Method for processing object and method for manufacturing wafer

Abstract

To suppress a resin from remaining on an object to be treated when a sheet is peeled off from the object to be treated.SOLUTION: A method for treating a workpiece P includes a first resin supplying step of supplying a first resin J to the surface Sa of a sheet S, a second resin laminating step of laminating a second resin K having a lower adhesive strength than the first resin J onto the first resin J supplied to the sheet S, a workpiece coating step of contacting the workpiece P with the second resin K and covering the workpiece P with the second resin K, and a curing step of curing the first resin J and the second resin K.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a method for processing an object to be processed and a method for manufacturing a wafer. [Background technology]

[0002] A known processing method involves forming a flat surface by attaching a sheet to one side of a plate-shaped workpiece via a resin, and then grinding and flattening the other side of the workpiece held by suction using the flat surface. Such a processing method is described, for example, in Patent Document 1. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-149451 Summary of the Invention [Problem to be solved by the invention]

[0004] The sheet attached to the workpiece is peeled off after the grinding process, but at this time, the resin may remain on the workpiece.

[0005] The present invention has been made in view of the above points, and aims to provide a technique that can suppress resin residue on an object to be treated when a sheet is peeled off from the object to be treated. [Means for solving the problem]

[0006] A method for processing a workpiece according to one embodiment of the present invention includes a first resin supplying step of supplying a first resin to the surface of a sheet, a second resin laminating step of laminating a second resin having a lower adhesive strength than the first resin onto the first resin supplied to the sheet, a workpiece coating step of contacting the workpiece with the second resin and covering the workpiece with the second resin, and a curing step of curing the first resin and the second resin.

[0007] A wafer manufacturing method according to one aspect of the present invention includes a first resin supplying step of supplying a first resin onto the surface of a sheet, a second resin laminating step of laminating a second resin having a lower adhesive strength than the first resin onto the first resin supplied to the sheet, a workpiece coating step of contacting the workpiece with the second resin and covering the workpiece with the second resin, a hardening step of hardening the first resin and the second resin, a first planarizing step of planarizing one side of the workpiece opposite to the side coated with the second resin, a peeling step of peeling the sheet together with the first resin and the second resin from the workpiece, and a second planarizing step of planarizing the other side of the workpiece after the peeling step. [Effects of the Invention]

[0008] According to the present invention, when the sheet is peeled off from the object to be treated, it is possible to suppress the resin from remaining on the object to be treated. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 10 is a diagram illustrating a first resin supplying step. [Figure 2] 10A and 10B are diagrams illustrating a first resin curing step. [Figure 3] 10A and 10B are diagrams illustrating a second resin layering step and a processing object covering step. [Figure 4] FIG. 10 is a diagram illustrating a curing step. [Figure 5] FIG. 10 is a diagram illustrating a first flattening step. [Figure 6] FIG. 10 is a diagram illustrating a peeling step. [Figure 7] FIG. 10 is a diagram illustrating a second flattening step. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a wafer manufacturing method according to this embodiment and a method for processing a workpiece according to this embodiment, which is performed during the wafer manufacturing method, will be described with reference to the accompanying drawings. The method for processing a workpiece according to this embodiment enables the resin interposed between the sheet and the workpiece to be successfully peeled off together with the sheet, which has been attached for the purpose of holding and protecting the workpiece before planarization.

[0011] The wafer manufacturing method according to the present embodiment, which will be described below, is a method for manufacturing a flat wafer by processing a workpiece, and includes eight steps (a first resin supply step, a first resin hardening step, a second resin lamination step, a workpiece coating step, a hardening step, a first planarization step, a peeling step, and a second planarization step). Five of these steps (a first resin supply step, a first resin hardening step, a second resin lamination step, a workpiece coating step, and a hardening step) constitute a method for processing a workpiece. Each step will be described in detail below.

[0012] <First resin supply step> 1 is a diagram illustrating the first resin supplying step, in which a first resin J having high adhesive strength is supplied onto a sheet S placed on a flat surface 11 of a holding table 10, as shown in FIG.

[0013] The sheet S is larger than the workpiece P (see FIG. 3) used to manufacture a flat wafer. The sheet S is not particularly limited, but may be made of a synthetic resin such as polyolefin, polyethylene, or PET (Poly Ethylene Terephthalate). The shape of the sheet S is not particularly limited. When manufacturing a circular wafer from the workpiece P, the sheet S is, for example, circular, but a sheet S larger than the wafer may be used and cut along the wafer at a predetermined timing.

[0014] The first resin J is a resin having a higher adhesive strength than the second resin K described below, and may have the property of being cured by a predetermined external stimulus (such as light or heat). The first resin J is supplied in the first resin supplying step as a fluid liquid resin. The method for testing the adhesive strength of the resin is not particularly limited, and may be, for example, the test method specified in JIS K 6854-1 (Adhesives - Peel Adhesion Strength Test Method - Part 1: 90-Degree Peel). The first resin J may be, for example, a photocurable (e.g., ultraviolet-curable) resin or a thermosetting resin. In this embodiment, the first resin J is an acrylic resin, more specifically, an ultraviolet-curable acrylic resin, but the first resin J is not limited to an ultraviolet-curable acrylic resin. The first resin J may also be, for example, another ultraviolet-curable resin such as an epoxy resin, or a thermosetting resin.

[0015] The holding table 10 is a table having a flat surface 11 on which the sheet S is placed. The holding table 10 is configured to hold the sheet S placed on the surface 11. There are no particular limitations on the holding table 10, but for example, the holding table 10 may be configured to suck and hold the sheet S onto the surface 11 by using negative pressure generated on the surface 11 by operating a suction source (not shown). It is desirable that the holding table 10 be made of a material that transmits ultraviolet light, such as quartz glass.

[0016] In the first resin supply step, first, a first resin J is dropped onto the surface Sa of the sheet S from a nozzle (not shown) provided above the holding table 10. After the nozzle is retracted, the first resin J deposited on the surface Sa of the sheet S is spread to a substantially uniform thickness using a roller C or the like. As a result, the surface Sa of the sheet S is covered with the spread first resin J, as shown in FIG. 1 . The area of ​​the surface Sa of the sheet S that is covered with the first resin J is, for example, approximately the same size as the workpiece P. However, the area covered with the first resin J only needs to be at least approximately the same size as the workpiece P, and may be larger than the workpiece P.

[0017] Although an example has been shown in which the first resin J is spread using a roller C, in the first resin supplying step, it is sufficient that an area of ​​the surface Sa that is at least as large as the workpiece P is covered with the first resin J. For this reason, the first resin J deposited on the surface Sa may be spread using a brush or the like instead of the roller C. Furthermore, instead of spreading the first resin J deposited on the surface Sa, the surface Sa may be coated with the first resin J by spraying it onto the surface Sa. Furthermore, if the holding table 10 is configured to be rotatable, the first resin J may be spread by centrifugal force generated by the rotation of the holding table 10.

[0018] <First resin curing step> 2 is a diagram illustrating the first resin curing step, in which the first resin J is cured before the second resin laminating step, which will be described later with reference to FIG.

[0019] In the first resin curing step, an ultraviolet irradiation unit 20 provided below the surface 11 of the holding table 10 radiates ultraviolet rays UV. The ultraviolet irradiation unit 20 includes a light source 21 that emits ultraviolet rays UV. The light source 21 may be any light source that radiates ultraviolet rays UV, and may be, for example, a UV-LED, a mercury lamp, or the like.

[0020] The ultraviolet rays UV emitted from the light source 21 are irradiated onto the first resin J, which is an ultraviolet-curable acrylic resin, through the holding table 10 and the sheet S, and as a result, the first resin J is cured and adhered to the sheet S. This makes it possible to avoid a situation in which, in the second resin lamination step that is performed later, the first resin J is pushed aside by the newly supplied second resin K, exposing the surface Sa, and as a result, the second resin K comes into direct contact with the sheet S.

[0021] The first resin curing step is preferably performed in a state where the first resin J is exposed to oxygen, that is, in a state where the surface of the first resin J that is not in contact with the sheet S is exposed to oxygen. In other words, the first resin curing step preferably includes a step of irradiating ultraviolet rays UV onto the first resin J, at least a portion of which is exposed to a space containing a predetermined amount of oxygen. Specifically, the first resin curing step is preferably performed in the atmosphere, for example.

[0022] This is because when ultraviolet light is irradiated onto the first resin J, which is an ultraviolet-curable acrylic resin, in an oxygen-containing atmosphere, oxygen inhibits the photopolymerization reaction on the surface Ja of the first resin J that is in contact with the atmosphere (oxygen), i.e., oxygen inhibition occurs. Due to oxygen inhibition, in the first resin curing step, the exposed surface portion of the first resin J does not harden and maintains its fluidity, while the other portions harden to form a layer of the first resin J adhered to the sheet S. In other words, the first resin J is in a semi-cured state, where it is partially hardened and partially unhardened. This makes it possible to bring the first resin J and the second resin K into contact with each other in a fluid state while avoiding direct contact of the second resin K with the sheet S in the second resin lamination step that is performed later.

[0023] Generally, in the step of curing a resin by irradiating it with ultraviolet light, it is undesirable for the curing of the resin to be inhibited. For this reason, ultraviolet light is typically irradiated onto the resin in an environment where oxygen inhibition is suppressed, such as in a vacuum or a nitrogen atmosphere purged with nitrogen, and oxygen inhibition is not intentionally created. In contrast, the first resin curing step described above actively utilizes oxygen inhibition to differentiate the state of the first resin J on the sheet S side from the side opposite the sheet S (the second resin side), thereby simultaneously achieving the two different states required of the first resin J in the second resin lamination step described below (a state in which fluidity is lost and the resin is fixed, and a state in which fluidity is maintained).

[0024] The above describes an example in which ultraviolet light is irradiated in an environment in which oxygen inhibition occurs in the first resin curing step, but the method for achieving the coexistence of these two different states is not particularly limited as long as the sheet S side of the first resin J is cured and the fluidity of the side opposite the sheet S (the second resin side) is maintained. For example, if the first resin J is a thermosetting resin, the first resin curing step may achieve the above-mentioned two different states on the sheet S side and the side opposite the sheet S by using any method that inhibits thermosetting.

[0025] <Second Resin Laminating Step and Processing Object Covering Step> 3 is a diagram illustrating the second resin layering step and the workpiece coating step. In the second resin layering step, as shown in FIG. 3, a second resin K having a lower adhesive strength than the first resin J is layered on the first resin J supplied to the sheet S. In the workpiece coating step, the workpiece P is brought into contact with the second resin K, and the workpiece P is coated with the second resin K.

[0026] The second resin K is a resin having weaker adhesive strength than the first resin J described above. Like the first resin J, the second resin K may also have the property of being hardened by a predetermined external stimulus, and therefore may be a photo-curable (e.g., ultraviolet-curable) resin or a thermosetting resin. The second resin K may also have the property of being hardened by the same type of stimulus (e.g., light, heat, etc.) as the first resin J, or may have the property of being hardened by a different type of stimulus. The second resin K is supplied in the second resin lamination step in the form of a fluid liquid resin. In this embodiment, an example will be described in which the second resin K is an ultraviolet-curable acrylic resin like the first resin J.

[0027] The workpiece P is a disk-shaped wafer made of silicon, and may be, for example, an as-sliced ​​wafer cut from an ingot using a wire saw or the like before planarization. The workpiece P may also be a wafer made of a material other than silicon, such as ceramic, glass, or sapphire, or may be a semiconductor wafer on which devices are already formed.

[0028] In the second resin layering step and the workpiece coating step, first, a second resin K is dropped onto the surface Ja of the first resin J from a nozzle (not shown) provided above the holding table 10. At least a portion of the first resin J on the side in contact with the sheet S is cured, restricting the flow of the first resin J, and the first resin J is in a semi-cured state where a predetermined fluidity remains in the portion exposed to the surface Ja, so that the first resin J does not escape when the second resin K is dropped. Therefore, the dropped second resin K is supplied onto the first resin J. As shown in FIG. 3, the second resin K supplied onto the first resin J is maintained in a state of being concentrated in a portion of the surface Ja of the first resin J, for example, near the center of the surface Ja, due to its viscosity.

[0029] Next, the nozzle is retracted, and the holding table 30, holding the workpiece P on its surface 31, is positioned above the holding table 10. Furthermore, the holding table 30 is lowered toward the holding table 10 by a lifting mechanism (not shown), bringing the surface Pa, which is the underside of the workpiece P, into contact with the second resin K. The holding table 30 is then gradually lowered, so that the second resin K is pressed against the first resin J and spread in the radial direction of the workpiece P. This causes the second resin K to form a new layer on top of the layer of the first resin J, i.e., to be layered on the first resin J. At the same time, the surface Pa of the workpiece P is covered by the second resin K, which has been spread in the radial direction of the workpiece P. The holding table 30 may be lowered until the entire surface Pa of the workpiece P is covered by the second resin K. For example, as shown in FIG. 4, the second resin K may be lowered until the second resin K wraps around and covers the outer edge of the workpiece P. However, it is not necessary for the entire surface Pa of the workpiece P to be covered by the second resin K. It is desirable that at least the device region of the surface Pa where the device is formed be covered, and it is more desirable that the peripheral excess region around the device region be covered as well, but it is also possible that the outer edge of the workpiece P be covered.

[0030] <Curing step> 4 is a diagram illustrating the curing step. In the curing step, the first resin J and the second resin K are cured. In the curing step, for example, similar to the first resin curing step, an ultraviolet irradiation unit 20 provided below the surface 11 of the holding table 10 may radiate ultraviolet rays UV. This allows the ultraviolet rays UV emitted from the light source 21 to be irradiated onto the first resin J and the second resin K through the holding table 10 and the sheet S, and as a result, the first resin J and the second resin K may be cured.

[0031] By irradiating with ultraviolet light UV, the first resin J and the second resin K are cured while in contact with the sheet S and the workpiece P, respectively. As a result, the first resin J adheres to the sheet S with a first adhesive force, and the second resin K adheres to the workpiece P with a second adhesive force weaker than the first adhesive force. Furthermore, at the start of the curing step, the first resin J and the second resin K are in contact with each other while maintaining their fluidity, so that at least a portion of them are mixed near their interface. By irradiating with ultraviolet light, the first resin J and the second resin K, including the mixed portion, are cured, and the first resin J and the second resin K are bonded to each other so strongly that they will not break or peel even when a force at least equal to the second adhesive force between the second resin K and the workpiece P is applied in the direction of separation. In other words, the first resin J and the second resin K are bonded to each other with an adhesive force equal to or greater than the second adhesive force upon curing.

[0032] 4, the curing step is desirably performed with the workpiece P pressed against the sheet S by the holding table 30. This allows the resin to harden and bond without any gaps between the layers. Furthermore, the pressure affects the miscibility of the first resin J and the second resin K and the interfacial tension between the first resin J and the second resin K, which promotes mixing of the first resin J and the second resin K and is expected to result in a stronger bond between the first resin J and the second resin K.

[0033] In order to reliably cure the first resin J and the second resin K, the curing step is desirably carried out in an environment where oxygen inhibition does not occur, such as a nitrogen-purged nitrogen atmosphere or a vacuum, but it may also be carried out in an oxygen-containing atmosphere. This is because even if the curing step is carried out in the atmosphere, the layers are not exposed between them, and there are almost no surfaces that come into direct contact with oxygen.

[0034] As described above, according to the method for processing a workpiece according to this embodiment, a processing result is formed in which a sheet S is adhered to the workpiece P via a first resin J and a second resin K, and the adhesive strength (or bonding strength) between each layer of the processing result from the sheet S to the workpiece P has the following relationship: Adhesion strength between sheet S and first resin J > Adhesion strength between second resin K and workpiece P Adhesion (bonding strength) between first resin J and second resin K > Adhesion strength between second resin K and object to be treated P

[0035] <First flattening step> 5 is a diagram illustrating the first planarization step. In the first planarization step, of the two surfaces of the workpiece P, the surface opposite to the surface of the workpiece P that is coated with the second resin K, i.e., the exposed surface Pa, is planarized. The first planarization step is performed, for example, by a grinding device 40.

[0036] 5, the grinding device 40 includes a holding table 41 having a flat surface 42 on which the processed product is placed, and a grinding unit 43 that grinds the processed product. The grinding unit 43 includes a mount 45 provided at the lower end of a rotation shaft 44, and a grinding wheel 46 held on the underside of the mount 45. The grinding wheel 46 is provided with a wheel base 47 and multiple grinding stones 48 arranged in a ring shape on the underside of the wheel base 47. The multiple grinding stones 48 are formed, for example, by bonding diamond abrasive grains with a bonding agent such as a vitrified bond.

[0037] In the first flattening step, first, the grinding device 40 holds the processed object, which is placed on the holding table 41 with the sheet S facing the surface 42, on the holding table 41. The holding table 41 is not particularly limited, but may be configured, for example, to suck and hold the processed object to the surface 42 by using negative pressure generated on the surface 42 by operating a suction source (not shown). Because the sheet S side of the processed object is flattened by the sheet S and the resins (first resin J, second resin K), vacuum leaks and the like do not occur during suction holding.

[0038] Next, the grinding device 40 rotates the holding table 41. The holding table 41 is configured to be rotatable by a rotation mechanism (not shown), and by rotating it while holding the processed product, the processed product can be rotated. Furthermore, the grinding device 40 rotates the grinding wheel 46 at high speed around the rotation axis 44. Thereafter, the grinding device 40 lowers the grinding unit 43 so that the grinding stone 48 of the rotating grinding wheel 46 comes into contact with the processed product held on the holding table 41. As a result, the exposed surface Pa of the workpiece P is ground and flattened.

[0039] <Peeling step> 6 is a diagram illustrating the peeling step. In the peeling step, the sheet S is peeled off from the workpiece P together with the first resin J and the second resin K. The peeling step is performed, for example, by a peeling device 50, as shown in FIG. 6, which includes a holding table 51 having a flat surface 52 on which the processed object is placed, and a gripping unit 53 that grips the sheet S adhered to the workpiece P.

[0040] In the peeling step, first, the peeling device 50 holds the processed object, which has been placed on the holding table 51 with the surface Pa flattened by the grinding device 40 facing the surface 52, on the holding table 51. The holding table 51 is not particularly limited, but may be configured, for example, to suck and hold the processed object on the surface 52 by a negative pressure generated on the surface 52 by the operation of a suction source (not shown). Because the flattened surface Pa of the processed object faces the surface 52 of the holding table 51, no vacuum leak or the like occurs during suction holding.

[0041] Next, the peeling device 50 grips an edge of the sheet S of the processing result held on the holding table 51 with the gripping unit 53. Thereafter, the gripping unit 53 holding the sheet S is moved toward the center of the processing result by a moving mechanism (not shown). As a result, a force that resists the adhesive force acts between the processing object P held on the holding table 51 and the sheet S gripped by the gripping unit 53, and the sheet S is peeled off from the processing object P.

[0042] More specifically, since the processing result sheet S and the processing object P are bonded with a relatively weak adhesive force between them, the processing object P and the second resin K are separated into two at the boundary between them by a force that resists the adhesive force, and the sheet S is peeled off from the processing object P. In other words, the first resin J and the second resin K are peeled off from the processing object P together with the sheet S while remaining adhered to the sheet S. Therefore, it is possible to prevent the resins (first resin J, second resin K) from remaining on the processing object P side after the sheet S is peeled off.

[0043] <Second flattening step> 7 is a diagram illustrating the second planarization step. In the second planarization step, after the peeling step, the other of the two surfaces (surface Pa, surface Pb) of the workpiece P, i.e., surface Pb that was coated with the second resin K before the peeling step, is planarized. The second planarization step is performed, for example, by a grinding device 40, similar to the first planarization step.

[0044] In the second planarization step, first, the grinding device 40 places the workpiece P on the holding table 41 with the unground surface Pb facing the grinding unit 43, and holds it on the holding table 41. At this time, as shown in FIG. 7 , the workpiece P may be held on the holding table 41 after a protective member T is attached to the ground surface Pa of the workpiece P that has been flattened.

[0045] The protective member T may be attached by a processing method for the workpiece P using the two types of resins (first resin J, second resin K) described above. Furthermore, the attachment of the protective member T in the second planarization step does not have the role of filling in the irregularities on the unplanarized surface of the workpiece P with resin to planarize it, but only serves to protect the already planarized surface. For this reason, the protective member T may be attached directly to the workpiece P by the adhesive force of the surface of the protective member T without the interposition of a resin or the like, as long as sufficient holding force required during the grinding process can be obtained.

[0046] Thereafter, the grinding device 40 operates in the same manner as in the first planarization step to grind and planarize the surface Pb of the workpiece P. As a result, both surfaces of the workpiece P are planarized, and a planarized wafer W is manufactured.

[0047] As described above, according to the method for processing a workpiece and the method for manufacturing a wafer according to this embodiment, the resin interposed between the workpiece and the sheet can be bonded to the workpiece and the sheet with different adhesive strengths. More specifically, the workpiece and the resin can be bonded with an adhesive strength weaker than the adhesive strength between the sheet and the resin. This makes it possible to suppress the resin from remaining on the workpiece when the sheet is peeled off from the workpiece. Therefore, it is possible to avoid various inconveniences caused by the resin remaining on the workpiece after the sheet is peeled off, and as a result, it becomes possible to efficiently manufacture flat wafers.

[0048] Furthermore, in the method for processing a workpiece and the method for manufacturing a wafer according to this embodiment, by using an ultraviolet-curable acrylic resin, which is a radical polymerization resin, as the first resin J, oxygen inhibition is utilized to create a state in which only the surface Ja of the first resin J is uncured, and then the second resin K can be supplied onto the first resin J. This makes it possible to easily and reliably form a layer of the second resin K on top of the layer of the first resin J, thereby preventing the highly adhesive first resin J from coming into contact with the workpiece P. Furthermore, by firmly bonding the first resin J and the second resin K, separation between the first resin J and the second resin K is avoided when the sheet is peeled off, thereby suppressing resin residue on the workpiece P side.

[0049] The embodiments of the present invention are not limited to the above-described embodiments, and may be variously modified, substituted, or altered without departing from the spirit and scope of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention.

[0050] The processing order of each step described in the above embodiment is not limited to this example and can be changed within a range that does not cause inconsistencies. For example, the workpiece coating step may be performed prior to the first resin supply step and the second resin lamination step, and the first resin J and the second resin K may be laminated by pressing the workpiece P coated with the second resin K against the first resin J on the sheet S.

[0051] Some of the steps described in the above-described embodiments may be omitted, or new steps may be added. For example, the first resin curing step may be omitted by taking any measures to prevent the first resin J from being extruded from the sheet S. In other words, the first resin J and the second resin K may be laminated without curing the first resin J.

[0052] In the above-described embodiment, an example was shown in which the first resin J was cured in an environment where oxygen inhibition occurs in the first resin supply step. However, it is sufficient that the first resin J and the second resin K are bonded more strongly than the second resin K and the workpiece P, and the first resin J may be completely cured in the first resin supply step. In other words, the use of oxygen inhibition is one example of a technique for creating a state in which the first resin J and the second resin K are bonded more strongly than the second resin K and the sheet S, and the above-described state may be achieved by other techniques. For example, the above-described state may be achieved by reducing the adhesive force between the second resin K and the sheet S by modifying the surface Sa of the sheet S through any treatment. Furthermore, the first resin J may be cured so as to form irregularities on the surface Ja of the first resin J, thereby creating an anchor effect between the first resin J and the second resin K, thereby creating a state in which the first resin J and the second resin K are bonded more strongly than the second resin K and the workpiece P.

[0053] In the above-described embodiment, an example is shown in which the second resin K is laminated on the first resin J so as not to come into contact with the sheet S, but it is sufficient if the first resin J, which has strong adhesive strength, does not come into direct contact with the workpiece P, and the first resin J may be partially applied to the surface Sa of the sheet S, and the second resin K may be applied to the areas of the surface Sa where the first resin J is not applied.

[0054] In the above-described embodiment, an example has been shown in which the sheet S, the first resin J, the second resin K, and the workpiece P are stacked in this order in a vertically upward direction, but this is not particularly limited to this example. For example, they may be stacked in the above-described order in a vertically downward direction, or they may be stacked so that they are aligned in a direction inclined or perpendicular to the vertical direction.

[0055] In the above-described embodiment, the method for processing the workpiece P is a method for adhering a sheet S to the workpiece P, and an example has been shown in which the processing result obtained by this method is used for manufacturing wafers, but the processing result may be used for purposes other than manufacturing wafers. The processing result may be used to perform any processing other than grinding on the workpiece P (e.g., cutting, polishing, etc.), or may be used to perform processing other than processing on the workpiece P (e.g., cleaning, inspection, etc.). [Industrial Applicability]

[0056] As described above, the method for processing a workpiece and the method for manufacturing a wafer of the present invention can suppress the residue of resin on the workpiece when peeling off the sheet and resin from the workpiece, and are useful, for example, when manufacturing a flat wafer from a plate-shaped workpiece. [Explanation of symbols]

[0057] 10, 30, 41, 51: holding table, 11, 31, 42, 52, Sa, Ja: surface, 20: ultraviolet irradiation unit, 21: light source, 40: grinding device, 43: grinding unit, 44: rotating shaft, 45: mount, 46: grinding wheel, 47: wheel base, 48: grinding stone, 50: peeling device, 53: gripping part, C: roller, J: first resin, K: second resin, P: object to be treated, Pa, Pb: surface, S: sheet, T: protective member, UV: ultraviolet light, W: wafer

Claims

1. a first resin supplying step of supplying a first resin to a surface of a sheet; a second resin laminating step of laminating a second resin having a lower adhesive strength than the first resin onto the first resin supplied to the sheet; a workpiece coating step of contacting the workpiece with the second resin and covering the workpiece with the second resin; a curing step of curing the first resin and the second resin. A method for treating an object to be treated.

2. The method further includes a first resin curing step of curing the first resin before the second resin laminating step. The method for treating an object to be treated according to claim 1.

3. the first resin is an ultraviolet-curable acrylic resin, The first resin curing step includes irradiating the first resin with ultraviolet light in a space containing a predetermined amount of oxygen. The method for treating an object to be treated according to claim 2.

4. A method for manufacturing a wafer, comprising: a first resin supplying step of supplying a first resin to a surface of a sheet; a second resin laminating step of laminating a second resin having a lower adhesive strength than the first resin onto the first resin supplied to the sheet; a workpiece coating step of contacting the workpiece with the second resin and covering the workpiece with the second resin; a curing step of curing the first resin and the second resin; a first planarization step of planarizing one surface of the object opposite to the surface coated with the second resin; a peeling step of peeling the sheet together with the first resin and the second resin from the object to be treated; After the peeling step, a second planarization step of planarizing the other surface of the object to be processed is provided. Wafer manufacturing method.

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