Light heating device and light source unit

Abstract

To provide an optical heating device in which heating light emitted from a solid-state light source is prevented from being reflected by an object to be processed and being radiated onto the solid-state light source, and a light source unit mounted on the optical heating device.SOLUTION: A light heating device according to the present invention includes a support unit that supports an object to be processed and a light source unit that radiates light onto the object to be processed, and the light source unit includes a heat sink having an inclined surface that is inclined relative to the main surface of the object to be processed, a substrate supported on the inclined surface, and a plurality of solid-state light sources that are placed on the substrate and are positioned substantially outside the object to be processed when viewed in a first direction perpendicular to the main surface of the object to be processed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an optical heating device that heats an object to be processed by irradiating the object with light, and also to a light source unit mounted in the optical heating device. [Background technology]

[0002] In semiconductor manufacturing processes, various processes such as film formation, oxidation / diffusion, modification, and annealing are performed on processing objects such as semiconductor wafers. These processes often employ a heating method in which a heating light (hereinafter sometimes referred to as "heating light") is irradiated onto the main surface of the processing object because it allows for non-contact processing. Here, the "main surface" refers to the surface that is much larger in area than the other surfaces of a plate-like object.

[0003] Examples of light sources for heating light include halogen lamps and solid-state light sources such as LED elements. Of these, solid-state light sources are increasingly being adopted because they are capable of rapidly raising the temperature of the object to be treated. For example, Patent Document 1 listed below discloses an optical heating device in which multiple LED elements are arranged to face the main surface of the object to be treated, and the object is irradiated with heating light. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2016-58722 Summary of the Invention [Problem to be solved by the invention]

[0005] By using a solid-state light source as the light source of the heating light, it is possible to select a solid-state light source that emits heating light suitable for the absorption wavelength of the object to be processed, enabling rapid temperature increase of the object to be processed. Also, as shown in Patent Document 1, if the light source is positioned facing the main surface of the object to be processed, for example, by making the output of the light source facing the central region of the object to be processed different from the output of the light source facing the peripheral region of the object to be processed, it becomes easier to make the temperature uniform within the main surface of the object to be processed.

[0006] Incidentally, a portion of the heating light irradiated onto the main surface of the object to be processed is reflected by the main surface of the object to be processed. Therefore, when a light source is disposed opposite the object to be processed, the heating light reflected by the main surface of the object to be processed is reflected back toward the light source and is irradiated directly onto the light source. In this case, if the light source is a solid-state light source such as an LED element or a laser diode (LD) element, the irradiation of the heating light reflected by the object to be processed may increase the temperature of the solid-state light source, leading to a decrease in light-emitting efficiency and a shortened lifespan.

[0007] Furthermore, in recent years, there has been an increasing demand for heat treatment of objects to be treated at higher temperatures while achieving rapid temperature rise. Therefore, in order to increase the temperature of the object to be treated, it is conceivable to increase the output of the solid-state light source, for example, and irradiate the object with more heating light. However, in conventional configurations, the solid-state light source is positioned opposite the object to be treated, and the heating light reflected by the object to be treated is irradiated onto the solid-state light source. Therefore, increasing the output of the solid-state light source results in a more significant decrease in the luminous efficiency and a shorter lifespan of the solid-state light source. In other words, in conventional optical heating devices in which the light source is positioned opposite the main surface of the object to be treated, it is difficult to increase the output of the solid-state light source.

[0008] In view of the above, an object of the present invention is to provide an optical heating device in which heating light emitted from a solid-state light source is prevented from being reflected by an object to be treated and being irradiated onto the solid-state light source. [Means for solving the problem]

[0009] The light heating device according to the present invention is a support unit that supports the object to be processed; a light source unit that irradiates light onto the processing object, The light source unit is a heat sink having an inclined surface inclined with respect to a main surface of the processing object; a substrate supported on the inclined surface; and a plurality of solid-state light sources placed on the substrate and positioned substantially outside the object to be processed when viewed in a first direction perpendicular to the main surface of the object to be processed.

[0010] In this specification, "the plurality of solid-state light sources are located substantially outside the object to be treated" may mean that 80% or more of the plurality of solid-state light sources are located outside the object to be treated when viewed in the first direction.

[0011] According to the above configuration, the solid-state light source is placed on a substrate that is tilted with respect to the main surface of the object to be processed. Therefore, the solid-state light source emits heating light with the emission surface from which the heating light is emitted tilted with respect to the object to be processed. Therefore, the heating light emitted from the solid-state light source and irradiated onto the object to be processed is reflected in a direction different from that of the solid-state light source that emitted the heating light.

[0012] The heating light reflected by the object to be processed travels in a first direction through an area facing the object to be processed. Here, the solid-state light source is located substantially outside the object to be processed when viewed in the first direction. In other words, the solid-state light source is disposed in an area different from the area through which the heating light reflected by the object to be processed mainly travels. Therefore, with the above configuration, the heating light reflected by the object to be processed is prevented from being irradiated onto the solid-state light source.

[0013] In the above-mentioned light heating device, The apparatus may include a reflecting member that is disposed opposite to the main surface of the processing object and that reflects light reflected by the main surface of the processing object toward the processing object.

[0014] According to the above configuration, the heating light reflected by the object to be processed is reflected by the reflecting member so as to travel toward the object to be processed, thereby making it possible to efficiently heat the object to be processed while preventing the heating light reflected by the object from being irradiated onto the solid-state light source.

[0015] In the above-mentioned light heating device, The reflecting surface of the reflecting member may be configured to diffuse the light emitted by the solid-state light source.

[0016] The above configuration is preferable because it allows the heating light reflected by the reflecting member to be irradiated over a wider range of the object to be processed.

[0017] In the above-mentioned light heating device, the heat sink has a plurality of inclined surfaces that have different angles relative to a main surface of the processing object, The light source unit may include a plurality of substrates supported on the respective inclined surfaces and oriented at different angles relative to the main surface of the processing object.

[0018] By providing the heat sink with a plurality of inclined surfaces, it becomes easier to design the angle of each substrate relative to the object to be processed.

[0019] In addition, in the above-mentioned light heating device, The substrate may be disposed so as to surround the object to be processed when viewed in the first direction.

[0020] In the above-mentioned light heating device, The vicinity of a central axis passing through the center of the main surface of the processing object in the first direction may be in communication with the processing object.

[0021] The above configuration is preferable because it is easy to place, in a position opposite the main surface of the object to be treated, for example, a radiation thermometer that measures the temperature of the object to be treated, or a supply unit that supplies a predetermined liquid onto the main surface of the object to be treated.

[0022] In the above-mentioned light heating device, The solid-state light source is configured to include an LD element, The light source unit may include a diffusing lens that diffuses the light emitted by the LD element.

[0023] According to the above configuration, the directivity of the heating light emitted by the LD element is reduced by the diffusing lens, which is preferable because it makes it easier to make the temperature uniform within the main surface of the processing object.

[0024] The light heating device is a plurality of the substrates; All of the plurality of substrates may be tilted with respect to the main surface of the processing object. [Effects of the Invention]

[0025] According to the present invention, there is provided an optical heating device in which heating light emitted from a solid-state light source is prevented from being reflected by an object to be processed and being irradiated onto the solid-state light source. Also, according to the present invention, there is provided a light source unit to be mounted on the optical heating device. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a side cross-sectional view schematically showing an example of the configuration of a light heating device according to the present invention. [Figure 2] 2 is an enlarged view of a part of FIG. 1. [Figure 3] This is a diagram of the light source unit viewed from the -Z side of the object to be processed in the +Z direction. [Figure 4] 2 is a diagram showing the propagation of heating light emitted from the solid-state light source in FIG. 1. [Figure 5] 1, showing the configuration of a light heating device according to a second embodiment. [Figure 6] 10 is a diagram showing another example of the configuration of the reflecting member. [Figure 7] 7 is a diagram of the reflecting member in FIG. 6 as viewed in the +Z direction. [Figure 8] 10 is a diagram showing a modified example of a heat sink. [Figure 9] 10 is a diagram showing another modified example of the heat sink. [Figure 10] 10 is a diagram schematically illustrating a modified example of the light heating device. [Figure 11] 10 is a diagram schematically illustrating another modified example of the light heating device. [Figure 12] 10 is a diagram schematically illustrating yet another modified example of the light heating device. DETAILED DESCRIPTION OF THE INVENTION

[0027] [First embodiment] Hereinafter, embodiments of the light heating device according to the present invention will be described with reference to the drawings. Note that the drawings are all schematic illustrations, and the dimensional ratios and numbers in the drawings do not necessarily correspond to the actual dimensional ratios and numbers.

[0028] Fig. 1 is a side cross-sectional view schematically showing an example of the configuration of an optical heating device according to the present invention. The optical heating device 1 performs heat treatment on the processing object W1 by irradiating the processing object W1 with heating light (hereinafter referred to as "heating light L1"). As shown in Fig. 1, the optical heating device 1 includes a chamber 10, a support unit 11 that supports the processing object W1, and a light source unit 12.

[0029] In the following description, an XYZ coordinate system will be referred to where appropriate, in which the direction perpendicular to the main surface W1a of the processing object W1 is the Z direction and the plane perpendicular to the Z direction is the XY plane. The Z direction corresponds to the "first direction." Also, FIG. 1 illustrates a central axis A1 that passes through the center of the main surface W1a of the processing object W1 in the Z direction.

[0030] Furthermore, when expressing a direction, if a distinction is made between positive and negative directions, the direction is written with a positive or negative sign, such as "+X direction" and "-X direction." When expressing a direction without distinguishing between positive and negative directions, the direction is simply written as "X direction." In other words, in this specification, when simply written as "X direction," both the "+X direction" and the "-X direction" are included. The same applies to the Y direction and the Z direction.

[0031] (Chamber 10) 1, the chamber 10 accommodates the processing object W1, a support unit 11, and a light source unit 12. As an example, the chamber 10 has an air atmosphere inside. Note that the chamber 10 may be configured so that the internal space can be reduced in pressure, or so that the internal space can be replaced with an inert gas such as nitrogen gas.

[0032] (Support unit 11) As shown in Fig. 1, the support unit 11 supports the processing object W1 on the -Z side of the processing object W1. As an example, the support unit 11 is configured to support the processing object W1 by negative pressure generated by a suction mechanism (not shown). The configuration of the support unit 11 is arbitrary as long as it can support the processing object W1. For example, the support unit 11 may be configured to have a plurality of pin-shaped protrusions that support the processing object W1.

[0033] Furthermore, the support unit 11 may be configured to support the processing object W1 while rotating it around the central axis A1, for example.

[0034] In this embodiment, the processing object W1 is a semiconductor wafer such as a silicon substrate, etc. The diameter of the processing object W1 is arbitrary, but as an example, the diameter is set to 300 mm.

[0035] (Light source unit 12) 1, the light source unit 12 irradiates the +Z-side main surface W1a of the processing object W1 with heating light L1. As shown in FIG. 1, the light source unit 12 includes a plurality of solid-state light sources 5, 5, ..., a substrate 6 on which the solid-state light sources 5 are mounted, a diffusing lens 7, and a heat sink 9.

[0036] Fig. 2 is an enlarged view of a portion of Fig. 1. Fig. 2 partially shows the +X side of the light source unit 12 in Fig. 1, with the chamber 10 not shown. Fig. 3 is a view of the light source unit 12 as viewed from the -Z side of the workpiece W1 in the +Z direction. Note that the diffusing lens 7 is not shown in Fig. 3.

[0037] The heat sink 9 has inclined surfaces (9a, 9b, 9c) inclined with respect to the main surface W1a of the processing object W1, as shown in Fig. 2. Furthermore, the heat sink 9 has the shape of a body of revolution about a central axis A1, as shown in Figs. 1 and 3, and has an opening h1 at a position facing the processing object W1.

[0038] The heat sink 9 supports the substrate 6 on inclined surfaces (9a, 9b, 9c). FIG. 2 illustrates the angles (θ1a, θ1b, θ1c) of the inclined surfaces (9a, 9b, 9c) relative to the processing object W1. As shown in FIG. 2, in this embodiment, the angles θ1a, θ1b, and θ1c may be different from each other. Furthermore, the heat sink 9 may be configured such that the angles (θ1a, θ1b, θ1c) of the inclined surfaces (9a, 9b, 9c) relative to the processing object W1 increase with increasing distance from the central axis A1 in the radial direction toward the outer edge of the processing object W1. As an example, the angles (θ1a, θ1b, θ1c) are 15° to 70°. In this embodiment, the angle θ1a is 30°, the angle θ1b is 35°, and the angle θ1c is 45°.

[0039] 2, the distance between the processing object W1 and the heat sink 9 in the Z direction may decrease as the distance increases from the central axis A1 in the radial direction toward the outer edge of the processing object W1. That is, the heat sink 9 has a dome shape that is convex toward the +Z side. Specifically, the distance between the inclined surface 9c and the processing object W1 in the Z direction is smaller than the distance between the inclined surface 9b and the processing object W1. The distance between the inclined surface 9b and the processing object W1 in the Z direction is smaller than the distance between the inclined surface 9a and the processing object W1.

[0040] The heat sink 9 is made of a metal material such as copper, aluminum, or stainless steel, and dissipates heat generated in the substrate 6. The heat sink 9 may have a flow path therein through which a cooling fluid flows.

[0041] As shown in Figures 2 and 3, the substrate 6 is placed on the inclined surfaces (9a, 9b, 9c) of the heat sink 9. Therefore, the substrate 6 is inclined with respect to the processing object W1. Specifically, the angle of the substrate 6 on the inclined surface 9a with respect to the processing object W1 corresponds to angle θ1a. The angles of the substrate 6 on the inclined surface 9b and the substrate 6 on the inclined surface 9c with respect to the processing object W1 correspond to angles θ1b and θ1c, respectively.

[0042] 2, the angles (θ1a, θ1b, θ1c) of the inclined surfaces (9a, 9b, 9c) supporting the respective substrates 6 relative to the workpiece W1 may be different from one another. Thus, the light source unit 12 has a plurality of substrates 6 each having a different angle relative to the main surface W1a of the workpiece W1.

[0043] 3, the plurality of substrates 6 are arranged to surround the processing object W1 when viewed in the Z direction. Note that "the plurality of substrates 6 surround the processing object W1" may mean that the total length of the area in which the plurality of substrates 6 are arranged in the circumferential direction of the processing object W1 is 50% or more of the circumference of the processing object W1.

[0044] The substrate 6 is made of, for example, ceramic, and has a power supply electrode and a wiring pattern formed on the main surface opposite to the heat sink 9. For convenience, these are not shown in the figure. As an example, the substrate 6 and the heat sink 9 are in contact with each other via a heat transfer material (not shown) for improving thermal conductivity.

[0045] 2, the solid-state light source 5 is placed on the main surface of the substrate 6 opposite to the heat sink 9. In this embodiment, the solid-state light source 5 is a laser diode (LD) element with a peak wavelength of 455 nm in its emission spectrum. From the viewpoint of efficiently heating a processing object such as a semiconductor wafer, the peak wavelength of the solid-state light source 5 is preferably selected from the range of 400 nm to 500 nm.

[0046] The solid-state light sources 5 emit light when power is supplied to a pair of electrodes (not shown) formed on the substrate 6. As an example, 24 solid-state light sources 5 are arranged on each substrate 6. Note that the arrangement pattern of the solid-state light sources 5 shown in the figure is merely an example, and the arrangement pattern of the solid-state light sources 5 is not limited to the example shown in the figure.

[0047] 3, the solid-state light sources 5 are located substantially outside the processing object W1 when viewed in the +Z direction. Here, "the solid-state light sources 5 are located substantially outside the processing object W1" may mean that 80% or more of the solid-state light sources 5 are located outside the processing object W1. Preferably, 90% or more of the solid-state light sources 5 are located outside the processing object W1.

[0048] The solid-state light source 5 is not limited to an LD element having the above-described characteristics, and the peak wavelength and type of element are arbitrarily selected depending on the processing target W1. Specifically, the solid-state light source 5 may be an LD element whose peak wavelength in the emission spectrum belongs to the visible light region, the ultraviolet light region, or the infrared light region. The solid-state light source 5 may also be an LED element. Furthermore, the light source unit 12 may be equipped with a plurality of LED elements instead of or in addition to a plurality of LD elements.

[0049] 2, the diffusing lenses 7 are disposed opposite the respective substrates 6. As an example, the diffusing lenses 7 are microlens arrays made of glass material such as quartz glass. For example, the diffusing lenses 7 are supported by the substrates 6.

[0050] The heating light L1 emitted by the LD element exhibits high directivity. However, by diffusing the heating light L1 using the diffusing lens 7, the directivity of the heating light L1 emitted by the LD element can be reduced. This makes it easier to uniformize the temperature within the main surface W1a of the processing target W1, which is preferable.

[0051] Next, the manner in which the heating light L1 emitted by the solid-state light source 5 travels will be described with reference to Fig. 4. Fig. 4 is a diagram showing the manner in which the heating light L1 emitted by the solid-state light source 5 travels in Fig. 1. In Fig. 4, the manner in which the heating light L1 travels is schematically illustrated by a dashed line.

[0052] 4, heating light L1 is emitted by a solid-state light source 5 toward the processing object W1, diffused by a diffusion lens 7, and then irradiated onto the processing object W1. At this time, part of the heating light L1 is reflected by the processing object W1. For example, if the processing object W1 is a silicon substrate, it is estimated that about 40% of the heating light L1 is reflected by the main surface W1a.

[0053] Here, the solid-state light source 5 is placed on a substrate 6 that is tilted with respect to the processing object W1. Therefore, the solid-state light source 5 emits the heating light L1 with the emission surface from which the heating light L1 is emitted tilted with respect to the processing object W1.

[0054] Therefore, the heating light L1 emitted from the solid-state light source 5 and irradiated onto the main surface W1a of the processing object W1 is reflected in a direction different from that of the solid-state light source 5 that emitted the heating light L1, as shown in FIG.

[0055] As shown in Fig. 4, the heating light L1 reflected by the processing object W1 travels toward the +Z side in the area facing the processing object W1. Here, as described with reference to Fig. 3, the solid-state light source 5 is positioned substantially outside the processing object W1 when viewed in the Z direction. That is, in the optical heating device 1, the area through which the heating light L1 reflected by the processing object W1 mainly travels is different from the area where the solid-state light source 5 is located. Therefore, in the optical heating device 1, the heating light L1 reflected by the processing object W1 is prevented from being irradiated onto the solid-state light source 5.

[0056] Note that the peripheral edge region of the main surface W1a of the processing object W1 dissipates heat more easily than the central region. In view of this, it is preferable to irradiate more heating light L1 to the peripheral edge region of the main surface W1a of the processing object W1 than to the central region. In contrast, in this embodiment, as shown in FIG. 3, the number of solid-state light sources 5 arranged in the circumferential direction increases as the distance from the central axis A1 increases in the radial direction. Specifically, 24 substrates 6 are arranged on the inclined surface 9a of the heat sink 9, 30 substrates 6 are arranged on the inclined surface 9b, and 36 substrates 6 are arranged on the inclined surface 9c. This makes it easier to irradiate more heating light L1 to the peripheral edge region of the main surface W1a of the processing object W1. Furthermore, from the viewpoint of irradiating more heating light L1 to the peripheral edge region of the processing object W1, as described with reference to Figure 2, the angles (θ1a, θ1b, θ1c) of the inclined surfaces (9a, 9b, 9c) of the heat sink 9 relative to the processing object W1 may be made larger as they move away from the central axis A1 in the radial direction.

[0057] Note that when the heating light L1 emitted by the solid-state light source 5 is diffused, it is assumed that the heating light L1 having a relatively small angle with respect to the main surface W1a of the processing object W1 is reflected by the processing object W1 and then travels toward the solid-state light source 5. Specifically, taking the heating light L1 emitted by the solid-state light source 5 on the +X side as an example, when the heating light L1 diffused by the diffusing lens 7 is reflected by the processing object W1, it is assumed that some of the heating light L1 travels toward the solid-state light source 5 on the -X side. However, only a small amount of the heating light L1 has a relatively small angle with respect to the main surface W1a. In other words, considering that the majority of the heating light L1 reflected by the processing object W1 travels in a direction different from the solid-state light source 5, it can be understood that the irradiation of the heating light L1 to the solid-state light source 5 is suppressed in the optical heating device 1.

[0058] In this embodiment, the vicinity of the central axis A1 communicates with the treatment object W1. Specifically, the heat sink 9 has an opening h1 at a position facing the treatment object W1 (see FIG. 1). This makes it easy to arrange, at the position facing the treatment object W1, for example, a radiation thermometer that measures the temperature of the treatment object W1 or a supply unit that supplies a liquid for treating the treatment object W1.

[0059] The term "vicinity of the central axis A1" may refer to a region within a distance of 90 mm from the central axis A1 in the radial direction of the processing object W1.

[0060] [Second embodiment] Next, a second embodiment of the light heating device 1 will be described, focusing on the differences from the first embodiment.

[0061] Fig. 5 is a diagram showing the configuration of a light heating device 1 according to a second embodiment, following Fig. 1. In this embodiment, the solid-state light sources 5 are configured to include LD elements, and diffusing lenses 7 are arranged at positions facing the respective substrates 6, similar to the first embodiment.

[0062] As shown in FIG. 5, the light heating device 1 may have a reflecting member 15 at a position facing the processing object W1 on the +Z side of the processing object W1.

[0063] The reflecting member 15 has, for example, a plate shape and has, on the -Z side, a reflecting surface 15a that reflects the heating light L1. For example, the reflectance of the reflecting surface 15a with respect to the heating light L1 is 40% or more, preferably 60% or more, and more preferably 80% or more.

[0064] The reflecting member 15, like the heat sink 9, is disposed on the +Z side of the processing object W1. For example, the reflecting member 15 may have a connecting portion 16 on the +Z side, and may be supported by the connecting portion 16 communicating with the chamber 10. The method of disposing the reflecting member 15 is arbitrary as long as the reflecting surface 15a faces the main surface W1a of the processing object W1. For example, the reflecting member 15 may be connected to the heat sink 9 and configured integrally with the light source unit 12.

[0065] As an example, the distance in the Z direction between the reflecting member 15 and the processing object W1 is set to 50 mm to 200 mm.

[0066] 5, similar to FIG. 4, shows the traveling state of a portion of the heating light L1. As shown in FIG. 5, the reflecting member 15 reflects the heating light L1 reflected by the processing object W1 so that the heating light L1 travels toward the processing object W1. This prevents the heating light L1 reflected by the processing object W1 from being irradiated onto the solid-state light source 5, and allows the processing object W1 to be efficiently heated.

[0067] The reflecting member 15 may be made of a metal material such as aluminum or stainless steel, or may be made of a member having a reflective film made of the above metal material. The reflecting surface 15a may be made to have diffusive properties with respect to the heating light L1. For example, by forming minute irregularities on the reflecting surface 15a, the reflecting surface 15a can reflect and diffuse the heating light L1.

[0068] 6 is a diagram showing another example of the configuration of the reflecting member 15, and Fig. 7 is a diagram showing the reflecting member 15 in Fig. 6 as viewed in the +Z direction. As shown in Fig. 6 and Fig. 7, the reflecting member 15 may have an opening h2 in the vicinity of the central axis A1. This allows the vicinity of the central axis A1 in the light heating device 1 to communicate with the object to be treated W1.

[0069] In the optical heating device 1, since the vicinity of the central axis A1 is in communication with the treatment object W1, it becomes easy to arrange, for example, a radiation thermometer that measures the temperature of the treatment object W1 or a supply unit that supplies a liquid for treating the treatment object W1 at a position facing the treatment object W1. As an example, a radiation thermometer may be arranged through the openings h1 and h2, or a nozzle that sprays the liquid may be arranged. Furthermore, the reflecting member 15 may have an opening different from the opening h2 at a position different from the opening h2. For example, a radiation thermometer may be arranged in the opening, and a nozzle that sprays the liquid may be arranged in the opening h2.

[0070] [Variations] Below, modified examples of the light heating device 1 will be described.

[0071] <1> FIG. 8 is a diagram showing a modified example of the heat sink 9. In the above description, the light source unit 12 has been described as having a plurality of substrates 6 that are angled differently relative to the workpiece W1. However, the present invention is not limited to this, and as shown in FIG. 8, the angles of the substrates 6 relative to the workpiece W1 may be equal. For example, as shown in FIG. 8, the heat sink 9 may support a plurality of substrates 6 on an inclined surface 9a. In other words, the present invention is not limited to whether the heat sink 9 has a plurality of inclined surfaces that are angled differently relative to the workpiece W1. It is also possible to form a plurality of substrates 6 as a single unit.

[0072] <2> Fig. 9 is a diagram showing another modified example of the heat sink 9. As shown in Fig. 9, the heat sink 9 may be configured by being divided into a plurality of members.

[0073] <3> Fig. 10 is a diagram schematically illustrating a modified example of the optical heating device 1. In the above description, the light source unit 12 is described as irradiating the heating light L1 onto the main surface W1a on the +Z side of the processing object W1. However, as shown in Fig. 10, the light source unit 12 may irradiate the heating light L1 onto the main surface W1b on the -Z side of the processing object W1. In this modified example, as an example, the support unit 11 is disposed within an opening h1 of the heat sink 9.

[0074] 11 is a diagram schematically illustrating another modified example of the optical heating device 1. As shown in Fig. 11, the reflecting member 15 may be disposed on the -Z side of the processing target W1. In this case, for example, the support unit 11 may be installed on a wall surface of the chamber 10 in the X direction.

[0075] This modified example is advantageous in that it is easy to arrange, for example, a radiation thermometer that measures the temperature of the processing object W1 and a supply unit that supplies liquid to the main surface W1a of the processing object W1 on the +Z side of the processing object W1.

[0076] <4> In the above description, the plurality of substrates 6 surround the periphery of the processing object W1, but the present invention is not limited to this. For example, if the support unit 11 supports the processing object W1 while rotating, the heating light L1 can be irradiated to the entire area in the circumferential direction of the processing object W1 even if the plurality of substrates 6 do not surround the periphery of the processing object W1.

[0077] <5> In the above description, the light source unit 12 is described as having the diffusing lens 7, but the present invention is not limited to this. Whether the light source unit 12 is equipped with the diffusing lens 7 can be appropriately selected depending on the heating conditions of the processing target W1.

[0078] The solid-state light source 5 may also be composed of multiple LED elements. In this case, a diffusing lens 7 may be disposed opposite the substrate 6, or, in view of the low directivity of the heating light L1 emitted by the LED elements, a converging lens that converges the heating light L1 emitted by the LED elements may be disposed opposite the substrate 6.

[0079] <6> In the above description, the vicinity of the central axis A1 of the optical heating device 1 is described as being in communication. However, it is optional whether to place a radiation thermometer or the like in the area facing the treatment target W1, and the present invention is not limited to this configuration. For example, it is optional whether the heat sink 9 has an opening h1.

[0080] <7> Fig. 12 is a diagram schematically illustrating yet another modified example of the optical heating device 1. As shown in Fig. 12, the chamber 10 may have a light-transmitting window 10a that partitions the space within the chamber 10. The light source unit 12 may be disposed in a space different from that of the processing object W1, and the processing object W1 may be irradiated with heating light L1 through the light-transmitting window 10a. This modified example is suitable, for example, for performing heat treatment on the processing object W1 in a state in which the atmosphere surrounding the processing object W1 has been replaced with a predetermined gas.

[0081] <8> In the above description, all of the substrates 6 are inclined with respect to the processing object W1, and the solid-state light sources 5 are disposed outside the processing object W1 when viewed in the Z direction. However, the substrates 6 and the solid-state light sources 5 may be disposed in any manner as long as the solid-state light sources 5 are disposed substantially outside the processing object W1 when viewed in the Z direction. For example, the scope of the present invention also includes a case in which the light source unit 12 includes a substrate disposed at a position facing the processing object W1, and the solid-state light sources are disposed on the substrate.

[0082] <9> The configurations of the above-described embodiment and each modification can be combined as appropriate. Furthermore, the configuration of the present invention is not limited to the configurations shown in the drawings. [Explanation of symbols]

[0083] 1 : Optical heating device 5 : Solid state light source 6: Substrate 7: Diffusion lens 9: Heat sink 9a,9b,9c: Slope 10: Chamber 11: Support unit 12: Light source unit 15: Reflective material 16: Liaison Department

Claims

1. a support unit that supports the object to be processed; a light source unit that irradiates light onto the processing object, The light source unit is a heat sink having an inclined surface inclined with respect to a main surface of the processing object; a substrate supported on the inclined surface; and a plurality of solid-state light sources placed on the substrate and positioned substantially outside the object to be treated when viewed in a first direction perpendicular to the main surface of the object to be treated.

2. 2. The optical heating device according to claim 1, further comprising a reflecting member disposed opposite a main surface of the object to be processed, which reflects light reflected by the main surface of the object to the side of the object to be processed.

3. the heat sink has a plurality of inclined surfaces that have different angles relative to a main surface of the processing object, 3. The optical heating device according to claim 1, wherein the light source unit includes a plurality of the substrates supported on the respective inclined surfaces and oriented at different angles relative to the main surface of the object.

4. The light heating device according to claim 1 or 2, wherein the substrate is disposed so as to surround the object to be processed when viewed in the first direction.

5. The light heating device according to claim 1 or 2, wherein a vicinity of a central axis passing through a center of a main surface of the object to be treated in the first direction communicates with the object to be treated.

6. the solid-state light source is configured to include an LD element, 3. The light heating device according to claim 1, wherein the light source unit has a diffusing lens for diffusing the light emitted by the LD element.

7. The light heating device according to claim 2 , wherein the reflecting surface of the reflecting member exhibits diffusivity with respect to the light emitted from the solid-state light source.

8. a plurality of the substrates; 3. The optical heating device according to claim 1, wherein all of the plurality of substrates are inclined with respect to a main surface of the object to be processed.

9. A light source unit to be mounted in the light heating device according to claim 1 or 2.

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