Processing device and processing method of workpiece

Abstract

To prevent a processing liquid or mist of the processing liquid scattering in a specific area from entering another area in a processing device which uses the processing liquid to process a workpiece.SOLUTION: A processing device includes: a moving unit (19); a holding table (20) having a holding surface for holding a workpiece (W) disposed in the moving unit; a processing unit (25) which processes the workpiece while supplying the processing liquid (M); and a control unit (11). The control unit controls to stop supply of the processing liquid in at least part of a moving time in which the moving unit is moved.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for processing an object to be processed using a processing liquid, and a processing method for processing an object to be processed using a processing liquid. [Background technology]

[0002] In a processing device for processing workpieces, a holding table holding the workpieces is moved and positioned in a plurality of areas corresponding to a plurality of processing units, and each processing unit performs a predetermined processing on the workpieces. The plurality of processing units include a processing unit that processes the workpieces and a transport unit that transports the workpieces.

[0003] When a processing liquid is supplied to a specific area to process an object, such as during processing by a processing unit, there is a risk that the processing liquid scattered in that area or the spray of the processing liquid may invade another area. As disclosed in Patent Documents 1 and 2, a structure is provided to separate the areas to prevent the scattered processing liquid or the spray of the processing liquid from invading another area. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-026012 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-217924 Summary of the Invention [Problem to be solved by the invention]

[0005] In a processing apparatus, when a holding table holding an object to be processed is moved to multiple areas, even if measures such as those in Patent Documents 1 and 2 are taken, there is a possibility that scattered processing liquid or spray of processing liquid may enter other areas as the holding table moves, and it is difficult to reliably block these.

[0006] The object of the present invention is to prevent processing liquid or spray of processing liquid scattered in a specific area from entering another area in a processing device for processing a workpiece using a processing liquid, and in a processing method for processing a workpiece using a processing liquid. [Means for solving the problem]

[0007] One aspect of the present invention is a processing apparatus comprising a moving mobile unit, a holding table disposed on the moving unit and having a holding surface for holding a workpiece, a processing unit for processing the workpiece while supplying a processing liquid, and a control unit, wherein the control unit controls the supply of the processing liquid to be stopped during at least a portion of the movement time during which the moving unit is moved.

[0008] As an example, the moving unit moves the holding table between a processing area where the workpiece held on the holding table is processed by the processing unit, and a transport area where the workpiece is transported in and out of the holding table.

[0009] As an example, the processing unit includes a grinding wheel that grinds the workpiece, and a spindle that rotatably supports the grinding wheel.

[0010] The grinding wheel has a base portion including a plurality of grinding stones and one or more supply ports communicating with a source of the processing liquid and supplying the processing liquid, and the control unit stops the supply of the processing liquid to the base portion during at least a portion of the movement time.

[0011] One aspect of the present invention is a processing method for processing a workpiece in a processing apparatus comprising a moving moving unit, a holding table arranged on the moving unit and having a holding surface for holding the workpiece, a processing unit for processing the workpiece while supplying a processing liquid, and a transport section for transporting the workpiece to and from the holding table, the method comprising a processing step of positioning the holding table in a processing area corresponding to the processing unit and processing the workpiece in the processing unit, a transport step of positioning the holding table in a transport area corresponding to the transport section and transporting the workpiece to and from the holding table, and a moving step of moving the moving unit between the processing area and the transport area, and the supply of the processing liquid is stopped during at least a portion of the moving step. [Effects of the Invention]

[0012] According to the above-described aspects of the processing device and method for processing the object to be processed, the supply of processing liquid can be stopped during at least part of the movement time or movement step while the moving unit is moving, thereby preventing processing liquid that has scattered in a specific area or spray of processing liquid from entering another area. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. [Figure 2] FIG. 2 is a perspective view of a grinding wheel that constitutes a processing unit. [Figure 3] 1A-1C are cross-sectional views illustrating processing steps. [Figure 4] FIG. 10 is a cross-sectional view showing a moving step. [Figure 5] FIG. 10 is a cross-sectional view showing a modified example of the configuration for supplying the processing liquid. [Figure 6] 1A-1C are perspective views of processing devices in different configurations. [Figure 7] 1A-1C are perspective views of processing devices of different configurations. DETAILED DESCRIPTION OF THE INVENTION

[0014] 1 is a grinding apparatus that performs grinding on a workpiece, that is, a wafer W. In the processing apparatus 10, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other, and the Z-axis direction is the up-down direction.

[0015] The type of workpiece is not limited to a wafer. The processing of the workpiece is not limited to grinding, and may be processing other than grinding (polishing, cutting, etc.), or may be processing other than processing, such as transportation, cleaning, forming a protective film, inspection, and imaging. Any of the multiple processing performed on the workpiece may include a processing using a processing liquid.

[0016] The processing apparatus 10 is controlled by a control unit 11 and performs a series of operations, such as transporting, grinding, and cleaning, on the wafer W, in a fully automatic manner. The control unit 11 includes a processor and a memory, and the processor performs processing according to a program stored in the memory to control each part of the processing apparatus 10. The operation of the processing apparatus 10, which will be described below, is performed under the control of the control unit 11.

[0017] The processing apparatus 10 is equipped with two cassette stages 13 at the end of the base 12 on the -Y direction side. The two cassette stages 13 are arranged side by side in the X-axis direction, with a cassette 14 containing wafers W before grinding being placed on one cassette stage 13, and a cassette 14 containing wafers W after grinding being placed on the other cassette stage 13. The number of cassette stages 13 is not limited to two, and may be one, or three or more.

[0018] [Positioning step] The wafer W before grinding, which is accommodated in the cassette 14, is transported to a positioning unit 17 by a robot 15. The robot 15 has a robot hand 16 that holds the wafer W by suction, and moves the robot hand 16 by operating a movable arm connected to the robot hand 16. The positioning unit 17 temporarily places the wafer W on a positioning table 18 and positions the wafer W.

[0019] A turntable 19 rotatable about an axis extending in the Z-axis direction is provided on the base 12. Two holding tables 20 are supported on the turntable 19. The upper surface of each holding table 20 forms a holding surface capable of suction-holding a wafer W. The two holding tables 20 are arranged on either side of the rotation center of the turntable 19, with one holding table 20 positioned in a processing area Ea on the +Y direction side and the other holding table 20 positioned in a transfer area Eb on the -Y direction side. By rotating the turntable 19 180° at a time using a turntable rotation mechanism 21 equipped with a motor, the positions of the two holding tables 20 are alternately switched between the processing area Ea and the transfer area Eb. In other words, the turntable 19 constitutes a moving unit that moves the holding table 20 holding the wafer W between the processing area Ea and the transfer area Eb.

[0020] Each holding table 20 can be rotated around an axis extending in the Z-axis direction relative to the turntable 19 by a holding table rotation mechanism 22 equipped with a motor. Although Fig. 1 shows only the holding table rotation mechanism 22 connected to one of the holding tables 20 positioned in the processing area Ea, the two holding tables 20 can be rotated independently.

[0021] [Transport step (carry-in)] A transport step is performed in which the wafer W before grinding is loaded onto the holding table 20. In this transport step, the upper surface of the wafer W on the positioning table 18 is suction-held by the transport pad of the first transport section 24 provided in the transport unit 23, and the transport pad is moved to transport the wafer W to the holding table 20 positioned in the transport area Eb. The wafer W is transferred from the first transport section 24 to the holding table 20, and the lower surface of the wafer W is held on the holding surface of the holding table 20. The holding table 20 applies negative pressure to the holding surface to hold the wafer W by suction.

[0022] [Movement Step] A moving step is performed in which the wafer W before grinding is moved from the transfer area Eb to the processing area Ea. In this moving step, the turntable 19 is rotated by the turntable rotation mechanism 21, and the holding table 20 holding the wafer W by suction is moved from the transfer area Eb to the processing area Ea. A processing unit 25 is disposed above the processing area Ea.

[0023] The processing unit 25 has a grinding wheel 27 attached to the lower end of a spindle 26 extending in the Z-axis direction, and a plurality of grinding stones 28 arranged in an annular shape on the underside of the grinding wheel 27 (see FIG. 2). The spindle 26 is rotated by a motor provided in a spindle unit 29. The processing unit 25 is supported by a processing feed mechanism 30, which is a ball screw mechanism, so that it can move up and down in the vertical direction.

[0024] [Processing Steps] Once the holding table 20 holding the wafer W before grinding is positioned in the processing area Ea corresponding to the processing unit 25, a processing step is performed in which the wafer W is processed in the processing unit 25. In this processing step, the spindle 26 is rotated, the holding table rotation mechanism 22 rotates the holding table 20, and the processing unit 25 is lowered by the processing feed mechanism 30. With these operations, the grinding wheel 28 and the wafer W rotate relatively, and the grinding wheel 28 comes into contact with the upper surface of the wafer W, thereby grinding the wafer W (see FIG. 3).

[0025] [Movement Step] Once the wafer W has been ground to the desired thickness, a moving step is performed in which the ground wafer W is moved from the processing area Ea to the transfer area Eb. In this moving step, the processing unit 25 is raised by the processing feed mechanism 30 to move the grinding wheel 28 away from the wafer W (see FIG. 4). Next, the turntable 19 is rotated by the turntable rotation mechanism 21, and the holding table 20, which holds the ground wafer W by suction, is moved from the processing area Ea to the transfer area Eb.

[0026] [Transport step (unloading)] A transport step is performed in which the ground wafer W is transported from the holding table 20. In this transport step, the upper surface of the wafer W on the holding table 20 moved to the transport area Eb is held by suction with a transport pad of the second transport section 31 provided in the transport unit 23, and the transport pad is moved to transport the wafer W to the cleaning unit 32. The wafer W is transferred from the second transport section 31 to the cleaning table 33 of the cleaning unit 32, and the lower surface of the wafer W is held by suction on the holding surface of the cleaning table 33.

[0027] [Washing step] In the cleaning unit 32, cleaning water is sprayed from the cleaning nozzle 34 while the cleaning table 33 is rotated to clean the wafer W. After cleaning with the cleaning water, air is sprayed from the cleaning nozzle 34 to dry the wafer W.

[0028] The ground wafer W that has been cleaned in the cleaning unit 32 is held by suction by the robot hand 16. The robot 15 operates to transport the wafer W to the cassette 14 on the cassette stage 13 and store it in the cassette 14.

[0029] In the manner described above, a series of processes are performed on wafers W in processing apparatus 10. In summary, wafers W before grinding are taken out one by one from cassette 14 on cassette stage 13 and transported to positioning unit 17 for positioning (positioning step), the positioned wafer W is transported from positioning unit 17 to holding table 20 (transport step), turntable 19 is rotated to move holding table 20 holding wafer W from transfer region Eb to processing region Ea (moving step), in processing region Ea, wafer W on holding table 20 is ground by processing unit 25 (processing step), turntable 19 is rotated to move holding table 20 holding wafer W from processing region Ea to transfer region Eb (moving step), the ground wafer W is transported from holding table 20 to cleaning unit 32 (transport step), the wafer W is cleaned in cleaning unit 32 (cleaning step), and stored in cassette 14 on cassette stage 13.

[0030] In the processing step, the processing unit 25 processes the wafer W while supplying a processing liquid. The supply of the processing liquid will be described. FIG. 2 shows the underside of the grinding wheel 27 that constitutes the processing unit 25. FIG. 3 shows the processing step in which the wafer W is processed (grinded) by the processing unit 25. FIG. 4 shows the movement step in which the turntable 19 is moved (rotated) between the processing area Ea and the transfer area Eb.

[0031] The grinding wheel 27 has a disk-shaped mount 35 connected to the lower end of the spindle 26, and a ring-shaped base 36 fixed to the underside of the mount 35. As shown in Fig. 2, the base 36 has an annular surface 37 facing downward, and multiple grinding wheels 28 are supported on the annular surface 37. The multiple grinding wheels 28 are arranged in a line in the circumferential direction of the base 36, with a predetermined gap between each grinding wheel 28.

[0032] Supply ports 38 are formed in the annular surface 37 of the base portion 36. The supply ports 38 open downward. A plurality of supply ports 38 are arranged at predetermined intervals around the circumference of the base portion 36. The grinding wheel 28 is supported on the outermost edge side of the annular surface 37, and the supply ports 38 are located inside (closer to the center) of the base portion 36 than the grinding wheel 28.

[0033] 3 and 4, each supply port 38 communicates with a processing liquid supply source 39. More specifically, a conduit extending from the processing liquid supply source 39 is connected to an inlet 40 (see FIG. 1) provided at the top of the processing unit 25. An internal flow path 41 extending downward from the inlet 40 is formed inside the spindle 26. The internal flow path 41 passes through the inside of the mount 35 and the base portion 36 and connects to each supply port 38.

[0034] The processing liquid supply source 39 includes a tank 391 that stores processing liquid M, a pump 392 that delivers processing liquid M from the tank 391, and an on-off valve 393 that is provided between the tank 391 and a pipeline extending to the inlet 40. By opening the on-off valve 393 and driving the pump 392, the processing liquid M flows from the tank 391 to the pipeline at a predetermined pressure. The processing liquid M delivered from the processing liquid supply source 39 enters the internal flow path 41 from the inlet 40, passes through the internal flow path 41 to reach each supply port 38, and is supplied from the supply port 38 toward below the grinding wheel 27.

[0035] 3, in the processing step of processing the wafer W in the processing unit 25, the holding table 20 holding the wafer W is positioned in the processing area Ea corresponding to the processing unit 25, and a grinding wheel 28 constituting the processing unit 25 is brought into contact with the upper surface of the wafer W to grind the wafer W. During grinding, the spindle 26 is rotated while the holding table 20 is rotated, and the grinding wheel 28 and the wafer W are rotated relative to each other, while the grinding wheel 28 is pressed against the wafer W to grind it.

[0036] In the processing step, the control unit 11 drives the pump 392 to open the on-off valve 393, thereby supplying the processing liquid M from the processing liquid supply source 39. The processing liquid M supplied from the processing liquid supply source 39 enters the internal flow path 41 from the inlet 40, exits from the supply port 38, and is supplied to the vicinity of the processing point where the grinding wheel 28 contacts the wafer W. The processing liquid M supplied to the vicinity of the processing point serves to wash away processing debris generated during the grinding process on the wafer W and to cool the vicinity of the processing point. Because the grinding wheel 27 rotates during the grinding process, the processing liquid M discharged from the supply port 38 is directed toward the outside of the grinding wheel 27 by centrifugal force and is efficiently supplied to the location of the grinding wheel 28 arranged on the outer periphery of the grinding wheel 27 relative to the supply port 38.

[0037] When the processing liquid M coming out of the supply port 38 hits the grinding stone 28 or grinding wheel 27 rotating at high speed, the processing liquid M scatters around, or the processing liquid M turns into a mist-like spray and spreads around. In addition, some of the processing liquid M coming out of the supply port 38 passes between the multiple grinding stones 28 arranged in a ring shape with gaps in the circumferential direction of the grinding wheel 27, and may flow out to the outside of the grinding wheel 27. The processing liquid M used for cleaning or cooling the area around the processing point is contaminated with processing debris and the like, so it is necessary that the processing liquid M does not contaminate surrounding structures, etc.

[0038] 1, the processing apparatus 10 is provided with a box-shaped cover 45 that covers the processing area Ea. The cover 45 has a rectangular top plate 451 and partition portions 452 that hang down from the outer edges (four sides) of the top plate 451 and separate both sides in the X-axis direction and the Y-axis direction. The cover 45 covers approximately half of the area on the +Y direction side of the turntable 19. Approximately half of the area on the -Y direction side of the turntable 19 (i.e., the transfer area Eb) is not covered by the cover 45.

[0039] A top plate opening 46 is formed in a top plate 451 of the cover 45, allowing the grinding wheel 27 to pass through in the vertical direction. In addition, a side opening 47 is formed in the lower part of the partition portion 452 on the -Y direction side of the cover 45, allowing the turntable 19 and the holding table 20 to pass through in the horizontal direction. As the turntable 19 rotates, each holding table 20 passes through the side opening 47 and moves to the processing area Ea and the transfer area Eb.

[0040] 3, when the processing unit 25 is moved downward by the processing feed mechanism 30 to a position where the grinding wheel 28 contacts the upper surface of the wafer W, the grinding wheel 27 and the grinding wheel 28 are positioned inside the cover 45. Therefore, even if the processing liquid M coming out of the supply port 38 hits the grinding wheel 28 and splashes or sprays, the cover 45 can prevent leakage to the outside.

[0041] However, the internal space of the cover 45 is partially connected to the outside via the top panel opening 46 and the side opening 47, and these openings are not blocked while the turntable 19 is rotating to move the holding table 20 between the processing area Ea and the transfer area Eb. Therefore, there is a possibility that the processing liquid M scattered inside the cover 45 or sprays of the processing liquid M may escape to the outside of the cover 45 as the turntable 19 rotates. In particular, the side opening 47 must be open to allow the turntable 19 and the holding table 20 to pass through while the turntable 19 is rotating, and leakage of the processing liquid M from the side opening 47 is likely to occur. The external area adjacent to the side opening 47 is the transfer area Eb where the wafer W is transferred in and out of the holding table 20. If the processing liquid M enters the transfer area Eb, it will contaminate the transfer path of the wafer W, the transfer unit 23, and the like.

[0042] To address this problem, in the processing device 10, the control unit 11 controls the supply of processing liquid M to stop during at least part of the movement time when the turntable 19 is moved between the processing area Ea and the transport area Eb (the movement step when the turntable 19 is moved between the processing area Ea and the transport area Eb).

[0043] 4 shows the moving step. In the moving step, the processing unit 25 is raised by the processing feed mechanism 30 to move the grinding wheel 28 away from the wafer W. Then, the turntable 19 is rotated by the turntable rotation mechanism 21 to move one of the two holding tables 20 on the turntable 19 from the processing region Ea to the transfer region Eb, and move the other from the transfer region Eb to the transfer region Eb. During at least a part of this moving time, the control unit 11 stops driving the pump 392 and closes the on-off valve 393 to stop the supply of the processing liquid M from the processing liquid supply source 39 to the supply port 38 of the base part 36.

[0044] In the moving step, the control unit 11 continues to drive the motor of the spindle unit 29 included in the processing unit 25, thereby rotating the grinding wheel 27. The reason for this will be described later.

[0045] In a state where the processing liquid M is not supplied from the supply port 38 of the grinding wheel 27, i.e., in a state where the scattering and spraying of the processing liquid M is reduced in the processing area Ea, the turntable 19 is rotated to move the holding table 20 between the processing area Ea and the transport area Eb, thereby preventing the processing liquid M from escaping from the processing area Ea through the side opening 47 to the outside of the cover 45 and contaminating the transport path of the wafer W, the transport unit 23, etc.

[0046] In particular, the supply port 38 provided in the base portion 36 of the grinding wheel 27 does not change its relative positional relationship with the grinding wheel 28, so even if the processing unit 25 is raised by the processing feed mechanism 30 to separate the grinding wheel 28 from the wafer W after grinding the wafer W, as long as the grinding wheel 27 continues to rotate, the processing liquid M supplied from the supply port 38 remains in a state where it is likely to hit the rotating grinding wheel 28 and be scattered. Therefore, stopping the supply of the processing liquid M from the supply port 38 provided in the grinding wheel 27 during the movement time (movement step) when the turntable 19 is rotated is particularly effective in preventing the surroundings from being contaminated by the processing liquid M.

[0047] One method for preventing the scattering of the processing liquid M supplied from the supply port 38 is to stop the grinding wheel 27 while the turntable 19 is moving and rotating. However, in the processing unit 25, the spindle 26 is idled for a predetermined period of time before processing, and a waiting time is required until the spindle 26 rotates stably and the heat of the processing unit 25 stabilizes. Therefore, if the rotation of the grinding wheel 27 is stopped after the grinding process in order to prevent the scattering of the processing liquid M, the above-mentioned waiting time will be required every time a wafer W is processed next, which will reduce the productivity of the processing apparatus 10.

[0048] In contrast, the process of temporarily stopping the supply of the processing liquid M requires less time to resume the supply of the processing liquid M than the process of stopping the grinding wheel 27, and the processing apparatus can be quickly restored to a state where the next wafer W can be processed, thereby preventing contamination of the surroundings by the processing liquid M without reducing the productivity of the processing apparatus 10. Therefore, the processing apparatus 10 of this embodiment employs a process of stopping the supply of the processing liquid M during the movement time of rotating the turntable 19, without stopping the rotation of the grinding wheel 27.

[0049] As described above, in the processing apparatus 10 that fully automatically performs a series of processes on the wafer W, the control unit 11 controls the supply of the processing liquid M to be stopped for at least a portion of the time it takes for the turntable 19 to rotate and move the holding table 20 between the processing region Ea and the transfer region Eb. This prevents the processing liquid M scattered in the processing region Ea or sprays of the processing liquid M from entering the transfer region Eb. Since the supply of the processing liquid M is stopped at a timing other than during processing by the processing unit 25 (when the wafer W is being ground), the processing in the processing region Ea that requires the processing liquid M is not affected. Furthermore, since the effect can be obtained without stopping the rotation of the grinding wheel 27, the productivity of the processing apparatus 10 is not reduced.

[0050] The supply of the processing liquid M may be stopped for the entire movement time during which the turntable 19 is rotated, or for only a part of the movement time. Although the effect of preventing scattering of the processing liquid M is enhanced by stopping the supply of the processing liquid M for the entire movement time, the effect of reducing scattering of the processing liquid M can also be obtained even if the supply of the processing liquid M is stopped for at least a part of the movement time.

[0051] 5 shows a modified configuration for supplying the processing liquid to the processing area Ea. In addition to the supply port 38 provided in the grinding wheel 27, an external nozzle 42 located outside the grinding wheel 28 in the radial direction of the grinding wheel 27 and an internal nozzle 43 located inside the grinding wheel 28 are provided. The external nozzle 42 and the internal nozzle 43 are each supported on the base 12 (see FIG. 1), with the external nozzle 42 pointing its nozzle toward the outer circumferential surface of the grinding wheel 28 and the internal nozzle 43 pointing its nozzle toward the inner circumferential surface of the grinding wheel 28.

[0052] The external nozzle 42 and the internal nozzle 43 are each connected to a processing liquid supply source 44. The processing liquid supply source 44 includes a tank 441 that stores the processing liquid M, a pump 442 that delivers the processing liquid M from the tank 441, and an on-off valve 443 provided between the tank 441 and the pipeline extending to each of the nozzles 42 and 43. By opening the on-off valve 443 and driving the pump 442, the processing liquid M flows from the tank 441 into the pipeline at a predetermined pressure. The external nozzle 42 and the internal nozzle 43 each spray the processing liquid M in a direction (approximately horizontal direction) along the holding surface of the holding table 20 positioned in the processing region Ea.

[0053] In a processing step in which the grinding wheel 28 of the processing unit 25 is brought into contact with the upper surface of the wafer W to grind the wafer W, the control unit 11 drives the pump 442 to open the on-off valve 443 and causes the processing liquid M to be supplied from the processing liquid supply source 44. The processing liquid M sprayed from the external nozzle 42 and the internal nozzle 43 is supplied to the vicinity of the processing point where the grinding wheel 28 contacts the wafer W.

[0054] During at least a part of the moving step in which the turntable 19 is rotated to move between the processing region Ea and the transfer region Eb, the control unit 11 stops the pump 392 and closes the on-off valve 393 to stop the supply of the processing liquid M from the processing liquid supply source 39. The control unit 11 also stops the pump 442 and closes the on-off valve 443 to stop the supply of the processing liquid M from the processing liquid supply source 44. This allows the turntable 19 to rotate in a state in which the processing liquid M is not being supplied from any of the supply port 38, the external nozzle 42, and the internal nozzle 43. This prevents the scattered processing liquid M from leaking outside the cover 45 through the side opening 47 and contaminating the transfer path of the wafer W, the transfer unit 23, and the like.

[0055] Unlike the supply port 38 provided on the base portion 36 of the grinding wheel 27, the external nozzle 42 and the internal nozzle 43 do not follow the vertical movement of the processing unit 25 by the processing feed mechanism 30, but are supported at a fixed height on the base 12 side. Therefore, when the processing unit 25 is raised and the grinding wheel 28 is separated from the wafer W (see FIG. 4), the processing liquid M sprayed from the external nozzle 42 and the internal nozzle 43 is unlikely to hit the rotating grinding wheel 28 and be scattered. However, there is a possibility that the processing liquid M sprayed from the external nozzle 42 or the internal nozzle 43 may hit a structure other than the grinding wheel 28 and be scattered or sprayed. Alternatively, depending on the orientation of the nozzles of the external nozzle 42 and the internal nozzle 43, the treatment liquid M sprayed from the external nozzle 42 and the internal nozzle 43 may proceed toward the side opening 47, pass through the side opening 47, and directly enter the transfer region Eb as it is no longer blocked by the grinding wheel 28. Therefore, in the moving step, it is effective to stop the supply of the treatment liquid M from not only the supply port 38 but also the external nozzle 42 and the internal nozzle 43.

[0056] It should be noted that the configuration may include only one of the external nozzle 42 and the internal nozzle 43, rather than both.

[0057] Furthermore, instead of stopping the supply of the processing liquid M from both the external nozzle 42 and the internal nozzle 43, the supply of the processing liquid M may be stopped from only one of them. For example, in the configuration shown in Fig. 5, the external nozzle 42 sprays the processing liquid M toward the +Y direction, and the internal nozzle 43 sprays the processing liquid M toward the -Y direction. Because the side opening 47 is formed at a position on the -Y direction side of the processing area Ea, in the movement step, the supply of the processing liquid M from the internal nozzle 43 arranged to spray the processing liquid M toward the side opening 47 may be stopped, and the supply of the processing liquid M may be continued from the external nozzle 42 arranged to spray the processing liquid M toward the opposite side of the side opening 47.

[0058] 5, in the processing liquid supply source 44, by providing separate on-off valves in the flow path on the external nozzle 42 side and the flow path on the internal nozzle 43 side, it is possible to separately control the supply and stop of the processing liquid M to the external nozzle 42 and the internal nozzle 43. Alternatively, two independent processing liquid supply sources may be provided, which separately supply the processing liquid M to the external nozzle 42 and the internal nozzle 43.

[0059] Furthermore, the external nozzle 42 and the internal nozzle 43 may be connected to a processing liquid supply source 39, and the supply and stop of the processing liquid M to the supply port 38, the external nozzle 42, and the internal nozzle 43 may be controlled collectively.

[0060] Next, a processing apparatus 50 of a different configuration will be described with reference to Fig. 6. The processing apparatus 50 performs rough grinding, finish grinding, and polishing as processing of the wafer W. Regarding the configuration of the processing apparatus 50, parts common to the above-described processing apparatus 10 are indicated by the same reference numerals as the corresponding parts of the processing apparatus 10, and description thereof will be omitted.

[0061] The first processing unit 60 of the processing device 50 is a processing unit for rough grinding. The first processing unit 60 has a grinding wheel 62 attached to the lower end of a spindle 61 extending in the Z-axis direction, and a plurality of grinding stones 63 arranged in an annular shape on the underside of the grinding wheel 62. The spindle 61 is rotated by a motor provided in a spindle unit 64. The first processing unit 60 is supported by a processing feed mechanism 65, which is a ball screw mechanism, so that it can move up and down in the vertical direction.

[0062] The first processing unit 60 is equipped with a processing liquid supply source 66, and a supply port (not shown) provided in the grinding wheel 62 is connected to the processing liquid supply source 66. When the first processing unit 60 is used to roughly grind the wafer W, the processing liquid is delivered from the processing liquid supply source 66 and supplied from the supply port of the grinding wheel 62 toward the vicinity of the processing point where the grinding stone 63 comes into contact with the wafer W.

[0063] The second processing unit 70 of the processing device 50 is a processing unit for finish grinding. The second processing unit 70 has a grinding wheel 72 attached to the lower end of a spindle 71 extending in the Z-axis direction, and a plurality of grinding stones 73 arranged in an annular shape on the underside of the grinding wheel 72. The spindle 71 is rotated by a motor provided in a spindle unit 74. The second processing unit 70 is supported by a processing feed mechanism 75, which is a ball screw mechanism, so that it can move up and down in the vertical direction.

[0064] The second processing unit 70 is equipped with a processing liquid supply source 76, and a supply port (not shown) provided in the grinding wheel 72 is connected to the processing liquid supply source 76. When the second processing unit 70 is used to finish grind the wafer W, the processing liquid is delivered from the processing liquid supply source 76 and supplied from the supply port of the grinding wheel 72 toward the vicinity of the processing point where the grinding stone 73 comes into contact with the wafer W.

[0065] The third processing unit 80 of the processing device 50 is a processing unit for polishing. The third processing unit 80 has a polishing wheel 82 attached to the lower end of a spindle 81 extending in the Z-axis direction, and a polishing pad 83 attached to the underside of the polishing wheel 82. The spindle 81 is rotated by a motor provided in a spindle unit 84. The third processing unit 80 is supported by a processing feed mechanism 85, which is a ball screw mechanism, so that it can move up and down in the vertical direction. In addition, the third processing unit 80 is supported by a Y-axis movement mechanism 86, which is also a ball screw mechanism, so that it can move in the Y-axis direction.

[0066] The third processing unit 80 is equipped with a processing liquid supply source 87, and a supply port (not shown) provided in the polishing wheel 82 is connected to the processing liquid supply source 87. When polishing a wafer W using the third processing unit 80, the processing liquid is delivered from the processing liquid supply source 87 and supplied from the supply port of the polishing wheel 82 toward the vicinity of the processing point where the polishing pad 83 contacts the wafer W.

[0067] Four holding tables 52 are supported on a turntable 51. The turntable 51 is rotated by 90° by a turntable rotation mechanism 53, thereby sequentially moving the four holding tables 52 to a first processing area Fa, a second processing area Fb, a third processing area Fc, and a transfer area Fd. The first processing area Fa is an area where a wafer W held on the holding table 52 is roughly ground by a first processing unit 60. The second processing area Fb is an area where a wafer W held on the holding table 52 is finish ground by a second processing unit 70. The third processing area Fc is an area where a wafer W held on the holding table 52 is polished by a third processing unit 80. The transfer area Fd is an area where a wafer W is transferred in and out of the holding table 52 by a first transfer unit 24 and a second transfer unit 31 of a transfer unit 23.

[0068] Each holding table 52 can be rotated around an axis extending in the Z-axis direction relative to the turntable 51 by a holding table rotation mechanism 54 equipped with a motor.

[0069] Processing device 50 is equipped with a box-shaped cover 55 that covers first processing region Fa, second processing region Fb, and third processing region Fc. Cover 55 has a top plate 551 and partitions 552 that hang down from the outer edge of top plate 551 and separate both sides in the X-axis and Y-axis directions. Cover 55 covers approximately three-quarters of the area of ​​turntable 51, leaving transfer region Fd, which corresponds to the remaining approximately one-quarter, exposed.

[0070] A top plate 551 of the cover 55 is formed with a first top plate opening 56 through which the grinding wheel 62 of the first processing unit 60 can pass in the vertical direction, a second top plate opening 57 through which the grinding wheel 72 of the second processing unit 70 can pass in the vertical direction, and a third top plate opening 58 through which the polishing wheel 82 of the third processing unit 80 can pass in the vertical direction. A side opening 59 is formed at the boundary between the partition 552 on the −Y direction side of the cover 55 and the partition 552 on the +X direction side, connecting the first processing region Fa and the third processing region Fc with the transfer region Fd. As the turntable 51 rotates, each holding table 52 passes through the side opening 59 to move from the transfer region Fd to the first processing region Fa and from the third processing region Fc to the transfer region Fd.

[0071] When rough grinding the wafer W in the first processing area Fa, the first processing unit 60 is lowered by the processing feed mechanism 65, the grinding wheel 62 is positioned inside the cover 55, and the grinding wheel 62 and the holding table 52 are rotated relative to each other while the rotating grinding stone 63 is brought into contact with the upper surface of the rotating wafer W to perform processing. This processing is performed while a processing liquid is supplied from a processing liquid supply source 66 to the supply port of the grinding wheel 62. When processing is completed, the first processing unit 60 is raised by the processing feed mechanism 65 to separate the grinding stone 63 from the wafer W.

[0072] When finish grinding the wafer W in the second processing region Fb, the second processing unit 70 is lowered by the processing feed mechanism 75, the grinding wheel 72 is positioned inside the cover 55, and the grinding wheel 72 and the holding table 52 are rotated relative to each other while the rotating grinding stone 73 is brought into contact with the upper surface of the rotating wafer W to perform processing. This processing is performed while a processing liquid is supplied from a processing liquid supply source 76 to the supply port of the grinding wheel 72. When processing is completed, the second processing unit 70 is raised by the processing feed mechanism 75 to separate the grinding stone 73 from the wafer W.

[0073] When polishing the wafer W in the third processing region Fc, the third processing unit 80 is lowered by the processing feed mechanism 85, the polishing wheel 82 is positioned inside the cover 55, and the polishing wheel 82 and the holding table 52 are rotated relative to each other while the rotating polishing pad 83 is brought into contact with the upper surface of the rotating wafer W to perform processing. During processing, the third processing unit 80 may be moved in the Y-axis direction by the Y-axis movement mechanism 86. This processing is performed while a processing liquid is supplied from a processing liquid supply source 87 to the supply port of the polishing wheel 82. When processing is completed, the third processing unit 80 is raised by the processing feed mechanism 85 to separate the polishing pad 83 from the wafer W.

[0074] After the processing of the wafer W is completed in each of the first processing region Fa, the second processing region Fb, and the third processing region Fc, the turntable 51 is rotated by 90°. As a result, the wafer W that has been rough ground in the first processing region Fa is ready to be finish ground in the second processing region Fb. The wafer W that has been finish ground in the second processing region Fb is ready to be polished in the third processing region Fc. The wafer W that has been polished in the third processing region Fc is then carried out from the holding table 52 by the second transfer section 31 of the transfer unit 23 in the transfer region Fd and transferred to the cleaning unit 32. The wafer W that was located in the transfer region Fd is ready to be rough ground in the first processing region Fa.

[0075] By repeating the above process, rough grinding, finish grinding and polishing can be performed on a plurality of wafers W consecutively.

[0076] The control unit 11 of the processing device 50 controls at least one of the first processing unit 60, the second processing unit 70, and the third processing unit 80 to stop the supply of processing liquid from the processing liquid supply source 66, the processing liquid supply source 76, and the processing liquid supply source 87 during at least a part of the movement time (movement step) during which the turntable 51 is moved among the first processing region Fa, the second processing region Fb, the third processing region Fc, and the transport region Fd. By stopping the supply of processing liquid during the movement time during which the turntable 51 is rotated, it is possible to prevent the processing liquid scattered in the processing regions Fa, Fb, and Fc or sprays of the processing liquid from entering the transport region Fd, as in the case of the processing device 10 described above.

[0077] The processing apparatus 50 differs from the processing apparatus 10 in that the first processing area Fa and the third processing area Fc are adjacent to the transfer area Fd, while the second processing area Fb is not adjacent to the transfer area Fd. Therefore, the control unit 11 may control the processing apparatus 50 to stop the supply of processing liquid only in the first processing unit 60 corresponding to the first processing area Fa or the third processing unit 80 corresponding to the third processing area Fc, while continuing the supply of processing liquid in the second processing unit 70 corresponding to the second processing area Fb.

[0078] Alternatively, in consideration of the possibility that the effect of scattering of the processing liquid in the second processing region Fb may reach the transport region Fd via the first processing region Fa or third processing region Fc adjacent to the second processing region Fb, the supply of processing liquid in the second processing unit 70 may also be stopped in the second processing region Fb that is not adjacent to the transport region Fd. The greatest effect can be achieved by stopping the supply of processing liquid in all of the processing units 60, 70, and 80.

[0079] As can be seen from the above processing device 50, the number of holding tables and the number of processing units provided in the processing device are not limited to one, and the device can also be applied to a processing device having multiple holding tables and multiple processing units.

[0080] Furthermore, the type of processing performed by the processing unit is not limited, and any processing device or processing method that processes a workpiece using at least a processing liquid is applicable. For example, the processing device 10 of the above embodiment performs grinding as a processing for the workpiece, i.e., wafer W, but the processing device or processing method may also be a processing device or processing method that polishes the workpiece, such as the third processing unit 80 of the processing device 50. Note that although the processing device 50 performs both grinding and polishing, the present invention is also applicable to a polishing device that only performs polishing.

[0081] Furthermore, various types of processing devices and processing methods may be applicable, such as cutting devices that use cutting blades to cut workpieces, protective film coating devices that coat workpieces with resin or the like to form protective films, tool cutting devices that use tools to cut workpieces, and cleaning devices that clean workpieces. In cutting devices and tool cutting devices, processing liquids hit tools that rotate or vibrate at high speed, causing the processing liquid to splash around or spray. In protective film coating devices and cleaning devices, processing liquids for cleaning or protective film formation are supplied while rotating a holding table that holds the workpieces. Therefore, these various devices, like the processing devices 10 and 50 (grinding devices and polishing devices) in the above embodiments, have the problem of preventing processing liquids splashed in a specific area or sprayed with the processing liquid from invading other areas. By applying the processing device and processing method for workpieces according to the present invention, the same effects as those of the above embodiments can be achieved.

[0082] The processing device (10, 50) of the above embodiment includes a rotating turntable (19, 51) as a moving unit on which the holding table (20, 52) is disposed, but the moving unit may perform an operation other than rotation.

[0083] The processing apparatus 100 shown in Fig. 7 is a modified example of the processing apparatus 10 described above, and includes a moving unit that moves the holding table 20 linearly in the Y-axis direction. Similar to the processing apparatus 10 described above, the processing apparatus 100 performs grinding using a processing unit 25 as a process for a wafer W (not shown in Fig. 7). With regard to the configuration of the processing apparatus 100, parts that function in the same way as the corresponding parts of the processing apparatus 10 described above are denoted by the same reference numerals, and description thereof will be omitted.

[0084] The processing apparatus 100 includes a holding table 20 for holding a wafer W on a base 101. The holding table 20 can be rotated about an axis extending in the Z-axis direction by a holding table rotation mechanism 102 equipped with a motor. A pedestal 103 supporting the holding table 20 and the holding table rotation mechanism 102 is provided inside the base 101. The pedestal 103 can be moved in the Y-axis direction by a movement mechanism 104. The movement mechanism 104 includes a pair of guide rails 105 and a ball screw 106, each extending in the Y-axis direction. The guide rails 105 support the pedestal 103 so that it can move in the Y-axis direction, and the ball screw 106 is threadedly engaged with a threaded portion (not shown) provided on the pedestal 103. When the ball screw 106 is rotated by a motor 107, the pedestal 103 moves along the guide rails 105 in the Y-axis direction. The holding table 20 moves together with the pedestal 103 in the Y-axis direction.

[0085] The holding table 20 is moved in the Y-axis direction by a moving unit having a base 103 and a moving mechanism 104, and is thereby positioned between a processing region Ga on the +Y-axis side and a transfer region Gb on the -Y-axis side. A grinding wheel 28 provided in the processing unit 25 is brought into contact with the wafer W held on the holding table 20 positioned in the processing region Ga to perform grinding. The wafer W is transferred into and out of the holding table 20 positioned in the transfer region Gb. An opening 108 extending in the Y-axis direction is formed in the upper surface of the base 101, and the holding table 20 moves in the Y-axis direction along the opening 108. The opening 108 is covered by an expandable bellows 109. The bellows 109 is connected to a moving plate that moves in the Y-axis direction together with the holding table 20, and the bellows 109 expands and contracts as the holding table 20 moves.

[0086] The processing apparatus 100 is equipped with a box-shaped cover 110 that covers the processing region Ga. The cover 110 has a rectangular top plate 111 and partition portions 112 that hang down from the outer edges (four sides) of the top plate 111 and separate both sides in the X-axis and Y-axis directions. A top plate opening 113 is formed in the top plate 111 of the cover 110 to allow the spindle 26 of the processing unit 25 to pass through, and the grinding wheel 27 and grinding stone 28 are located inside the cover 110 (below the top plate 111).

[0087] A side opening 114 is formed in a partition 112 on the -Y direction side of the cover 110, allowing the holding table 20 to pass through in the horizontal direction (Y axis direction). When the moving mechanism 104 moves the holding table 20 in the Y axis direction, the holding table 20 passes through the side opening 114 and moves to the processing region Ga and the transfer region Gb. The transfer region Gb is an area outside the cover 110. An openable and closable lid 115 is provided in the side opening 114. A lid opening / closing mechanism (not shown) that opens and closes the lid 115 using the driving force of a motor is provided, and the control unit 11 controls the lid opening / closing mechanism.

[0088] In a processing step in which the wafer W is ground by the processing unit 25 in the processing area Ga, the holding table 20 is positioned in the processing area Ga, and the wafer W on the rotating holding table 20 is ground by bringing the rotating grinding wheel 28 into contact with it. At this time, the control unit 11 causes the processing liquid to be discharged from the processing liquid supply source 39, and the processing liquid is supplied to the vicinity of the processing point where the grinding wheel 28 contacts the wafer W. In the processing step, the control unit 11 closes the lid 115. As a result, even if the processing liquid hits the rotating grinding wheel 28 and splashes or sprays, the cover 110 and the lid 115 can prevent the processing liquid from leaking to the outside.

[0089] In the moving step of moving the holding table 20 between the processing region Ga and the transfer region Gb, the control unit 11 opens the cover 115 to allow the holding table 20 to pass through the side opening 114. The control unit 11 also stops the supply of the processing liquid from the processing liquid supply source 39 during at least a part of the moving time of moving the holding table 20 in the moving step. Since the supply of the processing liquid is stopped and the occurrence of scattering or spraying of the processing liquid in the processing region Ga is reduced, the processing liquid can be prevented from leaking from the processing region Ga through the side opening 114 to the outside of the cover 110 and contaminating the transfer path of the wafer W, including the transfer region Gb.

[0090] The processing apparatus (10, 50, 100) of the above embodiment controls to stop the supply of processing liquid when the holding table (20, 52) is moved between a processing region (Ea, Fa, Fb, Fc, Ga) where the workpiece (wafer W) held on the holding table (20, 52) is processed by a processing unit (25, 60, 70, 80) and a transfer region (Eb, Fd, Gb) where the workpiece (wafer W) is loaded and unloaded from the holding table 20. However, the content of the processing performed in each region is not limited to this.

[0091] For example, as a modification of the processing apparatus 50 described above, the third processing region Fc may be provided with an inspection processing unit for inspecting the wafer W, an imaging processing unit for imaging the wafer W, etc. If the inspection or imaging performed in the third processing region Fc is affected by the intrusion of the processing liquid, it is necessary to prevent the processing liquid scattered in the second processing region Fb or the spray of the processing liquid from intruding into the third processing region Fc. Therefore, when the holding table 52 holding the wafer W moves from the second processing region Fb to the third processing region Fc, it is effective to stop the supply of the processing liquid from the second processing unit 70 in the second processing region Fb to prevent the processing liquid from intruding from the second processing region Fb into the third processing region Fc.

[0092] The embodiments of the present invention are not limited to the above-described embodiments and modifications, and may be variously changed, substituted, or modified without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological advances or other derived technologies, it may be implemented using that method. Therefore, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0093] As described above, the processing apparatus and processing method for the object to be processed of the present invention prevent the processing liquid scattered in a specific area or the spray of the processing liquid from entering another area, and can efficiently process the object to be processed without spreading contamination caused by the processing liquid. [Explanation of symbols]

[0094] 10: Processing equipment 11: Control unit 19: Turntable (mobile unit) 20: Holding table 23: Transport unit (transport section) 24: First conveying section 25: Processing unit 26: Spindle 27: Grinding wheel 28: Grinding wheel 29: Spindle unit 30: Processing feed mechanism 31: Second conveying section 32: Cleaning unit 35: Mount 36: Base part 37: Circular surface 38: Supply port 39: Processing liquid supply source 40:Inlet 41: Internal flow path 42: External nozzle 43: Internal nozzle 44: Processing liquid supply source 45: Cover 47: Side opening 50: Processing equipment 51: Turntable (mobile unit) 52: Holding table 55: Cover 59: Side opening 60: First treatment unit 61: Spindle 62: Grinding wheel 63: Grinding wheel 64: Spindle unit 65: Processing feed mechanism 66: Processing liquid supply source 70: Second treatment unit 71: Spindle 72: Grinding wheel 73: Grinding wheel 74: Spindle unit 75: Processing feed mechanism 76: Processing liquid supply source 80: Third processing unit 81: Spindle 82: Abrasive wheel 83: Polishing pad 84: Spindle unit 85: Processing feed mechanism 86:Y-axis movement mechanism 87: Processing liquid supply source 100: Processing device 103: Pedestal (mobile unit) 104: Moving mechanism (moving unit) 110: Cover 114: Side opening 115: Lid Ea: Processing area Eb: Transport area Fa: First processing area Fb: Second processing area Fc: Third processing area Fd: Transport area Ga: Processing area Gb: Transport area M: Processing liquid W: Wafer (processing object)

Claims

1. a moving mobile unit; a holding table disposed in the moving unit and having a holding surface for holding the object to be processed; a processing unit that processes the object to be processed while supplying a processing liquid; a control unit; A processing device comprising: The control unit controls the moving unit to stop supplying the processing liquid during at least a part of the time the moving unit is moving.

2. 2. The processing apparatus according to claim 1, wherein the moving unit moves the holding table between a processing area where the workpiece held on the holding table is processed by the processing unit and a transport area where the workpiece is transported in and out of the holding table.

3. The processing unit a grinding wheel for grinding the workpiece; a spindle that rotatably supports the grinding wheel; 2. The processing device of claim 1, further comprising:

4. The grinding wheel is a base portion including a plurality of grinding wheels and one or more supply ports communicating with a supply source of the treatment liquid and supplying the treatment liquid; 4. The processing apparatus according to claim 3, wherein the control unit stops the supply of the processing liquid to the base portion during at least a part of the movement time.

5. a moving mobile unit; a holding table disposed on the moving unit and having a holding surface for holding the object to be processed; a processing unit that processes the object to be processed while supplying a processing liquid; a transport unit that transports the workpiece to and from the holding table; A processing method for processing a workpiece in a processing apparatus comprising: a processing step of positioning the holding table in a processing area corresponding to the processing unit and processing the object to be processed in the processing unit; a transport step of positioning the holding table in a transport area corresponding to the transport unit and transporting the workpiece into and out of the holding table; a moving step of moving the moving unit between the processing area and the transport area; Equipped with The method for treating an object to be treated, wherein the supply of the treatment liquid is stopped for at least a part of the time of the moving step.

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