Cleaning method for semiconductor chip gap

Abstract

To provide a cleaning method for a semiconductor chip gap.SOLUTION: The present invention provides a cleaning method for a semiconductor chip gap, and can improve the cleaning effect and efficiency by thoroughly cleaning till the depth of each gap between chips and at the same time shorten the cleaning time. This method is used for cleaning the gap of a plurality of chips that are fixed to a substrate with a flux, have an edge path at four sides along the outer periphery after cutting, and have a checker board shaped gap path formed on the inside, and has the following procedure: the gap is cleaned following a cleaning path. The shift of the cleaning path includes a sawtooth path and a nozzle used at the cleaning in step 1 is a fluid nozzle.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor technology, and more particularly to a method for cleaning gaps between semiconductor chips, which penetrates deep into the gaps between the chips and cleans them thoroughly. [Background technology]

[0002] With the rapid development of semiconductor technology, the demand for smaller chips and higher performance is constantly increasing. Chip cleaning is extremely important in this process, as even the smallest contamination can have a serious impact on chip performance. Traditional semiconductor chip cleaning methods have mainly used line-type and rotary-type cleaning machines, but they face many challenges when dealing with modern high-density, high-precision chips.

[0003] While line-type cleaning machines can process large volumes of chips, they consume a lot of fluid and are unable to clean the narrow gaps of high-precision chips thoroughly and uniformly. Furthermore, their large size poses significant challenges in production environments with limited space.

[0004] Rotary cleaners use centrifugal force to remove chemicals from chips, but the cleaning effect is uneven depending on the part of the chip, and the centrifugal force is particularly weak near the center of the chip, resulting in insufficient cleaning.In addition, high-speed rotation is required for effective cleaning, which increases chemical splashing, extends cleaning time, and increases consumable costs. Summary of the Invention [Problem to be solved by the invention]

[0005] In light of the above, the present invention aims to provide a method for cleaning gaps between semiconductor chips that thoroughly cleans each gap between chips, improving cleaning effect and efficiency while shortening cleaning time, thereby overcoming the limitations of prior art high-precision chip cleaning and providing a highly efficient and comprehensive cleaning solution for the semiconductor manufacturing industry. [Means for solving the problem]

[0006] To achieve the object of the present invention, there are two technical means.

[0007] The first technical solution is a method for cleaning gaps between semiconductor chips, which is used to clean gaps between multiple chips that are fixed to a substrate by flux and have edge paths formed on their four outer peripheries and checkerboard-shaped spacing paths formed inside after cutting, and includes the following steps: Step 1: Clean the gaps according to the cleaning path, and perform the above steps until all gaps are clean; The cleaning pass is composed of pass 1, pass 2, and pass 3, The path 1 passes through the edge path on one side of the substrate and passes through all the chips, The second path turns to the adjacent edge path, and turns again after passing one chip. The third path goes through all the chips in the interval path. Circulating pass 2 and pass 3 at least once and continuing until the edge pass ends on the opposite side of the substrate; The cleaning path movement exhibits a sawtooth path, and the nozzle used in step 1 is a fluid nozzle.

[0008] In the above technical means, the pressure of the nozzle is 5-125 kgf / cm 2 .

[0009] In the above technical means, the nozzle can be tilted toward the cleaning path.

[0010] In the above technical means, the inclination angle of the nozzle is 0 to 45 degrees.

[0011] In the above technical means, the nozzle is detachable and easy to replace or adjust.

[0012] The second technical means is a method for cleaning gaps between multiple chips that are similarly fixed to a substrate with flux and have edge paths formed on the four outer edges and checkerboard-shaped spacing paths formed inside after cutting, and includes the following steps: Step 1: Clean the gap according to the cleaning path; Step 2: rotating the mounting table to drive the substrate; Repeat the above steps until all gaps are clean. Steps 1 to 2 are considered as one cleaning flow, and step 2 is performed at least once during the cleaning process, and this is continued until the gap is clean; The cleaning pass is composed of pass 1, pass 2, and pass 3, The path 1 passes through the edge path on one side of the substrate and passes through all the chips, The second path turns to the adjacent edge path, and turns again after passing one chip. The third path goes through all the chips in the interval path. Circulating pass 2 and pass 3 at least once and continuing until the edge pass ends on the opposite side of the substrate; the movement of the cleaning path exhibits a sawtooth path; The nozzle used in steps 1 and 2 is a fluid nozzle.

[0013] In the above technical means, the pressure of the nozzle is 5-125 kgf / cm 2 .

[0014] In the above technical means, the nozzle can be tilted toward the cleaning path and the second cleaning path.

[0015] In the above technical means, the inclination angle of the nozzle is 0 to 45 degrees.

[0016] In the above technical means, the nozzle is detachable and can be easily replaced or adjusted.

[0017] In the above technical means, the rotation angle range of the mounting table in step 2 is 90 degrees. [Effects of the Invention]

[0018] By adopting the technical means of the present invention, the following effects can be obtained compared to the prior art.

[0019] First, by performing step 1, the present invention allows the nozzle to penetrate deep into each narrow gap of the chip, allowing the cleaning solution to reach every corner of the chip, improving the cleaning effect, reducing contaminant residue, and improving product yield.

[0020] Second, the present invention uses a fluid nozzle to distribute the cleaning fluid evenly, improving the uniformity, penetration and quality of cleaning, especially in narrow gaps, and reducing the risk of contaminant residue.

[0021] Third, in the present invention, the cleaning flow from step 1 to step 2 can be carried out to complete the entire cleaning in a short time, thereby saving time and improving production efficiency.

[0022] Fourth, highly efficient and precise cleaning reduces the amount of cleaning fluid and other consumables used, reducing waste and lowering costs.

[0023] Fifth, the semiconductor chip gap cleaning method of the present invention is applicable to chips of different sizes and types, has high adaptability, and can be widely applied to various semiconductor manufacturing processes. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a diagram showing a solid body of the present invention; [Figure 2] FIG. 2 is a diagram showing steps of a first embodiment of the present invention. [Figure 3] FIG. 10 is a diagram showing an edge path and an interval path in the present invention. [Figure 4] FIG. 2 is a diagram illustrating the operation of the first exemplary embodiment of the present invention. [Figure 5] FIG. 10 is a diagram showing flow steps of a second embodiment of the present invention. [Figure 6] FIG. 10 is a diagram illustrating the operation of the second exemplary embodiment of the present invention. [Figure 7] FIG. 10 is a diagram illustrating the operation of the second exemplary embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0025] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the drawings. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention.

[0026] As shown in Figures 1 to 4, a first embodiment of the present invention is a method for cleaning gaps between semiconductor chips, which is used to clean gaps (13) between multiple chips (12) that are fixed to a substrate 20 with flux (10) and have edge paths (121) on their four outer edges and checkerboard-shaped spacing paths (122) formed inside after cutting, and includes the following steps:

[0027] Step 1 (1): Cleaning the gaps (13) according to the cleaning path (11). This step is repeated until all gaps (13) are cleaned. The cleaning path (11) is composed of path 1 (A), path 2 (B), and path 3 (C). Path 1 (A) passes through the edge path (121) on one side of the substrate (20) and passes all chips (12). Path 2 (B) turns to the adjacent edge path (121) and turns again after passing one chip (12). Path 3 (C) enters the spacing path (122) and passes all chips (12). Path 2 (B) and path 3 (C) circulate at least once and continue until the end of the edge path (121) on the opposite side of the substrate (20). The cleaning path (11) moves in a sawtooth pattern to clean the gaps (13). The nozzle (15) used in step 1 (1) is a fluid nozzle.

[0028] As described above, by performing step 1 (1), the nozzle (15) penetrates deeply into each narrow gap (13) of the chip (12), allowing the cleaning solution to reach every corner of the chip (12), effectively cleaning the gap (13), and improving the cleaning effect. Furthermore, thorough cleaning of the gap (13) reduces residual contaminants, contributing to improved product yield.

[0029] Secondly, since the nozzle (15) is a fluid nozzle, the cleaning liquid can be distributed more evenly, improving the uniformity, penetration and quality of cleaning, especially in the narrow gap (13) of the tip (12), and reducing the risk of contaminant residue.

[0030] In addition, by performing the sawtooth cleaning pass (11) in step 1 (1), the entire cleaning can be completed in a short time, saving time and improving production efficiency.

[0031] Additionally, the high efficiency and precision of the cleaning process reduces the use of cleaning fluids and other consumables, reducing waste and costs.

[0032] In addition, the semiconductor chip gap cleaning method of the present invention can be applied to chips (12) of different sizes and types, has high adaptability, and can be widely applied to various semiconductor manufacturing processes.

[0033] As shown in Figures 5 to 7, a second embodiment of the present invention is a method for cleaning the gaps (13) between multiple chips (12) that are fixed to a substrate (20) with flux (10) and have edge paths (121) formed on the four outer edges after cutting and checkerboard-shaped spacing paths (122) formed inside, and includes the following steps.

[0034] Step 1 (1): Clean the gap (13) according to the cleaning path (11); Step 2 (2): Rotate the mounting table (14) and drive the substrate (20); Repeat the above steps until all the gaps (13) are clean; Steps 1 (1) to 2 (2) constitute one cleaning flow (100), and Step 2 (2) is performed at least once during the cleaning process, and continues until the gaps (13) are clean; the cleaning path (11) includes path 1 (A), path 2 (B), and The cleaning path (11) is composed of a first path (A) that passes through the edge path (121) on one side of the substrate (20) and passes all of the chips (12), a second path (B) that turns to the adjacent edge path (121) and turns again after passing one chip (12), and a third path (C) that enters the spacing path (122) and passes all of the chips (12). The cleaning path (11) moves in a sawtooth pattern to clean the gaps (13). The nozzle (15) used in steps (1) and (2) is a fluid nozzle.

[0035] As described above, in the second embodiment, the rotation of the mounting table (14) is added to step 2 (2) in comparison with the first embodiment, so that the coverage area of ​​the cleaning liquid is expanded and the comprehensiveness of the cleaning is improved.

[0036] Rotation allows the orientation of the chips (12) to be changed without moving the cleaning device, allowing cleaning to be completed more quickly and increasing overall efficiency.

[0037] Furthermore, the platform (14) can be rotated to adjust the rotation angle to suit different cleaning needs.

[0038] In the second embodiment, the rotation angle range of the stage 14 in step 2 is 90 degrees, which allows the cleaning solution to be evenly distributed to the edges and hard-to-reach areas of the chip 12 during the cleaning process, enabling omnidirectional cleaning in a short time and improving cleaning efficiency.

[0039] Additionally, different types of tips (12) may require different cleaning regimes, and the 90 degree rotation range provides ample flexibility to accommodate a variety of cleaning needs.

[0040] As shown in Figures 6 and 7, in the cleaning flow (100) of the present invention, first, the gaps (13) between each chip (12) after cutting are cleaned according to the cleaning path (11), and then the mounting table (14) is rotated to change the orientation of the chips (12). This flow is repeated as necessary to completely clean the gaps (13) between all chips (12).

[0041] In both embodiments, the pressure of the nozzle (15) is 5-125 kgf / cm 2 Within this range, the nozzle (15) can remove dirt with sufficient force, and it is highly effective in cleaning even in small gaps and hard-to-reach areas. The pressure can be adjusted according to the degree of contamination and the type of tip (12), using low pressure for light contamination and high pressure for stubborn contamination to deal with various levels of contamination. 2The following control reduces the risk of damage to chips (12), especially those with fragile or fine structures. Also, proper pressure ensures that the cleaning solution is evenly distributed throughout all gaps (13) of the chip (12), improving uniformity and penetration even in narrow or irregular spaces.

[0042] In both embodiments, the nozzle (15) can be tilted toward the cleaning path (11) and the second cleaning path, with the tilt angle ranging from 0 to 45 degrees. By adjusting the tilt angle of the nozzle (15), the coverage area of ​​the cleaning liquid can be expanded, allowing the contaminated area to be directly targeted for cleaning, improving cleaning efficiency, shortening cleaning time, and saving resources and costs.

[0043] In both embodiments, the nozzle (15) is detachable and easily replaceable or adjustable, facilitating cleaning and maintenance of the nozzle (15) and ensuring high-efficiency operation. In the event of a nozzle (15) failure, only the nozzle can be replaced, reducing maintenance costs and downtime. Furthermore, different types and sizes of nozzles (15) can be quickly replaced, flexibly responding to various cleaning needs and tip (12) sizes, shapes, and materials, ensuring optimal cleaning conditions at all times.

[0044] The above examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes or modifications made based on the structures, features and principles described in the claims of the present invention are included in the claims of the present invention. [Explanation of symbols]

[0045] 1 Step 1 2 Step 2 11 Cleaning Pass 12 chips 121 Edge Pass 122 Spacing Path 13 Gap 14 Mounting table 15 nozzles 10 Flux 20 PCB 100 Cleaning Flow A Pass 1 B Pass 2 C Pass III

Claims

1. A method for cleaning gaps (13) between a plurality of chips (12) in which a flux (10) is fixed on a substrate (20), and after cutting, edge paths (121) are formed on the four outer periphery sides and checkerboard-shaped spacing paths (122) are formed inside, comprising: It includes step 1 (1) of cleaning the gaps (13) according to the cleaning path (11) until all the gaps (13) are clean; The cleaning path (11) is composed of path 1 (A), path 2 (B), and path 3 (C), The first path (A) passes through the edge path (121) on one side of the substrate (20) and passes through all the chips (12); The second path (B) turns to the adjacent edge path (121) and turns again after passing one chip (12). The third path (C) enters the interval path (122) and passes through the entire chip (12), Circulating the second pass (B) and the third pass (C) at least once, and continuing until the end of the edge pass (121) on the other side of the substrate (20); The movement of the cleaning path (11) presents a sawtooth path. The method for cleaning gaps between semiconductor chips is characterized in that the nozzle (15) used in step 1 (1) is a fluid nozzle.

2. The pressure of the nozzle (15) is 5-125 kgf / cm ２ 2. The method for cleaning gaps between semiconductor chips according to claim 1, wherein:

3. 3. The method for cleaning gaps between semiconductor chips according to claim 2, wherein the nozzle (15) is tiltable toward the cleaning path (11).

4. 4. The method for cleaning gaps between semiconductor chips according to claim 3, wherein the inclination angle of the nozzle is 0 to 45 degrees.

5. 5. The method for cleaning gaps between semiconductor chips according to claim 4, wherein the nozzle (15) is detachable and can be easily replaced or adjusted.

6. A method for cleaning gaps (13) between a plurality of chips (12) in which a flux (10) is fixed on a substrate (20), and after cutting, edge paths (121) are formed on the four outer periphery sides and checkerboard-shaped spacing paths (122) are formed inside, comprising: Step 1 (1) of cleaning the gap (13) according to a cleaning path (11); and step (2) of rotating the mounting table (14) to drive the substrate (20), Repeat step 1 (1) and step 2 (B) until all gaps (13) are clean; Step 1 (1) to step 2 (2) are one cleaning flow (100), and step 2 (2) is performed at least once during the cleaning process, and continues until the gap (13) is clean; The cleaning path (11) is composed of path 1 (A), path 2 (B), and path 3 (C), The first path (A) passes through the edge path (121) on one side of the substrate (20) and passes through all the chips (12); The second path (B) turns to the adjacent edge path (121) and turns again after passing one chip (12). The third path (C) enters the interval path (122) and passes through the entire chip (12), Circulating the second pass (B) and the third pass (C) at least once, and continuing until the end of the edge pass (121) on the other side of the substrate (20); The movement of said cleaning path (11) presents a sawtooth path, The method for cleaning gaps between semiconductor chips is characterized in that the nozzle (15) used in the step 1 (1) and the step 2 (2) is a fluid nozzle.

7. The pressure of the nozzle (15) is 5-125 kgf / cm ２ 7. The method for cleaning gaps between semiconductor chips according to claim 6, wherein:

8. The nozzle (15) is tiltable towards the cleaning path (11), 8. The method for cleaning gaps between semiconductor chips according to claim 7, wherein the inclination angle of the nozzle is 0 to 45 degrees.

9. 9. The method for cleaning gaps between semiconductor chips according to claim 8, wherein the nozzle (15) is detachable and can be easily replaced or adjusted.

10. 10. The method for cleaning gaps between semiconductor chips according to claim 9, wherein the angle range of rotation of the mounting table (14) in step two (2) is 90 degrees.

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