Measurement device, measurement method, program, and measurement system

Abstract

To provide a measurement device, a measurement method, a program, and a measurement system capable of easily comparing images of two or more objects to be measured captured at different timings.SOLUTION: A measurement device includes a holding mechanism 30 that holds an object to be measured 10, an imaging mechanism 40 that images the object to be measured 10 held by the holding mechanism 30, a storage part 220 that stores image data captured by the imaging mechanism 40, a display part 100 that displays the image data, and a control part 210 that controls a measurement apparatus 1. The control part 210 includes: a storage control part 211 that causes a storage part 220 to store object information 220a in which an imaging history including at least the imaging date or the imaging date and time captured by the imaging mechanism 40 and object identification information capable of specifying the object to be measured 10 imaged by the imaging mechanism are associated with image data; and a display control part 212 that causes the display part to simultaneously or sequentially display two or more pieces of object information 220a.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a measuring device, a measuring method, a program, and a measuring system for an object to be measured. [Background technology]

[0002] 2. Description of the Related Art There is known a method of inspecting a workpiece such as a semiconductor wafer for defects after the workpiece has been processed.

[0003] For example, Patent Document 1 describes a method in which an imaging unit is moved to an arbitrary position to capture an image of a portion of a workpiece after processing, and the captured image of the portion of the workpiece is used to inspect the size of chipping, etc. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-32588 Summary of the Invention [Problem to be solved by the invention]

[0005] There is a demand for comparing images of a workpiece taken at multiple different dates and times on a single screen in order to inspect how the workpiece was processed through multiple processing steps, in which processing step a defect occurred, etc. However, with conventional technology, an operator must manually select and display images of the workpiece taken at multiple different dates and times, which poses a problem of time and effort required for selecting the images.

[0006] The present invention provides a measuring device, a measuring method, a program, and a measuring system that make it possible to easily compare images of two or more objects to be measured (workpieces) captured at different times. [Means for solving the problem]

[0007] One aspect of the present invention is A measuring device for measuring an object to be measured, a holding mechanism for holding the object to be measured; an imaging mechanism that images the object to be measured held by the holding mechanism; a storage unit that stores image data captured by the imaging mechanism; a display unit that displays the image data; a control unit that controls the measurement device, The control unit a storage control unit that stores in the storage unit, in association with the image data, an imaging history including at least the imaging date or imaging time when the image was captured by the imaging mechanism, and measurement object identification information that can identify the measurement object imaged by the imaging mechanism; and a display control unit that causes the display unit to display two or more pieces of device under test information simultaneously or sequentially.

[0008] Another aspect of the present invention is A measurement method for measuring an object to be measured, comprising: a holding step of holding the object to be measured by a holding mechanism; an imaging step of imaging the object to be measured held by the holding mechanism with an imaging mechanism to obtain image data; a storage step of storing, in a storage unit, an imaging history of the object to be measured captured by the imaging mechanism and object to be measured identification information capable of identifying the object to be measured captured by the imaging mechanism in association with the image data, as object to be measured information; and a display step of displaying the two or more pieces of device under test information simultaneously or sequentially on a display unit.

[0009] Another aspect of the present invention is A program executed by a computer to display image data of a wafer on a display unit, a process of storing, as wafer information, an imaging history including at least the imaging date or imaging date of the image of the wafer and wafer identification information capable of identifying the wafer in association with the image data; The computer is caused to execute a process of displaying two or more pieces of wafer information simultaneously or sequentially on the display unit.

[0010] Another aspect of the present invention is A measurement system that displays image data of a measured object captured by an imaging mechanism provided in one or more processing devices or inspection devices, a storage unit that stores image data captured by the imaging mechanism; a display unit that displays the image data; a control unit, The control unit a storage control unit that stores in the storage unit, in association with the image data, an imaging history including at least the imaging date or imaging time when the image was captured by the imaging mechanism, and measurement object identification information that can identify the measurement object imaged by the imaging mechanism; and a display control unit that causes the display unit to display two or more pieces of device under test information simultaneously or sequentially. [Effects of the Invention]

[0011] According to the present invention, it is possible to easily compare images of two or more workpieces captured at different times. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing an example of a measuring device 1. As shown in FIG. [Figure 2] FIG. 2 is a perspective view showing an example of the object 10 before processing. [Figure 3] FIG. 3 is a perspective view showing an example of the object 10 after processing. [Figure 4] FIG. 4 is a perspective view showing an example of the holding mechanism 30. As shown in FIG. [Figure 5] FIG. 5 is a perspective view showing an example of the imaging mechanism 40. As shown in FIG. [Figure 6] FIG. 6 is a diagram for explaining an example of imaging the object under test 10 for each small section. [Figure 7]FIG. 7 is a diagram illustrating an example of the configuration of the control unit 200. As shown in FIG. [Figure 8] FIG. 8 is a diagram illustrating an example of information associated with image data. [Figure 9] FIG. 9 is a diagram showing an example of a display on the display unit. [Figure 10] FIG. 10 is a diagram showing another example of the display on the display unit. [Figure 11] FIG. 11 is a flowchart showing an example of the process of the measurement method. DETAILED DESCRIPTION OF THE INVENTION

[0013] A measuring device and a measuring method according to an embodiment of the present invention will be described below with reference to the drawings.

[0014] The measuring device 1 in the embodiment inspects the object to be measured 10, for example, a workpiece (work) by capturing an image of the object to be measured 10 using an imaging mechanism 40 and displaying the captured image data on a display unit 100. The object to be measured 10 includes an object before and after processing by a processing device (not shown).

[0015] FIG. 1 is a perspective view showing an example of a measuring device 1 in an embodiment. FIGS. 2 and 3 are perspective views showing an object 10 to be measured, which is the object to be measured by the measuring device 1 shown in FIG. 1, with FIG. 2 showing the state of the object 10 before being processed by the processing device (before dicing), and FIG. 3 showing the state of the object 10 after being processed by the processing device (after dicing). In the following description, the X-axis direction is one direction in a horizontal plane. The Y-axis direction is a direction perpendicular to the X-axis direction in a horizontal plane. The Z-axis direction is a direction perpendicular to the X-axis direction and the Y-axis direction.

[0016] (Object to be measured) The object under test 10 is, for example, a substantially disc-shaped wafer or optical device wafer made of a material such as Si (silicon), SiC (silicon carbide), GaN (gallium nitride), GaAs (gallium arsenide), or other semiconductor. The object under test 10 may also be a variety of plate-shaped processed materials, such as a plate-shaped inorganic material substrate made of ceramics, glass, or sapphire, or a plate-shaped ductile material such as metal or resin. The object under test 10 may also be a package substrate containing multiple device chips sealed with a molded resin or the like. FIGS. 2 and 3 show a wafer as an example of the object under test 10.

[0017] 2, the surface 11 of the object to be measured 10 is divided by, for example, a plurality of mutually intersecting planned dividing lines called streets 12. Devices 13 such as ICs (Integrated Circuits) and LSIs (Large Scale Integrated circuits) are formed in each area divided by the streets 12 on the surface 11 of the object to be measured 10, a wafer. When the wafer is divided along the streets 12, individual device chips are formed.

[0018] To divide the workpiece 10, for example, a processing device (cutting device) capable of cutting the workpiece 10 along the streets 12 with an annular cutting blade is used. Alternatively, a laser processing device may be used that laser processes the workpiece 10 by irradiating a laser beam onto the workpiece 10 along the streets 12.

[0019] Before the object 10 is loaded into the processing equipment, as shown in FIG. 2 , the object 10 is integrated with an annular frame 14 and tape 15 attached to cover the opening of the annular frame 14 to form a frame unit 16. The object 10, with the tape 15 attached and attached to the frame 14 via the tape 15, is loaded into the processing equipment in this state and processed. In the embodiment, this state is referred to as "before processing." Reference numeral 17 denotes a "wafer ID" that indicates an example of identification information for the object 10. The wafer ID may be indicated, for example, by engraving or the like on the object 10. Alternatively, the wafer ID may be indicated by attaching a sheet or the like onto the object 10, converting the wafer ID into a barcode. When the barcode-converted sheet or the like is attached, the wafer ID is read by a detection mechanism such as a barcode reader, which will be described later.

[0020] FIG. 3 is a diagram showing the state of the object to be measured 10 after it has been processed by a processing device and divided into devices 13, and in this example, shows the case where cutting has been performed by blade dicing.

[0021] In the embodiment, in order to confirm that the workpiece 10 has been properly machined, for example, along the streets 12, images of predetermined locations on the workpiece 10 before and after machining are taken, and the workpiece 10 is inspected. With this measuring device 1, for example, the workpiece 10 is inspected along the streets 12 to inspect the positions of machining marks and the shapes and sizes of chips, known as chippings, formed in the workpiece 10 along the machining marks. The size of device chips formed by dividing the workpiece 10 is also inspected. However, the use of the measuring device 1 is not limited to this.

[0022] 1, the configuration of the measurement device 1 will be described. The measurement device 1 includes a base 20 that supports each part of the measurement device 1. The base 20 has an opening 21 formed along the X-axis direction.

[0023] The measuring device 1 is arranged to straddle the opening 21 of the base 20 in the Y-axis direction and comprises a holding mechanism 30 that holds the object to be measured 10, an imaging mechanism 40 that images the object to be measured 10 held by the holding mechanism 30, a moving mechanism 60 that moves the holding mechanism 30 and the imaging mechanism 40 relative to each other, a display unit 100 that displays an image of the object to be measured 10 imaged by the imaging mechanism 40, and a control unit 200 that controls the measuring device 1 that includes the holding mechanism 30, the imaging mechanism 40, the moving mechanism 60, the display unit 100, etc.

[0024] (Movement mechanism) The movement mechanism 60 includes an X-axis movement unit 61 that can move the holding mechanism 30 and the imaging mechanism 40 relatively along the X-axis direction, and a Y-axis movement unit 62 that can move them relatively along the Y-axis direction. Specifically, the X-axis movement unit 61 allows the holding mechanism 30 to move in the X-axis direction, and the Y-axis movement unit 62 allows the imaging mechanism 40 to move in the Y-axis direction.

[0025] 4, X-axis movement unit 61 is provided with guide rail 63 extending along the X-axis direction on the side of opening 21 in the upper surface of base 20. Also, on the side of opening 21 on the opposite side of guide rail 63 on the upper surface of base 20, guide rail 64 is provided which is parallel to guide rail 63 and extends along the X-axis direction. A movable body 65 is slidably mounted on guide rail 63, and a movable body 66 is slidably mounted on guide rail 64.

[0026] A bridge-like support structure 69 is provided above the movable bodies 65 and 66 so as to straddle the movable bodies 65 and 66. A nut (not shown) is provided at the lower end of one of the movable bodies 65 and 66, and a ball screw 67 provided in parallel to the guide rails 63 and 64 is fitted into this nut.

[0027] A pulse motor 68 controlled by the control unit 200 is connected to one end of the ball screw 67. When the pulse motor 68 rotates the ball screw 67, the movable bodies 65 and 66 move in the X-axis direction along the guide rails 63 and 64, and the bridge-like support structure 69 moves in the X-axis direction. The holding mechanism 30 is supported by the support structure 69 at a position overlapping with the opening 21 of the base 20. The X-axis moving unit 61 moves the support structure 69 along the X-axis direction, thereby moving the holding mechanism 30 along the X-axis direction.

[0028] 1, Y-axis movement unit 62 includes a pair of guide rails 71 that are provided along the Y-axis direction on the upper surface of support structure 70 that supports imaging mechanism 40. A movable body 72 that supports imaging mechanism 40 is slidably mounted on the pair of guide rails 71. A nut (not shown) is provided on the lower surface of movable body 72, and a ball screw 73 that is parallel to the pair of guide rails 71 is fitted into this nut.

[0029] A pulse motor 74 controlled by the control unit 200 is connected to one end of the ball screw 73. When the pulse motor 74 rotates the ball screw 73, the movable body 72 moves in the Y-axis direction along the guide rail 71, and the imaging mechanism 40 moves in the Y-axis direction.

[0030] In this way, the X-axis moving unit 61 and the Y-axis moving unit 62 work together to function as a moving mechanism 60 that can move the holding mechanism 30 and the imaging mechanism 40 relatively in a direction parallel to the mounting surface 31a of the holding mechanism 30 on which the object to be measured 10 is placed.

[0031] (holding mechanism) The holding mechanism 30 is a disc-shaped holding table having a transparent body exposed at the top and bottom, and equipped with a mounting portion 31 on which the DUT 10 is placed (see FIG. 4). The transparent body is made of a material such as glass or resin. The upper surface of the transparent body serves as the mounting surface 31a on which the DUT 10 is placed via the tape 15 described above.

[0032] The holding mechanism 30 has a tape holding section 32 with a suction groove (not shown) on the outer periphery of the mounting section 31. A suction source (neither shown) is connected to the suction groove via a suction path. When the frame unit 16 is placed on the holding mechanism 30 and the suction source is activated, the object under test 10 is sucked into and held by the holding mechanism 30 via the tape 15. At this time, suction occurs between the holding mechanism 30 and the tape 15, causing the tape 15 to adhere to the entire surface of the mounting surface 31a, so that the object under test 10 held by the holding mechanism 30 will not shift during inspection.

[0033] For example, even if the object 10 to be measured is a warped wafer or the like, when the object 10 to be measured is held by the holding mechanism 30, the tape 15 adheres to the entire mounting surface 31a. Therefore, the object 10 to be measured is sucked and held by the holding mechanism 30 in a state where the warpage is alleviated. If the warpage of the object 10 to be measured held by the holding mechanism 30 is alleviated, the focus of the imaging mechanism 40 is less likely to deviate from the object 10 to be measured when imaging each region of the object 10 in succession, and therefore the object 10 can be imaged more clearly.

[0034] (imaging mechanism) The imaging mechanism 40 captures an image of the object 10 held by the holding mechanism 30, and outputs the captured image to the control unit 200 (the output image is stored in the storage section 220). As will be described in detail later, the image captured by the imaging mechanism 40 is displayed on the display section 100 in association with information such as identification information (e.g., a wafer ID) of the object 10.

[0035] 1, the imaging mechanism 40 is supported by a support structure 70 provided on the base 20 so as to straddle the opening 21, the X-axis moving unit 61, and the holding mechanism 30. The above-mentioned Y-axis moving unit 62, which moves the imaging mechanism 40 along the Y-axis direction, is provided on the support structure 70.

[0036] 1 and 5, the imaging mechanism 40 includes a first imaging unit 41 provided above the mounting surface 31a of the holding mechanism 30, and a second imaging unit 42 provided below the mounting surface 31a. This allows the measuring device 1 to be configured as a measuring device that can simultaneously observe the object 10 to be measured from both the top side (front surface) and the bottom side (back surface) of the same position (same position coordinates).

[0037] The imaging mechanism 40 further includes a connecting portion 43 that connects the first imaging unit 41 and the second imaging unit 42 together.

[0038] The first imaging unit 41 is supported by a pillar-shaped support structure 44. An elevation mechanism 45 that raises and lowers the first imaging unit 41 is provided on the front surface of the pillar-shaped support structure 44. The elevation mechanism 45 has a pair of guide rails 46 along the Z-axis direction, a movable body 47 slidably mounted on the guide rails 46, and a ball screw 48 fitted into a nut provided on the rear surface of the movable body 47.

[0039] The first imaging unit 41 is fixed to the front surface of the movable body 47. A pulse motor 49 controlled by the control unit 200 is connected to one end of a ball screw 48. When the ball screw 48 is rotated by the pulse motor 49, the movable body 47 moves in the Z-axis direction along the guide rail 46, and the first imaging unit 41 fixed to the movable body 47 moves up and down.

[0040] An upper end of the connecting portion 43 is connected to, for example, a lower end of the rear surface of the support structure 44, and a lower end of the connecting portion 43 is connected to an upper end of the rear surface of a pillar-shaped support structure 50 that supports the second imaging unit 42. A lifting mechanism 51 configured similarly to the lifting mechanism 45 provided on the support structure 44 is provided on the front surface of the support structure 50.

[0041] The lifting mechanism 51 has a pair of guide rails 52 along the Z-axis direction, a movable body 53 slidably mounted on the guide rails 52, and a ball screw 54 fitted into a nut provided on the rear surface of the movable body 53. A pulse motor 55 controlled by the control unit 200 is connected to one end of the ball screw 54. When the ball screw 54 is rotated by the pulse motor 55, the second imaging unit 42 fixed to the front surface of the movable body 53 moves up and down.

[0042] The first imaging unit 41 faces downward and can image the object 10 from above that is placed on the upper surface of the holding mechanism 30. The second imaging unit 42 faces upward and can image the object 10 from below through the transparent mounting surface 31a and the tape 15. The first imaging unit 41 and the second imaging unit 42 are, for example, an area camera, a line camera, a 3D camera, or an infrared camera.

[0043] 6 is a diagram for explaining an imaging area of ​​the object to be measured 10 (wafer) imaged by the imaging mechanism 40. The imaging area is divided into small sections A11, A12, A13, etc. in an X-row and a Y-row. For example, the surface of each of the small sections A11, A12, A13, etc. is imaged in order by the first imaging unit 41. Note that the small sections to be imaged may be in a predetermined order, such as A11, A12, A13, etc., or may be any small section designated by the operator.

[0044] Similarly, the rear surface of the object to be measured 10 is imaged by the second imaging unit 42. This rear surface is also imaged in the same manner, for example, in the order of small sections A11, A12, A13, etc., or for each arbitrary small section designated by the operator.

[0045] Such imaging of the object to be measured 10 is performed under the control of the control unit 200 (more specifically, the control unit 210 described later), and image data of the front and back surfaces of each of the captured small sections A11, A12, A13, etc. are output to the control unit 200 and stored in the memory unit 220.

[0046] (Display) The display unit 100 is a display device that provides various information to the operator and accepts input from the operator, and is configured, for example, with a display such as a touch panel. The display unit 100 also includes a group of various switches 110 (see FIGS. 9 and 10) that accept input from the operator. The display unit 100 is capable of displaying, for example, image data of the object under test 10 captured by the imaging mechanism 40 and various information that can be obtained from the image data. The specific configuration and display content of the display unit 100 will be described later.

[0047] (control unit) The control unit 200 controls each of the above-mentioned components of the measuring apparatus 1, causing the measuring apparatus 1 to perform an inspection of the object under test 10, etc. FIG. 7 shows an example configuration including the control unit 200 and the configuration of each section that inputs and outputs data between the control unit 200 and the outside. The control unit 200 is a computer that includes a control unit 210 that performs various calculations, a storage unit 220 having a storage medium, and an input / output interface (not shown) that controls the input and output of data between the inside and outside of the control unit 200. The control unit 210 includes a microprocessor such as a CPU (Central Processing Unit). The storage unit 220 has a memory such as an HDD (Hard Disk Drive), ROM (Read Only Memory), or RAM (Random Access Memory).

[0048] The storage unit 220 stores image data of the object to be measured 10 captured by, for example, the imaging mechanism 40. The storage unit 220 also stores object to be measured information 220a in which object to be measured identification information (e.g., a wafer ID) capable of identifying the object to be measured 10 captured by the imaging mechanism 40 is associated with the image data. The process of storing the object to be measured information 220a in the storage unit 220 (i.e., storing process) is executed by the storage control unit 211, which will be described later.

[0049] 8 is a diagram showing an example of information associated with image data of the object to be measured 10 as the object to be measured information 220a, and this information includes, for example, a wafer ID, an imaging history, imaging conditions, a processing step, and numerical data. Note that the information associated with the image data of the object to be measured 10 may be any data that can be used for comparison when two or more pieces of object to be measured information 220a are displayed on the display unit 100, and therefore is not limited to the information shown in FIG. 8. This information may be input by an operator, or may be automatically recorded when a predetermined process (an imaging process or a processing process of the object to be measured 10) is performed.

[0050] The wafer ID indicates identification information of the object under test 10, and is assigned a predetermined alphabet or number (for example, ABCD-1234) so ​​that each of the wafers that may exist can be identified.

[0051] The imaging history indicates the date or time when the object 10 to be measured was imaged by the imaging mechanism 40 (the imaging date and time in the example of FIG. 8), and lot information to which the object 10 to be measured belongs. The lot information is, for example, a manufacturing control number (e.g., L1111) that indicates the manufacturing date and manufacturing factory when the object 10 to be measured was manufactured before processing.

[0052] The imaging conditions are information indicating the conditions when the object under test 10 is imaged by the imaging mechanism 40. Possible imaging conditions include, for example, the amount of light in the imaging mechanism 40, the direction of light, and the focal position (or focal length).

[0053] As shown in Fig. 8, the processing steps include the name of the processing step, such as laser grooving or dicing, and the processing recipe. The processing recipe is information indicating processing conditions, including information such as the wafer diameter and the processing speed in each processing step. In the example shown in Fig. 8, the processing recipe is indicated by an ID (e.g., A-01) that identifies the processing recipe. The various processing steps shown in Fig. 8 are examples of "pre-processing steps that identify the processing step immediately before that performed on the object under test 10" of the present invention.

[0054] The numerical data indicates various numerical information about the object under test 10, and examples of the numerical data include the amount of chipping, the average size of chipping, and the maximum chipping size.

[0055] 8 may be updated, for example, every time a processing process is performed. For example, every time a processing process is performed on the object under test 10 in order from before processing, various pieces of information on the processing process (wafer ID, imaging history, imaging conditions, processing steps, etc.) are recorded by the control unit 210 (more specifically, the storage control unit 211) described later, thereby updating the information.

[0056] In the embodiment, among these pieces of information, at least the wafer ID, the imaging date and time (or imaging date), and the image data are associated with each other as object to be measured information 220a, which is stored in the storage unit 220. The stored object to be measured information 220a is displayed on the display unit 100 based on, for example, an instruction from an operator.

[0057] The control unit 210 executes various programs stored in the storage unit 220. In order to inspect the process by which the workpiece 10 (workpiece) was processed, in which processing step a defect occurred, and so on, it is preferable that the image data of the workpiece 10 be associated with the image data of the workpiece 10, such as the date and time of capturing the image data and identification information of the workpiece 10. Therefore, in the embodiment, the control unit 210 executes a program that displays desired image data on the display unit 100 by referring to the image data captured by the imaging mechanism 40 and various information stored in the storage unit 220.

[0058] The control unit 210 includes, as functional units realized by executing the program, a storage control unit 211 and a display control unit 212. Note that, hereinafter, the processes described as being performed by the storage control unit 211 and the display control unit 212 are processes realized by the control unit 210.

[0059] The storage control unit 211 stores in the storage unit 220 object to be measured information 220a, which associates the above-mentioned imaging history of the image captured by the imaging mechanism 40 and object to be measured identification information (e.g., wafer ID) with image data by the imaging mechanism 40. That is, the storage control unit 211 refers to the storage unit 220 to identify the imaging history including at least the imaging date and time and the wafer ID, and stores the identified information in association with the image data as object to be measured information 220a in the storage unit 220. That is, the storage control unit 211 stores in the storage unit 220 at least information regarding which object to be measured and when the image data captured by the imaging mechanism 40 was captured.

[0060] Furthermore, as described above, image data for each predetermined small section (A11, A12, A13, etc.) can be obtained by moving the holding mechanism 30 and the imaging mechanism 40 relative to each other using the moving mechanism 60. Therefore, the memory control unit 211 associates the image data for each small section with the position coordinates in the image data for that small section and stores them in the memory unit 220. This is to enable observation of changes over time in the object under test 10 based on image data for the same small section.

[0061] 8, the information associated with the image data may include, in addition to the wafer ID and imaging date and time, other information such as a lot number, imaging conditions, processing steps, numerical data, etc. Therefore, the storage control unit 211 may refer to the information in FIG. 8 etc. stored in the storage unit 220, and associate this other information with the image data as the object to be measured information 220a.

[0062] For example, the storage control unit 211 stores, as the object to be measured information 220a, imaging conditions such as the light amount, light direction, and focal position of the imaging mechanism 40 in the storage unit 220 in association with the image data.

[0063] Furthermore, the storage control unit 211 stores, as the object to be measured information 220a, information specifying the processing steps (such as the name of the processing device and the processing recipe) executed on the object to be measured 10 in the storage unit 220 in association with the image data.

[0064] Furthermore, the storage control unit 211 stores in the storage unit 220 the image data captured by the first imaging unit 41 and the second imaging unit 42, respectively.

[0065] Furthermore, the storage control unit 211 stores the numerical data of the object under test 10 in association with the image data in the storage unit 220 as object under test information 220a.

[0066] 8 may not necessarily be associated with the image data as long as the information associated with the image data includes at least the imaging date and time and a wafer ID capable of identifying the object under test 10. That is, the information shown in FIG. 8 may be selectively associated based on, for example, an instruction from an operator, or predetermined information may be associated. Furthermore, the timing at which the information is associated with the image data may be, for example, when the object under test 10 is imaged, or when the image data is displayed on the display unit 100 based on an instruction from an operator.

[0067] The display control unit 212 causes the display unit 100 to simultaneously or sequentially display two or more pieces of object to be measured information 220a stored in the storage unit 220. Specifically, the display control unit 212 refers to the storage control unit 211 to identify two or more pieces of object to be measured information 220a specified by the operator, and causes the display unit 100 to display the identified object to be measured information 220a.

[0068] 9 is an example of a display on the display unit 100. In the example shown in FIG. 9, two or more pieces of object information 220a corresponding to the same position coordinates are displayed on the display unit 100. Specifically, three pieces of image data for each processing step at the same coordinate position of the same object 10 (e.g., wafer ID: "ABCD-1234") are displayed. Specifically, from left to right, an image of the object 10 before processing, an image of the object 10 after processing by laser grooving, and an image of the object 10 after processing by dicing are displayed. Each image is associated with information on the wafer ID, the date and time of image capture, and the processing (name and recipe).

[0069] 9, for example, by focusing on the portions of each street 12 in the three images, it can be seen that a processing defect (chipping of a predetermined size or larger) indicated by the reference numeral 120 has occurred in the image after processing by laser grooving. In other words, the processing defect that was not displayed before processing is displayed in the image after laser grooving, and the size of the processing defect does not change even in the dicing process that follows, so it can be inferred that this processing defect occurred during the laser grooving process.

[0070] It is preferable that the images in the two or more pieces of object to be measured information 220a to be displayed are images of the same size (i.e., the same magnification) in order to compare the images. The switch group 110 shown in Fig. 9 includes various switches, such as switches for enlarging or reducing an image, switches for changing the range of the image to be displayed, and switches for displaying numerical data. Reference numeral 130 denotes a sub-screen for displaying information included in Fig. 8 (not shown here), such as numerical data.

[0071] 9, three pieces of object to be measured information 220a are simultaneously displayed in chronological order from the left, but the display on the display unit 100 may be any display method as long as it is possible to grasp information such as when each image was captured and which object to be measured 10 the image is of. For example, two or more pieces of object to be measured information 220a may be simultaneously displayed, or one piece of object to be measured information 220a may be displayed in order (for example, in chronological order). Also, for example, an arbitrary image selected by the operator may be displayed in a pop-up format.

[0072] In addition to the example of Fig. 9, images that can be displayed may include, for example, a case where a plurality of different objects 10 (objects with different wafer IDs) processed by the same processing step (same processing device name, same processing recipe) are displayed. Fig. 10 is a diagram showing an example of such a display, displaying images of three different objects 10 processed by the same dicing process using the same recipe. In the example shown in Fig. 10, the images are displayed in chronological order from left to right (oldest on the left, newest on the right).

[0073] 10, for example, by focusing on each street 12, it can be seen that processing defects (chipping) shown in (a) to (f) have occurred over time. Furthermore, the size of each chipping shown in (a) to (f) is displayed in the image on the sub-screen 130, and an operator or the like looking at this display can see the change in chipping over time and the size of the chipping.

[0074] Note that other displays on the display unit 100 may include the following. For example, the display control unit 212 causes the display unit 100 to display two or more pieces of object to be measured information 220a including the same lot information. Also, for example, the display control unit 212 causes the display unit 100 to display two or more pieces of object to be measured information 220a including the same imaging conditions. Also, for example, the display control unit 212 causes the display unit 100 to display object to be measured information 220a including image data captured by the first imaging unit 41 and object to be measured information 220a including image data captured by the second imaging unit 42.

[0075] Furthermore, for example, when one of two or more images displayed on the display unit 100 is enlarged or reduced, or when the section to be displayed is changed, the display control unit 212 also displays the other images displayed at the same time in synchronization with the one image. In other words, when the section to be displayed in one of the two or more images is changed, the section to be displayed in the other of the two or more images is similarly changed. This is because the main purpose of the display on the display unit 100 is to display a comparison or change of two or more pieces of object to be measured information 220a, and therefore when the display of one image is changed, it is preferable to change the display of the other images in synchronization with the change.

[0076] (Measurement method) Next, a measurement method of the measurement device 1 in this embodiment will be described using a flowchart. Fig. 11 is a flowchart showing an example of the process, which includes a retention step S10, an imaging step S11, a storage step S12, and a display step S13. The process is executed by the control unit 210. Since the detailed explanation of each step is as described above, the process flow of the measurement method will be mainly described here.

[0077] In the holding step S10, the control unit 210 holds the object under test 10, which has been transported by, for example, a transport unit (not shown), on the holding mechanism 30 (that is, a holding table).

[0078] In the imaging step S11, the control unit 210 moves the imaging mechanism 40 and the holding mechanism 30 relatively in the X-axis direction, the Y-axis direction, or the Z-axis direction to image any small section of the object to be measured 10 held by the holding mechanism 30. The any small section may include the street 12, a processed groove formed along the street 12, a pattern formed on the device, etc.

[0079] In storage step S12, control unit 210 stores the image captured in imaging step S11 and various pieces of information obtainable from the captured image in storage unit 220. Examples of the information to be stored include the various pieces of information described with reference to Fig. 8. Furthermore, image data in which the information and the image are associated with each other is stored in storage unit 220 as measured object information 220a.

[0080] In display step S13, control unit 210 causes display unit 100 to display two or more pieces of object to be measured information 220a stored in storage unit 220. Specific examples of display on display unit 100 have been described using Figs. 9 and 10, and therefore description thereof will be omitted here.

[0081] As described above, in the measuring apparatus 1 according to the embodiment, the storage unit 220 stores the object to be measured information 220a, which associates the image history, including at least the image date and time captured by the imaging mechanism 40, and identification information (e.g., wafer ID) capable of identifying the object to be measured captured by the imaging mechanism 40, with image data, and the display unit 100 displays two or more pieces of object to be measured information 220a simultaneously or sequentially. This allows, for example, an operator to easily compare two or more images of the object to be measured 10 captured at different times without having to select an image of the object to be measured 10. For example, the operator can determine at what point in the processing step of the object to be measured 10 a defect, such as a processing fault, occurred without having to select an image of the object to be measured 10. As a result, the time required to display the object to be measured information 220a on the display unit 100 can be significantly reduced, and two or more pieces of object to be measured information 220a can be easily compared.

[0082] Furthermore, the control unit 210 stores and displays, as the object to be measured information 220a, image data for each small section obtained by relatively moving the holding mechanism 30 and the imaging mechanism 40, in association with the position coordinates in the image data. Therefore, the same position coordinates in a part of the object to be measured 10 can be displayed on the display unit 100.

[0083] Furthermore, the imaging history includes lot information to which the object under test 10 belongs, and object under test information 220a in which the lot information is associated with the image data can be displayed on the display unit 100. This makes it possible to easily compare image data of objects under test 10 having the same lot information, for example.

[0084] Furthermore, the display unit 100 can display, as the object to be measured information 220a, the imaging conditions of the object to be measured 10 by the imaging mechanism 40 in association with the image data. Therefore, it becomes possible to easily compare image data of the object to be measured 10 imaged under the same imaging conditions (for example, light intensity).

[0085] Furthermore, the display unit 100 can display the processing steps of the object to be measured 10 in association with the image data as the object to be measured information 220a. Therefore, it becomes possible to easily compare image data of the object to be measured 10 processed in the same processing steps (processing device, processing recipe), for example.

[0086] Furthermore, the display unit 100 can display the object to be measured information 220a including image data captured by the first imaging unit 41 that captures an image of the front surface of the object to be measured and the second imaging unit 42 that captures an image of the back surface of the object to be measured 10. Therefore, it is possible to compare image data including not only the front surface of the object to be measured 10 but also the back surface.

[0087] Furthermore, numerical data can be displayed in association with image data as object to be measured information 220a on display unit 100. This makes it possible to easily grasp, for example, changes over time in processing defects (size of chipping) at the same location.

[0088] (Variation) Next, a modified example will be described. The above-mentioned measurement object identification information (wafer ID) may be acquired by, for example, input by an operator, or may be acquired by, for example, a detection mechanism provided in the measuring device 1 that detects (or reads) the measurement object identification information. In this case, the storage control unit 211 associates the measurement object identification information detected by the detection mechanism with image data captured by the imaging mechanism 40 and stores them in the storage unit 220. Note that, as the detection mechanism, for example, an OCR (Optical Character Recognition / Reader) or a barcode reader that recognizes printed character and numeric information can be envisioned. This allows, for example, the wafer ID to be detected by the detection mechanism without the operator having to input it himself, thereby saving the operator time and reducing the possibility of input errors, etc.

[0089] Furthermore, in the above-described embodiment, the relative movement between the imaging mechanism 40 and the holding mechanism 30 is performed by the moving mechanism 60, but this only needs to be able to adjust the imaging area (imaging range) of the imaging mechanism 40. Therefore, for example, a rotation mechanism (not shown) that rotates the holding mechanism 30 may be provided, and the imaging area of ​​the imaging mechanism 40 may be adjusted by rotating the holding mechanism 30 using this rotation mechanism.

[0090] (others) Although the embodiments have been described above with reference to the drawings, it goes without saying that the present invention is not limited to such embodiments. It is clear that a person skilled in the art can conceive of various modifications and alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present invention. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the invention.

[0091] For example, the measuring device 1 may be incorporated into a part of a processing device that processes a workpiece (measurement object 10). Examples of the processing device include a cutting device that cuts the workpiece, a dividing device that applies an external force to the workpiece to divide it, a grinding device that grinds the workpiece, and a polishing device that polishes the surface of the workpiece thinned by the grinding device to flatten it with high precision.

[0092] Furthermore, the number of measuring devices is not limited to one, and multiple measuring devices may be present. In such a case, for example, image data captured by a first measuring device and image data captured by a second measuring device may be stored in a server, various information may be associated with the image data stored in the server, and the image data, etc. may be displayed on a display unit of at least one of the first measuring device and the second measuring device.

[0093] The measuring apparatus 1 may also be separated into multiple devices. For example, at least some of the control unit 210, memory unit 220, and display unit 100 included in the measuring apparatus 1 may be separate devices. A measurement system may also be configured with multiple devices. For example, in a measurement system that displays image data of the object to be measured 10 captured by an imaging mechanism 40 provided in one or more processing devices (such as the cutting device, dividing device, grinding device, or polishing device described above) or an inspection device, the system may display the image data and object to be measured information 220a, etc. on a display unit 100 located away from the processing device or inspection device. The display unit 100 may be, for example, a display unit of a personal computer, tablet terminal, or the like. In this case, the image data and object to be measured information 220a, etc. may be displayed using dedicated viewer software, for example. Note that the apparatuses and systems separated into multiple devices are not limited to this.

[0094] Furthermore, for example, in the above-described control unit 200, the storage control unit 211 and the display control unit 212 constituting the control unit 210 may be separated into multiple devices. For example, some of the functions of the storage control unit 211 and the display control unit 212 may be realized by a server or the like.

[0095] The measurement method described in the above-described embodiment can be realized by executing a prepared control program on a computer. The control program is recorded on a computer-readable storage medium and executed by being read from the storage medium. The control program may be provided in a form stored on a non-transitory storage medium such as a flash memory, or may be provided via a network such as the Internet. The computer that executes the control program may be included in the measurement device, or may be included in an electronic device such as a smartphone, tablet, or personal computer that can communicate with the measurement device, or may be included in a server device that can communicate with these measurement devices and electronic devices.

[0096] This specification describes at least the following items. Note that the components in parentheses correspond to those in the above-described embodiment, but are not limited to these.

[0097] (1) A measuring device (measuring device 1) for measuring an object to be measured (object to be measured 10), a holding mechanism (holding mechanism 30) that holds the object to be measured; an imaging mechanism (imaging mechanism 40) that images the object to be measured held by the holding mechanism; a storage unit (storage unit 220) that stores image data captured by the imaging mechanism; a display unit (display unit 100) that displays the image data; a control unit (control unit 210) that controls the measurement device, The control unit a storage control unit (storage control unit 211) that stores in the storage unit measurement object information (measurement object information 220a) that associates an imaging history including at least the imaging date or imaging date and time when the image was taken by the imaging mechanism and measurement object identification information that can identify the measurement object imaged by the imaging mechanism with the image data; a display control unit (display control unit 212) that causes the display unit to simultaneously or sequentially display two or more pieces of object to be measured information; Measuring equipment.

[0098] According to (1), for example, an operator can easily compare two or more images of an object to be measured that have been captured at different times, without having to select the image of the object to be measured himself.

[0099] (2) The measuring device according to (1), a moving mechanism (moving mechanism 60) that moves the holding mechanism and the imaging mechanism relatively; The storage control unit Further, as the information on the object to be measured, image data for each predetermined small section obtained by relatively moving the holding mechanism and the imaging mechanism by the moving mechanism and position coordinates in the image data are stored in association with each other. Measuring device.

[0100] According to (2), for example, it is possible to display image data of a part of the object to be measured on the display unit.

[0101] (3) The measuring device according to (2), The display control unit displaying two or more pieces of object information corresponding to the same position coordinates on the display unit; Measuring device.

[0102] According to (3), for example, it becomes possible to easily compare image data of the same position coordinates.

[0103] (4) The measuring device according to (1) or (2), the imaging history includes lot information to which the object to be measured belongs; The storage control unit storing the object information in the storage unit, the object information being further associated with the image data; The display control unit displaying two or more pieces of object to be measured information including the same lot information on the display unit; Measuring device.

[0104] According to (4), for example, it becomes possible to easily compare image data of objects having the same lot information.

[0105] (5) The measuring device according to (1) or (2), The storage control unit Further, as the object information, imaging conditions of the object to be measured by the imaging mechanism are stored in association with the image data; The display control unit displaying two or more pieces of the object to be measured including the same imaging condition on the display unit; Measuring device.

[0106] According to (5), for example, it becomes possible to easily compare image data of the object to be measured captured under the same imaging conditions.

[0107] (6) The measuring device according to (1) or (2), The storage control unit As the object information, pre-processing process information specifying the immediately preceding processing process executed on the object is further stored in association with the image data; The display control unit displaying two or more pieces of object information including the same pretreatment process information on the display unit; Measuring device.

[0108] According to (6), for example, it becomes possible to easily compare image data of the object to be measured that have been processed in the same processing step.

[0109] (7) The measuring device according to (6), The pre-treatment process information includes information that can identify treatment conditions in the treatment process. Measuring device.

[0110] According to (7), for example, it becomes possible to easily compare image data of objects processed under the same processing conditions (processing recipe).

[0111] (8) The measuring device according to (1) or (2), further comprising a detection mechanism for detecting the object identification information; The storage control unit The object identification information detected by the detection mechanism and the image data are stored in the storage unit in association with each other. Measuring device.

[0112] According to (8), since the object identification information can be detected by the detection mechanism, it is possible to eliminate the need for the operator to input the object identification information, and it is also possible to reduce the possibility of input errors.

[0113] (9) The measuring device according to (1) or (2), The holding mechanism is a holding table having a mounting surface (mounting surface 31a) on which the object to be measured is placed, the placement surface is configured to include a transparent body, The imaging mechanism includes a first imaging unit (first imaging unit 41) that images an upper surface of the object to be measured placed on the placement surface, and a second imaging unit (second imaging unit 42) that images a lower surface of the object to be measured. Measuring device.

[0114] According to (9), it is possible to acquire image data including not only the first surface (for example, the front surface) of the object to be measured, but also the surface opposite to the first surface (the back surface).

[0115] (10) The measuring device according to (9), The storage control unit storing image data captured by the first imaging unit and the second imaging unit in the storage unit; The display control unit displaying, on the display unit, the object information including image data captured by the first imaging unit and the object information including image data captured by the second imaging unit; Measuring device.

[0116] According to (10), it is possible to use image data including not only the first surface (for example, the front surface) of the object to be measured, but also the surface opposite to the first surface (the back surface) as the comparison target.

[0117] (11) The measuring device according to (1) or (2), The storage control unit Further, as the object information, numerical data of the object to be measured is stored in association with the image data; The display control unit displaying the object to be measured information including the numerical data on the display unit; Measuring device.

[0118] According to (11), for example, it becomes possible to easily grasp numerical data (for example, numerical values ​​indicating changes over time such as processing defects) at the same location.

[0119] (12) A measurement method for measuring an object to be measured (object to be measured 10), comprising: a holding step (holding step S10) in which the object to be measured is held by a holding mechanism (holding mechanism 30); an imaging step (imaging step S11) of imaging the object to be measured held by the holding mechanism with an imaging mechanism (imaging mechanism 40) to obtain image data; a storage step (storage step S12) of storing, in a storage unit (storage unit 220), an imaging history of the object to be measured captured by the imaging mechanism and object to be measured identification information capable of identifying the object to be measured captured by the imaging mechanism in association with the image data, as object to be measured information (object to be measured information 220a); and a display step (display step S13) of displaying the two or more pieces of object information simultaneously or sequentially on a display unit (display unit 100). Measurement method.

[0120] According to (12), for example, an operator can easily compare two or more images of an object to be measured taken at different times without having to select the image of the object to be measured by himself.

[0121] (13) A program executed by a computer to display image data of a wafer (object under test 10) on a display unit (display unit 100), a process of storing, as wafer information (measurement object information 220a), an imaging history including at least the imaging date or imaging date and time of the image of the wafer and wafer identification information capable of identifying the wafer in association with the image data; and causing the computer to execute a process of displaying two or more pieces of wafer information simultaneously or sequentially on the display unit. program.

[0122] According to (13), for example, an operator can easily compare two or more wafer images taken at different times without having to select the wafer images himself.

[0123] (14) A measurement system that displays image data of a measurement object (measurement object 10) captured by an imaging mechanism provided in one or more processing devices or inspection devices, a storage unit (storage unit 220) that stores image data captured by the imaging mechanism (imaging mechanism 40); a display unit (display unit 100) that displays the image data; a control unit (control unit 210), The control unit a storage control unit (storage control unit 211) that stores in the storage unit, in association with the image data, an imaging history including at least the imaging date or imaging time when the image was taken by the imaging mechanism, and measurement object identification information that can identify the measurement object imaged by the imaging mechanism; a display control unit (display control unit 212) that causes the display unit to simultaneously or sequentially display two or more pieces of object to be measured information; Measurement system.

[0124] According to (14), information about the object to be measured can be displayed on a display unit located away from the processing device or the inspection device, and for example, an operator can easily compare images of two or more objects taken at different times without having to select the images of the object to be measured himself. [Explanation of symbols]

[0125] 1. Measuring equipment 10 Object to be measured 30 Retention mechanism 31a Placement surface 41 First imaging unit 42 Second imaging unit 40 Imaging mechanism 60 Moving mechanism 100 Display 210 Control Unit 211 Memory control unit 212 Display control unit 220 Storage section 220a Measured object information S10 Hold step S11 Imaging step S12 Memory Step S13 Display Step

Claims

1. A measuring device for measuring an object to be measured, a holding mechanism for holding the object to be measured; an imaging mechanism that images the object to be measured held by the holding mechanism; a storage unit that stores image data captured by the imaging mechanism; a display unit that displays the image data; a control unit that controls the measurement device, The control unit a storage control unit that stores in the storage unit, in association with the image data, an imaging history including at least an imaging date or an imaging date and time when the image was captured by the imaging mechanism, and measurement object identification information that can identify the measurement object imaged by the imaging mechanism; a display control unit that causes the display unit to display two or more pieces of the object to be measured simultaneously or sequentially; Measuring equipment.

2. 2. The measuring device according to claim 1, a moving mechanism for relatively moving the holding mechanism and the imaging mechanism; The storage control unit Further, as the information on the object to be measured, image data for each predetermined small section obtained by relatively moving the holding mechanism and the imaging mechanism by the moving mechanism and position coordinates in the image data are stored in association with each other. Measuring equipment.

3. 3. The measuring device according to claim 2, The display control unit displaying two or more pieces of object information corresponding to the same position coordinates on the display unit; Measuring equipment.

4. 3. The measuring device according to claim 1 or 2, the imaging history includes lot information to which the object to be measured belongs; The storage control unit storing the object information in which the lot information is further associated with the image data in the storage unit; The display control unit displaying two or more pieces of object to be measured information including the same lot information on the display unit; Measuring equipment.

5. 3. The measuring device according to claim 1 or 2, The storage control unit Further, as the object information, imaging conditions of the object to be measured by the imaging mechanism are stored in association with the image data; The display control unit displaying two or more pieces of the object to be measured including the same imaging condition on the display unit; Measuring equipment.

6. 3. The measuring device according to claim 1 or 2, The storage control unit As the object information, pre-processing step information specifying the immediately preceding processing step executed on the object is further stored in association with the image data; The display control unit displaying two or more pieces of object information including the same pretreatment process information on the display unit; Measuring equipment.

7. 7. The measuring device according to claim 6, The pre-treatment process information includes information that can identify treatment conditions in the treatment process. Measuring equipment.

8. 3. The measuring device according to claim 1 or 2, further comprising a detection mechanism for detecting the object identification information; The storage control unit The object identification information detected by the detection mechanism and the image data are stored in the storage unit in association with each other. Measuring equipment.

9. 3. The measuring device according to claim 1 or 2, the holding mechanism is a holding table having a mounting surface on which the object to be measured is placed, the placement surface is configured to include a transparent body, the imaging mechanism includes a first imaging unit that images an upper surface of the object to be measured placed on the placement surface, and a second imaging unit that images a lower surface of the object to be measured. Measuring equipment.

10. 10. The measuring device according to claim 9, The storage control unit storing the image data captured by each of the first imaging unit and the second imaging unit in the storage unit; The display control unit displaying, on the display unit, the object information including image data captured by the first imaging unit and the object information including image data captured by the second imaging unit; Measuring equipment.

11. 3. The measuring device according to claim 1 or 2, The storage control unit Further, as the object information, numerical data of the object to be measured is stored in association with the image data; The display control unit displaying the object to be measured information including the numerical data on the display unit; Measuring equipment.

12. A measurement method for measuring an object to be measured, comprising: a holding step of holding the object to be measured by a holding mechanism; an imaging step of imaging the object to be measured held by the holding mechanism with an imaging mechanism to obtain image data; a storage step of storing, in a storage unit, an imaging history of the object to be measured captured by the imaging mechanism and object to be measured identification information capable of identifying the object to be measured captured by the imaging mechanism in association with the image data, as object to be measured information; and a display step of displaying two or more pieces of the object to be measured simultaneously or sequentially on a display unit. Measurement method.

13. A program executed by a computer to display image data of a wafer on a display unit, a process of storing, as wafer information, an imaging history including at least the imaging date or imaging time of the image of the wafer and wafer identification information capable of identifying the wafer in association with the image data; causing the computer to execute a process of displaying two or more pieces of wafer information simultaneously or sequentially on the display unit; program.

14. A measurement system that displays image data of a measured object captured by an imaging mechanism provided in one or more processing devices or inspection devices, a storage unit that stores image data captured by the imaging mechanism; a display unit that displays the image data; a control unit, The control unit a storage control unit that stores in the storage unit, in association with the image data, an imaging history including at least an imaging date or an imaging date and time when the image was captured by the imaging mechanism, and measurement object identification information that can identify the measurement object imaged by the imaging mechanism; a display control unit that causes the display unit to display two or more pieces of the object to be measured simultaneously or sequentially; Measurement system.

Images