Apparatus and method for locking probe card

Abstract

To provide an apparatus and method for locking a probe card.SOLUTION: An apparatus for locking a probe card according to some embodiments may comprise a test head including one or more test boards, a probe card, a base unit disposed between the test head and the probe card and coupled to each of the test head and the probe card, including a plurality of balance adjustment assemblies and a plurality of sensors measuring a plurality of displacement values of a plurality of points of the probe card and a controller determining whether the probe card is in an equilibrium state, based on the plurality of displacement values measured from the plurality of sensors, and controlling the probe card to be in an equilibrium state by adjusting a length of at least one of the plurality of balance adjustment assemblies when it is determined that the probe card is out of the equilibrium state.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an apparatus and method for securing a probe card utilized to test a device under test. [Background technology]

[0002] A probe card can be used to test semiconductor devices. The probe card contacts a device under test (DUT) on a wafer. Test signals are transmitted to the DUT via the probe card, and the quality of the DUT is determined by analyzing the response signal from the DUT.

[0003] However, when the probe card contacts the wafer, a fairly large load may be applied to the probe card.

[0004] FIG. 1 is a diagram showing a test system, and FIG. 2 is a diagram showing a state in which a probe card 50 is in contact with a wafer 60. As shown in FIG.

[0005] As shown in FIGS. 1 and 2, the test system uses a tester 10, a cable 20, a test head 30, a base unit 40, and a probe card 50 to test a device under test.

[0006] After the bottom surface of the probe card 50 contacts the top surface of the wafer 60, a test signal generated by the tester 10 can be applied to a device under test (DUT) on the wafer 60 via the cable 20, a board in the test head 30, and the probe card 50.

[0007] However, when the wafer 60 comes into contact with the probe card 50, a considerable load may be generated. For example, a load of approximately 200 kg or more may be generated. Furthermore, when the probe card 50 repeatedly comes into contact with the wafer 60, the contact state between the probe card 50 and the wafer 60 may become unstable. For example, when the probe card 50 repeatedly comes into contact with the wafer 60, the load may cause the probe card 50 to tilt, which may cause the alignment between the probe card 50 and the wafer 60 to shift.

[0008] If the probe card 50 is tilted (i.e., not in a balanced state), the load of the wafer 60 may not be distributed but may be concentrated in a specific area, which may result in improper testing of the devices under test included in the wafer 60.

[0009] Therefore, there is an increasing demand for a technique that can stably bring the probe card 50 into contact with the wafer 60. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Korean Patent Publication No. 10-2023-0143361 (October 12, 2023) Summary of the Invention [Problem to be solved by the invention]

[0011] The technical problem that some embodiments of the present disclosure aim to solve is to provide a probe card fixing device and method that can maintain a balanced state between the probe card and the wafer and stably connect the probe card to the wafer.

[0012] Another technical problem that some embodiments of the present disclosure aim to solve is to provide a probe card fixing device for uniformly distributing the load applied to a wafer when the probe card contacts the wafer.

[0013] The technical problems of the present disclosure are not limited to the technical problems described above, and other technical problems not mentioned will be clearly understood by a person of ordinary skill in the technical field of the present disclosure from the following description. [Means for solving the problem]

[0014] A probe card fixing device according to one embodiment of the present disclosure for solving the above technical problems may include a test head including one or more test boards, a probe card, a base unit arranged between the test head and the probe card and coupled to each of the test head and the probe card, and including a plurality of balance adjustment assemblies and a plurality of sensors for measuring displacement values ​​at a plurality of points on the probe card, and a control unit that determines whether the probe card is in a balanced state based on a plurality of displacement values ​​measured from the plurality of sensors, and if it is determined that the probe card is out of balance, controls the length of at least one of the plurality of balance adjustment assemblies to bring the probe card into a balanced state.

[0015] In addition, when the probe card deviates from the equilibrium state, the control unit can determine a target balance adjustment assembly among the multiple balance adjustment assemblies to be subjected to length adjustment based on the deviation or difference of the multiple displacement values, and adjust the length of the determined target balance adjustment assembly.

[0016] The control unit may also determine a contraction length or extension length of the determined target balance adjustment assembly based on the deviation or difference between the multiple displacement values, and adjust the length of the determined target balance adjustment assembly based on the determined contraction length or extension length.

[0017] The control unit may also determine the rotation direction and rotation speed of the motor based on the deviation or difference of the multiple displacement values, and control the motor included in the determined target balance adjustment assembly based on the determined rotation direction and rotation speed to adjust the length of the target balance adjustment assembly.

[0018] The base unit may further include a central clamp and an inclined block formed on an upper portion of the central clamp, the inclined block enabling one end of each of the plurality of balance adjustment assemblies to be moved up and down.

[0019] Each of the plurality of balance adjustment assemblies may include a motor, a length adjustment member connected to one end of the motor and adapted to lengthen in the direction of the tilt block or shorten in the direction opposite to the tilt block as the motor rotates, and a lifting member that moves up the tilt block when the length adjustment member lengthens and moves down from the tilt block when the length adjustment member shortens.

[0020] Furthermore, when the lifting member moves up the inclined block, the lifting member lowers a first point on the inclined block, and a second point on the probe card corresponding to the first point is lowered; when the lifting member moves down the inclined block, the lifting member raises a third point on the inclined block, and a fourth point on the probe card corresponding to the third point is raised.

[0021] The plurality of sensors may also be sensors that measure distances between a plurality of points on the probe card.

[0022] The control unit may also determine that the probe card is in a balanced state when the deviation or difference between the plurality of displacement values ​​falls within a predetermined range.

[0023] A probe card alignment method performed by at least one processor according to one embodiment of the present disclosure to solve the technical problem may include a step of determining whether the probe card is in a balanced state based on multiple displacement values ​​measured from multiple sensors, and if it is determined that the probe card is out of balance, a step of determining a target balance adjustment assembly to be subjected to length adjustment among multiple balance adjustment assemblies based on the deviation or difference of the multiple displacement values, and a step of adjusting the length of the determined target balance adjustment assembly so that the probe card is in a balanced state.

[0024] Furthermore, the probe card alignment method may further include, before the step of determining whether the probe card is in a balanced state, the steps of docking the probe card to a base unit coupled to a test head, controlling a plurality of motors included in the plurality of balance adjustment assemblies based on predetermined values, and setting displacement values ​​of each of the plurality of sensors to initial values.

[0025] Furthermore, the probe card alignment method further includes a step of activating one or more probe card locking modules to fix the probe card to the base unit after the step of controlling the plurality of motors based on predetermined values, and the step of setting the displacement values ​​of each of the plurality of sensors to an initial value is performed after the step of controlling one or more probe card locking modules to be in a locked state.

[0026] Furthermore, the step of determining the target balancing assembly may include a step of determining a contracted length or an extended length of the determined target balancing assembly based on the deviation or difference of the plurality of displacement values, and the step of adjusting the length of the determined target balancing assembly may include a step of adjusting the length of the determined target balancing assembly based on the determined contracted length or extended length.

[0027] Furthermore, the step of determining the target balance adjustment assembly may include a step of determining a rotation direction and a rotation speed of a motor based on the deviation or difference of the plurality of displacement values, and the step of adjusting the length of the determined target balance adjustment assembly may include a step of controlling a motor included in the determined target balance adjustment assembly based on the determined rotation direction and the rotation speed to adjust the length of the target balance adjustment assembly.

[0028] Furthermore, the step of determining whether the probe card is in a balanced state may include the step of determining that the probe card is in a balanced state if the deviation or difference between the plurality of displacement values ​​is within a predetermined range.

[0029] Furthermore, the probe card alignment method may further include, before the step of determining whether the probe card is in a balanced state, the step of generating a contact force on one side of the probe card and the step of acquiring the plurality of displacement values ​​using the plurality of sensors.

[0030] Also, generating a contact force on one surface of the probe card may include contacting the one surface of the probe card with a wafer.

[0031] A control device according to one embodiment of the present disclosure for solving the technical problem includes one or more processors and a memory for storing a computer program executed by the one or more processors, and the computer program may include instructions for performing the following operations: determining whether a probe card is in a balanced state based on a plurality of displacement values ​​measured from a plurality of sensors; if it is determined that the probe card is out of balance, determining a target balance adjustment assembly among a plurality of balance adjustment assemblies to be subjected to length adjustment based on the deviation or difference of the plurality of displacement values; and adjusting the length of the determined target balance adjustment assembly so that the probe card is in a balanced state. [Brief explanation of the drawings]

[0032] [Figure 1] FIG. 1 illustrates a test system. [Figure 2] FIG. 10 is a diagram showing a state in which the probe card is in contact with the wafer. [Figure 3] FIG. 1 is a cross-sectional view of a probe card fixture according to one embodiment of the present disclosure. [Figure 4] FIG. 10 is a close-up cross-sectional view of an alignment module according to one embodiment of the present disclosure. [Figure 5] FIG. 1 is a plan view of an alignment module according to one embodiment of the present disclosure. [Figure 6] FIG. 1 illustrates an example of a location where sensors are installed according to one embodiment of the present disclosure. [Figure 7] 1 is a flowchart illustrating a probe card alignment method according to an embodiment of the present disclosure. [Figure 8] FIG. 2 is a hardware configuration diagram of a control device according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0033] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Advantages and features of the present disclosure, as well as methods for achieving them, will become clearer with reference to the following embodiments in detail with the accompanying drawings. However, the technical idea of ​​the present disclosure is not limited to the following embodiments and can be realized in various different forms. The following embodiments are provided merely to complete the technical idea of ​​the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art to which the present disclosure pertains, and the technical idea of ​​the present disclosure is defined only by the scope of the claims.

[0034] When assigning reference numerals to components in each drawing, it should be noted that the same components are assigned the same numerals as much as possible even when they appear in other drawings. Furthermore, when describing the present disclosure, if a detailed description of related publicly known configurations or functions is deemed to obscure the gist of the present disclosure, the detailed description thereof will be omitted.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in the sense commonly understood by a person of ordinary skill in the art to which this disclosure belongs. Furthermore, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless otherwise defined. The terms used herein are intended to describe the embodiments and are not intended to limit the present disclosure. In this specification, the singular form includes the plural form unless otherwise specified in the context.

[0036] Furthermore, terms such as first, second, A, B, (a), and (b) are used to describe components of the present disclosure. These terms are merely used to distinguish a component from other components, and do not limit the nature, order, or sequence of the components. When a component is described as being "coupled," "coupled," or "connected" to another component, it should be understood that the component may be directly coupled or connected to the other component, but that other components may also be "coupled," "coupled," or "connected" between each component.

[0037] As used in the specification, "comprises" and / or "comprising" specify the presence of stated components, steps, operations and / or elements, but do not exclude the presence or addition of one or more other components, steps, operations and / or elements.

[0038] In the embodiments of the present disclosure, "alignment" with respect to a probe card means that the probe card is in a "balanced" state. That is, aligning a probe card means that the probe card is in a balanced state.

[0039] Hereinafter, several embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0040] FIG. 3 is a cross-sectional view of a probe card fixture 100 according to one embodiment of the present disclosure.

[0041] As shown in FIG. 3, the probe card fixture 100 may include a test head 110 and a base unit 120 .

[0042] The test head 110 may include a base unit support member 111, a frame 112, a plurality of test boards 113, and a lock module 114. The test head 110 is electrically connected to the main body of the device and may transmit a response signal to the main body of the device that responds to the response signal from a device under test (DUT) included in a wafer (not shown). Here, the main body of the device may be a tester that transmits a test signal to the DUT and determines whether the DUT is good or bad based on the response signal in response to the test signal.

[0043] Frame 112 is formed on one or more sides of test head 110 and serves to house and protect test board 113 .

[0044] The test board 113 has a rectangular shape, and a plurality of test boards can be attached to the test head 110. The test board 113 can generate electrical signals for testing the device under test.

[0045] The locking module 114 securely couples the test head 110 to the base unit 120 .

[0046] In an embodiment of the present invention, test head 110 may include a base unit support member 111 that is located in a central region of test head 110 and serves a central frame function.

[0047] The base unit support member 111 can compensate for the flexure of the base unit 120. More specifically, the locking modules 114 are located in the regions on both sides, and the test head 110 and the base unit 120 can be coupled together by the coupling force of the locking modules 114. However, because the locking modules 114 are located in the regions on both sides, the center region of the base unit 120 becomes weak, which can cause flexure, which can degrade the test quality when testing the devices under test included in the wafer.

[0048] In order to compensate for the weakening of the central region of the base unit 120, the base unit support member 111 is arranged in the central region of the test head 110 and is tightly coupled to the upper end of the base frame 121 of the base unit 120, so as to support the central region of the base unit 120.

[0049] The base unit 120 may include a base frame 121, an alignment module 122, a tilt block 123, a center clamp 124, a plurality of floating units 125a and 125b, a plurality of card lock modules 126a and 126b, and a plurality of sensors 127a to 127d.

[0050] The probe card 130 may include a reinforcing member 131 and a PCB (Printed Circuit Board) 132. Although not shown in the drawings, the probe card 130 may include a plurality of pins formed on the underside of the PCB 132 for contacting devices under test on the wafer. The probe card 130 may also include a coupling member (not shown) coupled to the plurality of card lock modules 126 a and 126 b.

[0051] The PCB 132 forms a circuit for testing the device under test, and the reinforcing member 131 is placed on the top surface of the PCB 132 to protect the PCB 132 from external impacts and the like.

[0052] According to an embodiment, the alignment module 122 may be coupled to a lower portion of the base frame 121. According to an embodiment, at least one of the balance adjustment assemblies 210a-210d included in the alignment module 122 may be fixed after moving the inclined surface of the tilt block 123 a predetermined distance so that the probe card 130 is aligned. The moving distance and moving direction of each of the balance adjustment assemblies 210a-210d are determined by a controller (not shown). Here, the controller may include a processor and may be included in the probe card fixing device 100.

[0053] A plurality of floating units 125a and 125b are arranged on the base unit 120. The floating units 125a and 125b may be provided with springs inside so that they can float in the X, Y, and Z directions.

[0054] The central clamp 124 is disposed between the alignment module 122 and the card locking modules 126a and 126b.

[0055] A tilt block 123 having a predetermined size and tilt is formed in the central region of the central clamp 124. The tilt may be formed in a predetermined direction and angle. According to one embodiment, the tilt block 123 has tilts formed in multiple directions, the number of which is equal to the number of balance adjustment assemblies 210a-210d. For example, if there are four balance adjustment assemblies 210a-210d, the tilt block 123 may have tilts formed in four directions.

[0056] FIG. 4 is a close-up cross-sectional view of alignment module 122 according to one embodiment of the present disclosure.

[0057] FIG. 5 is a top view of alignment module 122 according to one embodiment of the present disclosure.

[0058] 4 and 5, the alignment module 122 may include multiple balancing assemblies 210a-210d. As shown in FIG. 5, four balancing assemblies 210a-210d may be included in the alignment module 122. The balancing assemblies 210a-210d may extend in different directions. For example, the first balancing assembly 210a may extend in an azimuth direction of 90 degrees, the second balancing assembly 210b may extend in an azimuth direction of 180 degrees, the third balancing assembly 210c may extend in an azimuth direction of 270 degrees, and the fourth balancing assembly 210d may extend in an azimuth direction of 360 degrees.

[0059] As shown in FIG. 4 , the multiple balancing assemblies 210a, 210b may include motors 212a, 212b, length adjustment members 214a, 214b, and lifting members 216a, 216b. Here, the motors 212a, 212b may be servo motors. The length adjustment members 214a, 214b may be configured to shorten when the motors 212a, 212b rotate clockwise and to lengthen when the motors 212a, 212b rotate counterclockwise. In some embodiments, the length adjustment members 214a, 214b may be configured to shorten when the motors 212a, 212b rotate counterclockwise and to lengthen when the motors 212a, 212b rotate clockwise. The length adjustment members 214a and 214b include ball screws for converting linear motion into rotary motion of the motors 212a and 212b, and can be configured to include bars with variable lengths.

[0060] The length of each of the multiple balance adjustment assemblies 210a, 210b can be adjusted so that one end is closer to the center point 250 or farther from the center point 250. That is, one end of each of the multiple balance adjustment assemblies 210a to 210d can be longer in the direction of the tilt block 123 and the center point 250 and shorter in the opposite direction of the tilt block 123 and the center point 250.

[0061] Each of the plurality of lifting members 216 a and 216 b may include a rotating member such as a roller at the bottom so that it can move up and down the lifting block 123 .

[0062] Although not shown in FIG. 4, the third balancing assembly 210c and the fourth balancing assembly 210d may also include a motor, a length adjusting member, and an elevating member.

[0063] According to one embodiment, each of the plurality of sensors 127a to 127d measures a displacement value of the probe card 130. Here, the displacement value refers to a value that has changed from a reference value.

[0064] FIG. 6 is a diagram illustrating the locations where sensors are installed according to one embodiment of the present disclosure.

[0065] Referring to FIG. 6, a plurality of sensors 127a to 127d are arranged at predetermined positions.

[0066] The plurality of sensors 127a to 127d are arranged on the base unit 120 so as to measure displacement values ​​for a plurality of points on the probe card 130. Fig. 6 illustrates an example in which the plurality of sensors 127a to 127d are arranged at regular intervals on a circular member 128. Fig. 6 illustrates an example in which four sensors 127a to 127d are arranged. Each of the sensors 127a to 127d senses a distance value to a specific point or portion on the probe card 130.

[0067] The controller determines whether the probe card 130 is in a balanced state based on the displacement values ​​measured by the sensors 127a to 127d. The controller determines that the probe card 130 is in a balanced state when the deviations or differences between the displacement values ​​fall within a predetermined range. For example, the controller determines that the probe card 130 is in a balanced state when all (or part) of the following deviations fall within the predetermined ranges: a first deviation based on a first displacement value measured by the first sensor 127a; a second deviation based on a second displacement value measured by the second sensor 127b; a third deviation based on a third displacement value measured by the third sensor 127c; and a fourth deviation based on a fourth displacement value measured by the fourth sensor 127d. On the other hand, the controller determines that the probe card 130 is out of a balanced state when the deviations between the displacement values ​​fall outside the predetermined ranges. For example, if all (or part) of the first deviation based on the first displacement value measured by the first sensor 127a, the second deviation based on the second displacement value measured by the second sensor 127b, the third deviation based on the third displacement value measured by the third sensor 127c, and the fourth deviation based on the fourth displacement value measured by the fourth sensor 127d are not included in the predetermined range, it is determined that the probe card 130 is not in an equilibrium state.

[0068] In some embodiments, the controller calculates differences between a plurality of displacement values, and when the calculated differences between the plurality of displacement values ​​are within a predetermined range, determines that the probe card 130 is in a balanced state. For example, the controller calculates a first difference value between a first displacement value measured by the first sensor 127a and a second displacement value measured by the second sensor 127b, a second difference value between the first displacement value measured by the first sensor 127a and a third displacement value measured by the third sensor 127c, and a third difference value between the first displacement value measured by the first sensor 127a and a fourth displacement value measured by the fourth sensor 127d, and determines that the probe card 130 is in a balanced state when all (or a part) of the calculated first difference value, second difference value, and third difference value are within the predetermined range.

[0069] In some embodiments, the controller calculates a difference between the displacement values ​​measured by a pair of opposing sensors and determines that the probe card 130 is in a balanced state based on the calculated difference. For example, the controller calculates a first difference value between a first displacement value measured by the first sensor 127a and a second displacement value measured by the second sensor 127b, calculates a fourth difference value between a third displacement value measured by the third sensor 127c and a fourth displacement value measured by the fourth sensor 127d, and then determines that the probe card 130 is in a balanced state if both the calculated first difference value and the fourth difference value are within a predetermined range.

[0070] If it is determined that the state of the probe card 130, determined based on the displacement values ​​measured from the multiple sensors 127a-127d, is out of equilibrium, the length of one or more of the multiple balancing assemblies 210a-210d is increased or decreased based on the multiple displacement values ​​so that the probe card 130 is in a predetermined state.

[0071] As shown in FIG. 6 , sensors 127a to 127d are arranged in four directions. For example, four sensors 127a to 127d may be arranged at 90-degree intervals. According to some embodiments, a particular sensor is arranged at a position to measure a distance between first points on the probe card 130. For example, the first sensor 127a may be arranged at a first point on the base unit 120 to sense a displacement value relative to the first point on the probe card 130, and the second sensor 127b may be arranged at a second point on the base unit 120 to sense a displacement value relative to the second point on the probe card 130. The third sensor 127c may be arranged at a third point on the base unit 120 to sense a displacement value relative to the third point on the probe card 130, and the fourth sensor 127d may be arranged at a fourth point on the base unit 120 to sense a displacement value relative to the fourth point on the probe card 130.

[0072] A controller included in the probe card fixture 100 controls the length of one or more of the balancing assemblies 210a-210d based on the displacement values ​​measured from the sensors 127a-127d. That is, under the control of the controller, at least one of the balancing assemblies 210a-210d can be controlled to extend in the direction of the tilt block 123 or shorten in the direction opposite to the tilt block 123. According to one embodiment, the controller can individually adjust the length of each of the balancing assemblies 210a-210d based on the displacement values.

[0073] 4, when the balance adjustment assemblies 210a to 210d are lengthened in the direction of the tilt block 123 and the lifting members 216a and 216b climb up the tilt block 123, a downward force is applied, and the probe card 130 may be lowered by a predetermined height. That is, when the lifting members 216a and 216b climb up the tilt block 123, the lifting members 216a and 216b lower a first point of the tilt block, and a second point of the probe card 130 corresponding to the first point may be lowered.

[0074] Conversely, when the balance adjustment assemblies 210a to 210d shorten in the opposite direction of the tilt block 123 and the lifting members 216a and 216b descend from the tilt block 123, the force pushing the probe card 130 weakens, and the probe card 130 may rise by a predetermined height. That is, when the lifting members 216a and 216b descend from the tilt block 123, the lifting members 216a and 216b raise a third point on the tilt block 123, and a fourth point on the probe card 130 corresponding to the third point may rise.

[0075] According to this principle, the plurality of balance adjustment assemblies 210a-210d are controlled so that the tilted probe card is brought into a balanced state. That is, by adjusting the lengths of the plurality of balance adjustment assemblies 210a-210d, a specific point among the plurality of points included in the probe card 130 is raised or lowered, bringing the probe card 130 into a balanced state. For example, if a fourth point on the probe card 130 is raised higher than the other points and the probe card 130 is in a tilted state (i.e., out of equilibrium), a specific balance adjustment assembly is lengthened so that the third point on the tilt block 123 corresponding to the fourth point is lowered so that the fourth point can be lowered.

[0076] As described above, the control unit included in the probe card fixture 100 can adjust the length of each of the plurality of balance adjustment assemblies 210a to 210d. According to one embodiment, the control unit can adjust the length of each of the plurality of balance adjustment assemblies 210a to 210d by controlling the motors included in the plurality of balance adjustment assemblies 210a to 210d.

[0077] The control unit determines whether the probe card 130 is in a balanced state based on the plurality of displacement values ​​measured from the plurality of sensors 127a to 127d. According to one embodiment, the control unit determines that the probe card 130 is in a balanced state when the deviation (or difference) of the plurality of displacement values ​​falls within a predetermined range.

[0078] When it is determined that the probe card 130 is out of equilibrium, the control unit can adjust the length of at least one of the plurality of balance adjustment assemblies 210a to 210d to control the probe card to be in equilibrium.

[0079] Furthermore, when the probe card is out of equilibrium, the controller may determine a target balance adjustment assembly among the balance adjustment assemblies 210a-210d to be subjected to length adjustment based on the deviation (or difference) of the plurality of displacement values, and adjust the length of the determined target balance adjustment assembly. For example, if the first displacement value measured by the first sensor 127a is calculated to be smaller than the second displacement value measured by the second sensor 127b by more than a critical value, the probe card 130 may be tilted such that a third point of the probe card 130 associated with the first displacement value is higher and a fourth point of the probe card 130 associated with the second displacement value is lower. In this case, the controller may adjust the length of the first balance adjustment assembly 210a associated with the first displacement value to increase so that the third point is lower. Additionally or alternatively, the controller may control the length of the second balance adjustment assembly 210b associated with the second displacement value to decrease so that the fourth point is higher.

[0080] According to one embodiment, the control unit can determine a contraction length or extension length of the target balancing assembly based on the deviation (or difference) of the multiple displacement values, and adjust the determined length of the target balancing assembly based on the determined contraction length or extension length. According to one embodiment, the control unit can determine the contraction length or extension length corresponding to the displacement value and the deviation (or difference) by referring to a table in which contraction lengths or extension lengths for each deviation (difference) are mapped to the displacement value.

[0081] According to one embodiment, the control unit can determine the rotation direction and rotation speed of the motor based on the determined contracted length or extended length, and can control the motor included in the determined target balancing assembly based on the determined rotation direction and rotation speed to adjust the length of the target balancing assembly. According to one embodiment, the control unit can determine the rotation direction and rotation speed of the motor according to the contracted length or extended length by referring to a second table in which the rotation direction and rotation speed of the motor for each contracted length and extended length are recorded.

[0082] A method for aligning a probe card according to an embodiment of the present disclosure will now be described with reference to FIG.

[0083] The method shown in Fig. 7 is one embodiment for achieving the object of the present disclosure, and it goes without saying that some steps can be added or omitted as necessary. Furthermore, the method shown in Fig. 7 can be performed by at least one processor included in the control device of Fig. 8 or by a control unit. For convenience of explanation, each method shown in Fig. 7 will be described assuming that it is performed by a processor included in the control device of Fig. 8.

[0084] FIG. 7 is a flowchart illustrating a method for aligning a probe card according to an embodiment of the present disclosure.

[0085] 7, when the probe card 130 is docked, the processor may turn on the power of the motors 212a and 212b included in the balance adjustment assemblies 210a to 210d, and then turn off the brakes of the motors 212a and 212b to enable the movement of the motors 212a and 212b. Here, docking means that the probe card 130 is connected to the base unit 120.

[0086] The control unit then controls each of the motors 212a and 212b based on a predetermined initial value (e.g., a home value) to control the balance adjustment assemblies 210a to 210d to a predetermined length. The control unit then activates the first card locking module 126a and the second card locking module 126b so that the probe card 130 is fixed to the base unit 120 by the first card locking module 126a and the second card locking module 126b.

[0087] Next, the control unit sets the displacement value for each of the plurality of sensors 127a-127d to an initial value. For example, the initial value may be "0 (zero)." After that, the control unit can turn on the brake for each of the plurality of motors 212a, 212b and power off each of the plurality of motors 212a, 212b so that the motors 212a, 212b do not rotate.

[0088] After the initial settings related to docking are completed, the controller may artificially generate a contact force on one side of the probe card 130. According to one embodiment, the controller may artificially generate a predetermined contact force on the probe card 130 by bringing one side of the probe card 130 into contact with the top surface of the wafer. For example, similar to a test process for a device under test, multiple pins on the bottom surface of the probe card 130 may be brought into contact with multiple devices under test on the top surface of the wafer. Here, the generation of the contact force may be maintained for a predetermined period of time. That is, contact between the probe card 130 and the wafer may be maintained for a predetermined period of time.

[0089] Thereafter, the processor uses the plurality of sensors 127a to 127d to obtain a plurality of displacement values ​​for a plurality of points on the probe card 130 (S110).

[0090] Next, the processor determines whether the probe card 130 is in a balanced state based on the plurality of displacement values ​​(S120). If the processor determines that the probe card 130 is out of balance, the processor determines a target balance adjustment assembly to be subjected to length adjustment among the plurality of balance adjustment assemblies based on the deviation or difference of the plurality of displacement values ​​(S130). According to some embodiments, the processor can determine the rotation direction and rotation speed of the motor based on the deviation or difference of the plurality of displacement values.

[0091] Next, the processor adjusts the determined length of the target balancing assembly so that the probe card is in a balanced state (S140). The processor can adjust the determined length of the target balancing assembly based on the determined contracted length or extended length. According to some embodiments, the processor can adjust the length of the target balancing assembly by controlling a motor included in the determined target balancing assembly based on the determined rotation direction and rotation number.

[0092] Thereafter, the processor again acquires a plurality of displacement values ​​using the plurality of sensors 127a to 127d (S150).

[0093] Next, the processor determines whether the probe card 130 is in a balanced state based on the acquired displacement values ​​(S160). If the processor determines that the probe card 130 is still out of balance, it may perform step S130 again to adjust the length of at least one balancing assembly.

[0094] If the processor determines that the probe card 130 is in a balanced state at step S120 or step S160, the processor may perform a process of bringing the probe card 130 into contact with the device under test on the wafer. After that, the device under test is tested.

[0095] 8 is a hardware configuration diagram of a control device according to some embodiments of the present disclosure. The control device 1000 in FIG. 8 is a computing device and may include one or more processors 1100, a system bus 1600, a communication interface 1200, a memory 1400 into which a computer program 1500 executed by the processor 1100 is loaded, and a storage 1300 into which the computer program 1500 is stored.

[0096] The processor 1100 controls the overall operation of each component of the control device 1000. The processor 1100 can perform calculations for at least one application or program for performing methods / operations according to various embodiments of the present disclosure. The memory 1400 stores various data, instructions, and / or information. The memory 1400 can load one or more computer programs 1500 from the storage 1300 for performing methods / operations according to various embodiments of the present disclosure. The storage 1300 can non-temporarily store one or more computer programs 1500.

[0097] The computer program 1500 may include one or more instructions that embody methods / operations according to various embodiments of the present disclosure. When the computer program 1500 is loaded into the memory 1400, the processor 1100 can execute the one or more instructions to perform the methods / operations according to various embodiments of the present disclosure.

[0098] According to one embodiment, the computer program 1500 may include instructions for performing the following operations: determining whether the probe card is in a balanced state based on multiple displacement values ​​measured from multiple sensors; if it is determined that the probe card is out of equilibrium, determining a target balance adjustment assembly among the multiple balance adjustment assemblies to be subjected to length adjustment based on the deviation or difference between the multiple displacement values; and adjusting the length of the determined target balance adjustment assembly so that the probe card is in a balanced state.

[0099] Various embodiments of the present disclosure and the effects of the embodiments have been described above with reference to Figures 1 to 8. The effects of the technical ideas of the present disclosure are not limited to the effects described above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

[0100] The methods according to the above-described embodiments of the present invention can be performed by executing a computer program embodied as computer-readable code. Also, although the figures show operations in a particular order, the operations do not necessarily have to be performed in the particular order or sequential order shown, and it should not be understood that desired results will be achieved only if all of the illustrated operations are performed. Multitasking and parallel processing may be advantageous in certain situations.

[0101] Although the embodiments of the present disclosure have been described above with reference to the accompanying drawings, those skilled in the art will understand that the present disclosure can be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be illustrative in all respects and not limiting. The scope of protection of the present invention should be interpreted by the claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of rights of the technical ideas defined by the present disclosure.

Claims

1. In the probe card fixing device, a test head including one or more test boards; probe card; a base unit disposed between the test head and the probe card, coupled to each of the test head and the probe card, the base unit including a plurality of balance adjustment assemblies and a plurality of sensors for measuring displacement values ​​at a plurality of points on the probe card; and A probe card fixing device including a control unit that determines whether the probe card is in a balanced state based on multiple displacement values ​​measured from the multiple sensors, and if it is determined that the probe card is out of balance, adjusts the length of at least one of the multiple balance adjustment assemblies to bring the probe card into a balanced state.

2. The control unit 2. The probe card fixing device of claim 1, wherein when the probe card is out of equilibrium, a target balance adjustment assembly among the plurality of balance adjustment assemblies to be subjected to length adjustment is determined based on the deviation or difference of the plurality of displacement values, and the length of the determined target balance adjustment assembly is adjusted.

3. The control unit 3. The probe card fixture device of claim 2, further comprising: determining a contraction or extension length of the determined target balance adjustment assembly based on the deviation or difference of the plurality of displacement values; and adjusting the determined length of the target balance adjustment assembly based on the determined contraction or extension length.

4. The control unit 3. The probe card fixing device of claim 2, further comprising: determining a direction and number of rotations of a motor based on the deviation or difference of the plurality of displacement values; and controlling a motor included in the determined target balance adjustment assembly based on the determined direction and number of rotations to adjust the length of the target balance adjustment assembly.

5. The base unit a central clamp; and The probe card fixture of claim 1 , further comprising a tilt block formed on an upper portion of the central clamp, the tilt block enabling one end of the plurality of balance adjustment assemblies to move up and down.

6. Each of the plurality of balancing assemblies comprises: motor; a length adjusting member coupled to one end of the motor, the length adjusting member lengthening in the direction of the tilt block or shortening in the direction opposite to the tilt block as the motor rotates; and 6. The probe card fixing device according to claim 5, further comprising an elevating member that moves up the inclined block when the length adjusting member is lengthened and moves down from the inclined block when the length adjusting member is shortened.

7. When the lifting member moves up the inclined block, the lifting member lowers a first point on the inclined block, and a second point on the probe card corresponding to the first point is lowered; 7. The probe card fixing device of claim 6, wherein when the lifting member descends the inclined block, the lifting member lifts a third point on the inclined block, and a fourth point on the probe card corresponding to the third point is lifted.

8. The plurality of sensors include: The probe card fixture device of claim 1 , wherein the sensor measures the distance between a plurality of points on the probe card.

9. The control unit The probe card fixture device of claim 1 , wherein the probe card is determined to be in a balanced state when the deviation or difference between the plurality of displacement values ​​falls within a predetermined range.

10. 1. A method for aligning a probe card performed by at least one processor, comprising: determining whether the probe card is in an equilibrium state based on the plurality of displacement values ​​measured from the plurality of sensors; determining a target balance adjustment assembly to be subjected to length adjustment among the plurality of balance adjustment assemblies based on the deviation or difference of the plurality of displacement values ​​when it is determined that the probe card is out of equilibrium; and A method of aligning a probe card, comprising adjusting the determined length of the target balancing assembly so that the probe card is in a balanced state.

11. Before determining whether the probe card is in an equilibrium state, docking the probe card to a base unit coupled to a test head; controlling a plurality of motors included in the plurality of balancing assemblies based on predetermined values; and The method of aligning a probe card according to claim 10 , further comprising the step of setting a displacement value for each of the plurality of sensors to an initial value.

12. after the step of controlling the plurality of motors based on predetermined values, activating one or more probe card locking modules to secure the probe card to the base unit; The step of setting the displacement values ​​of each of the plurality of sensors to an initial value includes: after the step of controlling the locking state of one or more probe card lock modules; The method for aligning a probe card according to claim 11, which is performed after the step of controlling one or more probe card locking modules to be in a locked state.

13. determining the target balancing assembly comprises: determining a contracted or extended length of the determined target balancing assembly based on a deviation or difference between the plurality of displacement values; The step of adjusting the length of the determined target balancing assembly includes: The method of claim 10 , further comprising adjusting the determined length of the target balancing assembly based on the determined contracted or extended length.

14. determining the target balancing assembly comprises: determining a rotation direction and a rotation speed of the motor based on the deviation or difference of the plurality of displacement values; The step of adjusting the length of the determined target balancing assembly includes: The probe card alignment method of claim 10, further comprising a step of controlling a motor included in the determined target balance adjustment assembly based on the determined rotation direction and number of rotations to adjust the length of the target balance adjustment assembly.

15. The step of determining whether the probe card is in an equilibrium state comprises: The method of aligning a probe card according to claim 10, further comprising determining that the probe card is in a balanced state if deviations or differences for the plurality of displacement values ​​are within a predetermined range.

16. Before determining whether the probe card is in an equilibrium state, generating a contact force on one side of the probe card; and The method of aligning a probe card according to claim 10 , further comprising the step of obtaining the plurality of displacement values ​​using the plurality of sensors.

17. The step of generating a contact force on one surface of the probe card comprises: The method of aligning a probe card according to claim 16, further comprising contacting one surface of the probe card with a wafer.

18. one or more processors; and a memory for storing a computer program to be executed by said one or more processors; The computer program comprises: determining whether the probe card is in an equilibrium state based on the plurality of displacement values ​​measured from the plurality of sensors; determining, when it is determined that the probe card is out of equilibrium, a target balance adjustment assembly to be subjected to length adjustment among the plurality of balance adjustment assemblies based on the deviation or difference of the plurality of displacement values; and a controller including instructions for performing an operation to adjust the determined length of the target balancing assembly so that the probe card is in a balanced state;

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