Substrate container with mechanically actuated drain valve - Patents.com

Abstract

A system is provided, the system including a substrate container having at least two purge modules, each purge module of the at least two purge modules including a flow control device, the flow control device of each purge module being configured to be actuated for the outflow of a purge fluid. A method of actuating a flow control device of a purge module of a substrate container is provided, the method including initiating a purge process of the substrate container, flowing a purge fluid inside the substrate container, the substrate container having at least two purge modules, each purge module of the at least two purge modules including a flow control device, the flow control device of each purge module being configured to be actuated for the outflow of the purge fluid, and actuating the flow control device for the outflow of the purge fluid.

Description

[Technical field]

[0001] The present disclosure is directed to purge process control of a substrate container, such as a front opening integrated pod (FOUP), including actuating a flow control device of a purge module of the substrate container. [Background technology]

[0002] Substrates in the form of wafers can be processed to form semiconductor devices. Substrates can include glass, silicon, or any other material suitable for semiconductor devices. Substrates can have a panel shape, and the panels can be circular, rectangular, or any other shape suitable for processing and transport in a container. Wafer substrates (hereafter "substrates") undergo a series of process steps, including material layer deposition, doping, etching, or otherwise chemically or physically reacting the material of a particular substrate. Substrate containers are used to store substrates and transport substrates during processing within a manufacturing facility. Substrate containers include, for example, FOUPs, which generally include a shell with an interior space for holding substrates and a plate for interfacing with various conveyors and other devices, for example, so that the FOUP can be moved around the processing facility. The shell and plate are secured to each other, for example, by welding, connectors, etc.

[0003] During processing, gas must be introduced into and removed from the FOUP, for example during a purge process, which requires the FOUP to have one or more locations where gas can enter or exit the FOUP. For example, substrates may be transferred from a FOUP to processing equipment through an equipment front-end module (EFEM), which typically includes a load port for receiving the FOUP, a transfer unit, a frame or "mini-environment," and a fan filter unit that is used to generate gas flow within the EFEM.

[0004] When a FOUP is docked to the load port, the load port door interfaces with the FOUP door and separates the FOUP door from the FOUP shell. When the FOUP door is separated (opened) from the shell, the EFEM allows a transfer unit housed within the EFEM to access the substrates stored within the FOUP. A gas flow introduced by the fan filter unit flows through the EFEM from the top of the EFEM to the bottom of the EFEM. Summary of the Invention

[0005] The present disclosure is directed to purge process control of a substrate container, including, for example, actuating one or more flow control devices of a purge module of a substrate container used in semiconductor manufacturing. More particularly, the present disclosure is directed to configuring and actuating one or more flow control devices of the purge module in real time during purging, based on timing, and / or based on sensed environmental conditions on or within the substrate container, such as relative humidity, oxygen levels, internal pressure, volatile organic compounds, etc.

[0006] In at least one exemplary embodiment, a system includes a substrate container having at least two purge modules, each of the at least two purge modules including a flow control device, the flow control device of each purge module configured to be actuated for the outflow of purge fluid.

[0007] In at least one exemplary embodiment, a method of activating a flow control device of a purge module of a substrate container includes initiating a purge process of the substrate container; flowing a purge fluid inside the substrate container, the substrate container having at least two purge modules, each purge module of the at least two purge modules including a flow control device, the flow control device of each purge module configured to be activated for the outflow of the purge fluid; and activating the flow control device for the outflow of the purge fluid.

[0008] In the following detailed description, embodiments are described by way of example only, since various changes and modifications will become apparent to those skilled in the art from the following detailed description. The use of the same reference numbers in different figures indicates similar or identical items. [Brief description of the drawings]

[0009] [Figure 1] 1 is a front perspective view of a substrate container in accordance with at least one exemplary embodiment; [Diagram 2] FIG. 1 is an exploded view of a substrate container in accordance with at least one exemplary embodiment. [Diagram 3] FIG. 13 is an exploded view of a substrate container in accordance with at least one other exemplary embodiment. [Figure 4] FIG. 1 is a schematic diagram of a substrate container interacting with an EFEM in accordance with at least one example embodiment. [Figure 5A-5B] FIG. 1 illustrates a purge module for a substrate container according to at least one embodiment. [Fig. 5C-5D] FIG. 1 illustrates a purge module for a substrate container according to at least one embodiment. [Fig. 5E-5F] FIG. 1 illustrates a purge module for a substrate container according to at least one embodiment. [Figure 6A-6B] 1 illustrates another purge module for a substrate container according to at least one embodiment. [Figure 6C-6D] 1 illustrates another purge module for a substrate container according to at least one embodiment. [Figure 6E-6F] 1 illustrates another purge module for a substrate container according to at least one embodiment. [Figure 7A] FIG. 2 illustrates a bottom view of a substrate container according to at least one embodiment. [Figure 7B] FIG. 2 illustrates a bottom view of a substrate container according to at least one embodiment. [Figure 8] 8 is a cross-sectional view of the substrate container of FIG. 7B taken along dotted line 8-8 according to at least one embodiment. [Figure 9A] FIG. 9 is an enlarged view of a portion of FIG. 8 according to at least one embodiment. [Figure 9B] FIG. 9 is an enlarged view of another portion of FIG. 8 according to at least one embodiment. [Figure 10] FIG. 2 illustrates a bottom view of a substrate container according to at least one embodiment. [Figure 11] 11 is a front perspective view of the substrate container of FIG. 10 according to at least one embodiment. [Figure 12A] 1 is a diagram illustrating the internal pressure of a substrate container during a purging process according to at least one embodiment. [Figure 12B] 1 is another diagram illustrating the internal pressure of a substrate container during a purging process according to at least one embodiment. [Figure 13] FIG. 1 illustrates an operational flowchart for actuating one or more flow control devices of a purge module of a substrate container in accordance with at least one example embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In the following detailed description, reference is made to the accompanying drawings, which form a part of the description. In the drawings, like symbols generally identify like components unless the context dictates otherwise. Moreover, unless otherwise noted, the description of each successive drawing may refer to features from one or more of the previous drawings to provide a clearer context and a more substantial description of the present exemplary embodiment. Furthermore, the exemplary embodiments described in the detailed description, the drawings, and the claims are not intended to be limiting. Other embodiments may be utilized and other changes may be made without departing from the spirit or scope of the subject matter presented herein. In general, it will be readily understood that the aspects of the present disclosure described herein and illustrated in the drawings may be arranged, substituted, combined, separated, and designed in a wide variety of different configurations, all of which are expressly contemplated herein.

[0011] The present disclosure is directed to purge process control of a substrate container, including, for example, actuating one or more flow control devices of a purge module of a substrate container used in semiconductor manufacturing. More particularly, the present disclosure is directed to configuring and actuating one or more flow control devices of the purge module in real time during purging, based on timing, and / or based on sensed environmental conditions on or within the substrate container, such as relative humidity, oxygen levels, internal pressure, volatile organic compounds, etc.

[0012] As defined herein, the term "operation" of a flow control device or "operating" or "operating" a flow control device may refer to opening or control of opening a flow control device to allow purge fluid to pass through the flow control device (e.g., for the outflow of purge fluid from the interior space of the substrate container) using an active mechanism (e.g., with an actuator, etc.) other than a passive mechanism (e.g., passively opening a flow control device by or via the pressure of purge fluid). The term "deactivation" of a flow control device or "deactivating" or "deactivating" a flow control device may refer to deactivating or control of deactivating an active mechanism for an activated flow control device such that the flow control device is no longer activated. That is, the term "operated" or "deactivated" may refer to a state of a flow control device, and the terms "activate", "operating", "deactivating", and "deactivating" may refer to an action that changes the state of a flow control device.

[0013] As defined herein, the term "inflow" may refer to the flow of purge fluid in a direction, for example, from a load port through a flow control device toward the interior space of the substrate container. As defined herein, the term "outflow" may refer to the flow of purge fluid in a direction, for example, from the interior space of the substrate container toward the load port through a flow control device.

[0014] As defined herein, the term "purge fluid" may refer to one or more of nitrogen, clean dry air (CDA), extra clean dry air (xCDA), a gas for conditioning the vessel environment, or any other suitable fluid.

[0015] The term "cracking pressure" of a flow control device (e.g., a check valve, etc.), as defined herein, may refer to the minimum upstream pressure required to open the flow control device sufficiently to allow detectable flow. Detectable flow is when the flow control device allows a small but constant flow of fluid (e.g., liquid, gas, etc.) through the body of the flow control device (e.g., a valve body, etc.) and out through the outlet port of the flow control device. In embodiments, the cracking pressure of a flow control device may also refer to the inlet pressure level at which the first sign of fluid flow is present. The term "cracking pressure" of a door or door seal (e.g., of a substrate container), as defined herein, may refer to the pressure at which the door seal fails (e.g., the door seal begins to leak or a leak from the door seal is generated).

[0016] As defined herein, the term "environmental conditions" may refer to one or more of relative humidity (%RH) data, oxygen levels, temperature, pressure (e.g., absolute pressure, etc.), the measured presence of airborne molecular contaminants, and / or the measured presence of one or more volatile organic compounds (VOCs). The environmental conditions may be detected or measured by sensors on or within the substrate container, and the detected data may be communicated to a controller inside or outside the container.

[0017] It will be appreciated that substrates in the form of wafers may be processed to form semiconductor devices. For example, a substrate container, such as a FOUP, may be used to transport and store the substrate during processing. In at least one other exemplary embodiment, the container may be a reticle container that contains a photolithography mask.

[0018] In at least one exemplary embodiment, when purging the substrate container (e.g., open door purge, closed door purge, etc.), the detected environmental conditions may be communicated in real time to a controller or stored using, for example, a data logger. Sensors and / or data loggers may be placed on the substrate container or on the substrates within the substrate container and positioned to capture environmental conditions at various locations (e.g., front, back, right, left inside the substrate container at various slots that receive wafers).

[0019] FIG. 1 is a front perspective view of a substrate container 100 according to at least one embodiment.

[0020] 1, the substrate container 100 includes a door 104 and a shell 102. The door 104 couples to the shell 102 to form an enclosed interior space. The door 104 may be coupled to the shell 102 by being mechanically latched or suction fitted into a corresponding opening in the shell 102, or alternatively, the door 104 may be coupled to the shell 102 at one of the top, bottom, or either side of the corresponding opening in the shell 102 (e.g., via a hinge). In at least one exemplary embodiment, the door of the substrate container may be coupled to the shell of the substrate container at a bottom opening of the shell.

[0021] Figure 2 is an exploded view of a substrate container 110, according to at least one example embodiment. Figure 2 illustrates the substrate container 110 with the door 111 removed (e.g., open). As shown in Figure 2, the shell 113 defines an interior space 117 of the substrate container 110 in which a substrate may be stored.

[0022] The shell 113 may include an opening 119 that may be sealed by a door 111 coupled to the shell 113. The substrate container 110 may be accessed by moving (e.g., opening, removing) the door 111. For example, the door 111 may be coupled to the shell 113 by mating the door 111 with the opening 119 in the shell 113. In at least one exemplary embodiment, one or more of the door 111 and the shell 113 may include a locking mechanism (not shown) to prevent inadvertent opening or removal of the door 111. In at least another exemplary embodiment, the opening in the shell 113 may be at the bottom of the shell.

[0023] As shown in FIG. 2, the shell 113 may further include a first side wall 114, a second side wall 116, a rear wall 118, and a top wall 120, as well as a bottom wall 122.

[0024] In at least one exemplary embodiment, first side wall 114 may be opposite and parallel to second side wall 116 and separated by a top wall 120 and a bottom wall 122. First side wall 114 may be referred to as the left side and right side 116 may be referred to as the right side, although the designations of "left" or "right" are a matter of perspective and are not intended to be limiting in any way.

[0025] The top wall 120 and the bottom wall 122 each extend between the first side wall 114 and the second side wall 116. In at least one exemplary embodiment, the top wall 120 may be opposite and parallel to the bottom wall 122 separated by the first side wall 114 and the second side wall 116. The bottom wall 122 includes an edge 124A that extends along the front opening 119. The edge 124A also extends between the first side wall 114 and the second side wall 116 of the shell 113. The first side wall 114 includes an edge 124B that extends along the front opening 119. The edge 124B of the first side wall 114 also extends between the top wall 120 and the bottom wall 122 of the shell 113. Front edges 124A and 124B, in at least one exemplary embodiment, are perpendicular to one another and define front opening 119.

[0026] The substrate container 110 may include an equipment connector 126 (also referred to as an "automation flange") on the top wall 120 of the shell 113. In at least one exemplary embodiment, the equipment connector 126 allows for an automated attachment (not shown) for moving the substrate container 110. The automated attachment may include, but is not limited to, an automated arm (also referred to as an "overhead transfer system") that may be connected to the substrate container 110. For example, the automated arm may be used to move the substrate container 110 between several different pieces of processing equipment. In at least one exemplary embodiment, the substrate container 110 may include one or more handles (not shown) to allow a user (e.g., a technician, etc.) to manually move the substrate container 110.

[0027] The substrate container 110 may further include a number of shelves 115 for holding substrates in the interior space 117 .

[0028] In at least one exemplary embodiment, the interior space 117 includes interior walls / surfaces of the walls 114, 116, 118, 120, and / or 122. The portions of the shelf 115 on the interior surface of the second sidewall 116 are obscured in FIG. 2 and may have a similar configuration to the portions of the shelf 115 on the first sidewall 114. The shelves 115 on the interior surfaces of the walls 114 and 116 may be configured to cooperatively hold a substrate (not shown) within the interior space 117. For example, the shelf 115 may form and / or define a slot and be sized to hold a particular size substrate (e.g., a 150 mm wafer, a 200 mm wafer, etc.).

[0029] According to at least one exemplary embodiment, when the door 111 of the substrate container 110 is open, a purge fluid may be supplied to the interior space 117 to reduce the inflow of the external environment (e.g., gas, particles, humidity, etc.) through the front opening 119 into the substrate container 110. For example, the supplied purge fluid may flow out of the interior space 117 through the front opening 119, thereby reducing the flow of any gas or substance through the front opening 119 into the interior space 117. In at least one exemplary embodiment, the door of the load port is configured to interface with the door 111 and separate the door 111 from the shell 113 (to open the door 111). In at least one exemplary embodiment, the controller is configured to open / close the door 111. The purge process may be controlled before the door is opened, while the door is opened, while the door is closed, and when the door is closed. The purge fluid may be a generally inert gas, such as nitrogen. The purge fluid may also be clean dry air (CDA) or extra clean dry air (xCDA). The purge fluid may also be any gas used to condition substrates or any other suitable gas. It will be appreciated that a purge tower (not shown) may facilitate flow of purge fluid into the substrate container 110 such that the purge fluid may be directed toward and then away from the wafers contained therein. The purge fluid may clean the container and contents of the container, picking up residual moisture, oxygen and atmospheric micro-contaminants (AMC) and encouraging particulate movement toward an exit purge port or door opening.

[0030] The bottom wall 122 of the substrate container 110 includes purge ports (112A, 112B, 112C) for receiving or housing a purge module and for supplying purge fluid to the interior space 117. For example, the substrate container 110 may be supplied with a first stream of purge fluid through the first purge port 112A, a second stream of purge fluid through the second purge port 112B, and / or a third stream of purge fluid through the third purge port 112C. In at least one exemplary embodiment, one or more of the purge ports (112A, 112B, 112C) may be configured as either an inlet purge port or an outlet purge port. The substrate container 110 may include a fourth inlet / outlet purge port (not shown). The embodiments described and represented herein are not limited to four or fewer purge ports. That is, the quantities described and represented herein are provided for illustrative purposes only and are not intended to be limiting. In at least one exemplary embodiment, inlet / outlet purge ports may be disposed on a sidewall of the substrate container 110 .

[0031] The shell 113 has an exterior surface 150. Each of the inlet / outlet purge ports (112A, 112B, 112C, etc.) extends from the interior space 117 through the bottom wall 122 to the exterior surface 150 of the shell 113. The substrate container 110 may include four inlet / outlet purge ports or a different number of inlet / outlet purge ports. In at least one exemplary embodiment, the substrate container 110 may include one or more purge ports. In at least one exemplary embodiment, the substrate container 110 may include one or more pre-purge ports (corresponding to and fluidly connected with 210 and / or 240 of FIG. 5, respectively) and one or more post-purge ports (corresponding to and fluidly connected with 220 and / or 230 of FIG. 5, respectively). In at least one exemplary embodiment, one or more of the pre-purge ports may be an outlet purge port for venting gas in the interior space 117 outside the substrate container 110 .

[0032] The purge ports (112A, 112B, 112C) may allow fluids, such as a purge fluid (e.g., nitrogen), to flow into the substrate container 110. Check valves (not shown, e.g., mechanical check valves) may be provided to facilitate the flow of fluids, including gases being purged from the substrate container 110, from the interior space 117 of the substrate container 110 out through the outlet purge ports (112A, 112B, 112C, or a fourth purge port).

[0033] 3 is an exploded view of a substrate container 121, according to at least one example embodiment. The substrate container 121 includes an open front 123, a door 125, and a shell 127. Wafers 129 may be inserted and removed horizontally through the open front 123. A slot (not visible) formed in an interior side of the shell 127 receives the wafers 129. The door 125 may include a seal for engaging with the shell 127 to create an interior environment insulated from the ambient atmosphere.

[0034] 4 is a schematic diagram 130 of a substrate container 138 interacting with an EFEM 148, according to an embodiment. The substrate container 138 is docked to a load port 142 adjacent to the EFEM 148. The substrate container 138 may be any front-opening substrate carrier, such as, for example, a FOUP, a front-opening shipping box (FOSB), or a multi-purpose carrier (MAC). It will be generally understood by those skilled in the art that many of the concepts disclosed herein may have applicability to other substrate containers or carriers, more particularly, other front-opening or bottom-opening substrate containers or carriers. The substrate container 138 may include equipment hook-ups 134. When the substrate container 110 is attached to the EFEM 148, the front opening 132 of the substrate container 110 is disposed along the interior of the EFEM 148.

[0035] During use, the substrate container 138 may dock to the load port 142, whose door interfaces with the substrate container 138 door (e.g., 125 in FIG. 3 ) and separates the substrate container 138 door from the shell of the substrate container 138. When the substrate container 138 door is separated (opened) from the shell, the EFEM 148 allows a robot arm housed within the EFEM 148 to access the semiconductor wafers 140 stored within the substrate container 138. Gas (e.g., nitrogen, very clean dry air, etc.) may flow through the EFEM 148 from the top 150 of the EFEM 148 to the bottom 144 of the EFEM 148, as indicated by the arrows in FIG. 4 , to reduce contaminants within the EFEM 148.

[0036] When the front opening 132 of the substrate container 138 interfaces with the load port opening 146 of the EFEM 148 to create a FOUP-EFEM interface, some of the gas flowing through the EFEM 148 and beyond the load port opening 146 may flow into the interior 136 of the container 138, potentially interfering with the purging capability of the substrate container 138 by temporarily causing an increase in the internal environment, such as the relative humidity and / or oxygen level within the microenvironment of the substrate container 138, which may be undesirable. In addition, not all EFEMs have the same structure. The size and dimensions of the EFEM, as well as the internal structure of the EFEM, may vary depending on the manufacturer. Variations in size and structure between EFEMs of different manufactures may create differences in the purging performance of the substrate container 138 when the substrate container 138 is utilized with different EFEMs. It will be appreciated that during a purging process of the substrate container 138, the purge fluid may be distributed throughout the interior of the container 138, including the front opening 132, to address turbulent flow of gas through the front opening 132 from the EFEM 148 into the interior space 136. A controller (described in detail in FIGS. 6 and 7 ) may be configured to adjust purge flow parameters (e.g., gas flow rate) for the substrate container 138 to achieve an optimized environmental response (e.g., % RH, pressure, etc.) with influences from different EFEMs.

[0037] 5A-5F illustrate a purge module (or purge cartridge) 210 of a substrate container according to at least one embodiment. FIG. 5A is a side view of the purge module 210. FIG. 5B is a cross-sectional view of the purge module 210. FIG. 5C is a cross-sectional perspective view of the purge module 210. FIG. 5D is a perspective top view of the purge module 210. FIG. 5E is a perspective bottom view of the purge module 210. FIG. 5F is a bottom view of the purge module 210. It will be appreciated that the purge module 210 may be disposed in a purge port of a substrate container.

[0038] 6A-6F illustrate another purge module 220 of a substrate container according to at least one embodiment. FIG. 6A is a side view of the purge module 220. FIG. 6B is a cross-sectional view of the purge module 220. FIG. 6C is a cross-sectional perspective view of the purge module 220. FIG. 6D is a perspective top view of the purge module 220. FIG. 6E is a perspective bottom view of the purge module 220. FIG. 6F is a bottom view of the purge module 220. It will be appreciated that the purge module 220 may be disposed in a purge port of the substrate container.

[0039] It will be appreciated that several embodiments of purge modules are described in US Pat. No. 5,810,062, US Pat. No. 6,187,182, and US Pat. No. 7,328,727, which are incorporated by reference herein in their entireties.

[0040] It will be appreciated that in Figures 5B, 5F, 6B, 6F, 7A, and 8, the direction along the height of the substrate container is labeled as the "Z" direction. The direction along the length of the substrate container is labeled as the "X" direction. The direction along the width of the substrate container is labeled as the "Y" direction. It will be further appreciated that each purge module may be disposed in a purge port, and that the purge modules (210, 220) may be disposed in the purge ports (e.g., 112A, 112B, 112C, etc.) of Figure 2.

[0041] 5A-5F, the purge module 210 may be configured as a "passive" inlet purge module. That is, the flow control device of the purge module 210 may be opened via a passive mechanism (e.g., passively opening the flow control device by or through the pressure of the purge fluid flowing into the substrate container). The purge module 210 includes flow control devices (212, 214, 216, 218) configured to control the flow of the purge fluid. In an embodiment, the flow control devices may be check valves, umbrella valves, diaphragms, or any other suitable devices for controlling the flow of the purge fluid.

[0042] In the embodiment shown in FIG. 5B, the flow control device includes a body 212, a valve member 214 and a seal / seat for the valve member 214, a resilient member (e.g., a spring, etc.) 216, and a stem 218. In an embodiment, the valve member 214 and the stem 218 may be referred to as a plunger. The body 212 is an outer casing that contains the internal portion of the flow control device. The valve member 214 is a movable obstruction within the body 212 that adjustably restricts the flow of purge fluid through the flow control device. The resilient member 216 is disposed within the body 212 and is configured to shift the valve member 214 to a position (in other words, a closed or sealed position or state of the flow control device) by default (by the resilient force of the resilient member 216 alone when no upward force is applied to the valve member 214 to compress the resilient member 216), but allows control to reposition the valve member 214. The stem 218 is encased by and disposed within the resilient member 216 and may move with the valve member 214 .

[0043] In operation, the purge module 210 may be configured as a passive inlet purge module. An end face 210A of the purge module 210 faces the interior space of the substrate container. An end face 210B of the purge module 210 faces the outside of the substrate container and faces the load port. The valve member 214 is disposed on the end face 210B side. Before starting the purge process, there is no purge fluid flow (and other forces from the active mechanism), and the flow control device is in a closed position, for example, due to the elastic force of the elastic member 216. When the purge process is started, the purge fluid is caused to flow and flows into the substrate container through the purge module 210. The flow of the purge fluid exerts an upward force on the valve member 214. When the pressure of the purge fluid increases to a level greater than the cracking pressure of the flow control device of the purge module 210, a force pushes the valve member 214 to move upward (with the stem 218), compressing the elastic member 216 (to overcome the elastic force of the elastic member 216) such that the flow control device changes from a closed position (where purge fluid is prevented from flowing through the flow control device) to an open position (where purge fluid can flow through the flow control device), e.g., in a direction from the load port toward the interior space of the substrate container.

[0044] 6A-6F, the purge module 220 may be configured as a "passive" outlet purge module. That is, the flow control device of the purge module 220 may be opened via a passive mechanism (e.g., the flow control device is passively opened by or via the pressure of the purge fluid in the substrate container). The purge module 220 includes flow control devices (212, 214, 216, 218) configured to control the flow of the purge fluid. In an embodiment, the flow control device of the purge module 220 may be the same as the flow control device of the purge module 210 except for the orientation (e.g., whether the valve member 214 is disposed / oriented on a side facing the interior space of the substrate container or on a side facing the load port).

[0045] In operation, the purge module 220 may be configured as an outlet purge module. An end face 220A of the purge module 220 faces the inner space of the substrate container. An end face 220B of the purge module 220 faces the outside of the substrate container and faces the load port. The valve member 214 is disposed on the end face 220A side. Before starting the purge process, there is no purge fluid flow (and other forces from the active mechanism), and the flow control device is in a closed position, for example, due to the elastic force of the elastic member 216. When the purge process is started, the purge fluid is caused to flow and flows into the substrate container through the purge module 210, and the internal pressure of the substrate container increases. The pressure of the purge fluid in the substrate container causes a downward force to be applied to the valve member 214. When the internal pressure of the substrate container increases to a level greater than the cracking pressure of the flow control device of the purge module 220, a force pushes the valve member 214 (with the stem 218) to move downward, e.g., in a direction from the interior space of the substrate container toward the load port, compressing the elastic member 216 (to overcome the elastic force of the elastic member 216) such that the flow control device changes from a closed position (in which purge fluid is prevented from flowing through the flow control device) to an open position (in which purge fluid can flow through the flow control device).

[0046] 7A-7B illustrate bottom views of a substrate container according to at least one embodiment. As shown in FIG. 7A, the substrate container 310 includes four purge ports. Two purge ports 200 are plugged. That is, no purge module is disposed / housed in the purge port 200 and / or the purge port 200 is plugged with a closed cartridge (or body, plug, etc.) and is inoperable to direct purge fluid. One purge port is configured to house a passive inlet purge module 210. Another purge port is configured to house a passive outlet purge module 220. It will be appreciated that each of the purge modules 200 can be the same as any one of the purge modules (210, 220). It will be appreciated that the substrate container 310 can include any suitable number (e.g., one, two, etc.) of plugged purge ports 200. 7B, the substrate container 320 includes four purge ports. Three purge ports are configured to accommodate the passive inlet purge module 210. One purge port is configured to accommodate the passive outlet purge module 220.

[0047] Figure 8 is a cross-sectional view of the substrate container 320 of Figure 7B along dotted line 8-8, according to at least one embodiment. Figure 9A is an enlarged view of a portion of Figure 8, according to at least one embodiment. Figure 9B is an enlarged view of another portion of Figure 8, according to at least one embodiment. The enlarged portion shown in Figure 9A includes a purge module 220 configured as a passive outlet purge module. The enlarged portion shown in Figure 9B includes a purge module 210 configured as a passive inlet purge module.

[0048] Figure 10 illustrates a bottom view of a substrate container 330 according to at least one embodiment. Figure 11 is a front perspective view of the substrate container 330 of Figure 10 (not showing the door of the substrate container 330) according to at least one embodiment. As shown in Figures 10 and 11, the substrate container 330 includes four purge modules, each having a flow control device. It will be appreciated that the substrate container 330 can include at least two purge modules, or any other suitable number of purge modules.

[0049] 10 and 11, the flow control devices of all purge modules are configured and / or oriented similarly to one another (e.g., such that each purge module is configured as a passive inlet purge module 210). When the purge ports are connected to a source of purge fluid, such a configuration and / or orientation can allow the flow control devices to be passively opened by or through the pressure of the purge fluid (e.g., flowing into the interior space of the substrate container) during a purge process of the substrate container. When the purge ports are not connected to a source of purge fluid, such a configuration and / or orientation can also prevent the flow control devices from being passively opened by or through the pressure of the purge fluid in the substrate container (e.g., flowing out of the interior space of the substrate container) during a purge process of the substrate container, since the internal pressure of the substrate container can cause a downward force on the valve member 214 to keep the flow control devices closed.

[0050] In such an embodiment, opening or controlling the opening of the flow control device to allow purge fluid to pass through the flow control device (e.g., for outflow of purge fluid from the interior space of the substrate container) may be performed using an active mechanism (e.g., with an actuator, etc.). That is, the flow control device may be actuated (to open for outflow of purge fluid from the interior space of the substrate container) via an actuation mechanism (not shown). It will be appreciated that actuating (e.g., mechanically) a flow control device for outflow of purge fluid may be performed either in conjunction with actuating (e.g., mechanically) or passively opening other flow control devices for inflow of purge fluid. In an embodiment, the actuation mechanism includes an actuator (e.g., a solenoid controlling a pin, a mechanical device, etc.) to actuate the flow control device. For example, the actuator can be controlled to contact and push upward on the valve member 214 of the flow control device, and to apply an upward force to the valve member 214 to overcome the internal pressure of the substrate container (and the elastic force of the elastic member 216) so that the flow control device can be opened and purge fluid from the interior space of the substrate container can flow out of the substrate container (and the internal pressure of the substrate container is reduced). In an embodiment, the actuation mechanism can be on or part of the substrate container. In another embodiment, the actuation mechanism can be decoupled from or independent of the substrate container (e.g., the actuation mechanism is disposed on a load port, etc.).

[0051] In an embodiment, any one of the purge modules of the substrate container 330 may include a particle filter or a vent. In an embodiment, the substrate container 330 may include a pressure relief valve. The pressure relief valve may be configured to open, for example, when the internal pressure of the substrate container is equal to or greater than the cracking pressure of the door seal of the substrate container (e.g., during normal use, etc.). It will be appreciated that the door seal and inlet directional check valve cracking pressure may become dangerously high if the container is purged / pressurized without at least one of the inlet directional check valves being actuated during purging. In such a case, the pressure relief valve may be configured to open at a pressure level less than the system cracking pressure to ensure that the container does not fail under pressure. It will also be appreciated that the cracking pressure of the pressure relief valve may be less than the cracking pressure of the door seal. If the system pressure (e.g., door seal and inlet directional check valve cracking pressure) is dangerously high (e.g., above a threshold value), the pressure relief valve may be configured to open, for example, if a purge module designated for bleed-out is inadvertently not activated. In an embodiment, one or more of the flow control devices of the purge modules of the substrate container 330 may be activated (or deactivated) simultaneously or in sequence to achieve the desired purge.

[0052] 12A is a diagram 500 illustrating the internal pressure of a substrate container during a purge process, according to at least one embodiment. FIG. 12B is another diagram 550 illustrating the internal pressure of a substrate container during a purge process, according to at least one embodiment. It will be appreciated that diagram 500 illustrates seven purging operations illustrating the problem with door cracking due to container pressurization. Point 540 indicates the door seal cracking pressure. Diagram 500 illustrates that during a purge process (e.g., a closed door purge), the container is pressurized until it reaches the door seal cracking pressure. In such a case, instead of continuing, the purge is stopped, but if the purge fluid leaks out of the door, the purge may continue. The operations are repeated seven times to demonstrate repeatability. Diagram 550 illustrates that upon reaching 510 (same as 540), the system can react by activating a flow control device of the purge module in the purge port to relieve the pressure to a level below the cracking pressure of the door seal. In such a case, the purge fluid can flow in a controlled manner out of the purge port (which contains the activated flow control device) instead of leaking around the door.

[0053] 12A and 12B, the vertical coordinate represents the internal pressure of the substrate container (e.g., during the purge process) (e.g., in kilopascals or kPa). In an embodiment, the substrate container may be a wafer or reticle carrier, e.g., a FOUP, a pod (e.g., an extreme ultraviolet (EUV) reticle pod), etc. The horizontal coordinate represents the time of the purge process (e.g., in seconds).

[0054] During a purge process (eg, a closed door purge process), purge fluid is flowed into the interior space of the substrate container through a purge port (eg, an inlet purge port) and the internal pressure 520 of the substrate container is increased.

[0055] It will be appreciated that purging with a purge fluid such as a dry gas can help lower the %RH. If an inert gas is used as the purge fluid, it can be economical and safe to vent the inert gas from inside the vessel through an activated purge module instead of leaking the inert gas through the door. Using an inert gas as a purge fluid can have the added benefit of lowering oxygen. It will also be appreciated that increased internal pressurization of the substrate vessel can help enhance oxygen recovery. Increased internal pressurization can extend the time for the internal pressure to decay to ambient. With regard to oxygen recovery, it will be appreciated that purging with an inert gas (as a purge fluid) can lower the oxygen level in the vessel, for example, to zero parts per million (ppm) or about zero parts per million (ppm). Oxygen recovery can be referred to as a process in which the oxygen level is raised to a certain defined level, for example, 200 ppm, 10,000 ppm, or 21%, etc. The lower the oxygen level in the vessel, the less likely oxidation of the circuitry during semiconductor production may occur. Thus, a generally high (e.g., 1 kPa or about 1 kPa to 5 kPa or about 5 kPa) cracking pressure exhaust check valve (of the outlet purge port) may be required to allow the substrate vessel to pressurize to a desired level. In contrast, a low (e.g., less than 1 kPa) cracking pressure exhaust check valve may also be desirable when purging the substrate vessel to ensure that the purge fluid passively exits through the exhaust port (outlet purge port) by opening the exhaust check valve. Also, substrate vessel internal pressure exceeding the (substrate vessel) door seal cracking pressure may generate leakage from the door seal. Therefore, generally, a passive "exit" check valve (e.g., of the purge module 220 of FIG. 5B) should have a cracking pressure lower than the door seal cracking pressure. It will be appreciated that the cross-sectional area of ​​the door seal is generally much larger than that of the purge port. Even if the passive cracking pressure of the purge port is lower than that of the door seal, most of the purge fluid may still flow around the door.If one attempts to "solve" this challenge by reducing the purge port cracking pressure to zero or near zero, the oxygen in the vessel can rise quickly.

[0056] In a typical substrate container configuration, the substrate container may include three inlet purge ports and one outlet purge port, or two inlet purge ports and two outlet purge ports, etc. (see FIGS. 7A and 7B). With such a configuration, during the purge process, purge fluid flows into the substrate container through the inlet purge ports and is passively exhausted through the outlet purge ports. The internal pressure inside the substrate container opens the check valve of the outlet purge module at a known cracking pressure (aka minimum opening pressure, e.g., less than 4 kPa). Typically, due to the low (e.g., 5 kPa or about 5 kPa or greater) cracking pressure of the door seal, the cracking pressure of the check valve of the outlet purge module needs to be correspondingly low in value to ensure that the purge fluid is exhausted through the outlet purge port before being exhausted through the door seal.

[0057] The embodiments disclosed herein (e.g., as described in FIGS. 10 and 11) can provide a substrate container in which all of the flow control devices of all of the purge modules are configured and / or oriented similarly to one another (such that each purge module is configured as a passive inlet purge module 210). When the purge ports are connected to a source of purge fluid, such a configuration and / or orientation can allow the flow control devices to be passively opened by or through the pressure of the purge fluid (e.g., flowing into the interior space of the substrate container) during a purge process of the substrate container. When the purge ports are not connected to a source of purge fluid, such a configuration and / or orientation can also prevent the flow control devices from being passively opened by or through the pressure of the purge fluid in the substrate container (e.g., flowing out of the interior space of the substrate container) during a purge process, since the internal pressure of the substrate container applies a downward force on the valve member 214 to keep the flow control devices closed. In such embodiments, opening or controlling the opening of the flow control device to allow purge fluid to pass through the flow control device (e.g., for outflow of purge fluid from the interior space of the substrate container) may be performed using an active mechanism (e.g., with an actuator, etc.).

[0058] Returning to FIG. 12A, with the purge port configurations of FIG. 10 and FIG. 11, any one of the flow control devices can be configured to have a cracking pressure greater than the cracking pressure of the door seal of the substrate container and / or greater than the cracking pressure of a typical flow control device (e.g., 220 in FIG. 6A-6F). During a purge process (e.g., a closed door purge process, etc.), purge fluid is flowed into the interior space of the substrate container through a purge port connected to a source of purge fluid, and without activating the flow control devices of the purge module, the internal pressure 520 can be increased until it reaches the door seal cracking pressure 510 at point 540. At point 540, the purge fluid can leak out through the door gasket during the purge process if no action is taken (e.g., none of the flow control devices of the purge module are activated). At point 540, one or more of the flow control devices of the purge module can be activated (to open for the outflow of purge fluid from the interior space of the substrate container) via an activation mechanism. That is, each purge module with an activated flow control device can function as an "outlet" purge module such that purge fluid can be discharged from the interior space of the substrate container via the activated flow control device of each "outlet" purge module and the internal pressure 520 can reach zero at point 530 (without purge fluid leaking through the door seal). At point 530, the activated flow control device can be deactivated (in other words, without being activated by an activation mechanism) and the internal pressure of the substrate container and / or the elastic force of the elastic member of the flow control device can keep the flow control device closed to prevent the outflow of purge fluid from the interior space of the substrate container. The internal pressure 520 can increase again as purge fluid continues to be flowed into the substrate container.

[0059] 12B, with the purge port configurations of FIGS. 10 and 11, during a purge process (e.g., a closed door purge process, etc.), the internal pressure 570 can be maintained below the door cracking pressure 510 (e.g., between a first threshold 580 and a second threshold 590) by activating and deactivating one or more of the flow control devices of the purge module. For example, when a purge fluid is flowed into the interior space of the substrate container via a purge port connected to a source of the purge fluid, and the internal pressure increases to reach the first threshold 580 (which may be equal to or less than the door cracking pressure 510) without activating the flow control devices of the purge module, one or more of the flow control devices of the purge module can be activated (to open for the outflow of purge fluid from the interior space of the substrate container) via an activation mechanism such that the internal pressure 570 decreases until it reaches the second threshold 590. When the second threshold 590 is reached, one or more of the flow control devices of the purge module may be deactivated (to close to prevent the outflow of purge fluid from the interior space of the substrate container) such that the internal pressure 570 increases (as purge fluid continues to be flowed into the substrate container during the purge process). It will be appreciated that in another embodiment, the door cracking pressure 510 is known and thus the system may activate one or more of the flow control devices when the first threshold 580 is reached (before the door cracking pressure 510 is reached). It will also be appreciated that in an embodiment, the internal pressure 570 need not reach the thresholds 580 or 590. In such an embodiment, the internal pressure 570 may be kept within a certain percentage of the limits of the thresholds 580 or 590, for example, by activating or deactivating one or more of the flow control devices of the purge module. It will be further appreciated that in an embodiment, the controller may be configured to actuate one or more of the flow control devices of the purge module to continuously control the outlet flow rate of the purge fluid.

[0060] FIG. 13 illustrates an operational flow chart 600 for operating one or more flow control devices of a purge module of a substrate container in accordance with at least one example embodiment.

[0061] The operational flow 600 may include one or more operations, actions, or functions depicted by one or more blocks 610, 620, 630, 640, 650, and 660. Although illustrated as separate blocks, various blocks may be divided into additional blocks, combined into fewer blocks, or eliminated depending on the desired implementation. As a non-limiting example, the description of the method 600 implemented by a controller corresponding to the purge port configurations thereof in Figures 10 and 11 pertains to actuating one or more flow control devices of a purge module of a substrate container for a purge process in accordance with one or more exemplary embodiments described herein.

[0062] It will be appreciated that in embodiments, the controller may include a processor, memory, input / output, and / or storage. It should be appreciated that the controller may include one or more additional components. The processor may retrieve and execute programming instructions stored in the memory and / or storage. The processor may also store and retrieve application data in the memory. The processor may be a single processor, multiple processors, co-processors, or a single processor having multiple processing cores. In some embodiments, the processor may be a single-threaded processor. In some embodiments, the processor may be a multi-threaded processor. The memory is generally included as representative of random access memory, such as, but not limited to, static random access memory (SRAM), dynamic random access memory (DRAM), flash, suitable combinations thereof, etc. In some embodiments, the memory may be volatile memory. In some embodiments, the memory may be non-volatile memory. The input / output may include both wired and wireless connections.

[0063] The process flow 600 may begin at block 610. Block 610 may refer to preparing a substrate container, including configuring and / or orienting all of the flow control devices of all of the purge modules of the substrate container similar to one another (see discussion of FIGS. 10 and 11). With such configuration or orientation, all of the purge modules may be configured as "passive" inlet purge modules (in other words, allowing the flow control devices to be passively opened by or via the pressure of purge fluid flowing into the substrate container). Block 610 may be followed by block 620.

[0064] Block 620 may refer to the controller controlling the initiation or initiation of a purge process (e.g., a closed door purge process, etc.). Block 620 may be followed by block 630.

[0065] Block 630 may refer to the controller controlling the flow of purge fluid into the interior of the substrate container through one or more of the purge ports of the substrate container, for example, by connecting / opening the purge ports to a source of purge fluid. Since all of the purge modules are configured as "passive" inlet purge modules, purge fluid may be flowed into the substrate container through any one or more of the purge ports simultaneously or in sequence, for example, based on a required / desired / predetermined purge fluid flow rate or flow volume. Block 630 may be followed by block 640.

[0066] Block 640 may refer to one or more sensors detecting / sensing / measuring one or more environmental conditions on or in the interior of the substrate container in real time or during a period of time. The one or more environmental conditions may include one or more of relative humidity (%RH), internal pressure (e.g., absolute pressure), oxygen level, temperature, measured presence of airborne molecular contaminants, measured presence of one or more volatile organic compounds (VOCs), and the like. The one or more sensors may be disposed or mounted on the substrate container or in the interior space of the substrate container. It will be appreciated that the one or more sensors may be located outside the container in a system that provides the purge. The one or more environmental conditions may be communicated from the one or more sensors to a controller. In another embodiment, block 640 may refer to the controller determining the timing. Block 640 may be followed by block 650.

[0067] Block 650 may refer to the controller controlling the activation or deactivation of one or more flow control devices of the substrate container's purge module (e.g., via controlling an actuation mechanism) based on the determined environmental conditions or the determined timing.

[0068] For example, during a purge process, purge fluid is flowed into the substrate container and the internal pressure of the substrate container is increasing. The controller may be configured to activate one or more flow control devices (e.g., for flow or release of purge fluid from the substrate container's interior space) or deactivate one or more flow control devices (e.g., for closing the one or more flow control devices to prevent flow of purge fluid from the substrate container's interior space) based on the sensed internal pressure of the substrate container (e.g., to maintain the internal pressure of the substrate container below a cracking pressure of a door seal of the substrate container, etc.). See the discussion of Figures 12A and 12B.

[0069] In another example, during a purge process, purge fluid is flowed into the substrate container and the controller can be configured to actuate one or more flow control devices (e.g., for outflow of purge fluid from the interior space of the substrate container) or deactuate one or more flow control devices (e.g., to close one or more flow control devices to prevent outflow of purge fluid from the interior space of the substrate container) based on a timing (e.g., based on an amount of time or timed to an event, which may be customer or application specific timing).

[0070] In yet another example, during a purge process, a purge fluid is flowed into the substrate container, and the controller may be configured to activate one or more flow control devices (e.g., for outflow of purge fluid from the substrate container's interior space) or deactivate one or more flow control devices (e.g., to close one or more flow control devices to prevent outflow of purge fluid from the substrate container's interior space) based on a detected environmental condition, such as a detected internal relative humidity of the substrate container, a detected internal oxygen level of the substrate container, and / or a detected presence of one or more volatile organic compounds (VOCs) in the substrate container. Similar to the discussion of Figures 12A and 12B, when a detected environmental condition, for example, exceeds a desired range (or exceeds a maximum allowable threshold), the controller may be configured to activate one or more flow control devices (e.g., for outflow of purge fluid from the substrate container's interior space) to reduce the level of the environmental condition, for example. When the sensed environmental condition is, for example, below a desired range (or below a minimum acceptable threshold), the controller may be configured to deactivate one or more flow control devices to increase the level of the environmental condition (e.g., to close one or more flow control devices to prevent outflow of purge fluid from the interior space of the substrate container). In an embodiment, the desired range of the environmental condition may be from 0% to ambient conditions. In an embodiment, the control is to reduce or prevent contaminants (e.g., VOCs, etc.) from entering the substrate container.

[0071] In yet another example, during a purge process, purge fluid is flowed into the substrate container, and the controller may be configured to selectively activate, deactivate, and / or connect / open sources of purge fluid to any suitable combination of flow control devices of the purge modules (e.g., any one or more of the four purge modules) simultaneously or in sequence to maintain a desired purging (e.g., even distribution, etc.) of the purge fluid flow within the substrate container.

[0072] Block 650 may be followed by block 660. Block 660 may refer to the controller controlling the deactivation of one or more flow control devices of a purge module of the substrate container when a desired environmental condition is met, when a defined time has expired, or when a defined event has occurred / ended, etc.

[0073] The embodiments disclosed herein can help reduce or eliminate the need to rely on passive outlet check valves to passively open due to internal pressure during the purge process, leading to improved oxygen control, can provide for higher internal pressurization of the substrate container during a closed door purge process, can provide improved sealing conductance due to the internal pressure of the container causing the check valve plunger to close during the purge process, and can actuate (e.g., mechanically, etc.) the flow control devices of the purge modules to open or deactivate (such that the flow control devices are closed as none of the purge modules are passively opened due to the internal pressure of the container) during the purge process depending on time or consistent with environmental condition criteria such as VOC, %RH, pressure inside the substrate container, etc.

[0074] The embodiments disclosed herein can use automation to actuate (e.g., mechanically, etc.) the purge module to open or deactivate the flow control devices of the purge module, monitor environmental conditions in the substrate container via sensors, and actuate (e.g., mechanically, etc.) the exhaust to control the internal pressure, VOC, %RH, AMH, oxygen, etc. levels in the substrate container. The embodiments disclosed herein can use automation to selectively actuate and / or selectively deactivate combinations of flow control devices of the purge module to assist in efficient evacuation of the substrate container to maintain desired environmental conditions.

[0075] Aspects: It should be appreciated that any one of aspects 1-19 may be combined with any one of aspects 20-27.

[0076] Aspect 1. A substrate container having at least two purge modules, each purge module of the at least two purge modules includes a flow control device; The system is configured such that the flow control device of each purge module is actuated to flow purge fluid.

[0077] Embodiment 2. The system of embodiment 1, wherein the substrate container is a front-opening integrated pod (FOUP).

[0078] Embodiment 3. The system of embodiment 1 or embodiment 2, further comprising a controller configured to actuate the flow control device.

[0079] Embodiment 4. The system of embodiment 3, wherein the controller is configured to actuate the flow control device during a closed door purge process.

[0080] Embodiment 5. The device further comprising at least one sensor, at least one sensor configured to sense at least one parameter; The system of any one of embodiments 3 to 4, wherein the controller is configured to actuate the flow control device based on the at least one sensed parameter.

[0081] Embodiment 6. The system of embodiment 5, wherein the at least one sensor is a pressure sensor configured to sense an internal pressure of the substrate container.

[0082] Embodiment 7. The system of any one of embodiments 3 to 6, wherein the flow control device is actuated via an actuation mechanism, the actuation mechanism being controlled by the controller.

[0083] Embodiment 8. The system of embodiment 7, wherein the actuation mechanism includes a solenoid that controls an actuator to actuate the flow control device.

[0084] Embodiment 9. The system of any one of embodiments 1 to 8, wherein the flow control device is a check valve, and the check valve is oriented such that the check valve is opened by pressure or force from outside the substrate container.

[0085] Embodiment 10. The system of any one of embodiments 1 to 9, wherein the cracking pressure of the flow control device is greater than the cracking pressure of the door seal of the substrate container.

[0086] Embodiment 11. The at least two purge modules include four purge modules, and the system further includes a controller; 11. The system of any one of aspects 1 to 10, wherein the controller is configured to selectively actuate a combination of flow control devices of the four purge modules to maintain a desired purge of the purge fluid flow in the substrate container.

[0087] Aspect 12. The system further comprises a controller, 12. The system of any one of aspects 1-11, wherein during a closed-door purge process, the controller is configured to actuate the flow control device based on a sensed internal pressure of the substrate container.

[0088] Aspect 13. The system of aspect 12, wherein during the closed door purge process, the controller is configured to maintain an internal pressure of the substrate container below a cracking pressure of a door seal of the substrate container.

[0089] Aspect 14. The system further comprises a controller, 14. The system of any one of aspects 1-13, wherein during a closed door purge process, the controller is configured to actuate the flow control device based on timing.

[0090] Aspect 15. The system further comprises a controller, 15. The system of any one of aspects 1-14, wherein during a closed-door purge process, the controller is configured to actuate the flow control device based on the sensed internal relative humidity of the substrate container.

[0091] Aspect 16. The system further comprises a controller, 16. The system of any one of aspects 1-15, wherein during a closed-door purge process, the controller is configured to activate the flow control device based on a sensed internal oxygen level of the substrate container.

[0092] Aspect 17. The system further comprises a controller, 17. The system of any one of aspects 1 to 16, wherein during a closed-door purge process, the controller is configured to actuate the flow control device based on a detected presence of one or more volatile organic compounds in the substrate container.

[0093] Embodiment 18. The system of any one of embodiments 1 to 17, wherein each purge module of the at least two purge modules includes a particulate filter or a vent.

[0094] Aspect 19. The device further comprises a pressure relief valve; 19. The system of any one of aspects 1-18, wherein the pressure relief valve is configured to open when the system pressure is equal to or greater than a threshold value.

[0095] A method of operating a flow control device of a purge module of a substrate container, comprising: initiating a purge process for the substrate container; flowing a purge fluid inside the substrate container, the substrate container having at least two purge modules, each purge module of the at least two purge modules including a flow control device, the flow control device of each purge module being configured to be actuated for flowing of the purge fluid; activating a flow control device for outflow of the purge fluid; A method comprising:

[0096] Sensing at least one parameter via at least one sensor; activating a flow control device based on the at least one sensed parameter; 21. The method of embodiment 20, further comprising:

[0097] Aspect 22. Detecting the internal pressure of a substrate container; activating a flow control device based on the sensed internal pressure; The method of embodiment 20 or embodiment 21, further comprising:

[0098] Embodiment 23. The method of embodiment 22, further comprising maintaining an internal pressure of the substrate container below a cracking pressure of a door seal of the substrate container.

[0099] Embodiment 24. The at least two purge modules include four purge modules, and the method further comprises: 24. The method of any one of aspects 20 to 23, further comprising selectively activating a combination of flow control devices of the four purge modules to maintain a desired purging of purge fluid in the substrate container.

[0100] Aspect 25. Sensing an internal oxygen level of a substrate container; activating a flow control device based on the sensed internal oxygen level; 25. The method of any one of embodiments 20 to 24, further comprising:

[0101] Aspect 26. Detecting the internal relative humidity of a substrate container; activating a flow control device based on the sensed internal relative humidity; 26. The method of any one of embodiments 20 to 25, further comprising:

[0102] Embodiment 27. The method of any one of embodiments 20 to 26, further comprising activating a flow control device based on timing.

[0103] The examples disclosed in this application should be considered in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the appended claims, rather than by the above description, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein.

[0104] The terminology used herein is intended to describe particular embodiments and is not intended to be limiting. The terms "a", "an" and "the" include the plural unless clearly indicated otherwise. The terms "comprises" and / or "comprising", as used herein, specify the presence of stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements and / or components.

[0105] With regard to the above description, it should be understood that changes may be made in details, particularly with respect to the materials of construction employed and the shape, size, and arrangement of parts without departing from the scope of the present disclosure. The specification and described embodiments are exemplary only, the true scope and spirit of the present disclosure being indicated by the following claims.

Claims

1. a substrate container having at least two purge modules; each purge module of the at least two purge modules includes a flow control device; The system, wherein the flow control device of each purge module is configured to be actuated for the outflow of purge fluid.

2. 10. The system of claim 1, wherein the substrate container is a front opening integrated pod (FOUP).

3. The system of claim 1 , further comprising a controller configured to operate the flow control device.

4. 10. The system of claim 1, wherein the flow control device is a check valve, the check valve being oriented such that the check valve is opened by pressure or force from outside the substrate container.

5. The system of claim 1 , wherein a cracking pressure of the flow control device is greater than a cracking pressure of a door seal of the substrate container.

6. the at least two purge modules include four purge modules, the system further includes a controller; 2. The system of claim 1, wherein the controller is configured to selectively actuate a combination of flow control devices of the four purge modules to maintain a desired purge of purge fluid flow within the substrate container.

7. The system further includes a controller; 10. The system of claim 1, wherein during a closed door purge process, the controller is configured to actuate the flow control device based on a sensed internal pressure of the substrate container.

8. The system further includes a controller; The system of claim 1 , wherein the controller is configured to actuate the flow control device based on timing during a closed door purge process.

9. The system further includes a controller; 10. The system of claim 1, wherein during a closed door purge process, the controller is configured to operate the flow control device based on a sensed internal relative humidity of the substrate container.

10. The system further includes a controller; 10. The system of claim 1, wherein during a closed door purge process, the controller is configured to actuate the flow control device based on a sensed internal oxygen level of the substrate container.

11. The system further includes a controller; 10. The system of claim 1, wherein during a closed door purge process, the controller is configured to actuate the flow control device based on a detected presence of one or more volatile organic compounds in the substrate container.

12. The system of claim 1 , wherein each purge module of the at least two purge modules includes a particulate filter or a vent.

13. Further comprising a pressure relief valve; The system of claim 1 , wherein the pressure relief valve is configured to open when a system pressure is above a threshold value.

14. 1. A method of operating a flow control device of a purge module of a substrate container, comprising: initiating a purge process for the substrate container; flowing a purge fluid inside the substrate container, the substrate container having at least two purge modules, each purge module of the at least two purge modules including a flow control device, the flow control device of each purge module configured to be actuated for the outflow of the purge fluid; activating the flow control device for the outflow of the purge fluid; A method comprising:

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