Wearable Heat Transfer Devices and Associated Systems - Patent application

Abstract

Thermal management devices and associated systems and methods are disclosed herein. In some embodiments, a representative device may comprise (i) a thermoelectric component (TEC) including a first side and a second side opposite the first side, each configured to be operated at a desired temperature, and (ii) a heat transfer system including an array of fluid distribution networks, an inlet passage coupled to the fluid distribution network, and an outlet passage coupled to the fluid distribution network. In operation, a working fluid flows through the fluid distribution network from the inlet passage to the outlet passage and absorbs heat from the fluid distribution network. The inlet and outlet passages may be fluidly coupled to the respective fluid distribution networks such that the pressure drop and / or temperature drop of the working fluid across the respective fluid distribution networks are approximately identical to one another.

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 266,401, filed January 4, 2022, the disclosures of which are incorporated herein by reference in their entireties, and is related to U.S. Provisional Patent Application No. 17 / 183,313, entitled "WEARABLE HEAT TRANSFER DEVICES AND ASSOCIATED SYSTEMS AND METHODS," filed February 23, 2021, and U.S. Patent Application No. 18 / 149,574, entitled "OCULAR REGION HEAT TRANSFER DEVICES AND ASSOCIATED SYSTEMS AND METHODS," filed January 3, 2023.

[0002] The present disclosure relates to heat transfer devices, and associated systems and methods, configured to be worn by a user. [Background technology]

[0003] Many types of devices and systems produce significant heat flux, and there is a growing demand for advanced and efficient systems that can extract and dissipate such heat flux and keep the temperature within an acceptable operating range. Many wearable devices, for example, dissipate heat from a target area to reduce pain or swelling, change tissue structure (e.g., reduce adipose tissue and treat skin conditions), or alleviate localized heating of tissue caused by other procedures (e.g., laser treatments). Although wearable devices are desirably lightweight and portable, this presents a challenge for dissipating significant heat flux, which is required in many applications. As a result, a significant gap exists between the heat transfer performance required for many applications and that of existing devices and systems. For example, current heat transfer systems are often large and heavy to provide adequate heating or cooling to control swelling and other post-surgical applications. Thus, such systems can be cumbersome and uncomfortable in wearable devices, which are often too large and unable to work with the complex contours of certain anatomical features. Furthermore, thermal therapy applications for more sensitive areas, such as under-eye tissue, are limited and often unable to provide consistent active cooling treatment for the required time duration required to freeze and kill the corresponding fat cells. As a result, a need exists for improved wearable heat transfer devices. [Brief description of the drawings]

[0004] The features, aspects, and advantages of the techniques of the present disclosure may be better understood with regard to the following drawings.

[0005] [Figure 1] FIG. 1 is a partial schematic cross-sectional view of a heat transfer device around a portion of a mammal, in accordance with an embodiment of the present technology.

[0006] [Diagram 2] 2 is a partially schematic, enlarged cross-sectional view of a portion of the heat transfer device shown in FIG.

[0007] [Figure 3A] 3A is a partially schematic cross-sectional isometric view of a portion of the heat transfer device shown in FIG. 2. FIG.

[0008] [Figure 3B] FIG. 3B is a partial schematic cross-sectional isometric view of a heat transfer structure in accordance with an embodiment of the present technology.

[0009] [Figure 4] FIG. 4 is a partial schematic top view of the heat transfer device of FIG.

[0010] [Figure 5A] FIG. 5A is a partial schematic top view of a heat transfer system of a wearable heat transfer device in accordance with an embodiment of the present technology.

[0011] [Figure 5B] FIG. 5B is a partial schematic cross-sectional side view of the heat transfer system of FIG. 5A.

[0012] [Figure 6] FIG. 6 is a partial schematic top view of a heat transfer system of a heat-transfer device, in accordance with an embodiment of the present technology.

[0013] [Figure 7] FIG. 7 is a partial schematic bottom view of a heat-transfer device with a thermally conductive member in accordance with an embodiment of the present technology.

[0014] [Figure 8A] FIG. 8A is a partial schematic bottom view of an expandable heat transfer device in an unexpanded state and including a thermally conductive member in accordance with an embodiment of the present technology.

[0015] [Figure 8B] FIG. 8B is a partial schematic bottom view of the heat-transfer device of FIG. 8A in an expanded state.

[0016] [Figure 9]FIG. 9 is a partial schematic bottom view of a heat-transfer device expandable in multiple directions and including a thermally conductive member in accordance with an embodiment of the present technology.

[0017] [Figure 10] FIG. 10 is a schematic exploded isometric view of a heat-transfer device including a thermally conductive member in accordance with an embodiment of the present technique.

[0018] [Figure 11] FIG. 11 is a schematic exploded isometric view of a heat-transfer device with a thermally conductive member in accordance with an embodiment of the present technology.

[0019] [Figure 12] FIG. 12 is a schematic top view of an arrangement of thermoelectric components of a heat-transfer device in accordance with an embodiment of the present technology.

[0020] [Figure 13] FIG. 13 is a schematic top view of an arrangement of thermoelectric components of a heat-transfer device in accordance with an embodiment of the present technology.

[0021] [Figure 14] FIG. 14 is a schematic top view of an arrangement of thermoelectric components of a heat-transfer device in accordance with an embodiment of the present technology.

[0022] [Figure 15A] FIG. 15A is a partial schematic diagram of a heat-transfer device being worn by a human in accordance with an embodiment of the present technology.

[0023] [Figure 15B] 15B-15D are partial schematic diagrams of a heat transfer system including the heat transfer device of FIG. 15A in accordance with an embodiment of the present technology. [Figure 15C] 15B-15D are partial schematic diagrams of a heat transfer system including the heat transfer device of FIG. 15A in accordance with an embodiment of the present technology. [Figure 15D]15B-15D are partial schematic diagrams of a heat transfer system including the heat transfer device of FIG. 15A in accordance with an embodiment of the present technology.

[0024] [Figure 16] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 17] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 18] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 19] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 20] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 21] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 22] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 23] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology. [Figure 24] 16-24 are partial schematic diagrams of heat transfer devices worn by a human at various target areas in accordance with embodiments of the present technology.

[0025] [Diagram 25]FIG. 25 is a schematic block diagram illustrating a system incorporating a heat transfer device in accordance with an embodiment of the present technology.

[0026] [Figure 26] FIG. 26 is a flow diagram illustrating a method for treating a human via a heat transfer device in accordance with an embodiment of the present technology.

[0027] [Figure 27] FIG. 27 is a flow diagram illustrating a method for controlling the temperature of a target area of ​​a human using a heat-transfer device in accordance with an embodiment of the present technology.

[0028] Those skilled in the art will appreciate that the features shown in the drawings are for illustrative purposes and that variations, including different and / or additional features and arrangements thereof, are possible. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] Detailed Description I. Overview Many types of devices and systems produce significant heat flux, and there is a growing demand for advanced and efficient systems that can extract and dissipate such heat flux and keep the temperature within an acceptable operating range. Many wearable devices, for example, dissipate heat from a target area to reduce pain or swelling, change tissue structure (e.g., reduce adipose tissue and treat skin conditions), or alleviate localized heating of tissue caused by other procedures (e.g., laser treatments). Although wearable devices are desirably lightweight and portable, this presents a challenge for dissipating significant heat flux, which is required in many applications. As a result, a significant gap exists between the heat transfer performance required for many applications and that of existing devices and systems. For example, current single-phase systems are often too large and heavy to provide adequate heating or cooling to control swelling and other post-surgical applications. Thus, such systems can be cumbersome and uncomfortable in wearable devices, and they are often too large and unable to work with the complex contours of certain anatomical features, including the knees, shoulders, ankles, legs, arms, back, head, neck, and / or elbow areas.

[0030] Sleeves with circulating coolant and ice / gel packs are currently the most widely accepted wearable heat transfer devices for thermally treating a target tissue area, e.g., reducing the temperature of the tissue. For example, with a fluid-circulating sleeve, a cryogenic fluid at a single temperature is circulated by a pump through a sleeve wrapped around the target area. The temperature of the tissue in the target area drops as heat is conducted across the sleeve and absorbed by the circulating cryogenic fluid. The heated fluid is returned to the ice bath, and the heat removed from the tissue is absorbed by the ice as it melts. Ice / gel packs similarly function by absorbing heat from the target area by warming the cryogenic ice or gel within the pack.

[0031] Both of these wearable devices have significant drawbacks, including (i) lack of temperature control to which the tissue is exposed or cold therapy control over the musculoskeletal or similar structures surrounding the target tissue, (ii) limited duration or capacity for cooling, (iii) inability to provide sustained cold therapy without adjustment or care of the device, and (iv) lack of flexibility of the device, e.g., due to pressurized liquid flow and / or rigidity of ice packs, in that it causes an uncomfortable fit for the user. The lack of flexibility may further limit the amount of heat transfer between the device and the user, as the inflexible nature of the device prevents a comfortable fit and / or optimal thermal contact between the device and the user. As a result, current wearable devices are unable to properly thermally treat the target area of ​​a mammal and are generally ineffective in treating underlying conditions (e.g., pain, swelling, overheating, reduced blood perfusion, reduced neural connectivity, stroke, etc.).

[0032] The embodiments of the present disclosure address at least some of the problems described above by providing thermal management devices and systems that, among other features, are safer, allow better temperature control, are flexible, and are lighter and thinner than current related devices, thereby enabling improved thermal contact between the device and a user / mammal. For example, as described herein, the embodiments of the present disclosure can include (i) thermoelectric components arranged in an array and spaced apart from one another for thermally coupling to a target of the mammal, and (ii) a heat transfer system thermally coupled to the thermoelectric components. The heat transfer system can include a heat exchanger, a fluid distribution network, an inlet (and / or low temperature working fluid) passage fluidly coupled to the fluid distribution network and configured to provide a working fluid to the fluid distribution network, and an outlet (and / or high temperature working fluid) passage fluidly coupled to the fluid distribution network and configured to receive the working fluid from the fluid distribution network. In some embodiments, the thermal management devices and systems include a flexible support unit coupled to the thermoelectric components and configured to compress against a target area of ​​the mammal such that the thermoelectric components are arranged to thermally treat the target area. The flexible support unit may include a thermally conductive member positioned across the two or more thermoelectric components to distribute heat between the thermoelectric components and the device. Each of the thermoelectric components can be controlled (e.g., set to a particular temperature) by a controller operatively coupled thereto, either individually or as a group. Thus, individual regions of the device can be set to different temperatures relative to other regions, thus individually treating corresponding target areas of a mammal on or around which the device is positioned. When in cooling mode, heat can flow from the target areas to the thermoelectric components and heat transfer system. By doing so, embodiments of the present disclosure allow for fast and controlled cooling to treat certain underlying conditions, such as pain, swelling, overheating, reduced blood perfusion, reduced nerve connectivity, and / or stroke, while mitigating damage to epidermal and / or dermal tissue.

[0033] In some embodiments, the fluid distribution network (also referred to herein as a heat transfer structure) of the heat transfer system includes a first fluid distribution network and a second fluid distribution network, in which the first fluid distribution network is coupled to a first area of ​​the inlet passage and the second fluid distribution network is coupled to a second area of ​​the inlet passage downstream of the first area of ​​the inlet passage. In such an embodiment, the first fluid distribution network can be coupled to a first area of ​​the outlet passage and the second fluid distribution network is coupled to a second area of ​​the outlet passage downstream of the first area of ​​the outlet passage. Advantageously, such an embodiment of the thermal management device allows the pressure drop of the working fluid across each of the fluid distribution networks to be approximately equal or differ from each other by less than a predetermined pressure threshold (e.g., within 10%). In other words, the pressure of the working fluid at the inlet and outlet of the individual fluid distribution networks may be different, but the pressure drop of the working fluid across each of the fluid distribution networks is approximately equal or differs by less than a predetermined pressure threshold. Additionally or alternatively, as a result of the pressure drop profile, the temperature drop across each of the fluid distribution networks is also approximately equal or differs by less than a predetermined temperature threshold (e.g., within 10%). This common temperature profile can help ensure that the amount of heat removed from the individual TECs across the device is approximately the same (e.g., on a proportional basis), thereby allowing the device to be more effective at removing or regulating heat from the target area and / or surrounding region.

[0034] In the figures, the same reference numbers generally identify similar and / or identical elements. Many of the details, dimensions, and other features shown in the figures are merely illustrative of specific embodiments of the disclosed technology. Thus, other embodiments can have other details, dimensions, and features without departing from the spirit or scope of the disclosure. In addition, those skilled in the art will appreciate that further embodiments of the various disclosed technologies can be practiced without some of the details described below. II. HEAT TRANSFER DEVICES AND ASSOCIATED SYSTEMS AND METHODS

[0035] 1 is a partial schematic cross-sectional view of a heat transfer device 100 ("device 100") around a portion of a mammal or human 10 ("human 10"), in accordance with an embodiment of the present technology. As shown in the illustrated embodiment, device 100 includes (i) a flexible support unit 105 that is at least partially wrapped around a portion or target area of ​​human 10 (e.g., skin, tissue, arm, leg, knee, ankle, foot, shoulder, head, neck, face, elbow, or any other body part area), (ii) a thermoelectric component or module 110 ("TEC 110") that is thermally coupled to human 10 across flexible support unit 105, and (iii) a heat transfer system or unit 115 that is thermally coupled to TEC 110 and configured to remove heat therefrom. As described in additional detail herein, heat transfer system 115 includes a single-phase heat transfer system, and in some embodiments, a two-phase heat transfer system. In operation, the TEC 110 can be set to a particular temperature and therefore configured to heat and / or cool a target area of ​​the human 10. When the device 100 is in a cooling mode, for example, the heat flow (H F) transfers from the human 10 to the flexible support unit 105, the individual TECs 110, and the heat transfer system 115. As heat is removed from the human 10 in such a manner, a cooling zone 15 on the target area can be formed and extend to a cooling depth (D1) of the human. The depth (D1) can be at least 1 millimeter (mm), 2 mm, 3 mm, 4 mm, or 5 mm, or within the range of 1-5 mm or any incremental range thereof (e.g., 1.5-3 mm). The cooling zone 15 can correspond to a heating zone when the device 100 is in a heating mode.

[0036] 2 is a partially schematic, enlarged cross-sectional view of a portion of the device 100 of FIG. 1 in accordance with an embodiment of the present technique. The heat transfer system 115 of FIGS. 1 and 2 is a single-phase heat transfer system. In some embodiments, the heat transfer system 115 can be a two-phase heat transfer system. The heat transfer system 115 includes (i) an array of fluid distribution networks or heat transfer structures 120, each thermally coupled to a corresponding one of the TEC 110, and (ii) a working fluid (WF) at a cryogenic temperature. C (iii) a cold working fluid (WF C ) at high temperatures, which is higher than the temperature of the working fluid (WF H The device 100 may include a heated working fluid passage 140 (e.g., an outlet working fluid passage) configured to receive the heated working fluid (WF) from each of the heat transfer structures 120 (e.g., at a respective outlet 142 of each of the heat transfer structures 120), (iv) an insulating member 150, and (v) a heat exchanger 160. In some embodiments, the insulating member 150 is omitted from the device 100. The heat exchanger 160 is configured to receive the heated working fluid (WF H ) from the heated working fluid passage 140 and a cold working fluid (WF C) to the cold working fluid passage 130. In some embodiments, the heat exchanger 160 is passively air-cooled or actively cooled with a cooling fluid provided via one or more pumps.

[0037] The TEC 110 can comprise semiconductor-based electronic components configured to transfer heat from one side of the TEC 110 to a second, opposing side of the TEC 110. The TEC 110 can provide precise, controllable, and / or localized temperature control at an interface between a target area and the device 100. As shown in FIG. 1, the TEC 110 can be thermally coupled to the human 10 and set by a controller (e.g., controller 2594; FIG. 27) to a particular temperature and / or a predetermined temperature profile (e.g., a constant temperature profile, a temperature cycle profile, and / or a time-based profile) to cool and / or heat an adjacent target area of ​​the human 10. Setting the TEC 110 to a particular temperature can include providing an electrical current to the TEC 110 that corresponds to that temperature. For example, setting the first TEC 110 to a first temperature can include providing a first current level to the first TEC 110, and setting the second TEC 110 to a second temperature different from the first temperature can include providing a second current level different from the first current to the second TEC 110. By doing so, the human 10 can receive a desired therapy only in certain target areas.

[0038] As an example of how the TEC 110 may be operated, in some embodiments, a first side of the TEC 110 facing the human 10 or a second side of the TEC 110 facing the heat transfer structure 120 may be set to a temperature within a range of 45° C. to −20° C. (e.g., 40° C., 35° C., 20° C., 5° C., 0° C., −5° C., −10° C., −15° C., etc.). In some embodiments, the TEC 110, either alone or in combination with the heat transfer structure 120, may be configured such that the second side of the TEC 110 is set or held at a first temperature or first temperature range and the first side of the TEC 110 is controlled to cool from a normal body surface temperature to a second temperature or second temperature range. In such embodiments, the second temperature or second temperature range may be higher or lower than the first temperature or first temperature range (e.g., higher or lower than 5° C., 10° C., 20° C., 30° C., or 40° C.). Additionally or alternatively, in response to setting the temperature on the second side of the TEC 110, the first side of the TEC 110 can be configured to reach the desired temperature within a predetermined time, for example, 10 seconds or less, 20 seconds or less, 30 seconds or less, 40 seconds or less, or 60 seconds or less, or within a range of 10-60 seconds or any increment therebetween. As disclosed herein, operation of the TEC 110 may be based on signals received from one or more sensors configured to detect the temperature of the target area, the first side of the TEC 110, or the second side of the TEC 110.

[0039] The TEC 110 can be placed in a heating mode, a cooling mode, or cycled between heating and cooling to control the temperature in the target area. The heat flow across an individual TEC 110 can be a function of the temperature difference between its two sides and / or the power input provided to the individual TEC 110 from a power source (e.g., power source 2592; FIG. 25). The mode and / or mode of operation can be selected based on a predetermined cycle time, temperature sensor feedback, and / or other parameters. When in the heating mode, the TEC 110 can provide heat to the target area of ​​the human 10 by heating a first side of the TEC 110 (e.g., via the flexible support unit 105), which causes a second side of the TEC 110 to cool. The heat transfer structure 120 can be controlled (e.g., turned off) to mitigate further cooling of the second side of the TEC 110. In some embodiments, the device 100 can further comprise an additional resistive heater that can be controlled via the controller and configured to heat an adjacent target area of ​​the human 10.

[0040] When in the cooling mode, the heat transfer structure 120 is configured to remove heat from the hotter second side of the TEC 110, thereby allowing the first side of the TEC 110 to cool an adjacent target area of ​​the human 10. Thus, in the cooling mode, heat flows radially outward from the target area of ​​the human 10 to the TEC 110 and then to the heat transfer structure 120. As described above, the TEC 110 can also cycle between heating and cooling modes, which may improve blood flow and perfusion to the target area. In some embodiments, the parameters of the cooling and / or heating modes are based on or limited by safety considerations, such as a maximum heating or cooling temperature and / or a maximum amount of heating or cooling time (e.g., 15 minutes, 20 minutes, etc.). Additional details regarding the individual TECs 110 are provided herein (see, e.g., FIGS. 3 and 5).

[0041] The heat transfer system 115 may comprise a closed-loop single-phase system, where the flow of the working fluid through the heat transfer system 115 is driven by heat transfer from the TEC 110 to the individual heat transfer structures 120. In some embodiments, the heat transfer system may comprise a closed-loop two-phase system or may include one or more pumps that drive the flow of the working fluid through the heat transfer system 115. Additionally or alternatively, the flow of the working fluid through the heat transfer system 115 is driven by gravity. For example, when driven by gravity, the heat exchanger 160 may be physically located above other portions of the heat transfer system 115 (e.g., the heat transfer structures 120) such that gravity can provide sufficient force to circulate the working fluid to the transfer structures, where the temperature of the working fluid is increased, via the heated working fluid passages 140, and back to the heat exchanger 160. Additionally or alternatively, the flow of the working fluid through the heat transfer system 115 can be driven by capillary forces induced by microfeatures (e.g., posts, pins, or walls) that form channels within the chamber of the heat transfer structure 120 that drive the cold working fluid from the inlet of the chamber towards the outlet of the chamber. Additionally or alternatively, in some embodiments, the heat transfer system 115 can be configured to pump an excess amount of cold working fluid (WF C ) and, for example, a low temperature working fluid (WF C ) can be supplied continuously. The buffer reservoir may be beneficial, particularly when device 100 operates at more extreme temperatures (e.g., 45° C., −20° C., etc.). In some embodiments, the buffer reservoir and heat exchanger 160 may comprise a single integrated unit.

[0042] Each of the heat transfer structures 120 may include a chamber 320, a base substrate or member 322 within the chamber 320, micro-features 324 protruding from the base member 322, and channels 326 formed between and defined by adjacent ones of the micro-features 324. The heat transfer structures 120 may comprise a monolithic structure (e.g., a single component) and thus may include a continuous surface extending along the base member 322 and the channels 326. As shown in FIG. 2, a working fluid (WF C and W.F. H ) may be positioned within the channel 326 and form a meniscus, which may be due in part to the nature of the working fluid and the microfeatures 324, more specifically, the heat of the microfeatures 324 and the arrangement (e.g., spacing) of the microfeatures 324 relative to one another. Without being bound by theory, the meniscus may form a thin film portion at the interface with the adjacent microfeature walls that enhances efficient heat transfer from the TEC 110 to the heat transfer structure 120 and the working fluid. In operation, the heat and / or arrangement of the microfeatures 324 induce capillary forces on the working fluid, moving the working fluid from the inlet region 132 at a first end of the chamber 320 to the outlet region 142 at a second, opposing end of the chamber 320. Individual microfeatures 324 may have a lateral dimension (D1) of 5 microns to 250 microns and may be spaced apart from adjacent microfeatures 324 by a lateral dimension (D2) of 5 to 1,000 microns.

[0043] As shown in the illustrated embodiment, the micro-features 324 extend from the base member 322 away from the TEC 110. In other embodiments, the heat transfer structure 120 can be positioned in a facing orientation with the base member 322 adjacent the cold working fluid passage 130 or the insulating member 150 and micro-features extending from the base member 322 toward the TEC 110. In such embodiments, the heat transfer structure 120 is adjacent the TEC 110 and is configured to pass the cold working fluid (WF C ) and the end portion of the micro-feature 324 is provided with a reservoir containing a cold working fluid (WF C In operation, the microfeatures 324 act to draw capillary forces into the cold working fluid (WF C) to increase its temperature and exit the chamber 320 through the heated working fluid passage 140. H ) is generated.

[0044] Each of the heat transfer structures 120 spans one or more TECs 110. A cold working fluid passage 130 and a heated working fluid passage 140 are fluidly coupled to each of the heat transfer structures 120, and more specifically, to the chamber 320 of the heat transfer structure 120. For example, for each individual heat transfer structure 120, a cold working fluid (WF C ) is provided from the cold working fluid passage 130 to an inlet 132 (e.g., one of the inlets) of the chamber 320 of the heat transfer structure 120. C As the working fluid (WF) absorbs heat, it becomes heated at a higher temperature. H ) and directed through an outlet 142 (e.g., one of several outlets) of the chamber 320 of the heat transfer structure 120 to the heated working fluid passage 140. The heated working fluid passage 140 and the cold working fluid passage 130 are each fluidly connected to a heat exchanger 160 and are part of a closed loop system. Thus, the heated working fluid (WF H ) is the low temperature working fluid (WF C ) into the heat exchanger 160 and a low temperature working fluid (WF C ) is thereby driven from the heat exchanger 160 into the cold working fluid passages 130, through which it flows in a sustained cycle to each of the heat transfer structures 120. The heat exchanger 160 is shown diagrammatically in FIG. 2. In some embodiments, the heat exchanger 160 can be positioned radially inward from the thermal insulation member 150 and the radial periphery of each of the cold working fluid passages 130 and the heated working fluid passages 140 (e.g., the outermost elements of the heat transfer system). In some embodiments, the heat exchanger 160 can be physically positioned above the heat transfer structures 120, such that the cold working fluid (WF) provided from the heat exchanger 160 is C) has an additional head pressure, which can be beneficially used to increase the pressure of the cold working fluid (WF C ) can be provided for better circulation.

[0045] 2 (and the corresponding areas of the cold working fluid path 130 and the heated working fluid path 140) can have different orientations. For example, some of the heat transfer structures 120 are positioned generally parallel to gravity, others are positioned at an angle to gravity, and still others are positioned generally perpendicular to gravity. Thus, in some embodiments, the heat transfer system 115 can operate despite these different orientations and / or be substantially insensitive to gravity acting on the device 100. That is, the heat transfer system 115 and its individual elements (e.g., heat transfer structures 120) can operate regardless of their orientation relative to gravity.

[0046] The insulating member 150 can be the outermost layer or element and / or can be at the periphery of the heat transfer system and can fully or partially surround other elements of the device 100. The insulating member 150 can prevent or inhibit heat leakage from the device 100 to the surrounding environment and / or from the surrounding environment to the device 100. In practice, the insulating member 150 can also act as a protective barrier between a user (e.g., human 10) and other elements of the device 100, which may have more extreme temperatures.

[0047] In some embodiments, the insulating member 150 can have additional functionality and / or perform other functions. For example, in some embodiments, the insulating member 150 can be configured to contain compressed air (or other fluid) with adjustable pressure to increase and / or decrease the contact pressure applied from the device 100 onto the target area of ​​the human 10. Modifying such pressure can modify blood flow to and / or from the target area, which can be beneficial for treating swelling and / or pain. For example, in some embodiments, the device 100 can cool the target area of ​​the human 10 at pressure (e.g., compression) applied via the insulating member 150 or other members of the device 100 for a period of time (e.g., 15-20 minutes), and then pause the thermal cooling and decrease the applied pressure for a period of time (e.g., 5-10 minutes). By decreasing the applied pressure, blood flow to the target area is enhanced while the target area remains cooled. Additionally or alternatively, the ability to adjust the applied pressure of the device and the compressive force it is applying to the target area can eliminate the need to remove and refasten the device 100.

[0048] The TEC 110 of device 100 may include a thermoelectric first face 312 on a first side of the TEC 110 and adjacent the flexible support unit 105, a thermoelectric second face 316 on a second, opposing side of the TEC 110 and adjacent the heat transfer structure 120, and thermoelectric legs or posts 314 extending between the first face 312 and the second face 316. In some embodiments, the second face 316 may be omitted and the legs 314 are in direct contact with the heat transfer structure 120. 2, the TEC 110 and the heat transfer system 115, including the heat transfer structure 120, the cold working fluid path 130, and the heated working fluid path 140, can both have a dimension (D3) of 1 mm or less, 3 mm or less, 5 mm or less, 10 mm or less, 15 mm or less, 25 mm or less, or 30 mm or less, or in the range of 1 millimeter (mm) to 30 mm, or any increment therebetween. In some embodiments, the TEC 110 and the heat transfer structure 120 can both have a dimension (D4) of 1 mm or less, 3 mm or less, 5 mm or less, 10 mm or less, 15 mm or less, 25 mm or less, or 30 mm or less, or in the range of 1 mm to 30 mm, or any increment therebetween.

[0049] In some embodiments, the TEC 110 (e.g., first surface 312, second surface 316, and / or legs 314) can comprise a rigid material that is generally inflexible. In such embodiments, it may be desirable to limit the footprint of an individual TEC 110 to ensure that the device 100 (or any other heat transfer device disclosed herein) maintains overall flexibility and can conform to the periphery or geometry of the target area (e.g., knee). That is, when the footprint of the TEC 110 is smaller and the rigid portion of the device 100 therein is smaller, the device 100 has sufficient flexibility between the flexible support unit 105 to the TEC 110 to at least generally conform to the periphery or geometry of the target area and improve thermal contact between the human and the TEC 110. In some embodiments, the TEC is less than 2 mm 2 Below, 3mm 2 Below, 4mm 2Below, 5mm 2 Below, 6mm 2 Below, 7mm 2 Below, 8mm 2 Less than or equal to 9mm 2 Less than or equal to 2-9mm 2 or any incremental range therebetween.

[0050] In some embodiments, the first surface 312, second surface 316, and / or legs 314 of the individual TEC 110 may comprise a flexible material, for example, allowing the TEC 110 to better conform to a target area when the device 100 is worn by a human. For those embodiments in which the TEC 110 is formed from a rigid material, for example, using a flexible material for the first surface 312 (i.e., hot side) of the TEC 110 may allow the TEC 110 to have a larger footprint because the flexibility of the device 100 is no longer limited by the TEC 110. By doing so, a larger thermal TEC 110 may allow for a higher capacity for heat transfer and / or reduce manufacturing costs for the device 100.

[0051] FIG. 3A is a cross-sectional isometric view of a portion of a device 100 according to an embodiment of the present technology. Only the TEC 110 and the heat transfer structure 120 are shown in FIG. 3A, and other elements of the device 100 are omitted for illustrative purposes. As shown in FIG. 3A, the heat transfer structure 120 has microfeatures 324 defined by continuous elongated walls that form continuous elongated channels 326 arranged in a plurality of rows. The channels 326 can have uniform widths along their lengths that are substantially the same as one another. In some embodiments, the channels 326 can have widths that vary along their lengths, for example, becoming narrower as they approach the inlet or outlet of the chamber. Additionally or alternatively, individual channels can be different (e.g., wider or narrower) than adjacent channels. Without being bound by theory, such channel designs can induce additional favorable pressure gradients on the liquid working fluid flow.

[0052] In some embodiments, the microfeatures may comprise structures that are not continuous elongated walls, but rather are other types of protrusions that extend into the chamber. For example, as shown in FIG. 3B, which illustrates a cross-sectional view of a portion of a heat transfer structure, the microfeatures 324 are posts or pins. As shown in FIG. 3B, the microfeatures 324 may be arranged in rows and columns or other suitable arrangements that define channels 326 in the spaces between the microfeatures 326. The pin-type microfeatures 324 shown in FIG. 3B have a straight cross-section, but they may also have circular or other cross-sectional shapes (e.g., hexagonal, octagonal, etc.). Also, as shown in FIGS. 3A and 3B, the working fluid (WF) in the channels 326 defined by the microfeatures 324 flows from the inlet region 132 (FIG. 3A) to the outlet region 142 (FIG. 3A) where it exits the chamber 320.

[0053] FIG. 4 is a partial schematic top view of the device 100 of FIG. 1 in accordance with an embodiment of the present technology. Some of the elements of the device 100 (as shown in FIG. 1) are removed from FIG. 4 to illustrate the layered arrangement of the elements of the device 100. As shown, the device 100 includes, in a radially outward direction, a flexible support unit 105, a heat transfer structure 120, a cold working fluid passage 130, a heated working fluid passage 140, and a thermal insulation member 150. For illustrative purposes, the heat exchanger 160 (as shown in FIG. 2) is not shown in FIG. 4, and the TEC 110 is covered by the heat transfer structure 120. The flexible support unit 105 is thermally coupled to and extends between each of the TECs 110. The flexible support unit 105 may comprise thermally conductive and / or flexible contact members that act as heat spreaders and enhance heat transfer to and / or from the target area of ​​the human 10 in the regions between the TECs 110. Additionally or alternatively, the flexible support unit 105 may comprise conductive and / or biocompatible materials including metals, metal alloys, coatings, polymers, silicones, and / or combinations thereof. In some embodiments, the thermally conductive members may comprise a metallic sheet or material on a first side of the contact members in contact with the individual TECs 110 and a non-metallic sheet or material on a second, opposing side of the thermally conductive members in contact with the human 10. In some embodiments, the flexible support unit 105 comprises an elastic wrap or material configured to be wrapped around the target area. The elastic wrap may be strapped with fasteners configured to retain the elastic wrap and apply a compressive force against the target area of ​​the human 10. 1 and 2, the TECs 110 each reside over a flexible support unit 105, which resides around the human 10. In some embodiments, the flexible support units 105 extend only between individual ones of the TECs 110, and the TECs 110 reside directly over (e.g., in direct contact with) the human 10. In some embodiments, the flexible support units 105 can be omitted entirely, and the TECs 110 reside over or directly over the human 10.

[0054] The device 100 may include one or more sensors 180a-f (collectively referred to as "sensors 180"), which are diagrammatically illustrated in FIG. 4. As shown, the device 100 may include a first sensor 180a on the insulating member 150 and configured to measure a desired parameter thereof (e.g., temperature, pressure, etc.), a second sensor 180b on the heated working fluid path 140 and configured to measure the desired parameter thereof, a third sensor 180c on the cold working fluid path 130 and configured to measure the desired parameter thereof, a fourth sensor 180d on the flexible support unit 105 and configured to measure the desired parameter thereof, a fifth sensor 180e on the heat transfer structure 120 and configured to measure the desired parameter thereof, and a sixth sensor 180f on the human 10 and configured to measure the desired parameter thereof. Other sensors may also be included, depending on the end use of the device 100. For example, one or more other sensors may be present on TEC 110 and configured to measure a desired parameter thereof, such as to measure its individual performance or abnormal operation. Sensors 180 are each in communication with the controller and, via the controller, can be used to verify and / or improve the safety (e.g., to prevent overcooling and / or high pressure zones), effectiveness, and operation of device 100.

[0055] As shown in the illustrated embodiment of FIG. 4, the device 100 includes eight separate TECs 110. In other embodiments, the actual number of TECs 110 may be more or less (e.g., 2, 3, 5, 10, 20, 30, or more) depending on the particular end use of the device 100 and the heating / cooling capacity requirements needed from the device 100. Furthermore, the shapes and sizes of the TECs 110 may vary between different regions of the device. Additionally or alternatively, the TECs 110 may be arranged differently than shown in FIG. 4. For example, in addition to individual TECs 110 around a target area (e.g., around the circumference of the human 10) as shown in FIG. 1, individual TECs 110 may be stacked on top of each other to increase the heating and / or cooling capacity of that particular stack of TECs 110. In such an embodiment, a second TEC 110 stacked on top of a first TEC 110 can have one side in contact with the first TEC 110 and another opposing side in contact with the heat transfer structure 120. A stacked arrangement of TECs 110 can be beneficial, particularly when more extreme temperatures (e.g., below 0° C., −10° C., or −20° C.) are desired in a target area of ​​the human 10.

[0056] FIG. 5A is a partial schematic top view of a single-phase heat transfer system 515 of a mountable heat transfer device (e.g., device 100; FIG. 1A), and FIG. 5B is a partial schematic cross-sectional side view of the heat transfer system 515 of FIG. 5A. Similar to the heat transfer systems or portions thereof previously described (see, e.g., FIGS. 3A-3B), the heat transfer system 515 is configured to reside across the TEC 110 and remove heat therefrom. With reference to both FIGS. 5A and 5B, the heat transfer system 515 can include a base member or substrate 522 across one or more TECs 110. The substrate 522 can include microfeatures 524 (e.g., pins or other structures configured to increase the exposed surface area of ​​the substrate) that at least in part define channels 526 or manifolds 525 of a fluid distribution network. The microfeatures 524 and channels 526 can include the features and / or functionality of the individual microfeatures 322 and channels 324 described herein. Channel 524 is for conveying a cold working fluid (WF C ) and is configured to absorb heat from the substrate 522 and / or the micro-features 522. C ) is provided to each fluid distribution network 525 at an inlet 528 located in an intermediate or central region thereof at a first temperature, and a heated working fluid (WF H ) and exit the fluid distribution network at outlets 530a-b (collectively referred to as "outlets 530") in peripheral regions on opposing sides of the fluid distribution network 525. By providing the working fluid in an intermediate region, the fluid distribution network 525 can provide more uniform cooling to the fluid distribution network that supplies the working fluid on a first side and removes the heated working fluid from a second, opposing side. As shown in FIGS. 5A and 5B, the fluid distribution network 525 includes only one inlet and one outlet 530a, 530b on each side of the fluid distribution network 525. In other embodiments, the fluid distribution network 525 can include multiple inlets, multiple outlets, or multiple inlets and outlets.

[0057] In an alternative embodiment, the heat transfer system 515 may function in an opposed arrangement, in which case the channels 524 pass a heated working fluid (WF H ) and is configured to provide heat to the substrate 522 and / or the micro-features 522. H ) is provided to each fluid distribution network 525 at an inlet 528 located in an intermediate or central region thereof at a first temperature, and a cooled working fluid (WF C ) may exit the fluid distribution network at outlet 530.

[0058] The heat transfer system 515 further comprises: (i) a heated working fluid (WF H ) to, for example, a first temperature, and (ii) one or more pumps 565 configured to circulate the working fluid throughout the heat transfer system 515. The heat exchanger 560 can include the same features and functionality as the heat exchanger 160 described herein.

[0059] FIG. 6 is a partial schematic top view of a heat transfer system 615 of a heat transfer device (e.g., heat transfer device 100; FIGS. 1-4 ) according to an embodiment of the present technique. The heat transfer system 615 corresponds to the heat transfer system 115 and may include some, similar, or all of the elements previously described in connection with the heat transfer system 115. As shown in FIG. 6 , the heat transfer system 615 may include a cold working fluid passage 130 fluidly coupled at an upstream end to a heat exchanger 160 and fluidly coupled at a downstream end to inlet portions of respective heat transfer structures 120 (individually shown as heat transfer structures 120a, 120b, and 120c), and may include a heated working fluid passage 140 fluidly coupled at an upstream end to outlet portions of respective heat transfer structures 120 and fluidly coupled at a downstream end to the heat exchanger 160. The cold working fluid passage 130 may include a cold working fluid (WF C) to the heat transfer structure 120, and the heated working fluid passage 140 is configured to provide a heated working fluid (WF H ) from heat transfer structures 120. As described above, heat transfer structures 120 are each thermally coupled to a corresponding one of TECs 110 (individually shown as TECs 110a, 110b, and 110c) and configured to remove heat therefrom.

[0060] 6, the cold working fluid path 130 is fluidly coupled to at least the first heat transfer structure 120a at a first inlet region 632a and to the second heat transfer structure 120b at a second inlet region 632b downstream of the first inlet region 632a. The cold working fluid path 130 may further be fluidly coupled to the third heat transfer structure 120c at a third inlet region 632c downstream of the second inlet region 632b. The heated working fluid path 140 is fluidly coupled to at least the first heat transfer structure 120a at a first outlet region 642a and to the second heat transfer structure 120b at a second outlet region 642b downstream of the first outlet region 642a. The heated working fluid passage 140 may further be fluidly coupled to the third heat transfer structure 120c at a third outlet region 642c downstream of the second outlet region 642b. The heat transfer system 615 may include additional heat transfer structures 120 with associated inlet and outlet regions 632, 642 that are fluidly coupled to the cold working fluid passage 130 and the heated working fluid passage 140 downstream of the third heat transfer structure 120c, respectively. The cold working fluid passage 130 extends from the heat exchanger 160 to the third (or most downstream) inlet region 632c of the third (or most downstream) heat transfer structure 120c, and the heated working fluid passage 140 extends from the first outlet region 642a of the first heat transfer structure 120a to the heat exchanger 160.

[0061] In operation, the cold working fluid passage 130 is adapted to receive a cold working fluid (WF C) from the heat exchanger 160 to all heat transfer structures 120 (e.g., heat transfer structures 120a-c, as shown) that are fluidly coupled to the cold working fluid passage 130, and the heated working fluid passage 140 provides a heated working fluid (WF H ) to the heat exchanger 160 from all heat transfer structures 120 (e.g., heat transfer structures 120a-c, as shown) that are fluidly coupled to the heated working fluid path 140. As shown in FIG. 6, the heat transfer system 615 operates as a hybrid series-parallel system. The cold working fluid path 130 returns the cold working fluid (WF C ) from the heat exchanger 160 and a cold working fluid (WF C ) is delivered (i) to a first inlet region 632a at a first inlet temperature and pressure, (ii) to a second inlet region 632b at a second inlet temperature and pressure, and (iii) to a third inlet region 632c at a third inlet temperature and pressure. C ) the first, second, and third inlet temperatures are the same or substantially the same (e.g., within 1, 5%, or 10%), the first inlet pressure is greater than the second inlet pressure, and the second inlet pressure is greater than the third inlet pressure.

[0062] The heated working fluid passage 140 is adapted to receive the heated working fluid (WF H) from the first outlet region 642a at a first outlet temperature and pressure, (ii) from the second outlet region 642b at a second outlet temperature and pressure, and (iii) from the third outlet region 642c at a third outlet temperature and pressure. The first outlet pressure exceeds the second outlet pressure, which exceeds the third outlet pressure. In addition, the pressure difference between the first inlet and outlet regions 632a, 642a is the same or substantially the same as the pressure difference between the second inlet and outlet regions 632b, 642b and the pressure difference between the third inlet and outlet regions 632c, 642c. This equal pressure difference causes equal or substantially equal flow rates of the working fluid to pass through the first, second, and third heat transfer structures 120a-c. If additional heat transfer structures 120 are included in the heat transfer system 615, (i) their inlet regions also (a) receive a cold working fluid (WF) at the same temperature as the preceding inlet regions 632a-c. C ) from the heat exchanger 160, (b) have a lower inlet pressure than the preceding inlet region 632a-c, and (ii) their outlet regions also (a) have a lower outlet pressure than the preceding outlet region 634a-c, and (b) have the same pressure difference between the inlet and outlet pressure as the heat transfer structures 120a-c. In some embodiments, the pressure difference between the inlet and outlet pressure for each heat transfer structure 120a-c can be less than 1.0 bar or 0.5 bar, or in the range of 0 to 1 bar or 0 to 0.5 bar.

[0063] The embodiments of the present technology, described with reference to FIG. 6, have several advantages over other conventional heat transfer devices that use cooling systems connected in parallel or series to the heat transfer structures. For example, the closed loop system shown and described allows the embodiments of the present technology to provide thermal treatment and more overall efficient system operation by cooling at a uniform temperature across the target area. As described herein, this is achieved because the heat transfer structures are arranged with respect to the cold working fluid passage 130 and the hot working fluid passage 140 such that the working fluid provided to each heat transfer structure has the same or nearly the same temperature and the pressure drop across the heat transfer structures is the same or nearly the same. By doing so, the flow rates of the working fluid across the individual heat transfer structures are the same or similar to each other. As a result, the TEC of the heat transfer device can be effectively thermally treated regardless of its location relative to the incident source header.

[0064] In contrast to the embodiment shown in FIG. 6, for a heat transfer device utilizing a series arrangement, the downstream heat transfer structure of the heat transfer system receives the working fluid at a higher temperature due to heat absorbed from the upstream heat transfer structure. That is, as the working fluid is passed successively through the heat transfer structures, each downstream heat transfer structure receives a warmer working fluid than the preceding structure. As a result, the downstream heat transfer structure is not as effective as the upstream heat transfer structure in removing heat from the corresponding TEC. For a heat transfer device utilizing a parallel arrangement, the pressure drop experienced by the working fluid across the heat transfer structures is equal only if the working fluid source headers to the respective heat transfer structures are centrally located between the heat transfer structures. For example, if the working fluid source headers are closer to one heat transfer structure than to another heat transfer structure, the working fluid will prefer the path of least resistance and the more distant heat transfer structure will receive less working fluid. In addition, less heat will be absorbed from the corresponding TEC. For heat transfer devices that are configured to be worn by a human and thus wrapped around a body part or target area, the ability to center the source header can be difficult, and in some cases, impractical.

[0065] FIG. 7 is a partial schematic bottom view of a heat-transfer device 700 ("device 700") according to an embodiment of the present technology. Heat-transfer device 700 corresponds to device 100 and can include some, similar, or all of the elements previously described in connection with device 100. Device 700 can include a flexible support unit 705, a module 710 (shown via dashed lines) across a top surface of the flexible support unit 705, and a thermally conductive member 770. Module 710 can include the TEC 110 and / or thermal transfer structure 120 previously described. Thermally conductive member 770 can be embedded (e.g., woven or sewn therein) or bonded thereto, and can extend laterally across all or a portion of the dimensions of the flexible support unit 705. In some embodiments, as shown in FIG. 7, thermally conductive member 770 can extend across and / or generally be aligned with a row of modules 710. In some embodiments, the thermally conductive members 770 can extend between certain rows or groups of modules 710 or between certain individual modules 710. Adjacent thermally conductive members 770 can be spaced apart from one another by a dimension (D7), which can be at least 0 mm, 2 mm, 4 mm, 6 mm, 8 mm, or 10 mm, or in the range of 0-10 mm, or any increment therebetween. As shown in FIG. 7, two thermally conductive members 770 are included adjacent to one another per row of modules 710. In some embodiments, more (e.g., three, five, etc.) or fewer thermally conductive members 770 may be included. The thermally conductive members 770 can comprise or consist of a metallic material (e.g., copper, brass, steel, zinc, or alloys thereof) or other synthetic material that is conductive and has a higher stiffness than that of the flexible support unit 705.

[0066] As shown in FIG. 7, the thermally conductive members 770 can have a serpentine shape (e.g., wavy, oscillating, etc.) as they extend across the device 700. The wires can be fabricated using laid wire, or metal formed into a serpentine shape and stamped into a serpentine shape, or any other suitable fabrication process that can achieve the desired pattern before the thermally conductive members 770 are incorporated with the device 700. In some embodiments, the thermally conductive members 770 can be bonded to the bottom or top surface of the flexible support unit 705 in a radial direction. In all described implementations of the thermally conductive members 770, the thermally conductive members 770 distribute heat across the flexible support unit 705, modules 710, or groups of modules 710 such that the thermal effect from the modules 710 (e.g., TECs) is more uniform across the dimensions of the flexible support unit 705. Additionally or alternatively, the thermally conductive member 770 may improve the strength and resilience of the device 700 and / or the flexible support unit 705 .

[0067] The improvement in strength and resilience provided by the thermally conductive member is further illustrated in Figures 8A and 8B, which are partial schematic bottom views of a heat transfer device 800 ("device 800"). Heat transfer device 800 corresponds to device 100 and may include some, similar, or all of the elements previously described in association with device 100. With reference to Figures 8A and 8B, device 800 includes a flexible support unit 805 that is expandable (e.g., elastic, extensible, etc.) along one or more dimensions and includes a thermally conductive member 870 that extends along all or a portion of the dimensions of flexible support unit 805. Thermally conductive member 870 corresponds to thermally conductive member 770 and may include some, similar, or all of the elements previously described in association with thermally conductive member 770. In FIG. 8A, the flexible support unit 805 is in an unexpanded state (eg, a relaxed state), and in FIG. 8B, the flexible support unit 805 is in an expanded state (eg, a tensioned state).

[0068] Thermally conductive member 870 can provide strength to flexible support unit 805, or more generally, device 800, by introducing a material into flexible support unit 805 with a higher stiffness than flexible support unit 805. In the unexpanded state of device 800, shown in FIG. 8A, thermally conductive member 870 is relaxed, dissipating heat and providing structure to flexible support unit 805 and device 800. Additionally or alternatively, thermally conductive member 870 can provide resiliency by acting as a spring within flexible support unit 805. When the thermally conductive member 870 and flexible support unit 805 are expanded along the dimension of the thermally conductive member 870, the device 800 enters an expanded state shown in FIG. 8B (as illustrated by the increased wavelength of the thermally conductive member 870), in which the thermally conductive member 870, in addition to providing continued heat distribution and structure to the flexible support unit 805, generates a spring force, biasing the device 800 toward the unexpanded state.

[0069] FIG. 9 illustrates an alternative approach to provide improvements to heat dissipation, strength, and resilience as illustrated in FIGS. 7-8B above. FIG. 9 is a partial schematic bottom view of a heat-transfer device 900 ("device 900") according to an embodiment of the present technology. Heat-transfer device 900 corresponds to device 100 and can include some, similar, or all of the elements previously described in connection with device 100. Device 900 can include a flexible support unit 905, a module 910 (a single module is shown using dashed lines) across a top surface of flexible support unit 905, a first thermally conductive member 970, and a second thermally conductive member 972. Module 910 can include the TEC 110 and / or heat-transfer structure 120 previously described. The flexible support unit 905 can include first and second thermally conductive members 970, 972, which can be expandable (e.g., stretchable) along at least first and second dimensions and extend along at least the first and second dimensions of the flexible support unit 905, respectively.

[0070] The first and second thermally conductive members 970, 972, both or individually, may correspond to the thermally conductive member 770. In particular, the first and second thermally conductive members 970, 972 may similarly (i) be embedded within or coupled to the flexible support unit 905, (ii) extend across all or a portion of the dimensions of the flexible support unit 905, (iii) extend across and / or generally aligned with the rows of the modules 910, and / or (iv) extend between certain individuals, rows, or groups of the modules 910. The first and second thermally conductive members 970, 972, both or individually, may similarly comprise or consist of a metallic material (e.g., copper, brass, steel, zinc, or alloys thereof) or other synthetic material that is conductive and has a higher stiffness than that of the flexible support unit 905. The first and second thermally conductive members 970, 972, both or individually, may also be metal, laid down, formed into a wavy shape, or stamped, having a wavy or oscillating shape as they extend across the device 900. The first and second thermally conductive members 970, 972, both or individually, may also be radially bonded to a bottom or top surface of the flexible support unit 905. The first and second thermally conductive members 970, 972, both or individually, may also distribute heat across the flexible support unit 905, the module 910, or a group of modules 910 such that the thermal effect from the module 910 (e.g., a TEC) is more uniform across one or more dimensions of the device 900.

[0071] As shown in FIG. 9, four individual first and second thermally conductive members 970, 972 extend across the module 910. In some embodiments, more (e.g., five, six, etc.) or fewer first and / or second thermally conductive members 970, 972 may be included. The first and second thermally conductive members 970, 972 may be positioned within the flexible support unit 905 and intersect at substantially right angles relative to one another. In some embodiments, the first and second thermally conductive members 970, 972 may intersect at substantially acute angles. In some embodiments, the device 900 may include additional thermally conductive members that intersect the first and second thermally conductive members 970, 972. In these further embodiments, the included thermally conductive members can intersect with every other included thermally conductive member at substantially a 60° angle, with some of the included thermally conductive members at substantially a 90° angle, and with others at substantially 45°, or any other combination of intersection angles.

[0072] The first and second thermally conductive members 970, 972 may improve the strength of the flexible support unit 905, or, more generally, the device 900, by introducing a material into the flexible support unit 905 with a higher stiffness than the flexible support unit 905. Additionally or alternatively, the first and second thermally conductive members 970, 972 may improve the resiliency of the device 900 along at least all or a portion of the first and second dimensions of the flexible support unit 905. For example, as also illustrated in FIG. 8, when the first thermally conductive member 970 and the flexible support unit 905 are expanded, the first thermally conductive member 970 may urge the device 900 back from the expanded state to a non-expanded state along a dimension of the first flexible support unit 905 that corresponds with the first thermally conductive member 970. Similarly, when the second thermally conductive member 972 and the flexible support unit 905 are expanded, the second thermally conductive member 972 can urge the device 900 along a second dimension of the flexible support unit 905 that corresponds to the second thermally conductive member 972, returning the device 900 from the expanded state to a non-expanded state.

[0073] In some embodiments, the thermally conductive member 770, 870, 970 may be a continuous structure of highly conductive material (e.g., a sheet) or highly conductive particles dispersed within and / or on the flexible support unit (e.g., flexible support unit 105, 705, 805, 905). Figure 10 is a schematic exploded isometric view of a heat-transfer device 1000 ("device 1000") with a thermally conductive member 1070, illustrated as a sheet of highly conductive material, in accordance with an embodiment of the present technology. Heat-transfer device 1000 corresponds to device 100 and can include some, similar, or all of the elements previously described in connection with device 100. In FIG. 10, the layers of the device 1000 are partially exposed to show the flexible support unit 1005, the thermally conductive member 1070, the module 1010 (shown via dashed lines), the group of modules 1060, the cold working fluid path 130, the heated working fluid path 140, and the thermal insulation member 150. The module 1010 may include the TEC 110 and / or the heat transfer structure 120 described above. As shown in FIG. 10, the thermally conductive member 1070 is a sheet of highly conductive material that extends across the multiple modules 1010 of the group of modules 1060. The thermally conductive member 1070 is radially bonded to the top of the flexible support unit 1005, or alternatively bonded to the module 1010 prior to assembly with the flexible support unit 1005. The thermally conductive member 1070 may alternatively be radially bonded to the bottom of the flexible support unit 1005. The thermally conductive member 1070 may be a uniform sheet that extends in all directions between the modules 1010 and the flexible support unit 1005. Additionally or alternatively, areas of the thermally conductive member 1070 (e.g., area overlapping modules 1010) may vary in thickness or have cutouts to avoid or reduce thermal conduction between certain modules 1010 or for other functional purposes.

[0074] FIG. 11 is a schematic exploded isometric view of a heat transfer device 1100 ("device 1100") with a thermally conductive member 1170 according to an embodiment of the present technology. The heat transfer device 1100 corresponds to device 100 and can include some, similar, or all of the elements previously described in connection with device 100. In FIG. 11, the layers of device 1100 are partially exposed to show flexible support unit 1105, thermally conductive member 1170, module 1110 (shown via dashed lines), group of modules 1160, cold working fluid path 130, heated working fluid path 140, and thermal insulation member 150. Module 1110 can include the TEC 110 and / or heat transfer structure 120 previously described. As shown in FIG. 11, thermally conductive member 1170 is highly conductive particles interspersed within flexible support unit 1105. In some embodiments, the thermally conductive member 1170 may be sprayed or otherwise radially attached to the top or bottom surface of the flexible support unit 1105. The thermally conductive member 1170 may comprise or consist of a metallic material (e.g., copper, brass, steel, zinc, or alloys thereof) or other synthetic material that is conductive and may have a higher stiffness than that of the flexible support unit 1105. In either of the illustrations of FIG. 10 or 11, the highly conductive member 1070, 1170 may distribute heat across the dimensions of the flexible support unit 1005, 1105 or between groups of modules 1010, 1110 or modules 1060, 1160, improving the strength and / or resilience of the flexible support unit 1005, 1105.

[0075] 12-14 show alternative embodiments of the arrangement, number, and shape of modules (e.g., modules 110, 710, 810, 910, 1010, 1110). For illustrative purposes in the following description, only the outlines of the modules are shown in FIG. 12-14. The modules shown and described with reference to FIG. 12-14 can enable more effective thermal treatment of the corresponding device. For example, the shape of the individual modules or the arrangement of the groups of modules can be determined based on the target area of ​​the human to be treated. For example, individual modules or groups of modules may be utilized such that the shape of the individual modules or groups of modules resembles the shape of the target area.

[0076] 12 is a schematic top view of an arrangement of grouped rectangular modules 1210 in a heat-transfer device 1200, according to an embodiment of the present technology. The heat-transfer device 1200 corresponds to the device 100 and may include some, similar, or all of the elements previously described in connection with the device 100. The modules 1210 may include the TEC 110 and / or the heat-transfer structure 120 previously described. As shown in FIG. 12, the two modules 1210 are parallel rectangles arranged in a first direction (D 12 ) from one another. The modules 1210 can be (i) equal in height and width, (ii) equal in height or width only, or (iii) varying in height and width. The modules 1210 may be spaced apart and centrally aligned as shown in FIG. 12, or the modules 1210 may be spaced apart and misaligned to create a stepped or cascaded arrangement. Additionally, the modules 1210 may not be arranged in parallel; instead, the modules 1210 may be arranged at an angle, e.g., with an acute angle between them.

[0077] FIG. 13 provides additional illustration of module arrangements (e.g., modules 110, 710, 810, 910, 1010, 1110, 1210). FIG. 13 is a schematic top view of an arrangement of grouped circular modules 1310 in a heat-transfer device 1300, in accordance with an embodiment of the present technology. The heat-transfer device 1300 corresponds to the device 100 and may include some, similar, or all of the elements previously described in connection with the device 100. The modules 1310 may include the TEC 110 and / or the heat-transfer structure 120 previously described. As shown in FIG. 13, the modules 1310 of the heat-transfer device 1300 are circular in shape and roughly arranged in a square configuration, with the individual modules 130 spaced apart from each other by a first distance (D 13-1 ) and the second distance (D 13-2 ) from neighboring modules 130. Fewer modules 1310 may be loosely arranged in rows, columns, or other configurations (e.g., triangles), or more modules 1310 may be arranged according to other polygonal shapes. The modules 1310 may be equal in diameter or may vary in diameter. The modules 1210, 1310 of Figures 12 and 13 may have shapes other than square or circular in some embodiments, including, for example, polygons with three or more sides, ovals, or other customized shapes for a particular heat transfer device 1200, 1300 application.

[0078] Different groups of modules (e.g., modules 110, 710, 810, 910, 1010, 1110, 1210, 1310) having different shapes, sizes, spacing, and arrangements may be combined for different heat-transfer device applications. FIG. 14 is a schematic top view of an arrangement of modules 1460, 1462, 1464 in a heat-transfer device 1400 ("device 1400") according to an embodiment of the present technology. Heat-transfer device 1400 corresponds to device 100 and may include some, similar, or all of the elements previously described in connection with device 100. The illustrated device 1400 has a square module group 1460, a rectangular module group 1462, and a circular module group 1464 (collectively, "groups 1460-1464," identified by dashed lines). Modules in groups 1460-1464 may include the TEC 110 and / or heat-transfer structure 120 previously described. Groups 1460-1464 are three evenly spaced (D 14-1 ) rows. Square groups 1460 may be located in the first and third rows and flank either side of device 1400. Rectangular groups 1462 may be evenly spaced above and below the circular groups 1464 in the second row ( D14-2 14 ). The device 1400 may include additional individual groups 1460-1464 above, below, or to the side of the device 1400 that are oriented similarly to the associated individual groups 1460-1464 of FIG. 14 (e.g., side-by-side vertical rectangles). In some embodiments, the additional individual groups 1460-1464 may be rotated from the orientation of FIG. 14 (e.g., horizontal rectangles stacked one above the other). The device 1400 may instead include additional sets of groups 1460-1464 above, below, or to the side of the device 1400 that are oriented in or rotated from FIG. 14 . Each group 1460-1464 may individually implement the heat transfer system 615 of FIG. 6 and connect to the TEC of each group 1460-1464. In this configuration, each group 1460 - 1464 may be individually controlled to provide a different heating or cooling therapy or rate to adjacent target areas of the person 10 .

[0079] As described above, the modules described herein (e.g., modules 110, 710, 810, 910, 1010, 1110, 1210, 1310, or modules in groups 1460-1464) can be cycled between heating and cooling modes. When the modules described herein are implemented in device 1400 with different shapes and arrangements and / or when device 1400 includes a flexible support unit similar to flexible support unit 105, device 1400 can at least substantially conform to the contours of human 10 (FIGS. 1 and 2). When the device 1400 is in better contact with the human 10, heat transfer from the human 10 to and from the device 1400 may be more effective, allowing thermal therapy to be more effectively administered to target areas on the human 10 to treat conditions such as pain, swelling, overheating, reduced blood perfusion, reduced nerve connectivity, and / or stroke, while mitigating damage to epidermal and / or dermal tissue. III. Wearable Heat Transfer Device Area of ​​Treatment

[0080] The wearable heat transfer devices disclosed herein can be designed for different target areas and / or body parts, including head, neck, chest, shoulders, upper back, lower back, upper arms, lower arms, wrists, waist, upper legs, lower legs, feet, hands, etc. The devices can be placed on the target areas utilizing fasteners, adhesives, straps, tapes (e.g., Velcro®), belts, or other means. Some of the target areas are illustrated in FIGS. 15A-24, which are various partial schematics of a heat transfer device being worn by a human 10. The devices shown in FIGS. 15A-24 may correspond to any of the devices 100 described herein, and thus each may include some or all of the elements described herein (e.g., flexible support unit, TEC, cold working fluid passage, heated working fluid passage, etc.). With reference to these figures, device 1500 is located around the knee region of human 10, device 1600 is across the shoulder region of human 10, device 1700 is located around the ankle and / or lower leg regions of human 10, device 1800 is located around the head and neck regions of human 10, device 1900 is located around the head, neck, and face (e.g., nose) regions of human 10, device 2000 is located around the neck region of human 10, device 2100 is located around the wrist and / or lower arm regions of human 10, device 2200 is located around the elbow region of human 10, device 2300 is located around the lower and upper body regions of human 10, and device 2400 is located around the lower, upper, and head regions of human 10.

[0081] 15B-15D are partial schematic diagrams of a heat transfer system 1790 including a heat transfer device 1500 and subsystems or other device elements. In addition to device 1500, the system described with reference to FIGS. 15B-15D can be applied to or incorporated with any of the devices disclosed herein (e.g., devices 100, 700, 800, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, 2000, 2100, 2200, 2300, 2400). The subsystems and / or device elements can be integrated into a package 1550 that is secured to the person 10 (e.g., in the lumbar region). The device 1500 can include a heat exchanger 1560 and one or more pumps 1562, both of which can be housed within the package 1550. The heat exchanger 1560 can include a liquid-to-air heat exchanger (e.g., heat exchanger 560). Physically housing the heat exchanger 1560 above the device 1500 can advantageously provide additional head pressure to the working fluid supplied to the device 1500 and help ensure proper flow of the working fluid to the fluid distribution network of the device 1500. One or more pumps 1562 can be fluidly coupled to the heat exchanger 1560 and the heat transfer system of the device 1500 to ensure proper flow of the working fluid throughout the heat transfer system.

[0082] The heat transfer system 1590 may further include a power source 1592 operably coupled to the device 1500 and configured to provide power to the TEC 110 (FIG. 15C). The power source 1592 may enable the TEC 110 to be set to a particular temperature for heating and / or cooling purposes. In some embodiments, the power source 1592 may include a portable energy storage device (e.g., a battery).

[0083] The heat transfer system 1590 may further include a controller and / or electronic components 1594 operably coupled to the device 1500, the power supply 1592, and other subsystems. In some embodiments, the controller and / or electronic components 1594 may include a transmitter and / or receiver that allows the controller 1594 to communicate (e.g., wirelessly communicate) with a remote user interface (e.g., on a mobile device and / or a remote network) and / or the device 1500. In some embodiments, the controller 1594 may be configured to operate the device 1500 in multiple operating modes (e.g., a cooling mode, a heating mode, or both) and / or provide a process value (e.g., a setpoint temperature) at which the device 1500 is configured to operate. In some embodiments, the controller 1594 may provide a setpoint temperature to the device 1500 in a range of 40° C. to −20° C. (e.g., 35° C., 20° C., 0° C., −10° C., etc.) such that the TEC (e.g., the first or second side of the TEC) is configured to operate at the setpoint temperature. Additionally or alternatively, controller 1594 can be configured to receive inputs from sensors on device 1500 (e.g., sensors 180a-f; FIG. 2) and control the device based on the received inputs. For example, controller 1594 can determine any anomalies in the operating device and automatically generate an indication of the anomaly and / or adjust operating parameters of the device. Additionally or alternatively, controller 1594 may utilize artificial intelligence and / or machine learning to adjust power and / or other control parameters, for example, based on previous treatments used for the same user or group of users.

[0084] In some embodiments, the heat transfer system 1590 can include a conduit 1580 extending from the package 1550 to the device 500. The conduit 1580 can include (i) fluid delivery lines, e.g., extending from the heat exchanger 1560 and / or one or more pumps 1562 to and fluidly coupled to a fluid distribution network of the device 1500, (ii) power lines, e.g., extending from the power source 1592 to and operably coupled to the TEC, and / or (iii) other wires, e.g., extending from a controller to and operably coupled to sensors on the device 1500. In some embodiments, the conduit 1580 is omitted, e.g., as shown and described with reference to FIG. 10D. Additionally or alternatively, in some embodiments, the conduit 1580.

[0085] 15C illustrates another view of the system 1590 shown and described with reference to FIG. 15B, but omitting for illustrative purposes the outer covering of the device 1500. Thus, the TEC 110, flexible support unit 105, and heat transfer system 115 previously described with reference to the other figures are shown diagrammatically.

[0086] FIG. 15D illustrates another system 1598 that is generally similar to the system 1590 illustrated and described with reference to FIGS. 15B and 15C, except that the package 1550 and its components (e.g., heat exchanger 1560, pump 1562, power supply 1592, and / or controller 1594) are physically embedded within the device 1500, e.g., above the TEC or most of the device components.

[0087] Systems 1590, 1598, described with reference to individual Figures 15C and 15D, are shown as operably coupled to a single device. In some embodiments, system 1590 or system 1598 can be operably coupled to multiple devices, e.g., on or around different target areas of human 10. For example, in some embodiments, system 1590 (or system 1598) can be operably coupled to a first device around the knee region and a second device across the shoulder region. In such embodiments, system 1590 (or system 1598) can individually control the first device independently from the second device (and the individual TECs 110 thereon), or vice versa.

[0088] Each of the devices shown in FIGS. 15A-19 can be used to treat some underlying condition suffered in the target area, such as pain, swelling, overheating (e.g., for cancer patients), reduced blood perfusion, reduced neural connectivity, and / or stroke, among other conditions. Additionally, each of the devices shown in FIGS. 15A-19 can be designed based on the particular area of ​​treatment. That is, in addition to designing the device to conform to the geometry of the target area, as shown in FIGS. 15A-19, other characteristics (e.g., thickness, flexibility, density of TEC, compressive force applied to the target area, etc.) may be incorporated into the design based on the target area. For example, device 1500 around the knee region of human 10 can be designed to have increased flexibility in the knee joint area of ​​device 1500 that is expected to experience the most flexion, and therefore may include less TEC adjacent to that area. In some embodiments, the design may be based on the expected treatment to be provided via the particular device. For example, devices 1800 and 1900 around the head region of human 10 may be particularly useful for treating patients who have experienced a stroke and who have a need for relatively rapid cooling of the head region following the stroke event (e.g., in an ambulance or in a hospital). Thus, devices 1800 and 1900 may be pre-programmed with an operational mode configured to thermally treat a patient who has recently experienced a stroke or other related condition.

[0089] Any one of the heat transfer devices 100, 700, 800, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, 2000, 2100, 2200, 2300, or 2400 described herein with reference to Figures 1-24 can be incorporated into countless other and / or more complex systems, a representative example of which is system 2590, shown diagrammatically in Figure 25. The system 2590 may include a heat transfer device (e.g., heat transfer device 100, 700, 800, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, 2000, 2100, 2200, 2300, or 2400), a power source 2592 (e.g., portable power source, battery, etc.) operably coupled to the device (e.g., the TEC of the device), a controller 2594 (e.g., a processor) operably coupled to the device and to the power source 2592, a user interface 2596 operably coupled to the controller 2594 and to the power source 2592, and other subsystems. The system 2590 may perform any of a wide variety of functions, such as memory storage, data processing, and / or other suitable functions.

[0090] The controller 2594 can be configured to operate the device in one of the operating modes (e.g., cooling mode, heating mode, or both) and / or provide a process value (e.g., a setpoint temperature) at which the device is configured to operate. As described above with reference to FIG. 1, for example, the controller 2594 can provide a setpoint temperature to the device within a range of 40° C. to −20° C. (e.g., 35° C., 20° C., 0° C., −10° C., etc.) such that the TEC 110 (e.g., the first or second side of the TEC) is configured to operate at the setpoint temperature. Additionally or alternatively, the controller 2594 can be configured to receive input from sensors on the device (e.g., sensors 180a-f; FIG. 4) and control the device based on the received input. For example, the controller 2594 can determine any anomalies in the operating device and automatically generate an indication of the anomaly and / or adjust an operating parameter of the device. Additionally or alternatively, the controller 2594 may utilize artificial intelligence and / or machine learning to adjust power and / or other control parameters based on, for example, previous treatments used for the same user or group of users.

[0091] The user interface 2596 can include a display and / or applications or programs that allow a user to utilize the device through a mobile device (e.g., phone, tablet, watch, laptop, etc.) or other computing device. The user interface 2596 may include pre-programmed thermal management procedures and / or allow the user to adjust cooling and heating parameters based on a desired application.

[0092] 26 is a flow diagram illustrating a method 2600 for treating a human (e.g., for pain, swelling, overheating, reduced blood perfusion, reduced nerve connectivity, and / or stroke) via a heat transfer device in accordance with an embodiment of the present technology. The method 2600 can include providing a heat transfer device (e.g., heat transfer device 100, 700, 800, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900, 2000, 2100, 2200, 2300, or 2400) (process portion 2602) and positioning the heat transfer device over a target area of ​​the human (process portion 2604). Positioning the heat transfer device over the target area can include, for example, fastening the device over the target area such that the device or a flexible support unit of the device provides a compressive force on the target area, positioning the TEC of the device in thermal contact with the target area.

[0093] Method 2600 may further include initiating, via a controller (e.g., controller 2594; FIG. 25), an operating mode of a temperature control and / or heat transfer device, thereby transferring heat from the target area of ​​the human to the heat transfer device or vice versa (process portion 2606). Initiating an operating mode may include initiating a cooling mode, a heating mode, or both a cooling mode and a heating mode. Initiating a temperature control may include providing a temperature for a TEC (e.g., TEC 110; FIG. 1-6) to operate or a temperature at which the device is configured to heat or cool the target area within a predetermined time (e.g., 10 seconds, 20 seconds, 30 seconds, 40 seconds, 60 seconds, or 120 seconds). In some embodiments, the temperature may be set within a range of 40° C. to −20° C. (e.g., 35° C., 20° C., 0° C., −10° C., etc.).

[0094] 27 is a flow diagram illustrating a method 2700 for controlling the temperature of a target area of ​​a human via a heat transfer device, according to an embodiment of the present technology. Method 2700 determines the current power input into the heat transfer device or module or modules, the heated working fluid temperature in the heat transfer device or module or modules, and the cold working fluid temperature in the heat transfer device or module or modules, based on the current power input into the heat transfer device or module or modules, the heated working fluid temperature in the heat transfer device or module or modules, and the cold working fluid temperature in the heat transfer device or module or modules. The method may include calculating an incident heat flux of an individual or group of modules (modules 0, 1010, 1110, 1210, 1310, or in group 1460-1464) (process portion 2702), calculating a temperature of the target area of ​​the human given the incident heat flux and properties of the flexible support unit proximate the heat transfer device or module or modules (process portion 2704), and determining a modified (or maintained) power input into the heat transfer device or module or modules given the temperature of the target area of ​​the human and the target temperature for the target area of ​​the human (process portion 2706). Depending on whether the desired outcome is achieved in the target area, the process may be repeated. IV. Conclusion

[0095] It will be apparent to those skilled in the art that changes may be made to the details of the embodiments described above without departing from the underlying principles of the present disclosure. In some cases, well-known structures and functions have not been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments of the present technology. Although method steps may be presented herein in a particular order, alternative embodiments may perform the steps in a different order. Similarly, certain aspects of the present technology that are disclosed in the context of certain embodiments may be combined or eliminated in other embodiments. Furthermore, although advantages associated with certain embodiments of the present technology may be disclosed in the context of those embodiments, other embodiments may also exhibit such advantages, and not all embodiments necessarily need to exhibit such advantages or other advantages disclosed herein to fall within the scope of the present technology. Thus, the present disclosure and associated technology may encompass other embodiments not expressly shown or described herein, and the present invention is not limited, except as by the appended claims.

[0096] Throughout this disclosure, the singular terms "a," "an," and "the" include plural references unless the context clearly indicates otherwise. The term "and / or," when used in reference to a list of two or more items, should be interpreted as including (a) any single item in the list, (b) all of the items in the list, or (c) any combination of items in the list. In addition, the terms "comprising," "including," and "having" should be interpreted as meaning the inclusion of at least the recited features, not to the exclusion of any greater number of the same features and / or other features of additional types.

[0097] As used herein, reference to "one embodiment," "an embodiment," "some embodiments," or similar formulaic phrases means that a particular feature, structure, operation, or characteristic described in connection with an embodiment may be included in at least one embodiment of the technology. Thus, appearances of such phrases or formulaic phrases herein are not necessarily all referring to the same embodiment. Furthermore, various particular features, structures, operations, or characteristics may be combined in any suitable manner in one or more embodiments.

[0098] Unless otherwise indicated, all numbers used in the specification and claims expressing numerical values ​​should be understood in all instances as being modified by the term "about" or "approximately". The term "about" or "approximately", when used in reference to a value, should be interpreted to mean within 10% of the stated value. Thus, unless indicated to the contrary, the numerical parameters set forth in the following specification and the appended claims are approximations that may vary depending on the desired properties sought to be obtained by the present technology. At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter should be interpreted at least in light of the number of reported significant digits and by applying ordinary rounding techniques. In addition, all ranges disclosed herein should be understood to encompass any subranges subsumed therein. For example, the range "1 to 10" includes any subrange (and includes) between the minimum value of 1 and the maximum value of 10, i.e., any subrange having a minimum value equal to or greater than 1 and a maximum value equal to or less than 10, such as 5.5 to 10.

[0099] The disclosure set forth above should not be interpreted as reflecting an intention that any claim require more features than are expressly recited in that claim. Rather, as the following claims reflect, inventive aspects lie in a combination of less than all features of any single foregoing disclosed embodiment. Accordingly, the claims following this detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment. The present disclosure includes all recitations of the independent claims along with their dependent claims.

[0100] The present technology is illustrated, for example, in accordance with various aspects described below. Various embodiments of aspects of the technology are described as numbered embodiments (1, 2, 3, etc.) for convenience. These are provided as examples and are not intended to limit the present technology. It should be noted that any of the dependent embodiments may be combined in any combination and placed within a separate independent embodiment. Other embodiments may be presented in a similar manner. (Appendix 1) 1. A thermal management device comprising: thermoelectric components arranged in an array and spaced apart from one another, each thermoelectric component having a first side configured to be thermally coupled to a target area of ​​a mammal and a second side opposite the first side; a heat transfer system having a heat exchanger, an array of fluid distribution networks, an inlet passage fluidly coupled to the fluid distribution networks and configured to provide a working fluid to the fluid distribution networks, and an outlet passage fluidly coupled to the fluid distribution networks and configured to receive the working fluid from the fluid distribution networks, each fluid distribution network being thermally coupled to a second side of a corresponding one of the thermoelectric components and fluidly coupled to the heat exchanger via the inlet passage and the outlet passage, each fluid distribution network having an inlet region and an outlet region, wherein in operation the working fluid flows from the inlet region, through the fluid distribution networks to the outlet region; A thermal management device comprising: (Appendix 2) the fluid distribution network includes a first fluid distribution network and a second fluid distribution network; a first fluid distribution network coupled to a first area of ​​the inlet passage and a second fluid distribution network coupled to a second area of ​​the inlet passage downstream of the first area of ​​the inlet passage; a first fluid distribution network coupled to a first area of ​​the outlet passage and a second fluid distribution network coupled to a second area of ​​the outlet passage downstream of the first area of ​​the outlet passage; A thermal management device as described in any one of the appendices herein. (Appendix 3) 3. The thermal management device of claim 2, wherein during operation, a difference in pressure of the working fluid measured between the first area of ​​the inlet passage and the first area of ​​the outlet passage is approximately equal to a difference in pressure of the working fluid measured between the second area of ​​the inlet passage and the second area of ​​the outlet passage. (Appendix 4) During operation, a working fluid flowing between the first area of ​​the inlet passage and the first area of ​​the outlet passage has a first pressure drop; a working fluid flowing between the second area of ​​the inlet passage and the second area of ​​the outlet passage has a second pressure drop; the difference between the first pressure drop and the second pressure drop is the same or within 5%, 10%, or 15% of each other; 3. A thermal management device as described in claim 2. (Appendix 5) During operation, a working fluid flowing between the first area of ​​the inlet passage and the first area of ​​the outlet passage has a first pressure drop; a working fluid flowing between the second area of ​​the inlet passage and the second area of ​​the outlet passage has a second pressure drop; The difference between the first pressure drop and the second pressure drop is less than a predetermined threshold. 3. A thermal management device as described in claim 2. (Appendix 6) 3. The thermal management device of claim 2, wherein during operation, the working fluid in the first area of ​​the inlet passage and the working fluid in the second area of ​​the inlet passage have the same temperature. (Appendix 7) 3. The thermal management device of claim 2, wherein during operation, the working fluid in a first area of ​​the inlet passage has a first temperature and the working fluid in a second area of ​​the inlet passage has a second temperature, and a difference between the first and second temperatures is less than a predetermined threshold of 1°C, 2°C, 3°C, 4°C, or 5°C. (Appendix 8) 3. The thermal management device of claim 2, wherein the first area of ​​the outlet passage is a proximal end of the outlet passage. (Appendix 9) 3. The thermal management device of claim 2, wherein the second area of ​​the inlet passage is a distal end of the inlet passage. (Appendix 10) 3. The thermal management device of claim 2, wherein the heat transfer system is a closed loop system. (Appendix 11) 3. The thermal management device of claim 2, wherein the inlet passage is a low-temperature working fluid passage configured to direct cooled working fluid from the heat exchanger to the fluid distribution network, and the outlet passage is a high-temperature working fluid passage configured to direct heated working fluid from the fluid distribution network to the heat exchanger. (Appendix 12) 3. The thermal management device of claim 2, wherein the fluid distribution network further includes a third fluid distribution network coupled to (i) a third area of ​​the inlet passage downstream of the second area of ​​the inlet passage and (ii) a third area of ​​the outlet passage downstream of the second area of ​​the outlet passage. (Appendix 13) 13. The thermal management device of claim 12, wherein during operation, a difference in pressure of the working fluid measured between the first area of ​​the inlet passage and the first area of ​​the outlet passage is approximately equal to (i) a difference in pressure of the working fluid measured between the second area of ​​the inlet passage and the second area of ​​the outlet passage, and (ii) a difference in pressure of the working fluid measured between the third area of ​​the inlet passage and the third area of ​​the outlet passage. (Appendix 14) During operation, a working fluid flowing between the first area of ​​the inlet passage and the first area of ​​the outlet passage experiences a first pressure drop; a working fluid flowing between the second area of ​​the inlet passage and the second area of ​​the outlet passage experiences a second pressure drop; a working fluid flowing between the third area of ​​the inlet passage and the third area of ​​the outlet passage experiences a third pressure drop; the differences between the first pressure drop, the second pressure drop, and the third pressure drop are the same or within 5%, 10%, or 15% of each other; 13. The thermal management device of claim 12. (Appendix 15) During operation, a working fluid flowing between the first area of ​​the inlet passage and the first area of ​​the outlet passage has a first pressure drop; a working fluid flowing between the second area of ​​the inlet passage and the second area of ​​the outlet passage has a second pressure drop; The difference between the first pressure drop and the second pressure drop is less than a predetermined threshold. 3. The thermal management device of claim 2. (Appendix 16) A thermal management device described in any one of the appendices herein, wherein each of the fluid distribution networks includes microfeatures spaced apart from one another and defines, at least in part, a channel configured to receive a working fluid. (Appendix 17) The thermal management device described in any one of the appendices herein, further comprising a flexible support member including a first side and a second side opposite the first side, the first side of the flexible support member coupled to the first side of the thermoelectric component, and the second side of the flexible support member configured to be positioned over a target area of ​​a mammal. (Appendix 18) 18. The thermal management device of claim 17, wherein the flexible support member is expandable along at least one of a first dimension or a second dimension that is normal to the first dimension. (Appendix 19) 18. The thermal management device of claim 17, further comprising one or more thermally conductive members extending along all or a portion of a dimension of the flexible support member. (Appendix 20) 18. The thermal management device of claim 17, wherein the thermally conductive member comprises copper, brass, steel, zinc, or an alloy thereof. (Appendix 21) 18. The thermal management device of claim 17, wherein the thermally conductive member has a greater stiffness than the flexible support member. (Appendix 22) 18. The thermal management device of claim 17, wherein the thermally conductive member comprises a conductive wire, a stamped conductive metal, or a sheet of thermally conductive material. (Appendix 23) 20. The thermal management device of claim 19, wherein the thermally conductive member has an oscillating or wavy shape. (Appendix 24) 20. The thermal management device of claim 19, wherein the thermally conductive member includes a first thermally conductive member extending in a first direction and a second thermally conductive member extending in a second direction that is normal to the first direction. (Appendix 25) 1. A thermal management device comprising: thermoelectric components arranged in an array and spaced apart from one another, each thermoelectric component having a first side configured to be thermally coupled to a target area of ​​a mammal and a second side opposite the first side; a heat transfer system having a heat exchanger, an array of fluid distribution networks, an inlet passage fluidly coupled to the fluid distribution networks and configured to provide a working fluid to the fluid distribution networks, and an outlet passage fluidly coupled to the fluid distribution networks and configured to receive the working fluid from the fluid distribution networks, each of the fluid distribution networks being thermally coupled to a second side of a corresponding one of the thermoelectric components and fluidly coupled to the heat exchanger via the inlet passage and the outlet passage, each of the fluid distribution networks having an inlet region, an outlet region, and microfeatures spaced apart from one another and at least partially defining a channel configured to receive the working fluid, wherein in an operational mode the working fluid flows from the inlet region to the outlet region and absorbs heat from the microfeatures; Equipped with the fluid distribution network includes a first fluid distribution network and a second fluid distribution network; the inlet passage is positioned to provide a working fluid to the first fluid distribution network at a first temperature and a first pressure and to the second fluid distribution network at a second temperature and a second pressure; the first temperature and the second temperature are approximately equal; The first pressure exceeds the second pressure. Thermal management devices. (Appendix 26) A thermal management device described in any one of the appendices herein, wherein a first pressure drop between the inlet region and the outlet region of the first fluid distribution network and a second pressure drop between the inlet region and the outlet region of the second fluid distribution network are equal. (Appendix 27) A thermal management device as described in any one of the appendices herein, wherein the first fluid distribution network has a first working fluid flow rate and the second fluid distribution network has a second working fluid flow rate, the first and second working fluid flow rates being equal. (Appendix 28) A thermal management device according to any one of the appendices herein, wherein the heat exchanger provides a low temperature working fluid to the fluid distribution network and receives a high temperature working fluid from the fluid distribution network. (Appendix 29) A thermal management device as described in any one of the appendices herein, wherein the operating mode is a first operating mode, and the thermal management device further comprises a second operating mode, wherein the working fluid provides heat to the microfeature. (Appendix 30) 1. A thermal management device comprising: thermoelectric components arranged in an array and spaced apart from one another, each thermoelectric component having a first side configured to be thermally coupled to a target area of ​​a mammal and a second side opposite the first side; a heat transfer system having a heat exchanger and an array of fluid distribution networks in which individual fluid distribution networks are thermally coupled to second sides of corresponding ones of the thermoelectric components and fluidly coupled to the heat exchanger, each of the fluid distribution networks having an inlet region, an outlet region, and microfeatures spaced apart from one another and defining, at least in part, a channel configured to receive a working fluid, wherein in operation, the working fluid flows from the inlet region to the outlet region and absorbs heat from the microfeatures; a flexible support unit coupled to the thermoelectric component and configured, when attached to the mammal, to align the thermoelectric component adjacent to the target area, the flexible support unit configured to apply a compressive force to the target area; a thermally conductive member coupled to the flexible support unit and in thermal communication along a dimension of the flexible support unit and across two or more of the thermoelectric components; A thermal management device comprising: (Appendix 31) A thermal management device described in any one of the appendices herein, wherein the thermally conductive member is a conductive wire in a wavy pattern that crosses two or more of the thermoelectric components. (Appendix 32) A thermal management device described in any one of the appendices herein, wherein the thermally conductive member is a conductive metal that is stamped in a wavy pattern across two or more of the thermoelectric components. (Appendix 33) A thermal management device described in any one of the appendices herein, wherein the thermally conductive member is a sheet of thermally conductive material that traverses two or more of the thermoelectric components. (Appendix 34) The thermal management device of any one of the appendices herein, wherein the sheet of thermally conductive material defines a cutout, the cutout being aligned with at least one of the thermoelectric components. (Appendix 35) A thermal management device according to any one of the appendices herein, wherein the thermally conductive member is one of several thermally conductive members. (Appendix 36) 36. The thermal management device of claim 35, wherein a first set of the number of thermally conductive members are substantially aligned with dimensions of the flexible support unit and a second set of the number of thermally conductive members are misaligned from dimensions of the flexible support unit. (Appendix 37) 36. The thermal management device of claim 35, wherein some of the thermally conductive members have a higher rigidity than the flexible support unit. (Appendix 38) 36. The thermal management device of claim 35, wherein the number of thermally conductive members are configured as springs within the flexible support unit such that when the flexible support unit and the number of thermally conductive members are expanded along a dimension of the flexible support unit, the number of thermally conductive members impart a spring biasing force on the flexible support unit. (Appendix 39) 36. The thermal management device of claim 35, wherein some of the thermally conductive members are conductive particles within the flexible support unit. (Appendix 40) A thermal management device described in any one of the appendices herein, wherein the thermally conductive member is embedded within the flexible support unit. (Appendix 41) 1. A thermal management device comprising: thermoelectric components arranged in an array and spaced apart from one another, each thermoelectric component having a first side configured to be thermally coupled to a target area of ​​a mammal and a second side opposite the first side; a heat transfer system having a heat exchanger and an array of fluid distribution networks in which individual fluid distribution networks are thermally coupled to second sides of corresponding ones of the thermoelectric components and fluidly coupled to the heat exchanger, the fluid distribution networks each having an inlet region, an outlet region, and microfeatures spaced apart from one another and defining, at least in part, a channel configured to receive a working fluid, wherein in operation the working fluid flows from the inlet region to the outlet region and absorbs heat from the microfeatures; a flexible support unit having an effective thermal conductivity, coupled to the thermoelectric component and configured such that when attached to the mammal, the thermoelectric component is aligned adjacent to the target area, the flexible support unit configured to apply a compressive force to the target area; a controller coupled to the thermoelectric component, the controller configured to collect a number of temperature readings at the first side and the second side from the thermoelectric component, evaluate the collected temperature readings with reference to an effective thermal conductivity of the flexible support unit, identify a temperature of a target area, and modify an input to the thermoelectric component such that the thermoelectric component changes the temperature of the target area to the target temperature within a predetermined period of time; A thermal management device comprising: (Appendix 42) A thermal management device described in any one of the appendices of the present specification, wherein the flexible support unit is coupled to a first side of the thermoelectric components and includes a thermally conductive flexible member extending at least between the individual thermoelectric components, and the thermoelectric components are thermally coupled to the target area via the thermally conductive flexible member. (Appendix 43) A thermal management device described in any one of the appendices herein, further comprising first and second groups of thermoelectric components, each of the first and second groups of thermoelectric components including at least two thermoelectric components and at least two fluid distribution networks. (Appendix 44) 44. The thermal management device of claim 43, wherein the controller is further configured to independently collect temperature readings at the first side and the second side from the first and second thermoelectric component groups, evaluate the collected temperature readings with reference to the effective thermal conductivity of the flexible support unit to identify a temperature of the target area, and modify inputs to the thermoelectric component groups such that the thermoelectric component groups independently change a temperature of the target area proximate the first thermoelectric component group to a first target temperature within a first predetermined time period and a temperature of the target area proximate the second thermoelectric component group to a second target temperature within a second predetermined time period. (Appendix 45) 45. The thermal management device of claim 44, wherein the first and second predetermined periods are identical. (Appendix 46) 1. A method for controlling the temperature of a target area of ​​a mammal within a predetermined period of time, comprising: thermoelectric components, each having a first side and a second side opposite the first side; an array of fluid distribution networks, each thermally coupled to a second side of a corresponding one of the thermoelectric components and fluidly coupled to the heat exchanger, each fluid distribution network having an inlet region fluidly coupled to a common inlet fluid distribution passage and an outlet region fluidly coupled to a common outlet fluid distribution passage, wherein in operation, a working fluid disposed within the fluid distribution network is configured to absorb heat from a corresponding one of the thermoelectric components; a flexible support unit coupled to a first side of the thermoelectric components and extending at least between the individual thermoelectric components, the flexible support unit being a heat spreader configured to enhance heat transfer from the mammal; providing a wearable heat transfer device comprising: placing a heat transfer device over a target area of ​​the mammal such that a thermoelectric component of the heat transfer device is thermally coupled to the target area; via a controller operably coupled to the heat transfer device; collecting, using a controller, a number of temperature readings at a first side and a second side of the thermoelectric component; evaluating the several collected temperature readings with reference to an effective thermal conductivity of the flexible support unit to identify a temperature of a target area of ​​the mammal; Modifying an input to the thermoelectric component such that the thermoelectric component changes a temperature of the target area toward a desired temperature; repeating the collecting, evaluating, and correcting until the temperature of the target area equals the desired temperature; activating a temperature control of the heat transfer device, A method comprising: (Appendix 47) The method of any one of the appendices herein, wherein the flexible support unit is coupled to a first side of the thermoelectric components and includes a thermally conductive flexible member extending at least between the individual thermoelectric components, and the thermoelectric components are thermally coupled to the target area via the thermally conductive flexible member. (Appendix 48) 48. The method of claim 47, wherein positioning the heat transfer device over the target area comprises positioning a thermally conductive flexible member directly against the mammal. (Appendix 49) The method of any one of the appendices herein, further comprising first and second groups of thermoelectric components, each of the first and second groups of thermoelectric components including at least two thermoelectric components and at least two fluid distribution networks. (Appendix 50) 49. The method of claim 49, wherein the controller is further configured to independently collect temperature readings at the first side and the second side from the first and second thermoelectric component groups, evaluate the collected temperature readings with reference to the effective thermal conductivity of the flexible support unit, identify a temperature of the target area, and modify inputs to the thermoelectric component groups such that the thermoelectric component groups independently change a temperature of the target area proximate the first thermoelectric component group to a first target temperature within a first predetermined time period and a temperature of the target area proximate the second thermoelectric component group to a second target temperature within a second predetermined time period. (Appendix 51) 51. The method of claim 50, wherein the first and second predetermined periods are the same.

Claims

1. 1. A thermal management device comprising: thermoelectric components arranged in an array and spaced apart from one another, each thermoelectric component having a first side configured to be thermally coupled to a target area of ​​a mammal and a second side opposite the first side; 1. A heat transfer system comprising: A heat exchanger; an array of fluid distribution networks; an inlet passageway fluidly coupled to the fluid distribution network and configured to provide a working fluid to the fluid distribution network; an outlet passageway fluidly coupled to the fluid distribution network and configured to receive the working fluid from the fluid distribution network; Including, each fluid distribution network is thermally coupled to the second side of a corresponding one of the thermoelectric components and fluidly coupled to the heat exchanger via the inlet passage and the outlet passage; each fluid distribution network having an inlet region and an outlet region, and in operation, the working fluid flows from the inlet region, through the fluid distribution network, and to the outlet region; the fluid distribution network includes a first fluid distribution network and a second fluid distribution network; the first fluid distribution network is coupled to a first area of ​​the inlet passageway, and the second fluid distribution network is coupled to a second area of ​​the inlet passageway downstream from the first area of ​​the inlet passageway; the first fluid distribution network is coupled to a first area of ​​the outlet passageway and the second fluid distribution network is coupled to a second area of ​​the outlet passageway downstream from the first area of ​​the outlet passageway; Heat transfer system and A thermal management device comprising:

2. 2. The thermal management device of claim 1, wherein during operation, a difference in pressure of the working fluid measured between the first area of ​​the inlet passage and the first area of ​​the outlet passage is approximately equal to a difference in pressure of the working fluid measured between the second area of ​​the inlet passage and the second area of ​​the outlet passage.

3. During operation, the working fluid flowing between the first area of ​​the inlet passage and the first area of ​​the outlet passage has a first pressure drop; the working fluid flowing between the second area of ​​the inlet passage and the second area of ​​the outlet passage has a second pressure drop; The thermal management device of claim 1 , wherein a difference between the first pressure drop and the second pressure drop is within 10% of each other.

4. In operation, the working fluid a first pressure in the first area of ​​the inlet passage; a second pressure in the first area of ​​the outlet passageway that is less than the first pressure; a third pressure in the second area of ​​the inlet passage that is less than the first pressure; and a fourth pressure in the second area of ​​the outlet passage that is less than the third pressure; and and The thermal management device of claim 1 , wherein a difference between the first pressure drop and the second pressure drop is less than a predetermined threshold.

5. The thermal management device of claim 1 , wherein during operation, the working fluid in the first area of ​​the inlet passage and the working fluid in the second area of ​​the inlet passage have the same temperature.

6. 2. The thermal management device of claim 1, wherein, during operation, the working fluid in the first area of ​​the outlet passage has a first temperature and the working fluid in the second area of ​​the outlet passage has a second temperature, and a difference between the first temperature and the second temperature is about the same as or less than a predetermined threshold.

7. The thermal management device of claim 1 , wherein the first area of ​​the outlet passage is a proximal end of the outlet passage.

8. The thermal management device of claim 7 , wherein the second area of ​​the inlet passage is a distal end of the inlet passage.

9. The thermal management device of claim 1 , wherein the heat transfer system is a closed loop system.

10. 2. The thermal management device of claim 1, wherein the inlet passage is a low-temperature working fluid passage configured to direct cooled working fluid from the heat exchanger to the fluid distribution network, and the outlet passage is a high-temperature working fluid passage configured to direct heated working fluid from the fluid distribution network to the heat exchanger.

11. 2. The thermal management device of claim 1, wherein the fluid distribution network further includes a third fluid distribution network coupled to (i) a third area of ​​the inlet passage downstream of the second area of ​​the inlet passage and (ii) a third area of ​​the outlet passage downstream of the second area of ​​the outlet passage.

12. 12. The thermal management device of claim 11, wherein during operation, a difference in pressure of the working fluid measured between the first area of ​​the inlet passage and the first area of ​​the outlet passage is approximately equal to (i) a difference in pressure of the working fluid measured between the second area of ​​the inlet passage and the second area of ​​the outlet passage, and (ii) a difference in pressure of the working fluid measured between the third area of ​​the inlet passage and the third area of ​​the outlet passage.

13. In operation, the working fluid a first pressure in the first area of ​​the inlet passage; a second pressure in the first area of ​​the outlet passageway that is less than the first pressure; a third pressure in the second area of ​​the inlet passage that is less than the first pressure; and a fourth pressure in the second area of ​​the outlet passageway that is less than the third pressure; and a fifth pressure in the third area of ​​the inlet passage that is less than the second pressure; and a sixth pressure in the third area of ​​the outlet passage that is less than the fifth pressure; and The thermal management device of claim 11 , comprising:

14. During operation, the working fluid flowing between the first area of ​​the inlet passage and the first area of ​​the outlet passage has a first pressure drop; the working fluid flowing between the second area of ​​the inlet passage and the second area of ​​the outlet passage has a second pressure drop; the working fluid flowing between the third area of ​​the inlet passage and the third area of ​​the outlet passage has a third pressure drop; 14. The thermal management device of claim 13, wherein a difference between (i) the first pressure drop and the second pressure drop and (ii) the second pressure drop and the third pressure drop is approximately equal.

15. 1. A thermal management device comprising: thermoelectric components arranged in an array and spaced apart from one another, each thermoelectric component having a first side configured to be thermally coupled to a target area of ​​a mammal and a second side opposite the first side; A heat transfer system comprising: A heat exchanger; an array of fluid distribution networks; an inlet passageway fluidly coupled to the fluid distribution network and configured to provide a working fluid to the fluid distribution network; an outlet passageway fluidly coupled to at least some of the fluid distribution networks and configured to receive the working fluid from the fluid distribution networks; Including, each fluid distribution network is thermally coupled to the second side of a corresponding one of the thermoelectric components and fluidly coupled to the heat exchanger via the inlet passage and the outlet passage; each of the fluid distribution networks having an inlet region, an outlet region, and microfeatures spaced apart from one another to define, at least in part, a channel configured to receive the working fluid; In an operational mode, the working fluid flows from the inlet region to the outlet region and absorbs heat from the micro-features. Heat transfer system and Equipped with the fluid distribution network includes a first fluid distribution network and a second fluid distribution network; the inlet passage is positioned to provide the working fluid (i) to the first fluid distribution network at a first temperature and a first pressure, and (ii) to the second fluid distribution network at a second temperature and a second pressure; the first temperature and the second temperature are equal; The thermal management device, wherein the first pressure exceeds the second pressure.

16. 16. The thermal management device of claim 15, wherein a first pressure drop between the inlet region and the outlet region of the first fluid distribution network and a second pressure drop between the inlet region and the outlet region of the second fluid distribution network are equal.

17. 16. The thermal management device of claim 15, wherein the first fluid distribution network has a first working fluid flow rate and the second fluid distribution network has a second working fluid flow rate, the first working fluid flow rate and the second working fluid flow rate being equal.

18. The thermal management device of claim 15 , wherein the heat exchanger provides a cold working fluid to the fluid distribution network and receives a hot working fluid from the fluid distribution network.

19. The thermal management device of claim 15 , wherein the mode of operation is a first mode of operation, and the thermal management device further comprises a second mode of operation, wherein the working fluid provides heat to the microfeature.

20. 1. A thermal management device comprising: thermoelectric components arranged in an array and spaced apart from one another, each thermoelectric component having a first side configured to be thermally coupled to a target area of ​​a mammal and a second side opposite the first side; a heat transfer system comprising a heat exchanger and an array of fluid distribution networks, each of which is thermally coupled to the second side of a corresponding one of the thermoelectric components and fluidly coupled to the heat exchanger, each of which has an inlet region, an outlet region, and spaced-apart microfeatures, the fluid distribution networks at least partially defining channels configured to receive a working fluid, wherein in operation the working fluid flows from the inlet region to the outlet region and absorbs heat from the microfeatures; a flexible support unit coupled to the thermoelectric component and configured such that, when attached to the mammal, the thermoelectric component is aligned adjacent to the target area, the flexible support unit configured to apply a compressive force to the target area; a thermally conductive member coupled to the flexible support unit and in thermal communication across two or more of the thermoelectric components along a dimension of the flexible support unit; A thermal management device comprising:

21. The thermal management device of claim 20 , wherein the thermally conductive member is a conductive wire in a wave-like pattern that traverses two or more of the thermoelectric components.

22. The thermal management device of claim 20 , wherein the thermally conductive member is a sheet of thermally conductive material that traverses two or more of the thermoelectric components.

23. 23. The thermal management device of claim 22, wherein a first set of the number of thermally conductive members substantially matches the dimensions of the flexible support unit, and a second set of the number of thermally conductive members is misaligned from the dimensions of the flexible support unit.

24. The thermal management device of claim 22 , wherein the number of thermally conductive members has a higher stiffness than the flexible support unit.

25. 23. The thermal management device of claim 22, wherein the number of thermally conductive members are configured like springs within the flexible support unit such that when the flexible support unit and the number of thermally conductive members are expanded along the dimension of the flexible support unit, the number of thermally conductive members exert a spring biasing force on the flexible support unit.

26. The thermal management device of claim 20 , wherein the thermally conductive member is embedded within the flexible support unit.

27. 1. A system for controlling the temperature of a target area of ​​a mammal within a predetermined period of time, comprising:

1. A wearable heat transfer device, comprising: thermoelectric components, each having a first side and a second side opposite the first side; an array of fluid distribution networks, each of the fluid distribution networks thermally coupled to the second side of a corresponding one of the thermoelectric components and fluidly coupled to a heat exchanger, each of the fluid distribution networks having an inlet region fluidly coupled to a common inlet fluid distribution passage and an outlet region fluidly coupled to a common outlet fluid distribution passage, wherein in operation, a working fluid in the fluid distribution networks is configured to absorb heat from the corresponding one of the thermoelectric components; a flexible support unit coupled to the first side of the thermoelectric components and extending at least between individual thermoelectric components, the flexible support unit being a heat spreader configured to enhance heat transfer from the mammal; and a wearable heat transfer device comprising: a controller operably coupled to the heat transfer device; Equipped with the heat-transfer device is configured to be placed over the target area of ​​the mammal such that the thermoelectric component of the heat-transfer device is thermally coupled to the target area; The controller collecting temperature readings at the first side and the second side of the thermoelectric component; evaluating the collected temperature readings with reference to an effective thermal conductivity of the flexible support unit to identify the temperature of the target area of ​​the mammal; modifying input power to at least some of the thermoelectric components such that at least some of the thermoelectric components change the temperature of the target area toward a desired temperature; to initiate temperature control of the heat transfer device.

28. 28. The system of claim 27, wherein the flexible support unit comprises a thermally conductive flexible member coupled to the first side of the thermoelectric components and extending at least between individual thermoelectric components, the thermoelectric components being thermally coupled to the target area via the thermally conductive flexible member.

29. 28. The system of claim 27, further comprising a first group of thermoelectric components and a second group of thermoelectric components, wherein the first group of thermoelectric components and the second group of thermoelectric components each comprise at least two thermoelectric components and at least two fluid distribution networks, and wherein modifying the input comprises modifying a first input provided to the first group of thermoelectric components and modifying a second input provided to the second group of thermoelectric components.

30. The system described in claim 27, wherein the controller is further configured to iteratively repeat the collecting, evaluating, and correcting steps at least twice until the temperature of the target area is equal to the desired temperature.

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