Powder supply device and powder supply method

Abstract

To provide a powder supply device and powder supply method, which allow for supplying a tiny amount of powder.SOLUTION: A powder supply device 1 for supplying powder B is provided comprising a nozzle 2, a suction device 3 for applying negative pressure to the nozzle 2, a filter tip 4 attached to an opening 22 of the nozzle 2 and provided with an adsorptive surface 41 for adsorbing the powder B, a horizontal movement mechanism 52 for horizontally moving the nozzle 2, and a lifting mechanism 53 for vertically moving the nozzle 2. The adsorptive surface 41 of the filter tip 4 is exposed from the opening 22 of the nozzle 2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a powder supplying device and a powder supplying method. [Background technology]

[0002] Patent Document 1 describes a powder pipette that accurately dispenses a predetermined amount of powder. This powder pipette includes a tip that has an internal filter and a predetermined volume between the filter and the tip, a nozzle that detachably holds the tip, a vibrator that applies vibrations to the nozzle, and a suction / discharge mechanism that applies negative or positive pressure to the nozzle. In this powder pipette, the suction / discharge mechanism applies negative pressure to the nozzle, thereby drawing powder between the filter and the tip, and the vibrator applies vibrations to the nozzle, thereby maintaining a constant bulk density of the powder drawn between the filter and the tip. This allows the predetermined amount of powder to be accurately dispensed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-158293 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a demand for weighing powders on the order of μg. To weigh powders on the order of μg, it is possible to supply minute amounts of powder to a weighing cup in several batches. A minute amount refers to, for example, approximately 5 to 500 μg. However, the powder pipette described in Patent Document 1 aspirates powder so that the powder fills the entire area between the tip and the filter, making it unsuitable for adsorbing minute amounts of powder. Furthermore, because the distance from the tip to the filter is long, the powder pipette described in Patent Document 1 requires the application of a strong negative pressure to the nozzle to adsorb the powder onto the filter. Furthermore, because the adsorption surface of the filter that adsorbs the powder is surrounded by the tip, applying a strong negative pressure to the nozzle to adsorb the powder onto the filter results in a large amount of powder being adsorbed onto the adsorption surface of the filter. This makes it difficult to adsorb and dispense minute amounts of powder. Furthermore, because the powder adheres to the inner surface of the tip due to electrostatic forces, etc., even when positive pressure is applied to the nozzle, the powder does not fall off but remains in the nozzle, resulting in significant variation in the amount of powder dispensed. In particular, when a minute amount of powder is supplied, the variation in the amount of powder supplied becomes significant.

[0005] Therefore, an object of the present disclosure is to provide a powder supplying device and a powder supplying method that are capable of supplying a minute amount of powder. [Means for solving the problem]

[0006] [1] The powder supplying device according to the present disclosure is a powder supplying device that supplies powder, and includes a nozzle, a suction device that applies negative pressure to the nozzle, and a filter tip that is attached to the opening of the nozzle and has an adsorption surface that adsorbs the powder, the adsorption surface being exposed beyond the opening of the nozzle.

[0007] In this powder supplying device, by applying negative pressure to the nozzle using a suction device, powder can be adsorbed onto the adsorption surface of the filter chip attached to the nozzle opening. By stopping the application of negative pressure to the nozzle, the powder can be dropped from the adsorption surface. Furthermore, because the adsorption surface is exposed from the nozzle opening, powder can be adsorbed onto the adsorption surface without applying strong negative pressure to the nozzle. Furthermore, because the adsorption surface is exposed from the nozzle opening, i.e., the periphery of the adsorption surface is not covered by the nozzle, excess powder can be prevented from being adsorbed onto the adsorption surface. This allows for adsorption and supply of minute amounts of powder. Moreover, because powder is not adsorbed to the inner circumferential surface of the nozzle even when electrostatic forces are generated, variation in the amount of powder supplied can be reduced. Even if powder gets between the nozzle and the filter chip, the amount is extremely small, thereby reducing variation in the amount of powder supplied. Although this powder supplying device is capable of supplying minute amounts of powder, the amount of powder supplied does not necessarily have to be minute. Furthermore, when the supply destination is a container, the powder can be prevented from scattering outside the container by inserting at least a portion of the suction surface and nozzle into the container and then allowing the powder to fall from the suction surface.

[0008] [2] In the powder supplying device described in [1], the suction surface may be disposed at a position protruding from the nozzle opening. In this powder supplying device, the suction surface is disposed at a position protruding from the nozzle opening, so that a minute amount of powder can be easily adsorbed onto the suction surface.

[0009] [3] In the powder supplying device described in [1], the adsorption surface may be located at the same position as the nozzle opening. In this powder supplying device, the adsorption surface is located at the same position as the nozzle opening, which prevents or suppresses the adsorption of powder to the outer peripheral surface of the filter chip. This allows a minute amount of powder to be adsorbed onto the adsorption surface.

[0010] [4] In the powder supplying device according to any one of [1] to [3], the diameter of the nozzle opening may be 0.03 mm or more and 5 mm or less. In this powder supplying device, the diameter of the nozzle opening is 0.03 mm or more and 5 mm or less, so that a minute amount of powder can be easily adsorbed onto the adsorption surface while preventing a decrease in ease of manufacturing the nozzle.

[0011] [5] The powder supplying device according to any one of [1] to [4] may further include a static eliminator that eliminates static electricity from at least the adsorption surface of the filter chip and the powder. In this powder supplying device, the static eliminator eliminates static electricity from at least the adsorption surface and the powder adsorbed to the adsorption surface. This prevents the powder from remaining on the adsorption surface due to electrostatic force when the application of negative pressure to the nozzle is stopped. This further reduces the variation in the amount of powder supplied.

[0012] [6] The powder supplying device according to any one of [1] to [5] may further include a lifting mechanism for raising and lowering the nozzle. Since this powder supplying device includes a lifting mechanism for raising and lowering the nozzle, it is possible to easily adsorb powder onto the adsorption surface and easily supply the powder adsorbed to the adsorption surface.

[0013] [7] The powder supplying device described in [6] may further include a horizontal movement mechanism that moves the nozzle horizontally. This powder supplying device includes a horizontal movement mechanism that moves the nozzle horizontally, so that the powder can be supplied to the supply destination by, for example, lowering the nozzle to adsorb powder onto the adsorption surface, raising the nozzle, moving the nozzle horizontally so that the adsorption surface is positioned above the supply destination, and then lowering the nozzle to release the powder from the adsorption surface.

[0014] [8] The powder supplying device described in [6] may further include a horizontal movement mechanism for horizontally moving the powder supply source and the powder supply destination. This powder supplying device includes a horizontal movement mechanism for horizontally moving the powder supply source and the powder supply destination. Because this mechanism moves the powder supply source and the powder supply destination horizontally, the powder from the supply source can be adsorbed onto the adsorption surface and the powder adsorbed onto the adsorption surface can be supplied to the destination without horizontally moving the nozzle and filter tip. This suppresses vibrations in the nozzle, preventing powder from falling off the adsorption surface due to nozzle vibrations before the application of negative pressure to the nozzle is stopped. This further reduces variation in the amount of powder supplied.

[0015] [9] The powder supplying device according to any one of [1] to [8] may further include a nozzle vibration imparting device that imparts vibration to the nozzle. Since this powder supplying device includes the nozzle vibration imparting device that imparts vibration to the nozzle, it is possible to impart vibration to the nozzle to shake off the powder from the filter tip. Therefore, for example, when stopping the application of negative pressure to the nozzle to allow the powder to fall from the adsorption surface, imparting vibration to the nozzle to shake off the powder from the filter tip can prevent the powder from remaining on the filter tip.

[0016]

[10] In the powder supplying device described in [9], the nozzle vibration imparting device may have a vibrator attached to the nozzle. In this powder supplying device, the vibrator of the nozzle vibration imparting device is attached to the nozzle, so that vibration can be imparted directly to the nozzle. This makes it possible to more reliably shake off the powder from the filter tip.

[0017]

[11] The powder supplying device according to any one of [1] to

[10] may further include a supply source vibration imparting device that imparts vibration to a powder supply source. Since this powder supplying device includes the supply source vibration imparting device that imparts vibration to the powder supply source, even if depressions occur on the surface of the powder at the supply source, the surface of the powder at the supply source can be smoothed by imparting vibration to the supply source. Therefore, even when powder at the supply source is adsorbed onto the adsorption surface of the filter chip multiple times, an appropriate amount of powder can be adsorbed onto the adsorption surface of the filter chip.

[0018]

[12] The powder supplying device according to

[11] may further include a stage on which the supply source is placed, and the supply source vibration imparting device may have a vibrator attached to the stage. In this powder supplying device, the vibrator of the supply source vibration imparting device is attached to the stage on which the supply source is placed, so that vibration can be imparted to the supply source indirectly via the stage. Therefore, for example, even if a vibrator cannot be attached to the supply source, vibration can be imparted to the supply source.

[0019]

[13] The powder supplying device according to any one of [1] to

[12] may further include a supply source stage for vertically moving the powder supply source. In this powder supplying device, the supply source stage can vertically move the powder supply source. Therefore, without raising or lowering the nozzle, the filter tip can be brought close to the supply source, the powder can be adsorbed onto the adsorption surface, and the powder adsorbed onto the adsorption surface can be transported upward. This suppresses vibrations in the nozzle, and prevents the powder from falling from the adsorption surface due to nozzle vibrations before the application of negative pressure to the nozzle is stopped to cause the powder to fall from the adsorption surface. This further reduces variation in the amount of powder supplied.

[0020]

[14] The powder supplying device according to any one of [1] to

[13] may further include a supply destination stage that moves the supply destination of the powder in the vertical direction. In this powder supplying device, the supply destination can be moved in the vertical direction by the supply destination stage, so that the filter tip can be brought closer to the supply destination without raising and lowering the nozzle. This can suppress vibrations occurring in the nozzle, and can cause the powder to fall from the adsorption surface near the supply destination, thereby suppressing the powder from scattering outside the supply destination.

[0021]

[15] The powder supplying method according to the present disclosure is a powder supplying method that supplies powder using a powder supplying device described in any one of [1] to

[14] , in which a suction device applies negative pressure to a nozzle to adsorb the powder onto an adsorption surface of a filter chip, the adsorption surface is positioned above a supply destination, and the application of negative pressure by the suction device is stopped to release the powder from the adsorption surface and supply the powder to the supply destination.

[0022] In this powder supply method, the above-mentioned powder supply device is used to adsorb powder onto the adsorption surface of a filter chip, the adsorption surface is positioned above the destination, and the powder is released from the adsorption surface to supply the powder to the destination, thereby allowing a very small amount of powder to be supplied to the destination.

[0023]

[16] In the powder supplying method described in

[15] , the supply destination may be a container, and after the suction surface is positioned above the container, at least a portion of the suction surface and the nozzle may be inserted into the container, and then the application of negative pressure by the suction device may be stopped, thereby releasing the powder from the suction surface and supplying the powder to the container. In this powder supplying method, because at least a portion of the suction surface and the nozzle are inserted into the container, the nozzle can function as a lid for the container. Therefore, when releasing the powder from the suction surface and supplying the powder to the container, scattering of the powder outside the container can be suppressed.

[0024]

[17] The powder supplying method according to the present disclosure is a powder supplying method that supplies powder using a powder supplying device described in any one of [1] to

[14] , in which a suction device applies negative pressure to a nozzle to adsorb powder onto an adsorption surface of a filter chip, the adsorption surface is positioned above a supply destination, and the application of negative pressure by the suction device is stopped to release the powder from the adsorption surface and supply the powder to the supply destination. This powder supply cycle is repeated multiple times.

[0025] In this powder supply method, the above-mentioned powder supply device is used to adsorb powder onto the adsorption surface of a filter chip, position the adsorption surface above the destination, and release the powder from the adsorption surface to supply the powder to the destination.This powder supply cycle is repeated multiple times, making it easier to supply the specified amount of powder compared to supplying a specified amount of powder in one go. [Effects of the Invention]

[0026] According to the present disclosure, minute amounts of powder can be supplied. [Brief explanation of the drawings]

[0027] [Figure 1] FIG. 1 is a schematic diagram of a powder supplying device according to the first embodiment. [Figure 2] FIG. 2 is a schematic diagram of the powder supplying device shown in FIG. 1 as seen from above. [Figure 3] 3(a), 3(b), and 3(c) are schematic front views illustrating examples of how the filter chip is attached to the nozzle. [Figure 4] FIG. 4 is a schematic diagram for explaining the powder supplying method according to the first embodiment. [Figure 5] FIG. 5 is a schematic diagram for explaining the powder supplying method according to the first embodiment. [Figure 6] FIG. 6 is a schematic diagram for explaining the powder supplying method according to the first embodiment. [Figure 7] FIG. 7 is a schematic diagram for explaining the powder supplying method according to the first embodiment. [Figure 8]FIG. 8 is a schematic diagram for explaining the powder supplying method according to the first embodiment. [Figure 9] FIG. 9 is a schematic diagram for explaining the powder supplying method according to the first embodiment. [Figure 10] FIG. 10 is a schematic diagram for explaining the powder supplying method according to the first embodiment. [Figure 11] FIG. 11 is a schematic diagram of a powder supplying device according to the second embodiment. [Figure 12] FIG. 12 is a schematic diagram for explaining the powder supplying method according to the second embodiment. [Figure 13] FIG. 13 is a schematic diagram for explaining the powder supplying method according to the second embodiment. [Figure 14] FIG. 14 is a schematic diagram for explaining the powder supplying method according to the second embodiment. [Figure 15] FIG. 15 is a schematic diagram for explaining the powder supplying method according to the second embodiment. [Figure 16] FIG. 16 is a schematic diagram for explaining the powder supplying method according to the second embodiment. [Figure 17] FIG. 17 is a schematic diagram for explaining the powder supplying method according to the second embodiment. [Figure 18] FIG. 18 is a schematic diagram for explaining the powder supplying method according to the second embodiment. [Figure 19] FIG. 19 is a schematic diagram of a powder supplying device according to a modified example, viewed from above. [Figure 20] FIG. 20 is a schematic diagram of a powder supplying device according to a modified example, viewed from above. [Figure 21] FIG. 21 is a schematic diagram of a powder supplying device according to a modified example. [Figure 22] FIG. 22 is a schematic diagram of a powder supplying device according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0028] Hereinafter, embodiments of a powder supplying device and a powder supplying method according to the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and duplicated explanations will be omitted.

[0029] [First embodiment] FIG. 1 is a schematic diagram of a powder supplying device according to a first embodiment. FIG. 2 is a schematic diagram of the powder supplying device shown in FIG. 1 as viewed from above. As shown in FIGS. 1 and 2, the powder supplying device 1 according to this embodiment is a device for supplying (transporting) powder B stored in a powder holding member A to a container C. The powder holding member A is a supply source of powder B and holds powder B. The powder holding member A, which is the supply source of powder B, can be, for example, a container containing powder B or filter paper on which powder B is placed. The container C is a supply destination of powder B. The container C, which is the supply destination of powder B, can be, for example, a sample cup for weighing. The container C may be placed on an electronic balance or the like. The size, shape, etc. of the container C are not particularly limited, and can be, for example, a cup-shaped container with an inner diameter (diameter) of 4 mm and a height of 8 mm. The powder supplying device 1 includes a nozzle 2, a suction device 3, a filter tip 4, a stand 5, and a control device 6.

[0030] The nozzle 2 is a tubular member having a hollow portion 21 through which air flows. An opening 22 that opens the hollow portion is formed at the tip of the nozzle 2. The shape of the nozzle 2 is not particularly limited, and can be, for example, a shape that extends linearly, a shape that extends curvedly, or a shape that extends while bending. The material of the nozzle 2 is not particularly limited, and can be, for example, SUS (stainless steel).

[0031] The diameter of the opening 22 (opening diameter) is not particularly limited. From the viewpoint of supplying a minute amount of powder, the diameter of the opening 22 can be, for example, 5 mm or less, preferably 2 mm or less, and more preferably 1 mm or less. Furthermore, from the viewpoint of easily manufacturing the nozzle 2, the diameter of the opening 22 can be, for example, 0.03 mm or more, preferably 0.1 mm or more, and more preferably 0.5 mm or more. From these viewpoints, the diameter of the opening 22 can be, for example, 0.03 mm or more and 5 mm or less, preferably 0.1 mm or more and 2 mm or less, and more preferably 0.5 mm or more and 1 mm or less. When supplying 5 to 500 μg of powder B, the diameter of the opening 22 can be, for example, 0.03 mm or more and 5 mm or less. When supplying 5 to 200 μg of powder B, the diameter of the opening 22 can be, for example, 0.03 mm or more and 2 mm or less. When supplying 5 to 10 μg of powder B, the diameter of the opening 22 can be, for example, 0.03 mm or more and 1 mm or less.

[0032] The cross-sectional area (opening area) of the opening 22 is not particularly limited. From the viewpoint of supplying a minute amount of powder, the cross-sectional area of ​​the opening 22 is, for example, 19.6 mm 2 Less than or equal to 3.14 mm, preferably 2 Less than or equal to 0.785 mm, preferably 2 From the viewpoint of easily manufacturing the nozzle 2, the cross-sectional area of ​​the opening 22 can be set to, for example, 0.000707 mm 2 More than 0.00785mm, preferably 0.00785mm 2 More than 0.196mm, preferably 0.196mm 2 From these viewpoints, the cross-sectional area of ​​the opening 22 can be set to, for example, 0.000707 mm 2 Over 19.6mm 2 Less than or equal to 0.00785 mm, preferably 2 Over 3.14mm 2 Less than or equal to 0.196 mm, preferably 2 More than 0.785mm 2 When 5 to 500 μg of powder B is to be supplied, the cross-sectional area of ​​the opening 22 is, for example, 0.000707 mm 2 Over 19.6mm2 When 5 to 200 μg of powder B is to be supplied, the cross-sectional area of ​​the opening 22 is, for example, 0.000707 mm 2 Over 3.14mm 2 When 5 to 10 μg of powder B is to be supplied, the cross-sectional area of ​​the opening 22 is, for example, 0.000707 mm 2 More than 0.785mm 2 It can be as follows:

[0033] The inner diameter (diameter) of the nozzle 2 is not particularly limited. From the viewpoint of supplying a minute amount of powder, the inner diameter of the nozzle 2 can be, for example, 5 mm or less, preferably 2 mm or less, and more preferably 1 mm or less. Furthermore, from the viewpoint of easily manufacturing the nozzle 2, the inner diameter of the nozzle 2 can be, for example, 0.03 mm or more, preferably 0.1 mm or more, and more preferably 0.5 mm or more. From these viewpoints, the inner diameter of the nozzle 2 can be, for example, 0.03 mm or more and 5 mm or less, preferably 0.1 mm or more and 2 mm or less, and more preferably 0.5 mm or more and 1 mm or less. When supplying 5 to 500 μg of powder B, the inner diameter of the nozzle 2 can be, for example, 0.03 mm or more and 5 mm or less. When supplying 5 to 200 μg of powder B, the inner diameter of the nozzle 2 can be, for example, 0.03 mm or more and 2 mm or less. When supplying 5 to 10 μg of powder B, the inner diameter of the opening 22 can be, for example, 0.03 mm or more and 1 mm or less.

[0034] A first pipe 71 connected to the suction device 3 and a second pipe 72 open to the atmosphere are connected to the end of the nozzle 2 opposite to the opening 22. A first valve 73 is attached to the first pipe 71 between the nozzle 2 and the suction device 3. The first valve 73 is a valve for opening and closing the first pipe 71. For example, an electromagnetic valve driven and controlled by the control device 6 can be used as the first valve 73. Furthermore, a second valve 74 is attached to the second pipe 72. The second valve 74 is a valve for opening and closing the second pipe 72. For example, an electromagnetic valve driven and controlled by the control device 6 can be used as the second valve 74.

[0035] The suction device 3 is a device that applies negative pressure to the nozzle 2. The suction device 3 is connected to the nozzle 2 via a first valve 73 and a first pipe 71. The suction device 3 operates when the first valve 73 is open, thereby sucking the hollow portion 21 of the nozzle 2 and applying negative pressure to the hollow portion 21 of the nozzle 2. As the suction device 3, for example, a vacuum pump that sends air from the nozzle 2 side to the opposite side of the nozzle 2 can be used.

[0036] The filter tip 4 is a member that allows air to pass through but does not allow powder to pass through. The structure of the filter tip 4 can be, for example, a fibrous structure formed into fibers or a porous structure having a plurality of pores. The filter tip 4 can be made of, for example, paper, metal, or ceramic. The metal can be, for example, carbon steel or stainless steel.

[0037] The filter tip 4 is attached to the opening 22 of the nozzle 2. The filter tip 4 allows air to pass through but does not allow powder to pass through, and therefore becomes able to adsorb the powder B when the hollow portion 21 of the nozzle 2 is under negative pressure.

[0038] The filter tip 4 has an adsorption surface 41 that adsorbs the powder B. The adsorption surface 41 is the surface of the filter tip 4 opposite to the hollow portion 21 of the nozzle 2. The filter tip 4 is attached to the nozzle 2 so that the adsorption surface 41 is exposed from the opening 22 of the nozzle 2. The adsorption surface 41 may be located in any position as long as it is exposed from the opening 22 of the nozzle 2. For example, the adsorption surface 41 may be located in a position that protrudes from the opening 22 of the nozzle 2, or may be located in the same position as the opening 22 of the nozzle 2. "The adsorption surface 41 being located in the same position as the opening 22 of the nozzle 2" means that the adsorption surface 41 and the opening 22 of the nozzle 2 are flush with each other.

[0039] The structure for attaching the filter chip 4 to the nozzle 2 is not particularly limited. FIGS. 3(a), 3(b), and 3(c) are schematic front views illustrating examples of attaching the filter chip to the nozzle. As shown in FIGS. 3(a) and 3(b), the filter chip 4 may be attached to the nozzle 2 by inserting the filter chip 4 into the hollow portion 21 of the nozzle 2 through the opening 22 of the nozzle 2. Alternatively, as shown in FIG. 3(c), the filter chip 4 may be attached to the end face of the nozzle 2 on the opening 22 side. The nozzle 2 and the filter chip 4 can be attached by, for example, adhesive bonding. As shown in FIGS. 3(a) and 3(b), by inserting the filter chip 4 into the hollow portion 21 of the nozzle 2 through the opening 22 of the nozzle 2, the adsorption surface 41 can be positioned at a position protruding from the opening 22 of the nozzle 2 or at the same position as the opening 22 of the nozzle 2. FIG. 3(a) illustrates a state in which the adsorption surface 41 is positioned at a position protruding from the opening 22 of the nozzle 2. 3(b) shows a state in which the adsorption surface 41 is positioned at the same position as the opening 22 of the nozzle 2. In addition, as shown in FIG. 3(c), by joining a filter chip 4 to the tip of the nozzle 2 on the opening 22 side, the adsorption surface 41 can be positioned at a position protruding from the opening 22 of the nozzle 2.

[0040] The mount 5 includes a fixed mount 51 , a horizontal movement mechanism 52 , and an elevation mechanism 53 .

[0041] The fixed base 51 is a base for supporting the nozzle 2. The fixed base 51 has a base 51a and a support 51b extending vertically upward from the base 51a.

[0042] The horizontal movement mechanism 52 is a movement mechanism for moving the nozzle 2 in the horizontal direction. In this embodiment, the horizontal movement mechanism 52 moves the nozzle 2 in the horizontal direction by rotating the nozzle 2 around the support 51b. The horizontal movement mechanism 52 has a rotation unit 52a that is rotatably attached to the support 51b around the support 51b, and a rotation drive unit 52b that rotates the rotation unit 52a relative to the support 51b. The rotation unit 52a has an arm unit 52c that extends horizontally from the support 51b, and a holder 52d that is provided at the tip of the arm unit 52c and holds the nozzle 2. A servo motor, for example, can be used as the rotation drive unit 52b.

[0043] The lifting mechanism 53 is a moving mechanism for raising and lowering the nozzle 2. In this embodiment, the lifting mechanism 53 raises and lowers the nozzle 2 relative to the holder 52d, thereby raising and lowering the nozzle 2. The lifting mechanism 53 has a lifting unit 53a attached to the holder 52d so as to be able to rise and lower, and a lifting drive unit 53b that raises and lowers the lifting unit 53a relative to the holder 52d. The lifting unit 53a is attached to the holder 52d by, for example, a ball screw, so that it can be raised and lowered relative to the holder 52d. A servo motor, for example, can be used as the lifting drive unit 53b.

[0044] The control device 6 controls the operation of the suction device 3, the first valve 73, the second valve 74, the rotation drive unit 52b of the horizontal movement mechanism 52, and the lift drive unit 53b of the lift mechanism 53 in order to supply the powder B in the powder holding member A to the container C. The control device 6 is an electronic control unit having, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), etc. The control device 6 performs various controls, for example, by loading a program stored in the ROM into the RAM and executing it on the CPU.

[0045] Next, a powder supplying method according to this embodiment will be described with reference to Figs. 4 to 10. Figs. 4 to 10 are schematic diagrams for explaining a powder supplying method according to a first embodiment. Note that the control device 6 is not shown in Figs. 4 to 10. The powder supplying method according to this embodiment is a method for supplying powder B in a powder holding member A to a container C using the powder supplying device 1 described above.

[0046] 4, the nozzle 2 is positioned above the powder holding member A by operating the lifting drive unit 53b of the lifting mechanism 53 and the rotation drive unit 52b of the horizontal movement mechanism 52. Then, the second valve 74 is closed, the first valve 73 is opened, and the suction device 3 is operated to apply a negative pressure to the hollow portion 21 of the nozzle 2. Then, a suction force is generated on the adsorption surface 41 of the filter tip 4 due to the negative pressure in the hollow portion 21 of the nozzle 2.

[0047] Next, as shown in FIG. 5 , with the hollow portion 21 of the nozzle 2 under negative pressure, the lifting drive unit 53b of the lifting mechanism 53 is operated to lower the nozzle 2. As a result, a portion of the powder B on the powder holding member A is adsorbed onto the adsorption surface 41. At this time, it is preferable to drive the suction device 3 so that, for example, only a minute amount of powder B is adsorbed onto the adsorption surface 41. Note that as long as powder B can be adsorbed onto the adsorption surface 41, the nozzle 2 may be lowered to a position where the adsorption surface 41 abuts on the powder B on the powder holding member A, or it is not necessary to lower the nozzle 2 to a position where the adsorption surface 41 abuts on the powder B on the powder holding member A.

[0048] 6, with the hollow portion 21 of the nozzle 2 under negative pressure, the lifting drive portion 53b of the lifting mechanism 53 is operated to lift the nozzle 2. As a result, the powder B adsorbed on the adsorption surface 41 is transported upward.

[0049] 7 and 2, with the hollow portion 21 of the nozzle 2 under negative pressure, the rotation drive unit 52b of the horizontal movement mechanism 52 is operated to horizontally move the nozzle 2 until the adsorption surface 41 is positioned above the container C. As a result, the powder B adsorbed to the adsorption surface 41 is transported to above the container C.

[0050] 8, with the hollow portion 21 of the nozzle 2 under negative pressure, the lifting drive unit 53b of the lifting mechanism 53 is operated to lower the nozzle 2 until the suction surface 41 and at least a portion of the nozzle 2 are inserted into the container C. As a result, the suction surface 41 and at least a portion of the nozzle 2 are positioned inside the container C, and the powder B adsorbed to the suction surface 41 is transported to the inside of the container C.

[0051] 9, with the adsorption surface 41 inserted into the container C, the operation of the suction device 3 is stopped, the first valve 73 is closed, and the second valve 74 is opened. This opens the hollow portion 21 of the nozzle 2 to the atmosphere, thereby eliminating the suction force of the adsorption surface 41. As a result, the powder B that had been adsorbed to the adsorption surface 41 is released from the adsorption surface 41 and supplied to the container C.

[0052] 10, with the hollow portion 21 of the nozzle 2 open to the atmosphere, the lifting drive portion 53b of the lifting mechanism 53 is operated to lift the nozzle 2. As a result, the adsorption surface 41 is removed from the container C and positioned above the container C.

[0053] This completes the series of processes for supplying powder B from powder holding member A to container C. This series of processes for supplying powder B from powder holding member A to container C is called a powder supply cycle. Thereafter, the above series of processes (powder supply cycle) is repeated until a predetermined amount of powder B is supplied to container C.

[0054] That is, when a predetermined amount of powder B is supplied using the powder supply device 1 from the powder holding member A (supply source) to the container C (supply destination), a powder supply cycle is repeated multiple times: a negative pressure is applied to the nozzle 2 by the suction device 3, causing an amount of powder B less than the predetermined amount to be adsorbed onto the adsorption surface 41 of the filter tip 4; the adsorption surface 41 is positioned above the container C; and the application of negative pressure by the suction device 3 is stopped, releasing the powder B from the adsorption surface 41 and supplying the powder B to the container C. The predetermined amount can be, for example, 50 μg±20 μg, i.e., 30 to 70 μg. The amount of powder supplied in one powder supply cycle can be, for example, 1 to 20 μg.

[0055] In addition, when a predetermined amount of powder B is supplied to container C in one series of processes (powder supply cycle), it is not necessary to repeat the above series of processes (powder supply cycle).

[0056] As described above, in the powder supplying device 1 according to this embodiment, by applying negative pressure to the hollow portion 21 of the nozzle 2 using the suction device 3, powder B can be adsorbed onto the adsorption surface 41 of the filter tip 4 attached to the opening 22 of the nozzle 2. By stopping the application of negative pressure to the nozzle 2, powder B can be dropped from the adsorption surface 41. Furthermore, because the adsorption surface 41 is exposed from the opening 22 of the nozzle 2, powder B can be adsorbed onto the adsorption surface 41 without applying a strong negative pressure to the nozzle 2. Furthermore, because the adsorption surface 41 is exposed from the opening 22 of the nozzle 2, i.e., the periphery of the adsorption surface 41 is not covered by the nozzle 2, excess powder B can be prevented from being adsorbed onto the adsorption surface 41. This allows a minute amount of powder B to be adsorbed and supplied. Moreover, because powder B is not adsorbed to the inner circumferential surface of the nozzle 2 even when electrostatic force or the like is generated, variation in the amount of powder B supplied can be reduced. Even if powder B gets between the nozzle 2 and the filter tip 4, the amount is extremely small, so that it is possible to reduce variation in the amount of powder B supplied. Note that although this powder supplying device 1 is capable of supplying a minute amount of powder B, the amount of powder B supplied does not necessarily have to be minute. Furthermore, by inserting at least a portion of the adsorption surface 41 and the nozzle 2 into the container C and then dropping the powder B from the adsorption surface 41, it is possible to prevent the powder B from scattering outside the container C.

[0057] Furthermore, in this powder supplying device 1, the adsorption surface 41 is disposed at a position protruding from the opening 22 of the nozzle 2, so that a minute amount of powder B can be easily adsorbed onto the adsorption surface 41.

[0058] On the other hand, in this powder supplying device 1, the adsorption surface 41 is disposed at the same position as the opening 22 of the nozzle 2, thereby preventing or suppressing the powder B from being adsorbed onto the outer peripheral surface of the filter tip 4. This allows a minute amount of powder B to be adsorbed onto the adsorption surface 41.

[0059] Furthermore, in this powder supplying device 1, the diameter of the opening 22 of the nozzle 2 is 5 mm or less, preferably 2 mm or less, and more preferably 1 mm or less, so that a minute amount of powder B can be easily adsorbed onto the adsorption surface 41. On the other hand, the diameter of the opening 22 is 0.03 mm or more, preferably 0.1 mm or more, and more preferably 0.5 mm or more, so that the ease of manufacturing the nozzle 2 can be prevented from decreasing.

[0060] Furthermore, this powder supplying device 1 is provided with an elevation mechanism 53 that raises and lowers the nozzle 2, so that the powder B can be easily adsorbed onto the adsorption surface 41 and the powder B adsorbed onto the adsorption surface 41 can be easily supplied. Since a movement mechanism that moves the nozzle 2 is provided, the powder B adsorbed onto the adsorption surface 41 can be easily supplied to the container C.

[0061] In addition, this powder supplying device 1 is equipped with a horizontal movement mechanism 52 that moves the nozzle 2 horizontally, so that, for example, the nozzle 2 is lowered to adsorb the powder B onto the adsorption surface 41, the nozzle 2 is raised, the nozzle 2 is moved horizontally so that the adsorption surface 41 is positioned above the container C, and the nozzle 2 is lowered to release the powder B from the adsorption surface 41, thereby supplying the powder B to the container C.

[0062] In the powder supply method of this embodiment, the above-mentioned powder supply device 1 is used, powder B is adsorbed onto the adsorption surface 41 of the filter tip 4, the adsorption surface 41 is positioned above the container C, and the powder B is released from the adsorption surface 41 to supply the powder B to the container C, so that a minute amount of powder B can be supplied to the container C.

[0063] Furthermore, in this powder supplying method, since the suction surface 41 and at least a portion of the nozzle 2 are inserted into the container C, the nozzle 2 can function as a lid for the container C. Therefore, when the powder B is released from the suction surface 41 and supplied to the container C, the powder B can be prevented from scattering outside the container C.

[0064] Furthermore, in the powder supply method according to this embodiment, the above-described powder supply device 1 is used, and the powder supply cycle of adsorbing powder B onto the adsorption surface 41 of the filter tip 4, positioning the adsorption surface 41 above the container C, releasing the powder B from the adsorption surface 41, and supplying the powder B to the container C is repeated multiple times, making it easier to supply the powder B close to the predetermined amount compared to supplying a predetermined amount of powder B in one go.

[0065] [Second embodiment] Next, a powder supplying device and a powder supplying method according to a second embodiment will be described. The second embodiment is basically the same as the first embodiment, but differs from the first embodiment in that it further includes a nozzle vibration imparting device that imparts vibration to the nozzle and a supply source vibration imparting device that imparts vibration to the supply source. By imparting vibration to the nozzle, powder is shaken off the adsorption surface of the filter chip, and by imparting vibration to the supply source, the surface of the powder at the supply source is leveled. Therefore, only the differences from the first embodiment will be described below, and a description of the same aspects as the first embodiment will be omitted.

[0066] Fig. 11 is a schematic diagram of a powder supplying device according to the second embodiment. As shown in Fig. 11, the powder supplying device 1A according to this embodiment includes a nozzle 2, a suction device 3, a filter tip 4, a stand 5, a control device 6, a stage 11A, a nozzle vibration imparting device 12A, and a supply-source vibration imparting device 13A.

[0067] Stage 11A is a platform on which powder holding member A, which is the supply source of powder B, is placed. Stage 11A may be, for example, a platform on which powder holding member A is simply placed, a platform on which powder holding member A is placed by fitting powder holding member A into a recess, or a platform on which powder holding member A is placed by sandwiching powder holding member A.

[0068] The nozzle vibration imparting device 12A is a device that imparts vibration to the nozzle 2. The nozzle vibration imparting device 12A has a vibrator 121A that serves as a vibration source. The vibrator 121A vibrates under drive control by the control device 6 or the like. The vibrator 121A can be configured, for example, by a vibrator having an eccentric weight attached to the rotation shaft of a motor. The vibrator 121A is attached at a position where it can impart vibration to the nozzle 2. The vibrator 121A is attached, for example, to the nozzle 2 or the stand 5. In this embodiment, the vibrator 121A is described as being attached to the nozzle 2.

[0069] Here, powder B adsorbed to the adsorption surface 41 of the filter tip 4 is caused to fall from the adsorption surface 41 when the application of negative pressure to the nozzle 2 is stopped. However, if powder B becomes caught in the adsorption surface 41, powder B may remain on the adsorption surface 41 without falling from the adsorption surface 41 even when the application of negative pressure to the nozzle 2 is stopped. Furthermore, when powder B is adsorbed onto the adsorption surface 41, static electricity or the like of the filter tip 4 or the nozzle 2 may cause powder B to adhere to portions of the filter tip 4 other than the adsorption surface 41 or to the nozzle 2. Therefore, in this embodiment, by applying vibration to the nozzle 2 using the nozzle vibration imparting device 12A, powder B can be shaken off by the vibration of the nozzle 2 in addition to falling from the adsorption surface 41 when the application of negative pressure to the nozzle 2 is stopped.

[0070] The supply source vibration imparting device 13A is a device that imparts vibration to the powder holding member A, which is the supply source of the powder B. The supply source vibration imparting device 13A has a vibrator 131A that serves as a vibration source. The vibrator 131A can be configured, for example, by a vibrator having an eccentric weight attached to the rotation shaft of a motor. The vibrator 131A vibrates under drive control by the control device 6 or the like. The vibrator 131A is attached at a position where it can impart vibration to the powder holding member A. The vibrator 131A is attached, for example, to the stage 11A or the powder holding member A. In this embodiment, the vibrator 131A is described as being attached to the stage 11A.

[0071] When powder B held in powder holding member A is adsorbed onto adsorption surface 41 of nozzle 2, a portion of powder B is removed from powder holding member A, causing depressions in the surface of powder B on powder holding member A. Therefore, in this embodiment, vibrator 131A of supply-source vibration imparting device 13A is vibrated to impart vibration to powder holding member A, thereby leveling the surface of powder B on powder holding member A. The timing of vibrating vibrator 131A of supply-source vibration imparting device 13A to impart vibration to powder holding member A can be any timing between when powder B held in powder holding member A is adsorbed onto adsorption surface 41 and when powder B held in powder holding member A is adsorbed onto adsorption surface 41 in the next powder supply cycle. For example, the timing for vibrating the vibrator 131A of the supply source vibration imparting device 13A to impart vibration to the powder holding member A can be immediately before the powder B held in the powder holding member A is adsorbed onto the adsorption surface 41, or immediately after the powder B held in the powder holding member A is adsorbed onto the adsorption surface 41.

[0072] Next, a powder supplying method according to this embodiment will be described with reference to Figs. 11 to 18. Figs. 12 to 18 are schematic diagrams for explaining a powder supplying method according to a second embodiment. Note that the control device 6 is not shown in Figs. 12 to 18. The powder supplying method according to this embodiment is a method for supplying powder B in a powder holding member A to a container C using the powder supplying device 1A described above.

[0073] First, as shown in FIG. 11, the nozzle 2 is positioned above the powder holding member A by operating the lifting drive unit 53b of the lifting mechanism 53 and the rotation drive unit 52b of the horizontal movement mechanism 52, for example.

[0074] 12, vibrator 131A of supply source vibration imparting device 13A is vibrated to impart vibration to powder holding member A. As a result, the surface of powder B on powder holding member A is leveled.

[0075] Next, the second valve 74 is closed, the first valve 73 is opened, and the suction device 3 is activated to apply negative pressure to the hollow portion 21 of the nozzle 2. Then, the negative pressure in the hollow portion 21 of the nozzle 2 generates a suction force on the adsorption surface 41 of the filter tip 4.

[0076] 13 , with the hollow portion 21 of the nozzle 2 under negative pressure, the lifting drive unit 53b of the lifting mechanism 53 is operated to lower the nozzle 2. As a result, some of the powder B on the powder holding member A is adsorbed onto the adsorption surface 41. At this time, it is preferable to drive the suction device 3 so that, for example, only a minute amount of powder B is adsorbed onto the adsorption surface 41. Note that as long as powder B can be adsorbed onto the adsorption surface 41, the nozzle 2 may be lowered to a position where the adsorption surface 41 abuts on the powder B on the powder holding member A, or it is not necessary to lower the nozzle 2 to a position where the adsorption surface 41 abuts on the powder B on the powder holding member A.

[0077] 14, with the hollow portion 21 of the nozzle 2 under negative pressure, the lifting drive portion 53b of the lifting mechanism 53 is operated to lift the nozzle 2. As a result, the powder B adsorbed on the adsorption surface 41 is transported upward.

[0078] 15 and 2, with the hollow portion 21 of the nozzle 2 under negative pressure, the rotation drive unit 52b of the horizontal movement mechanism 52 is operated to move the nozzle 2 horizontally until the adsorption surface 41 is positioned above the container C. As a result, the powder B adsorbed to the adsorption surface 41 is transported to above the container C.

[0079] 16 , with the hollow portion 21 of the nozzle 2 under negative pressure, the lifting drive unit 53b of the lifting mechanism 53 is operated to lower the nozzle 2 until the suction surface 41 and at least a portion of the nozzle 2 are inserted into the container C. As a result, the suction surface 41 and at least a portion of the nozzle 2 are positioned inside the container C, and the powder B adsorbed to the suction surface 41 is transported to the inside of the container C.

[0080] Next, as shown in FIG. 17 , with the adsorption surface 41 inserted into the container C, the operation of the suction device 3 is stopped, the first valve 73 is closed, and the second valve 74 is opened. This causes the hollow portion 21 of the nozzle 2 to be exposed to the atmosphere, eliminating the suction force of the adsorption surface 41. As a result, the powder B that had been adsorbed to the adsorption surface 41 is released from the adsorption surface 41 and supplied to the container C. Furthermore, the vibrator 121A of the nozzle vibration imparting device 12A is vibrated to impart vibration to the nozzle 2. As a result, the powder B that had been adsorbed to the adsorption surface 41 is shaken off the adsorption surface 41 and supplied to the container C. Note that the operation of stopping the operation of the suction device 3, closing the first valve 73, and opening the second valve 74 and the operation of vibrating the vibrator 121A of the nozzle vibration imparting device 12A may be performed in either order, or may be performed simultaneously. For example, the operation of the suction device 3 may be stopped, the first valve 73 may be closed, the second valve 74 may be opened, and then the vibrator 121A of the nozzle vibration imparting device 12A may be vibrated.

[0081] 18, with the hollow portion 21 of the nozzle 2 open to the atmosphere, the lifting drive unit 53b of the lifting mechanism 53 is operated to lift the nozzle 2. As a result, the suction surface 41 is removed from the container C and placed above the container C. Note that before or after the nozzle 2 is lifted, the vibration of the vibrator 121A of the nozzle vibration imparting device 12A is stopped.

[0082] This completes the series of processes (powder supply cycle) for supplying powder B from powder holding member A to container C. Thereafter, the above series of processes (powder supply cycle) is repeated until a predetermined amount of powder B is supplied to container C. Note that if a predetermined amount of powder B is supplied to container C in one series of processes (powder supply cycle), there is no need to repeat the above series of processes (powder supply cycle).

[0083] As described above, the powder supplying device 1A according to this embodiment includes the nozzle vibration imparting device 12A that imparts vibration to the nozzle 2, and therefore can impart vibration to the nozzle 2 to shake off the powder B from the adsorption surface 41 of the filter chip 4. Therefore, for example, when stopping the application of negative pressure to the nozzle 2 to cause the powder B to fall from the adsorption surface 41, imparting vibration to the nozzle 2 to shake off the powder from the filter chip 4 can prevent the powder from remaining on the filter chip 4. Furthermore, even if the powder B adheres to the nozzle 2 or to portions of the filter chip 4 other than the adsorption surface 41 due to static electricity or the like of the filter chip 4 or the nozzle 2 when the powder B is adsorbed onto the adsorption surface 41, imparting vibration to the nozzle 2 can prevent the powder B from remaining on the nozzle 2 or to portions of the filter chip 4 other than the adsorption surface 41.

[0084] Furthermore, in this powder supplying device 1A, the vibrator 121A of the nozzle vibration imparting device 12A is attached to the nozzle 2, so that vibration can be imparted directly to the nozzle 2. This makes it possible to shake off the powder B from the filter tip 4 more reliably.

[0085] Furthermore, this powder supplying device 1A is equipped with a supply source vibration imparting device 13A that imparts vibration to the powder holding member A, which is the supply source of the powder B, so that even if there are depressions on the surface of the powder B on the powder holding member A, it is possible to smooth the surface of the powder B on the powder holding member A by imparting vibration to the powder holding member A. Therefore, even when, for example, powder B on the powder holding member A is adsorbed onto the adsorption surface 41 of the filter chip 4 multiple times, an appropriate amount of powder B can be adsorbed onto the adsorption surface 41 of the filter chip 4.

[0086] Furthermore, in this powder supplying device 1A, the vibrator 131A of the supply-source vibration imparting device 13A is attached to the stage 11A on which the powder holding member A, which is the supply source, is placed, so that vibration can be imparted indirectly to the powder holding member A via the stage 11A. Therefore, for example, even if a vibrator cannot be attached to the powder holding member A, vibration can still be imparted to the powder holding member A.

[0087] The present disclosure is not limited to the above-described embodiments, and modifications can be made as appropriate without departing from the spirit of the present disclosure.

[0088] For example, although the above embodiment has been described as including a horizontal movement mechanism and an elevation mechanism, these movement mechanisms may not be included. Even without these movement mechanisms, a minute amount of powder can be supplied by adsorbing and releasing the powder onto the adsorption surface of the filter tip.

[0089] Furthermore, in the above embodiment, the horizontal movement mechanism was described as moving the nozzle horizontally by rotating the nozzle around the support, but the horizontal movement mechanism may be one that moves the nozzle horizontally along any trajectory as long as it can move the nozzle horizontally.

[0090] 19, the powder supplying device may include a static eliminator that eliminates static electricity from at least the adsorption surface of the filter tip and the powder adsorbed to the adsorption surface. Similarly to the powder supplying device 1B shown in FIG. 19, the powder supplying device may include a housing that houses the nozzle, the filter tip, a powder supply source, a powder supply destination, and the static eliminator.

[0091] FIG. 19 is a schematic diagram of a modified powder supplying apparatus viewed from above. The powder supplying apparatus 1B shown in FIG. 19 includes a nozzle 2, a suction device 3, a filter tip 4, a stand 5, a control device 6, a static eliminator 8, and a housing 9. The static eliminator 8 is a device for eliminating static electricity from the entire powder supplying apparatus 1B. The static eliminator 8 is not particularly limited, and may be, for example, an ionizer that emits ions. The housing 9 houses the nozzle 2, the suction device 3, the filter tip 4, the stand 5, the control device 6, the powder holding member A, the container C, and the static eliminator 8. Note that the housing 9 does not necessarily house the control device 6. Therefore, when ions are emitted from the static eliminator 8, static electricity is eliminated from the nozzle 2, the suction device 3, the filter tip 4, the stand 5, the control device 6, the powder holding member A, the powder B on the powder holding member A, the powder B adsorbed on the adsorption surface 41, the container C, and the powder B supplied to the container C.

[0092] In this powder supplying device 1B, the static eliminator 8 eliminates static electricity from at least the adsorption surface 41 and the powder B adsorbed to the adsorption surface 41, so that when the application of negative pressure to the nozzle 2 is stopped, it is possible to prevent the powder B from remaining on the adsorption surface 41 due to electrostatic force. This makes it possible to further reduce the variation in the amount of powder B supplied.

[0093] Furthermore, since the nozzle 2, suction device 3, filter tip 4, stand 5, powder holding member A serving as a supply source of powder B, container C serving as a supply destination of powder B, and static eliminator 8 are housed in housing 9, static elimination can be achieved throughout the housing 9. Furthermore, the influence of external disturbances when supplying a minute amount of powder B can be reduced.

[0094] The static eliminator may be one that only eliminates static electricity from the adsorption surface of the filter chip and the powder adsorbed to the adsorption surface. In this case, for example, the direction of ion emission may be set so that ions are emitted toward the adsorption surface of the filter chip and the powder adsorbed to the adsorption surface.

[0095] In addition, in the above embodiment, the powder supplying device is described as having a horizontal movement mechanism and moving the nozzle horizontally, but it is also possible to move the powder supply source and powder supply destination horizontally without moving the nozzle horizontally, as in the powder supplying device 1C shown in Figure 20.

[0096] Fig. 20 is a schematic diagram of a powder supplying device of a modified example seen from above. Instead of a horizontal movement mechanism that moves the nozzle 2 horizontally, the powder supplying device 1C shown in Fig. 20 includes a horizontal movement mechanism 10 that horizontally moves the powder holding member A, which is the supply source of the powder B, and the container C, which is the supply destination of the powder B.

[0097] The horizontal movement mechanism 10 moves the powder holding member A and the container C in the horizontal direction between a first position where the powder holding member A is disposed below the adsorption surface 41 of the filter tip 4 and a second position where the container C is disposed below the adsorption surface 41. The horizontal movement mechanism 10 may be configured, for example, as a rotating table that rotates around the base 51a of the fixed base 51 with the support 51b of the fixed base 51 as its central axis. Note that this powder supplying device 1C does not include a horizontal movement mechanism that moves the nozzle 2 in the horizontal direction, and therefore the arm 52c of the horizontal movement mechanism 52 in the above embodiment becomes the arm 51c extending from the support 51b of the fixed base 51, and the holder 52d becomes the holder 51d provided at the tip of the arm 51c.

[0098] In this way, by providing the horizontal movement mechanism 10 that horizontally moves the powder holding member A, which is the supply source of the powder B, and the container C, which is the supply destination of the powder B, it is possible to adsorb the powder B from the powder holding member A, which is the supply source, onto the adsorption surface 41, and to supply the powder B adsorbed to the adsorption surface 41 to the container C, which is the supply destination, without moving the nozzle 2 horizontally. This makes it possible to suppress vibrations and the like that occur in the nozzle 2, and therefore to prevent the powder B from falling from the adsorption surface 41 due to vibrations of the nozzle 2 before the application of negative pressure to the nozzle 2 is stopped. This further reduces variation in the amount of powder B supplied.

[0099] Furthermore, in the above embodiment, the powder holding member and the container are described as not moving in the up-down direction (vertical direction), but the powder holding member and the container may also be configured to move in the up-down direction (vertical direction), as in the modified powder supply device shown in Figures 21 and 22.

[0100] 21 and 22 are schematic diagrams of a powder supplying device according to a modified example. The powder supplying device 1D of the modified example shown in Fig. 21 and Fig. 22 is basically the same as that of the first embodiment, but differs from the first embodiment in that it includes a supply source stage 14D and a supply destination stage 15D.

[0101] The supply source stage 14D is a platform on which the powder holding member A is placed. The supply source stage 14D is movable in the up and down direction UD with the powder holding member A placed on it. The supply source stage 14D can be moved in the up and down direction UD by a lifting mechanism using, for example, a motor, hydraulics, or the like.

[0102] The destination stage 15D is a platform on which the container C is placed. The destination stage 15D is movable in the up-down direction UD with the container C placed thereon. The movement of the destination stage 15D in the up-down direction UD can be performed by, for example, a lifting mechanism using a motor, hydraulics, or the like.

[0103] In this powder supplying device 1D, the powder holding member A can be moved in the up and down directions UD by the supply source stage 14D, so that the filter tip 4 can be brought close to the powder holding member A to adsorb the powder B onto the adsorption surface 41 and transport the powder B adsorbed to the adsorption surface 41 upward, without raising or lowering the nozzle 2. This makes it possible to suppress vibrations occurring in the nozzle 2, and therefore to prevent the powder B from falling from the adsorption surface 41 due to vibrations of the nozzle 2 before the application of negative pressure to the nozzle 2 is stopped to cause the powder B to fall from the adsorption surface 41. This further reduces variation in the amount of powder B supplied.

[0104] Furthermore, in this powder supplying device 1D, the supply destination stage 15D can move the container C in the up and down direction UD, so the filter tip 4 can be brought close to the container C without raising and lowering the nozzle 2. This makes it possible to suppress vibrations occurring in the nozzle 2, and also to cause the powder B to fall from the adsorption surface 41 near the container C, so that the powder B can be prevented from scattering outside the container C. [Explanation of symbols]

[0105] 1...powder supply device, 1A...powder supply device, 1B...powder supply device, 1C...powder supply device, 1D...powder supply device, 2...nozzle, 3...suction device, 4...filter tip, 5...frame, 6...control device, 8...static charge removal device, 9...casing, 10...horizontal movement mechanism, 11A...stage, 12A...nozzle vibration imparting device, 13A...supply source vibration imparting device, 14D...supply source stage, 15D...supply destination stage, 21...hollow portion, 22...opening, 41...adsorption surface, 51...fixed base, 51a...base, 51b...support, 51c...arm portion, 51d...holding portion, 52...horizontal movement mechanism, 52a...rotating portion, 52b...rotating drive portion, 52c...arm portion, 52d...holding portion, 53...lifting mechanism, 53a...lifting portion, 53b...lifting drive portion, 71...first piping, 72...second piping, 73...first valve, 74...second valve, A...powder holding member (supply source), B...powder, C...container (supply destination), UD...up and down direction (vertical direction).

Claims

1. A powder supplying device that supplies powder, A nozzle; a suction device that applies negative pressure to the nozzle; a filter tip attached to the opening of the nozzle and having an adsorption surface that adsorbs the powder; The suction surface is exposed from the opening of the nozzle. Powder feeding device.

2. The suction surface is disposed at a position protruding from the opening of the nozzle. The powder supplying device according to claim 1 .

3. The suction surface is disposed at the same position as the opening of the nozzle. The powder supplying device according to claim 1 .

4. The diameter of the opening of the nozzle is 0.03 mm or more and 5 mm or less. The powder supplying device according to claim 1 .

5. The apparatus further includes a static eliminator that eliminates static electricity at least from the adsorption surface and the powder adsorbed on the adsorption surface. The powder supplying device according to claim 1 .

6. Further provided is a lifting mechanism for lifting and lowering the nozzle. The powder supplying device according to claim 1 .

7. Further provided is a horizontal movement mechanism that moves the nozzle in a horizontal direction. The powder supplying device according to claim 6.

8. Further provided is a horizontal movement mechanism that moves the powder supply source and the powder supply destination in a horizontal direction. The powder supplying device according to claim 6.

9. Further provided is a nozzle vibration imparting device that imparts vibration to the nozzle. The powder supplying device according to claim 1 .

10. The nozzle vibration imparting device has a vibrator attached to the nozzle. The powder supplying device according to claim 9.

11. The powder supply device further includes a supply source vibration imparting device that imparts vibration to the powder supply source. The powder supplying device according to claim 1 .

12. Further, a stage on which the supply source is placed is provided, the vibration source imparting device has a vibrator attached to the stage; The powder supplying device according to claim 11.

13. Further provided is a supply source stage that moves the powder supply source in a vertical direction. The powder supplying device according to claim 1 .

14. Further provided is a supply destination stage that moves the supply destination of the powder in the vertical direction. The powder supplying device according to claim 1 .

15. A powder supplying method for supplying powder using the powder supplying device according to any one of claims 1 to 14, comprising: applying a negative pressure to the nozzle by the suction device to adsorb powder onto the adsorption surface of the filter tip; The adsorption surface is positioned above a supply destination; by stopping the application of the negative pressure by the suction device, the powder is released from the adsorption surface and the powder is supplied to the supply destination. Powder feeding method.

16. the supply destination is a container, After the suction surface is positioned above the container, the suction surface and at least a portion of the nozzle are inserted into the container, and then the application of the negative pressure by the suction device is stopped, thereby releasing the powder from the suction surface and supplying the powder to the container.

16. The powder feeding method of claim 15.

17. A powder supplying method for supplying powder using the powder supplying device according to any one of claims 1 to 14, comprising: a powder supply cycle in which a negative pressure is applied to the nozzle by the suction device to cause the powder to be adsorbed onto the adsorption surface of the filter tip, the adsorption surface is positioned above a supply destination, and the application of the negative pressure by the suction device is stopped to release the powder from the adsorption surface and supply the powder to the supply destination is repeated multiple times; Powder feeding method.

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