Laser processing apparatus

Abstract

To provide a laser processing apparatus capable of reducing the generation amount of fume and improving the processing quality.SOLUTION: A laser processing apparatus that irradiates a workpiece W with laser light L and cuts out an inside of a predetermined irradiation locus C by drawing the irradiation locus a plurality of times, comprises: a support 200 that supports the workpiece W; a laser oscillator 10 that generates the laser light L; a scanning unit 20 that scans the laser light L generated from the laser oscillator 10; and an emitting unit 30 that emits the laser light L scanned by the scanning unit 20 toward a cutting position of the workpiece W supported by the support 200 so as to draw the predetermined irradiation locus C. In the support 200, a suction hole 212 that suctions the workpiece W is formed at a position of supporting an outer end material with respect to the cutting position of the workpiece W supported.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a laser processing device. [Background technology]

[0002] The laser processing device described in Patent Document 1 is a laser processing machine that irradiates a single-layer or laminated film with laser light and cuts the film into a desired shape. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-126740 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional cutting processes for film and other workpieces, the position of the cut film scraps can shift to the position of the laser irradiation path, which can cause the problem of generating unnecessary fumes.

[0005] The laser processing apparatus according to the present disclosure has an object to provide a laser processing apparatus that can reduce the amount of fumes generated and improve processing quality. [Means for solving the problem]

[0006] A laser processing apparatus according to one aspect of the present invention comprises: A laser processing device that irradiates a workpiece with laser light, draws a predetermined irradiation locus multiple times, and cuts out an area inside the irradiation locus, a support portion that supports the workpiece; a laser oscillator that generates laser light; a scanning unit that scans the laser light generated from the laser oscillator; an emission unit that emits the laser light scanned by the scanning unit toward the workpiece supported by the support, the scanning unit scans the laser light emitted from the emission unit onto the workpiece so as to draw the predetermined irradiation locus; The support portion is characterized in that a suction hole for suctioning the workpiece is formed at a position for supporting an end piece outside a cutting position of the supported workpiece. [Effects of the Invention]

[0007] According to the laser processing apparatus of the present disclosure, it is possible to provide a laser processing apparatus that can reduce the amount of fumes generated and improve processing quality. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic diagram of a laser processing device according to this embodiment. [Figure 2] FIG. 2 is a top view of the support body in this embodiment as seen from the laser processing device side. [Figure 3] FIG. 3 is a top view of a support according to another embodiment as viewed from the laser processing device side. DETAILED DESCRIPTION OF THE INVENTION

[0009] FIG. 1 is a schematic diagram of a laser processing apparatus 1 according to this embodiment. As shown in FIG. 1, the laser processing apparatus 1 is used in a mode in which a laser L is irradiated onto a workpiece W fixed to a stage 100. The stage 100 shown in FIG. 1 has a fixed stage 101 and a movable stage 102. The movable stage 102 can move the workpiece W to be processed by moving on the fixed stage 101 in the left-right and depth directions of the paper surface of FIG. 1. A support 200 is provided on the movable stage 102. The support 200 is a member capable of fixing the workpiece W on the movable stage 102.

[0010] In this embodiment, the workpiece W is assumed to be a thin film or thin plate-like resin member. The workpiece W may be, for example, a single-layer film or a laminate of multiple films. Alternatively, the workpiece W may be such a film on which a resin coating is formed. The film may be, for example, a plastic film, and examples of the material include polyimide. Such a workpiece W is used as a substrate for an organic EL (Electro Luminescence) display, for example.

[0011] In this embodiment, it is assumed that the workpiece W is cut along the irradiation trajectory C shown by the dashed line in Fig. 2 to obtain a member having a desired shape. The laser processing apparatus 1 of this embodiment places the workpiece W on the support 200, holds the workpiece W on the support 200, and then performs laser processing by irradiating the workpiece W with laser light L. Note that the workpiece W may be irradiated with laser light L multiple times.

[0012] The laser processing apparatus 1 has an oscillator 10, a scanning unit 20, and an emission unit 30. The oscillator 10 emits laser light L to be irradiated onto the workpiece W. The scanning unit 20 is a member having a mechanism capable of adjusting the irradiation direction of the laser light L, such as a galvano optical system. The emission unit 30 has a condensing lens and condenses the laser light scanned by the scanning unit 20 to irradiate the workpiece W. The scanning unit 20 can change the irradiation position and the moving speed of the irradiation position of the laser light L. In this embodiment, the scanning unit 20 has a control unit (not shown), which scans the laser light so as to trace a predetermined irradiation trajectory on the workpiece W. In this embodiment, the laser processing apparatus 1 irradiates the workpiece W supported by a support 200 with laser light from above.

[0013] Next, the support body 200 of the laser processing apparatus 1 according to this embodiment will be described in detail with reference to Fig. 2. Fig. 2 is a top view of the support body 200 according to this embodiment. In Fig. 2, the location where the workpiece W is placed is indicated by a dashed line. Also in Fig. 2, the irradiation trajectory C of the laser light L irradiated onto the workpiece W is indicated by a broken line. In this embodiment, the laser processing apparatus 1 draws a predetermined irradiation locus C shown in FIG. 2 on the workpiece W multiple times to cut out the inside of the irradiation locus C. For example, if the workpiece W is configured to have a mixture of portions with different numbers of layers, such as a base material with a film partially attached thereto, it may not be possible to cut out the inside of the irradiation locus C by simply irradiating the laser light to draw the irradiation locus C once. Therefore, the laser processing apparatus 1 of this embodiment draws a predetermined irradiation locus C on the workpiece W multiple times to cut out the inside of the irradiation locus C. The portion of the workpiece W that is cut out inside the irradiation locus C is the desired portion, and the portion of the workpiece W outside the irradiation locus C becomes the waste material.

[0014] As shown in FIG. 2, the support 200 is composed of a base portion 210 and an auxiliary support portion 202 attached to the base portion 210 . On the upper surface of the base portion 210, a recessed portion 260 that is generally gate-shaped (or generally Π-shaped) when viewed from above, and an island-shaped main support portion 201 surrounded by the recessed portion 260 are formed. The main support portion 201 supports a portion of the workpiece W that will become a desired member. The auxiliary support portion 202 supports a portion of the workpiece W that will become scrap material other than the desired member.

[0015] The main support portion 201 is made of, for example, an aluminum alloy. The main support portion 201 may be treated with, for example, a hard anodized oxide coating. The recess 260 is recessed downward from the main support portion 201. In other words, the upper surface of the recess 260 is located lower than the upper surface of the main support portion 201, and the main support portion 201 is raised higher than the recess 260.

[0016] The recess 260 is provided with a plurality of suction ports 261 that open to its upper surface. The plurality of suction ports 261 suck in the atmosphere in the vicinity of the position where the laser light is irradiated on the workpiece. These suction ports 261 can suck in and collect fumes and dust that are generated during cutting of the workpiece W along the irradiation trajectory C. Each suction port 261 extends downward, and its lower end is connected to a flow path 262 that extends outward. The flow path 262 is connected to a suction pump (not shown).

[0017] The auxiliary support portion 202 is made of, for example, a fluororesin with a low surface friction coefficient, particularly polytetrafluoroethylene. The auxiliary support portion 202 is provided so as to be fitted into the recess 260. The auxiliary support portion 202 has a first auxiliary support portion 210 and a pair of second auxiliary support portions 220. The second auxiliary support portions 220 are provided at a pair of opposing positions in the approximately gate-shaped recess 260, with the main support portion 201 sandwiched between them. The first auxiliary support portion 210 is provided at the remaining position in the recess 260. The first auxiliary support portion 210 and the second auxiliary support portion 220 are both fixed to the recess 260 with a plurality of screws 300. Furthermore, the top surfaces of the first auxiliary support portion 210 and the second auxiliary support portion 220 are approximately flush with the top surface of the main support portion 201 when fixed to the recess 260.

[0018] The first auxiliary support part 210 further has a suction part 211. The suction part 211 is provided in a portion that overlaps with the workpiece W in a top view when the workpiece W is placed on the support 200. The suction part 211 can suction the workpiece W to the first auxiliary support part 210. The suction part 211 has a plurality of suction holes 212 and a flow path 213. The suction holes 212 are connected to the flow path 213 that communicates with the outside of the support 200 inside the first auxiliary support part 210, and the flow path 213 is connected to a suction pump (not shown). The suction part 211 can suction the workpiece W to the first auxiliary support part 210 by operating the suction pump and creating a negative pressure in the suction holes 212.

[0019] The pair of second auxiliary support members 220 have suction portions 221, similar to the first auxiliary support members 210. The suction portions 221 are provided in portions that overlap with the workpiece W in a top view when the workpiece W is placed on the support member 200. The suction portions 221 have a plurality of suction holes 222 and a flow path 223. The suction holes 212 are connected to the flow path 223 inside the second auxiliary support members 220, which communicates with the outside of the support member 200, and the flow path 223 is connected to a suction pump (not shown). The method by which the suction portions 221 suction the workpiece W is the same as that of the first auxiliary support members 210.

[0020] The laser processing apparatus 1 according to the present disclosure is a laser processing apparatus that irradiates a workpiece W with laser light L, draws a predetermined irradiation locus C multiple times, and cuts out the inside of the irradiation locus, A support 200 that supports a workpiece W; a laser oscillator 10 that generates laser light L; a scanning unit 20 that scans with laser light L generated from a laser oscillator 10; an emission unit (30) that emits the laser light (L) scanned by the scanning unit (20) toward a cutting position of the workpiece (W) supported by the support (200) so as to draw a predetermined irradiation locus (C); The support 200 is characterized in that suction holes 212 for suctioning the workpiece W are formed at positions for supporting scrap material outside the cutting position of the workpiece W being supported.

[0021] According to the laser processing device 1 of the present disclosure, scrap material on the outside of the workpiece W is adsorbed while the workpiece W is being processed, thereby preventing the scrap material from slipping into the irradiation path of the laser light L. This makes it possible to provide a laser processing device that can reduce the amount of fumes generated and improve processing quality.

[0022] Furthermore, in the laser processing apparatus 1 according to the present disclosure, the suction holes 212 formed in the support body 200 may be formed at positions corresponding to two or more corners of the supported workpiece W. According to the above configuration, the number of suction holes can be reduced, and the mechanism for suppressing fume generation can be simplified.

[0023] Furthermore, the laser processing device 1 according to the present disclosure is particularly effective when processing a workpiece that is prone to moving during processing, such as a film.

[0024] 3 is a top view of a support body according to another embodiment, as seen from the laser processing apparatus side. As shown in FIG. 3, in the laser processing apparatus 1 according to the present disclosure, the support body 200 may have suction holes 500 formed therein, which suction holes 500 suction the workpiece W, at a position inside the cutting position of the supported workpiece W. According to the above configuration, since the suction holes are also provided inside the cutting position of the workpiece W, it is possible to suppress the movement of both the desired part of the workpiece W and the scrap material. This suppresses the movement of the entire workpiece W during laser processing, thereby further suppressing the generation of fumes.

[0025] In the laser processing apparatus 1 according to the present disclosure, the support body 200 may have suction channels 213, 223, and 262 extending from the suction port 261. [Explanation of symbols]

[0026] 1. Laser processing equipment 10. Oscillators 10 Laser oscillator 20 Scanning unit 30 Exit section 100 stages 101 Fixed Stage 102 Moving Stage 200 Support 201 Main support part 202 Auxiliary support part 210 First auxiliary support part 211,221 Adsorption part 212,222,500 Adsorption holes 261 Suction port 213,223,262 flow paths 220 Second auxiliary support part 260 Hollow 300 screws

Claims

1. A laser processing device that irradiates a workpiece with laser light, draws a predetermined irradiation locus multiple times, and cuts out an area inside the irradiation locus, A support that supports a workpiece; a laser oscillator that generates laser light; a scanning unit that scans the laser light generated from the laser oscillator; an emission unit that emits the laser light scanned by the scanning unit toward the workpiece supported by the support, the scanning unit scans the laser light emitted from the emission unit onto the workpiece so as to draw the predetermined irradiation locus; A laser processing device characterized in that the support body has suction holes formed in a position that supports scrap material outside the cutting position of the supported workpiece, for suctioning the workpiece.

2. 2. The laser processing device according to claim 1, wherein the suction holes formed in the support body are formed at positions corresponding to two or more corners of the workpiece to be supported.

3. 3. The laser processing device according to claim 1, wherein the workpiece is a film.

4. 2. The laser processing device according to claim 1, wherein the support body has a suction hole formed therein at a position inside a cutting position of the supported workpiece for suctioning the workpiece.

5. 5. The laser processing apparatus according to claim 1, wherein the support has a suction port for sucking in an atmosphere around a position on the workpiece where the laser light is irradiated, and a suction flow path extending from the suction port.

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