Injection molding device and injection molding mold
The injection molding apparatus uses a partitioning member to prevent resin caps from forming in certain spaces, enabling easy removal and minimizing thermal interference and expansion damage.
Patent Information
- Application Number
- JP2024087690
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-12-11
AI Technical Summary
In injection molding apparatuses, it is difficult to remove resin caps formed when plasticized material solidifies in the spaces between probes and through-holes in fixed molds, especially when multiple components are involved.
The injection molding apparatus includes a partitioning member that separates spaces between the probe and through-holes, preventing resin caps from forming in certain areas and allowing easy removal.
The partitioning member effectively prevents resin caps from forming in specific spaces, facilitating easy removal and reducing thermal interference and expansion-related damage.
Smart Images

Figure 2025180382000001_ABST
Abstract
Description
[Technical Field]
[0001] The present disclosure relates to an injection molding apparatus and an injection mold. [Background technology]
[0002] For example, Patent Document 1 discloses a hot runner device equipped with a hot runner nozzle and a hot runner mold. The hot runner nozzle is inserted into a nozzle mounting hole in the fixed mold, and a heat insulating space is formed between the hot runner nozzle and the fixed mold. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-20472 Summary of the Invention [Problem to be solved by the invention]
[0004] In an injection molding apparatus in which a space is formed between a probe that injects plasticized material into a cavity and a through-hole in a fixed mold into which the probe is inserted, injection molding is generally performed after filling the space with plasticized material. However, when through-holes are formed across multiple components that make up the fixed mold, there is a problem in that it is difficult to remove the resin cap that is formed when the plasticized material filled in the space solidifies. [Means for solving the problem]
[0005] According to a first aspect of the present disclosure, there is provided an injection molding apparatus comprising: a molding die having a fixed die and a movable die; a probe having a probe channel through which a plasticizable material flows and configured to inject the plasticizable material toward a cavity formed by the fixed die and the movable die; and a partitioning member, wherein the fixed die has a first plate having a first through hole and a second plate positioned between the first plate and the movable die and having a second through hole communicating with the first through hole, the probe is disposed in the first through hole and the second through hole, a first space is formed between an outer peripheral surface of the probe and an inner wall surface of the first through hole, and a second space is formed between an outer peripheral surface of the probe and an inner wall surface of the second through hole, and the partitioning member is disposed in the first through hole or the second through hole to surround the probe and partition the first space from the second space.
[0006] According to a second aspect of the present disclosure, there is provided an injection molding mold comprising: a stationary mold, a movable mold, a probe having a probe flow path through which a plasticizable material flows and configured to inject the plasticizable material toward a cavity formed by the stationary mold and the movable mold, and a partitioning member, wherein the stationary mold has a first plate having a first through hole and a second plate positioned between the first plate and the movable mold and having a second through hole communicating with the first through hole, the probe is disposed within the first through hole and the second through hole, a first space is formed between an outer peripheral surface of the probe and an inner wall surface of the first through hole, and a second space is formed between an outer peripheral surface of the probe and an inner wall surface of the second through hole, and the partitioning member is disposed within the first through hole or the second through hole to surround the probe and partition the first space from the second space. [Brief explanation of the drawings]
[0007] [Figure 1] FIG. 1 is a top view showing a schematic configuration of an injection molding device. [Figure 2] FIG. 1 is a perspective view showing a schematic configuration of an injection molding device. [Figure 3]FIG. 2 is a cross-sectional view showing a schematic configuration of an injection unit. [Figure 4] FIG. 2 is a perspective view showing a schematic configuration of a flat screw. [Figure 5] FIG. 2 is a schematic plan view of the barrel. [Figure 6] FIG. 2 is a cross-sectional view showing a schematic configuration of a molding die. [Figure 7] 7 is an explanatory diagram showing an enlarged view of a part of an area AR in FIG. 6. FIG. [Figure 8] FIG. 10 is a diagram showing a state in which the second space is filled with a plasticizing material. DETAILED DESCRIPTION OF THE INVENTION
[0008] A. First embodiment: FIG. 1 is a top view showing a schematic configuration of injection molding apparatus 10. FIG. 2 is a perspective view showing a schematic configuration of injection molding apparatus 10. FIGS. 1 and 2 show arrows representing mutually orthogonal X, Y, and Z directions. The X and Y directions are parallel to the horizontal plane. The Z direction is parallel to the vertical direction. The X, Y, and Z directions in FIGS. 1 and 2 and the X, Y, and Z directions in other figures indicate the same directions. When specifying a direction, positive and negative signs are used in combination to indicate the direction, with "+" indicating the positive direction indicated by the arrow and "-" indicating the negative direction opposite to the direction indicated by the arrow.
[0009] The injection molding apparatus 10 includes an injection unit 20, a mold clamping device 30, and a control unit 40. The injection molding apparatus 10 molds a molded product by injecting a plasticizable material from the injection unit 20 into a molding die 200 attached to the mold clamping device 30. The control unit 40 is configured as a computer equipped with a CPU and memory, and controls each part of the injection molding apparatus 10 by the CPU executing a program stored in the memory. The control unit 40 may also be configured as a circuit.
[0010] A metal molding die 200 is attached to the mold clamping unit 30. The metal molding die 200 is called a mold. The molding die 200 includes a fixed die 201 and a movable die 202. The fixed die 201 is a die that is fixed to the injection unit 20. The movable die 202 is a die that can be moved forward and backward in the mold clamping direction relative to the fixed die 201 by the mold clamping unit 30. In this embodiment, the mold clamping direction is the -Y direction. In this specification, the molding die 200 is also called an injection molding die.
[0011] The mold clamping device 30 has the function of opening and closing the fixed mold 201 and the movable mold 202. Under the control of the control unit 40, the mold clamping device 30 drives the mold drive unit 31 formed by a motor to rotate the ball screw 32, and moves the movable mold 202 connected to the ball screw 32 relative to the fixed mold 201, thereby opening and closing the casting mold 200.
[0012] A hopper 50 into which the material for the molded article is introduced is connected to the injection unit 20. The material for the molded article may be, for example, a thermoplastic resin formed into pellets. Examples of the thermoplastic resin include ABS (acrylonitrile butadiene styrene), PC (polycarbonate), POM (polyacetal), PP (polypropylene), and PBT (polybutylene terephthalate). The material for the molded article may contain metal or ceramic in addition to the thermoplastic resin. The material may be supplied to the injection unit 20 not only through the hopper 50 but also, for example, via a tube through which the material is pressure-fed.
[0013] The injection unit 20 plasticizes at least a portion of the material supplied from the hopper 50 to produce a plasticized material, and then injects the produced plasticized material into a cavity defined between the fixed mold 201 and the movable mold 202. In this specification, "plasticization" is a concept that includes melting, and refers to changing a material from a solid to a fluid state. Specifically, for a material that undergoes glass transition, plasticization refers to raising the temperature of the material above its glass transition point. For a material that does not undergo glass transition, plasticization refers to raising the temperature of the material above its melting point.
[0014] 3 is a cross-sectional view showing a schematic configuration of the injection unit 20. The injection unit 20 includes a plasticizing section 21, a suction delivery section 22, and a nozzle 23 having a nozzle opening 24.
[0015] The plasticizing section 21 plasticizes at least a portion of the material supplied from the hopper 50 to produce a plasticized material. The plasticizing section 21 includes a flat screw 110, a barrel 130, and a heater 140.
[0016] The flat screw 110 is housed in a screw case 111. The flat screw 110 is rotated by a drive motor 112 within the screw case 111 around a drive shaft 119 of the drive motor 112. A central axis RX, which is the rotation center of the flat screw 110, coincides with the center of the drive shaft 119 of the drive motor 112 in the XZ plane. In this embodiment, the axial directions of the drive shaft 119 and the central axis RX are aligned along the Y direction. The rotation of the flat screw 110 by the drive motor 112 is controlled by the control unit 40. The flat screw 110 may be driven by the drive motor 112 via a reducer. The flat screw 110 is also called a rotor or simply a screw.
[0017] A communication hole 131 is formed in the center of the barrel 130. The communication hole 131 is connected to a flow path 170 through which the plasticized material flows. A cylinder 151 and a nozzle 23, which will be described later, are connected to the flow path 170. A check valve 132 is provided in the flow path 170, upstream of the cylinder 151. The check valve 132 prevents the plasticized material from flowing back from the nozzle 23 side to the flat screw 110 side.
[0018] FIG. 4 is a perspective view showing a schematic configuration of the flat screw 110. The flat screw 110 has a generally cylindrical shape whose length along the central axis RX is shorter than its length perpendicular to the central axis RX. A spiral groove 123 is formed around a central portion 122 on a groove-forming surface 121 of the flat screw 110 facing the barrel 130. The groove 123 communicates with a material inlet 124 formed on the side surface of the flat screw 110. Material supplied from the hopper 50 is supplied to the groove 123 through the material inlet 124. The grooves 123 are separated by ridge portions 125. While FIG. 4 shows an example in which three grooves 123 are formed, the number of grooves 123 may be one or more. The groove 123 is not limited to a spiral shape, but may also be a spiral shape or an involute curve shape, or may have a shape extending in an arc from the central portion 122 to the outer periphery.
[0019] 5 is a schematic plan view of barrel 130. Barrel 130 has an opposing surface 133 that faces groove-forming surface 121 of flat screw 110. A communication hole 131 is formed in the center of opposing surface 133. A plurality of guide grooves 134 are formed in opposing surface 133, connected to communication hole 131 and extending spirally from communication hole 131 toward the outer periphery. Note that guide grooves 134 do not necessarily have to be provided in barrel 130. Furthermore, guide grooves 134 do not necessarily have to be connected to communication hole 131.
[0020] The material supplied to the groove 123 of the flat screw 110 is plasticized between the flat screw 110 and the barrel 130 by the rotation of the flat screw 110 and the heating of the heater 140, and flows along the groove 123 and the guide groove 134 by the rotation of the flat screw 110, and is guided to the center portion 122 of the flat screw 110. The material that has flowed into the center portion 122 flows out into the flow path 170 from a communication hole 131 provided in the center of the barrel 130.
[0021] As shown in FIG. 3, suction delivery unit 22 has a cylinder 151, a plunger 152, and a plunger driver 153. Suction delivery unit 22 has the function of injecting the plasticized material in cylinder 151 into the cavity of molding die 200. Under the control of control unit 40, suction delivery unit 22 controls the injection amount, injection speed, and injection pressure of the plasticized material from nozzle 23. Cylinder 151 is a substantially cylindrical member connected to flow path 170 and has plunger 152 therein. Plunger 152 slides inside cylinder 151 and pressure-feeds the plasticized material in cylinder 151 to nozzle 23. Plunger 152 is driven by plunger driver 153, which is composed of a motor.
[0022] Nozzle 23 is formed with a flow path 170. Plunger 152 pressure-feeds the plasticized material in cylinder 151 to nozzle 23, whereby the plasticized material is injected from nozzle opening 24 of nozzle 23 into molding die 200.
[0023] FIG. 6 is a cross-sectional view showing the schematic configuration of the molding die 200. The molding die 200 is configured as a hot runner type molding die. An in-mold flow path 210 through which the plasticized material flows is formed inside the fixed die 201. The plasticized material injected into the molding die 200 from the nozzle 23 of the injection unit 20 reaches the cavity Cv via the in-mold flow path 210. The in-mold flow path 210 is formed by a space such as a hole or groove formed in a member constituting the fixed die 201. The plasticized material in the in-mold flow path 210 is heated by a heater provided in the fixed die 201 and maintained in a fluid state. The "hot runner type" is also called a "runnerless type."
[0024] The fixed mold 201 includes a mounting plate 220, a first plate 230, a second plate 240, two probes 250, and a heat insulating member 260. The mounting plate 220 is located at a position closest to the injection unit 20 among the members of the fixed mold 201. The first plate 230 and the second plate 240 are located between the movable mold 202 and the mounting plate 220 in the mold clamping direction. The first plate 230 is located between the second plate 240 and the mounting plate 220 in the mold clamping direction. The second plate 240 is located between the movable mold 202 and the first plate 230 in the mold clamping direction. The mounting plate 220, the first plate 230, and the second plate 240 are fixed to one another by screws or the like (not shown).
[0025] A sprue bushing 221 is attached to the mounting plate 220. A sprue 222 extending along the Y direction is formed within the sprue bushing 221. The sprue 222 forms the inlet end of the in-mold flow path 210. The -Y direction end of the sprue 222 corresponds to the start end of the in-mold flow path 210. The +Y direction end of the sprue 222 is connected to a manifold flow path 232 within a manifold 231, which will be described later. The tip of the nozzle 23 of the injection unit 20 comes into contact with the -Y direction end of the sprue 222.
[0026] The first plate 230 is provided with a manifold 231. The manifold 231 is disposed on the +Y direction side of the sprue bushing 221. A manifold channel 232 is formed within the manifold 231. As described above, the beginning end of the manifold channel 232 is connected to the sprue 222. The manifold channel 232 forms part of the in-mold channel 210 and functions as a channel that distributes the plasticized material that flows from the nozzle 23 into the casting mold 200 to each probe 250. The manifold channel 232 branches into two channels extending in different directions within the manifold 231. Each of the branched channels is connected to a probe channel 251 within each probe 250, which will be described later. The plasticized material within the manifold channel 232 is heated by a cartridge heater 233 inserted into the manifold 231. The cartridge heater 233 heats the manifold 231, thereby maintaining the plasticized material within the manifold channel 232 in a molten state. The temperature of the cartridge heater 233 is controlled by the control unit 40. The control unit 40 sets the temperature of the cartridge heater 233 to 400°C, for example.
[0027] The first plate 230 has a first through-hole 234 that is a hole that penetrates the first plate 230 in the mold clamping direction. A part of the probe 250 is disposed inside the first through-hole 234. In this embodiment, the first plate 230 is made of SUS304. However, the first plate 230 may be made of metal other than SUS304, ceramic, or the like. In this specification, the first plate 230 is also referred to as a spacer.
[0028] Refrigerant pipes 235 through which a refrigerant flows are embedded in the first plate 230. The refrigerant pipes 235 are connected to a refrigerant pump (not shown) that supplies the refrigerant to the refrigerant pipes 235. As the refrigerant, for example, a liquid such as water or oil, or a gas such as carbon dioxide can be used. The temperature of the refrigerant flowing through the refrigerant pipes 235 is controlled by the control unit 40. The control unit 40 sets the temperature of the refrigerant flowing through the refrigerant pipes 235 to 50°C, for example. The first plate 230 is cooled by the refrigerant flowing through the refrigerant pipes 235. Therefore, heat from the manifold 231 is transferred to the second plate 240, and it is possible to prevent the temperature of the second plate 240 from becoming too high.
[0029] The second plate 240 has a second through-hole 241 that penetrates the second plate 240 in the mold clamping direction. The second through-hole 241 is formed to communicate with the first through-hole 234 of the first plate 230. A portion of the probe 250 is disposed inside the second through-hole 241. In this embodiment, the second plate 240 is formed of carbon steel. However, the second plate 240 may be formed of a metal other than carbon steel, ceramic, or the like. The second plate 240 is preferably formed of a material with a higher thermal conductivity than the first plate 230. The second plate 240 is provided with a second plate heater 242 that heats the second plate 240. The temperature of the second plate heater 242 is controlled by the control unit 40. The control unit 40 controls the temperature of the second plate heater 242 to be lower than the temperature of the cartridge heater 233. The control unit 40 sets the temperature of the second plate heater 242 to 200°C, for example. The second plate 240 is also referred to herein as a cavity plate.
[0030] The probe 250 injects the plasticized material toward the cavity Cv formed by the fixed mold 201 and the movable mold 202. The probe 250 is configured as an open-gate hot runner nozzle. In this embodiment, the probe 250 is made of iron. Note that the probe 250 may be made of a metal other than iron. As described above, the probe 250 is disposed inside the first through hole 234 and the second through hole 241. In other words, the probe 250 is inserted into the first through hole 234 and the second through hole 241. A probe channel 251 extending along the Y direction is formed within the probe 250. The probe channel 251 forms the outlet end of the in-mold channel 210. The −Y direction end of the probe channel 251 is connected to the manifold channel 232 as described above. Note that the probe 250 may also be configured as a valve-gate hot runner nozzle.
[0031] In this embodiment, as shown in FIG. 6 , the fixed mold 201 has two probes 250, two first through holes 234, and two second through holes 241. One probe 250 is disposed inside one first through hole 234 and one second through hole 241. The probes 250, the first through holes 234, and the second through holes 241 have the same structure. Note that in other embodiments, the fixed mold 201 may have one probe 250, or three or more probes 250. In this case, the first plate 230 has the same number of first through holes 234 as the number of probes 250, and the second plate 240 has the same number of second through holes 241 as the number of probes 250.
[0032] The heat insulating member 260 is provided between the second plate 240 and the first plate 230 in the mold clamping direction, and suppresses heat transfer between the second plate 240 and the first plate 230. The heat insulating member 260 is made of, for example, glass fiber or ceramic.
[0033] 7 is an explanatory diagram showing an enlarged view of a partial area AR of FIG. 6. As described above, the probe 250 is disposed in the first through hole 234 and the second through hole 241. A first space 236 is formed between the outer peripheral surface of the probe 250 and the inner wall surface of the first through hole 234. A second space 246 is formed between the outer peripheral surface of the probe 250 and the inner wall surface of the second through hole 241. The probe 250 has a probe heater 252. The probe heater 252 is provided within the probe 250 so as to surround the probe flow path 251. The probe heater 252 heats the probe 250, thereby maintaining the plasticized material in the probe flow path 251 in a molten state.
[0034] The fixed mold 201 further includes a partitioning member 270. The partitioning member 270 is disposed within the first through-hole 234 or the second through-hole 241 so as to surround the probe 250 and partition the first space 236 and the second space 246. The partitioning member 270 includes a first member 271 and a second member 276. The first member 271 and the second member 276 are annular. The second member 276 is composed of a pair of annular members. Hereinafter, the second member 276 disposed on the -Y direction side will also be referred to as the upstream second member 276a, and the second member 276 disposed on the +Y direction side will also be referred to as the downstream second member 276b. The first member 271 is sandwiched between the second members 276 in the direction along the first through-hole 234 and the second through-hole 241. In this embodiment, the direction along the first through hole 234 and the second through hole 241 is the Y direction. In other words, the first member 271 is sandwiched between the upstream second member 276a and the downstream second member 276b. In this embodiment, the first member 271 is disposed within the first through hole 234, the upstream second member 276a is disposed within the first through hole 234, and the downstream second member 276b is disposed within the first through hole 234 and the second through hole 241.
[0035] The thermal conductivity of the second member 276 is lower than that of the first member 271. The thermal expansion coefficient of the second member 276 is also lower than that of the probe 250 and the first member 271. It is preferable that the thermal expansion coefficient of the probe 250 and that of the first member 271 are approximately the same. In this embodiment, the first member 271 is made of SUS304, and the second member 276 is made of zirconia. The first member 271 and the second member 276 may be made of materials whose thermal conductivity and thermal expansion coefficient satisfy the above-mentioned relationship. The first member 271 may be made of a metal or ceramic other than SUS304, and the second member 276 may be made of a metal or ceramic other than zirconia. It is preferable that the second member 276 be made of a high-strength material.
[0036] The first member 271 has a fourth through hole 272 that is a hole that penetrates the first member 271 in the Y direction. The second member 276 has a third through hole 277 that is a hole that penetrates the second member 276 in the Y direction. The first member 271 is disposed within the first through hole 234 such that the probe 250 is located within the fourth through hole 272. The second member 276 is disposed within the first through hole 234 and the second through hole 241 such that the probe 250 is located within the third through hole 277. In other words, the first member 271 and the second member 276 surround the probe 250. The outer peripheral surface of the probe 250 and the inner wall surface of the fourth through hole 272 are in contact with each other. A space is formed between the outer peripheral surface of the probe 250 and the inner wall surface of the third through hole 277.
[0037] The outer diameter of the second member 276 is larger than the outer diameter of the first member 271. A third space 273 is formed between the outer peripheral surface of the first member 271 and the inner wall surface of the first through hole 234. That is, the first member 271 does not contact the first plate 230. The outer peripheral surface of the second member 276 contacts the inner wall surface of the first through hole 234 and the inner wall surface of the second through hole 241. Specifically, the outer peripheral surface of the upstream second member 276a contacts the inner wall surface of the first through hole 234, and the outer peripheral surface of the downstream second member 276b contacts the inner wall surface of the first through hole 234 and the inner wall surface of the second through hole 241. That is, the second member 276 contacts the first plate 230 and the second plate 240.
[0038] FIG. 8 is a diagram showing the state in which the second space 246 has been filled with the plasticizing material MR. In the injection molding apparatus 10, before injecting the plasticizing material MR into the cavity Cv to form a molded product, the plasticizing material MR is filled into the space formed between the probe 250 and the through-hole of the fixed mold 201 into which the probe 250 is inserted. In other words, after the space has been filled with the plasticizing material MR, the plasticizing material MR is injected into the cavity Cv. The molded product is removed from the molding die 200 after the plasticizing material MR filled into the space has solidified. In this specification, the plasticizing material MR filled and solidified in the space formed between the probe 250 and the through-hole of the fixed mold 201 into which the probe 250 is inserted is referred to as a resin cap. 8, the first space 236 and the second space 246 are separated by the separating member 270, so that the plasticizable material MR is filled in the second space 246 but not in the first space 236. Therefore, a resin cap is formed in the second space 246 but not in the first space 236.
[0039] According to the first embodiment described above, the partition member 270 partitions the first space 236 formed between the outer peripheral surface of the probe 250 and the inner wall surface of the first through hole 234, and the second space 246 formed between the outer peripheral surface of the probe 250 and the inner wall surface of the second through hole 241. Therefore, when filling the space between the probe 250 and the through hole of the fixed mold 201 into which the probe 250 is inserted with plasticizing material, the plasticizing material is filled in the second space 246, but not in the first space 236. Therefore, since no resin cap is formed in the first space 236, the resin cap can be removed from the fixed mold 201 simply by removing the resin cap formed in the second space 246. In this way, the resin cap can be easily removed from the fixed mold 201.
[0040] Furthermore, in this embodiment, the thermal conductivity of the second member 276 is lower than the thermal conductivity of the first member 271. Furthermore, the first member 271 is sandwiched between the second members 276 in the direction along the first through-hole 234 and the second through-hole 241. Therefore, it is possible to prevent the heat of the probe 250 from being transferred to the first plate 230 or the second plate 240 via the first member 271.
[0041] In addition, in this embodiment, a third space 273 is formed between the outer peripheral surface of the first member 271 and the outer peripheral surface of the first through hole 234. Therefore, it is possible to suppress the heat of the probe 250 from being transmitted to the first plate 230 via the first member 271.
[0042] Furthermore, in this embodiment, a space is formed between the outer peripheral surface of the probe 250 and the inner wall surface of the third through-hole 277. Therefore, when the probe 250 thermally expands, the possibility that the probe 250 and the second member 276 will come into contact with each other and cause damage to the probe 250 or the second member 276 can be reduced.
[0043] Furthermore, in this embodiment, the thermal expansion coefficient of the second member 276 is smaller than the thermal expansion coefficients of the probe 250 and the first member 271. This makes it possible to suppress expansion of the entire partition member 270. Furthermore, if the thermal expansion coefficients of the probe 250 and the first member 271 are approximately the same, it is possible to suppress the generation of a gap between the outer peripheral surface of the probe 250 and the inner wall surface of the fourth through hole 272 when the probe 250 and the first member 271 thermally expand.
[0044] Furthermore, in this embodiment, the injection molding apparatus 10 includes a heat insulating member 260 between the first plate 230 and the second plate 240. Therefore, heat transfer between the first plate 230 and the second plate 240 can be suppressed.
[0045] B. Other Embodiments: (B-1) In the above embodiment, the first member 271 is disposed within the first through hole 234, the upstream second member 276a is disposed within the first through hole 234, and the downstream second member 276b is disposed within the first through hole 234 and the second through hole 241. In contrast to this, the first member 271 may be disposed within the first through hole 234 and the second through hole 241, the upstream second member 276a is disposed within the first through hole 234, and the downstream second member 276b is disposed within the second through hole 241. In this case, a third space 273 is formed between the outer peripheral surface of the first member 271 and the inner wall surfaces of the first through hole 234 and the second through hole 241.
[0046] (B-2) In the above embodiment, the first member 271 is disposed within the first through hole 234, the upstream second member 276a is disposed within the first through hole 234, and the downstream second member 276b is disposed within the first through hole 234 and the second through hole 241. In contrast, the first member 271 may be disposed within the second through hole 241, the upstream second member 276a may be disposed within the first through hole 234 and the second through hole 241, and the downstream second member 276b may be disposed within the second through hole 241. In this case, a third space 273 is formed between the outer peripheral surface of the first member 271 and the inner wall surface of the second through hole 241.
[0047] (B-3) In the above embodiment, the first member 271 is disposed within the first through hole 234, the upstream second member 276a is disposed within the first through hole 234, and the downstream second member 276b is disposed within the first through hole 234 and the second through hole 241. In contrast to this, the entire partition member 270 may be disposed within the first through hole 234.
[0048] (B-4) In the above embodiment, the first member 271 is disposed within the first through hole 234, the upstream second member 276a is disposed within the first through hole 234, and the downstream second member 276b is disposed within the first through hole 234 and the second through hole 241. In contrast to this, the entire partition member 270 may be disposed within the second through hole 241.
[0049] (B-5) In the above embodiment, the partitioning member 270 has the first member 271 and the second member 276. However, the partitioning member 270 may be made up of a single member.
[0050] (B-6) In the above embodiment, the thermal conductivity of the second member 276 is lower than the thermal conductivity of the first member 271. In contrast to this, the thermal conductivity of the second member 276 may be higher than the thermal conductivity of the first member 271.
[0051] (B-7) In the above embodiment, the third space 273 is formed between the outer peripheral surface of the first member 271 and the inner wall surface of the first through hole 234 or the second through hole 241. In contrast to this, the third space 273 does not have to be formed between the outer peripheral surface of the first member 271 and the inner wall surface of the first through hole 234 or the second through hole 241. In other words, the first member 271 and the first plate 230 or the second plate 240 may be in contact with each other.
[0052] (B-8) In the above embodiment, the first member 271 and the second member 276 are annular in shape. However, the first member 271 and the second member 276 do not have to be annular in shape. For example, the first member 271 may be a rectangular parallelepiped having the fourth through-hole 272, and the second member 276 may be a rectangular parallelepiped having the third through-hole 277.
[0053] (B-9) In the above embodiment, a space is formed between the outer peripheral surface of the probe 250 and the inner wall surface of the third through hole 277. In contrast, a space does not have to be formed between the outer peripheral surface of the probe 250 and the inner wall surface of the third through hole 277. In other words, the outer peripheral surface of the probe 250 and the second member 276 may be in contact with each other.
[0054] (B-10) In the above embodiment, the thermal expansion coefficient of the second member 276 is smaller than the thermal expansion coefficients of the probe 250 and the first member 271. In contrast, the thermal expansion coefficient of the second member 276 may be larger than the thermal expansion coefficients of the probe 250 or the first member 271.
[0055] (B-11) In the above embodiment, the fixed mold 201 includes the heat insulating member 260. However, the fixed mold 201 does not necessarily need to include the heat insulating member 260.
[0056] C. Other forms: The present disclosure is not limited to the above-described embodiments and can be realized in various forms without departing from the spirit thereof. For example, the present disclosure can also be realized in the following forms. The technical features in the above embodiments corresponding to the technical features in each form described below can be appropriately replaced or combined to solve some or all of the problems of the present disclosure or to achieve some or all of the effects of the present disclosure. Furthermore, if a technical feature is not described as essential in this specification, it can be appropriately deleted.
[0057] (1) According to a first aspect of the present disclosure, there is provided an injection molding apparatus comprising: a molding die having a fixed die and a movable die; a probe having a probe flow path through which a plasticizable material flows and configured to inject the plasticizable material toward a cavity formed by the fixed die and the movable die; and a partitioning member, wherein the fixed die has a first plate having a first through hole and a second plate positioned between the first plate and the movable die and having a second through hole communicating with the first through hole, the probe is disposed within the first through hole and the second through hole, a first space is formed between an outer peripheral surface of the probe and an inner wall surface of the first through hole, and a second space is formed between an outer peripheral surface of the probe and an inner wall surface of the second through hole, and the partitioning member is disposed within the first through hole or the second through hole to surround the probe and partition the first space from the second space. According to this embodiment, since no resin cap is formed in the first space, the resin cap can be easily removed from the fixed mold.
[0058] (2) In the above embodiment, the partition member may have a first member and a second member, and the first member may be sandwiched between the second member in a direction along the first through hole and the second through hole.
[0059] (3) In the above embodiment, the thermal conductivity of the second member may be lower than the thermal conductivity of the first member. According to this embodiment, it is possible to prevent heat from the probe from being transferred to the first plate or the second plate via the first member.
[0060] (4) In the above embodiment, the first member and the second member may be annular in shape surrounding the probe, the outer diameter of the second member may be larger than the outer diameter of the first member, and a third space may be formed between the outer peripheral surface of the first member and the inner wall surface of the first through hole or the second through hole. According to this embodiment, it is possible to prevent heat from the probe from being transferred to the first plate or the second plate via the first member.
[0061] (5) In the above embodiment, the second member may have a third through hole, the probe may be disposed within the third through hole, and a space may be formed between the outer surface of the probe and the inner wall surface of the third through hole. According to this embodiment, when the probe undergoes thermal expansion, it is possible to reduce the possibility that the probe and the second member will come into contact with each other and break the probe or the second member.
[0062] (6) In the above aspect, the second member may have a smaller coefficient of thermal expansion than the probe and the first member. According to this configuration, the partition member as a whole can be prevented from expanding.
[0063] (7) In the above embodiment, a heat insulating member may be provided between the first plate and the second plate. According to this configuration, heat transfer between the first plate and the second plate can be suppressed.
[0064] (8) According to a second aspect of the present disclosure, there is provided an injection molding mold comprising: a fixed mold, a movable mold, a probe having a probe flow path through which a plasticizable material flows and configured to inject the plasticizable material toward a cavity formed by the fixed mold and the movable mold, and a partitioning member, wherein the fixed mold has a first plate having a first through hole and a second plate positioned between the first plate and the movable mold and having a second through hole communicating with the first through hole, the probe is disposed within the first through hole and the second through hole, a first space is formed between an outer peripheral surface of the probe and an inner wall surface of the first through hole, and a second space is formed between an outer peripheral surface of the probe and an inner wall surface of the second through hole, and the partitioning member is disposed within the first through hole or the second through hole to surround the probe and partition the first space from the second space. According to this embodiment, since no resin cap is formed in the first space, the resin cap can be easily removed from the fixed mold. [Explanation of symbols]
[0065] 10...injection molding apparatus, 20...injection unit, 21...plasticizing section, 22...suction delivery section, 23...nozzle, 24...nozzle opening, 30...mold clamping device, 31...mold drive section, 32...ball screw, 40...control section, 50...hopper, 110...flat screw, 111...screw case, 112...drive motor, 119...drive shaft, 121...groove forming surface, 122...center section, 123...groove, 124...material inlet, 125...ridge section, 130...barrel, 131...communicating hole, 132...check valve, 133...opposing surface, 134...guide groove, 140...heater, 151...cylinder, 152...plunger, 153...plunger drive section, 170...flow path, 200...mold, 201...fixed mold, 202...movable mold, 210...in-mold flow path , 220...mounting plate, 221...sprue bushing, 222...sprue, 230...first plate, 231...manifold, 232...manifold flow path, 233...cartridge heater, 234...first through hole, 235...refrigerant piping, 236...first space, 240...second plate, 241...second through hole, 242...second plate heater, 246...second space, 250...probe, 251...probe flow path, 252...probe heater, 260...insulating member, 270...compartment member, 271...first member, 272...fourth through hole, 273...third space, 276...second member, 276a...upstream second member, 276b...downstream second member, 277...third through hole, Cv...cavity, MR...plasticized material, RX...central axis
Claims
1. a molding die having a fixed die and a movable die; a probe having a probe flow path through which a plasticized material flows, the probe injecting the plasticized material toward the cavity formed by the fixed mold and the movable mold; a partition member, The fixed type is a first plate provided with a first through hole; a second plate located between the first plate and the movable die, the second plate having a second through hole communicating with the first through hole; the probe is disposed in the first through-hole and the second through-hole; a first space is formed between an outer peripheral surface of the probe and an inner wall surface of the first through hole; a second space is formed between an outer peripheral surface of the probe and an inner wall surface of the second through hole; the partitioning member is disposed in the first through-hole or the second through-hole so as to surround the probe, and partitions the first space and the second space. Injection molding equipment.
2. 2. The injection molding apparatus according to claim 1, The partition member has a first member and a second member, the first member is sandwiched between the second member in a direction along the first through hole and the second through hole; Injection molding equipment.
3. 3. The injection molding apparatus according to claim 2, The thermal conductivity of the second member is lower than the thermal conductivity of the first member. Injection molding equipment.
4. 3. The injection molding apparatus according to claim 2, the first member and the second member have an annular shape surrounding the probe, The outer diameter of the second member is larger than the outer diameter of the first member, a third space is formed between an outer peripheral surface of the first member and an inner wall surface of the first through hole or the second through hole; Injection molding equipment.
5. 3. The injection molding apparatus according to claim 2, the second member has a third through hole; the probe is disposed in the third through-hole; a space is formed between an outer peripheral surface of the probe and an inner wall surface of the third through hole; Injection molding equipment.
6. 3. The injection molding apparatus according to claim 2, The second member has a coefficient of thermal expansion smaller than the coefficients of thermal expansion of the probe and the first member. Injection molding equipment.
7. 2. The injection molding apparatus according to claim 1, a heat insulating member provided between the first plate and the second plate; Injection molding equipment.
8. Fixed type and Movable type and a probe having a probe flow path through which a plasticized material flows, the probe injecting the plasticized material toward the cavity formed by the fixed mold and the movable mold; a partition member, The fixed type is a first plate provided with a first through hole; a second plate located between the first plate and the movable die, the second plate having a second through hole communicating with the first through hole; the probe is disposed in the first through-hole and the second through-hole; a first space is formed between an outer peripheral surface of the probe and an inner wall surface of the first through hole; a second space is formed between an outer peripheral surface of the probe and an inner wall surface of the second through hole; the partitioning member is disposed in the first through-hole or the second through-hole so as to surround the probe, and partitions the first space and the second space. Mold for injection molding.
Citation Information
Patent Citations
Hot runner device
JP2012020472A