Dynamic burn-in test system and dynamic burn-in test method

Abstract

To provide a dynamic burn-in test system and a dynamic burn-in test method capable of running an optimal burn-in test in accordance with the specification or the state of a specific test object.SOLUTION: A dynamic adjustment module is electrically connected to at least one signal generation module and at least one burn-in board, receives dynamic test parameters from the at least one signal generation module, and, together with the signal generation module, modulates the at least one burn-in board to perform a dynamic burn-in test on at least one defective test specimen in accordance with the dynamic test parameters.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a semiconductor test system and test method, and more particularly to a dynamic burn test system and dynamic burn test method. [Background technology]

[0002] Burn-in testing is primarily used to screen for potential risks of failure or malfunction in semiconductor products due to factors such as manufacturing process defects or design flaws.

[0003] Through harsh environmental factors (variables such as high temperature or temperature difference, large current, high voltage, etc.) in burn tests, chip defects and failures caused by changes in the external environment are detected, preventing problems that may occur when end users use the product. Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a typical burn test architecture, to improve test efficiency, multiple DUTs (devices under test, specimens) are usually tested simultaneously on a single burn board, but the parameters pre-programmed into different test subjects on the same burn board are all the same.

[0005] In other words, the current architecture of burn testing does not allow optimal burn testing to be performed according to the specifications or state of a particular test target, and there is still room for improvement in this regard. [Means for solving the problem]

[0006] In view of the above problems, the present invention has the following configuration. A dynamic burn test system comprising at least one burn plate, at least one signal generating module, and a dynamic adjustment module, the at least one burn plate is adapted to be electrically connected to a plurality of analytes; the at least one signal generating module is electrically connected to the at least one burn plate and is used to control the plurality of specimens to perform testing, and is also adapted to determine at least one failed specimen in the plurality of specimens in response to test results of the plurality of specimens, and to transmit simulation test data to the at least one failed specimen; The at least one signal generating module controls the at least one failed specimen to execute the simulation test data to generate a simulation test result, and generates a dynamic test parameter in response to the simulation test result; The dynamic adjustment module is electrically connected to the at least one signal generating module and the at least one burn plate, receives the dynamic test parameters from the at least one signal generating module, and modulates the at least one burn plate in accordance with the signal generating module so that the dynamic test parameters perform a dynamic burn test on the at least one failed specimen.

[0007] Also, the at least one burn plate comprises a substrate, a plurality of test sockets, a temperature control module, and a power control module; the plurality of test sockets are electrically connected to the substrate; the temperature control module is electrically connected to the substrate, and the temperature control module is controlled by the dynamic adjustment module to adjust the temperature of each of the test sockets; The power control module is electrically connected to the board, and is controlled by the dynamic adjustment module to adjust and output the voltage value of each of the test sockets.

[0008] The power control module also provides power at a reduced voltage value and an increased current value to each of the test sockets.

[0009] The dynamic adjustment module also includes a power supply module, a temperature distribution module, and a power distribution module, which are electrically connected to each other; the power supply module is used to supply power to the at least one burn plate, and the temperature distribution module is used to send a test temperature control signal to the temperature control module to test the temperature of each of the test sockets based on the dynamic test parameters; The power distribution module sends a test power control signal to the power control module according to the dynamic test parameters to adjust and output a voltage value for each of the test sockets.

[0010] Also, the at least one signal generating module includes a storage module and a processor electrically connected to each other; The storage module stores a lookup table, the lookup table including a plurality of test results and a plurality of group test parameters, and the at least one signal generation module finds one of the corresponding plurality of test results from the lookup table based on the simulation test result, and outputs one of the corresponding plurality of group test parameters to be the dynamic test parameter.

[0011] The processor may be a system on a chip, a field programmable gate array chip, or a high performance computing chip.

[0012] The specimen includes a plurality of processing cores, each of which includes at least one temperature observation circuit; When the at least one failed specimen executes the simulation test data, the at least one signal generating module reads the observation value of the at least one temperature observation circuit as the simulation test result.

[0013] Further, the number of the temperature control modules corresponds to the number of the plurality of test sockets, and the number of the power control modules corresponds to the number of the plurality of test sockets; Each of the test sockets is electrically connected to the temperature control module and the power control module, respectively.

[0014] The at least one signal generating module further includes a concentrator and a computing host, wherein the at least one signal generating module is a plurality of signal generating modules; The burn plates are electrically connected to the signal generating modules, respectively, and the signal generating modules are electrically connected to the computing host via the concentrator.

[0015] Also, a dynamic burn test method suitable for testing a plurality of specimens on a burn plate, comprising: utilizing a signal generating module to control and test the plurality of analytes and determine at least one failing analyte in the plurality of analytes in response to the test results of the plurality of analytes; The signal generating module transmits simulation test data to the at least one specimen, and controls the at least one failed specimen to execute the simulation test data, thereby generating a simulation test result; The signal generation module generates dynamic test parameters in response to the simulation test results and sends the dynamic adjustment module; The dynamic adjustment module modulates the burn plate in conjunction with the signal generation module so that the dynamic test parameters perform a burn test on the at least one failed specimen.

[0016] The signal generating module also controls the plurality of analytes to perform functional tests. The simulation test result is one of a voltage change value, a current change value, and a temperature change value.

[0017] Also, the dynamic test parameters include inputting at least one of a predetermined voltage value and a predetermined current value of the at least one failed specimen, and the temperature of the at least one failed specimen is controlled to a predetermined temperature value.

[0018] The signal generation module also generates the dynamic test parameters from a look-up table based on the simulation test results. [Effects of the Invention]

[0019] It is possible to provide a dynamic burn test system and a dynamic burn test method that can perform an optimum burn test according to the specifications or state of a specific test object. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a system block diagram according to an embodiment of the dynamic burn test system of the present invention. [Figure 2] 1 is a flowchart of an embodiment of a dynamic burn test method of the present invention. [Figure 3] FIG. 2 is a system block diagram of another embodiment of the dynamic burn test system of the present invention. [Figure 4] FIG. 2 is a block diagram of an embodiment of a signal generation module of the dynamic burn test system of the present invention. [Figure 5] FIG. 10 is a block diagram of another embodiment of the signal generation module of the dynamic burn test system of the present invention. [Figure 6] 1 is a logic diagram for implementing the burn test method of the dynamic burn test system of the present invention; [Figure 7] 1 is a flowchart illustrating a process for switching a burn test model in the dynamic burn test method of the present invention. [Figure 8] FIG. 1 is a block diagram illustrating an embodiment of a burn plate in a dynamic burn test system of the present invention. [Figure 9]4 is a flow chart of modulated test power parameters in the dynamic burn test method of the present invention. [Figure 10] 4 is a flow chart of modulated test power parameters in the dynamic burn test method of the present invention. [Figure 11] FIG. 10 is a block diagram showing another embodiment of the burn plate in the dynamic burn test system of the present invention. [Figure 12] 1 is a block diagram illustrating an embodiment of a test object in a dynamic burn test system of the present invention. [Figure 13] FIG. 2 is a schematic block diagram of another embodiment of the dynamic burn test system of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] An embodiment of the present invention will be described with reference to Figure 1. Figure 1 is a system block diagram of an embodiment of a dynamic burn test system of the present invention, which includes a burn-in board (a pre-fired substrate; the same applies hereinafter) 10, a signal generation module 20, and a dynamic adjustment module 30. The signal generation module 20 and the dynamic adjustment module 30 work together to perform dynamic burning, i.e., pre-writing, on at least one failed device on the burn board 10 based on the results of a simulation test of a device under test (DUT; hereinafter simply referred to as "device under test") D, which is the object to be measured.

[0022] 1 and 2, in which FIG. 2 is a flowchart of an embodiment of the dynamic burn test method of the present invention. A burn plate 10 is adapted to be electrically connected to a plurality of specimens D. A signal generating module 20 is electrically connected to the burn plate 10 and adapted to control the specimens D for testing, determine at least one failed specimen D among the specimens D in response to the test results of the specimens D, and transmit simulation test data to the failed specimens D, control the failed specimens D to perform the simulation test and generate simulation test results, and generate dynamic test parameters in response to the simulation test.

[0023] The dynamic adjustment module 30 is electrically connected to the signal generation module 20 and the burn plate 10, and is adapted for the signal generation module 20 to receive the dynamic test parameters. The dynamic adjustment module 30, in conjunction with (together with) the signal generation module 20, modulates the burn plate 10 to perform a dynamic burn-in test (hereinafter also simply referred to as a "dynamic burn test") on the failed specimen D using the dynamic test parameters.

[0024] The present invention will be described with reference to Figures 1 and 2. Based on the dynamic burn test system described above, the present invention provides another dynamic burn test method as follows.

[0025] Step S01: Using the signal generating module 20, control and test the specimen D, and determine at least one failed specimen D in the specimen D in response to the test result of the specimen D. In this embodiment, the signal generating module 20 controls the specimen D to perform a functional test and classifies the specimen D based on the result of the functional test.

[0026] Step S02: The signal generating module 20 sends the simulation test data to the failed specimen D, and controls the failed specimen D to execute the simulation test data and generate the simulation test result.

[0027] Step S03: The signal generating module 20 generates dynamic test parameters in response to the simulation test results and sends them to the dynamic adjusting module 30.

[0028] Step S04: The dynamic adjustment module 30 cooperates with the signal generation module 20 to modulate the failed specimen D to conform to the dynamic test parameters for the dynamic burn test.

[0029] The specimen D is a semiconductor component. In this embodiment, the specimen D of the dynamic burn test system and the dynamic burn test method of the present application is a high performance computing (HPC) chip.

[0030] Specimen D is an HPC chip, but is not limited to the following: a CPU (Central Processing Unit) chip, a HW accelerator chip (e.g., a GPU (Graphic Processing Unit) chip, a GPGPU (General-purpose computing on graphics processing units), FPGA (Field Programmable Gate Array chip, DSP (Digital Signal The chip may be a CPU (Chip), a CPU (Chip for Processing), a Tensor Processing Unit (TPU) chip, an Artificial Intelligence (AI) chip, other suitable HW accelerator chip, or a combination thereof, a memory chip (e.g., a high bandwidth memory (HBM)) chip, a graphics double-data rate (GDDR) memory chip, other suitable memory chip, or a combination thereof, an I / O chip, a communication chip, and a power management chip.

[0031] 1 and 3, which are block diagrams of another embodiment of the dynamic burn test system of the present invention. In this embodiment, a burn plate 10 includes a substrate 11 and a plurality of test sockets 12, and the test sockets 12 are electrically connected to the substrate 11 and to a specimen D to perform the dynamic burn test.

[0032] 3, the signal generating module 20 includes a processor 21 and a storage module 22 electrically connected to each other. The processor 21 performs various processes required by the signal generating module 20.

[0033] In this embodiment, the processor 21 may be a system on a chip (SOC), a field programmable gate array (FPGA) chip, or a high performance computing (HPC) chip. The chip may be, but is not limited to, a High Performance Computing (HPC) chip.

[0033] Reference will now be made to Figure 4, which is a block diagram of an embodiment of a signal generation module of the dynamic burn test system of the present invention. In some embodiments where the processor 21 of the signal generation module 20 is a system-on-chip (SOC), referring to Figure 4, a system single chip functions as the processor 21 and is integrated with a storage module 22 to form a single-chip type signal generation module 20. Reference will now be made to FIG. 5, which is a block diagram of another embodiment of a signal generation module of the dynamic burn test system of the present invention. In some embodiments in which the processor 21 of the signal generation module 20 is a field programmable gate array chip (FPGA), referring to FIG. 5, the field programmable gate array chip includes a first field programmable gate array chip (FPGA1) and a second field programmable gate array chip (FPGA2), the first field programmable gate array chip (FPGA1) functions as the processor 21, and the second field programmable gate array chip (FPGA2) and a storage module 22 constitute a test data processing module, which is electrically connected to the processor 21 to form the signal generation module 20.

[0034] The storage module 22 stores test data that is executable by the specimen D. That is, if the data that the specimen D can process is different, the test data will also be different.

[0035] In this embodiment, the test data may be, but is not limited to, an image file, a text file, an audio file, a video file, an application, or any other file or data that can be executed by the subject D.

[0036] In this embodiment, the test data includes simulation test data and a burn test model. The simulation test data is data for performing a simulation test on specimen D. The burn test model is test data executed during a dynamic burn test. That is, the simulation test data is determined based on the test results of specimen D in step S01, and the burn test model is determined based on the dynamic test parameters.

[0037] In these embodiments, storage module 22 may pre-store various simulation test data and burn test models suitable for various different specimens D for simulation testing and dynamic burn testing. Specifically, the simulation test data may be, but is not limited to, image files, text files, audio files, video files, applications, and other files or data that can be executed by specimen D.

[0038] In this embodiment, storage module 22 may be any type of fixed or removable random access memory (RAM), read-only memory (ROM), flash memory, hard disk drive (HDD), solid state drive (SSD), or similar component, or a combination of the above components.

[0039] An embodiment of the present invention will be described with reference to Figures 1 to 3 and 6. Here, Figure 6 is a schematic diagram of the logic for executing the burn test method of the dynamic burn test system of the present invention. The execution logic of the dynamic burn test method of the present invention is to execute a simulation test if specimen D is determined to be unsuccessful in the test of step S01.

[0040] In this embodiment, in step S01, the signal generating module 20 determines that the specimen D has failed based on the result of the functional test, and the basis for this determination is determined by the signal generating module 20.

[0041] In this embodiment, the determination method for determining that the specimen D has failed may be based on a condition such as the result of the functional test being greater than, less than, or not equal to a specific parameter, because the determined value of the specific parameter can be adjusted according to the importance of the test.

[0042] Therefore, the result of the function test can be used as a criterion for determining whether the function test is above or below a specific parameter, for example, when the data processing time exceeds a predetermined time, etc. In several embodiments, the result of the function test may be, for example, the number of functions that passed / failed when the specimen D was subjected to several function tests, but is not limited to this.

[0043] The present invention will be described with reference to Figures 1 to 3 and 6. In step S02, the processor 21 of the signal generating module 20 accesses the simulation test data in the storage module 22 in response to the test result of the specimen D in step S01. Then, the simulation test data corresponding to the specimen D is transmitted to the specimen D, and a simulation test using the specimen D is performed.

[0044] In some embodiments, steps S01 and S02 can be performed directly in a burn-in apparatus (combustion apparatus) in advance. Also, the test environment for performing step S02 (simulation test) can be the same as that for performing step S01. In other embodiments, environmental parameters, such as high temperature, for performing step S01 can also be canceled, and step S02 can be performed at room temperature.

[0045] Furthermore, when the specimen D generates a simulation test result, the processor 21 of the signal generation module 20 receives the simulation test result and generates dynamic test parameters based on the simulation test result.

[0046] In some embodiments, the simulation test results include at least one of a voltage change value, a current change value, and a temperature change value.

[0047] In other embodiments, the simulation test results may be the time it takes for Specimen D to process the test data, the Thermal Design Power, the clock frequency, or any other parameter sufficient to identify the functionality or performance of Specimen D.

[0048] The dynamic adjustment module 30 adjusts the dynamic burn test parameters for each failed specimen D on the burn plate 10 based on the dynamic test parameters.

[0049] Referring to FIG. 6, in some embodiments, the dynamic burn test parameters include a burn test pattern, a test power parameter, and a test temperature parameter. In this embodiment, the burn test model refers to test contents such as test items, test methods, and judgment criteria of a dynamic burn test.

[0050] In some embodiments, the burn test models for steps S01 and S04 may be the same. In other embodiments, the burn test models for steps S01 and S04 may be different, for example, by omitting certain test items or adjusting the criteria for certain test items.

[0051] The test power parameter is a specific voltage value and a specific current value that is input to the failed specimen D for dynamic burn-in. The test temperature parameter is a specific test temperature at which the failed specimen D is dynamically pre-burned in.

[0052] That is, in these embodiments, in step S04, the specific method in which the dynamic adjustment module 30 cooperates with the signal generation module 20 to modulate the burn plate 10 is to adjust the burn test model with the failed specimen D input, test the power parameters and temperature parameters, and perform the dynamic burn-in test.

[0053] In some embodiments, a specific method for modulating the burn test model input by a failed specimen D is shown in FIG. 7. Here, FIG. 7 is a flowchart for switching the burn test model in the dynamic burn test method of the present invention. After the signal generation module 20 generates the dynamic burn test parameters in response to the simulation test results of the specimen D, the signal generation module 20 transmits the generated burn test model of the dynamic burn-in test parameters to the test socket 12 of the failed specimen D on the burn board 10.

[0054] 2 and 3, in some embodiments, the dynamic adjustment module 30 includes a power supply module 31, a power distribution module 32, and a temperature distribution module 33 electrically connected to one another.

[0055] In some embodiments, the power supply module 31 includes an A / D converter, receives AC power, converts AC power to DC power, and outputs DC power.

[0056] In this embodiment, in step S04, the dynamic adjustment module 30 sends a test power control signal to the burn plate 10 via the power distribution module 32 based on the parameters of the dynamic burn test, and a test temperature control signal is sent to the burn plate 10 via the temperature distribution module 33 based on the dynamic burn test parameters.

[0057] Reference is now made to Figure 8, which is a block diagram illustrating an embodiment of a burn plate in a dynamic burn test system of the present invention. In some embodiments, burn plate 10 also includes a power control module 13. Power control module 13 is electrically connected to substrate 11 and adjusts the voltage value output to each test socket 12 based on control of power distribution module 32 from dynamic adjustment module 30.

[0058] In some embodiments, the power control module 13 is a DC-DC converter, and the power supply module 31 of the dynamic adjustment module 30 provides power to the power control module 13 .

[0059] In this embodiment, a specific method for the dynamic adjustment module 30 to modulate the test power parameters of the burn plate 10 in step S04 is shown in FIG. 9. Here, FIG. 9 is a flowchart of modulating test power parameters in the dynamic burn test method of the present invention. After the signal generation module 20 generates dynamic burn test parameters including the test power parameters in response to the simulation test results of the specimen D, the signal generation module 20 sends a test power control signal to the power control module 13 of the burn plate 10 via the power distribution module 32. The power control module 13 of the burn plate 10 can supply corresponding power to the test socket 12 based on the test power control signal from the power distribution module 32.

[0060] In some embodiments, the power supply module 31 includes an A / D converter and the power control module 13 is a DC / DC converter.

[0061] The power supplied by the power supply module 31 has a first voltage value and a first current value, and after the power control module 13 receives the power supplied from the power supply module 31, the first voltage value decreases and the first current value increases at the same time. This allows a dynamic burn test to be performed on a failed specimen D in the test socket 12 using power with a decreased voltage value and an increased current value.

[0062] Therefore, the power supply module 31 only needs to provide normal voltage and current values ​​to the burn plate 10, and can supply power with a reduced voltage and increased current value to the test socket 12 via the power control module 13 on the burn plate 10, and the power supply module 31 does not need to be designed to be able to pass a larger current as the number of specimens D increases.

[0063] 8, in some embodiments, the burn plate 10 also includes a temperature control module 14, which is electrically connected to the substrate 11.

[0064] In these embodiments, in step S04, the temperature control module 14 of the burn plate 10 controls to adjust the temperature of each test socket 12 based on the temperature control signal from the temperature distribution module 33 of the dynamic adjustment module 30, i.e., the temperature is the temperature of the burn test.

[0065] In some embodiments, the specific method by which the dynamic adjustment module 30 adjusts the test temperature parameters of the burn plate 10 in step S04 is as shown in FIG. 10 , which is a flowchart of modulating test power parameters in the dynamic burn test method of the present invention. After the signal generation module 20 generates the dynamic burn test parameters, including the test temperature parameters, in response to the simulation test results of the specimen D, the signal generation module 20 sends a test temperature control signal to the temperature control module 14 of the burn plate 10 via the temperature distribution module 33. The temperature control module 14 of the burn plate 10 can change the test temperature of the test socket 12 based on the test temperature control signal from the temperature distribution module 33.

[0066] In some embodiments, the temperature control module 14 may be a heater or a cooler. In these embodiments, the temperature control module 14 is disposed at a location corresponding to each test socket 12, but is not limited to this.

[0067] 8 and 11, in some embodiments where the burn plate 10 includes a power control module 13, the number of power control modules 13 is not limited. Here, FIG. 11 is a block diagram illustrating another embodiment of the burn plate in the dynamic burn test system of the present invention.

[0068] When the number of power control modules 13 is single (as shown in FIG. 8), the power control module 13 is electrically connected to each test socket 12 on the burn plate 10, and the power parameters of each test socket 12 are controlled via the single power control module 13.

[0069] When there are a plurality of power control modules 13 (as shown in FIG. 11 ), the number of power control modules 13 is the same as the number of test sockets 12. Each power control module 13 is electrically connected to a test socket 12, and the power parameters of each test socket 12 are controlled by a separate power control module 13.

[0070] 8 and 11, in some embodiments where the burn plate 10 includes temperature control modules 14, the number of temperature control modules 14 is not limited, and may be single or multiple.

[0071] When the number of temperature control modules 14 is single (as shown in FIG. 8), the temperature control module 14 is electrically connected to each test socket 12 on the burn plate 10, and the temperature parameters of each test socket 12 are controlled via the single temperature control module 14.

[0072] When there are multiple temperature control modules 14 (as shown in FIG. 11 ), the number of temperature control modules 14 is the same as the number of test sockets 12. Each temperature control module 14 is electrically connected to a test socket 12, and the temperature parameters of each test socket 12 are controlled by a separate temperature control module 14.

[0073] In some embodiments, the means by which signal generation module 20 generates dynamic test parameters based on simulation test results may include generating the dynamic test parameters from a lookup table. In these embodiments, storage module 22 stores a lookup table that includes a plurality of test results and a plurality of grouped test parameters corresponding to each test result.

[0074] In these embodiments, the processor 21 of the signal generation module 20 compares the simulation test results with the lookup table to obtain corresponding test results, compares the test results to obtain corresponding grouped test parameters (hereinafter also simply referred to as "group test parameters"), and finally, the obtained grouped test parameters are output to the dynamic adjustment module 30 as dynamic test parameters.

[0075] In various embodiments, the relationship between test results and grouped test parameters in the lookup table may include, but is not limited to, a single simulation test result corresponding to a single grouped test parameter, or a single simulation test result corresponding to multiple grouped test parameters, or multiple simulation test results corresponding to a single grouped test parameter, or multiple simulation test results corresponding to multiple grouped test parameters.

[0076] Specifically, an example of a single simulation test result corresponding to a single grouped test parameter is that the grouped test parameter modulates the test voltage parameter input to the test socket 12 when the voltage change value (simulation test result) meets a predetermined value (test result).

[0077] An example of a single simulation test result corresponding to multiple grouped test parameters is when the voltage change value (simulation test result) meets a predetermined value (test result), the grouped test parameters simultaneously switch the burn test model input to test socket 12 and modulate the test voltage parameters input to test socket 12.

[0078] An example of multiple simulation test results corresponding to a single grouped test parameter is when the voltage change value (simulation test result) and the temperature change value (simulation test result) both meet a predetermined value (test result), the grouped test parameter is switched to switch the burn test model input into the test socket 12.

[0079] An example of multiple simulation test results corresponding to multiple grouped test parameters is when the voltage change value (simulation test result) and the current change value (simulation test result) both meet predetermined values ​​(test results), the grouped test parameters simultaneously switch the burn test model input to the test socket 12 and modulate the test temperature parameters input to the test socket 12.

[0080] However, the above test results and grouped test parameter settings are merely examples, and the present invention is not limited to these.

[0081] In some embodiments, the number of lookup tables stored by storage module 22 is multiple, and each lookup table can correspond to, but is not limited to, a different analyte D, different simulated test data, or different simulated test data groups.

[0082] In this embodiment, each lookup table corresponds to a different specimen D. If the type or specification of the specimen D is different, the corresponding lookup table is also different. In this way, when the specimen D changes, the results of the tests in the lookup table and the corresponding grouped test parameters also change accordingly.

[0083] In some embodiments where the lookup tables correspond to different simulation test data, different test data from the simulation test performed by subject D correspond to different lookup tables.

[0084] Thus, as the data of the simulation test performed by specimen D changes, the results of the test and the corresponding grouped test parameters in the look-up table change accordingly.

[0085] In some embodiments where the lookup tables correspond to different groups of simulation test data, if the data of the simulation test performed by specimen D belongs to a different simulation test data group that includes data from multiple simulation tests, the corresponding lookup tables are different.

[0086] In this way, when the simulation test data executed by the specimen D belongs to a different simulation test data group, the test results and corresponding grouped test parameters in the lookup table also change accordingly. However, the above lookup table settings are merely an example and are not limiting.

[0087] It should be noted that the method by which the signal generation module 20 generates the dynamic test parameters based on the simulation test results is not limited to generation using a lookup table as shown in the above embodiment. In other implementations, the signal generation module 20 can also calculate the dynamic test parameters based on a specific formula.

[0088] In this embodiment, the temperature change value of the simulation test result is calculated based on the surface temperature (Tc: Case Temperature) of the specimen D, the junction temperature (Tj: Junction Temperature, or core operating temperature. The surface temperature of the specimen D is the temperature of the shell surface of the specimen D, and can be detected by placing a surface temperature sensor on the surface of the specimen D.

[0089] The connection temperature of specimen D is the operating temperature when specimen D actually operates. It can be calculated based on the ambient temperature (Ta), the known thermal resistance of the specimen (θj-a), and its power consumption efficiency (P[W]) using the formula (Tj=Ta+θj-a×P[W]) based on the connection temperature.

[0090] Overall, unlike after step S01 in the prior art, the rejected specimen D is rejected directly.

[0091] In this embodiment, the failed specimens D are subjected to the simulation test of step S02 again, and based on the simulation test results of each failed specimen D, the dynamic test parameters of the burn are adjusted again, and the burn is performed again.

[0092] Here, the processing range of dynamic test parameters includes, but is not limited to, dynamic calculation test upper limit of power supply, dynamic adjustment of power supply and protection range, test program, output status, temperature and voltage provision, automatic switch of hottest area, and automatic temperature control of surface temperature, interface temperature, or core temperature of specimen D, etc.

[0093] The working core temperature of the specimen D includes the actual operating working temperature of each processing core C of the plurality of processing cores C of the specimen D.

[0094] The following description will be given with reference to FIGS. 3 and 12. FIG. 12 is a block diagram showing an embodiment of a test object in a dynamic burn test system according to the present invention. In these embodiments, the test object D includes a number of processing cores C. Each processing core C includes at least one temperature observation circuit C1. The signal generation module 20 reads the temperature detection values ​​of the temperature observation circuits C1 of each processing core C of the test object D as simulation test results.

[0095] In this way, when the specimen D includes processing cores C and highly complex simulation test data is executed, the signal generating module 20 can directly read the core temperature of each processing core C, thereby improving the accuracy of temperature determination and subsequent dynamic fluctuations.

[0096] Next, the processor 21 of the signal generation module 20 generates dynamic test parameters for each processing core C of the specimen D according to the simulation test results, and the dynamic adjustment module 30 adjusts the dynamic burn test parameters for each processing core C of each failed specimen D on the burn plate 10 based on the dynamic test parameters. The parameters include, but are not limited to, an appropriate test voltage and temperature for each processing core C to prevent each processing core C from overheating.

[0097] In other words, these embodiments can also be used to simulate test results for each processing core C on each specimen D, dynamically adjusting the respective test parameters (such as voltage and temperature).

[0098] Reference is now made to Figure 13, which is a schematic block diagram of another embodiment of the dynamic burn test system of the present invention. In some embodiments, the dynamic burn test system further includes a concentrator (hub) 40, a computing host 50, and a burn host 60.

[0099] In these embodiments, the number of signal generating modules 20 is plural, and each signal generating module 20 is electrically connected to a computing host 50 via a concentrator 40 to form a computing system. The dynamic adjustment module 30 is electrically connected to a burn host 60 to form a burn test system.

[0100] The computing system is electrically connected to the burn test system and can be adapted to burn in a plurality of burn plates 10. Here, there are a plurality of burn plates 10, and each burn plate 10 is electrically connected to a respective signal generating module 20. In this way, the computing system and the burn test system cooperate to perform dynamic burning on the plurality of burn plates 10.

[0101] 13, in some embodiments, the dynamic burn test system may be integrated into a single hardware architecture, for example, the computing system may be embedded in a first body M1, and the burn test system may be embedded in a second body M2 and installed in the first body M1 of the computing system.

[0102] This allows the connection line between the computing system and the burn test system to be as short as possible, which is more suitable for the operating environment of high-speed transmission and high-speed computing. [Explanation of symbols]

[0103] 10 Burn Board 11 Circuit Board 12 test sockets 13 Power Control Module 14 Temperature Control Module 20 Signal Generation Module 21 processors 22 Storage Module 30 Dynamic Adjustment Module 31 Power Supply Module 32 Power Distribution Module 33 Temperature Distribution Module 40 Concentrator 50 computing hosts 60 Burn Host C Processing Core C1 Temperature observation circuit D. Sample M1 First body M2 Second Body S01~S04 steps

Claims

1. A dynamic burn test system comprising at least one burn plate, at least one signal generating module, and a dynamic adjustment module, the at least one burn plate is adapted to be electrically connected to a plurality of analytes; the at least one signal generating module is electrically connected to the at least one burn plate and is used to control the plurality of specimens to perform testing, and is also adapted to determine at least one failed specimen in the plurality of specimens in response to test results of the plurality of specimens, and to transmit simulation test data to the at least one failed specimen; The at least one signal generating module controls the at least one failed specimen to execute the simulation test data to generate a simulation test result, and generates a dynamic test parameter in response to the simulation test result; The dynamic adjustment module is electrically connected to the at least one signal generating module and the at least one burn plate, receives the dynamic test parameters from the at least one signal generating module, and modulates the at least one burn plate in conjunction with the signal generating module so that the dynamic test parameters perform a dynamic burn test on the at least one failed specimen.

2. the at least one burn plate comprises a substrate, a plurality of test sockets, a temperature control module, and a power control module; the plurality of test sockets are electrically connected to the substrate; the temperature control module is electrically connected to the substrate, and the temperature control module is controlled by the dynamic adjustment module to adjust the temperature of each of the test sockets; 2. The dynamic burn test system of claim 1, wherein the power control module is electrically connected to the board, and the power control module adjusts and outputs the voltage value of each of the test sockets under the control of the dynamic adjustment module.

3. 3. The dynamic burn test system of claim 2, wherein the power control module provides power at a reduced voltage value and an increased current value to each of the test sockets.

4. the dynamic adjustment module includes a power supply module, a temperature distribution module, and a power distribution module electrically connected to each other; the power supply module is used to supply power to the at least one burn plate, and the temperature distribution module is used to send a test temperature control signal to the temperature control module to test the temperature of each of the test sockets based on the dynamic test parameters; 3. The dynamic burn test system according to claim 2, wherein the power distribution module transmits a test power control signal to the power control module based on the dynamic test parameters to adjust and output a voltage value of each of the test sockets.

5. the at least one signal generating module includes a storage module and a processor electrically connected to each other; 2. The dynamic burn test system of claim 1, wherein the storage module stores a lookup table, the lookup table including a plurality of test results and a plurality of group test parameters, and the at least one signal generating module finds out one of the plurality of corresponding test results from the lookup table based on the simulation test result, and outputs one of the plurality of corresponding group test parameters to be the dynamic test parameter.

6. 6. The dynamic burn test system of claim 5, wherein the processor is a system on a chip, a field programmable gate array chip, or a high performance computing chip.

7. the specimen includes a plurality of processing cores, each of the processing cores including at least one temperature observation circuit; 2. The dynamic burn test system of claim 1, wherein when the at least one failed specimen executes the simulation test data, the at least one signal generating module reads the observation value of the at least one temperature observation circuit and uses it as the simulation test result.

8. the number of the temperature control modules corresponds to the number of the plurality of test sockets, and the number of the power control modules corresponds to the number of the plurality of test sockets; 3. The dynamic burn test system of claim 2, wherein each of the test sockets is electrically connected to the temperature control module and the power control module, respectively.

9. The at least one signal generating module further includes a concentrator and a computing host, wherein the at least one signal generating module is a plurality of signal generating modules; 2. The dynamic burn test system of claim 1, wherein the plurality of burn plates are electrically connected to the signal generating module, and the signal generating module is electrically connected to the computing host through the concentrator.

10. 1. A dynamic burn test method suitable for testing a plurality of specimens on a burn plate, comprising: utilizing a signal generating module to control and test the plurality of analytes and determine at least one failing analyte in the plurality of analytes in response to the test results of the plurality of analytes; The signal generating module transmits simulation test data to the at least one specimen, and controls the at least one failed specimen to execute the simulation test data, thereby generating a simulation test result; The signal generation module generates dynamic test parameters in response to the simulation test results and sends the dynamic adjustment module; The dynamic burn test method, wherein the dynamic adjustment module modulates the burn plate in conjunction with the signal generation module so that the dynamic test parameters perform a burn test on the at least one failed specimen.

11. The dynamic burn test method of claim 10, wherein the signal generating module controls the plurality of analytes to perform a functional test.

12. 11. The dynamic burn test method of claim 10, wherein the simulation test result is one of a voltage change value, a current change value, and a temperature change value.

13. 11. The dynamic burn test method of claim 10, wherein the dynamic test parameters include inputting at least one of a predetermined voltage value and a predetermined current value of the at least one failed specimen, and the temperature of the at least one failed specimen is controlled to a predetermined temperature value.

14. The dynamic burn test method of claim 10 , wherein the signal generation module generates the dynamic test parameters from a lookup table based on the simulation test results.

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