Component pressure-bonding device and abnormality determination method

Abstract

To provide a component pressure-bonding device capable of appropriately determining the type of an abnormality.SOLUTION: A component pressure-bonding device 100 includes a lower receiving part 46 having a supporting surface 46a, a detection part 71, a movement part 76 that moves the detection part 71, and a control part 2a. The detection part 71 includes an imaging part 72 that acquires a two-dimensional image by imaging the supporting surface 46a, a first light source 73 that illuminates the supporting surface 46a with first illumination light, and a second light source 74 that illuminates the supporting surface 46a with second illumination light. The control part 2a causes the imaging part 72 to perform first imaging that is imaging of a detection target position illuminated with the first illumination light and second imaging that is imaging of the detection target position illuminated with the second illumination light, while causing the movement part 76 to move the detection part 71, and determines the presence / absence of a foreign matter adhering to the detection target position so as to protrude from the supporting surface 46a based on a difference between a first image acquired by the first imaging and a second image acquired by the second imaging.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a component crimping device that crimps a component onto a substrate. [Background technology]

[0002] Conventionally, a component bonding device has been provided that bonds electronic components (hereinafter simply referred to as "components") to panels such as liquid crystal panels (see Patent Document 1). This component bonding device bonds the components to the edge of the liquid crystal panel via an anisotropic conductive film (ACF), which is an anisotropic conductive material. That is, the ACF is attached to the edge of the liquid crystal panel as an adhesive material. The component bonding device mounts the components on the portion of the liquid crystal panel where the ACF is attached, and bonds the components to the liquid crystal panel. This component bonding device also checks whether any foreign matter is attached to the support surface of a backup unit that supports the substrate by capturing an image of the support surface. If any foreign matter is attached to the support surface, the component bonding device cleans the support surface. The backup unit is also called a support unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-38666 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the component crimping device of Patent Document 1 has a problem in that it is difficult to determine the type of abnormality. In other words, although the component crimping device of Patent Document 1 can check whether or not there is an abnormality on the support surface by capturing an image of the support surface, it is difficult to properly determine whether the abnormality is the adhesion of a foreign substance. For example, the component crimping device may determine that a foreign substance is attached to the support surface even when there is dirt, a defect (specifically, a scratch), or the like on the support surface that is not a foreign substance.

[0005] Therefore, the present disclosure provides a component crimping device and the like that can appropriately determine the type of abnormality. [Means for solving the problem]

[0006] A component crimping device according to one aspect of the present disclosure includes a lower receiving unit having a support surface that supports a substrate from below in order to crimp a component onto the substrate, a detection unit that detects a state of the support surface, a movement unit that moves the detection unit in one direction along the support surface, and a control unit that controls the detection unit and the movement unit, wherein the detection unit includes an imaging unit that captures a two-dimensional image by imaging the support surface, a first light source that is arranged rearward in the one direction relative to the imaging unit and that irradiates the support surface with first irradiation light, and a second light source that is arranged forward in the one direction relative to the imaging unit and that irradiates the support surface with second irradiation light. and a second light source for detecting a foreign object protruding from the support surface, and the control unit, while causing the moving unit to move the detection unit in one direction, causes the imaging unit to perform a first image capture, which is an image capture of the detection target position irradiated with the first irradiation light, and a second image capture, which is an image capture of the detection target position irradiated with the second irradiation light, as detection of the state of the support surface, and determines the presence or absence of a foreign object adhering to the detection target position so as to protrude from the support surface based on the difference between the first image, which is the two-dimensional image acquired by the first image capture, and the second image, which is the two-dimensional image acquired by the second image capture.

[0007] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized as any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may also be a non-transitory recording medium. [Effects of the Invention]

[0008] The component crimping device of the present disclosure can appropriately determine the type of abnormality.

[0009] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some of the embodiments and configurations described in the specification and drawings, but not all of the configurations are necessarily required. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to the first embodiment. [Figure 2] FIG. 2 is a plan view of the component mounting line according to the first embodiment. [Figure 3] FIG. 3 is a diagram showing a computer provided in the component mounting line according to the first embodiment and each component controlled by the computer. [Figure 4] FIG. 4 is a block diagram showing the functional configuration of the component crimping device according to the first embodiment. [Figure 5A] FIG. 5A is a diagram illustrating an example of the first half of a series of processing operations including maintenance of the lower receiving portion and a process of main-pressure bonding of components in the first embodiment. [Figure 5B] FIG. 5B is a diagram illustrating an example of the latter half of a series of processing operations including maintenance of the lower receiving portion and a process of main-pressure bonding of components in the first embodiment. [Figure 6] FIG. 6 is a diagram showing an example of the configuration of the detection unit, the movement unit, and the cleaning unit according to the first embodiment. [Figure 7] FIG. 7 is a diagram showing a specific example of the cleaning unit according to the first embodiment. [Figure 8] FIG. 8 is a diagram illustrating the first imaging in the first embodiment. [Figure 9] FIG. 9 is a diagram illustrating the second imaging in the first embodiment. [Figure 10] FIG. 10 is a diagram for explaining a method for determining the presence or absence of a foreign substance according to the first embodiment. [Figure 11]FIG. 11 is a diagram illustrating the timing and state of movement of the detection unit, the first image capture, and the second image capture in the first embodiment. [Figure 12] FIG. 12 is a diagram showing an example of the arrangement of the imaging unit, the first light source, and the second light source according to the first embodiment. [Figure 13] FIG. 13 is a flowchart showing an example of a maintenance processing operation performed by the component crimping device according to the first embodiment. [Figure 14] FIG. 14 is a diagram for explaining an outline of the processing operation of the component crimping device according to the second embodiment. [Figure 15] FIG. 15 is a flowchart showing an example of a maintenance processing operation performed by the component crimping device according to the second embodiment. [Figure 16] FIG. 16 is a diagram showing an example of determination history data according to the second embodiment. [Figure 17] FIG. 17 is a flowchart showing another example of the maintenance processing operation performed by the component crimping device according to the second embodiment. [Figure 18] FIG. 18 is a diagram illustrating an example of a specific configuration of a maintenance unit in the modified example of the first and second embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0011] A component crimping device according to a first aspect of the present disclosure includes a lower receiving unit having a support surface that supports a substrate from below in order to crimp a component onto the substrate, a detection unit that detects a state of the support surface, a movement unit that moves the detection unit in one direction along the support surface, and a control unit that controls the detection unit and the movement unit, wherein the detection unit includes an imaging unit that captures a two-dimensional image by imaging the support surface, a first light source that is arranged rearward in the one direction relative to the imaging unit and that irradiates the support surface with first irradiation light, and a second light source that is arranged forward in the one direction relative to the imaging unit and that irradiates the support surface with second irradiation light. and a second light source for detecting a foreign object protruding from the support surface, and the control unit, while causing the moving unit to move the detection unit in one direction, causes the imaging unit to perform a first image capture, which is an image capture of the detection target position irradiated with the first irradiation light, and a second image capture, which is an image capture of the detection target position irradiated with the second irradiation light, as detection of the state of the support surface, and determines the presence or absence of a foreign object adhering to the detection target position so as to protrude from the support surface based on the difference between the first image, which is the two-dimensional image acquired by the first image capture, and the second image, which is the two-dimensional image acquired by the second image capture.

[0012] If a foreign object is attached to the detection target position so as to protrude from the support surface of the lower receiving part, a difference image, which is the difference between the first image and the second image, will show an area with a light and dark pattern different from dirt or defects, etc., at a position corresponding to the detection target position. Therefore, in the first mode, the presence or absence of a foreign object is determined based on such a difference image, thereby improving the accuracy of the determination. In other words, an abnormality due to the attachment of a foreign object can be determined separately from an abnormality due to dirt or defects on the support surface. Therefore, the type of abnormality can be appropriately determined.

[0013] In the component crimping device according to a second aspect, the control unit may control the detection unit and the movement unit so that an irradiation angle of the first irradiation light to the detection target position when the first image is captured is the same as an irradiation angle of the second irradiation light to the detection target position when the second image is captured. Note that the second aspect may be dependent on the first aspect.

[0014] As a result, since the irradiation angle in the first image capture and the irradiation angle in the second image capture are the same, abnormalities due to the adhesion of foreign matter can be more clearly distinguished from abnormalities due to stains or defects on the support surface and determined with high accuracy.

[0015] In the component crimping device according to a third aspect, the control unit may cause the imaging unit to perform the first imaging and the second imaging at different times. Note that the third aspect may be dependent on the first or second aspect.

[0016] This makes it possible to more clearly distinguish between abnormalities due to stains or defects on the support surface and determine abnormalities due to the adhesion of foreign matter than when the first and second images are taken at the same time. Also, the irradiation angle in the first image capture and the irradiation angle in the second image capture can be easily made closer, making it possible to determine abnormalities due to the adhesion of foreign matter with high accuracy.

[0017] In the component crimping device according to a fourth aspect, a first distance between the image capturing unit and the first light source may be longer than a second distance between the image capturing unit and the second light source, and the control unit may cause the image capturing unit to capture the first image and then the second image. Note that the fourth aspect may be dependent on any one of the first to third aspects.

[0018] This makes it easier to perform the first and second images at different times and at the same irradiation angle while moving the detection unit, thereby making it possible to more appropriately determine the type of foreign matter.

[0019] In the component crimping device according to the fifth aspect, the first distance is L1, the second distance is L2, the moving speed of the detector moved by the moving unit is V, and the time difference between when the first image capture and the second image capture are performed is t, the relational expression L2=L1-V×t may be satisfied. Note that the fifth aspect may be dependent on the fourth aspect.

[0020] This allows the first and second images to be captured at different times and at the same irradiation angle while the detection unit is being moved, thereby making it possible to more appropriately determine the type of foreign matter.

[0021] In the component crimping device according to a sixth aspect, a first distance between the image capturing unit and the first light source may be shorter than a second distance between the image capturing unit and the second light source, and the control unit may cause the image capturing unit to capture the first image after capturing the second image. Note that the sixth aspect may be dependent on any one of the first to third aspects.

[0022] This makes it easier to perform the first and second images at different times and at the same irradiation angle while moving the detection unit, thereby making it possible to more appropriately determine the type of foreign matter.

[0023] In the component crimping device according to the seventh aspect, the relational expression L1=L2-V×t may be satisfied where the first distance is L1, the second distance is L2, the detection unit is moved by the moving unit at a moving speed V, and the time difference between when the first image capture and the second image capture are performed is t. The seventh aspect may be dependent on the sixth aspect.

[0024] This allows the first and second images to be captured at different times and at the same irradiation angle while the detection unit is being moved, thereby making it possible to more appropriately determine the type of foreign matter.

[0025] In addition, the component crimping device according to an eighth aspect may further include a cleaning unit that cleans the support surface, and the control unit may cause the cleaning unit to clean the detection target position when it determines that the foreign matter is present at the detection target position. Note that the eighth aspect may be dependent on any one of the first to seventh aspects.

[0026] This makes it possible to remove foreign matter adhering to the support surface, thereby improving the quality of the mounted substrates produced by pressure-bonding components to the substrate, thereby improving the yield of the mounted substrates.

[0027] Furthermore, an abnormality determination method according to a first aspect of the present disclosure is an abnormality determination method performed by a component crimping device, the component crimping device including: a lower receiving unit having a support surface that supports a substrate from below in order to crimp a component onto the substrate; and a detection unit that detects a state of the support surface, the detection unit including an imaging unit that captures a two-dimensional image by imaging the support surface; a first light source that is arranged rearward in the one direction relative to the imaging unit and that irradiates the support surface with first irradiation light when the detection unit moves in one direction along the support surface; and a second light source that is arranged forward in the one direction relative to the imaging unit and that irradiates the support surface with first irradiation light. and a second light source that irradiates second irradiation light. In the abnormality determination method, while the detection unit is moved in the one direction, the imaging unit performs a first image capture, which is an image capture of the detection target position where the first irradiation light is irradiated, and a second image capture, which is an image capture of the detection target position where the second irradiation light is irradiated, to detect the state of the support surface, and based on the difference between the first image, which is the two-dimensional image obtained by the first imaging, and the second image, which is the two-dimensional image obtained by the second imaging, it is determined whether or not a foreign object is attached to the detection target position so as to protrude from the support surface.

[0028] This makes it possible to achieve the same effects as those of the component crimping device according to the first aspect.

[0029] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0030] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step orders shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not recited in the independent claims that represent the highest concepts are described as optional components. Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Furthermore, the same components in each figure are assigned the same reference numerals. Furthermore, expressions such as "approximately the same" are used in the following embodiments. For example, "approximately the same" does not only mean completely the same, but also means substantially the same, i.e., including an error of a few percent (e.g., 1 to 10%). Furthermore, "approximately the same" means the same to the extent that the effects of the present disclosure can be achieved. The same applies to other expressions using "approximately the same."

[0031] (Embodiment 1) [Schematic configuration of the component mounting line] FIG. 1 is a diagram showing a schematic configuration of a component mounting line according to this embodiment.

[0032] The component mounting line 1 in this embodiment is a system that produces products such as liquid crystal displays by mounting components 5 on a substrate 3 such as a liquid crystal panel. The components 5 are, for example, electronic components such as drive circuits. Specifically, as shown in FIG. 1 , the component mounting line 1 has a substrate carry-in section 10, an adhesion section 20, a pre-pressure bonding section 30, a full-pressure bonding section 40, and a substrate carry-out section 50. The substrate carry-in section 10, the adhesion section 20, the pre-pressure bonding section 30, the full-pressure bonding section 40, and the substrate carry-out section 50 are connected in this order.

[0033] The substrate carrying-in section 10 receives a rectangular substrate 3 carried in by a worker or from another device on the upstream side, and the substrate 3 is then carried out to the bonding section 20 on the downstream side.

[0034] The adhering unit 20 receives the substrate 3 carried out from the substrate carrying-in unit 10, and adheres an adhesive member to each of the plurality of electrode units 4 on the periphery of the substrate 3. Then, the substrate 3 with the adhesive member adhered thereto is carried out to the temporary pressure-bonding unit 30. Each of the plurality of electrode units 4 is composed of, for example, a plurality of electrodes.

[0035] The pre-bonding unit 30 receives the substrate 3 carried out from the adhering unit 20, and mounts and pre-bonds the component 5 on the portion of the substrate 3 where the adhesive member is attached. Then, the substrate 3 with the component 5 pre-bonded thereto is carried out to the full-bonding unit 40.

[0036] The final compression bonding section 40 receives the substrate 3 carried out from the temporary compression bonding section 30, and performs final compression bonding (also called thermocompression bonding) on ​​the components 5 that have been temporarily compression bonded to the substrate 3. Then, the substrate 3 that has been subjected to the final compression bonding is carried out to the substrate carrying-out section 50.

[0037] The substrate unloading section 50 receives the substrate 3 unloaded from the full-compression bonding section 40. The substrate 3 received by the substrate unloading section 50 is unloaded downstream.

[0038] In this way, the component mounting line 1 performs component mounting work to mount components 5 on each of the multiple electrode portions 4 provided on the periphery of the loaded board 3, and then transports the board 3 with the mounted components 5 out of the board transport section 50.

[0039] [Detailed configuration of component mounting line] FIG. 2 is a plan view of the component mounting line 1 in this embodiment. Specifically, FIG. 2 shows the configuration of the component mounting line 1 as viewed from above. In this embodiment, the board transport direction is referred to as the X-axis direction, the vertical direction is referred to as the Z-axis direction, and the direction perpendicular to the X-axis and Z-axis directions, i.e., the depth direction, is referred to as the Y-axis direction. The negative and positive sides in the X-axis direction correspond to the upstream and downstream sides, respectively, in the board transport direction, the negative and positive sides in the Z-axis direction correspond to the lower and upper sides, respectively, in the vertical direction, and the negative and positive sides in the Y-axis direction correspond to the near and far sides or the front and rear sides, respectively, in the depth direction.

[0040] The substrate loading section 10 includes a base 1a on which the substrate 3 to be loaded is placed. The base 1a of the substrate loading section 10 is provided with a stage 11 on which the substrate 3 is placed. The stage 11 moves up and down in the Z-axis direction relative to the base 1a. The stage 11 also has a plurality of suction holes 11a on its upper surface. The stage 11 holds the substrate 3, which has been loaded by an operator or from another upstream device and placed on the stage 11, by vacuum suction through the suction holes 11a using a suction device such as a pump (not shown).

[0041] The adhering unit 20 has a function of performing an adhering operation (in other words, an adhering step) of adhering an ACF, which is an adhesive member, to the electrode unit 4 of the substrate 3. The adhering unit 20 includes a substrate moving mechanism 21 and an adhering mechanism 22.

[0042] The substrate moving mechanism 21 is a mechanism that moves the substrate 3. The substrate moving mechanism 21 includes, for example, an X-axis table that is movable in the X-axis direction, a Y-axis table that is movable in the Y-axis direction, a Z-axis table that is movable in the Z-axis direction, and a stage 23. In the substrate moving mechanism 21, the X-axis table, the Y-axis table, the Z-axis table, and the stage 23 are stacked on top of each other on the base 1b in this order from the bottom.

[0043] The Y-axis table extends in the Y-axis direction and moves freely in the X-axis direction on the X-axis table. The Z-axis table moves freely in the Y-axis direction on the Y-axis table, raising and lowering the stage 23 provided above it in the Z-axis direction and rotating it around the Z axis.

[0044] Furthermore, a plurality of suction holes 23a are provided on the upper surface of the stage 23, and the stage 23 holds the substrate 3 placed on its upper surface by vacuum suction. In this way, the substrate moving mechanism 21 suction-holds the substrate 3, moves it within a horizontal plane (specifically, in the X-axis and Y-axis directions), raises and lowers it in the vertical direction (specifically, in the Z-axis direction), and rotates it around the Z-axis.

[0045] The bonding mechanism 22 is provided with, for example, two bonding heads aligned in the X-axis direction above the base 1b. Each bonding head is provided with a supply unit that supplies ACF and a bonding tool that bonds the ACF to the substrate 3. Each of the two bonding heads bonds the ACF at positions on the substrate 3 that correspond to the plurality of electrode portions 4. In addition, a bonding support table is provided at a position corresponding to each of the two bonding heads below.

[0046] The pre-compression bonding unit 30 performs a pre-compression bonding process in which a component 5 is mounted and pre-compressed on the area of ​​the substrate 3 where the ACF is attached (i.e., the area to be compressed). The pre-compression bonding unit 30 includes a substrate moving mechanism 31, a component mounting mechanism 32, a component supply unit 33, and a component transport unit 35.

[0047] The substrate moving mechanism 31 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 31 has a stage 37 that holds the substrate 3. The stage 37 has a plurality of suction holes 37a on its upper surface. The substrate moving mechanism 31 holds the substrate 3 placed on the stage 37 by vacuum suction using the plurality of suction holes 37a. The substrate moving mechanism 31 also has the function of moving the stage 37 that holds the substrate 3 by suction within a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 37, the substrate moving mechanism 31 positions the area of ​​the substrate 3, where the ACF is attached, that is held by suction above the support unit 36, which serves as a backup stage for the component mounting mechanism 32.

[0048] The component supply unit 33 is provided at the rear side (i.e., the positive side in the Y-axis direction) of the component mounting mechanism 32, projecting from the rear part of the base 1b. For example, the component supply unit 33 includes a supply reel 33a around which a strip-shaped component storage body such as a TCP (Tape Carrier Package) is wound, a punching unit 33b, a movable stage 33c, and a rail 33d. The component supply unit 33 sequentially supplies components 5 from the strip-shaped component storage body by the movement of these components.

[0049] The component transfer unit 35 moves the component 5 supplied from the component supply unit 33 to the side of the crimping tool 34 included in the component mounting mechanism 32.

[0050] The component mounting mechanism 32 is provided on the base 1b and includes a crimping tool 34 and a support 36.

[0051] The lower support portion 36 is an elongated member that supports from below a predetermined portion, that is, a pressure-bonding target portion, of the substrate 3 held by the stage 37. The pressure-bonding target portion is the portion of the substrate 3 to which the ACF is attached.

[0052] The crimping tool 34 holds the component 5 and crimps the component 5 to a crimping target portion supported by the receiving portion 36. Specifically, the crimping tool 34 moves up and down in the Z-axis direction and picks up (i.e., picks up) the component 5 moved by the component transfer portion 35 from above. The crimping tool 34 then places the picked-up component 5 on the ACF and presses it together with the substrate 3 against the receiving portion 36, thereby pre-bonding the component 5 to the substrate 3. Note that the pre-crimping portion 30 may also include a mechanism for rotating the orientation of the substrate 3 held by the substrate moving mechanism 31 by 90 degrees.

[0053] The final compression bonding unit 40 performs a final compression bonding process (i.e., a thermocompression bonding process) in which the component 5, which has been temporarily compression bonded to the substrate 3 by the temporary compression bonding unit 30, is finally compressed (i.e., thermocompression bonded) to the substrate 3. In this way, the electrode units 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF. The final compression bonding unit 40 includes a substrate moving mechanism 41, a compression bonding mechanism 42, and a detection unit 71.

[0054] The substrate moving mechanism 41 has a structure similar to that of the substrate moving mechanism 21 of the bonding unit 20. Specifically, the substrate moving mechanism 41 has a stage 49. A plurality of suction holes 49a is provided on the upper surface of the stage 49. The substrate moving mechanism 41 holds the substrate 3 placed on the stage 49 by vacuum suction using the plurality of suction holes 49a. The substrate moving mechanism 41 also has the function of moving the stage 49, which holds the substrate 3 by suction, in a horizontal plane, raising and lowering it in the vertical direction, and rotating it around the Z axis. By moving and rotating the stage 49, the substrate moving mechanism 41 positions the area of ​​the substrate 3, where the component 5 is temporarily pressure-bonded, above the lower support portion 46 of the pressure-bonding mechanism 42.

[0055] The crimping mechanism 42 is provided on the base 1b and includes two crimping tools 44 and a support 46. The heated crimping tool 44 presses the component 5 on the substrate 3 toward the support 46. This causes the component 5 to be fully crimped, and the electrode 4 formed on the substrate 3 and the component 5 are electrically connected via the ACF.

[0056] The detector 71 detects the state of the lower support 46 included in the crimping mechanism 42 .

[0057] The substrate unloading section 50 has a function of holding the substrate 3 transported from the main pressure bonding section 40 on the stage 51 by vacuum suction. The substrate 3 held in the substrate unloading section 50 is either unloaded to another device downstream or removed from the stage 51 by an operator.

[0058] The stage 51 moves up and down in the Z-axis direction relative to the base 1c. A plurality of suction holes 51a are provided on the top surface of the stage 51, and the stage 51 holds the substrate 3 transferred from the main pressure bonding section 40 by vacuum suction on its top surface.

[0059] The transport unit 60 is a device that transports the substrate 3. Specifically, the transport unit 60 has a function of transferring (transporting) the substrate 3 that has been carried into the substrate carry-in unit 10 to the adhering unit 20, the pre-press bonding unit 30, the final pressure bonding unit 40, and the substrate carry-out unit 50 in this order. The transport unit 60 is disposed in the front area (i.e., on the negative side in the Y-axis direction) of the adhering unit 20, the pre-press bonding unit 30, and the final pressure bonding unit 40.

[0060] The transport section 60 includes a substrate transport mechanism 62A, a substrate transport mechanism 62B, a substrate transport mechanism 62C, and a substrate transport mechanism 62D, which are arranged in order from the upstream side on a movable base 61 extending in the X-axis direction across bases 1a, 1b, and 1c.

[0061] Each of the substrate transport mechanisms 62A to 62D includes a base 63 and one or more arm units 64. In this embodiment, the case where each of the substrate transport mechanisms 62A to 62D includes two arm units 64 is exemplified.

[0062] The base 63 is provided on a movable base 61 and is movable freely in the X-axis direction. Two arm units 64 are provided side by side in the X-axis direction on the base 63. The arm units 64 vacuum-suck the substrate 3 from above.

[0063] Each of the substrate transport mechanisms 62A to 62D moves to a substrate transfer position where the substrate 3 held by the stage 11, 23, 37, 49, 51 is vacuum-sucked from above, and receives or transfers the substrate 3 from the rising and lowering stage 11, 23, 37, 49, 51. For example, the substrate transport mechanism 62A receives the substrate 3 placed on the stage 11 of the substrate carry-in unit 10 and transfers it to the stage 23 of the bonding unit 20. Also, for example, the substrate transport mechanism 62B receives the substrate 3 from the stage 23 of the bonding unit 20 and transfers it to the stage 37 of the pre-compression bonding unit 30. Also, for example, the substrate transport mechanism 62C receives the substrate 3 from the stage 37 of the pre-compression bonding unit 30 and transfers it to the stage 49 of the main compression bonding unit 40. Also, for example, the substrate transport mechanism 62D receives the substrate 3 from the stage 49 of the main compression bonding unit 40 and transfers it to the stage 51 of the substrate carry-out unit 50.

[0064] FIG. 3 is a diagram showing a computer provided in the component mounting line 1 and each of the components controlled by the computer.

[0065] 3, the component mounting line 1 includes a computer 2. The computer 2 is communicably connected to, for example, the adhering unit 20, the pre-press bonding unit 30, the main pressure bonding unit 40, and the transport unit 60 via, for example, control lines, and controls each of these units. The computer 2 includes a control unit 2a and a storage unit 2b.

[0066] The storage unit 2b stores various data necessary for component mounting operations, such as the size of the board 3, the type of components 5 to be mounted on the board 3, the mounting position, the mounting direction, and the timing for transferring the board 3, as well as control programs executed by the control unit 2a. The storage unit 2b is realized by a ROM (Read Only Memory), a RAM (Random Access Memory), or the like.

[0067] The control unit 2a controls the substrate moving mechanism 21 of the bonding unit 20, the substrate moving mechanism 31 of the pre-press bonding unit 30, the substrate moving mechanism 41 of the main pressure bonding unit 40, and the transport unit 60 to perform a substrate transfer operation for transferring the substrate 3 between each unit to the next process. The transfer of the substrate 3 from the upstream side to the downstream side in the substrate transfer operation is performed synchronously between each unit.

[0068] In addition, the control unit 2a controls the adhering unit 20 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 21, change the spacing between multiple adhering heads using the head moving motor, and cause the adhering unit 20 to perform the adhering work of adhering the ACF to the substrate 3 using the adhering mechanism 22.

[0069] Furthermore, for example, control unit 2a controls pre-bonding unit 30 to change the orientation and position of substrate 3 held by substrate moving mechanism 31, and causes component mounting mechanism 32 to pre-bond components 5 to substrate 3. Control unit 2a also controls component supply unit 33 and component transfer unit 35 to move components 5 to be pre-bonded to substrate 3 toward component mounting mechanism 32.

[0070] Furthermore, for example, the control unit 2a controls the final compression bonding unit 40 to change the orientation and position of the substrate 3 held by the substrate moving mechanism 41, and causes the component 5 temporarily compressed on the substrate 3 to be final compressed by the compression bonding mechanism 42. The final compression bonding unit 40 in this embodiment also includes a maintenance unit 70 having the above-mentioned detection unit 71. The maintenance unit 70 cleans the support unit 46 in accordance with the detection result by the detection unit 71. The control unit 2a controls the maintenance unit 70.

[0071] Such a control unit 2a is realized, for example, by a control program stored in the memory unit 2b for controlling each part and mechanism of the component mounting line 1, and a processor such as a CPU (Central Processing Unit) that executes the control program.

[0072] [Component crimping device configuration] FIG. 4 is a block diagram showing the functional configuration of component crimping apparatus 100 according to this embodiment.

[0073] The component crimping device 100 is made up of, for example, a main crimping unit 40 in the component mounting line 1, and a control unit 2a and a storage unit 2b of a computer 2.

[0074] Specifically, component crimping apparatus 100 includes control unit 2a, storage unit 2b, crimping tool 44, under-receiving unit 46, substrate moving mechanism 41, and maintenance unit 70. Under-receiving unit 46 has a support surface that supports substrate 3 from below in order to crimp (specifically, thermo-compression) component 5 to substrate 3. The support surface is the upper surface of under-receiving unit 46, and is a placement surface on which a peripheral portion of substrate 3 having a portion to be crimped is placed.

[0075] The control unit 2 a controls the pressure bonding tool 44 , the substrate moving mechanism 41 , and the maintenance unit 70 .

[0076] The maintenance unit 70 includes a detection unit 71, a movement unit 76, and a cleaning unit 77. The control unit 2a controls the detection unit 71, the movement unit 76, and the cleaning unit 77.

[0077] The moving unit 76 is a mechanism that moves the detecting unit 71. The detecting unit 71 detects the state of the support surface of the support portion 46. The detecting unit 71 includes an imaging unit 72, a first light source 73, a second light source 74, and a main body 75. The imaging unit 72 is, for example, a camera. The first light source 73 and the second light source 74 are lights such as LED (Light Emitting Diode) lights that illuminate the support surface of the support portion 46. The main body 75 is a structure that holds the imaging unit 72, the first light source 73, and the second light source 74 together.

[0078] The cleaning section 77 cleans the support surface of the lower receiving section 46 .

[0079] [Maintenance and final crimping process] 5A and 5B are diagrams showing an example of a series of processing operations including maintenance of the lower receiving portion 46 and the final pressure-bonding process of the component 5. FIG.

[0080] In this embodiment, the lower support portion 46 is formed in an elongated shape, with its longitudinal direction aligned with the X-axis direction. The support surface 46a of the lower support portion 46 is on the positive side of the lower support portion 46 in the Z-axis direction and is a surface parallel to the X-axis and Y-axis directions. Furthermore, foreign matter 91 may be attached to the support surface 46a.

[0081] The control unit 2a controls the substrate moving mechanism 41 to adsorb and hold the substrate 3 on the stage 49, as shown in (a) of FIG. 5A, for example. The substrate moving mechanism 41 may also move and rotate the stage 49. The detection unit 71 and the cleaning tool 77a are disposed at positions that are not above the support unit 46. The cleaning tool 77a is a tool such as a cylindrical brush that the cleaning unit 77 has.

[0082] During maintenance, the control unit 2a controls the moving unit 76 to move the detection unit 71 in the X-axis direction, as shown in FIG. 5A(b), for example. At this time, the detection unit 71 is located above and spaced apart from the support surface 46a of the lower receiving part 46, and moves along the longitudinal direction of the support surface 46a while capturing an image of the support surface 46a. The detection unit 71 detects the state of the support surface 46a by capturing the image. If a foreign object 91 is found attached to the support surface 46a, the control unit 2a determines that a foreign object 91 is attached to the support surface 46a based on the detection result of the detection unit 71. In other words, the control unit 2a determines that an abnormality caused by the attachment of the foreign object 91 exists.

[0083] As a result, the control unit 2a controls the cleaning unit 77 to move the cleaning tool 77a of the cleaning unit 77 along the longitudinal direction of the lower receiving portion 46 while rubbing it against the support surface 46a of the lower receiving portion 46, as shown in (c) of FIG. 5A, for example. This cleans the support surface 46a of the lower receiving portion 46. By this cleaning, foreign matter 91 adhering to the support surface 46a of the lower receiving portion 46 is removed.

[0084] Next, in the main bonding step, the control unit 2a controls the substrate moving mechanism 41 to move the stage 49 in the Y-axis direction positive side, as shown in (d) of FIG. 5B. Then, the control unit 2a places the peripheral edge portion of the substrate 3 held by the stage 49 on the Y-axis direction positive side on the support surface 46a of the support portion 46. As a result, the peripheral edge portion of the substrate 3 on the Y-axis direction positive side is supported from below by the support surface 46a of the support portion 46. In other words, the portion of the substrate 3 to which the component 5 is temporarily bonded is supported from below by the support surface 46a of the support portion 46. The control unit 2a also controls the crimping tool 44 to position the crimping tool 44 above the component 5.

[0085] Then, as shown in (e) of Fig. 5B, for example, the control unit 2a lowers the heated pressure bonding tool 44 to press the component 5 together with the substrate 3 against the lower receiving portion 46. This causes the component 5 to be fully pressure bonded.

[0086] Fig. 6 is a diagram showing an example of the configuration of the detection unit 71, the movement unit 76, and the cleaning unit 77. In the example shown in Fig. 6, a foreign object 91 is attached to the detection target position on the support surface 46a of the lower receiving portion 46.

[0087] As described above, the detection unit 71 includes the imaging unit 72, the first light source 73, the second light source 74, and the main body 75. As shown in FIG. 6 , the imaging unit 72, the first light source 73, and the second light source 74 are arranged along one direction on the lower side of the main body 75. The one direction is, for example, the positive direction in the X-axis direction, which is the longitudinal direction of the support 46. The imaging unit 72 is arranged to image the lower side, i.e., to image the support surface 46a of the support 46. The imaging unit 72 acquires a two-dimensional image by imaging the support surface 46a of the support 46. The first light source 73 and the second light source 74 are each arranged to illuminate the lower side, i.e., to illuminate the support surface 46a of the support 46. Specifically, the first light source 73 is arranged rearward of the imaging unit 72 in the above-mentioned one direction and irradiates the support surface 46a of the support 46 with first irradiation light. The second light source 74 is disposed forward in the aforementioned direction relative to the imaging unit 72, and irradiates the second irradiation light onto the support surface 46a of the lower receiving part 46. In other words, the first light source 73 and the second light source 74 are light sources that can irradiate the support surface 46a with two types of irradiation light that have different irradiation conditions.

[0088] The moving unit 76 moves the detection unit 71 in the X-axis direction. That is, the moving unit 76 moves the detection unit 71 in one direction along the support surface 46a of the receiving unit 46. The moving unit 76 includes a moving drive unit 76a and a moving shaft 76b. The moving shaft 76b is movably attached to the moving drive unit 76a along the X-axis direction. The detection unit 71 is fixed to the end of the moving shaft 76b on the positive side in the X-axis direction. The moving drive unit 76a includes an actuator such as a motor, and moves the moving shaft 76b in the X-axis direction. That is, the moving drive unit 76a pulls the moving shaft 76b out in the positive side of the X-axis direction and, conversely, pulls it in in the negative side. As the moving drive unit 76a moves the moving shaft 76b, the detection unit 71 moves above the support surface 46a of the receiving unit 46 along the longitudinal direction of the receiving unit 46. That is, the moving unit 76 moves the detecting unit 71 in the X-axis direction.

[0089] The detection unit 71 detects the state of the support surface 46a of the lower receiving part 46 when moving in the positive side of the X-axis direction, i.e., in one direction. For example, the detection unit 71 detects the state of the support surface 46a by capturing an image of the foreign object 91 adhering to the support surface 46a using the imaging unit 72. Specifically, the detection unit 71 captures an image of the foreign object 91 irradiated with the first irradiation light, and then captures an image of the foreign object 91 irradiated with the second irradiation light, thereby detecting the state of the support surface 46a.

[0090] The cleaning unit 77 includes a cleaning tool 77a, a tool shaft 77b, and a tool driver 77c. The tool shaft 77b holds the cleaning tool 77a aligned in the Y-axis direction. One end of the cleaning tool 77a is fixed to one end of the tool shaft 77b. The other end of the tool shaft 77b is movably attached to the tool driver 77c. The tool driver 77c includes an actuator, such as a motor, and moves the tool shaft 77b in the X-axis direction. The tool driver 77c retracts the tool shaft 77b toward the negative side and the positive side of the X-axis. As the tool driver 77c moves the tool shaft 77b, the cleaning tool 77a rubs against the support surface 46a of the support member 46 and moves along the longitudinal direction of the support member 46. As a result, the support surface 46a of the support member 46 is cleaned, and foreign matter 91 is removed from the support surface 46a.

[0091] When the control unit 2a in this embodiment determines that there is foreign matter 91 at the detection target position based on the detection result of the state of the support surface 46a, it causes the cleaning unit 77 to clean the detection target position. This makes it possible to remove the foreign matter 91 adhering to the support surface 46a, thereby improving the quality of the mounted substrates produced by pressure-bonding the components 5 to the substrate 3. This makes it possible to improve the yield of the mounted substrates.

[0092] [Cleaning section configuration] Fig. 7 is a diagram showing a specific example of the cleaning unit 77. Note that Fig. 7(a) shows the cleaning unit 77 and the lower receiving unit 46 as viewed from above, and Fig. 7(b) shows the cleaning unit 77 and the lower receiving unit 46 as viewed from the front.

[0093] The cleaning tool 77a of the cleaning unit 77 is a tool for cleaning the under-receiving portion 46, and is, for example, a cylindrical brush as shown in FIGS. 7A and 7B. The component crimping device 100 of this embodiment also includes a foreign matter removal unit 81 that removes foreign matter 91 adhering to the cleaning tool 77a, for example, by suction. The foreign matter removal unit 81 includes a first foreign matter removal unit 81a and a second foreign matter removal unit 81b. For example, the first foreign matter removal unit 81a and the second foreign matter removal unit 81b have the same configuration. Furthermore, as shown in FIG. 7B, the first foreign matter removal unit 81a and the second foreign matter removal unit 81b are disposed below the support surface 46a of the under-receiving portion 46. Furthermore, the first foreign matter removal unit 81a and the second foreign matter removal unit 81b are disposed along the longitudinal direction of the under-receiving portion 46, sandwiching the under-receiving portion 46 therebetween. That is, the first foreign matter removal section 81a and the second foreign matter removal section 81b are disposed on both ends of the lower receiving section 46 in the longitudinal direction.

[0094] Here, suction holes h are formed in the upper surface, which is the surface on the positive side in the Z axis direction, of each of the first foreign matter removal unit 81a and the second foreign matter removal unit 81b. Each of the first foreign matter removal unit 81a and the second foreign matter removal unit 81b is connected to, for example, a suction pump, which uses the suction pump to suck air around the openings of the suction holes h. In other words, when a cleaning tool 77a is placed near the openings of the suction holes h, each of the first foreign matter removal unit 81a and the second foreign matter removal unit 81b removes the foreign matter 91 from the cleaning tool 77a by sucking in the foreign matter 91 adhering to the cleaning tool 77a.

[0095] The cleaning unit 77 alternately performs a cleaning operation and a retraction operation. The cleaning operation is an operation in which the cleaning tool 77a is moved along the longitudinal direction of the lower receiving portion 46 while rubbing against the support surface 46a of the lower receiving portion 46. The retraction operation is an operation in which the cleaning tool 77a is retracted to a retracted position that is below the support surface 46a of the lower receiving portion 46 and where the foreign matter 91 is removed by the foreign matter removal unit 81. Here, the retracted position is a position near the opening of the suction hole h of each of the first foreign matter removal unit 81a and the second foreign matter removal unit 81b.

[0096] Specifically, as shown in FIG. 7A, the tool shaft 77b is formed, for example, in a substantially L-shape when viewed from the Z-axis direction positive side, and holds the cleaning tool 77a in a state aligned with the Y-axis direction. The tool driver 77c moves the tool shaft 77b in the X-axis direction and the Z-axis direction. That is, the tool driver 77c moves the tool shaft 77b not only in the X-axis direction but also in the Z-axis direction positive and negative directions, as shown in FIG. 7B. As the tool driver 77c moves the tool shaft 77b, the cleaning tool 77a rubs against the support surface 46a of the receiver 46 while moving along the longitudinal direction of the receiver 46, and is retracted to the retracted position.

[0097] [Determining the presence or absence of foreign matter] Component crimping apparatus 100 in this embodiment determines whether foreign matter 91 is present or not based on the detection result from detector 71.

[0098] Fig. 8 is a diagram for explaining the first image capture. In the example shown in Fig. 8(a), a foreign object 91 is attached to the detection target position on the support surface 46a of the lower receiving portion 46. In the example shown in Fig. 8(b), a stain or other dirt 92 is attached to the detection target position. In the example shown in Fig. 8(c), a defect 93 such as a scratch is present at the detection target position.

[0099] 8(a) to 8(c), the imaging unit 72 captures an image of the detection target position on the support surface 46a when the first light source 73 is irradiating the support surface 46a of the lower receiving part 46 with the first irradiation light. At this time, the first irradiation light is directed toward the detection target position from above the detection target position and from the negative side in the X-axis direction.

[0100] 8(a), foreign matter 91 is attached to support surface 46a so as to protrude from support surface 46a. Therefore, in first image P1, which is a two-dimensional image obtained by the first imaging when foreign matter 91 is attached to the detection target position on support surface 46a, support surface 46a is displayed as image 46a', and foreign matter 91 is displayed as image 91'. Because foreign matter 91 protrudes from support surface 46a, the portion of image 91' of foreign matter 91 on the negative side in the X-axis direction appears brighter than the portion on the positive side in the X-axis direction.

[0101] 8(b), the stain 92 is attached to the support surface 46a without protruding from the support surface 46a. Therefore, in the first image P1, which is a two-dimensional image obtained by the first imaging when the stain 92 is attached to the detection target position on the support surface 46a, the support surface 46a is displayed as an image 46a', and the stain 92 is displayed as an image 92'. However, because the stain 92 does not protrude from the support surface 46a as much as the foreign matter 91, the image 92' of the stain 92 is displayed with a relatively uniform brightness.

[0102] 8(c), the defect 93 is recessed relative to the support surface 46a. Therefore, in the first image P1, which is a two-dimensional image obtained by the first imaging when the defect 93 is located at the detection target position on the support surface 46a, the support surface 46a is displayed as an image 46a', and the defect 93 is displayed as an image 93'. Here, because the defect 93 is recessed relative to the support surface 46a, the portion of the image 93' of the defect 93 on the negative side in the X-axis direction appears darker than the portion on the positive side in the X-axis direction.

[0103] Fig. 9 is a diagram for explaining the second imaging. As in Fig. 8, in the example shown in Fig. 9(a), a foreign object 91 is attached to the detection target position on the support surface 46a of the lower receiving portion 46. In the example shown in Fig. 9(b), a stain or other dirt 92 is attached to the detection target position. In the example shown in Fig. 9(c), a defect 93 such as a scratch is present at the detection target position.

[0104] 9(a) to 9(c), in the second imaging, the imaging unit 72 captures an image of the detection target position on the support surface 46a while the second light source 74 is irradiating the support surface 46a of the lower receiving part 46 with the second irradiation light. At this time, the second irradiation light is directed toward the detection target position from above the detection target position and from the positive side in the X-axis direction.

[0105] 9(a), foreign matter 91 is attached to support surface 46a so as to protrude from support surface 46a. Therefore, in second image P2, which is a two-dimensional image obtained by the second imaging when foreign matter 91 is attached to the detection target position on support surface 46a, support surface 46a is displayed as image 46a', and foreign matter 91 is displayed as image 91'. Because foreign matter 91 protrudes from support surface 46a, the portion of image 91' of foreign matter 91 on the negative side in the X-axis direction appears darker than the portion on the positive side in the X-axis direction.

[0106] 9(b), the stain 92 is attached to the support surface 46a without protruding from the support surface 46a. Therefore, in the second image P2, which is a two-dimensional image obtained by the second imaging when the stain 92 is attached to the detection target position on the support surface 46a, the support surface 46a is displayed as an image 46a', and the stain 92 is displayed as an image 92'. However, because the stain 92 does not protrude from the support surface 46a as much as the foreign matter 91, the image 92' of the stain 92 is displayed with a relatively uniform brightness.

[0107] 9(c), the defect 93 is recessed relative to the support surface 46a. Therefore, in the second image P2, which is a two-dimensional image obtained by the second imaging when the defect 93 is located at the detection target position on the support surface 46a, the support surface 46a is displayed as an image 46a', and the defect 93 is displayed as an image 93'. Here, because the defect 93 is recessed relative to the support surface 46a, the portion of the image 93' of the defect 93 on the negative side in the X-axis direction appears brighter than the portion on the positive side in the X-axis direction.

[0108] Therefore, the control unit 2a in this embodiment generates a difference image based on the results of the first and second images taken in order to determine whether or not foreign matter 91, which is neither dirt 92 nor defect 93, is present on the support surface 46a of the receiving part 46. Then, the control unit 2a determines whether or not foreign matter 91 is present on the support surface 46a based on the difference image.

[0109] FIG. 10 is a diagram for explaining a method for determining whether or not a foreign substance 91 is present.

[0110] The control unit 2a generates a difference image P0 by subtracting the first image P1 shown in Fig. 10(b), i.e., the first image P1 obtained by the first imaging, from the second image P2 shown in Fig. 10(a), i.e., the second image P2 obtained by the second imaging. Then, if there is an area 90 in the difference image P0 that becomes brighter from the negative side to the positive side in the X-axis direction, the control unit 2a determines that a foreign object 91 is present at the detection position.

[0111] As described above, when a foreign substance 91 is present at the detection position, the portion of the image 91' included in the first image P1 on the negative side of the X axis appears brighter than the portion on the positive side of the X axis. Conversely, the portion of the image 91' included in the second image P2 on the negative side of the X axis appears darker than the portion on the positive side of the X axis. Therefore, in the difference image P0 obtained by subtracting the first image P1 from the second image P2, the region 90 corresponding to the detection position has a stronger contrast between light and dark than the image 91' included in the second image P2. In other words, the portion on the negative side of the X axis appears darker with higher contrast than the portion on the positive side of the X axis. Therefore, the control unit 2a can easily find the region 90 in the difference image P0 that becomes brighter from the negative side to the positive side of the X axis, and can accurately determine the presence of a foreign substance 91 at the detection position.

[0112] On the other hand, if a stain 92 is present at the detection position, the difference image P0 generated as described above does not contain the region 90 that becomes brighter from the negative side to the positive side in the X-axis direction. Therefore, the control unit 2a can prevent erroneous determination that a foreign substance 91 is present at the detection position based on the difference image P0.

[0113] Furthermore, when a defect 93 is present at the detection position, the difference image P0 generated as described above does not include an area 90 that becomes brighter from the negative side to the positive side in the X-axis direction, but instead includes an area that becomes darker from the negative side to the positive side in the X-axis direction. Therefore, the control unit 2a can prevent erroneous determination that a foreign object 91 is present at the detection position based on the difference image P0.

[0114] The control unit 2a may align the first image P1 and the second image P2 so that the positions of the respective images 91' coincide with each other, and generate the difference image P0.

[0115] 11 is a diagram for explaining the timing and state of movement of the detection unit 71 and the first and second image captures. In the example shown in FIG. 11, a foreign object 91 is attached to the detection target position on the support surface 46a of the lower receiving portion 46.

[0116] As shown in FIGS. 11A and 11B, the detection unit 71 performs first and second image capture while moving in one direction, i.e., in the positive X-axis direction, by driving the moving unit 76. For example, the image capture unit 72 of the detection unit 71 performs the first image capture at time t=t1 and the second image capture at time t=t2 (t2>t1). In the first image capture, the irradiation angle of the first irradiation light emitted from the first light source 73 at the detection target position is θ1. In the second image capture, the irradiation angle of the second irradiation light emitted from the second light source 74 at the detection target position is θ1. The irradiation angle is the angle between the optical axis of the first irradiation light or the second irradiation light and the support surface 46a of the support portion 46. The control unit 2a determines the presence or absence of a foreign substance 91 adhering to the detection target position on the support surface 46a based on the difference between the first image P1 obtained by the first image capture and the second image P2 obtained by the second image capture, i.e., the difference image P0.

[0117] As described above, in this embodiment, the control unit 2a causes the moving unit 76 to move the detection unit 71 in one direction, while causing the imaging unit 72 to perform a first imaging that is an imaging of the detection target position irradiated with the first irradiation light and a second imaging that is an imaging of the detection target position irradiated with the second irradiation light, as detection of the state of the support surface 46a. Then, the control unit 2a determines the presence or absence of a foreign object 91 adhering to the detection target position so as to protrude from the support surface 46a, based on the difference between the first image P1 that is a two-dimensional image acquired by the first imaging and the second image P2 that is a two-dimensional image acquired by the second imaging.

[0118] When a foreign object 91 is attached to the detection target position so as to protrude from the support surface 46a of the receiving portion 46, a region 90 having a different light and dark pattern from stains 92 or defects 93 appears at a position corresponding to the detection target position in a differential image P0, which is the difference between the first image P1 and the second image P2. Therefore, in this embodiment, the presence or absence of the foreign object 91 is determined based on this differential image P0, thereby improving the accuracy of the determination. In other words, an abnormality due to the attachment of the foreign object 91 can be determined separately from an abnormality due to stains 92 or defects 93 on the support surface 46a. Therefore, the type of abnormality can be appropriately determined.

[0119] Furthermore, in this embodiment, the control unit 2a controls the detection unit 71 and the moving unit 76 so that the irradiation angle of the first irradiation light to the detection target position when the first imaging is performed and the irradiation angle of the second irradiation light to the detection target position when the second imaging is performed are approximately the same angle θ1.

[0120] As a result, since the irradiation angle in the first image capture is approximately the same as the irradiation angle in the second image capture, abnormalities due to the adhesion of foreign matter 91 can be more clearly distinguished from abnormalities due to stains 92 or defects 93 on the support surface 46a, and abnormalities due to the adhesion of foreign matter 91 can be determined with high accuracy.

[0121] For example, while causing the moving unit 76 to move the imaging unit 72 in one direction, the control unit 2a causes the first light source 73 to emit the first irradiation light when the irradiation angle of the first irradiation light at the detection target position becomes angle θ1, and causes the imaging unit 72 to capture an image of the detection target position. This results in a first image being captured. Thereafter, while causing the moving unit 76 to further move the imaging unit 72 in one direction, the control unit 2a causes the second light source 74 to emit the second irradiation light when the irradiation angle of the second irradiation light at the detection target position becomes angle θ1, and causes the imaging unit 72 to capture an image of the detection target position. This results in a second image being captured. In other words, in this embodiment, the control unit 2a causes the imaging unit 72 to capture the first image and the second image at different times.

[0122] This makes it possible to more clearly distinguish between abnormalities caused by stains 92 or defects 93 on the support surface and determine abnormalities caused by the adhesion of foreign matter 91 than when the first and second imaging are performed at the same time. Furthermore, the irradiation angle in the first imaging and the irradiation angle in the second imaging can be easily made closer to each other, making it possible to determine abnormalities caused by the adhesion of foreign matter 91 with high accuracy.

[0123] Fig. 12 is a diagram showing an example of the arrangement of the imaging unit 72, the first light source 73, and the second light source 74. In the example shown in Fig. 12, a foreign object 91 is attached to the detection target position on the support surface 46a of the lower receiving portion 46.

[0124] For example, as shown in FIG. 11, the irradiation angle of the first irradiation light at the detection target position and the irradiation angle of the second irradiation light at the detection target position are substantially the same angle θ1. That is, the irradiation angles of the first irradiation light and the second irradiation light are each θ1. In such a case, the imaging unit 72, the first light source 73, and the second light source 74 are disposed as shown in FIG. 12(a), for example. That is, the first distance L1, which is the distance from the imaging unit 72 to the first light source 73 in the X-axis direction, is longer than the second distance L2, which is the distance from the imaging unit 72 to the second light source 74 in the X-axis direction. The relational expression L2 = L1 - V × t is satisfied. Here, V is the moving speed of the detection unit 71 in one direction, and t is the time between the time t = t1 when the first image is captured and the time t = t2 when the second image is captured.

[0125] That is, in this embodiment, the first distance L1, which is the distance between the imaging unit 72 and the first light source 73, is longer than the second distance L2, which is the distance between the imaging unit 72 and the second light source 74. The control unit 2a then causes the imaging unit 72 to perform the first imaging and then the second imaging. This makes it easier to perform the first imaging and the second imaging at different times and at approximately the same illumination angle while moving the detection unit 71. As a result, the type of the foreign matter 91 can be more appropriately determined. Furthermore, when the first distance is L1, the second distance is L2, the movement speed of the detection unit 71 moved by the movement unit 76 is V, and the time difference between the first imaging and the second imaging is t, the relational expression L2 = L1 - V × t is satisfied. This makes it possible to perform the first imaging and the second imaging at different times and at approximately the same illumination angle while moving the detection unit 71. As a result, the type of the foreign matter 91 can be more appropriately determined.

[0126] In the above example, the first imaging is performed before the second imaging, but the first imaging may be performed after the second imaging, i.e., the second imaging may be performed at time t=t1 and the first imaging may be performed at time t=t2.

[0127] In this case, as shown in FIG. 12(b), the irradiation angle of the first irradiation light at the detection target position and the irradiation angle of the second irradiation light at the detection target position are substantially the same angle θ2. That is, the irradiation angles of the first irradiation light and the second irradiation light are each θ2. The imaging unit 72, the first light source 73, and the second light source 74 are disposed, for example, as shown in FIG. 12(b). That is, the first distance L1, which is the distance from the imaging unit 72 to the first light source 73 in the X-axis direction, is shorter than the second distance L2, which is the distance from the imaging unit 72 to the second light source 74 in the X-axis direction. The relational expression L1=L2-V×t is satisfied.

[0128] That is, in this embodiment, the first distance L1, which is the distance between the imaging unit 72 and the first light source 73, may be shorter than the second distance L2, which is the distance between the imaging unit 72 and the second light source 74. In this case, the control unit 2a causes the imaging unit 72 to perform the second imaging and then the first imaging. Even in this case, the first imaging and the second imaging can be easily performed at different times and at approximately the same illumination angle while moving the detection unit 71. As a result, the type of the foreign matter 91 can be more appropriately determined. Furthermore, when the first distance is L1, the second distance is L2, the movement speed of the detection unit 71 moved by the movement unit 76 is V, and the time difference between the first imaging and the second imaging is t, the relational expression L1 = L2 - V × t may be satisfied. This allows the first imaging and the second imaging to be performed at different times and at approximately the same illumination angle while moving the detection unit 71. As a result, the type of the foreign matter 91 can be more appropriately determined.

[0129] In the above example, the first distance L1 and the second distance L2 are different, but they may be the same. In such a case, for example, as shown in FIG. 12(c), the irradiation angle of the first irradiation light at the detection target position and the irradiation angle of the second irradiation light at the detection target position are substantially the same angle θ3. That is, the irradiation angles of the first irradiation light and the second irradiation light are θ3. The imaging unit 72, the first light source 73, and the second light source 74 are disposed, for example, as shown in FIG. 12(c). That is, the first distance L1, which is the distance from the imaging unit 72 to the first light source 73 in the X-axis direction, is substantially equal to the second distance L2, which is the distance from the imaging unit 72 to the second light source 74 in the X-axis direction. Note that in the example of FIG. 12(c), the first imaging is performed at time t=t1, and then the second imaging is performed at time t=t2. However, conversely, the second imaging may be performed at time t=t1, and then the first imaging may be performed at time t=t2. Even in this case, the irradiation angle of the first irradiation light onto the detection target position and the irradiation angle of the second irradiation light onto the detection target position are substantially the same angle.

[0130] FIG. 13 is a flowchart showing an example of the maintenance processing operation by component crimping apparatus 100 according to this embodiment.

[0131] The control unit 2a first controls the detection unit 71 and the movement unit 76 to cause the imaging unit 72 to perform a first imaging (step S11), and then causes the imaging unit 72 to perform a second imaging (step S12). Note that the first imaging may be performed after the second imaging.

[0132] Next, the control unit 2a generates a difference image P0 between the first image P1 obtained by the first imaging and the second image P2 obtained by the second imaging (step S13).Then, the control unit 2a determines whether or not a foreign object 91 is present at the detection target position on the support surface 46a of the lower receiving part 46 based on the difference image P0 (step S14).

[0133] If the control unit 2a determines that the foreign matter 91 is present (Yes in step S14), it causes the cleaning unit 77 to clean the support surface 46a (step S15). On the other hand, if the control unit 2a determines that the foreign matter 91 is not present (No in step S14), it ends the maintenance of the support surface 46a of the receiving part 46.

[0134] As described above, in this embodiment, the presence or absence of foreign matter 91 adhering to the support surface 46a of the lower receiving portion 46 can be appropriately determined, distinguishing it from stains 92, defects 93, and the like.

[0135] (Embodiment 2) The component mounting line 1 and component crimping device 100 in this embodiment have the same configuration as those in the first embodiment. Furthermore, the control unit 2a in this embodiment executes not only the processing operations performed by the control unit 2a in the first embodiment but also other processing operations. That is, the control unit 2a in this embodiment executes a first determination process, and then executes a determination process similar to that in the first embodiment, i.e., a second determination process for determining the presence or absence of a foreign substance 91. Note that, of the components in this embodiment, the same components as those in the first embodiment are assigned the same reference numerals as those in the first embodiment, and detailed description thereof will be omitted.

[0136] FIG. 14 is a diagram for explaining the outline of the processing operation of the component crimping device 100 in the present embodiment. In the example shown in FIG. 14, a foreign object 91 is attached to the detection target position on the support surface 46a of the lower receiving portion 46.

[0137] First, as shown in (a) of FIG. 14, the control unit 2a of the component crimping device 100 in the present embodiment controls the detection unit 71 and the moving unit 76 at time t = t0 (t0 < t1) to perform a first determination process. Specifically, the control unit 2a causes the moving unit 76 to move the detection unit 71 in the positive X-axis direction. While the detection unit 71 is moving, the control unit 2a turns on the first light source 73 and the second light source 74 and causes the imaging unit 72 to perform imaging. The imaging by the imaging unit 72 at this time is also called abnormal determination imaging. Thereby, the imaging unit 72 sequentially images, as detection target positions, each position from the negative end to the positive end in the X-axis direction on the support surface 46a of the lower receiving portion 46, which is illuminated by the first light source 73 and the second light source 74. Then, the control unit 2a performs a first determination process for determining the presence or absence of an abnormality on the support surface 46a by determining whether there is a region different from the surrounding brightness in the image obtained by the abnormal determination imaging. For example, if there is a region different from the surrounding brightness, the control unit 2a determines that there is an abnormality at the position corresponding to that region (i.e., the detection target position) on the support surface 46a of the lower receiving portion 46. That is, it is determined that there is an abnormality at the detection target position due to a foreign object 91, dirt 92, or a defect 93. Therefore, it has not been determined which of the foreign object 91, dirt 92, and defect 93 the abnormality is caused by. The image obtained by the abnormal determination imaging is also called an abnormal determination image and may be a moving image.

[0138] When the control unit 2a determines that an abnormality exists at the detection target position, the control unit 2a then causes the moving unit 76 to move the detection unit 71 toward the negative side in the X-axis direction, as shown in (b-1) and (b-2) of FIG. 14. While the detection unit 71 is moving in this manner, the control unit 2a performs a second determination process. That is, at time t=t1, the control unit 2a causes the second light source 74 to irradiate the detection target position with the second irradiation light and causes the imaging unit 72 to perform the second imaging. Furthermore, at time t=t2, the control unit 2a causes the first light source 73 to irradiate the detection target position with the first irradiation light and causes the imaging unit 72 to perform the first imaging. Then, the control unit 2a generates a differential image P0, which is the difference between the first image P1 obtained by the first imaging and the second image P2 obtained by the second imaging. As in the first embodiment, the control unit 2a determines, based on the difference image P0, whether or not a foreign substance 91 is attached to the detection target position determined to have an abnormality in the first determination process.

[0139] 14(b-1) and 14(b-2), the one direction in the first embodiment is the negative side in the X-axis direction. The first irradiation angle in the first image capture and the second irradiation angle in the second image capture are substantially the same angle θ1. Note that in this example, unlike the first embodiment, the one direction is the negative side in the X-axis direction, so the first image capture is performed after the second image capture.

[0140] FIG. 15 is a flowchart showing an example of the maintenance processing operation by component crimping apparatus 100 according to this embodiment.

[0141] First, the control unit 2a controls the detection unit 71 and the movement unit 76 to execute a first determination process. That is, the control unit 2a causes the movement unit 76 to move the detection unit 71 toward the positive side in the X-axis direction while causing the image capture unit 72 to perform image capture for abnormality determination (step S1). Then, the control unit 2a determines whether or not an abnormality exists on the support surface 46a of the support unit 46 based on the image for abnormality determination obtained by the image capture for abnormality determination (step S2). If the control unit 2a determines that an abnormality exists (Yes in step S2), it executes the processes of steps S11 to S14 for the detection target position where an abnormality has been determined to exist, as in the first embodiment. That is, the control unit 2a executes a second determination process. Then, if the control unit 2a determines that the abnormality determined in step S2 is caused by the foreign matter 91, that is, that the foreign matter 91 exists at the detection target position on the support surface 46a (Yes in step S14), it causes the cleaning unit 77 to clean the support surface 46a (step S15).

[0142] On the other hand, when the control unit 2a determines that there is no abnormality in the support surface 46a (No in step S2), the control unit 2a ends the maintenance of the support surface 46a of the lower receiving portion 46.

[0143] As described above, in this embodiment, control unit 2a controls detection unit 71 and performs a first determination process and a second determination process based on the state detected by detection unit 71. In the first determination process, control unit 2a determines whether or not there is an abnormality in support surface 46a of lower receiving portion 46. Furthermore, in the second determination process, if control unit 2a determines that there is an abnormality in the first determination process, control unit 2a determines whether or not the abnormality is caused by foreign matter 91 adhering to support surface 46a so as to protrude from support surface 46a.

[0144] For example, if the first determination process determines that there is no abnormality, then no foreign matter 91 is attached to the support surface 46a, and there are no stains 92, defects 93, or the like on the support surface 46a. Therefore, in this embodiment, if the first determination process determines that there is no abnormality, then the second determination process is not executed. This reduces the frequency with which the second determination process is executed to check whether the foreign matter 91 is attached to the support surface 46a. For example, if such a check is required repeatedly, the frequency with which the second determination process is executed can be significantly reduced. Furthermore, since the time or load required for the first determination process tends to be smaller than the time or load required for the second determination process, the time and load required to check whether the foreign matter 91 is attached to the support surface 46a can be effectively reduced. As a result, the attachment of the foreign matter 91 can be effectively determined.

[0145] More specifically, in the first determination process, the controller 2a causes the imaging unit 72 to capture an image of the detection target position on the support surface 46a as a detection of the state of the support surface 46a, and determines whether or not an abnormality exists at the detection target position based on the abnormality determination image obtained by the image capture. Then, in the second determination process, if the controller 2a determines that an abnormality exists at the detection target position in the first determination process, the controller 2a causes the imaging unit 72 to capture a first image of the detection target position illuminated with one of the two irradiation lights and a second image of the detection target position illuminated with the other of the two irradiation lights as a detection of the state of the support surface 46a. The two irradiation lights are the first irradiation light and the second irradiation light. Then, the controller 2a determines whether or not the abnormality is caused by the foreign matter 91 based on the difference between the first image P1 acquired by the first imaging and the second image P2 acquired by the second imaging.

[0146] When a foreign object 91 is attached to the detection target position so as to protrude from the support surface 46a of the receiving portion 46, a region 90 having a different light and dark pattern from stains 92 or defects 93 appears at a position corresponding to the detection target position in a differential image P0, which is the difference between the first image P1 and the second image P2. Therefore, in this embodiment, whether or not an abnormality is caused by the foreign object 91 is determined based on this differential image P0, thereby improving the accuracy of the determination. In other words, an abnormality caused by the attachment of the foreign object 91 can be determined separately from an abnormality caused by stains 92 or defects 93 on the support surface 46a. Therefore, the attachment of the foreign object 91 can be appropriately determined.

[0147] Then, when the control unit 2a determines in the second determination process that the abnormality is caused by the foreign matter 91, it causes the cleaning unit 77 to clean the detection target position on the support surface 46a. This makes it possible to remove the foreign matter 91 adhering to the support surface 46a, thereby improving the quality of the mounted substrates produced by pressure-bonding the components 5 to the substrate 3. This therefore makes it possible to improve the yield of the mounted substrates.

[0148] In the above example, if the control unit 2a determines that an abnormality exists in the first determination process, the control unit 2a always executes the second determination process. For example, even if the second determination process was previously executed and it was determined as a result that the abnormality at the detection target position was not caused by the foreign matter 91, if the first determination process again determines that an abnormality exists at that detection target position, the control unit 2a executes the second determination process. As a result, if the first determination process is repeatedly executed when there is a defect 93 at the detection target position, the second determination process is always executed after the first determination process, even though there is a sufficiently high possibility that the abnormality determined to exist in the first determination process is not caused by the foreign matter 91.

[0149] Therefore, the control unit 2a may reduce the frequency with which the second determination process is performed by using past results of the second determination process as a history.

[0150] FIG. 16 is a diagram illustrating an example of the determination history data.

[0151] The storage unit 2b of the computer 2 of the component crimping apparatus 100 stores, for example, the determination history data d1 shown in FIG.

[0152] This determination history data d1 indicates the results of the past first determination process and second determination process at each detection target position. Specifically, as shown in Fig. 16, the determination history data d1 indicates "yes" or "no" for each detection target position on the support surface 46a of the support portion 46 as the results of the past first determination process and second determination process for that detection target position. Furthermore, the detection target position is expressed by a combination of any one of positions X1 to X4 in the X-axis direction and any one of positions Y1 to Y4 in the Y-axis direction.

[0153] "Present" means that the first determination process determined that there is an abnormality at the detection target position, and the second determination process determined that the abnormality is not caused by the foreign matter 91. In other words, "present" means that there is no foreign matter 91 attached to the detection target position, but there is a stain 92 or a defect 93, in other words, there is an abnormality that is not caused by the foreign matter 91. Note that "present" is also called non-foreign matter history.

[0154] On the other hand, "absent" means that the first determination process has not been performed on the detection position, or that the first determination process has determined that there is no abnormality at the detection position. Alternatively, "absent" means that the first determination process has determined that there is an abnormality at the detection position, and that the second determination process has determined that the abnormality is caused by foreign matter 91, but that foreign matter 91 has been removed by cleaning. In other words, "absent" means that the state of the detection position is unknown, or that there is no foreign matter 91 attached to the detection position, and that there is neither dirt 92 nor defect 93.

[0155] When the control unit 2a determines in the first determination process that there is an abnormality at the detection target position, it reads out the determination history data d1 from the storage unit 2b and identifies the determination result associated with the detection target position in the determination history data d1. If the identified determination result is "yes," the control unit 2a does not perform the second determination process for the detection target position, and if the identified determination result is "no," it performs the second determination process for the detection target position.

[0156] FIG. 17 is a flowchart showing another example of the maintenance processing operation by the component crimping apparatus 100 according to this embodiment.

[0157] First, the control unit 2a performs the first determination process as described above (steps S1 and S2). If the control unit 2a determines that there is no abnormality (No in step S2), it ends maintenance on the support surface 46a of the support portion 46. On the other hand, if the control unit 2a determines that there is an abnormality (Yes in step S2), it refers to the determination history data d1 and determines whether or not the determination history data d1 indicates a non-foreign object history for the detection target position where it has been determined that there is an abnormality (step S4). In other words, the control unit 2a determines whether or not "present" is associated with the detection target position in the determination history data d1.

[0158] Here, if the control unit 2a determines that the determination history data d1 indicates a non-foreign matter history (Yes in step S4), that is, if it determines that "present" is associated with the detection target position, it determines that the abnormality determined to be present in the first determination process is not caused by the foreign matter 91. As a result, the control unit 2a ends the maintenance of the support surface 46a of the lower receiving portion 46.

[0159] On the other hand, if the control unit 2a determines that no non-foreign substance history is indicated in the determination history data d1 (No in step S4), that is, if it determines that "absent" is associated with the detection target position, it executes the processes of steps S11 to S14, as in the first embodiment. That is, the control unit 2a executes the second determination process. Then, if the control unit 2a determines that a foreign substance 91 is present (Yes in step S14), it causes the cleaning unit 77 to clean the support surface 46a (step S15). On the other hand, if the control unit 2a determines that a foreign substance 91 is not present (No in step S14), it updates the determination history data d1 (step S16). Specifically, the control unit 2a writes the non-foreign substance history (i.e., "present") in association with the above-mentioned detection target position into the determination history data d1.

[0160] As described above, in this embodiment, the storage unit 2b stores determination history data d1 that indicates, as a history, the results of the first determination process and the second determination process that have been performed in the past. If the control unit 2a determines that an abnormality exists in the first determination process, the control unit 2a determines whether the determination history data d1 indicates, as a non-foreign object history, that there is an abnormality at the detection target position that is not caused by the foreign object 91. If the control unit 2a determines that there is a non-foreign object history, the control unit 2a determines that the abnormality determined to exist in the first determination process is not caused by the foreign object 91, without performing the second determination process.

[0161] As a result, even if the first determination process determines that foreign matter 91 is present, if a non-foreign matter history is indicated, the second determination process is not performed and it is determined that the abnormality is not caused by foreign matter 91. Therefore, the frequency with which the second determination process is performed can be further reduced. In other words, if the first determination process determines that there is an abnormality due to the presence of stain 92 or defect 93 on the support surface 46a of the lower receiving portion 46, and if the second determination process determines that the abnormality is not caused by foreign matter 91, then even if the first determination process determines that there is an abnormality, it can be determined that the abnormality is not caused by foreign matter 91 without performing the second determination process. As a result, it is possible to more effectively determine the adhesion of foreign matter 91.

[0162] Furthermore, if the control unit 2a determines that the determination history data d1 does not indicate any non-foreign object history for the detection target position, the control unit 2a performs a second determination process. That is, if "absent" is associated with the detection target position in the determination history data d1, the control unit 2a performs the second determination process. This allows the control unit 2a to appropriately determine whether the abnormality is caused by the foreign object 91.

[0163] Furthermore, if the first determination process determines that an abnormality exists at the detection target position, and the second determination process determines that the abnormality is not caused by the foreign object 91, the control unit 2a updates the determination history data d1 so that the detection target position indicates a non-foreign object history. In other words, "present" is associated with the detection target position in the determination history data d1. This allows the results of the first determination process and the second determination process that were previously performed to be reflected in the determination history data d1, thereby maintaining the determination history data d1 in an accurate state.

[0164] 14, in this embodiment, the first determination process is performed when the detection unit 71 is moving in the positive direction of the X axis, and the second determination process is performed when the detection unit 71 is moving in the negative direction of the X axis. However, the timing at which the first determination process and the second determination process are performed may be when the detection unit 71 is moving in the positive direction of the X axis, or when the detection unit 71 is moving in the negative direction of the X axis. For example, the first determination process and the second determination process may be performed at different times when the detection unit 71 is moving in the positive direction of the X axis.

[0165] 15 , after the first determination process including step S1 of causing the imaging unit 72 to perform imaging for abnormality determination, the second determination process including step S11 of causing the imaging unit 72 to perform the first imaging and step S12 of causing the imaging unit 72 to perform the second imaging is performed, but step S1 may also serve as step 11 or step 12. In other words, the image for abnormality determination obtained in step S1 in the first determination process may be reused as either the first image P1 or the second image P2 in the second determination process.

[0166] As described above, in this embodiment, adhesion of foreign matter 91 can be effectively determined by the first determination process and the second determination process.

[0167] (Variation) In the first and second embodiments, the detector 71 and the cleaning tool 77a of the cleaner 77 move independently of each other. In contrast, in this modification, the detector 71 and the cleaning tool 77a of the cleaner 77 move integrally.

[0168] Figure 18 is a diagram showing an example of a specific configuration of the maintenance unit 70 in this modified example. Note that (a) of Figure 18 shows the maintenance unit 70 and the lower receiving part 46 as seen from the front side. (b) of Figure 18 shows the maintenance unit 70 and the lower receiving part 46 as seen from above. (c) of Figure 18 shows the maintenance unit 70 and the lower receiving part 46 as seen from the positive side in the X-axis direction.

[0169] In this modification, detection unit 71 and cleaning tool 77a of cleaning unit 77 are housed in housing 82. In this modification, component crimping device 100 includes drive unit 83 instead of movement unit 76 that moves detection unit 71, and tool shaft 77b and tool drive unit 77c that move cleaning tool 77a.

[0170] As shown in (a) to (c) of Figure 18, the drive unit 83 includes a housing holding unit 84 that holds the housing 82, a circular belt 85 connected to the housing holding unit 84, and a plurality of pulleys 86 arranged on the inner side of the belt 85.

[0171] At least one of the pulleys 86 is rotated by an actuator such as a motor, circulating the belt 85. The circulation of the belt 85 causes the housing holder 84 to move along the X-axis direction. As the housing holder 84 moves, the housing 82 moves on the support surface 46a of the lower receiving part 46 along the X-axis direction.

[0172] The detection unit 71 and cleaning tool 77a included in the housing 82 are arranged along the X-axis direction. The bristles of the cleaning tool 77a may be raised and lowered in the Z-axis direction, switching between a state in which the bristles of the cleaning tool 77a are in contact with the support surface 46a and a state in which the bristles of the cleaning tool 77a are separated from the support surface 46a.

[0173] 18(a), when maintenance is not being performed, housing 82 waits in a standby position on the negative side of receiving portion 46 in the X-axis direction. When maintenance is performed, housing 82 moves from the standby position to the positive side of receiving portion 46 in the X-axis direction, and when it reaches the end of receiving portion 46, it moves in the opposite direction, i.e., to the negative side of the X-axis direction, and returns to the original standby position.

[0174] As described above, the component crimping device according to one or more aspects has been described based on the above-mentioned embodiments and modifications. However, the present disclosure is not limited to these embodiments and modifications. Various modifications conceivable by those skilled in the art to the above-mentioned embodiments and modifications may also be included within the scope of the present disclosure, provided they do not deviate from the spirit of the present disclosure. Furthermore, the above-mentioned modifications may be applied to both the first and second embodiments.

[0175] For example, in the above-described embodiments and modifications, component crimping apparatus 100 includes a final crimping unit 40, but may also include a preliminary crimping unit 30. That is, in the above-described embodiments and modifications, maintenance is performed on support surface 46a of under-receiving portion 46 of final crimping unit 40, but maintenance may also be performed on the support surface that is the upper surface of under-receiving portion 36 of preliminary crimping unit 30. This maintenance includes at least one of determining whether or not there is an abnormality, determining whether or not there is foreign matter 91, and cleaning. That is, component crimping apparatus 100 of the present disclosure is not limited to a final crimping unit 40, and may be any device that includes a member that supports substrate 3, such as under-receiving portion 46 (e.g., under-receiving portion 36, stage 23, etc.).

[0176] Furthermore, in the above-described embodiments and modifications, the substrate 3 is a liquid crystal panel to which the component 5 is temporarily and permanently pressure-bonded, but the substrate 3 may be a substrate other than a liquid crystal panel.

[0177] Furthermore, in the above-described embodiments and modifications, the cleaning tool 77a is a brush, but it may be a cloth. Furthermore, the cleaning tool 77a may be a rotating brush. That is, the cleaning tool 77a cleans the support portion 46 by moving along the X-axis direction, but it may also move while rotating. Furthermore, the bristles held by the cleaning tool 77a may be resin molded products, fibers, or wires.

[0178] In addition, in each of the above embodiments and modifications, all or some of the components of the computer 2 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded on a recording medium such as an HDD (Hard Disk Drive) or semiconductor memory. For example, the program execution unit causes the main compression bonding unit 40 to execute each of the steps shown in Figures 13, 15, and 17.

[0179] Furthermore, the components of the computer 2 may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit. The one or more electronic circuits may include, for example, a semiconductor device, an integrated circuit (IC), or a large-scale integration (LSI). The IC or LSI may be integrated on a single chip or on multiple chips. Although the terms IC and LSI are used here, the term may be changed depending on the degree of integration, and may be called a system LSI, a very large-scale integration (VLSI), or an ultra-large-scale integration (ULSI). A field-programmable gate array (FPGA), which is programmed after the LSI is manufactured, can also be used for the same purpose. [Industrial Applicability]

[0180] The present disclosure can be used, for example, in a component crimping device provided in a component mounting line that produces liquid crystal displays. [Explanation of symbols]

[0181] 1. Component mounting line 1a, 1b, 1c base 2. Computer 2a Control section 2b Storage section 3. Circuit Board 4 Electrode part 5 parts 10. Board loading area Stages 11, 23, 37, 49, and 51 20 Adhesive part 21, 31, 41 Substrate moving mechanism 22 Adhesion mechanism 30 Temporary crimping section 32 Parts mounting mechanism 33 Parts Supply Department 34, 44 Crimping Tools 35 Parts transfer section 36 Lower support 40 Crimping section 42 Crimping mechanism 46 Lower support 46a Support surface 50 Substrate unloading section 70 Maintenance Department 71 Detector 72 Imaging unit 73 1st light source 74 Second light source 75 Main body 76 Mobile Unit 76a Mobile drive unit 76b Movement axis 77 Cleaning Department 77a Cleaning Tools 77b Tool axis 77c Tool drive unit 81 Foreign matter removal section 81a 1st foreign matter removal section 81b 2nd foreign matter removal section 82 Case 83 Drive unit 84 Housing holder 85 Belt 86 Pulley 90 areas 91 Foreign object 91' statue 92 Dirt 92' statue 93 missing 93' statue 100 Component crimping device d1 Judgment history data h Suction hole P0 difference image P1 1st image P2 2nd image

Claims

1. a support portion having a support surface that supports the substrate from below in order to press-bond components to the substrate; a detection unit that detects a state of the support surface; a moving unit that moves the detection unit in one direction along the support surface; a control unit that controls the detection unit and the movement unit, The detection unit an imaging unit that captures a two-dimensional image by imaging the support surface; a first light source that is disposed rearward in the one direction relative to the imaging unit and that irradiates the support surface with first irradiation light; a second light source that is disposed on the front side of the imaging unit in the one direction and that irradiates the support surface with second irradiation light, The control unit While causing the moving unit to move the detection unit in the one direction, causing the imaging unit to perform a first imaging operation, which is an imaging operation of a detection target position irradiated with the first irradiation light, and a second imaging operation, which is an imaging operation of the detection target position irradiated with the second irradiation light, as detection of a state of the support surface; determining whether or not there is a foreign object adhering to the detection position so as to protrude from the support surface based on a difference between a first image, which is the two-dimensional image acquired by the first imaging, and a second image, which is the two-dimensional image acquired by the second imaging; Component crimping device.

2. The control unit controlling the detection unit and the movement unit so that an irradiation angle of the first irradiation light to the detection target position when the first image capture is performed and an irradiation angle of the second irradiation light to the detection target position when the second image capture is performed are the same; The component crimping device according to claim 1 .

3. The control unit causing the imaging unit to perform the first imaging and the second imaging at different timings; The component crimping device according to claim 1 or 2.

4. a first distance between the imaging unit and the first light source is longer than a second distance between the imaging unit and the second light source; The control unit causing the imaging unit to perform the first imaging and then the second imaging; The component crimping device according to claim 3 .

5. the first distance is L1 and the second distance is L2; a moving speed of the detection unit moved by the moving unit is V; When the time difference between the first imaging and the second imaging is t, The relation L2=L1-V×t is satisfied. The component crimping device according to claim 4 .

6. a first distance between the imaging unit and the first light source is shorter than a second distance between the imaging unit and the second light source; The control unit causing the imaging unit to perform the second imaging and then the first imaging; The component crimping device according to claim 3 .

7. the first distance is L1 and the second distance is L2; a moving speed of the detection unit moved by the moving unit is V; When the time difference between the first imaging and the second imaging is t, The relation L1=L2-V×t is satisfied. The component crimping device according to claim 6.

8. The component crimping device further comprises: a cleaning unit that cleans the support surface; The control unit When it is determined that the foreign object is present at the detection target position, causing the cleaning unit to clean the detection target position; The component crimping device according to claim 1 .

9. A method for determining an abnormality performed by a component crimping device, comprising: The component crimping device includes: a support portion having a support surface that supports the substrate from below in order to press-bond components to the substrate; a detection unit that detects a state of the support surface, The detection unit an imaging unit that captures a two-dimensional image by imaging the support surface; a first light source that is arranged on a rear side of the imaging unit in the one direction when the detection unit moves in the one direction along the support surface and that irradiates the support surface with first irradiation light; a second light source that is disposed on the front side of the imaging unit in the one direction and that irradiates the support surface with second irradiation light, In the abnormality determination method, While moving the detection unit in the one direction, causing the imaging unit to perform a first imaging of a detection target position irradiated with the first irradiation light and a second imaging of a detection target position irradiated with the second irradiation light, as detection of a state of the support surface; determining whether or not there is a foreign object adhering to the detection position so as to protrude from the support surface based on a difference between a first image, which is the two-dimensional image acquired by the first imaging, and a second image, which is the two-dimensional image acquired by the second imaging; Abnormality determination method.

Images