Load lock chamber, cleaning method thereof, and semiconductor device

Abstract

The present application relates to a load lock chamber, a cleaning method thereof, and a semiconductor device. The load lock chamber includes a chamber body. At least one load lock chamber is configured therein, and the chamber body has an intake section and an exhaust section communicating with each load lock chamber. The chamber body has at least one dispersion section, each of which is arranged corresponding to one load lock chamber, and each dispersion section includes a plurality of independently provided dispersion holes, each of which communicates between the intake section and the corresponding load lock chamber and is configured to distribute an airflow entering the corresponding load lock chamber.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to Chinese patent application bearing application number 2022117304102, filed on December 30, 2022, the entire text of which is incorporated herein by reference for all purposes. [Technical field]

[0002] The present application relates to the field of semiconductor technology, and more particularly to a load lock chamber and a cleaning method therefor, and a semiconductor device. [Background technology]

[0003] A semiconductor device for processing a substrate (e.g., a wafer) generally includes an Equipment Front-End Module (EFEM), a Load Lock Chamber, a Transfer Chamber, a Process Module, etc. During substrate processing, the substrate needs to be transferred into and out of the Load Lock Chamber through the Equipment Front-End Module under atmospheric pressure environment, and into and out of the Process Chamber through the Transfer Chamber under vacuum environment.

[0004] In actual production conditions, due to pressure differences between the reaction chamber, transfer chamber, load lock chamber and equipment front-end module, a large amount of residual particles from chemical reactions and atmospheric dust and particles inevitably enter the load lock chamber, thereby contaminating the inner walls of the load lock chamber and the substrates inside the load lock chamber, and affecting the yield rate of substrates.

[0005] Usually, manufacturers create corresponding product maintenance cycles according to the usage status of the equipment, and periodically disassemble and clean the load-lock chamber. In this cleaning method, not only is it time-consuming to disassemble and clean the load-lock chamber, but there is still a risk of substrate contamination during the maintenance cycle, which is detrimental to improving the yield rate of substrates. Summary of the Invention [Problem to be solved by the invention]

[0006] According to various embodiments of the present application, a load lock chamber and a cleaning method thereof, and a semiconductor device are provided. [Means for solving the problem]

[0007] The load lock chamber is a chamber body having at least one load lock chamber formed therein and having an intake section and an exhaust section communicating with each of the load lock chambers; The chamber body has at least one distribution section, each of which is arranged corresponding to one of the load lock chambers, and each of the distribution sections includes a plurality of distribution holes provided independently, and each of the distribution holes is connected between the intake section and the corresponding load lock chamber and is configured to distribute the airflow entering the corresponding load lock chamber.

[0008] In one embodiment, the load lock chamber is for loading a substrate, In the height direction of the chamber body, at least one of the dispersion sections is located above the substrate in the corresponding load lock chamber, and the outlets of the dispersion holes of the at least one of the dispersion sections are all formed toward the side where the substrate is located.

[0009] In one embodiment, in a plane perpendicular to a height direction of the chamber body, an orthogonal projection of at least one of the dispersion portions covers an orthogonal projection of the substrate in the corresponding load lock chamber.

[0010] In one embodiment, the distribution section corresponding to at least one of the load lock chambers is arranged in at least two layers, The at least two layers of dispersion sections are arranged at intervals along an airflow path, and projections of the at least two layers of dispersion sections onto a plane perpendicular to the spacing direction of the dispersion holes are arranged to be shifted from each other.

[0011] In one embodiment, a return air chamber and a return air hole are configured inside the chamber body, the return air chamber is connected to the exhaust section, and each of the load lock chambers is provided with a corresponding number of return air holes, and the return air holes of the same load lock chamber are provided independently and are connected to the return air chamber and the load lock chamber, respectively.

[0012] In one embodiment, the dispersion section and the return air hole corresponding to each of the load lock chambers are disposed on opposite sides of the load lock chamber.

[0013] In one embodiment, the chamber body includes a top cover and a side plate, the top cover being placed over the side plate and both defining at least one of the load lock chambers, the intake section being provided on the top cover, and the at least one distribution section being provided on the top cover.

[0014] In one embodiment, the chamber body includes an intake chamber communicating with the intake section, at least one of the distribution sections separates the intake chamber from the corresponding load lock chamber, and the distribution hole in at least one of the distribution sections connects the intake chamber to the load lock chamber.

[0015] In one embodiment, the chamber body includes at least one partition, and the at least one partition divides an internal space of the chamber body to form a plurality of load lock chambers independent of each other; At least one of the partition sections is configured with the intake chamber and the dispersion section communicating with at least one of the load lock chambers formed by being partitioned by the partition section itself.

[0016] In one embodiment, the load lock chambers are arranged in sequence along the height direction of the chamber body, and the intake section communicating with the intake chamber is located on a side surface of the chamber body.

[0017] In one embodiment, each of the at least one load lock chamber is in communication with one of the intake sections and one of the exhaust sections.

[0018] In one embodiment, a gas uniformization space is formed between the at least one dispersion part and the upper cover, and the gas entering from the intake part flows through the gas uniformization space and is diffused.

[0019] In one embodiment, a plurality of the load lock chambers are provided, the plurality of the load lock chambers being independent of each other and sharing one of the intake chambers and one of the intake sections.

[0020] In one embodiment, a plurality of the load lock chambers are provided, the plurality of the load lock chambers are independent of each other, and each of the plurality of the load lock chambers is provided with one of the intake chambers and one of the intake units.

[0021] The semiconductor device includes a load lock chamber according to any of the above embodiments.

[0022] The method for cleaning the load lock chamber is as follows: a step of opening an intake section and an exhaust section of a chamber body of the load lock chamber, the chamber body having a load lock chamber and a distribution section, the intake section and the exhaust section both communicating with the load lock chamber, each distribution section being arranged corresponding to one load lock chamber, and each distribution section including a plurality of independent distribution holes, each of the distribution holes communicating between the intake section and the corresponding load lock chamber; and introducing a cleaning gas into the intake section until a preset condition is met. [Brief description of the drawings]

[0023] In order to more clearly describe the technical means in the embodiments of the present application or the prior art, the following briefly describes the drawings that need to be used in the description of the embodiments or the prior art. It is obvious that the drawings in the following description are only the embodiments of the present application, and those skilled in the art can obtain other drawings based on the disclosed drawings without creative labor. [Figure 1] FIG. 1 is a perspective view of a load lock chamber in accordance with some embodiments of the present application. [Diagram 2] FIG. 2 is another perspective view of the load lock chamber shown in FIG. 1. [Diagram 3] FIG. 2 is a side view of the load lock chamber shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line AA in FIG. [Diagram 5] FIG. 4 is a cross-sectional view taken along line BB in FIG. [Figure 6] 1 is a schematic configuration diagram of a semiconductor device according to some embodiments of the present application; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] In order to make the above objects, features and advantages of the present application clearer and easier to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, many specific details are described to provide a complete understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited by the specific examples disclosed below.

[0025] In the description of the present application, the orientations or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like are orientations or positional relationships shown in the drawings, and are used only to facilitate or simplify the description of the present application, and are not intended to represent or imply that the devices or parts shown necessarily have a specific orientation or a specific orientation structure and operation, and therefore should not be construed as limiting the present application.

[0026] Additionally, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply a relative importance or to imply a number of the technical features depicted. Thus, a feature qualified as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of this application, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.

[0027] In this application, unless otherwise clearly specified and limited, the terms "attached", "coupled", "connected" and the like should be understood in a broad sense, for example, may be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, an internal communication between two elements, or an interactive relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific situation.

[0028] In this application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include direct contact between the first feature and the second feature, or indirect contact between the first feature and the second feature via an intermediate medium. Furthermore, a first feature being "above," "above," and "on the upper surface" of a second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. A first feature being "below," "below," and "on the lower surface" of a second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than that of the second feature.

[0029] It should be noted that when an element is referred to as being "fixed" or "mounted" to another element, it may be directly on the other element, or there may be intervening elements present. When an element is considered to be "connected" to another element, it may be directly connected to the other element, or there may be intervening elements present as well. The terms "vertical," "horizontal," "up," "down," "left," "right," and similar terms used herein are for illustrative purposes only and do not represent the only embodiments.

[0030] As described in the Background Art, in conventional techniques, the load lock chamber is often cleaned by disassembling and cleaning the load lock chamber, but this method is time-consuming and disadvantageous in improving the yield rate of substrates.

[0031] The load lock chamber, as a relay point for substrate transport, has the ability to frequently switch between a vacuum state and an atmospheric pressure state. When the equipment front-end module transfers the substrate into or out of the load lock chamber, the load lock chamber needs to switch to an atmospheric pressure state; when the transfer chamber transfers the substrate into or out of the load lock chamber, the load lock chamber needs to switch to a vacuum state; that is, the load lock chamber is equipped with an intake hole and an exhaust hole to support switching between a vacuum state and an atmospheric pressure state.

[0032] In the related art, the intake and exhaust holes of the load-lock chamber are mainly used to change the atmospheric pressure environment in the load-lock chamber, and have little cleaning effect on the inside of the load-lock chamber. The inventors of the present application have deeply investigated the cause and found that in the related art, the intake and exhaust holes of the load-lock chamber are both arranged on two opposing sides of the load-lock chamber, and the number of the intake and exhaust holes is one to two. When a large amount of gas is introduced into the load-lock chamber, the intake hole of the load-lock chamber is easily formed in the load-lock chamber because it directly communicates with the inside of the load-lock chamber. When the vortex airflow flows into the exhaust hole, the airflow distribution is locally concentrated and cannot effectively contact the inner wall of each part of the load-lock chamber, so the removal effect on the fine particles and dust attached to some of the inner walls of the load-lock chamber is limited, so the load-lock chamber needs to be periodically disassembled and cleaned, which leads to the above technical problem.

[0033] In response to the above technical problems, the inventors of the present application have provided a load lock chamber that improves the uniformity of the airflow distribution within the load lock chamber by changing the flow state of the airflow within the load lock chamber, further improves the uniform contact effect between the airflow and the inner wall of the load lock chamber, improves the cleaning effect of the airflow on the inner wall of the load lock chamber, effectively reduces the frequency of disassembly and cleaning of the load lock chamber, saving effort, and improves the cleanliness of the inner wall of the load lock chamber during maintenance periods, thereby providing a load lock chamber that is advantageous for improving the yield rate of substrates. The load lock chamber according to the embodiment of the present invention will be described in detail below.

[0034] 1 to 5 are schematic configuration diagrams of a load lock chamber according to some embodiments of the present application.

[0035] As shown in FIGS. 1, 2, 3, and 4, a load lock chamber 100 according to some embodiments of the present application includes a chamber body 10. The chamber body 10 has at least one load lock chamber Q1 configured therein, and has an intake section I and an exhaust section O communicating with each load lock chamber Q1. The chamber body 10 has at least one distribution section 10a. Each distribution section 10a is disposed corresponding to one load lock chamber Q1. Each distribution section 10a includes a plurality of distribution holes k1 that are independently provided. Each distribution hole k1 communicates between the intake section I and the corresponding load lock chamber Q1, and distributes the air flow in the corresponding load lock chamber Q1.

[0036] The number of the load lock chambers Q1 may be one or more. When a plurality of load lock chambers Q1 are arranged, one intake section I and one exhaust section O may be arranged corresponding to all the load lock chambers Q1, that is, all the load lock chambers Q1 share one intake section I and one exhaust section O, or one intake section I and one exhaust section O may be arranged independently corresponding to each load lock chamber Q1, that is, one intake section I and one exhaust section O are arranged in each load lock chamber Q1, and the plurality of intake sections I are independent from each other, and the plurality of exhaust sections O are independent from each other. Each intake section I may include one or more intake holes, and each exhaust section O may include one or more exhaust holes. An air supply device is connected to the intake section I, and an exhaust device is connected to the exhaust section O. The air supply device may supply nitrogen gas, an inert gas, or the like. The exhaust device may include a vacuum pump. In practical application, in order to reduce the air intake equipment and the exhaust equipment, each intake section I and each exhaust section O respectively includes one intake hole and one exhaust hole.

[0037] The dispersion portion 10a may be integrally molded with the chamber body 10 as part of the chamber body 10, or may be fixed to the chamber body 10, and the fixing method may be a conventional installation in this field (e.g., tightening connection, welding, etc.), and the description thereof will be omitted here.

[0038] Each load lock chamber Q1 is provided with a corresponding dispersion section 10a to disperse the airflow entering the load lock chamber Q1. Specifically, the dispersion section 10a includes a plurality of dispersion holes k1. Each dispersion hole k1 is provided independently of the others, that is, the gas can pass through each dispersion hole k1 of the same dispersion section 10a at the same time during the flow of the gas and then enter the same load lock chamber Q1. The cross-sectional shape of each dispersion hole k1 may be a circle, a square, a polygon, or other shape, and the present application is not limited thereto.

[0039] In each load-lock chamber Q1, the airflow enters the intake section I, passes through the corresponding distribution section 10a, and is dispersed by each distribution hole k1 of the distribution section 10a into a number of small airflows. In the dispersion process, the kinetic energy of the airflow is lost, the speed of the airflow decreases, and finally, the airflow uniformly enters the load-lock chamber Q1.

[0040] Compared with the prior art, the distribution holes k1 of each distribution part 10a of each load lock chamber Q1 can distribute the airflow and reduce the airflow speed, effectively avoiding the airflow from concentrating to become a vortex airflow, making the gas distribution in the load lock chamber Q1 more uniform, greatly increasing the probability of contact between the airflow and the inner wall of the load lock chamber Q1, improving the effect of removing fine particles and dust attached to the inner wall of the load lock chamber Q1 by the airflow, extending the maintenance cycle of the load lock chamber 100, reducing maintenance costs, and contributing to improving the yield rate of the substrates 500. The provision of the distribution parts 10a can reduce the actual weight of the load lock chamber 100, contributing to reducing the weight of the entire chamber, and is more advantageous for manual transportation and assembly.

[0041] 4, the load lock chamber 100 is for loading a substrate 500. In the height direction of the chamber body 10, at least one dispersion part 10a is located above the substrate 500 in the corresponding load lock chamber Q1, and the outlets of the dispersion holes k1 are all formed toward the side where the substrate 500 is located.

[0042] Each load lock chamber Q1 may be provided with a support seat 20. The support seat 20 supports the substrate 500 loaded in the load lock chamber Q1. The structural form of the support seat 20 is not limited, and may be, for example, a plurality of support columns provided in the load lock chamber Q1.

[0043] When the load lock chamber 100 is in use, the height direction of the chamber body 10 is parallel to the direction of gravity. When the substrate 500 is supported by the support seat 20, the substrate 500 is located between the distribution portion 10a and the support seat 20 in the height direction.

[0044] In the embodiment shown in Figures 1, 2 and 3, the load lock chamber 100 has a substantially rectangular parallelepiped structure, the first direction X is the width direction of the load lock chamber 100, the second direction Y is the length direction of the load lock chamber 100, and the third direction Z is the height direction of the load lock chamber 100.

[0045] The outlet of the dispersion hole k1 is formed toward the side where the substrate 500 is located, and the gas flowing out from the outlet of the dispersion hole k1 flows toward the side where the substrate 500 is located. At this time, since the airflow speed is small, when the airflow passes through the substrate 500 below the dispersion section 10a, it can remove fine particles and dust that have fallen onto the substrate 500, improve the cleanliness of the substrate 500, reduce the probability that the substrate 500 is corroded by fine particles and dust, and further improve the yield rate of the substrate 500.

[0046] In addition, the distribution unit 10a can be disposed above the substrate 500 in the load lock chamber 100 and face the substrate 500 on the support seat 20, so that the airflow dispersed by the distribution unit 10a can effectively cover most of the substrate 500, and the cleaning effect on the substrate 500 is better.

[0047] In other embodiments, each of the dispersion units 10a may be disposed at other positions of each of the load lock chambers Q1. For example, the dispersion unit 10a is disposed on the inner wall of the load lock chamber Q1 in the width direction or the length direction. Since the dispersion unit 10a has a plurality of dispersion holes k1, and the dispersion holes k1 can disperse and reduce the speed of the airflow blown out intensively from the intake unit I, the uniformity of the airflow distribution in the load lock chamber Q1 can be improved regardless of the position of the dispersion unit 10a on the support seat 20, and the contact probability between the airflow and the inner wall of the load lock chamber Q1 can be improved, thereby improving the degree of cleaning of the inside of the load lock chamber Q1. In the embodiments of the present application, the arrangement of the dispersion unit 10a is not specifically limited.

[0048] 4, in the height direction of the chamber body 10, the orthogonal projection of at least one dispersion unit 10a onto the XY plane covers the orthogonal projection of the substrate 500 in the corresponding load lock chamber Q1 onto the XY plane. When the dispersion unit 10a is located above the support seat 20 and the orthogonal projection onto the substrate 500 covers the substrate 500, the arrangement area of ​​the dispersion unit 10a on the plane perpendicular to the height direction (i.e., the XY plane) is large, and the airflow can be sent to most of the space of the load lock chamber Q1, increasing the probability of contact between the airflow and the inner wall of the load lock chamber Q1, which contributes to improving the cleaning effect on the inner wall of the load lock chamber Q1.

[0049] In some embodiments, as shown in Fig. 4, the dispersion section 10a corresponding to at least one load lock chamber Q1 is arranged in at least two layers, all the dispersion sections 10a are arranged at intervals along the airflow path, and the projections of the dispersion holes k1 of at least two dispersion sections 10a onto a plane perpendicular to the spacing direction are arranged to be offset from each other. As can be seen from Fig. 4, at least two dispersion sections 10a are arranged at intervals in the Z direction, and the projections of the dispersion holes k1 of two adjacent dispersion sections 10a onto the XY plane do not overlap.

[0050] The airflow path is a path through which gas flows from the intake section I to the load lock chamber Q1. When each distribution section 10a is spaced apart along the airflow path, the gas can flow through each distribution section 10a in sequence.

[0051] The spacing direction is the spacing direction of each dispersion part 10a. In a plane (defined as a reference plane) perpendicular to the spacing direction, the dispersion holes k1 of at least two dispersion parts 10a (specifically, the first dispersion part a1) are arranged to be shifted from each other, that is, the projections of the dispersion holes k1 of at least two dispersion parts 10a onto the reference plane do not intersect with each other. Specifically, the dispersion holes k1 of two adjacent dispersion parts 10a may be arranged to be shifted from each other on a reference plane perpendicular to the spacing direction, and the dispersion holes k1 of two dispersion parts 10a separated in the spacing direction by a certain dispersion part 10a may be arranged to be shifted from each other on a reference plane perpendicular to the spacing direction.

[0052] When the airflow passes through the staggered dispersion holes k1 in the multi-layer dispersion section 10a, it can be dispersed multiple times to consume kinetic energy. In this way, the airflow flowing into the load lock chamber Q1 can be more dispersed and made uniform, and the flow velocity is slower, so that the airflow will not collide with the substrate 500 and damage it due to being too fast, which contributes to improving the yield rate of the substrate 500.

[0053] 5, a return air chamber Q3 and a return air hole k2 are formed inside the chamber body 10. The return air chamber Q3 is connected to the exhaust section O. A plurality of return air holes k2 are provided corresponding to each of the load lock chambers Q1. Each return air hole k2 of the same load lock chamber Q1 is provided independently and is connected to the return air chamber Q3 and the load lock chamber Q1.

[0054] The return air holes k2 are provided in the inner wall of each load lock chamber Q1, and each load lock chamber Q1 is provided with multiple return air holes k2. Each return air hole k2 is connected to the return air chamber Q3, and the gas in the load lock chamber Q1 enters the return air chamber Q3 through each return air hole k2 and is then exhausted to the outside of the chamber body 10 through the return air chamber Q3 and the exhaust section O.

[0055] One return air chamber Q3 may be arranged corresponding to one load lock chamber Q1, and gas in each load lock chamber Q1 enters the corresponding return air chamber Q3 through the return air hole k2 therein, and is then exhausted to the outside of the chamber body 10 through the exhaust part O. One return air chamber Q3 may be arranged corresponding to multiple load lock chambers Q1, and gas in multiple load lock chambers Q1 enters the same return air chamber Q3 through each return air hole k2, and is then exhausted to the outside of the chamber body 10 through the exhaust part O.

[0056] In this case, the gas in each load-lock chamber Q1 can be dispersed through each return air hole k2 to enter the return air chamber Q3 and then flow to the exhaust part O. Compared with the technical means of exhausting through one exhaust hole in the prior art, in this application, when the gas flows out of the load-lock chamber Q1, it does not concentrate in one place but is dispersed and flows out from multiple places of the load-lock chamber Q1, which improves the effect of uniform distribution of the airflow in the load-lock chamber Q1 and further improves the cleaning effect of the inner wall of the load-lock chamber Q1. At the same time, the provision of the return air chamber Q3 also contributes to reducing the weight of the load-lock chamber 100.

[0057] In a specific embodiment, the distribution unit 10a and the return air hole k2 corresponding to each load lock chamber Q1 are arranged on opposite sides of the load lock chamber Q1. Specifically, the distribution unit 10a and the return air hole k2 may be arranged on both sides in the height direction of the load lock chamber Q1, or on both sides in the width direction (or length direction) of the load lock chamber Q1, and are not particularly limited.

[0058] The distribution section 10a and the return air hole k2 are arranged opposite each other, and when gas flows out from each distribution hole k1 of the distribution section 10a, it basically flows along a straight path to each return air hole k2, the airflow bends less within the load lock chamber Q1, and can pass through most of the areas located within the spatial ranges on both sides, the cleaning range is large, and the cleaning effect for the load lock chamber Q1 can be improved.

[0059] 4, the chamber body 10 includes a top cover 11 and a side plate 12. The top cover 11 is placed over the side plate 12, and both of them define at least one load lock chamber Q1. The top cover 11 is provided with an intake section I, and the distribution section 10a is provided in the top cover 11.

[0060] The top lid 11 is placed over the side plate 12 in the height direction of the chamber body 10. The top lid 11 and the side plate 12 define at least one load lock chamber Q1. When the top lid 11 and the side plate 12 define multiple load lock chambers Q1, the multiple load lock chambers Q1 are arranged adjacent to each other in the width direction and / or length direction of the chamber body 10. The top lid 11 and the side plate 12 defining the load lock chamber Q1 means that the top lid 11 and the side plate 12 form at least a part of the inner wall of the load lock chamber Q1.

[0061] The intake section I provided on the top lid 11 is the first intake section I1, which is located above the load lock chamber Q1 with which it communicates. In other words, the load lock chamber Q1 draws in air from above. In this case, the intake path is short and the intake speed is fast.

[0062] A gas uniformization space W is formed between the distribution section 10a and the upper cover 11. The gas entering from the intake section I first enters the gas uniformization space W, flows and diffuses within the gas uniformization space W, and then flows into the load lock chamber Q1 through each distribution hole k1 in the distribution section 10a that communicates with the gas uniformization space W.

[0063] In this case, the airflow entering the load lock chamber Q1 through the intake section I in the top lid 11 flows from top to bottom (i.e., flows along the direction indicated by the arrow inside the chamber body 10 shown in Figure 4), and can effectively clean the substrate 500 on the support seat 20.

[0064] In a further embodiment, as shown in Figures 3 and 4, the chamber body 10 further includes a base 13. The base 13 is provided below the side plate 12, and the top cover 11, the side plate 12, and the base 13 together form an internal space of the chamber body 10. The base 13 and the side plate 12 may be integrally molded, or may be provided separately and fixedly connected. The top cover 11, the base 13, and the side plate 12 are sealed and connected.

[0065] In some embodiments, as shown in FIG. 4, the chamber body 10 includes an intake chamber Q2 communicating with the intake section I, and at least one distribution section 10a separates the intake chamber Q2 from the corresponding load lock chamber Q1, and a distribution hole k1 thereon communicates the intake chamber Q2 with the load lock chamber Q1.

[0066] The intake chamber Q2 is a space formed in the chamber body 10, and communicates with at least one intake section I, and communicates with a corresponding load lock chamber Q1 via at least one dispersion section 10a. One intake chamber Q2 and one intake section I may be provided corresponding to one load lock chamber Q1, and one intake chamber Q2 and one intake section I may be provided corresponding to multiple load lock chambers Q1, that is, multiple load lock chambers Q1 share one intake chamber Q2 and one intake section I. The installation manner of the intake chamber Q2, the intake section I, and the load lock chamber Q1 is not limited to the embodiments of the present application.

[0067] The partition 14 separates the intake chamber Q2 from the corresponding load lock chamber Q1. In this case, the partition 14 may be an integrally molded part of the chamber body 10, and is enclosed together with other parts of the chamber body 10 to form the intake chamber Q2.

[0068] In this case, the gas entering through the intake part I first passes through the intake chamber Q2, and then is dispersed through the dispersion hole k1 on the partition part 14 and enters the load lock chamber Q1. The arrangement position of the intake part I can be flexibly set.

[0069] 4 and 5, the chamber body 10 includes at least one partition 14. All the partitions 14 divide the internal space of the chamber body 10 into a plurality of load lock chambers Q1 that are independent of each other. At least one partition 14 is configured with an intake chamber Q2 and a distribution section 10a that communicate with at least one load lock chamber Q1 formed by partitioning the at least one partition 14.

[0070] The partitions 14 may be integrally formed with the chamber body 10, or may be fixedly connected to the chamber body 10, as long as the load-lock chambers Q1 can be independent of each other. The multiple partitions 14 may be arranged at intervals along the height direction of the chamber body 10, or may be arranged at intervals along the width direction or length direction of the chamber body 10, and are not particularly limited.

[0071] At least one partition section 14 has an intake chamber Q2 and a distribution section 10a (specifically, a second distribution section a2), that is, the partition section 14, as a gas flow mediator, transports gas to the load lock chamber Q1 that is formed by partitioning it itself. Note that the distribution section 10a provided in the partition section 14 may be integrally formed with other parts of the partition section 14 or may be provided separately and fixedly, and is not specifically limited.

[0072] In this case, the partition 14 divides the internal space of the chamber body 10 into multiple load lock chambers Q1, improving the relay capability of the load lock chamber 100 and contributing to improved production efficiency of the semiconductor device 1000 in which the load lock chamber 100 is disposed. At the same time, the intake chamber Q2 contributes to reducing the weight of the entire load lock chamber 100.

[0073] In a further embodiment, as shown in FIG. 4, all the load lock chambers Q1 are arranged in sequence along the height direction of the chamber body 10, and the intake section I communicating with the intake chamber Q2 is located on the side of the chamber body 10.

[0074] The load lock chamber Q1 is provided adjacent to the chamber body 10 in the height direction, and the partition 14 extends along the length or width direction of the chamber body 10. When the partition 14 has an intake chamber Q2 and the intake part I is located on the side of the chamber body 10, the distance between the intake part I and the intake chamber Q2 is short, so that the gas inflow distance from the intake part I to the intake chamber Q2 can be shortened and the gas can be transported to the load lock chamber Q1 quickly.

[0075] In some embodiments, each load lock chamber Q1 is connected to an intake section I and an exhaust section O in a one-to-one correspondence. That is, one load lock chamber Q1 is connected to one intake section I and one exhaust section O. This allows each corresponding load lock chamber Q1 to independently inhale and exhaust air, providing different air pressure conditions. In practice, a part of the load lock chamber Q1 is in a vacuum state for the transfer chamber 300 to load and unload the substrate 500, and another part of the load lock chamber Q1 is in an atmospheric pressure state for the equipment front-end module 200 to load and unload the substrate 500, thereby improving the transfer efficiency of the substrate 500 and improving the processing efficiency of the substrate 500.

[0076] When both the intake chamber Q2 and the return air chamber Q3 are present in one partition 14, the two chambers are independent. The intake chamber Q2 and the return air chamber Q3 of the same partition 14 may be arranged hierarchically above and below, the return air chamber Q3 may be arranged around the intake chamber Q2, the intake chamber Q2 may be provided around the return air chamber Q3, or the intake chamber Q2 and the return air chamber Q3 may be arranged with an interval between them on the left and right, and are not specifically limited.

[0077] The chamber body 10 is provided with a first access port and a second access port communicating with the load lock chamber Q1. The first access port is used by the equipment front-end module 200 to load and unload the substrate 500 into and from the load lock chamber Q1, and the second access port is used by the transfer chamber 300 to load and unload the substrate 500 into and from the load lock chamber Q1. The transfer chamber 300 and the equipment front-end module 200 are each provided with a mechanism for transporting the corresponding substrate 500, such as a manipulator. The specific structures of the transfer chamber 300 and the equipment front-end module 200 are not limited to the embodiments of the present application and can be provided with reference to conventional equipment structures. When there are multiple load lock chambers Q1, each load lock chamber Q1 is provided with a first access port and a second access port. When the equipment front-end module 200 and the transfer chamber 300 finish transporting the substrate 500, the first and second loading / unloading ports are closed, which facilitates forming and filling a vacuum in the load-lock chamber Q1 and prevents foreign matter such as external particles and dust from entering the load-lock chamber Q1.

[0078] In order to help those skilled in the art to have a deeper understanding of the technical concept of the present application, a load lock chamber 100 according to an embodiment of the present application will be described below.

[0079] In one embodiment, as shown in FIG. 4 and FIG. 5, the load lock chamber 100 includes a chamber body 10 and a support seat 20. The chamber body 10 includes a top cover 11, a side plate 12, a base 13, and a partition 14. The top cover 11, the side plate 12, and the base 13 are connected in sequence along the height direction of the chamber body 10 and together surround the chamber body 10 to form an internal space of the chamber body 10. The partition 14 is provided in the chamber body 10 and divides the internal space of the chamber body 10 into a plurality of load lock chambers Q1 that are arranged in sequence in the height direction and are independent of each other, and a support seat 20 is provided in each load lock chamber Q1. The top cover 11 has a first intake part I1 that communicates with the uppermost load lock chamber Q1. The side plate 12 has a plurality of second intake parts I2, and each second intake part I2 communicates with the other load lock chambers Q1 other than the uppermost load lock chamber Q1 in a one-to-one correspondence. The exhaust part O communicating with the uppermost load lock chamber Q1 is the first exhaust part O1, and the exhaust parts O communicating with the other load lock chambers Q1 in one-to-one correspondence are the second exhaust parts O2. The first exhaust part O1 and the second exhaust part O2 are both disposed on the side plate 12.

[0080] The distribution section 10a includes a first distribution section a1 and a second distribution section a2. The first distribution section a1 is disposed in the uppermost load lock chamber Q1 and is connected to the upper cover 11. A plurality of distribution holes k1 provided thereon distribute and discharge the airflow in the first intake section I1 to each location in the load lock chamber Q1. The second distribution section a2 is formed in the partition section 14 that defines the upper inner wall of the other load lock chamber Q1. An intake chamber Q2 is formed in the partition section 14. The intake chamber Q2 of each partition section 14 communicates with the load lock chamber Q1 and the second intake section I2 via the distribution holes k1 of the distribution section 10a of each partition section 14.

[0081] At the same time, a plurality of return air holes k2 are formed in the bottom of each load lock chamber Q1, and a return air chamber Q3 is formed in a portion defining the bottom inner wall of each load lock chamber Q1 (e.g., the partition portion 14 or the bottom plate), and the return air chamber Q3 is connected in one-to-one correspondence to each exhaust portion O.

[0082] In this embodiment, the air currents entering each load-lock chamber Q1 from each intake section I can flow from top to bottom, providing a good cleaning effect on the inner walls of each load-lock chamber Q1 and the substrates 500. At the same time, the provision of the return air chamber Q3, the intake chamber Q2, and the dispersion section 10a contributes to reducing the weight of the load-lock chamber 100, making it easier to transport and install / remove the load-lock chamber 100.

[0083] In addition, the embodiment of the present application further provides a semiconductor device 1000 including the load lock chamber 100 described in any of the above embodiments. The semiconductor device 1000 has all the beneficial effects of the load lock chamber 100 described above, so a description thereof will be omitted here.

[0084] 6, the semiconductor device 1000 may further include an equipment front-end module 200, a transfer chamber 300, and a reaction chamber 400. The load lock chamber 100 is located between the equipment front-end module 200 and the transfer chamber 300. The transfer chamber 300 is located between the reaction chamber 400 and the load lock chamber 100. The reaction chamber 400 is used to process (e.g., coat, etch, etc.) the substrate 500. The transfer chamber 300 is for transporting the substrate 500 between the load lock chamber 100 and the reaction chamber 400. The equipment front-end module 200 is for taking out the substrate 500 from the load lock chamber 100. The specific structures of the equipment front-end module 200, the transfer chamber 300, and the reaction chamber 400 are not limited in the embodiments of the present application and can be understood with reference to conventional structures.

[0085] In addition, the present embodiment further includes a step S10 of opening an intake section I and an exhaust section O of a chamber body 10 of a load lock chamber 100, the chamber body 10 having a load lock chamber Q1 and a distribution section 10a, the intake section I and the exhaust section O both communicating with the load lock chamber Q1, each distribution section 10a being disposed corresponding to one load lock chamber Q1, each distribution section 10a including a plurality of independent distribution holes k1, each distribution hole k1 communicating between the intake section I and the corresponding load lock chamber Q1; and a step S20 of introducing a cleaning gas into the intake section I until a preset condition is satisfied.

[0086] The structure of the load lock chamber 100 can be referred to in the above embodiment, and the description will be omitted here. In step S10, when the load lock chamber 100 needs to be cleaned, the intake section I and the exhaust section O are opened. Specifically, an on-off valve is provided at the inlet of the intake section I and the outlet of the exhaust section O, respectively, and the intake section and the exhaust section can be opened and closed by controlling the opening and closing of the on-off valve. Alternatively, an intake pump is provided at the intake section I, an exhaust pump is provided at the exhaust section O, the intake pump is started to open the intake section I, and the exhaust pump is started to open the exhaust section O.

[0087] In step S20, the intake section I may be connected to a gas storage tank via an intake pump, and cleaning gas may be stored in the gas storage tank, and the cleaning gas may be nitrogen gas, inert gas, etc. When it is necessary to introduce cleaning gas into the intake section I, the intake pump is started, and the cleaning gas is transported from the gas storage tank through the intake section to the dispersion section, then enters the load lock chamber Q1 through the dispersion section, and finally flows out of the load lock chamber Q1 through the exhaust section O.

[0088] The preset condition may be that the time for introducing the cleaning gas reaches a preset value, and when the preset cleaning time is reached, cleaning is completed by default. Of course, a gas sampling device may be provided in the exhaust section O, and the gas sampling device may detect whether the cleanliness of the gas flowing out of the exhaust section reaches the preset condition to determine whether cleaning is completed.

[0089] Specifically, step S10 may be performed before or after the equipment front-end module 200 places the substrate 500 into the load lock chamber Q1, or may be performed after the equipment front-end module 200 removes the substrate 500 from the load lock chamber Q1, and is not specifically limited, and step S10 may be performed if cleaning is required.

[0090] The load lock chamber and cleaning method thereof, and semiconductor device according to the present application can effectively solve the problem in the conventional load lock chamber cleaning method that it is time-consuming and disadvantageous in improving the yield rate of substrates.

[0091] According to the load lock chamber and cleaning method thereof, and the semiconductor device of the present application, the airflow can be dispersed by the dispersion holes of the dispersion parts of each load lock chamber, and the speed of the airflow can be reduced, effectively preventing the airflow from concentrating and becoming a vortex airflow, making the gas distribution in the load lock chamber more uniform, greatly increasing the probability of contact between the airflow and the inner wall of the load lock chamber, improving the effect of removing fine particles and dust attached to the inner wall of the load lock chamber by the airflow, extending the maintenance cycle of the load lock chamber, reducing maintenance costs, and contributing to improving the yield rate of substrates. At the same time, the weight of the load lock chamber can be reduced by providing the dispersion parts, which contributes to reducing the weight of the entire chamber and is more convenient for manual transportation and assembly.

[0092] Furthermore, the load lock chamber and cleaning method thereof, and the semiconductor device according to the present application configured as described above further have a rapid cooling function.

[0093] The technical features of the above-described embodiments may be combined in any combination. For the sake of brevity, not all possible combinations of the technical features of the above-described embodiments are described, but all such combinations should be considered to fall within the scope described in this specification unless there is a contradiction.

[0094] The above examples only describe some embodiments of the present application, and although the descriptions are specific and detailed, they should not be construed as limiting the scope of the patent of the present application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements belong to the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be based on the scope of the attached claims. [Explanation of symbols]

[0095] 1000 semiconductor device, 100 load lock chamber, 10 chamber body, 11 top cover, 12 side plate, Q1 load lock chamber, Q2 intake chamber, Q3 return chamber, I intake section, I1 first intake section, I2 second intake section, O exhaust section, O1 first exhaust section, O2 second exhaust section, k2 return hole, 10a distribution section, a1 first distribution section, a2 second distribution section, k1 distribution hole, W gas homogenization space, 13 base, 14 partition section, 20 support seat, X first direction, Y second direction, Z third direction, 200 equipment front end module, 300 transfer chamber, 400 reaction chamber, 500 substrate.

Claims

1. a chamber body having at least one load lock chamber formed therein and having an intake section and an exhaust section communicating with each of the load lock chambers; a chamber body having at least one distribution section, each of the distribution sections being arranged corresponding to one of the load lock chambers, each of the distribution sections including a plurality of independent distribution holes, each of the distribution holes connecting the intake section to the corresponding load lock chamber and configured to distribute an airflow entering the corresponding load lock chamber.

2. the load lock chamber for loading a substrate; 2. The load lock chamber of claim 1, wherein in the height direction of the chamber body, at least one of the dispersion sections is located above the substrate in the corresponding load lock chamber, and the outlets of the dispersion holes of the at least one of the dispersion sections are all formed toward the side where the substrate is located.

3. 3. The load lock chamber of claim 2, wherein in a plane perpendicular to a height direction of the chamber body, an orthogonal projection of at least one of the dispersion portions covers an orthogonal projection of the substrate in the corresponding load lock chamber.

4. The distribution section corresponding to at least one of the load lock chambers is arranged in at least two layers, 2. The load lock chamber of claim 1, wherein the at least two layers of dispersion sections are spaced apart along the airflow path, and projections of the at least two layers of dispersion sections onto a plane perpendicular to the spacing direction of the dispersion holes are offset from each other.

5. 5. The load lock chamber according to claim 1, wherein an air return chamber and an air return hole are defined inside the chamber body, the air return chamber being connected to the exhaust section, and each of the load lock chambers is provided with a corresponding one of the air return holes, and the air return holes of the same load lock chamber are provided independently and are connected to the air return chamber and the load lock chamber, respectively.

6. The load lock chamber of claim 5 , wherein the dispersion section and the return hole corresponding to each load lock chamber are disposed on opposite sides of the load lock chamber.

7. 5. The load lock chamber according to claim 1, wherein the chamber body includes a top lid and a side plate, the top lid being placed over the side plate and both of which define at least one of the load lock chambers, the intake section being provided on the top lid, and the at least one dispersion section being provided on the top lid.

8. 5. The load lock chamber according to claim 1, further comprising: an intake chamber in communication with the intake section within the chamber body; at least one of the distribution sections separates the intake chamber from the corresponding load lock chamber; and the distribution hole in at least one of the distribution sections connects the intake chamber to the load lock chamber.

9. the chamber body includes at least one partition, the at least one partition partitioning an internal space of the chamber body to form a plurality of the load lock chambers independent of each other; 9. The load lock chamber according to claim 8, wherein at least one of the partition sections is configured with the intake chamber and the dispersion section communicating with at least one of the load lock chambers formed by being partitioned by the partition section itself.

10. 10. The load lock chamber of claim 9, wherein the load lock chambers are arranged in sequence along a height direction of the chamber body, and the intake section communicating with the intake chamber is located on a side surface of the chamber body.

11. 5. The load lock chamber according to claim 1, wherein each of the at least one load lock chambers is connected to one of the intake parts and one of the exhaust parts.

12. 8. The load lock chamber of claim 7, wherein a gas uniformization space is formed between the at least one dispersion part and the upper cover, and the gas entering from the intake part flows through the gas uniformization space and is diffused.

13. 9. The load lock chamber according to claim 8, wherein a plurality of the load lock chambers are provided, the plurality of the load lock chambers being independent of one another and sharing one of the intake chambers and one of the intake sections.

14. 9. The load lock chamber according to claim 8, wherein a plurality of the load lock chambers are provided, the plurality of the load lock chambers are independent of each other, and each of the plurality of the load lock chambers is provided with one of the intake chambers and one of the intake parts.

15. A semiconductor device comprising the load lock chamber according to any one of claims 1 to 14.

16. a step of opening an intake section and an exhaust section of a chamber body of the load lock chamber, the chamber body having a load lock chamber and a distribution section, the intake section and the exhaust section both communicating with the load lock chamber, each of the distribution sections being arranged corresponding to one of the load lock chambers, and each of the distribution sections including a plurality of distribution holes provided independently, each of the distribution holes communicating between the intake section and a corresponding one of the load lock chambers; and introducing a cleaning gas into the intake section until a preset condition is satisfied.

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