Wafer processing apparatus, wafer processing system and control method

Abstract

The present invention provides a wafer processing apparatus, a wafer processing system and a control method, which includes a driving device, a transfer chamber, a processing chamber and a mounting assembly, the mounting assembly being installed in the transfer chamber, the processing chamber being connected to the transfer chamber, the processing chamber being used to process the wafer, the mounting assembly being used to mount the wafer, the driving device being used to adjust the position of the mounting assembly in the transfer chamber, and the driving device being further used to drive the mounting assembly to move between the transfer chamber and the processing chamber. The wafer processing apparatus of the present invention can directly transport the wafers that need to be processed to the processing chamber by the driving device for processing, and can directly adjust or store the wafers that need to be adjusted or do not need to be directly processed in the transfer chamber, which can reduce the time that the wafers between different batches occupy the operating mechanism and the waiting time, and can provide the basic conditions for synchronous processing of multiple wafers or multiple batches by the transfer chamber and the mounting assembly.

Description

[Technical field]

[0001] The present invention relates to the technical field of semiconductor processing, and more particularly to a wafer processing apparatus, a wafer processing system and a control method. [Background technology]

[0002] Wafer processing is used to process semiconductors by techniques including physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), plasma enhanced atomic layer deposition (PEALD), pulse deposition layer (PDL), molecular layer deposition (MLD), plasma enhanced pulsed deposition layer (PEPDL) processing, etching and etch inhibitor removal, etc.

[0003] When processing a wafer, it is necessary to first preheat the wafer. Conventional wafer processing apparatuses generally have a heating plate installed in the processing apparatus when preheating the wafer, and the wafer is preheated by the heating plate before the processing process, and the wafer is processed only after it reaches a predetermined processing condition.

[0004] This processing method causes problems in that the wafer processing time is long and the efficiency is low. Summary of the Invention [Problem to be solved by the invention]

[0005] The objective of the present invention is to provide a wafer processing apparatus, a wafer processing system and a control method, in which wafers that need to be processed can be directly transported to the processing chamber by the driving device for processing, and wafers that need to be adjusted or do not need to be directly processed can be adjusted or stored in the transfer chamber, thereby reducing the time that wafers between different batches occupy the operating mechanism and waiting time, and improving the wafer processing efficiency; and the transfer chamber and the mounting assembly provide the basic conditions for synchronous processing of multiple wafers or multiple batches of wafers, thereby solving the problems of long occupancy time and low efficiency when processing wafers in the prior art. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention provides a wafer processing apparatus, the wafer processing apparatus including a drive unit, a transfer chamber, a processing chamber, a first bleed unit, a second bleed unit, and a mounting assembly, the processing chamber communicates with the transfer chamber, the transfer chamber is used to provide a sealed space, the first bleed unit communicates with the transfer chamber, the first bleed unit is used to extract gas in the transfer chamber and perform a first vacuum process on the transfer chamber, the processing chamber is used to process a wafer. a second bleed device communicating with the processing chamber, the second bleed device being used to extract gas within the processing chamber and perform a second vacuum process on the processing chamber; the mounting assembly being installed in the transfer chamber, the mounting assembly being used to place a wafer thereon; the drive device being used to adjust a position of the mounting assembly in the transfer chamber, and the drive device being further used to drive the mounting assembly to move between the transfer chamber and the processing chamber.

[0007] The beneficial effects of the wafer processing apparatus of the present invention are as follows: by setting the processing chamber, the wafer placed in the processing chamber is processed, where the processing includes heating, deposition, coating, etching or other processing methods; by setting the mounting assembly, the wafer is supported; by setting the transfer chamber and performing a first vacuum process on the transfer chamber to provide a sealed space, the wafer can be adjusted or stored in the transfer chamber, and a second vacuum process on the processing chamber to provide a sealed space, thus the driving device, the transfer chamber and the processing chamber can flexibly control multiple batches of wafers to be adjusted or stored in the transfer chamber under the first vacuum condition, which avoids the prior art transferring the wafers in a non-vacuum environment before entering the processing chamber, which damages the quality of the wafers. In the present invention, a transfer chamber under a first vacuum condition is set up to store wafers, so that different batches of wafers can be flexibly controlled to be transported to the processing chamber for processing, and the wafers can be freely moved between the transfer chamber under a first vacuum condition and the processing chamber under a second vacuum condition while ensuring that the wafers are not damaged, providing a basic condition for simultaneously processing multiple or multiple batches of wafers. The driving device is set up to move the loading assembly between the transfer chamber and the processing chamber, or adjust the position of the loading assembly in the transfer chamber.As can be seen from this, in the wafer processing apparatus of the present application, the driving device, the transfer chamber and the processing chamber can flexibly control the wafers to be adjusted or stored in the transfer chamber, or the wafers to be transported to the processing chamber for processing, and multiple wafers can be placed on one mounting assembly for processing or transport according to demand, thereby reducing the time that one or a set of wafers occupies the processing chamber, and improving the processing efficiency of the processing apparatus; further, according to the flexible use of the driving device, the transport time between wafers of different batches or the interval time between processing wafers of different batches can be reduced, thereby further improving the processing efficiency of the processing apparatus.

[0008] In one possible embodiment, the processing chamber at least includes a first heating chamber and a first process chamber, the first heating chamber is used to heat the wafer, and the first process chamber is used to process the wafer. Its beneficial effects are as follows: by setting the processing chamber as at least the first heating chamber and the first process chamber, heating treatment and processing can be performed synchronously on wafers of different batches, and the heating treatment can be a pre-preheating treatment or a post-heating treatment, which solves the problem of long occupancy time and low efficiency when pre-heating or heating the wafer in the prior art. In addition, since the transfer chamber provides a first vacuum condition, wafers of different batches can be stored or transported in the transfer chamber under the first vacuum condition before entering the first heating chamber or the first process chamber, which avoids the prior art of transferring wafers in a non-vacuum environment before entering the process chamber, which would result in loss of wafer quality. In the present invention, by providing a transfer chamber under the first vacuum condition for wafer storage, wafers of different batches can be flexibly controlled to be transported to the heating chamber or the process chamber for processing, thereby reducing the waiting time for wafer pre-heating processing of different batches and improving the processing efficiency of wafers of different batches.

[0009] In one possible embodiment, the processing chamber includes at least a first heating chamber, a second heating chamber, a first process chamber, and a second process chamber, the first heating chamber and the second heating chamber are used for performing heat treatment on the first batch of wafers and the second batch of wafers, respectively, and the first process chamber and the second process chamber are used for performing processing on the first batch of wafers and the second batch of wafers, respectively. The beneficial effects are as follows: By providing at least two of the process chambers and the heating chambers, the same batch of wafers can be sequentially heated and processed, and the first batch of wafers and the second batch of wafers can be simultaneously heated and processed, which solves the problem of the long occupancy time and low efficiency when preheating or heat-treating wafers in the prior art, and greatly improves the batch wafer processing efficiency. In addition, since the transfer chamber provides the first vacuum condition, the first batch of wafers and the second batch of wafers can be stored or transferred in the transfer chamber under the first vacuum condition before entering the first heating chamber, the first processing chamber, the second heating chamber and the second processing chamber, respectively, to avoid the loss of wafer quality caused by transferring the wafers in a non-vacuum environment before entering the processing chamber in the prior art. In the present invention, by providing a transfer chamber under the first vacuum condition to store wafers, wafers of different batches can be flexibly controlled to be transported to the first heating chamber, the second heating chamber, the first processing chamber and the second processing chamber for processing, thereby reducing the waiting time for wafer preheating processing of different batches and improving the processing efficiency of wafers of different batches.

[0010] In one possible embodiment, the processing chamber is installed above or below the transfer chamber, and the drive device is installed on the side of the transfer chamber remote from the processing chamber, which has the following beneficial effects: By installing the processing chamber above or below the transfer chamber, it is easy to attach the mounting assembly and support the wafer, and by installing the drive device on the side of the transfer chamber remote from the processing chamber, it is easy for the drive device to drive the mounting assembly and transport the wafer.

[0011] In one possible embodiment, the driving device includes a first driving mechanism, a second driving mechanism, and a transfer device, the transfer device is installed in the transfer chamber, the first driving mechanism is connected to the transfer device, the first driving mechanism is used to move or rotate the transfer device, the mounting assembly is installed in the transfer device, the second driving mechanism is installed on one side of the transfer device, and the second driving mechanism is used to move the mounting assembly between the processing chamber and the transfer chamber. The beneficial effects are as follows: The first driving mechanism moves the transfer device in the transfer chamber; When the mounting assembly is located in the transfer device, the position of the mounting assembly can be adjusted; The second driving mechanism moves the mounting assembly to the processing chamber to process the wafer.

[0012] In one possible embodiment, the transfer device is removably connected to the first drive mechanism, the beneficial effect of which is that such an arrangement makes it easy to maintain or replace the transfer device.

[0013] In one possible embodiment, the driving device further includes a connection mechanism, the connection mechanism is installed on the mounting assembly or the transfer device, a first fastening part is installed on the connection mechanism, the mounting assembly or the transfer device is provided with a second fastening part that matches the first fastening part, and the connection mechanism is used to connect the transfer device and the connection member. Its beneficial effects are as follows: The connection mechanism can be installed to connect the mounting assembly and the transfer device by the first fastening part and the second fastening part, and when the second driving mechanism drives the mounting assembly to move, the transfer device and all the mounting assemblies in the transfer device can be moved.

[0014] In one possible embodiment, the driving device further includes a third driving mechanism, the third driving mechanism is installed on one side of the transfer device, and the third driving mechanism is used to move the transfer device and the placement assembly. Its beneficial effects are as follows: By installing the third driving mechanism to drive the transfer device, the placement assembly can be driven to move at the same time as driving the transfer device, and when a plurality of the placement assemblies are installed, each placement assembly can be driven to move synchronously.

[0015] In one possible embodiment, the mounting assembly is provided in at least two pieces, the beneficial effect of which is that the wafer can be supported by two mounting assemblies, which facilitates asynchronous processing.

[0016] In one possible embodiment, the second driving mechanism is provided in at least two, and each of the second driving mechanisms is used to drive each of the mounting assemblies. The beneficial effect is that by providing at least two second driving mechanisms and providing each of the two second driving mechanisms corresponding to different mounting assemblies, different mounting assemblies can be moved synchronously or asynchronously, which increases the flexibility of use.

[0017] In one possible embodiment, the mounting assembly is provided with N support parts, each of which is used to support the wafer, and N is an integer greater than 1. The beneficial effect is that by providing N support parts to the mounting assembly, multiple wafers can be mounted on one mounting assembly at the same time, and multiple wafers can be processed at the same time, improving processing efficiency.

[0018] In one possible embodiment, the processing chambers are provided in a plurality of locations, each of which operates independently, and the driving device is used to drive the mounting assembly to move between each of the processing chambers and the transfer chamber. The beneficial effect is that by providing a plurality of processing chambers which operate independently, different wafers can be processed synchronously, and the same wafer can be processed asynchronously before and after.

[0019] In one possible embodiment, the processing chamber is provided in two, and the two processing chambers are two process chambers, or the two processing chambers are two heating chambers, or the two processing chambers are one process chamber and one heating chamber. The beneficial effect is that by providing two processing chambers, two sets or two different wafers can be processed synchronously, and two asynchronous steps of processing can be performed on the same wafer.

[0020] In one possible embodiment, the wafer processing apparatus further includes a supply device, the supply device communicates with the process chamber, and the supply device is used to provide raw materials for the process chamber to process the wafer. The beneficial effect is that by installing the supply device, the process chamber can provide raw materials when it needs to process, and ensure the normal operation of the apparatus.

[0021] In one possible embodiment, the wafer processing apparatus further includes a seal member for isolating the transfer chamber and the processing chamber, which is installed on the mounting assembly. The beneficial effect is that the seal member isolates the processing chamber and the transfer chamber, and prevents the diffusion of raw materials or temperature into the transfer chamber during processing in the processing chamber, thereby ensuring normal processing.

[0022] In one possible embodiment, the wafer processing apparatus further includes a fourth driving mechanism, the fourth driving mechanism is installed on one side of the mounting assembly, and the fourth driving mechanism is used to rotate the mounting assembly. The beneficial effect is that the angle of the wafer on the mounting assembly can be adjusted by installing the fourth driving mechanism and rotating the mounting assembly, so that the quality of the wafer after processing can be ensured.

[0023] In one possible embodiment, the wafer processing apparatus further includes a base, the processing chamber and the transfer chamber are provided on the base, the driving device is installed on the base, and the sealing method between the driving device and the base is dynamic sealing. The beneficial effect is that by installing in this way, a part of the structure of the driving device can be installed outside the transfer chamber, so that the space of the transfer chamber does not need to be increased, and the manufacturing difficulty of the operating environment during processing can be reduced.

[0024] In one possible embodiment, the wafer processing apparatus further includes a fifth driving mechanism, the base includes a first fixing part and a second fixing part, the process chamber and the heating chamber are installed on the first fixing part, the first fixing part and the second fixing part form the transfer chamber, the fifth driving mechanism is installed on the first fixing part and / or the second fixing part, and the fifth driving mechanism is used to move the first fixing part or the second fixing part. The beneficial effects are as follows: By installing the base as the first fixing part and the second fixing part, the space of the transfer chamber can be opened and closed. By installing the fifth driving mechanism, the first fixing part or the second fixing part can be moved by the fifth driving mechanism, making it easy to open and close the transfer chamber, and easy to clean or repair.

[0025] In one possible embodiment, the wafer processing device further includes a heating device, the heating device is connected to the transfer chamber, and the heating device is used to heat the transfer chamber, the beneficial effect of which is that by installing the heating device, the transfer chamber can be heated, the wafer or the device located in the transfer chamber can be heated, and the temperature of the wafer or the preheating for the wafer can be ensured.

[0026] The present invention further provides a wafer processing system, comprising a transfer device and a wafer processing apparatus according to any one of the feasible aspects, the wafer processing apparatus being provided with a transfer passage, the transfer device being connected to the transfer passage, and the transfer device being used to transfer the wafer. The beneficial effect is that by installing the transfer device, it is easy to transfer a wafer to the wafer processing apparatus and easy to remove a wafer from the wafer processing apparatus.

[0027] In one possible embodiment, at least two of the wafer processing devices are installed, each of the wafer processing devices is installed on a different side of the transport device, the transport device is used to transport wafers to each of the wafer processing devices, and the transport device is used to transport wafers from each of the wafer processing devices. The beneficial effects are as follows: By installing at least two of the wafer processing devices in one transport device in this manner, one transport device can be used in combination with at least two of the wafer processing devices, which can increase the utilization rate of the transport device, save the space occupied, and reduce the system cost.

[0028] In one possible embodiment, the wafer processing system further includes a front-end processing device, the front-end processing device is installed on one side of the transport device, a wafer transport cassette is provided in the front-end processing device, the transport device transports the wafer to the wafer transport cassette and / or the wafer processing device, and the front-end processing device is used to transport the wafer transport cassette. The beneficial effect is that by installing the front-end processing device and the wafer transport cassette, the wafer discharged by the transport device can be transported into the wafer transport cassette in the front-end processing device, reducing the possibility of contamination of the wafer.

[0029] In one possible embodiment, the wafer processing system further includes a wafer transport cassette and a transport unit, the wafer transport cassette is installed in the front-end processing module, the front-end processing module is used to transport the wafer transport cassette to the wafer transport cassette, and the transport unit is used to transport the wafer transport cassette. The beneficial effect is that by installing the wafer transport cassette and the transport unit, the wafer transport cassette can be transported to the wafer transport cassette by the front-end processing module, and the wafer transport cassette can be transported by the transport unit, making it easy to supply and unload wafers.

[0030] The present invention further provides a method for controlling a wafer processing apparatus, the method comprising the steps of: a step S1 of transferring a wafer to the mounting assembly in the transfer chamber, a first evacuation device being connected to the transfer chamber, the first evacuation device being used to extract gas in the transfer chamber and perform a first vacuum process on the transfer chamber; a step S2 of moving the mounting assembly to the processing chamber by the driving device, wherein a second bleed device is connected to the processing chamber, and the second bleed device is used to extract gas in the processing chamber and perform a second vacuum process on the processing chamber; Step S3 of processing the wafer in the mounting assembly by the processing chamber; Step S4: moving the mounting assembly by the driving device to transfer the processed wafer to the transfer chamber; and step S5 of unloading the processed wafer from the transfer chamber.

[0031] In one possible embodiment, the drive device includes a first drive mechanism, a second drive mechanism, and a transfer device; Specifically, S2 is a step S21 of moving the mounting assembly in the transfer device by the first driving mechanism and adjusting the position of the mounting assembly in the transfer chamber; and a step S22 of moving the mounting assembly to the processing chamber by the second driving mechanism.

[0032] In one possible embodiment, the processing chamber is located above or below the transfer chamber, and the drive is located on a side of the transfer chamber away from the processing chamber; Specifically, step S22 includes moving the mounting assembly to the processing chamber in a vertical direction by the second driving mechanism.

[0033] In one possible embodiment, at least two second drive mechanisms are provided, and each second drive mechanism operates independently; S22 further includes moving the mounting assembly vertically to the processing chamber by each of at least two of the second driving mechanisms.

[0034] In one possible embodiment, the processing chamber is provided in a plurality of processing chambers, each processing chamber operates independently, and the plurality of processing chambers includes at least a first heating chamber and a first process chamber; Specifically, S2 and S3 are a step S31 of moving the mounting assembly to the first heating chamber by the driving device and heating the wafer on the mounting assembly; and a step S32 of moving the mounting assembly to the first process chamber by the driving device and performing a process on the wafer on the mounting assembly.

[0035] In one possible embodiment, the heating chamber and the processing chamber are each provided in two pieces, Specifically, the S31 is a step S311 of moving the mounting assembly to a first heating chamber by the driving device and heating the wafer on the mounting assembly for the first time; and a step S312 of moving the mounting assembly to a second heating chamber by the driving device and heating the wafer on the mounting assembly for a second time. Specifically, S32 is a step S321 of moving the mounting assembly to a first process chamber by the driving device and performing a first process on the wafer on the mounting assembly; and a step S322 of moving the mounting assembly to a second process chamber by the driving device and performing a second process on the wafer on the mounting assembly.

[0036] In one possible embodiment, the mounting assembly, the heating chamber and the processing chamber are each provided in two pieces, Specifically, the step S31 includes moving each of the two mounting assemblies to the two heating chambers by the driving device, and heating the first batch of wafers and the second batch of wafers in the two mounting assemblies in the first heating chamber and the second heating chamber, respectively, within at least a first predetermined time; Specifically, S32 includes moving each of the two mounting assemblies to the two process chambers by the driving device, and performing process processing on the first batch of wafers and the second batch of wafers in the two mounting assemblies in the first process chamber and the second process chamber, respectively, within at least a second predetermined time.

[0037] In one possible embodiment, The method further includes a step S0 of providing a front-end processing device and a transport device; Specifically, S1 includes storing the wafer to be processed by the front-end processing device, and moving the wafer to be processed to a loading assembly of the transfer chamber by the transport device. [Brief description of the drawings]

[0038] [Figure 1] 1 is a schematic diagram showing a three-dimensional structure of a wafer processing apparatus according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a structural schematic diagram of a portion of FIG. [Diagram 3] FIG. 2 is a structural schematic diagram of the mounting assembly in FIG. 1; [Figure 4] FIG. 2 is a structural schematic diagram of a heating chamber in FIG. 1. [Diagram 5] FIG. 11 is a structural schematic diagram of a first driving mechanism according to a second embodiment of the present invention. [Figure 6] FIG. 11 is a structural schematic diagram of a third driving mechanism in the second embodiment of the present invention. [Figure 7] FIG. 11 is a structural schematic diagram of a mounting assembly according to a third embodiment of the present invention. [Figure 8] FIG. 13 is a structural schematic diagram of a fourth drive mechanism in the fourth embodiment of the present invention. [Figure 9] FIG. 13 is a structural schematic diagram of a transfer chamber in a fifth embodiment of the present invention. [Figure 10] FIG. 2 is a schematic diagram showing the three-dimensional structure of the wafer processing system according to the embodiment of the present invention. [Figure 11] 4 is a flowchart showing a method for controlling the wafer processing apparatus in the above embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0039] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following clearly and completely describes the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained based on the embodiments of the present invention without the creative efforts of those skilled in the art are all within the scope of protection of the present invention. Unless otherwise defined, technical or scientific terms used herein should have the ordinary meanings understood by those with ordinary skill in the field to which the present invention belongs. Similar words such as "comprise" used in this specification mean that the elements or objects appearing before this word cover the elements or objects listed after this word and their equivalents without excluding other elements or objects.

[0040] In response to problems existing in the prior art, embodiments of the present invention provide a wafer processing apparatus.

[0041] FIG. 1 is a schematic diagram of the three-dimensional structure of a wafer processing apparatus in a first embodiment of the present invention, FIG. 2 is a schematic diagram of a portion of the structure of FIG. 1, FIG. 3 is a schematic diagram of the structure of the mounting assembly in FIG. 1, FIG. 4 is a schematic diagram of the structure of the heating chamber in FIG. 1, FIG. 7 is a schematic diagram of the structure of the mounting assembly in a third embodiment of the present invention, and FIG. 9 is a schematic diagram of the structure of the transfer chamber in a fifth embodiment of the present invention.

[0042] In some embodiments of the present invention, the wafer processing apparatus 11 includes a drive unit 4, a transfer chamber 103, a processing chamber 100, a first evacuation unit 9, a second evacuation unit (not shown), and a mounting assembly 2, the processing chamber 100 communicates with the transfer chamber 103, the transfer chamber 103 is used to provide a sealed space, the first evacuation unit 9 communicates with the transfer chamber 103, the first evacuation unit 9 is used to extract gas in the transfer chamber 103 so that the transfer chamber 103 has a first vacuum condition, and a first vacuum process is performed on the transfer chamber 103, the processing chamber 100 is used to process a wafer. a second evacuation device (not shown) communicates with the processing chamber 100, the second evacuation device (not shown) is used to extract gas in the processing chamber 100 and perform a second vacuum process on the processing chamber 100 so that the processing chamber 100 has a second vacuum condition; the placement assembly 2 is installed in the transfer chamber 103, the placement assembly 2 is used to place a wafer, the drive device 4 is used to adjust the position of the placement assembly 2 in the transfer chamber 103, and the drive device 4 is further used to drive the placement assembly 2 to move between the transfer chamber 103 and the processing chamber 100. Here, the transfer chamber 103 operates at a wafer transfer pressure, typically 0.1-0.3 Torr (unit of pressure), and the transfer chamber 103 has a first vacuum condition to match the wafer transfer pressure of the transfer chamber 103. The process chamber 100 operates at a process pressure, e.g., 1 Torr (unit of pressure), and the process chamber 100 has a second vacuum condition that matches the process pressure of the process chamber 100, i.e., the first vacuum condition of the transfer chamber is different from the second vacuum condition of the process chamber. In some other embodiments of the present invention, the first vacuum condition of the transfer chamber is the same as the second vacuum condition of the process chamber.

[0043] In some embodiments, the processing chambers 100 are provided in a plurality of locations, each of which operates independently, and the drive unit 4 is used to drive the mounting assembly 2 to move between each of the processing chambers 100 and the transfer chamber 103. In some specific embodiments, the processing chambers 100 may be provided in two, three, four or more locations. In some embodiments of the present invention, the wafer processing apparatus 11 includes a drive unit 4, a transfer chamber 103, a processing chamber 100, and a mounting assembly 2, the processing chamber 100 is connected to the transfer chamber 103, the transfer chamber 103 is used to provide a sealed space so that the transfer chamber 103 has a first vacuum condition, the processing chamber 100 is used to process a wafer, the processing chamber 100 has a second vacuum condition, the mounting assembly 2 is installed in the transfer chamber 103, the mounting assembly 2 is used to mount a wafer, the drive unit 4 has a first drive assembly for adjusting the position of the mounting assembly 2 in the transfer chamber 103, and a second drive assembly for driving the mounting assembly 2 to move between the transfer chamber 103 and the processing chamber 100. Here, the transfer chamber 103 operates at a wafer transfer pressure, typically 0.1-0.3 Torr (units of pressure), and the transfer chamber 103 has a first vacuum condition that matches the wafer transfer pressure of the transfer chamber 103, and the process chamber 100 operates at a process pressure, e.g., 1 Torr (units of pressure), and the process chamber 100 has a second vacuum condition that matches the process pressure of the process chamber 100, i.e., the first vacuum condition of the transfer chamber is different from the second vacuum condition of the process chamber. In some other embodiments of the present invention, the first vacuum condition of the transfer chamber is the same as the second vacuum condition of the process chamber.In another embodiment of the present invention, the wafer processing apparatus includes a drive unit 4, a transfer chamber 103, a processing chamber 100, and a mounting assembly 2, the processing chamber 100 is connected to the transfer chamber 103, the transfer chamber 103 is used to provide a sealed space so that the transfer chamber 103 has a first vacuum condition, the processing chamber 100 is used to process a wafer, the processing chamber includes at least a heating chamber 102 and a process chamber 101, and the process chamber 102 is used to process a wafer. The process chamber 101 has a second vacuum condition, the heating chamber 102 has a third vacuum condition, the mounting assembly 2 is installed in the transfer chamber 103, the mounting assembly 2 is used to mount a wafer, and the driving device has a first driving assembly for adjusting a position of the mounting assembly 2 in the transfer chamber 103, and a second driving assembly for driving the mounting assembly 2 to move between the transfer chamber 103 and the processing chamber 100. Here, the transfer chamber 103 can obtain a first vacuum condition by a first bleed device 9, the process chamber 101 can obtain a second vacuum condition by a second bleed device, and the heating chamber 102 can obtain a third vacuum condition by a third bleed device.Specifically, the transfer chamber 103 operates at a wafer transfer pressure, typically 0.1-0.3 Torr (unit of pressure), and the transfer chamber 103 has a first vacuum condition that matches the wafer transfer pressure of the transfer chamber 103; the process chamber 101 operates at a process pressure, e.g., 1 Torr (unit of pressure), and the process chamber 101 has a second vacuum condition that matches the process pressure of the process chamber 101; the heating chamber 102 operates at a heating pressure, e.g., 0.1-0.3 Torr (unit of pressure), and the heating chamber 102 has a third vacuum condition that matches the heating pressure of the heating chamber 102; i.e., the first vacuum condition of the transfer chamber 103 is different from the second vacuum condition of the process chamber 101, and the first vacuum condition of the transfer chamber 103 is the same as the third vacuum condition of the heating chamber 102. In some other embodiments of the present invention, the first vacuum condition of the transfer chamber 103, the second vacuum condition of the process chamber 101, and the third vacuum condition of the heating chamber 102 may be the same or may not be the same.

[0044] In some embodiments, the processing chamber 100 includes a first heating chamber 102 and a first process chamber 101, the first heating chamber 102 is used to heat the wafer, and the first process chamber 101 is used to perform a process on the wafer. In some specific embodiments, the processing chamber 100 is provided as one, and the processing chamber 100 is a heating chamber 102 or a process chamber 101. In some embodiments, the processing chamber 100 is provided as two, and the two processing chambers 100 are two processing chambers 101, or the two processing chambers 100 are two heating chambers 102, or the two processing chambers 100 are one processing chamber 101 and one heating chamber 102.

[0045] It should be noted that when the processing chamber 100 of one wafer processing apparatus 11 is set as either the heating chamber 102 or the process chamber 101, the processing chamber 100 of the wafer processing apparatus 11 used in combination with the wafer processing apparatus 11 may be set as a processing chamber 100 different from the former. For example, the processing chamber 100 of the first wafer processing apparatus 11 is the heating chamber 102, and the processing chamber 100 of the second wafer processing apparatus 11 is the process chamber 101.

[0046] In some preferred embodiments of the present invention, the process chamber 101 and / or the heating chamber 102 are provided in at least two units, that is, the processing chamber includes at least a first heating chamber 102, a second heating chamber (not shown), a first process chamber 101, and a second process chamber (not shown), the first heating chamber 102 and the second heating chamber (not shown) are used to perform heating processing on a first batch of wafers and a second batch of wafers, respectively, and the first process chamber 101 and the second process chamber (not shown) are used to perform processing on a first batch of wafers and a second batch of wafers, respectively. In some other specific embodiments, the process chamber 101 is provided in two, three, or more units. In some further embodiments, the heating chamber 102 is provided in two, three, or more units.

[0047] In some embodiments of the present invention, the processing chamber 100 and the transfer chamber 103 are provided on the base 1, and the driving device 4 is installed on the base 1. In some embodiments, when the processing chamber 101 and the heating chamber 102 are provided simultaneously on the wafer processing device 11, the processing chamber 101, the heating chamber 102 and the transfer chamber 103 are provided on the base 1.

[0048] In some embodiments of the present invention, the processing chamber 100 is located above or below the transfer chamber 103, and the drive unit 4 is located on the side of the transfer chamber 103 away from the processing chamber 100. In some specific embodiments of the present invention, the processing chamber 100 is located above the transfer chamber 103, and the drive unit 4 is located below the transfer chamber 103.

[0049] In some embodiments of the present invention, two mounting assemblies 2 are provided so that one or a set of wafers can be heated while processing one or a set of wafers is performed simultaneously, or one or a set of wafers can be processed while heating another or a set of wafers is performed simultaneously. The two mounting assemblies 2 include a first mounting assembly 202 and a second mounting assembly 3.

[0050] In some embodiments, the number of the mounting assemblies 2 may be one. That is, asynchronous processing may be performed on the wafers mounted on the mounting assembly 2 by different processing chambers 100, specifically, heating followed by processing, or processing followed by heating.

[0051] It should be noted that when two, three or more of the heating chambers 102 or the process chambers 101 are installed and at least two of the mounting assemblies 2 are installed, different wafers may be processed synchronously by different mounting assemblies 2, or the wafers may be partially processed or heated by different or the same mounting assemblies 2.

[0052] In some other embodiments, the number of the mounting assemblies 2 may be greater than the sum of the number of the process chambers 101 and the number of the heating chambers 102. In some embodiments, the number of the mounting assemblies 2 may be three. For example, one mounting assembly 2 performs heating, another mounting assembly 2 performs processing, and the last mounting assembly 2 is connected to an external device to transport the wafer.

[0053] It should be noted that, in actual use, one of the process chambers 101 and one of the heating chambers 102 may form a group of processing chambers 100, and one or more groups of the processing chambers 100 may be installed in one of the wafer processing apparatuses 11, and synchronous processing and / or processing of the same step can be performed simultaneously on one or more groups of wafers.

[0054] In some specific embodiments of the present invention, when the process chamber 101 and the heating chamber 102 are installed in the wafer processing apparatus 11 at the same time, the transfer chamber 103, the process chamber 101 and the heating chamber 102 are installed in the base 1, and the process chamber 101 and the heating chamber 102 are located above the transfer chamber 103. In another embodiment, the process chamber 101 and the heating chamber 102 may be located below the transfer chamber 103. In some embodiments, the process chamber 101 and the heating chamber 102 may be located on the left or right side of the transfer chamber 103. In some embodiments, the heating chamber 102 and the process chamber 101 may be located on different sides of the transfer chamber 103.

[0055] In some embodiments, the process chamber 101 is provided with nozzles, spray panels or other structures that are connected to the supply device 5, thus allowing coating, deposition, etching or other processing to be performed on the wafer within the process chamber 101.

[0056] In some embodiments, the contour of the process chamber 101 is rectangular. In other embodiments, the contour of the process chamber 101 may be square, circular, polygonal, or other shapes. In further embodiments, the contour of the process chamber 101 may be more regularly or irregularly shaped.

[0057] In another embodiment, the process chamber 101 is formed by a first cover 1011 and the base 1, and the first cover 1011 is removably mounted on the base 1. Such a mounting allows for easy installation, repair, cleaning or replacement of structures within the process chamber 101.

[0058] In some other embodiments, the heating chamber 102 is formed by a second cover 1021 and the base 1 , and the second cover 1021 is removably mounted on the base 1 .

[0059] In some embodiments, the feeder 5 is generally installed as a cabinet, and the feeder 5 can provide process ingredients. In other embodiments, the feeder 5 can achieve a blending operation of various ingredients in a fixed ratio.

[0060] In some embodiments, a heating assembly is provided within the heating chamber 102 that can heat the space within the heating chamber 102. In other embodiments, the heating assembly may be located outside the heating chamber 102.

[0061] In some embodiments, the contour of the heating chamber 102 is circular. In other embodiments, the contour of the heating chamber 102 may be rectangular, circular, polygonal, or other shapes. In some embodiments, the contour of the heating chamber 102 may also be regular or irregular.

[0062] In some embodiments, the transfer chamber 103 communicates with the process chamber 101 and the heating chamber 102. Here, the communication includes at least two communication states, for example, in the case of two mounting assemblies 2, (1) when the first mounting assembly 202 and the second mounting assembly 3 are located in the heating chamber 102 and the process chamber 101, respectively, both the heating chamber 102 and the process chamber 101 communicate with the transfer chamber 103, and (2) when the first mounting assembly 202 and the second mounting assembly 3 are located in the transfer chamber 103, both the heating chamber 102 and the process chamber 101 communicate with the transfer chamber 103. In another embodiment, the transfer chamber 103 communicating with the process chamber 101 and the heating chamber 102 may include one of the process chamber 101 or the heating chamber 102 communicating with the transfer chamber 103. Specifically, the transfer chamber 103 is connected to the process chamber 101 and the heating chamber 102, i.e., the driving device 4 can directly move the first mounting assembly 202 and / or the second mounting assembly 3 between the heating chamber 102 and the transfer chamber 103, the driving device 4 can directly move the first mounting assembly 202 and / or the second mounting assembly 3 between the process chamber 101 and the transfer chamber 103, or the driving device 4 can transport the first mounting assembly 202 and / or the second mounting assembly 3 to the process chamber 101 via the heating chamber 102, or the driving device 4 can transport the first mounting assembly 202 and / or the second mounting assembly 3 to the heating chamber 102 via the process chamber 101.

[0063] In some embodiments, the first support member and the second support member may be disk-shaped, plate-shaped, rod-shaped, or other shapes. Both the first support member and the second support member are movably mounted within the transfer chamber 103, and the drive 4 is mounted on the base 1. In use, the drive 4 moves the first mounting assembly 202 and the second mounting assembly 3 between the process chamber 101, the heating chamber 102, and the transfer chamber 103. Here, the above-mentioned "moving between" includes moving the mounting assembly 2 between the process chamber 101 and the transfer chamber 103, moving the mounting assembly 2 between the heating chamber 102 and the transfer chamber 103, moving the mounting assembly 2 between the process chamber 101 and the heating chamber 102, moving the mounting assembly 2 between one of the process chambers 101 and another of the process chambers 101, and moving the mounting assembly 2 between one of the heating chambers 102 and another of the heating chambers 102.

[0064] It should be noted that when the mounting assembly 2 moves directly between the process chamber 101 and the heating chamber 102, between one of the process chambers 101 and another of the process chambers 101, or between one of the heating chambers 102 and another of the heating chambers 102, a switch device for controlling the blocking of communication between two adjacent chambers may be installed between the process chamber 101 and the heating chamber 102, between the process chamber 101 and the process chamber 101, or between the heating chamber 102 and the heating chamber 102.

[0065] FIG. 5 is a structural schematic diagram of a first driving mechanism in the second embodiment of the present invention.

[0066] In some embodiments of the present invention, the driving device 4 includes a first driving mechanism 401, a second driving mechanism 402, and a transfer device 403, the transfer device 403 is installed in the transfer chamber 103, the first driving mechanism 401 is connected to the transfer device 403, the first driving mechanism 401 is used to move or rotate the transfer device 403, the placement assembly 2 is installed in the transfer device 403, the second driving mechanism 402 is installed on one side of the transfer device 403, and the second driving mechanism 402 is used to move the placement assembly 2 between the processing chamber 100 and the transfer chamber 103.

[0067] Specifically, when the processing chamber 100 is the process chamber 101 and / or the heating chamber 102, the second driving mechanism 402 is used to move the mounting assembly 2 between the process chamber 101 and the transfer chamber 103, and / or the second driving mechanism 402 is used to move the mounting assembly 2 between the heating chamber 102 and the transfer chamber 103.

[0068] In some specific embodiments of the present invention, the transfer device 403 is set as a support plate, the transfer device 403 is provided with a hollow space, and the placement assembly 2 is placed in the hollow space. The first driving device 4 is a rotary motor, and the rotary shaft of the rotary motor is connected to the transfer device 403, so that the transfer device 403 can rotate with the rotation of the rotary motor, and further rotate the placement assembly 2 horizontally, that is, adjust the position of the placement assembly 2 in a horizontal plane.

[0069] By adjusting, the mounting assembly 2 can be moved from a position located below the process chamber 101 to a position located below the heating chamber 102. By adjusting, the mounting assembly 2 can also be moved from a position located below the heating chamber 102 to a position located below the process chamber 101.

[0070] The second driving device 4 is an electric cylinder, an air cylinder, a worm gear or other structure. The second driving mechanism 402 is installed vertically, and in use, the second driving device 4 can move the first mounting assembly 202 and / or the second mounting assembly 3 up and down, i.e., adjust the height position of the mounting assembly 2, and further realize the movement of the first mounting assembly 202 and the second mounting assembly 3 between the process chamber 101, the heating chamber 102 and the transfer chamber 103.

[0071] In some embodiments, a fixed part of the second driving mechanism 402 is installed under the transfer chamber 103, and a movable part of the second driving mechanism 402 is installed inside the transfer chamber 103. By installing in this way, the size of the space of the transfer chamber 103 can be reduced, and it is possible to avoid the transfer chamber 103 being installed with too large a space, which increases the manufacturing difficulty, or increases the manufacturing difficulty of the environment required for the transfer chamber 103.

[0072] Also, in some embodiments, the first drive mechanism 401 and / or the second drive mechanism 402 may be located at the front, back, left, right, or other orientation of the transfer chamber 103.

[0073] In some specific embodiments, the inner diameter of the hollow portion is smaller than the outer diameter of the mounting assembly 2, and thus the mounting assembly 2 can be lowered into the transfer device 403 as the movable part of the second driving mechanism 402 descends, and is restricted by the transfer device 403 so that the movable part of the second driving mechanism 402 can be detached from the mounting assembly 2, and vice versa.

[0074] FIG. 6 is a structural schematic diagram of a third driving mechanism in the second embodiment of the present invention.

[0075] In some embodiments of the present invention, the transfer device 403 is detachably connected to the first driving mechanism 401. The driving mechanism 401 further includes a third driving mechanism 404, which is installed on one side of the transfer device 403, and which is used to move the transfer device 403 and the placement assembly 2.

[0076] In some specific embodiments of the present invention, an irregular protrusion is provided on the underside of the transfer device 403, a groove that fits the irregular protrusion is provided on the movable end of the first driving mechanism 401, the transfer tool and the first driving mechanism 401 are connected via the protrusion and the groove, and the third driving mechanism 404 is installed on the underside of the transfer device 403. In use, the third driving mechanism 404 pushes up the transfer device 403 to separate the transfer device 403 from the first driving mechanism 401, that is, the third driving mechanism 404 replaces the second driving mechanism 402 to move the placement assembly 2 between the transfer chamber 103 and the processing chamber 100.

[0077] In some embodiments, the driving device 4 further includes a connection mechanism (not shown), which is installed on the placement assembly 2 or the transfer device 403, a first fastening part is installed on the connection mechanism (not shown), the placement assembly 2 or the transfer device 403 is provided with a second fastening part that matches the first fastening part, and the connection mechanism is used to connect the transfer device 403 and the connection member. In use, the placement assembly 2 and the transfer device 403 are integrally formed by engaging the first fastening part with the second fastening part through the connection mechanism, and when the second driving mechanism 402 drives the placement assembly 2 to move, the transfer device 403 can achieve the effect of interlocking, and further move all the placement assemblies 2 in the transfer device 403 up and down synchronously.

[0078] In some embodiments of the present invention, the sealing method between the driving device 4 and the base 1 is a dynamic seal. In some specific embodiments of the present invention, the type of the dynamic seal may be a magnetic fluid seal. In this way, the entire non-moving part of the second driving mechanism 402 is located outside the transfer chamber 103, and impurities between the fixed part and the moving part of the second driving mechanism 402 can be reduced from entering the transfer chamber 103.

[0079] In another embodiment, the transfer device 403 may be implemented in the form of a belt or track conveyor mechanism, and the placement assembly 2 is mounted on the belt or track conveyor mechanism. The first drive mechanism 401 is implemented as a robot hand, a gripper mechanism, or other mechanism, and the first drive mechanism 401 moves the first placement assembly 202 and / or the second placement assembly 3 to the second drive mechanism 402. The second drive mechanism 402 moves the placement assembly 2 into the process chamber 101 or the heating chamber 102.

[0080] In some embodiments of the present invention, there are at least two process chambers 101, and there are at least two mounting assemblies 2. In some embodiments, there are at least two first mounting assemblies 202 and / or at least two second mounting assemblies 3. There are at least two second driving mechanisms 402, and each of the second driving mechanisms 402 operates independently.

[0081] In some specific embodiments of the present invention, two process chambers 101 are provided, one heating chamber 102 is provided, two first mounting assemblies 202 and two second mounting assemblies 3 are provided, four second driving mechanisms 402 are provided, and the four second driving mechanisms 402 operate independently.

[0082] It should be noted that when the heating conditions are the same, multiple mounting assemblies 2 may be heated in the same heating chamber 102, so the number of heating chambers 102 may still be one when multiple mounting assemblies 2 are installed.

[0083] When one mounting assembly 2 and two second driving mechanisms 402 are installed, both of the two second driving mechanisms 402 are used to drive the mounting assembly 2 to move. For example, the first second driving mechanism 402 drives the mounting assembly 2 to move to the heating chamber 102, and the second second driving mechanism 402 drives the mounting assembly 2 to move to the process chamber 101.

[0084] In alternative embodiments, the process chambers 101 may be configured in one, three, four or other numbers.

[0085] In alternative embodiments, two, three or other numbers of heating chambers 102 may be provided.

[0086] In another embodiment, the first mounting assembly 202 and the second mounting assembly 3 may be provided in one, three, four or other numbers.

[0087] In another embodiment, the second driving mechanism 402 may be installed in one, two, three, four or other numbers. It should be noted that, when actually installed, the same second driving mechanism 402 may be installed to simultaneously control the lifting and lowering of two, three or more mounting assemblies 2. For example, five mounting assemblies 2 are installed, two second driving mechanisms 402 are installed, one second driving mechanism 402 controls the lifting and lowering of two mounting assemblies 2, and the other second driving mechanism 402 controls the lifting and lowering of three mounting assemblies 2.

[0088] In some other embodiments, two of the second drive mechanisms 402 may control the elevation and lowering of the same mounting assembly.

[0089] In some embodiments of the present invention, each of the mounting assemblies 2 is provided with N supports 201, each of which is used to support the wafer, where N is an integer greater than 1.

[0090] In some specific embodiments of the present invention, the mounting assembly 2 is provided with 25 supports 201, so that 25 wafers can be mounted on one mounting assembly 2 at the same time.

[0091] In alternative embodiments, any other number of supports 201 may be provided.

[0092] In some embodiments of the present invention, the apparatus further includes a seal member (not shown) disposed on the mounting assembly 2 for isolating the transfer chamber 103 from the process chamber 101 and / or the heating chamber 102.

[0093] In some specific embodiments of the present invention, the seal member (not shown) is installed on the first mounting assembly 202 and the second mounting assembly 3, and when the first support member or the second support member moves into the process chamber 101 or the heating chamber 102, the side of the seal member abuts against the side wall of the process chamber 101 or the heating chamber 102. At this time, the seal member and the first mounting assembly 202 or the second mounting assembly 3 isolate the process chamber 101 and / or the heating chamber 102 from the transfer chamber 103. As a result, only the heating chamber 102 is heated during heating, and only the wafer in the process chamber 101 is processed during processing.

[0094] In another embodiment, a movable plate, a gate valve, or other structural member may be installed at a connection point between the process chamber 101 and / or the heating chamber 102 and the transfer chamber 103, and a moving mechanism can be installed to move the movable plate, the gate valve, or the other structural member. Thus, when the first mounting assembly 202 and / or the second mounting assembly 3 are positioned in the transfer chamber 103, the communication between the process chamber 101 and / or the heating chamber 102 and the transfer chamber 103 can still be blocked by the movable plate, the gate valve, or the other structural member.

[0095] FIG. 8 is a structural schematic diagram of a fourth driving mechanism in the fourth embodiment of the present invention.

[0096] In some embodiments of the present invention, the fourth drive mechanism 6 is further included, the fourth drive mechanism 6 is installed on one side of the mounting assembly 2, and the fourth drive mechanism 6 is used to rotate the mounting assembly 2. In some embodiments, the fourth drive mechanism 6 is installed on one side of the mounting assembly 2, and the fourth drive mechanism 6 is used to rotate the mounting assembly 2.

[0097] In some specific embodiments of the present invention, the third drive mechanism 404 is installed in the transfer chamber 103. The third drive mechanism 404 is a rack and pinion mechanism, a pinion of the third drive mechanism 404 is installed in the first mounting assembly 202 or the second mounting assembly 3, a rack of the third drive mechanism 404 is installed in the transfer chamber 103, and a drive assembly of the third drive mechanism 404 is connected to the rack. In use, the drive assembly moves the rack and rotates the first mounting assembly 202 and / or the second mounting assembly 3 by a certain angle via the pinion.

[0098] In some embodiments, one or more fourth driving mechanisms 6 may be provided, and when one fourth driving mechanism 6 is provided, the wafer processing position corresponding to the fourth driving mechanism 6 has a rotation function or an angle adjustment function. In some embodiments, a plurality of fourth driving mechanisms 6 may be provided, and each of the fourth driving mechanisms 6 is provided in one-to-one correspondence with each of the mounting assemblies 2.

[0099] It should be noted that, in order to avoid mutual interference between the third driving mechanism 404 and the second driving mechanism 402, the height of the third driving mechanism 404 and the height of the transfer device 403 may be different. Also, in some embodiments, the third driving mechanism 404 may be installed in the transfer device 403.

[0100] In another embodiment, the third drive mechanism 404 may be arranged in the form of a double pinion.

[0101] Furthermore, in some embodiments, the third drive mechanism 404 may be mounted within the movable end of the second drive mechanism 402, by mounting the third drive mechanism 404 to a rotary air cylinder, rotary motor, or other drive. It should be noted that when the third drive mechanism 404 is mounted to the second drive mechanism 402, the third drive mechanism 404 moves with the movement of the movable end of the second drive mechanism 402.

[0102] In some embodiments of the present invention, the apparatus further includes a fifth driving mechanism 7, the base 1 includes a first fixed part 104 and a second fixed part 105, the process chamber 101 and the heating chamber 102 are mounted on the first fixed part 104, the first fixed part 104 and the second fixed part 105 form the transfer chamber 103, the fifth driving mechanism 7 is mounted on the first fixed part 104 and / or the second fixed part 105, and the fifth driving mechanism 7 is used to move the first fixed part 104 or the second fixed part 105.

[0103] In some specific embodiments of the present invention, the first fixed part 104 is installed above the second fixed part 105, and the process chamber 101 and the heating chamber 102 are installed above the first fixed part 104. The first fixed part 104 and the second fixed part 105 surround the transfer chamber 103. The fifth driving mechanism 7 is an air cylinder, an electric cylinder or other mechanism. One end of the fifth driving mechanism 7 is fixed to the second fixed part 105. When in use, the fifth driving mechanism 7 is turned on to move the movable end of the fifth driving mechanism 7 to be in close contact with the first fixed part 104, and as the fifth driving mechanism 7 continues to be turned on, the fifth driving mechanism 7 pushes up the first fixed part 104 and further opens the transfer chamber 103. At this time, the structure inside the transfer chamber 103 can be cleaned, repaired or replaced. When it is necessary to control the transfer chamber 103 to close, the fifth drive mechanism 7 is controlled to move in the reverse direction, and the first fixing part 104 automatically descends under the action of gravity until it comes into close contact with the second fixing part 105.

[0104] In another embodiment, the tip of the fifth driving mechanism 7 may be fixedly installed on the first fixed part 104, and thus, as the fifth driving mechanism 7 contracts, the first fixed part 104 and the second fixed part 105 can reach a state of close contact.

[0105] In some embodiments, the positional relationship between the first fixing portion 104 and the second fixing portion 105 may be in the front-rear direction or the left-right direction. In some embodiments, the positional relationship between the first fixing portion 104 and the second fixing portion 105 may further be in the tilt direction.

[0106] In some other embodiments, a sealing member may be provided between the first fixed portion 104 and the second fixed portion 105 to enhance airtightness.

[0107] In some embodiments, a plurality of the fifth driving mechanisms 7 may be provided.

[0108] Some embodiments of the present invention further include a heating device 8, said heating device 8 being in communication with said transfer chamber 103, said heating device 8 being used to heat said transfer chamber 103.

[0109] In some specific embodiments of the present invention, the heating device 8 is installed in the transfer chamber 103 , and the heating device 8 can generate heat and heat the transfer chamber 103 .

[0110] In some embodiments, the heating device 8 may be installed in the transfer chamber 103 in the form of a heating plate, a heating wire, or a heating sheet. In some embodiments, the heating device 8 may be installed in the form of a heating tube or a heating rod. In other embodiments, the heating device 8 may further be installed as a device for emitting light, which is irradiated to the wafer to generate heat. For example, the light is an infrared light.

[0111] Some embodiments of the present invention further include a first bleed device 9, said first bleed device 9 being in communication with said transfer chamber 103, said first bleed device 9 being used to extract gas within said transfer chamber 103.

[0112] In some specific embodiments of the present invention, the transfer chamber 103 is provided with a joint port, and the first gas extraction device 9 communicates with the transfer chamber 103 through the joint port. Since it is necessary to ensure that the inside of the transfer chamber 103 is in a vacuum state during use, the installation of the first gas extraction device 9 facilitates the extraction of gas within the transfer chamber 103, thereby realizing the vacuum state of the transfer chamber 103.

[0113] Some embodiments of the present invention further include a second bleed system (not shown), the second bleed system being in communication with the processing chamber 100, the second bleed system being used to extract gas within the processing chamber 100.

[0114] In some specific embodiments of the present invention, the process chamber 100 is provided with a gas port, and the second gas extraction device (not shown) communicates with the process chamber 100 through the gas port.

[0115] FIG. 10 is a schematic diagram of a three-dimensional structure of a wafer processing system according to an embodiment of the present invention.

[0116] In some embodiments of the present invention, the apparatus includes a transport apparatus 10 and a wafer processing apparatus 11 described in any one of the above embodiments, the wafer processing apparatus 11 is provided with a transport passage, the transport apparatus 10 is connected to the transport passage, and the transport apparatus 10 is used to transport the wafer.

[0117] In some specific embodiments of the present invention, a transfer passage is provided between the transfer device 10 and the wafer processing device 11, and the transfer device 10 is provided with a robot hand and a driving unit, and the driving unit can move the robot hand. In use, the transfer device 10 can transfer an external wafer to the wafer processing device 11. Or, the transfer device 10 can transfer a wafer from the wafer processing device 11 to the outside.

[0118] In some embodiments of the present invention, at least two wafer processing devices 11 are installed, each of the wafer processing devices 11 being installed on a different side of the transport device 10, the transport device 10 being used to transport wafers to each of the wafer processing devices 11, and the transport device 10 being used to transport wafers to each of the wafer processing devices 11.

[0119] In some specific embodiments of the present invention, three wafer processing devices 11 are installed, and the three wafer processing devices 11 are installed around the periphery of the transfer device 10, and a transfer passage is provided between the transfer device 10 and each of the three wafer processing devices 11. The transfer device 10 is used to transfer wafers to the three wafer processing devices 11.

[0120] In another embodiment, the number of the wafer processing devices 11 on the periphery of one of the transport devices 10 may be two, four, five, or other numbers.

[0121] In some embodiments of the present invention, the system further includes a front-end processing device 12, which is installed on one side of the transport device 10, a wafer transport cassette (not shown) is provided in the front-end processing device 12, the transport device 10 transports the wafer to the wafer transport cassette and / or the wafer processing device 11, and the front-end processing device 12 is used to transport the wafer transport cassette.

[0122] In some specific embodiments of the present invention, the front-end processing device 12 is installed on one side of the transport device 10, so that the transport device 10 can supply and remove wafers to and from the front-end processing device 12.

[0123] Due to the requirements of use, it is necessary to move the wafer in a dust-free or vacuum environment. By installing the wafer transfer cassette (not shown) in the front-end processing device 12, the wafer can be transported by the wafer transfer cassette when transporting. Specifically, a vacuum or dust-free environment may be installed in the front-end processing device 12. The wafer of the wafer processing device 11 is placed in the wafer transfer cassette in the front-end processing device 12, or an external wafer is transported to the front-end processing device 12 by the wafer transfer cassette, and then transported to the transport device 10 or the wafer processing device 11, thereby preventing the wafer from contacting the outside.

[0124] In another embodiment, a gripper, gripping or other transport mechanism may be provided within the front end processing equipment 12 to complete the movement of wafers between the wafer transport cassette and the transport apparatus 10.

[0125] In some embodiments of the present invention, the system further includes a wafer transport cassette 13 and a transport unit (not shown), the wafer transport cassette 13 is installed in the front-end processing device 12, the front-end processing device 12 is used to transport the wafer transport cassette to the wafer transport cassette 13, and the transport unit is used to transport the wafer transport cassette 13.

[0126] In some specific embodiments of the present invention, the wafer transport cassette 13 is movably installed in the front-end processing device 12. When in use, the wafer transport cassette is transported into the wafer transport cassette 13, and the wafer transport cassette 13 is transported by the transport unit (not shown). Alternatively, the wafer transport cassette in the wafer transport cassette 13 is transported to the front-end processing device 12 by the transport unit. By installing in this manner, the wafer transport cassette 13 is transported by the wafer transport cassette 13, and the possibility of the wafers being contaminated is further reduced. At the same time, the transport unit is arranged to facilitate the transport of the wafer transport cassette 13.

[0127] In another embodiment, an opening and closing mechanism may be installed on the wafer transport cassette 13. When the wafer transport cassette 13 is transported to the front-end processing device 12 or other devices, the opening and closing mechanism can be controlled to open, so that the wafer transport cassette inside can be taken out.

[0128] In addition, in some embodiments, a structure identical to the opening and closing structure may be installed in the front-end processing device 12, which can restrict the supply and removal of the wafer transport cassette and improve the sealing effect of the front-end processing device 12.

[0129] In a first embodiment of the present invention, a control method applied to the above-mentioned wafer processing apparatus is provided, which is as follows, referring to FIG.

[0130] In step 1, a robot arm (not shown) simultaneously transports a first batch of wafers and a second batch of wafers to a first position and a second position in the transfer chamber 103, the first position and the second position in the transfer chamber 103 corresponding to a first heating chamber 102 and a second heating chamber (not shown) of the plurality of processing chambers; In step 2, a first transfer and placement member (not shown) coupled to the robot arm (not shown) is driven by a driving device 4 so as to move the first batch of wafers at the first position in the transfer chamber 103 and the second batch of wafers at the second position upward to a first heating chamber 102 and a second heating chamber (not shown) of the plurality of processing chambers to perform a heating process thereon; In step 3, a rotating bracket (not shown) coupled to the first transfer / mount member (not shown) is driven by a driving device 4 to move the heat-treated first batch of wafers and the second batch of wafers to a third position and a fourth position in the transfer chamber 103, the third position and the fourth position in the transfer chamber 103 corresponding to a first process chamber 101 and a second process chamber (not shown) of the plurality of processing chambers; In step 4, a second transport and support member (not shown) coupled to the rotating bracket (not shown) is driven by the drive device 4 so as to move the first batch of wafers at the third position in the transfer chamber 103 and the second batch of wafers at the fourth position upward to a first process chamber 101 and a second process chamber (not shown) of the multiple processing chambers for processing.

[0131] In the above first embodiment of the present invention, the first transporting and supporting member, the rotating bracket and the second transporting and supporting member are devices in a supporting assembly, and the first transporting and supporting member, the rotating bracket and the second transporting and supporting member are installed in the transfer chamber 103. The first transporting and supporting member and the second transporting and supporting member are in the form of an assembly.

[0132] In the above-mentioned first embodiment of the present invention, the driving device realizes the following functions by including one or more driving mechanisms: driving a first transport and placement member (not shown) to move the first batch of wafers at the first position in the transfer chamber 103 and the second batch of wafers at the second position to a first heating chamber 102 and a second heating chamber (not shown) of the plurality of processing chambers for heat treatment, driving a rotating bracket (not shown) to move the heat-treated first batch of wafers and the second batch of wafers to a third position and a fourth position in the transfer chamber 103, and driving a second transport and placement member (not shown) to move the first batch of wafers at the third position in the transfer chamber 103 and the second batch of wafers at the fourth position to a first process chamber 101 and a second process chamber (not shown) of the plurality of processing chambers for process treatment. Specifically, referring to Figures 1 and 2, a semiconductor device includes a reaction chamber unit, a sinking space is provided in the reaction chamber unit, a rotating bracket is provided in the sinking space, four work stations are provided on the rotating bracket, and multiple work stations may be provided, and an upper cover plate is further provided in the sinking space.

[0133] Each workstation is used to place a wafer boat, for example, which can hold a first batch of wafers, for example 50 wafers, and has preheat chamber A, preheat chamber B, process chamber A and process chamber B installed above an upper cover plate.

[0134] The first batch of wafers and the second batch of wafers are simultaneously transported into the sinking space by the robot arm, and then the lifting mechanism in the driving device transports the wafer boat into the preheating chamber A and the preheating chamber B to preheat, and the preheating is performed within at least a first predetermined time, for example, about 30 min. After the preheating is completed, the lifting mechanism in the driving device lowers the wafer boat into the sinking space, rotates the wafer boat by a certain angle, for example, 180°, and transports the wafer boat into the process chamber A and the process chamber B to process, and performs the process within at least a second predetermined time, for example, 1 h. At the same time, the robot arm continues to transport the wafers into the empty wafer boat, and then places the wafers into the preheating chamber A and the preheating chamber B to preheat. After the preheating and processing are completed, the wafer boat is lowered into the sinking space, and the rotating bracket rotates by a certain angle, for example, 180°, and the processed wafers are removed by the robot arm, and the preheated wafer boat is placed into the process chamber to process. Then, the above steps are repeated.

[0135] In other application scenarios, the position of the pre-heating chamber and the position of the process chamber can be interchanged, and the pre-heating chamber can be used as a post-treatment chamber, and different process steps can be set to meet pre-treatment and post-treatment based on the process requirements.

[0136] In a second embodiment of the present invention, a control method applied to the above-mentioned wafer processing apparatus is provided, as follows.

[0137] In step 1, a loading assembly (e.g., a robot hand) simultaneously transports a first batch of wafers and a second batch of wafers to a first position and a second position in the transfer chamber 103, the first position and the second position in the transfer chamber 103 corresponding to a first heating chamber 102 and a second heating chamber (not shown) of the plurality of processing chambers; In step 2, a mounting assembly (e.g., a robot hand) is driven by a driving device 4 so as to move the first batch of wafers at the first position in the transfer chamber 103 and the second batch of wafers at the second position upward to a first heating chamber and a second heating chamber among the plurality of processing chambers, and perform a heating process thereon; In step 3, a mounting assembly (e.g., a rotating bracket) is driven by a driving device to move the heat-treated first batch of wafers and the second batch of wafers to a third position and a fourth position in the transfer chamber 103, the third position and the fourth position in the transfer chamber 103 corresponding to a first process chamber 101 and a second process chamber (not shown) of the plurality of processing chambers; In step 4, the mounting assembly (e.g., a robot hand) is driven by the drive device 4 to move the first batch of wafers at the third position in the transfer chamber 103 and the second batch of wafers at the fourth position upward to a first process chamber 101 and a second process chamber (not shown) of the multiple processing chambers for processing.

[0138] In the second embodiment of the present invention, the mounting assembly includes one or more robot hands and one or more rotating brackets. To achieve the above functions, the driving device 4 may include one or more driving mechanisms, and is not limited thereto.

[0139] In a third embodiment of the present invention, a control method applied to the above-mentioned wafer processing apparatus is provided, as follows.

[0140] In step 1, a loading assembly (e.g., a robot hand) simultaneously transfers a first batch of wafers and a second batch of wafers to a first position and a second position in the transfer chamber 103, the first position and the second position in the transfer chamber 103 corresponding to a first process chamber 101 and a second process chamber (not shown) of the plurality of processing chambers; In step 2, a mounting assembly (e.g., a robot hand) is driven by a driving device 4 to move the first batch of wafers at the first position in the transfer chamber 103 and the second batch of wafers at the second position upward to a first process chamber 101 and a second process chamber (not shown) of the plurality of processing chambers to perform processing; In step 3, a mounting assembly (e.g., a rotating bracket) is rotated by a driving device to move the first batch of processed wafers and the second batch of processed wafers to a third position and a fourth position in the transfer chamber 103, the third position and the fourth position in the transfer chamber 103 corresponding to a first heating chamber 102 and a second heating chamber (not shown) of the plurality of processing chambers; In step 4, the driving device 4 drives a mounting assembly (e.g., a robot hand) to move the first batch of wafers at the third position in the transfer chamber 103 and the second batch of wafers at the fourth position upward to a first heating chamber 102 and a second heating chamber (not shown) of the multiple processing chambers to perform heating processing.

[0141] In the third embodiment of the present invention, the mounting assembly includes one or more robot hands and one or more rotating brackets. To achieve the above functions, the driving device 4 may include one or more driving mechanisms, and is not limited thereto.

[0142] In the second embodiment of the present invention, the heating process is performed beforehand, whereas in the third embodiment of the present invention, the heating process is performed after the processing, which is determined by different wafer processing processes.

[0143] FIG. 11 is a flow chart of a method for controlling the wafer processing apparatus in the above embodiment of the present invention.

[0144] An embodiment of the present invention further provides a method for controlling a wafer processing apparatus, the method being used for controlling the wafer processing apparatus in any one of the above embodiments, Step S1 of transferring a wafer to the mounting assembly 2 in the transfer chamber 103, a first evacuation device being connected to the transfer chamber, the first evacuation device being used to extract gas from the transfer chamber and perform a first vacuum process on the transfer chamber; a step S2 of moving the mounting assembly 2 to the processing chamber 100 by the driving device 4, a second evacuation device being connected to the processing chamber, the second evacuation device being used to extract gas in the processing chamber and perform a second vacuum process on the processing chamber; Step S3: performing processing on the wafer in the mounting assembly 2 by the processing chamber 100; Step S4: moving the mounting assembly 2 by the driving device 4 to transport the processed wafer to the transfer chamber 103; and step S5 of unloading the processed wafer from the transfer chamber 103.

[0145] In some specific embodiments of the present invention, in the general case, the wafer processing device 11 is used in combination with the front-end processing device 12 and the transfer device 10. When a wafer needs to be processed, the processed or unprocessed wafer or the unprocessed wafer is moved by the front-end processing device 12, and the unprocessed wafer is transferred to the loading assembly 2 of the wafer processing device 11 by the transfer device 10, and then the driving device 4 moves the loading assembly 2 upward into the processing chamber 100, and the wafer on the loading assembly 2 is processed, and after the processing is completed, the driving device 4 controls the loading assembly 2 to move down into the space of the transfer chamber 103, and then the transfer device 10 transfers the processed wafer to the front-end processing device 12 to complete the processing.

[0146] In some embodiments of the present invention, the driving device 4 includes a first driving mechanism 401, a second driving mechanism 402, and a transfer device 403, and the S2 is specifically: A step S21 of moving the mounting assembly 2 in the transfer device 403 by the first driving mechanism 401 and adjusting the position of the mounting assembly 2 in the transfer chamber 103; and a step S22 of moving the mounting assembly 2 to the processing chamber 100 by the second driving mechanism 402.

[0147] In some specific embodiments of the present invention, the second driving mechanism 402 rotates the transfer device 403 horizontally and further adjusts the position of the mounting assembly 2 in the transfer device 403, so that the same mounting assembly 2 can correspond to different processing chambers 100, and the second driving mechanism 402 can transport the mounting assembly 2 into the different processing chambers 100 for processing.

[0148] In some embodiments of the present invention, the processing chamber 100 is located above or below the transfer chamber 103, and the drive 4 is located on the side of the transfer chamber 103 away from the processing chamber 100; Specifically, step S22 includes moving the mounting assembly 2 to the processing chamber 100 in the vertical direction by the second driving mechanism 402.

[0149] In some specific embodiments of the present invention, the processing chamber 100 is installed above the transfer chamber 103, and the driving device 4 is installed below the transfer chamber 103, and when in use, the second driving mechanism 402 moves the mounting assembly 2 up and down to realize the movement of the mounting assembly 2 between the transfer chamber 103 and the processing chamber 100.

[0150] In some embodiments of the present invention, at least two second drive mechanisms 402 are provided, and each second drive mechanism 402 operates independently; S22 further includes moving the mounting assembly 2 to the processing chamber 100 in the vertical direction by each of at least two of the second driving mechanisms 402.

[0151] In some specific embodiments of the present invention, when the mounting assembly 2 is positioned under different wafer processing positions, the lifting and lowering control is performed by different second driving mechanisms 402, making it easy to control each wafer processing position or each mounting assembly 2.

[0152] In some embodiments of the present invention, the processing chamber 100 is provided in a plurality of locations, and each of the processing chambers 100 operates independently. The plurality of processing chambers 100 includes at least a first heating chamber 102 and a first process chamber 101. Specifically, S2 and S3 are a step S31 of moving the mounting assembly 2 to the first heating chamber 102 by the driving device 4 and heating the wafer on the mounting assembly 2; and a step S32 of moving the mounting assembly 2 to the first process chamber 101 by the driving device 4 and performing a process on the wafer on the mounting assembly 2.

[0153] In some specific embodiments of the present invention, by installing multiple processing chambers 100, it is easy to perform different processing processes using different processing chambers 100, and by installing at least one heating chamber 102 and at least one process chamber 101, it is possible to heat and process the same wafer in the same wafer processing device 11.

[0154] In some embodiments of the present invention, the heating chamber 102 and the processing chamber 100 are both provided in duplicate. Specifically, the S31 is a step S311 of moving the mounting assembly 2 to a first heating chamber 102 by the driving device 4 and heating the wafer on the mounting assembly 2 for the first time; and a step S312 of moving the mounting assembly 2 to a second heating chamber 102 by the driving device 4 and heating the wafer on the mounting assembly 2 for a second time. Specifically, S32 is a step S321 of moving the mounting assembly 2 to a first process chamber 101 by the driving device 4 and performing a first process on the wafer on the mounting assembly 2; and a step S322 of moving the mounting assembly 2 to a second process chamber 101 by the driving device 4 and performing a second process on the wafer on the mounting assembly 2.

[0155] In some specific embodiments of the present invention, by installing two heating chambers 102 and two processing chambers 100, it is possible to perform stepwise heating or processing on wafers in the same mounting assembly 2 by using different heating chambers 102 and different process chambers 101.

[0156] In some embodiments of the present invention, the mounting assembly 2, the heating chamber 102 and the process chamber 100 are each provided in two pieces, Specifically, the step S31 includes moving each of the two mounting assemblies 2 to the two heating chambers 102 by the driving device 4, and heating the first batch of wafers and the second batch of wafers in the two mounting assemblies 2 in the first heating chamber 102 and the second heating chamber, respectively, within at least a first predetermined time; Specifically, S32 includes moving each of the two mounting assemblies 2 to the two process chambers 101 by the driving device 4, and performing process processing on the first batch of wafers and the second batch of wafers in the two mounting assemblies 2 in the first process chamber 101 and the second process chamber, respectively, within at least a second predetermined time.

[0157] In some specific embodiments of the present invention, two of the mounting assemblies 2, the heating chambers 102 and the processing chambers 100 are provided, so that two sets or two wafers can be processed synchronously by different mounting assemblies 2, i.e., heated and processed simultaneously, or processed simultaneously, or heated and processed for one or one set and processed for another or another set.

[0158] Although the embodiments of the present invention have been described in detail above, it is apparent to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the present invention as described in the claims. In addition, the present invention described herein can have other embodiments and can be implemented or realized in various forms. [Explanation of symbols]

[0159] 1 Base 100 Processing chambers 101 Process Chamber 1011 First Cover 102 Heating chamber 1021 Second Cover 103 Transfer Chamber 104 First fixed part 105 Second fixed part 2. Mounting Assembly 201 Support part 202 First mounting assembly 3 Second Mounting Assembly 4. Drive unit 401 First driving mechanism 402 Second Drive Mechanism 403 Transfer device 404 Third Drive Mechanism 5 Feeding device 6 Fourth Drive Mechanism 7 Fifth Drive Mechanism 8 Heating device 9 First Bleeding Device 10. Conveyor 11 Wafer processing equipment 12 Front-end processing unit 13 Wafer transport cassette

Claims

1. 1. A wafer processing apparatus comprising: a drive unit, a transfer chamber, a processing chamber, a first bleed unit, a second bleed unit, and a mounting assembly; a first bleed device connected to the transfer chamber and used to extract gas in the transfer chamber and perform a first vacuum process on the transfer chamber; the processing chamber is used to process a wafer; the second bleed device connected to the processing chamber and used to extract gas in the processing chamber and perform a second vacuum process on the processing chamber; the placement assembly is installed in the transfer chamber and used to place a wafer thereon; the drive device is further used to adjust a position of the placement assembly in the transfer chamber; and the drive device drives the placement assembly to move between the transfer chamber and the processing chamber.

2. 2. The wafer processing apparatus according to claim 1, wherein the processing chamber includes at least a first heating chamber and a first process chamber, the first heating chamber being used to perform a heat treatment on the wafer, and the first process chamber being used to perform a process on the wafer.

3. 3. The wafer processing apparatus according to claim 2, wherein the processing chambers include at least a first heating chamber, a second heating chamber, a first process chamber, and a second process chamber, the first heating chamber and the second heating chamber being used for performing heat processing on a first batch of wafers and a second batch of wafers, respectively, and the first process chamber and the second process chamber being used for performing processing on the first batch of wafers and the second batch of wafers, respectively.

4. 2. The wafer processing apparatus according to claim 1, wherein the processing chamber is installed above or below the transfer chamber, and the driving device is installed on a side of the transfer chamber remote from the processing chamber.

5. The drive device includes a first drive mechanism, a second drive mechanism, and a transfer device; the transfer device is disposed in the transfer chamber, the first drive mechanism is connected to the transfer device, and the first drive mechanism is used to move or rotate the transfer device; 2. The wafer processing apparatus of claim 1, wherein the mounting assembly is installed in the transfer device, the second driving mechanism is installed on one side of the transfer device, and the second driving mechanism is used to move the mounting assembly between the processing chamber and the transfer chamber.

6. 6. The wafer processing apparatus according to claim 5, wherein the transfer device is detachably connected to the first driving mechanism.

7. The drive device further includes a third drive mechanism; 7. The wafer processing apparatus according to claim 6, wherein the third driving mechanism is installed on one side of the transfer device, and the third driving mechanism is used to move the transfer device and the mounting assembly.

8. The wafer processing apparatus according to claim 5 , wherein at least two of the mounting assemblies are provided.

9. 6. The wafer processing apparatus according to claim 5, wherein at least two of the second drive mechanisms are provided, and each of the second drive mechanisms operates independently.

10. 2. The wafer processing apparatus according to claim 1, wherein the mounting assembly is provided with N support portions, each of the support portions being used to support the wafer, and N is an integer greater than 1.

11. 2. The wafer processing apparatus according to claim 1, wherein a plurality of the processing chambers are provided, each of the processing chambers operates independently, and the driving device is used to drive the mounting assembly so as to move between each of the processing chambers and the transfer chamber.

12. Further comprising a supply device; 2. The wafer processing apparatus of claim 1, wherein the supply device is in communication with the processing chamber, the supply device being used to provide raw materials for the processing chamber to process the wafer.

13. 2. The wafer processing apparatus according to claim 1, further comprising a seal member disposed on said mounting assembly for isolating said transfer chamber from said processing chamber.

14. a fourth drive mechanism; 2. The wafer processing apparatus according to claim 1, wherein the fourth driving mechanism is installed on one side of the mounting assembly, and the fourth driving mechanism is used to rotate the mounting assembly.

15. Further comprising a base, 2. The wafer processing apparatus according to claim 1, wherein the processing chamber and the transfer chamber are provided on the base, the driving device is installed on the base, and a sealing method between the driving device and the base is a dynamic seal.

16. a fifth drive mechanism; the base includes a first fixing portion and a second fixing portion; the processing chamber is mounted on the first fixture, and the first fixture and the second fixture form the transfer chamber; 16. The wafer processing apparatus according to claim 15, wherein the fifth driving mechanism is installed on the first fixed part and / or the second fixed part, and the fifth driving mechanism is used to move the first fixed part or the second fixed part.

17. Further comprising a heating device; 2. The wafer processing apparatus of claim 1, wherein the heating device is in communication with the transfer chamber, and the heating device is used to heat the transfer chamber.

18. A wafer processing system comprising a transfer device and the wafer processing device according to any one of claims 1 to 19, A wafer processing system, characterized in that a transfer passage is provided in the wafer processing apparatus, the transfer device is in communication with the transfer passage, and the transfer device is used to transfer the wafer.

19. 20. The wafer processing system of claim 18, wherein at least two of the wafer processing devices are installed, each of the wafer processing devices being installed on a different side of the transport device, the transport device being used to transport wafers to each of the wafer processing devices, and the transport device being used to transport wafers between each of the wafer processing devices.

20. Further comprising a front-end processing unit; 20. The wafer processing system of claim 18, wherein the front-end processing device is installed on one side of the transport device, a wafer transport cassette is provided in the front-end processing device, the transport device transports the wafer to the wafer transport cassette and / or the wafer processing device, and the front-end processing device is used to transport the wafer transport cassette.

21. Further including a wafer transport cassette and a transport unit; the wafer transport cassette is installed in the front-end processing device, and the front-end processing device is used to transport the wafer transport cassette to the wafer transport cassette; 21. The wafer processing system of claim 20, wherein the transport section is used to transport the wafer transport cassette.

22. a step S1 of transferring a wafer to the mounting assembly in the transfer chamber, a first bleed device being connected to the transfer chamber, the first bleed device being used to extract gas in the transfer chamber and perform a first vacuum process on the transfer chamber; a step S2 of moving the mounting assembly to the processing chamber by the driving device, wherein a second bleed device is connected to the processing chamber, and the second bleed device is used to extract gas in the processing chamber and perform a second vacuum process on the processing chamber; Step S3 of processing the wafer in the mounting assembly by the processing chamber; Step S4: moving the mounting assembly by the driving device to transfer the processed wafer to the transfer chamber; 2. The method for controlling a wafer processing apparatus according to claim 1, further comprising a step S5 of unloading the processed wafer from said transfer chamber.

23. The drive device includes a first drive mechanism, a second drive mechanism, and a transfer device; Specifically, S2 is a step S21 of moving the mounting assembly in the transfer device by the first driving mechanism and adjusting the position of the mounting assembly in the transfer chamber; 23. The method of claim 22, further comprising a step S22 of moving the mounting assembly to the processing chamber by the second driving mechanism.

24. the processing chamber is disposed above or below the transfer chamber, and the drive device is disposed on a side of the transfer chamber away from the processing chamber; 24. The method of claim 23, wherein step S22 specifically includes moving the mounting assembly to the processing chamber in a vertical direction by the second driving mechanism.

25. At least two of the second drive mechanisms are provided, and each of the second drive mechanisms operates independently; 25. The method of claim 24, further comprising: moving the mounting assembly vertically to the processing chamber by each of at least two of the second driving mechanisms.

26. The processing chambers are provided in a plurality of stages, each of the processing chambers operates independently, and the plurality of processing chambers includes at least a first heating chamber and a first process chamber; Specifically, S2 and S3 are a step S31 of moving the mounting assembly to the first heating chamber by the driving device and heating the wafer on the mounting assembly; 23. The method of claim 22, further comprising: a step S32 of moving the mounting assembly to the first process chamber by the driving device, and performing a process on the wafer on the mounting assembly.

27. The heating chamber and the process chamber are each provided in two pieces; Specifically, S31 is a step S311 of moving the mounting assembly to a first heating chamber by the driving device and heating the wafer on the mounting assembly for the first time; and moving the mounting assembly to a second heating chamber by the driving device and heating the wafer on the mounting assembly for a second time. Specifically, S32 is A step S321 of moving the mounting assembly to a first process chamber by the driving device and performing a first process on the wafer on the mounting assembly; 27. The method of claim 26, further comprising a step S322 of moving the mounting assembly to a second process chamber by the driving device and performing a second process on the wafer on the mounting assembly.

28. The mounting assembly, the heating chamber and the process chamber are each provided in two pieces; Specifically, the step S31 includes moving each of the two mounting assemblies to the two heating chambers by the driving device, and heating a first batch of wafers and a second batch of wafers in the two mounting assemblies in the first heating chamber and the second heating chamber, respectively, within at least a first predetermined time; 23. The method of claim 22, wherein step S32 specifically includes moving each of the two mounting assemblies to the two process chambers by the driving device, and performing process processing on a first batch of wafers and a second batch of wafers in the two mounting assemblies in the first process chamber and the second process chamber, respectively, within at least a second predetermined time.

29. The method further includes a step S0 of providing a front-end processing device and a transport device; 23. The method for controlling a wafer processing apparatus according to claim 22, wherein S1 specifically includes storing the processed wafer by the front-end processing apparatus and moving the processed wafer to a loading assembly of the transfer chamber by the transport apparatus.

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