Temperature actuated valve and method of use

Abstract

Disclosed herein is a temperature actuated valve including a stationary member and a movable member, the stationary member configured to receive the movable member. A first flow path is defined between an outer surface of the stationary member and an inner surface of the housing, and a second flow path is defined within the movable member by the movable member. The temperature actuated valve further includes at least one temperature actuated member having a first end seated against a base of the stationary member and a second end seated against a base of the movable member. The temperature actuated valve further includes a bias member having a first end connected to the base of the stationary member and a second end connected to the base of the movable member, the at least one temperature actuated member configured to contract at a first temperature and expand at a second temperature.

Description

[Technical field]

[0001] The present disclosure relates to electronic device manufacturing, and more particularly to one or more embodiments of a temperature activated valve and methods of use thereof. [Background technology]

[0002]

[0002] Large semiconductor manufacturing plants can use as much electricity as 100 megawatt-hours per hour. Such plants use as much electricity as about 50,000 homes in a year. In some markets, electricity can account for 30% of a semiconductor manufacturing plant's operating costs. Such consumption can exceed that of many oil refineries and automotive factories. Although the electricity consumed by semiconductor chips has been greatly reduced over the years, improvements in the energy used in the manufacturing process have lagged.

[0003]

[0003] Semiconductor manufacturers continue to seek ways to reduce energy consumption throughout the factory, including reducing the energy consumption of the process equipment used to perform various unit processes. For example, regulating coolant flow is an opportunity to reduce the energy footprint of process equipment. New components that are non-electrical or use reduced amounts of power are needed. Summary of the Invention

[0004]

[0004] According to one or more embodiments, disclosed herein is a temperature actuated valve comprising: a fixed member and a movable member, the fixed member configured to receive the movable member; a first flow passage defined between an outer surface of the fixed member and an inner surface of a housing; a second flow passage defined within the movable member by the movable member; at least one temperature actuated member including a first end seated against a base of the fixed member and a second end seated against the base of the movable member, the at least one temperature actuated member comprising a shape memory alloy; and a bias member including a first end connected to the base of the fixed member and a second end connected to the base of the movable member, the at least one temperature actuated member configured to contract at a first temperature to reduce an opening to the second flow passage and expand at a second temperature to increase an opening to the second flow passage.

[0005] In some embodiments, an electronic device manufacturing system is disclosed that includes:

[0006]

[0006] A fluid line containing a fluid having a variable temperature and further including a temperature actuated valve, the temperature actuated valve comprising a fixed member and a movable member, the fixed member configured to receive the movable member, a first flow path defined between an outer surface of the fixed member and an inner surface of a housing, a second flow path defined within the movable member by the movable member, at least one temperature actuated member including a first end seated against a base of the fixed member and a second end seated against the base of the movable member, the at least one temperature actuated member including a shape memory alloy, and a bias member including a first end connected to the base of the fixed member and a second end connected to the base of the movable member, the at least one temperature actuated member configured to contract at a first temperature to reduce an opening to the second flow path and expand at a second temperature to increase an opening to the second flow path.

[0007] In one or more embodiments, disclosed herein is a method of reducing fluid consumption in an electronic device manufacturing system, the method comprising: flowing a fluid through a temperature activated valve disposed in a fluid line of the electronic device manufacturing system, the temperature activated valve comprising a fixed member and a movable member, the fixed member configured to receive the movable member, a first flow path defined between an outer surface of the fixed member and an inner surface of a housing, a second flow path defined within the movable member by the movable member, and a first end seated against a base of the fixed member and a second end seated against the base of the movable member. The method includes flowing a fluid through a temperature actuated valve disposed in a fluid line of an electronic device manufacturing system, the temperature actuated valve including at least one temperature actuated member including a shape memory alloy and a bias member including a first end connected to a base of the fixed member and a second end connected to a base of the movable member, and opening and closing the temperature actuated valve based on a temperature of the fluid, the at least one temperature actuated member configured to contract when the fluid is at a first temperature, causing the valve to have a smaller opening to a second flow path, and to expand when the fluid is at a second temperature, causing the valve to at least partially open, causing a larger opening to the second flow path.

[0008]

[0008] The drawings described below are for illustrative purposes and are not necessarily drawn to scale. The drawings are not intended to limit the scope of the present disclosure in any way. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 illustrates a process chamber suitable for use with a temperature activated valve according to some embodiments. [Figure 2A] 1A-1D illustrate temperature activated valves according to various embodiments of the present disclosure. [Figure 2B] 1A-1D illustrate cross-sections of a temperature activated valve according to various embodiments of the present disclosure. [Figure 2C] 1A-1D illustrate internal components of a temperature activated valve according to various embodiments of the present disclosure. [Figure 2D] 1A-1D illustrate a movable member along with a temperature actuated member and other internal components of a temperature actuated valve according to various embodiments of the present disclosure. [Figure 2E] 1 illustrates a movable member along with other internal components of a temperature activated valve according to various embodiments of the present disclosure. [Figure 2F] 1A-1D illustrate cross-sections of a fixing member along with a temperature actuated member and a biasing member of a temperature actuated valve according to various embodiments of the present disclosure. [Diagram 3] FIG. 1A illustrates a temperature actuated valve having a temperature actuated member in an extended state according to various embodiments of the present disclosure; FIG. 1B illustrates a temperature actuated valve having a temperature actuated member in a contracted state according to various embodiments of the present disclosure. [Figure 4] FIG. 1A illustrates the flow path through an "open" temperature-activated valve according to an embodiment of the present disclosure; FIG. 1B illustrates the flow path through a "closed" temperature-activated valve according to an embodiment of the present disclosure. [Diagram 5] FIG. 1A is a diagram showing a temperature-activated valve installed in a fluid line according to an embodiment of the present invention, and FIG. 1B is a diagram showing a cross-section of a temperature-activated valve installed in a fluid line according to an embodiment of the present invention. [Figure 6] FIG. 1 is a flow diagram illustrating a method for reducing fluid consumption in an electronic device manufacturing system according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010]

[0023] Reference will now be made in detail to the exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the several drawings to refer to the same or like parts throughout the several drawings. The features of the various embodiments described herein may be combined with each other unless specifically stated otherwise.

[0011]

[0024] Semiconductor manufacturers are interested in reducing the energy consumption of manufacturing equipment during processing and reducing the overall cost of ownership of such manufacturing equipment. Process chambers often include components that are cooled during processing. Cooling of the components may be performed by supplying a coolant through one or more channels of the process chamber components. Typically, active valves (e.g., pneumatic and / or electric valves) are used to regulate the flow of the coolant. Such active valves consume power. The embodiments described herein are directed to temperature-activated valves that do not require any active components (e.g., no electricity or power consumption) for operation. The use of such temperature-activated valves may reduce the energy footprint of the semiconductor manufacturing equipment. Temperature-activated valves may open or close (e.g., increase the size of one or more flow channels and / or decrease the size of one or more flow channels) based on the temperature of a fluid passing through the temperature-activated valve. Thus, if the temperature of the coolant or other liquid increases, the increased temperature may cause the valve to automatically open and the size of the flow channel to increase to increase the flow of the coolant. In contrast, if the temperature of the coolant or other liquid decreases, the decrease in temperature may cause the valve to automatically close and the size of the flow channel to decrease the flow of the coolant. Such actuation of flow values ​​may be performed automatically to control the flow of the coolant without the use of additional sensors, active or powered components, and / or control systems. Thus, the use of temperature actuated valves may reduce the overall energy consumption of equipment such as semiconductor processing equipment.

[0012]

[0025] According to one or more embodiments herein, a temperature actuated valve (e.g., spool valve) assembly is disclosed, for example, positioned in the return line of a coolant flow loop of a semiconductor manufacturing device. The valve described in the embodiments herein utilizes a temperature responsive shape memory alloy spring that actuates when the coolant temperature exceeds an actuation temperature. The temperature actuated valve may include one or more shape memory alloy springs, one or more bias springs, and associated mechanical structure that supports the springs. When the temperature drops below the return actuation temperature, the valve may be returned to its original position by the bias spring.

[0013]

[0026] A temperature-activated valve may be a passive system that activates based on the temperature of the inflowing and / or outflowing coolant and does not rely on external sensors or actuators. In an embodiment, a temperature-responsive shape memory alloy spring activates the valve when the coolant temperature exceeds an activation temperature. When the temperature drops below a return activation temperature, the valve may return to its original position with the assistance of a bias spring. In some embodiments, the amount of expansion and / or contraction of the shape memory alloy spring depends on the temperature of the liquid (e.g., coolant). In such an embodiment, rather than simply having an open and closed position, a temperature-activated valve may have many intermediate positions associated with different flow passage opening sizes. As a result, the size of the flow passage provided by the valve may be passively and automatically adjusted based on the temperature of the liquid.

[0014]

[0027] The temperature actuated valve operates based on the coolant return temperature in the embodiments (i.e., the temperature of the coolant after it has been used for cooling) and is therefore independent of the operating strategy of the corresponding semiconductor manufacturing equipment in the embodiments. The temperature actuated valve with a shape memory alloy spring can function without the use of a control system or adjustment of the temperature actuated valve and / or the control system. The temperature actuated valve described in the embodiments herein is a robust design with valve actuation and reset points pre-designed into the system. In some embodiments, adjustment of the actuation and reset temperatures can be performed during on-site valve setup by manipulating the pre-loaded tension on the bias spring.

[0015]

[0028] In some embodiments, the temperature actuated valve can be sized based on maximum cooling specifications and can regulate the coolant flow. The ability to regulate the coolant flow based on cooling specifications provides an opportunity to conserve energy and therefore reduce tool operating costs.

[0016]

[0029] FIG. 1 illustrates a process chamber 100 suitable for use with one or more embodiments of a temperature-activated valve described herein. The process chamber may be any type of chamber, such as an etch chamber, a deposition chamber, a transfer chamber, etc. In some embodiments, the process chamber 100 includes a grounded chamber body 105 that defines an interior region 101 that may include a processing region 103. In one or more embodiments, the processing region 103 may be defined as the region disposed between a substrate support 121 configured to receive and hold a substrate 110 during processing and a showerhead 135 disposed within the interior region 101. A vacuum pump 155 may be coupled to the interior region 101 via an exhaust valve 151 to facilitate evacuating the interior region 101.

[0017]

[0030] In an embodiment, the substrate 110 may be loaded through an opening 115 in the chamber body 105 via a substrate transfer robot (not shown) and provided to the substrate support 121. In one or more embodiments, the substrate support 121 may include one or more mechanisms for holding the substrate 110 on the substrate support 121, such as, for example, an electrostatic chuck 110. The substrate 110 may be any type of substrate conventionally employed in plasma processing techniques, and the inventive methods disclosed herein are not limited in this respect.

[0018]

[0031] In some embodiments, the process chamber 100 may include a plasma power source (e.g., an RF source 130) coupled to an upper electrode (e.g., a conductive portion of the chamber ceiling 181, a showerhead 135, etc.) via a matching network 131 to inductively or capacitively supply power to form a plasma in the processing region 101 of the process chamber 100.

[0019]

[0032] A plasma source power 130 is coupled to the plasma generating elements via a matching network 131 to provide high frequency source power for inductively or capacitively exciting the plasma. To facilitate control of the process chamber 100, a controller 170 may be coupled to the process chamber. The controller 170 may be one of any form of general purpose computer processor that may be used in an industrial environment to control various chambers and sub-processors. The memory, or computer readable medium 173, of the CPU 172 may be one or more of readily available memory such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form of digital storage, local or remote. Support circuits 174 are coupled to the CPU 172 to support the processor in a conventional manner. These circuits include cache, power supplies, clock circuits, input / output circuits and subsystems, and the like.

[0020]

[0033] In some embodiments, the process chamber 100 may include a showerhead 135 configured to supply one or more process gases supplied from a gas source 145 via a mass flow controller 149 to the interior region 101. In one or more embodiments, the showerhead 135 may be a temperature controlled showerhead having one or more heating zones (a center or inner heating zone 164 and an edge or outer heating zone 165 are shown), each zone being independently controllable. Although illustrated as having two zones, the showerhead 135 may have any amount of zones, such as, for example, one zone, or three or more zones.

[0021]

[0034] In some embodiments, each of the one or more heating zones may include a heater 153 having one or more electrical resistive heating elements 178, 179 coupled to a heater element 190. The heater element 190 may be coupled to a heater driver 190B and controlled by a temperature controller 175. The heating elements 178, 179 may be independently driven based on one or more temperature sensors 166 and 167 (e.g., optical probes in each of the heating zones 164, 165). The heater driver 190B may be, for example, a solid state relay or a semiconductor controlled rectifier (SCR). In some embodiments, the heater controller 191 provides a pulse width modulation (PWM) function similar to the coolant PWM controller 180 and couples the temperature controller 175 to either or both of the heating elements 178, 179 and the coolant loop 171.

[0022]

[0035] Instead of or in combination with one or more heating zones, in some embodiments, the process chamber 100 may include a coolant system 169 having one or more coolant loops 171, for example to facilitate control over the temperature of the showerhead 135 and / or the substrate support (e.g., electrostatic chuck). In some embodiments, the coolant system 169 includes a chiller 177 for providing cooling power to the showerhead 135 via the coolant loop 171 that thermally couples the showerhead 135 and the chiller 177. During operation, a coolant (e.g., 50% ethylene glycol, water, etc.) passes through one or more coolant channels embedded in both the inner heating zone 164 and the outer heating zone 165 of the showerhead 135 (e.g., entering adjacent to the first zone and exiting adjacent to the other zone). In one embodiment, the flow rate of coolant through one or more coolant loops 171 and one or more coolant channels is controlled by a pulse wave modulated controller 180 via one or more temperature actuated valves (one valve 123 is shown) in accordance with embodiments herein. Alternatively, or in addition, embodiments use temperature actuated valves to control the flow rate of coolant through one or more coolant loops. Temperature actuated valves may be passively actuated valves that do not rely on sensors, controllers, or power sources.

[0023]

[0036] According to various embodiments, the temperature actuated valve may be positioned in, for example, the coolant loop 171. Although described with respect to the coolant loop 171, it is understood that the temperature actuated valve according to embodiments herein may be installed in any fluid line and / or pipe through which a fluid of variable temperature flows. The fluid may be a heat transfer fluid, such as a liquid or gas suitable for adding or removing heat from a medium or component. The temperature actuated valve is temperature driven and may function with any chemically compatible fluid or temperature change (e.g., change in ambient temperature) within an electronic device manufacturing system. The temperature actuated valve is suitable for use in fluid lines where it is beneficial to modify the flow rate of the fluid based on the temperature of the fluid. Suitable fluids include, but are not limited to, liquid water, purified liquid water, water vapor, glycol, ethylene glycol, propylene glycol, liquid nitrogen, nitrogen gas, air, argon, liquid helium, helium gas, or a compatible mixture of any two or more of the foregoing.

[0024]

[0037] In response to changes in the temperature of the coolant flowing through the coolant line 171, one or more temperature actuated members within the valve warm and / or cool, causing the valve to activate or deactivate in conjunction with one or more biasing members. The temperature actuated valves according to embodiments herein activate and deactivate without the use of sensors or controllers. The physical properties of the alloy of the coolant and the temperature actuated valve initiate activation (or deactivation) of the valve. During process conditions that require cooling (or increased cooling), the temperature of the coolant increases as the coolant absorbs thermal energy, causing one or more temperature actuated members within the valve to expand and open or increase flow through the valve. However, when process conditions do not require cooling (or only require low cooling), the temperature of the coolant decreases, causing the temperature actuated members to contract (or shrink), closing the valve (or reducing the size of the opening through which the coolant flows) and decreasing the flow of the coolant. In some embodiments, the temperature actuated valves operate in an on (i.e., fully open) or off (i.e., fully closed) configuration. In one or more embodiments, the valve may be configured to open partially to control the flow rate, for example, and thus in some embodiments the size of the opening may be variable based on the temperature of the coolant.

[0025]

[0038] One embodiment of a temperature activated valve 200 is shown in Figures 2A and 2B. The internal components of the valve 200 are positioned within a housing 202. The housing 202 may include a connecting member 207 configured to attach to two sections of a fluid line and / or pipe. That is, the temperature activated valve 200 may be installed to match the pipe and / or fluid line. In some embodiments, the inner surface of the housing 202 has a cylindrical shape and / or a shape that matches the inner surface of the fluid line and / or pipe. The inner surface of the housing 202 may receive a stationary member 204 therein. In some embodiments, at least a portion of an outer surface of the stationary member 204 is spaced from at least a portion of the inner surface of the housing 202 to define a first flow path therethrough. The first flow path (e.g., an outer annular flow path) may be defined in a space between an outer surface of the stationary member 204 and an inner surface of the housing 202. In some embodiments, the outer annular flow path has the same diameter opening for a particular flow segment regardless of whether the valve 200 is in an open or closed position. For example, the outer annular passage may have a fixed open position. As a result, flow through the outer annular passage may be a choked flow (e.g., a first flow rate) that provides a certain back pressure in some embodiments. The second flow path of the temperature activated valve 200 may be an inner annular passage disposed within a movable member 206 positioned within a fixed member 204. When the inner annular passage is open, fluid may flow through both the outer and inner annular passages, reducing the back pressure and resulting in a high flow rate (e.g., a second flow rate that is higher than the first flow rate).

[0026]

[0039] The temperature actuated valve 200 may include a movable member 206 received within a fixed member 204 (e.g., a router spool), as shown in FIGS. 2A-2C. The fixed member 204 and the movable member 206 may each have a cylindrical shape such that the movable member 206 is configured to movably slide within the fixed member 204. A second flow path may be defined within the movable member 206 by the movable member 206. For example, the fixed member 204 may include one or more flow elements 203. The one or more flow elements 203 may be openings, orifices, holes, perforations, divots, protrusions, fins, louvers, roughness elements, rough surfaces, or a combination of any two or more of the foregoing. The movable member 206 may likewise include one or more flow elements 205. The one or more flow elements 205 may be openings, orifices, holes, perforations, divots, protrusions, fins, louvers, roughness elements, rough surfaces, or a combination of any two or more of the foregoing. As described in more detail with respect to Figures 3A-5B, the one or more flow elements 203 of the fixed member 204 are configured to be at least partially aligned with the one or more flow elements 205 of the movable member 206 such that fluid flowing through a first flow path can enter the interior of the movable member 206 to form a second flow path.

[0027]

[0040] The temperature actuated valve 200 may further include at least one temperature actuated member 216, 217, 218. Each temperature actuated member 216, 217, 218 may independently be in the form of a spring, a coil spring, a bellows spring, a Belleville spring, a leaf spring, or a spring cylinder. In some embodiments, each temperature actuated member 216, 217, 218 is a coil spring. During operation, the temperature actuated members 216, 217, 218 may be wetted and in direct contact with the fluid flowing therethrough.

[0028]

[0041] In one or more embodiments, at least one temperature actuated member 216, 217, 218 may be formed of a shape memory alloy. In some embodiments, the shape memory alloy includes, but is not limited to, nickel, titanium, iron, copper, and combinations thereof. Suitable shape memory alloys include, but are not limited to, Benevolent alloys, nickel-titanium alloys, nickel-titanium-cobalt alloys, nickel-titanium-copper alloys, or combinations thereof. The shape memory alloy is configured to at least partially elongate the temperature actuated member 216, 217, 218 at a first temperature and at least partially contract at a second temperature. As used herein, the term "elongate" refers to an increase in the stiffness of the shape memory alloy material. The terms "contract" or "compress" refer to a decrease in the stiffness of the shape memory alloy material. In one or more embodiments, the first temperature is about 40° C. to about 90° C., or any individual value or subrange within this range. In one or more embodiments, the second temperature is about 12° C. to about 40° C., or any individual value or subrange within this range. Each of the temperature actuated members 216, 217, 218 may be supported by a corresponding guiding member 220, 221, 222. The guiding members 220, 221, 222 are configured to move linearly with the movable member 206. As the temperature actuated members 216, 217, 218 expand and contract, the guiding members 220, 221, 222 permit linear (but not lateral) movement of the members 216, 217, 218.

[0029]

[0042] Each temperature actuated member 216, 217, 218 may include a first end 219 that seats against the base 211 of the fixed member 204 and a second end that seats against the base 223 of the movable member 206. Each guide member 220, 221, 222 may be received within an opening and secured to the base 223, as shown in Figures 2B, 2D, 2E, 2F. In some embodiments, each guide member 220, 221, 222 is secured to the base 223 by any suitable means, including but not limited to screws, bolts, rivets, machined notches, welding, soldering, adhesives, etc. As the temperature actuated members 216, 217, 218 extend, they press against the base 223, moving the movable member 206 in the direction of the force and aligning the flow elements 203, 205.

[0030]

[0043] In some embodiments, the temperature actuated valve 200 further includes at least one biasing member 214. The at least one biasing member may have the form of a spring, a coil spring, a bellows spring, a Belleville spring, a leaf spring, or a spring cylinder. In some embodiments, the biasing member 214 is a coil spring. In some embodiments, the temperature actuated members 216, 217, 218 act against the biasing member 214 (e.g., the biasing spring) to provide a load or tension between these elements. The biasing member 214 may be configured to return the movable member 206 and the one or more temperature actuated members 216, 217, 218 to a first position (e.g., a closed position) when the temperature of the liquid is below a temperature threshold. For example, when the fluid flowing through the temperature actuated valve 200 reaches or falls below a certain threshold temperature, the shape memory alloy of the extended temperature actuated members 216, 217, 218 compresses and the biasing member 214 returns the temperature actuated members to the first position.

[0031]

[0044] According to one or more embodiments, the biasing member 214 may include attachment members 210, 212 at its opposing ends. The attachment member 210 may be, for example, a hook, wire, coil, etc. configured to pass through an opening 213 in the post 208 configured to pass through the base 223. In some embodiments, the post 208 may have a threaded portion configured to be attached to a nut 240 to secure the post 208 and biasing member 214 to the movable member 206. The attachment member 212, for example, a hook, wire, coil, etc., may be configured to pass through an opening 215 in the post 209 configured to pass through the base 211. In some embodiments, the post 209 may have a threaded portion configured to be attached to a nut 241 to secure the post 209 and biasing member 214 to the stationary member 204. In one or more embodiments, by selecting an appropriate shape memory alloy material and material stiffness of the biasing member 214, the temperature at which the valve 200 opens and closes can be controlled.

[0032]

[0045] In some embodiments, the temperature actuated valve 200 further includes an adjustment member attached to the biasing member 214. The adjustment member may be operable to adjust the tension of the biasing member 214. In some embodiments, the nut 241 may be the adjustment member. The nut 241 may be tightened to increase the tension of the biasing member 214, or loosened to decrease the tension of the biasing member 214. The pretensioning adjustment nut may be designed with an operating design table that has some markings around the edge so that the user knows where to set the nut (i.e., as a continuous dial, or as a step change dial). In the case of a step change dial, the nut may be a latch or pawl ratchet design so that the user can jump from one setting to another.

[0033]

[0046] According to one or more embodiments, the components of the temperature actuated valve 200, particularly the wetted components, are constructed of non-corrosive metals, polymers, ceramics, combinations thereof, or any other suitable solid materials. In some embodiments, the stationary member 203, the movable member 206, the housing 202, and the biasing member 214 (including, for example, components 208, 209, 210, 212, 213, 217, 221) each independently comprise stainless steel, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or any combination of the foregoing. In some embodiments, the stationary member 203, the movable member 206, and the housing 202 are formed of 316 stainless steel alloy. In some embodiments, the biasing member 214 is formed of a stainless steel alloy other than 316 stainless steel alloy, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or any combination of the foregoing.

[0034]

[0047] 3A and 3B illustrate a temperature actuated valve 300 having temperature actuated members 316, 318 in an expanded position (FIG. 3A) and a contracted position (FIG. 3B). For example, when a fluid flowing through the valve 300 reaches a first temperature, the shape memory alloy of the temperature actuated members 316, 318 expands and elongates the temperature actuated members, thereby opening the valve 300. When the temperature actuated members 316, 318 expand, a force is exerted on the movable member 306. The movable member 306 moves linearly within the fixed member 304, aligning the opening 305 of the movable member 306 with the opening 303 of the fixed member 304. When the openings 303, 305 are aligned, the outer surface of the fixed member 304 allows fluid flowing between the inner surface of the housing 302 and the fixed member 304 to flow through the openings 303, 305, and through the interior of the movable member 306. The movable member 306 may be concentrically enclosed within the fixed member 304 to form an annular flow passage. When the valve 300 is open, fluid flowing therethrough can enter a larger area within the movable member 306, thereby increasing the flow rate.

[0035]

[0048] When the fluid flowing through the valve 300 reaches a second temperature, the shape memory alloy of the temperature actuated members 316, 318 compresses (FIG. 3B), causing the temperature actuated members to contract and close the valve 300. As the temperature actuated members 316, 318 contract, the biasing member 314 returns to its original shape, pulling the movable member 306 back towards its closed position. As the movable member 306 moves linearly within the fixed member 304 and re-engages the mounting member 310 of the biasing member 314, it moves out of position with the opening 303 and closes the opening 305. As the openings 303, 305 close, fluid stops flowing through the interior of the movable member 306. In some embodiments, fluid begins to flow over the exterior surface of the fixed member 304, thereby reducing the flow rate.

[0036]

[0049] Although described as a binary (i.e., open / closed) configuration, in some embodiments the shape memory alloy expands and compresses as a function of the temperature of the fluid. Thus, the temperature actuated members 316, 318 may expand or contract to partially align the openings 303, 305 to provide intermediate flow rates when the valve 300 is fully open or fully closed. In some embodiments, the shape memory alloy expands and compresses linearly or non-linearly as a function of temperature.

[0037]

[0050] 4A and 4B are diagrams illustrating a fluid flow path through a temperature actuated valve 400 according to one or more embodiments described herein when in an open configuration (FIG. 4A) and a closed configuration (FIG. 4B). When the temperature actuated valve 400 is in an open position, a fluid flow path 401 is formed within the interior of the valve 400 between an outer surface of a fixed member 404 and an inner surface of a housing 402. Temperature actuated members 416, 418 attached to a base 411 are configured to at least partially expand when a fluid flowing through the fluid flow path 401 is at a first temperature. The first temperature may be from about 40° C. to about 90° C., or any individual value or subrange within this range. When the temperature actuated members 416, 418 extend, the movable member 406 moves linearly within the fixed member 404 such that an opening in the fixed member 404 aligns with an opening in the movable member 406. Fluid flow path 401 splits to continue beyond the outer surface of fixed member 404 to 446 , and fluid also flows through openings in members 404 , 406 into the interior region of movable member 406 forming flow path 448 .

[0038]

[0051] When the temperature actuated valve 400 is in a closed position (FIG. 4B), a fluid flow path 401 is formed within the interior of the valve 400 between an outer surface of the fixed member 404 and an inner surface of the housing 402. The temperature actuated members 416, 418 attached to the base 411 are configured to at least partially contract when the fluid flowing through the fluid flow path 401 is at a second temperature. The second temperature may be from about 12° C. to about 40° C., or any individual value or subrange within this range. When the temperature actuated members 416, 418 contract, the movable member 406 moves linearly within the fixed member 404 such that the opening in the fixed member 404 is closed by the opening in the movable member 406. The fluid flow path 401 then continues 446 beyond the outer surface of the fixed member 404 and does not flow through the flow path 448. In some embodiments, the shape memory alloy material of the temperature actuated members 416, 418 predictably expands and compresses as a function of temperature. In this manner, valve 400 may be configured to be partially open or partially closed to provide additional functionality with respect to controlling the flow rate of fluid flowing therethrough.

[0039]

[0052] According to one or more further embodiments, disclosed herein is an electronic device manufacturing system having a fluid line 570 as shown in FIG. 5A and FIG. 5B with a temperature actuated valve 500 as described in one or more embodiments described herein. In an embodiment, the fluid flowing through the fluid line 570 has a variable temperature sufficient to expand and compress the shape memory alloy of one or more temperature actuated members 516, 518, thereby at least partially opening and at least partially closing the valve 500. For example, the temperature of the fluid flowing through the line 570 may be from about 10° C. to about 120° C., or any individual value or subrange within this range. In one or more embodiments, the fluid is a coolant. Suitable fluids include, but are not limited to, liquid water, purified liquid water, water vapor, glycol, ethylene glycol, propylene glycol, liquid nitrogen, nitrogen gas, air, argon, liquid helium, helium gas, or a compatible mixture of any two or more of the foregoing.

[0040]

[0053] The temperature activated valve 500 can be easily installed in a fluid line 570 of an electronic device manufacturing system using, for example, threaded connectors and tubing. Although Figures 5A and 5B show an in-line threaded connector, it should be understood that any suitable valve end connector can be used, including, but not limited to, pipe threads, socket weld, butt weld, soldered, adhesive socket, flanges, tri-clamp, compression, push-in, barbed hose, union / true union, manifold mount, and combinations thereof.

[0041]

[0054] An electronic device manufacturing system operating with temperature activated valves 200, 300, 400, 500 according to various embodiments herein can reduce the consumption of fluids, particularly fluids having variable temperatures used to heat or cool devices, chemicals and / or processes. In some embodiments, installation of a temperature activated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) of an electronic device manufacturing system can reduce fluid consumption by about 10% to about 50%, or any individual value or subrange within this range. In some embodiments, installation of a temperature activated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) of an electronic device manufacturing system can reduce energy demand by about 1% to about 99%, or any individual value or subrange within this range.

[0042]

[0055] In some embodiments, electronic device manufacturing systems operating with temperature activated valves 200, 300, 400, 500 according to various embodiments of the present disclosure can reduce the amount of water consumed by the system reducing environmental and health impacts. Companies and governments continue to seek to reduce the environmental health and safety costs of semiconductor equipment and make such equipment and associated processes sustainable in the long term. In addition to reducing the water consumed by such systems, supporting equipment and processes also benefit from reduced power and energy required to circulate the water.

[0043]

[0056] 6 is a block diagram illustrating a method 600 for reducing fluid consumption in an electronic device manufacturing system. At block 602, the method includes flowing a fluid through a temperature activated valve according to one or more embodiments described herein. In some embodiments, the fluid is a coolant. Suitable fluids include, but are not limited to, liquid water, purified liquid water, water vapor, glycol, ethylene glycol, propylene glycol, liquid nitrogen, nitrogen gas, air, argon, liquid helium, helium gas, or a compatible mixture of any two or more of the foregoing.

[0044]

[0057] At block 604, the method 600 includes opening and closing a temperature actuated valve based on the temperature of the fluid. According to an embodiment, when the temperature of the fluid is at a first temperature, at least one temperature actuated member of the temperature actuated valve contracts, causing the at least one temperature actuated member to contract. The contraction of the at least one temperature actuated member at least partially closes the opening of the movable member from the opening of the fixed member, thereby decreasing the flow rate of the fluid. In some embodiments, the first temperature is about 12° C. to about 40° C., or any individual value or subrange within this range. When the temperature of the fluid is at a second temperature, the at least one temperature actuated member expands, causing the at least one temperature actuated member to expand. The expansion of the at least one temperature actuated member at least partially aligns the opening of the movable member with the opening of the fixed member, thereby increasing the flow rate of the fluid. In some embodiments, the second temperature is about 40° C. to about 90° C., or any individual value or subrange within this range.

[0045]

[0058] In some embodiments, at block 606, the method 600 includes reducing fluid consumption in the electronic device manufacturing system. In one or more embodiments, installation of a temperature activated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) of an electronic device manufacturing system may reduce fluid consumption by about 10% to about 50%, or any individual value or subrange within this range. In some embodiments, installation of a temperature activated valve 200, 300, 400, 500 in a variable temperature fluid line (e.g., a coolant line) of an electronic device manufacturing system may reduce energy demand by about 1% to about 99%, or any individual value or subrange within this range. In some embodiments, the method 600 includes flowing a liquid having a first temperature, closing the temperature activated valve, flowing a liquid having a second temperature, and opening the temperature activated valve.

[0046]

[0059] References throughout this specification, for example, to "one embodiment," "a particular embodiment," "one or more embodiments," or "an embodiment," mean that a particular feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. Thus, the appearances of phrases such as "in one or more embodiments," "in a particular embodiment," "in one embodiment," or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment of the invention. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0047]

[0060] As used herein, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to "a robot arm" includes not only a single robotic arm, but also multiple robotic arms.

[0048]

[0061] As used herein, the term "about" in connection with a measurand refers to the normal variation in that measurand that would be expected when one of ordinary skill in the art makes the measurement and exercises a level of care commensurate with the purpose of the measurement and the precision of the measurement device. In certain embodiments, the term "about" includes ±10% of the referenced number, such that "about 10" includes 9 to 11.

[0049]

[0062] The term "at least about" in relation to a measurable quantity refers to the normal variation in the measurable quantity that would be expected when one of ordinary skill in the art makes the measurement and exercises a level of care commensurate with the purpose of the measurement and the precision of the measurement device, and any quantity greater than that. In certain embodiments, the term "at least about" includes the recited number minus 10% and any quantity greater than that, such as "at least about 10" including 9 or greater. The term can also be expressed as "about 10 or greater." Similarly, the term "less than about" typically includes the recited number plus 10% and any quantity less than that, such as "less than about 10" including 11 or less. The term can also be expressed as "less than about 10."

[0050]

[0063] Unless otherwise indicated, all parts and percentages are by weight. Weight percent (wt.%) is based on the total composition free of volatiles, i.e., dry solids, unless otherwise indicated.

[0051]

[0064] The foregoing description discloses exemplary embodiments of the present disclosure. Modifications of the above disclosed assemblies, devices, and methods that fall within the scope of the present disclosure will be readily apparent to those of ordinary skill in the art. Thus, although the present disclosure has been disclosed in connection with exemplary embodiments, it should be understood that other embodiments may be included within the scope of the present disclosure, as defined by the following claims.

Claims

1. 1. A temperature activated valve, comprising: a fixed member and a movable member, the fixed member configured to receive the movable member; a first flow passage defined between an outer surface of the stationary member and an inner surface of a housing; a second flow path defined by and within the movable member; at least one temperature actuated member including a first end seated against a base of the fixed member and a second end seated against a base of the movable member, the at least one temperature actuated member comprising a shape memory alloy; a bias member including a first end connected to a base of the fixed member and a second end connected to a base of the movable member; Equipped with a temperature actuated valve, the at least one temperature actuated member configured to contract at a first temperature to reduce an opening to the second flow path and to expand at a second temperature to increase an opening to the second flow path.

2. The temperature actuated valve of claim 1 , further comprising an adjustment member attached to said biasing member, said adjustment member operable to adjust the tension of said biasing member.

3. 2. The temperature actuated valve of claim 1, wherein the fixed member, the movable member, the housing, and the biasing member each independently comprise stainless steel, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or a combination of any two or more of the foregoing.

4. The temperature activated valve of claim 1 , wherein the shape memory alloy comprises at least one of a spring, a coil spring, a bellows spring, a Belleville spring, a leaf spring, or a spring cylinder.

5. 2. The temperature actuated valve of claim 1, further comprising at least one guide member having a first end seated against a base of the fixed member and a second end seated against a base of the movable member, the at least one guide member extending through the at least one temperature actuated member.

6. The temperature actuated valve of claim 1 , wherein the at least one temperature actuated member and the moveable member each include a plurality of flow elements.

7. 7. The temperature actuated valve of claim 6, wherein the plurality of flow elements comprises one or more of openings, orifices, holes, perforations, divots, protrusions, fins, louvers, roughness elements, rough surfaces, or a combination of any two or more of the foregoing.

8. 10. The temperature actuated valve of claim 1, wherein at least one of the at least one temperature actuated member or the at least one biasing member is in the form of a spring, a coil spring, a bellows spring, a Belleville spring, a leaf spring, or a spring cylinder.

9. 2. The temperature actuated valve of claim 1, further comprising a plurality of temperature actuated members and a plurality of corresponding guide members, each guide member having a first end seated against a base of the fixed member and a second end seated against a base of the movable member, each of the plurality of guide members extending through a corresponding temperature actuated member.

10. 1. An electronic device manufacturing system, comprising:

1. A fluid line containing a fluid having a variable temperature and further comprising a temperature activated valve, said temperature activated valve comprising: a fixed member and a movable member, the fixed member configured to receive the movable member; a first flow passage defined between an outer surface of the stationary member and an inner surface of a housing; a second flow path defined by and within the movable member; at least one temperature actuated member including a first end seated against a base of the fixed member and a second end seated against a base of the movable member, the at least one temperature actuated member comprising a shape memory alloy; a bias member including a first end connected to a base of the fixed member and a second end connected to a base of the movable member; Including, the at least one temperature actuated member is configured to contract at a first temperature to reduce an opening to the second flow path and to expand at a second temperature to increase an opening to the second flow path. An electronic device manufacturing system comprising a fluid line.

11. The electronic device manufacturing system of claim 10 , wherein the fluid is a coolant.

12. The electronic device manufacturing system of claim 10 , further comprising an adjustment member attached to the bias member, the adjustment member operable to adjust a tension in the bias member.

13. 11. The electronic device manufacturing system of claim 10, wherein the fixed member, the movable member, the housing, and the bias member each independently comprise stainless steel, plastic, copper, brass, bronze, aluminum, nickel-cobalt alloy, iron, or a combination of any two or more of the foregoing.

14. The electronic device manufacturing system of claim 10 , wherein the shape memory alloy comprises at least one of a nickel-titanium alloy, a nickel-titanium-cobalt alloy, a nickel-titanium-copper alloy, or a combination thereof.

15. 11. The electronic device manufacturing system of claim 10, further comprising at least one guide member having a first end seated against a base of the fixed member and a second end seated against a base of the movable member, the at least one guide member extending through the at least one temperature actuated member.

16. The electronic device manufacturing system of claim 10 , wherein the at least one temperature actuated member and the moveable member each include a plurality of flow elements.

17. 11. The electronic device manufacturing system of claim 10, wherein at least one of the at least one temperature actuated member or the at least one biasing member is in the form of a spring, a coil spring, a bellows spring, a Belleville spring, a leaf spring, or a spring cylinder.

18. 11. The electronic device manufacturing system of claim 10, wherein the temperature actuated valve includes a plurality of temperature actuated members and a plurality of corresponding guide members, each guide member having a first end seated against a base of the fixed member and a second end seated against a base of the movable member, each of the plurality of guide members extending through a corresponding temperature actuated member.

19. 1. A method for reducing fluid consumption in an electronic device manufacturing system, comprising: flowing a fluid through a temperature activated valve positioned in a fluid line of the electronic device manufacturing system, the temperature activated valve comprising: a fixed member and a movable member, the fixed member configured to receive the movable member; a first flow passage defined between an outer surface of the stationary member and an inner surface of a housing; a second flow path defined by and within the movable member; at least one temperature actuated member including a first end seated against a base of the fixed member and a second end seated against a base of the movable member, the at least one temperature actuated member comprising a shape memory alloy; a bias member including a first end connected to a base of the fixed member and a second end connected to a base of the movable member; flowing a fluid through a temperature activated valve positioned in a fluid line of the electronic device manufacturing system; opening and closing the temperature actuated valve based on a temperature of the fluid; Including, the at least one temperature actuated member is configured to contract when the fluid is at a first temperature, causing the valve to have a smaller opening to the second flow path, and to expand when the fluid is at a second temperature, causing the valve to at least partially open and have a larger opening to the second flow path.

20. The method of claim 19, wherein the shape memory alloy comprises at least one of a nickel-titanium alloy, a nickel-titanium-cobalt alloy, a nickel-titanium-copper alloy, or a combination thereof.

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