Imaging apparatus

Abstract

To provide an imaging apparatus comprising an image shake correction mechanism that can efficiently dissipate heat from an image pick-up device without inhibiting drive controllability of a movable part.SOLUTION: An imaging apparatus comprises an image shake correction mechanism having a movable part for holding an image pick-up device and a support part for movably supporting the movable part in the vertical direction relative to an optical axis direction, and comprises: an imaging substrate on which the image pick-up device is mounted; and a heat dissipation member. The heat dissipation member is formed of a substrate attachment area attached to the imaging substrate, a support part attachment area attached to the support part, and a connection part connecting the substrate attachment area and the support part attachment area to each other. The substrate attachment area is closer to an imaging optical axis than the support part attachment area, and does not overlap the support part attachment area.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an imaging device, and more particularly to an imaging device equipped with a shake correction mechanism capable of efficiently dissipating heat. [Background technology]

[0002] Imaging devices such as digital still cameras and video cameras are equipped with imaging elements such as CMOS sensors for capturing subject images, and electronic elements such as CPUs and ICs mounted on circuit boards, which typically generate heat. If the temperature of the imaging elements or electronic elements rises excessively, the performance of these devices may deteriorate or malfunction, making it difficult to capture good images.

[0003] In recent years, imaging devices equipped with a so-called "image stabilization mechanism" that moves the imaging element in a direction perpendicular to the optical axis to improve image quality have become widespread. In imaging devices equipped with such an image stabilization mechanism, heat generated from the imaging element during operation of the image stabilization mechanism, during continuous shooting, during video shooting, and the like can affect image quality, so sufficient heat dissipation is required.

[0004] For example, Patent Document 1 discloses a structure in which the load on the image stabilization mechanism is reduced by orthogonally orthogonalizing the optical axis to the thickness of a bendable heat transfer member that connects the movable part and support part of the image stabilization mechanism. Also, Patent Document 2 discloses an imaging device in which the load on the image stabilization mechanism is reduced by orthogonally ... [Prior art documents] [Patent documents]

[0005] [Patent Document 1] WO2020 / 202811 publication [Patent Document 2] Japanese Patent Publication No. 2022-162695 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the prior art disclosed in Patent Document 1, the thickness of the heat transfer member is set in a direction perpendicular to the optical axis direction. Therefore, to improve heat dissipation, it is necessary to increase the number of heat transfer members or widen the width of the heat transfer members. Furthermore, in the prior art disclosed in Patent Document 2, heat is transferred to the support part via a movable member that holds the image sensor. Furthermore, to reduce the load on the image stabilization mechanism, the heat transfer member needs to be configured to be thin and long. This poses a problem of reduced efficiency of heat transfer from the image sensor to the support member.

[0007] The present invention has been made in consideration of such problems, and aims to provide an imaging device equipped with an image stabilization mechanism that can efficiently dissipate heat from the imaging element without impeding the drive controllability of the movable part. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, one aspect of the present invention is an imaging device equipped with an image shake correction mechanism having a movable part for holding an imaging element and a support part that supports the movable part so that the movable part can move perpendicularly to the optical axis direction, the imaging device comprising: an imaging board on which the imaging element is mounted; and a heat dissipation member, the heat dissipation member comprising a board attachment area attached to the imaging board, a support part attachment area attached to the support part, and a connection part that connects the board attachment area and the support part attachment area, the board attachment area being closer to the imaging optical axis than the support part attachment area and not overlapping with the support part attachment area. [Effects of the Invention]

[0009] According to the present invention, it is possible to realize an image pickup apparatus having an image blur correction mechanism that can efficiently dissipate heat from an image pickup element without impeding the drive controllability of a movable part. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a block diagram of a digital camera as an imaging apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is an exploded rear perspective view of the digital camera. [Figure 3] FIG. 2 is an exploded perspective view of an imaging unit and an image stabilization mechanism therein. [Figure 4] 2A and 2B are a front view and a central cross-sectional view of the imaging unit; [Figure 5] FIG. 2 is a perspective view of the imaging unit of the first embodiment. [Figure 6] FIG. 10 is a perspective view of an imaging unit according to a second embodiment. [Figure 7] FIG. 10 is a perspective view of an imaging unit according to a third embodiment. [Figure 8] FIG. 10 is a perspective view of an imaging unit according to a fourth embodiment. [Figure 9] FIG. 10 is a perspective view of an imaging unit according to a fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the configurations described in the following embodiments are merely examples, and the scope of the present invention is not limited to the configurations described in the embodiments. First, a first embodiment of the present invention will be described. In the following embodiments of the present invention, a digital camera 100 will be used as an example of an imaging device, but the digital camera 100 is merely an example of an imaging device. Cameras other than the digital camera 100 may also be described as imaging devices. For example, cameras mounted on smartphones and the like can also be included in the present invention. Furthermore, the optical axis direction refers to the direction of the imaging optical axis.

[0012] (Figure 1: Block diagram of a digital camera) (Lens unit 20; shutter 116; imaging unit 200) FIG. 1 is a block diagram of a digital camera 100. The digital camera 100 is equipped with a lens unit 20 via a mount 103. The lens unit 20 is equipped with an imaging lens 24 and an aperture 26, in that order from the subject side. The mount 103 allows the lens unit 20 to be attached and detached to the digital camera 100. A shutter 116 is disposed on the image side of the lens unit 20, and an imaging unit 200 is disposed on the image side of the shutter 116. The imaging unit 200 has an imaging element unit 230 on the subject side (front side) to which an imaging element 231 is fixed, and an image shake correction mechanism 240 that fixes and supports the imaging element unit 230. In other words, the imaging unit 200 has the imaging element unit 230 with the imaging element 231, and the image shake correction mechanism 240.

[0013] The shutter 116 is a light-blocking member, and opening and closing the shutter 116 controls the amount of exposure to the image sensor 231 in the imaging unit 200. A light beam incident on the imaging lens 24 is guided via the aperture 26 and the shutter 116, and an optical image is formed on the imaging surface of the image sensor 231. As described above, the imaging unit 200 has the image sensor unit 230 and the image shake correction mechanism 240, and the image sensor 231 fixed to the front side of the image sensor unit 230 converts the optical image into an electrical signal. In addition, the image shake correction mechanism 240 realizes "image sensor shift type image shake correction" that corrects image shake by driving the image sensor 231 in a plane perpendicular to the optical axis direction (imaging direction) in accordance with the amount of shake detected by the gyroscope 82.

[0014] (System control circuit 50) The digital camera 100 also includes a system control circuit 50 that controls the entire camera. Various devices are connected to the system control circuit 50. As shown in Fig. 1, memory 52, display unit 54, timer 56, thermometer 58, operation member 80, gyro 82, battery 88, power supply control circuit 86, power supply SW (switch) 84, battery 88, external communication terminal 121, storage medium 122, and image processing circuit 60 are connected to the system control circuit 50. Furthermore, a distance measurement control circuit 66, aperture control circuit 62, and SH control circuit 68 are connected to the system control circuit 50.

[0015] (Memory 52) As described above, the system control circuit 50 controls the entire digital camera 100, and the memory 52 stores constants, variables, programs, etc. for the operation of the system control circuit 50. The system control circuit 50 executes the programs stored in the memory 52 to realize various functions required for the present invention. For example, the system control circuit 50 functions as a "determining unit" and a "control unit" in various operations of the digital camera 100. The memory 52 also stores the holding state of the image sensor unit 230 by the image stabilization mechanism 240.

[0016] (Distance measurement control circuit 66: Aperture control circuit 62: SH control circuit 68) The system control circuit 50 also controls the distance measurement control circuit 66, the aperture control circuit 62, and the SH control circuit 68 based on the results of calculations performed by the image processing circuit 60 on image data captured by the image sensor 231. As a result, the shutter 116, the imaging lens 24, and the aperture 26 are controlled, and AF processing and AE processing are performed.

[0017] (Display unit 54: Operation member 80: Thermometer 58: Operation member 80: Gyro 82: Power supply control circuit 86: Power supply SW 84) The display unit 54 is composed of a rear display unit 175 and an EVF display unit 176, which will be described later with reference to FIG. 2, etc., and displays information related to imaging. The thermometer 58 measures the temperature of the imaging element 231 and other heat-generating components. The operation members 80 are made up of various buttons, switches, etc., and are used to select and set various functions when capturing images, playing back, communicating, etc., and to issue instructions for capturing images and playing back. Although FIG. 1 shows one operation member 80, in reality, multiple operation members 80 are provided. The gyroscope 82 detects the amount of image shake of the digital camera 100. The power switch 84 is an operator for switching the power of the digital camera 100 on and off.

[0018] The power supply control circuit 86 is composed of a battery detection circuit, a DC / DC converter, a switch circuit for switching between blocks to be energized, and the like, and supplies the required voltage to each device using a battery 88 as a power source. Specifically, the power supply control circuit 86 detects the remaining charge of the battery 88 that serves as the power source for the digital camera 100, and supplies the required voltage for the required period to each section, including the storage medium 122, based on the detection result and instructions from the system control circuit 50. The gyro 82 is a sensor that detects the amount of shake of the digital camera 100.

[0019] (Timer 56: External communication terminal 121: Storage medium 122) The storage medium 122 is implemented, for example, as a smart card or the like, and is a device that stores images captured by the digital camera 100 and is detachable from the digital camera 100. The external communication terminal 121 enables the digital camera 100 to communicate required information, including captured images, with other information devices or the like via wired or wireless connections. One example of this is Bluetooth (registered trademark). The timer 56 sends a timeout signal to the system control circuit 50 when a time set by the system control circuit 50 for required control, processing, or the like has elapsed.

[0020] (Fig. 2: Exploded rear perspective view of a digital camera) (exterior materials) The digital camera 100 has exterior members such as a front base 102, a rear cover 104, a top cover 106, a bottom cover 108, and side covers 110. These exterior members form the outer surface of the digital camera 100.

[0021] (Front base 102: Rear cover 104) The front base 102 is molded from magnesium die-cast, resin, or the like, and has a mount 103, to which the lens unit 20 is attached, fixed to its front portion, and is also provided with a grip portion (not shown) for holding the digital camera 100. A plurality of operation members 80 and an openable and closable rear display unit 175 are attached to the rear cover 104. The rear display unit 175 is attached to the center of the rear of the rear cover 104. Also attached to the rear cover 104 are an EVF display unit 176 and a finder unit 112 for user observation, which are shown in the upper center of FIG. 2. The rear display unit 175 is realized by a display device such as an LCD or EL.

[0022] (Top cover 106: Bottom cover 108: Side cover 110) A plurality of operation members 80 are attached to the top cover 106. The bottom cover 108 is formed with a battery chamber that houses the battery 88 shown in Fig. 1, and is capable of being fitted with a tripod mount for fixing the digital camera 100. The side cover 110 is provided with a terminal cover 111 for protecting the external communication terminal 121 shown in Fig. 1.

[0023] (Arrangement of the shutter 116, imaging unit 200, chassis 118, printed circuit board 120, etc.) Arranged inside these exterior members, from the subject side, are the shutter 116, the imaging unit 200, a chassis 118, a printed circuit board 120, etc. Mounted on the printed circuit board 120 are various electronic components such as the above-mentioned electronic devices such as the system control circuit 50 and the image processing circuit 60, and a connector for attaching a storage medium 122. The printed circuit board 120 is fixed to the front base 102 and the chassis 118, which is made of metal or the like, with screws or the like. In addition, an external communication terminal 121 is mounted on the printed circuit board 120.

[0024] (Flexible PCB 280) The flexible substrate 280 is flexible and connects the image sensor unit 230 of the imaging unit 200 to the printed circuit board 120. The image signal output from the image sensor 231 is sent via the flexible substrate 280 to electronic devices such as the system control circuit 50 mounted on the printed circuit board 120.

[0025] (Measures to prevent heat generation from the image sensor 231) The image sensor 231 consumes particularly large amounts of power in the digital camera 100. For this reason, its temperature is prone to rise, and if the temperature of the image sensor 231 exceeds a certain level, it will have a negative effect on the captured image, so it is necessary to keep the temperature of the image sensor 231 below a certain level. Therefore, the image capturing unit 200 having the image sensor 231 is fixed to the front base 102 with screws or the like. This allows heat generated by the image capturing unit 200 to be transferred to the front base 102 and dissipated.

[0026] (Fig. 3: Exploded perspective view of the imaging unit and its internal image stabilization mechanism) Next, the image stabilization mechanism 240 in the imaging unit 200 will be described with reference to Figures 3 and 4. Figure 3 is an exploded perspective view of the imaging unit 200 and the image stabilization mechanism 240 therein, with Figure 3(a) being an exploded perspective view seen from the rear side and Figure 3(b) being an exploded perspective view seen from the front side. Figure 3(a) is illustrated so that the further to the right you go, the closer you get to the rear side of the digital camera 100, and Figure 3(b) is illustrated so that the further to the right you go, the closer you get to the front side of the digital camera 100.

[0027] (Front plate 210: Rear plate 220) The imaging unit 200 has an imaging element unit 230 that is configured to be sandwiched between a front plate 210 and a rear plate 220, and the front plate 210 and the rear plate 220 are made of, for example, metal plates. The rear plate 220 is fixed to the front base 102 (see FIG. 2, etc.) with screws or the like, and is fixed to the front plate 210 with screws or the like, with the imaging element unit 230 sandwiched between them.

[0028] (Imaging substrate 232: imaging element holder 238: ball 242: heat dissipation member 300: swingable structure of imaging element unit) An imaging board 232 on which an imaging element 231 is mounted is disposed between the imaging element holder 238 and the rear plate 220, which constitute the imaging element unit 230. Then, for example, a total of three balls 242 are supported around the imaging board 232 so as to be able to roll, and these are disposed so as to surround the imaging optical axis A. As the balls 242 roll freely, the imaging element unit 230 is held between the front plate 210 and the rear plate 220 so as to be able to swing in a direction perpendicular to the imaging optical axis A.

[0029] That is, the image blur correction mechanism 240 is made up of the back plate 220 (support portion) that supports the imaging element holder 238 so that it can move in a direction perpendicular to the imaging optical axis A, and the ball 242. The image blur correction mechanism 240 is also provided with a heat dissipation member 300. More specifically, the heat dissipation member 300 is provided on the subject side of the back plate 220. The heat dissipation member 300 is flexible, for example, to improve the drive controllability of the imaging element holder 238 (movable portion).

[0030] (Magnet 244: Coil 246: Flexible substrate for coil 270) A plurality of magnets 244 are arranged on the rear plate 220, and a plurality of coils 246 are arranged on the imaging element holder 238 so as to face the respective magnets 244. The coils 246 generate a magnetic field when power is supplied from the coil flexible substrate 270. The repulsive and attractive forces between the magnetic field generated in the coils 246 and the magnets 244 are utilized to control the swing of the imaging element unit 230.

[0031] In general, the image stabilization mechanism 240 controls the image sensor unit 230 to be maintained at the center position of imaging, and also controls the image sensor unit 230 to move in a direction that cancels out image shake of the digital camera 100 caused by the user capturing an image. A metal plate 248 is disposed in a position facing the coil 246 on the coil flexible substrate 270, and a magnet 244 attracts the metal plate 248, thereby bringing the image sensor holder 238, the rear plate 220, and the ball 242 into contact with each other. This determines the flange focal distance position of the image sensor 231 in the digital camera 100 to a specified position. The connection portion 232a in FIG. 3(a) will be described later.

[0032] (Figure 4: Front view of the imaging unit, central cross section; first surface 233: second surface 234) Fig. 4(a) is a front view of the imaging unit 200, and Fig. 4(b) is a central cross-sectional view (BB' cross-sectional view) of Fig. 4(a). The imaging element unit 230 includes an imaging element 231, an imaging board 232, and an imaging element holder 238 (movable part) that holds the imaging board 232. The imaging board 232 has a first surface 233 on which the imaging element 231 is mounted and a second surface 234 opposite thereto, and has an image processing circuit 60 (see Fig. 1) for the imaging element 231 mounted thereon.

[0033] (Heat Transfer Using Heat Dissipation Member 300: Dissipation of Heat Generated by Imaging Board 232) Furthermore, heat dissipation member 300 is connected to second surface 234 of imaging board 232 and rear plate 220, and is made of a graphite sheet or the like laminated with a PET sheet or the like. Heat generated by imaging element 231 is transferred to rear plate 220 via imaging board 232, imaging element holder 238 that holds imaging board 232, and heat dissipation member 300, and then to front base 102 to which rear plate 220 is fixed with screws or the like. Furthermore, heat generated by imaging board 232 is configured to be transferred to rear plate 220.

[0034] (First embodiment: FIG. 5: rear perspective view of the imaging unit 200) Next, with reference to Fig. 5, a heat dissipation member 300 provided in the image shake correction mechanism 240 according to the first embodiment will be described. In the first embodiment, the central portion of the rear plate 220 does not overlap the imaging board 232. Fig. 5 is a perspective view of the imaging unit 200 shown in Fig. 3, seen from the rear. In Fig. 5 and subsequent figures, "X" indicates the width direction of the digital camera 100, and "Y" indicates the height direction of the digital camera 100.

[0035] (heat dissipation member 300: substrate attachment area 302: support attachment area 304: connection portion 310) As shown in FIG. 5, the heat dissipation member 300 includes a substrate-attached region 302, a support-attached region 304, and a connection portion 310. Specifically, the substrate-attached region 302 and the support-attached region 304 are connected via the connection portion 310. The heat dissipation member 300 is attached to the substrate-attached region 302, which can be fixed to the second surface 234 of the imaging substrate 232, and the support-attached region 304, which can be fixed to the rear-side plate 220, using double-sided tape or the like. This allows heat generated in the imaging element 231 (not shown in FIG. 5) and the imaging substrate 232 to be transferred to the rear-side plate 220. In this embodiment, the substrate-attached region 302 is closer to the imaging optical axis than the support-attached region 304, and at least a portion of the substrate-attached region 302 and the support-attached region 304 do not overlap. In other words, the substrate-attached region 302 and the support-attached region 304 do not overlap at all.

[0036] (Temperature distribution of the image sensor 231) The temperature distribution in the imaging element 231 differs depending on the element, and also changes depending on the arrangement of heat-generating components other than the imaging element 231 mounted on the imaging board 232. By making the board attachment area 302 a part of or near the area of ​​the imaging board 232 that becomes the hottest, the temperature difference with the back plate 220, to which heat is transferred, increases, making heat transfer easier. In addition, the ground wiring and power supply wiring of the imaging board 232 have more connection terminals with the imaging element 231 than other signal lines. For this reason, if the board attachment area 302 is located on the ground wiring or power supply wiring of the imaging board 232, heat from the imaging element 231 can be transferred efficiently to the back plate 220.

[0037] (Substrate attachment area 302) The substrate attachment area 302 is preferably connected as follows. First, the substrate attachment area 302 is positioned closer to the imaging optical axis than the support part attachment area 304. Then, the substrate attachment area 302 and the support part attachment area 304 are connected to the imaging substrate 232 and the rear plate 220 so that their respective longitudinal directions are parallel to each other or so that their respective longitudinal directions are in the same direction. With this configuration, the connection path can be made relatively short, and the width of the heat dissipation member 300 can be made wider. This makes it possible to increase the amount of heat transferred from the imaging substrate 232 to the rear plate 220.

[0038] Furthermore, the longitudinal direction of the substrate attachment area 302 is arranged to be parallel to the connection portion 232a (see also FIG. 3(a) and the like) that electrically connects the imaging substrate 232 and the flexible substrate 280. Generally, as the imaging element 231 has higher pixel counts and higher speeds, the number of signal lines passing through the flexible substrate 280 that transmit and receive image signals between the imaging element 231 and the printed circuit board 120 tends to increase, and the number of terminals at the connection portion 232a also tends to increase. To address this, it is effective to arrange the longitudinal direction of the substrate attachment area 302 parallel to the connection portion 232a in order to increase the width of the heat dissipation member 300.

[0039] (Connection 310: Bending portion 312: Slit 306: Heat transfer portion 308) The connecting portion 310 has a bent portion 312 that is bent overall, and is formed with slits 306 for reducing load due to oscillation of the imaging element unit 230, extending parallel to the connecting direction between the imaging substrate 232 and the rear plate 220. The portion other than the slits 306 is a heat transfer portion 308 filled with a graphite sheet or the like. The width of each slit 306 is set so that adjacent heat transfer portions 308 do not come into contact with each other even when the imaging element unit 230 is at its maximum displacement, thereby preventing load from being generated due to contact between the heat transfer portions 308. Furthermore, multiple slits 306 and bent portions 312 may be provided, or the connecting portion 310 may extend from both the substrate-attached region 302 and the support-attached region 304 in the Y direction (a direction perpendicular to the optical axis direction) and connect the two together with one or more bent portions 312.

[0040] (Second embodiment: FIG. 6: rear perspective view of the imaging unit of the second embodiment) Next, a heat dissipation member 300 provided in an image shake correction mechanism 240 according to the second embodiment will be described with reference to Fig. 6. In the second embodiment, a part of the rear plate 220 overlaps with the imaging board 232.

[0041] 6A and 6B are perspective views of the imaging unit 200 according to the second embodiment as seen from the rear, with Fig. 6A showing a state in which the flexible substrate 280 is connected, and Fig. 6B showing a state in which the flexible substrate 280 has been detached from the imaging unit 200. In a configuration in which a part of the rear plate 220 overlaps the imaging substrate 232 (see symbol T) as shown in Fig. 6, the support portion attachment area 304 of the heat dissipation member 300 may be attached so as to be closer to the imaging optical axis than the substrate attachment area 302.

[0042] (Third embodiment: FIG. 7: rear perspective view of the imaging unit of the third embodiment) Next, a heat dissipation member 300 provided in an image shake correction mechanism 240 according to the third embodiment will be described with reference to Fig. 7. Fig. 7 is a perspective view of an imaging unit 200 according to the third embodiment, as seen from the rear.

[0043] 7, in the third embodiment, the connection portions 310 of the heat dissipation member 300 extend from both the substrate-attached region 302 and the support-attached region 304 toward the imaging optical axis and are connected at bent portions 312. In other words, the heat dissipation member 300 is bent overall into a U-shape when viewed from the side. With this configuration, the heat dissipation member 300 is longer than in the first and second embodiments, which has the advantage of making it easier to follow the movement of the image shake correction mechanism 240 when the amount of movement of the image shake correction mechanism 240 is large.

[0044] (Fourth embodiment: FIG. 8: rear perspective view of the imaging unit of the fourth embodiment) Next, a heat dissipation member 300 provided in an image shake correction mechanism 240 according to the fourth embodiment will be described with reference to Fig. 8. Fig. 8 is a perspective view of an imaging unit 200 according to the fourth embodiment as seen from the rear, with Fig. 8(a) showing a state in which a flexible substrate 280 is connected, and Fig. 8(b) showing a state in which the flexible substrate 280 has been removed from the imaging unit 200. The fourth embodiment has a configuration in which the second imaging substrate 236 and the rear-side plate 220 are connected by the heat dissipation member 300.

[0045] The image processing circuit 60 of the imaging element 231 is mounted on the second imaging board 236, and the second imaging board 236 is electrically connected to the imaging board 232 via a connector (not shown). The second imaging board 236 is also fixed to the imaging element holder 238 with screws 239 or the like.

[0046] The heat dissipation member 300 connects the second imaging board 236 and the rear plate 220, and heat generated in the second imaging board 236 is transferred to the rear plate 220. The second imaging board 236 is thermally connected to the imaging board 232 via a connector (not shown) and the imaging element holder 238. This allows the heat from the imaging element 231 and the imaging board 232 to be transferred to the rear plate 220 via the second imaging board 236.

[0047] (Fifth embodiment: FIG. 9: rear perspective view of the imaging unit of the fifth embodiment) Next, a heat dissipation member 300 provided in an image shake correction mechanism 240 according to the fifth embodiment will be described with reference to Fig. 9. Fig. 9 is a perspective view of the imaging unit 200 according to the fifth embodiment, viewed from the rear. The heat dissipation member 300 of the fifth embodiment has one end of a graphite sheet laminated with a PET sheet or the like wrapped around an elastic member 314 and attached to the imaging board 232, and the other end, via a connection portion 310, is attached to the rear plate 220.

[0048] With this configuration, the difference in height in the imaging optical axis direction is reduced by the height of the elastic member 314. Therefore, the length of the connection portion 310 where the slit 306 is formed can be made shorter than in the first embodiment, and heat generated in the imaging element 231 and imaging board 232 can be efficiently transferred to the back plate 220.

[0049] Furthermore, in a configuration having the second imaging board 236 as in the fourth embodiment, the heat dissipation member 300 can be configured to be in contact with the second imaging board 236. This allows heat to be transferred from the second imaging board 236 to the back plate 220, or the heat transfer path can be increased in another direction as in the fourth embodiment, thereby further improving the heat transfer effect.

[0050] Although preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments. Various modifications and variations are possible without departing from the spirit and scope of the present invention. For example, the number and spacing of the slits 306 formed in the heat dissipation member 300 are not limited to those shown in the drawings. Furthermore, the direction in which the slits 306 are formed does not necessarily have to be the Y direction in FIG. 5, but may be a direction that slightly intersects the Y direction.

[0051] (Regarding the main invention) Digital camera 100 (imaging device) has an image blur correction mechanism 240. Image blur correction mechanism 240 has an imaging element holder 238 (movable part) for holding an imaging element 231, and a back plate 220 (support part) that supports imaging element holder 238 so that it can move in a direction perpendicular to the optical axis direction. Digital camera 100 also has an imaging board 232 on which imaging element 231 is mounted, and a heat dissipation member 300.

[0052] The heat dissipation member 300 is made up of a substrate attachment area 302 attached to the imaging substrate 232, a support attachment area 304 attached to the back plate 220 (support), and a connection area 310 connecting the substrate attachment area 302 and the support attachment area 304. The substrate attachment area 302 is closer to the imaging optical axis than the support attachment area 304, and does not overlap with the support attachment area 304. This configuration makes it possible to realize an imaging device equipped with an image shake correction mechanism 240 that can efficiently dissipate heat from the imaging element 231 without impeding the drive controllability of the movable part.

[0053] <Additional Note> The disclosure of this embodiment includes the following configuration. (Configuration 1) An imaging device equipped with an image stabilization mechanism having a movable portion for holding an imaging element and a support portion for supporting the movable portion so as to be movable in a direction perpendicular to an optical axis direction, an imaging substrate on which the imaging element is mounted, and a heat dissipation member; The heat dissipation member is a substrate attachment area attached to the imaging substrate; a support attachment area attached to the support; a connection portion that connects the substrate attachment region and the support attachment region, The substrate attachment area is An imaging device characterized in that the imaging device is located closer to an imaging optical axis than the support part attachment area and does not overlap with the support part attachment area. (Configuration 2) The substrate attachment area is The imaging device according to configuration 1, characterized in that the support portion is located farther in the optical axis direction than the support portion attachment area. (Configuration 3) The substrate attachment area is 3. The imaging device according to configuration 1 or 2, characterized in that the temperature is in a part of or in the vicinity of a region that becomes high temperature in the imaging substrate. (Configuration 4) The substrate attachment area is 3. The imaging device according to configuration 1 or 2, wherein the wiring is located on the ground wiring or power supply wiring of the imaging board. (Configuration 5) 3. The imaging device according to configuration 1 or 2, wherein the longitudinal directions of the substrate attachment region and the support attachment region are parallel to each other. (Configuration 6) 3. The imaging device according to configuration 1 or 2, wherein the longitudinal direction of the substrate attachment area is the same as the longitudinal direction of the imaging substrate. (Configuration 7) The imaging substrate is a first surface on which the imaging element is mounted and a second surface facing the first surface; The heat dissipation member is 3. The imaging device according to claim 1, wherein the second surface and the support portion are connected to each other. (Configuration 8) The connection portion is 3. The imaging device according to configuration 1 or 2, further comprising a slit parallel to the direction of connection between the imaging substrate and the support portion, and a bent portion. (Configuration 9) The connection portion is The imaging device according to configuration 1 or 2, characterized in that the substrate attachment region and the support attachment region extend in a direction perpendicular to the optical axis direction from each other and are connected to each other by one or more bent portions. (Configuration 10) The heat dissipation member is The imaging device described in configuration 1 or 2, characterized in that one end is wrapped around an elastic member and attached to the imaging board, and the other end via the connection portion is attached to the support portion. (Configuration 11) An imaging device equipped with an image stabilization mechanism having a movable portion for holding an imaging element and a support portion for supporting the movable portion so as to be movable in a direction perpendicular to an optical axis direction, an imaging substrate on which the imaging element is mounted; a second substrate fixed to the imaging substrate; a heat dissipation member connecting the second substrate and the support portion, The heat dissipation member is a substrate attachment area to be attached to the second substrate; a support attachment area attached to the support; a connection portion that connects the substrate attachment region and the support attachment region, The substrate attachment area is An imaging device characterized in that the imaging device is located closer to an imaging optical axis than the support part attachment area and does not overlap with the support part attachment area. [Explanation of symbols]

[0054] 20 Lens unit 24 Imaging lens 26 Aperture 50 System control circuit 52 memory 54 Display section 56 Timer 58 Thermometer 60 Image processing circuit 62 Aperture control circuit 66 Distance control circuit 68 SH control circuit 80 Operating member 82 Gyro 84 Power SW 86 Power supply control circuit 100 digital cameras 116 Shutter 121 External communication terminal 122 Storage medium 200 Imaging unit 230 Image sensor unit 231 Image sensor 232 Imaging board 240 Image stabilization mechanism 300 Heat dissipation material 302 Substrate attachment area 304 Support attachment area 310 Connection

Claims

1. An imaging device equipped with an image stabilization mechanism having a movable portion for holding an imaging element and a support portion for supporting the movable portion so as to be movable in a direction perpendicular to an optical axis direction, an imaging substrate on which the imaging element is mounted, and a heat dissipation member; The heat dissipation member is a substrate attachment area attached to the imaging substrate; a support attachment area attached to the support; a connection portion that connects the substrate attachment region and the support attachment region, The substrate attachment area is An imaging device characterized in that the imaging device is located closer to an imaging optical axis than the support part attachment area and does not overlap with the support part attachment area.

2. The substrate attachment area is The imaging device according to claim 1 , wherein the support portion is located farther in the optical axis direction than the support portion attachment area.

3. The substrate attachment area is 3. The imaging device according to claim 1, wherein the temperature sensor is located in a part of or near a high-temperature region of the imaging substrate.

4. The substrate attachment area is 3. The imaging device according to claim 1, wherein the power supply wiring is provided on the ground wiring or the power supply wiring of the imaging board.

5. 3. The imaging device according to claim 1, wherein the longitudinal directions of the substrate attachment area and the support attachment area are parallel to each other.

6. 3. The imaging device according to claim 1, wherein the longitudinal direction of the substrate attachment area is the same as the longitudinal direction of the imaging substrate.

7. The imaging substrate is a first surface on which the imaging element is mounted and a second surface facing the first surface; The heat dissipation member is 3. The imaging device according to claim 1, wherein the second surface and the support portion are connected to each other.

8. The connection portion is 3. The imaging device according to claim 1, further comprising a slit parallel to a direction in which the imaging substrate and the support portion are connected, and a bent portion.

9. The connection portion is 3. The imaging device according to claim 1, wherein the substrate attachment region and the support attachment region extend in a direction perpendicular to the optical axis direction from each other and are connected to each other by one or more bent portions.

10. The heat dissipation member is 3. The imaging device according to claim 1, wherein one end is wrapped around an elastic member and attached to the imaging board, and the other end via the connection portion is attached to the support portion.

11. An imaging device equipped with an image stabilization mechanism having a movable portion for holding an imaging element and a support portion for supporting the movable portion so as to be movable in a direction perpendicular to an optical axis direction, an imaging substrate on which the imaging element is mounted; a second substrate fixed to the imaging substrate; a heat dissipation member connecting the second substrate and the support portion, The heat dissipation member is a substrate attachment area attached to the second substrate; a support attachment area attached to the support; a connection portion that connects the substrate attachment region and the support attachment region, The substrate attachment area is An imaging device characterized in that the imaging device is located closer to an imaging optical axis than the support part attachment area and does not overlap with the support part attachment area.

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