Method for dividing glass substrate using laser

Abstract

To provide a method for dividing a glass substrate, capable of suppressing back crack defects.SOLUTION: A method for dividing a glass substrate, capable of dividing the glass substrate including a glass core, an upper laminate and a lower laminate into a plurality of units comprises: a laminate removal step of removing the upper and lower laminates in an area to be divided along a predetermined line using a laser; a laser perforation step of perforating the glass core along a predetermined line using the laser; and a physical or laser breaking step of dividing the glass substrate subjected to the perforation step into a plurality of units by a physical method.SELECTED DRAWING: Figure 4b

Description

[Technical Field]

[0001] The present invention relates to a method for dividing a glass substrate into a plurality of units, wherein the glass substrate may include an interposer substrate and a core substrate.

[0002] In particular, the present invention relates to a method for dividing a glass substrate into a plurality of units using a laser. [Background technology]

[0003] Glass substrates, such as core substrates and interposer substrates, are substrates with multiple layers stacked on both sides. Glass substrates are used in high-performance semiconductor packaging processes. Glass substrates offer superior data transmission speeds and power efficiency, greatly contributing to the improvement of AI (Artificial Intelligence) semiconductor performance.

[0004] The conventional method for separating a glass substrate includes a mechanical processing step and a breaking step.

[0005] In the mechanical processing step, grooves are formed on the upper and lower surfaces of the glass substrate while removing multiple layers formed on both sides of the glass substrate with a wheel or blade. In the breaking processing step, the glass substrate is cut mechanically or with a laser along the grooves formed by the mechanical processing, thereby dividing the glass substrate into multiple units.

[0006] However, in the conventional glass substrate dividing method, cracks are generated on the surface or inside of the glass core when the glass substrate is mechanically processed using a mechanical wheel or blade. These cracks are likely to cause a defect called a spine crack (SeWaRe) defect, in which the glass substrate is broken horizontally after dividing. Summary of the Invention [Problem to be solved by the invention]

[0007] The problem to be solved by the present invention is to provide a method for dividing a glass substrate that can suppress spine crack defects.

[0008] In particular, the problem to be solved by the present invention is to provide a method for dividing a glass substrate, which can suppress spine crack defects by including at least two laser processes before the breaking process, can efficiently perform the breaking process, and can minimize the impact on elements during the breaking step.

[0009] The problems to be solved by the present invention are not limited to the above problems, and other unmentioned problems and advantages of the present invention can be understood from the following description and will be more clearly understood by the embodiments of the present invention. Furthermore, it will be easily understood that the problems and advantages of the present invention can be realized by the means set forth in the claims and combinations thereof. [Means for solving the problem]

[0010] In order to solve the above problems, a method for dividing a glass substrate according to an embodiment of the present invention is a method for dividing a glass substrate including a glass core, an upper laminate laminated on an upper surface of the glass core, and a lower laminate laminated on a lower surface of the glass core into a plurality of units, and includes a laminate removal step of removing the upper laminate and the lower laminate in a region to be divided along a predetermined line using a laser, a laser drilling step of drilling holes in the glass core along the predetermined line using a laser, and a physical or laser breaking step of dividing the glass substrate after the drilling step into a plurality of units by a physical method or a laser method.

[0011] The stack removal step may be performed such that the glass core is not laser etched or the etching depth from the top and / or bottom surface of the glass core is 1 μm or less.

[0012] The laminate removal step may be performed using a laser having a wavelength in the range of 1064 nm or less, for example, 257 to 1064 nm, and a pulse width of 100 ns or less, for example, 100 fs to 100 ns.

[0013] In the laminate removal step, the laser may be emitted from an optical system having one or more mirrors and operable on two axes, and a stage on which the glass substrate is placed may be operable on the X / Y / T / Z axes.

[0014] The laser perforation step may be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

[0015] In the laser drilling step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0016] The physical or laser breaking step may be performed by a physical method of tilting and dividing the glass substrate that has undergone the laser drilling step.

[0017] The physical or laser breaking step may be performed by a laser method in which heat is applied to the surface of the glass core of the glass substrate that has undergone the laser drilling step using a laser, and the glass core is divided while being cooled with a cooling fluid. The laser breaking step may be performed using a CW (continuous wave) laser having a wavelength of 200 to 10900 nm and a pulse width of 100 ns to 100 fs.

[0018] The glass core may have a thickness of 0.03 mm to 3 mm.

[0019] In order to solve the above problems, a method for dividing a glass substrate according to another embodiment of the present invention is a method for dividing a glass substrate including a glass core, an upper laminate laminated on an upper surface of the glass core, and a lower laminate laminated on a lower surface of the glass core into a plurality of units, the method including: a laminate removing step of removing each of the upper laminate and the lower laminate in a region to be divided along a predetermined line using a laser; a laser drilling step of drilling holes in the glass core along the predetermined line using a laser; a physical or laser breaking step of dividing the glass substrate after the drilling step into a plurality of units by a physical or laser method; and a chamfering step of processing corners of the glass cores of the divided units after the physical or laser breaking step.

[0020] The laminate removal step may be performed such that the glass core is not laser etched or the etching depth from the top and / or bottom surfaces of the glass core is 1 μm or less.

[0021] The laminate removal step may be performed using a laser having a wavelength in the range of 257 to 1064 nm and a pulse width of 100 fs to 100 ns.

[0022] In the laminate removal step, the laser may be emitted from an optical system having one or more mirrors and operable on two axes, and a stage on which the glass substrate is placed may be operable on the X / Y / T / Z axes.

[0023] The laser perforation step may be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

[0024] In the laser drilling step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0025] The physical or laser breaking step may be performed by a physical method of tilting and dividing the glass substrate that has undergone the laser drilling step.

[0026] The physical or laser breaking step may be performed by a laser method in which heat is applied to the surface of the glass core of the glass substrate that has undergone the laser drilling step using a laser, and the glass core is divided while being cooled with a cooling fluid. The laser breaking step may be performed using a CW (continuous wave) laser having a wavelength of 200 to 10900 nm and a pulse width of 100 ns to 100 fs.

[0027] The chamfering may be performed by a grinding method.

[0028] The chamfering may be performed by a laser method, in which case the chamfering step may be performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

[0029] The glass core may have a thickness of 0.03 mm to 3 mm.

[0030] In accordance with another embodiment of the present invention for solving the above problems, a method for dividing a glass substrate includes a glass core, an upper laminate laminated on an upper surface of the glass core, and a lower laminate laminated on a lower surface of the glass core, and divides the glass substrate into a plurality of units. The method includes a laminate removing step of removing the upper laminate and the lower laminate in a region to be divided along a predetermined line using a laser, a laser drilling step of drilling holes in the glass core along the predetermined line using a laser, a chamfering step of processing corners of the glass core of the unit to be divided using a laser, and a physical or laser breaking step of dividing the glass substrate, after the drilling and chamfering steps, into a plurality of units by a physical or laser method.

[0031] The stack removal step may be performed such that the glass core is not laser etched or the etching depth from the top and / or bottom surface of the glass core is 1 μm or less.

[0032] The laminate removal step may be performed using a laser having a wavelength in the range of 257 to 1064 nm and a pulse width of 100 fs to 100 ns.

[0033] In the laminate removal step, the laser may be emitted from an optical system having one or more mirrors and operable on two axes, and a stage on which the glass substrate is placed may be operable on the X / Y / T / Z axes.

[0034] The laser perforation step may be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

[0035] In the laser drilling step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0036] The chamfering may be performed by a laser method, in which case the chamfering step may be performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

[0037] The physical or laser breaking step may be performed by a physical method of tilting and dividing the glass substrate that has been subjected to the laser drilling and chamfering steps.

[0038] The physical or laser breaking step may be performed by a laser method in which heat is applied to the surface of the glass core of the glass substrate that has undergone the laser drilling step and the chamfering step using a laser, and the glass core is cooled with a cooling fluid while being broken.

[0039] The glass core may have a thickness of 0.03 mm to 3 mm. [Effects of the Invention]

[0040] The method for dividing a glass substrate according to the present invention not only suppresses spine crack defects by using a laser to remove the laminate and perform laser perforation before the breaking process, but also allows the breaking process to be carried out efficiently by forming a series of perforation lines.

[0041] Furthermore, the glass substrate dividing method according to the present invention can minimize the impact on devices during breaking by performing the breaking step using a physical or laser method. While chemical breaking provides superior strength, the liquid used in chemical breaking can contaminate the substrate surface, necessitating the application of a protective film or masking film. Furthermore, in the case of an interposer substrate, the glass may be too thin and may break during transfer. Physical or laser breaking is a method that can be applied regardless of the thickness of the substrate.

[0042] In addition, the glass substrate dividing method according to the present invention can eliminate microcracks in individual units by performing a chamfering step on the corners of the glass core, thereby further increasing the efficiency of suppressing spine crack (SeWaRe) defects. The chamfering process can also provide the effect of enabling tilting with lower force than in physical breaking methods, for example.

[0043] Furthermore, the glass substrate dividing method according to the present invention can be applied to glass cores with various thicknesses ranging from 0.03 mm to 3 mm.

[0044] In addition to the above-mentioned effects, specific effects of the present invention will be described below together with specific matters for carrying out the invention. [Brief explanation of the drawings]

[0045] [Figure 1] 1 is a diagram schematically illustrating a glass substrate having laminates laminated on the top and bottom of a glass core. [Figure 2] 1A to 1C are diagrams schematically illustrating a method for dividing a glass substrate according to a conventional technique. [Figure 3] FIG. 10 is a diagram schematically showing an example in which a spine crack (SeWaRe) defect occurs after division. [Figure 4a] FIG. 1 is a flow chart schematically illustrating a method for dividing a glass substrate according to an embodiment of the present invention. [Figure 4b] 4b is a diagram illustrating the steps of FIG. 4a. FIG. [Figure 5] 10A-10C are diagrams illustrating an example of a stack removal step. [Figure 6] FIG. 10 is a diagram showing an example of a laser optical system and a stage used in the laminate removal step. [Figure 7] 1A-1C are diagrams showing a schematic diagram of a laser drilling step. [Figure 8] 10A and 10B are schematic diagrams illustrating an example in which a laser drilling step is performed along the dividing line. [Figure 9] Schematic diagram of (a) physical breaking and (b) laser breaking. [Figure 10a] FIG. 10 is a flow chart schematically showing a method for dividing a glass substrate according to another embodiment of the present invention. [Figure 10b] 10b shows a schematic diagram of each step of FIG. 10a. [Figure 11] FIG. 1 is a diagram showing (a) grinding-type chamfering and (b) laser-type chamfering. [Figure 12a] FIG. 10 is a flow chart schematically illustrating a method for dividing a glass substrate according to still another embodiment of the present invention. [Figure 12b] 12b shows a schematic diagram of each step of FIG. 12a. DETAILED DESCRIPTION OF THE INVENTION

[0046] The advantages and features of the present invention, as well as methods for achieving them, will become more apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various different forms. The present embodiments are provided solely for the purpose of complete disclosure of the present invention and to enable those skilled in the art to fully understand the scope of the invention. The present invention is defined solely by the claims. The same reference numerals refer to the same elements throughout the specification.

[0047] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation are omitted, and the same or similar components are given the same reference numerals throughout the specification. Furthermore, the size and thickness of each component shown in the drawings are shown arbitrarily for the convenience of explanation, and the present invention is not necessarily limited to those shown in the drawings.

[0048] Throughout the specification, when a part is said to be "connected" to another part, this includes not only "directly connected" but also "indirectly connected" via other members. Furthermore, when a part is said to "comprise" a certain component, this does not mean that it excludes other components, but rather that it can further include other components, unless otherwise specified.

[0049] In this specification, the terms "forward" and "rearward" are used relative to the direction of travel of the beam, and the direction approaching the workpiece is defined as "rearward."

[0050] Hereinafter, a method for dividing a glass substrate using a laser according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0051] FIG. 1 is a diagram schematically illustrating a glass substrate having laminates laminated on the top and bottom of a glass core.

[0052] The glass substrate 100 can include an interposer substrate and a core substrate.

[0053] The glass substrate 100 includes a glass core 110, an upper laminate 120a laminated on the upper surface of the glass core 110, and a lower laminate 120b laminated on the lower surface of the glass core 110.

[0054] The upper laminate 120a and / or the lower laminate 120b disposed on both sides of the glass core 110 of the glass substrate 100 are divided into a plurality of element units and outer shells of the respective element units, and specific positions of the outer shells between the element units are to be cut. The glass core 110 may include one or more via holes that electrically connect the upper laminate 120a and the lower laminate 120b.

[0055] The thickness of the glass core 110 that can be used in the method for dividing a glass substrate using a laser according to the present invention can vary within a range of 0.03 mm to 3 mm.

[0056] The upper stack 120a and / or the lower stack 120b include at least one layer, which may typically be a polymer, an Ajinomoto Build-up Film (ABF), silicon nitride, a solder resist (SR), or the like.

[0057] FIG. 2 is a diagram schematically showing a method for dividing a glass substrate according to the prior art.

[0058] Referring to FIG. 2, the conventional method for dividing a glass substrate includes a mechanical processing step and a breaking step.

[0059] 2(a) and 2(b), in the mechanical processing step, a groove 220 is formed on the upper surface of the glass core 110 by removing the upper laminate 120a formed on the upper surface of the glass core 110 using a wheel or blade 210. In the breaking processing step, the glass substrate is cut mechanically, chemically, or by using a laser along the groove 220 formed by the mechanical processing, thereby dividing the glass substrate into a plurality of units.

[0060] However, in the conventional glass substrate dividing method, cracks occur on the surface or inside of the glass core 110 when the glass substrate is mechanically processed using a mechanical wheel or blade 210 .

[0061] This crack is likely to cause a defect in which the glass core splits horizontally after separation, also known as a spine crack (SeWaRe) defect.

[0062] FIG. 3 is a diagram schematically showing an example in which a spine crack (SeWaRe) defect occurs after cutting.

[0063] Referring to FIG. 3(a), a crack 310 is formed along the horizontal direction of the glass core 110. As described above, such a crack 310 is mainly generated when a glass substrate is mechanically processed using a mechanical wheel or blade. This crack 310 may cause the divided glass substrate to break horizontally, as shown in FIG. 3(b). This type of defect, i.e., a spine crack defect, has a negative impact on the manufacturing yield and operational reliability of the device, and therefore must be suppressed as much as possible.

[0064] Fig. 4a is a flow diagram schematically illustrating a method for dividing a glass substrate according to an embodiment of the present invention, and Fig. 4b is a diagram schematically illustrating each step of Fig. 4a.

[0065] Referring to FIGS. 4a and 4b, the illustrated method for dividing a glass substrate includes an upper and lower laminate removal step (S410), a laser drilling step (S420), and a physical or laser breaking step (S430).

[0066] The present invention provides a method for dividing a glass substrate including a glass core 110, an upper laminate 120a laminated on the upper surface of the glass core, and a lower laminate 120b laminated on the lower surface of the glass core into a plurality of units.

[0067] First, in the upper and lower laminate removal step (S410), a laser is used to remove the upper and lower laminates in the region to be divided along a predetermined line in a top view. For example, as shown in FIG. 4b, the upper laminate 120a may be removed first (S410a) and then the lower laminate 120b may be removed (S410b), or vice versa.

[0068] FIG. 5 is a diagram illustrating an example of a laminate removal step. As shown in FIG. 5, the upper laminate 120a may be removed along a predetermined line with a laser to form the upper glass core exposed portion 510a. Similarly, the lower laminate 120b may be removed along a predetermined line with a laser to form the lower glass core exposed portion 510b. While it may be possible to perform the laminate removal and laser drilling in a single process, this may result in problems such as impurity contamination during the laser drilling process. However, by first exposing the upper and lower surfaces of the glass core 110 by removing the upper and lower laminates with a laser, as in the present invention, problems such as impurity residue in the subsequent laser drilling step (S420) can be prevented.

[0069] The upper and lower laminate removal step (S410) is preferably performed so that the glass core is not easily affected by the laser, i.e., so that the glass core is not damaged. This provides a protective effect against microcracks, i.e., suppresses the occurrence and expansion of microcracks. For example, the upper and lower laminate removal step (S410) may be performed so that the glass core 110 is not laser-etched or so that the etching depth from the upper and / or lower surfaces of the glass core 110 is 1 μm or less.

[0070] To this end, the upper and lower laminate removal step (S410) may be performed using a laser having a wavelength of 1064 nm or less, specifically 257 to 1064 nm, and a pulse width of 100 ns or less, specifically 100 fs to 100 ns. If the laser wavelength used in the laminate removal step exceeds 1064 nm, the absorption at the glass surface may increase, damaging the surface and potentially causing cracks. Furthermore, if the laser pulse width used in the laminate removal step exceeds 100 ns, a large heat-affected zone (HAZ) may be generated in the polymer being removed, potentially leading to unit defects.

[0071] FIG. 6 is a diagram schematically illustrating an example of a laser optical system and a stage used in the laminate removal step.

[0072] In the upper and lower laminate removal step (S410), as shown in FIG. 6, a laser may be emitted from an optical system 610 having one or more mirrors and operable on two axes. A stage 620 on which the glass substrate is placed may operate on the X, Y, T, and Z axes. That is, the stage can move along the X, Y, and Z axes, and can turn, for example, along the horizontal T axis. With this configuration of the laser optical system 610 and the stage 620, even if the thicknesses of the upper and lower laminates are different, the upper and lower laminates can be stably removed at a predetermined width along the predetermined dividing line L.

[0073] On the other hand, FIG. 6 shows an example in which the laminate of glass substrates 100 is removed along a predetermined dividing line L corresponding to the Y axis.

[0074] Then, in the laser drilling step (S420), a laser is used to form perforations 410 in the glass core along predetermined lines.

[0075] Fig. 7 is a diagram schematically illustrating the laser perforation step. Fig. 8 is a diagram schematically illustrating an example in which the laser perforation step is performed along the dividing line. As shown in Fig. 7, the upper laminate 120a and the lower laminate 120b are removed, exposing the glass core 110, and a laser is irradiated to form perforations 710 in the thickness direction of the glass core. A plurality of perforations 710 are formed along the dividing line L.

[0076] The laser drilling step may be performed using a laser with a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs. If the wavelength of the laser used in the laser drilling step is less than 515 nm, problems may occur during processing due to increased glass absorption. Furthermore, if the laser pulse width used in the laminate drilling step exceeds 100 ps, ​​problems may occur in that many cracks occur inside and outside the glass. For this reason, in the laser drilling step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0077] Next, in the physical or laser breaking step (S430), the glass substrate that has been subjected to the perforation step is divided into a plurality of units by a physical or laser method.

[0078] Generally, breaking is performed by chemical etching. However, chemical etching can cause problems such as the penetration of an etching solution into the device, which can affect the device operation and stability. Furthermore, applying chemical etching requires additional processes such as attaching a masking film or a protective film. Therefore, the present invention solves the problems associated with chemical etching by performing breaking using a physical or laser method.

[0079] The laser drilling step creates a weakened strength along the line of separation, facilitating subsequent physical or laser breaking steps.

[0080] FIG. 9 is a diagram showing (a) physical (tilt) breaking and (b) laser breaking.

[0081] The physical or laser breaking step (S430) may be performed by a physical method such as the tilt method shown in (a) of Figure 9. By tilting while holding the unit to be divided, the glass substrate can be broken into units along the pre-formed perforations.

[0082] Alternatively, the physical or laser breaking step (S430) may be performed using a laser, as shown in Figure 9(b). For example, physical or laser breaking can be performed by applying heat to the surface of the glass core of the glass substrate that has undergone the laser drilling step using a laser that can be easily absorbed by the glass surface, and then cooling the glass core with a cooling fluid such as air, gas, or water to separate the glass core. The laser used in laser breaking is preferably a laser that can be easily absorbed by the glass surface, and a CO2 laser, for example, can be used.

[0083] Fig. 10a is a flow diagram schematically showing a method for dividing a glass substrate according to another embodiment of the present invention, and Fig. 10b is a diagram schematically showing each step of Fig. 10a.

[0084] The glass substrate cutting method shown in FIG. 10a includes an upper and lower laminate removal step (S1010), a laser drilling step (S1020), a physical or laser breaking step (S1030), and a chamfering step (S1040).

[0085] In the upper and lower laminate removal step (S1010), a laser is used to remove the upper laminate 120a stacked on the upper side of the glass core 110 in the region to be divided along a predetermined line, and the lower laminate 120b stacked on the lower side of the glass core 110. Figure 10b shows a process of removing the upper laminate 120a using a laser (S1010a) and then removing the lower laminate 120b using a laser (S1010b), but the reverse is also possible.

[0086] The laminate removal step may be performed such that the glass core 110 is not laser-etched or such that the etching depth from the upper and / or lower surfaces of the glass core 110 is 1 μm or less. The laminate removal step may be performed using a laser having a wavelength range of 1064 nm or less and a pulse width of 100 ns or less. In the laminate removal step, the laser is emitted from an optical system having one or more mirrors and capable of moving on two axes, and a stage on which the glass substrate is placed may move on the X / Y / T / Z axes.

[0087] Next, in the laser drilling step (S1020), a laser is used to form a hole 1010 in the glass core 110 along a predetermined line. The laser drilling step may be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs. In the laser drilling step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0088] Next, in the physical or laser breaking step (S1030), the glass substrate that has been subjected to the perforation step is divided into a plurality of units by physical or laser breaking.

[0089] The physical or laser breaking step may be performed by a physical method in which the glass substrate that has undergone the laser drilling step is tilted to be divided. Alternatively, the physical or laser breaking step may be performed by a laser method in which heat is applied to the surface of the glass core of the glass substrate that has undergone the laser drilling step using a laser with high glass surface absorption, and the glass core is cooled with a cooling fluid to be divided.

[0090] The upper and lower laminate removal step (S1010), laser drilling step (S1020), and physical or laser breaking step (S1030) illustrated in Figures 10a and 10b may be performed in substantially the same manner as the upper and lower laminate removal step (S410), laser drilling step (S420), and physical or laser breaking step (S430) illustrated in Figures 4a and 4b described above.

[0091] Next, in a chamfering step (S1040), the corners of the glass core of the divided units are processed after the physical or laser breaking step.

[0092] The chamfering step (S1040) is performed to remove chips that occur after physical or laser breaking or to chamfer sharp corners. The shape of the chamfered surface 1020 may be angular or C-shaped.

[0093] In the present invention, the upper and lower laminate removal step (S1010) allows the chamfering process to be performed only on the corners of the glass core in the chamfering step (S1040), thereby eliminating microcracks at the corners of the glass core and improving the effect of suppressing spine crack defects.

[0094] FIG. 11 is a diagram showing (a) grinding type chamfering and (b) laser type chamfering.

[0095] The chamfering may be performed by a grinding method using a grinder 910 as shown in FIG. 11(a).

[0096] As another example, chamfering may be performed using a laser, as shown in Figure 11(b). In this case, the chamfering step may be performed using a laser with a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs to minimize heat transfer to the glass core. If the laser wavelength used in the chamfering step exceeds 355 nm, the glass absorption may be low, which may cause problems during the chamfering process. Furthermore, if the pulse width of the laser used in the chamfering step exceeds 100 ps, ​​excessive heat may be generated during processing, which may actually increase the number of microcracks.

[0097] Fig. 12a is a flow chart schematically showing a method for dividing a glass substrate according to still another embodiment of the present invention, and Fig. 12b is a diagram schematically showing each step of Fig. 12a.

[0098] The glass substrate cutting method illustrated in Figures 12a and 12b includes an upper and lower laminate removal step (S1210), a laser drilling step (S1220), a chamfering step (S1230), and a physical or laser breaking step (S1240).

[0099] In the upper and lower laminate removal step (S1210), a laser is used to remove the upper laminate 120a stacked on the upper side of the glass core 110 in the region to be divided along a predetermined line, and the lower laminate 120b stacked on the lower side of the glass core 110. Figure 12b shows a process of removing the upper laminate 120a using a laser (S1210a) and then removing the lower laminate 120b using a laser (S1210b), but the reverse is also possible.

[0100] The upper and lower laminate removal step (S1210) may be performed so that the glass core 110 is not laser-etched or so that the etching depth from the upper and / or lower surfaces of the glass core 110 is 1 μm or less. The upper and lower laminate removal step (S1210) may be performed using a laser having a wavelength range of 1064 nm or less and a pulse width of 100 ns or less. In the laminate removal step, the laser is emitted from an optical system having one or more mirrors and capable of moving on two axes, and a stage on which the glass substrate is placed may move on the X / Y / T / Z axes.

[0101] Next, in the laser drilling step (S1220), a laser is used to form a hole 1210 in the glass core 110 along a predetermined line. The laser drilling step may be performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs. In the laser drilling step, the laser may be emitted from a filamentation or Bessel beam optical system.

[0102] Next, in the physical or laser breaking step (S1240), the glass substrate that has been subjected to the drilling step and the chamfering step (S1230) is divided into a plurality of units by physical or laser breaking.

[0103] The physical or laser breaking step (S1240) may be performed by a physical method in which the glass substrate is tilted to break it. Alternatively, the physical or laser breaking step may be performed by a laser method in which heat is applied to the surface of the glass core of the glass substrate by a laser and the glass core is cooled with a cooling fluid to break it.

[0104] The upper and lower laminate removal step (S1210), laser drilling step (S1220), and physical or laser breaking step (S1240) shown in Figures 12a and 12b may be performed in substantially the same manner as the upper and lower laminate removal step (S410), laser drilling step (S420), and physical or laser breaking step (S430) shown in Figures 4a and 4b described above, or the upper and lower laminate removal step (S1010), laser drilling step (S1020), and physical or laser breaking step (S1030) shown in Figures 10a and 10b described above.

[0105] On the other hand, in the glass substrate dividing method shown in Figures 12a and 12b, unlike the method shown in Figures 10a and 10b, the chamfering step (S1230) is performed first, followed by the physical or laser breaking step (S1240).

[0106] In the glass substrate dividing method shown in FIGS. 12a and 12b, in the chamfering step (S1230), a laser is used to process the corners of the glass core of the unit to be divided.

[0107] The chamfering step (S1230) is performed to chamfer sharp corners. The shape of the chamfered surface 1220 may be angular or C-shaped.

[0108] The chamfering step may be performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

[0109] On the other hand, in the glass substrate dividing method illustrated in FIGS. 12a and 12b, the chamfering step is performed before the physical or laser breaking step, and therefore chamfering using a grinder is not applied.

[0110] As described above, by performing laminate removal and laser perforation using a laser before the breaking process of the present invention, not only can spine crack defects be suppressed, but also a series of perforation lines can be formed, allowing the breaking process to be carried out efficiently, and by performing physical or laser breaking, the impact on the element during breaking can be minimized.

[0111] Although the present invention has been described above with reference to preferred embodiments, various modifications and variations may be made by a person skilled in the art to which the present invention pertains. Such modifications and variations are within the scope of the present invention as long as they do not deviate from the technical concept of the present invention. Therefore, the scope of the present invention should be determined by the following claims. [Explanation of symbols]

[0112] 100: Glass substrate 110: Glass core 120a: Upper laminate 120b: Lower laminate 410, 710, 1010, 1210: Perforation 610: Laser optics 620: Stage 910: Grinder 1020, 1220: Chamfered surface

Claims

1. A method for dividing a glass substrate including a glass core, an upper laminate laminated on an upper surface of the glass core, and a lower laminate laminated on a lower surface of the glass core into a plurality of units, comprising: a laminate removal step of removing the upper laminate and the lower laminate in the region to be divided along a predetermined line using a laser; a laser drilling step of drilling holes in the glass core along predetermined lines using a laser; A physical or laser breaking step of dividing the glass substrate that has undergone the perforation step into a plurality of units by a physical or laser method.

2. A method for dividing a glass substrate including a glass core, an upper laminate laminated on an upper surface of the glass core, and a lower laminate laminated on a lower surface of the glass core into a plurality of units, comprising: a laminate removal step of removing the upper laminate and the lower laminate in the region to be divided along a predetermined line using a laser; a laser drilling step of drilling holes in the glass core along predetermined lines using a laser; a physical or laser breaking step of dividing the glass substrate subjected to the perforation step into a plurality of units by a physical or laser method; The method further comprises, after the physical or laser breaking step, a chamfering step for machining corners of the glass core of the divided units.

3. The method according to claim 2 , wherein the chamfering is performed by grinding.

4. The method of claim 2 , wherein the chamfering is performed by a laser.

5. 5. The method of claim 4, wherein the chamfering step is performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

6. A method for dividing a glass substrate including a glass core, an upper laminate laminated on an upper surface of the glass core, and a lower laminate laminated on a lower surface of the glass core into a plurality of units, comprising: a laminate removal step of removing the upper laminate and the lower laminate in the region to be divided along a predetermined line using a laser; a laser drilling step of drilling holes in the glass core along predetermined lines using a laser; a chamfering step of processing the corners of the glass core of the unit to be separated using a laser; a physical or laser breaking step of dividing the glass substrate, which has been subjected to the drilling step and the chamfering step, into a plurality of units by a physical or laser method.

7. 7. The method of claim 6, wherein the chamfering step is performed using a laser having a wavelength of 265 to 355 nm and a pulse width of 100 ps to 100 fs.

8. 8. The method according to claim 1, wherein the laminate removal step is performed such that the glass core is not laser etched or the etching depth from the top and / or bottom surface of the glass core is 1 μm or less.

9. 8. The method according to claim 1, wherein the layered structure removal step is performed using a laser having a wavelength in the range of 257 to 1064 nm and a pulse width in the range of 100 fs to 100 ns.

10. 8. The method according to claim 1, wherein in the laminate removal step, the laser is emitted from an optical system having one or more mirrors and operable on two axes, and a stage on which the glass substrate is placed operates on the X / Y / T / Z axes.

11. 8. The method of claim 1, wherein the laser drilling step is performed using a laser having a wavelength of 515 to 1064 nm and a pulse width of 100 ps to 100 fs.

12. 8. The method according to claim 1, wherein in the laser drilling step, the laser is emitted from a filamentation or Bessel beam optical system.

13. The method according to claim 1 , wherein the physical or laser breaking step is performed by a physical method of tilting and breaking the glass substrate.

14. 8. The method according to claim 1, wherein the physical or laser breaking step is performed by a laser method in which heat is applied to a glass core surface of the glass substrate with a laser that can be absorbed by the glass surface, and the glass core is broken while being cooled with a cooling fluid.

15. The method according to any one of claims 1 to 7, wherein the glass core has a thickness of 0.03 mm to 3 mm.

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