Multilayer ceramic capacitor

Abstract

To provide a multilayer ceramic capacitor which improves reliability after being mounted.SOLUTION: In a multilayer ceramic capacitor 100, a first external electrode 120 includes an end face side first external electrode, a principal surface side first external electrode, a side surface side first external electrode and a ridge line part side first external electrode 124. At least one of the principal surface side first external electrode and the side surface side first external electrode has a first protruding part 122a1 which protrudes from the ridge line part side first external electrode 124 toward a central part side of an element assembly part 110 in a length direction L. When a maximum distance between a first principal surface 111 and a second principal surface is defined as T0, T0 is 2.5 mm or more. When a maximum distance between a first side surface 113 and a second side surface 114 is defined as W0, W0 is 2.5 mm or more. When a maximum protruding length of the first protruding part 122a1 is defined as P1, it satisfies the following formulas (1): 0.01×T0≤P1≤0.06×T0 and (2): 0.01×W0≤P1≤0.06×W0.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a multilayer ceramic capacitor. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2005-19921 (Patent Document 1) is a prior art document that discloses the configuration of a multilayer ceramic capacitor. The multilayer ceramic capacitor described in Patent Document 1 includes a substantially rectangular parallelepiped element body in which dielectric layers and internal electrode layers are alternately stacked, and external electrodes provided on a pair of end faces of the element body in the longitudinal direction.

[0003] The external electrodes not only cover the end faces of the element body, but also extend from these end faces to each of the four outer peripheral surfaces of the element body. The multilayer ceramic capacitor is mounted on an insulating substrate via solder joined to the external electrodes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-19921 A Summary of the Invention [Problem to be solved by the invention]

[0005] In a multilayer ceramic capacitor mounted on an insulating substrate, stress is generated in the external electrodes when the insulating substrate is warped due to the influence of external heat, etc. This stress tends to concentrate particularly on the end portions of the external electrodes extending on the outer circumferential surface of the element body, which are located toward the center of the element body in the longitudinal direction.

[0006] As a result, the multilayer ceramic capacitor may suffer from damage originating from the end portion, which is particularly noticeable in multilayer ceramic capacitors in which the end faces of the element body are configured to be considerably large.

[0007] SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a multilayer ceramic capacitor that has improved reliability after mounting. [Means for solving the problem]

[0008] A multilayer ceramic capacitor according to the present invention comprises a body and a first external electrode. The body includes a plurality of dielectric layers and a plurality of internal electrode layers stacked in a stacking direction. The body has a first main surface and a second main surface facing each other in the stacking direction, a first side surface and a second side surface facing each other in a width direction perpendicular to the stacking direction, and a first end surface and a second end surface facing each other in a length direction perpendicular to the stacking direction and the width direction. The first external electrode extends from the first end surface to each of the first main surface, the second main surface, the first side surface, and the second side surface. The first external electrode is electrically connected to some of the internal electrode layers. The body includes a ridge portion where two adjacent surfaces of the first main surface, the second main surface, the first side surface, and the second side surface intersect. The first external electrodes include an end surface side first external electrode, a main surface side first external electrode, a side surface side first external electrode, and a ridge line side first external electrode. The end surface side first external electrode covers the first end surface. The main surface side first external electrode is connected to the end surface side first external electrode and covers a portion of the first main surface and a portion of the second main surface. The side surface side first external electrode is connected to the end surface side first external electrode and covers a portion of the first side surface and a portion of the second side surface. The ridge line side first external electrode is connected to the end surface side first external electrode and covers the ridge line portion. At least one of the main surface side first external electrode and the side surface side first external electrode has a first protrusion that protrudes further than the ridge line side first external electrode toward a center portion of the element body in the length direction. When the maximum distance between the first main surface and the second main surface is T0, T0 is 2.5 mm or more. When the maximum distance between the first side surface and the second side surface is W0, W0 is 2.5 mm or more. When the maximum protruding length of the first protruding portion is P1, the following formulas (1) and (2) are satisfied. 0.01×T0≦P1≦0.06×T0 (1) 0.01×W0≦P1≦0.06×W0 (2) [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a multilayer ceramic capacitor with improved reliability after mounting. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view schematically illustrating the appearance of a multilayer ceramic capacitor according to an embodiment. [Figure 2] 2 is a schematic cross-sectional view of the multilayer ceramic capacitor taken along line II-II of FIG. 1. [Figure 3] 3 is a schematic cross-sectional view of the multilayer ceramic capacitor taken along line III-III shown in FIG. [Figure 4] 4 is a schematic plan view of the multilayer ceramic capacitor as seen from the direction of arrow IV shown in FIG. [Figure 5] 5 is a partially enlarged view of a portion of the multilayer ceramic capacitor shown in FIG. 4. [Figure 6] FIG. 2 is a flowchart showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. [Figure 7] FIG. 7 is a schematic cross-sectional view for explaining step S81 of the manufacturing flow shown in FIG. [Figure 8] FIG. 7 is a schematic cross-sectional view for explaining step S81 of the manufacturing flow shown in FIG. [Figure 9] FIG. 7 is a schematic cross-sectional view for explaining step S81 of the manufacturing flow shown in FIG. [Figure 10] FIG. 7 is a schematic cross-sectional view illustrating step S82 of the manufacturing flow shown in FIG. [Figure 11] FIG. 7 is a schematic cross-sectional view illustrating step S82 of the manufacturing flow shown in FIG. [Figure 12] FIG. 10 is a schematic cross-sectional view of a multilayer ceramic capacitor according to a first modified example. [Figure 13] FIG. 10 is a schematic plan view of a multilayer ceramic capacitor according to a second modified example. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments shown below, the same or common parts are denoted by the same reference numerals in the drawings, and their descriptions will not be repeated. In the drawings, the length direction of the body part is indicated by L, the width direction of the body part is indicated by W, and the stacking direction of the body part is indicated by T. The body part will be described in detail later.

[0012] (Embodiment) <A. Configuration of Multilayer Ceramic Capacitor> FIG. 1 is a perspective view schematically showing the appearance of a multilayer ceramic capacitor according to an embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II of the multilayer ceramic capacitor shown in FIG. 1. FIG. 3 is a schematic cross-sectional view taken along line III-III of the multilayer ceramic capacitor shown in FIG. 1. FIG. 4 is a schematic plan view of the multilayer ceramic capacitor as viewed from the direction of arrow IV shown in FIG. 1. FIG. 5 is a partially enlarged view of a part of the multilayer ceramic capacitor shown in FIG. 4. First, referring to FIGS. 1 to 5, the configuration of the multilayer ceramic capacitor 100 according to the present embodiment will be described.

[0013] As shown in FIGS. 1 to 4, the multilayer ceramic capacitor 100 according to the present embodiment includes a body part 110 and external electrodes. The external electrodes are composed of a first external electrode 120 and a second external electrode 130.

[0014] The body part 110 has a substantially rectangular parallelepiped shape. The body part 110 has a first main surface 111 and a second main surface 112 that face each other in the stacking direction T, a first side surface 113 and a second side surface 114 that face each other in the width direction W orthogonal to the stacking direction T, and a first end surface 115 and a second end surface 116 that face each other in the length direction L orthogonal to the stacking direction T and the width direction W. As an example, in the present embodiment, the second main surface 112 defines the mounting surface when the multilayer ceramic capacitor 100 is mounted on an insulating substrate.

[0015] The element body 110 includes multiple corners 110a. The corners 110a are portions where three surfaces of the element body 110 intersect. That is, the multiple corners 110a are formed at portions where three adjacent surfaces among the first main surface 111, the second main surface 112, the first side surface 113, the second side surface 114, the first end surface 115, and the second end surface 116 intersect. It is preferable that all of the multiple corners 110a are rounded.

[0016] The body part 110 includes a plurality of ridges 110b. The plurality of ridges 110b are formed at the intersections of two adjacent faces among the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114. It is preferable that all of the plurality of ridges 110b are rounded.

[0017] The element body part 110 includes a plurality of end face-side ridge portions 110c. The plurality of end face-side ridge portions 110c are configured by portions where the first end face 115 intersects with each of the first main face 111, second main face 112, first side face 113, and second side face 114, and portions where the second end face 116 intersects with each of the first main face 111, second main face 112, first side face 113, and second side face 114. It is preferable that all of the plurality of end face-side ridge portions 110c are rounded.

[0018] Here, element body 110 is configured with considerably large first end face 115 and second end face 116. More specifically, as shown in Figures 2 and 3, if the maximum distance between first main face 111 and second main face 112 of element body 110 is T0 and the maximum distance between first side face 113 and second side face 114 is W0, T0 is 2.5 mm or more and W0 is 2.5 mm or more.

[0019] The maximum distance L0 between the first end face 115 and the second end face 116 of the element body 110 is set to, for example, not less than 3.05 mm and not more than 3.2 mm.

[0020] The element body 110 has, for example, a length L0 of 3.1 mm, a width W0 of 2.5 mm, and a thickness T0 of 2.5 mm. Note that tolerances are taken into account in the above sizes.

[0021] The first external electrode 120 is provided over the entire first end face 115. The first external electrode 120 extends from the first end face 115 to each of the first main face 111, the second main face 112, the first side face 113, and the second side face 114.

[0022] The second external electrode 130 is provided over the entire second end surface 116. The second external electrode 130 also extends from the second end surface 116 to each of the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114.

[0023] The detailed configurations of the first external electrode 120 and the second external electrode 130 will be described later.

[0024] As shown in Figures 2 and 3, the body part 110 includes a first outer layer 117a made of a dielectric layer and including a first main surface 111, a second outer layer 117b made of a dielectric layer and including a second main surface 112, and a plurality of internal electrode layers 118 stacked alternately with the dielectric layers between the first outer layer 117a and the second outer layer 117b.

[0025] In this embodiment, the dielectric layer constituting the first outer layer 117a and the dielectric layer constituting the second outer layer 117b are made of substantially the same ceramic material system. Substantially the same ceramic material system means that the blending ratios of the raw ceramic materials are substantially the same, and the range of variation in ceramic composition due to variations in blending ratios and processing steps is included in the range of substantially the same ceramic material system.

[0026] The multiple internal electrode layers 118 are composed of first internal electrode layers 118a and second internal electrode layers 118b. Inside the element body 110, the first internal electrode layers 118a and the second internal electrode layers 118b are alternately stacked along the stacking direction T. Each of the multiple first internal electrode layers 118a and the multiple second internal electrode layers 118b is arranged parallel to the length direction L and the width direction W. A dielectric layer 119 is arranged between the first internal electrode layer 118a and the second internal electrode layer 118b adjacent to each other in the stacking direction T. In other words, the first internal electrode layer 118a and the second internal electrode layer 118b adjacent to each other in the stacking direction T face each other with the dielectric layer 119 sandwiched therebetween.

[0027] The first internal electrode layer 118a is drawn to a first end surface 115. The first end surface 115 is covered with a first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b is drawn to a second end surface 116. The second end surface 116 is covered with a second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0028] 2 and 3 show an example in which seven first internal electrode layers 118a and seven second internal electrode layers 118b are provided, but the number of each of the first internal electrode layers 118a and the second internal electrode layers 118b is not particularly limited to seven. The total number of the first internal electrode layers 118a and the second internal electrode layers 118b is preferably 300 to 600. The thickness of each of the first internal electrode layers 118a and the second internal electrode layers 118b is preferably 0.9 μm to 10 μm.

[0029] The first internal electrode layer 118a includes a first opposing portion 118a1 and a first lead portion 118a2. The first opposing portion 118a1 faces the adjacent second internal electrode layer 118b in the stacking direction T. The first lead portion 118a2 connects the first opposing portion 118a1 and the first external electrode 120. The first lead portion 118a2 is led out to the first end face 115 side. The first opposing portion 118a1 and the first lead portion 118a2 are integrally formed.

[0030] The second internal electrode layer 118b includes a second opposing portion 118b1 and a second lead portion 118b2. The second opposing portion 118b1 faces the adjacent first internal electrode layer 118a in the stacking direction T. The second lead portion 118b2 connects the second opposing portion 118b1 and the second external electrode 130. The second lead portion 118b2 is led out to the second end face 116 side. The second opposing portion 118b1 and the second lead portion 118b2 are integrally formed.

[0031] Each of the first internal electrode layer 118a and the second internal electrode layer 118b contains one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing the metal. An example of such an alloy is an alloy of Ag and Pd. In this embodiment, each of the first internal electrode layer 118a and the second internal electrode layer 118b contains Ni as a main component. Each of the first internal electrode layer 118a and the second internal electrode layer 118b may further contain dielectric particles having the same composition as the ceramic contained in the dielectric layer 119. Furthermore, each of the first internal electrode layer 118a and the second internal electrode layer 118b may contain Sn at the interface with the dielectric layer 119.

[0032] The plurality of dielectric layers 119 consists of outer layer dielectric layers located between the internal electrode layer 118 closest to the first main surface 111 side in the stacking direction T and the first main surface 111, and between the internal electrode layer 118 closest to the second main surface 112 side in the stacking direction T and the second main surface 112, and inner layer dielectric layers located between adjacent internal electrode layers 118 in the stacking direction T. The number of the plurality of dielectric layers 119 is preferably 300 or more and 800 or less. The thickness of the outer layer dielectric layer is preferably 20 μm or more and 50 μm or less. The thickness of the inner layer dielectric layer is preferably 3 μm or more and 10 μm or less.

[0033] For each of the plurality of dielectric layers 119, as the ceramic material, for example, a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3 can be used. Also, those obtained by adding sub-components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds to these main components may be used.

[0034] The element body 110 includes an inner layer portion C. The inner layer portion C has a capacitance by laminating the first facing portion 118a1 of the first internal electrode layer 118a and the second facing portion 118b1 of the second internal electrode layer 118b in the stacking direction T.

[0035] The distance s1 (see FIG. 2) between the end portion on the second end face 116 side of the first internal electrode layer 118a and the second end face 116 is preferably 1.6 mm or more and 6.0 mm or less. The same applies to the distance between the end portion on the first end face 115 side of the second internal electrode layer 118b and the first end face 115.

[0036] The distance s2 (see FIG. 3) between the first internal electrode layer 118a and the second internal electrode layer 118b and the first side face 113 is preferably 0.8 mm or more and 3.0 mm or less. The same applies to the distance between the first internal electrode layer 118a and the second internal electrode layer 118b and the second side face 114.

[0037] <B. Detailed Configuration of External Electrodes> The detailed configuration of the external electrodes will be described below with reference to Figures 1 to 5. As described above, the external electrodes are made up of the first external electrode 120 and the second external electrode 130.

[0038] The first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170 that covers the base electrode layer 160 .

[0039] The base electrode layer 160 includes at least one of a baked layer, a resin layer, a thin film layer, etc. In this embodiment, the base electrode layer 160 is formed of a baked layer.

[0040] The baking layer contains a glass component and a metal component. The metal component is one metal component selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal, such as an alloy of Ag and Pd. The glass component contains at least one of Si and Zn.

[0041] The baked layer may be composed of multiple laminated layers. The baked layer may be a layer that is baked after a conductive paste is applied to the element body 110, or may be a layer that is baked simultaneously with the internal electrode layer 118.

[0042] The plating layer 170 is disposed on the base electrode layer 160. The material constituting the plating layer 170 may be one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing such a metal. As an example, the material constituting the plating layer 170 may be an alloy of Ag and Pd.

[0043] In this embodiment, the plating layer 170 has a Ni layer located on the base electrode layer 160 side and a Sn layer located on the opposite side to the base electrode layer 160. In detail, the plating layer 170 has a two-layer structure in which a Sn plating layer is formed on a Ni plating layer.

[0044] The Ni plating layer can prevent the base electrode layer 160 from eroding the external electrodes due to the solder used when mounting the multilayer ceramic capacitor 100 on an insulating substrate. The Sn plating layer can improve the wettability of the solder during this mounting process, thereby facilitating the mounting of the multilayer ceramic capacitor 100.

[0045] The first external electrode 120 includes an end surface side first external electrode 121, a main surface side first external electrode 122, a side surface side first external electrode 123, a ridge side first external electrode 124, a corner side first external electrode 125, and an end surface side ridge side first external electrode 126. The main surface side first external electrode 122, the side surface side first external electrode 123, the ridge side first external electrode 124, the corner side first external electrode 125, and the end surface side ridge side first external electrode 126 are connected to the end surface side first external electrode 121.

[0046] The end surface-side first external electrode 121 covers the entire first end surface 115. The main surface-side first external electrode 122 covers a portion of the first main surface 111 located on the first end surface 115 side and a portion of the second main surface 112 located on the first end surface 115 side. The side surface-side first external electrode 123 covers a portion of the first side surface 113 located on the first end surface 115 side and a portion of the second side surface 114 located on the first end surface 115 side. The ridge portion-side first external electrode 124 covers a portion of the multiple ridge portions 110b located on the first end surface 115 side. The corner portion-side first external electrode 125 covers a portion of the multiple corner portions 110a located on the first end surface 115 side. The end surface-side ridge portion-side first external electrode 126 covers a portion of the multiple end surface-side ridge portions 110c located on the first end surface 115 side.

[0047] As shown in Figures 1 to 4, the main surface side first external electrode 122 is composed of a first main surface side first external electrode 122a, which is a portion covering a part of the first main surface 111, and a second main surface side first external electrode 122b, which is a portion covering a part of the second main surface 112.

[0048] 4, the first main surface side first external electrode 122a has a first protrusion 122a1. The first protrusion 122a1 protrudes further than the ridge side first external electrode 124 toward the center of the element body 110 in the longitudinal direction L. The edge of the first protrusion 122a1 located on the center side of the element body 110 has an arc shape.

[0049] Here, the first protrusion 122a1 is configured so that its maximum protrusion length is considerably small. More specifically, when the maximum protrusion length of the first protrusion 122a1 is P1, the following formulas (1) and (2) are satisfied. As described above, T0 is the maximum distance between the first main surface 111 and the second main surface 112 of the element body 110, and W0 is the maximum distance between the first side surface 113 and the second side surface 114.

[0050] 0.01×T0≦P1≦0.06×T0 (1) 0.01×W0≦P1≦0.06×W0 (2)

[0051] By configuring in this way, it is possible to provide a multilayer ceramic capacitor 100 with improved reliability after mounting, which will be described in detail later.

[0052] Here, P1 can be confirmed by observing the multilayer ceramic capacitor 100 from a plan view direction.

[0053] First, a distance d1 along the length direction L is measured from the outermost portion of the surface of the end face-side first external electrode 121 in the length direction L to the end of the ridge-side first external electrode 124 arranged adjacent to the first main surface-side first external electrode 122a. The ridge-side first external electrode 124 arranged adjacent to the first main surface-side first external electrode 122a includes a portion located on the first side face 113 side and a portion located on the second side face 114 side. Therefore, the distance d1 is measured for each of these two portions, and the larger of the two measured distances d1 is used. Note that the end of the ridge-side first external electrode 124 located on the first side face 113 side refers to a portion of the first external electrode 120 that intersects with the ridge that appears at the intersection of the first main surface 111 and the first side face 113 when the multilayer ceramic capacitor 100 is viewed from above (see position X1 in FIG. 4 ). The same applies to the end of the ridge-side first external electrode 124 located on the second side surface 114 side.

[0054] Next, a distance d2 along the length direction L from the outermost portion of the surface of the end face side first external electrode 121 in the length direction L to the most protruding portion of the first protruding portion 122a1 is measured.

[0055] Next, distance d1 is subtracted from distance d2. The value calculated in this way becomes P1 mentioned above.

[0056] The first principal surface side first external electrode 122a is divided into four equal parts in the width direction W, and the rate of change in the average dimension in the length direction L of each of the four parts is 20% or less when comparing the average dimension of adjacent parts. The rate of change is a value obtained by dividing the absolute value of the difference between two average dimensions by the smaller of the two average dimensions. Note that if the two average dimensions are the same, the rate of change is 0%.

[0057] The average dimension of each of the four portions in the length direction L is calculated by observing the multilayer ceramic capacitor 100 from a plan view. Below, a method for calculating the average dimension of the portion of the four portions that is located closest to the first side surface 113 will be described with reference to FIG.

[0058] First, the first principal surface side first external electrode 122a is divided into four equal parts in the width direction W (see the two-dot chain lines in FIG. 5). Next, for one of the four equal parts of the first principal surface side first external electrode 122a, distances e1 to e5 along the length direction L are measured at five equally spaced locations in the width direction W, from the outermost part of the surface of the end face side first external electrode 121 in the length direction L to the end of the first principal surface side first external electrode 122a. When measuring at these five locations, the spacing in the width direction W between adjacent measurement locations is set to be the same as the spacing when one of the four equal parts of the first principal surface side first external electrode 122a is divided into six equal parts in the width direction W.

[0059] Next, the average value of the five measured values ​​thus obtained is calculated, and the average value thus calculated becomes the average dimension described above.

[0060] Although the description is omitted here, the second principal surface side first external electrode 122b also has a configuration basically similar to that of the first principal surface side first external electrode 122a described above.

[0061] As shown in Figures 1 and 3, the side surface side first external electrode 123 is composed of a first side surface side first external electrode 123a which is a portion covering a portion of the first side surface 113, and a second side surface side first external electrode 123b which is a portion covering a portion of the second side surface 114.

[0062] The first side surface side first external electrode 123a has a first protrusion 123a1. The first protrusion 123a1 protrudes further than the ridge line side first external electrode 124 toward the center of the element body 110 in the longitudinal direction L. The end of the first protrusion 123a1 located toward the center of the element body 110 has an arc shape.

[0063] The configuration of the first side surface side first external electrode 123a and the first protrusion 123a1 (more specifically, the rate of change in length of the first side surface side first external electrode 123a in the longitudinal direction L and the protrusion length of the first protrusion 123a1) is basically the same as the configuration of the first main surface side first external electrode 122a and the first protrusion 122a1 described above.

[0064] That is, when the protruding length of the first protruding portion 123a1 is P1, the above formulas (1) and (2) are satisfied. In addition, the first side surface side first external electrode 123a is divided into four equal parts in the stacking direction T, and the rate of change in average dimension in the length direction L of each of the four parts of the first side surface side first external electrode 123a is 20% or less when comparing the average dimension of adjacent parts.

[0065] In the above, the protrusion length of the first protrusion 122a1 of the first main surface side first external electrode 122a and the protrusion length of the first protrusion 123a1 of the first side surface side first external electrode 123a are both represented as P1, but this does not necessarily mean that the protrusion length of the first protrusion 122a1 and the protrusion length of the first protrusion 123a1 are the same.

[0066] Although the description thereof will be omitted here, the second side surface side first external electrode 123b also has a configuration basically similar to that of the first side surface side first external electrode 123a described above.

[0067] If the thickness of the end face side first external electrode 121 is smaller than a predetermined thickness, it becomes difficult to ensure the reliability of the first external electrode 120 as an extraction electrode. On the other hand, assuming that the external size of the multilayer ceramic capacitor 100 is not changed, if the thickness of the end face side first external electrode 121 is larger than a predetermined thickness, the inner layer portion C becomes smaller by that amount, and it becomes difficult to ensure the capacitance of the multilayer ceramic capacitor 100.

[0068] 2 and 3, when the maximum thickness of the end surface side first external electrode 121 is t1, it is preferable that the end surface side first external electrode 121 satisfy the condition 0.006×L0≦t1≦0.015×L0, and more preferably t1≦0.008×L0. Furthermore, it is preferable that the thickness of the end surface side first external electrode 121 is 20 μm or more and 120 μm or less. When comparing the maximum thickness of the end surface side first external electrode 121 and the maximum thickness of the end surface side second external electrode 131, it is preferable that the difference therebetween be 20 μm or more.

[0069] When the maximum thickness of the main surface-side first external electrode 122 is t2 and the maximum thickness of the side surface-side first external electrode 123 is t3, it is preferable to satisfy at least one of the following formulas (3) and (4). This can improve the strength of the multilayer ceramic capacitor 100 against stress applied to the multilayer ceramic capacitor 100 mounted on an insulating substrate.

[0070] 0.008×T0≦t2 (3) 0.008×W0≦t3 (4)

[0071] More preferably, t2 and t3 are 30 μm or more and less than 40 μm. When comparing the maximum thickness of the main surface side first external electrode 122 with the maximum thickness of the main surface side second external electrode 132 described below, it is preferable that the difference between them be 5 μm or more. Similarly, when comparing the maximum thickness of the side surface side first external electrode 123 with the maximum thickness of the side surface side second external electrode 133 described below, it is preferable that the difference between them be 5 μm or more.

[0072] t1 and t2 can be confirmed, for example, by polishing the multilayer ceramic capacitor 100 so that the LT cross section of the multilayer ceramic capacitor 100 at the center in the width direction W is exposed, and then observing the portion of the cross section where the end face-side first external electrode 121 is located using an electron microscope or the like. t1 and t3 can also be confirmed, for example, by polishing the multilayer ceramic capacitor 100 so that the LW cross section of the multilayer ceramic capacitor 100 at the center in the stacking direction T is exposed, and then observing the cross section.

[0073] When checking t2, the maximum thickness of the first principal surface side first external electrode 122a and the maximum thickness of the second principal surface side first external electrode 122b are measured, and the smaller of these values ​​is used. Similarly, when checking t3, the maximum thickness of the first side surface side first external electrode 123a and the maximum thickness of the second side surface side first external electrode 123b are measured, and the smaller of these values ​​is used.

[0074] The length dimension along the longitudinal direction L from the outermost part of the surface of the end face side first external electrode 121 in the longitudinal direction L to the end part of the ridge side first external electrode 124 located on the second external electrode 130 side is 500 μm or more and 600 μm or less.

[0075] In the end face-side ridge line portion-side first external electrode 126, the difference in thickness between the thickest portion and the thinnest portion is preferably 2.0 μm or less.

[0076] The second external electrode 130 includes an end surface side second external electrode 131, a main surface side second external electrode 132, a side surface side second external electrode 133, a ridge side second external electrode 134, a corner side second external electrode 135, and an end surface side ridge side second external electrode 136. The main surface side second external electrode 132, the side surface side second external electrode 133, the ridge side second external electrode 134, the corner side second external electrode 135, and the end surface side ridge side second external electrode 136 are connected to the end surface side second external electrode 131.

[0077] The end surface-side second external electrode 131 covers the entire second end surface 116. The main surface-side second external electrode 132 covers a portion of the first main surface 111 located on the second end surface 116 side and a portion of the second main surface 112 located on the second end surface 116 side. The side surface-side second external electrode 133 covers a portion of the first side surface 113 located on the second end surface 116 side and a portion of the second side surface 114 located on the second end surface 116 side. The ridge portion-side second external electrode 134 covers a portion of the multiple ridge portions 110b located on the second end surface 116 side. The corner portion-side second external electrode 135 covers a portion of the multiple corner portions 110a located on the second end surface 116 side. The end surface-side ridge portion-side second external electrode 136 covers a portion of the multiple end surface-side ridge portions 110c located on the second end surface 116 side.

[0078] 1 and 2, the main surface side second external electrode 132 is composed of a first main surface side second external electrode 132a that is a portion covering part of the first main surface 111, and a second main surface side second external electrode 132b that is a portion covering part of the second main surface 112. The side surface side second external electrode 133 is composed of a first side surface side second external electrode 133a that is a portion covering part of the first main surface 111, and a second side surface side second external electrode that is a portion covering part of the second main surface 112.

[0079] The first main surface side second external electrode 132a has a second protrusion 132a1. The second protrusion 132a1 protrudes further than the ridge side second external electrode 134 toward the center of the element body 110 in the longitudinal direction L. The end of the second protrusion 132a1 located toward the center of the element body 110 has an arc shape.

[0080] Here, when the maximum protruding length of the second protruding portion 132a1 is P2, the following formulas (5) and (6) are satisfied.

[0081] 0.01×T0≦P2≦0.06×T0 (5) 0.01×W0≦P2≦0.06×W0 (6)

[0082] The second external electrode 132b on the second main surface side, the second external electrode 133a on the first side surface side, and the second external electrode on the second side surface side also have second protrusions having basically the same configuration as the second protrusion 132a1 of the second external electrode 132a on the first main surface side.

[0083] Although the description thereof is omitted here, the remaining configuration of the second external electrode 130 is also the same as the configuration of the first external electrode 120 described above.

[0084] <C. Method for Manufacturing a Multilayer Ceramic Capacitor> FIG. 6 is a flowchart showing a method for manufacturing a multilayer ceramic capacitor according to an embodiment. FIGS. 7 to 11 are schematic cross-sectional views for explaining each step of the manufacturing process shown in FIG. 6. Hereinafter, a method for manufacturing the multilayer ceramic capacitor 100 according to the present embodiment will be described. In FIGS. 7 to 11, the detailed structure inside the element body 110 is omitted.

[0085] First, as shown in FIG. 6, a ceramic dielectric slurry is prepared (step S1). Specifically, a ceramic dielectric powder, an additive powder, a binder resin, a dissolving solution, and the like are dispersed and mixed. Thereby, a ceramic dielectric slurry is prepared.

[0086] The ceramic dielectric powder is, for example, dielectric particles with a perovskite structure such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The additive powder is, for example, composed of at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. Examples of binder resins that can be used include polyurethane resins, urea resins, melamine resins, epoxy resins, vinyl acetate resins, acrylic resins, and water-based polymers such as polyvinyl alcohol (PVA) and polyvinyl butyral (PVB). These may be used alone or in combination. The ceramic dielectric slurry may be either solvent-based or water-based. When the ceramic dielectric slurry is used as a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and dispersant with the dielectric raw material dissolved in water.

[0087] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, gravure coater, microgravure coater, or the like, and then dried. This forms a ceramic dielectric sheet. From the viewpoint of miniaturization and high capacitance of the multilayer ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0088] Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to a ceramic dielectric sheet in a predetermined pattern. This results in a mother sheet having a predetermined internal electrode pattern on the ceramic dielectric sheet. The conductive paste contains Ni powder, a solvent, a dispersant, a binder, etc., and is prepared to have a constant viscosity. PVA, PVB, etc., is used as the binder. The conductive paste can be applied by screen printing, inkjet printing, gravure printing, etc. From the viewpoint of miniaturization and high capacity of the multilayer ceramic capacitor, the thickness of the internal electrode pattern is preferably 0.3 μm or more and 0.8 μm or less. In addition to mother sheets having internal electrode patterns, ceramic dielectric sheets that have not been subjected to step S3 can also be prepared as mother sheets.

[0089] Next, a plurality of mother sheets are stacked (step S4). In detail, a predetermined number of mother sheets, each consisting of only a ceramic dielectric sheet and without an internal electrode pattern, are stacked to a thickness of, for example, 10 μm or more and 30 μm or less. A predetermined number of mother sheets, each having an internal electrode pattern, are stacked on top of these. The number of stacked mother sheets, each having an internal electrode pattern, is, for example, 1 sheet or more and 1000 sheets or less. A predetermined number of mother sheets, each consisting of only a ceramic dielectric sheet and without an internal electrode pattern, are stacked on top of these to a thickness of, for example, 10 μm or more and 30 μm or less. In this way, a mother sheet group is formed.

[0090] Next, the mother sheet group is pressed together to form a dielectric block (step S5). Specifically, the mother sheet group is pressed in the stacking direction using a hydrostatic press or a rigid press, and is pressed together. This forms the dielectric block. At this time, the ceramic dielectric sheets are pressed at a predetermined temperature, so that the ceramic dielectric sheets adhere to each other. Furthermore, a ceramic dielectric sheet of a certain thickness is placed on the outermost layer in the stacking direction and pressed. This makes it possible to protect the dielectric sheet on which the internal electrode patterns are formed.

[0091] Next, the dielectric block is divided into chips (step S6). Specifically, the dielectric block is divided into a matrix shape by press-cutting, dicing, or laser cutting, thereby being separated into a plurality of chips. When dividing the dielectric block, the dielectric block may be divided in a softened state by heating.

[0092] Next, the chip is fired (step S7). Specifically, the chip is heated to fire the dielectric material and conductive material contained in the chip, forming the element part 110. The firing temperature is, for example, 900°C or higher and 1300°C or lower. The firing temperature is set appropriately depending on the dielectric material and conductive material.

[0093] Next, external electrodes are formed (step S8), which includes steps S81 to S84 described below.

[0094] First, as shown in FIGS. 7 to 9, the element body 110 is immersed in the conductive paste for the first time (step S81). Specifically, one of the first end face 115 and the second end face 116 of the element body 110 is immersed in the conductive paste 201 (see the arrow in FIG. 8), and then the element body 110 is lifted up from the conductive paste 201 (see the arrow in FIG. 9). As a result, a first conductive paste layer 1001 made of the conductive paste 201 is applied to the end face and the first main face 111, the second main face 112, the first side face 113, and the second side face 114 of the adjacent portions. As an example, in the present embodiment, the first end face 115 is immersed in the conductive paste 201.

[0095] Here, the thickness of conductive paste 201 prepared in the first dipping is preferably thinner than the thickness of conductive paste 202 prepared in the second or subsequent dipping, which will be described later. That is, it is preferable that dimension r1 in Fig. 7 is smaller than dimension r2 in Fig. 10. This effectively prevents air bubbles from being trapped in first conductive paste layer 1001.

[0096] 10 and 11, the element body is immersed in the conductive paste for the second time (step S82). Specifically, the first end surface 115, to which the first conductive paste layer 1001 has been applied in step S81, is immersed in the conductive paste 202 (see the arrow in FIG. 10), and then the element body 110 is lifted up from the conductive paste 202 (see the arrow in FIG. 11). As a result, the second conductive paste layer 1002 made of the conductive paste 202 is wetted and applied to the first end surface 115, the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114 so as to overlap the first conductive paste layer 1001.

[0097] In this embodiment, the element body is dipped in the conductive paste a total of two times. By dipping the element body in the conductive paste multiple times in this manner, the first protrusion 122a1 provided on the first main surface side first external electrode 122a can be formed so as to satisfy the above formulas (1) and (2). When the second conductive paste layer 1002 wets and rises from the first end face 115 side onto the first main surface 111, the second conductive paste layer 1002 needs to climb over the first conductive paste layer 1001, which makes it possible to prevent the second conductive paste layer 1002 from being applied to the first main surface 111 more than necessary.

[0098] After step S82, the element body may be repeatedly immersed in the conductive paste.

[0099] Next, the above-described steps S81 and S82 are similarly performed on the second end surface 116. At this time, the second protrusion 132a1 provided on the first main surface side second external electrode 132a, etc. can also be formed so as to satisfy the above formulas (5) and (6) by immersing the element body in the conductive paste multiple times.

[0100] Next, the first and second conductive paste layers are baked (step S83). Specifically, the first conductive paste layer 1001 and the second conductive paste layer 1002 applied to the first end face 115 and its periphery and the second end face 116 and its periphery are heated, thereby forming a baked layer. The baking temperature is, for example, 700°C or higher and 900°C or lower. Note that the baking temperature can be appropriately changed according to the dielectric material and the conductive material.

[0101] Next, a plating layer is provided on the surface of the baked layer (step S84). By going through the steps described above, the multilayer ceramic capacitor 100 according to the present embodiment can be manufactured.

[0102] <D. Parentheses> In the multilayer ceramic capacitor 100 according to the present embodiment, as described above, when the maximum distance between the first main surface 111 and the second main surface 112 of the element body 110 is T0 and the maximum distance between the first side surface 113 and the second side surface 114 is W0, T0 is 2.5 mm or more and W0 is 2.5 mm or more. Also, when the maximum protrusion length of the first protrusion 122a1 is P1, the above-described formulas (1) and (2) are satisfied.

[0103] Thus, in the multilayer ceramic capacitor 100 in which the first end face 115 and the second end face 116 of the element body 110 are configured to be relatively large, by configuring the maximum protrusion length of the first protrusion 122a1 to be relatively small, it is possible to improve the reliability of the multilayer ceramic capacitor 100 after mounting.

[0104] That is, in a multilayer ceramic capacitor 100 mounted on an insulating substrate, if the insulating substrate warps, stress tends to concentrate at the ends of the first external electrode 120 extending to the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114 of the element body 110, which ends are located toward the center of the element body 110 in the longitudinal direction L. For example, in the case of the first main surface side first external electrode 122a, the stress tends to concentrate at the ends of the first protrusions 122a1 in the longitudinal direction L. The same applies to the second main surface side first external electrode 122b, the first side surface side first external electrode 123a, and the second side surface side first external electrode 123b.

[0105] In this regard, in the multilayer ceramic capacitor 100 according to this embodiment, the maximum protruding length of the first protruding portion 122a1 is configured to be considerably small as described above. This makes it possible to effectively prevent the stress from concentrating on the end portion of the first protruding portion 122a1, compared to when the maximum protruding length of the first protruding portion 122a1 is configured to be considerably large. This effect is also achieved in the second main surface side first external electrode 122b, the first side surface side first external electrode 123a, and the second side surface side first external electrode 123b.

[0106] Therefore, by configuring as described above, it is possible to obtain a multilayer ceramic capacitor with improved reliability after mounting.

[0107] Furthermore, in the multilayer ceramic capacitor 100 according to this embodiment, as described above, the first-main-surface-side second external electrode 132a has the second protruding portion 132a1, and when the maximum protruding length of the second protruding portion 132a1 is P2, the above-described formulas (5) and (6) are satisfied. This configuration effectively prevents the above-described stress from concentrating on the end of the second protruding portion 132a1 in the length direction L. This effect is also achieved in the second-main-surface-side second external electrode 132b, the first-side-face-side second external electrode 133a, and the second-side-face-side second external electrode.

[0108] Therefore, damage to both the first external electrode 120 and the second external electrode 130 provided on both ends of the element body 110 can be effectively prevented.

[0109] In the multilayer ceramic capacitor 100 according to the present embodiment described above, the first protrusion satisfying the above formulas (1) and (2) is provided on all of the first main surface side first external electrode 122a, the second main surface side first external electrode 122b, the first side surface side first external electrode 123a, and the second side surface side first external electrode 123b. However, such a first protrusion may be provided on at least one of the first main surface side first external electrode 122a, the second main surface side first external electrode 122b, the first side surface side first external electrode 123a, and the second side surface side first external electrode 123b. In this case, it is preferable that the first protrusion is provided on a portion of the first external electrode 120 located opposite the mounting surface (the second main surface 112 in this embodiment). This is because stress concentration is particularly likely to occur in this portion of the first external electrode 120.

[0110] Furthermore, in the multilayer ceramic capacitor 100 according to the present embodiment described above, the second main surface 112 is the mounting surface, but the mounting surface is not limited to the second main surface 112, and may be any one of the first main surface 111, the first side surface 113, and the second side surface 114.

[0111] Furthermore, in the multilayer ceramic capacitor 100 according to the present embodiment described above, the case where the second external electrode 130 is provided with the second protrusion 132a1, etc. has been exemplified, but the second external electrode 130 does not necessarily have to be provided with the second protrusion 132a1, etc.

[0112] Furthermore, in the multilayer ceramic capacitor 100 according to the present embodiment described above, the first external electrode 120 and the second external electrode 130 include the base electrode layer 160 and the plating layer 170, but the first external electrode 120 and the second external electrode 130 may be composed of only the base electrode layer 160.

[0113] (First Modification) Fig. 12 is a schematic cross-sectional view of a multilayer ceramic capacitor according to a first modified example. More specifically, Fig. 12 is a schematic cross-sectional view of a portion of the multilayer ceramic capacitor according to the first modified example, which corresponds to Fig. 2. Hereinafter, a multilayer ceramic capacitor 100A according to the first modified example based on the above-described embodiment will be described with reference to Fig. 12.

[0114] As shown in FIG. 12, the multilayer ceramic capacitor 100A according to this modification differs from the multilayer ceramic capacitor 100 according to the above-described embodiment in the configuration of the first end face 115 and the second end face 116 of the element body portion 110.

[0115] More specifically, in the multilayer ceramic capacitor 100A, the central portions of the first end face 115 and the second end face 116 are recessed. Accordingly, the end face-side first external electrode 121 is recessed along the recess 115a provided in the first end face 115. Similarly, the end face-side second external electrode 131 is recessed along the recess 116a provided in the second end face 116.

[0116] The depth of recess 115a is preferably 20 μm or less. This is because by configuring recess 115a to be considerably deep, the film thickness of end face side first external electrode 121 formed along recess 115a becomes considerably thin, thereby suppressing the occurrence of solder erosion, etc. The same applies to the depth of recess 116a.

[0117] Even in this configuration, effects similar to those described in the above-described embodiments can be obtained, and a multilayer ceramic capacitor with improved reliability after mounting can be obtained.

[0118] Furthermore, in this configuration, when the multilayer ceramic capacitor 100A is mounted on an insulating substrate, the solder fillets enter and are fixed to the recessed portions of the end face side first external electrode 121 and the end face side second external electrode 131. This increases the contact area between the solder fillets and the end face side first external electrode 121 and the end face side second external electrode 131. This allows the multilayer ceramic capacitor 100A to be more firmly joined to the insulating substrate.

[0119] In this configuration, when the element body is immersed in the conductive paste for the first time (step S81), air bubbles are likely to be trapped in the first conductive paste layer 1001 in the portions applied to the recesses 115a and 116a. In this regard, when manufacturing the multilayer ceramic capacitor 100A according to this modification, the element body is also immersed in the conductive paste multiple times. This effectively prevents air bubbles from being trapped, allowing the formation of external electrodes that are free of voids with a diameter of 1 μm or more.

[0120] Furthermore, in this modified example, the case where the central portions of each of first end face 115 and second end face 116 are recessed has been exemplified, but only one of first end face 115 and second end face 116 may be recessed.

[0121] (Second Modification) 13 is a schematic plan view of a multilayer ceramic capacitor according to a second modified example. Hereinafter, a multilayer ceramic capacitor 100B according to a second modified example based on the above-described embodiment will be described with reference to FIG.

[0122] As shown in FIG. 13, the multilayer ceramic capacitor 100B according to this modified example differs from the multilayer ceramic capacitor 100 according to the above-described embodiment in the relationship between the first protrusion 122a1 of the first main surface side first external electrode 122a and the second protrusion 132a1 of the first main surface side second external electrode 132a.

[0123] More specifically, in the multilayer ceramic capacitor 100B, the maximum protrusion length P1 of the first protrusion 122a1 is configured to be smaller than the maximum protrusion length P2 of the second protrusion 132a1. In this case, P1 is preferably smaller than P2 by 20 μm or more.

[0124] Even in this configuration, effects similar to those described in the above-described embodiments can be obtained, and a multilayer ceramic capacitor with improved reliability after mounting can be obtained.

[0125] Furthermore, with this configuration, it is possible to further disperse the stress that occurs in the first external electrode 120 due to warping of the insulating substrate as described above.

[0126] In this modification, although the case where P1 is smaller than P2 has been exemplified, P2 may be configured to be smaller than P1. In other words, in this modification, it is sufficient that one of P1 and P2 is configured to be smaller than the other.

[0127] (Addendum) The characteristic configurations of the multilayer ceramic capacitors disclosed in the above-described embodiments and their modifications can be summarized as follows.

[0128] [Appendix 1] an element body portion including a plurality of dielectric layers and a plurality of internal electrode layers stacked in a stacking direction, and having a first main surface and a second main surface facing each other in the stacking direction, a first side surface and a second side surface facing each other in a width direction perpendicular to the stacking direction, and a first end surface and a second end surface facing each other in a length direction perpendicular to the stacking direction and the width direction; a first external electrode extending from the first end surface to each of the first main surface, the second main surface, the first side surface, and the second side surface, and electrically connected to some of the internal electrode layers of the plurality of internal electrode layers; the body portion includes a ridge portion which is a portion where two adjacent surfaces among the first main surface, the second main surface, the first side surface, and the second side surface intersect, The first external electrode is an end face side first external electrode covering the first end face; a main surface side first external electrode connected to the end surface side first external electrode and covering a part of the first main surface and a part of the second main surface; a side surface side first external electrode connected to the end surface side first external electrode and covering a part of the first side surface and a part of the second side surface; a ridge line side first external electrode connected to the end face side first external electrode and covering the ridge line portion, at least one of the main surface side first external electrode and the side surface side first external electrode has a first protruding portion that protrudes further than the ridge line side first external electrode toward a center portion of the element body portion in the length direction, When a maximum distance between the first main surface and the second main surface is T0, T0 is 2.5 mm or more, When the maximum distance between the first side surface and the second side surface is W0, W0 is 2.5 mm or more, The multilayer ceramic capacitor satisfies the following formulas (1) and (2), where P1 is the maximum protruding length of the first protruding portion. 0.01×T0≦P1≦0.06×T0 (1) 0.01×W0≦P1≦0.06×W0 (2)

[0129] [Appendix 2] 2. The multilayer ceramic capacitor according to claim 1, wherein the condition t1≦0.008×L0 is satisfied, where L0 is the maximum distance between the first end face and the second end face, and t1 is the maximum thickness of the end face-side first external electrode.

[0130] [Appendix 3] The multilayer ceramic capacitor according to appendix 1 or 2, wherein, when the maximum thickness of the first external electrode on the main surface side is t2 and the maximum thickness of the first external electrode on the side surface side is t3, at least one of the following formulas (3) and (4) is satisfied: 0.008×T0≦t2 (3) 0.008×W0≦t3 (4)

[0131] [Appendix 4] 4. The multilayer ceramic capacitor according to claim 1, wherein the rate of change in average lengthwise dimension of each of four portions of the main surface side first external electrode obtained by dividing the main surface side first external electrode into four equal parts in the width direction, when the average lengthwise dimension of adjacent portions is compared, is 20% or less.

[0132] [Appendix 5] 5. The multilayer ceramic capacitor according to any one of appendices 1 to 4, wherein the rate of change in average lengthwise dimension of each of the four portions of the side-face-side first external electrode obtained by dividing the side-face-side first external electrode into four equal parts in the stacking direction, when comparing the average dimensions of adjacent portions, is 20% or less.

[0133] [Appendix 6] further comprising a second external electrode extending from the second end surface to each of the first main surface, the second main surface, the first side surface, and the second side surface, and electrically connected to another part of the internal electrode layers of the plurality of internal electrode layers; The second external electrode is an end face side second external electrode covering the second end face; a main surface side second external electrode connected to the end surface side second external electrode and covering a part of the first main surface and a part of the second main surface; a side surface side second external electrode connected to the end surface side second external electrode and covering a part of the first side surface and a part of the second side surface; a ridge line side second external electrode connected to the end face side second external electrode and covering the ridge line portion, at least one of the main surface side second external electrode and the side surface side second external electrode has a second protruding portion that protrudes further than the ridge line side second external electrode toward the center portion of the element body portion in the length direction, 6. The multilayer ceramic capacitor according to any one of appendixes 1 to 5, wherein, when the maximum protruding length of the second protruding portion is P2, one of P1 and P2 is smaller than the other.

[0134] [Appendix 7] 7. The multilayer ceramic capacitor according to claim 1, wherein the first end face and the second end face each have a recessed central portion.

[0135] (Other forms, etc.) The shape, configuration, size, number, material, etc. of each part shown in the above-described embodiment of the present invention and its modified examples can be changed in various ways without departing from the spirit of the present invention.

[0136] Furthermore, the characteristic configurations shown in the above-described embodiments of the present invention and their modifications can naturally be combined with each other within the scope of the present invention.

[0137] As such, the above-described embodiments and their modifications disclosed herein are illustrative in all respects and are not limiting. The technical scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0138] 100, 100A, 100B Multilayer ceramic capacitor, 110 element body portion, 110a corner portion, 110b ridge portion, 110c end face side ridge portion, 111 first main surface, 112 second main surface, 113 first side surface, 114 second side surface, 115 first end surface, 115a recessed portion, 116 second end surface, 116a recessed portion, 117a first outer layer, 117b second outer layer, 118 internal electrode layer, 118a first internal electrode layer, 118a1 first opposing portion, 118a2 first lead portion, 118b second internal electrode layer, 118b1 second opposing portion, 118b2 second lead portion, 119 dielectric layer, 120 first external electrode, 121 end face side first external electrode, 122 Main surface side first external electrode, 122a First main surface side first external electrode, 122a1 First protrusion, 122b Second main surface side first external electrode, 123 Side surface side first external electrode, 123a First side surface side first external electrode, 123a1 First protrusion, 123b Second side surface side first external electrode, 124 Ridge line side first external electrode, 125 Corner side first external electrode, 126 Edge side first external electrode, 130 Second external electrode, 131 End side second external electrode, 132 Main surface side second external electrode, 132a First main surface side second external electrode, 132a1 Second protrusion, 132b Second main surface side second external electrode, 133 Side side second external electrode, 133a Second external electrode on first side surface, 134 Second external electrode on ridgeline side, 135 Corner-side second external electrode, 136 end-face-side ridge-side second external electrode, 160 base electrode layer, 170 plating layer, 201, 202 conductive paste, 1001 first conductive paste layer, 1002 second conductive paste layer, C inner layer portion.

Claims

1. an element body portion including a plurality of dielectric layers and a plurality of internal electrode layers stacked in a stacking direction, and having a first main surface and a second main surface opposing each other in the stacking direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the stacking direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the stacking direction and the width direction; a first external electrode extending from the first end surface to each of the first main surface, the second main surface, the first side surface, and the second side surface, and electrically connected to some of the plurality of internal electrode layers, the element body portion includes a ridge portion which is a portion where two adjacent surfaces among the first main surface, the second main surface, the first side surface, and the second side surface intersect, The first external electrode is an end face side first external electrode covering the first end face; a main surface side first external electrode connected to the end surface side first external electrode and covering a part of the first main surface and a part of the second main surface; a side surface side first external electrode connected to the end surface side first external electrode and covering a part of the first side surface and a part of the second side surface; a ridge line side first external electrode connected to the end face side first external electrode and covering the ridge line portion, at least one of the main surface side first external electrode and the side surface side first external electrode has a first protruding portion that protrudes further than the ridge line side first external electrode toward a center portion of the element body portion in the length direction, When a maximum distance between the first main surface and the second main surface is defined as T0, T0 is 2.5 mm or more, When the maximum distance between the first side surface and the second side surface is W0, W0 is 2.5 mm or more, A multilayer ceramic capacitor, wherein when the maximum protrusion length of the first protrusion is P1, the following formulas (1) and (2) are satisfied: 0.01 × T0 ≦ P1 ≦ 0.06 × T0 (1) 0.01 × W0 ≦ P1 ≦ 0.06 × W0 (2)

2. 2. The multilayer ceramic capacitor according to claim 1, wherein a condition of t1≦0.008×L0 is satisfied, where L0 is a maximum distance between the first end face and the second end face, and t1 is a maximum thickness of the end face-side first external electrode.

3. 2. The multilayer ceramic capacitor according to claim 1, wherein, when a maximum thickness of the main surface side first external electrode is t2 and a maximum thickness of the side surface side first external electrode is t3, at least one of the following formulas (3) and (4) is satisfied: 0.008 × T0 ≦ t2 (3) 0.008 × W0 ≦ t3 (4)

4. 2. The multilayer ceramic capacitor according to claim 1, wherein a rate of change in average length dimension of each of four portions of the main surface side first external electrode obtained by dividing the main surface side first external electrode into four equal parts in the width direction, when the average dimension of adjacent portions is compared, is 20% or less.

5. 2. The multilayer ceramic capacitor according to claim 1, wherein a rate of change in average length dimension of each of four portions of the side surface-side first external electrode obtained by dividing the side surface-side first external electrode into four equal parts in the stacking direction when the average dimensions of adjacent portions are compared is 20% or less.

6. a second external electrode extending from the second end surface to each of the first main surface, the second main surface, the first side surface, and the second side surface, and electrically connected to another part of the plurality of internal electrode layers, The second external electrode is an end surface side second external electrode covering the second end surface; a main surface side second external electrode connected to the end surface side second external electrode and covering a part of the first main surface and a part of the second main surface; a side surface side second external electrode connected to the end surface side second external electrode and covering a part of the first side surface and a part of the second side surface; a ridge line side second external electrode connected to the end face side second external electrode and covering the ridge line portion, at least one of the main surface side second external electrode and the side surface side second external electrode has a second protruding portion that protrudes further than the ridge line side second external electrode toward the center portion of the element body portion in the length direction, 2. The multilayer ceramic capacitor according to claim 1, wherein when a maximum protruding length of said second protruding portion is defined as P2, one of said P1 and said P2 is smaller than the other.

7. 2. The multilayer ceramic capacitor according to claim 1, wherein the first end face and the second end face each have a recessed central portion.

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