Reactive hot-melt composition

Abstract

To provide a reactive hot-melt composition that enables impartation of flame retardancy with a reduced addition amount of a flame retardant as compared with conventional reactive hot-melt compositions, while suppressing appearance defects including bleed-out and cracks.SOLUTION: A reactive hot-melt composition contains (A) a hot melt and (B) a flame retardant, wherein the (A) hot melt is a urethane prepolymer obtained by reacting (C) a hydroxyl group-containing compound with (D) an isocyanate compound, the (C) hydroxyl group-containing compound includes (C1) a hydroxyl group-containing compound having a melting point of 50°C or more, and (C2) a hydroxyl group-containing compound having a melting point of 20°C or less and not having an alicyclic structure, and the (B) flame retardant includes (B1) an organic phosphorus compound having a melting point of 50°C or more.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to reactive hot melt compositions. [Background technology]

[0002] In general, hot melt compositions are solvent-free, environmentally friendly, can be cured in a short time, and are very easy to handle, which makes it possible to improve the working environment at manufacturing sites, and therefore hot melt compositions are widely used in precision fields such as automobiles and electrical machinery, as well as in the construction field.

[0003] Among hot melts, reactive hot melts can be applied at low temperatures compared to conventional hot melts such as polyolefins or polyamides. In addition, they are characterized by excellent chemical resistance and heat resistance due to crosslinking caused by moisture, ultraviolet rays, etc. Because reactive hot melt adhesives immediately show strength when they cool and harden, and because they have the above characteristics, they are expected to be a new material for potting or coating agents. The functions required for potting or coating agents include workability, electrical insulation, and durability (hydrolysis resistance), as well as flame retardancy for the resin alone.

[0004] Therefore, techniques have been proposed for imparting flame retardancy to reactive hot melts (for example, Patent Documents 1 and 2).

[0005] Patent Document 1 describes a moisture-curable reactive hot melt adhesive composition containing a urethane prepolymer (A) having an isocyanate group, aluminum hydroxide (B), and fumed silica (C), in which the content of the fumed silica (C) is 0.2 to 1 mass %.

[0006] Patent Document 2 describes a moisture-curable polyurethane hot melt adhesive comprising an isocyanate-terminated urethane prepolymer (C) obtained by reacting a polyol component (A) containing an alicyclic polyester polyol (a1) and an aliphatic polyester polyol (a2) with a polyisocyanate component (B), and a phenoxyphosphazene compound (D), wherein the content of alicyclic structures in the prepolymer (C) is 0.5% by weight or more and less than 10.0% by weight, and the phenoxyphosphazene compound (D) is contained in an amount of 5 to 60 parts by weight per 100 parts by weight of the prepolymer (C).

[0007] However, when the present inventors produced the hot melt compositions described in Patent Documents 1 and 2, the materials obtained from them required the incorporation of a large amount of flame retardant in order to impart flame retardancy that complies with the UL (Underwriters Laboratories Inc.) standard (UL94 V test), which is a safety standard for electrical appliances, materials, parts, etc. Furthermore, the obtained materials had problems with abnormal appearance such as bleeding out and cracks after solidification. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-009289 [Patent Document 2] Patent No. 5787141 Summary of the Invention [Problem to be solved by the invention]

[0009] An object of the present invention is to provide a reactive hot melt composition that can impart flame retardancy with a smaller amount of flame retardant than conventional reactive hot melt compositions, and that can suppress appearance abnormalities such as bleed-out and cracks. [Means for solving the problem]

[0010] As a result of intensive research into solving the above problems, the present inventors have found that the above problems can be solved by adding an organic phosphorus compound having a melting point of 50°C or higher as a flame retardant to a hot melt obtained by reacting a hydroxyl group-containing compound having a melting point of 50°C or higher, a hydroxyl group-containing compound having no alicyclic structure having a melting point of 20°C or lower, and an isocyanate compound. The present invention was completed based on this finding.

[0011] That is, the present invention relates to the following reactive hot melt composition, etc. Section 1. A reactive hot melt composition comprising (A) a hot melt and (B) a flame retardant, The (A) hot melt is a urethane prepolymer obtained by reacting (C) a hydroxyl group-containing compound with (D) an isocyanate compound, The (C) hydroxyl group-containing compound is (C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) Hydroxyl-containing compounds having a melting point of 20°C or less and not having an alicyclic structure and The (B) flame retardant is a reactive hot melt composition containing (B1) an organophosphorus compound having a melting point of 50°C or higher. Section 2. Item 2. The reactive hot melt composition according to Item 1, wherein the (B1) organophosphorus compound having a melting point of 50° C. or higher has a phosphate group. Section 3. Item 2. The reactive hot melt composition according to Item 1, wherein the (B1) organophosphorus compound having a melting point of 50° C. or higher includes an organophosphorus compound having a phosphorus atom and a nitrogen atom. Section 4. Item 4. The reactive hot melt composition according to Item 3, wherein the (B1) organophosphorus compound having a melting point of 50° C. or higher includes a phosphoric acid amidate. Section 5. Item 5. The reactive hot melt composition according to Item 4, wherein the (B1) organophosphorus compound having a melting point of 50° C. or higher further contains a phosphoric acid ester. Section 6. Item 2. The reactive hot melt composition according to Item 1, wherein the (C2) hydroxyl group-containing compound having a melting point of 20°C or less and no alicyclic structure contains one or more compounds selected from the group consisting of amorphous polyester polyols, polyolefin polyols, and polyether polyols. Section 7. Item 7. The reactive hot melt composition according to item 6, further comprising one or more additives selected from the group consisting of (E) an ion scavenger and (F) a catalyst. Section 8. Item 8. The reactive hot melt composition according to Item 7, wherein the (F) catalyst is an amine catalyst. Section 9. Item 9. The reactive hot melt composition according to item 8, wherein the amine catalyst is bis(2-morpholinoethyl) ether. Section 10. Item 1. An electric / electronic component sealed using the reactive hot melt composition according to item 1.

[0012] In addition, among the present inventions, inventions of products such as reactive hot melt compositions defined by a manufacturing process are described as product-by-process claims because it is currently impossible or impractical to specify all of the components contained therein or the structure of the product. [Effects of the Invention]

[0013] According to the present invention, a reactive hot melt composition can be obtained which can impart flame retardancy with a smaller amount of flame retardant than conventional reactive hot melt compositions and which can suppress appearance abnormalities such as bleed-out and cracks. Furthermore, by adding an ion scavenger and a catalyst, a reactive hot melt composition with improved durability (electrical insulation properties) under high temperature and high humidity conditions can be obtained. [Brief explanation of the drawings]

[0014] [Figure 1]The left side of Figure 1 is a photograph of the cured reactive hot melt composition of Example 7, which shows a good appearance, and the right side of Figure 1 is a photograph of the cured reactive hot melt composition of Comparative Example 3, which shows poor compatibility of the flame retardant and abnormal appearance due to bleed-out (indicated by the arrow). DETAILED DESCRIPTION OF THE INVENTION

[0015] The reactive hot melt composition of the present invention will be described in detail below. In this specification, the expressions "contain" or "comprise" include the concepts of "contain," "comprise," "consist essentially of," and "consist only of."

[0016] 1. Reactive hot melt composition The reactive hot melt composition of the present invention is a reactive hot melt composition containing (A) a hot melt and (B) a flame retardant, The (A) hot melt is a urethane prepolymer obtained by reacting (C) a hydroxyl group-containing compound with (D) an isocyanate compound, The (C) hydroxyl group-containing compound is (C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) Hydroxyl-containing compounds having a melting point of 20°C or less and not having an alicyclic structure and The (B) flame retardant contains (B1) an organophosphorus compound having a melting point of 50° C. or higher.

[0017] The reactive hot melt composition of the present invention is imparted with flame retardancy by adding a smaller amount of flame retardant than conventional reactive hot melt compositions, and also has improved appearance (visual abnormalities or poor appearance are suppressed).

[0018] Furthermore, the cured product obtained by moisture curing the reactive hot melt composition containing the ion scavenger and catalyst has excellent durability (electrical insulation properties) under high temperature and high humidity conditions. Here, moisture curing refers to the self-crosslinking / curing of the reactive hot melt composition, such as when the isocyanate group is hydrolyzed in the presence of moisture to generate an amino group terminal, thereby forming a polyurea bond, or when the latent curing agent is decomposed by water to generate an amine or hydroxyl group, which reacts with the isocyanate group to form a polyurea / polyurethane bond.

[0019] (A) Hot melt The reactive hot melt composition of the present invention comprises (A) a hot melt. The (A) hot melt is a urethane prepolymer obtained by reacting (C) a hydroxyl group-containing compound with (D) an isocyanate compound, The (C) hydroxyl group-containing compound is (C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) A hydroxyl group-containing compound having a melting point of 20°C or less and not having an alicyclic structure is included. Here, the hot melt can be rephrased as "urethane prepolymer" or "isocyanate group-terminated urethane prepolymer."

[0020] The (A) hot melt can be obtained by reacting the (C) hydroxyl group-containing compound with the (D) isocyanate compound, i.e., the (A) hot melt is a reaction product of the (C) hydroxyl group-containing compound with the (D) isocyanate compound.

[0021] (C) Hydroxyl group-containing compound The (A) hot melt contains, as the (C) hydroxyl group-containing compound, (C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) a hydroxyl group-containing compound having no alicyclic structure and having a melting point of 20°C or lower.

[0022] (C1) Hydroxyl-containing compounds with a melting point of 50°C or higher The (C1) hydroxyl-containing compound having a melting point of 50°C or higher is not particularly limited as long as it is a crystalline solid at room temperature (25°C). The (C1) hydroxyl-containing compound having a melting point of 50°C or higher preferably has a melting point of 70°C or lower. Crystalline means having a crystalline structure at room temperature (25°C).

[0023] In this specification, the melting point is measured by differential scanning calorimetry (DSC). Specifically, the melting point can be measured by simultaneously raising the temperature of a standard sample (alumina powder) in an air stream at a rate of 20°C / min and detecting the temperature (°C) at which the maximum endothermic peak is observed.

[0024] The content of the (C1) hydroxyl group-containing compound having a melting point of 50°C or higher is usually 10 to 80% by mass, preferably 15 to 70% by mass, more preferably 20 to 60% by mass, and even more preferably 25 to 50% by mass, relative to 100% by mass of the (C) hydroxyl group-containing compound. Examples of the (C1) hydroxyl group-containing compound having a melting point of 50° C. or higher include (C1-1) crystalline polyester polyol; (C1-2) crystalline hydrogenated polyolefin polyol; and the like.

[0025] (C1-1) Crystalline polyester polyol The crystalline polyester polyol (C1-1) is not particularly limited as long as it is a crystalline polyester polyol, and can be obtained, for example, by reacting an aliphatic dicarboxylic acid with an aliphatic diol and / or a cyclic ether. Specifically, examples of the (C1-1) crystalline polyester polyol include a crystalline polyester polyol obtained by a condensation reaction between an aliphatic dicarboxylic acid and an aliphatic diol; a crystalline polyester polyol obtained by an esterification reaction between an aliphatic dicarboxylic acid and a cyclic ether; and a crystalline polyester polyol obtained by an esterification reaction between an aliphatic dicarboxylic acid, an aliphatic diol, and a cyclic ether.

[0026] The aliphatic dicarboxylic acid is not particularly limited, and examples thereof include succinic acid, adipic acid, sebacic acid (decanedioic acid), and dodecamethylenedicarboxylic acid. Among these, preferred aliphatic dicarboxylic acids are adipic acid, sebacic acid, dodecamethylenedicarboxylic acid, and 1,12-dodecanedicarboxylic acid, and more preferred is sebacic acid. The dicarboxylic acid may be a derivative of a carboxylic acid. Examples of such derivatives include dialkyl esters, such as dimethyl esters and diethyl esters, of the dicarboxylic acids listed above.

[0027] The aliphatic diol is not particularly limited, and examples thereof include ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 2-methyl-1,4-butanediol, neopentyl glycol, 1,6-hexanediol, 2-methyl-1,5-pentanediol, 3-methyl-1,5-pentanediol, etc. Among these, the aliphatic diol is preferably an aliphatic diol having 2 to 10 carbon atoms, more preferably an aliphatic diol having 4 to 8 carbon atoms, and even more preferably ethylene glycol, 1,4-butanediol, and 1,6-hexanediol.

[0028] The cyclic ether is not particularly limited, and examples thereof include oxirane (also called epoxide, ethylene oxide, or alkylene oxide), oxetane, and the like.

[0029] The crystalline polyester polyol (C1-1) can be used alone or in combination of two or more. Among these, (C1-1) crystalline polyester polyol is preferred because it provides a hot melt with an appropriate melting point and recrystallization (solidification) time, improving workability, and is therefore a polyester polyol obtained by condensation polymerization using adipic acid or sebacic acid as the aliphatic dicarboxylic acid and an aliphatic diol having 4 to 8 carbon atoms as the aliphatic diol.

[0030] The content of the crystalline polyester polyol (C1-1) is usually 20 to 100 mass%, preferably 50 to 100 mass%, more preferably 60 to 95 mass%, and even more preferably 65 to 90 mass%, relative to 100 mass% of the hydroxyl group-containing compound (C1) having a melting point of 50°C or higher.

[0031] (C1-2) Crystalline hydrogenated polyolefin polyol The crystalline hydrogenated polyolefin polyol (C1-2) is not particularly limited, and examples thereof include hydrogenated polyisoprene polyol and hydrogenated polybutadiene polyol.

[0032] The (C1-2) hydrogenated polyolefin polyol is not particularly limited, and examples thereof include hydrogenated polybutadiene polyol, hydrogenated polyisoprene polyol, and hydroxyl-modified polyolefins that can be obtained by reacting an amino alcohol with an acid-modified polyolefin obtained by modifying a polyolefin with an unsaturated (poly)carboxylic acid (anhydride), as described in JP 2018-076428 A, for example.

[0033] The commercially available crystalline hydrogenated polyolefin polyol (C1-2) is not particularly limited, and examples thereof include Polytail H (hydrogenated polybutadiene polyol, manufactured by Mitsubishi Chemical Corporation).

[0034] The average hydroxyl value of the crystalline polyester polyol (C1-1) or the crystalline hydrogenated polyolefin polyol (C1-2) is usually 5 to 160 mgKOH / g, preferably 15 to 1100 mgKOH / g, and more preferably 20 to 80 mgKOH / g. In the present specification, the "average hydroxyl value" refers to the hydroxyl value of the hydroxyl-containing compound (C1-1) when the crystalline polyester polyol (C1-1) or the crystalline hydrogenated polyolefin polyol (C1-2) is used alone, and refers to the average hydroxyl value calculated by multiplying the hydroxyl values ​​of the hydroxyl-containing compounds by their blending ratios and adding them up when two or more are used in combination. In this specification, the hydroxyl value is measured in accordance with Method A of JIS K1557-1:2007. The crystalline hydrogenated polyolefin polyol (C1-2) can be used alone or in combination of two or more.

[0035] The content of the crystalline hydrogenated polyolefin polyol (C1-2) is usually 0 to 95 mass%, preferably 3 to 80 mass%, more preferably 5 to 60 mass%, and even more preferably 7 to 50 mass%, relative to 100 mass% of the hydroxyl group-containing compound (C1) having a melting point of 50°C or higher.

[0036] The hydroxyl group-containing compound (C1) having a melting point of 50°C or higher used in the hot melt (A) preferably contains a crystalline polyester polyol (C1-1) because this provides the hot melt with an appropriate melting point and time for recrystallization (also known as solidification or coagulation), improving workability.

[0037] (C2) Hydroxyl-containing compounds having a melting point of 20°C or less and not having an alicyclic structure The (C2) hydroxyl group-containing compound having a melting point of 20°C or less and not having an alicyclic structure is not particularly limited as long as it does not have an alicyclic structure in its molecular structure, and examples thereof include (C2-1) amorphous polyester polyol, (C2-2) polyolefin polyol, and (C2-3) polyether polyol.

[0038] The melting point of the (C2) hydroxyl group-containing compound having no alicyclic structure and having a melting point of 20°C or less is preferably 0°C or less, more preferably -5 to -80°C. The content of the (C2) hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or lower is usually 5 to 90 mass%, preferably 15 to 85 mass%, more preferably 20 to 80 mass%, and even more preferably 25 to 75 mass%, relative to 100 mass% of the (C) hydroxyl group-containing compound.

[0039] (C2-1) Amorphous polyester polyol The amorphous polyester polyol (C2-1) is not particularly limited, and examples thereof include castor oil polyols and condensation type polyester polyols.

[0040] The castor oil-based polyol is not particularly limited, and examples thereof include castor oil, castor oil derivatives, etc. As the polyester polyol, castor oil-based polyol is preferred.

[0041] Commercially available castor oil-based polyols include URIC H-1824, URIC H-30, URIC Y-403, URIC HF-1300, URIC HF-2009, and URIC PH-5001 manufactured by Ito Oil Mills, Ltd.

[0042] Examples of castor oil derivatives include castor oil fatty acids, hydrogenated castor oils obtained by hydrogenating castor oil or castor oil fatty acids, transesterification products of castor oil and other fats and oils, reaction products of castor oil and polyhydric alcohols, esterification products of castor oil fatty acids and polyhydric alcohols, and compounds obtained by addition polymerization of these with alkylene oxides. Among the above castor oil-based polyols, it is preferable to use esterification products of castor oil or castor oil fatty acids and polyhydric alcohols.

[0043] Examples of the hydrogenated castor oil include those disclosed in Japanese Patent Application Laid-Open No. 2-298574. Hydrogenated castor oil can be obtained by hydrogenating the above-mentioned castor oil-based polyol.

[0044] The average hydroxyl value of the castor oil-based polyol is preferably 5 to 400 mgKOH / g, and more preferably 10 to 200 mgKOH / g.

[0045] The average number of functional groups in the castor oil-based polyol is usually 1.5 to 3.5, more preferably 1.7 to 3, and even more preferably 1.9 to 2.7.

[0046] The number average molecular weight (Mn) of the above castor oil-based polyol is usually in the range of 100 to 5,000, preferably in the range of 200 to 4,000, and more preferably in the range of 300 to 3,500.

[0047] In this specification, the number average molecular weight (Mn) can be measured by gel permeation chromatography (GPC) (polystyrene equivalent). Specifically, the number average molecular weight by GPC is measured using a Shodex GPC System 21 measuring device manufactured by Showa Denko K.K., a Shodex LF-804 / KF-803 / KF-804 column manufactured by Showa Denko K.K., and NMP as the mobile phase at a column temperature of 40°C, and can be calculated using a calibration curve of standard polystyrene.

[0048] Condensation type polyester polyols include aliphatic dicarboxylic acids (succinic acid (C4H6O4), adipic acid (C6H 10 O4), azelaic acid (C9H 16 O4), sebacic acid (C 10 H 18 Examples of suitable condensation polyester polyols include polycarboxylic acids having 2 to 10 carbon atoms or esters thereof, and more preferred condensation polyester polyols include polycarboxylic acids obtained by reacting a polycarboxylic acid such as adipic acid, sebacic acid, or isophthalic acid with a diol such as ethylene glycol, propylene glycol, butylene glycol, polyethylene glycol, or polypropylene glycol.

[0049] Specific examples of condensation type polyester polyols include polyethylene adipate diol, polybutylene adipate diol, polyhexamethylene adipate diol, polyethylene terephthalate diol, polyhexamethylene isophthalate diol, polyethylene terephthalate diol, polyhexamethylene terephthalate diol, polyneopentyl terephthalate diol, polyneopentyl adipate diol, polyethylene propylene adipate diol, polyethylene butylene adipate diol, polybutylene Examples of the copolymer include hexamethylene adipate diol, polydiethylene adipate diol, poly(polytetramethylene ether) adipate diol, poly(3-methylpentylene adipate) diol, polyethylene azelate diol, polyethylene sebacate diol, polybutylene azelate diol, polybutylene sebacate diol, poly(butylene adipate / butylene terephthalate) copolymer diol, and poly(3-methylpentylene adipate / 3-methylpentylene terephthalate) copolymer diol.

[0050] Commercially available condensation polyester polyols include, for example, Polylite (registered trademark) OD-X-286, OD-X-102, OD-X-355, OD-X-2330, OD-X-240, OD-X-668, OD-X-2108, OD-X-2376, OD-X-2044, OD-X-688, OD-X-2068, OD-X-2547, and OD-X-2 420, OD-X-2523, OD-X-2555, OD-X-2560, Kuraray Co., Ltd. polyols P-510, P-1010, P-2010, P-3010, P-4010, P-5010, P-6010, F-510, F-1010, F-2010, F-3010, P-1011, P-2011, P-2013, P-2030, N-2010, PNNA-2016; Sun-Estar 2610 [polyethylene adipate diol with Mn=1,000, manufactured by Sanyo Chemical Industries, Ltd.], Sun-Estar 4620 [polytetramethylene adipate diol with Mn=2,000], Sun-Estar 2620 [polyethylene adipate diol with Mn=2,000, manufactured by Sanyo Chemical Industries, Ltd.], Kuraray Polyol P-2010 [poly-3-methyl-1,5-pentylene adipate diol with Mn=2,000], Kuraray Polyol P-3010 [poly-3-methyl-1,5-pentylene adipate diol with Mn=3,000], Kuraray Polyol P-6010 [Poly-3-methyl-1,5-pentylene adipate diol with Mn=6000], Kuraray Polyol P-520 [Poly-3-methyl-1,5-pentylene terephthalate diol with Mn=500], Kuraray Polyol P-1020 [Poly-3-methyl-1,5-pentylene terephthalate diol with Mn=1000], Kuraray Polyol P-2020 [Poly-3-methyl-1,5-pentylene terephthalate diol with Mn=2000], Kuraray Polyol P-530 [Poly-3-methyl-1,5-pentylene isoflurane diol with Mn=500] terephthalate diol], Kuraray Polyol P-1030 [poly-3-methyl-1,5-pentylene isophthalate diol with Mn=1000], Kuraray Polyol P-2030 [poly-3-methyl-1,5-pentylene isophthalate diol with Mn=2000], Kuraray Polyol P-1011 [poly(3-methyl-1,5-pentylene adipate / 3-methyl-1,5-pentylene terephthalate) copolymer diol with Mn=1,000], Kuraray Polyol P-2011 [poly(3-methyl-1,5-pentylene adipate / 3- Examples of suitable poly(3-methyl-1,5-pentylene adipate / 3-methyl-1,5-pentylene isophthalate) copolymer diols include Kuraray Polyol P-1012 [poly(3-methyl-1,5-pentylene adipate / 3-methyl-1,5-pentylene isophthalate) copolymer diols with Mn=1000], Kuraray Polyol P-1012 [poly(3-methyl-1,5-pentylene adipate / 3-methyl-1,5-pentylene isophthalate) copolymer diols with Mn=2000], and Kuraray Polyol P-2050 [poly-3-methyl-1,5-pentylene sebacate diol with Mn=2000].

[0051] Examples of condensation polyester polyols include polyester polyols obtained by condensing a low-molecular-weight polyol having a number average molecular weight (Mn) of less than 300 with a polycarboxylic acid having 2 to 10 carbon atoms or an ester-forming derivative thereof. Among the low-molecular-weight polyols having a number-average molecular weight (Mn) of less than 300 used in the condensation polyester polyol, preferred are ethylene glycol, propylene glycol, 1,4-butanediol, neopentyl glycol, 1,6-hexane glycol, low-molar adducts of bisphenol A with ethylene oxide (hereinafter abbreviated as "EO") or 1,2- or 1,3-propylene oxide (hereinafter abbreviated as "PO"), and mixtures thereof.

[0052] The average hydroxyl value of the condensation type polyester polyol is preferably from 5 to 400 mgKOH / g, and more preferably from 10 to 200 mgKOH / g.

[0053] The average number of functional groups of the condensation type polyester polyol is usually 1.5 to 3.5, more preferably 1.8 to 3, and even more preferably 2 to 2.7.

[0054] The number average molecular weight (Mn) of the condensation type polyester polyol is usually in the range of 100 to 6,000, preferably in the range of 200 to 5,000, and more preferably in the range of 300 to 4,000.

[0055] The amorphous polyester polyol (C2-1) can be used alone or in combination of two or more. The amount of the (C2-1) amorphous polyester polyol is usually 0 to 100% by mass, preferably 10 to 80% by mass, and more preferably 20 to 75% by mass, relative to 100% by mass of the (C2) hydroxyl group-containing compound having a melting point of 20°C or lower and no alicyclic structure.

[0056] (C2-2) Polyolefin Polyol The (C2-2) polyolefin polyol is not particularly limited, and may be, for example, a polymer of a radically polymerizable monomer having two or more unsaturated double bonds, or a copolymer of such a radically polymerizable monomer with another radically polymerizable monomer, and has two or more hydroxyl groups.

[0057] (C2-2) polyolefin polyols include polyolefin polyols (for example, polybutadiene polyols, polyisoprene polyols), hydrogenated polyolefin polyols (hydrogenated polyolefin polyols), and the like.

[0058] Examples of (C2-2) polyolefin polyols include polybutadiene polyols, polyisoprene polyols, etc. Commercially available polyolefin polyols include polybutadiene polyols [NISSO-PBG series (G-1000, G-2000, G-3000, etc.) manufactured by Nippon Soda Co., Ltd., Poly bd (registered trademark) series (R-45M, R-45HT, CS-15, CN-15, etc.) manufactured by ARCO Corporation of the United States, Krasol series (LBH-P2000, LBH 2000, LBH-P3000, LBH 3000, etc.) manufactured by Cray Valley Chemical Industries, Ltd., and polyisoprene polyols [Poly ip manufactured by Idemitsu Kosan Co., Ltd.].

[0059] Examples of hydrogenated polyolefin polyols (hydrogenated polyolefin polyols) include hydrogenated polybutadiene polyols, hydrogenated polyisoprene polyols, etc. Commercially available hydrogenated polyolefin polyols include hydrogenated polybutadiene polyols (NISSO-PBGI series (GI-1000, GI-2000, GI-3000, etc.) manufactured by Nippon Soda Co., Ltd.), Krasol series (HLBH-P2000, HLBH-P 3000, etc.) manufactured by Cray Valley, and hydrogenated polyolefin polyols (EPOL manufactured by Idemitsu Kosan Co., Ltd.).

[0060] The hydroxyl value of the (C2-2) polyolefin polyol is preferably from 10 to 120 mgKOH / g, more preferably from 25 to 110 mgKOH / g, and particularly preferably from 30 to 100 mgKOH / g.

[0061] The average number of functional groups in the (C2-2) polyolefin polyol is usually 1.5 to 5, preferably 1.6 to 3, and more preferably 1.7 to 2.5.

[0062] The number average molecular weight (Mn) of the (C2-2) polyolefin polyol is usually in the range of 100 to 5,000, preferably in the range of 1,000 to 4,000, and more preferably in the range of 1,500 to 3,500.

[0063] The hydroxyl group content of the (C2-2) polyolefin polyol is not particularly limited and is usually 0.001 to 3 mol / kg, preferably 0.01 to 2 mol / kg, and more preferably 0.1 to 1.2 mol / kg.

[0064] The viscosity of the polyolefin polyol (C2-2) (30° C.) is usually in the range of 0.01 to 500 Pa·s, preferably in the range of 0.1 to 300 Pa·s, and more preferably in the range of 1 to 150 Pa·s.

[0065] The iodine value of the (C2-2) polyolefin polyol is usually in the range of 1 to 1000 g / 100 g, preferably in the range of 5 to 500 g / 100 g, and more preferably in the range of 10 to 100 g / 100 g.

[0066] The (C2-2) polyolefin polyols can be used alone or in combination of two or more. Among these, the (C2-2) polyolefin polyol is preferably a polybutadiene polyol, and more preferably a polybutadiene polyol having a number average molecular weight (Mn) of 1200 or more and a hydroxyl value of 20 to 150 mgKOH / g.

[0067] The content of the (C2-2) polyolefin polyol is usually 0 to 95 mass%, preferably 5 to 90 mass%, more preferably 10 to 85 mass%, and even more preferably 15 to 80 mass%, relative to 100 mass% of the (C2) hydroxyl group-containing compound having a melting point of 20°C or lower and no alicyclic structure.

[0068] (C2-3) Polyether Polyol The (C2-3) polyether polyol is not particularly limited, and examples thereof include polyether polyols obtained by addition polymerization of alkylene oxides such as ethylene oxide, propylene oxide, and butylene oxide using as initiators water, low-molecular-weight polyols (propylene glycol, ethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), and dihydroxybenzenes (catechol, resorcinol, hydroquinone, etc.). Specific examples include polyethylene glycol, polypropylene glycol, polytetramethylene glycol, propylene oxide adducts of bisphenol A (bisphenol ether polyols), and polyether carbonate diols.

[0069] The hydroxyl value of the (C2-3) polyether polyol is preferably from 1 to 600 mgKOH / g, more preferably from 10 to 400 mgKOH / g, and particularly preferably from 20 to 150 mgKOH / g.

[0070] The average number of functional groups in the (C2-3) polyether polyol is usually 1.5 to 5, preferably 2 to 4, and more preferably 1.8 to 2.3.

[0071] The number average molecular weight (Mn) of the (C2-3) polyether polyol is usually in the range of 100 to 5,000, preferably in the range of 300 to 4,000, and more preferably in the range of 500 to 3,500.

[0072] The (C2-3) polyether polyols can be used alone or in combination of two or more. Among these, preferred (C2-3) polyether polyols are polypropylene diol, polytetramethylene glycol, and propylene oxide adducts of bisphenol A (bisphenol ether polyols).

[0073] The content of the (C2-3) polyether polyol is usually 0 to 100 mass%, preferably 10 to 90 mass%, more preferably 15 to 85 mass%, and even more preferably 20 to 80 mass%, relative to 100 mass% of the (C2) hydroxyl group-containing compound having a melting point of 20°C or lower and no alicyclic structure.

[0074] The (C2) hydroxyl group-containing compound having a melting point of 20°C or less and no alicyclic structure preferably contains one or more compounds selected from the group consisting of (C2-1) amorphous polyester polyols, (C2-2) polyolefin polyols, and (C2-3) polyether polyols, and more preferably contains two or more compounds. When the (C2) hydroxyl group-containing compound having a melting point of 20°C or less and no alicyclic structure contains two selected from the group consisting of (C2-1) amorphous polyester polyol, (C2-2) polyolefin polyol, and (C2-3) polyether polyol, it preferably contains any of the following combinations: a combination of (C2-1) amorphous polyester polyol and (C2-2) polyolefin polyol; a combination of (C2-1) amorphous polyester polyol and (C2-3) polyether polyol; a combination of (C2-2) polyolefin polyol and (C2-3) polyether polyol; or a combination of (C2-1) amorphous polyester polyol, (C2-2) polyolefin polyol, and (C2-3) polyether polyol. Among these, the combination of (C2-1) amorphous polyester polyol and (C2-2) polyolefin polyol; and the combination of (C2-2) polyolefin polyol and (C2-3) polyether polyol are more preferred.

[0075] The (C2) hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or less used in the present invention may further contain a polyol compound having no alicyclic structure other than the above (C2-1) to (C2-3) (sometimes referred to as other polyols having no alicyclic structure).

[0076] Other polyols not having an alicyclic structure include, for example, polycarbonate polyols; silicone polyols; dimer acid polyols; polycarbonate polyols; polycaprolactone polyols; acrylic polyols; amine polyols; and hydrogenated versions of these.

[0077] The polycarbonate polyol is not particularly limited, and examples thereof include reaction products of polyols with carbonate compounds such as dialkyl carbonates, alkylene carbonates, and diaryl carbonates.

[0078] Examples of dialkyl carbonates include dimethyl carbonate and diethyl carbonate. Examples of alkylene carbonates include ethylene carbonate. Examples of diaryl carbonates include diphenyl carbonate. Polycarbonate polyols obtained by polycondensation of the above polyol components with phosgene; polycarbonate polyols obtained by transesterification of the above polyol components with carbonate diesters such as dimethyl carbonate, diethyl carbonate, dipropyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethylbutyl carbonate, ethylene carbonate, propylene carbonate, diphenyl carbonate, and dibenzyl carbonate; copolymer polycarbonate polyols obtained by combining two or more of the above polyol components; polycarbonate polyols obtained by esterification of the above various polycarbonate polyols with carboxyl group-containing compounds; and the above various polycarbonate polyols. Examples of the polycarbonate polyol include polycarbonate polyols obtained by etherifying polyols with hydroxyl group-containing compounds, polycarbonate polyols obtained by transesterification of the above-mentioned various polycarbonate polyols with ester compounds, polycarbonate polyols obtained by transesterification of the above-mentioned various polycarbonate polyols with hydroxyl group-containing compounds, polyester-based polycarbonate polyols obtained by polycondensation of the above-mentioned various polycarbonate polyols with dicarboxylic acid compounds, and copolymerized polyether-based polycarbonate polyols obtained by copolymerizing the above-mentioned various polycarbonate polyols with alkylene oxides. Note that polycarbonate polyols can also be called polycarbonate diols.

[0079] The silicone polyol is not particularly limited, and examples thereof include those in which two or more hydroxyl groups and / or organic groups having a hydroxyl group are introduced into the terminals and / or side chains of dimethylpolysiloxane.Preferred examples of the silicone polyol include carbinol-modified silicone oil, polyether-modified silicone oil, and silanol-modified silicone oil. Commercially available silicone polyols include, for example, "Silaplane FMDA26" manufactured by JNC Corporation, and "Shin-Etsu Silicones" manufactured by Shin-Etsu Chemical Co., Ltd., carbinol-modified types: KF-6000, KF-6001, KF-6002, KF-6003, X-22-170BX, silanol-modified types: X-21-5841, KF-9701, and diol-modified type: X-22-176F.

[0080] The dimer acid polyol is not particularly limited, and for example, known dimer acid polyols can be used.

[0081] The polycaprolactone polyol is not particularly limited, and examples thereof include caprolactone-based polyester diols obtained by ring-opening polymerization of cyclic ester monomers such as ε-caprolactone and δ-valerolactone.

[0082] Examples of acrylic polyols include copolymers obtained by copolymerizing a hydroxyl group-containing acrylate with a copolymerizable vinyl monomer copolymerizable with the hydroxyl group-containing acrylate.

[0083] Examples of hydroxyl group-containing acrylates include 2-hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, 2,2-dihydroxymethylbutyl (meth)acrylate, polyhydroxyalkyl maleate, and polyhydroxyalkyl fumarate, and preferably 2-hydroxyethyl (meth)acrylate.

[0084] Examples of copolymerizable vinyl monomers include C monomers such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, isononyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and cyclohexyl acrylate. 1-12 Examples of suitable vinyl monomers include alkyl (meth)acrylates; aromatic vinyl monomers such as styrene, vinyl toluene, and α-methylstyrene; vinyl cyanides such as (meth)acrylonitrile; vinyl monomers containing a carboxyl group such as (meth)acrylic acid, fumaric acid, maleic acid, and itaconic acid, or alkyl esters thereof; alkane polyol poly(meth)acrylates such as ethylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, hexanediol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, trimethylolpropane di(meth)acrylate, and trimethylolpropane tri(meth)acrylate; and vinyl monomers containing an isocyanate group such as 3-(2-isocyanate-2-propyl)-α-methylstyrene.

[0085] The acrylic polyol can be obtained by copolymerizing these hydroxyl group-containing acrylates and copolymerizable vinyl monomers in the presence of a suitable solvent and a polymerization initiator.

[0086] The acrylic polyol includes, for example, silicone polyol, fluorine polyol, and the like.

[0087] Examples of the fluorine polyol include acrylic polyols blended with a fluorine compound containing a vinyl group, such as tetrafluoroethylene or chlorotrifluoroethylene, as a copolymerizable vinyl monomer in the copolymerization of the acrylic polyol described above.

[0088] The vinyl monomer-modified polyol can be obtained by reacting the above-mentioned high molecular weight polyol with a vinyl monomer.

[0089] The amine polyol is not particularly limited, and examples thereof include diethanolamine, triethanolamine, aliphatic amine polyols, etc. Commercially available aliphatic amine polyols include "Sannyx NP-300" manufactured by Sanyo Chemical Industries, Ltd.

[0090] When (C2) the hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or lower contains another polyol having no alicyclic structure, the content of the other polyol having no alicyclic structure is usually 5 to 95 parts by mass, preferably 15 to 80 parts by mass, more preferably 25 to 60 parts by mass, and even more preferably 30 to 50 parts by mass, per 100 parts by mass of (C2) the hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or lower.

[0091] The ratio of the hydroxyl group-containing compound (C1) having a melting point of 50°C or higher to the hydroxyl group-containing compound (C2) having a melting point of 20°C or lower and not having an alicyclic structure in the hydroxyl group-containing compound (C) is usually 25:75 by mass, preferably 40:60, more preferably 60:40, and even more preferably 75:25.

[0092] The (C) hydroxyl group-containing compound may contain a hydroxyl group-containing compound other than the (C1) hydroxyl group-containing compound having a melting point of 50°C or higher and the (C2) hydroxyl group-containing compound having a melting point of 20°C or lower and not having an alicyclic structure (hereinafter also referred to as "(C3) other hydroxyl group-containing compound").

[0093] (C3) Other hydroxyl group-containing compounds include, for example: (C3-1) a hydroxyl group-containing compound having a melting point of 20°C or higher and lower than 50°C; (C3-2) Hydroxyl-containing compounds having an alicyclic structure and a melting point of 20° C. or higher.

[0094] Examples of the (C3-1) hydroxyl group-containing compound having a melting point of 20° C. or higher and lower than 50° C. include high molecular weight polytetramethylene glycol, caprolactone-based polyols, and polycarbonate diols. Examples of the (C3-2) hydroxyl group-containing compound having an alicyclic structure and a melting point of 20°C or higher include polycarbonate diol having a cyclohexane structure (ETERNACOLL (registered trademark) UC-100: manufactured by UBE Corporation, etc.) and alicyclic polyols such as 1,4-cyclohexanediol.

[0095] When the (C) hydroxyl group-containing compound contains the (C3) other hydroxyl group-containing compound, the content of the (C3) other hydroxyl group-containing compound is usually 0.1 to 70 mass%, preferably 1 to 50 mass%, more preferably 3 to 40 mass%, and even more preferably 5 to 30 mass%, relative to 100 mass% of the (C) hydroxyl group-containing compound.

[0096] (D) Isocyanate compounds The isocyanate compound (D) is not particularly limited as long as it has two or more isocyanate groups, and various components that are used or can be used in reactive hot melt compositions can be used.

[0097] The (D) isocyanate compound is not particularly limited and may be, for example, (D1) an aliphatic polyisocyanate compound, (D2) alicyclic polyisocyanate compounds, (D3) Aromatic polyisocyanate compounds Polyisocyanate compounds such as; The modified polyisocyanate compound (D-1) (for example, (d-1a) isocyanurate compound, (d-1b) carbodiimide compound, (d-1c) adduct, (d-1d) Biuret body, (d-1e) allophanate, etc.); Examples thereof include the polynuclear derivatives (D-2) of the above polyisocyanate compounds.

[0098] Examples of the aliphatic polyisocyanate compound (D1) include tetramethylene diisocyanate, dodecamethylene diisocyanate, 1,6-hexamethylene diisocyanate (HDI), 2,2,4-trimethylhexamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, lysine diisocyanate, 2-methylpentane-1,5-diisocyanate, 3-methylpentane-1,5-diisocyanate, and 1,5-pentamethylene diisocyanate, and preferably 1,6-hexamethylene diisocyanate (HDI).

[0099] The (D1) aliphatic polyisocyanate compound is preferably an allophanate-modified or urethane-modified aliphatic polyisocyanate compound (D1a-1). For example, in the present invention, a polyisocyanate compound having an isocyanate group at its terminal, derived from 1,6-hexamethylene diisocyanate (hereinafter abbreviated as "HDI"), can be used. Specific examples of such compounds include Duranate (registered trademark) A201H, D101, D201, TKA-100, TSA-100, TSS-100, TSE-100, and TLA-100, all manufactured by Asahi Chemical Industry Co., Ltd.

[0100] Examples of the (D2) alicyclic polyisocyanate compound include isophorone diisocyanate, hydrogenated xylylene diisocyanate, 4,4'-dicyclohexylmethane diisocyanate (hydrogenated 4,4'-diphenylmethane diisocyanate, HMDI), 1,4-cyclohexane diisocyanate, methylcyclohexylene diisocyanate, and 1,3-bis(isocyanatemethyl)cyclohexane.

[0101] The hydrogenated product of 4,4'-diphenylmethane diisocyanate used in the present invention is a polyisocyanate obtained by hydrogenating 4,4'-diphenylmethane diisocyanate (hereinafter abbreviated as MDI). A specific example of this is WANNATE (registered trademark) HMDI manufactured by Wanka Chemical Japan.

[0102] Examples of the aromatic polyisocyanate compound (D3) include tolylene diisocyanate, 2,2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate (MDI), 4,4'-dibenzyl diisocyanate, 1,5-naphthylene diisocyanate, xylylene diisocyanate, 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, dialkyldiphenylmethane diisocyanate, tetraalkyldiphenylmethane diisocyanate, and α,α,α,α-tetramethylxylylene diisocyanate, and preferred are 2,2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, and 4,4'-diphenylmethane diisocyanate (MDI). A specific example of such a product is Millionate (registered trademark) MT (Pure MDI) manufactured by Tosoh Corporation.

[0103] (D3) An example of a modified aromatic polyisocyanate compound (D3-1) is (d3-1b) a carbodiimide derivative of 4,4'-diphenylmethane diisocyanate (MDI). In the present invention, a polyisocyanate having a carbodiimide group derived from 4,4'-diphenylmethane diisocyanate (carbodiimide-modified MDI) can be used. A specific example of this is Millionate (registered trademark) MTL manufactured by Tosoh Corporation.

[0104] The viscosity of the (D) isocyanate compound varies depending on the type of isocyanate compound, whether or not it is modified, and other factors, but is not particularly limited. For example, in the case of aromatic polyisocyanate compounds and their modified products and polynuclear products (preferably carbodiimide and polynuclear aromatic polyisocyanate compounds), the viscosity at 25°C is, for example, 5 to 200 mPa·s, preferably 10 to 150 mPa·s, more preferably 15 to 100 mPa·s, and even more preferably 20 to 80 mPa·s. As another example, in the case of aliphatic polyisocyanate compounds and their modified products and polynuclear products, the viscosity at 25°C is, for example, 100 to 3000 mPa·s, preferably 500 to 2500 mPa·s, more preferably 1000 to 2000 mPa·s, and even more preferably 1200 to 1700 mPa·s.

[0105] The NCO content of the (D) isocyanate compound is not particularly limited, but is, for example, 15 to 45%, more preferably 20 to 40%, and even more preferably 20 to 35%.

[0106] As the (D) isocyanate compound, from the viewpoint of excellent workability and suppressing a decrease in electrical insulation, it is preferable to use (Da-1) an allophanate-modified or urethane-modified polyisocyanate compound (more preferably (D1a-1) an allophanate-modified or urethane-modified aliphatic polyisocyanate compound), (D3) an aromatic polyisocyanate compound (more preferably, 4,4'-diphenylmethane diisocyanate (MDI) or a polynuclear MDI, and a mixture of MDI and a polynuclear MDI); (D3) Carbodiimide derivatives of aromatic polyisocyanate compounds (more preferably, polyisocyanates having carbodiimide groups derived from 4,4'-diphenylmethane diisocyanate (carbodiimide-modified MDI)) are included.

[0107] As the (D) isocyanate compound, 4,4'-diphenylmethane diisocyanate or a modified or polynuclear compound thereof is more preferred, and specifically, (D3) an aromatic polyisocyanate compound (more preferably, 4,4'-diphenylmethane diisocyanate (MDI) or a polynuclear MDI, and a mixture of MDI and a polynuclear MDI), and A carbodiimide-modified product of 4,4'-diphenylmethane diisocyanate, that is, a polyisocyanate having a carbodiimide group derived from 4,4'-diphenylmethane diisocyanate (carbodiimide-modified MDI) is more preferred.

[0108] Among these, preferred commercially available isocyanate compounds (D) include, for example, Duranate (registered trademark) D201 (manufactured by Asahi Kasei Corporation), Duranate (registered trademark) A201H (manufactured by Asahi Kasei Corporation), Millionate (registered trademark) MT (manufactured by Tosoh Corporation), Millionate (registered trademark) NM (manufactured by Tosoh Corporation), Millionate (registered trademark) MR-200 (manufactured by Tosoh Corporation), and Millionate (registered trademark) MTL (manufactured by Tosoh Corporation), with Millionate (registered trademark) MT (manufactured by Tosoh Corporation) and Duranate (registered trademark) D201 (manufactured by Asahi Kasei Corporation) being more preferred.

[0109] The (D) isocyanate compound may be used alone or in any combination of two or more kinds.

[0110] The content of the (D) isocyanate compound is not particularly limited as long as it is an amount that can be used in a reactive hot melt composition, and the content is, for example, usually 0.01 to 70 mass %, preferably 0.1 to 50 mass %, more preferably 1 to 40 mass %, and particularly preferably 1.5 to 35 mass %, relative to 100 mass % of the (A) hot melt. By blending (D) the isocyanate compound with (A) the hot melt in the above ratio, foaming caused by carbon dioxide gas during moisture curing is suppressed, the melt viscosity is reduced, workability is improved, and electrical insulation is also improved. The content of the (D) isocyanate compound is, for example, 3 to 40 parts by mass, preferably 5 to 30 parts by mass, and more preferably 7 to 25 parts by mass relative to 100 parts by mass of the (C) hydroxyl group-containing compound.

[0111] When two or more types of (D) isocyanate compounds are blended in the (A) hot melt, the total amount thereof can be adjusted according to the content of the (D) isocyanate compounds.

[0112] When the (A) hot melt contains the (D3) aromatic polyisocyanate compound, the content thereof is usually 0.01 to 70 mass%, preferably 0.1 to 50 mass%, more preferably 1 to 40 mass%, and particularly preferably 1.5 to 35 mass%, relative to 100 mass% of the (A) hot melt. By blending (D3) aromatic isocyanate compound with (A) hot melt in the above ratio, foaming caused by carbon dioxide gas during moisture curing is suppressed, melt viscosity is reduced, workability is improved, and electrical insulation is also improved.

[0113] The amounts of the (D) isocyanate compound and the (C) hydroxyl group-containing compound are such that the NCO / OH ratio (INDEX), which is the ratio of the number of moles of isocyanate groups in the (D) isocyanate compound to the number of moles of hydroxyl groups in the (C) hydroxyl group-containing compound, is usually in the range of 1.3 to 4, preferably 1.5 to 3.5, and more preferably 1.8 to 3.

[0114] (B) Flame retardant The reactive hot melt composition of the present invention contains, in addition to the above-mentioned (A) hot melt, (B1) an organophosphorus compound having a melting point of 50° C. or higher as (B) a flame retardant. By using (B1) an organophosphorus compound having a melting point of 50° C. or higher as the flame retardant (B), a small amount can be used to impart flame retardancy to the reactive hot melt composition.

[0115] (B1) Organophosphorus compounds with a melting point of 50°C or higher The (B1) organic phosphorus compound having a melting point of 50°C or higher is not particularly limited as long as it is a crystalline solid at room temperature (25°C). The (B1) organic phosphorus compound having a melting point of 50°C or higher preferably has a melting point of 60°C or higher. Crystalline means having a crystalline structure at room temperature (25°C). The organic phosphorus compound can be rephrased as organic phosphorus compound. The (B1) organophosphorus compound having a melting point of 50° C. or higher is preferably an organophosphorus compound generally used as a flame retardant. Examples of such organophosphorus compounds generally used as flame retardants include phosphate esters such as monomeric aromatic phosphate esters and aromatic condensed phosphate esters; phosphate amidates, phosphazenes, phosphine oxides, ammonium phosphate, melamine phosphate, and cyclic phosphate esters; and reactive phosphorus compounds having functional groups such as hydroxyl groups, carboxyl groups, and amino groups in the above compounds.

[0116] Examples of monomeric aromatic phosphate esters include triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, tris(isopropylphenyl)phosphate, tris(phenylphenyl)phosphate, trinaphthyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, diphenyl(2-ethylhexyl)phosphate, and di(isopropylphenyl)phenyl phosphate.

[0117] Examples of aromatic condensed phosphate esters include condensed phosphate esters such as trialkyl polyphosphate, resorcinol polyphenyl phosphate, resorcinol poly(di-2,6-xylyl) phosphate, hydroquinone poly(2,6-xylyl) phosphate, and condensates thereof.

[0118] A wide variety of known commercially available aromatic condensed phosphate esters can be used, including, for example, "PX-200" manufactured by Daihachi Chemical Industry Co., Ltd.

[0119] Phosphoric acid amidates are organic phosphorus compounds having phosphorus and nitrogen atoms, in which one or two ester structures of a phosphoric acid ester are replaced with amide structures. The phosphorus atom can be referred to as elemental phosphorus. Examples of phosphoric acid amidates include aliphatic phosphoric acid amidates and aromatic phosphoric acid amidates. From the viewpoint of flame retardancy and flexibility, aliphatic phosphoric acid amidates are preferred. Commercially available products include, for example, "DAIGUARD-850" manufactured by Daihachi Chemical Industry Co., Ltd. Note that phosphoric acid amidates are not compounds included in phosphoric acid esters.

[0120] Examples of phosphazenes include hexaphenoxycyclotriphosphazene and n-propoxyphosphazene oligomers in which dichlorophosphazene obtained by ring-opening polymerization of hexachlorocyclotriphosphazene is substituted with a propoxy group.

[0121] Examples of reactive phosphorus compounds having a functional group include bis(4-hydroxyphenyl)phenylphosphine oxide and bis(4-carboxyphenyl)phenylphosphine oxide.

[0122] (B1) The organic phosphorus compound having a melting point of 50° C. or higher may be used alone or in combination of two or more.

[0123] (B1) The organic phosphorus compound having a melting point of 50° C. or higher preferably has a phosphate group. Among the above-mentioned compounds, examples of the organic phosphorus compound having a phosphate group and a melting point of 50° C. or higher include monomeric aromatic phosphate esters, aromatic condensed phosphate esters, and phosphate amidates. The (B1) organophosphorus compound having a melting point of 50° C. or higher preferably includes an organophosphorus compound having a phosphorus atom and a nitrogen atom. Among the above-mentioned compounds, the organophosphorus compound having a phosphorus atom and a nitrogen atom and having a melting point of 50° C. or higher more preferably contains 16% or more phosphorus atoms. Specifically, (B1) the organic phosphorus compound having a melting point of 50° C. or higher includes, for example, amidate phosphate, ammonium polyphosphate, melamine polyphosphate, and the like.

[0124] From the viewpoint of flame retardancy, (B1) the organophosphorus compound having a melting point of 50° C. or higher preferably contains a phosphate amidate, and more preferably contains a phosphate ester in addition to the phosphate amidate. The reactive hot melt composition of the present invention more preferably contains an aliphatic phosphoric acid amidate and an aromatic condensed phosphoric acid ester as (B1) the organophosphorus compound having a melting point of 50° C. or higher.

[0125] The content of (B1) the organophosphorus compound having a melting point of 50° C. or higher is usually 3 to 60 parts by mass, preferably 5 to 50 parts by mass, and more preferably 7 to 40 parts by mass, per 100 parts by mass of (A) the hot melt.

[0126] The reactive hot melt composition of the present invention may further contain, as the (B) flame retardant, in addition to the (B1) organophosphorus compound having a melting point of 50°C or higher, an organophosphorus compound other than the (B1) organophosphorus compound having a melting point of 50°C or higher, for example, (B2) an organophosphorus compound having a melting point of 20°C or lower. (B2) Examples of organic phosphorus compounds having a melting point of 20° C. or less include condensed phosphate esters and phosphate esters. (B2) A wide variety of known commercially available products can be used as the organic phosphorus compound having a melting point of 20° C. or less. Examples of commercially available products include "PX-110" manufactured by Daihachi Chemical Industry Co., Ltd.

[0127] When the reactive hot melt composition of the present invention contains (B2) an organic phosphorus compound having a melting point of 20°C or lower, the content of (B2) an organic phosphorus compound having a melting point of 20°C or lower is usually 0.01 to 30 parts by mass, preferably 0.1 to 20 parts by mass, and more preferably 1 to 10 parts by mass per 100 parts by mass of (A) the hot melt. The reactive hot melt composition of the present invention preferably contains an aliphatic phosphoric acid amidate as (B1) an organophosphorus compound having a melting point of 50°C or higher, and further contains (B2) an organophosphorus compound having a melting point of 20°C or lower.

[0128] The reactive hot melt composition of the present invention may further contain, as the (B) flame retardant, a flame retardant other than the (B1) organophosphorus compound having a melting point of 50°C or higher and the (B2) organophosphorus compound having a melting point of 20°C or lower (hereinafter also referred to as "(B3) other flame retardant").

[0129] (B3) Other flame retardants include, for example, inorganic phosphorus-based flame retardants, inorganic flame retardants, bromine-based flame retardants, and chlorine-based flame retardants.

[0130] Examples of inorganic phosphorus-based flame retardants that can be used include red phosphorus and phosphate esters.

[0131] As the inorganic flame retardant, in addition to aluminum hydroxide and magnesium hydroxide described above as inorganic fillers, for example, antimony trioxide, antimony pentoxide, ammonium borate, zinc borate, etc. can be used. Examples of bromine-based flame retardants include hexabromobenzene, decabromodiphenyl oxide (DBDPO), tetrabromobisphenol A (TBBA), and ethylenebis(pentabromophenyl). Examples of chlorine-based flame retardants include chlorinated paraffin, perchlorocyclopentadecanone, and chlorendic acid.

[0132] When the reactive hot melt composition of the present invention contains (B3) other flame retardants, the content of (B3) other flame retardants is usually 0.01 to 30 parts by mass, preferably 0.1 to 20 parts by mass, and more preferably 1 to 10 parts by mass, per 100 parts by mass of (A) hot melt.

[0133] The reactive hot melt composition of the present invention may further contain, if necessary, one or more additives selected from the group consisting of (E) an ion scavenger and (F) a catalyst.

[0134] (E) Ion scavenger The (E) ion scavenger is an organic or inorganic compound having ion-capturing ability, and is generally also called an ion catcher, ion exchanger, ion trapping agent, ion collector, or ion adsorbent. There are no particular limitations on the ion scavenger, as long as it performs ion exchange by incorporating ions of opposite charge and captures and fixes ionic impurities. The ion scavenger (E) can adsorb and eliminate phosphoric acid derived from the (B1) organophosphorus compound having a melting point of 50°C or higher and the (B2) organophosphorus compound having a melting point of 20°C or lower. Phosphoric acid is known to promote hydrolysis of hot melts and to cause ion migration of copper patterns on substrates. Therefore, by including the ion scavenger (E) in the reactive hot melt composition of the present invention, resin deterioration and ion migration can be prevented, thereby improving electrical insulation.

[0135] As the (E) ion scavenger, for example, an organic ion exchanger, an inorganic ion exchanger, etc. can be used. Examples of organic ion exchangers include compounds having a polymeric acid to which acidic groups such as acidic hydroxyl groups, carboxyl groups, and sulfonic groups are bonded. Examples of inorganic ion exchangers include hydrous oxides of metals, such as hydrous oxides of Si, Ti, Nb, Sn, Zr, Mg, Al, Sb, and Fe, phosphates of tetravalent metals such as Zr, Sn, and Ti, and zeolites.

[0136] Among inorganic ion exchangers, examples of cation exchangers (inorganic cation exchangers) capable of capturing cations such as metal ions include manganese compounds (hydrous manganese dioxide, etc.), antimony compounds (crystalline antimonic acid, hydrous antimony pentoxide, etc.), zirconium compounds (zirconium phosphate, zirconium molybdate, zirconium tungstate, etc.), silicate compounds (aluminosilicates, synthetic aluminosilicates, etc.), phosphate compounds (titanium phosphate, tin phosphate, etc.), cerium(III) oxalate, ammonium molybdophosphate, potassium hexacyanoferrate(III)cobalt(II), etc. Among these, antimony compounds and zirconium compounds have a high ability to capture cations. As the inorganic cation exchanger, for example, commercially available products such as "IXE-100" (zirconium phosphate-based ion exchanger), "IXE-100" (zirconium phosphate-based ion exchanger), and "IXE-300" (antimony oxide-based ion exchanger), manufactured by Toagosei Co., Ltd., can be used.

[0137] Among inorganic ion exchangers, examples of anion exchangers (inorganic anion exchangers) that have the ability to capture anions such as halide ions include bismuth compounds (such as hydrated bismuth oxide and hydrated bismuth nitrate), magnesium-aluminum composite oxides (such as magnesium aluminum hydrotalcite), phosphate compounds (such as lead hydroxide phosphate), and zirconium compounds (zirconium hydroxide). Among these, magnesium-aluminum composite oxides have a high ability to capture anions. Examples of inorganic anion exchangers that can be used include commercially available products manufactured by Toagosei Co., Ltd., such as "IXE-500" (bismuth oxide-based ion exchanger), "IXE-530," "IXE-550," and "IXE-700F" (all magnesium-aluminum-based ion exchangers), and "IXE-700D" and "IXE-800" (hydrous zirconium oxide-based ion exchangers).

[0138] The zeolite is not particularly limited, and any zeolite used in known hot melt compositions can be used. Among these, the zeolite is preferably a crystalline hydrous aluminosilicate of an alkali metal or alkaline earth metal. The crystal form of the zeolite is not particularly limited, and examples thereof include A-type, X-type, LSX-type, etc. Among these, the preferred crystal form is A-type. The alkali metal or alkaline earth metal in the zeolite is not particularly limited, and examples thereof include potassium, sodium, calcium, lithium, etc. Among these, potassium is preferred. Activated carbon can also be used as the ion exchanger.

[0139] The (E) ion scavenger may be used alone or in combination of two or more. As the (E) ion scavenger, magnesium-aluminum based ion exchangers and zeolites are preferred.

[0140] The content of the (E) ion scavenger is usually 0.01 to 10 parts by mass, preferably 0.1 to 7 parts by mass, and more preferably 0.2 to 5 parts by mass, per 100 parts by mass of the (A) hot melt. (F)Catalyst As the catalyst (F), known polymerization catalysts can be used. By including the catalyst (F) in the reactive hot melt composition of the present invention, the compatibility between the hydroxyl group-containing compound (C1) having a melting point of 50°C or higher and the hydroxyl group-containing compound (C2) having a melting point of 20°C or lower and not having an alicyclic structure is improved, thereby improving the properties of the resin. (F) Catalysts include, for example, amine catalysts and organometallic catalysts.

[0141] The amine catalyst includes, for example, a non-reactive amine catalyst, a reactive amine catalyst, and the like. A non-reactive amine catalyst is an amine catalyst that remains in the product after functioning as a catalyst. Catalysts generally referred to as "amine catalysts" fall into this category. Examples of non-reactive amine catalysts include primary amine catalysts, secondary amine catalysts, and tertiary amine catalysts. An example of the primary amine catalyst is trimethylenediamine. Examples of primary and secondary amine catalysts include diethylenetriamine. Examples of tertiary amine catalysts include triethylamine, N,N-dimethylcyclohexylamine, N,N,N',N'-tetramethylethylenediamine, N,N,N',N",N"-pentamethyldiethylenetriamine, 1,4-diazabicyclo[2.2.2]octane (DABCO), bis(2-morpholinoethyl) ether, and bis(2-dimethylaminoethyl) ether. As the non-reactive amine catalyst, a tertiary amine catalyst is preferred, and bis(2-morpholinoethyl) ether is more preferred.

[0142] The reactive amine catalyst is an amine catalyst having a functional group in the molecule that reacts with an isocyanate compound. The reactive amine catalyst functions as a catalyst during the production of a polyurethane resin, and simultaneously reacts with the resin to immobilize the catalyst in the resin skeleton after curing. Examples of functional groups that react with an isocyanate compound include hydroxyl groups. The reactive amine catalyst is preferably an amine compound containing at least one hydroxyl group in the molecule, such as 2-dimethylaminoethanol, 6-dimethylamino-1-hexanol, 2-[2-(dimethylamino)ethoxy]ethanol, or 1,4-azabicyclo[2.2.2]octane-2-methanol, with 1,4-azabicyclo[2.2.2]octane-2-methanol being preferred.

[0143] Organometallic catalysts include, for example, organotin catalysts, organolead catalysts, organobismuth catalysts, and the like. Examples of the organotin catalyst include dioctyltin dilaurate, dibutyltin diacetate, dibutyltin dilaurate, and dioctyltin diacetate.

[0144] Examples of the organic lead catalyst include lead octoate, lead octenoate, and lead naphthenate.

[0145] Examples of the organic bismuth catalyst include bismuth octoate and bismuth neodecanoate. As the catalyst, an organometallic compound, a metal complex compound, or the like may be used.

[0146] When a catalyst (F) is added, its content is not particularly limited, and is, for example, usually 0.00001 to 10 parts by mass, preferably 0.0001 to 5 parts by mass, and more preferably 0.001 to 1 part by mass, per 100 parts by mass of the reactive hot melt composition.

[0147] The catalyst (F) may be used alone or in combination of two or more.

[0148] The catalyst (F) is preferably an amine catalyst, more preferably a non-reactive amine catalyst, and even more preferably a tertiary amine catalyst.

[0149] The reactive hot melt composition of the present invention preferably contains one or more additives selected from the group consisting of (E) ion scavengers and (F) catalysts. A reactive hot melt composition containing one or more additives selected from the group consisting of (E) ion scavengers and (F) catalysts has excellent durability (electrical insulation properties) under high-temperature and high-humidity conditions. The reactive hot melt composition of the present invention more preferably contains (E) an ion scavenger and (F) a catalyst.

[0150] Other ingredients The reactive hot melt composition of the present invention may further contain other components, as needed, such as known radical scavengers, plasticizers, inorganic fillers, antifoaming agents, flame retardant assistants, crosslinking agents (chain extenders), tackifiers, curing accelerators, antioxidants, ultraviolet absorbers, colorants, fillers, pigments, bulking agents, moisture absorbers, antifungal agents, and silane coupling agents.

[0151] As the radical scavenger, for example, a hindered phenol compound, a benzotriazole compound, a hindered amine compound, etc. can be used. The benzotriazole-based compound and the hindered phenol-based compound also function as antioxidants, and the hindered amine-based compound also functions as an ultraviolet absorber. When a radical scavenger is contained, its content is not particularly limited and is usually 0.01 to 10 parts by mass, preferably 0.1 to 5 parts by mass, and more preferably 0.2 to 2 parts by mass, per 100 parts by mass of the hot melt.

[0152] The plasticizer is not particularly limited, and examples thereof include ester group-containing plasticizers, phosphorus-based plasticizers, and hydrocarbon-based plasticizers.

[0153] Examples of ester group-containing plasticizers include phthalate ester plasticizers such as dioctyl phthalate, diisononyl phthalate (diisononyl phthalate), and diundecyl phthalate; adipate ester plasticizers such as dioctyl adipate, diisononyl adipate, and diisodecyl adipate; castor oil ester plasticizers such as methyl acetyl ricinoleate, butyl acetyl ricinoleate, acetylated ricinoleic acid triglyceride, and acetylated polyricinoleic acid triglyceride; trimellitic acid esters such as trioctyl trimellitate and triisononyl trimellitate; and pyromellitic acid ester plasticizers such as tetraoctyl pyromellitate and tetraisononyl pyromellitate.

[0154] Examples of phosphorus-based plasticizers include triphenyl phosphate (TPP), tricresyl phosphate (TCP), trixylenyl phosphate (TXP), and cresyl diphenyl phosphate (CDP).

[0155] Examples of hydrocarbon plasticizers include olefinic hydrocarbons such as ethylene and α-olefin co-oligomers, poly-α-olefins, and hydrogenated poly-α-olefins, paraffinic hydrocarbons, naphthenic hydrocarbons, and mixed paraphene-naphthenic hydrocarbons.

[0156] The inorganic filler is not particularly limited, and examples thereof include metal hydroxides, metal oxides, metal nitrides, natural minerals, etc. Furthermore, the surface of the metal oxides, etc. may be treated. Examples of methods for treating the surface of the metal oxides, etc. include oxidation treatment and treatment with a surface treatment agent such as a silane coupling agent.

[0157] Examples of metal hydroxides include aluminum hydroxide, magnesium hydroxide, etc. Here, aluminum hydroxide and magnesium hydroxide also function as flame retardants.

[0158] Examples of metal oxides include aluminum oxide (alumina), magnesium oxide, silicon dioxide (silica, etc.), and titanium oxide.

[0159] Examples of metal nitrides include boron nitride, aluminum nitride, and silicon nitride.

[0160] Examples of natural minerals include calcium carbonate, talc (silicate mineral), mica, kaolin, clay, and silica.

[0161] The inorganic fillers may be used alone or in combination of two or more.

[0162] The antifoaming agent is not particularly limited, and examples thereof include silicones (oil type, compound type, self-emulsifying type, emulsion type, etc.), alcohols, and the like.

[0163] A preferred silicone-based antifoaming agent is a modified silicone-based antifoaming agent (particularly one in which polysiloxane has a lipophilic group and is modified with a hydrophilic group).

[0164] The above antifoaming agents can be used alone or in combination of two or more.

[0165] When an antifoaming agent is contained, its content is not particularly limited, and is preferably 0.001 to 10 mass %, more preferably 0.005 to 5 mass %, relative to 100 mass % of the reactive hot melt composition.

[0166] Examples of the flame retardant aid include nitrogen-based compounds and antimony oxide. Examples of the nitrogen-based compound include melamine cyanurate, triazine compounds, and guanidine compounds.

[0167] The crosslinking agent (chain extender) is not particularly limited, and examples thereof include aromatic alcohol-based crosslinking agents such as N,N-bis(2-hydroxypropyl)aniline, hydroquinone-bis(β-hydroxyethyl)ether, and resorcinol-bis(β-hydroxyethyl)ether; aliphatic alcohol-based crosslinking agents such as ethylene glycol, 1,3-butanediol (1,3-butylene glycol), 1,4-butanediol, octanediol, trimethylolpropane, and triisopropanolamine; aromatic amine-based crosslinking agents such as phenylenediamine, tolylenediamine, diphenyldiamine, 4,4'-diaminodiphenylmethane, 3,3'-dichloro-4,4'-diaminodiphenylmethane, 1,2-bis(2-aminophenylthio)ethane, and trimethylene glycol-p-aminobenzoate; and aliphatic amine-based crosslinking agents such as ethylenediamine, propylenediamine, hexamethylenediamine, and diethylenetriamine.

[0168] Among these, aromatic alcohol-based crosslinking agents and aliphatic alcohol-based crosslinking agents are preferred, and aliphatic alcohol-based crosslinking agents are more preferred.

[0169] The number average molecular weight of the crosslinking agent is usually 1,000 or less, preferably 500 or less, and more preferably 400 or less.

[0170] When the reactive hot melt composition of the present invention contains a crosslinking agent, the content of the crosslinking agent is not particularly limited, and is, for example, usually 0.01 to 30 mass %, preferably 0.1 to 20 mass %, and more preferably 1 to 15 mass %, relative to 100 mass % of the reactive hot melt composition.

[0171] The above crosslinking agents can be used alone or in combination of two or more.

[0172] The content of these components may be appropriately determined depending on the intended use from the range of the usual amounts and specifications so as not to impair the desired properties of the reactive hot melt composition.

[0173] The reactive hot melt composition of the present invention is imparted with flame retardancy by adding a smaller amount of flame retardant than conventional reactive hot melt compositions, and is also inhibited from having abnormal appearance such as bleeding out and cracking. Bleeding here refers to the phenomenon in which constituent substances other than the polymer, which is the main component, such as fillers, flame retardants, colorants, plasticizers, lubricants, etc. (liquid or solid) seep out onto the surface of a product and stain it. Bleeding here is also called the blooming phenomenon or blooming.

[0174] 2. Method for producing reactive hot melt composition The method for producing the reactive hot melt composition of the present invention is not particularly limited, and it can be produced according to any known method used for producing reactive hot melt compositions. For example, a method for producing a reactive hot melt composition of the present invention includes a step of mixing (A) a hot melt and (B) a flame retardant.

[0175] The hot melt (A) used in the present invention can be produced by a known method, for example, by reacting the isocyanate compound (D) with the hydroxyl group-containing compound (C) ((C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) a hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or lower) in a reaction vessel.

[0176] The (A) hot melt can usually be produced without a solvent, but may also be produced by reacting in an organic solvent. When the reaction is carried out in an organic solvent, an organic solvent such as ethyl acetate, n-butyl acetate, methyl ethyl ketone, or toluene that does not inhibit the reaction can be used, but it is necessary to remove the organic solvent by heating under reduced pressure or other methods during or after the reaction.

[0177] The (A) hot melt is preferably reacted such that the equivalent ratio of the isocyanate groups of the (D) isocyanate compound to one equivalent of the hydroxyl groups of the (C) hydroxyl group-containing compound ((C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) a hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or lower) is in the range of 1.2 to 5.0, more preferably 1.5 to 3.0.

[0178] When producing the (A) hot melt, a (F) catalyst or the like can be used as needed. The (F) catalyst or the like can be added appropriately at any stage of the reaction.

[0179] The (A) hot melt may contain the above-mentioned other components in addition to the (D) isocyanate compound and the (C) hydroxyl group-containing compound ((C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) a hydroxyl group-containing compound having no alicyclic structure and having a melting point of 20°C or lower).

[0180] The mixing of the (C) hydroxyl group-containing compounds ((C1) a hydroxyl group-containing compound having a melting point of 50°C or higher and (C2) a hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or lower) is preferably carried out at a temperature of about 90 to 120°C under reduced pressure. The reaction of the resulting mixture with the isocyanate compound (D) is preferably carried out under a nitrogen stream. The reaction temperature is usually about 90 to 110°C, preferably about 100°C, and the reaction time is usually about 1 to 3 hours, preferably about 2 hours.

[0181] Next, the resulting (A) hot melt and (B) flame retardant are mixed together. The blending ratio of the (B) flame retardant is usually 5 to 60 parts by mass, preferably 10 to 50 parts by mass, and more preferably 15 to 40 parts by mass, per 100 parts by mass of the (A) hot melt. The mixing temperature is usually about 50 to 130°C, preferably about 60 to 120°C, and the mixing time is usually about 0.2 to 3 hours, preferably about 0.5 to 2 hours.

[0182] As described above, the reactive hot melt composition of the present invention may be produced by preparing (A) a hot melt in advance and then mixing the resulting (A) hot melt with (B) a flame retardant. Alternatively, the (D) isocyanate compound, (C) a hydroxyl group-containing compound ((C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) a hydroxyl group-containing compound having no alicyclic structure and a melting point of 20°C or lower), and (B) a flame retardant may be placed in a reaction vessel and reacted, and the (A) hot melt and the (A) hot melt and the (B) flame retardant may be mixed in the reaction vessel.

[0183] 3. Uses of reactive hot melt compositions and cured products of reactive hot melt compositions The reactive hot melt composition of the present invention and the cured product of the reactive hot melt composition can be used for applications such as coating agents, covering agents, potting agents, encapsulants, sealing agents, adhesives, etc. Among these, the reactive hot melt composition of the present invention and the cured product of the reactive hot melt composition can be used even in small amounts, and therefore are preferably used as coating agents (formal coating agents) and potting agents.

[0184] The reactive hot melt composition of the present invention is suitably used for electric and electronic parts on which electronic circuit boards and the like are mounted. The reactive hot melt composition of the present invention is solid at room temperature and immediately solidifies after being poured into an electric / electronic component, and therefore has excellent tack-free properties compared to two-component potting agents.

[0185] Furthermore, the reactive hot melt composition of the present invention has a melting point of 50° C. or higher and a freezing point of 0° C. to 40° C. The melting point is preferably 52° C. to 70° C., more preferably 54° C. to 65° C. The freezing point is preferably 2° C. to 38° C., more preferably 5° C. to 35° C.

[0186] The melting point of the reactive hot-melt composition is measured by differential scanning calorimetry (DSC). Specifically, the composition is heated at a rate of 20°C / min in an air stream together with a standard sample (alumina powder), and the temperature (°C) at which the maximum endothermic peak is observed is measured. The freezing point is measured by differential scanning calorimetry (DSC) by cooling the sample in an air stream together with a standard sample (alumina powder) from 120°C at a rate of 20°C / min, and detecting the temperature (°C) at which the maximum endothermic peak is reached.

[0187] The melt viscosity (120° C.) of the reactive hot melt composition of the present invention is usually 100 to 5000 mPa·s, preferably 200 to 4000 mPa·s, and more preferably 300 to 3800 mPa·s.

[0188] The volume resistivity of the reactive hot melt composition of the present invention is not particularly limited, but is preferably 1×10 7 ~1×10 18 Ω·m, and more preferably 5×10 10 ~1×10 17 Ω·m, particularly preferably 1×10 11 ~1×10 16 Ω·m.

[0189] The reactive hot melt composition of the present invention can be used, inter alia, as a hot melt coating agent or a hot melt potting agent.

[0190] The components contained in the hot melt coating agent of the present invention are the same as those described in the "reactive hot melt composition" above. The components contained in the hot melt potting agent of the present invention are the same as those described in the "reactive hot melt composition" above.

[0191] Examples of methods for sealing electrical and electronic components equipped with electronic circuit mounting boards or the like using the reactive hot melt composition, hot melt coating agent, or hot melt potting agent of the present invention include a method in which the hot melt potting agent of the present invention is melted at a temperature of about 80 to 130°C and then dispensed using a dispenser onto the surface of the electrical and electronic component equipped with the electronic circuit mounting board, thereby sealing the component.

[0192] The reactive hot melt composition of the present invention has an isocyanate group at the polymer terminal or within the molecule, which can react with moisture present in the air or on a casing, adherend, or the like to which the reactive hot melt composition is applied to form a crosslinked structure. Therefore, the reactive hot melt composition of the present invention can react with water to form a coating layer (coating film). In the reactive hot melt composition of the present invention, the equivalent ratio ([NCO / OH]) of the isocyanate groups of the isocyanate compound (D) to 1 equivalent of the hydroxyl groups of the hydroxyl group-containing compound (C) is preferably in the range of 1.2 to 5.0, more preferably 1.5 to 3.0.

[0193] The electronic circuit mounting board of the present invention comprises a printed circuit board as a carrier layer, electronic components, and the above-mentioned coating. The electronic components are not particularly limited, and known components can be used depending on the application, but examples include integrated circuits (ICs), CPUs, memories, communication circuits, amplifiers, AD converters, wireless communication units, analog filters, capacitors, resistors, batteries, sensors, etc. One or more of these components may be modularized (mounted) on the circuit board. The electric circuit mounting board is preferably constructed by combining a coating layer obtained by reacting the polyurethane resin composition of the present invention with water or humidity, and a printed circuit board as a carrier layer.

[0194] The printed circuit board is not particularly limited, and examples thereof include copper-clad laminates. Specifically, a copper-clad laminate is formed by laminating rolled copper foil having the above-mentioned properties on one or both sides of a resin layer. The resin layer is not particularly limited as long as it has properties applicable to printed wiring boards, etc. For example, for rigid PWBs, a paper-based phenolic resin, a paper-based epoxy resin, a synthetic fiber cloth-based epoxy resin, a glass cloth and paper composite-based epoxy resin, a glass cloth and glass nonwoven fabric composite-based epoxy resin, and a glass cloth-based epoxy resin can be used. Also, polyester film, polyimide film, liquid crystal polymer (LCP) film, Teflon (registered trademark) film, polyethylene terephthalate film, polyethylene naphthalate film, etc. can be used for FPC. The printed circuit board is preferably a board made of a glass cloth substrate copper clad laminate.

[0195] The thickness of the reactive hot melt composition (coating layer) is not particularly limited, but is usually 10,000 μm or less, preferably 10 μm to 1,000 μm, more preferably 30 μm to 800 μm, and even more preferably 50 μm to 600 μm. The thickness here refers to the maximum thickness of the resin (layer). The thickness of the coating layer (film) can be measured with a vernier caliper or a ruler. The amount of the reactive hot melt composition (coating layer) is not particularly limited, but is usually 1000 mg / cm 2 or less, preferably 1 mg / cm 2 ~100mg / cm 2 and more preferably 3 mg / cm 2 ~80mg / cm 2 and more preferably 5 mg / cm 2 ~60mg / cm 2 is. The amount of the coating layer (film) can be calculated by measuring the area of ​​the coated surface and the weight of the polyurethane resin composition.

[0196] Copper-clad laminates can be used for various types of printed circuit boards (printed wiring boards (PWBs)). Printed circuit boards include rigid and flexible printed circuit boards. There are no particular limitations on the type of printed circuit board, but for example, in terms of the number of conductor pattern layers, they can be used for single-sided PWBs, double-sided PWBs, and multilayer PWBs (three or more layers); in terms of the type of insulating substrate material, they can be used for rigid PWBs, flexible PWBs (FPCs), and rigid-flex PWBs.

[0197] Electrical and electronic components coated with the reactive hot melt composition of the present invention include not only the above-mentioned electronic circuit mounting boards, but also, for example, transformers such as transformer coils, choke coils, and reactor coils, equipment control boards, various sensors, etc. Such electrical and electronic components also constitute the present invention. The electrical and electronic components of the present invention can be used in electric washing machines, toilet seats, water heaters, hot water heaters, water purifiers, bathtubs, dishwashers, power tools, automobiles, motorcycles, battery packs, etc. An example of a method for applying the reactive hot melt composition of the present invention to an electronic circuit mounting board is to melt the polyurethane resin composition at a temperature of about 80 to 130°C and apply the composition to an electronic circuit mounting board using an application device.

[0198] When used as a coating agent, the reactive hot melt composition of the present invention can be used in smaller amounts than potting agents and does not require a curing process, thereby reducing the takt time (the time required to manufacture one product) when coating electronic circuit boards and the energy consumption during production. Furthermore, the coating agent (protective material, film) is easy to disassemble (recyclable) and can reduce the carbon footprint. The formula for calculating takt time (also called "pitch time") is "takt time = operating time / production volume." In the manufacturing industry, the shorter the takt time, the higher the productivity.

[0199] In Japan, the "Act on Promotion of Resource Recycling Related to Plastics," also known as the "New Plastics Act" or the "Plastic Resource Recycling Promotion Act," came into effect in 2022. This law includes the following three concepts: "reduce" to reduce the amount of waste generated; "recycle" to regenerate and reuse disposable plastic waste as a resource; "reuse" to repeatedly use plastic products instead of throwing them away; and "renewable" to replace plastic products with renewable ones. Therefore, the reactive hot melt composition and cured product thereof of the present invention will play a major role in realizing a sustainable society. [Example]

[0200] The reactive hot melt composition of the present invention will be specifically described below with reference to examples and comparative examples. However, the examples are merely illustrative and the present invention is not limited to these examples.

[0201] The raw materials used in the examples and comparative examples are shown below.

[0202] (C) Hydroxyl group-containing compound (C1) Hydroxyl-containing compounds with a melting point of 50°C or higher Hydroxyl-containing compounds with a melting point of 50°C or higher: Sebacic acid-based polyester polyol produced by reacting decanedioic acid and 1,6-hexanediol, average functionality 2, number average molecular weight: 3500, melting point 65°C, hydroxyl value: 32 mgKOH / g Hydroxyl-containing compounds with a melting point of 50°C or higher 2: Adipic acid-based polyester polyol produced by reacting adipic acid and 1,6-hexanediol, average functionality 2, number average molecular weight: 2000, melting point 55°C, hydroxyl value: 56 mgKOH / g

[0203] (C2) Hydroxyl-containing compounds having a melting point of 20°C or less and not having an alicyclic structure Polyolefin polyols: Hydroxyl-terminated polybutadiene (Krasol® LBH-P2000), manufactured by Cray Valley, average functionality 2.0, number average molecular weight: 2000, freezing point -20°C or less, viscosity 13000 mPa·s (25°C), hydroxyl value: 50 mgKOH / g Polyether polyols: Polypropylene glycol (Sannyx (registered trademark) PP-2000), manufactured by Sanyo Chemical Industries, Ltd., average functionality 2, number average molecular weight: approximately 2000, freezing point -35°C, viscosity 310 mPa·s (25°C), hydroxyl value: 56 mg KOH / g Amorphous polyester polyol: Castor oil polyol (castor oil modified polyol) (Yurik H-1824), manufactured by Ito Oil Mills, average functionality 2.3, number average molecular weight: 1700 (calculated from hydroxyl value), freezing point below 0°C, viscosity 1110 mPa·s, hydroxyl value: 68 mgKOH / g (C4) Alicyclic polyester polyol Cycloaliphatic polyester polyols: Dimer acid modified polyester polyol, Preblast 1838, manufactured by Equus Japan Co., Ltd., average functionality 2.0, number average molecular weight: 2000, viscosity 14000 mPa·s (25°C), hydroxyl value: 56 mg KOH / g

[0204] (D) Isocyanate compounds Isocyanate compound 1: Millionate (registered trademark) MT (monomeric MDI), manufactured by Tosoh Corporation, molecular weight 250, specific gravity 1.23, melting point 40°C Isocyanate compound 2: Millionate (registered trademark) NM (monomeric MDI isomer (monomeric MDI, 2,4-MDI 99%)), manufactured by Tosoh Corporation, molecular weight 250, specific gravity 1.23 Isocyanate compounds 3: Millionate (registered trademark) MR-200 (Polyisocyanate (Polymeric MDI)), manufactured by Tosoh Corporation, molecular weight 250, specific gravity 1.23

[0205] (B) Flame retardant (B1) Organophosphorus compounds with a melting point of 50°C or higher Phosphate amidates: DAIGUARD-850 (trade name), manufactured by Daihachi Chemical Industry Co., Ltd., phosphate amidate, melting point 240°C or higher (solid at room temperature), phosphorus content 16% Phosphate ester 1: PX-200 (trade name), manufactured by Daihachi Chemical Industry Co., Ltd., aromatic condensed phosphate ester, melting point 90°C (solid at room temperature), phosphorus content 9% Phosphazene: Lavitol FP-110 (product name), manufactured by Fushimi Pharmaceutical Co., Ltd., phosphazene compound, melting point 90°C (solid at room temperature), phosphorus content 13.4%

[0206] (B2) Organophosphorus compounds with a melting point of 20°C or less Phosphate ester 2: PX-110 (product name), manufactured by Daihachi Chemical Industry Co., Ltd., condensed phosphate ester, liquid at room temperature, phosphorus content 7.8% (B3) Other flame retardants ·Metal hydroxide: B103 (trade name), manufactured by Nippon Light Metal Co., Ltd., aluminum hydroxide, specific gravity 2.42, average particle size 7 μm

[0207] (E) Ion scavenger Ion exchanger 1: IXE-700F (product name), manufactured by Toagosei Co., Ltd., magnesium-aluminum based, average particle size 1.5 μm, total ion exchange capacity 4.5 meq / g Ion exchanger 2: Zeolite (molecular sieves 5A), manufactured by Resonac Universal Co., Ltd.

[0208] (F)Catalyst Amine catalyst: Bis(2-morpholinoethyl) ether U-CAT 660M (product name), manufactured by San-Apro Co., Ltd.

[0209] Radical Scavenger Antioxidants: Hindered phenol Irganox (registered trademark) 1010 (product name), manufactured by BASF Japan Ltd.

[0210] <Preparation of reactive hot melt composition> Example 1 26 parts by weight of (C1) a sebacic acid-based polyester polyol (a hydroxyl-containing compound having a melting point of 50°C or higher), 56 parts by weight of (C2) a polyolefin polyol (a hydroxyl-containing compound having a melting point of 20°C or lower and no alicyclic structure), 18 parts by weight of a polyether polyol, 16 parts by weight of (B) a flame retardant phosphazene, and 0.5 parts by weight of an antioxidant were placed in a separable flask, heated in an oil bath at 100°C, reduced pressure with a vacuum pump, and dehydrated until the water content was 0.05% by weight or less. 20 parts by weight of (D) a monomeric MDI isocyanate compound were then added to the flask, and the mixture was allowed to react at 100°C for 2 hours under a nitrogen stream to produce the reactive hot melt composition of Example 1.

[0211] Examples 2 to 9 Reactive hot melt compositions 2 to 9 were prepared by mixing in the same manner as in Example 1, except that (C) hydroxyl group-containing compounds ((C1) hydroxyl group-containing compounds having a melting point of 50°C or higher, and (C2) hydroxyl group-containing compounds having no alicyclic structure and a melting point of 20°C or lower), (D) isocyanate compounds, and (B) flame retardants were replaced with the components and blending amounts shown in Table 1, respectively.

[0212] Comparative Examples 1 to 5 Comparative reactive hot melt compositions 1 to 5 were prepared by mixing in the same manner as in Example 1, except that the (C) hydroxyl group-containing compound ((C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, (C2) a hydroxyl group-containing compound having a melting point of 20°C or lower and having no alicyclic structure, or (C4) an alicyclic polyester polyol, (D) an isocyanate compound, (B) a flame retardant, and (F) a catalyst were changed to the components and blending amounts shown in Table 1, respectively.

[0213] Test Example 1 <Flame retardancy> A flame retardancy test was conducted in accordance with UL94 (combustion test for plastic materials for equipment components). A reactive hot melt composition molten at 120°C was poured into a mold with a 1.5 mm rubber dispenser sandwiched between glass plates and allowed to solidify at room temperature. The solidified reactive hot melt composition was demolded and then aged in an environment of 25°C and 50% RH for one week to allow moisture curing. The cured reactive hot melt composition was then cut to a size of 125±5 mm in length and 13.0±0.5 mm in width to prepare test piece C. UL94V testing was performed using test piece C, and the test piece was rated as "V-2," "V-1," or "V-0." The flame retardant content is calculated using the formula: (B) / [(A)+(B)+(E)+(F)]×100 It was calculated from. The flame retardancy was evaluated according to the following evaluation criteria. A:V-0 B: V-2 or higher but less than V-0, and flame retardant content less than 15% C: V-2 or more but less than V-0, and flame retardant content is 15% or more but less than 20% D: Does not fall under the category of A to C

[0214] <Melting point> The melting point was measured by differential scanning calorimetry (DSC) by simultaneously raising the temperature of a standard sample (alumina powder) at 20°C / min in an air stream and detecting the temperature (°C) at which the maximum endothermic peak was reached. <Freezing point> The freezing point was measured by differential scanning calorimetry (DSC) by detecting the temperature (°C) at which the maximum endothermic peak was observed, while simultaneously cooling the sample in an air stream from 120°C at a rate of 20°C / min together with a standard sample (alumina powder).

[0215] <Appearance> The appearance of the cured reactive hot melt composition was visually inspected and evaluated according to the following evaluation criteria. A: The freezing point is 10°C or higher, and there are no external defects such as bleeding out or cracks. B: The solidification point is less than 10°C and no abnormal appearance such as bleeding out or cracking occurs. C: Abnormal appearance such as bleeding out or cracks occurs during solidification or after moisture curing. D: Does not coagulate.

[0216] <Overall rating 1 (flame retardancy and appearance)> A: Flame retardancy and appearance are rated B or higher, and there is at least one A rating B: Flame retardancy and appearance are rated B C: At least one of flame retardancy and appearance is rated C, and the other is rated B or higher D: Flame retardancy and appearance are rated C or lower, or at least one is rated D

[0217] The results are shown in Table 1. Photographs of the cured reactive hot-melt compositions of Example 7 and Comparative Example 3 are shown in FIG. The photograph of the cured reactive hot melt composition of Example 7 on the left side of Figure 1 shows a good appearance, while the photograph of the cured reactive hot melt composition of Comparative Example 3 on the right side of Figure 1 shows poor compatibility of the flame retardant and abnormal appearance due to bleed-out (indicated by the arrow).

[0218] [Table 1]

[0219] <Judgment result> From Table 1, it was found that the reactive hot melt compositions of Examples 1 to 9 could impart flame retardancy equal to or greater than that of conventional reactive hot melt compositions with a smaller amount of flame retardant added than that of conventional reactive hot melt compositions (the reactive hot melt compositions of Comparative Examples 1, 3, and 4). Furthermore, compared with the reactive hot melt compositions of Comparative Examples 1 to 5, the reactive hot melt compositions of Examples 1 to 9 had higher flame retardancy, suppressed abnormal appearance such as bleed-out and cracking, and also achieved a good overall rating of 1 (flame retardancy and appearance). On the other hand, Comparative Example 1 is a reactive hot melt composition similar to the moisture-curable reactive hot melt adhesive composition of Patent Document 1 in the background art, in which the flame retardant (B) does not contain (B1) an organophosphorus compound with a melting point of 50°C or higher, and contains only (B3) other flame retardants such as metal hydroxides. Therefore, despite the high flame retardant content, the flame retardancy was low, and the overall rating 1 (flame retardancy and appearance) was also low. Comparative Example 2 is a reactive hot melt composition in which the flame retardant (B) does not contain (B1) an organic phosphorus compound with a melting point of 50°C or higher, and contains only (B2) an organic phosphorus compound with a melting point of 20°C or lower. As a result, cracks occurred after solidification, making it impossible to measure the flame retardancy. Furthermore, abnormalities in appearance such as bleed-out and cracks occurred, resulting in a low overall rating of 1 (flame retardancy and appearance). Comparative Examples 3 and 4 are reactive hot melt compositions corresponding to the moisture-curable polyurethane hot melt of Patent Document 2 in the background art, which do not contain (C2) a hydroxyl group-containing compound without an alicyclic structure and having a melting point of 20°C or less, but contain (C4) an alicyclic polyester polyol, and the flame retardant (B) contains only phosphazene as (B1) an organophosphorus compound having a melting point of 50°C or more. As a result, the flame retardancy was low, and abnormal appearance such as bleed-out and cracking occurred. Therefore, the overall rating 1 (flame retardancy and appearance) was also low. Comparative Example 5 is a reactive hot melt composition that does not contain (C1) a hydroxyl group-containing compound having a melting point of 50°C or higher. Therefore, the melting point and solidification point were too low to solidify, and the flame retardancy test could not be performed. Therefore, the overall evaluation of 1 (flame retardancy and appearance) was also low.

[0220] Next, reactive hot melt compositions containing ion scavengers and / or catalysts were prepared and evaluated for flame retardancy, appearance, and durability.

[0221] <Preparation of reactive hot melt composition containing ion scavenger and / or catalyst> Examples 10 to 16 Reactive hot melt compositions 10 to 16 were prepared by mixing in the same manner as in Example 1, except that (C) hydroxyl group-containing compound ((C1) hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) hydroxyl group-containing compound having no alicyclic structure having a melting point of 20°C or lower), (D) isocyanate compound, (B) flame retardant, (E) ion scavenger, and (F) catalyst were replaced with the components and blending amounts shown in Table 2, respectively.

[0222] Test Example 1 In addition to the reactive hot melt compositions 10 to 16 obtained in Examples 10 to 16, the reactive hot melt compositions 5 and 6 in Examples 5 and 6, and the reactive hot melt compositions 1 and 3 in Comparative Examples 1 and 3 were used to evaluate the flame retardancy, melting point, solidification point, and appearance as described above, as well as to perform overall evaluation 1.

[0223] Test Example 2 In addition to the reactive hot melt compositions 10 to 16 obtained in Examples 10 to 16, the reactive hot melt compositions 5 and 6 in Examples 5 and 6, and the reactive hot melt compositions 1 and 3 in Comparative Examples 1 and 3 were used to carry out the following evaluations.

[0224] <Melt viscosity> The viscosity was measured using a Brookfield viscometer equipped with a thermosel, the thermosel temperature was set at 120°C, and an SC4-27 spindle was used.

[0225] <Durability> The interdigital electrodes were coated with hot melt adhesive to a thickness of 0.5 mm, placed in a high-temperature, high-humidity chamber at 85°C and 85% RH, and a voltage of 100 V was applied. After the test, the electrodes were left at 23°C for 1 hour, and then the electrical resistance (Ω) was measured. Measurements were taken initially and after 500 hours.

[0226] Durability was evaluated according to the following evaluation criteria. A: The initial value is 1E+13 (1 × 10 13 )Ω or more, and the value after high temperature and high humidity testing is 1E+11(1×10 11 )Ω or more B: The value after high temperature and high humidity test is 1E+11 (1 × 10 11 )Ω or more C: The value after high temperature and high humidity test is 1E+11 (1 × 10 11 )Ω less than 1E+10(1×10 10 )Ω or more D: The value after high temperature and high humidity test is 1E+10(1×10 10 )Ω

[0227] <Overall rating 2 (flame retardancy, appearance, and durability)> S: Flame retardancy, appearance, and durability all rated B or higher, and two or more rated A's A: All items of flame retardancy, appearance, and durability are rated B or higher, and the overall rating does not fall under S. B: All items of flame retardancy, appearance, and durability are rated C or higher, and there are two or more B ratings. C: Overall rating does not fall under S to B

[0228] These results are shown in Table 2. For reactive hot melt compositions 5 and 6 of Examples 5 and 6, and reactive hot melt compositions 1 and 3 of Comparative Examples 1 and 3, the results of Test Example 1 are also shown in Table 2.

[0229] [Table 2]

[0230] <Judgment result> The reactive hot melt compositions of Examples 10 to 16 containing (E) an ion scavenger and / or (F) a catalyst were highly flame retardant, and abnormal appearance such as bleed-out and cracking was suppressed, and the overall rating of 1 (flame retardancy and appearance) was also good. Furthermore, the reactive hot melt compositions of Examples 10 to 16 were superior in durability to the reactive hot melt compositions of Examples 5 and 6, which did not contain the (E) ion scavenger and the (F) catalyst, and were particularly good in overall rating 2 (flame retardancy, appearance, and durability). Furthermore, the reactive hot melt compositions of Examples 10 to 16 had a good overall rating of 2 (flame retardancy, appearance, and durability) when compared with the reactive hot melt composition of Comparative Example 1, which is similar to the moisture-curable reactive hot melt adhesive composition of Patent Document 1 in the background art, and the reactive hot melt composition of Comparative Example 3, which corresponds to the moisture-curable polyurethane hot melt of Patent Document 2 in the background art. [Industrial Applicability]

[0231] The reactive hot melt composition of the present invention and its cured product can be used for flexible substrates, adhesives for multilayer substrates, surface coating agents, sealants, coverlays, bonding sheets, copper foils, laminates, dry films, electronic component materials, etc.

Claims

1. A reactive hot melt composition comprising (A) a hot melt and (B) a flame retardant, The (A) hot melt is a urethane prepolymer obtained by reacting (C) a hydroxyl group-containing compound with (D) an isocyanate compound, The (C) hydroxyl group-containing compound is (C1) a hydroxyl group-containing compound having a melting point of 50°C or higher, and (C2) Hydroxyl-containing compounds having a melting point of 20°C or lower and no alicyclic structure and The (B) flame retardant is a reactive hot melt composition containing (B1) an organophosphorus compound having a melting point of 50°C or higher.

2. The reactive hot melt composition according to claim 1, wherein the (B1) organophosphorus compound having a melting point of 50°C or higher has a phosphate group.

3. 2. The reactive hot melt composition according to claim 1, wherein the (B1) organophosphorus compound having a melting point of 50°C or higher comprises an organophosphorus compound having a phosphorus atom and a nitrogen atom.

4. The reactive hot melt composition according to claim 3, wherein the (B1) organophosphorus compound having a melting point of 50°C or higher comprises a phosphoric acid amidate.

5. The reactive hot melt composition according to claim 4, wherein the (B1) organophosphorus compound having a melting point of 50°C or higher further contains a phosphoric acid ester.

6. 2. The reactive hot melt composition according to claim 1, wherein the (C2) hydroxyl group-containing compound having a melting point of 20°C or lower and no alicyclic structure contains one or more compounds selected from the group consisting of amorphous polyester polyols, polyolefin polyols, and polyether polyols.

7. The reactive hot melt composition of claim 6, further comprising one or more additives selected from the group consisting of (E) ion scavengers and (F) catalysts.

8. 8. The reactive hot melt composition of claim 7, wherein the (F) catalyst is an amine catalyst.

9. The reactive hot melt composition of claim 8, wherein the amine catalyst is bis(2-morpholinoethyl) ether.

10. An electric / electronic component sealed with the reactive hot melt composition of claim 1.

Images