Light emitting device and device including the same

Abstract

To provide a technique advantageous for improving moisture resistance performance of a light emitting device.SOLUTION: A display device includes: a light emitting region having a plurality of light emitting elements disposed on a main surface of a substrate; a moisture resistant ring disposed on the main surface so as to surround the light emitting region; and an insulating layer covering the light emitting region and the moisture resistant ring. In orthogonal projection with respect to the main surface, the insulating layer has a shape in which a first portion having a plurality of corner portions including a first corner portion and a second portion having a shape in which the first corner portion is expanded outward are combined.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a light emitting device and an apparatus including the same. [Background technology]

[0002] Patent Document 1 describes the provision of a guard ring on a light-emitting device to prevent the influence of impacts and static electricity on the driver circuit or pixels of the light-emitting device when cutting the original substrate to obtain multiple light-emitting devices, and to prevent moisture from entering the device from the end faces. Such a guard ring is also called a moisture-resistant ring. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-29070 Summary of the Invention [Problem to be solved by the invention]

[0004] The moisture-resistant ring is covered with an insulating layer to improve moisture resistance. Because this insulating layer interferes with dicing the substrate, the insulating layer in the scribe area can be removed in an etching process before dicing. The etching process can be performed through openings in a photoresist pattern formed by a photolithography process. If the corners of the openings in the photoresist pattern are rounded due to a defect in the photolithography process or if there is a slight alignment error, the corners of the moisture-resistant ring may be exposed, which may result in the corners of the moisture-resistant ring being removed in the etching process. In such cases, the moisture resistance of the light-emitting device may be reduced.

[0005] An object of the present invention is to provide a technique that is advantageous for improving the moisture resistance of a light-emitting device. [Means for solving the problem]

[0006] One aspect of the present invention relates to a display device comprising: a light-emitting region having a plurality of light-emitting elements arranged on a main surface of a substrate; a moisture-resistant ring arranged on the main surface to surround the light-emitting region; and an insulating layer covering the light-emitting region and the moisture-resistant ring, wherein, in an orthogonal projection onto the main surface, the insulating layer has a shape that combines a first portion having a plurality of corners including a first corner and a second portion having a shape in which the first corner is expanded outward. [Effects of the Invention]

[0007] According to the present invention, a technique is provided that is advantageous for improving the moisture resistance of a light-emitting device. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view schematically showing the configuration of a light emitting device according to a first embodiment. [Figure 2] 5A and 5B are diagrams for explaining the shape of an insulating layer that covers a light-emitting region and a moisture-resistant ring. [Figure 3A] FIG. 3 is a plan view showing a first modified example of the light emitting device of the first embodiment. [Figure 3B] FIG. 10 is a plan view showing a second modified example of the light emitting device of the first embodiment. [Figure 3C] FIG. 10 is a plan view showing a third modified example of the light emitting device of the first embodiment. [Figure 4] 2 is a schematic cross-sectional view showing an example of the configuration of a light emitting device taken along the cut line A in FIG. 1. [Figure 5] 2 is an enlarged view schematically showing an example of the configuration of the light emitting device in cut area B of FIG. 1. [Figure 6A] 10A and 10B are plan views showing modified shapes of insulating layers at corners of the moisture-resistant ring. [Figure 6B] 10A and 10B are plan views showing other modified shapes of the insulating layer at the corners of the moisture-resistant ring. [Figure 7] FIG. 10 is a plan view schematically showing the configuration of a light emitting device according to a second embodiment. [Figure 8A] Enlarged view of cut area C in Figure 7. [Figure 8B]8 is an enlarged view showing a modified example of the configuration of the cut area C in FIG. 7. [Figure 9] FIG. 2 is a plan view schematically showing the configuration of an original substrate on which a plurality of light emitting devices are arranged during the manufacturing process. [Figure 10A] 10A to 10C are diagrams for explaining a process flow for forming grooves by etching an insulating layer disposed in a scribe area. [Figure 10B] 10A to 10C are diagrams for explaining a process flow for forming grooves by etching an insulating layer disposed in a scribe area. [Figure 10C] 10A to 10C are diagrams for explaining a process flow for forming grooves by etching an insulating layer disposed in a scribe area. [Figure 11] FIG. 1 is a schematic view showing a first application example of a light emitting device according to an embodiment. [Figure 12] FIG. 10 is a schematic diagram showing a second application example of the light emitting device according to the embodiment. [Figure 13] FIG. 10 is a schematic diagram showing a third application example of the light emitting device according to the embodiment. [Figure 14] FIG. 10 is a schematic view showing a fourth application example of the light emitting device according to the embodiment. [Figure 15] 8A to 8C are schematic diagrams showing fifth and sixth application examples of the light emitting device according to the embodiment. [Figure 16] 8A to 8C are schematic diagrams showing seventh and eighth application examples of the light emitting device according to the embodiment. [Figure 17] 10A to 10C are schematic diagrams showing a ninth application example and a tenth application example of the light emitting device according to the embodiment. [Figure 18] 11A to 11C are schematic diagrams showing an eleventh application example and a twelfth application example of the light emitting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] FIG. 1 is a plan view schematically illustrating the configuration of a light-emitting device 100 according to a first embodiment. The light-emitting device 100 includes a plurality of light-emitting elements 111 arranged on a main surface of a substrate 200. The main surface of the substrate 200 is indicated as a main surface PS in FIG. 4, which will be referred to later. The plurality of light-emitting elements 111 form a light-emitting region 110. The light-emitting region 110 may also be understood as a pixel array. The light-emitting elements 111 may be, for example, organic light-emitting diode (OLED) elements. The light-emitting device 100 may also include a moisture-resistant ring 120 arranged on the main surface of the substrate 200 to surround the light-emitting region 110. The moisture-resistant ring 120 may have a frame shape that surrounds the entire periphery of the light-emitting region 110.

[0011] Before dicing an original substrate on which a plurality of light emitting devices 100 are formed, the plurality of light emitting devices 100 are arranged on the original substrate, separated by scribe areas 130. The plurality of light emitting devices 100 can be diced, i.e., chipped, by cutting the original substrate at the scribe areas 130. After dicing, part of the scribe areas 130 may remain around the light emitting devices 100. The moisture-resistant ring 120 prevents the effects of impact when cutting the original substrate and static electricity from spreading to the light emitting region 110, etc., and prevents moisture from entering the light emitting device 100 from the cut surface of the original substrate (the edge surface of the light emitting device 100).

[0012] The light-emitting device 100 includes an insulating layer 140 that covers the light-emitting region 110 and the moisture-resistant ring 120. The insulating layer 140 can function as a sealing layer. The insulating layer 140 as a sealing layer, for example, prevents moisture from penetrating into each light-emitting element 111 in the light-emitting region 110. A portion of the insulating layer 140 in the scribe area 130 is removed by etching through openings in a photoresist pattern formed by a photolithography process. In an orthogonal projection onto the main surface of the substrate 200 (which is conveniently also referred to as a plan view or a top view; FIG. 1 schematically illustrates the orthogonal projection onto the main surface of the substrate 200), the outer edge of the insulating layer 140 completely surrounds the outer edge of the moisture-resistant ring 120. The outer edge of the insulating layer 140 is positioned at a minimum distance greater than a predetermined distance from the outer edge of the moisture-resistant ring 120. In an orthogonal projection onto the main surface of the substrate 200, the insulating layer 140 may have a shape that combines a first portion having a plurality of corners and a second portion having a shape in which the plurality of corners are bulged outward. This configuration may ensure moisture resistance.

[0013] The shape of the insulating layer 140 will be described with reference to FIG. 2. Note that the shape shown in FIG. 2 is exaggerated for ease of explanation. FIG. 2(a) shows only the insulating layer 140 of FIG. 1. FIG. 2(b) shows the first portion 141, and FIG. 2(c) shows the second portion 142. In an orthogonal projection onto the main surface of the substrate 200, the insulating layer 140 may have a shape that combines the first portion 141 having multiple corners C1 to C4 and the second portion 142 having a shape in which the multiple corners C1 to C4 expand outward. Here, on one side, the multiple corners C1 to C4 include a first corner (e.g., C1), and the second portion 142 has a shape in which the first corner expands outward (outward from the first portion 141). The first portion 141 is a closed figure. The second portion 142 may include multiple segments spaced apart from each other. Each segment is a closed figure. The first portion 141 and the second portion 142 are virtual figures for describing the shape (shape of the outer edge) of the insulating layer 140. In one aspect, merging the first portion and the second portion means combining the first portion and the second portion. In another aspect, merging the first portion and the second portion means calculating the logical sum of the first portion and the second portion in orthogonal projection onto the main surface of the substrate 200.

[0014] In one aspect, the second portion 142 may include a portion having a rounded shape. The rounded portion may determine a part of the outer edge of the insulating layer 140. In another aspect, the second portion 142 may have a shape obtained by expanding a corner of the first portion 141 in the radial direction. In yet another aspect, in an orthogonal projection onto the main surface of the substrate 200, a portion of the outer edge of the insulating layer 140 located outside the corner of the moisture-resistant ring 120 has a shape that partially surrounds the corner of the moisture-resistant ring 120.

[0015] 3A, 3B, and 3C show modified examples of the light emitting device 100. In the modified examples shown in FIGS. 3A, 3B, and 3C, the insulating layer 140 has a shape that combines a first portion having multiple corners and a second portion having a shape in which each of the multiple corners is bulged outward when orthogonally projected onto the main surface of the substrate 200. In another aspect, in the modified examples shown in FIGS. 3A, 3B, and 3C, the insulating layer 140 has a shape that combines a first portion having multiple corners including a first corner and a second portion having a shape in which the first corner is bulged outward. In yet another aspect, in the modified examples shown in FIGS. 3A, 3B, and 3C, the insulating layer 140 has a shape that combines a first portion having multiple corners including a first corner and a second corner and a second portion having a shape in which each of the first corner and the second corner is bulged outward. In the modified examples shown in FIGS. 3A, 3B, and 3C, the interior angle of the two sides constituting the first corner, which is one of the multiple corners of the first portion, can be a right angle, an obtuse angle, or an acute angle. When forming a photoresist pattern used to pattern the insulating layer 140, patterning errors, such as rounded corners of the opening in the photoresist pattern or slight alignment errors, can occur. However, by forming the insulating layer 140 in the above-described shape, the insulating layer 140 can be patterned so that the corners of the moisture-resistant ring 120 are covered by the insulating layer 140. This is advantageous for reducing exposure of the moisture-resistant ring 120 and suppressing moisture penetration into the light-emitting region 110.

[0016] In the examples shown in FIGS. 1, 2A to 2C, 3A, and 3B, the first portion 141 has a quadrilateral or polygonal shape. The quadrilateral may be, for example, a rectangle, a parallelogram, or a trapezoid. Here, the concept of a trapezoid includes a parallelogram, and the concept of a parallelogram includes a rectangle. From another perspective, in the examples shown in FIGS. 1, 2A to 2C, 3A, and 3B, the first portion 141 has a shape similar to the outer shape of the moisture-resistant ring 120. From yet another perspective, in the examples shown in FIGS. 1, 2A to 2C, 3A, and 3B, the first portion 141 has a shape similar to the smallest rectangle that encloses the moisture-resistant ring 120. In the example shown in FIG. 3C, the first portion 141 has a polygonal (more specifically, octagonal) shape. 1, 2A to 2C, 3A, 3B, and 3C, the first portion 141 has a shape similar to the smallest rectangle (virtual figure) that encloses the moisture-resistant ring 120.

[0017] Fig. 4 is a schematic cross-sectional view showing an example of the configuration of the light emitting device 100 taken along the cut line A in Fig. 1. Fig. 4 shows the structures of the light emitting region 110, the moisture-resistant ring 120, and the scribe area 130 together with the substrate 200. Fig. 4 also shows the main surface PS of the substrate 200. The substrate 200 may be, for example, a silicon substrate, but may also be a substrate made of other materials.

[0018] The light-emitting region 110 includes, for example, a plurality of light-emitting elements 111 and a plurality of transistors 201 for driving or controlling them. The light-emitting element 111 may include, for example, a lower electrode 210, an organic layer 212 including a light-emitting layer, and an upper electrode 213. The light-emitting device 100 may also include, for example, wiring layers 203, 205, and 207, and plugs 204, 206, and 208 for interconnecting the wiring layers. The light-emitting device 100 may also include a plug 202 for connecting the wiring layers to the transistor 201 or the substrate 200. The wiring layers 203, 205, and 207 and the plugs 202, 204, 206, and 208 are disposed in an insulating layer 209. The wiring layers 203, 205, and 207, the plugs 202, 204, 206, and 208, and the lower electrode 210 arranged in the light-emitting region 110 and the moisture-resistant ring 120, respectively, may have approximately the same film configuration and film thickness. However, each element constituting the moisture-resistant ring 120 may be omitted as appropriate. For example, the wiring layer 205 may be omitted and the wiring layer 203 and the wiring layer 207 may be directly connected. The substrate 200 is a single-crystal silicon layer having a thickness of, for example, 750 to 800 μm, preferably 770 to 780 μm.

[0019] The organic layer 212 is disposed between the upper electrode 213 and the lower electrode 210, and the lower electrode 210 is connected to the wiring layer 207 via a plug 208. An insulating layer 140 for ensuring moisture resistance is disposed on top of the organic layer 212. The material of the insulating layer 140 can be selected from materials commonly used in semiconductor devices. The insulating layer 140 can be formed, for example, of a silicon nitride film, which is a light-transmitting, dense film. The insulating layer 140 can have a stacked structure. The insulating layer 140 can have a three-layer structure including, for example, a silicon nitride film formed by a plasma CVD method, an alumina (Al2O3) film formed by an ALD method, and another silicon nitride film formed by a plasma CVD method. The transistor 201 can be formed using a known semiconductor process technology. The contact plug 202 can be formed of a high-melting-point metal such as tungsten. The wiring layers 203, 205, and 207 can be formed of aluminum or copper. The insulating layer 209 can be made of a silicon-based insulating layer such as a silicon oxide film, a silicon nitride film, a silicon carbide film, etc. The insulating layer 209 may include a low-k material with a low dielectric constant.

[0020] FIG. 5 is an enlarged view schematically illustrating an example of the configuration of the light-emitting device 100 in the cut area B of FIG. 1. The moisture-resistant ring 120 has a first side S1 extending in a first direction D1, a second side S2 extending in a second direction D2 different from the first direction D1, and a corner CP between the first side S1 and the second side S2. The insulating layer 140 may have a shape in which a portion of the moisture-resistant ring 120 located outside the corner CP expands outward (toward the outside of the moisture-resistant ring 120). The outer edge of this shape may include, for example, a circular arc. The angle of the corner CP of the moisture-resistant ring 120 may be any angle, such as a right angle, an obtuse angle, or an acute angle. In one aspect, it is preferable that the shortest distance a from the corner CP of the moisture-resistant ring 120 to the outer edge of the insulating layer 140 be greater than the shortest distance b from the first side S1 of the moisture-resistant ring 120 to the outer edge of the insulating layer 140. When forming the photoresist pattern used to pattern the insulating layer 140, patterning errors may occur, such as rounded corners of the openings in the photoresist pattern or slight alignment errors. However, a configuration that satisfies a > b is advantageous for patterning the insulating layer 140 so that the corners CP of the moisture-resistant ring 120 are covered by the insulating layer 140. This is advantageous for preventing exposure of the moisture-resistant ring 120 and suppressing moisture penetration into the light-emitting region 110.

[0021] As illustrated in FIGS. 1, 2A to 2C, and 3A to 3C, in an orthogonal projection onto the main surface of the substrate 200, the outer edge of the moisture-resistant ring 120 may have a shape having multiple vertices and multiple sides connecting adjacent vertices. The configuration illustrated in FIG. 5 may be applied to not only one vertex but also other vertices. That is, in an orthogonal projection onto the main surface of the substrate 200, the shortest distance from each vertex of the outer edge of the moisture-resistant ring 120 to the outer edge of the insulating layer 140 is preferably greater than the shortest distance from each side of the outer edge of the moisture-resistant ring 120 to the outer edge of the insulating layer 140. From another perspective, the outer edge of the insulating layer 140 has a shape similar to a polygon that contains the moisture-resistant ring 120, with corners bulging outward.

[0022] 6A and 6B show modified shapes of the insulating layer 140 at the corners of the moisture-resistant ring 120. In the examples shown in FIGS. 1, 2A to 2C, 3A to 3C, and 5, the insulating layer 140 has a shape in which the corners of the moisture-resistant ring 120 are expanded, and the shape is rounded or arc-shaped. On the other hand, in the example shown in FIG. 6A, the insulating layer 140 has a shape in which the corners of the moisture-resistant ring 120 are expanded, and the shape is a shape including four sides of a rectangle. In the example shown in FIG. 6B, the insulating layer 140 has a shape in which the corners of the moisture-resistant ring 120 are expanded, and the shape is a shape including two sides of a triangle.

[0023] FIG. 7 is a plan view schematically illustrating the configuration of a light-emitting device 100 according to the second embodiment. Details not mentioned regarding the light-emitting device 100 of the second embodiment may conform to those of the first embodiment. The outer shape of the light-emitting region 110 is a polygon, for example, a rectangle. The outer shape of the moisture-resistant ring 120 includes a portion PP along one side S11 of the polygon that constitutes the outer shape of the light-emitting region 110. The portion PP includes two first line segments LS1 that are spaced a first distance D1 from the side S11, and a second line segment LS2 that is located between the two first line segments LS1 and has a distance D2 from the side S11 that is smaller than the first distance D1. The shape of the portion PP may be understood as a shape having a recess when orthogonally projected onto the main surface of the substrate 200.

[0024] In the light-emitting device 100 of the second embodiment illustrated in FIG. 7, the first portion virtually defining the shape of the outer edge of the insulating layer 140 can have a shape similar to the smallest rectangle that encloses the moisture-resistant ring. FIG. 8A is an enlarged view of cut area C in FIG. 7. In the example of FIG. 8A, the first portion virtually defining the shape of the outer edge of the insulating layer 140 has a shape similar to the smallest rectangle that encloses the moisture-resistant ring. In other words, in the example of FIG. 8A, the first portion virtually defining the shape of the outer edge of the insulating layer 140 is not affected by the recess. FIG. 8B shows a modified example of the configuration example of FIG. 8A. In FIG. 8B, the outer edge of the insulating layer 140 has a shape formed by outwardly expanding corners of a shape formed by multiple sides parallel to the multiple sides that constitute the outer shape of the moisture-resistant ring 120.

[0025] FIG. 9 is a plan view schematically illustrating the configuration of an original substrate 250 on which multiple light-emitting devices 100 are arranged during the manufacturing process. The original substrate 250 is also called a wafer. The original substrate 250 has scribe areas 130 that separate the multiple light-emitting devices 100. The original substrate 250 is separated into multiple light-emitting devices 100 by dicing. Dicing is a process of cutting the original substrate 250 at the scribe areas 130. Dicing methods include, for example, blade dicing, which uses a rotating grindstone to cut the original substrate at high speed, and stealth dicing, which focuses laser light inside the original substrate to form a modified layer inside, and then applies external force to cut the original substrate. The insulating layer 140 on the center line of the scribe area 130 is removed because the presence of an insulating layer 140 in the scribe area 130 would hinder dicing.

[0026] 10A, 10B, and 10C, a process flow for forming grooves by etching insulating layer 140 and insulating layer 209 disposed in scribe area 130 will be described. 10A, 10B, and 10C are schematic cross-sectional views of the periphery of scribe area 130 in the process of forming grooves in scribe area 130.

[0027] 10A schematically shows the cross-sectional structure before openings are formed in the scribe area 130. The outer edge of the scribe area 130 may be defined as the ends 301a of the moisture-resistant rings 120 of two adjacent light-emitting devices 100. The insulating layer 140 may be, for example, a single silicon nitride film formed by plasma CVD, or a three-layer film having an alumina (Al2O3) film formed by ALD between two silicon nitride films formed by plasma CVD. The insulating layer 140 is preferably made of a film with a lower moisture permeability than the insulating layer 209, and can thereby function as a barrier film that blocks moisture from penetrating from the outside.

[0028] First, as schematically shown in Fig. 10B, a photoresist pattern PRP is formed by a photolithography process. The photoresist pattern PRP has openings OP for forming grooves by etching the insulating layer 140 and the insulating layer 209. The openings OP of the photoresist pattern PRP are formed so that their outer edges are located at positions 302a away from the end 301a of the moisture-resistant ring 120, so that the insulating layer 140 disposed above the moisture-resistant ring 120 is not removed by etching.

[0029] 10C, the insulating layer 140 and the insulating layer 209 are anisotropically etched through the openings OP in the photoresist pattern PRP, thereby forming grooves TR in the scribe area 130. The photoresist pattern PRP is then removed. For example, plasma etching (RIE) using a C4F8 or CF4-based gas can be used for the anisotropic etching.

[0030] Next, an organic light-emitting element applicable to the light-emitting element in the light-emitting device 100 will be described. The organic light-emitting element has a first electrode, a second electrode, and an organic compound layer disposed between these electrodes. One of the first electrode and the second electrode serves as an anode and the other as a cathode. In the organic light-emitting element of this embodiment, the organic compound layer may be a single layer or a laminate consisting of multiple layers, as long as it has an emitting layer. If the organic compound layer is a laminate consisting of multiple layers, the organic compound layer may have, in addition to the emitting layer, a hole injection layer, a hole transport layer, an electron blocking layer, a hole / exciton blocking layer, an electron transport layer, an electron injection layer, etc. Furthermore, the emitting layer may be a single layer or a laminate consisting of multiple layers. If the emitting layer has multiple layers, a charge generation layer may be disposed between the emitting layers. The charge generation layer may be composed of a compound having a lower LUMO than the hole transport layer, and the LUMO of the charge generation layer may be lower than the HOMO of the hole transport layer. Here, the molecular orbital energy of the organic compound layer may be the molecular orbital energy of the organic compound having the largest weight ratio of the organic compound layer.

[0031] Here, the closer the HOMO and LUMO are to the vacuum level, the higher they are described as being. The LUMO of the charge generation layer being lower than the HOMO of the hole transport layer means that the LUMO of the charge generation layer is closer to the vacuum level than the HOMO of the hole transport layer.

[0032] In this specification, the HOMO and LUMO can be calculated using molecular orbital calculations. The molecular orbital calculations are performed using density functional theory (DFT) or the like, with the functional being B3LYP and the basis set being 6-31G. *For example, the range of graphical designs is provided by Gaussian09(Gaussian09, RevisionC.01,MJFrisch,GWTrucks,HBSchlegel,GEScuse ria, MARobb,JRCheeseman,G.Scalmani,V.Barone,B.Mennucci,GAPetersson,H.Nakatsuji,M.Caricato,X.Li,HPHra tchian, AFIzmaylov, J. Bloino, G. Zheng, JLSonnenberg, M. Hada, M. Ehara, K. Toyota, R. Fukuda, J. Hasegawa, M. Ishi da,T.Nakajima,Y.Honda,O.Kitao,H.Nakai,T.Vreven,JAMontgomery,Jr.,JEPeralta,F.Ogliaro,M.Bearpark,JJHe yd, E. Brothers, KNKudin, VNS Taroverov, T. Keith, R. Kobayashi, J. Normand, K. Raghavachari, A. Rendell, JCBurant ,SSIyengar,J.Tomasi,M.Cossi,N.Rega,JMMillam,M.Klene,JEKnox,JBCross,V.Bakken,C.Adamo,J.Jaramillo,R.G omperts,REStratmann,O.Yazyev,AJAustin,R.Cammi,C.Pomelli,JWOchterski,RLMartin,K.Morokuma,VGZakrzews ki,GAVoth,P.Salvador,JJDannenberg,S.Dapprich,ADDaniels,O.Farkas,JBForesman,JVOrtiz,JCioslowski,and DJFox,Gaussian,Inc.,Wallingford CT,2010.)

[0033] The HOMO and LUMO in this specification can be calculated using the ionization potential and band gap. The HOMO can be estimated by measuring the ionization potential. The ionization potential can be measured by dissolving the compound to be measured in a solvent such as toluene and using a measuring device such as an AC-3. The band gap can be measured by dissolving the compound to be measured in a solvent such as toluene and irradiating it with excitation light. The band gap can be measured by measuring the absorption edge of the excitation light. Alternatively, the compound to be measured can be deposited on a substrate such as glass and irradiated with excitation light on the deposited film. The band gap can be measured by measuring the absorption edge of the absorption spectrum where the deposited film absorbs the excitation light.

[0034] The LUMO can be calculated using the band gap and ionization potential: subtracting the ionization potential from the band gap gives the LUMO.

[0035] The LUMO can also be estimated from the reduction potential. For example, the one-electron reduction potential can be estimated using CV (cyclic volmetry) measurements. CV measurements are performed, for example, in a 0.1 M tetrabutylammonium perchlorate solution in DMF, with an Ag / Ag reference electrode. + The LUMO can be estimated by adding -4.8 eV, the difference between the reduction potential of the compound and that of ferrocene, to the reduction potential of the compound obtained.

[0036] If necessary, conventionally known low-molecular-weight and high-molecular-weight hole-injecting or hole-transporting compounds, host compounds, light-emitting compounds, electron-injecting or electron-transporting compounds, etc. may be used together. Examples of these compounds are listed below.

[0037] As the hole injection / transport material, a material with high hole mobility is preferred, facilitating the injection of holes from the anode and transporting the injected holes to the light-emitting layer. Furthermore, a material with a high glass transition temperature is preferred to reduce deterioration of film quality, such as crystallization, in organic light-emitting devices. Examples of low-molecular-weight and high-molecular-weight materials with hole injection / transport properties include triarylamine derivatives, arylcarbazole derivatives, phenylenediamine derivatives, stilbene derivatives, phthalocyanine derivatives, porphyrin derivatives, poly(vinylcarbazole), poly(thiophene), and other conductive polymers. Furthermore, the above-mentioned hole injection / transport materials are also suitable for use in electron blocking layers. Specific examples of compounds that can be used as hole injection / transport materials are listed below, but the present invention is not limited to these.

[0038] [ka]

[0039] Among the hole transport materials listed above, HT16 to HT18 can reduce the driving voltage when used in a layer in contact with the anode. HT16 is widely used in organic light-emitting devices. HT2, HT3, HT4, HT5, HT6, HT10, and HT12 may be used in an organic compound layer adjacent to HT16. Furthermore, multiple materials may be used in one organic compound layer.

[0040] Examples of light-emitting materials that are mainly involved in light-emitting function include fused ring compounds (for example, fluorene derivatives, naphthalene derivatives, pyrene derivatives, perylene derivatives, tetracene derivatives, anthracene derivatives, rubrene, etc.), quinacridone derivatives, coumarin derivatives, stilbene derivatives, organoaluminum complexes such as tris(8-quinolinolato)aluminum, iridium complexes, platinum complexes, rhenium complexes, copper complexes, europium complexes, ruthenium complexes, and polymer derivatives such as poly(phenylenevinylene) derivatives, poly(fluorene) derivatives, and poly(phenylene) derivatives.

[0041] Specific examples of compounds that can be used as light-emitting materials are shown below, but the present invention is not limited to these.

[0042] [ka]

[0043] When the light-emitting material is a hydrocarbon compound, it is preferable because it can reduce a decrease in light-emitting efficiency due to exciplex formation and a decrease in color purity due to a change in the emission spectrum of the light-emitting material due to exciplex formation.

[0044] Hydrocarbon compounds are compounds composed only of carbon and hydrogen, and among the above-mentioned exemplary compounds, BD7, BD8, GD5 to GD9, and RD1 are mentioned.

[0045] When the light-emitting material is a fused polycyclic ring containing a five-membered ring, it is preferable because it has a high ionization potential, is resistant to oxidation, and results in a device with a long and durable life. Among the above-mentioned exemplary compounds, BD7, BD8, GD5 to GD9, and RD1 are preferred.

[0046] Examples of the light-emitting layer host or light-emitting assist material contained in the light-emitting layer include aromatic hydrocarbon compounds or derivatives thereof, as well as carbazole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, organoaluminum complexes such as tris(8-quinolinolato)aluminum, and organic beryllium complexes.

[0047] Specific examples of compounds that can be used as the light-emitting layer host or light-emitting assist material contained in the light-emitting layer are shown below, but the present invention is not limited to these.

[0048] [ka]

[0049] The host material may be a hydrocarbon compound. A hydrocarbon compound is a compound composed only of carbon and hydrogen, and examples of the above-mentioned compounds include EM1 to EM12 and EM16 to EM27. From the viewpoint of stability, host materials that do not have a carbon-heteroatom bond in the single bond connecting the aryl group units in their structure, such as F3 in Compound 1, are more preferred.

[0050] The electron transporting material can be arbitrarily selected from those capable of transporting electrons injected from the cathode to the light-emitting layer, and is selected taking into consideration the balance with the hole mobility of the hole transporting material, etc. Examples of materials having electron transport properties include oxadiazole derivatives, oxazole derivatives, pyrazine derivatives, triazole derivatives, triazine derivatives, quinoline derivatives, quinoxaline derivatives, phenanthroline derivatives, organoaluminum complexes, and fused ring compounds (e.g., fluorene derivatives, naphthalene derivatives, chrysene derivatives, anthracene derivatives, etc.). Furthermore, the above electron transporting materials are also suitable for use in hole-blocking layers.

[0051] Specific examples of compounds that can be used as electron transporting materials are shown below, but the present invention is not limited to these.

[0052] [ka]

[0053] The electron injection material can be selected from those that allow easy electron injection from the cathode, taking into consideration the balance with hole injection properties, etc. Organic compounds include n-type dopants and reducing dopants. Examples include compounds containing alkali metals such as lithium fluoride, lithium complexes such as lithium quinolinol, benzimidazolidene derivatives, imidazolidene derivatives, fulvalene derivatives, and acridine derivatives.

[0054] It can also be used in combination with the above electron transporting material.

[0055] [Configuration of organic light-emitting element] The organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When a color filter is provided, a planarizing layer may be provided between the protective layer. The planarizing layer may be made of acrylic resin or the like. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0056] [substrate] Examples of the substrate include quartz, glass, a silicon wafer, a resin, and a metal. Furthermore, the substrate may be provided with a switching element such as a transistor and wiring, and an insulating layer thereon. Any material can be used for the insulating layer, as long as it allows for the formation of a contact hole so that wiring can be formed between the first electrode and the insulating layer, and ensures insulation from wiring that is not connected. For example, resins such as polyimide, silicon oxide, silicon nitride, etc. can be used.

[0057] [electrode] A pair of electrodes can be used. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode, and the other is the cathode. It can also be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0058] The anode material should have as high a work function as possible. Examples include simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, and tungsten, mixtures containing these metals, alloys of these metals, and metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), and zinc indium oxide. Conductive polymers such as polyaniline, polypyrrole, and polythiophene can also be used.

[0059] These electrode materials may be used alone or in combination of two or more. The anode may be composed of one layer or multiple layers.

[0060] When used as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys or laminates thereof can be used. The above materials can also function as a reflective film without functioning as an electrode. When used as a transparent electrode, transparent conductive oxide layers such as indium tin oxide (ITO) and indium zinc oxide can be used, but are not limited to these. Photolithography techniques can be used to form the electrode.

[0061] On the other hand, materials with a low work function are preferred for the cathode. Examples include alkali metals such as lithium, alkaline earth metals such as calcium, and metals such as aluminum, titanium, manganese, silver, lead, and chromium, as well as mixtures containing these metals. Alternatively, alloys combining these metals can be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, and zinc-silver can be used. Metal oxides such as indium tin oxide (ITO) can also be used. These electrode materials can be used alone or in combination. The cathode can have either a single-layer or multi-layer structure. Among these, silver is preferred, and a silver alloy is even more preferred to reduce silver aggregation. The alloy ratio is not critical as long as silver aggregation can be reduced. For example, the silver:other metal ratio can be 1:1, 3:1, or the like.

[0062] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but DC and AC sputtering methods are more preferred because they provide good film coverage and make it easier to reduce resistance.

[0063] [Pixel isolation layer] The pixel separation layer is formed of a silicon nitride (SiN) film, a silicon oxynitride (SiON) film, or a silicon oxide (SiO) film formed using a chemical vapor deposition (CVD) method. To increase the in-plane resistance of the organic compound layer, it is preferable that the organic compound layer, particularly the hole transport layer, be thinly formed on the sidewalls of the pixel separation layer. Specifically, the thickness of the sidewalls can be made thin by increasing the taper angle of the sidewalls of the pixel separation layer or the thickness of the pixel separation layer, thereby increasing vignetting during deposition.

[0064] On the other hand, it is preferable to adjust the sidewall taper angle and film thickness of the pixel separation layer to such an extent that voids are not formed in the protective layer formed thereon. Since voids are not formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, deterioration of reliability such as the occurrence of dark spots and poor conduction of the second electrode can be reduced.

[0065] According to this embodiment, charge leakage to adjacent pixels can be effectively suppressed even if the taper angle of the sidewall of the pixel separation layer is not steep. As a result of this study, it was found that a taper angle in the range of 60 degrees to 90 degrees can sufficiently reduce charge leakage. The thickness of the pixel separation layer is preferably 10 nm to 150 nm. Similar effects can also be achieved even if the pixel separation layer is composed only of pixel electrodes without a pixel separation layer. However, in this case, it is preferable to make the thickness of the pixel electrode less than half that of the organic layer or to make the edge of the pixel electrode forward tapered at less than 60 degrees, as this reduces short circuits in the organic light-emitting element.

[0066] [Organic compound layer] The organic compound layer may be formed as a single layer or as multiple layers. When multiple layers are included, they may be called hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, or electron injection layer depending on their functions. The organic compound layer is mainly composed of organic compounds but may also contain inorganic atoms or inorganic compounds. For example, the organic compound layer may contain copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, or the like. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0067] When the device has multiple light-emitting layers, a charge generation portion may be present between the first light-emitting layer and the second light-emitting layer. The charge generation portion may have an organic compound with a lowest unoccupied molecular orbital energy (LUMO) of -5.0 eV or less. The same applies when the charge generation portion is present between the second light-emitting layer and the third light-emitting layer.

[0068] [Protective layer] A protective layer may be provided on the second electrode. For example, by adhering glass with a moisture absorbent on the second electrode, the intrusion of water and other contaminants into the organic compound layer can be reduced, thereby reducing the occurrence of display defects. In another embodiment, a passivation film such as silicon nitride may be provided on the cathode to reduce the intrusion of water and other contaminants into the organic compound layer. For example, after forming the cathode, the cathode may be transferred to another chamber without breaking the vacuum, and a 2 μm-thick silicon nitride film may be formed by CVD to serve as a protective layer. A protective layer may be provided using atomic layer deposition (ALD) after the CVD film formation. The material of the film formed by ALD is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed on the film formed by ALD by CVD. The film formed by ALD may have a thickness smaller than that of the film formed by CVD. Specifically, the thickness may be 50% or less, or even 10% or less.

[0069] [Color Filter] A color filter may be provided on the protective layer. For example, a color filter taking into consideration the size of the organic light-emitting element may be provided on a separate substrate and then bonded to the substrate on which the organic light-emitting element is provided, or a color filter may be patterned on the protective layer described above using photolithography technology. The color filter may be made of a polymer.

[0070] [Planarization layer] A planarization layer may be provided between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the underlying layer. It may also be called a material resin layer without limiting its purpose. The planarization layer may be composed of an organic compound, and may be either a low molecular weight or a high molecular weight, but a high molecular weight is preferred.

[0071] The planarizing layer may be provided above or below the color filter, and may be made of the same or different materials, such as polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0072] [Microlens] The organic light-emitting device may have an optical component such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be used to increase the amount of light extracted from the organic light-emitting device and to control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the hemisphere is the vertex of the microlens. The vertex of the microlens can be determined in the same way in any cross-sectional view. In other words, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the point of contact between this tangent and the semicircle is the vertex of the microlens.

[0073] It is also possible to define the midpoint of a microlens. In the cross section of the microlens, a line segment is imagined from the point where an arc shape ends to the point where another arc shape ends, and the midpoint of this line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0074] The microlens has a first surface having a convex portion and a second surface opposite the first surface. The second surface is preferably disposed closer to the functional layer than the first surface. To achieve this configuration, the microlens must be formed on the light-emitting device. When the functional layer is an organic layer, it is preferable to avoid processes that result in high temperatures during the manufacturing process. Furthermore, when the second surface is disposed closer to the functional layer than the first surface, it is preferable that the glass transition temperatures of all organic compounds constituting the organic layer are 100°C or higher, and more preferably 130°C or higher.

[0075] [Counter substrate] An opposing substrate may be provided on the planarization layer. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the aforementioned substrate. The constituent material of the opposing substrate may be the same as that of the aforementioned substrate. When the aforementioned substrate is defined as a first substrate, the opposing substrate may be a second substrate.

[0076] [Organic layer] The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light emitting device according to one embodiment of the present invention are formed by the method shown below.

[0077] The organic compound layer constituting the organic light-emitting device according to one embodiment of the present invention can be formed by dry processes such as vacuum deposition, ionization deposition, sputtering, plasma, etc. Alternatively to the dry process, a wet process can be used in which the compound is dissolved in an appropriate solvent and a layer is formed by a known coating method (for example, spin coating, dipping, casting, LB method, inkjet method, etc.).

[0078] Here, when a layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When a film is formed by a coating method, the film can be formed by combining with an appropriate binder resin.

[0079] Examples of the binder resin include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0080] These binder resins may be used singly or in combination as homopolymers or copolymers, and may further contain known additives such as plasticizers, antioxidants, and ultraviolet absorbers, if necessary.

[0081] [Pixel circuit] The light-emitting device may have a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that controls the emission of the first light-emitting element and the second light-emitting element independently. The active matrix type circuit may be voltage-programmed or current-programmed. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have a light-emitting element, a transistor that controls the emission brightness of the light-emitting element, a transistor that controls the emission timing, a capacitor that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without going through the light-emitting element.

[0082] The light-emitting device has a display region and a peripheral region arranged around the display region. The display region has pixel circuits, and the peripheral region has a display control circuit. The mobility of a transistor constituting the pixel circuit may be lower than the mobility of a transistor constituting the display control circuit.

[0083] The slope of the current-voltage characteristics of the transistors that make up the pixel circuit may be smaller than the slope of the current-voltage characteristics of the transistors that make up the display control circuit. The slope of the current-voltage characteristics can be measured using the so-called Vg-Ig characteristics.

[0084] The transistors that make up the pixel circuit are transistors connected to light-emitting elements such as the first light-emitting element.

[0085] [Pixels] An organic light emitting device includes a plurality of pixels, each of which includes sub-pixels that emit different colors, for example, RGB colors.

[0086] The pixel emits light from an area called the pixel aperture. This area is the same as the first area. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0087] The distance between the subpixels may be 10 μm or less, and specifically may be 8 μm, 7.4 μm, or 6.4 μm.

[0088] The pixels may be arranged in a known manner in a plan view. For example, they may be in a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in a plan view may be any known shape. For example, they may be rectangular, quadrilaterals such as diamonds, or hexagons. Here, these shapes do not need to be exact figures; as long as they are close to a rectangle, they are included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0089] [Use of the organic light-emitting device according to one embodiment of the present invention] The organic light-emitting device according to one embodiment of the present invention can be used as a component of a display device or a lighting device, and can also be used as an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, a light-emitting device having a white light source and a color filter, etc.

[0090] The display device may be an image information processing device that has an image input unit that inputs image information from an area CCD, a linear CCD, a memory card, etc., has an information processing unit that processes the input information, and displays the input image on the display unit.

[0091] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. The display device may also be used in the display unit of a multifunction printer.

[0092] Various devices to which the above-described light emitting device 100 is applied will be described below as examples. The device may be realized in various forms as long as it includes a light emitting device and a circuit for driving the light emitting device. The device may be, for example, an image forming device, a camera, an information processing device, or a mobile object.

[0093] FIG. 11 is a schematic diagram showing a first application example of the light emitting device 100. The light emitting device of the first application example can be used, for example, as a light source for an image forming device. The light emitting device of the first application example can have a rectangular shape with long sides parallel to a first direction and short sides parallel to a direction intersecting the first direction. The first direction can be, for example, a direction along the rotation axis of a photosensitive member of the image forming device.

[0094] The substrate 1701 has a polygonal shape, and an example of a rectangular substrate 1701 will be described here. In this specification, the direction of the long sides of the rectangular substrate 1701 is referred to as the first direction, and the direction of the short sides perpendicular to the long side is referred to as the second direction. In addition, the polygon in this specification also includes shapes with rounded corners. A moisture-resistant ring 1700 is disposed on the rectangular substrate 1701, and serves to suppress and prevent moisture from penetrating into the light-emitting device. The moisture-resistant ring 1700 can be, for example, a guard ring formed of a wiring layer.

[0095] A light-emitting region 1702, a contact region 1703, pads 1704, and a circuit 1706 are arranged inside the moisture-resistant ring 1700. The contact region 1703 includes, for example, a first contact region 1703_1, a second contact region 1703_2, and a third contact region 1703_3. The pads 1704 include, for example, a first pad 1704_1, a second pad 1704_2, and a third pad 1704_3.

[0096] The circuits 1706_1 and 1706_2 are circuits for driving the light-emitting element EL, and specific examples thereof include, but are not limited to, an input protection circuit, an input circuit to which data for each drive is input, and a logic circuit for processing data.

[0097] Light-emitting elements EL are arranged in rows and columns in the light-emitting region 1702. Wiring that electrically connects to a common electrode of the light-emitting elements EL is arranged in the contact region 1703. Pads 1704_1 electrically connect the contact region 1703 to an external element.

[0098] The outer periphery of the moisture-resistant ring 1700 may include a plurality of recessed portions, which can be used as contact areas for contacting ribs that are part of a mask for vapor deposition in a film-forming process, for example.

[0099] Each of the plurality of light-emitting elements EL arranged in a matrix in the light-emitting region 1702 is composed of a light-emitting layer and a first electrode and a second electrode that sandwich the light-emitting layer. In one example, the first electrode is an independent electrode provided individually for each light-emitting element EL, and the second electrode is a common electrode provided in common to the plurality of light-emitting elements EL.

[0100] For example, in the case where light-emitting region 1702 has four rows of light-emitting elements EL, the initial positions of the light-emitting elements EL in the first row and the second row may be shifted in the X direction by ¼ of the X-direction dimension of the light-emitting elements EL, as illustrated in Fig. 11. In the case of n rows, where n is an integer of 2 or greater, the initial positions of the light-emitting elements EL in the first row and the second row may be shifted in the X direction by 1 / n of the X-direction dimension of the light-emitting elements EL. Such a configuration is advantageous for improving resolution.

[0101] The contact region 1703 is an area adjacent to the light emitting region 1702 of the substrate 1701, and is disposed inside the moisture-resistant ring 1700. At least one of the first contact region 1703, the pad 104, and the circuit 1706, together with the recess of the moisture-resistant ring 1700, may be disposed between the light emitting region 102 and one long side end of the substrate 1701, and may be disposed in series in the long side direction.

[0102] In this way, by providing the contact region 1703, the pad 1704, the circuit 1706, etc. at the same position in the short side direction, the length of the light emitting device in the short side direction can be reduced, making it possible to miniaturize the light emitting device.

[0103] The light-emitting device of the first application example has multiple contact regions 1703 between the common electrode of the light-emitting element EL and the power supply wiring along the long side edge of the light-emitting device. For example, if the common electrode is made of a transparent electrode material with a relatively high electrical resistance, the amount of voltage drop in the long axis direction may be large. Therefore, the voltage applied to the light-emitting element EL varies depending on the distance from the contact region to which the potential is supplied. This may result in differences in actual emission brightness between light-emitting elements EL to which a voltage is applied to emit light with the same brightness, resulting in shading and other problems. However, by having multiple contact regions 1703 in the long axis direction, the voltage drop in the common electrode in the long side direction can be suppressed, thereby preventing shading and other problems.

[0104] A second application example of the light emitting device 100 will be described below with reference to Fig. 12. The second application example is an example in which the light emitting device shown in Fig. 11 is applied to a head substrate 1800 of an exposure head of an image forming apparatus. Fig. 12(a) is a schematic perspective view of the head substrate 1800. Fig. 12(b) shows an arrangement of multiple light emitting devices provided on the head substrate 1800, and Fig. 12(c) shows an enlarged view of a portion of Fig. B(b).

[0105] An LED chip 1803 is mounted on the head substrate 1800. The LED chip 1803 is, for example, the light emitting device of the first application example shown in FIG.

[0106] 12(a), an LED chip 1803 is provided on one surface of a head substrate 1800, and a long flexible flat cable (FFC) connector 1807 is provided on the other surface. The one surface of the head substrate 1800 here refers to the surface (upper surface, front surface) on which the LED chip 1803 is provided. The other surface of the substrate refers to the surface (lower surface, back surface) opposite to the side on which the LED chip 1803 is provided.

[0107] The FFC connector 1807 is attached to the other surface (bottom surface, back surface) of the head substrate 1800 so that its longitudinal direction follows the longitudinal direction of the head substrate 1800. The long FFC connector 1807 is provided to input a control signal (drive signal) from a control circuit section of the main body of the image forming apparatus, and the control signal is transferred to each LED chip 1803. The LED chips 1803 are driven (to emit light or turn off) by the control signal input to the head substrate 1800.

[0108] The LED chips 1803 mounted on the head substrate 1800 will now be described. As shown in Fig. 12(b) and Fig. 12(c), a plurality of light-emitting devices are arranged on one surface of the head substrate 1800. For example, LED chips 1803-1 to 1803-17 (17 chips) are arranged. Fig. 12(b) shows LED chips 1803_1, 1803_7, 1803_8, 1803_9, 1803_10, and 1803_17 as examples. Each of the LED chips 1803-1 to 1803-29 has a plurality of light-emitting elements EL arranged in its longitudinal direction, and for example, 516 light-emitting elements EL are arranged.

[0109] The center-to-center distance k2 between adjacent light-emitting devices in the longitudinal direction of the LED chip 1803 corresponds to the resolution of the image forming device. For example, if the resolution of the image forming device of the second application example is 1200 dpi, the multiple light-emitting devices are arranged in the longitudinal direction of the LED chips 1803-1 to 1803-17 so that the center-to-center distance k2 between adjacent light-emitting devices is 21.16 μm. Therefore, the exposure range of this exposure head is approximately 314 mm.

[0110] The photosensitive layer of the photosensitive drum is formed with a width of 314 mm or more. Since the long side of A4 size recording paper and the short side of A3 size recording paper are 297 mm, the exposure head of this embodiment has an exposure range that can form images on A4 size recording paper and A3 size recording paper. Note that while Figure 12 shows an example in which multiple light-emitting devices are arranged in the longitudinal direction, multiple light-emitting devices may be arranged in the lateral direction as well as the longitudinal direction.

[0111] A plurality of LED chips 1803-1 to 1803-17 are arranged in the axial direction of the photosensitive drum. Specifically, the LED chips 1803-1 to 1803-17 are alternately arranged in two rows along the axial direction of the photosensitive drum. That is, as shown in FIG. 12(b), counting from the left, odd-numbered LED chips 1803-1, 1803-3, ..., 1803-17 are mounted in a row in the longitudinal direction of the substrate 1800. Also, counting from the left, even-numbered LED chips 1803-2, 1803-4, ..., 1803-16 are mounted in a row in the longitudinal direction of the substrate 1800. The LED chips 1803 are arranged in this manner.

[0112] 12(c), the center-to-center distance k1 of the light-emitting elements EL can be made equal to the center-to-center distance k2 of the light-emitting elements EL in the longitudinal direction of the LED chip 1803. Here, the center-to-center distance k1 of the light-emitting elements EL indicates the center-to-center distance between the light-emitting elements EL arranged at one end of the LED chip 1803_7 and the other end of the LED chip 1803_8. Also, the center-to-center distance k2 of the light-emitting elements EL indicates the center-to-center distance k2 between adjacent light-emitting elements EL in the LED chip 1803_8.

[0113] In other words, the center-to-center distance k1 between adjacent light-emitting elements EL arranged on one end of an LED chip 1803 and the other end of another LED chip 1803 can be made equal to the center-to-center distance k2 between adjacent light-emitting elements EL on one LED chip 1803.

[0114] In each LED chip, the light emitting elements are arranged in a line along the main scanning direction (axial direction of the photosensitive drum 2) and are electrically connected in parallel by power supply wiring also provided along the main scanning direction.

[0115] When the light emitting device (LED chip) is used in an exposure head, linear exposure is performed, and therefore the ratio of the longitudinal direction (first direction X) to the lateral direction (second direction Y) of the shape of the light emitting region 1702 is larger than when the light emitting device is used in a display device, etc. The ratio of the longitudinal direction (first direction X) to the lateral direction (third direction Y) of the shape of the LED chip substrate is also larger.

[0116] Specifically, for example, the length of the long side of the LED chip (or light-emitting region 1702) is at least 5 times the length of the short side of the LED chip (or light-emitting region 1702), and may be at least 10 times the length. For example, the length of the long side of the LED chip (or light-emitting region 1702) can be at least 20 times the length of the short side of the LED chip (or light-emitting region 1702).

[0117] The length of the long side of the LED chip is determined by the axial length of the photosensitive drum 2, the number of LED chips arranged in the axial direction, and the arrangement of the LED chips 1803. The length of the short side of the LED chip 1803 is determined in the direction perpendicular to the axis of the photosensitive drum by whether the light-emitting element EL is arranged in the light-emitting region 1702 and the arrangement of the pads 1704 and contact region 1703.

[0118] Furthermore, the organic layer 66 may be configured to have a light-emitting layer that emits red light in consideration of the wavelength dependency of the photosensitivity of the photosensitive drum 2.

[0119] The LED chip 1803 may have a color filter. By having a color filter, the amount of normal light incident on the photosensitive drum is not reduced, and stray light from unintended directions can be absorbed, thereby improving print quality. Next, a third application example of the light emitting device 100 will be described with reference to Fig. 13. The third application example is an example in which the light emitting device 100 is applied to a display device. Fig. 13 is a cross-sectional view showing an example of a display device having an organic light emitting element and a transistor connected to the organic light emitting element. The transistor is an example of an active element. The transistor may be a thin film transistor (TFT).

[0120] FIG. 13(a) shows an example of a pixel, which is a component of a display device. The pixel has sub-pixels 10. One sub-pixel corresponds to one light-emitting element in a light-emitting device 100. The sub-pixels are divided into 10R, 10G, and 10B based on their light emission. The emitted colors may be distinguished by the wavelength of light emitted from the light-emitting layer, or the light emitted from the sub-pixels may be selectively transmitted or color-converted using a color filter or the like. Each sub-pixel has a reflective electrode 2, which is a first electrode, on an interlayer insulating layer 1, an insulating layer 3 covering the edge of the reflective electrode 2, an organic compound layer 4 covering the first electrode and the insulating layer, a transparent electrode 5, a protective layer 6, and a color filter 7.

[0121] A transistor and a capacitor may be disposed below or inside the interlayer insulating layer 1. The transistor and the first electrode may be electrically connected via a contact hole or the like (not shown).

[0122] The insulating layer 3 is also called a bank or pixel separation film. It covers the edges of the first electrode and surrounds the first electrode. The part where the insulating layer is not provided contacts the organic compound layer 4 and becomes the light-emitting region.

[0123] The organic compound layer 4 includes a hole injection layer 41 , a hole transport layer 42 , a first light-emitting layer 43 , a second light-emitting layer 44 , and an electron transport layer 45 .

[0124] The second electrode 5 may be a transparent electrode, a reflective electrode, or a semi-transparent electrode.

[0125] The protective layer 6 reduces the penetration of moisture into the organic compound layer. Although the protective layer is illustrated as a single layer, it may be a multi-layer. Each layer may be an inorganic compound layer and an organic compound layer.

[0126] The color filters 7 are divided into 7R, 7G, and 7B depending on their colors. The color filters may be formed on a planarization film (not shown). A resin protective layer (not shown) may be provided on the color filters. The color filters may be formed on a protective layer 6. Alternatively, the color filters may be provided on an opposing substrate such as a glass substrate and then bonded thereto.

[0127] The display device DD in Figure 13(b) includes an organic light-emitting element 26 and a TFT 18 as an example of a transistor. A substrate 11 made of glass, silicon, or the like is provided with an insulating layer 12 on top of it. An active element 18 such as a TFT is disposed on the insulating layer, and a gate electrode 13, a gate insulating film 14, and a semiconductor layer 15 of the active element are disposed on top of it. The TFT 18 also includes the semiconductor layer 15, a drain electrode 16, and a source electrode 17. An insulating film 19 is disposed on top of the TFT 18. An anode 21 constituting the organic light-emitting element 26 and the source electrode 17 are connected via a contact hole 20 provided in the insulating film.

[0128] The electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 26 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the embodiment shown in Fig. 13(b). In other words, it is sufficient that either the anode or the cathode is electrically connected to either the TFT source electrode or the drain electrode. TFT stands for thin film transistor.

[0129] 13(b), the organic compound layer 22 is illustrated as a single layer, but may be a multi-layer organic compound layer 22. A first protective layer 24 and a second protective layer 25 are provided on the cathode 23 to reduce deterioration of the organic light-emitting element.

[0130] In the display device DD of FIG. 13(b), transistors are used as switching elements, but other switching elements may be used instead.

[0131] The transistors used in the display device DD of Figure 13(b) are not limited to transistors using single-crystal silicon wafers, but may also be thin-film transistors having an active layer on the insulating surface of a substrate. Examples of active layers include single-crystal silicon, amorphous silicon, microcrystalline silicon, and other non-single-crystal silicon, as well as non-single-crystal oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Thin-film transistors are also called TFT elements.

[0132] The transistors included in the display device DD in Figure 13(b) may be formed within a substrate such as a Si substrate. Here, "formed within a substrate" means that the substrate itself, such as a Si substrate, is processed to form the transistors. In other words, having a transistor within a substrate can be seen as the substrate and the transistor being formed integrally.

[0133] In this application example, the emission brightness of the organic light-emitting element is controlled by a TFT, which is an example of a switching element. By providing multiple organic light-emitting elements on a surface, an image can be displayed based on the emission brightness of each element. Note that the switching element according to this embodiment is not limited to a TFT, and may be a transistor formed from low-temperature polysilicon or an active matrix driver formed on a substrate such as a Si substrate. "On the substrate" can also be referred to as "inside the substrate." Whether to provide a transistor in the substrate or to use a TFT is determined by the size of the display unit. For example, for a display unit of about 0.5 inches, it is preferable to provide the organic light-emitting element on a Si substrate.

[0134] Next, a fourth application example of the light emitting device 100 will be described with reference to FIG. 14. The fourth application example is an example in which the light emitting device 100 is applied to a display device. FIG. 14 is an exploded perspective view of a display device according to the fourth application example. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected by flexible printed circuits FPCs 1002 and 1004. Transistors are printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different position even if the display device is a portable device.

[0135] The display device according to this application example may have color filters having red, green, and blue colors, and the red, green, and blue colors may be arranged in a delta arrangement in the color filters.

[0136] The display device according to the present invention may be used as a display unit of a mobile terminal. In this case, the display unit may have both a display function and an operation function. Examples of the mobile terminal include a mobile phone such as a smartphone, a tablet, and a head-mounted display.

[0137] The display device according to this application example may be used as a display unit of an imaging device having an optical unit with a plurality of lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. The display unit may be a display unit exposed to the outside of the imaging device or a display unit disposed within a viewfinder. The imaging device may be a camera such as a digital camera or a digital video camera.

[0138] Next, a fifth application example of the light emitting device 100 will be described with reference to FIG. 15(a). The fifth application example is an example in which the light emitting device 100 is applied to an imaging device. FIG. 15(a) is a schematic diagram illustrating an example of an imaging device according to the fifth application example. The imaging device 1100 may have a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may include a display device to which the light emitting device 100 is applied. In this case, the display device may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the speed at which the subject moves, the possibility that the subject will be blocked by an obstruction, and the like.

[0139] Since the optimum timing for capturing an image is very short, it is better to display the information as soon as possible, and therefore it is preferable to use a display device that uses organic light-emitting elements with a fast response speed.

[0140] The imaging device 1100 has an optical section (not shown). The optical section has multiple lenses, which form an image on an imaging element housed in a housing 1104. The focus of the multiple lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may also be called a photoelectric conversion device. Instead of sequentially capturing images, the photoelectric conversion device can include an imaging method that detects the difference from the previous image, or a method of cutting out an image from a constantly recorded image, etc.

[0141] Next, a sixth application example of the light emitting device 100 will be described with reference to FIG. 15(b). The sixth application example is an example in which the light emitting device 100 is applied to an electronic device. FIG. 15(b) is a schematic diagram illustrating an example of an electronic device according to the sixth application example. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric recognition unit that recognizes a fingerprint to unlock the device, etc. An electronic device having a communication unit can also be called a communication device. The electronic device may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone and a laptop computer.

[0142] Next, a seventh application example of the light-emitting device 100 will be described with reference to FIG. 16(a). The seventh application example is an example in which the light-emitting device 100 is applied to a display device. FIG. 16(a) is a diagram showing an example of a display device 1300 according to the seventh application example. The display device 1300 may be configured as a television monitor, a PC monitor, or the like. The display device 1300 has a frame 1301 and a display unit 1302. The display unit 1302 may use the light-emitting device according to this embodiment. The display device 1300 has the frame 1301 and a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in FIG. 16(a). The bottom side of the frame 1301 may also serve as the base. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0143] Next, an eighth application example of the light-emitting device 100 will be described with reference to FIG. 16(b). The eighth application example is an example in which the light-emitting device 100 is applied to a display device. FIG. 16(b) is a diagram showing an example of a display device 1310 according to the eighth application example. The display device 1310 is configured to be bendable, and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may include the light-emitting device according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single display unit without any joints. The first display unit 1311 and the second display unit 1312 can be separated by the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or the first and second display units may display a single image.

[0144] Next, a ninth application example of the light emitting device 100 will be described with reference to FIG. 17(a). The ninth application example is an example in which the light emitting device 100 is applied to a lighting device. FIG. 17(a) is a schematic diagram illustrating an example of a lighting device 1400 according to the ninth application example. The lighting device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion unit 1405. The light source may include the light emitting device 100. The optical filter may be a filter that improves the color rendering of the light source. The light diffusion unit can effectively diffuse light from the light source, such as for illumination, and deliver the light over a wide area. The optical filter and the light diffusion unit may be provided on the light output side of the lighting. If necessary, a cover may be provided on the outermost surface.

[0145] The lighting device is, for example, a device for illuminating a room. The lighting device may emit white, daylight white, or any other color from blue to red. It may have a dimming circuit for dimming these colors. The lighting device may have the organic light-emitting element of the present invention and a power supply circuit connected thereto. The power supply circuit is a circuit for converting AC voltage to DC voltage. Furthermore, white has a color temperature of 4200K, and daylight white has a color temperature of 5000K. The lighting device may have a color filter.

[0146] The lighting device according to this application example may also have a heat dissipation unit, which dissipates heat from within the device to the outside, and examples of the heat dissipation unit include metal with a high specific heat, liquid silicon, and the like.

[0147] Next, a tenth application example of the light emitting device 100 will be described with reference to FIG. 17(b). The tenth application example is an example in which the light emitting device 100 is applied to an automobile as a moving body. FIG. 17(b) is a schematic diagram of an automobile, which is an example of a moving body according to the tenth application example. The automobile has tail lamps, which are an example of a lighting fixture. The automobile 1500 has tail lamps 1501, and may be configured to turn on the tail lamps when braking or the like is performed.

[0148] The tail lamp 1501 may include the light emitting device 100. The tail lamp may include a protective member for protecting the organic EL element. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but it is preferably made of polycarbonate or the like. Polycarbonate may be mixed with a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like.

[0149] The automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window may be a transparent display as long as it is not a window for checking the front and rear of the automobile. The transparent display may have a display device to which the light-emitting device 100 is applied. In this case, constituent materials of the electrodes and the like of the display device are made of transparent members.

[0150] The moving body according to this application example may be a ship, an aircraft, a drone, or the like. The moving body may have a body and a lighting fixture provided on the body. The lighting fixture may emit light to indicate the position of the body. The light-emitting device 100 may be applied to the lighting fixture.

[0151] Next, an eleventh application example of the light emitting device 100 will be described with reference to FIG. 18(a). The eleventh application example is an example in which the light emitting device 100 is applied to eyeglasses 1600 as a base for a display device. FIG. 18(a) is a schematic diagram of eyeglasses 1600 according to the eleventh application example. The eyeglasses 1600 can be configured as a device that can be attached as a wearable device such as smart glasses, HMD, or smart contact lenses. The eyeglasses 1600 have, for example, an imaging device capable of photoelectrically converting visible light and a display device capable of emitting visible light.

[0152] An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of glasses 1600. In addition, a display device according to any of the above-described embodiments is provided on the back side of the lens 1601.

[0153] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light onto the image capture device 1602.

[0154] Next, a twelfth application example of the light-emitting device 100 will be described with reference to FIG. 18(b). In the twelfth application example, the light-emitting device 100 is applied to eyeglasses 1610 as a base for a display device. FIG. 18(b) is a schematic diagram of eyeglasses 1610 according to the twelfth application example. The eyeglasses 1610 can be configured as a wearable device such as smart glasses, an HMD, or smart contact lenses. The eyeglasses 1610 include a control device 1612. The control device 1612 is equipped with an imaging device corresponding to the imaging device 1602 and a display device. The lens 1611 includes an optical system for projecting light emitted by the display device in the control device 1612, and an image is projected onto the lens 1611. The control device 1612 functions as a power source that supplies power to the imaging device and the display device and controls the operation of the imaging device and the display device. The control device may include a gaze detection unit that detects the wearer's gaze. Infrared light may be used for gaze detection. The infrared light emitting unit emits infrared light toward the eyeball of a user gazing at the displayed image. An imaging unit having a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. By including a reduction unit that reduces the light from the infrared light emitting unit to the display unit in a planar view, degradation of image quality is reduced.

[0155] The gaze of the user relative to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be used for gaze detection using an image of the eyeball. One example is a gaze detection method based on the Purkinje image formed by reflection of irradiated light on the cornea.

[0156] More specifically, gaze detection processing is performed based on the pupil-corneal reflex method, which calculates a gaze vector representing the direction (rotation angle) of the eyeball based on the pupil image and Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0157] A display device as an application example of the light emitting device 100 may have an imaging device having a light receiving element, and may control the image displayed on the display device based on information on the user's line of sight from the imaging device.

[0158] Specifically, the display device determines a first display area on which the user gazes and a second display area other than the first display area based on the line-of-sight information. The first display area and the second display area may be determined by a control device of the display device, or may be determined by an external control device and received. In the display area of ​​the display device, the display resolution of the first display area may be controlled to be higher than the display resolution of the second display area. In other words, the resolution of the second display area may be lower than that of the first field of view area.

[0159] The display area includes a first display area and a second display area different from the first display area, and a high-priority area is determined from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received. The resolution of the high-priority area may be controlled to be higher than the resolution of areas other than the high-priority area. In other words, the resolution of an area with a relatively low priority may be lowered.

[0160] Note that AI may be used to determine the first display area and the area with high priority. The AI ​​may be a model configured to estimate the angle of gaze and the distance to an object in the line of sight from the image of the eyeball, using as training data an image of the eyeball and the actual direction in which the eyeball in the image was looking. The AI ​​program may be included in the display device, the imaging device, or an external device. If included in the external device, it is transmitted to the display device via communication.

[0161] When display control is performed based on visual recognition detection, the smart glasses can be preferably applied to smart glasses that further include an imaging device for capturing images of the outside world. The smart glasses can display captured external information in real time.

[0162] This specification and the accompanying drawings include the following disclosure: (Item 1) a light-emitting region having a plurality of light-emitting elements disposed on a major surface of the substrate; a moisture-resistant ring disposed on the main surface so as to surround the light-emitting region; an insulating layer covering the light-emitting region and the moisture-resistant ring; In an orthogonal projection onto the main surface, the insulating layer has a shape that combines a first portion having a plurality of corners including a first corner, and a second portion having a shape in which the first corner is expanded outward. A light-emitting device characterized by: (Item 2) The second portion has a round shape. 2. The light emitting device according to item 1. (Item 3) The second portion has a shape in which the first corner portion is expanded in a radial direction. 2. The light emitting device according to item 1. (Item 4) The first portion has a polygonal shape. 3. The light-emitting device according to item 1 or 2. (Item 5) The polygon is a quadrilateral. 5. The light emitting device according to item 4. (Item 6) the first portion has a shape similar to the outer shape of the moisture-resistant ring; 6. The light emitting device according to any one of items 1 to 5, (Item 7) the first portion has a shape similar to the smallest rectangle that encloses the moisture-resistant ring; 6. The light emitting device according to any one of items 1 to 5, (Item 8) The interior angle of the two sides constituting the first corner portion is a right angle, an obtuse angle, or an acute angle. 8. The light emitting device according to any one of items 1 to 7, (Item 9) The plurality of corner portions include second corner portions, and the second portion has a shape in which each of the first corner portion and the second corner portion expands outward. 9. The light emitting device according to any one of items 1 to 8, (Item 10) The second portion has a shape in which each of the plurality of corners expands outward. 9. The light emitting device according to any one of items 1 to 8, (Item 11) In the orthogonal projection, an outer edge of the moisture-resistant ring has a shape having a plurality of vertices and a plurality of sides connecting adjacent vertices among the plurality of vertices, In the orthogonal projection, the shortest distance from each vertex to the outer edge of the insulating layer is greater than the shortest distance from each side to the outer edge of the insulating layer. 11. The light emitting device according to any one of items 1 to 10, (Item 12) The outer shape of the light emitting region is polygonal, the outer shape of the moisture-resistant ring has a portion along one side of the polygon, the portion having two first line segments whose distance from the one side is a first distance, and a second line segment whose distance from the one side is smaller than the first distance and which is located between the two first line segments; 12. The light emitting device according to any one of items 1 to 11, (Item 13) A light emitting device according to any one of items 1 to 12, and a circuit for driving the light emitting device; An apparatus comprising: (Item 14) a light-emitting region having a plurality of light-emitting elements disposed on a major surface of the substrate; a moisture-resistant ring disposed on the main surface so as to surround the light-emitting region; an insulating layer covering the light-emitting region and the moisture-resistant ring; the moisture-resistant ring has a first side extending in a first direction, a second side extending in a second direction different from the first direction, and a corner portion connecting the first side and the second side, the shortest distance from the corner to the outer edge of the insulating layer is greater than the shortest distance from the first side to the outer edge of the insulating layer; A light-emitting device characterized by: (Item 15) In an orthogonal projection onto the main surface, a portion of the outer edge of the insulating layer that is positioned outside the corner of the moisture-resistant ring has a round shape. Item 15. The light emitting device according to item 14. (Item 16) Item 16. The light-emitting device according to item 14 or 15, wherein, in an orthogonal projection onto the main surface, a portion of the outer edge of the insulating layer that is positioned outside the corner of the moisture-resistant ring has a shape that partially surrounds the corner. (Item 17) The outer shape of the light emitting region is polygonal, the outer shape of the moisture-resistant ring has a portion along one side of the polygon, the portion having two first line segments whose distance from the one side is a first distance, and a second line segment whose distance from the one side is smaller than the first distance and which is located between the two first line segments; 17. The light emitting device according to any one of items 14 to 16, (Item 18) the outer edge of the insulating layer has a shape formed by outwardly expanding corners of a shape formed by a plurality of sides parallel to a plurality of sides constituting the outer shape of the moisture-resistant ring, 18. The light emitting device according to any one of items 14 to 17, (Item 19) The interior angle of the corner is a right angle, an obtuse angle, or an acute angle. 19. The light emitting device according to any one of items 14 to 18, (Item 20) A light emitting device according to any one of items 14 to 19, and a circuit for driving the light emitting device; An apparatus comprising: (others) The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0163] 100: Light emitting device, 101: Light emitting element, 120: Moisture-resistant ring, 130: Scribe area, 140: Insulating layer, 141: First portion, 142: Second portion, 200: Substrate, Main surface: PS, C1 to C4: Corners

Claims

1. a light-emitting region having a plurality of light-emitting elements disposed on a major surface of the substrate; a moisture-resistant ring disposed on the main surface so as to surround the light-emitting region; an insulating layer covering the light-emitting region and the moisture-resistant ring; In an orthogonal projection onto the main surface, the insulating layer has a shape that combines a first portion having a plurality of corners including a first corner, and a second portion having a shape in which the first corner is expanded outward. A light-emitting device characterized by:

2. The second portion has a rounded shape.

2. The light emitting device according to claim 1.

3. The second portion has a shape in which the first corner portion is expanded in a radial direction.

2. The light emitting device according to claim 1.

4. the first portion has a polygonal shape; 2. The light emitting device according to claim 1.

5. The polygon is a quadrilateral.

5. The light emitting device according to claim 4.

6. the first portion has a shape similar to an outer shape of the moisture-resistant ring; 2. The light emitting device according to claim 1.

7. the first portion has a shape similar to the smallest rectangle that encloses the moisture-resistant ring; 2. The light emitting device according to claim 1.

8. The interior angle of the two sides constituting the first corner portion is a right angle, an obtuse angle, or an acute angle.

2. The light emitting device according to claim 1.

9. the plurality of corner portions include second corner portions, and the second portion has a shape in which each of the first corner portion and the second corner portion expands outward.

2. The light emitting device according to claim 1.

10. The second portion has a shape in which each of the plurality of corners expands outward.

2. The light emitting device according to claim 1.

11. In the orthogonal projection, an outer edge of the moisture-resistant ring has a shape having a plurality of vertices and a plurality of sides connecting adjacent vertices among the plurality of vertices, In the orthogonal projection, the shortest distance from each vertex to the outer edge of the insulating layer is greater than the shortest distance from each side to the outer edge of the insulating layer.

2. The light emitting device according to claim 1.

12. The outer shape of the light emitting region is polygonal, an outer shape of the moisture-resistant ring has a portion along one side of the polygon, the portion having two first line segments whose distance from the one side is a first distance, and a second line segment whose distance from the one side is smaller than the first distance and which is located between the two first line segments; 2. The light emitting device according to claim 1.

13. A light emitting device according to any one of claims 1 to 12, and a circuit for driving the light emitting device; An apparatus comprising:

14. a light-emitting region having a plurality of light-emitting elements disposed on a major surface of the substrate; a moisture-resistant ring disposed on the main surface so as to surround the light-emitting region; an insulating layer covering the light-emitting region and the moisture-resistant ring; the moisture-resistant ring has a first side extending in a first direction, a second side extending in a second direction different from the first direction, and a corner portion connecting the first side and the second side, the shortest distance from the corner to the outer edge of the insulating layer is greater than the shortest distance from the first side to the outer edge of the insulating layer; A light-emitting device characterized by:

15. In an orthogonal projection onto the main surface, a portion of the outer edge of the insulating layer that is positioned outside the corner of the moisture-resistant ring has a round shape.

15. The light emitting device according to claim 14.

16. The light emitting device according to claim 14 , wherein, in an orthogonal projection onto the main surface, a portion of the outer edge of the insulating layer located outside the corner of the moisture-resistant ring has a shape that partially surrounds the corner.

17. The outer shape of the light emitting region is polygonal, an outer shape of the moisture-resistant ring has a portion along one side of the polygon, the portion having two first line segments whose distance from the one side is a first distance, and a second line segment whose distance from the one side is smaller than the first distance and which is located between the two first line segments; 15. The light emitting device according to claim 14.

18. the outer edge of the insulating layer has a shape formed by outwardly expanding corners of a shape formed by a plurality of sides parallel to a plurality of sides constituting the outer shape of the moisture-resistant ring, 15. The light emitting device according to claim 14.

19. The interior angle of the corner is a right angle, an obtuse angle, or an acute angle.

15. The light emitting device according to claim 14.

20. A light emitting device according to any one of claims 14 to 19, and a circuit for driving the light emitting device; An apparatus comprising:

Images