multiple unprocessed areas FA2 may be formed on the surface of the coating film SF. In this case, the position measurement device 18c may measure the positions of at least two of the multiple processed areas FA1. The position measurement device 18c may measure the positions of at least two of the multiple unprocessed areas FA2. The position measurement device 18c may measure the position of a single boundary B defined by at least one processed area FA1 and at least one unprocessed area FA2. The position measurement device 18c may measure the positions of at least two boundaries B defined by at least one processed area FA1 and at least one unprocessed area FA2.

[0244] An example of a state in which multiple processed areas FA1 are formed on the surface of the coating film SF is a state in which two processed areas FA1 with an unprocessed area FA2 located between them are formed on the surface of the coating film SF, as shown in Figure 30. In this situation, the control device 2 may control the processing device 1 to perform a processing operation on an unprocessed area FA located between the two processed areas FA1 based on measurement results of the positions of the two processed areas FA1 (e.g., the positions of the two boundaries B defined by the two processed areas FA1 and one unprocessed area FA2). The processing operation in this case may be, for example, a processing operation that performs additional processing on an unprocessed area FA between two processed areas FA1 that are so close that they can be considered to be substantially adjacent. For example, the processing operation in this case may be a processing operation that combines two processed areas FA1 into substantially one processed area FA1.

[0245] (3-2-2) Second measurement operation The second measurement operation is an operation for measuring the relative positional relationship between the coating film SF and the light irradiation device 11 by measuring the positions of feature points on the surface of the coating film SF (i.e., feature points of the work-piece S). The feature points on the surface of a certain coating film SF may include points at characteristic positions in the three-dimensional shape of the object represented by point cloud data, which is a collection of points indicating positions on the surface of the coating film SF. Examples of feature points include at least one of a vertex, a corner, a boundary, a point located closest to the +Z side, a point located closest to the -Z side, a point located closest to the +X side, a point located closest to the -X side, a point located closest to the +Y side, and a point located closest to the -Y side on the coating film SF.

[0246] In this case, the control device 2 can identify the position of the feature point relative to the light irradiation device 11 in a reference coordinate system (e.g., the measurement coordinate system of the position measurement device 18c) based on the measurement results of the position measurement device 18c. Furthermore, the control device 2 can identify the coordinates of the feature point in the coordinate system of the three-dimensional model data of the workpiece S (or the three-dimensional model data of the coating film SF) by referring to the three-dimensional model data of the workpiece S. Therefore, the control device 2 can identify the position of any part of the workpiece S (i.e., the coating film SF) in the reference coordinate system based on the measurement results of the position measurement device 18c and the three-dimensional model data of the workpiece S (or the three-dimensional model data of the coating film SF). As a result, the control device 2 can change the relative position of the coating film SF and the light irradiation device 11 so that the light irradiation device 11 is positioned in the reference coordinate system so that the processing light EL can be irradiated onto a desired position on the coating film SF.

[0247] However, compared to the first measurement operation, it is more difficult to accurately determine the position of the unmachined area FA2 (especially the area of ​​the unmachined area FA2 that is to be machined next) in the second measurement operation. Therefore, the control device 2 may perform the second measurement operation when it is difficult to perform the first measurement operation because a machined area FA1 does not exist on the coating film SF. For example, when the processing device 1 performs a processing operation on the coating film SF for the first time, it is highly likely that a machined area FA1 does not exist on the coating film SF. Therefore, the control device 2 may perform the second measurement operation when the processing device 1 performs a processing operation on the coating film SF for the first time. On the other hand, the control device 2 may perform the first measurement operation when it is possible to perform the first measurement operation because a machined area FA1 exists on the coating film SF. The control device 2 does not need to perform the second measurement operation when it is possible to perform the first measurement operation because a machined area FA1 exists on the coating film SF.

[0248] (3-2-3) Third measurement operation The third measurement operation is an operation for measuring the relative positional relationship between the coating film SF and the light irradiation device 11 by measuring the riblet structure formed on the surface of the coating film SF. In other words, the third measurement operation is an operation for measuring the relative positional relationship between the coating film SF and the light irradiation device 11 by measuring the riblet structure formed in the processed area FA1.

[0249] Specifically, as already explained with reference to Figures 6(a) and 6(b), the riblet structure is a structure in which a plurality of concave structures CP1 or a plurality of convex structures CP2 extending along a first direction (e.g., the Y-axis direction) have a periodic direction in a second direction (e.g., the X-axis direction) intersecting the first direction. In other words, the riblet structure is a periodic structure. For this reason, the riblet structure can be used as a so-called encoder scale for position measurement. The third measurement operation is an operation in which the riblet structure is used as an encoder scale to measure the relative positional relationship between the coating film SF and the light irradiation device 11.

[0250] When the riblet structure is used as an encoder scale, as shown in FIG. 31, which shows the structure of a machining system SYSc including a position measurement device 18c for performing the third measurement operation, the position measurement device 18c includes a light irradiating unit 181c and a light receiving unit 182c. The light irradiating unit 181c is a device that irradiates the riblet structure with measurement light ML. The light irradiating unit 181c is a device that emits the measurement light ML toward the riblet structure. The light receiving unit 182c is a light receiving device that receives the measurement light ML that has passed through the riblet structure (i.e., a detection device that detects the measurement light ML). The light receiving unit 182c is a light receiving device that receives the measurement light ML from the riblet structure. In particular, because the riblet structure is a periodic structure, the riblet structure can essentially function as a diffraction grating. In this case, the measurement light ML that has passed through the riblet structure (i.e., the measurement light ML from the riblet structure) becomes diffracted light diffracted by the riblet structure. Therefore, the light receiving portion 182c receives the diffracted light diffracted by the riblet structure.

[0251] Based on the light reception result of the light receiving unit 182c, the control device 2 can identify the relative positional relationship between the coating film SF and the light irradiation device 11. As a result, based on the light reception result of the light receiving unit 182c, the control device 2 can change the relative position between the coating film SF and the light irradiation device 11 so that the processing light EL is irradiated onto a desired position on the surface of the coating film SF.

[0252] However, when the light-receiving result of the light-receiving unit 182c does not include a periodic signal corresponding to the period of the riblet structure, it may be more difficult to determine the relative positional relationship between the coating film SF and the light irradiation device 11 based on the light-receiving result of the light-receiving unit 182c than when the light-receiving result of the light-receiving unit 182c includes a periodic signal corresponding to the period of the riblet structure. Therefore, in order to determine the relative positional relationship between the coating film SF and the light irradiation device 11, the control device 2 may cause the measurement light ML to scan the riblet structure in a direction intersecting the extension direction of the concave structures CP1 and the convex structures CP2 that constitute the riblet structure. For example, the control device 2 may change the relative position between the coating film SF and the position measurement device 18c so that the measurement light ML can scan the riblet structure in a direction intersecting the extension direction of the concave structures CP1 and the convex structures CP2. For example, the control device 2 may change the attitude of the position measurement device 18c relative to the coating film SF so that the measurement light ML can scan the riblet structure along a direction intersecting the extension direction of the concave structures CP1 and the convex structures CP2. An example in which the measurement light ML scans the riblet structure along a direction intersecting the extension direction of the concave structures CP1 and the convex structures CP2 is shown in FIGS. 32(a) and 32(b). For example, FIG. 32(a) shows the measurement light ML scanning the riblet structure along a direction perpendicular to the extension direction of the concave structures CP1 and the convex structures CP2 that constitute the riblet structure (the Y-axis direction in the example shown in FIG. 32(a)). For example, FIG. 32(b) shows the measurement light ML scanning the riblet structure along a direction that is not perpendicular to but intersects with the extension direction of the concave structures CP1 and the convex structures CP2 that constitute the riblet structure (the Y-axis direction in the example shown in FIG. 32(b)).

[0253] (3-4) Technical effects of the processing system SYSc The machining system SYSc of the third embodiment described above can achieve the same effects as those achieved by the machining system SYSa of the first embodiment or the machining system SYSb of the second embodiment. Furthermore, in the third embodiment, the machining system SYSc controls the drive system 12 based on the measurement results of the position measurement device 18c. Therefore, the machining system SYSc can improve the positioning accuracy of the light irradiation device 11. In other words, the machining system SYSc can appropriately change the relative position between the coating film SF and the light irradiation device 11 so that the processing light EL is irradiated onto a desired position on the coating film SF. As a result, the machining system SYSc can more appropriately process the coating film SF.

[0254] For example, the machining system SYSc can set a desired relationship between the phase of the riblet structure formed in the machined area FA1 and the phase of a newly formed riblet structure (e.g., a riblet structure newly formed in the unmachined area FA2). Typically, the machining system SYSc can match the phase of the riblet structure formed in the machined area FA1 with the phase of a newly formed riblet structure. Furthermore, the machining system SYSc can set the phases of the riblet structures formed in two machined shot areas SA (e.g., machined shot areas SA#1 and SA#2) to a desired relationship (typically, a relationship in which the phases match). Note that in this case, the period of the riblet structure formed in the machined area FA1 and the period of the newly formed riblet structure may be the same. The periods of the riblet structures formed in two machined shot areas (e.g., machined shot areas SA#1 and SA#2) may be the same.

[0255] (4) Other variations In the above description, the processing system SYS deflects the processing light EL with the galvanometer mirror 1122 to cause the multiple processing light beams EL to scan the surface of the coating film SF. However, in addition to or instead of deflecting the processing light EL with the galvanometer mirror 1122, the processing apparatus 1 may cause the multiple processing light beams EL to scan the surface of the coating film SF by moving the light irradiation device 11 relative to the coating film SF. That is, the control device 2 may control the drive system 12 to move the light irradiation device 11 relative to the coating film SF so that the processing light EL scans the surface of the coating film SF.

[0256] One of the purposes of the drive system 12 moving the light irradiation device 11 relative to the coating film SF is to scan the surface of the coating film SF with the processing light EL, as described above. Therefore, if scanning of the coating film SF with the processing light EL can be achieved without moving the light irradiation device 11, the light irradiation device 11 does not need to move. In other words, the processing system SYS does not need to be equipped with the drive system 12. As an example, if the workpiece S moves relative to the light irradiation device 11, scanning of the coating film SF with the processing light EL can be achieved without moving the light irradiation device 11. Therefore, the processing system SYS may be equipped with a drive system that moves the workpiece S. For example, the processing system SYS may be equipped with a drive system that moves a stage that supports the workpiece S.

[0257] One of the purposes of the drive system 12 moving the light irradiation device 11 relative to the coating film SF is to scan the multiple processing shot areas SA in sequence with the processing light EL without moving the storage device 13 and the support device 14 when multiple processing shot areas SA are stored in the storage space SP of the storage device 13. Therefore, when a single processing shot area SA is stored in the storage space SP, the light irradiation device 11 does not need to move. In other words, the processing device 1 does not need to be equipped with the drive system 12.

[0258] In the above description, the processing apparatus 1 includes the storage device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17. However, the processing apparatus 1 does not have to include at least one of the storage device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17, as long as it is capable of processing the workpiece S. The processing apparatus 1 does not have to include at least some of the storage device 13, the support device 14, the drive system 15, the exhaust device 16, and the gas supply device 17, as long as it is capable of processing the workpiece S. If the processing apparatus 1 does not include the storage device 13, the drive system 12 may be attached to the support device 14. Furthermore, the structures of the above-mentioned storage device 13, support device 14, drive system 15, exhaust device 16 and gas supply device 17 are merely examples, and the processing apparatus 1 may be equipped with at least one of the storage device 13, support device 14, drive system 15, exhaust device 16 and gas supply device 17 having a structure different from that described above.

[0259] In the above description, the processing system SYS is provided with the display 4. However, the processing system SYS does not necessarily have to be provided with the display 4.

[0260] In the above description, the processing system SYS forms a riblet structure using a coating film SF on the surface of the workpiece S. However, the processing system SYS may also form any structure using a coating film SF having any shape on the surface of the workpiece S. Even in this case, any structure having any shape can be formed if the control device 2 controls the light irradiation device 11, etc. so that the processing light EL scans the surface of the coating film SF along a scanning trajectory corresponding to the structure to be formed. An example of an arbitrary structure is a regularly or irregularly formed micro- or nanometer-order fine texture structure (typically, an uneven structure). Such a fine texture structure may include at least one of a shark skin structure and a dimple structure, which have the function of reducing resistance due to fluids (gas and / or liquid). The fine texture structure may also include a lotus leaf surface structure having at least one of liquid-repellent and self-cleaning functions (e.g., having the lotus effect). The fine texture structure may include at least one of a micro-protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function using van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, and a honeycomb structure having a droplet collecting function.

[0261] In the above description, the processing system SYS removes the coating film SF by evaporating it with processing light EL. However, in addition to or instead of evaporating the coating film SF by irradiating it with processing light EL, the processing system SYS may remove the coating film SF by changing the properties of the coating film SF by irradiating it with processing light EL. For example, the processing system SYS may melt the coating film SF by irradiating it with processing light EL and remove the melted coating film SF to remove the coating film SF. For example, the processing system SYS may embrittle the coating film SF by irradiating it with processing light EL and remove the embrittlement by peeling off the embrittled coating film SF to remove the coating film SF. In the above description, the processing system SYS ablate the coating film SF formed on the surface of the workpiece S. However, the processing system SYS may also remove a portion of the coating film SF formed on the surface of the workpiece S by thermal processing.

[0262] In the above description, the processing system SYS forms the recesses C (or the recessed structures CP1, or any structure such as a riblet structure formed by the recessed structures CP1) by removing the coating film SF. That is, the processing system SYS processes the coating film SF to partially thin the coating film SF. However, in addition to or instead of partially thinning the coating film SF, the processing system SYS may process the coating film SF to partially thicken the coating film SF. That is, in addition to or instead of forming the recesses C by removing the coating film SF, the processing system SYS may form convex portions (or the convex structures CP2, or any structure formed by the convex structures CP2) by adding the coating film SF. For example, the processing system SYS may irradiate a first portion of the coating film SF with processing light EL to remove the coating film SF from the first portion, and then fix the removed coating film SF to a second portion of the coating film SF to relatively thicken the coating film SF in the second portion (that is, form convex portions in the second portion).

[0263] In the above description, the processing system SYS processes a coating film SF formed on the surface of the workpiece S. However, the processing system SYS may process any coating other than the coating film SF formed on the surface of the workpiece S. Alternatively, the processing system SYS may process a structure having multiple layers stacked together. Specifically, the processing system SYS may process at least one layer (typically, at least one layer including the outermost layer) of the multiple layers constituting the structure. The processing system SYS may process at least one layer of the multiple layers constituting the structure to form a structure from the layers. In this case, the at least one layer to be processed corresponds to the coating film SF described above, and the layers other than the at least one layer correspond to the workpiece S. Alternatively, the processing system SYS may process the workpiece S itself. In other words, the processing system SYS may process a workpiece S on whose surface no coating film SF or any coating is formed.

[0264] In the above description, the processing system SYS forms a riblet structure on the workpiece S to reduce the resistance of the surface of the workpiece S against a fluid. However, the processing system SYS may form another structure on the workpiece S that is different from a riblet structure for reducing the resistance of the surface against a fluid. For example, the processing system SYS may form a riblet structure on the workpiece S to reduce noise generated when the fluid and the surface of the workpiece S move relative to each other. For example, the processing system SYS may form a structure on the workpiece S that generates vortices in the flow of fluid on the surface of the workpiece S. For example, the processing system SYS may form a structure on the workpiece S to impart hydrophobic properties to the surface of the workpiece S.

[0265] (5) Supplementary Notes The following additional notes are provided regarding the above-described embodiment. [Appendix 1] In a processing method for processing an object with processing light, inspecting a region to be inspected on the surface of the object for foreign matter; irradiating the inspection area with processing light; A processing method comprising: [Appendix 2] In a processing method for processing an object with processing light, inspecting a surface of the object for defects in an inspection area on the surface of the object; irradiating the inspection area with processing light; A processing method comprising: [Appendix 3] In a processing method for processing an object with processing light, removing foreign matter within at least a portion of a surface of the object; irradiating at least a portion of the surface of the object with processing light; A processing method comprising: [Appendix 4] receiving light from a surface of an object having a structure formed on the surface that changes aerodynamic characteristics; evaluating features of the structure formed on the surface of the object using design information on the shape of the structure and information on the result of receiving the light; An inspection method including: [Appendix 5] In a processing method for processing an object with processing light, Irradiating a first region on the object with processing light; measuring the position of the first area on the object irradiated with the processing light; Including, The irradiating step includes irradiating a second area on the object, which is different from the first area, with processing light using a position measurement result of the first area. Processing method. [Appendix 6] A control device connected to a processing system that processes an object with processing light, a process of causing an inspection device to inspect a region to be inspected on the surface of the object for foreign matter; a process of irradiating the inspection area with processing light by an irradiation device; The processing system executes Control device. [Appendix 7] A control device connected to a processing system that processes an object with processing light, a process of causing an inspection device to inspect a surface of the object for defects in an inspection area on the surface of the object; a process of irradiating the inspection area with processing light by an irradiation device; The processing system executes Control device. [Appendix 8] A control device connected to a processing system that processes an object with processing light, removing foreign matter from at least a portion of the surface of the object using a foreign matter removal device; a process of irradiating at least a part of the surface of the object with processing light by an irradiation device; The processing system executes Control device. [Appendix 9] 1. A control device coupled to an inspection system for inspecting an object, comprising: a process of receiving light from a surface of an object having a structure formed on the surface that changes aerodynamic characteristics, using a light receiving device; a process of evaluating characteristics of the structure formed on the surface of the object using design information regarding the shape of the structure and output information from the light receiving device; The inspection system executes Control device. [Appendix 10] A control device connected to a processing system that processes an object with processing light, a process of irradiating a first region on the object with processing light by an irradiation device; a process of measuring the position of the first region on the object irradiated with the processing light by a position measurement device; a process of irradiating a second area on the object, which is different from the first area, with processing light by the irradiation device using a position measurement result of the first area by the position measurement device; The processing system executes Control device. [Appendix 11] A computer program executed by a computer that controls a processing system that processes an object with processing light, a process of causing an inspection device to inspect a region to be inspected on the surface of the object for foreign matter; a process of irradiating the inspection area with processing light by an irradiation device; causing the computer to execute Computer program. [Appendix 12] A computer program executed by a computer that controls a processing system that processes an object with processing light, a process of causing an inspection device to inspect a surface of the object for defects in an inspection area on the surface of the object; a process of irradiating the inspection area with processing light by an irradiation device; causing the computer to execute Computer program. [Appendix 13] A computer program executed by a computer that controls a processing system that processes an object with processing light, removing foreign matter from at least a portion of the surface of the object using a foreign matter removal device; a process of irradiating at least a part of the surface of the object with processing light by an irradiation device; causing the computer to execute Computer program. [Appendix 14] A computer program to be executed by a computer that controls an inspection system that inspects an object, comprising: a process of receiving light from a surface of an object having a structure formed on the surface that changes aerodynamic characteristics, using a light receiving device; a process of evaluating characteristics of the structure formed on the surface of the object using design information regarding the shape of the structure and output information from the light receiving device; causing the computer to execute Computer program. [Appendix 15 A computer program executed by a computer that controls a processing system that processes an object with processing light, a process of irradiating a first region on the object with processing light by an irradiation device; a process of measuring the position of the first region on the object irradiated with the processing light by a position measurement device; a process of irradiating a second area on the object, which is different from the first area, with processing light by the irradiation device using a position measurement result of the first area by the position measurement device; causing the computer to execute Computer program. [Appendix 16] an irradiation device that irradiates an object with processing light for processing the object; an object measuring device that measures the object to measure a relative position between the object and the irradiation device; a control device that changes the relative position between the object and the irradiation device based on the measurement result of the object measuring device; A processing system comprising: [Appendix 17] The object measuring device is fixed in position relative to the illumination device. 17. The processing system of claim 16. [Appendix 18] The object measuring device includes an imaging device. 18. The processing system of claim 16 or 17. [Appendix 19] The imaging device is capable of imaging the object. 19. The processing system of claim 18. [Appendix 20] The imaging device is capable of imaging an area irradiated with the processing light on the object. 20. The processing system of claim 18 or 19. [Appendix 21] The object measuring device measures the positions of feature points on the surface of the object. 21. The processing system of any one of clauses 16 to 20. [Appendix 22] The object measuring device measures the position of a processed area on the surface of the object that has been processed by irradiating the processing light. 22. The processing system of any one of clauses 16 to 21. [Appendix 23] The object measuring device measures the position of a processed area on the surface of the object that has been processed by irradiating the processing light, and the position of an unprocessed area on the surface of the object that has not yet been processed. 23. The processing system of any one of clauses 16 to 22. [Appendix 24] The object measuring device measures the position of a boundary between a processed area on the surface of the object that has been processed by irradiating the processing light and an unprocessed area on the surface of the object that has not yet been processed. 24. The processing system of any one of clauses 16 to 23. [Appendix 25] The object measuring device measures a processing pattern formed on a surface of the object by irradiating the processing light. 25. The processing system of any one of clauses 16 to 24. [Appendix 26] The object measuring device includes an emission device that emits measurement light toward the processing pattern, and a detection device that detects the measurement light from the processing pattern. 26. The processing system of claim 25. [Appendix 27] the processing pattern includes a pattern in which a plurality of unit patterns extending in a first direction along a surface of the object are arranged along a second direction that is along the surface of the object and intersects with the first direction, The object measuring device measures the processing pattern by scanning the processing pattern with the measurement light along the second direction. 27. The processing system of claim 26. [Appendix 28] The object measuring device uses the processing pattern as an encoder scale. 28. The processing system of any one of clauses 25 to 27. [Appendix 29] The method further includes a state measurement device that measures a state of a certain region of the object before the irradiation device irradiates the certain region with the processing light, The control device controls the irradiation device to irradiate the one region with the processing light based on the measurement result of the state measurement device. 29. The processing system of any one of clauses 16 to 28. [Appendix 30] an irradiation device that irradiates an object with processing light for processing the object; a state measurement device that measures a state of a certain region of the object before the irradiation device irradiates the certain region with the processing light; a control device that controls the irradiation device so as to irradiate the one region with the processing light based on a measurement result of the state measurement device; A processing system comprising: [Appendix 31] The state measurement device includes an imaging device capable of imaging the surface of the object. 31. The processing system of claim 29 or 30. [Appendix 32] The control device determines whether or not an abnormal event that may hinder processing by irradiation of the processing light has occurred in the one region based on the measurement result of the state measurement device. 32. The processing system of any one of clauses 29 to 31. [Appendix 33] The abnormal event includes an event in which a foreign object is attached to the one region. 33. The processing system of claim 32. [Appendix 34] When the control device determines that the abnormal event has occurred in the one area, the control device controls the irradiation device to irradiate the one area with the processing light after the abnormal event is resolved. 34. The processing system of claim 32 or 33. [Appendix 35] the abnormal event includes an event in which a foreign object is attached to the one region; When the control device determines that the abnormal event has occurred in the one area, the control device controls the irradiation device to irradiate the one area with the processing light after the foreign matter is removed from the one area. 35. The processing system of any one of clauses 32 to 34. [Appendix 36] When the control device determines that the abnormal event has occurred in the one area, the control device controls a elimination device for eliminating the abnormal event to eliminate the abnormal event. 36. The processing system of any one of clauses 32 to 35. [Appendix 37] the abnormal event includes an event in which a foreign object is attached to the one region; The eliminating device includes a removing device that removes the foreign object from the one area. 37. The processing system of claim 36. [Appendix 38] The removal device removes the foreign matter from the one area by spraying gas and / or liquid onto the one area. 38. The processing system of claim 37. [Appendix 39] the irradiation device irradiates the processing light so that an irradiation area of ​​the processing light moves on the surface of the object along one direction along the surface of the object; On the surface of the object, an irradiation area onto which the processing light is irradiated and a measurement area to be measured by the state measurement device are aligned along the one direction. 39. The processing system of any one of clauses 29 to 38. [Appendix 40] The measurement area is located forward of the projection area in the direction of movement of the projection area. 39. The processing system of claim 39. [Appendix 41] The state measurement device measures the state of a second region of the surface of the object during at least a portion of a period during which the irradiation device irradiates the first region of the surface of the object with the processing light. 41. The processing apparatus of any one of appendices 29 to 40. [Appendix 42] the irradiation device irradiates the processing light so that an irradiation area of ​​the processing light moves on the surface of the object along one direction along the surface of the object; The second area is located forward of the first area in the direction of movement of the illumination area. 42. The processing system of claim 41. [Appendix 43] the state measurement device is a first state measurement device, The apparatus further includes a second state measuring device that measures a state of another region of the object after the irradiation device irradiates the processing light onto the other region. 43. The processing system of any one of clauses 29 to 42. [Appendix 44] The second state measurement device includes an imaging device capable of imaging the surface of the object. 44. The processing system of claim 43. [Appendix 45] The control device determines whether the processing quality in the other area is appropriate based on the measurement result of the second state measurement device. 45. The processing system of claim 43 or 44. [Appendix 46] The control device outputs information regarding whether the processing quality in the other region is appropriate or not based on the measurement result of the second state measurement device. 46. ​​The processing system of any one of clauses 43 to 45. [Appendix 47] The control device controls the irradiation device to irradiate the processing light onto the other region based on the measurement result of the second state measurement device. 47. The processing system of any one of clauses 43 to 46. [Appendix 48] The control device controls the irradiation device so as to irradiate the other region with the processing light to improve processing quality in the other region. 48. The processing apparatus of claim 47. [Appendix 49] the irradiation device irradiates the processing light so that an irradiation area of ​​the processing light moves on the surface of the object along one direction along the surface of the object; On the surface of the object, the irradiation area of ​​the processing light and the measurement area of ​​the second state measurement device are aligned along the one direction. 49. The processing system of any one of clauses 43 to 48. [Appendix 50] The measurement area is located behind the projection area in the direction of movement of the projection area. 49. The processing system of claim 49. [Appendix 51] The second state measurement device measures a state of a fourth region on the surface of the object during at least a part of a period during which the irradiation device irradiates the third region on the surface of the object with the processing light. 51. The processing apparatus of any one of appendices 43 to 50. [Appendix 52] the irradiation device irradiates the processing light so that an irradiation area of ​​the processing light moves on the surface of the object along one direction along the surface of the object; The fourth region is located behind the third region in the direction of movement of the irradiation region. 52. The processing system of claim 51. [Appendix 53] Irradiating an object with processing light for processing the object from an irradiation device; measuring the relative position of the object and the irradiation device by measuring the object; changing the relative position between the object and the irradiation device based on the measurement result of the relative position between the object and the irradiation device; A processing method comprising: [Appendix 54] measuring a state of a region of an object before the region is irradiated with processing light for processing the object; irradiating the one area with the processing light based on a measurement result of the state of the one area; A processing method comprising: [Appendix 55] irradiating an object with processing light for processing the object to form a first periodic structure in a first region on the object; irradiating the object with processing light for processing the object, and forming a second periodic structure in a second region on the object that is different from the first region; Including, The phase of the first periodic structure is equal to the phase of the second periodic structure. Processing method. [Appendix 56] The period of the first periodic structure is equal to the period of the second periodic structure. 5. The processing method described in Appendix 55.

[0266] The requirements of the above-described embodiments may be combined as appropriate. Some of the requirements of the above-described embodiments may not be used. The requirements of the above-described embodiments may be replaced with requirements of other embodiments as appropriate. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents relating to the devices, etc. cited in the above-described embodiments are incorporated herein by reference.

[0267] Furthermore, the present invention can be modified as appropriate within the scope that does not contradict the gist or idea of ​​the invention that can be read from the claims and the entire specification, and the processing system, inspection system, processing method, inspection method, control device, and computer program that involve such modifications are also included in the technical idea of ​​the present invention. [Explanation of symbols]

[0268] 1, 1c processing equipment 11 Light irradiation device 111 Light source system 1111 Light source 112 Optical system 1122 Galvanometer Mirror 12 Drivetrain 18c Position measurement device 2. Control device 31 Foreign object measuring device 311 Imaging device 312 Light receiving device 32 Foreign matter removal device 33b Defect measurement equipment 34b Defect repair device 4. Display C recess CP1 concave structure CP2 convex structure EA target irradiation area EL processing light S Processing object SF paint film SYS Machining System SA processing shot area AMA, DMA measurement area

Claims

1. In a processing system that processes an object using processing light, an inspection device that inspects a region to be inspected on the surface of the object for foreign matter; an irradiation device that irradiates the inspection area with processing light; A processing system comprising:

2. The irradiation device irradiates the inspection area where the foreign matter inspection has been performed with processing light. The processing system of claim 1 .

3. The foreign substance inspection includes detecting foreign substances in the inspection area. The processing system according to claim 1 or 2.

4. The inspection device measures the presence or absence of foreign matter in the inspection area. The processing system according to any one of claims 1 to 3.

5. The inspection device measures the characteristics of the foreign matter. The processing system according to any one of claims 1 to 4.

6. The characteristics of the foreign object include at least one of the shape and size of the foreign object. The processing system according to claim 5 .

7. The inspection device counts the number of foreign particles. The processing system according to any one of claims 1 to 6.

8. The apparatus further includes a foreign matter removal device that removes foreign matter using the measurement results from the inspection device. The processing system according to any one of claims 1 to 7.

9. The inspection device inspects the surface of the object that has been acted upon by the foreign matter removal device. The processing system according to claim 8 .

10. a display device that displays information about the output from the inspection device; The processing system according to any one of claims 1 to 9.

11. The inspection device measures the size of the foreign matter in the inspection area. The processing system according to any one of claims 1 to 10.

12. When the size of the foreign matter is less than a predetermined size, the irradiation device irradiates the foreign matter and the object with the processing light. The processing system of claim 11.

13. The inspection device inspects the surface for foreign matter in a non-contact manner. The processing system according to any one of claims 1 to 12.

14. The inspection device optically inspects the surface for foreign matter. The processing system of claim 13.

15. The inspection device includes an imaging device that images the surface. The processing system according to claim 13 or 14.

16. The inspection device inspects the surface for foreign matter using information about the surface features of the object and the imaging results obtained by the imaging device. The processing system of claim 15.

17. The inspection device includes a light receiving device that receives at least one of scattered light scattered by the surface and diffracted light diffracted by the surface as inspection light.

17. The processing system according to any one of claims 13 to 16.

18. The inspection device is disposed on one side of the irradiation device.

18. The processing system according to any one of claims 1 to 17.

19. The irradiation position of the processing light by the irradiation device is movable toward the one direction relative to the object.

20. The processing system of claim 18.

20. The irradiation device is movable in the one direction relative to the object.

20. The processing system of claim 19.

21. In a processing system that processes an object using processing light, an inspection device that inspects a surface of the object for defects in an inspection area on the surface of the object; an irradiation device that irradiates the inspection area with processing light; A processing system comprising:

22. The irradiation device irradiates the inspection area where the defect inspection has been performed with processing light.

22. The processing system of claim 21.

23. The defect inspection includes detecting defects in the inspection area.

23. The processing system according to claim 21 or 22.

24. The inspection system further includes a defect repair device that repairs defects using the measurement results from the inspection device.

24. The processing system according to any one of claims 21 to 23.

25. The inspection device inspects the surface of the object that has been acted upon by the defect repair device.

25. The processing system of claim 24.

26. The inspection device measures the presence or absence of defects in the inspection area.

26. The processing system of any one of claims 21 to 25.

27. The inspection device measures the state of the defect.

27. The processing system of any one of claims 21 to 26.

28. The state of the defect includes at least one of the size of the defect and the shape of the defect.

28. The processing system of claim 27.

29. The inspection device counts the number of defects.

28. The processing system of any one of claims 21 to 27.

30. The inspection device inspects the surface for defects in a non-contact manner.

30. The processing system of any one of claims 21 to 29.

31. The inspection device optically inspects the surface for defects.

31. The processing system of claim 30.

32. The inspection device includes an imaging device that images the surface.

32. The processing system according to claim 30 or 31.

33. The inspection device inspects the surface for defects using information about the surface features of the object and the imaging results obtained by the imaging device.

33. The processing system of claim 32.

34. The inspection device includes a light receiving device that receives at least one of scattered light scattered by the surface and diffracted light diffracted by the surface as inspection light.

34. The processing system of any one of claims 30 to 33.

35. a display device that displays information about the output from the inspection device; 35. The processing system of any one of claims 21 to 34.

36. The inspection device is disposed on one side of the irradiation device.

36. The processing system of any one of claims 21 to 35.

37. The irradiation position of the processing light by the irradiation device is movable toward the one direction relative to the object.

37. The processing system of claim 36.

38. The irradiation device is movable in the one direction relative to the object.

38. The processing system of claim 37.

39. In a processing system that processes an object using processing light, a foreign matter removal device for removing foreign matter from at least a portion of the surface of the object; an irradiation device that irradiates processing light onto at least a part of the surface of the object; A processing system comprising:

40. After the foreign matter removal device removes foreign matter from at least a partial region on the surface of the object, the processing light is irradiated onto the partial region.

40. The processing system of claim 39.

41. The foreign body removal device supplies a fluid into the at least a portion of the surface.

41. The processing system according to claim 39 or 40.

42. The foreign matter removal device cleans the interior of the at least a portion of the surface.

42. The processing system of any one of claims 39 to 41.

43. The foreign matter removal device is disposed on one side of the irradiation device.

43. The processing system of any one of claims 39 to 42.

44. The irradiation position of the processing light by the irradiation device is movable toward the one direction relative to the object.

44. The processing system of claim 43.

45. The irradiation device is movable in the one direction relative to the object.

45. The processing system of claim 44.

46. a light receiving device that receives light from a surface of an object having a structure formed on the surface that changes aerodynamic characteristics; an evaluation device that evaluates the features of the structure formed on the surface of the object using design information related to the features of the structure and output information from the light receiving device; An inspection system comprising:

47. The characteristics of the structure include at least one of the shape and size of the structure.

47. The inspection system of claim 46.

48. The light receiving device includes an imaging device that images the surface.

48. An inspection system according to claim 46 or 47.

49. The evaluation device evaluates the characteristics of the structure using information about the surface characteristics of the object and the imaging results obtained by the imaging device.

49. The inspection system of claim 48.

50. The light receiving device receives at least one of scattered light scattered by the surface and diffracted light diffracted by the surface as inspection light.

50. An inspection system according to any one of claims 46 to 49.

51. a display device that displays information about the output from the evaluation device; 51. An inspection system according to any one of claims 46 to 50.

52. The structure on the surface of the object extends in a first direction along the surface of the object and includes a structure that is periodic on the surface of the object in a second direction that intersects with the first direction.

52. An inspection system according to any one of claims 46 to 51.

53. In a processing system that processes an object using processing light, an irradiation device that irradiates a first region on the object with processing light; a position measurement device that measures the position of the first region on the object irradiated with the processing light; Equipped with The irradiation device irradiates a second area on the object, which is different from the first area, with processing light using a position measurement result of the first area by the position measurement device. Processing system.

54. The first area and the second area are in a predetermined positional relationship.

54. The processing system of claim 53.

55. The predetermined positional relationship includes a positional relationship in which the first region and the second region are adjacent to each other.

55. The processing system of claim 54.

56. The position measurement device measures the position of a boundary between the first area and an area outside the first area.

56. The processing system of any one of claims 53 to 55.

57. The boundary of the first region overlaps with the boundary of the second region.

57. The processing system of claim 56.

58. The position measurement device measures the positions of the first regions.

58. The processing system of any one of claims 53 to 57.

59. The second region is located between two of the first regions.

59. The processing system of claim 58.

60. The first region and the second region have the same shape and size.

60. The processing system of any one of claims 53 to 59.

61. The size of the second region is smaller than the size of the first region.

60. The processing system of any one of claims 53 to 59.

62. The irradiation device irradiates a part of the first region with the processing light.

62. The processing system of any one of claims 53 to 61.

63. The position measurement device measures the position of the first area in a non-contact manner.

63. The processing system of any one of claims 53 to 62.

64. the irradiation device irradiates the object with the processing light so as to form a relief structure in the first region; The position measurement device includes a measurement light irradiating unit that irradiates the concave-convex structure with measurement light, and a measurement light receiving unit that receives the measurement light that has passed through the concave-convex structure.

64. The processing system of claim 63, comprising:

65. The measurement light receiving unit receives diffracted light diffracted by the uneven structure.

65. The processing system of claim 64.

66. The irradiation device includes an irradiation position moving device that moves an irradiation position where the processing light is irradiated in a moving direction along the surface of the object.

66. The processing system of any one of claims 53 to 65.

67. The position measurement device measures a portion of the surface of the object on the movement direction side of the irradiation position.

67. The processing system of claim 66.

68. The position measurement device is disposed on the side of the irradiation device in the movement direction.

68. The processing system of claim 66 or 67.

69. The apparatus further includes a moving device that moves the range of the first region on the object.

69. The processing system of any one of claims 53 to 68.

70. The position measurement device measures a portion of the surface of the object on the side of the movement direction of the first region.

70. The processing system of claim 69.

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