Electronic device

Abstract

To provide an electronic device that reduces the thermal resistance caused by air, improves the heat transfer effect, and accelerates the heat dissipation of a chip.SOLUTION: An electronic device includes a heat dissipation housing including multiple housing walls 11 and 13, a circuit board 2, a chip 3, a thermal interface material layer 4, a thermally conductive member 5, and an elastic member 6. The circuit board, the chip, the thermally conductive member, and the elastic member are located within a chamber 101 formed of the heat dissipation housing. The chip is located on a surface of the circuit board. The thermally conductive member is located on a surface of the chip. The elastic member, which has a heat transfer property, is compressed between the thermally conductive member and the first housing wall 11 to reduce a gap between the chip and the thermally conductive member. The gap is filled with a thermal interface material layer. The thin thermal interface material layer filling the gap can accelerate heat transfer between the chip and the thermally conductive member, thereby, allowing the thermally conductive member to quickly transfer absorbed heat to the heat dissipation housing, to heat dissipation effect.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] This application claims priority to Chinese Patent Application No. 202011478901.3, entitled "ELECTRONIC DEVICE," filed on December 15, 2020, which is incorporated herein by reference in its entirety.

[0002] This application relates to the field of heat dissipation technology, and more particularly to heat dissipation architectures for electronic devices. [Background technology]

[0003] An electronic device, such as an on-board device for an autonomous vehicle, may structurally include a chip and a heat dissipation housing, where the chip is disposed in the heat dissipation housing, and the heat dissipation housing is configured to seal the chip, provide dustproof and waterproof effects, and dissipate heat from the chip.

[0004] Because chips have large processing tolerances and the housing walls and base of the heat dissipation housing each have thickness tolerances during processing, there is usually a large gap between the chip and the housing wall of the heat dissipation housing, which must be filled with a thick thermal interface material layer (e.g., a thermal interface material layer usually about 1 millimeter thick). The thermal interface material layer eliminates the large gap between the chip and the housing wall of the heat dissipation housing, reduces the thermal resistance caused by air, improves heat transfer, and accelerates heat dissipation from the chip.

[0005] Although a thick thermal interface material layer filled between the chip and the heat dissipation housing can eliminate the gap and reduce the thermal resistance caused by the air, the thick thermal interface material layer itself has a large thermal resistance, so the effect of improving heat transfer is insufficient, and therefore the heat dissipation effect of the electronic device is still insufficient. Summary of the Invention

[0006] This application provides an electronic device to overcome the problems of the related art. The technical solutions are as follows:

[0007] According to one embodiment, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a thermally conductive member, and an elastic member. The circuit board, chip, thermally conductive member, and elastic member are all located within a chamber formed by the heat dissipation housing. The chip is located on a surface of the circuit board. The thermally conductive member is located on a surface of the chip away from the circuit board. The elastic member is compressed between the surface of the thermally conductive member away from the chip and an inner surface of a first housing wall of the heat dissipation housing to reduce a gap between the chip and the thermally conductive member. The elastic member has heat transfer properties. The first housing wall is a housing wall of the heat dissipation housing located opposite the chip.

[0008] In one example, the elastic member is compressed between the thermal conduction member and the first housing wall, so that the gap between the chip and the thermal conduction member can be largely eliminated, and the chip and the thermal conduction member can be fitted more tightly to each other. The closer the contact between the chip and the thermal conduction member, the faster the heat transfer between the chip and the thermal conduction member. Therefore, the thermal conduction member can quickly absorb the heat of the chip, and transfer the absorbed heat to the heat dissipation housing using the elastic member with heat transfer properties, thereby further improving the heat dissipation effect of the electronic device.

[0009] In one possible implementation, the electronic device further includes a thermal interface material layer, which fills the gap between the chip and the thermally conductive member.

[0010] In one example, the elastic member is compressed between the thermal conduction member and the first housing wall, thereby eliminating most of the gap between the chip and the thermal conduction member and reducing the thickness of the thermal interface material layer filled between the chip and the thermal conduction member. Reducing the thickness of the thermal interface material layer also reduces the thermal resistance of the thermal interface material layer. Reducing the thermal resistance of the thermal interface material layer speeds up heat transfer from the chip to the thermal interface material layer and the thermal conduction member, allowing the thermal conduction member to quickly absorb heat from the chip and transfer the absorbed heat to the thermal interface material layer, the elastic member with thermal transfer properties, and the heat dissipation housing, thereby further improving the heat dissipation effect of the electronic device.

[0011] In one possible implementation, the elastic member includes a spring and a heat pipe. The spring is compressed between the thermally conductive member and the first housing wall to reduce the gap between the chip and the thermally conductive member. The heat pipe is connected between the thermally conductive member and the first housing wall to transfer heat absorbed from the chip by the thermally conductive member to the heat dissipation housing. The heat pipe is elastic. The heat pipe is compressed between a surface of the thermally conductive member away from the chip and an inner surface of the first housing wall of the heat dissipation housing.

[0012] In one example, the elastic force of the spring can largely eliminate the gap between the chip and the thermal conductive member, accelerating heat transfer between the chip and the thermal conductive member. The thermal conductivity of the heat pipe can accelerate heat transfer between the thermal conductive member and the heat dissipation housing 1. It can be seen that heat generated by the chip can be rapidly transferred to the thermal conductive member, and the heat absorbed by the thermal conductive member can be rapidly transferred to the heat dissipation housing using the heat pipe, and then dissipated to the outside using the heat dissipation housing, thereby improving the heat dissipation effect of the chip.

[0013] In one possible implementation, the heat pipe includes a first pipe section, a second pipe section, and a third pipe section. The first pipe section is attached to a surface of the heat conducting member away from the chip. The third pipe section is attached to an inner surface of the first housing wall. The second pipe section is diagonally connected between the first pipe section and the third pipe section.

[0014] In one example, since the second pipe section is inclined relative to the first and third pipe sections, and the heat pipe is made of metal and has ductility, the connection between the first and second pipe sections can be made elastically deformable, and the connection between the second and third pipe sections can be made elastically deformable, realizing the elasticity of the heat pipe without interfering with the expansion and contraction action of the spring.

[0015] In one possible implementation, the resilient member is a folded thermally conductive sheet that is compressed and disposed between the surface of the thermally conductive member away from the chip and the inner surface of the first housing wall, the resilient member providing resilience through its folding properties and transferring heat through its thermally conductive properties.

[0016] In one example, the elastic member is a folded sheet, and the folded structure has elasticity to be freely stretched and contracted. Since the elastic member is a thermally conductive sheet and has heat transfer properties, the elastic member can be compressed between the thermally conductive member and the first housing wall, and can transfer heat between the thermally conductive member and the first housing wall.

[0017] In one possible implementation, the circuit board is clamped to the housing wall of the heat dissipating housing.

[0018] In one example, the circuit board is clamped and fixed in the chamber, and can provide support against the compressive elastic force of the elastic member. The circuit board may be clamped and fixed to any housing wall of the heat dissipation housing, for example, to the first housing wall or the second housing wall.

[0019] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, a thermally conductive member, and an elastic member. The circuit board, chip, thermal interface material layer, thermally conductive member, and elastic member are all located within a chamber formed by the heat dissipation housing. The chip is located on a surface of the circuit board. The thermally conductive member is located on a surface of the chip away from the circuit board. The elastic member is compressed between a surface of the thermally conductive member away from the chip and an inner surface of a first housing wall of the heat dissipation housing to reduce a gap between the chip and the thermally conductive member. The gap is filled with a thermal interface material layer. The elastic member has heat transfer properties. The first housing wall is a housing wall of the heat dissipation housing located opposite the chip.

[0020] In one example, the elastic member is compressed between the thermal conduction member and the first housing wall, thereby eliminating most of the gap between the chip and the thermal conduction member and reducing the thickness of the thermal interface material layer filled between the chip and the thermal conduction member. Reducing the thickness of the thermal interface material layer also reduces the thermal resistance of the thermal interface material layer. Reducing the thermal resistance of the thermal interface material layer speeds up heat transfer from the chip to the thermal interface material layer and the thermal conduction member, allowing the thermal conduction member to quickly absorb heat from the chip and transfer the absorbed heat to the thermal interface material layer, the elastic member with thermal transfer properties, and the heat dissipation housing, thereby further improving the heat dissipation effect of the electronic device.

[0021] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, an elastic member, and a heat dissipation device. Both the circuit board and the chip are located in a chamber formed by the heat dissipation housing. The chip is located on a surface of the circuit board. A first housing wall of the heat dissipation housing has an opening corresponding to the chip. The first housing wall is a housing wall of the heat dissipation housing facing the chip. The heat dissipation device includes a heat dissipation base and a mounting plate. The mounting plate is located on an outer surface of a side wall of the heat dissipation base. The heat dissipation base fits into the opening and is removably disposed in the opening, and the heat dissipation base is located on a surface of the chip remote from the circuit board. The mounting plate is located on the outer surface of the first housing wall. The elastic member is located on a surface of the mounting plate remote from the first housing wall. Both the elastic member and the mounting plate are fastened to the first housing wall using fasteners. The elastic member is compressed between the fastener and the mounting plate to reduce a gap between the chip and the heat dissipation base.

[0022] In one example, since the elastic member is compressed between the upper part of the fastener and the mounting plate, the gap between the chip and the heat dissipation base can be largely eliminated, and the chip and the heat dissipation base can be fitted more snugly to each other. When the chip and the heat dissipation base are fitted more snugly to each other, the heat transfer between the chip and the heat dissipation base is correspondingly faster, so that the heat dissipation base can quickly absorb and dissipate the heat of the chip, and further improve the heat dissipation effect of the electronic device.

[0023] Furthermore, regarding the path for dissipating heat from the chip, since the bottom of the mounting plate is in close contact with the outer surface of the first housing wall, the heat dissipation device and the heat dissipation housing are thermally connected, so that the heat absorbed from the chip by the heat dissipation base is also transferred to the heat dissipation housing, allowing the heat from the chip to be dissipated by the heat dissipation housing. It can be seen that a portion of the heat generated by the chip is dissipated by the heat dissipation device, and the other portion of the heat is transferred by the heat dissipation device to the heat dissipation housing and dissipated by the heat dissipation housing.

[0024] In one possible implementation, the electronic device further includes a thermal interface material layer that fills the gap between the chip and the heat dissipation base, and the elastic member can also reduce the thickness of the thermal interface material layer that fills the gap.

[0025] In one example, a thermal interface material layer is filled between the chip and the heat dissipation base of an electronic device, but a compressed elastic member disposed on the outer surface of the mounting plate applies a compressive force to the heat dissipation base, thereby eliminating most of the gap between the chip and the heat dissipation base. In this case, only a thin layer of thermal interface material is required to fill the gap. For example, the thickness of the filled thermal interface material layer may be only 0.05 to 0.07 millimeters, or even less.

[0026] Furthermore, the thin thermal interface material layer filled between the chip and the heat dissipation base has compressive deformation properties, and the elastic member applies a pressing force to the heat dissipation base, which further compresses the thickness of the thermal interface material layer, thereby making the thermal interface material layer even thinner. For example, a thermal interface material layer made of silica gel and having a thickness of 0.07 millimeters is selected and filled between the chip and the heat dissipation base. Under the pressing action of the elastic member, the thermal interface material layer is compressed again by a thickness of 0.02 millimeters. In this case, the final thickness of the thermal interface material layer filled between the chip and the heat dissipation base is 0.05 millimeters.

[0027] It can be seen that the compressed elastic member can eliminate most of the gap between the chip and the heat dissipation base, significantly reducing the thickness of the thermal interface material layer filled between the chip and the heat dissipation base. Reducing the thickness of the thermal interface material layer also reduces the thermal resistance of the thermal interface material layer. Reducing the thermal resistance of the thermal interface material layer improves the thermal conductivity of the thermal interface material layer, further improving the heat dissipation effect of the electronic device.

[0028] In one possible implementation, a vapor chamber is located on a surface of the heat dissipation base close to the chip.

[0029] In one example, the vapor chamber can also speed up heat transfer between the chip and the heat dissipation device, thereby improving the effectiveness of dissipating heat from the chip.

[0030] In one possible implementation, the heat dissipation device further includes heat dissipation fins, which are located on a surface of the heat dissipation base remote from the chip.

[0031] In one example, the heat dissipation fins can increase the overall heat dissipation area of ​​the heat dissipation base, accelerating the heat dissipation of the chip.

[0032] In one possible implementation, the mounting plate is located at the base of the heat dissipation fins adjacent to the sidewall of the heat dissipation base.

[0033] In one example, in a solution in which the heat dissipation fins are attached to the outer surface of the top of the heat dissipation base, a mounting plate on the outer surface of the side wall of the heat dissipation base may be fastened to the base of the heat dissipation fins. Of course, the mounting plate may alternatively be located on the outer surface of the side wall of the heat dissipation base, closer to the top of the heat dissipation base. This embodiment does not limit the specific mounting position of the mounting plate, but it is assumed that the bottom of the heat dissipation base can be located in the opening and the mounting plate can be attached to the outer surface of the first housing wall.

[0034] In one possible implementation, the end of the mounting plate remote from the side wall of the heat dissipation base contacts the housing heat dissipation fins of the heat dissipation housing.

[0035] In one example, the bottom of the mounting plate is in contact with the first housing wall, and the end of the mounting plate is in contact with the housing heat dissipation fins, thereby increasing the contact area between the mounting plate and the heat dissipation housing, accelerating heat transfer between the heat dissipation device and the heat dissipation housing, and improving the effectiveness of chip heat dissipation.

[0036] In one possible implementation, an encapsulant is disposed between the sidewall of the heat dissipation base and the inner wall of the opening.

[0037] In one example, when the heat dissipation base is attached to the opening of the heat dissipation housing, a sealant is positioned between the side wall of the heat dissipation base and the inner wall of the opening, thereby preventing dust, water, etc. from entering the chamber through the gap between the outer wall of the heat dissipation base and the inner wall of the opening.

[0038] In one possible implementation, the circuit board is clamped to the housing wall of the heat dissipating housing.

[0039] In one example, the circuit board is clamped and fixed in the chamber, and can provide support against the compressive elastic force of the elastic member. The circuit board may be clamped and fixed to any housing wall of the heat dissipation housing, for example, to the first housing wall or the second housing wall.

[0040] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, an elastic member, and a heat dissipation device. The circuit board, chip, and thermal interface material layer are all located within a chamber formed by the heat dissipation housing. The chip is located on a surface of the circuit board. A first housing wall of the heat dissipation housing has an opening at a position corresponding to the thermal interface material layer. The first housing wall is a housing wall of the heat dissipation housing located opposite the chip. The heat dissipation device includes a heat dissipation base and a mounting plate. The mounting plate is located on an outer surface of a side wall of the heat dissipation base. The heat dissipation base fits into the opening and is removably disposed in the opening, with the heat dissipation base located on a surface of the chip remote from the circuit board. The mounting plate is located on the outer surface of the first housing wall. The elastic member is located on a surface of the mounting plate remote from the first housing wall. Both the elastic member and the mounting plate are fastened to the first housing wall using fasteners. The resilient member is compressed between the fastener and the mounting plate to reduce the gap between the chip and the heat dissipation base and reduce the thickness of the thermal interface material layer that fills the gap.

[0041] In one example, the compressed elastic member can eliminate most of the gap between the chip and the heat dissipation base, significantly reducing the thickness of the thermal interface material layer filled between the chip and the heat dissipation base. As the thickness of the thermal interface material layer is reduced, the thermal resistance of the thermal interface material layer is also reduced. As the thermal resistance of the thermal interface material layer is reduced, the thermal conductivity of the thermal interface material layer is improved, further improving the heat dissipation effect of the electronic device.

[0042] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, and an elastic member. The circuit board, chip, and elastic member are all located within a chamber formed by the heat dissipation housing. The chip is located on a surface of the circuit board. The elastic member is compressed between the circuit board and a second housing wall of the heat dissipation housing to reduce a gap between the chip and a first housing wall of the heat dissipation housing. The first housing wall is a housing wall of the heat dissipation housing located opposite the chip. The second housing wall is located opposite the first housing wall.

[0043] In one example, the elastic force applied to the circuit board by the elastic member can reduce the gap between the chip and the first housing wall, allowing the chip and the first housing wall to fit more snugly against each other. When the chip and the first housing wall fit more snugly against each other, the heat transfer between the chip and the first housing wall is correspondingly faster, so that the heat dissipation housing can quickly absorb the heat of the chip 3 and dissipate the heat of the chip 3, thereby further improving the heat dissipation effect of the electronic device.

[0044] In one possible implementation, the electronic device further includes a thermal interface material layer that fills the gap between the chip and the first housing wall, and the elastic member can also reduce the thickness of the thermal interface material layer that fills the gap.

[0045] In one example, a thermal interface material layer is filled between the chip and the first housing wall of an electronic device, but a compressed elastic member disposed on the circuit board and the second housing wall applies an elastic force to the circuit board toward the chip, thereby eliminating most of the gap between the chip and the first housing wall. In this case, only a thin layer of thermal interface material is required to fill the gap. For example, the thickness of the filled thermal interface material layer may be only 0.05 to 0.07 millimeters, or even smaller.

[0046] It can be seen that the compressed elastic member mounted between the circuit board and the second housing wall can eliminate most of the gap between the chip and the first housing wall, significantly reducing the thickness of the thermal interface material layer between the chip and the first housing wall. Reducing the thickness of the thermal interface material layer also reduces the thermal resistance of the thermal interface material layer. Reducing the thermal resistance of the thermal interface material layer improves the thermal conductivity of the thermal interface material layer, further improving the heat dissipation effect of the electronic device.

[0047] In one possible implementation, the circuit board includes a first sub-board and a second sub-board. The first sub-board and the second sub-board are electrically connected. The chip is located on a surface of the first sub-board. The elastic member is compressed between the first sub-board and the second housing wall. The second sub-board is clamped to the housing wall of the heat dissipation housing. An interface component of the electronic device is located on a surface of the second sub-board.

[0048] In one example, due to the elastic force applied to the first sub-board by the elastic member, the gap between the chip and the first housing wall is largely eliminated, thereby accelerating heat transfer between the chip and the first housing wall. Even when a thermal interface material layer is filled between the chip and the first housing wall, the thickness of the filled thermal interface material layer is small, for example, in the range of 0.05 mm to 0.07 mm, and the thermal resistance of the thermal interface material layer is small. Considering this, heat transfer between the chip and the first housing wall is further accelerated, thereby improving the effectiveness of dissipating heat from the chip.

[0049] Since the interface component is located on the surface of the second sub-board and does not need to vibrate with the elastic member, there is no need to ensure a gap between the interface component and the mounting port through which the interface component is attached, thus ensuring sealing performance between the interface component and the mounting port and achieving dustproof and waterproof effects.

[0050] According to another aspect, an electronic device is provided. The electronic device includes a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, and an elastic member. The circuit board, chip, thermal interface material layer, and elastic member are all located within a chamber formed by the heat dissipation housing. The chip is located on a surface of the circuit board. The elastic member is compressed between the circuit board and a second housing wall of the heat dissipation housing to reduce a gap between the chip and a first housing wall of the heat dissipation housing. The gap is filled with a thermal interface material layer. The first housing wall is a housing wall of the heat dissipation housing located opposite the chip. The second housing wall is located opposite the first housing wall.

[0051] It can be seen that the compressed elastic member mounted between the circuit board and the second housing wall can eliminate most of the gap between the chip and the first housing wall, significantly reducing the thickness of the thermal interface material layer between the chip and the first housing wall. Reducing the thickness of the thermal interface material layer also reduces the thermal resistance of the thermal interface material layer. Reducing the thermal resistance of the thermal interface material layer improves the thermal conductivity of the thermal interface material layer, further improving the heat dissipation effect of the electronic device. [Brief explanation of the drawings]

[0052] [Figure 1] 1 is a schematic diagram of a structure in which an elastic member is located inside a heat dissipation housing according to the present application;

[0053] [Figure 2] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0054] [Figure 3] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0055] [Figure 4] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0056] [Figure 5] 1 is a schematic diagram of the structure of a heat pipe for an electronic device according to the present application;

[0057] [Figure 6] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0058] [Figure 7] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0059] [Figure 8] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0060] [Figure 9] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0061] [Figure 10] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0062] [Figure 11] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0063] [Figure 12] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0064] [Figure 13] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0065] [Figure 14] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0066] [Figure 15] 1 is a schematic diagram of the structure of an electronic device according to the present application;

[0067] [Reference Number] 1. heat dissipation housing; 101. chamber; 11. first housing wall; 12. opening; 13. second housing wall; 14. top cover; 15. bottom; 16. housing heat dissipation fins; 2. circuit board; 21. first sub-board; 22. second sub-board; 3. chip; 4. thermal interface material layer; 5. thermal conduction member; 6. elastic member; 61. spring; 62. heat pipe; 621. first pipe section; 622. second pipe section; 623. third pipe section; 7. heat dissipation device; 71. heat dissipation base; 72. mounting plate; 73. vapor chamber; 74. heat dissipation fins; 8. fastener; 9. encapsulant; 10. interface component. DETAILED DESCRIPTION OF THE INVENTION

[0068] An embodiment of the present application provides an electronic device. The electronic device may be a device in the computer field, a device in the vehicle field, or the like. This embodiment does not limit the specific field to which the electronic device relates. The electronic device may be applied to any field in which heat needs to be dissipated from a chip and further needs to be provided with a dustproof and waterproof heat-dissipating housing. For example, the electronic device may be an on-vehicle module used outdoors.

[0069] In this embodiment, the dustproof and waterproof level of the heat dissipation housing of the electronic device is IP54 or higher. From the dustproof perspective, the heat dissipation housing can completely prevent foreign objects from entering the electronic device. Although it does not completely prevent dust from entering, it cannot prevent a sufficient amount of dust from entering to impair the normal operation of the electronic device. From the waterproof perspective, the heat dissipation housing can prevent water splashing from any direction from entering the electronic device and causing damage.

[0070] 1 , the heat dissipation housing 1 of the electronic device includes multiple housing walls, which may be enclosed to form a chamber 101. For example, the heat dissipation housing 1 may be a hexahedral box and include six housing walls, which may be enclosed to form the chamber 101. Components of the electronic device may be located inside the heat dissipation housing 1. The heat dissipation housing 1 has a dustproof and waterproof level of IP54 or higher, and can fulfill roles such as heat dissipation, waterproofing, and dustproofing of the components inside the heat dissipation housing 1. Therefore, the heat dissipation housing 1 can effectively prevent dust and water from entering the chamber 101 and affecting the normal operation of the components of the electronic device.

[0071] Still referring to Figure 1, the heat dissipating housing 1 may include a top cover 14 and a bottom 15. The top cover 14 covers the bottom 15 to form the heat dissipating housing 1 having a chamber 101.

[0072] 1, the top cover 14 of the heat dissipating housing 1 may be a bottomless housing-like structure, and the bottom 15 may be a coverless housing-like structure. The top cover 14 and the bottom 15 are matched in size. For example, the length and width of the top cover 14 match the length and width of the bottom 15, respectively, so that the top cover 14 covers the bottom 15 to form a housing with a chamber.

[0073] In another example, the top cover 14 of the heat dissipating housing 1 may alternatively be a plate-like structure, and the bottom 15 may be a coverless housing-like structure, with the top cover 14 covering the bottom 15 to form the heat dissipating housing 1. Alternatively, the top cover 14 of the heat dissipating housing 1 may be a bottomless housing-like structure with no bottom, and the bottom 15 may be a plate-like structure, with the top cover 14 covering the bottom 15 to form the heat dissipating housing 1. This embodiment does not limit the specific formation manner of the heat dissipating housing 1, but it is assumed that the heat dissipating housing 1 has a chamber configured to accommodate components of an electronic device and has excellent sealing performance.

[0074] Since the heat dissipating housing 1 also has a heat dissipating function, the heat dissipating housing 1 may be die-cast from a metal (for example, metallic aluminum, an aluminum alloy, metallic copper, or a copper alloy).

[0075] To increase the overall heat dissipation area of ​​the heat dissipation housing 1, as shown in FIG. 1 , housing heat dissipation fins 16 may be arranged on the outer surface of the heat dissipation housing 1. For example, the housing heat dissipation fins 16 are arranged on the outer surface of the top cover 14. In another example, the housing heat dissipation fins 16 are arranged on both the outer surface of the top cover 14 and the outer surface of the bottom 15. This embodiment is not limited thereto. Those skilled in the art will flexibly select the specific positions of the housing heat dissipation fins 16 on the outer surface of the heat dissipation housing 1 based on actual circumstances.

[0076] In one example, the heat dissipating housing 1 is fabricated by die-casting. Correspondingly, the housing heat dissipating fins 16 may also be fabricated by die-casting. Alternatively, the housing heat dissipating fins 16 may be fabricated by welding. Fabricating the heat dissipating fins by welding results in the housing heat dissipating fins 16 being densely distributed on the outer surface of the heat dissipating housing 1. The denser the housing heat dissipating fins 16 are, the larger the overall heat dissipation area of ​​the heat dissipating housing 1 is, and the better the heat dissipation effect of the chip 3. Those skilled in the art may flexibly select the specific fabrication method of the housing heat dissipating fins 16 on the outer surface of the heat dissipating housing 1 based on actual circumstances. This embodiment is not limited thereto.

[0077] In order to facilitate the installation of components of an electronic device in the heat dissipating housing 1, the top cover 14 and the bottom 15 of the heat dissipating housing 1 are correspondingly detachably attached. For example, the housing wall of the top cover 14 and the housing wall of the bottom 15 are assembled using screws or the like. In this embodiment, the installation method of the top cover 14 and the bottom 15 is not limited. Those skilled in the art may flexibly select the installation method based on actual circumstances.

[0078] The electronic device in this embodiment further includes a circuit board 2 and a chip 3. The circuit board 2 is located in the heat dissipation housing 1. For example, the circuit board 2 may be attached to the inner surface of the housing wall of the top cover 14, or the circuit board 2 may be attached to the inner surface of the housing wall of the bottom part 15. The chip 3 and other components of the electronic device are then attached to the circuit board 2. Finally, the top cover 14 is attached to the bottom part 15.

[0079] For ease of explanation, the housing wall facing the chip 3 may be referred to as the first housing wall 11. In other words, the housing wall facing the surface of the chip 3 away from the circuit board 2 is referred to as the first housing wall 11. The housing wall facing the circuit board 2 is referred to as the second housing wall 13. In other words, the housing wall facing the surface of the circuit board 2 away from the chip 3 is referred to as the second housing wall 13. The first housing wall 11 and the second housing wall 13 are positioned opposite each other. As shown in FIG. 1 , the first housing wall 11 may be the top wall of the top cover 14, and the second housing wall 13 may be the bottom wall of the bottom 15.

[0080] In one example, the chip 3 may be electrically connected to other components of the electronic device using a flat cable on the circuit board 2. Correspondingly, the chip 3 is located on the circuit board 2. For example, the chip 3 may be soldered with tin on the surface of the circuit board 2. For example, the top or bottom surface of the circuit board 2 may have a designated chip position, and the chip 3 may be soldered with tin at this designated chip position. When the chip 3 operates, heat is generated. The heat dissipation housing 1 can dissipate the heat of the chip 3. Correspondingly, the heat of the chip 3 may be transferred to the housing wall of the heat dissipation housing 1 and dissipated through the housing wall of the heat dissipation housing 1. Specific paths for dissipating heat will be described in detail below in the description of the structure of the electronic device.

[0081] In some application scenarios, an electronic device may include multiple chips 3. The chip 3 in this embodiment may be any chip on the surface of the circuit board 2, or may be the main chip on the surface of the circuit board 2. The main chip is the chip whose power consumption accounts for 50% of the total power consumption.

[0082] The specific structures of the electronic devices provided in this embodiment are described in detail below.

[0083] See Figures 2-6 for a schematic diagram of the structure of the electronic device.

[0084] FIG. 2 is a schematic diagram of the exploded assembly structure of an electronic device. The electronic device not only includes a heat dissipation housing 1, a circuit board 2, and a chip 3, but also includes a thermally conductive member 5 and an elastic member 6. FIG. 3 is a schematic diagram of the assembled electronic device structure. The thermally conductive member 5 is located on the surface of the chip 3 away from the circuit board 2. The elastic member 6 is compressed between the thermally conductive member 5 and the first housing wall 11 of the heat dissipation housing 1. The elastic member 6 not only has compressive elasticity but also heat transfer properties. In this way, heat generated in the chip 3 is transferred to the thermally conductive member 5, then to the elastic member 6 by the thermally conductive member 5, and then to the first housing wall 11 by the elastic member 6, so that the heat can be dissipated to the outside by the first housing wall 11.

[0085] 2, the circuit board 2 may be fastened in the chamber 101 of the heat dissipation housing 1. For example, as shown in FIG. 2, the circuit board 2 is fastened to the bottom 15 of the heat dissipation housing 1 using screws. Alternatively, the circuit board 2 may be fastened to the top cover 14 of the heat dissipation housing 1 using screws. In this embodiment, the mounting position and mounting method of the circuit board 2 in the chamber 101 of the heat dissipation housing 1 are not limited, as long as the circuit board 2 can be firmly fastened in the chamber 101.

[0086] The circuit board 2 is clamped and fixed in the chamber 101 and can provide a supporting force against the compressive elastic force of the elastic member 6 .

[0087] As shown in FIG. 3 , the thermal conduction member 5 is located on the surface of the chip 3 away from the circuit board 2. The thermal conduction member 5 is configured to absorb heat from the chip 3 and transfer the absorbed heat to the heat dissipation housing 1. The shape and size of the thermal conduction member 5 match the chip 3. For example, the thermal conduction member 5 is a plate-shaped structure, and the size of the thermal conduction member 5 is equal to the size of the chip 3 or the area of ​​the thermal conduction member 5 is slightly larger than the area of ​​the chip 3. The thermal conduction member 5 covers the surface of the chip 3 and absorbs heat at each position on the chip 3. The thermal conduction member 5 may be a copper plate, a vapor chamber, or the like. In this embodiment, the material of the thermal conduction member is not limited, but it is assumed that the thermal conduction member 5 can quickly absorb heat from the chip 3.

[0088] In order to reduce the gap between the chip 3 and the heat conducting member 5, increase the contact area between the heat conducting member 5 and the chip 3, and accelerate the heat absorption of the chip 3 by the heat conducting member 5, the elastic member 6 is correspondingly compressed between the heat conducting member 5 and the first housing wall 11 of the heat dissipation housing 1, as shown in FIG. 3 . The first housing wall 11 is a housing wall of the heat dissipation housing 1 located opposite to the heat conducting member 5. Because the elastic member 6 is compressed between the heat conducting member 5 and the first housing wall 11, the chip 3 and the heat conducting member 5 are compressed together, thereby reducing or even eliminating the gap between the chip 3 and the heat conducting member 5. The closer the chip 3 and the heat conducting member 5 fit together, the better the heat transfer effect between the chip 3 and the heat conducting member 5.

[0089] The elastic member 6 has not only elasticity but also heat transfer properties, and is compressed between the heat conduction member 5 and the first housing wall 11. This reduces the gap between the chip 3 and the heat conduction member 5, allowing the heat absorbed from the chip 3 by the heat conduction member 5 to be transferred to the heat dissipation housing 1, and the heat can be dissipated to the outside by the heat dissipation housing 1. The specific structure of the elastic member 6 will be described in detail below.

[0090] It can be seen that the elastic member 6 compressed between the first housing wall 11 and the heat conducting member 5 presses the chip 3 against the surface of the heat conducting member 5, making the chip 3 and the heat conducting member 5 fit more tightly against each other, which can speed up the heat transfer between the chip 3, the heat conducting member 5 and the heat dissipation housing 1 and improve the heat dissipation effect of the electronic device.

[0091] To further reduce the gap between the chip 3 and the thermal conductive member 5, a thermal interface material layer 4 is correspondingly filled between the chip 3 and the thermal conductive member 5, as shown in FIG. 4 . The thermal interface material layer 4 is a flexible material with a certain thermal conductivity. For example, the thermal interface material layer 4 may be silica gel, silicone grease, gel, or the like. In this embodiment, the specific material of the thermal interface material layer 4 is not limited, but it is assumed that the thermal interface material layer 4 can reduce the gap and achieve a thermal conduction effect.

[0092] A thermal interface material layer 4 is filled between the chip 3 and the thermally conductive member 5 of the electronic device, but the elastic member 6 compressed between the thermally conductive member 5 and the first housing wall 11 applies a pressing force to the thermally conductive member 5, thereby eliminating most of the gap between the chip 3 and the thermally conductive member 5. In this case, only a thin thermal interface material layer 4 needs to fill the gap. For example, the thickness of the thermal interface material layer 4 to be filled may be only 0.05 to 0.07 millimeters, or even smaller.

[0093] Furthermore, because the thin thermal interface material layer 4 filled between the chip 3 and the thermal conductive member 5 has compressive deformation properties and the elastic member 6 applies a pressing force to the thermal conductive member 5, the thickness of the thermal interface material layer 4 can be further reduced, thereby making the thermal interface material layer 4 even thinner. For example, a thermal interface material layer 4 made of silica gel and having a thickness of 0.07 mm is selected and filled between the chip 3 and the thermal conductive member 5. The thermal interface material layer 4 is compressed again by a thickness of 0.02 mm under the pressing action of the elastic member 6. In this case, the thickness of the thermal interface material layer 4 finally filled between the chip 3 and the thermal conductive member 5 is 0.05 mm.

[0094] It can be seen that the elastic member 6 compressed between the thermal conduction member 5 and the first housing wall 11 can eliminate most of the gap between the chip 3 and the thermal conduction member 5, and can significantly reduce the thickness of the thermal interface material layer 4 filled between the chip 3 and the thermal conduction member 5. As the thickness of the thermal interface material layer 4 is reduced, the thermal resistance of the thermal interface material layer 4 is also reduced. As the thermal resistance of the thermal interface material layer 4 is reduced, the thermal conductivity of the thermal interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0095] For example, if the elastic member 6 is not compressed between the thermal conduction member 5 and the first housing wall 11, a thermal interface material layer 4 having a thickness of 1 to 1.5 millimeters needs to be disposed between the chip 3 and the thermal conduction member 5. If the elastic member 6 is compressed between the thermal conduction member 5 and the first housing wall 11, a thermal interface material layer 4 having a thickness of only 0.05 to 0.07 millimeters needs to be disposed between the chip 3 and the thermal conduction member 5. It can be seen that the thickness of the thermal interface material layer 4 in the former case is significantly greater than the thickness of the thermal interface material layer 4 in the latter case. In this case, the thermal resistance of the thermal interface material layer 4 in the former case is also greater than the thermal resistance of the thermal interface material layer 4 in the latter case. Furthermore, the thermal transfer performance of the thermal interface material layer 4 in the latter case is greater than the thermal transfer performance of the thermal interface material layer 4 in the former case.

[0096] As mentioned above, the heat dissipation path of the electronic device is as follows: heat is generated in the chip 3. The thermally conductive member 5 located on the surface of the chip 3 absorbs the heat and transfers it to the elastic member 6. The elastic member 6 then transfers the heat to the heat dissipation housing 1, and finally the heat dissipation housing 1 dissipates the heat to the outside.

[0097] It is understood that the elastic member 6 needs to have a heat transfer function as well as a function of pressing the heat conduction member 5 against the surface of the chip 3. In the following, a plurality of elastic members 6 having heat transfer properties will be described.

[0098] A possible structure of the elastic member 6 may be as follows. As shown in FIG. 2, the elastic member 6 includes a spring 61 and a heat pipe 62. As shown in FIG. 4, the spring 61 is compressed between the thermally conductive member 5 and the first housing wall 11 to reduce the gap between the chip 3 and the thermally conductive member 5. The heat pipe 62 is connected between the thermally conductive member 5 and the first housing wall 11 to transfer the heat absorbed from the chip 3 by the thermally conductive member 5 to the heat dissipation housing 1. Furthermore, the heat pipe 62 has elasticity and is compressed between the thermally conductive member 5 and the first housing wall 11.

[0099] The heat pipe 62 is a copper pipe filled with a coolant (sometimes called a heat dissipation liquid).

[0100] The heat pipe 62 further has elasticity, and is also compressed between the thermal conduction member 5 and the first housing wall 11, so that the heat pipe 62 can perform expansion and contraction movements together with the spring 61. In this way, when the spring 61 applies an elastic force toward the thermal conduction member 5 toward the chip 3, the heat pipe 62 does not apply an acting force in the opposite direction to the thermal conduction member 5, so that the reduction of the gap between the thermal conduction member 5 and the chip 3 is not affected.

[0101] 5 , the heat pipe 62 may include three sections, namely, a first pipe section 621, a second pipe section 622, and a third pipe section 623. The first pipe section 621 is attached to a surface of the heat conduction member 5 that is remote from the chip 3. The third pipe section 623 is attached to an inner surface of the first housing wall 11. The second pipe section 622 is connected obliquely between the first pipe section 621 and the third pipe section 623.

[0102] For example, the outer surface of the pipe wall of the first pipe section 621 may be welded to the surface of the heat conduction member 5 that is remote from the chip 3, and the outer surface of the pipe wall of the third pipe section 623 may be welded to the inner surface of the first housing wall 11 of the heat dissipation housing 1. The second pipe section 622 is disposed obliquely between the heat conduction member 5 and the first housing wall 11 to achieve the elasticity of the heat pipe 62 without interfering with the expansion and contraction action of the spring 61.

[0103] The second pipe section 622 is diagonally connected between the first pipe section 621 and the third pipe section 623. For example, as shown in FIG. 5 , the second pipe section 622 is inclined to the right relative to the first pipe section 621. In another example, the second pipe section 622 may also be inclined to the left relative to the first pipe section 621. This embodiment does not limit whether the second pipe section 622 is inclined to the right or left relative to the first pipe section 621. This embodiment does not limit the inclination angle of the second pipe section 622 relative to the first pipe section 621. Those skilled in the art will flexibly select the inclination angle based on actual situations.

[0104] Since the second pipe section 622 is inclined relative to the first pipe section 621 and the third pipe section 623, and the heat pipe 62 is made of metal and is ductile, the connection between the first pipe section 621 and the second pipe section 622 can be made elastically deformable, and the connection between the second pipe section 622 and the third pipe section 623 can be made elastically deformable.

[0105] It can be seen that the elastic member 6 provides elastic resilience using springs 61 and heat transfer properties using heat pipes 62 .

[0106] Another possible structure of the elastic member 6 may be as follows. As shown in Fig. 6, the elastic member 6 is a folded thermally conductive sheet, which may be, for example, a folded metal sheet, a folded copper sheet, or a folded vapor chamber. The elastic member 6 may be compressed between the thermally conductive member 5 and the first housing wall 11, and can transfer heat between the thermally conductive member 5 and the first housing wall 11.

[0107] In one example, there may be multiple elastic members 6, and multiple folded thermally conductive sheets are compressed between the thermally conductive member 5 and the first housing wall 11. The multiple folded thermally conductive sheets may be uniformly compressed between the thermally conductive member 5 and the first housing wall 11. Alternatively, the folded thermally conductive sheets may be arranged densely in positions where the heat is high and sparsely in positions where the heat is low. Those skilled in the art can flexibly select the arrangement method based on actual situations.

[0108] 2 to 5, the elastic member 6 is compressed between the heat conducting member 5 and the first housing wall 11, so that the gap between the chip 3 and the heat conducting member 5 can be largely eliminated, and the chip 3 and the heat conducting member 5 can fit more tightly to each other. When the chip 3 and the heat conducting member 5 fit more tightly to each other, the heat transfer between the chip 3 and the heat conducting member 5 becomes faster accordingly, so that the heat conducting member 5 can quickly absorb the heat of the chip 3 and transfer the absorbed heat to the heat dissipation housing 1 using the elastic member 6 having heat transfer properties, thereby further improving the heat dissipation effect of the electronic device.

[0109] See FIG. 4 for a schematic diagram of another electronic device structure.

[0110] The electronic device not only includes a heat dissipation housing 1, a circuit board 2, and a chip 3, but also includes a thermal interface material layer 4, a thermally conductive member 5, and an elastic member 6. The thermally conductive member 5 is located on a surface of the chip 3 remote from the circuit board 2. The thermal interface material layer 4 is located on a surface of the thermally conductive member 5 remote from the chip 3. The elastic member 6, which has heat transfer properties, is compressed between the thermally conductive member 5 and a first housing wall 11.

[0111] For a description of an electronic device having such a structure, please refer to the description of Figures 4 and 6 above, and the details will not be described one by one again here.

[0112] In the electronic device shown in FIG. 4 , the elastic member 6 is compressed between the thermal conductive member 5 and the first housing wall 11, eliminating most of the gap between the chip 3 and the thermal conductive member 5 and reducing the thickness of the thermal interface material layer 4 filled between the chip 3 and the thermal conductive member 5. Reducing the thickness of the thermal interface material layer 4 also reduces the thermal resistance of the thermal interface material layer 4. The reduced thermal resistance of the thermal interface material layer 4 speeds up heat transfer from the chip 3 to the thermal interface material layer 4 and the thermal conductive member 5. This allows the thermal conductive member 5 to quickly absorb heat from the chip 3 and transfer the absorbed heat sequentially to the thermal interface material layer 4, the elastic member 6 with thermal transfer properties, and the heat dissipation housing 1, further improving the heat dissipation effect of the electronic device.

[0113] See Figures 7-12 for schematic diagrams of alternative electronic device structures.

[0114] FIG. 7 is a schematic diagram of the structure of an electronic device before assembly. The electronic device includes a heat dissipation housing 1, a circuit board 2, and a chip 3, as well as an elastic member 6 and a heat dissipation device 7. The circuit board 2 is located in a chamber 101 formed by the housing wall of the heat dissipation housing 1. For example, as shown in FIG. 7, the circuit board 2 is fastened to the top cover 14 of the heat dissipation housing 1 using screws. Alternatively, the circuit board 2 may be fastened to the bottom 15 of the heat dissipation housing 1 using screws. This embodiment does not limit the location or manner of the circuit board 2 in the chamber 101 of the heat dissipation housing 1, as long as the circuit board 2 can be securely fastened within the chamber 101. The chip 3 is located on the surface of the circuit board 2 and may be, for example, soldered to the surface of the circuit board 2 with tin.

[0115] The heat dissipation device 7 is configured to dissipate heat from the chip 3. To accelerate the heat dissipation of the chip 3, the heat dissipation device 7 may be made of a metal with a high thermal conductivity coefficient, for example, copper.

[0116] As shown in FIG. 7 , the heat dissipation device 7 may include a heat dissipation base 71 and a mounting plate 72. The heat dissipation base 71 has a plate-like structure and may have a certain thickness. The mounting plate 72 may be located on a side wall of the heat dissipation base 71, with the bottom of the mounting plate 72 being higher than the bottom of the heat dissipation base 71. The heat dissipation base 71 is configured to contact the chip 3. The mounting plate 72 is configured to realize detachable mounting of the heat dissipation device 7 and the heat dissipation housing 1. The positional relationship and mounting relationship between the heat dissipation device 7 and the heat dissipation housing 1 may be as follows:

[0117] 7, the first housing wall 11 of the heat dissipation housing 1 has an opening 12 at a position corresponding to the chip 3. The size of the opening 12 matches the size of the chip 3. For example, the area of ​​the opening 12 is larger than that of the chip 3. For example, the first housing wall 11 may have an opening 12 at a position corresponding to the chip 3. The opening 12 may be a rectangular window, which allows the heat dissipation base 71 of the heat dissipation device 7 to be fixed to the opening 12.

[0118] The size of the heat dissipation base 71 matches the opening 12. For example, the area of ​​the heat dissipation base 71 is slightly larger than or equal to the area of ​​the opening 12, so that the heat dissipation base 71 can be placed in the opening 12. The heat dissipation base 71 is located on the surface of the chip 3 that is remote from the circuit board 2. The mounting plate 72 is located on the outer surface of the first housing wall 11.

[0119] In this way, the chip 3 is located opposite the opening 12, and the area of ​​the opening 12 is larger than the area of ​​the chip 3. As shown in Figure 8, the bottom of the heat dissipation base 71 may be fixed to the opening 12 and may be in contact with the chip 3. The mounting plate 72 is mounted on the outer surface of the first housing wall 11.

[0120] 8 , in order to reduce the gap between the heat dissipation device 7 and the chip 3, the elastic member 6 is located on a surface of the mounting plate 72 that is away from the first housing wall 11. Both the elastic member 6 and the mounting plate 72 are fastened to the first housing wall 11 using fasteners 8. The elastic member 6 is compressed between the fasteners 8 and the mounting plate 72 to reduce the gap between the chip 3 and the heat dissipation base 71.

[0121] The fastener 8 may be any structure with a transverse plate on top, and the transverse plate on top of the fastener 8 serves to compress the elastic member 6. For example, the fastener 8 may be a screw, and the nut of the screw may be used as the transverse plate on top of the fastener 8.

[0122] The elastic member 6 may be any structure having compressive elasticity, such as a spring.

[0123] In this way, the elastic member 6 is located on the outer surface of the mounting plate 72, and the fastener 8 passes through the elastic member 6, the mounting plate 72, and the first housing wall 11 successively to realize a detachable attachment between the heat dissipation device 7 and the heat dissipation housing 1. The elastic member 6 is compressed between the lateral plate on top of the fastener 8 and the mounting plate 72, for example, the elastic member 6 is compressed between the nut of the screw and the mounting plate 72.

[0124] 8, the elastic member 6 is compressed between the upper part of the fastener 8 and the mounting plate 72, so that the gap between the chip 3 and the heat dissipation base 71 can be largely eliminated, and the chip 3 and the heat dissipation base 71 can fit more snugly against each other. When the chip 3 and the heat dissipation base 71 fit more snugly against each other, the heat transfer between the chip 3 and the heat dissipation base 71 is accordingly faster, so that the heat dissipation base 71 can quickly absorb and dissipate the heat of the chip 3, further improving the heat dissipation effect of the electronic device.

[0125] Furthermore, regarding the path for dissipating heat from the chip 3, as shown in FIG. 8 , the bottom of the mounting plate 72 is in close contact with the outer surface of the first housing wall 11, so that the heat dissipation device 7 and the heat dissipation housing 1 are thermally connected, and thus the heat absorbed from the chip 3 by the heat dissipation base 71 is also transferred to the heat dissipation housing 1, allowing the heat from the chip 3 to be dissipated by the heat dissipation housing 1. It can be seen that in the electronic device shown in FIG. 8 , a portion of the heat generated by the chip 3 is absorbed by the heat dissipation device 7 and dissipated to the outside by the heat dissipation device 7; the other portion of the heat is transferred by the heat dissipation device 7 to the heat dissipation housing 1 and dissipated to the outside by the heat dissipation housing 1. It can be seen that the heat generated by the chip 3 can be dissipated to the outside by the heat dissipation device 7 and the heat dissipation housing 1 together.

[0126] In order to further accelerate the heat transfer between the heat dissipation device 7 and the heat dissipation housing 1, the end of the mounting plate 72 away from the heat dissipation base 71 is correspondingly in contact with the housing heat dissipation fins 16 of the heat dissipation housing 1, as shown in FIG.

[0127] In this way, the bottom of the mounting plate 72 is in contact with the first housing wall 11, and the end of the mounting plate 72 is in contact with the housing heat dissipation fins 16, so the contact area between the mounting plate 72 and the heat dissipation housing 1 is increased, which speeds up heat transfer between the heat dissipation device 7 and the heat dissipation housing 1 and improves the effect of dissipating heat from the chip 3.

[0128] To further reduce the gap between the chip 3 and the heat dissipation base 71, a thermal interface material layer 4 is correspondingly filled between the chip 3 and the heat dissipation base 71, as shown in FIG. 10 . The thermal interface material layer 4 is a flexible material with thermal conductivity. For example, the thermal interface material layer 4 may be silica gel, silicone grease, gel, or the like. This embodiment does not limit the specific material of the thermal interface material layer 4, but it is assumed that the thermal interface material layer 4 can reduce the gap and achieve a thermal conduction effect.

[0129] Although the thermal interface material layer 4 is filled between the chip 3 and the heat dissipation base 71 of the electronic device, the compressed elastic member 6 disposed on the outer surface of the mounting plate 71 applies a pressing force to the heat dissipation base 71, thereby eliminating most of the gap between the chip 3 and the heat dissipation base 71. In this case, only a thin thermal interface material layer 4 needs to fill the gap. For example, the thickness of the thermal interface material layer 4 to be filled may be only 0.05 to 0.07 millimeters, or even smaller.

[0130] Furthermore, because the thin thermal interface material layer 4 filled between the chip 3 and the heat dissipation base 71 has compressive deformation properties and the elastic member 6 applies a pressing force to the heat dissipation base 71, the thickness of the thermal interface material layer 4 can be further reduced, resulting in a thinner thermal interface material layer 4. For example, a thermal interface material layer 4 made of silica gel and having a thickness of 0.07 mm is selected and filled between the chip 3 and the heat dissipation base 71. The thermal interface material layer 4 is compressed again by a thickness of 0.02 mm under the pressing action of the elastic member 6. In this case, the thickness of the thermal interface material layer 4 finally filled between the chip 3 and the heat dissipation base 71 is 0.05 mm.

[0131] It can be seen that the compressed elastic member 6 can eliminate most of the gap between the chip 3 and the heat dissipation base 71, significantly reducing the thickness of the thermal interface material layer 4 filled between the chip 3 and the heat dissipation base 71. As the thickness of the thermal interface material layer 4 is reduced, the thermal resistance of the thermal interface material layer 4 is also reduced. As the thermal resistance of the thermal interface material layer 4 is reduced, the thermal conductivity of the thermal interface material layer 4 is improved, further improving the heat dissipation effect of the electronic device.

[0132] For example, in a solution without an elastic member 6, a thermal interface material layer 4 having a thickness of 1 to 1.5 millimeters must be disposed between the chip 3 and the heat dissipation base 71. In a solution with an elastic member 6 in a compressed state disposed on the outer surface of the mounting plate 72, a thermal interface material layer 4 having a thickness of only 0.05 to 0.07 millimeters must be disposed between the chip 3 and the heat dissipation base 71. It can be seen that the thickness of the thermal interface material layer 4 in the former case is significantly greater than the thickness of the thermal interface material layer 4 in the latter case. In this case, the thermal resistance of the thermal interface material layer 4 in the former case is also greater than the thermal resistance of the thermal interface material layer 4 in the latter case. Furthermore, the thermal transfer performance of the thermal interface material layer 4 in the latter case is greater than the thermal transfer performance of the thermal interface material layer 4 in the former case.

[0133] In the electronic device shown in FIG. 10 , the compressed elastic member 6 is disposed on the outer surface of the mounting plate 72, which eliminates most of the gap between the chip 3 and the heat dissipation base 71 and reduces the thickness of the thermal interface material layer 4 filled between the chip 3 and the heat dissipation base 71. Reducing the thickness of the thermal interface material layer 4 also reduces the thermal resistance of the thermal interface material layer 4. The reduced thermal resistance of the thermal interface material layer 4 speeds up the heat transfer from the chip 3 to the thermal interface material layer 4 and the heat dissipation base 71, allowing the heat dissipation base 71 to quickly absorb the heat from the chip 3. Furthermore, the heat dissipation base 71 transfers the absorbed heat to the heat dissipation housing 1, further improving the heat dissipation effect of the electronic device.

[0134] To further accelerate the heat transfer between the chip 3 and the heat dissipation device 7, a vapor chamber 73 is correspondingly disposed on the surface of the heat dissipation base 71 close to the chip 3, as shown in FIG.

[0135] The vapor chamber 73 matches the chip 3. For example, the shape of the vapor chamber 73 matches the shape of the chip 3, and the area of ​​the vapor chamber 73 matches the area of ​​the chip 3.

[0136] Thus, in one solution, the heat dissipation base 71 passes through the opening 12 and is positioned on the surface of the chip 3. The vapor chamber 73 at the bottom of the heat dissipation base 71 is in contact with the chip 3. The compressed elastic member 6 located on the outer surface of the mounting plate 72 presses the heat dissipation base 71 against the surface of the chip 3 facing the circuit board 2, so that the vapor chamber 73 is in close contact with the chip 3 and can accelerate heat transfer between the chip 3 and the vapor chamber 73.

[0137] In another solution, the heat dissipation base 71 passes through the opening 12 and is positioned on the surface of the chip 3. A vapor chamber 73 at the bottom of the heat dissipation base 71 is in contact with the thermal interface material layer 4, which in turn is in contact with the chip 3. A compressed elastic member 6 positioned on the outer surface of the mounting plate 72 presses the heat dissipation base 71 against the surface of the chip 3 facing the circuit board 2, reducing the gap between the vapor chamber 73 and the chip 3. A thin thermal interface material layer 4 fills the gap. For example, the thickness of the thermal interface material layer 4 is about 0.05 millimeters, which speeds up heat transfer between the chip 3 and the vapor chamber 73.

[0138] 12 , in order to improve the heat dissipation capability of the heat dissipation device 7, the heat dissipation device 7 further includes heat dissipation fins 74. The heat dissipation fins 74 are located on the surface of the heat dissipation base 71 that is far from the chip 3.

[0139] The heat dissipation fins 74 increase the overall heat dissipation area of ​​the heat dissipation base 71, thereby accelerating the heat dissipation of the chip 3.

[0140] 12, the heat dissipating fins 74 may include vertical heat dissipating fins perpendicular to the heat dissipating base 71. To increase the number of heat dissipating fins 74, the heat dissipating fins 74 may further include horizontal heat dissipating fins perpendicular to the vertical heat dissipating fins. Those skilled in the art may flexibly select the arrangement of the heat dissipating fins 74 on the outer surface of the heat dissipating base 71 based on actual circumstances.

[0141] In one example, the heat dissipation fins 74 may be attached in multiple ways, for example, by welding to the outer surface of the heat dissipation base 71. Because the heat dissipation fins 74 are processed by welding, the number of heat dissipation fins 74 increases and the heat dissipation fins 74 are densely packed, which increases the overall heat dissipation area of ​​the heat dissipation device 7 and improves the effect of the heat dissipation device 7 in dissipating heat from the chip 3.

[0142] As shown in Fig. 12 , in the solution in which the heat dissipating fins 74 are mounted on the outer surface of the upper part of the heat dissipating base 71, the mounting plate 72 on the outer surface of the side wall of the heat dissipating base 71 may be fastened to the base of the heat dissipating fins 74. For example, as shown in Fig. 12 , the mounting plate 72 may be located at the base of the heat dissipating fins 74 adjacent to the side wall of the heat dissipating base 71. Of course, as shown in Fig. 11 , the mounting plate 72 may alternatively be located on the outer surface of the side wall of the heat dissipating base 71, close to the heat dissipating base 71. This embodiment does not limit the specific mounting position of the mounting plate 72, but assumes that the bottom of the heat dissipating base 71 can be located in the opening 12 and the mounting plate 72 can be mounted on the outer surface of the first housing wall 11.

[0143] Since the heat dissipation device 7 is detachably attached to the opening 12 of the heat dissipation housing 1, in order to improve the dustproof and waterproof performance of the electronic device, a sealing material 9 is correspondingly arranged between the side wall of the heat dissipation base 71 and the inner wall of the opening 12, as shown in FIG.

[0144] In one example, the seal 9 fits to the heat dissipation base 71. For example, the heat dissipation base 71 is rectangular, and the seal 9 is a rectangular ring that can be sleeved onto the side wall of the heat dissipation base 71. Then, when the heat dissipation base 71 is attached to the opening 12 of the heat dissipation housing 1, the seal 9 is located between the side wall of the heat dissipation base 71 and the inner wall of the opening 12, which prevents dust, water, and the like from entering the chamber 101 through the gap between the outer wall of the heat dissipation base 71 and the inner wall of the opening 12.

[0145] 9, the heat dissipation device 7 passes through the opening 12 and is positioned on the surface of the chip 3. The compressed elastic member 6 positioned on the outer surface of the mounting plate 72 of the heat dissipation device 7 applies an elastic force to the heat dissipation device 7, thereby eliminating most of the gap between the chip 3 and the heat dissipation base 71 and allowing the chip 3 and the heat dissipation base 71 to fit more snugly against each other. When the chip 3 and the heat dissipation base 71 fit more snugly against each other, the heat transfer between the chip 3 and the heat dissipation base 71 is correspondingly faster, so that the heat dissipation base 71 can quickly absorb and dissipate the heat of the chip 3, further improving the heat dissipation effect of the electronic device.

[0146] 10, even when the thermal interface material layer 4 is filled between the chip 3 and the heat dissipation base 71, the thickness of the filled thermal interface material layer 4 is small, for example, only in the range of 0.05 mm to 0.07 mm, and the thermal resistance of the thermal interface material layer 4 is small. Considering this, the thermal conductivity of the thermal interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0147] Furthermore, since the bottom of the mounting plate 71 of the heat dissipation device 7 is in contact with the outer surface of the first housing wall 11, and the end of the mounting plate 71 is in contact with the housing heat dissipation fins 16 on the first housing wall 11, the heat dissipation device 7 and the heat dissipation housing 1 can be thermally connected, so that the heat absorbed from the chip 3 by the heat dissipation device 7 can be transferred to the heat dissipation housing 1 and dissipated by the heat dissipation housing 1. It can be seen that both the heat dissipation device 7 and the heat dissipation housing 1 can dissipate the heat of the chip 3, thereby improving the effect of dissipating the heat of the chip 3.

[0148] In this way, the heat generated by the chip 3 can be quickly transferred to the heat dissipation device 7. A part of the heat absorbed by the heat dissipation device 7 is dissipated by itself, and the other part may be transferred to the heat dissipation housing 1 through the contact between the mounting plate 72 and the first housing wall 11, and is dissipated by the heat dissipation housing 1. It can be seen that both the heat dissipation device 7 and the heat dissipation housing 1 can dissipate the heat of the chip 3, thereby improving the effect of dissipating the heat of the chip 3.

[0149] See FIG. 10 for a schematic diagram of the structure of another electronic device. The electronic device includes not only a heat dissipation housing 1, a circuit board 2, and a chip 3, but also a thermal interface material layer 4, an elastic member 6, and a heat dissipation device 7. The circuit board 2 is clamped and fixed in the chamber 101 of the heat dissipation housing 1. The chip 3 is located on the surface of the circuit board 2. The thermal interface material layer 4 is located on the surface of the chip 3 away from the circuit board 2. An opening 12 is provided in the first housing wall 11 of the heat dissipation housing 1 at a position corresponding to the chip 3. The bottom of the heat dissipation base 71 of the heat dissipation device 7 is inserted into the opening 12, and the heat dissipation base 71 is located on the surface of the thermal interface material layer 4. A mounting plate 72 of the heat dissipation device 7 is mounted on the outer surface of the first housing wall 11. The elastic member 6 is located on the outer surface of the mounting plate 72. Both the elastic member 6 and the mounting plate 72 are clamped and fixed to the first housing wall 11 using fasteners 8. The resilient member 6 is in compression, specifically compressed between the top of the fastener 8 and the mounting plate 72 .

[0150] For an explanation of an electronic device having such a structure, please refer to the explanation of Figures 9 to 12. Here, the details will not be explained again.

[0151] In the electronic device, the heat dissipation device 7 passes through the opening 12 and is positioned on the surface of the chip 3. The outer surface of the mounting plate 72 of the heat dissipation device 7 has an elastic member 6 in a compressed state. The elastic force applied to the heat dissipation device 7 by the elastic member 6 can eliminate most of the gap between the chip 3 and the heat dissipation base 71. A thermal interface material layer 4 is filled between the chip 3 and the heat dissipation base 71. However, the thickness of the filled thermal interface material layer 4 is small, for example, in the range of only 0.05 mm to 0.07 mm, and the thermal resistance of the thermal interface material layer 4 is low. Considering this, the thermal conductivity of the thermal interface material layer 4 is improved, further improving the heat dissipation effect of the electronic device.

[0152] Furthermore, since the bottom of the mounting plate 71 of the heat dissipation device 7 is in contact with the outer surface of the first housing wall 11, and the end of the mounting plate 71 is in contact with the housing heat dissipation fins 16 on the first housing wall 11, the heat dissipation device 7 and the heat dissipation housing 1 can be thermally connected, so that the heat absorbed from the chip 3 by the heat dissipation device 7 can be transferred to the heat dissipation housing 1 and dissipated by the heat dissipation housing 1. It can be seen that both the heat dissipation device 7 and the heat dissipation housing 1 can dissipate the heat of the chip 3, thereby improving the effect of dissipating the heat of the chip 3.

[0153] In this way, the heat generated by the chip 3 can be quickly transferred to the heat dissipation device 7. A part of the heat absorbed by the heat dissipation device 7 is dissipated by itself, and the other part may be transferred to the heat dissipation housing 1 through the contact between the mounting plate 72 and the first housing wall 11, and is dissipated by the heat dissipation housing 1. It can be seen that both the heat dissipation device 7 and the heat dissipation housing 1 can dissipate the heat of the chip 3, thereby improving the effect of dissipating the heat of the chip 3.

[0154] For schematic diagrams of alternative electronic device structures, see Figures 13-15.

[0155] 13 , the electronic device includes a heat dissipation housing 1, a circuit board 2, a chip 3, and an elastic member 6. The circuit board 2, the chip 3, and the elastic member 6 are all located in a chamber 101 formed by the heat dissipation housing 1. The chip 3 is located on the surface of the circuit board 2. The elastic member 6 is compressed between the circuit board 2 and the second housing wall 13 of the heat dissipation housing 1 to reduce the gap between the chip 3 and the first housing wall 11 of the heat dissipation housing 1.

[0156] The first housing wall 11 is a housing wall of the heat dissipating housing 1 that faces the chip 3. The second housing wall 13 is a housing wall of the heat dissipating housing 1 that faces the circuit board 2. Since the chip 3 is located on the surface of the circuit board 2, the second housing wall 13 faces the first housing wall 11.

[0157] The elastic member 6 may be any component having compressive elasticity, for example, a spring.

[0158] 13, both the circuit board 2 and the chip 3 are located in the chamber 101. The chip 3 is located on the surface of the circuit board 2. The chip 3 is located opposite the first housing wall 11. The circuit board 2 is located opposite the second housing wall 13. The elastic member 6 in a compressed state is attached between the surface of the circuit board 2 away from the chip 3 and the inner surface of the second housing wall 13.

[0159] There are several ways to attach the elastic member 6 in the chamber 101. For example, one way may be to weld one end of the elastic member 6 to a surface of the circuit board 2 away from the chip 3 and to weld the other end of the elastic member 6 to the inner surface of the second housing wall 13. In another example, another way may be to fasten the elastic member 6 between the circuit board 2 and the second housing wall 13 using a screw. For example, a screw passes through the elastic member 6, and one end of the screw is fastened to the circuit board 2 and the other end is fastened to the second housing wall 13. Although the specific way to attach the elastic member 6 in the chamber 101 is not limited, it is assumed that the elastic member 6 can be compressed between the circuit board 2 and the second housing wall 13 and positioned there, and that an elastic force toward the chip 3 can be applied to the circuit board 2.

[0160] In this way, the elastic force applied to the circuit board 2 by the elastic member 6 can reduce the gap between the chip 3 and the first housing wall 11, allowing the chip 3 and the first housing wall 11 to fit more tightly against each other. When the chip 3 and the first housing wall 11 fit more tightly against each other, the heat transfer between the chip 3 and the first housing wall 11 becomes faster accordingly, so that the heat dissipation housing 1 can quickly absorb and dissipate the heat of the chip 3, and further improve the heat dissipation effect of the electronic device.

[0161] To further reduce the gap between the chip 3 and the first housing wall 11, a thermal interface material layer 4 is correspondingly filled between the chip 3 and the first housing wall 11, as shown in FIG. 14 . The thermal interface material layer 4 is a flexible material and has thermal conductivity. For example, the thermal interface material layer 4 may be silica gel, silicone grease, gel, or the like. In this embodiment, the specific material of the thermal interface material layer 4 is not limited, but it is assumed that the thermal interface material layer 4 can reduce the gap and achieve a thermal conduction effect.

[0162] A thermal interface material layer 4 is filled between the chip 3 and the first housing wall 11 of the electronic device, but the compressed elastic member 6 disposed between the circuit board 2 and the second housing wall 13 applies an elastic force to the circuit board 2 toward the chip 3, thereby eliminating most of the gap between the chip 3 and the first housing wall 11. In this case, only a thin thermal interface material layer 4 needs to fill the gap. For example, the thickness of the filled thermal interface material layer 4 is 0.05 to 0.07 millimeters, or even smaller.

[0163] Furthermore, because the thin thermal interface material layer 4 filled between the chip 3 and the first housing wall 11 has compressive deformation properties and the elastic member 6 applies an elastic force to the circuit board 2, the thickness of the thermal interface material layer 4 can be further reduced, thereby making the thermal interface material layer 4 even thinner. For example, a thermal interface material layer 4 made of silica gel and having a thickness of 0.07 millimeters is selected and filled between the chip 3 and the first housing wall 11. The thermal interface material layer 4 is compressed again by a thickness of 0.02 millimeters under the pressing action of the elastic member 6. In this case, the thickness of the thermal interface material layer 4 finally filled between the chip 3 and the first housing wall 11 is 0.05 millimeters.

[0164] It can be seen that the compressed elastic member 6 attached between the circuit board 2 and the second housing wall 13 can eliminate most of the gap between the chip 3 and the first housing wall 11, and can significantly reduce the thickness of the thermal interface material layer 4 filled between the chip 3 and the first housing wall 11. As the thickness of the thermal interface material layer 4 is reduced, the thermal resistance of the thermal interface material layer 4 is also reduced. As the thermal resistance of the thermal interface material layer 4 is reduced, the thermal conductivity of the thermal interface material layer 4 can be improved, further improving the heat dissipation effect of the electronic device.

[0165] For example, in a solution without an elastic member 6, a thermal interface material layer 4 having a thickness of 1 to 1.5 millimeters must be disposed between the chip 3 and the first housing wall 11. In a solution with an elastic member 6 in a compressed state disposed between the circuit board 2 and the second housing wall 13, a thermal interface material layer 4 having a thickness of only 0.05 to 0.07 millimeters must be disposed between the chip 3 and the first housing wall 11. It can be seen that the thickness of the thermal interface material layer 4 in the former case is significantly greater than that of the thermal interface material layer 4 in the latter case. In this case, the thermal resistance of the thermal interface material layer 4 in the former case is also greater than that of the thermal interface material layer 4 in the latter case. Furthermore, the heat transfer performance of the thermal interface material layer 4 in the latter case is higher than that of the thermal interface material layer 4 in the former case.

[0166] 13 and 14, the circuit board 2 is fixed in the chamber 101 using an elastic member 6. When the elastic member 6 performs expansion and contraction operations, the circuit board 2 also vibrates together with the elastic member 6, which may affect the normal operation of other components on the surface of the circuit board 2, particularly the mounting and sealing performance of interface components.

[0167] To overcome the aforementioned problems, the circuit board 2 may be divided into at least two sub-boards, with only the chip 3 occupying one sub-board and the other components occupying another sub-board. The sub-board on which the chip 3 is located is flexibly fixed within the chamber 101 using the elastic member 6. The sub-board on which the other components are located is firmly fixed within the chamber 101. However, in electronic devices in which the circuit board 2 is large, the circuit board 2 may be further divided into more sub-boards, with only the chip 3 occupying one sub-board and the other components occupying the remaining sub-boards. This embodiment does not limit the number of sub-boards included in the circuit board 2, but an example including a first sub-board and a second sub-board may be used. The first sub-board is the sub-board on which the chip 3 is located, and the number of first sub-boards corresponds to the number of chips 3. The second sub-board is the sub-board on which the other components are located, and the number of second sub-boards is related to the number of other components, and there may be one or more second sub-boards.

[0168] 15, the circuit board 2 includes a first sub-board 21 and a second sub-board 22. The first sub-board 21 and the second sub-board 22 are electrically connected. The chip 3 is located on the surface of the first sub-board 21, and the elastic member 6 is compressed between the first sub-board 21 and the second housing wall 13. The second sub-board 22 is fastened to the housing wall of the heat dissipation housing 1, and the interface components 10 of the electronic device are located on the surface of the second sub-board 22.

[0169] There are one or more first sub-boards 21, which mainly relate to the number of chips 3. For example, if there is one chip 3, there is also one first sub-board 21. In another example, if there are multiple chips 3, there may be only one first sub-board 21, and all of the multiple chips 3 are located on this first sub-board 21. In another example, if there are multiple chips 3, there may also be multiple first sub-boards 21, and the chips 3 are in one-to-one correspondence with the first sub-boards 21. This embodiment does not limit the number of first sub-boards 21, but those skilled in the art will flexibly select the number of first sub-boards based on actual circumstances.

[0170] There may be one or more second sub-boards 22, which is mainly related to the number of components in the electronic device. For example, if there are a large number of components, there may be multiple second sub-boards 22. This embodiment does not limit the number of second sub-boards 22, and those skilled in the art may flexibly select the number of second sub-boards based on actual circumstances.

[0171] In the accompanying drawings, one first sub-board 21 and one second sub-board 22 may be used as an example.

[0172] 15 , the chip 3 is welded to the surface of a first sub-board 21 of the multiple circuit boards 2, and the elastic member 6 is compressed between the first sub-board 21 and the second housing wall 13. The interface component 10 is welded to the surface of the second sub-board 22, and the second sub-board 22 is firmly clamped and fixed in the chamber 101. Regarding the electrical connection, the first sub-board 21 and the second sub-board 22 may be electrically connected using a flexible cable, or the first sub-board 21 and the second sub-board 22 may be electrically connected using a flexible circuit board.

[0173] In this way, due to the elastic force of the elastic member 6 against the first sub-board 21, most of the gap between the chip 3 and the first housing wall 11 is eliminated, which can speed up heat transfer between the chip 3 and the first housing wall 11. Even when the thermal interface material layer 4 is filled between the chip 3 and the first housing wall 11, the thickness of the filled thermal interface material layer 4 is small, for example, in the range of 0.05 mm to 0.07 mm, and the thermal resistance of the thermal interface material layer 4 is small. Considering this, heat transfer between the chip 3 and the first housing wall 11 is further accelerated, and the effect of dissipating heat from the chip 3 is improved.

[0174] As for the interface component 10, since the interface component 10 is located on the surface of the second sub-board 22 and does not need to vibrate together with the elastic member 6, there is no need to ensure a gap between the interface component 10 and the mounting port through which the interface component is attached. In this way, sealing performance between the interface component 10 and the mounting port can be ensured, achieving dustproof and waterproof effects.

[0175] See Figures 14 and 15 for schematic diagrams of alternative electronic device structures.

[0176] 14 , the electronic device includes a heat dissipation housing 1, a circuit board 2, a chip 3, a thermal interface material layer 4, and an elastic member 6. The circuit board 2, the chip 3, the thermal interface material layer 4, and the elastic member 6 are all located within a chamber 101 formed by the heat dissipation housing 1. The chip 3 is located on a surface of the circuit board 2. The thermal interface material layer 4 is located on a surface of the chip 3 that is remote from the circuit board 2. The elastic member 6 is compressed between the circuit board 2 and the second housing wall 13 of the heat dissipation housing 1 to reduce the gap between the chip 3 and the first housing wall 11 of the heat dissipation housing 1.

[0177] The first housing wall 11 is a housing wall of the heat dissipating housing 1 that faces the chip 3. The second housing wall 13 is a housing wall of the heat dissipating housing 1 that faces the circuit board 2. The second housing wall 13 is located opposite the first housing wall 11.

[0178] For a description of an electronic device having such a structure, please refer to the above description, and the details will not be described one by one again here.

[0179] In the electronic device, the elastic member 6 compressed between the circuit board 2 and the second housing wall 13 applies an elastic force to the circuit board 2, so that the gap between the chip 3 and the first housing wall 11 can be largely eliminated, and the chip 3 and the first housing wall 11 can fit more tightly against each other. When the chip 3 and the first housing wall 11 fit more tightly against each other, the heat transfer between the chip 3 and the first housing wall 11 becomes faster accordingly, so that the first housing wall 11 can quickly absorb and dissipate the heat of the chip 3, thereby further improving the heat dissipation effect of the electronic device.

[0180] Even when the thermal interface material layer 4 is filled between the chip 3 and the first housing wall 11, the thickness of the filled thermal interface material layer 4 is small, for example, only in the range of 0.05 mm to 0.07 mm, and the thermal resistance of the thermal interface material layer 4 is small. In consideration of this, the thermal conductivity of the thermal interface material layer 4 is improved, and the heat dissipation effect of the electronic device can be further improved.

[0181] The foregoing description is merely an embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement, or improvement made without departing from the spirit and principle of the present application should fall within the protection scope of the present application. (Other possible items) [Item 1] An electronic device, the electronic device comprising: a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, a thermally conductive member, and an elastic member; the circuit board, the chip, the thermal interface material layer, the thermally conductive member, and the elastic member are all located within a chamber formed by the heat dissipation housing, the chip is located on a surface of the circuit board, and the thermally conductive member is located on a surface of the chip remote from the circuit board; an electronic device, wherein the elastic member is compressed between a surface of the thermal conduction member away from the chip and an inner surface of a first housing wall of the heat dissipation housing to reduce a gap between the chip and the thermal conduction member, the gap being filled with the thermal interface material layer, the elastic member having heat transfer properties, and the first housing wall being a housing wall of the heat dissipation housing located opposite the chip. [Item 2] the elastic member has a spring and a heat pipe; the spring is compressed between the thermally conductive member and the first housing wall to reduce the gap between the chip and the thermally conductive member; the heat pipe is connected between the thermally conductive member and the first housing wall to transfer heat absorbed from the chip by the thermally conductive member to the heat dissipation housing; Item 10. The electronic device of claim 1, wherein the heat pipe is elastic and compressed between the surface of the thermally conductive member away from the chip and the inner surface of the first housing wall of the heat dissipation housing. [Item 3] the heat pipe includes a first pipe section, a second pipe section, and a third pipe section; 3. The electronic device of claim 2, wherein the first pipe section is attached to the surface of the heat conduction member away from the chip, the third pipe section is attached to the inner surface of the first housing wall, and the second pipe section is connected diagonally between the first pipe section and the third pipe section. [Item 4] 4. The electronic device of claim 1, wherein the elastic member is a folded thermally conductive sheet and is arranged in compression between the surface of the thermally conductive member away from the chip and the inner surface of the first housing wall, and the elastic member provides elasticity through its folding properties and transfers heat through its thermally conductive properties. [Item 5] 5. The electronic device of any one of items 1 to 4, wherein the circuit board is fixed to a housing wall of the heat dissipation housing. [Item 6] An electronic device, the electronic device comprising: a heat dissipation housing, a circuit board, a chip, a thermally conductive member, and an elastic member; the circuit board, the chip, the thermally conductive member, and the elastic member are all located within a chamber formed by the heat dissipation housing, the chip is located on a surface of the circuit board, and the thermally conductive member is located on a surface of the chip remote from the circuit board; An electronic device, wherein the elastic member is compressed between a surface of the thermal conduction member away from the chip and an inner surface of a first housing wall of the heat dissipation housing to reduce a gap between the chip and the thermal conduction member, the elastic member having heat transfer properties, and the first housing wall being a housing wall of the heat dissipation housing located opposite the chip. [Item 7] the electronic device further comprising a thermal interface material layer; Item 7. The electronic device of item 6, wherein the thermal interface material layer fills the gap between the chip and the thermally conductive member. [Item 8] An electronic device, the electronic device comprising: a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, an elastic member, and a heat dissipation device; the circuit board, the chip, and the thermal interface material layer are all located within a chamber formed by the heat dissipation housing, and the chip is located on a surface of the circuit board; a first housing wall of the heat dissipation housing having an opening at a position corresponding to the thermal interface material layer, the first housing wall being a housing wall of the heat dissipation housing facing the chip; the heat dissipation device has a heat dissipation base and a mounting plate, the mounting plate being located on an outer surface of a side wall of the heat dissipation base; the heat dissipation base is fitted to the opening, the heat dissipation base is removably disposed in the opening, the heat dissipation base is located on a surface of the chip away from the circuit board, and the mounting plate is located on an outer surface of the first housing wall; the resilient member is located on a surface of the mounting plate away from the first housing wall, and the resilient member and the mounting plate are both secured to the first housing wall using fasteners; the elastic member is compressed between the fastener and the mounting plate to reduce a gap between the chip and the heat dissipation base, and the gap is filled with the thermal interface material layer. [Item 9] Item 9. The electronic device of item 8, wherein a vapor chamber is disposed on a surface of the heat dissipation base that is close to the chip. [Item 10] 10. The electronic device according to item 8 or 9, wherein the heat dissipation device further comprises heat dissipation fins, the heat dissipation fins being located on a surface of the heat dissipation base away from the chip. [Item 11] Item 11. The electronic device of any one of items 8 to 10, wherein an end of the mounting plate remote from the side wall of the heat dissipation base is in contact with a housing heat dissipation fin of the heat dissipation housing. [Item 12] Item 12. The electronic device of any one of items 8 to 11, wherein an encapsulant is disposed between the side wall of the heat dissipation base and the inner wall of the opening. [Item 13] 13. The electronic device of any one of items 8 to 12, wherein the circuit board is fixed to a housing wall of the heat dissipation housing. [Item 14] An electronic device, the electronic device comprising a heat dissipation housing, a circuit board, a chip, an elastic member, and a heat dissipation device; the circuit board and the chip are both located within a chamber formed by the heat dissipation housing, and the chip is located on a surface of the circuit board; a first housing wall of the heat dissipation housing having an opening at a position corresponding to the chip, the first housing wall being a housing wall of the heat dissipation housing at a position facing the chip; the heat dissipation device has a heat dissipation base and a mounting plate, the mounting plate being located on an outer surface of a side wall of the heat dissipation base; the heat dissipation base is fitted to the opening, the heat dissipation base is removably disposed in the opening, the heat dissipation base is located on a surface of the chip away from the circuit board, and the mounting plate is located on an outer surface of the first housing wall; the resilient member is located on a surface of the mounting plate away from the first housing wall, and the resilient member and the mounting plate are both secured to the first housing wall using fasteners; The electronic device, wherein the elastic member is compressed between the fastener and the mounting plate to reduce a gap between the chip and the heat dissipation base. [Item 15] the electronic device further comprising a thermal interface material layer; Item 15. The electronic device of item 14, wherein the thermal interface material layer fills the gap between the chip and the heat dissipation base. [Item 16] An electronic device, the electronic device comprising: a heat dissipation housing, a circuit board, a chip, a thermal interface material layer, and an elastic member; the circuit board, the chip, the thermal interface material layer, and the elastic member are all located within a chamber formed by the heat dissipation housing, and the chip is located on a surface of the circuit board; an electronic device, wherein the elastic member is compressed between the circuit board and the second housing wall of the heat dissipation housing to reduce a gap between the chip and the first housing wall of the heat dissipation housing, the gap being filled with the thermal interface material layer, the first housing wall being a housing wall of the heat dissipation housing located opposite the chip, and the second housing wall being located opposite the first housing wall. [Item 17] the circuit board has a first sub-board and a second sub-board, the first sub-board and the second sub-board being electrically connected; the chip is located on a surface of the first sub-board, and the elastic member is compressed between the first sub-board and the second housing wall; Item 17. The electronic device of item 16, wherein the second sub-board is fixed to a housing wall of the heat dissipation housing, and an interface component of the electronic device is located on a surface of the second sub-board. [Item 18] An electronic device, the electronic device comprising a heat dissipation housing, a circuit board, a chip, and an elastic member; the circuit board, the chip, and the elastic member are all located within a chamber formed by the heat dissipation housing, and the chip is located on a surface of the circuit board; An electronic device, wherein the elastic member is compressed between the circuit board and the second housing wall of the heat dissipation housing to reduce a gap between the chip and the first housing wall of the heat dissipation housing, the first housing wall being a housing wall of the heat dissipation housing located opposite the chip, and the second housing wall being located opposite the first housing wall. [Item 19] the electronic device further comprising a thermal interface material layer; Item 19. The electronic device of item 18, wherein the thermal interface material layer fills the gap between the chip and the first housing wall.

Claims

1. a heat dissipation housing, a circuit board, a chip, a heat conductive member, and an elastic member; the circuit board, the chip, the thermally conductive member, and the elastic member are all located within a chamber formed by the heat dissipation housing, the chip is located on a surface of the circuit board, and the thermally conductive member is located on a surface of the chip remote from the circuit board; An electronic device for a vehicle, wherein the elastic member is compressed between a surface of the heat conduction member away from the chip and an inner surface of a first housing wall of the heat dissipation housing to reduce a gap between the chip and the heat conduction member, the elastic member having heat transfer properties, and the first housing wall is a housing wall of the heat dissipation housing located opposite the chip.

2. the electronic device further comprising a thermal interface material layer; The electronic device of claim 1 , wherein the thermal interface material layer fills the gap between the chip and the thermally conductive member.

3. the elastic member has a spring and a heat pipe; the spring is compressed between the thermally conductive member and the first housing wall to reduce the gap between the chip and the thermally conductive member; 3. The electronic device according to claim 1, wherein the heat pipe is connected between the thermally conductive member and the first housing wall to transfer heat absorbed from the chip by the thermally conductive member to the heat dissipation housing.

4. 4. The electronic device of claim 3, wherein the heat pipe is elastic and compressed between the surface of the thermally conductive member away from the chip and the inner surface of the first housing wall of the heat dissipation housing.

5. the heat pipe includes a first pipe section, a second pipe section, and a third pipe section; 5. The electronic device of claim 3, wherein the first pipe section is attached to the surface of the heat conduction member away from the chip, the third pipe section is attached to the inner surface of the first housing wall, and the second pipe section is connected diagonally between the first pipe section and the third pipe section.

6. 6. The electronic device of claim 1, wherein the elastic member is a folded thermally conductive sheet and is arranged in compression between the surface of the thermally conductive member away from the chip and the inner surface of the first housing wall, and the elastic member provides elasticity through its bending properties and transfers heat through its thermally conductive properties.

7. The electronic device according to claim 1 , wherein the circuit board is fastened to a housing wall of the heat dissipation housing to provide a support force against the compressive elastic force of the elastic member.

8. The dustproof and waterproof level of the heat dissipation housing of the electronic device is IP54 or higher 8. An electronic device according to any one of claims 1 to 7.

9. a heat dissipation housing, a circuit board, a chip, an elastic member, and a heat dissipation device; both the circuit board and the chip are located within a chamber formed by the heat dissipation housing, and the chip is located on a surface of the circuit board; a first housing wall of the heat dissipation housing having an opening at a position corresponding to the chip, the first housing wall being a housing wall of the heat dissipation housing at a position facing the chip; the heat dissipation device has a heat dissipation base and a mounting plate, the mounting plate being located on an outer surface of a sidewall of the heat dissipation base; the heat dissipation base is fitted to the opening, the heat dissipation base is removably disposed in the opening, the heat dissipation base is positioned on a surface of the chip remote from the circuit board, and the mounting plate is positioned on an outer surface of the first housing wall; the resilient member is located on a surface of the mounting plate away from the first housing wall, and both the resilient member and the mounting plate are fastened to the first housing wall using fasteners; The electronic device for a vehicle, wherein the elastic member is compressed between the fastener and the mounting plate to reduce a gap between the chip and the heat dissipation base.

10. the electronic device further comprising a thermal interface material layer; The electronic device of claim 9 , wherein the thermal interface material layer fills the gap between the chip and the heat dissipation base.

11. The electronic device according to claim 9 or 10, wherein a vapor chamber is disposed on a surface of the heat dissipation base that is close to the chip.

12. 12. The electronic device according to claim 9, wherein the heat dissipation device further comprises heat dissipation fins, the heat dissipation fins being located on a surface of the heat dissipation base remote from the chip.

13. The electronic device of claim 9 , wherein an end of the mounting plate remote from the side wall of the heat dissipation base is in contact with a housing heat dissipation fin of the heat dissipation housing.

14. The electronic device according to claim 9 , wherein a sealing material is disposed between the side wall of the heat dissipation base and the inner wall of the opening.

15. The electronic device according to claim 9 , wherein the circuit board is fastened to a housing wall of the heat dissipation housing to provide a support force against the compressive elastic force of the elastic member.

16. The dustproof and waterproof level of the heat dissipation housing of the electronic device is IP54 or higher 8. An electronic device according to any one of claims 1 to 7.

17. a heat dissipation housing, a circuit board, a chip, and an elastic member; the circuit board, the chip, and the elastic member are all located within a chamber formed by the heat dissipation housing, and the chip is located on a surface of the circuit board; An electronic device for a vehicle, wherein the elastic member is compressed between the circuit board and the second housing wall of the heat dissipation housing to reduce a gap between the chip and the first housing wall of the heat dissipation housing, the first housing wall being a housing wall of the heat dissipation housing located opposite the chip, and the second housing wall being located opposite the first housing wall.

18. the electronic device further comprising a thermal interface material layer; 20. The electronic device of claim 17, wherein the thermal interface material layer fills the gap between the chip and the front first housing wall.

19. the circuit board has a first sub-board and a second sub-board, the first sub-board and the second sub-board being electrically connected; the chip is located on a surface of the first sub-board, and the elastic member is compressed between the first sub-board and the second housing wall; 19. The electronic device according to claim 17 or 18, wherein the second sub-board is fastened to a housing wall of the heat dissipation housing, and an interface component of the electronic device is located on a surface of the second sub-board.

20. The dustproof and waterproof level of the heat dissipation housing of the electronic device is IP54 or higher 20. An electronic device according to any one of claims 17 to 19.

21. A vehicle, 21. A vehicle comprising an electronic device according to any one of claims 1 to 8, or any one of claims 9 to 16, or any one of claims 17 to 20.

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