Manufacturing method of diaphragm pump

Abstract

To provide a manufacturing method of a diaphragm pump which inhibits misalignment caused when a valve is assembled to the diaphragm pump.SOLUTION: A manufacturing method of a diaphragm pump includes: a preparation step in which a first member having a first through hole and a second through hole is prepared; a film joint step in which the first member and the film are joined so as to cover an opening of the first through hole and an opening of the second through hole; a valve formation step in which the film is cut to form a first valve for opening / closing the opening of the first through hole and a second valve for opening / closing the opening of the second through hole; and a second member joint step in which a second member with a recessed part is joined to a surface, to which the film is joined, of the first member so that the recessed part allows the first through hole and the second through hole to communicate with each other. The valve formation step is performed after the film joint step.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a diaphragm pump. [Background technology]

[0002] Diaphragm pumps are known as pumps that pump a fixed amount of fluid with high precision. A diaphragm pump includes an actuator that generates pressure, a diaphragm that deforms due to the pressure generated by the actuator, and a pump chamber whose volume changes as the diaphragm deforms. When the volume of the pump chamber expands as the diaphragm deforms, the pressure inside the pump chamber decreases, and fluid flows into the pump chamber from outside the diaphragm pump. Conversely, when the volume of the pump chamber decreases, the pressure inside the pump chamber increases, and fluid flows out of the pump chamber to the outside. Diaphragm pumps also create one-way fluid flow by arranging check valves at the inlet and outlet ports through which fluid flows into and out of the pump chamber. The pump functions by repeatedly flowing fluid into and out of the pump chamber.

[0003] Since such diaphragm pumps utilize the pressure difference caused by volume changes in the pump chamber to repeatedly allow fluid to flow in and out, the smaller the pressure loss caused by the check valve opening and closing, the better the pump performance.For this reason, thin, flexible films, rubber, etc. are used as check valves.

[0004] A diaphragm pump using such a valve is disclosed in Patent Document 1. The diaphragm pump disclosed in Patent Document 1 is manufactured by sandwiching a film processed into the shape of a valve between members. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-193656 Summary of the Invention [Problem to be solved by the invention]

[0006] However, when the valve is made of a thin film or rubber material, the valve itself is very light. Furthermore, due to its low rigidity, the valve is difficult to handle when assembling it to other components, and it is prone to misalignment during assembly. If the valve is misaligned, there is a risk that the diaphragm pump will not operate properly.

[0007] In view of the above-mentioned problems, an object of the present invention is to provide a method for manufacturing a diaphragm pump that suppresses misalignment that occurs when assembling a valve to a diaphragm pump. [Means for solving the problem]

[0008] a film joining step of joining the first member and a film so as to cover the openings of the first through hole and the second through hole; a valve forming step of cutting the film to form a first valve that opens and closes the opening of the first through hole and a second valve that opens and closes the opening of the second through hole; and a second member joining step of joining a second member, having a recess formed therein, to the surface of the first member on the side where the film is joined so that the recess connects the first through hole and the second through hole, wherein the diaphragm pump allows a fluid to flow in the following order: the first through hole, the first valve, the recess, the second valve, and the second through hole; and the valve forming step is performed after the film joining step. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a method for manufacturing a diaphragm pump that suppresses misalignment that occurs when assembling a valve to a diaphragm pump. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is an external perspective view of a diaphragm pump. [Figure 2] Exploded perspective view of a diaphragm pump [Figure 3] FIG. 2 is a cross-sectional view of the diaphragm pump in an operating state. [Figure 4] FIG. 1 is a flow chart showing a manufacturing process of a diaphragm pump. [Figure 5] FIG. [Figure 6] FIG. 1 is a schematic diagram of a first member before a film is bonded to the first member. [Figure 7] FIG. 4 is a schematic diagram showing a step of pressing a film against a first member. [Figure 8] Schematic diagram of the film being bonded to the first component [Figure 9] Schematic diagram showing the process of separating the film from the roll. [Figure 10] Schematic diagram of the first member after film bonding. [Figure 11] An enlarged view of the vicinity of the inlet opening. [Figure 12] FIG. 2 is a perspective view of the first valve. [Figure 13] FIG. 2 is a perspective view of a first member to which a first valve and a second valve are joined. [Figure 14] FIG. 2 is an external view of the diaphragm pump as seen from the first member side. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the subject matter of the present invention, and not all combinations of features described in the embodiments are necessarily essential to the solution of the present invention. Note that the same reference numerals are used to designate the same components.

[0012] (First embodiment) (Diaphragm pump) Fig. 1 is an external perspective view of the diaphragm pump 1, and Fig. 2 is an exploded perspective view of the diaphragm pump 1. Note that the diaphragm pump according to this embodiment is a piezoelectric pump that includes a piezoelectric element that is driven by application of voltage as an actuator, but is not limited to this.

[0013] The diaphragm pump 1 has a first member 400 having an inlet hole 401 (also referred to as a first through-hole) and an outlet hole 402 (also referred to as a second through-hole). A second member 200 having a recess 201 (also referred to as a pump chamber) is joined to the first member 400. A method for joining the first member 400 and the second member 200 will be described in detail later. The recess 201 includes a pump chamber inlet hole 202 through which a fluid flows in and a pump chamber outlet hole 203 through which the fluid flows out. By joining the second member 200 to the first member 400, the inlet hole 401 communicates with the recess 201 via the pump chamber inlet hole 202, and the outlet hole 402 communicates with the recess 201 via the pump chamber outlet hole 203. In other words, the recess 201 communicates the inlet hole 401 with the outlet hole 402.

[0014] Additionally, a first valve 501 that opens and closes the opening of the inlet hole 401 and a second valve 502 that opens and closes the opening of the outlet hole 402 are joined to the first member 400. Details of the first valve 501 and the second valve 502 and the joining method will be described later.

[0015] A diaphragm 300 is bonded to the second member 200 so as to cover the recess 201. The diaphragm 300 is a flexible film. When bonding the second member 200 and the diaphragm 300, the positioning portions 204 of the second member 200 are inserted into the positioning portions 301 of the diaphragm 300, thereby positioning the second member 200 and the diaphragm 300. The method of bonding the second member 200 and the diaphragm 300 will be described in detail later.

[0016] An actuator unit 100 for deforming the diaphragm 300 is bonded to the back surface of the surface of the diaphragm 300 that covers the recess 201. The actuator unit 100 has a piezoelectric element (not shown) that is displaced by application of voltage and a diaphragm (not shown) that includes a metal. The actuator unit 100 is connected to an external power source via solder 101 and wiring 102, and application of voltage causes the piezoelectric element and diaphragm to vibrate, deforming the diaphragm 300. The actuator unit 100 in this embodiment is also referred to as a piezoelectric unit, and may include electrodes (not shown) in addition to the piezoelectric element and diaphragm.

[0017] Next, we will explain how the diaphragm pump 1 is driven. Figure 3 is a cross-sectional view of the diaphragm pump 1 taken along line AA' (Figure 1) in the driven state. When power is applied to the actuator unit 100 from an external power source, the piezoelectric element of the actuator unit 100 deforms. As the piezoelectric element deforms, the diaphragm and diaphragm 300, which are bonded to the piezoelectric element, also deform.

[0018] 3(a) shows a state in which the diaphragm 300 is deformed in a direction in which the volume of the pump chamber 201 is expanded. When the diaphragm 300 is deformed in a direction in which the volume of the pump chamber is expanded, the pressure in the pump chamber decreases. At this time, the first valve 501 covering the opening of the inlet hole 401 is opened, and fluid flows from the inlet hole 401 into the pump chamber 201 via the pump chamber inlet hole 202. On the other hand, the second valve 502 covering the opening of the outlet hole 402 is closed, and fluid does not flow from the pump chamber 201 to the outlet hole 402 via the pump chamber outlet hole 203.

[0019] 3(b) shows a state in which the diaphragm 300 is deformed in a direction that reduces the volume of the pump chamber 201. When the diaphragm 300 is deformed in a direction that reduces the volume of the pump chamber, the pressure in the pump chamber increases. At this time, the second valve 502 covering the opening of the outflow hole 402 is opened, and fluid flows out from the pump chamber 201 to the outflow hole 402 via the pump chamber outflow hole 203. On the other hand, the first valve 501 covering the opening of the inflow hole 401 is closed, and fluid does not flow from the inflow hole 401 to the pump chamber 201 via the pump chamber inflow hole 202.

[0020] In this way, the diaphragm pump 1 causes the fluid to flow by successively repeating the state of FIG. 3(a) and the state of FIG. 3(b).

[0021] (Diaphragm pump manufacturing method) 4 is a flow diagram of the manufacturing process of the diaphragm pump 1. The manufacturing method of the diaphragm pump 1 according to this embodiment will be described in detail below along the process flow.

[0022] First, in step S401, a first member having an inlet hole 401 and an outlet hole 402 is prepared (preparation step). FIG. 5 shows a perspective view of the first member 400. The preparation step may be any method that can prepare the first member 400. In addition to the inlet hole 401 and the outlet hole 402, the first member 400 preferably has a film welding rib 403 to which the film 510 is welded in a later step, and a second member welding rib 404 to which the second member 200 is welded. The inclusion of these welding ribs allows the first member 400 and the film 510 and the first member 400 and the second member to be easily joined by welding. Furthermore, the first member 400 preferably has a positioning portion 405 for joining the first member 400 and the second member 200 together. Since the first member 400 has the positioning portion 405, it is possible to suppress misalignment when the first member 400 and the second member 200 are joined together.

[0023] Next, in S402, the first member 400 and the film 510 are joined so as to cover the openings of the inlet hole 401 and the outlet hole 402 (film joining step). FIG. 6 is a schematic diagram of the first member 400 before the film 510 is joined, FIG. 7 is a schematic diagram showing the step of pressing the film 510 against the first member 400, and FIG. 8 is a schematic diagram of the process of joining the film 510 to the first member 400. The film 510 is a resin film having a thickness of approximately 0.05 mm, and is in a roll form wound around a roll 520. First, the film 510 is pulled out from the roll 520, and with a certain amount of tension applied to the film 510, it is sandwiched between nip rollers 700 for fixing and placed above the first member 400. Next, the first member 400 is pressed from below against the film 510 in a tensioned state. In this state, welding horn 600 is pressed against film 510 from above to bond film 510 to first member 400. Next, as shown in Fig. 9, laser irradiation unit 800 irradiates laser light 801 to cut film 510 from the roll.

[0024] The thickness of film 510 is preferably 0.01 mm to 0.5 mm, and more preferably 0.05 mm to 0.2 mm.

[0025] When the first member 400 is provided with the film welding ribs 403, it is preferable to join the film 510 to the film welding ribs 403 by heat welding.

[0026] In this embodiment, the film 510 and the first member 400 are joined by thermal welding, but the joining method is not limited to this, and they may be joined by laser welding or an adhesive. In addition, in this embodiment, the openings of the inlet hole 401 and the outlet hole 402 are covered by the same film 510, but they may be covered by separate films 510.

[0027] 10 is a schematic diagram showing first member 400 after film 510 has been bonded. In this state, film 510 does not function as a valve. In order for film 510 to function as a valve, film 510 needs to be processed into a valve shape.

[0028] Next, in S403, the film 510 is cut to form a first valve 501 that opens and closes the opening of the inlet hole 401 and a second valve 502 that opens and closes the opening of the outlet hole 402 (valve forming process). Because the first valve 501 and the second valve 502 have substantially the same configuration, the following description will focus on the first valve 501. FIG. 11 is an enlarged view of portion A (near the opening of the inlet hole 401) in FIG. 10. In the valve forming process, the film 510 may be cut into a valve shape using a blade such as a cutting plotter, but in this embodiment, the film 510 is cut by laser irradiation. Laser cutting is preferred because it allows for accurate formation of even very small valves. FIG. 12 is a perspective view of the first valve 501 cut along the laser cutting line 503 shown in FIG. 11. The laser cutting line 503 is provided inside the film welding rib 403, and the formed first valve 501 includes a joint portion 504 that is joined (welded) to the first member 400, and a valve body portion 505 that has one end connected to the joint portion 504 and the other end spaced apart from the joint portion 504. Because the first valve 501 includes the joint portion 504 and the valve body portion, the valve body portion 505 can open and close the opening of the inlet hole 401 without the first valve 501 being peeled off from the first member 400. Note that in the case of the second valve 502, the valve body portion 505 can open and close the opening of the outlet hole 402 without the second valve 502 being peeled off from the first member 400.

[0029] Through the above steps, first member 400 can be manufactured, in which first valve 501 and second valve 502 are joined together (FIG. 13).

[0030] Next, in S404, it is preferable to remove the film scraps generated in the valve formation step S403. Although the method for the film scrap removal step is not limited, it is preferable to remove the film scraps by pressing a suction nozzle against the first valve 501. By removing the film scraps, it is possible to reduce the risk that the scraps will interfere with subsequent steps.

[0031] Next, in S405, the second member 200 having the recess 201 formed therein is bonded to the surface of the first member 400 on which the film 510 is bonded, so that the recess 201 communicates with the inlet hole 401 and the outlet hole 402 (second member bonding step). First, the positioning portion 405 of the first member 400 is aligned with the positioning portion (not shown) of the second member 200. After alignment, the first member 400 and the second member 200 are bonded. While these bonding methods are not limited, in this embodiment, the first member 400 and the second member 200 are bonded by laser welding. Laser welding is preferable because it can bond the first member 400 and the second member 200 with high precision. In this embodiment, the first member 400 is formed of a laser-absorbing material, and the second member is formed of a laser-transparent material. Therefore, by irradiating the second member welding rib 404 of the first member 400 with a laser from the second member 200 side, the first member 400 and the second member 200 can be welded (joined) with high precision.

[0032] When the first member 400 and the second member 200 are joined by laser welding, it is preferable to use the laser irradiation unit 800 that processed the film 510 in the valve formation step. By using the same irradiation unit 800, the cost of manufacturing the diaphragm pump 1 can be reduced.

[0033] Next, in S406, the second member 200 and the diaphragm are bonded together so as to cover the recess 201 (diaphragm bonding step). First, positioning is performed using the positioning portion 204 of the second member 200 and the positioning portion 301 of the diaphragm 300. Then, it is preferable to irradiate the diaphragm 300 with a laser from the second member 200 side. For this reason, it is preferable that the diaphragm 300 be made of a material that absorbs laser light.

[0034] 14 is an external view of the second member 200 to which the diaphragm 300 is bonded, viewed from the first member 400 side. The laser irradiation portion 302 of the diaphragm is preferably located on the outer periphery of the first member 400. This makes it possible to irradiate the laser irradiation portion 302 of the diaphragm 300 with a laser from the second member 200 side, even after the first member 400 is bonded to the second member 200.

[0035] Next, in S407, the piezoelectric unit 100 for deforming the diaphragm is bonded to the back surface of the surface of the diaphragm 300 that covers the recess 201 (piezoelectric unit bonding step). In the piezoelectric unit bonding step, the piezoelectric unit 100 and the diaphragm 300 are preferably bonded together with an adhesive. By using an adhesive, the metal-containing diaphragm (not shown) of the piezoelectric unit 100 can be easily bonded to the diaphragm 300.

[0036] The diaphragm pump 1 is manufactured through the above steps.

[0037] In the manufacturing method of the diaphragm pump 1 of this embodiment, the valves are not formed and then bonded to the first component 400; instead, the film 510 is bonded to the first component 400 and then the first valve 501 and the second valve 502 are formed. Therefore, when transporting the film 510, the film 510 can be transported while being wound around the roll 520 and tensioned, which makes it possible to suppress misalignment when bonding the first component and the first valve (or the second valve). Furthermore, since a laser can be irradiated at a fixed position on the film 510, misalignment can be suppressed. Furthermore, suppression of misalignment also facilitates assembly using an automated machine. Furthermore, since the resin film is processed to form the valve shape, no mold is required, which reduces costs compared to methods such as molding a rubber component.

[0038] In this embodiment, the steps are performed in the order of S401 to S407, but this is not a limitation, and it is sufficient that step S403 is performed after step S402. For example, step S406 (diaphragm bonding step) and step S407 (piezoelectric unit bonding step) may be performed before step S405 (second member bonding step).

[0039] To summarize the present invention as described above, the present invention includes the following configurations.

[0040] (Method 1) a preparation step of preparing a first member having a first through hole and a second through hole; a film bonding step of bonding the first member and a film so as to cover the openings of the first through holes and the openings of the second through holes; a valve forming step of cutting the film to form a first valve that opens and closes the opening of the first through-hole and a second valve that opens and closes the opening of the second through-hole; a second member joining step of joining a second member having a recess formed therein to the surface of the first member on which the film is joined so that the recess communicates with the first through-hole and the second through-hole; A method for manufacturing a diaphragm pump, comprising: the diaphragm pump causes a fluid to flow in the order of the first through-hole, the first valve, the recess, the second valve, and the second through-hole; A method for manufacturing a diaphragm pump, wherein the valve forming step is performed after the film bonding step.

[0041] (Method 2) The method for manufacturing a diaphragm pump according to Method 1, further comprising a diaphragm bonding step of bonding the second member and the diaphragm so as to cover the recess.

[0042] (Method 3) The method for manufacturing a diaphragm pump according to Method 2, wherein the diaphragm bonding step bonds the second member and the diaphragm by irradiating a laser.

[0043] (Method 4) A method for manufacturing a diaphragm pump according to Method 2 or 3, which includes a piezoelectric unit bonding step of bonding a piezoelectric unit for deforming the diaphragm to the back surface of the surface of the diaphragm that covers the recess.

[0044] (Method 5) 5. The method for manufacturing a diaphragm pump according to Method 4, wherein the piezoelectric unit bonding step bonds the piezoelectric unit and the diaphragm with an adhesive.

[0045] (Method 6) The method for manufacturing a diaphragm pump described in Method 5, wherein the piezoelectric unit comprises a piezoelectric element that is displaced by application of voltage and a vibration plate containing metal, and the piezoelectric unit bonding step bonds the vibration plate and the diaphragm with an adhesive.

[0046] (Method 7) A method for manufacturing a diaphragm pump according to any one of methods 1 to 6, wherein in the film bonding step, the opening of the first through hole and the opening of the second through hole are each covered with a separate film.

[0047] (Method 8) 8. The method for manufacturing a diaphragm pump according to any one of methods 1 to 7, wherein the film bonding step comprises thermally welding the film and the first member together.

[0048] (Method 9) 9. The method for manufacturing a diaphragm pump according to method 8, wherein the first member has ribs for being heat-sealed to the film.

[0049] (Method 10) 10. The method for manufacturing a diaphragm pump according to any one of methods 1 to 9, wherein the valve forming step involves cutting the film by irradiating it with a laser.

[0050] (Method 11) 11. The method for manufacturing a diaphragm pump according to any one of methods 1 to 10, further comprising a removing step of removing scraps of the film produced in the valve forming step.

[0051] (Method 12) 12. The method for manufacturing a diaphragm pump according to any one of Methods 1 to 11, wherein the first valve and the second valve each comprise a joint portion joined to the first member, and a valve body portion having one end connected to the joint portion and the other end spaced apart from the joint portion.

[0052] (Method 13) 13. The method for manufacturing a diaphragm pump according to any one of methods 1 to 12, wherein the second member joining step joins the first member and the second member by irradiating a laser.

[0053] (Method 14) 14. The method for manufacturing a diaphragm pump according to Method 13, wherein in the second member joining step, the first member absorbs the laser and the second member transmits the laser.

[0054] (Method 15) 15. The method for manufacturing a diaphragm pump according to method 14, wherein the first member has ribs for welding to the second member.

[0055] (Method 16) 16. The method for manufacturing a diaphragm pump according to any one of methods 1 to 15, wherein the film bonding step is performed with the film wound into a roll. [Explanation of symbols]

[0056] 1 diaphragm pump 200 Second member 201 Recess (pump chamber) 400 First Component 401 Inlet hole (first through hole) 402 Outlet hole (second through hole) 501 First Valve 502 Second Valve 510 Film

Claims

1. a preparation step of preparing a first member having a first through hole and a second through hole; a film bonding step of bonding the first member and a film so as to cover the openings of the first through holes and the openings of the second through holes; a valve forming step of cutting the film to form a first valve that opens and closes the opening of the first through-hole and a second valve that opens and closes the opening of the second through-hole; a second member joining step of joining a second member having a recess formed therein to the surface of the first member on which the film is joined so that the recess communicates with the first through-hole and the second through-hole; A method for manufacturing a diaphragm pump, comprising: the diaphragm pump causes a fluid to flow in the order of the first through-hole, the first valve, the recess, the second valve, and the second through-hole; A method for manufacturing a diaphragm pump, wherein the valve forming step is performed after the film bonding step.

2. The method for manufacturing a diaphragm pump according to claim 1 , further comprising a diaphragm bonding step of bonding the second member and the diaphragm so as to cover the recess.

3. 3. The method for manufacturing a diaphragm pump according to claim 2, wherein the diaphragm bonding step bonds the second member and the diaphragm together by irradiating a laser.

4. 3. The method for manufacturing a diaphragm pump according to claim 2, further comprising a piezoelectric unit bonding step of bonding a piezoelectric unit for deforming the diaphragm to a surface of the diaphragm opposite to the surface covering the recess.

5. The method for manufacturing a diaphragm pump according to claim 4 , wherein the piezoelectric unit bonding step bonds the piezoelectric unit and the diaphragm together with an adhesive.

6. the piezoelectric unit includes a piezoelectric element that is displaced by application of a voltage and a vibration plate that includes a metal; 6. The method for manufacturing a diaphragm pump according to claim 5, wherein the piezoelectric unit bonding step bonds the vibration plate and the diaphragm together with an adhesive.

7. 2. The method for manufacturing a diaphragm pump according to claim 1, wherein in the film bonding step, the opening of the first through hole and the opening of the second through hole are covered with separate films.

8. 2. The method for manufacturing a diaphragm pump according to claim 1, wherein the film bonding step comprises heat welding the film and the first member together.

9. 9. The method for manufacturing a diaphragm pump according to claim 8, wherein the first member has a rib for being heat-sealed to the film.

10. The method for manufacturing a diaphragm pump according to claim 1 , wherein the valve forming step cuts the film by irradiating it with a laser.

11. The method for manufacturing a diaphragm pump according to claim 1 , further comprising a removing step of removing an end piece of the film produced in the valve forming step.

12. 2. The method for manufacturing a diaphragm pump according to claim 1, wherein the first valve and the second valve each include a joint portion joined to the first member, and a valve body portion having one end connected to the joint portion and the other end spaced apart from the joint portion.

13. 2. The method for manufacturing a diaphragm pump according to claim 1, wherein the second member joining step joins the first member and the second member by irradiating a laser.

14. 14. The method for manufacturing a diaphragm pump according to claim 13, wherein in the second member joining step, the first member absorbs the laser and the second member transmits the laser.

15. 15. The method for manufacturing a diaphragm pump according to claim 14, wherein the first member has a rib for welding to the second member.

16. The method for manufacturing a diaphragm pump according to claim 1 , wherein the film bonding step is performed with the film wound into a roll.

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