Resin molding apparatus, manufacturing apparatus of resin molded article, and manufacturing method of resin molded article

Abstract

To provide a resin molding apparatus capable of preventing a liquid resin having a thermosetting property from curing earlier than an appropriate timing, and to provide a manufacturing apparatus of a resin molded article, and a manufacturing method of the resin molded article.SOLUTION: A resin molding apparatus according to the present invention comprises: a mold including an upper mold, a lower mold facing the upper mold, and an intermediate plate provided between the upper mold and the lower mold; a film supply mechanism for supplying a release film between the intermediate plate and the lower mold; a liquid resin supply mechanism for supplying a liquid resin having a thermosetting property onto the release film; and a controller. The controller brings the release film into contact with the lower mold by pressing the intermediate plate against the release film, and while the release film and the lower mold are in contact with each other, supplies the liquid resin onto the release film from the liquid resin supply mechanism, brings the release film into close contact with a cavity of the lower mold, and causes the upper mold and the lower mold to be clamped.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus, a resin molded product manufacturing apparatus, and a resin molded product manufacturing method. [Background technology]

[0002] Patent Document 1 discloses a resin molding device. This resin molding device includes an upper mold and a lower mold arranged opposite each other. A film is fed between the upper mold and the lower mold. In this resin molding device, resin molding is performed by clamping the upper mold and the lower mold together with a resin material supplied onto the film (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-183443 Summary of the Invention [Problem to be solved by the invention]

[0004] In the resin molding device disclosed in Patent Document 1, the lower mold is heated, and the resin material is supplied onto the film while the film is adsorbed onto the lower mold. In such a configuration, if, for example, a thermosetting liquid resin is used as the resin material, the liquid resin supplied onto the film may harden earlier than the appropriate timing.

[0005] The present invention has been made to solve such problems, and its purpose is to provide a resin molding apparatus, a manufacturing apparatus for a resin molded product, and a manufacturing method for a resin molded product that can prevent a liquid thermosetting resin from curing prematurely. The liquid resin in this invention refers to a resin that exists as a liquid at room temperature (e.g., 5 to 35°C). [Means for solving the problem]

[0006] The resin molding apparatus of the present invention comprises a molding die including an upper die, a lower die opposing the upper die, and an intermediate plate provided between the upper die and the lower die; a film supply mechanism that supplies a release film between the intermediate plate and the lower die; a liquid resin supply mechanism that supplies a thermosetting liquid resin onto the release film; and a control unit, wherein the control unit is configured to press the intermediate plate against the release film, bringing the release film into contact with the lower die, and while the release film and the lower die are in contact, to supply the liquid resin from the liquid resin supply mechanism onto the release film, to adhere the release film to the cavity of the lower die, and to clamp the upper die and the lower die together.

[0007] The method for manufacturing a resin molded product according to the present invention includes the steps of attaching a substrate to an upper mold, supplying a release film between the upper mold and the lower mold, supplying a thermosetting liquid resin onto the release film, pressing the release film to bring the release film into contact with the lower mold, supplying the liquid resin from the liquid resin supply mechanism onto the release film while the release film and the lower mold are in contact, adhering the release film to the cavity of the lower mold, and clamping the upper mold and the lower mold together. [Effects of the Invention]

[0008] According to the present invention, it is possible to prevent the thermosetting liquid resin from curing earlier than the appropriate timing. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. [Figure 2] FIG. [Figure 3] FIG. 1 is a view including cross sections of an upper mold, a lower mold, and an intermediate plate. [Figure 4] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. [Figure 5] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. [Figure 6] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. [Figure 7] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. [Figure 8] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. [Figure 9] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. [Figure 10] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. [Figure 11] 1A to 1C are cross-sectional views showing a manufacturing procedure for a resin molded product. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a resin molding apparatus according to the present invention will be described below with reference to the drawings.

[0011] <1. Overall configuration of resin molding equipment> 1 is a front view of a resin molding apparatus according to this embodiment. The resin molding apparatus 10 is configured to manufacture a resin molded product by using a so-called compression molding method.

[0012] As shown in FIG. 1, the resin molding apparatus 10 includes a base 100, tie bars 110, an upper platen 120, a lower platen 130, a mold clamping mechanism 200, a molding die 300, a film supply mechanism 500, a control unit 700, and a liquid resin supply mechanism 900.

[0013] The base 100 is a plate-like member that is rectangular in plan view. Each of the multiple (four) tie bars 110 is a rod-like member that extends in the vertical direction. The multiple tie bars 110 are fixed to the four corners of the base 100. The upper platen 120 is a plate-like member that is rectangular in plan view, and is fixed to the top of the multiple tie bars 110. The lower platen 130 is a plate-like member that is rectangular in plan view, and is attached to the tie bars 110 between the base 100 and the upper platen 120 in a state where it can move in the vertical direction. In this way, the upper platen 120 and the lower platen 130 are arranged above the base 100 so as to face each other.

[0014] The mold clamping mechanism 200 is fixed to the upper surface of the base 100. The mold clamping mechanism 200 is configured to raise and lower the lower platen 130 along the tie bars 110 in order to clamp and open the forming mold 300. In other words, the mold clamping mechanism 200 is configured to clamp the forming mold 300. The mold clamping mechanism 200 can be realized, for example, by a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a link mechanism.

[0015] The molding die 300 has a metallic upper die 310, a metallic lower die 320 facing the upper die 310, and a metallic intermediate plate 323 facing both the upper die 310 and the lower die 320. The upper die 310 is fixed to the lower surface of the upper platen 120, and the lower die 320 is fixed to the upper surface of the lower platen 130. Each of the upper die 310 and the lower die 320 is provided with a heating unit (heater) 350, and is heated by the heating unit 350. The intermediate plate 323 is a frame-shaped member with a through-hole that is rectangular in plan view formed in the center, and is supported so as to move up and down between the upper die 310 and the lower die 320 in order to sandwich the release film 400 between it and the lower die 320. The molding die 300 will be described in detail later.

[0016] The film supply mechanism 500 is configured to supply a long release film 400 between the intermediate plate 323 and the lower mold 320. The material of the release film 400 is a resin material having properties such as heat resistance, releasability, flexibility, and extensibility, and examples of such materials include PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), polypropylene, polystyrene, and polyvinylidene chloride.

[0017] The film supply mechanism 500 includes a delivery mechanism 510 , a winding mechanism 520 , a delivery roller 530 , and a winding roller 540 .

[0018] The feed-out mechanism 510 is configured to feed the release film 400 before use between the intermediate plate 323 and the lower mold 320. For example, the feed-out mechanism 510 has a feed-out roll around which the release film 400 before use is wound, and a motor (not shown) that rotates the feed-out roll. On the other hand, the winding mechanism 520 is configured to wind up the release film 400 that has been used in resin molding. For example, the winding mechanism 520 has a winding roll around which the used release film 400 is wound, and a motor (not shown) that rotates the winding roll. The torque of each motor is controlled so that the release film 400 is fed in the traveling direction F. Furthermore, when the release film 400 is fed, an appropriate tension is applied to the release film 400 in the traveling direction F by controlling the torque of each motor.

[0019] A feed-out roller 530 is disposed above the feed mechanism 510, and a take-up roller 540 is disposed above the take-up mechanism 520. The release film 400 fed from the feed-out mechanism 510 is stretched over the feed-out roller 530 and the take-up roller 540 and taken up by the take-up mechanism 520. The feed-out roller 530 and the take-up roller 540 are disposed slightly above the lower mold 320, and the release film 400 is configured to pass slightly above the lower mold 320. Furthermore, the intermediate plate 323 is disposed slightly above the feed-out roller 530 and the take-up roller 540 as an initial position, and is configured to press the release film 400 from above, as will be described later.

[0020] The feed roller 530 and the take-up roller 540 are each configured to apply tension to the release film 400 and to transport the release film 400 between the intermediate plate 323 and the lower mold 320. The vertical position of the film supply mechanism 500 relative to the lower platen 130 is fixed.

[0021] The liquid resin supply mechanism 900 is a so-called dispenser, and is configured to dispense a thermosetting liquid resin onto the release film 400. The liquid resin supply mechanism 900 is capable of dispensing the liquid resin while moving in a planar direction (left and right direction in FIG. 1) in the region between the upper mold 310 and the lower mold 320, and is also capable of retracting to a region other than between the upper mold 310 and the lower mold 320. For example, after the liquid resin supply mechanism 900 has completed supplying the liquid resin onto the release film 400, it retracts to the outside from between the upper mold 310 and the lower mold 320. Note that, hereinafter, the nozzle 900 that dispenses the liquid resin may be illustrated as the liquid resin supply mechanism.

[0022] The liquid resin is not particularly limited, but a low viscosity is preferable. As will be described later, when resin-sealing a substrate 800 on which an LED chip is mounted, for example, a liquid resin with a viscosity of 50 Pa·s or less is used. When resin-sealing a substrate on which a semiconductor integrated circuit chip is mounted, a liquid resin with a viscosity of more than 50 Pa·s is used because a filler is added to ensure performance after sealing.

[0023] The control unit 700 is configured to control the entire resin molding apparatus 10. The control unit 700 controls, for example, the mold clamping mechanism 200, the film supply mechanism 500, the liquid resin supply mechanism 900, etc. The control unit 700 includes a hardware processor such as a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory), and is configured to execute information processing based on programs and various data. The control unit 700 may be located anywhere within the resin molding apparatus 10, or may be configured by multiple computers.

[0024] <2. Specific configuration of the molding die> Fig. 2 is a plan view of a portion of lower mold 320, and Fig. 3 is a view including cross sections of upper mold 310, lower mold 320, and intermediate plate 323. In Fig. 3, the cross section of a portion of lower mold 320 corresponds to the cross section taken along line AA in Fig. 2. Below, lower mold 320, intermediate plate 323, and upper mold 310 will be described in detail.

[0025] <2-1. Lower mold> 2 and 3, the lower mold 320 has a base 340, a bottom member 321 that is rectangular in plan view and fixed to the upper surface of the base 340, and a side member 322 that is formed in a frame shape so as to surround the periphery of the bottom member 321. The upper surface of the side member 322 is located higher than the upper surface of the bottom member 321. As a result, the upper surface of the bottom member 321 forms the bottom surface of a cavity 326 of the lower mold 320, and the inner wall surfaces of the side member 322 form the side surfaces of the cavity 326.

[0026] The side member 322 is fixed to the base 340 via an elastic member 322a such as a spring, etc. Therefore, when pressed by the upper mold 310 as described below, it is movable downward.

[0027] A frame-shaped presser member 327 is disposed outside the side surface member 322 with a gap therebetween, surrounding the side surface member 322. The outer shape of the presser member 327 is substantially the same as a support portion 313 of the upper mold 310 (described later), and is configured so that the support portion 313 and the presser member 327 face each other when the upper mold 310 and the lower mold 320 approach each other. The presser member 327 is also fixed to the base 340 via an elastic member 327a such as a spring. Therefore, the presser member 327 can move downward when pressed by the intermediate plate 323 (described later). However, the upper surface of the presser member 327 is located above the upper surface of the side surface member 322 in the initial position.

[0028] A frame-shaped first seal fixing part 329 is arranged outside the pressing member 327 with a gap therebetween so as to surround the pressing member 327. A seal member 329a is provided on the upper surface of the first seal fixing part 329. The upper surface of the first seal fixing part 329 is located lower than the upper surface of the side member 322.

[0029] In the base 340, a plurality of first suction passages 324 are formed between the pressing member 327 and the first seal fixing portion 329, and these first suction passages 324 are connected to a vacuum pump 330. A small gap is formed between the bottom member 321 and the side member 322, and this gap is connected to a second suction passage 325 formed inside the bottom member 321 and the base 340. This second suction passage 325 is also connected to the vacuum pump 330. When the vacuum pump 330 performs suction via the first and second suction passages 324, 325, the release film 400 arranged in the cavity 326 is sucked and adsorbed to the bottom and side surfaces of the cavity 326. The configuration including the first and second suction passages 324, 325 and the vacuum pump 330 is an example of the "adsorption mechanism" of the present invention.

[0030] <2-2. Intermediate plate> Intermediate plate 323 is formed in a plate shape that is larger than the outer shape of lower mold 320, and has a rectangular through-hole 323a formed in the center. The position of the inner wall surface of through-hole 323a is approximately aligned with the position of the inner wall surface of pressing member 327. A support member 328 that supports intermediate plate 323 is connected to the periphery of the lower surface of intermediate plate 323, and is configured so that intermediate plate 323 moves up and down as this support member 328 moves up and down. Note that because support member 328 is provided on part of the periphery of intermediate plate 323, release film 400 does not interfere with support member 328, as shown in FIG. 3 .

[0031] <2-3. Upper mold> The upper mold 310 has a base 311 that is rectangular in plan view, a frame-shaped second seal fixing portion 312 that is provided along the periphery of the lower surface of the base 311, and a support portion 313 that is rectangular in plan view and that is provided on the lower surface of the base 311, inside the second seal fixing portion 312. A seal member 314 is provided on the lower surface of the second seal fixing portion 312. The second seal fixing portion 312 is positioned opposite to the first seal fixing portion 329 of the lower mold 320.

[0032] A plurality of intake ports (not shown) are formed on the lower surface of the support portion 313 so that the substrate 800 can be sucked therethrough.

[0033] The configuration of the substrate 800 is not particularly limited, but for example, a plurality of chips 810 configured with semiconductor integrated circuits, light-emitting elements such as LEDs, etc. are arranged on the substrate 800. The shape of the substrate 800 is not particularly limited, but for example, it is rectangular or circular. Furthermore, the substrate 800 is, for example, a semiconductor substrate (such as a silicon wafer), a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, or a wiring substrate, and may include a carrier of a plate-like member used in a fan-out wafer-level package (FO-WLP) or a fan-out panel-level package (FO-PLP).

[0034] <3. Manufacturing procedure for resin molded products> Next, a procedure for manufacturing a resin molded product using the resin molding apparatus configured as above will be described with reference to Figures 4 to 11. Figures 4 to 11 are cross-sectional views showing the procedure for manufacturing a resin molded product.

[0035] The processing described below is performed in response to commands from the control unit 700. First, the delivery mechanism 510 and the winding mechanism 520 are driven to place a new release film 400 above the lower mold 320. Next, as shown in FIG. 4, the intermediate plate 323 is lowered so that the lower surface of the intermediate plate 323 comes into contact with the release film 400. Then, the intermediate plate 323 is further lowered to press the release film 400, and as shown in FIG. 5, the release film 400 is pressed against the upper surface of the pressing member 327. As a result, the release film 400 is sandwiched between the intermediate plate 323 and the pressing member 327.

[0036] When the intermediate plate 323 is further lowered from the state shown in FIG. 5, the pressing member 327 is lowered against the elastic member 327a. That is, the intermediate plate 323 and the pressing member 327 are lowered while sandwiching the release film 400. Then, as shown in FIG. 6, after the release film 400 contacts the upper surface of the side member 322, the intermediate plate 323 is further lowered until it contacts the first seal fixing portion 329. This results in the state shown in FIG. 7. As shown in FIG. 7, the pressing member 327 is pressed by the intermediate plate 323 and lowered to the same height as the first seal fixing portion 329. Therefore, the release film 400 is sandwiched between the first seal fixing portion 329, the pressing member 327, and the intermediate plate 323. Furthermore, because the height of the upper surface of the pressing member 327 is lowered to a position lower than the height of the upper surface of the side member 322, tension acts on the portion of the release film 400 above the cavity 326, pulling it in the left-right direction.

[0037] Next, the vacuum pump 330 is driven to suck downward the portion of the release film 400 above the cavity 326. At this time, the suction force is adjusted so that the release film 400 above the cavity 326 is slightly bent downward as shown in FIG.

[0038] 9, liquid resin 910 is supplied from a nozzle 900 of the liquid resin supply mechanism to a portion of the release film 400 above the cavity 326. When the supply of the liquid resin 910 is completed, the nozzle 900 is retracted from between the upper mold 310 and the lower mold 320.

[0039] Next, as shown in FIG. 10, the vacuum pump 330 is driven to suck the release film 400 so that it contacts the bottom and side surfaces of the cavity 326. Subsequently, as shown in FIG. 11, the mold clamping mechanism 200 is driven to move the lower mold 320 toward the upper mold 310. This clamps the molding die 300. At this time, the upper mold 310 and the lower mold 320 are heated by the heating unit 350, so that the liquid resin hardens and the substrate 800 is sealed with the resin. In this way, a resin molded product is completed. In the resin molding apparatus 10, the molding die 300 is then opened, and a new release film 400 is placed between the intermediate plate 323 and the lower mold 320. Then, in a manufacturing apparatus for a resin molded product including the resin molding apparatus 10, a transfer module (not shown) transfers the resin molded product from the resin molding apparatus 10, and the transfer module also transfers the substrate 800 before resin molding to the upper mold 310. By repeating the above process, resin molded products are mass-produced.

[0040] <4. Features> According to the resin molding apparatus 10 of this embodiment, the following effects can be obtained.

[0041] (1) For example, if the liquid resin is supplied while the release film 400 is in contact with the inner wall surface of the cavity 326 as shown in FIG. 10, the liquid resin may begin to harden during supply, potentially preventing resin sealing of the substrate. This limits the time for supplying the liquid resin. In contrast, in this embodiment, as shown in FIG. 9, the liquid resin 910 is supplied onto the release film 400 while the release film 400 is spaced from the inner wall surface of the cavity 326 (the upper surface of the bottom member 321 and the side surfaces of the side members). This prevents heat from the lower mold 320 from being transferred to the liquid resin on the release film 400. This prevents the liquid resin from hardening prematurely. This ensures sufficient time for supplying the liquid resin, ensuring accurate supply of the liquid resin and time for draining the liquid.

[0042] (2) Since the intermediate plate 323 is lowered from the upper surface of the side member 322 to press the release film 400, sufficient tension can be applied to the release film 400. This makes it possible to prevent wrinkles from occurring in the release film 400.

[0043] 8 and 9, the liquid resin 910 is supplied with the release film 400 bent downward, and therefore, when the viscosity of the liquid resin 910 is low (for example, 50 Pa·s or less), the liquid resin 910 can be prevented from flowing outward onto the release film 400 beyond the side surface member 322. Furthermore, because the release film 400 is bent while in contact with the side surface member 22, there is no need to adjust the bending of the release film 400 with the rollers of the film supply mechanism 500 or the like, and therefore the film can be easily and simply recessed.

[0044] <5. Variations> Although one embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. In addition, the gist of the following modifications can be combined as appropriate.

[0045] (1) In the above embodiment, as shown in Fig. 9, the liquid resin 910 is supplied in a state in which the release film 400 is bent, but this is not limited to this. For example, if the viscosity of the liquid resin 910 is high, there is no risk of the liquid resin 910 flowing, so the liquid resin 910 can be supplied in a state in which the release film 400 is stretched in the horizontal direction without being bent. In other words, the tension applied to the release film 400 can be adjusted depending on the viscosity of the liquid resin 910.

[0046] (2) The configuration of the suction mechanism for adsorbing the substrate 800 or the release film 400 is not particularly limited. That is, as long as the substrate 800 can be appropriately adsorbed to the upper mold 310, or the release film 400 can be appropriately adsorbed to the inner wall surface of the cavity 326, there is no particular limitation. Furthermore, the substrate 800 may be fixed to the upper mold 310, or the release film 400 may be tightly attached to the inner wall surface of the cavity 326, by a configuration other than the suction mechanism.

[0047] (3) The configurations of the upper mold 310 and the lower mold 320 shown in the above embodiment are merely examples and can be modified as appropriate. However, in the present invention, the intermediate plate 323 presses the release film against the lower mold 320 and applies tension to the release film 400, but as long as this is the case, the configurations of the upper mold 310 and the lower mold 320 can be modified as appropriate.

[0048] (4) The configuration of the film supply mechanism 500 is not particularly limited as long as it can supply the release film 400 between the intermediate plate 323 and the lower mold 320 . [Explanation of symbols]

[0049] 10:Resin molding equipment 300: Molding mold 310: Upper mold 320: Lower mold 323: Intermediate plate 326: Cavity 400: Release film 500: Film supply mechanism 700: Control unit 800: Substrate 900: Liquid resin supply mechanism 910: Liquid resin

Claims

1. a molding die including an upper die, a lower die facing the upper die, and an intermediate plate provided between the upper die and the lower die; a film supply mechanism for supplying a release film between the intermediate plate and the lower mold; a liquid resin supply mechanism that supplies a thermosetting liquid resin onto the release film; A control unit; Equipped with The control unit The intermediate plate is pressed against the release film to bring the release film into contact with the lower mold; supplying the liquid resin from the liquid resin supply mechanism onto the release film while the release film and the lower mold are in contact with each other; The release film is brought into close contact with the cavity of the lower mold, The upper mold and the lower mold are configured to be clamped together. Resin molding equipment.

2. Further provided is a suction mechanism for suctioning the release film to the cavity of the lower mold, The control unit After the liquid resin is supplied onto the release film, the release film is sucked into the cavity of the lower mold by the suction mechanism. The resin molding device according to claim 1 .

3. The control unit After the release film comes into contact with the lower mold, and before the liquid resin is supplied onto the film, the tension acting on the release film is adjusted according to the viscosity of the liquid resin. The resin molding apparatus according to claim 1 or 2.

4. The control unit When the viscosity of the liquid resin is equal to or lower than a predetermined value, after the release film comes into contact with the lower mold, the release film is bent downward above the cavity of the lower mold before the liquid resin is supplied onto the film. The resin molding apparatus according to claim 3 .

5. a transfer module for transferring a substrate; The resin molding device according to claim 1 or 2; An apparatus for manufacturing a resin molded product, comprising:

6. Mounting the substrate on an upper mold; Supplying a release film between the upper mold and the lower mold; supplying a thermosetting liquid resin onto the release film; pressing the release film to bring the release film into contact with the lower mold; supplying the liquid resin from the liquid resin supply mechanism onto the release film while the release film and the lower mold are in contact with each other; a step of adhering the release film to the cavity of the lower mold; clamping the upper mold and the lower mold together; A method for manufacturing a resin molded product, comprising:

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