Encapsulation mold, resin encapsulation apparatus, and resin encapsulation method

Abstract

To provide an encapsulation mold, a resin encapsulation apparatus, and a resin encapsulation method capable of molding with different two types of encapsulation resins by one time of a mold closing step using one type of an encapsulation mold.SOLUTION: An encapsulation mold 202 according to the present invention, having a first mold 206 and a second mold 204 to perform resin encapsulation comprises: a first pot 231 into which a first resin R1 is introduced; a second pot 232 into which a second resin R2 is introduced; a first runner 271 that constitutes a flow channel of the first resin R1 flowing in from the first pot 231; a second runner 272 that constitutes a flow channel of the second resin R2 flowing in from the second pot 232; a partition part 203 that is sandwiched by the first mold 206 and the second mold 204 to partition the first runner 271 and the second runner 272; and a flow channel formation part 209 that moves between a first position where it is in contact with the partition part 203 and a second position where it is not in contact with the partition part 203.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a sealing mold, a resin sealing apparatus, and a resin sealing method. [Background technology]

[0002] For example, a transfer molding method is known as an example of a resin sealing device and method for sealing a workpiece (molded product) having electronic components mounted on a substrate with sealing resin (sometimes simply referred to as "resin" in this application) and processing it into a molded product.

[0003] A typical transfer molding method is a technology in which a pot is provided to supply a predetermined amount of encapsulation resin (specifically, thermosetting resin) to a pair of encapsulation regions (cavities) provided in an encapsulation mold comprising an upper mold and a lower mold, and workpieces are placed in positions corresponding to the cavities and clamped between the upper and lower molds, and molding (resin encapsulation) is performed by pouring the encapsulation resin from the pot into the cavity (see Patent Document 1: Japanese Patent No. 5906528). Note that molding can also be performed by pouring the encapsulation resin into the cavity without placing a workpiece. Based on this, in this application, "resin encapsulation" refers to molding performed by pouring the encapsulation resin into the cavity, regardless of whether a workpiece is present or not. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5906528 [Patent Document 2] Patent No. 6749167 Summary of the Invention [Problem to be solved by the invention]

[0005] In conventional transfer molding such as that exemplified in Patent Document 1, molding is generally performed by using one type of sealing resin and performing a single mold closing step.

[0006] On the other hand, in the case of products such as LED devices and power devices, there was a need to mold, for example, a filler-free encapsulating resin with low heat dissipation properties and a filler-containing encapsulating resin with high heat dissipation properties so that they overlap. However, when molding using two different types of encapsulating resins, it was necessary to use two different molds, one for each encapsulating resin, and perform the mold closing process twice. This resulted in issues such as increased equipment costs due to the increased number of molds and longer molding times due to the increased number of processes.

[0007] The present inventors have been conducting extensive research into techniques to solve the above problems, and as one example, have developed a technique for molding using two different types of sealing resin (see Patent Document 2: Japanese Patent No. 6749167). [Means for solving the problem]

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a sealing mold, a resin sealing device, and a resin sealing method that are capable of molding using two different types of sealing resins in a single mold closing process using a single type of sealing mold.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] The sealing mold according to the present invention is a sealing mold that includes a first mold and a second mold and performs resin sealing, and is required to include a first pot into which a first resin is poured, a second pot into which a second resin is poured, a first runner that forms a flow path for the first resin flowing from the first pot, a second runner that forms a flow path for the second resin flowing from the second pot, a partition portion that is sandwiched between the first mold and the second mold and separates the first runner and the second runner, and a flow path forming portion that moves between a first position in which it is in contact with the partition portion and a second position in which it is not in contact with the partition portion.

[0011] This makes it possible to perform molding (resin sealing) using two different types of sealing resins in a single mold closing step using one type of sealing mold.

[0012] It is also preferable that the first mold has a first cavity into which the first resin flows, the second mold has a second cavity into which the second resin flows, the first position forms a flow path for the first resin to flow into the first cavity, and the second position forms a flow path for the second resin to flow into the second cavity.It is also preferable that the partition section is formed by either an intermediate mold, a work to be sealed, or a carrier for a work or molded product.This makes it possible to easily achieve a structure that separates the first runner and the second runner, which need to be formed as separate flow paths.

[0013] Preferably, the first resin and the second resin have different hardening times under the same temperature conditions, which allows molding to be performed in a single mold closing step using a single type of sealing mold without mixing the two different sealing resins.

[0014] A resin sealing device according to the present invention is required to include the above-described sealing mold.

[0015] Furthermore, the resin sealing method according to the present invention is a resin sealing method for resin sealing using a sealing mold having a first mold and a second mold, and is required to include, during one mold closing process, a first filling process of pressure-feeding a first resin poured into a first pot into a first cavity via a first runner, a flow path forming process of moving a flow path forming portion from a first position where it is sandwiched between the first mold and the second mold and in contact with a partition portion separating the first runner and the second runner to a second position where it is not in contact with the partition portion, and a second filling process of pressure-feeding a second resin poured into a second pot into a second cavity via the second runner.

[0016] It is also preferable that the flow path forming step is performed after the first resin filled into the first cavity in the first filling step is semi-cured, which allows molding to be performed in a single mold closing step using a single type of sealing mold without mixing two different types of sealing resins.

[0017] It is also preferable that the second resin be a resin material that has a longer hardening time than the first resin under the same temperature conditions, thereby avoiding the problem of the second resin hardening before being pumped and filled. [Effects of the Invention]

[0018] According to the present invention, molding can be performed using two different types of sealing resins in a single mold closing process using a single type of sealing mold, thereby reducing equipment costs and shortening the molding process time. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a plan view showing an example of a resin sealing apparatus including a sealing mold according to an embodiment of the present invention; [Figure 2] 1 is a side view showing an example of a press machine including a sealing mold according to an embodiment of the present invention. [Figure 3] FIG. 1 is a plan view illustrating an example of a sealing mold according to an embodiment of the present invention. [Figure 4] FIG. 4 is an enlarged view of the X portion in FIG. [Figure 5] 5 is a cross-sectional view of the X portion in FIG. 4 taken along the line AA. [Figure 6] 5 is a cross-sectional view of the Y portion in FIG. 4 taken along the line BB. [Figure 7] 1A to 1C are explanatory views of a resin sealing method according to an embodiment of the present invention. [Figure 8] FIG. 8 is an explanatory diagram following FIG. [Figure 9] FIG. 9 is an explanatory diagram following FIG. 8. [Figure 10] FIG. 10 is an explanatory diagram following FIG. [Figure 11]FIG. 11 is an explanatory diagram following FIG. [Figure 12] FIG. 12 is an explanatory diagram following FIG. [Figure 13] FIG. 13 is an explanatory diagram following FIG. DETAILED DESCRIPTION OF THE INVENTION

[0020] (Overall composition) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic view) showing an example of a resin sealing apparatus 1 according to an embodiment of the present invention. For convenience of explanation, arrows may be used in the drawing to indicate front-rear, left-right, and up-down directions in the resin sealing apparatus 1, etc. Furthermore, in all the drawings used to explain each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0021] The resin sealing apparatus 1 according to this embodiment is an apparatus for molding (resin sealing) resin R using a sealing mold 202 including an upper mold 204 (sometimes referred to as a "second mold" in this application) and a lower mold 206 (sometimes referred to as a "first mold" in this application). Hereinafter, the resin sealing apparatus 1 will be described using an example of a transfer molding type resin sealing apparatus in which the upper mold 204 and the lower mold 206 are clamped together and resin R is poured into cavities 208 formed in the lower mold 206 and the upper mold 204 for molding. While this embodiment is configured to perform resin sealing without placing a workpiece (without using the workpiece as a sealing target), a configuration in which a workpiece is placed and resin sealing may also be used (not shown). Furthermore, while a cavity 208 is provided in both the lower mold 206 and the upper mold 204, a configuration in which a cavity is provided in either one of them (not shown) may also be used. Furthermore, although the cavity 208 is configured to be sealed with resin without being covered with a film (release film), the cavity 208 (all or part) may be covered with a film and then sealed with resin (not shown).

[0022] First, as an example of the resin R, a tablet-shaped (e.g., cylindrical) thermosetting resin (e.g., epoxy-based resin, etc.) is used. Note that the resin R is not limited to the above state, and may be a shape other than a cylindrical shape, and may be a resin other than an epoxy-based thermosetting resin. In this embodiment, two types of resin (first resin R1, second resin R2) are used as the resin R. Specifically, the first resin R1 is a colored, opaque (e.g., white) thermosetting resin containing a filler, and the second resin R2 is a colorless, transparent thermosetting resin containing no filler. However, the resins are not limited to these.

[0023] Although not used in this embodiment, an example of a workpiece to be molded is generally a substrate having one or more electronic components mounted in a predetermined arrangement. Specific examples of substrates include resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers, etc., formed in a rectangular, circular, or other plate shape. Examples of electronic components include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive materials, spacers, etc. Furthermore, examples of methods for mounting electronic components on a substrate include wire bonding mounting, flip-chip mounting, etc.

[0024] Although not used in this embodiment, examples of films (release films) are generally made of film materials that are excellent in heat resistance, ease of peeling, flexibility, and extensibility. Specifically, PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc. are preferably used.

[0025] Next, an overview of the resin sealing apparatus 1 according to this embodiment will be described. As shown in Fig. 1, the resin sealing apparatus 1 mainly comprises a supply unit 100A that supplies resin R, a press unit 100B that seals with resin R and processes the molded product P, and a storage unit 100C that stores the molded product P after resin sealing.

[0026] The resin sealing apparatus 1 also includes a transport mechanism 100D that moves between the units to transport the resin R and the molded product P. As an example, the transport mechanism 100D includes an inloader 122 that loads the resin R into the press unit 100B, an outloader 124 that loads the molded product P out of the press unit 100B, and a guide rail 126 shared by the inloader 122 and the outloader 124. The transport mechanism 100D is not limited to the above configuration, and may also be configured to use a known pickup or the like (not shown) as appropriate. Furthermore, instead of a configuration including a loader, a configuration including an articulated robot (not shown) may also be used.

[0027] Here, the inloader 122 receives the resin R in the supply unit 100A and transports it to the press unit 100B. As an example of the configuration of the inloader 122, a resin holding section 122A is provided that can hold multiple pieces of resin R (as an example, four pieces of R1 and four pieces of R2 are given, but this is not limited to this, or a single piece may also be used) along the front-to-rear direction. Note that the resin holding section 122A uses a known holding mechanism (for example, a clamping configuration with holding claws, a suction configuration with suction holes communicating with a suction device, etc.) (not shown).

[0028] The inloader 122 according to this embodiment is configured to move in the left-right and front-rear directions to load the resin R into the sealing mold 202 and store it in a predetermined position (a pot, described later) of the lower mold 206. However, this is not limited to this, and a configuration may be provided in which a loader that moves in the left-right direction to transport between units and a loader that moves in the front-rear direction to load into the sealing mold 202 are provided separately (not shown).

[0029] The outloader 124 also receives the molded product P in the press unit 100B and transports it to the storage unit 100C. As an example of the configuration of the outloader 124, a molded product holding section 124A capable of holding the molded product P is provided. Note that the molded product holding section 124A uses a known holding mechanism (for example, a clamping configuration with holding claws, a suction configuration with suction holes communicating with a suction device, etc.) (not shown).

[0030] The outloader 124 according to this embodiment is configured to move in the left-right and front-rear directions to carry out the molded product P from the sealing mold 202 and place it on the molded product table 114. However, this is not limited to this, and a configuration may be provided in which a loader that moves in the front-rear direction to carry out the molding product P from the sealing mold 202 and a loader that moves in the left-right direction to transport between units are separately provided (not shown).

[0031] The overall configuration of the resin sealing apparatus 1 can be changed by changing the configuration of the units. For example, the configuration shown in Fig. 1 is an example in which two press units 100B are arranged, but a configuration in which only one press unit 100B is arranged, or three or more press units 100B is arranged, etc. Also, a configuration in which other units are added is possible (neither is shown).

[0032] (supply unit) Next, the supply unit 100A provided in the resin sealing apparatus 1 will be described.

[0033] The supply unit 100A (or another unit) includes a resin supply mechanism 140 that supplies the resin R. As an example, the resin supply mechanism 140 includes a supply section 142 that has a hopper, a feeder, etc. and supplies tablet-shaped resin R, and a delivery section 144 that has a transport mechanism such as an elevator and holds multiple pieces of resin R in predetermined positions that are supplied from the supply section 142. With this configuration, the multiple pieces of resin R held in the delivery section 144 are held by the inloader 122 and transported to the press unit 100B.

[0034] (Press unit) Next, the press unit 100B provided in the resin sealing apparatus 1 will be described.

[0035] The press unit 100B includes a press device 250 that performs resin sealing by opening and closing a sealing mold 202. Here, Fig. 2 is a side view (schematic diagram) of the press device 250. Fig. 3 is a plan view (schematic diagram) of the sealing mold 202. Fig. 4 is an enlarged view of the X portion in Fig. 3, Fig. 5 is a cross-sectional view of the X portion taken along line AA in Fig. 4, and Fig. 6 is a cross-sectional view of the Y portion taken along line BB in Fig. 4.

[0036] 2, the press device 250 includes a sealing mold 202 having a lower mold 206 and an upper mold 204 and disposed between a pair of platens 252, 254, a plurality of connecting mechanisms 256 between which the pair of platens 252, 254 are spanned, a drive source (e.g., an electric motor) 258 that moves (lifts and lowers) the platen 254, and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 260 (a partition unit 203, described below, is not shown). In this embodiment, the upper mold 204 is assembled to the stationary platen 252, and the lower mold 206 is assembled to the movable platen 254. However, the present invention is not limited to this configuration, and the upper mold 204 may be assembled to the movable platen and the lower mold 206 may be assembled to the stationary platen, or both the upper mold 204 and the lower mold 206 may be assembled to the movable platen.

[0037] Next, the lower mold 206 of the sealing mold 202 will be described in detail. As shown in FIGS. 2, 5, and 6, the lower mold 206 includes a lower mold base 212, a lower mold chase block 216, a lower mold clamp block 220, and the like, which are assembled together. As an example, the lower mold chase block 216 is fixed onto the lower mold base 212, and the lower mold base 212 is fixed onto a movable platen 254. In this embodiment, a lower mold cavity block 226 is provided in an arrangement surrounded by the lower mold clamp block 220. However, the configuration is not limited to these, and multiple components may be integrated as appropriate.

[0038] Here, a plurality of cylindrical pots for accommodating resin (for example, tablet-shaped resin) R are provided at predetermined positions in the lower mold 206. In this embodiment, as shown in Figs. 3 to 5, first pots 231 for accommodating a first resin R1 and second pots 232 for accommodating a second resin R2 are alternately arranged in a line. However, the present invention is not limited to this configuration.

[0039] Specifically, the first pot 231 is formed as a through-hole that is continuous with the lower chase block 216 and the lower clamp block 220, and a first plunger 241 that is pushed by a known transfer drive mechanism (not shown) is disposed inside the first pot 231. With this configuration, the first plunger 241 is pushed, and the first resin R1 in the first pot 231 is supplied into the cavity 208 (described below). Similarly, the second pot 232 is formed as a through-hole that is continuous with the lower chase block 216 and the lower clamp block 220, and a second plunger 242 that is pushed by a known transfer drive mechanism (not shown) is disposed inside the first pot 231. With this configuration, the second plunger 242 is pushed, and the second resin R2 in the second pot 232 is supplied into the cavity 208 (described below).

[0040] Furthermore, in the lower mold 206, a cavity 208 (208A: may be referred to as the first cavity) which serves as a sealing region into which the resin R (in this embodiment, this is a first resin R1, but it can also be set to a second resin R2 or both) flows is provided on the upper surface of the lower mold cavity block 226. Also, a runner (described later) which communicates with the cavity 208 (208A) and serves as a flow path for the resin R is provided.

[0041] A lower mold heater (not shown) is provided on the lower mold base 212. This allows heat to be conducted to the periphery of the first pot 231, the second pot 232, the first runner 271, the cavity 208 (208A), etc. via the lower chase block 216, etc., and the resin R therein can be heated efficiently to a predetermined temperature (about 180°C in this embodiment) in a short time. As an example, a known electric wire heater, sheath heater, etc. is used as the lower mold heater.

[0042] Next, the upper mold 204 of the sealing mold 202 will be described in detail. As shown in FIGS. 2, 5, and 6, the upper mold 204 includes an upper mold base 210, an upper chase block 214, an upper clamp block 218, and the like, which are assembled together. As an example, the upper chase block 214 is fixed to the lower surface of the upper mold base 210, and the upper mold base 210 is fixed to the lower surface of a stationary platen 252. In addition, in this embodiment, an upper cavity block 228 is provided in an arrangement surrounded by the upper clamp block 218. However, the present invention is not limited to these configurations, and multiple components may be integrated into one structure as appropriate.

[0043] Here, in the upper mold 204, a cavity 208 (208B: may be referred to as a second cavity) which serves as a sealing region into which the resin R (second resin R2 in this embodiment, but can also be set to first resin R1 or both) flows is provided on the lower surface of the upper mold cavity block 228. In addition, a runner (described later) which communicates with the cavity 208 (208B) and serves as a flow path for the resin R is provided.

[0044] An upper mold heater (not shown) is also provided on the upper mold base 210. This allows heat to be conducted to the periphery of the second cull 262, the second runner 272, the cavity 208 (208B), etc. via the upper chase block 214, etc., and the resin R therein can be heated efficiently to a predetermined temperature (about 180°C in this embodiment) in a short time. As an example, a known electric wire heater, sheath heater, etc. is used as the upper mold heater.

[0045] Next, the partition 203 of the sealing mold 202 will be described in detail. As shown in Figures 5 and 6, the partition 203 is provided as a member that is sandwiched between the upper mold 204 and the lower mold 206 when the molds are closed. In this embodiment, the partition 203 is configured as an "intermediate mold," that is, a mold made of the same metal material as the upper mold 204 and the lower mold 206 (or a different metal material). However, this is not limited to this, and for example, in a configuration in which a workpiece is sealed with resin, the workpiece or its carrier may be used as the partition 203 (not shown).

[0046] Here, a first cull 261 is formed on the lower surface of the partition portion 203 as a flow path for the first resin R1 extruded from the first pot 231 by the first plunger 241. Furthermore, a first runner 271 communicating from the first cull 261 to the cavity 208 (208A) is formed on the upper surface of the lower mold 206, and is arranged so as to be covered by the lower surface of the partition portion 203 when the mold is closed (i.e., so as to form a space that forms a flow path).

[0047] Meanwhile, a second cull 262 is formed on the lower surface of the upper mold 204 as a flow path for the second resin R2 extruded from the second pot 232 by the second plunger 242. A through-hole 207 is formed in the partition 203 at a position between the second pot 232 and the second cull 262. Furthermore, a second runner 272 communicating from the second cull 262 to the cavity 208 (208B) is formed on the lower surface of the upper mold 204, and is arranged so as to be covered by the upper surface of the partition 203 when the mold is closed (i.e., so as to form a space that forms a flow path).

[0048] In this embodiment, the first runner 271 and the second runner 272 are configured to be separated by a partition 203, but a communication passage 270 is provided to allow communication between them at a predetermined position (in this embodiment, a position near (adjacent to) the upper clamp block 218 and the lower clamp block 220). Furthermore, a flow path forming portion 209 is provided, which can be switched between a position where it contacts the partition 203 (sometimes referred to as a "first position" in this application) as shown in FIG. 10 and a position where it does not contact the partition 203 (sometimes referred to as a "second position" in this application) as shown in FIG. 11. This movement of the flow path forming portion 209 enables the desired resin sealing molding according to the present invention (a molding method will be described later). As a modified example, the first runner 271 and the second runner 272 may be provided without a partition (i.e., in the upper mold 204 and the lower mold 206) (not shown).

[0049] According to the above configuration, molding can be performed using two different types of sealing resin (thermosetting resin) R1 and R2 in one mold closing step (note that details of the molding operation will be described later).

[0050] The above-described configuration of the sealing mold 202 is merely an example, and other configurations may be adopted. For example, a configuration may be adopted in which the cavity 208 is provided in only one of the lower mold 206 or the upper mold 204. Also, a configuration may be adopted in which the workpiece is to be sealed with resin.

[0051] (storage unit) Next, the container unit 100C provided in the resin sealing apparatus 1 will be described.

[0052] The storage unit 100C, for example, includes a molded product table 114 (also referred to as a molded product mounting pallet) on which the molded product P is placed, a degating mechanism 116 that removes unwanted resin portions from the molded products P, and a molded product stocker 112 used to store the molded products P from which the unwanted resin portions have been removed. The molded product stocker 112 uses a known stack magazine, slit magazine, or the like, and is capable of storing multiple molded products P at once. With this configuration, the molded products P (including unwanted resin portions) transported from the press unit 100B using an outloader 124 or the like are placed on the molded product table 114. Next, the molded products P are transferred to the degating mechanism 116 using a known pickup or the like (not shown), where the unwanted resin portions are removed, and then stored in the molded product stocker 112 using a known pusher or the like (not shown). The molded product table 114 itself, with the molded products P loaded thereon, may move forward and backward to the degating mechanism 116.

[0053] (Resin sealing operation) Next, the operation of resin sealing using the resin sealing apparatus 1 equipped with the sealing mold 202 according to this embodiment (i.e., the resin sealing method according to this embodiment) will be described. As an example, a configuration will be given in which resin sealing is performed using two types of resin R (first resin R1, second resin R2) without placing a workpiece, to obtain a molded product P. However, this configuration is not limiting. Here, Figs. 7 to 13 are explanatory diagrams of each process. Note that Fig. 7 is a view from the same direction as Fig. 5, and Figs. 8 to 13 are views from the same direction as Fig. 6.

[0054] As a preparation step, a heating step (upper die heating step) is carried out in which the upper die 204 is heated to a predetermined temperature (for example, 100°C to 200°C) using an upper die heater. Also, a heating step (lower die heating step) is carried out in which the lower die 206 is heated to a predetermined temperature (for example, 100°C to 200°C) using a lower die heater. Note that a step of setting a release film on one or both die surfaces may be included.

[0055] Next, a process is carried out in which tablet-shaped resin R is transported one by one from the supply section 142 using a known feeder, elevator, etc. (not shown), and multiple pieces of resin R (for example, four pieces of the first resin R1 in a row and four pieces of the second resin R2 in a row next to them) are held in a predetermined position in the delivery section 144.

[0056] Next, the inloader 122 is moved to a position directly above the delivery section 144. At that position, the delivery section 144 is raised (or the inloader 122 is lowered), and a step of holding the resin R (first resin R1, second resin R2) by the resin holding section 122A is performed.

[0057] Next, the resin R (first resin R1, second resin R2) is transported by the inloader 122 into the sealing mold 202 of the press unit 100B, and a process is performed in which multiple (four in this embodiment) first resins R1 are placed one by one in the corresponding first pots 231, and multiple (four in this embodiment) second resins R2 are placed one by one in the corresponding second pots 232 (see FIG. 7). Note that during the transport, a process of preheating the resin R (preheating process) may be performed using a heater (not shown) provided in the inloader 122.

[0058] Next, the sealing mold 202 is closed, and a step of forming the molded product P by resin sealing (mold closing step) is carried out.

[0059] The mold closing step will now be described in detail. Figure 8 shows the state before the mold closing step is performed. From this state, the drive source 258 and the drive transmission mechanism 260 are driven to move the movable platen 254 upward. This causes the lower mold 206 to move toward the upper mold 204 (i.e., upward). As the lower mold 206 continues to move upward, the lower mold 206 and the upper mold 204 come into contact with each other with the partition 203 sandwiched between them (see Figure 9).

[0060] At this time, the flow path forming part 209 is lowered and moves to a position (first position) where it contacts the partition part 203, closing the flow paths of the communicating path 270 and the second runner 272. In this state, the transfer drive mechanism is operated to push the first plunger 241 toward the upper mold 204, and the molten first resin R1 is forced to pass from the first pot 231 through the first cull 261 and the first runner 271, and then pressure-fed into the cavity 208 (208A) (first filling step) (see FIG. 10).

[0061] After the first resin R1 filled in the cavity 208 (208A) is semi-cured (i.e., cured before reaching full curing), the flow path forming portion 209 is raised a predetermined distance (several μm to several mm) and moved to a position (second position) where it is not in contact with the partition portion 203, thereby performing a process (flow path forming process) to open the flow paths of the communicating path 270 and the second runner 272. Simultaneously with (or before or after) this, the lower mold cavity block 226 (and its surroundings, if necessary) is lowered a predetermined distance (several μm to several mm) to form a space communicating with the communicating path 270 (space forming process) (see FIG. 11). This space constitutes the cavity 208 (208C) that communicates with both the cavity 208 (208A) and the cavity 208 (208B). However, depending on the shape of the molded product P, there may be cases where the space forming step is not performed (i.e., the cavity 208C is not provided) (not shown). Also, as described above, there may be cases where either the cavity 208A or the cavity 208B is not provided (not shown). As an example, it is preferable to set the distance L1 between the lower surface of the flow path forming portion 209 and the upper surface of the lower mold cavity block 226, and the distance L2 between the lower surface of the upper mold cavity block 228 and the upper surface of the lower mold cavity block 226, so that L1 > L2. This allows the second resin R2 to be filled into the above space (i.e., the cavity 208C) in a short time and reliably in a subsequent step (the second filling step described below).

[0062] In the above state, the transfer drive mechanism is operated to push the second plunger 242 toward the upper mold 204, and the molten second resin R2 is passed from the second pot 232 through the through-hole 207 and the second cull 262, passing through the second runner 272, and pressure-fed into the cavity 208 (208B) and the cavity 208 (208C) (second filling step) (see FIG. 12). Note that the flow path forming step and the second filling step may overlap for a predetermined time. Furthermore, the initial step of the second filling step (for example, pressure-fed up to just before the partition section 203) may be started before the flow path forming step.

[0063] In this state, by applying heat and pressure for a predetermined time, the resin R (first resin R1, second resin R2) is thermally cured (mainly cured) and resin sealing is performed to form a molded product P. In this embodiment, resin sealing is finally performed in a state where the cavity 208 (208A) and the cavity 208 (208B) are in communication via the cavity 208 (208C), so a molded product P is formed in which the first resin R1 and the second resin R2 are continuous (connected).

[0064] In this way, molding (two-color molding) can be performed using two different types of resins (thermosetting resins) R1 and R2 through a single mold closing process using one type of sealing mold 202. Conventionally, when molding using two different types of resins (two-color molding), it was necessary to use two types of molds corresponding to the respective resins and perform two mold closing processes. However, according to this embodiment, molding (two-color molding) can be performed through a single mold closing process using one type of sealing mold 202, which reduces equipment costs and shortens process time.

[0065] Although the types of the first resin R1 and the second resin R2 are not limited, it is preferable to use a resin material for the second resin R2 that has a slower thermal curing property than the first resin R1 (i.e., a longer curing time under the same temperature conditions). This allows the second resin R2 to be pumped and filled after the first resin R1, thereby avoiding the problem of the resin curing during waiting. Therefore, a single mold closing process using a single type of sealing mold 202 can achieve molding (resin sealing) in which the two different types of sealing resins R1 and R2 do not mix.

[0066] After the above mold closing step, a mold opening step of the sealing mold 202 is carried out (see FIG. 13).

[0067] Next, the outloader 124 removes the molded product P (including unnecessary resin portions such as the cull portion, runner portion, and gate portion) from the sealing mold 202 and places it on the molded product table 114 (a known pickup mechanism or the like may be used in combination). Next, the degating mechanism 116 removes unnecessary resin portions such as the cull portion, runner portion, and gate portion from the molded product P (a degating process). Next, a known pusher or the like (not shown) is used to carry the molded products P (from which unnecessary resin portions have been removed) one by one into the molded product stocker 112. Note that a post-cure process for the molded products P may be performed before these processes.

[0068] The above are the main operations of resin sealing performed using the resin sealing apparatus 1. However, the above process order is only an example, and the order of the steps can be changed or the steps can be performed in parallel as long as there are no problems. For example, in this embodiment, since the configuration includes two press units 100B, performing the above operations in parallel enables efficient formation of molded products.

[0069] As described above, according to the present invention, molding with two different types of sealing resins can be performed in a single mold closing process using a single type of sealing mold, thereby reducing equipment costs and shortening the molding process time.

[0070] The present invention is not limited to the above-described embodiment, and various modifications are possible within the scope of the present invention. Specifically, in the above-described embodiment, the resin sealing that does not use a workpiece is described as an example, but the present invention is not limited to this, and can be similarly applied to the resin sealing that uses a workpiece. [Explanation of symbols]

[0071] 1 Resin sealing equipment 202 Sealing mold 203 Partition 204 Upper mold 206 Lower mold 209 Flow path forming section

Claims

1. A molding die for resin molding, comprising a first die and a second die, a first pot into which a first resin is poured; a second pot into which a second resin is poured; a first runner that forms a flow path for the first resin flowing from the first pot; a second runner that forms a flow path for the second resin flowing from the second pot; a partition portion sandwiched between the first die and the second die and separating the first runner and the second runner; a flow path forming portion that moves to a first position in contact with the partition portion and a second position in which the flow path forming portion does not contact the partition portion. The sealing mold is characterized by the above.

2. the first mold has a first cavity into which the first resin flows; the second mold has a second cavity into which the second resin flows; the first position forms a flow path for allowing the first resin to flow into the first cavity; The second position is configured to form a flow path for allowing the second resin to flow into the second cavity. The sealing mold according to claim 1,

3. The partition is constituted by either an intermediate mold, a work to be sealed, or a carrier for the work or molded product.

3. The sealing mold according to claim 1 or 2, wherein:

4. The first resin and the second resin have different hardening times under the same temperature conditions.

3. The sealing mold according to claim 1 or 2, wherein:

5. A resin sealing device comprising the sealing mold according to any one of claims 1 to 4.

6. A resin sealing method for performing resin sealing using a sealing mold including a first mold and a second mold, During one mold closing process, a first filling step of pumping a first resin charged into a first pot through a first runner into a first cavity; a flow path forming step of moving a flow path forming section from a first position where the flow path forming section is sandwiched between the first mold and the second mold and in contact with a partition section that separates the first runner and the second runner to a second position where the flow path forming section is not in contact with the partition section; a second filling step of pressure-feeding the second resin charged into the second pot to the second cavity via the second runner. A resin sealing method characterized by the above.

7. The flow path forming step is performed after the first resin filled into the first cavity in the first filling step is semi-cured.

7. The resin sealing method according to claim 6, wherein

8. The second resin is made of a resin material that has a longer hardening time under the same temperature conditions as the first resin.

8. The resin sealing method according to claim 6 or 7, wherein:

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