Device unit and construction method of the device unit

Abstract

To provide a device unit and a construction method of the device unit, which are capable of enhancing durability at the time of insertion and extraction of an optical transceiver.SOLUTION: A device unit 1' includes a housing into which an optical transceiver M can be inserted in an insertion direction (arrow A1-A2 direction), a first surface 3A that is provided on a housing and faces a peripheral surface of the optical transceiver, and a second surface 3B that is arranged on an insertion side in an insertion direction with respect to a first surface and is separated from the first surface with respect to the peripheral surface, and comprises a heat sink 3 capable of dissipating heat generated by the optical transceiver via the first surface, a heat conductive sheet 4 in surface contact with the first surface and disposed between the first surface and the peripheral surface, and a protective sheet 5 in surface contact with the second surface and capable of continuously covering the first surface and the second surface in the insertion direction with respect to the peripheral surface and in surface contact with the peripheral surface.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a device unit and a method for constructing a device unit. [Background technology]

[0002] As a device unit of this kind, Patent Document 1 discloses a technique relating to an optical transceiver module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2021-507288 Summary of the Invention [Problem to be solved by the invention]

[0004] The device unit described in Patent Document 1 has a thermally conductive sheet made of a thermal interface material disposed in an optical module insertion portion, and a protective sheet made of a polymer material that covers the thermally conductive sheet. However, in such a device unit, for example, the protective sheet or the heat conductive sheet may come off when inserting or removing the optical module into or from the optical module insertion portion, which may result in poor durability.

[0005] An object of the present disclosure is to provide a device unit and a method for constructing a device unit that solves the above-mentioned problems. [Means for solving the problem]

[0006] A device unit according to one aspect of the present disclosure comprises: a housing into which an optical transceiver can be inserted in an insertion direction; a heat sink provided on the housing and having a first surface facing the peripheral surface of the optical transceiver; and a second surface aligned with the first surface on the insertion side in the insertion direction and spaced apart from the first surface relative to the peripheral surface, the heat sink being capable of dissipating heat generated by the optical transceiver through the first surface; a thermally conductive sheet in face-to-face contact with the first surface and positioned between the first surface and the peripheral surface; and a protective sheet in face-to-face contact with the second surface, continuously covering the first surface and the second surface relative to the peripheral surface in the insertion direction and capable of face-to-face contact with the peripheral surface.

[0007] A method for constructing a device unit according to one aspect of the present disclosure includes: installing an optical transceiver insertion section into which an optical transceiver can be inserted in a heat sink attached to a housing into which the optical transceiver can be inserted in an insertion direction; installing a first surface on the heat sink that faces the circumferential surface of the optical transceiver to be inserted into the optical transceiver insertion section; installing a second surface on the heat sink that is aligned with the first surface on the insertion side in the insertion direction and that is further away from the first surface than the circumferential surface; installing a thermally conductive sheet on the first surface that faces the circumferential surface; and installing a protective sheet on the second surface that covers the thermally conductive sheet installed on the first surface. [Effects of the Invention]

[0008] According to the above aspect, durability when inserting and removing an optical transceiver can be improved. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view of a device unit according to the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a cross-sectional view of a device unit according to the present disclosure. [Figure 4] FIG. 4 is an enlarged view of a portion indicated by reference numeral IV in FIG. [Figure 5] FIG. 2 is a cross-sectional view of a device unit according to the present disclosure. [Figure 6] 1 is a flowchart illustrating steps in a method for constructing a device unit according to the present disclosure. [Figure 7] 1 is a flowchart illustrating steps in a method for constructing a device unit according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] Each embodiment will be described below with reference to the drawings. In all drawings, the same or corresponding components are designated by the same reference numerals, and common descriptions will be omitted.

[0011] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to FIGS. 1 and 2. FIG. FIG. 1 is a perspective view showing a device unit 1 into which an optical transceiver M is inserted and removed, and FIG. 2 is a cross-sectional view taken along line II-II in FIG.

[0012] The device unit 1 according to this embodiment is an optical transceiver module having a housing 2, a heat sink 3, a thermally conductive sheet 4, and a protective sheet 5 as its main components. The housing 2 has an optical transceiver insertion section 10 into which an optical transceiver M can be inserted. An optical transceiver M is inserted into or removed from the optical transceiver insertion section 10 of the housing 2 in the insertion direction indicated by the arrow A1-A2. When the optical transceiver M is inserted into the optical transceiver insertion section 10 of the housing 2, data transfer to an electronic device (not shown) becomes possible.

[0013] The heat sink 3 includes fins 6 and an end portion 7 on the insertion side (A1 side) of the base of the fins 6 in the insertion direction (arrow A1-A2 direction). The heat sink 3 is installed in the housing 2 and dissipates heat from the optical transceiver M inserted into the optical transceiver insertion portion 10 to the outside via the fins 6. Specifically, the heat sink 3 has a first surface 3A and a second surface 3B. The first surface 3A faces the peripheral surface Ma of the optical transceiver M. The first surface 3A is provided at a position corresponding to the fin 6 in the insertion direction. For example, the first surface 3A may be provided directly below the fin 6. The second surface 3B faces the peripheral surface Ma of the optical transceiver M. The second surface 3B is provided at the end portion 7. The second surface 3B is aligned with the first surface 3A on the insertion side in the insertion direction (the direction of arrows A1-A2). The second surface 3B is farther away from the peripheral surface Ma than the first surface 3A.

[0014] Here, the first surface 3A of the heat sink 3 is disposed in a convex shape relative to the second surface 3B of the heat sink 3. The second surface 3B of the heat sink 3 is disposed in a concave shape relative to the first surface 3A. The second surface 3B of the heat sink 3 is disposed so as to surround the entire periphery of the first surface 3A of the heat sink 3.

[0015] The thermally conductive sheet 4 is attached to the first surface 3A of the heat sink 3 so as to be in surface contact with the first surface 3A, and faces the peripheral surface Ma of the optical transceiver M inserted into the optical transceiver insertion portion . In addition, the thermal conduction sheet 4 is formed from a 0.5 mm thick silicone sheet with high thermal conductivity to fill the air gap between the first surface 3A of the heat sink 3 and the peripheral surface Ma of the optical transceiver M and to sufficiently conduct the heat generated by the optical transceiver M to the heat sink 3. Furthermore, this thermally conductive sheet 4 adheres these surfaces together, preventing a decrease in thermal conductivity, regardless of the surface roughness (minute irregularities) or variations in flatness on the metal surfaces of the first surface 3A of the heat sink 3 and the peripheral surface Ma of the optical transceiver M.

[0016] The protective sheet 5 is a sliding sheet that is attached so as to be in surface contact with the second surface 3B of the heat sink 3. The protective sheet 5 continuously covers the first surface 3A and the second surface 3B of the heat sink 3 in the insertion direction (the direction of arrows A1-A2) relative to the peripheral surface Ma of the optical transceiver M. The protective sheet 5 is interposed between the thermally conductive sheet 4 and the peripheral surface Ma of the optical transceiver M inserted into the optical transceiver insertion part 10. The outer surface (the upper surface in the drawing) of the thermally conductive sheet 4 is in surface contact with the peripheral surface Ma of the optical transceiver M inserted into the optical transceiver insertion part 10. Moreover, this protective sheet 5 is made of an ultra-high molecular weight polyethylene material that has excellent abrasion resistance, and is formed to a thickness of about 50 μm so as not to impair heat conduction and sliding performance.

[0017] In such a device unit 1, heat generated by the optical transceiver M inserted into the optical transceiver insertion section 10 is discharged to the outside sequentially through the peripheral surface Ma of the optical transceiver M, the protective sheet 5, the thermal conduction sheet 4, the first surface 3A of the heat sink 3, and the fins 6.

[0018] In the device unit 1 of the above embodiment, a thermally conductive sheet 4 facing the peripheral surface Ma of the optical transceiver M is installed on the first surface 3A of the heat sink 3, and a protective sheet 5 covering the thermally conductive sheet 4 on the first surface 3A is installed on the second surface 3B of the heat sink 3, which is away from the first surface 3A. That is, in the heat sink 3, the protective sheet 5 on the second surface 3B is positioned one step lower outside the optical transceiver insertion section 10 than the thermally conductive sheet 4 on the first surface 3A. As a result, in the device unit 1 of this embodiment, problems such as peeling or damage to the protective sheet 5 and the thermal conduction sheet 4 covered by the protective sheet 5 can be prevented when inserting or removing the optical transceiver M into the optical transceiver insertion section 10, thereby increasing durability when inserting or removing the optical transceiver.

[0019] In other words, in the device unit 1, by configuring the thermal conduction sheet 4 and the protective sheet 5 as described above, the contact thermal resistance value is reduced and sliding properties are ensured, while also ensuring durability in anticipation of actual use. More specifically, it has been confirmed that the device unit 1 has durability such that it will not break or peel off even when inserted and removed an estimated number of times (approximately 50 times) with this structure.

[0020] Furthermore, in the device unit 1 of this embodiment, the second surface 3B of the heat sink 3 is arranged to surround the entire periphery of the first surface 3A of the heat sink 3, so that the protective sheet 5 attached to the second surface 3B can completely cover the thermally conductive sheet 4 on the first surface 3A. This prevents problems such as peeling or damage to the protective sheet 5 and the thermal conductive sheet 4 covered by the protective sheet 5 when inserting or removing the optical transceiver M in the device unit 1, thereby increasing durability when inserting or removing the optical transceiver M.

[0021] Furthermore, in the device unit 1 of this embodiment, the first surface 3A of the heat sink 3 is arranged convexly relative to the second surface 3B of the heat sink 3, so that the thermal conductive sheet 4 on the first surface 3A can be brought into close contact with the peripheral surface Ma of the optical transceiver M inserted into the optical transceiver insertion portion 10. Furthermore, in the device unit 1, the first surface 3A of the heat sink 3 serves as the attachment surface for the thermally conductive sheet 4, thereby preventing malfunctions such as the thermally conductive sheet 4 becoming misaligned when the optical transceiver M is inserted or removed from the optical transceiver insertion section 10.

[0022] In the device unit 1 of this embodiment, the second surface 3B of the heat sink 3 on which the protective sheet 5 is placed is disposed in a concave shape with respect to the first surface 3A. Furthermore, in the device unit 1 of this embodiment, the second surface 3B of the heat sink 3 is the surface to which the protective sheet 5 is attached. This prevents problems such as peeling or damage to the heat conductive sheet 4 covered by the protective sheet 5 when inserting or removing the optical transceiver M in the device unit 1, thereby improving durability when inserting or removing the optical transceiver M.

[0023] Furthermore, in the device unit 1 of this embodiment, the thermally conductive sheet 4 is formed from a high thermal conductivity silicone sheet, and the protective sheet 5 is formed from an ultra-high molecular weight polyethylene sheet, so that the thermally conductive sheet 4 and the protective sheet 5 can be constructed inexpensively using commercially available materials.

[0024] Second Embodiment An embodiment of the present disclosure will be described below with reference to FIGS. FIG. 3 is a cross-sectional view of the device unit 1' taken along the insertion direction (arrow A1-A2 direction) of the optical transceiver M, and FIG. 4 is an enlarged view of the portion indicated by reference numeral IV in FIG.

[0025] The device unit 1' shown in the second embodiment differs from the device unit 1 described in the first embodiment in the configuration of the vicinity of the end 7 of the heat sink 3. That is, as shown in the detailed view of FIG. 4, a chamfered portion 11 is formed in an optical transceiver insertion portion 10 located at an end portion 7 of the heat sink 3 . This chamfered portion 11 is an insertion port 10A for the optical transceiver M, and is formed by chamfering the opening periphery of the heat sink 3 located at the insertion port 10A of the optical transceiver insertion section 10, making it easier to insert and remove the optical transceiver M into the optical transceiver insertion section 10. Moreover, the protective sheet 5 attached to the second surface 3B of the heat sink 3 has its peripheral edge 5A extending up to the chamfered portion 11 of the optical transceiver insertion portion 10.

[0026] In the device unit 1' of the above embodiment, a chamfered portion 11 is formed on the periphery of the opening of the optical transceiver insertion portion 10 located at the end portion 7 of the heat sink 3, and the peripheral portion 5A of the protective sheet 5 attached to the second surface 3B of the heat sink 3 extends onto this chamfered portion 11. As a result, in the device unit 1' of this embodiment, when the optical transceiver M is inserted or removed from the optical transceiver insertion section 10, problems such as peeling or damage to the protective sheet 5 and the thermal conduction sheet 4 covered by the protective sheet 5 can be prevented, and their durability can be improved.

[0027] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to FIG. The device unit 100 according to this embodiment includes a housing 101, a heat sink 102, a thermally conductive sheet 103, and a protective sheet 104 as main components.

[0028] The optical transceiver can be inserted into the housing 101 in the insertion direction (the direction of the arrow A1-A2). The heat sink 102 is provided in the housing 101 and has a first surface 102A facing the peripheral surface a of the optical transceiver, and a second surface 102B aligned with the first surface 102A on the insertion side in the insertion direction (arrow A1-A2 direction) and spaced apart from the peripheral surface than the first surface 102A. The heat sink 102 dissipates heat from the optical transceiver through the first surface 102A.

[0029] The thermally conductive sheet 103 is in surface contact with the first surface 102A of the heat sink 102, and is disposed between the first surface 102A and the peripheral surface of the optical transceiver. The protective sheet 104 is in surface contact with the second surface 102B of the heat sink 102, and continuously covers the first surface 102A and the second surface 102B of the heat sink 102 in the insertion direction (direction of arrow A1-A2) relative to the peripheral surface of the optical transceiver, so that it is able to be in surface contact with the peripheral surface of the optical transceiver.

[0030] In such a device unit 100, heat generated by the optical transceiver inserted into the housing 101 is discharged to the outside sequentially through the peripheral surface of the optical transceiver, the protective sheet 104, the thermal conduction sheet 103, and the first surface 102A of the heat sink 102.

[0031] As described above, in the device unit 100 of this embodiment, a thermally conductive sheet 103 is installed on the first surface 102A of the heat sink 102, and a protective sheet 104 that covers the thermally conductive sheet 103 on the first surface 102A is installed on the second surface 102B of the heat sink 102, which is away from the first surface 102A. That is, in the heat sink 102, the protection sheet 104 on the second surface 102B is positioned one step lower on the outer side of the optical transceiver insertion section 10 than the thermally conductive sheet 103 on the first surface 102A. As a result, in the device unit 100, problems such as peeling or damage to the protective sheet 104 and the thermal conduction sheet 103 covered by the protective sheet 104 can be prevented when inserting or removing an optical transceiver into the optical transceiver insertion section 10, thereby increasing durability when inserting or removing the optical transceiver.

[0032] <Fourth embodiment> An embodiment of the present disclosure will be described below with reference to FIGS. 1, 2, and 6. FIG. FIG. 6 is a flowchart showing the steps of the method for constructing the device unit 1.

[0033] [Step S1] The worker installs the optical transceiver insertion portion 10 into the heat sink 3, into which the optical transceiver M can be inserted.

[0034] [Step S2] The worker places the first surface 3A of the heat sink 3 facing the peripheral surface Ma of the optical transceiver M to be inserted into the optical transceiver insertion portion .

[0035] [Step S3] The worker installs a second surface 3B on the heat sink 3, which is aligned with the first surface 3A in the insertion direction (arrow A1-A2 direction) and has an end 7 on the insertion direction (arrow A1 side) side that is farther away from the first surface 3A than the peripheral surface Ma of the optical transceiver M. Here, the second surface 3B of the heat sink 3 is disposed at a front-rear position along the insertion direction (arrow A1-A2 direction) of the first surface 3A of the heat sink 3, or so as to surround the entire periphery of the first surface 3A.

[0036] [Step S4] The worker places the thermally conductive sheet 4 on the first surface 3A of the heat sink 3 so that the thermally conductive sheet 4 faces the peripheral surface Ma of the optical transceiver M inserted into the optical transceiver insertion portion .

[0037] [Step S5] The worker attaches the protective sheet 5 to the second surface 3B of the heat sink 3 to cover the thermally conductive sheet 4 placed on the first surface 3A.

[0038] [Step S6] The worker places the heat sink 3, to which the thermally conductive sheet 4 and the protective sheet 5 are attached, in the housing 2, thereby completing the construction of the device unit 1.

[0039] As described above, in the method for constructing the device unit 1 of this embodiment, a thermally conductive sheet 4 facing the peripheral surface Ma of the optical transceiver M is installed on the first surface 3A of the heat sink 3, and a protective sheet 5 covering the thermally conductive sheet 4 on the first surface 3A is installed on the second surface 3B of the heat sink 3, which is away from the first surface 3A. As a result, in the heat sink 3 of the device unit 1, the protective sheet 5 on the second surface 3B can be positioned one step lower outside the optical transceiver insertion section 10 than the thermally conductive sheet 4 on the first surface 3A.

[0040] As a result, in the device unit 1, problems such as peeling or damage to the protective sheet 5 and the thermal conduction sheet 4 covered by the protective sheet 5 can be prevented when the optical transceiver M is inserted or removed from the optical transceiver insertion section 10, thereby increasing durability when the optical transceiver is inserted or removed.

[0041] Fifth Embodiment An embodiment according to the present disclosure will be described below with reference to FIG. FIG. 7 is a flowchart showing the steps of the method for constructing the device unit 1.

[0042] [Step S11] An operator places an optical transceiver insertion section into which an optical transceiver can be inserted, on a heat sink attached to a housing into which the optical transceiver can be inserted in an insertion direction.

[0043] [Step S12] The worker places the first surface of the heat sink facing the peripheral surface of the optical transceiver to be inserted into the optical transceiver insertion portion.

[0044] [Step S13] The worker installs a second surface on the heat sink that is aligned with the first surface on the insertion side in the insertion direction and that is spaced apart from the first surface relative to the circumferential surface.

[0045] [Step S14] The worker places a thermally conductive sheet on the first surface of the heat sink so that the thermally conductive sheet faces the peripheral surface of the optical transceiver inserted into the optical transceiver insertion portion.

[0046] [Step S15] The worker places a protective sheet on the second surface of the heat sink to cover the thermally conductive sheet placed on the first surface.

[0047] As described above, in the method for constructing a device unit of this embodiment, a thermally conductive sheet facing the peripheral surface of the optical transceiver is placed on the first surface of the heat sink, and a protective sheet covering the thermally conductive sheet on the first surface is placed on the second surface of the heat sink, away from the first surface. Therefore, in the heat sink of the device unit, the protective sheet on the second surface can be positioned one step lower outside the optical transceiver insertion section than the thermally conductive sheet on the first surface.

[0048] This prevents problems such as peeling or damage to the protective sheet and the thermal conduction sheet covered by the protective sheet when inserting or removing an optical transceiver into the optical transceiver insertion section of the device unit, thereby increasing durability when inserting or removing the optical transceiver.

[0049] (Variation 1) In the above embodiment, a second surface 3B serving as the attachment surface for the protective sheet 5 is provided around the entire periphery of the first surface 3A of the heat sink 3, but this is not limited to this and the second surface 3B may be partially provided on the insertion side (arrow A1 direction side) of the first surface 3A of the heat sink 3 along the insertion direction (arrow A1-A2 direction) and on the opposite side (arrow A2 direction side).

[0050] (Variation 2) In the above embodiment, the protective sheet 5 is attached to the second surface 3B of the heat sink 3, but in addition to this, the protective sheet 5 may also be attached to the thermally conductive sheet 4 placed on the first surface 3A of the heat sink 3.

[0051] (Variation 3) The heat dissipation structure shown in this embodiment, which consists of a heat sink 3 having a first surface 3A and a second surface 3B, a thermally conductive sheet 4, and a protective sheet 5, may be provided around the entire periphery of the optical transceiver insertion section 10, or may be provided only partially around the periphery of the optical transceiver insertion section 10.

[0052] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate.

[0053] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0054] (Appendix 1) a housing into which an optical transceiver can be inserted in an insertion direction; a heat sink provided in the housing, the heat sink having a first surface facing a peripheral surface of the optical transceiver and a second surface aligned with the first surface on the insertion side in the insertion direction and spaced apart from the first surface with respect to the peripheral surface, the heat sink being capable of dissipating heat generated by the optical transceiver through the first surface; a thermally conductive sheet in surface contact with the first surface and disposed between the first surface and the peripheral surface; a protective sheet that is in surface contact with the second surface, continuously covers the first surface and the second surface in the insertion direction relative to the peripheral surface, and is in surface contact with the peripheral surface; A device unit comprising:

[0055] (Appendix 2) 2. The device unit of claim 1, wherein the second surface is arranged to surround the first surface.

[0056] (Appendix 3) 3. The device unit of claim 1, wherein the second surface is disposed concavely relative to the first surface.

[0057] (Appendix 4) 4. The device unit according to any one of claims 1 to 3, wherein the second surface is a surface to which the protective sheet is attached.

[0058] (Appendix 5) 5. The device unit according to any one of claims 1 to 4, wherein the protective sheet is made of an ultra-high molecular weight polyethylene sheet.

[0059] (Appendix 6) 6. The device unit according to any one of claims 1 to 5, wherein the first surface is disposed in a convex shape relative to the second surface.

[0060] (Appendix 7) 7. The device unit according to any one of claims 1 to 6, wherein the first surface is a surface to which the thermally conductive sheet is attached.

[0061] (Appendix 8) a chamfered portion having a chamfered periphery is formed at an insertion port of the heat sink for the optical transceiver, 8. The device unit according to any one of claims 1 to 7, wherein the peripheral edge of the protective sheet extends to the chamfered portion.

[0062] (Appendix 9) an optical transceiver insertion section into which the optical transceiver can be inserted is disposed in a heat sink attached to a housing into which the optical transceiver can be inserted in an insertion direction; a first surface of the heat sink facing a peripheral surface of the optical transceiver to be inserted into the optical transceiver insertion portion; a second surface is provided on the heat sink, the second surface being aligned with the first surface on the insertion side in the insertion direction and being spaced apart from the first surface with respect to the peripheral surface; a heat conductive sheet facing the peripheral surface is provided on the first surface; a protective sheet is provided on the second surface to cover the thermally conductive sheet provided on the first surface; How to build a device unit.

[0063] (Appendix 10) A method for constructing a device unit as described in Appendix 9, wherein the second surface is arranged to surround the first surface.

[0064] (Appendix 11) 11. The method for constructing a device unit according to claim 9 or 10, wherein the second surface is disposed concavely relative to the first surface.

[0065] (Appendix 12) 12. The method for constructing a device unit according to any one of claims 9 to 11, wherein the second surface is a surface to which the protective sheet is attached.

[0066] (Appendix 13) 13. The method for constructing a device unit according to any one of claims 9 to 12, wherein the protective sheet is made of an ultra-high molecular weight polyethylene sheet.

[0067] (Appendix 14) 14. The method for constructing a device unit according to any one of claims 9 to 13, wherein the first surface is disposed in a convex shape relative to the second surface.

[0068] (Appendix 15) 15. The method for constructing a device unit according to any one of claims 9 to 14, wherein the first surface is a surface to which the thermally conductive sheet is attached.

[0069] (Appendix 16) a chamfered portion having a chamfered periphery is formed at an insertion port of the heat sink for the optical transceiver, 16. The method for constructing a device unit according to any one of claims 9 to 15, wherein the peripheral edge of the protective sheet extends to the chamfered portion. [Explanation of symbols]

[0070] 1 Device Unit 1' Device unit 2. Case 3 Heatsink 3A Front page 3B Second side 4. Thermal Conduction Sheet 5 Protective sheet 5A Periphery 6 Fins 7 End 10 Optical transceiver insertion section 10A insertion port 11 Chamfered part 100 device units 101 Case 102 Heat sink 102A Front page 102B Second side 103 Thermal Conduction Sheet 104 Protective Sheet M Optical Transceiver Ma peripheral surface

Claims

1. a housing into which an optical transceiver can be inserted in an insertion direction; a heat sink provided in the housing, the heat sink having a first surface facing a peripheral surface of the optical transceiver and a second surface aligned with the first surface on the insertion side in the insertion direction and spaced apart from the first surface with respect to the peripheral surface, the heat sink being capable of dissipating heat generated by the optical transceiver through the first surface; a thermally conductive sheet in surface contact with the first surface and disposed between the first surface and the peripheral surface; a protective sheet that is in surface contact with the second surface, continuously covers the first surface and the second surface in the insertion direction relative to the peripheral surface, and is in surface contact with the peripheral surface; A device unit comprising:

2. The device unit according to claim 1 , wherein the second surface is disposed so as to surround the first surface.

3. The device unit according to claim 1 or 2, wherein the second surface is disposed concavely relative to the first surface.

4. The device unit according to claim 1 or 2, wherein the second surface is a surface to which the protective sheet is attached.

5. 3. The device unit according to claim 1, wherein the protective sheet is made of an ultra-high molecular weight polyethylene sheet.

6. The device unit according to claim 1 or 2, wherein the first surface is disposed convexly relative to the second surface.

7. The device unit according to claim 1 , wherein the first surface is a surface to which the thermally conductive sheet is attached.

8. a chamfered portion having a chamfered periphery is formed at an insertion port of the heat sink for the optical transceiver, The device unit according to claim 1 or 2, wherein the peripheral edge of the protection sheet extends to the chamfered portion.

9. an optical transceiver insertion section into which the optical transceiver can be inserted is disposed in a heat sink attached to a housing into which the optical transceiver can be inserted in an insertion direction; a first surface of the heat sink facing a peripheral surface of the optical transceiver to be inserted into the optical transceiver insertion portion; a second surface is provided on the heat sink, the second surface being aligned with the first surface on the insertion side in the insertion direction and being spaced apart from the first surface with respect to the peripheral surface; a heat conductive sheet facing the peripheral surface is provided on the first surface; a protective sheet is provided on the second surface to cover the thermally conductive sheet provided on the first surface; How to build a device unit.

10. The method for constructing a device unit according to claim 9 , wherein the second surface is disposed so as to surround the first surface.

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