Distribution board temperature rise alert system and distribution board function unit stacking plan support system

Abstract

To provide a distribution board temperature rise alert system which considers heat generation of a device, heat release of a distribution board, and a temperature rise in the distribution board.SOLUTION: The distribution board temperature rise alert system comprises: an input device 4 which accepts input of distribution board specifications and function unit specifications; an electric CAD device 2 which calculates a heat generation value of a function unit 20 on the basis of the function unit specifications; a mechanical CAD device 3 which calculates a heat generation value of a distribution board 10 and heat radiation values of the distributor board 10 and the function unit 20 on the basis of the distribution board specifications and the function unit specifications; a server 1 which calculates a temperature of the inside of the distribution board 10 from the heat generation value and the heat radiation values and, if this temperature exceeds an allowable temperature, outputs an alert; a display device 5 which displays results calculated by the electric CAD device 2, the mechanical CAD device 3, and the server 1; and a database 1D in which information for calculation in the electric CAD device 2, the mechanical CAD device 3, and the server 1 and calculation results are stored.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a power distribution panel temperature rise alert system and a power distribution panel functional unit stacking plan support system. [Background technology]

[0002] A distribution board (for example, a control center) that supplies power to multiple loads can have multiple functional units installed in the available space, but the number and type of functional units must be selected to prevent the temperature rise caused by heat generation from the equipment and wires inside the functional units when power is applied from exceeding the allowable temperature specified in the distribution board standards. Because there are many heat-generating elements inside a functional unit, calculating the amount of heat generated takes time. Furthermore, the temperature rise value must be calculated based on not only the amount of heat generated but also the amount of heat dissipated from the structure of the chassis and functional unit. It takes a lot of time to calculate whether the planned stacking of functional units will satisfy the allowable temperature. In relation to this problem, a switchboard specification determination support system has been disclosed as a system for supporting the layout design of panel devices on a switchboard (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-49969 Summary of the Invention [Problem to be solved by the invention]

[0004] However, while the system in Patent Document 1 assists in planning the appropriate placement of equipment on the surface of a distribution board, it does not take into account heat generated by the equipment, heat dissipation from the distribution board, or temperature rise inside the distribution board.

[0005] The present disclosure discloses technology for solving the above-mentioned problems, and aims to provide a distribution board temperature rise alert system that takes into account heat generation from equipment, heat dissipation from the distribution board, and temperature rises inside the distribution board, and a distribution board functional unit stacking plan support system that learns the output of this distribution board temperature rise alert system and supports distribution board functional unit stacking plans. [Means for solving the problem]

[0006] The distribution board temperature rise alert system of the present disclosure includes an input device for inputting distribution board specifications and functional unit specifications, an electrical CAD device for calculating the heat generation amount of the functional unit based on the functional unit specifications, a mechanical CAD device for calculating the heat generation amount of the distribution board and the heat dissipation amount of the functional unit and the distribution board based on the distribution board specifications and the functional unit specifications, a server for calculating the internal temperature of the distribution board from the heat generation amount and heat dissipation amount calculated by the electrical CAD device and the mechanical CAD device and for outputting an alarm if the allowable temperature of the distribution board is exceeded, a display device for displaying the results of calculations by the electrical CAD device, the mechanical CAD device, and the server, and a database for storing information and calculation results used by the electrical CAD device, the mechanical CAD device, and the server for calculations. The distribution board functional unit stacking planning support system of the present disclosure includes a learning device that includes a data acquisition unit that acquires learning data including distribution board specifications, functional unit specifications, functional unit stacking, and temperature inside the distribution board, and a model generation unit that uses the learning data to generate a trained model for inferring the functional unit stacking from the distribution board specifications and the functional unit specifications. The distribution board functional unit stack planning support system of the present disclosure includes an inference device that includes a data acquisition unit that acquires distribution board specifications and functional unit specifications, and an inference unit that uses a trained model for inferring functional unit stacks from the distribution board specifications and functional unit specifications and outputs the functional unit stacks from the distribution board specifications and functional unit specifications input from the data acquisition unit. [Effects of the Invention]

[0007] According to the distribution board temperature rise alert system of the present disclosure, a distribution board temperature rise alert system is obtained that takes into consideration heat generation from equipment, heat dissipation from the distribution board, and temperature rise inside the distribution board. According to the switchboard functional unit stacking plan support system of the present disclosure, a switchboard functional unit stacking plan support system can be obtained that can support switchboard functional unit stacking plans by learning the output of a switchboard temperature rise alert system. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a system configuration diagram of a switchboard temperature rise alert system according to a first embodiment. [Figure 2] 1 is a stacking diagram of functional units in a switchboard that is the subject of consideration of a switchboard temperature rise alert system according to embodiment 1. FIG. [Figure 3] Fig. 3A is an explanatory diagram of advance preparations for the switchboard temperature rise alert system according to embodiment 1. Fig. 3B is an explanatory diagram of advance preparations for the switchboard temperature rise alert system according to embodiment 1. Fig. 3C is an explanatory diagram of advance preparations for the switchboard temperature rise alert system according to embodiment 1. [Figure 4] FIG. 2 is an explanatory diagram of a processing flow of the switchboard temperature rise alert system according to the first embodiment. [Figure 5] 3 is a flowchart of the switchboard temperature rise alert system according to the first embodiment. [Figure 6] FIG. 10 is an explanatory diagram of a processing flow of the switchboard functional unit stacking plan support system according to the second embodiment. [Figure 7] 10 is a flowchart of a switchboard functional unit stacking plan support system according to a second embodiment. [Figure 8] FIG. 10 is a configuration diagram of a learning device of a switchboard functional unit stacking planning support system according to a second embodiment. [Figure 9] 10 is a flowchart relating to a learning process of a learning device of a switchboard functional unit stacking plan support system according to the second embodiment. [Figure 10] FIG. 10 is a conceptual diagram of a neural network model used in the learning process of the learning device of the switchboard functional unit stacking plan support system according to the second embodiment. [Figure 11] FIG. 10 is a configuration diagram of an inference device of a switchboard functional unit stacking planning support system according to a second embodiment. [Figure 12] 10 is a flowchart relating to an inference process of an inference device of a switchboard functional unit stacking plan support system according to the second embodiment. [Figure 13] 1 shows an example of the hardware configuration of an electrical CAD device, a mechanical CAD device, a server, a learning device, and an inference device according to first and second embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0009] Embodiment 1 Embodiment 1 relates to a distribution board temperature rise alert system that includes an electrical CAD device that calculates the heat generation amount of a functional unit, a mechanical CAD device that calculates the heat generation amount of a distribution board and the heat dissipation amount of the distribution board and the functional unit, a server that calculates the temperature inside the distribution board from the heat generation amount and heat dissipation amount and outputs an alarm if the temperature exceeds the allowable temperature, an input device that inputs the distribution board specifications and functional unit specifications, a display device that displays the results of calculations by the electrical CAD device 2, the mechanical CAD device, and the server, and a database that stores information and calculation results for calculations by the electrical CAD device, the mechanical CAD device, and the server.

[0010] The following describes the distribution board temperature rise alert system of embodiment 1 based on Figure 1, which is a system configuration diagram, Figure 2, which is a stack diagram of the distribution board functional units under consideration, Figures 3A to 3C, which are explanatory diagrams of advance preparations, Figure 4, which is an explanatory diagram of the processing flow, and Figure 5, which is a flowchart. In each drawing, the same or corresponding parts are denoted by the same reference numerals.

[0011] The configuration of a switchboard temperature rise alert system 100 that supports a switchboard 10 will be described with reference to Fig. 1. In the following description, the switchboard temperature rise alert system 100 will be referred to as the alert system 100 where appropriate. The alert system 100 includes a server 1, an electrical CAD device 2, a mechanical CAD device 3, an input device 4, and a display device 5. The server 1 includes a database 1D, the electrical CAD device 2 includes an electrical CAD database 2D, and the mechanical CAD device 3 includes a mechanical CAD database 3D.

[0012] Electrical CAD is software for creating drawings of electrical circuits, and the electrical CAD device 2 calculates the heat generation amount of the functional unit 20, which will be explained later. The functional unit 20 and the method for calculating the heat generation amount will be explained later. Mechanical CAD is software for creating structural drawings, and the mechanical CAD device 3 calculates the heat generation amount and heat dissipation amount of the switchboard 10, and also calculates the heat dissipation amount of the functional unit 20. The method for calculating the heat dissipation amount of the switchboard 10 will be explained later. The server 1 controls the electrical CAD device 2, the mechanical CAD device 3, the input device 4, and the display device 5, calculates the temperature inside the switchboard 10 from the heat generation and heat dissipation amount, and outputs an alarm if this temperature exceeds the allowable temperature. Furthermore, the database 1D stores information and calculation results required for calculations by the electrical CAD device 2, the mechanical CAD device 3, and the server 1. The input device 4 is used by an operator to input the switchboard specifications and functional unit specifications. The display device 5 displays the results of calculations performed by the electrical CAD device 2, the mechanical CAD device 3, and the server 1.

[0013] An example of a functional unit stacking diagram of the switchboard 10 that is a support target of the switchboard temperature rise alert system 100 will be described with reference to Fig. 2. In Fig. 2, for example, functional unit A is written as unit A. The switchboard 10 is, for example, a control center, and Fig. 2 shows an example in which the functional units 20 are mounted in a three-sided panel arrangement. However, in reality, there may be a single panel arrangement, or there may be four or more panels arranged in a row. In Fig. 2, the first side of the switchboard 10 is designated BA1, the second side is designated BA2, and the third side is designated BA3. The first surface BA1 of the switchboard is equipped with a functional unit A20A, a functional unit B20B, a functional unit C20C, a functional unit D20D, a functional unit E20E, and a functional unit F20F. The second side BA2 of the switchboard is equipped with functional units G20G, H20H, and I20I. The third side BA3 of the switchboard is equipped with functional unit J20J, functional unit K20K, functional unit L20L, functional unit M20M, and functional unit N20N. In addition, when there is no need to distinguish between the functional units and they are collectively described, they will be described as functional unit 20. Each functional unit 20 is equipped with devices such as a circuit board, a transformer, a capacitor, a resistor, a circuit breaker, a disconnecting switch, and electric wires.

[0014] Next, based on Figures 3A to 3C, we will explain the advance preparations required for the distribution board temperature rise alert system 100 to calculate the heat generation amount and heat dissipation amount from the specifications of the distribution board 10 and the specifications of the functional units 20, which are the purpose of the system, calculate the temperature inside the distribution board 10, and output an alarm if the allowable temperature is exceeded. In FIG. 3A, internal impedance information (installed device information) of each device to be installed in the functional unit 20 of the switchboard 10 is input to the database 2D of the electrical CAD device 2. Based on this internal impedance information, when the functional unit 20 to be mounted on the switchboard 10 is selected, the heat generation amount of the functional unit 20 can be calculated. In FIG. 3B, resistivity information of the bus conductors to be mounted on the switchboard 10 is input to the database 3D of the mechanical CAD device 3. Based on this resistivity information, once the switchboard specifications are determined, the heat generation amount of the bus conductor inside the switchboard 10 can be calculated. In FIG. 3C, structural information about the housing of the switchboard 10 and the functional unit 20 required for calculating the amount of heat dissipation is extracted from the design data of the mechanical CAD device 3 and stored in a database 3D. Based on this structural information, once the specifications of the switchboard 10 and the functional units 20 have been determined, the amount of heat dissipation of the entire switchboard 10 can be calculated.

[0015] Next, the overall processing flow of the distribution panel temperature rise alert system 100 will be described with reference to FIG. In step A, the designer selects the panel specifications of the switchboard 10 and the functional units 20 to be installed. In step B, the electrical CAD device 2 calculates the heat generation amount from the installed equipment information for the selected functional unit 20. For example, the heat generation amount of functional unit A is calculated to be 15W, and the heat generation amount of functional unit F is calculated to be 30W. In step C, the mechanical CAD device calculates the resistance value of the bus conductor from the resistivity information of the bus conductor, and further calculates the heat generation amount of the bus conductor from the bus current information. In step D, the amount of heat dissipation is calculated from the structural information of the switchboard 10 and the functional unit 20 in the mechanical CAD device. In step E, the server 1 calculates the temperature inside the switchboard 10 from the heat generation amount and heat radiation amount calculated in steps B to D, and outputs an alarm if the temperature exceeds the allowable temperature.

[0016] Here, the allowable value (allowable temperature) of the temperature inside the switchboard 10 will be described. The hottest part in a switchboard panel is usually the contact (or connection) that joins the busbar and the functional unit. The allowable temperature inside a distribution board is determined for each part by the JIS (Japanese Industrial Standards) and JEM (Standards of the Japan Electrical Manufacturers' Association) standards. Therefore, taking into consideration the allowable temperatures specified in the standards, the temperature is managed at the part with the most severe temperature conditions. The method for calculating the temperature inside a switchboard has become commonplace, and for example, the Japan Electricity Distribution Control Systems Industry Association has provided an example of such a calculation. Basically, the stacking of functional units is planned so that the heat generated by the entire switchboard is lower than the heat dissipation.

[0017] The processing flow of the distribution panel temperature rise alert system 100 will be described with reference to the flowchart of FIG. This processing flow includes step 11 (S11) to step 18 (S18). In step 11 (S11), a switchboard specification input step, the designer inputs the switchboard specifications of the switchboard 10. Here, the switchboard specifications include at least the number of panels, the type of panel housing, and the bus current, voltage, and short-circuit current. In step 12 (S12), a functional unit specification input step, the designer inputs the specifications of the functional unit 20. Here, the functional unit specifications include at least the type and number of functional units. In step 13 (S13), which is a stacking plan input step, a stacking plan is input, which indicates which functional units 20 are to be mounted on which panels of the switchboard 10. In step 14 (S14), a heat generation amount and heat radiation amount calculation step, the heat generation amount and heat radiation amount of the switchboard 10 and the functional unit 20 are calculated. In step 15 (S15), which is a step of calculating the temperature inside the panel, the temperature inside the panel of the switchboard 10 is calculated from the heat generation amount and heat radiation amount of the entire switchboard 10. In step 16 (S16), a step of determining the temperature inside the panel, it is determined whether the temperature inside the panel of the switchboard 10 exceeds the allowable temperature. If the temperature inside the panel exceeds the allowable temperature, the process proceeds to step 17 (S17), and if it does not exceed the allowable temperature, the process proceeds to step 18 (S18). In the alarm output step of step 17 (S17), an alarm is output, and the process returns to step 13 (S13) to redo the stacking plan. In the end step of step 18 (S18), the support for stacking planning is ended.

[0018] The distribution board temperature rise alert system 100 can improve the efficiency of the following distribution board design. (1) The temperature rise inside the panel is automatically calculated from the amount of heat generated and the amount of heat dissipated, reducing design time. (2) It is possible to determine whether the allowable temperature is satisfied at the time of stacking planning of functional units, which prevents rework after design.

[0019] As described above, the distribution board temperature rise alert system of the first embodiment can take into consideration heat generation from devices, heat dissipation from the distribution board, and temperature rise inside the distribution board.

[0020] Embodiment 2 The switchboard functional unit stacking plan support system of the second embodiment learns the output of the switchboard temperature rise alert system described in the first embodiment and supports the switchboard functional unit stacking plan.

[0021] The switchboard functional unit stacking planning support system of embodiment 2 will be described based on FIG. 6, which is an explanatory diagram of the processing flow of the switchboard functional unit stacking planning support system, FIG. 7, which is a flowchart, FIG. 8, which is a configuration diagram of a learning device, FIG. 9, which is a flowchart relating to the learning process of the learning device, FIG. 10, which is a neural network model used in the learning process of the learning device, FIG. 11, which is a configuration diagram of an inference device, and FIG. 12, which is a flowchart relating to the inference process of the inference device. In the drawings of the second embodiment, parts that are the same as or equivalent to those in the first embodiment are given the same reference numerals.

[0022] First, the overall processing flow of the switchboard functional unit stacking plan support system 200 will be described with reference to Fig. 6. The switchboard functional unit stacking plan support system 200 will be referred to as the support system 200 where appropriate. In step H, a stack diagram (pattern) of the functional unit 20 obtained by learning multiple examples of the distribution board temperature rise alert system 100 described in embodiment 1 is stored in the learned model memory unit 43 of the inference device 40 of the support system 200. In step I, the designer inputs the switchboard specifications and functional unit specifications of the switchboard 10. In step J, the support system 200 infers the optimal stack of functional units 20 from the specified switchboard specifications and functional unit specifications based on the trained model in the trained model storage unit 43, and outputs a stack diagram. In step K, the designer mounts the functional units 20 on the switchboard 10 according to the stack diagram output by the support system 200.

[0023] The processing flow of the switchboard functional unit stacking plan support system 200 will be described with reference to the flowchart of FIG. This processing flow includes step 21 (S21) to step 23 (S23). In step 21 (S21), a switchboard specification input step, the designer inputs the switchboard specifications of the switchboard 10. Here, the switchboard specifications include at least the number of panels, the type of panel housing, and the bus voltage, current, and short-circuit current. In step 22 (S22), a functional unit specification input step, the designer inputs the specifications of the functional unit 20. Here, the functional unit specifications include at least the type and number of functional units. In step 23 (S23), a stack diagram output step, an optimum stack of functional units is inferred and a stack diagram is output.

[0024] Next, the learning phase of the switchboard functional unit stacking plan support system 200 will be described with reference to FIGS. FIG. 8 is a configuration diagram of the learning device 30 of the switchboard functional unit stacking planning support system 200. The learning device 30 of the assistance system 200 includes a data acquisition unit 31, a model generation unit 32, and a trained model storage unit 33.

[0025] The data acquisition unit 31 acquires B1 input 1 and B2 input 2 (correct answer) as learning data. Note that B1 input 1 is the switchboard specifications and functional unit specifications, and B2 input 2 (correct answer) is the stacking of the functional units and the temperature inside the panel.

[0026] The model generation unit 32 learns the C output based on the learning data created based on the combination of the B1 input 1 and the B2 input 2 (correct answer) output from the data acquisition unit 31. That is, it generates a learned model that infers the optimal C output from the B1 input 1 and the B2 input 2 (correct answer) of the assistance system 200. Here, the learning data is data in which the B1 input 1 and the B2 input 2 (correct answer) are associated with each other. Note that the C output is a stack diagram of the optimal functional units.

[0027] The learning device 30 is used to learn the C output of the assistance system 200, but may be a device separate from the assistance system 200, connected to the assistance system 200 via a network, for example. The learning device 30 may also be built into the assistance system 200. Furthermore, the learning device 30 may exist on a cloud server.

[0028] The learning algorithm used by the model generation unit 32 may be a known algorithm such as supervised learning, unsupervised learning, reinforcement learning, etc. As an example, a case where a neural network is applied will be described. The model generation unit 32 learns the C output by so-called supervised learning, for example, according to a neural network model. Here, supervised learning refers to a method in which pairs of input and result (label) data are provided to the learning device 30, and the learning device 30 learns the features of the learning data and infers the result from the input.

[0029] A neural network consists of an input layer consisting of multiple neurons, an intermediate layer (hidden layer) consisting of multiple neurons, and an output layer consisting of multiple neurons. The intermediate layer may be one layer, or two or more layers.

[0030] For example, in a three-layer neural network as shown in Figure 10, when multiple inputs are input to the input layer (X1-X3), the values ​​are multiplied by weight W1 (w11-w16) and input to the middle layer (Y1-Y2), and the result is further multiplied by weight W2 (w21-w26) and output from the output layer (Z1-Z3). This output result changes depending on the values ​​of weights W1 and W2.

[0031] In the present disclosure, the neural network learns the C output by so-called supervised learning in accordance with learning data created based on a combination of B1 input 1 and B2 input 2 (correct answer) acquired by the data acquisition unit 31.

[0032] In other words, the neural network learns by inputting B1 input 1 to the input layer and adjusting the weights W1 and W2 so that the result output from the output layer approaches B2 input 2 (correct answer).

[0033] The model generation unit 32 generates and outputs a trained model by performing the above-described learning.

[0034] The trained model storage unit 33 stores the trained model output from the model generation unit 32.

[0035] Next, the learning process of the learning device 30 will be described with reference to Fig. 9. Fig. 9 is a flowchart showing the learning process of the learning device 30.

[0036] In step 31 (S31), the data acquisition unit 31 acquires B1 input 1 and B2 input 2 (correct answer). Note that, although B1 input 1 and B2 input 2 (correct answer) are acquired simultaneously, it is sufficient that B1 input 1 and B2 input 2 (correct answer) are input in association with each other, and the data for B1 input 1 and B2 input 2 (correct answer) may be acquired at different times.

[0037] In step 32 (S32), the model generation unit 32 learns the C output by so-called supervised learning in accordance with the learning data created based on the combination of B1 input 1 and B2 input 2 (correct answer) acquired by the data acquisition unit 31, and generates a learned model.

[0038] In step 33 (S33), the trained model storage unit 33 stores the trained model generated by the model generation unit 32.

[0039] Furthermore, the learning algorithm used in the model generation unit 32 can be deep learning, which learns to extract the features themselves, or machine learning can be performed according to other known methods, such as genetic programming, functional logic programming, or support vector machines.

[0040] Next, the utilization phase of the switchboard functional unit stacking plan support system 200 will be described with reference to FIGS.

[0041] FIG. 11 is a configuration diagram of the inference device 40 of the switchboard functional unit stacking planning support system 200. The inference device 40 of the assistance system 200 includes a data acquisition unit 41, an inference unit 42, and a trained model storage unit 43.

[0042] The data acquisition unit 41 acquires the B1 input 1. Here, the B1 input 1 is the switchboard specifications and the functional unit specifications.

[0043] The inference unit 42 infers the C output obtained using the trained model. That is, by inputting the B1 input 1 acquired by the data acquisition unit 41 to this trained model, it is possible to output the C output inferred from the B1 input 1. Here, the C output is a stack diagram of the optimal functional unit.

[0044] In this second embodiment, it has been described that the C output is output using a trained model trained by the model generation unit 32 of the assistance system 200, but it is also possible to obtain a trained model from outside another assistance system 200 and output the C output based on this trained model.

[0045] Next, the process for obtaining the C output using the inference device 40 will be described with reference to FIG.

[0046] In step 41 (S41), the data acquisition unit 41 acquires the B1 input 1.

[0047] In step 42 (S42), the inference unit 42 inputs the B1 input 1 to the trained model stored in the trained model storage unit 43, and obtains the C output.

[0048] In step 43 (S43), the inference unit 42 outputs the C output obtained by the trained model to the assistance system 200.

[0049] As described above, the switchboard functional unit stacking plan support system of the second embodiment can learn the output of the switchboard temperature rise alert system described in the first embodiment and support the switchboard functional unit stacking plan.

[0050] Here, an example of hardware for the server 1, electrical CAD device 2, mechanical CAD device 3, learning device 30, and inference device 40 according to the first and second embodiments will be described with reference to FIG. 13, using the server 1 as a representative example. The server 1 comprises a processor 1000 and a storage device 1001. The storage device 1001 includes a volatile storage device such as a random access memory, and a non-volatile auxiliary storage device such as a flash memory, both of which are not shown. Also, a hard disk auxiliary storage device may be provided instead of flash memory. Processor 1000 executes a program input from storage device 1001. In this case, the program is input from the auxiliary storage device to processor 1000 via a volatile storage device. Processor 1000 may output data such as calculation results to the volatile storage device of storage device 1001, or may store data in the auxiliary storage device via the volatile storage device.

[0051] Although the present disclosure describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to application to a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless variations not illustrated are conceivable within the scope of the technology disclosed in this disclosure, including, for example, cases where at least one component is modified, added, or omitted, and even cases where at least one component is extracted and combined with a component of another embodiment. [Explanation of symbols]

[0052] 1 server, 2 electrical CAD devices, 2D electrical CAD database, 3 Mechanical CAD device, 3D mechanical CAD database, 4 Input device, 5 Display device, 10 Switchboard, 20 Functional unit, 20A Functional unit A, 20B Functional unit B, 20C Functional unit C, 20D Functional unit D, 20E Functional unit E, 20F Functional unit F, 20G Functional unit G, 20H Functional unit H, 20I Functional unit I, 20J Functional unit J, 20K Functional unit K, 20L Functional unit L, 20M Functional unit M, 20N functional unit N, 30 learning device, 31 data acquisition unit, 32 model generation unit, 33 trained model storage unit, 40 inference device, 41 data acquisition unit, 42 inference unit, 43 Trained model memory unit, 100 Distribution panel temperature rise alert system, 200 Switchboard Functional Unit Stacking Planning Support System, 1000 Processors, 1001 Storage device, BA1 switchboard 1st side, BA2 switchboard 2nd side, BA3 Switchboard 3rd side.

Claims

1. an input device for inputting the switchboard specifications and the functional unit specifications; an electrical CAD device for calculating the heat generation amount of the functional unit based on the functional unit specifications; a mechanical CAD device that calculates the heat generation amount of the switchboard and the heat dissipation amount of the functional unit and the switchboard based on the switchboard specifications and the functional unit specifications; a server that calculates the temperature inside the switchboard from the heat generation amount and the heat dissipation amount calculated by the electrical CAD device and the mechanical CAD device, and outputs an alarm if the temperature exceeds an allowable temperature of the switchboard; a display device that displays the results calculated by the electrical CAD device, the mechanical CAD device, and the server; a database for storing information and calculation results for calculations by the electrical CAD device, the mechanical CAD device, and the server; A distribution panel temperature rise alert system.

2. The switchboard specifications include the number of panels, the type of panel case, and the bus voltage, current, and short-circuit current; The power distribution panel temperature rise alert system according to claim 1 , wherein the functional unit specifications include the type and number of the functional units.

3. the electrical CAD device stores an internal impedance of a device mounted on each of the functional units for calculating the heat generation amount of the functional units; the mechanical CAD device stores the resistivity of a bus bar for calculating the heat generation amount of the switchboard; The distribution board temperature rise alert system according to claim 1 or claim 2, wherein the mechanical CAD device stores structural information of the distribution board and the functional units for calculating the heat dissipation amount of the distribution board and the functional units.

4. a data acquisition unit that acquires learning data including the switchboard specifications, the functional unit specifications, the functional unit stacking, and the temperature inside the switchboard; a model generation unit that uses the learning data to generate a trained model for inferring the functional unit stack-up from the distribution board specifications and the functional unit specifications.

5. a data acquisition unit for acquiring the switchboard specifications and the functional unit specifications; a data acquisition unit that outputs the functional unit stack-up from the switchboard specifications and the functional unit specifications input from the data acquisition unit, using a trained model for inferring the functional unit stack-up from the switchboard specifications and the functional unit specifications.

6. The switchboard specifications include the number of panels, the type of panel case, and the voltage, current, and short-circuit current of the busbars, and the functional unit specifications include the type and number of functional units, 6. The switchboard functional unit stacking planning support system according to claim 4, wherein the functional unit stacking is an arrangement of the functional units in a switchboard.

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