Harvesting electrical energy from gate valve motions during wafer transfer

Abstract

To fabricate semiconductor devices and, more particularly, to harvest energy from gate valves during transfer of substrates to be used to fabricate semiconductor devices.SOLUTION: A substrate processing system having a gate valve assembly is provided. The substrate processing system includes a gate valve body defining a gate valve passage, a valve component that is movable to open and close the gate valve passage, an actuator coupled to the valve component, and an electrical generator coupled to a movable component of the actuator. Mechanical motion of the movable component controls movement of the valve component to open and close the gate valve passage. When the movable component is in motion, the electrical generator is configured to convert the mechanical motion of the movable component to electrical energy, which may be stored and reused.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims priority to and the benefit of U.S. Provisional Patent Application No. 63 / 654,669, filed May 31, 2024, the contents of which are incorporated herein by reference in their entirety.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to fabricating semiconductor devices, and more particularly to harvesting energy from gate valves during the transfer of substrates used to fabricate semiconductor devices. [Background technology]

[0003] Material layers are commonly deposited onto substrates during the fabrication of semiconductor devices, such as during the fabrication of integrated circuits and electronic devices. Material layer deposition is generally accomplished by supporting the substrate in a substrate processing chamber arrangement, heating the substrate to a desired deposition temperature, and flowing one or more material layer precursors through the chamber arrangement and across the substrate. As the precursors flow across the substrate, a material layer typically grows gradually onto the surface of the substrate, depending on the temperature of the substrate and the environmental conditions within the chamber arrangement.

[0004] In a cluster-type semiconductor vacuum processing tool, multiple substrate processing chambers may be coupled to a single substrate handling chamber that moves substrates into and out of the substrate processing chambers and into and out of the substrate processing system. The multiple substrate processing chambers are typically rigidly attached to the substrate handling chamber through a gate valve that sealingly couples the substrate processing chambers to the substrate handling chamber and provides a window through which substrates can be transferred into and out of the substrate processing chamber.

[0005] In conventional systems, the gate valve window is sealed to keep the substrate separated from one or more chambers. When conditions such as temperature, pressure, and atmospheric content are appropriate, the gate valve can be opened to transfer the substrate into the desired chamber. Typically, the gate valve is coupled to a movable actuator to open and close the window. Each time a single gate valve opens or closes, a certain amount of energy is generated. Considering the number of gate valves in a single-wafer processing system and the number of times the gate valves open or close, a significant amount of energy is wasted. As a result, there is a need in the art for a system and method for collecting this wasted energy and storing it for later use.

[0006] Any discussion set forth in this section, including discussion of problems and solutions, is included in this disclosure solely for the purpose of providing a context for the present disclosure, and should not be construed as an admission that any or all of the discussion was known at the time the invention was made or that it otherwise constitutes prior art. Summary of the Invention [Means for solving the problem]

[0007] A substrate processing system having a gate valve assembly is provided. The substrate processing system includes a gate valve body defining a gate valve passage. The substrate processing system further includes a valve component movable to open and close the gate valve passage. The substrate processing system also includes an actuator coupled to the valve component. The actuator includes a movable component, whereby mechanical movement of the movable component controls movement of the valve component to open and close the gate valve passage. The substrate processing system includes a generator coupled to the movable component. The generator is configured to convert the mechanical movement into electrical energy.

[0008] A method for storing energy generated from movement of an actuator in a gate valve of a semiconductor processing system is provided. The method includes providing a magnetic component. The method further includes providing an electrical component. The electrical component is electrically coupled to the magnetic component. The method includes generating electrical energy when a movable component of the actuator is in motion and the electrical component is within the magnetic field of the magnetic component. Finally, the method includes storing the electrical energy generated by the electrical component.

[0009] An actuator is provided. The actuator includes a movable component. The actuator further includes one or more sets of electric coils coupled to the movable component. The actuator also includes one or more magnets coupled to the one or more sets of electric coils. When the movable component is actuated, the one or more magnets and the one or more electric coils are electrically coupled to convert mechanical motion of the actuator into electrical energy.

[0010] This Summary is provided to introduce a selection of concepts in a simplified form. These concepts are described in more detail below in the Detailed Description of the Invention. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0011] These and other features, aspects, and advantages of the inventions disclosed herein are described below with reference to drawings of certain specific embodiments, which are intended to illustrate, but not to limit, the invention. [Brief explanation of the drawings]

[0012] [Figure 1A] 1 is an overhead view of a substrate processing system according to an exemplary embodiment of the present disclosure. [Figure 1B]1B is a perspective view and an exploded view of a gate valve assembly in the substrate processing system of FIG. 1A according to an exemplary embodiment of the present disclosure. [Figure 1C] 1B is a perspective view and an exploded view of a gate valve assembly in the substrate processing system of FIG. 1A according to an exemplary embodiment of the present disclosure. [Figure 2A] 1B and 1C according to exemplary embodiments of the present disclosure. [Figure 2B] 1B and 1C according to exemplary embodiments of the present disclosure. [Figure 2C] 1B and 1C according to exemplary embodiments of the present disclosure. [Figure 2D] 1B and 1C according to exemplary embodiments of the present disclosure. [Figure 2E] 1B and 1C according to exemplary embodiments of the present disclosure. [Figure 3] 2A-2E is a flow diagram of a method for storing energy generated from the movement of an actuator such as one of FIGS. 2A-2E according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0013] It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the relative size of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of the illustrated embodiments of the present disclosure.

[0014] Reference is now made to the drawings in which like reference numerals identify similar structural features or aspects of the disclosure to which they are directed. The systems and methods of the present disclosure may be of semiconductor processing systems employed to fabricate semiconductor devices, such as those employed to deposit layers of material using chemical vapor deposition (CVD) and atomic layer deposition (ALD) techniques during the fabrication of logic and memory devices, although the present disclosure is not generally limited to any semiconductor processing operation or to the fabrication of any particular semiconductor device.

[0015] As used herein, the term "substrate" may refer to any underlying material, including any underlying material that may be modified or upon which a device, circuit, or film may be formed. A "substrate" may be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. A substrate may be in any form, such as a powder, a plate, or a workpiece. A substrate in the form of a plate may include wafers of various shapes and sizes. Wafers may be 200 millimeters in diameter, 300 millimeters in diameter, or 450 millimeters in diameter. A substrate may be formed from one or more semiconductor materials, including, but not limited to, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0016] FIG. 1A illustrates an overhead view of a substrate processing system 10 according to an embodiment described herein. In the embodiment shown in FIG. 1A, the substrate processing system 10 includes a substrate handling chamber (SHC) 50 with five facets (although other embodiments of this technology may provide more or fewer facets). Four of these facets are coupled to respective substrate processing chambers (SPCs) 20 via one or more gate valves 100. In the illustrated embodiment, each SPC 20 is coupled to the SHC 50 by two gate valves 100. Furthermore, each SPC 20 is equipped to receive and process at least four substrates (substrate supports 22 are provided within the SPC 20). In the illustrated embodiment, three or more gate valves 100 may be used to connect the SPCs 20 with the SHC 50.

[0017] The SHC 50 includes at least one robotic arm 52 that is used to move substrates into and out of the various SPCs 20. In use, the gate valve 100 is opened and an end effector of the robotic arm 52 extends through the open gate valve 100 to insert or remove a substrate into or from the internal chamber of the SPC 20 (e.g., to place or remove a substrate onto or from one of the substrate supports 22). When the robotic arm 52 is retracted from the SPC 20, the gate valve 100 closes, thereby sealing the SPC 20 from the gate valve 100.

[0018] The substrate processing system 10 further includes a load lock (LL) module 30. The LL module 30 is connected to the fifth facet of the SHC 50 by one or more gate valves 100B. In the exemplary embodiment, the gate valves 100B have the same structure as the gate valve 100. In the exemplary embodiment shown in FIG. 1A, two gate valves 100B are used to connect the LL module 30 to the SHC 50. The LL module 30 includes one or more substrate holding components 32 to hold the substrate on its way into the SHC 50 for further processing and on its way out of the SHC 50 after processing is completed. An end effector of the robot arm 52 moves through the gate valve 100B (when open) to move the substrate into the SHC 50 (for layer deposition and other processing) and out of the SHC 50 (after processing is completed). The LL module 30 (and gate valve 100B) keeps the substrate isolated from the environment of the SHC 50 until conditions (e.g., temperature, pressure, atmospheric content, etc.) within the SHC 50 are ready for the substrate to be inserted.

[0019] The LL module 30 is further coupled to an equipment front-end module (EFEM) 60 via one or more additional gate valves 100C. In the exemplary embodiment, the gate valve 100C has the same structure as the gate valves 100 and / or 100B described above. The EFEM 60 further includes a robotic arm 62. The end effector of the robotic arm 62 moves through the gate valve 100C (when open) to move substrates into the LL module 30 (for eventual transfer to the processing chamber 20 for layer deposition and other processing) and out of the LL module 30 (after processing is completed). The robotic arm 62 of the EFEM 60 is also configured to pick up new substrates for processing from one or more front-opening integrated pods (FOUPs) 70 and return processed substrates to the FOUPs 70. In the exemplary embodiment, at least four FOUPs 70-1 through 70-4 are coupled to the EFEM 60.

[0020] 1A, multiple SPCs 20 are coupled to a single SHC 50 (with the additional assistance of LL modules 30, EFEMs 60, and FOUPs 70) to move substrates into and out of the individual SPCs 20 and into and out of the substrate processing system 10 as a whole. The multiple SPCs 20 are rigidly attached to the SHC 50 through gate valves 100. Gate valve 100 sealingly couples the SPCs 20 to the SHC 50 and may be selectively opened and closed (and sealed), providing a window through which substrates can be transferred into and out of the SPC 20. Similarly, gate valve 100B sealingly couples the LL modules 30 to the SHC 50 and may be selectively opened and closed (and sealed), providing a window through which substrates can be transferred into and out of the SHC 50. Additionally, gate valve 100C sealingly couples EFEM 60 and LL module 30 and provides a window that may be selectively opened and closed (and sealed) and through which substrates may be transferred into and out of EFEM 60. As a result, in an exemplary embodiment, EFEM 60, LL module 30, SHC 50, and SPC 20 may have different environmental zones (e.g., temperature zones, pressure zones, etc.), and gate valves 100C, 100B, and 100C remain sealed and do not allow substrates to pass from one chamber to another until the environmental zones between the two chambers are equal.

[0021] 1B and 1C provide perspective and exploded views of a gate valve 100 according to an exemplary embodiment described herein. As shown herein, the gate valve 100 includes a gate valve body 130, a seal plate 120, a seal plate cover 110, and an actuator 200. The actuator 200 is movable to open and close a gate valve passage 132. The gate valve passage 132 is an opening that allows access for transferring a substrate from one chamber to another. That is, an end effector of a robot arm 52 and / or 62 carrying a substrate can pass from one chamber to another when the passage 132 is open. In the exemplary embodiment shown herein, the seal plate 120 fits within the interior of the gate valve body 130 and engages with the actuator 200. The actuator 200 includes an actuator box body 218. The actuator 200 further includes an actuator cover 160 that covers the actuator box body 218.

[0022] 2A-2E illustrate perspective views of various embodiments of actuator 200. Specifically, FIGS. 2A-2E provide views into actuator box body 218 without cover 160. As shown in FIG. 2A, actuator 200 includes rear section 240 (including sections 244 and 246). Actuator 200 further includes movable component 212 secured to shaft 210. As shown in FIGS. 2A-2E, in the exemplary embodiment, shaft 210 moves up and down in a vertical motion with movable component 212. Additionally, movable component 212 is further supported by side bars 220 and 230. In the exemplary embodiment, movable component 212 includes first and second side openings on opposite sides, such that side bar 220 extends through the first side opening and second side bar 230 extends through the second side opening. In the exemplary embodiment, movable component 212 is an "I" shaped block (as shown in FIG. 2A). In the exemplary embodiment, the "I" shaped block is affixed to shaft 210 at a narrow section of the "I" shaped block and is further supported by side bars 220 and 230 along the wider ends of the "I" shaped block. In the exemplary embodiment, movable component 212 is a different shape (e.g., rectangular, cylindrical, etc.).

[0023] In the exemplary embodiment, the actuator 200 also includes a coil spring 214. The movable component 212 is guided by the side bars 220 and 230 to move vertically (i.e., up and down) to open and close the gate valve passage 132. In the exemplary embodiment, the shaft 210 may be cylindrical in shape. In the exemplary embodiment, one or more of the side bars 220 and / or 230 may be cylindrical in shape. That is, the side bars 220 and / or 230 may be pillars that guide the movement of the movable component 212 to open and close the gate valve passage 132. In the exemplary embodiment, the side bars 220 and / or 230 may be different shapes, as long as they are long enough to guide the movable component 212 within the actuator body 218. In the exemplary embodiment shown in FIGS. 2A-2E, the gate valve passage 132 is closed (i.e., the gate valve passage is sealed, and substrates cannot pass from one chamber to another). 2A-2E, the actuator 200 includes a pocket section 278 that accommodates the shaft 210 when the gate valve passage 132 is open. That is, when the movable component 212 is within the lower section 286, the shaft 210 is accommodated within the hollow portion 282 of the pocket section 278 by allowing the shaft 210 to pass through an intermediate opening 284.

[0024] The movable component 212 generates energy as it moves vertically to open and close the gate valve passage 132. In conventional systems, this mechanical energy generated from the movement of the movable component 212 is wasted. FIGS. 2B-2E provide various embodiments for storing this energy so that it can be reused in different capacities. Specifically, FIGS. 2B-2E illustrate various embodiments for generating electrical energy from the movement of the movable component. This electrical energy can be further stored for use in operating different tools of the semiconductor processing system 10.

[0025] 2B illustrates one embodiment of a generator that generates electrical energy from the movement of movable component 212. In an exemplary embodiment, one or more magnetic components 232 may be coupled to sidebar 230. In one exemplary embodiment, magnetic component 232 may be a strip of magnet or a set of magnets. In an exemplary embodiment, magnetic component 232 may be wrapped around sidebar 230. In an exemplary embodiment, sidebar 230 is magnetic component 232. In other words, in an exemplary embodiment, sidebar 230 may be formed from (e.g., consist of) a magnetic material.

[0026] As further shown in FIG. 2B , actuator 200 may include a set of electric coils 234. In an exemplary embodiment, the set of electric coils 234 may be attached to movable component 212 and therefore move with movable component 212. In an exemplary embodiment, the set of electric coils 234 is attached to a bottom surface 264 of movable component 212. In an exemplary embodiment, the set of electric coils 234 may be wrapped around sidebar 230, such as perpendicular and / or horizontal to the direction of gravity. In an exemplary embodiment, the set of electric coils 234 may not be wrapped around sidebar 230, but may be in proximity to magnetic component 232 when movable component 212 is in motion (as shown with respect to sidebar 220). As a result, when movable component 212 is in motion, a magnetic field results from magnetic component 232, and because set of electric coils 234 is within this magnetic field, a voltage is induced in set of electric coils 234 due to relative motion.

[0027] While FIG. 2B illustrates such a generator mounted on sidebar 230, in an exemplary embodiment, such a generator may be mounted on sidebar 220. For example, as shown in FIG. 2B , sidebar 220 may include one or more magnetic components 222. In one exemplary embodiment, magnetic component 222 may be a strip of magnet or a set of magnets. In an exemplary embodiment, magnetic component 222 is attached to sidebar 220. In an exemplary embodiment, magnetic component 222 may be wrapped around sidebar 220. In an exemplary embodiment, sidebar 220 is magnetic component 222. In other words, in an exemplary embodiment, sidebar 220 may be formed from (e.g., consist of) a magnetic material.

[0028] 2B , the actuator 200 may include a set of electric coils 226. In an exemplary embodiment, the set of electric coils 226 is near the magnetic component 222 but is not wrapped around the side bar 220. For example, in one exemplary embodiment, the set of electric coils 226 may be attached to the bottom surface 264 of the movable component 212. In an exemplary embodiment, the set of electric coils 226 is attached horizontally along the bottom surface 264 (not shown). In an exemplary embodiment, the set of electric coils 226 is attached to the interior bottom surface 262 of the actuator body 218. In an exemplary embodiment, the set of electric coils 226 is attached horizontally along the interior bottom surface 262. In an exemplary embodiment, the set of electric coils 226 is attached to the interior rear surface 242 of the actuator 200. As a result, when the movable component 212 is in motion, a magnetic field results from the magnetic component 222, and because the set of electrical coils 226 is within this magnetic field, a voltage is induced in the set of electrical coils 226.

[0029] Additionally, a second set of electric coils 224 may also be implemented within the generator. In an exemplary embodiment, the set of electric coils 224 is located opposite the electric coil 226. For example, in the embodiment shown in FIG. 2B , the set of coils 226 is located on one side of the magnetic component 222, and the set of electric coils 224 is located on the other side of the magnetic component 222. The set of electric coils 224 has a similar structure and functions in a similar manner as the set of electric coils 226.

[0030] 2B illustrates such generators implemented on sidebar 220, in an exemplary embodiment, such generators may also be implemented on sidebar 230. As a result, sidebar 220 and / or sidebar 230 may implement such generators individually or in various combinations, as shown with respect to sidebar 220 or with respect to sidebar 230 in FIG.

[0031] FIG. 2C illustrates one embodiment of a generator that generates electrical energy from the motion of movable component 212. In an exemplary embodiment, one or more magnetic components 252 may be coupled to a portion of rear section 240 (such as section 244). In one exemplary embodiment, magnetic component 252 may be a magnetic strip or a set of magnets. As further shown in FIG. 2C , in an exemplary embodiment, actuator 200 may include a set of electric coils 256. In an exemplary embodiment, the set of electric coils 256 may be attached to movable component 212 and thus move with movable component 212. In an exemplary embodiment, the set of electric coils 256 is attached to a bottom surface 264 of movable component 212. In an exemplary embodiment, the electric coils 256 may be attached to shaft 210 such that the set of electric coils 256 is in proximity to the magnetic component 252 when movable component 212 is in motion. As a result, when the movable component 212 is in motion, a magnetic field results from the magnetic component 252, and because the set of electrical coils 256 is within this magnetic field, a voltage is induced in the set of electrical coils 256 due to the relative motion.

[0032] For ease of illustration, FIGS. 2B-2C show an embodiment of a generator constructed within the lower section 286 of the actuator 200. However, any of the embodiments shown in FIGS. 2B-2C may be implemented within the upper section 288 of the actuator 200. As shown in FIG. 2A, the upper section 288 is the section of the actuator 200 that is between the moveable component 212 and the gate valve body 130. The lower section 286 is the remaining section of the actuator 200, but is farther away from the gate valve body 130. As a result, the gate valve passage 132 is closed, as shown in FIGS. 2B-2E, and the upper section 288 is smaller than the lower section 286, or vice versa.

[0033] 2D illustrates one embodiment of a generator that generates electrical energy from the motion of movable component 212. In an exemplary embodiment, one or more magnetic components 272 may be coupled to pocket section 278. In one exemplary embodiment, magnetic component 272 may be a strip of magnet or a set of magnets. In an exemplary embodiment, magnetic component 272 may be attached to at least one surface of pocket section 278. In an exemplary embodiment, magnetic component 272 is attached to all surfaces of pocket section 278. In an exemplary embodiment, pocket section 278 may be comprised of magnetic component 272. In other words, in an exemplary embodiment, the interior surface of pocket section 278 may be magnetic.

[0034] 2D , actuator 200 may include a set of electric coils 274. In an exemplary embodiment, the set of electric coils 274 may be attached to shaft 210 and therefore move with moveable component 212 and shaft 210. In an exemplary embodiment, the set of electric coils 274 is wound around shaft 210. In an exemplary embodiment, the set of electric coils 274 may not be wound around shaft 210, but may be coupled to bottom surface 264 of moveable component 212 such that the set of electric coils 274 is proximate to magnetic component 272 when moveable component 212 is in motion. As a result, when moveable component 212 is in motion, a magnetic field results from magnetic component 272, and because the set of electric coils 274 is within this magnetic field, a voltage is induced in the set of electric coils 274 due to the relative motion.

[0035] 2E illustrates one embodiment of a generator that generates electrical energy from the motion of the movable component 212. In an exemplary embodiment, the actuator 200 may include a set of electrical coils 294. In an exemplary embodiment, the set of electrical coils 294 may be attached to the movable component 212 and therefore move with the movable component 212. In an exemplary embodiment, the set of electrical coils 294 may be wrapped around the movable component 212. In an exemplary embodiment, the set of electrical coils 294 may be coupled to the bottom or top of the movable component 212.

[0036] In an exemplary embodiment, one or more magnetic components, such as component 292, may be coupled to rear surface 248. As shown in FIGS. 2A-2E , rear surface 248 forms a curved surface for accommodating shaft 210 within actuator 200. In an exemplary embodiment, one or more magnetic components, such as component 296, may be coupled to interior bottom surface 262 of actuator body 218. In an exemplary embodiment, one or more magnetic components, such as component 298, may be coupled to interior top surface 266 of actuator body 218. In one exemplary embodiment, one or more of magnetic components 292, 296, 298 may be a magnetic strip or set of magnets. In an exemplary embodiment, one or more of interior bottom surface 262, interior top surface 266, and / or rear surface 248 may be composed of a magnetic material. As a result, when the movable component 212 is in motion, a magnetic field results from one or more of the magnetic components 292, 296, and / or 298, and because the set of electrical coils 294 is within this magnetic field, a voltage is induced in the set of electrical coils 294 due to the relative motion.

[0037] 2B-2E provide a generator operating within a magnetic field, other generators (e.g., piezoelectric generators) can be implemented to convert the mechanical motion of the movable component 212 into electrical energy. For example, one or more piezoelectric generators can be positioned on the interior bottom surface 262 and / or the interior top surface 266, such that when the movable component 212 presses against the piezoelectric generator, the resulting pressure on the piezoelectric generator provides electrical energy proportional to the mechanical force of the movable component 212. In certain embodiments, the generator may include a piezoelectric ceramic (PZT) connected (e.g., carried) by a moving component of an actuator and a reactive mass coupled to the PZT, whereby movement of the actuator during opening and / or closing of the gate valve causes the reactive mass to exert an inertial force on the PZT, which in turn exerts a strain in the PZT and generates an electrical signal according to the movement of the actuator. As will be understood by those skilled in the art in view of the present disclosure, electrical energy generated from the exemplary generator implemented within actuator 200 in Figures 2B-2D can be stored (e.g., in one or more capacitors, batteries, etc.) so that the internal voltage supply is then available to power one or more tools of substrate processing system 10. Such a built-in generator reduces the need to power components of system 10 through external connections that may require additional wiring.

[0038] Furthermore, as shown in FIG. 1A, a five-faceted system, such as processing system 10, includes at least 12 gate valves 100. In an exemplary embodiment, each junction includes a top gate valve and a bottom gate valve. As a result, some implementations, such as that shown in FIG. 1A, may include 24 gate valves 100. Therefore, including a generator within each actuator 200 of each gate valve 100 results in substantial collection of electrical energy that can be stored and reused.

[0039] 3 illustrates a method 300 for storing energy generated from the movement of an actuator, such as actuator 200, in a gate valve, such as gate valve 100, of a semiconductor processing system, such as semiconductor processing system 10. Method 300 includes providing a magnetic component (such as magnetic component 222, 232, 252, 272, 292, 296, 298), as shown in box 302. The magnetic component is coupled to a movable component (such as movable component 212) of the actuator.

[0040] Method 300 further includes providing an electrical component (e.g., component 224, 226, 234, 256, 274, 294), as indicated by box 304. The electrical component is electrically coupled to the magnetic component. An exemplary embodiment of method 300 further includes providing at least one bar (e.g., bar 220, 230). The bar guides the movable component to move in a determined direction. In the exemplary embodiment shown herein, the determined direction is vertical (i.e., up and down).

[0041] When the movable component is in motion and the electrical component is within the magnetic field of the magnetic component, the method 300 includes generating electrical energy that is stored for reuse. In an exemplary embodiment, the electrical energy can be generated by electrically coupling the electrical component to the bar. Further, in an exemplary embodiment, the bar can be comprised of the magnetic component.

[0042] Finally, method 300 includes storing the electrical energy generated by the electrical component. In an exemplary embodiment of method 300, the electrical component includes one or more sets of electrical coils. In an exemplary embodiment of method 300, the magnetic component includes one or more magnets.

[0043] While the present disclosure has been provided in the context of certain embodiments and examples, those skilled in the art will understand that the present disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses of the present embodiments and obvious modifications and their equivalents. In addition, while several variations of the embodiments of the present disclosure have been shown and described in detail, other modifications that are within the scope of the present disclosure will be readily apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or subcombinations of specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another to form varying modes of embodiment of the present disclosure. Therefore, it is not intended that the scope of the present disclosure should be limited by the specific embodiments described above.

[0044] Any headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the devices and methods disclosed herein.

Claims

1. 1. A substrate processing system having a gate valve assembly, comprising: a gate valve body defining a gate valve passage; a valve component movable to open and close the gate valve passage; an actuator coupled to the valve component, the actuator comprising a movable component, wherein mechanical movement of the movable component controls movement of the valve component to open and close the gate valve passage; a generator coupled to the movable component, the generator configured to convert the mechanical motion into electrical energy.

2. The generator, one or more pairs of electrical coils; 10. The substrate processing system of claim 1, comprising: one or more magnets electrically coupled to the one or more sets of electric coils, wherein at least one of the one or more magnets or the one or more electric coils is coupled to the moveable component, and when the moveable component is in motion, the one or more magnets and the one or more electric coils are electrically coupled to convert the mechanical motion of the moveable component into electrical energy.

3. The actuator 3. The substrate processing system of claim 2, comprising: at least one pillar coupled to the movable component, the at least one pillar guiding the movable component to move in a determined direction; at least one of the one or more magnets or the one or more sets of electric coils coupled to the at least one pillar, and the one or more sets of electric coils electrically coupled to the one or more magnets when the movable component is in motion to convert mechanical motion of the movable component into electrical energy.

4. The substrate processing system of claim 3 , wherein the one or more magnets are coupled to the at least one pillar.

5. The substrate processing system of claim 3 , wherein the at least one pillar is constructed from a magnetic material.

6. 3. The substrate processing system of claim 2, wherein the one or more sets of electrical coils are coupled to the moveable component and the one or more magnets are coupled to a non-movable section of the actuator.

7. 7. The substrate processing system of claim 6, wherein the non-movable section of the actuator comprises at least one of a rear section of the actuator, an interior bottom section of the actuator, or an interior top section of the actuator.

8. 8. The substrate processing system of claim 7, wherein the rear section comprises a curved rear section for accommodating a shaft of the movable component.

9. the movable component comprises a shaft; the actuator further comprising a pocket section having an intermediate opening; 3. The substrate processing system of claim 2, wherein the pocket section provides access to the shaft through the intermediate opening, and the pocket section accommodates the shaft within an inner pocket section when the gate valve passage is open.

10. 10. The substrate processing system of claim 9, wherein the one or more magnets are coupled to the interior pocket section and the one or more sets of electrical coils are coupled to the shaft.

11. The substrate processing system of claim 4 , wherein the one or more magnets are wrapped around the at least one pillar.

12. The substrate processing system of claim 2 , wherein the movable component is constructed from a magnetic material.

13. 2. The substrate processing system of claim 1, wherein the actuator comprises an upper section and a lower section, the upper section being a portion of the actuator between the gate valve body and the movable component, and the lower section being the remaining section of the actuator, and the generator being contained within the lower section of the actuator.

14. The substrate processing system of claim 1 , wherein the generator comprises a piezoelectric generator.

15. a first chamber having a first pressure zone; a second chamber having a second pressure zone, the first pressure zone operating at a different pressure than the second pressure zone; 10. The substrate processing system of claim 1, wherein the gate valve assembly is coupled to the first chamber and the second chamber.

16. 1. A method for storing energy generated from movement of an actuator in a gate valve of a semiconductor processing system, comprising: Providing a magnetic component; providing an electrical component electrically coupled to the magnetic component, the electrical component generating electrical energy when a movable component of the actuator is in motion and the electrical component is within a magnetic field of the magnetic component; storing the electrical energy generated by the electrical component.

17. providing at least one pillar, the at least one pillar guiding the movable component to move in a determined direction; generating electrical energy that is stored for reuse; further comprising electrically coupling the electrical component to the at least one pillar. The method of claim 16 further comprising providing at least one pillar.

18. The method of claim 17 , wherein the at least one pillar is constructed from a magnetic material.

19. The method of claim 16 , wherein providing the electrical component comprises coupling the electrical component to the movable component of the actuator.

20. An actuator, a movable component; one or more sets of electrical coils coupled to the movable component; one or more magnets coupled to the one or more sets of electric coils, wherein when the movable component is in motion, the one or more magnets and the one or more sets of electric coils are electrically coupled to convert mechanical motion of the actuator into electrical energy.

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