Information processing apparatus

Abstract

To provide an information processing apparatus excellent in a list property, alternatively, an information processing apparatus excellent in portability, alternatively, an information processing apparatus with low power consumption, alternatively, an information processing apparatus having a high display quality.SOLUTION: A display unit includes a flexible display unit, a plurality of drive circuit units disposed on an outer periphery of the display unit, a detection unit for identifying a state of an outer shape of the display unit, an arithmetic unit for supplying image information to the drive circuit unit, and a storage unit for storing a program to be executed by the arithmetic unit. A first mode in which the display unit is opened or a second mode in which the display unit is folded is detected by the detection unit and a program performs low power consumption processing or degradation correction processing according to the first or second mode.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an article, a method, or a manufacturing method. The invention relates to the manufacture or composition of matter. The present invention is applicable to, for example, a human interface, a semiconductor device, a display device, and a light-emitting device. , a lighting device, a power storage device, a driving method thereof, or a manufacturing method thereof. The present invention relates to, for example, a method for processing and displaying image information, a program, and a program recorded thereon. In particular, the present invention relates to an information processing device having a display unit. Image information processing and display method for displaying an image including information processed by a processing device, and a display unit A program for displaying an image including processed information on an information processing device equipped with the program, and The present invention relates to an information processing device having a recording medium on which a program is recorded. [Background technology]

[0002] The social infrastructure related to information transmission methods has been improved. This allows diverse and abundant information to be shared with the workplace. It will be possible to acquire, process, or send information using information processing devices not only at home but also on the go. It is.

[0003] In this context, portable information processing devices have been actively developed.

[0004] For example, as an example of a portable information processing device, a switching element is provided on a film substrate. A flexible active matrix light emitting device with transistors and organic EL elements. An optical device is disclosed (see Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-174153 Summary of the Invention [Problem to be solved by the invention]

[0006] A display device that has a large screen and can display a large amount of information is excellent in viewability. Therefore, it is suitable for an information processing device.

[0007] On the other hand, display devices with large screens are less portable than those with small screens. Also, display devices with large screens consume less power than those with small screens. is high.

[0008] Furthermore, the display quality of the display device may be degraded. When a light-emitting element is used, the light-emitting characteristics of the light-emitting element deteriorate depending on the light-emitting intensity and light-emitting time. Therefore, if the light emission intensity or light emission time differs for each pixel, the deterioration state of the light emitting element will differ. This results in a decrease in display quality as it is observed as uneven display.

[0009] In view of the above problem, one aspect of the present invention is to provide an information processing device or the like that is excellent in browsability. Another object of the present invention is to provide an information processing device or the like that is highly portable. Alternatively, one of the objectives is to provide an information processing device or the like that consumes less power. Another object is to provide an information processing device or the like with high display quality. Another object is to provide an information processing device or the like with little display unevenness. One of the objectives is to provide a novel information processing device and the like.

[0010] The description of these problems does not preclude the existence of other problems. It is not necessary for one embodiment to solve all of these problems. The subject matter will be self-evident from the description, drawings, claims, etc. It is possible to extract other issues from the drawings, claims, etc. [Means for solving the problem]

[0011] One embodiment of the present invention is a display device including a flexible display unit and a plurality of drive circuits arranged around the periphery of the display unit. a path section, a detection section that identifies the external shape of the display section, and a calculation section that supplies image information to the drive circuit section. a storage unit that stores a program to be executed by the calculation unit, and A first configuration in which the display unit is unfolded or a second configuration in which the display unit is folded is detected, and The program performs low power consumption processing and deterioration correction processing according to the first or second form. The information processing device is characterized by the above.

[0012] Furthermore, the program stored in the information processing device according to one embodiment of the present invention is a program for specifying the state of the external shape. The first step, and if the first form is selected, proceed to the fourth step. If the first form is selected, proceed to the fourth step. If the second step is selected, proceed to the third step. If the second step is selected, proceed to the fifth step. and a third step of proceeding to the first step if the second mode is not selected, and a deterioration correction process is performed. If necessary, proceed to the sixth step, and if deterioration correction processing is not necessary, proceed to the seventh step. The fourth step is to proceed to the next step, the fifth step is to perform low power consumption processing, and the fifth step is to perform degradation correction processing. a sixth step of starting the low power consumption process and a seventh step of terminating the process, an eighth step of determining a region; and a ninth step of pausing at least one of the drive circuit units. a tenth step of measuring the time to pause, and a first step of canceling the low power consumption process. Proceed to step 2 and if the low power consumption processing is not cancelled, proceed to step 9. a twelfth step of returning from the low power consumption processing, a thirteenth step of determining a time period for a display area for which low power consumption processing has been performed; A fourteenth step of controlling the amount of current in the display area where the power processing has been performed, and a fourteenth step of canceling the deterioration correction processing. If the deterioration correction process is not cancelled, proceed to step 14. a fifteenth step of proceeding to the next step, and a sixteenth step of returning from the deterioration correction process. .

[0013] In each of the above configurations, the driver of the drive circuit unit is independently provided outside the folded area. It is preferable that the drive circuit section is formed independently outside the folded region. This allows the low power consumption process and the deterioration correction process to be carried out in an appropriate manner.

[0014] In this way, in the information processing device according to one aspect of the present invention, the program is According to the second embodiment, the display unit performs low power consumption processing and deterioration correction processing. This can suppress display unevenness and reduce power consumption. [Effects of the Invention]

[0015] According to one aspect of the present invention, an information processing device with excellent visibility can be provided. Alternatively, an information processing device with low power consumption can be provided. Alternatively, an information processing device with high display quality can be provided. [Brief explanation of the drawings]

[0016] [Figure 1] 1A and 1B are a block diagram and a schematic top view illustrating a configuration of an information processing device. [Figure 2] 1A and 1B are a schematic top view and a cross-sectional view illustrating a configuration of an information processing device. [Figure 3] 1A and 1B are a schematic top view and a cross-sectional view illustrating a configuration of an information processing device. [Figure 4] FIG. 4 is a flow diagram illustrating a program executed by a calculation unit of the information processing device. [Figure 5] FIG. 4 is a flow diagram illustrating a program executed by a calculation unit of the information processing device. [Figure 6] FIG. 1 is a schematic top view illustrating the configuration of an information processing apparatus. [Figure 7] FIG. 1 is a schematic top view illustrating the configuration of an information processing apparatus. [Figure 8] FIG. 2 is a diagram illustrating the circuit configuration of a pixel. [Figure 9] FIG. 2 illustrates a circuit configuration of a display device. [Figure 10] FIG. 2 illustrates a circuit configuration of a display device. [Figure 11] FIG. 2 illustrates a circuit configuration of a display device. [Figure 12] FIG. 2 illustrates a circuit configuration of a display device. [Figure 13] FIG. 2 illustrates a circuit configuration of a display device. [Figure 14] FIG. 2 illustrates a circuit configuration of a display device. [Figure 15] FIG. 2 illustrates a circuit configuration of a display device. [Figure 16] FIG. 2 illustrates a circuit configuration of a display device. [Figure 17] FIG. 2 illustrates a circuit configuration of a display device. [Figure 18] FIG. 1 is a perspective view illustrating one embodiment of an information processing device. [Figure 19] 1A and 1B are a top view and a cross-sectional view illustrating a light-emitting panel that can be used in an information processing device. [Figure 20] 1 is a cross-sectional view illustrating a light-emitting panel that can be used in an information processing device. [Figure 21] 1 is a cross-sectional view illustrating a light-emitting panel that can be used in an information processing device. [Figure 22] 1 is a cross-sectional view illustrating a light-emitting panel that can be used in an information processing device. [Figure 23] 1A to 1C are cross-sectional views illustrating a method for manufacturing a light-emitting panel that can be used in an information processing device. [Figure 24] 1A to 1C are cross-sectional views illustrating a method for manufacturing a light-emitting panel that can be used in an information processing device. [Figure 25] 1A and 1B illustrate a light-emitting panel that can be used in an information processing device. DETAILED DESCRIPTION OF THE INVENTION

[0017] An information processing device according to one embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following description, and the embodiments and methods thereof may be modified without departing from the spirit and scope of the present invention. It will be readily apparent to those skilled in the art that various modifications may be made to the details. The present invention is not limited to the following description of the embodiments. In the configuration of the invention, the same parts or parts having similar functions are designated by the same reference numerals in different drawings. These are commonly used between the surfaces, and their repeated explanation will be omitted.

[0018] In addition, the arrangement of each block in the block diagram in the drawing is specified for the purpose of explanation. Although different blocks are shown to perform different functions, they may not be used in actual circuits or domains. In the case where different functions can be realized within the same circuit or the same area, In addition, the function of each block in the block diagram in the drawing is specified for the purpose of explanation. Although it is shown as one block, it may not be one block in the actual circuit or area. In some cases, the processing performed by a lock is performed by multiple blocks.

[0019] (Embodiment 1) In this embodiment, a configuration of an information processing device of one embodiment of the present invention will be described with reference to FIGS. The following explanation will be given using this.

[0020] FIG. 1A is a block diagram illustrating a configuration of an information processing device 100 of one embodiment of the present invention. .

[0021] The information processing device 100 shown in FIG. 1A includes a flexible display unit 102 and a display unit 102. and a detection circuit for identifying the external shape of the display unit. a calculation unit 108 that supplies image information to the drive circuit unit 104; and a storage unit 110 for storing a program to be executed.

[0022] In FIG. 1A, the display unit 102 and the drive circuit unit 104 form a display panel. The display panel 105 may have only the display unit 102, or A configuration in which the display unit 102, the detection unit 106, the calculation unit 108, the storage unit 110, etc. are combined may also be used. good.

[0023] As shown in FIG. 1A, the display unit 102 and the driver circuit unit 104 are flexible. Therefore, by configuring the display panel 105, the drive circuit section 104 can also be made flexible. However, the driving circuit section 104 is fabricated on a substrate different from the display panel 105 and has flexibility. It may also be configured not to do so.

[0024] The data processing device 100 of one embodiment of the present invention illustrated in FIG. 1A includes a flexible display unit 10 The external shape of the 2 can be changed, making it a highly portable and easy-to-read device. For example, when the display unit 102 is unfolded, it is possible to achieve excellent visibility. When the display unit 102 of the information processing device 100 is folded, the information processing device 100 has excellent portability. The information processing device 100 can be used.

[0025] Here, each component shown in FIG. 1(A) will be described in detail below.

[0026] <Display section> The display unit 102 is made of a substrate whose shape can be changed, such as a flexible substrate or It is formed on a flexible film.

[0027] <Drive circuit section> The drive circuit unit 104 is disposed on the outer periphery of the display unit 102. The drive circuit unit 104 supplies a signal to the display unit 102. For example, when pixels are arranged in a matrix on the display unit 102, The circuit (gate driver) outputs a signal (scanning signal) that selects the pixel, and the display element of the pixel A circuit (source driver) is used to supply a driving signal (data signal). This can be done.

[0028] In addition, a part or the whole of the drive circuit section 104 is formed on the same substrate as the display section 102 in the same process. In particular, it is preferable that the area around the bend is formed by the same process on the same substrate. It is preferable to provide a gate driver that can be easily formed at an operating frequency of 1000 kHz. Since the thickness is low, it is easy to form the display unit 102 on the same substrate in the same process. In addition, the number of elements and terminals formed in the same process as the display unit 102 can be reduced. Therefore, a part or the whole of the driving circuit unit 104 may be flexible. Therefore, it can be folded at any position relative to the display unit 102. Therefore, the information processing device 100 is hard to break and can be made into a durable device. The configuration of the circuit unit 104 is not limited to this. For example, the circuit unit 104 may be formed on the same substrate as the display unit 102. In this case, part or all of the drive circuit unit 104 may be configured without COG or It can be implemented by TAB. When implementing by COG or TAB, When the substrate on which the display unit 102 is provided is folded, the area where the fold is to be formed is provided with a COG or a TAB. It is preferable to avoid providing ICs or LSIs that are provided by This allows the substrate on which the display unit 102 is provided to be bent.

[0029] The driving circuit section 104 includes a protection circuit, a control circuit, a power supply circuit, a signal generating circuit, etc. The configuration may also have a function including:

[0030] The drive circuit unit 104 is configured to have a plurality of power supply circuits, and the power supply circuits are By configuring the display unit 102 to be controlled independently, the display unit 102 may be configured to be driven separately. Alternatively, the supply of power supply voltage to each of the divided display units 102 can be controlled individually. Also, a part of the power supply circuit or a separate power supply circuit may be used. A circuit having a function of monitoring the amount of current flowing through the light emitting element provided in the unit 102 is provided. The amount of current flowing through the light-emitting element may be monitored to measure the power consumption of the display unit 102. For example, the amount of current can be monitored by a display unit 102. The amount of current between the anode and cathode of the light-emitting element may be monitored.

[0031] <Arithmetic section> The calculation unit 108 has a function of supplying image information to the drive circuit unit 104 .

[0032] <Detection unit> The detection unit 106 has a function that can identify the external shape of the display unit 102. For example, the display unit 102 may be in a first configuration in which it is unfolded, or in a second configuration in which it is folded. The detection unit 106 can identify the external shape of the display unit 102. For example, switches, MEMS pressure sensors, acceleration sensors, infrared sensors, magnetic It can be configured using a sensor, a pressure sensor, or the like.

[0033] <Storage section> The storage unit 110 stores a program to be executed by the calculation unit 108. The program The calculation unit 108 is caused to execute different processes depending on the information from the detection unit 106.

[0034] Next, an example of a specific configuration of the display panel 105 shown in FIG. 1(A) will be described below. conduct.

[0035] FIG. 1B is a schematic top view illustrating the configuration of the display panel 105. FIG.

[0036] The display panel 105 shown in FIG. 1B is folded between the dashed lines α1 and α2 and between the dashed lines β1 and β2. In the case of the configuration shown in FIG. 1(B), the display panel 105 can be folded into three. However, the configuration of the display panel 105 is not limited to this, and it can be one or more. The folded portion α1-α may be folded at three or more positions. 2 and the dashed line β1-β2 are arranged in parallel, but one aspect of the present invention is not limited to this. The folds may be arranged in a non-parallel manner or may be arranged in a cross-sectional manner. stomach.

[0037] The display panel 105 shown in FIG. 1B includes a display unit 102 and a display panel 105a. The driving circuit unit 104 includes a first gate driver 104g_1 and a second gate driver 104g_2, the first source driver 104s_1, and the second source driver 104s The first gate driver 104g_1 and the first source driver 104g_2 are also included. The first source driver 104s_1 and the second source driver 104s_2 are respectively connected to the non-folded area. It is formed independently.

[0038] At this time, the second gate driver 104g_2 is arranged in the folded region. However, by forming it on the same substrate as the display unit 102 in the same process, it operates without any problems. However, one embodiment of the present invention is not limited to this. For example, as shown in FIG. ), gate drivers (gate drivers 104g_1A and gate driver 104g_1B, gate driver 104g_2A and gate driver 10 4g_2B, gate driver 104g_2C and gate driver 104g_2D, etc.) Alternatively, only one source driver may be provided. The source driver is placed in the position of the gate driver in Fig. 1(B), and the source driver is placed in the position of the gate driver in Fig. 1(B). The gate driver may be placed in the place of the base driver. 7A does not include the second gate driver 104g_2, and the gate driver 104g _2A and gate driver 104g_2C, or gate driver 104g_2B and gate As with the driver 104g_2D, the circuit may not be arranged at the fold. This improves the reliability of the display panel. It can be equipped.

[0039] Alternatively, as shown in FIG. 7(B), the gate driver and the source driver are arranged on the same side. In FIG. 7B, the first gate driver 104g_3, the second gate The driver 104g_4, the first source driver 104s_3, and the second source driver The first gate driver 104s_4 is disposed on one side. The first gate driver 104g_3 and the second gate driver 104g_4 are arranged so as to surround the periphery of the display unit 102. By using such an arrangement, the display unit 102 The bending position can be freely changed. Also, the drive circuit cannot be bent. Therefore, no pressure is applied to the transistor, which improves reliability. In FIG. 7(B), the gate driver is placed on the source driver side, and the wiring to the gate line is Although the lines are arranged to detour around each other, one embodiment of the present invention is not limited to this. The source driver is placed on the driver side, and the wiring to the source line is arranged with a large detour. Good too.

[0040] Next, the display unit 102 of the display panel 105 shown in FIG. 1(B) is opened (first form). The display state of the display screen (state) will be described with reference to FIGS. 2(A) and 2(B).

[0041] FIG. 2A shows the display panel 105 in a state where the display unit 102 is unfolded (first mode). 2(B) is a cross-sectional view of the cross section between the dashed line AB shown in FIG. 2(A). is equivalent to

[0042] In the case of the display unit 102 shown in FIGS. 2A and 2B, the first gate driver 104g_1 and , the second gate driver 104g_2, the first source driver 104s_1, and the second By using the source driver 104s_2, an image is displayed on the entire surface of the display unit 102. It can be done.

[0043] Next, the display unit 102 of the display panel 105 shown in FIG. 1(B) is folded (second The display state of the display mode will be explained with reference to FIGS. 3(A), (B), and (C).

[0044] FIG. 3A is a schematic top view of the display unit 102 in a folded state (second mode). 3(B) corresponds to a cross-sectional view taken along the dashed line AB in FIG. 3(A). FIG. 3(C) is a cross-sectional view showing a display state different from that shown in FIG. 3(B).

[0045] In the case of the display portion 102 shown in FIG. 3A, a first gate driver 104g_1 and a second gate driver 104g_2 are connected. The gate driver 104g_2, the first source driver 104s_1, and the second source driver When the driver 104s_2 is used, an image is displayed on the entire surface of the display unit 102. 3(B) shows a schematic diagram of an image being displayed on the entire surface of the display unit 102. However, the area 120 located at the folded part is not directly visible to the viewer. Therefore, as shown in FIG. 3(C), the display unit 102 is The image on the display unit 102a that can be observed by the viewer is divided into a display unit 102a and a display unit 102b. Only the image on the display unit 102b is displayed, and the image on the display unit 102b that cannot be observed by the viewer is displayed. By adopting a configuration in which no display is provided, the power consumption of the display unit 102 can be reduced.

[0046] In this way, there are various methods to prevent the display unit 102b from displaying an image. For example, black (minimum brightness and number of gradations) can be used for the pixels of the display unit 102b. That is, the image signal supplied to the display unit 102b is controlled to be displayed. As a result, a black image is displayed on the display unit 102b. Therefore, it is essentially the same as not displaying the image.

[0047] Furthermore, other methods can be used, in which case the results may differ depending on the circuit configuration of the pixel. Or, it may differ depending on the location of the source driver and gate driver. be.

[0048] First, an example of a pixel circuit is shown in Figures 8(A) and 8(B). Here, we will show a pixel in an active matrix display device using a transistor. One embodiment of the present invention is not limited to this. Alternatively, the pixel may be a pixel of a display device with no pixels arranged, and the entire surface may be light-emitting. The lighting device may be a lighting device.

[0049] The pixel 909 includes a transistor 901, a transistor 903, a capacitor 902, and a light-emitting element. 904. Each screen is connected to the other screens via wiring 906, wiring 905, wiring 907, and wiring 908. The elements are connected.

[0050] The wiring 906 can supply a video signal, an initialization signal, a precharge signal, etc. Therefore, the wiring 906 has functions such as a source signal line and a video signal line. The wiring 905 has a function of supplying a selection signal and the like. The wiring 905 functions as a gate signal line, etc. The wiring 907 is connected to the light emitting element 904. Alternatively, the function of supplying current to the transistor 903 or the function of supplying current to the transistor 903 Therefore, the wiring 907 has a function of supplying a signal for correction. The wiring 908 functions as a current supply line, a power supply line, a voltage supply line, etc. It has functions such as an electrode.

[0051] The transistor 901 determines whether to supply a video signal, an initialization signal, or the like, or whether to set the pixel Therefore, the transistor The capacitor element 902 functions as a selection transistor. It has the function of maintaining the threshold voltage of the transistor. The resistor 903 has a function of controlling the magnitude of the current flowing through the light emitting element 904. The transistor 903 flows a large amount of current in response to the voltage held in the capacitor 902. In other words, the transistor 903 can be used as a driving transistor. Therefore, in FIG. 8A, the transistor 903 is a P-channel In FIG. 8B, an N-channel type is preferable. However, in one embodiment of the present invention, This is not limited to this.

[0052] Note that the pixel circuit can have various structures. is not limited to the configurations shown in FIGS. 8(A) and 8(B).

[0053] 9A and 9B show diagrams in which the pixel circuits of FIG. 8A are arranged in a matrix. FIG. 9(A) shows a case where a fold is provided parallel to the wiring 907, and FIG. 9(B) shows a case where a fold is provided parallel to the wiring 907. 9 shows a case where a fold is provided parallel to the wiring 905.

[0054] 10, in the case of FIG. 9A, a circuit 911 for controlling the conduction state of the wiring 907 is provided. The wiring 906 is connected to a source driver circuit 912. The wiring 907 is connected to a circuit 911. The circuit 911 is connected to a plurality of wirings 907. That is, it is possible to control which wirings are supplied with voltage and which wirings are not supplied with voltage. This allows a non-light-emitting area to be formed when the display panel 105 is folded. Power consumption can be reduced.

[0055] 11A and 11B show an example of the internal circuit configuration of the circuit 911. In the area to the left of the first fold, between the dashed lines α1 and α2, wire 918A is used. In the area to the right of the first fold, between the dashed lines α1 and α2, wire 918B is used. The area to the left of the first fold, between the dashed lines α1 and α2, is the display panel 1. This is the area that will be displayed even when 05 is folded, and is the first fold, dashed line α1-α2 The area to the right of the gap is not displayed when the screen is folded. 7A, wiring 907B, etc. are connected to wiring 918A, and wiring 907C, wiring 907D, wiring The wire 907E, the wire 907F, etc. are connected to the wire 918B. By this, when the display panel 105 is folded, a voltage is supplied to the wiring 918A. As a result, the transistor 903 of each pixel is connected to the wiring 907A, the wiring 907B, etc. A current is supplied to the light emitting element 904, and the light emitting element 904 emits light. By not supplying a voltage and leaving the light emitting element 904 in a floating state, or By supplying a voltage that does not emit light, the transistor 903 and the light emitting element 9 No current is supplied to 04, so it can be made not to emit light.

[0056] In FIG. 11A, the first fold, the dashed line α1-α2, is the boundary between the wiring 9 18A and wiring 918B are connected to the transistor 903 and the light emitting element 904 of each pixel. However, one aspect of the present invention is not limited to this. The right area between α1 and α2 can also emit light when the display panel 105 is folded. 11B, the transistor 903 and the light emitting element 904 are connected to the wiring 91. It may be connected to 8A.

[0057] The source driver circuit 912 and the circuit 911 can be divided into multiple IC chips. Do not place an IC chip in the area where the fold is located. It may be possible to implement it.

[0058] In addition, in FIGS. 11A and 11B, the display panel is connected using the wiring 918A and the wiring 918B. When folding the lens 105, it is possible to control the areas that emit light and the areas that do not emit light. However, one embodiment of the present invention is not limited to this. Alternatively, the light emission may be controlled by providing a switch. In Figure 12(A), in the left area between the dashed lines α1 and α2, which is the first fold, the wiring 9 907A, wiring 907B, etc. are connected to wiring 918 without going through a switch. Therefore, the display panel 105 can emit light regardless of whether it is folded or not. On the other hand, in the area on the right side between the dashed lines α1 and α2, which is the first fold, the wiring 907C and the wiring 90 7D, wiring 907E, wiring 907F, etc. are connected to switches 917C, 917D, It is connected to the wiring 918 via the switch 917E, the switch 917F, etc. When the display panel 105 is folded, these switches are turned off to display the image. The element can be made non-luminescent.

[0059] If the resistance value changes depending on the region depending on whether or not there is a switch, see Figure 12. As shown in (B), the wiring 9 907A, wiring 907B, etc. are connected to wiring 91 through switches 917A, 917B, etc. It may be connected to 8.

[0060] Next, in the case of FIG. 9(B), the configuration in which light emission can be controlled by region is as follows: As shown in Figure 13(A), the first fold, dashed line α1-α2 In the lower area between the gate driver 902 and the gate driver 903, the transistor 903 and the light emitting element 904 of each pixel are connected. 13B is connected, and in the upper area between the dashed lines α1-α2, which is the first fold, A gate driver 913A is connected to the transistor 903 and the light emitting element 904. In the area below the crease between the dashed lines α1 and α2, when the display panel 105 is folded, When the first fold is reached, the gate driver 913B is activated so that light can be emitted. The area above the line α1-α2 does not emit light when the display panel 105 is folded. For example, the gate driver 913A operates so that the pixel is not selected. As a result, the gate driver 913A outputs an L signal. Since the scanning operation is not performed, power consumption can be reduced. This corresponds to the case of 13(A).

[0061] In the case of the display portion 102 shown in FIG. 3C, for example, the first gate driver 104g_1 and , a first source driver 104s_1 and a second source driver 104s_2 are used. However, the second gate driver 104g_2 does not output a selection signal (for example, an L signal). By setting the scan mode to "Only output the Therefore, only the display unit 102a can be displayed.

[0062] As shown in FIG. 13B, a circuit 915 is provided at the output of the gate driver 914. By using the above, it may be possible to control whether or not the selection signal is output. 9 shows an example of the circuit 915. When the potential of the wiring 920 is set to an H signal, The output of 914 is controlled by an AND circuit 919 and output to a wiring 905. By setting the potential of the wiring 920 to an L signal, the wiring 905 is always supplied with an L signal. This allows the supply of selection signals to the pixels to be stopped, reducing power consumption. The force can be reduced.

[0063] The gate driver 914, the circuit 915, the gate driver 913A, etc. are connected to a plurality of I By dividing it into C chips, the IC chip is not placed in the area where it overlaps with the fold. This may be implemented in COG or TAB.

[0064] Next, the pixel circuits of FIG. 8B are arranged in a matrix, as shown in FIGS. 15A and 15B. 15A shows a case where a fold is provided parallel to the wiring 906, and FIG. 9B shows a case where a fold is provided parallel to the wiring 905.

[0065] In Figures 16(A) and (B), as in Figure 13(A), different driving circuits are used depending on the region. The circuit for driving the wiring 905 and the circuit for driving the wiring 907 are shown. In some cases, a circuit for driving the wiring 907 is provided. As circuits for this purpose, a circuit 916A and a circuit 916B are provided. In FIG. 16(B), a circuit 913 for driving a wiring 905 is provided without being divided according to the region. That is, a circuit for driving the wiring 905 and a circuit for driving the wiring 907 are The roads may or may not be divided into regions.

[0066] 13B, a circuit 921 is provided at the output of the circuit 916. An example of the case where the wiring 921 is formed is shown in FIG. 17A. A specific example of the circuit 921 is shown in FIG. 17B. By controlling the potential of the terminal 23, the potential of the wiring 907 is controlled by the AND circuit 922. will be done.

[0067] In this way, the light emission state can be controlled according to the region by various methods.

[0068] However, as shown in FIG. 3(C), only the display unit 102a displays an image. After the driving circuit unit 104 is driven in such a manner that the display panel shown in FIGS. When the display unit 102 of the roll 105 is unfolded (first form), an image is displayed on the entire surface of the display unit 102. When the display is performed, the phenomenon that the brightness of the display section 102a and the display section 102b differs as shown in FIG. 3(C) occurs. This can occur.

[0069] For example, when a light-emitting element is used as the display unit 102, only the display unit 102a displays an image. By using a configuration in which the light emitting element in the display area 102a is exposed to the light, the light emitting element in the display area 102a may be deteriorated. When the display unit 102 is in the first form in which it is unfolded, the brightness and the like vary within the plane of the display unit 102, and the display It is recognized as unevenness.

[0070] Therefore, in the information processing device 100 according to one embodiment of the present invention, the display unit 102 is The program is displayed in a low power state depending on the first configuration or the second configuration in which the display unit 102 is folded. By performing power consumption processing and deterioration correction processing and controlling the driving method, the display unit 102 Therefore, it is possible to provide an information processing device with high display quality. can be provided.

[0071] Here, the above-mentioned program will be explained with reference to FIG. 4 and FIGS. 5(A) and 5(B). cormorant.

[0072] <Program> FIG. 4 shows a flowchart of a program stored in the storage unit 110 of the information processing device 100 shown in FIG. This is a flow chart.

[0073] First, in the first step, the external shape of the display unit 102 is detected based on information from the detection unit 106. (Step S1).

[0074] In the second step, it is determined whether the display unit 102 is in the unfolded form (first form) ( Step S2). If it is the first type, proceed to the fourth step, and if it is not the first type, proceed to the fourth step. Proceed to step 3.

[0075] In the third step, it is determined whether the display unit 102 is in the folded form (second form). (Step S3). If it is the second type, proceed to the fifth step. If it is not the second type, Proceed to step 1.

[0076] In the fourth step, it is determined whether deterioration correction processing is necessary (step S4). If the processing is necessary, proceed to the sixth step, and if the deterioration correction processing is not necessary, proceed to the seventh step. Proceed to step 1.

[0077] In the fifth step, low power consumption processing is performed (step S5). After completing the step, proceed to step 7.

[0078] In the sixth step, a deterioration correction process is performed (step S6).

[0079] In the seventh step, the process ends (step S7).

[0080] Here, the fifth step (step S5) of the low power consumption processing and the sixth step (step S6) of the low power consumption processing are The deterioration correction process of step S6) is performed using the flowcharts shown in Figures 5(A) and 5(B). Give an explanation.

[0081] <Low power consumption processing> In the eighth step, a non-display area is determined (step T8). The area may be an area that is not observed by the viewer, such as the area 120 shown in FIG. 3(B).

[0082] In the ninth step, at least one drive circuit unit is put into a halt (step T9).

[0083] A mode in which the display unit 102 is folded by, for example, pausing at least one driving circuit unit. (Second embodiment) It is possible to hide the image in the area not observed by the viewer. Therefore, it is possible to provide the information processing device 100 with low power consumption.

[0084] In the tenth step, the time for which at least one driving circuit unit is stopped is measured ( Step T10).

[0085] In the eleventh step, it is determined whether to cancel the low power consumption process (step T11). If you want to cancel the low power consumption process, go to step 12. If you do not want to cancel the low power consumption process, go to step 13. If not, proceed to step 9.

[0086] In the twelfth step, the low power consumption process is returned to the program (step T1 2).

[0087] <Deterioration correction processing> In the thirteenth step, the time for which the display area has undergone the low power consumption process is identified (step Top U13).

[0088] In the fourteenth step, the amount of current in the display area where the low power consumption processing has been performed is controlled (step Step U14).

[0089] As a method for controlling the amount of current, for example, when a light emitting element is used as the display unit 102, The amount of current in the non-display area when the unit 102 is in the folded state (second state) is reduced, and increases the amount of current in the display area when the display unit 102 is in the folded state (second state). .

[0090] In this way, the display area or the hidden area when the display unit 102 is in the folded state (second state) can be adjusted. By controlling the amount of current in the display area, the display unit 102 can be displayed in the unfolded state (first state). This can suppress display unevenness.

[0091] In the fifteenth step, it is determined whether to cancel the deterioration correction process (step U15). If the deterioration correction process is to be cancelled, proceed to step 16. If the deterioration correction process is not to be cancelled, Proceed to step 14.

[0092] In addition, the degradation correction process calculates the time during which low power consumption processing is performed, and However, the amount of current in the display area where the image has been displayed may vary depending on the display state. Since there is a possibility that the current value of the display area where low power consumption processing is performed can be adjusted arbitrarily. For example, it will be possible to change the coefficients in the formula used to calculate the amount of current.

[0093] In the sixteenth step, the deterioration correction process is returned to (step U16).

[0094] Here, an example of the configuration of the drive circuit unit that performs the above-mentioned low power consumption processing and degradation correction processing is shown below. This will be explained with reference to FIG. 1(B) and FIGS. 6(A) and 6(B).

[0095] 6(A) and 6(B) are schematic top views illustrating the configuration of the display panel 105. The display panel 105 shown in FIGS. 6A and 6B is the same as the display panel 105 shown in FIG. 10 is a modified example of the schematic surface diagram.

[0096] The display panel 105 shown in FIGS. 6A and 6B is the same as the display panel 1 shown in FIG. Similarly to the above, the display panel 105 can be folded between the dashed lines α1 and α2 and between the dashed lines β1 and β2. This can be done.

[0097] The display panel 105 shown in FIG. 6A includes a display unit 102 and a driving circuit disposed around the periphery of the display unit 102. The path section 104 includes a first gate driver 104g_1 and a third gate driver 104 g_3, a first source driver 104s_1, and a second source driver 104s_2. , the first gate driver 104g_1, the first source driver 104s The first source driver 104s_1 and the second source driver 104s_2 are independently connected to the non-folded area. It is formed.

[0098] The display panel 105 shown in FIG. 6B includes a display unit 102 and a driving circuit disposed around the periphery of the display unit 102. The path section 104 includes a first gate driver 104g_1 and a third gate driver 104 g_3, a fourth gate driver 104g_4, and a fifth gate driver 104g_5. , a first source driver 104s_1, a second source driver 104s_2, and a third source driver 104s_3. The first gate driver 104g_1, The fourth gate driver 104g_4, the fifth gate driver 104g_5, the first source driver 104s_1, a second source driver 104s_2, and a third source driver The bars 104s_3 are formed independently in the non-folded regions.

[0099] As shown in FIG. 1B and FIGS. 6A and 6B, among the drivers of the driving circuit unit 104, Preferably, at least one driver is independently formed in the non-folded region. It is also preferable that the drivers of the drive circuit section can be controlled independently.

[0100] In this way, the driver is independently formed in the non-folded region, and the driver is independently By controlling this, it becomes possible to preferably perform low power consumption processing and deterioration correction processing.

[0101] In addition, the driver is formed independently in the non-folded area, which reduces the risk of folding the drive circuit. This is preferable because it improves resistance to bending. For example, it is preferable to form the driver in the folding area. When the display unit 102 is folded, the display unit 102 is folded in a first state. The driver may be destroyed by alternating between the two modes. This is because the driver circuit section has more transistors and other elements than 02.

[0102] As shown in Figure 6(A) and (B), there are two regions that are folded and those that are not. It is preferable to form a plurality of drive circuit units. The display unit 102 has a first configuration in which it is unfolded, and a second configuration in which it is folded. In addition, in the event that a part of the drive circuit is destroyed, However, if multiple drive circuits are formed, the display may be damaged using the undamaged drive circuit. This makes it possible to compensate for the operation of the display unit 102.

[0103] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. do.

[0104] (Embodiment 2) In this embodiment, an example of a data processing device of one embodiment of the present invention will be described with reference to FIG. 18. Reveal.

[0105] FIG. 18(A) shows an information processing device 150 in a state where the display unit is unfolded (first state). FIG. 18(B) shows a state in which the display unit is unfolded (first state) or a state in which the display unit is folded. 1 shows an information processing device 150 in a state in which it is changing from one of the two modes (second mode) to the other. 8(C) shows the information processing device 150 in a form in which the display unit is folded (second form).

[0106] The information processing device 150 shown in FIGS. 18(A), (B), and (C) has a flexible display unit. The information processing device 150 further includes a plurality of support panels 153 a, a plurality of support panels 155a, and a plurality of support panels 155b.

[0107] The support panel 153a is made of a material that is less flexible than the display panel 152, for example. The support panels 155a and 155b are, for example, the support panel 153a As shown in Figures 18(A), (B), and (C), the display is made of a material that is less flexible than the display. The display panel 152 has a support panel on the outer periphery thereof and on the surface thereof facing the display unit. This is preferable as it increases the mechanical strength of the display panel 152 and makes it less susceptible to breakage.

[0108] Furthermore, if the support panels 153a, 155a, and 155b are made of a material having a light-blocking property, This can prevent external light from being irradiated onto the drive circuit unit of the display panel 152. This is preferable because it can suppress light deterioration of transistors and the like used in the driving circuit section.

[0109] Although not shown in FIGS. 18(A), (B), and (C), the information processing device 150 The calculation unit, storage unit, detection unit, etc. are disposed between the display panel 152 and the support panel 155b. It is possible.

[0110] Materials that can be used for the support panels 153a, 155a, and 155b include plastic. It can be made of plastic, metal, alloy, rubber, etc. By using plastic, rubber, etc. This is preferable because it is possible to obtain a support panel that is lightweight and not easily damaged. 53a, 155a, 155b: silicone rubber, stainless steel, or aluminum Just use

[0111] In the information processing device 150, the display panel 152 including a flexible display unit is The information processing device 150 can be folded either inward or outward. When doing so, by bending the display panel 152 so that the display part faces inward, scratches and dirt on the display part can be prevented. This can prevent the formation of

[0112] Note that this embodiment mode can be appropriately combined with other embodiment modes shown in this specification. do.

[0113] (Embodiment 3) In this embodiment, a light-emitting panel that can be used in a data processing device of one embodiment of the present invention will be described. This will be explained with reference to FIGS.

[0114] <Example 1> FIG. 19(A) shows a top view of the light-emitting panel, and the dashed line A1-A2 in FIG. An example of a cross-sectional view of the cut surface between the two is shown in FIG.

[0115] The light-emitting panel shown in FIG. 19(B) has an element layer 180, an adhesive layer 185, and a substrate 181. The device layer 180 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive layer. an insulating layer 207; an insulating layer 209; a plurality of light-emitting elements; an insulating layer 211; a sealing layer 21 3, the insulating layer 261, the colored layer 259, the light-shielding layer 257, and the insulating layer 255.

[0116] The conductive layer 254 is electrically connected to the FPC 186 via the connector 215 .

[0117] The light emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The outer electrode 231 is electrically connected to the source electrode or the drain electrode of the transistor 240. The end of the lower electrode 231 is covered with an insulating layer 211. The light emitting element 230 is a top emitter. The upper electrode 235 has a light-transmitting property and transmits the light emitted from the EL layer 233. do.

[0118] A colored layer 259 is provided at a position overlapping the light emitting element 230, and a colored layer 259 is provided at a position overlapping the insulating layer 211. The colored layer 259 and the light-shielding layer 257 are covered with an insulating layer 261. The space between the light emitting element 230 and the insulating layer 261 is filled with a sealing layer 213.

[0119] The light-emitting panel has a plurality of transistors in the light extraction section 182 and the drive circuit section 184. The transistor 240 is provided on the insulating layer 205. The insulating layer 205 and the substrate 2 01 is bonded to the substrate 181 by an adhesive layer 203. In addition, the insulating layer 255 and the substrate 181 are bonded to each other. The insulating layer 205 and the insulating layer 255 are bonded together by a low-permeability film. By using the above, it is possible to prevent impurities such as water from entering the light emitting element 230 and the transistor 240. This is preferable because it can increase the reliability of the light-emitting panel. Various materials can be used.

[0120] In Example 1, the insulating layer 205, the transistor 240, and the light-emitting element 240 are formed on a substrate having high heat resistance. The substrate is peeled off, and an insulating layer 2 is formed on the substrate 201 using an adhesive layer 203. 2 shows a light-emitting panel that can be fabricated by transposing the transistor 240 and the light-emitting element 230. In addition, in Example 1, the insulating layer 255 and the colored layer 259 are formed on a substrate having high heat resistance. and a light-shielding layer 257 is formed, the substrate on which the layer is formed is peeled off, and the layer is then attached to the substrate 181 using an adhesive layer 185. A light-emitting panel can be produced by transposing the insulating layer 255, the colored layer 259, and the light-shielding layer 257. It shows.

[0121] When using a material with high water permeability and low heat resistance (such as resin) for the substrate, Since high temperatures cannot be applied, the conditions for fabricating transistors and insulating films on the substrate are limited. In the manufacturing method of this embodiment, transistors and the like are formed on a manufacturing substrate having high heat resistance. This allows for the formation of highly reliable transistors and insulating films with sufficiently low water permeability. By transferring these to the substrate 181 or the substrate 201, a highly reliable Thus, in one embodiment of the present invention, a light-emitting panel can be manufactured. A highly reliable information processing device can be realized.

[0122] It is preferable that the substrates 181 and 201 are made of a highly tough material. This makes it possible to realize a display device that is highly impact resistant and less susceptible to breakage. The substrate 201 is made of an organic resin, and the substrate 202 is made of a thin metal material or alloy material. This allows for a light-emitting panel that is lighter and less susceptible to breakage than a glass substrate. It can be achieved.

[0123] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0124] Furthermore, if a material with high thermal emissivity is used for the substrate 201, the surface temperature of the light-emitting panel will increase. This can prevent the light-emitting panel from being damaged or its reliability from being reduced. A metal substrate and a layer with high thermal emissivity (e.g., metal oxide or ceramic material) can be used. It may also have a laminated structure.

[0125] <Example 2> FIG. 20(A) shows another example of a light extraction section 182 in a light-emitting panel. The light-emitting panel is a light-emitting panel that can be touched. The description of the same configuration as in Example 1 will be omitted.

[0126] The light-emitting panel shown in FIG. 20(A) has an element layer 180, an adhesive layer 185, and a substrate 181. The device layer 180 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 206, and a semiconductor device. An edge layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, and a sealing layer 21 3, an insulating layer 261, a colored layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 281, a conductive The insulating layer 283 includes an insulating layer 291 , an insulating layer 293 , an insulating layer 295 , and an insulating layer 255 .

[0127] In Example 2, an insulating layer 217 is provided on the insulating layer 211. By providing the insulating layer 217, , the distance between the substrate 181 and the substrate 201 can be adjusted.

[0128] FIG. 20A shows an example in which a light-receiving element is provided between the insulating layer 255 and the sealing layer 213. The non-light-emitting region on the substrate 201 side (for example, the region where the transistor 240 and wiring are provided) is overlapped. Since the light receiving element can be arranged in the same position, the aperture ratio of the pixel (light emitting element) is not reduced. <A touch sensor can be provided on the light-emitting panel.

[0129] The light receiving element of the light emitting panel may be, for example, a pn-type or pin-type photodiode. In this embodiment, a p-type semiconductor layer 271, an i-type semiconductor layer A pin type photodiode having a conductor layer 273 and an n-type semiconductor layer 275 is used.

[0130] The i-type semiconductor layer 273 contains impurities that give p-type conductivity and impurities that give n-type conductivity. Each item is 1 x 10 20 cm -3 The concentration is less than 10 and the photoconductivity is 10 The i-type semiconductor layer 273 contains an impurity element of Group 13 or 15 of the periodic table. In other words, i-type semiconductors are those that have valence electron control. When no impurity elements are intentionally added, it exhibits weak n-type electrical conductivity, so it is called an i-type semiconductor layer. 273 is a method of intentionally or unintentionally adding impurity elements that impart p-type conductivity during or after film formation. This category includes those that are added intentionally.

[0131] The light-shielding layer 257 is located above the light-emitting element 230 and overlaps the light-receiving element. The light-shielding layer 257 located between the light-emitting element 230 and the light-receiving element 213 prevents light emitted from the light-emitting element 230 from reaching the light-receiving element 213. This can prevent the light from being irradiated.

[0132] The conductive layer 281 and the conductive layer 283 are electrically connected to the light receiving element. It is preferable that the conductive layer 283 is a layer that transmits light incident on the light receiving element. It is preferable to use a conductive layer that blocks light incident on the light receiving element.

[0133] When the optical touch sensor is provided between the substrate 181 and the sealing layer 213, the light emission of the light emitting element 230 This is preferable because it is less susceptible to the effects of light and can improve the S / N ratio.

[0134] <Example 3> FIG. 20(B) shows another example of the light extraction section 182 in the light-emitting panel. The light-emitting panel is a touch-operable light-emitting panel.

[0135] The light-emitting panel shown in FIG. 20(B) has an element layer 180, an adhesive layer 185, and a substrate 181. The device layer 180 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, an insulating layer 206, and a semiconductor device. An edge layer 207, an insulating layer 209a, an insulating layer 209b, a plurality of light-emitting elements, an insulating layer 211, an insulating layer 217, a sealing layer 213, a coloring layer 259, a light-shielding layer 257, a plurality of light-receiving elements, a conductive layer 280, It includes a conductive layer 281 and an insulating layer 255 .

[0136] FIG. 20B shows an example in which a light-receiving element is provided between the insulating layer 205 and the sealing layer 213. The light-receiving element is provided between the insulating layer 205 and the sealing layer 213, thereby forming a transistor 240. The conductive layer and semiconductor layer are made of the same material and in the same process as the conductive layer and semiconductor layer that are electrically connected to the light receiving element. Therefore, the number of manufacturing steps is greatly increased. Therefore, a light-emitting panel that can be touched can be manufactured without any trouble.

[0137] <Example 4> Another example of a light-emitting panel is shown in FIG. 21(A). The light-emitting panel in FIG. 21(A) is a touch panel. It is a light-emitting panel that can

[0138] The light-emitting panel shown in FIG. 21(A) has an element layer 180, an adhesive layer 185, and a substrate 181. The device layer 180 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive layer. a conductive layer 253, a conductive layer 254, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 21 1, insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 272, conductive layer 274, insulating layer 276, insulating layer 278, conductive layer 294 and conductive layer 296. Has.

[0139] In FIG. 21(A), a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274. .

[0140] The conductive layer 253 and the conductive layer 254 are electrically connected to the FPC 186 via the connector 215. The conductive layer 294 and the conductive layer 296 are electrically connected to the conductive layer 274 via the conductive particles 292. Therefore, the capacitive touch sensor is driven via the FPC186. It is possible.

[0141] <Example 5> Another example of a light-emitting panel is shown in FIG. 21(B). The light-emitting panel in FIG. 21(B) is a touch panel. It is a light-emitting panel that can

[0142] The light-emitting panel shown in FIG. 21(B) has an element layer 180, an adhesive layer 185, and a substrate 181. The device layer 180 includes a substrate 201, an adhesive layer 203, an insulating layer 205, a plurality of transistors, a conductive layer, and a conductive layer. a conductive layer 253, a conductive layer 254, an insulating layer 207, an insulating layer 209, a plurality of light-emitting elements, an insulating layer 21 1, insulating layer 217, sealing layer 213, coloring layer 259, light-shielding layer 257, insulating layer 255, conductive layer 270, conductive layer 272, conductive layer 274, insulating layer 276, and insulating layer 278.

[0143] In FIG. 21B, a capacitive touch sensor is provided between the insulating layer 255 and the sealing layer 213. The capacitive touch sensor has a conductive layer 272 and a conductive layer 274. .

[0144] The conductive layer 253 and the conductive layer 254 are electrically connected to the FPC 186a via the connector 215a. The conductive layer 270 is electrically connected to the FPC 186b via the connecting body 215b. Therefore, the light emitting element 230 and the transistor 240 are driven via the FPC 186a. A capacitive touch sensor can be driven via FPC186b.

[0145] <Example 6> FIG. 22(A) shows another example of a light extraction section 182 in a light-emitting panel.

[0146] The light extraction portion 182 shown in FIG. 22(A) includes a substrate 181, an adhesive layer 185, a substrate 202, An insulating layer 205, a plurality of transistors, an insulating layer 207, a conductive layer 208, an insulating layer 209a, an insulating layer 209b, an insulating layer 209c, an insulating layer 209d, an insulating layer 209e, an insulating layer 209f, an insulating layer 209g, an insulating layer 209h ... The light-emitting element includes an edge layer 209b, a plurality of light-emitting elements, an insulating layer 211, a sealing layer 213, and a coloring layer 259. do.

[0147] The light emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The outer electrode 231 is connected to the source electrode or drain electrode of the transistor 240 via the conductive layer 208. The end of the lower electrode 231 is covered with an insulating layer 211. The element 230 has a bottom emission structure. The lower electrode 231 is transparent, and the EL layer 23 It transmits the light emitted by 3.

[0148] A colored layer 259 is provided at a position overlapping the light emitting element 230, and the light emitted by the light emitting element 230 is The light emitting element 230 and the substrate 202 are extracted to the substrate 181 side through the colored layer 259. The gap is filled with a sealing layer 213. The substrate 202 is made of the same material as the substrate 201 described above. It can be made by

[0149] <Example 7> FIG. 22(B) shows another example of a light-emitting panel.

[0150] The light-emitting panel shown in FIG. 22(B) has an element layer 180, an adhesive layer 185, and a substrate 181. The device layer 180 includes a substrate 202, an insulating layer 205, a conductive layer 310a, a conductive layer 310b, and a plurality of The light-emitting element includes an insulating layer 211 , a conductive layer 212 , and a sealing layer 213 .

[0151] The conductive layer 310a and the conductive layer 310b are external connection electrodes of the light-emitting panel, and are connected to an FPC or the like. Electrical connection can be made.

[0152] The light emitting element 230 has a lower electrode 231, an EL layer 233, and an upper electrode 235. The end of the bottom electrode 231 is covered with an insulating layer 211. The light emitting element 230 is a bottom emitting element. The lower electrode 231 is translucent and transmits light emitted from the EL layer 233. The conductive layer 212 is electrically connected to the lower electrode 231 .

[0153] The substrate 181 has a light extraction structure, which includes a hemispherical lens, a microlens array, and a concave-convex structure. For example, the resin substrate may have a film on which the above-mentioned The lens or film is attached to the substrate or to a bonding agent having a refractive index similar to that of the lens or film. By bonding with an adhesive or the like, a light extraction structure can be formed.

[0154] The conductive layer 212 is not necessarily provided, but it is necessary to reduce the voltage drop due to the resistance of the lower electrode 231. For the same purpose, the upper electrode 235 and the electrode A conductive layer for electrical connection may be provided on the insulating layer 211 .

[0155] The conductive layer 212 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as their main components The conductive layer 212 can be formed as a single layer or a stacked layer using an alloy material. It can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.5 μm or less. Below.

[0156] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 235. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 233 to completely cover the conductive layer, and This is preferable because it makes it easier to electrically connect the conductive layer to the conductive layer.

[0157] <Example of materials> Next, materials that can be used for the light-emitting panel will be described. The description of the configuration explained above will be omitted.

[0158] The element layer 180 includes at least a light-emitting element. The category includes elements whose brightness is controlled by current or voltage. For example, light-emitting diodes (LEDs), organic EL elements, inorganic EL elements, etc. Among the above, organic EL elements are particularly preferred from the viewpoint of luminous efficiency and manufacturing method. .

[0159] The element layer 180 further includes transistors for driving light-emitting elements, touch sensors, etc. It may have.

[0160] The structure of the transistors included in the light-emitting panel is not particularly limited. The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top-gate or bottom-gate structure. The semiconductor material is not particularly limited, and examples thereof include silicon and germanium. , In-Ga-Zn-based metal oxides, etc. An oxide semiconductor containing one metal may be used.

[0161] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single-crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0162] The light-emitting element of the light-emitting panel has a pair of electrodes (a lower electrode 231 and an upper electrode 235) and The light-emitting device has an EL layer 233 provided between the pair of electrodes. One of the pair of electrodes is an anode. One acts as a cathode and the other acts as a cathode.

[0163] The light emitting element is available in top emission structure, bottom emission structure, and dual emission structure. The electrode on the light extraction side is provided with a conductive film that transmits visible light. In addition, a conductive film that reflects visible light can be used for the electrode on the side where light is not extracted. preferable.

[0164] The conductive film that transmits visible light is made of, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide containing gold, silver, platinum, magnesium, etc. , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. Also, a laminated film of the above materials can be used as the conductive layer. For example, a laminated film of silver and magnesium It is preferable to use a laminated film of an alloy of ITO and a rubber material, as this can increase the electrical conductivity. Graphene or the like may also be used.

[0165] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, or the like. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO can be used.

[0166] The electrodes may be formed by vapor deposition or sputtering. Forming using ejection methods such as ink jet printing, printing methods such as screen printing, or plating methods It can be achieved.

[0167] A voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 231 and the upper electrode 235. When this occurs, holes are injected into the EL layer 233 from the anode side, and electrons are injected from the cathode side. The electrons and holes recombine in the EL layer 233, and the luminescent material contained in the EL layer 233 emits light. It glows.

[0168] The EL layer 233 has at least a light-emitting layer. The EL layer 233 includes the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties Highly electron-injecting or bipolar material (highly electron-transporting and hole-transporting properties) The layer may further include a layer containing a material.

[0169] The EL layer 233 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 233 may be formed by evaporation (vacuum evaporation). It can be formed by methods such as transfer method, printing method, ink jet method, coating method, etc. Cut.

[0170] In the element layer 180, the light emitting element is provided between a pair of insulating films with low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, and This can prevent the reliability of the device from decreasing.

[0171] As insulating films with low water permeability, films containing nitrogen and silicon such as silicon nitride film and silicon nitride oxide film are used. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0172] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / m 2 ·day] or later Below, preferably 1 x 10 -6 [g / m 2 ·day] or less, preferably 1×10 -7 [ g / m 2 ·day] or less, more preferably 1 × 10 -8 [g / m 2 ·day] or less do.

[0173] The substrate 181 is light-transmitting and transmits at least the light emitted by the light-emitting element of the element layer 180. The substrate 181 may be flexible. The refractive index of the substrate 181 is set to be equal to that of the atmosphere. higher than the refractive index.

[0174] Since organic resin is lighter than glass, if organic resin is used as the substrate 181, This is preferable because it allows the light-emitting device to be made lighter than when glass is used.

[0175] Examples of materials that are flexible and transparent to visible light include: Thickness of glass, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resins, polyimide resins, polymers methyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE S) Resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide imide In particular, materials with a low thermal expansion coefficient are used. For example, polyamide-imide resin, polyimide resin, PET, etc. are preferably used. In addition, a substrate in which glass fiber is impregnated with organic resin or an inorganic filler is impregnated with organic resin can be used. It is also possible to use a substrate with a lower thermal expansion coefficient by mixing with

[0176] The substrate 181 is made of a layer of the above material, which serves as a protective layer for protecting the surface of the light-emitting device from scratches. Hard coat layer (e.g., silicon nitride layer) or layer of material that can disperse pressure (e.g., The light-emitting element may be laminated with a layer of a luminescent material such as an aramid resin layer. In order to prevent a decrease in the lifespan of the element, the above-mentioned insulating film with low water permeability may be provided.

[0177] The adhesive layer 185 is light-transmitting and transmits at least the light emitted by the light-emitting elements of the element layer 180. In addition, the refractive index of adhesive layer 185 is higher than the refractive index of the air.

[0178] The adhesive layer 185 may be made of a curable resin that hardens at room temperature, such as a two-component mixed resin, or a photo-curable resin. For example, epoxy resin, acrylic resin, or the like can be used. Examples include grease, silicone resin, and phenolic resin. In particular, epoxy resins and other resins with high moisture permeability are Low-temperature materials are preferred.

[0179] The resin may also contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture may be absorbed by the light emitting element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light emitting device.

[0180] In addition, by mixing a filler with a high refractive index (such as titanium oxide) into the resin, light emission This is preferable because it can improve the light extraction efficiency from the element.

[0181] The adhesive layer 185 may also have a scattering member that scatters light. The layer 185 may be made of a mixture of the above resin and particles having a refractive index different from that of the above resin. The particles function as light scattering materials.

[0182] The difference in refractive index between the resin and the particles having a different refractive index from that of the resin is preferably 0.1 or more. More preferably, the ratio is 0.3 or more. Specifically, the resin may be an epoxy resin, an acrylic resin, or the like. The particles may be titanium oxide particles, imide resin particles, silicone particles, etc. Examples of usable materials include fluorine, barium oxide, and zeolite.

[0183] Titanium oxide and barium oxide particles are preferred because they have a strong light scattering property. By using fluorite, it is possible to adsorb water contained in resins, etc., improving the reliability of light-emitting devices. It can be done.

[0184] The insulating layer 205 and the insulating layer 255 can be made of an inorganic insulating material. It is preferable to use an insulating film with low water permeability, since this allows for a highly reliable light-emitting panel to be realized.

[0185] The insulating layer 207 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 207 may be a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like. An inorganic insulating film such as a film can be used.

[0186] The insulating layer 209, the insulating layer 209a, and the insulating layer 209b are each a transistor. It is preferable to select an insulating film having a planarizing function in order to reduce surface irregularities caused by, for example, For example, organic materials such as polyimide resin, acrylic resin, and benzocyclobutene resin are used. In addition to the above organic materials, low-dielectric-constant materials (low-k materials) can also be used. It is possible to use insulating films or inorganic insulating films formed from these materials. It may be layered.

[0187] The insulating layer 211 is provided to cover the end of the lower electrode 231. In order to improve the coverage of the EL layer 233 and the upper electrode 235 formed on the insulating layer 2 It is preferable that the side wall 11 is an inclined surface formed with a continuous curvature.

[0188] The insulating layer 211 may be made of a resin or an inorganic insulating material. Examples of the resin include polyimide resin, polyamide resin, acrylic resin, and siloxane resin. The insulating layer 211 may be made of a material such as a resin, an epoxy resin, or a phenol resin. Since this makes it easier to manufacture the film, it is preferable to use a negative photosensitive resin or a positive photosensitive resin. It is preferable that:

[0189] The method for forming the insulating layer 211 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , evaporation method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) It is best to use a printing press, etc.

[0190] The insulating layer 217 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, organic insulating materials include negative and positive photosensitive resins, non-photosensitive resins, As the metal material, titanium, aluminum, etc. can be used. A conductive material is used for the insulating layer 217, and the insulating layer 217 and the upper electrode 235 are electrically connected. By adopting a configuration in which the upper electrode 235 is electrically connected, it is possible to suppress a potential drop caused by the resistance of the upper electrode 235. Furthermore, the insulating layer 217 may have a forward tapered shape or an inverse tapered shape.

[0191] The insulating layer 276, the insulating layer 278, the insulating layer 291, the insulating layer 293, and the insulating layer 295 are The insulating layer 278 and the insulating layer 295 can be formed using an inorganic insulating material or an organic insulating material. In order to reduce the surface irregularities caused by the sensor element, an insulating layer having a planarizing function is used. is preferred.

[0192] The sealing layer 213 may be made of a curable resin that hardens at room temperature, such as a two-component mixed resin, or a photo-curable resin. For example, a resin such as a thermosetting resin can be used. ide) resin, acrylic resin, polyimide resin, epoxy resin, silicone resin, PVB ( Polyvinyl butyral resin, EVA (ethylene vinyl acetate) resin, etc. can be used. The sealing layer 213 may contain a desiccant. When the light from the optical element 230 is extracted to the outside of the light-emitting panel, a high refractive index is applied to the sealing layer 213. It is preferable that the ink contains a filler or a scattering material. The same materials as those that can be used for adhesive layer 185 can be used.

[0193] The conductive layer 253, the conductive layer 254, the conductive layer 294, and the conductive layer 296 are transistors, respectively. The conductive layer can be formed using the same material and process as the conductive layer constituting the transistor or light-emitting element. The conductive layer 280 can be formed using the same material and process as the conductive layers that constitute the transistors.

[0194] For example, the conductive layers may be made of molybdenum, titanium, chromium, tantalum, or tungsten. Metallic materials such as zinc, aluminum, copper, neodymium, scandium, etc., or containing these elements The conductive layer can be formed of a single layer or a stacked layer using an alloy material. Each of the conductive metal oxides may be used. Indium (In2O3, etc.), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, Indium zinc oxide (In2O3-ZnO, etc.) or these metal oxide materials with silicon oxide It is possible to use a material containing kon.

[0195] In addition, the conductive layer 208, the conductive layer 212, the conductive layer 310a, and the conductive layer 310b are also The insulating film 10 can be formed using the above-mentioned metal materials, alloy materials, conductive metal oxides, or the like.

[0196] The conductive layers 272 and 274, and the conductive layers 281 and 283 are light-transmitting. For example, indium oxide, ITO, indium zinc oxide, zinc oxide The conductive layer 270 may be made of zinc oxide doped with lead or gallium. It can be formed using the same material and process as 272.

[0197] The conductive particles 292 are particles of organic resin or silica coated with a metal material. Nickel or gold is preferable as the metal material because it can reduce contact resistance. In addition, particles coated with two or more metal materials in layers, such as nickel coated with gold, are also available. It is preferable to use a child.

[0198] The connector 215 is a paste or sheet made of a thermosetting resin mixed with metal particles. A material that exhibits anisotropic conductivity when thermocompressed can be used. Metal particles are composed of layers of two or more metals, such as nickel particles coated with gold. It is preferable to use particles in which

[0199] The colored layer 259 is a colored layer that transmits light in a specific wavelength band. For example, the red wavelength band A red (R) color filter transmits light in the red wavelength band, and a green (G) color filter transmits light in the green wavelength band. and blue (B) color filters that transmit light in the blue wavelength band. Each color layer can be formed by using various materials and by printing, inkjet printing, photolithography, etc. They are formed at desired positions by etching using lithography or the like.

[0200] In addition, a light-shielding layer 257 is provided between adjacent colored layers 259. The light-shielding layer 257 is It blocks light that is coming around from adjacent light emitting elements, thereby suppressing color mixing between adjacent pixels. The end of the colored layer 259 is provided so as to overlap the light-shielding layer 257, thereby suppressing light leakage. The light-shielding layer 257 can be made of a material that blocks light emitted from the light-emitting element. The insulating layer 11 can be formed using a metal material or a resin material containing a pigment or dye. As shown in Figure 9(A), the light-shielding layer 257 is formed on the driving circuit section 184 and other parts other than the light extraction section 182. It is preferable to provide the light emitting element in the region (a) because unintended light leakage due to guided light or the like can be suppressed.

[0201] Furthermore, when an insulating layer 261 is provided to cover the colored layer 259 and the light-shielding layer 257, the colored layer 259 and the light-shielding layer 257 can be easily This is preferable because it can prevent impurities such as pigments contained in the optical layer 257 from diffusing into the light emitting elements, etc. It is preferable that the insulating layer 261 is made of a light-transmitting material, and that an inorganic insulating material or an organic insulating material is used. The insulating layer 261 may be made of the above-mentioned insulating film with low water permeability.

[0202] <Example of manufacturing method> Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 23 and 24. The following description will be given taking the light-emitting panel having the configuration of 1 (FIG. 19(B)) as an example.

[0203] First, a peeling layer 303 is formed on a substrate 301, and an insulating layer 205 is formed on the peeling layer 303. Next, a plurality of transistors, a conductive layer 254, an insulating layer 207, and an insulating layer 208 are formed on the insulating layer 205. An edge layer 209, a plurality of light-emitting elements, and an insulating layer 211 are formed. Note that the conductive layer 254 is exposed. In this manner, openings are formed in the insulating layer 211, the insulating layer 209, and the insulating layer 207 (FIG. 23(A)). ).

[0204] In addition, a peeling layer 307 is formed on the formation substrate 305, and an insulating layer 255 is formed on the peeling layer 307. Next, a light-shielding layer 257, a colored layer 259, and an insulating layer 261 are formed on the insulating layer 255. (Figure 23(B)).

[0205] The substrates 301 and 305 are made of glass, quartz, and surface treatment. A fiber substrate, a ceramic substrate, a metal substrate, or the like can be used.

[0206] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as glass and barium borosilicate glass can be used. If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0207] When a glass substrate is used as the substrate for fabrication, a silicon oxide film, an acid film, or the like is formed between the substrate for fabrication and the peeling layer. When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon nitride oxide film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0208] The peeling layer 303 and the peeling layer 307 are made of tungsten, molybdenum, and titanium, respectively. Niobium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of palladium, osmium, iridium, and silicon; It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

[0209] The release layer can be formed by sputtering, plasma CVD, coating, printing, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

[0210] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of silicon and molybdenum may be formed. The mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0211] In addition, a layer containing tungsten and a layer containing tungsten oxide may be used as a peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer made of oxide is formed on top of it. By forming a film, a tungsten oxide film is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to thermal oxidation. Oxidizing agents such as oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozone water A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0212] Note that an insulating layer is provided between the insulating layer 205 or the insulating layer 255 and the peeling layer, and the insulating layer is then removed in a later step. The peeling can also occur at the interface between the edge layer and the insulating layer 205 or the insulating layer 255. For example, a silicon nitride film, a silicon oxynitride film, a silicon nitride oxide film, or the like may be used as a single layer or multiple layers. It is preferably formed in layers.

[0213] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 100° C. or lower, a dense membrane with extremely low water permeability can be obtained.

[0214] Thereafter, the surface of the production substrate 305 on which the colored layer 259 and the like are provided or the light-emitting element of the production substrate 301 is A material for the sealing layer 213 is applied to the surface on which the element 230 and the like are provided, and the sealing layer 213 is then applied to the surface on which the element 230 and the like are provided. The surfaces are glued together (Figure 23(C)).

[0215] Then, the fabricated substrate 301 is peeled off, and the exposed insulating layer 205 and substrate 201 are bonded to the adhesive layer 20 3. Also, the manufacturing substrate 305 is peeled off, and the exposed insulating layer 255 and the substrate 24(A), the substrate 181 is bonded to the conductive layer 185. Although the conductive layer 254 does not overlap with the substrate 181, the conductive layer 254 and the substrate 181 may overlap with each other.

[0216] For example, a peeling layer may be formed by a method using a film made of a material such as a resin. When a layer containing a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the film. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, laser light The amorphous silicon film is removed by irradiation or etching, and the layer to be peeled is separated from the substrate. The peeling layer can be peeled off from the peeled layer. The metal oxide film is weakened by crystallization, and a part of the peeling layer is then dissolved in a solution or NF. 3. After removal by etching using fluoride gases such as BrF3 and ClF3, the weakened It can be peeled off from the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (for example, amorphous silicon film containing hydrogen, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by releasing the peeled layer may also be used. The substrate is mechanically removed or etched with a solution or fluorinated gas such as NF3, BrF3, or ClF3. In this case, the peeling layer can be removed without providing a peeling layer. good.

[0217] Furthermore, by combining a plurality of the above peeling methods, the peeling process can be carried out more easily. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the peeled layer easier to peel off. Peeling can also be performed by physical force (using a machine, etc.).

[0218] In addition, a liquid is allowed to penetrate into the interface between the peeling layer and the layer to be peeled, and the layer to be peeled is peeled from the substrate. Furthermore, the peeling may be performed while pouring a liquid such as water on the film.

[0219] As for other peeling methods, if the peeling layer is made of tungsten, ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0220] Note that if peeling can be performed at the interface between the formation substrate and the peeled layer, a peeling layer may not be provided. For example, glass is used as the substrate, and an organic resin such as polyimide is formed in contact with the glass. Then, insulating films, transistors, etc. are formed on the organic resin. In this case, the organic resin is heated. This allows separation at the interface between the substrate and the organic resin. A metal layer is placed between the resin and the organic resin, and an electric current is passed through the metal layer to heat the metal layer. Peeling may occur at the interface of the oil.

[0221] Finally, the insulating layer 255 and the sealing layer 213 are opened to expose the conductive layer 254. (FIG. 24(B)). In the case where the substrate 181 overlaps the conductive layer 254, The adhesive layer 185 is also opened (FIG. 24(C)). The means for opening is not particularly limited. Laser ablation, etching, ion beam sputtering, etc. In addition, a sharp blade or the like is used to make a cut in the film on the conductive layer 254, and the film is cut by physical force. You can also tear off a portion of it.

[0222] In this manner, a light-emitting panel can be manufactured.

[0223] As described above, the light-emitting panel of this embodiment includes the substrate 181 and the substrate 201 or the substrate The touch sensor is also included in the configuration. By minimizing the number of substrates, the light extraction efficiency can be improved. This makes it easier to improve the image quality and clarity of the display.

[0224] This embodiment mode can be combined with other embodiment modes as appropriate.

[0225] (Fourth embodiment) In this embodiment mode, a light-emitting panel that can be used in an information processing device will be described with reference to FIG. This will be used to explain.

[0226] The light-emitting panel shown in FIG. 25 includes a substrate 401, a transistor 240, a light-emitting element 230, an insulating layer 207, insulating layer 209, insulating layer 211, insulating layer 217, space 405, insulating layer 261, The light-receiving layer 257, the colored layer 259, the light-receiving element (p-type semiconductor layer 271, i-type semiconductor layer 273, and n-type semiconductor layer 275), conductive layer 281, conductive layer 283, insulating layer 291, insulating layer 2 93, an insulating layer 295, and a substrate 403.

[0227] The light-emitting panel includes a light-emitting element 230 and a light-receiving element between a substrate 401 and a substrate 403. The adhesive layer (not shown) is arranged in a frame shape so as to enclose the substrate 401 and the substrate. The light emitting element 230 is sealed by the plate 403 .

[0228] In the light-emitting panel of this embodiment, the substrate 403 has a light-transmitting property. The light emitted passes through the colored layer 259, the substrate 403, and the like and is extracted into the atmosphere.

[0229] The light-emitting panel of this embodiment is a touch-operable light-emitting panel. The proximity or contact of an object to the surface of the substrate 403 can be detected using an optical element.

[0230] Optical touch sensors have no effect on detection accuracy even if the surface that the object to be detected comes into contact with is scratched. Optical touch sensors are also preferable because they are non-contact sensing devices. It is possible to apply it to a display device without reducing the clarity of the image, and it is possible to apply it to a large light-emitting panel or a display. It also has the advantage of being applicable to display devices.

[0231] When the optical touch sensor is provided between the substrate 403 and the space 405, the light emitted by the light emitting element 230 This is preferable because it is less susceptible to the influence of the above and can improve the S / N ratio.

[0232] The light-shielding layer 257 is located above the light-emitting element 230 and overlaps the light-receiving element. Therefore, it is possible to prevent the light emitted by the light emitting element 230 from being irradiated onto the light receiving element.

[0233] There is no particular limitation on the materials used for the substrate 401 and the substrate 403. The substrate on the other side is made of a material that transmits light. For example, glass, quartz, ceramic, or surface Materials such as fiber and organic resin can be used. The substrate on the side where light is not extracted is transparent. Since it is not necessary for the substrate to have optical properties, metal materials and alloy materials can be used in addition to the substrates listed above. A metal substrate or the like can also be used. The substrate materials exemplified in the embodiment can also be used.

[0234] The sealing method of the light-emitting panel is not limited, and may be, for example, solid sealing or hollow sealing. For example, glass materials such as glass frit and two-component resins that harden at room temperature are suitable. Resin materials such as photocurable resin, photocurable resin, and thermosetting resin can be used. The space 405 may be filled with an inert gas such as nitrogen or argon, and the sealing layer 21 It may be filled with the same resin as in 3. In addition, the resin may contain the above-mentioned desiccant, a high refractive index Fillers or scattering materials may also be included.

[0235] This embodiment mode can be combined with other embodiment modes as appropriate. [Explanation of symbols]

[0236] 100 Information processing device 102 Display section 102a Display section 102b Display section 104 Drive circuit section 104g_1 Gate driver 104g_1A Gate Driver 104g_1B Gate Driver 104g_2 Gate driver 104g_2A Gate Driver 104g_2B Gate Driver 104g_2C Gate Driver 104g_2D Gate Driver 104g_3 Gate driver 104g_4 Gate driver 104g_5 Gate driver 104s_1 source driver 104s_2 source driver 104s_3 Source Driver 104s_4 source driver 105 Display Panel 106 Detection unit 108 Arithmetic section 110 Storage section 120 areas 150 Information processing equipment 152 Display Panel 153a Support Panel 155a Support Panel 155b Support panel 180 element layer 181 PCB 182 Light extraction section 184 Drive circuit section 185 Adhesive layer 186 FPC 186a FPC 186b FPC 201 Substrate 202 Substrate 203 Adhesive layer 205 Insulation Layer 207 Insulating layer 208 Conductive Layer 209 Insulating Layer 209a Insulating layer 209b Insulating layer 211 Insulating layer 212 Conductive layer 213 Sealing layer 215 Connectors 215a Connector 215b Connector 217 Insulating Layer 230 Light-emitting element 231 Lower electrode 233 EL layer 235 Upper electrode 240 transistors 253 Conductive Layer 254 Conductive Layer 255 insulating layer 257 Light blocking layer 259 Colored layer 261 Insulating Layer 270 Conductive Layer 271 p-type semiconductor layer 272 Conductive Layer 273 i-type semiconductor layer 274 Conductive Layer 275 n-type semiconductor layer 276 Insulating Layer 278 Insulating Layer 280 Conductive Layer 281 Conductive Layer 283 Conductive Layer 291 Insulating Layer 292 Conductive particles 293 Insulating Layer 294 Conductive Layer 295 Insulating Layer 296 Conductive Layer 301 Fabricated substrate 303 Peeling layer 305 Fabrication substrate 307 Peeling layer 310a conductive layer 310b conductive layer 401 Substrate 403 Substrate 405 Space 901 Transistor 902 Capacitor element 903 Transistor 904 Light-emitting element 905 Wiring 906 Wiring 907 Wiring 907A Wiring 907B wiring 907C wiring 907D Wiring 907E wiring 907F wiring 908 Wiring 909 pixels 911 Circuit 912 Source driver circuit 913 Circuit 913A Gate Driver 913B Gate Driver 914 Gate Driver 915 circuits 916 circuits 916A Circuit 916B Circuit 917A Switch 917B Switch 917C Switch 917D Switch 917E Switch 917F Switch 918 Wiring 918A Wiring 918B wiring 919 AND circuit 920 Wiring 921 circuits 922 AND circuit 923 Wiring

Claims

[Claim 1] a flexible display unit; a plurality of drive circuit units arranged on the outer periphery of the display unit; a detection unit for identifying the external shape of the display unit; a calculation unit that supplies image information to the drive circuit unit; a storage unit that stores a program to be executed by the calculation unit, the detection unit detects a first configuration in which the display unit is unfolded or a second configuration in which the display unit is folded, the program performs low power consumption processing and degradation correction processing according to the first form or the second form, 1. An information processing device comprising:

Images