Environmentally isolated intercalated compound mount

Abstract

To provide a system for improving the performance of compact, portable atomic clocks utilizing sourced atoms.SOLUTION: In a system, a mounting apparatus 200 for suspending an intercalated compound 220 includes spring connectors 208A, 208B that couple to an intercalated complex 106 that comprises the intercalated compound in an enclosure. The spring connectors exert spring forces on the intercalated complex, which causes it to be suspended between the spring connectors during operation. In doing so, the intercalated compound is thermally isolated relative to the exterior of the enclosure it is disposed in. The mounting apparatus can be used as part of an atomic clock sensor.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] (Statement regarding federally sponsored research and development) This invention was made with government support under N00014-22-C-1043 awarded by the Navy. The government has certain rights in this invention. [Background technology]

[0002] Atomic clocks utilize the frequency excitation of donor atoms as a reference clock signal. Intercalating compounds can be used to supply atoms (e.g., rubidium atoms) within atomic clocks. Such compounds contain lattice structures that can be doped when exposed to donor atoms under favorable reaction conditions. Thus, intercalating compounds operate by chemically releasing or absorbing donor atoms, depending on the ambient concentration and temperature of the donor atoms. These chemical reactions are reversible at chemical equilibrium, allowing the use of intercalating compounds to control the access of donor atoms in atomic clocks.

[0003] Maintaining the high operating temperatures of the intercalating compounds requires a large amount of power, so that the compounds are mounted in a manner that insulates them from the cold environment. For small portable atomic clocks that operate on battery power, the high power consumption is a disadvantage.

[0004] Therefore, there is a need to improve the performance of small portable atomic clocks that utilize donor atoms. Summary of the Invention

[0005] Details of one or more embodiments are set forth in the description below. Features illustrated or described in connection with one exemplary embodiment may be combined with features of other embodiments. Accordingly, any of the various embodiments described herein can be combined to provide further embodiments. Aspects of the embodiments can be modified, as necessary, to employ concepts from any patents, applications, and publications identified herein to provide still further embodiments.

[0006] In one embodiment, a system is disclosed. The system includes a first cover, a first heating element physically coupled to the first cover, a second cover, and a second heating element physically coupled to the second cover. The system further includes an intercalating compound in contact with the first heating element and the second heating element and coupled between the first cover and the second cover. The system further includes a first spring connector coupled to the first cover at a first end of the first spring connector and a second spring connector coupled to the second cover at a first end of the second spring connector. The system further includes a coupler attached to the exterior of the attachment interface device. The coupler couples to the first spring connector at both a second end of the first spring connector and a second end of the second spring connector. The intercalating compound is suspended at least in part between the first cover and the second cover due to spring forces exerted by the first spring connector and the second spring connector. The system transitions between a closed configuration and an open configuration. In the closed configuration, a spring force exerted by the first and second spring connectors causes the first and second covers to substantially encapsulate the intercalated compound. In the open configuration, expansion of the intercalated compound exerts a force on the first and second spring connectors, causing increased exposure of the intercalated compound to the external environment compared to the closed configuration. By suspending the intercalated compound, the intercalated compound is thermally insulated from the external environment.

[0007] In another embodiment, a device is disclosed. The device comprises an intercalated complex. The intercalated complex comprises a first cover, a first heating element physically coupled to the first cover, a second cover, a second heating element physically coupled to the second cover, and an intercalating compound in contact with the first heating element and the second heating element and coupled between the first cover and the second cover. The device comprises an attachment device physically coupled to the intercalated complex. The attachment device comprises a first spring connector coupled to the first cover at a first end of the first spring connector, a second spring connector coupled to the second cover at a first end of the second spring connector, and a coupler attached to the exterior of the attachment interface device. The coupler couples to the first spring connector at both the second end of the first spring connector and the second end of the second spring connector. The intercalating compound is suspended at least in part between the first cover and the second cover due to a spring force exerted by the first spring connector and the second spring connector.

[0008] In yet another embodiment, a method for fabricating a mounting apparatus for an intercalating compound is disclosed. The method includes attaching a first end of a first spring connector and a first end of a second spring connector to a mounting interface device. The method includes attaching a second end of the first spring connector to a first cover. The method includes attaching a second end of the second spring connector to a second cover. The method includes coupling first and second heating elements within a cavity formed by the first and second covers. The method includes suspending the intercalating compound between the first and second heating elements and between the first and second covers.

[0009] These and other features of the systems and methods of the present disclosure will become more readily apparent to those skilled in the art from the following detailed description of the preferred embodiments taken in conjunction with the drawings. [Brief explanation of the drawings]

[0010] Example embodiments are described with additional specificity and detail through the use of the accompanying drawings, as described below and in conjunction with the detailed description, with the understanding that the drawings depict example embodiments only and therefore should not be considered limiting in scope. [Figure 1] 1 depicts a block diagram of a system having an intercalating complex that can utilize the techniques described herein. [Figure 2] 1 depicts a block diagram of an exemplary mounting apparatus for sequestering an intercalating compound, as described in one or more embodiments. [Figure 3] 1 depicts an isometric view of an exemplary mounting interface device used in conjunction with a mounting apparatus, as described in one or more embodiments. [Figure 4] 1 depicts an isometric view of an exemplary coupler used to couple an intercalating complex to a mounting interface device, as described in one or more embodiments. [Figure 5] 1 depicts an isometric view of an exemplary spring connector used to couple an intercalating complex to a mounting interface device, as described in one or more embodiments. [Figure 6A] 1 depicts an isometric view of exemplary components used in an intercalating complex, as described in one or more embodiments. [Figure 6B] 1 depicts an isometric view of exemplary components used in an intercalating complex, as described in one or more embodiments. [Figure 7] 1 depicts an isometric view of an exemplary intercalating complex as described in one or more embodiments. [Figure 8] 1 depicts an isometric view of an exemplary mounting device with an intercalated complex in a closed configuration, as described in one or more embodiments. [Figure 9] 1 depicts an isometric view of an exemplary mounting device with an intercalated complex in an open configuration, as described in one or more embodiments. [Figure 10]1 depicts an isometric view of an exemplary mounting apparatus as described in one or more embodiments. [Figure 11] 1 depicts a flow diagram of an exemplary method for fabricating a mounting device, as described in one or more embodiments.

[0011] According to common practice, the various features described are not drawn to scale but rather to emphasize specific features relevant to the exemplary embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0012] In the following detailed description, reference is made to the accompanying drawings that form a part hereof, and in which are shown by way of illustration specific illustrative embodiments. However, it is to be understood that other embodiments may be utilized and that logical, mechanical, and electrical changes may be made. Furthermore, the methods presented in the drawings and specification should not be construed as limiting the order in which individual steps may be performed. Therefore, the following detailed description is not to be construed in a limiting sense.

[0013] FIG. 1 depicts a block diagram of a system 100 having an intercalated complex that can utilize the techniques described herein. In various embodiments, the system 100 is or includes an atomic clock sensor, although the present disclosure is not limited to atomic clock applications. The system 100 includes an enclosure 102 that provides a volume for input atoms to form a vapor. Specifically, the mounting apparatus includes an intercalated complex 106 that is physically and electrically coupled to a mounting interface device 104. The enclosure 102 generally creates a contained, high-vacuum environment surrounding the intercalated complex 106 and can isolate the intercalated complex 106 from external circuits and systems, such as a power supply 112, optional control electronics 110, and any other external systems coupled to the system 100 shown in FIG. 1 .

[0014] The intercalated complex 106 comprises an atomic source used in atomic clocks. As will be appreciated by those skilled in the art, atomic clocks generally operate by using electromagnetic radiation to excite a vapor of atoms, such as rubidium atoms. Observation of the excitation resonant frequency can then be used as a reference to define a stable clock signal, which can be used for various applications in timing, navigation, and sensing. Such applications may be advantageous when implemented in the context of air navigation. Thus, the system 100 can be coupled to a vehicle, such as an aircraft. In some embodiments, the enclosure 102 comprises a vacuum environment, despite the source atoms chemically interacting with the intercalated complex 106.

[0015] The intercalated composite 106 includes an intercalating compound that provides the donor atoms. For example, the intercalating compound can include graphite (i.e., a graphite intercalated compound (GIC)) or other similar materials that can bond with the donor atoms. The intercalating compound is characterized by a series of intercalated layers (e.g., graphite sheets) that, under certain conditions, chemically react with the donor atoms in a reversible chemical reaction. For example, to provide the donor atoms, the intercalating compound is exposed to a low-concentration environment and heated, which allows the donor atoms to escape from the intercalating compound into the interior of the enclosure 102, where the atomic vapor can be excited by electromagnetic interaction. Under conditions where a high concentration of donor atoms is present within the enclosure 102, the donor atoms can react with the intercalating compound, thereby reducing the concentration of donor atoms in the environment of the enclosure 102. Specifically, the donor atoms can become bonded (by covalent or ionic bonds, depending on the intercalating compound used) between layers of the host compound.

[0016] In some embodiments, the intercalating complex 106 includes a heating element that provides heat to the intercalating compound. Such a heating element (see FIG. 6B ) can be powered by a power source 112 through an electrical connection, conductor, or other means. The enclosure 102 also optionally includes a sensor 108. In some embodiments, the sensor 108 is a temperature sensor that monitors the temperature of the walls of the enclosure 102. Additionally or alternatively, the sensor 108 is a sensor that monitors the concentration of donor atoms within the enclosure 102. In embodiments in which a sensor 108 is used, measurements determined by the sensor 108 are provided to the control electronics 110 and can be used for feedback in controlling the temperature of the intercalating complex 106. For example, the control electronics 110 can control the exposure of the intercalating compound based on the temperature of the walls of the enclosure 102 and / or the concentration of donor atoms detected by the sensor 108. This provides an active mechanism for regulating the supply of donor atoms within the enclosure 102. However, in some embodiments, a passive atomic vapor regulation mechanism can be used without active control of the intercalated complex 106. Thus, the control electronics 110 and the sensor 108 are optional. Control and power signals from the control electronics 110 and the power supply 112 are provided from a bus 105, which can also connect these components to external systems.

[0017] The intercalated complex 106 is physically coupled to the mounting interface device 104. The mounting interface device 104 electrically couples the control electronics 110 and power source 112 to the mounting apparatus and, as will be described later, physically couples them to the mounting apparatus.

[0018] In the embodiments disclosed herein, the intercalated complexes 106 are thermally isolated from the walls of the enclosure 102. This allows the temperature of the intercalated complexes 106 to be maintained at a higher temperature than the walls of the enclosure while requiring minimal power for heating. Various embodiments of mounting devices (and their constituent components) used to isolate the intercalated complexes 106 are described with respect to Figures 2-10.

[0019] FIG. 2 depicts a diagram of a mounting apparatus 200 for sequestering an intercalating compound. The mounting apparatus 200 generally includes a set of spring connectors 208A, 208B physically coupled to the intercalating complex 106. Each spring connector 208A, 208B is configured to couple to a coupler 206 of the mounting interface device 104. Various coupling mechanisms can be used to couple the spring connectors 208A, 208B, including nuts, bolts, screws, and the like. In some embodiments, the spring connectors 208A, 208B can be coupled to the coupler 206 by adhesive, snap mechanisms, grooves, or other recesses on the coupler 206 that secure the spring connectors 208A, 208B to the mounting interface device 104. In the embodiment of FIG. 2, each spring connector 208A, 208B is coupled to the coupler 206 via a screw 204 inserted into a hole in the end of the connector 208A, 208B.

[0020] The mounting interface device 104 may be coupled to an interior wall (not shown in FIG. 2 ) of the enclosure 102, and the mounting interface device 104 and mounting apparatus 200 may be in a high vacuum environment. The intercalated complex 106 comprising the intercalated compound 220 may further protrude inside the enclosure 102. Electrical leads 202 may extend from the enclosure 102 to the power source 112 and / or control electronics 110, electrically coupling the mounting interface device 104 to these and other systems via a bus 105.

[0021] At the other end of the spring connectors 208A, 208B is the intercalated complex 106. The intercalated complex 106 includes an intercalated compound 220 and two planar heaters 216 and 218 bonded between two covers 212, 214. The covers 212, 214 are then each bonded to one of the spring connectors 208A, 208B, with cover 212 bonded to spring connector 208A and cover 214 bonded to spring connector 208B. In the embodiment of FIG. 2, each cover 212, 214 includes a protrusion 210 that projects outward from the cover 212, 214 and is inserted through a hole on the spring connector 208A, 208B. The covers 212, 214 capture the intercalated compound 220 and heaters 216, 218 together into an oven-like assembly. The spring connectors 208 thermally isolate the intercalated complex from the mounting interface and also allow for the expansion and contraction of the thickness of the intercalated compound 220 that occurs as donor atoms are released and absorbed during operation.

[0022] When the intercalated complex 106 is coupled between the two spring connectors 208A, 208B, the intercalated complex 106 remains suspended so that it does not come into contact with the walls of the enclosure 102 or any other platform. The mechanism of coupling between the spring connectors 208A, 208B and the intercalated complex 106 will now be described. The spring connectors 208A, 208B are configured to apply opposing spring forces (not necessarily equal in magnitude) to the intercalated complex 106, thereby keeping the intercalated complex 106 suspended between the respective spring connectors 208A, 208B. In the embodiment of FIG. 2, the spring connector 208A applies a spring force to the cover 212. However, the spring connector 208B also applies a counteracting spring force to the cover 214. Due to the tension between the spring force exerted by connector 208A and the spring force exerted by connector 208B, the net force on the intercalated complex 106 remains balanced and is therefore suspended between the two connectors 208A, 208B.

[0023] In some embodiments, the intercalated complex 106 is held fixed simply by the counteracting spring force exerted by the spring connectors 208A, 208B. In the coupled configuration shown in FIG. 2, the intercalated compound 220 and planar-heaters 216, 218 are held in place by spring forces acting on the two covers 212, 214. As further illustrated in FIGS. 8-10, the intercalated compound 220 is free to expand and contract in thickness as it releases or absorbs atoms to regulate the density of the vapor of source atoms in the surrounding environment. When the intercalated complex 106 is suspended between the two spring connectors 208A, 208B, the intercalated complex 106 can function as an atom source.

[0024] FIG. 3 depicts an isometric view of a mounting interface device used in the mounting apparatus. The mounting interface device 104 includes an exterior surface with an interior surface (not shown) inside the exterior surface. Connected to the interior of the mounting interface device 104 are electrical leads 302 that electrically couple the mounting apparatus 200 to external systems (e.g., the power source 112 and / or the control circuitry 110) located on the aircraft. In some embodiments, the mounting interface device 104 interfaces between different environmental compartments. For example, one end of the mounting interface device 104 (the end including the electrical leads 302) is exposed to air, while the other end of the mounting interface device 104 (the end including the electrical leads 304) is disposed within the vacuum enclosure 102, through which the source atoms can diffuse. The electrical leads 304 electrically couple power received from an external source (e.g., the power source 112) to the planar-heaters 216 and 218 within the intercalated composite 106.

[0025] The interior of the mounting interface device 104 couples the electrical leads 302, 304 together. In some embodiments, the interior of the mounting interface device 104 is empty except for the electrical leads 304, 304. The mounting interface device 104 can be welded to the wall of the enclosure 102. In some embodiments, the mounting interface device 104 can be designed in other ways to stabilize and physically couple the mounting apparatus within the enclosure 102.

[0026] FIG. 4 depicts an isometric view of a coupler 400 used to couple an intercalated complex to the attachment interface device 104. The coupler 400 is configured to be attached to the attachment interface device 104, for example, by adhesive, welding, or an external coupler, such as screws, bolts, or the like. The coupler 400 includes protrusions 206 that couple to the spring connectors 208A, 208B shown in FIG. 2. In the embodiment shown in FIG. 4, the coupler includes four members 404, each of which is mounted flush with the surface 401 of the attachment interface device 104. Specifically, each member 404 includes a hole 402 through which a coupling device, such as a screw or nut, can be inserted to couple to a reciprocating hole 306 on the surface 401 of the attachment interface device 104. The coupler 400 can be constructed of metal, ceramic, glass, or other sturdy material sufficient to handle the opposing spring forces of the spring connectors 208A, 208B and couple them to the attachment interface device 104. Coupler 400 may, in some embodiments, form part of wearable interface device 104, for example, by being permanently affixed to surface 401 as part of a fabrication process. Although Figure 4 depicts one embodiment of coupler 400, coupler 400 may be designed in ways other than that depicted in Figure 4.

[0027] FIG. 5 depicts an isometric view of spring connectors 208A, 208B used to couple the intercalated complex to the chamber. As described with respect to FIG. 2, each spring connector 208A, 208B couples to coupler 206. In some embodiments, each spring connector 208A, 208B includes a hole 502 through which a coupling device, such as a screw or bolt, can be inserted. For example, to couple each spring connector 208A, 208B to coupler 206, the hole 502 of spring connector 208A, 208B is aligned with either the top or bottom hole 407 of coupler 206. Specifically, the hole 502 of spring connector 208A can be aligned over the top hole 407, and the hole 502 of spring connector 208B can be aligned over the corresponding bottom hole (not shown in FIG. 4) of coupler 206. One or more screws can then be inserted through the top and bottom holes 407 to fasten the spring connectors 208A, 208B to the coupler 206.

[0028] The spring connectors 208A, 208B also include holes 504 at opposite ends for coupling the spring connectors 208A, 208B to the intercalated complex 106. For example, each hole 504 can be coupled to a respective cover 212, 214 by inserting the protrusion 210 of each cover 212, 214 into the respective hole 504. Additionally, each spring connector 208A, 208B is made from a flexible or resilient material that generates a spring force when stressed. In the example shown in FIG. 5 , each spring connector 208A, 208B can be slightly arched at its midpoint to facilitate the generation of a spring force when coupled to the coupler 206 and the intercalated complex 106. In some embodiments, the spring connectors 208A, 208B can be made from a material with low thermal conductivity, such as stainless steel, to reduce heat conduction from the intercalated complex 106 to the mounting fixture. The shape of the spring connectors 208A, 208B can be selected to exert an appropriate amount of force to maintain compression and stability without yielding or damaging the inner layers of the intercalated composite 106, which amount of force will vary based on the type of material, spring length, and shock / vibration requirements.

[0029] 6A-6B depict isometric views of components used in the intercalated composite. Specifically, FIG. 6A depicts an embodiment of a cover that at least partially contains an intercalated compound, and FIG. 6B depicts an embodiment of the internal components of the intercalated composite 106. Referring to FIG. 6A, each cover 212, 214 includes a respective protrusion 210 disposed on an outer surface of the cover. The protrusions 210 are configured to couple to holes 504 in the respective spring connectors 208A, 208B. In the embodiment depicted in FIG. 5, the holes 504 in the spring connector 208A engage with the protrusions 210 in the cover 214, and the holes 504 in the spring connector 208B engage with the protrusions 210 in the cover 212. However, the coupling between the covers 212, 214 and the spring connectors 208A, 208B may be performed in other manners. For example, the covers 212, 214 may include etched portions, grooves, latches, or other indentations on their surfaces that engage with the spring connectors 208A, 208B. The protrusions 210 on each cover 212, 214 should closely match the dimensions of the respective holes 504 to hold each cover 212, 214 in place, and the coupling mechanism between the spring connectors 208A, 208B and the covers 212, 214 should be designed so that the covers 212, 214 are oriented flush (as opposed to angled or arched) relative to one another.

[0030] The interior of each cover 212, 214 includes a cavity 602 within which an internal component (see FIG. 6B) can be disposed. The cavity 602 can be specially designed with dimensions to match the spatial dimensions of the internal component. In some embodiments, each cover 212, 214 includes an opening through which an electrical connection to the power source 112 can be coupled to the heating element 216 disposed within the cavity 602.

[0031] Referring to FIG. 6B, one or more heating elements can be disposed within the intercalated composite 106 to provide heat to the intercalated compound. For example, two planar heating elements 216, 218 are shown in FIG. 6B. Each heating element 216, 218 can be rectangular in design and can include a thermistor or other heating circuit. The intercalated compound 220 comprises a material having multiple intercalated layers. Under favorable reaction conditions, it acts as a sink or source of atoms, such as rubidium. The donor atoms react with the host atoms and become chemically bonded to these atoms, thereby increasing the concentration of the donor atoms in the compound 220. Binding the donor atoms to the intercalated layers also expands the compound 220. When conditions are favorable for the release of the donor atoms, the chemical bond between the donor atoms and the intercalated layer is broken, allowing the donor atoms to escape from the intercalated compound 220. Therefore, the thickness of the compound 220 can vary depending on the concentration of the donor atoms in the intercalated compound.

[0032] Intercalating compound 220 can include any intercalated material capable of reacting with donated atoms, such as rubidium. In one embodiment, intercalating compound 220 is graphite intercalated with rubidium atoms, although other intercalated host materials besides graphite can also be used and can intercalate and donate other atoms besides rubidium.

[0033] FIG. 7 depicts an isometric view of an intercalated complex 106 comprising the components described in FIGS. 6A-6B. Generally, the intercalated complex 106 is held together by opposing spring forces exerted by spring connectors 208A, 208B. As described above and below, the thickness of the intercalated complex 220 (the distance between the covers 212, 214) can change as the intercalated compound 106 absorbs or releases donor atoms. Although the thickness changes, in some embodiments, the covers 212, 214 do not physically contact, and a gap still exists between the covers 212 and 214, even when the intercalated compound 220 is at its minimum thickness. As the intercalated compound 220 expands, the spacing between the covers 212 and 214 increases. As the intercalated compound 220 contracts, the spacing between the covers 212 and 214 decreases. Thus, the positive mechanical entrapment of the internal components of the intercalated complex 106 is maintained even as the thickness of the intercalated compound 220 changes during operation.

[0034] 7, the intercalating compound 220 is sandwiched between two heating elements 216, 218. The heating elements 216, 218 may be attached to the inside of each respective cover 212, 214 and / or may be in contact with the intercalating compound 220. The sandwich of the heating elements 216, 218 and the intercalating compound 220 is further bonded between the two covers 212, 214.

[0035] 8 depicts an isometric view of a mounting device 800 in which the intercalating compound is in a minimal thickness state (i.e., a "closed" configuration). The mounting device 800 operates similarly to that described above with respect to FIG. 2, and the associated components operate similarly to those described with respect to FIGS. 3-7. In the embodiment shown in FIG. 8, the mounting device 800 is in a configuration in which the intercalating complex 106 is at a minimal thickness and the spacing between the two covers 212, 214 is minimized.

[0036] When in the closed configuration, the covers 212 and 214, facilitated by the spring force of the spring connectors 208A, 208B, tightly hold the planar-heaters 216, 218 and the intercalating compound 220 together. This configuration occurs when the majority of the feed atoms are released into the ambient environment of the enclosure 102, thereby minimizing the thickness of the intercalating compound 220. Even in this minimum thickness configuration, the heating elements 216, 218 still receive power through electrical leads 806, 808, which electrically couple the heating elements 216, 218 to the power source 112.

[0037] 9 depicts an isometric view of a mounting device 900 with the intercalating compound in a maximum thickness state (i.e., "open" configuration). The mounting device 900 operates similarly to that described above with respect to FIG. 2, and the associated components operate similarly to those described with respect to FIGS. 3-7. In the embodiment shown in FIG. 9, the mounting device 900 is in a configuration in which the intercalating complex 106 is expanded and the spacing between the two covers 212, 214 is at a maximum value.

[0038] When in the open configuration, the thickness of the intercalating compound 220 is maximized due to the high concentration of donor atoms intercalated into the intercalating compound 220. The increased thickness causes the intercalating compound 220 to push the covers 212, 214 apart. In the open configuration, the intercalating complex 106 remains in mechanical equilibrium with the spring connectors 208A, 208B. The intercalating compound 220 remains bonded between the covers 212, 214. In some embodiments, the covers 212, 214 include special grooves or etched portions that prevent lateral movement of the intercalating compound 220.

[0039] 8-9 , the mounting devices 800, 900 are configured to change between a closed configuration and an open configuration. The expansion and contraction of the thickness of the intercalated complex 106 can occur in a continuous or stepwise manner as the reaction equilibrium changes with respect to the bonding of the source atoms to the intercalating compound 220. Thus, the mounting devices 800, 900 can allow the intercalated complex 106 to expand or contract to any degree supported by the mounting devices 800, 900 between an open configuration (corresponding to a state in which all or nearly all of the source atoms are within the intercalating compound 220) and a closed configuration (corresponding to a state in which all or nearly all of the source atoms are absent from the intercalating compound 220). As reaction conditions change in the environment in which the mounting devices 800, 900 are disposed, the degree of expansion / contraction of the intercalated complex 106 changes accordingly. For example, as more and more source atoms are intercalated into the intercalating compound 220, the intercalated complex 106 can expand to an open configuration, and as fewer and fewer source atoms are intercalated into the intercalating compound 220, the intercalated complex 106 can contract to a closed configuration. Furthermore, the intercalated complex 106 can expand or contract to any intermediate state between these two configurations.

[0040] 8-9, the intercalated composites (specifically, covers 212, 214) include respective cutouts 802, 804 fabricated in the top of the respective covers 212, 214. Each cutout 802, 804 is configured to receive an end of a respective spring connector 208A, 208B and tightly attach the spring connectors 208A, 208B to the respective covers 212, 214. Each cutout 802, 804 may include other grooves or recesses that allow the end of the spring connectors 208A, 208B to rest parallel to the longitudinal (i.e., horizontal) axis of the respective covers 212, 214. Coupling the ends of spring connectors 208A, 208B to their respective notches 802, 804 in this manner can help create a suitable spring force in spring connectors 208A, 208B by building tension in the arched portions of spring connectors 208A, 208B.

[0041] As previously mentioned, constructing and operating the mounting devices 800, 900 (in addition to any of the other mounting devices described herein) allows the intercalated complex 106 to have greater thermal and / or vibrational isolation from the environment that may disturb the complex 106. The intercalated complex 106 can remain substantially thermally isolated from the mounting and walls, which may increase the power required to raise the intercalated compound 220 to a desired operating temperature. Additionally, vibrations experienced by larger sensor systems in which the source is utilized can be absorbed by the flexible spring force of the spring connectors 208A, 208B, which hold the intercalated complex 106 in place.

[0042] Also, as previously mentioned, operation of the mounting device can be facilitated in a passive or active manner. When driven in an active manner, appropriate processing or control circuitry can be utilized to increase or decrease the temperature of compound 220 in response to signals from sensor 108 to achieve a desired vapor density of source atoms. When operated in a passive manner, the temperature of the compound can be maintained at a fixed value.

[0043] FIG. 10 depicts an isometric view of the mounting device 1000. The mounting device 1000 operates similarly to the other mounting devices shown and described with respect to FIGS. 1-9. In FIG. 10, the cutout 802 in the cover 212 is more easily seen. In some embodiments, the spatial dimensions of the cutout 802 (and cutout 804) match the spatial dimensions of the ends of the spring connectors 208A (and spring connectors 208B) that rest on the respective cutouts 802, 804. The spring connectors 208A, 208B remain disposed within the cutouts 802, 804 as the intercalated complex 106 expands and compresses. Although FIG. 10 depicts the intercalated complex 106 in a closed configuration, the intercalated complex 106 can expand to the state shown in FIG. 9.

[0044] The intercalated complex 106 also includes an opening 1002. The opening 1002 can be formed by fabricating symmetrical grooves in each of the covers 212, 214, so that when the intercalated complex 106 compresses into a closed configuration, the opening 1002 allows environmental exposure to the intercalated compound 220 inside and between the two covers 212, 214. In doing so, source atoms can filter through the opening 1002 to interact with the intercalated compound 220 or be released into the environment.

[0045] 11 depicts a flow diagram of a method 1100 for fabricating a mounting device. Method 1100 may be implemented via the techniques described with respect to FIGS. 1-10 , but may also be implemented via other techniques. The blocks of the flow diagram are generally arranged sequentially for ease of explanation; however, it should be understood that this arrangement is merely exemplary, and that the operations associated with the methods described herein (and the blocks shown in the figures) may occur in different orders.

[0046] The method 1100 includes, at block 1102, attaching spring connectors to a mounting interface device. The spring connectors can be coupled together to a coupler that is attached to the mounting interface device. For example, with reference to FIGS. 2, 8-10, the coupler 206 is coupled to the ends of the spring connectors 208A, 208B by screws 204 that thread through holes 502 and into the interior of the coupler 206. Other devices, such as bolts, nuts, or other devices, can also be used to attach the spring connectors 208A, 208B to the coupler 206. In some embodiments, the spring connectors 208A, 208B are attached to the coupler 206 by other means, such as unique grooves, etched portions, notches, or adhesive contact between the spring connectors 208A, 208B and the coupler 206.

[0047] At block 1104, the method 1100 attaches spring connectors to each cover of the intercalated complex. The spring connectors 208A, 208B can be connected to the covers 212, 214, as shown in FIG. 2, with the holes 504 inserted through the respective protrusions 210 of the respective covers 212, 214. In some embodiments, the spring connectors 208A, 208B are connected to the covers 212, 214 by engaging the ends of the spring connectors 208A, 208B with the respective notches 802, 804, as shown in FIGS. 8-10. The spring connectors 208A, 208B can be coupled to the covers 212, 214 in other manners.

[0048] Proceeding to block 1106, the method 1100 couples a heating element within the cavity of each cover. For example, the heating elements can be coupled as shown in FIGS. 6A-7 by disposing the heating element 216, 218 within the cavity 602 of each cover 212, 214. The method 1100 then proceeds to block 1108 and suspends an intercalating compound between the heating element and the cover. The intercalating compound can be suspended as shown in FIGS. 2, 8-10, where the intercalating compound is allowed to expand and contract within the intercalated complex 106 as it reacts with the source atoms. In some embodiments, the intercalating compound 220 is coupled between the heating element 216, 218 and the cover 212, 214 solely by clamping spring force from the spring connectors 208A, 208B, i.e., without the use of adhesive materials or physical connecting devices, in a manner that preserves the reactivity of the intercalating compound 220. [Example]

[0049] Example 1 is a system including a first cover, a first heating element physically coupled to the first cover, a second cover, a second heating element physically coupled to the second cover, an intercalating compound in contact with the first heating element and the second heating element and coupled between the first cover and the second cover, a first spring connector coupled to the first cover at a first end of the first spring connector, a second spring connector coupled to the second cover at a first end of the second spring connector, and a coupler attached to the exterior of the attachment interface device, the coupler coupling to the first spring connector at both the second end of the first spring connector and the second end of the second spring connector. and a plug, wherein the intercalating compound is suspended between the first cover and the second cover at least in part due to a spring force exerted by the first spring connector and the second spring connector, the system transitioning between a closed configuration and an open configuration, wherein in the closed configuration, the spring force exerted by the first spring connector and the second spring connector causes the first cover and the second cover to substantially encapsulate the intercalating compound, and in the open configuration, expansion of the intercalating compound exerts a force on the first spring connector and the second spring connector, causing increased exposure of the intercalating compound to the external environment compared to the closed configuration, and by suspending the intercalating compound, the intercalating compound is thermally insulated from the external environment.

[0050] Example 2 includes the system of example 1, wherein the system is disposed within an enclosure and the mounting interface device is attached to a wall of the enclosure.

[0051] Example 3 includes the system of Example 2, wherein the mounting interface device is electrically coupled to a power source disposed outside the enclosure, and the mounting interface device is configured to pass an electrical signal from the power source to the first heating element and the second heating element.

[0052] Example 4 includes the system of Example 2 or 3, which includes a sensor disposed within the enclosure and control electronics disposed outside the enclosure, wherein the sensor is configured to measure an environmental parameter within the enclosure and provide the environmental parameter to the control electronics, and the control electronics is configured to control a configuration of the system based on the environmental parameter.

[0053] Example 5 includes the system of any of Examples 1-4, transitioning between the closed and open configurations in a passive manner.

[0054] Example 6 includes the system of any of Examples 1-5, wherein the first spring connector and the second spring connector are coupled to the attachment interface device by one or more screws, nuts, or bolts.

[0055] Example 7 includes the system of any of Examples 1-6, wherein the intercalating compound is a graphite intercalating compound.

[0056] Example 8 includes a device, the device including an intercalated complex, the intercalated complex comprising: a first cover; a first heating element physically coupled to the first cover; a second cover; a second heating element physically coupled to the second cover; an intercalated compound contacting the first heating element and the second heating element and coupled between the first cover and the second cover; and an attachment device physically coupling to the intercalated complex, the attachment device being attached to the first cover at a first end of a first spring connector. a coupled first spring connector, a second spring connector coupled to the second cover at a first end of the second spring connector, and a coupler attached to the exterior of the attachment interface device, wherein the coupler couples to the first spring connector at both the second end of the first spring connector and the second end of the second spring connector, and the intercalating compound is suspended at least in part between the first cover and the second cover due to spring forces exerted by the first spring connector and the second spring connector.

[0057] Example 9 includes the device of Example 8, wherein the intercalating compound is configured to expand when exposed to vapor of the donor atom, the intercalating compound is configured to contract when the vapor of the donor atom is released into the closed environment, and the intercalating compound remains suspended between the first cover and the second cover when expanded and when compressed.

[0058] Example 10 includes the device of example 8 or 9, wherein the first heating element and the second heating element receive power from one or more electrical leads coupled to a power source.

[0059] Example 11 includes the device of any of Examples 8-10, wherein the first cover and the second cover include respective notches, and wherein a first end of the first spring connector is disposed within the respective notches of the first cover, and a first end of the second spring connector is disposed within the respective notches of the second cover.

[0060] Example 12 includes the device of any of Examples 8-11, wherein the first cover and the second cover form a cavity, and the intercalating compound is disposed within the cavity.

[0061] Example 13 includes the device of any of Examples 8-12, wherein the first cover and the second cover form an opening when the intercalating compound is in a compressed state, allowing a volume of source atoms to enter the opening and interact with the intercalating compound.

[0062] Example 14 includes the device of any of Examples 8-13, wherein the first cover and the second cover include respective protrusions, a first end of the first spring connector is coupled to the respective protrusions of the first cover, and a first end of the second spring connector is coupled to the respective protrusions of the second cover.

[0063] Example 15 includes the device of any of Examples 8-14, wherein the attachment interface device is coupled to an interior wall of an enclosure housing the attachment device, the attachment device is physically coupled to the attachment interface device on a side of the attachment device, and the intercalated complex extends from the attachment interface device into the interior of the enclosure.

[0064] Example 16 includes the device of any of Examples 8-15, wherein the first spring connector and the second spring connector are longitudinal strips having an arched shape and comprised of a flexible material.

[0065] Example 17 includes a method for fabricating a mounting apparatus for an intercalating compound, the method including attaching a first end of a first spring connector and a first end of a second spring connector to a mounting interface device, attaching a second end of the first spring connector to a first cover, attaching a second end of the second spring connector to a second cover, coupling first and second heating elements within a cavity formed by the first cover and the second cover, and suspending an intercalating compound between the first heating element and the second heating element and between the first cover and the second cover.

[0066] Example 18 includes the method of example 17, wherein the first spring connector and the second spring connector are attached to the attachment interface device so as to exert opposing spring forces on the intercalating compound.

[0067] Example 19 includes the method of example 17 or 18, including attaching the mounting interface device to an interior wall of an enclosure, the enclosure housing the mounting device.

[0068] Example 20 includes the method of any of Examples 17-19, including coupling the attachment interface device to an interior wall of an enclosure that houses the attachment device; and coupling the attachment device to a side of the attachment interface device, wherein the intercalating compound extends from the attachment interface device into the interior of the enclosure.

[0069] Although specific embodiments have been illustrated and described herein, those skilled in the art will recognize that any configuration which is expected to achieve the same purpose may be substituted for the specific embodiments shown. Therefore, it is manifestly intended that this invention be limited only by the claims and the equivalents thereof.

Claims

1. 1. A system comprising: A first cover; a first heating element physically coupled to the first cover; A second cover; a second heating element physically coupled to the second cover; an intercalating compound in contact with the first heating element and the second heating element and bound between the first cover and the second cover; a first spring connector coupled to the first cover at a first end of the first spring connector; a second spring connector coupled to the second cover at a first end of the second spring connector; a coupler attached to the exterior of the attachment interface device, the coupler coupling to the first spring connector at both the second end of the first spring connector and the second end of the second spring connector; the intercalating compound is suspended at least in part between the first cover and the second cover due to a spring force exerted by the first spring connector and the second spring connector; the system transitions between a closed configuration and an open configuration; In the closed configuration, the spring force exerted by the first and second spring connectors causes the first and second covers to substantially enclose the intercalating compound; In the open configuration, expansion of the intercalating compound exerts a force on the first spring connector and the second spring connector, causing increased exposure of the intercalating compound to the external environment compared to the closed configuration; A system wherein the intercalating compound is thermally insulated from the external environment by suspending the intercalating compound.

2. 2. The system of claim 1, wherein the attachment interface device is coupled to an interior wall of an enclosure, the first and second spring connectors are physically coupled to sides of the attachment interface device, and the intercalating compound extends from the first and second spring connectors into the interior of the enclosure.

3. 3. The system of claim 2, wherein the mounting interface device is electrically coupled to a power source disposed outside the enclosure, the mounting interface device configured to pass electrical signals from the power source to the first heating element and the second heating element.

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