Electronic device

Abstract

To provide an electronic device that is prevented from short-circuiting, made compact and lightweight, and improved in reliability.SOLUTION: An electronic device comprises: a bus bar module which has a bus bar and a mold member molding the bus bar and also provides with a bus bar exposed surface where a part of a principal surface of the bus bar is exposed; and a metal member which adjoins the bus bar module, wherein a barrier part having predetermined height is formed between the bus bar exposed surface and the metal member.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] In a power conversion device, semiconductor switching elements and a control board are connected to a bus bar, and the housing has a sealed structure to prevent short circuits caused by dust or the like coming into contact with electrical connection parts such as the bus bar. The power conversion device is also designed to cool by circulating a refrigerant through the housing to dissipate heat generated by the components inside the device. However, condensation or the like occurs when the air inside the housing is cooled, so it is necessary to prevent short circuits caused by condensation or the like. For example, Patent Document 1 listed below discloses a preventive measure in which the housing is spaced apart from the surface of the bus bar to prevent the effects of condensation. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6654257 Summary of the Invention [Problem to be solved by the invention]

[0004] In view of the technology described in Patent Document 1, an object of the present invention is to provide an electronic device that prevents short circuits and achieves miniaturization, weight reduction, and improved reliability. [Means for solving the problem]

[0005] The electronic device comprises a busbar module having a busbar and a molding member that molds the busbar and provides a busbar exposed surface on which a portion of the main surface of the busbar is exposed, and a metal member adjacent to the busbar module, and a partition portion of a predetermined height is formed between the busbar exposed surface and the metal member. [Effects of the Invention]

[0006] It is possible to provide an electronic device that is smaller, lighter, and more reliable. [Brief explanation of the drawings]

[0007] [Figure 1] Overall exploded view of the power conversion device [Figure 2] A plan view of the power conversion device of FIG. 1 as seen from the cover side. [Figure 3] 3 is a cross-sectional view taken along line AA of FIG. 2 according to one embodiment of the present invention; [Figure 4] FIG. 1 is a diagram showing a configuration of a busbar module according to an embodiment of the present invention. [Figure 5] Exploded view of the busbar module in Figure 4 DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The following description and drawings are examples for explaining the present invention, and some omissions and simplifications have been made as appropriate for clarity of explanation. The present invention can be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

[0009] In order to facilitate understanding of the invention, the position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc. Therefore, the present invention is not necessarily limited to the position, size, shape, range, etc. disclosed in the drawings.

[0010] (One embodiment and overall configuration) (Figure 1) The power conversion device 1, which is an electronic device, includes a water channel cover 2, a housing 3, a power conversion module 7, a capacitor element 10, a busbar module 11, a control board 14, and a cover 15.

[0011] The water channel cover 2 is fixed to the housing 3 to form a refrigerant flow path within the housing 3 that cools the power conversion modules 7. The housing 3 is a metal case, and is provided with a refrigerant inlet 5 and a refrigerant outlet 6 for introducing a refrigerant from the outside into the formed refrigerant flow path. The multiple power conversion modules 7 incorporate semiconductor elements (not shown). The AC bus bar 8 transmits power converted from DC to AC by switching in the power conversion modules 7 to external devices such as motors (not shown).

[0012] Capacitor element 10 is fixed inside housing 3 by potting resin 9, and smooths ripple current generated by switching in power conversion module 7. Busbar module 11 is connected to capacitor element 10, and transmits to power conversion module 7 a direct current that is supplied from a battery (not shown) and smoothed by capacitor element 10.

[0013] The control board 14 is electrically connected to the power conversion module 7 through the base plate 13, and controls the switching of the power conversion module 7 using an external higher-level control signal (not shown). The AC power transmitted to the motor is detected by a current sensor 12 arranged between the power conversion module 7 and the AC bus bar 8, and the detected value is transmitted to the control board 14.

[0014] All of the above-mentioned components are housed and fixed inside the housing 3, and a cover 15 is fixed to the opening end face of the housing 3, thereby making the inside of the housing 3 dustproof. The housing 3 is provided with an air vent (not shown), and a waterproof filter 4 is fitted into this air vent, thereby preventing water from entering the inside of the power conversion device 1 and ensuring ventilation between the inside and outside of the power conversion device 1.

[0015] (Figs. 2 to 5) The busbar module 11 includes a positive busbar 16 and a negative busbar 17, each having terminal portions 19 formed thereon for connection to a plurality of power conversion modules 7, and an insulating plate 20, which is an insulating member stacked between the positive busbar 16 and the negative busbar 17. The busbar module 11 further includes a molding member, which is a molding resin 21 that molds the busbars while leaving portions of the main surfaces of the busbars exposed. The positive busbar 16, the negative busbar 17, and the insulating plate 20 are integrally formed into a laminated structure by the molding resin 21.

[0016] With this laminated structure, the positive bus bar 16 and the negative bus bar 17 are insulated by the insulating plate 20, resulting in low inductance due to the mutual inductance effect, and enabling fine control of electronic components, thereby reducing power loss.

[0017] The busbar module 11 is fixed inside the housing 3 of the power conversion device, thereby improving earthquake resistance and ensuring reliability even in a vibrating environment such as an automobile. The busbar module 11 is adjacent to the housing 3, which is a metal member, and includes a partition wall 18 having a predetermined height between the housing 3 and the busbar exposed surface 11a of the positive busbar 16.

[0018] The partition wall 18 is a part of the molded resin 21 and is formed to protrude from the molded resin 21. As a result, the partition wall 18 is made of an insulating material and there is no need to add a new part to provide the partition wall 18, so it is possible to ensure insulation and improve productivity at the same time, which also contributes to cost reduction.

[0019] The partition wall 18 can prevent the risk of short-circuiting between the busbar module 11 and the housing 3 via the condensed water 22, which may occur when condensed water 22 forms and adheres between the housing 3 and the busbar module 11 or on the surface of the busbar module 11, as shown in the figure. The partition wall 18, which is made of an insulating material, can reduce the distance between the busbar module 11 and the housing 3 while ensuring sufficient insulation between the busbar module 11 and the housing 3 and preventing short-circuiting. This allows the busbar module 11 to be placed closer to the wall surface of the housing 3, which contributes to the miniaturization and weight reduction of the power conversion device 1 and improves reliability at low cost.

[0020] The height of the partition wall portion 18 takes into consideration the rise in the liquid level of the condensed water 22 due to capillary action, and when the distance between the housing 3 and the partition wall portion 18 is distance D and the distance from the busbar exposed surface 11a to the apex of the partition wall portion 18 is distance L, the effects of the present invention can be achieved if the relationship L>0.3 / D holds.

[0021] 3 shows a configuration in which one side of the positive bus bar 16 is exposed, the arrangement of the positive bus bar 16 and the negative bus bar 17 may be reversed, or one side of the negative bus bar 17 may be exposed, and a partition wall 18 may be provided between the housing 3 and the exposed surface 11a of the negative bus bar 17. Also, as shown in FIG. 4, a configuration in which one side of the positive bus bar 16 and one side of the negative bus bar 17 are exposed, and a partition wall 18 may be provided between each exposed surface 11a and the housing 3. Furthermore, in the bus bar module 11, when the surfaces of the positive bus bar 16 and the negative bus bar 17 are exposed from both sides, a partition wall 18 may not be provided on the side with the least amount of exposed surface 11a.

[0022] By providing the partition wall portion 18, insulation from the housing 3 is ensured even for stacked bus bars, as shown in FIG. 4, and insulation is also ensured even when bus bar exposed surfaces 11a are present on both sides of the bus bar module 11.

[0023] According to the embodiment of the present invention described above, the following advantageous effects are achieved.

[0024] (1) Electronic device 1 includes bus bar module 11 having a bus bar and molded member 21 that molds the bus bar and provides bus bar exposed surface 11a where a portion of the main surface of the bus bar is exposed, and metal member 3 adjacent to bus bar module 11, and partition wall 18 of a predetermined height is formed between bus bar exposed surface 11a and metal member 3. This makes it possible to provide electronic device 1 that is smaller, lighter, and more reliable.

[0025] (2) The partition wall 18 is a part of the molded member 21 and is formed to protrude from the molded member 21. This makes it possible to ensure insulation and improve productivity at the same time, which also contributes to cost reduction.

[0026] (3) The busbars include a positive busbar 16 and a negative busbar 17, and the busbar module 11 has an insulating member 20 laminated between the positive busbar 16 and the negative busbar 17. This configuration makes it possible to achieve low inductance.

[0027] (4) The molded member 21 exposes one surface of the positive bus bar and one surface of the negative bus bar, and the partition wall 18 is provided between each exposed surface 11a and the metal member 3. This arrangement makes it possible to ensure insulation and achieve compactness at the same time.

[0028] (5) The metal member 3 is a housing 3 that houses the bus bar module 11. By doing so, the earthquake resistance of the bus bar module 11 can be improved.

[0029] The present invention is not limited to the above-described embodiments, and various modifications and combinations of other configurations are possible without departing from the spirit of the present invention. Furthermore, the present invention is not limited to those having all of the configurations described in the above-described embodiments, and includes those in which some of the configurations are omitted. [Explanation of symbols]

[0030] 1 Power conversion device 2 Waterway Cover 3. Housing 4. Waterproof filter 5 Refrigerant inlet 6 Refrigerant outlet 7 Power Conversion Module 8 AC bus bar 9 Potting resin 10 Capacitor element 11 Busbar module 11a Exposed bus bar surface 12 Current Sensor 13 Base plate 14 Control board 15 Cover 16 Positive bus bar 17 Negative bus bar 18 Bulkhead 19 Terminal section 20 Insulating plate 21 Molding resin 22 Condensation water

Claims

1. a bus bar module including a bus bar and a molding member that molds the bus bar and provides a bus bar exposed surface on which a part of a main surface of the bus bar is exposed; a metal member adjacent to the busbar module, A partition wall having a predetermined height is formed between the bus bar exposed surface and the metal member. electronic equipment.

2. The partition wall is a part of the molding member and is formed to protrude from the molding member. The electronic device of claim 1 .

3. The bus bars include a positive bus bar and a negative bus bar, The bus bar module has an insulating member laminated between the positive bus bar and the negative bus bar.

3. The electronic device of claim 2.

4. the molding member exposes one surface of the positive bus bar and one surface of the negative bus bar, The partition wall is provided between each exposed surface and the metal member. The electronic device of claim 3 .

5. The metal member is a housing that houses the busbar module.

5. The electronic device of claim 4.

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