Systems and methods for improving vacuum in compact packages - Patents.com

Abstract

Aspects of the present disclosure relate generally to systems and methods for use in implementing and / or operating a quantum information processing (QIP) system, and more particularly to methods and systems for improving vacuum in a compact room temperature package. An exemplary method for preparing a vacuum chamber for a QIP system includes inserting a lid having a shadow mask over an optical window into a process vacuum chamber, coating the inside of the lid with a getter material, removing the shadow mask from the optical window, providing an ion trap package in the process vacuum chamber, and welding the lid to the top of the ion trap package to prepare the vacuum chamber.

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims priority to U.S. Provisional Patent Application No. 63 / 321,475, filed March 18, 2022, the entire contents of which are incorporated herein by reference.

[0002] Aspects of the present disclosure generally relate to systems and methods for use in implementing and / or operating quantum information processing (QIP) systems. [Background technology]

[0003] Trapped atoms are one of the main implementations of quantum information processing or quantum computing. Atom-based qubits may be used as quantum memories, as quantum gates in quantum computers and simulators, and may function as nodes for quantum communication networks. Qubits based on trapped atomic ions enjoy a rare combination of attributes. For example, qubits based on trapped atomic ions have very good coherence properties, can be prepared and measured with nearly 100% efficiency, and are easily entangled with each other by modulating the Coulomb interaction with a suitable external control field, such as an optical or microwave field. These attributes make atom-based qubits attractive for extended quantum operations, such as quantum computing or quantum simulation.

[0004] Currently, operation of trapped ions is carried out in compact vacuum chambers operating at room temperature. The vacuum level in the vacuum enclosure is estimated using collision rates measured by monitoring the transition of the ion position between two trapping positions connected by a small energy barrier, or by monitoring reordering events in long ion chains. The resulting vacuum level (e.g., about 2 × 10 -11Torr are comparable to those available in conventional ultra-high vacuum (UHV) chambers. However, to reliably operate a large-scale trapped-ion quantum computer, the vacuum level needs to be improved by several orders of magnitude to keep the background collision rate low enough to minimize ion chain rearrangement events and loss of ions from the trap.

[0005] It is therefore important to develop new techniques to improve the design, fabrication, implementation and / or control of different QIP systems used as quantum computers or quantum simulators, in particular for QIP systems that include vacuum chambers operating at room temperature and that handle operations based on atom-based qubits. Summary of the Invention [Problem to be solved by the invention]

[0006] The following presents a simplified summary of one or more aspects to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is not intended to identify key or critical elements of all aspects or to delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0007] This disclosure describes various aspects of methods and systems for improving vacuum in compact, room temperature packages, including the use of such methods and systems in QIP systems. By enabling operation at room temperature, a complete quantum computing system can avoid the use of cryogenic systems, thereby facilitating a compact overall system with lower power requirements that are easier to deploy.

[0008] In an exemplary aspect, a method for preparing a vacuum chamber for a quantum computing system is provided, the method including inserting a lid into a processing vacuum chamber, the lid having a shadow mask over at least one window of the lid, coating an inside of the lid with a getter material, removing the shadow mask from the at least one window, providing an ion trap package in a processing vacuum chamber and welding the lid to the top of the ion trap package to prepare the vacuum chamber.

[0009] Further, in an exemplary aspect, the method may include removing the prepared vacuum chamber from the processing vacuum chamber and connecting the prepared vacuum chamber to a quantum computing system.

[0010] In another exemplary aspect, inserting the lid into the processing vacuum chamber further comprises load locking the processing vacuum chamber without venting.

[0011] In another exemplary aspect, the method may further include the step of surface treating the ion trap package before the lid is welded to the top thereof to reduce abnormal heating.

[0012] In another exemplary aspect, providing the ion trap package further includes mounting the ion trap on a ceramic package to provide the ion trap package outside the processing vacuum chamber, and inserting the ion trap package into the processing vacuum chamber.

[0013] In another exemplary aspect, the method may include sealing a groove in the lid to a ring frame on the ceramic package with a metal sealant.

[0014] In another exemplary aspect, the method may include removing the inert gas molecules from the vacuum chamber with an active ion pump integrated with the lid. Further, removing the inert gas molecules may include ionizing the inert gas molecules and forcing the inert gas molecules into a surface of the lid coated with a getter material.

[0015] In another exemplary aspect, the method may include applying at least one of a magnetic field and an electric field to a surface of the lid coated with the getter material.

[0016] In another exemplary aspect, the method may further include using laser ablation to strike a local plasma to drive inert gas molecules into a surface of the lid coated with the getter material.

[0017] In another exemplary aspect, coating the lid with a getter material includes conditioning an inner surface of the lid to be an adsorbent surface by sublimating the getter material on the inner surface, and may further include activating the getter material to spread over the inner surface of the lid to be an adsorbent surface.

[0018] In another exemplary embodiment, the getter material is at least one of a non-evaporable getter (NEG), titanium (Ti), and barium (Ba).

[0019] In another exemplary aspect, the method may further include configuring the ion trap package to operate quantum computing operations at room temperature by providing the ion trap package to provide a vacuum chamber.

[0020] In another exemplary aspect, the method may include reducing the pressure in the processing vacuum chamber before coating the lid with a getter material.

[0021] In another exemplary aspect, the method further comprises the step of connecting the prepared vacuum chamber to the quantum computing system, configuring the prepared vacuum chamber as a ground connection for the ion trap package.

[0022] In yet an additional exemplary aspect, a quantum information processing (QIP) system is provided that includes an interposer chip, an ion trap mounted on the interposer chip to provide an ion trap package, the ion trap including a plurality of trapped ions, a vacuum chamber having a lid with at least one window, the lid coupled to a top of the ion trap package facing the interposer chip, and a coating material coated on an inner surface of the lid facing the ion trap package.

[0023] To the accomplishment of the foregoing and related ends, the one or more aspects comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative features of the one or more aspects. These features are indicative, however, of only a few of the various ways in which the principles of the various aspects may be employed, and the description is intended to include all such aspects and their equivalents. [Brief description of the drawings]

[0024] The disclosed aspects are described below in conjunction with the accompanying drawings, which are provided to illustrate but not to limit the disclosed aspects, and in which like reference numerals represent like elements.

[0025] [Figure 1] 1 illustrates a diagram of atomic ions in a linear crystal or chain according to an exemplary embodiment of the present disclosure. [Diagram 2] 1 illustrates an example of a quantum information processing (QIP) system according to an exemplary embodiment of the present disclosure. [Diagram 3]1 illustrates an example of a computing device according to an exemplary aspect of the present disclosure. [Figure 4] 1 shows a flow chart for manufacturing a vacuum chamber for a QIP system according to an exemplary embodiment of the present disclosure. [Diagram 5] FIG. 1 shows a block diagram of a vacuum chamber integrated with a portion of a QIP system, according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] The detailed description set forth below in conjunction with the accompanying drawings or figures is intended as a description of various configurations or implementations, and is not intended to represent the only configurations or implementations in which the concepts described herein may be practiced. The detailed description includes specific details to provide a thorough understanding of the various concepts. However, it will be apparent to one of ordinary skill in the art that these concepts may be practiced without these specific details, or with variations of these specific details. In some instances, well-known components are shown in block diagram form, and some blocks may represent one or more well-known components.

[0027] Solutions to the above problems will be described in more detail with respect to Figures 1-5, which provide a general implementation of a QIP system or quantum computer, more specifically an atom-based QIP system or quantum computer. Exemplary systems and methods provide improved vacuum levels for vacuum enclosures used in such QIP systems.

[0028] Generally, FIG. 1, shown below, shows a diagram 100 with a number of atomic ions 106 (e.g., atomic ions 106a, 106b, ..., 106c, and 106d) trapped in a linear crystal or chain 110 using a trap (which may be in a vacuum chamber as shown in FIG. 2). The trap may also be referred to as an ion trap. The illustrated ion trap may be constructed or fabricated on a semiconductor substrate, a dielectric substrate, or a glass die or wafer (also referred to as a glass substrate). The atomic ions 106 may be provided to the trap as atomic species for ionization and confinement in the chain 110.

[0029] In the example shown in FIG. 1, the trap includes electrodes for trapping or confining a number of atomic ions in chains 110 that are laser-cooled to be nearly stationary. The number of trapped atomic ions (N) can be configurable, and more or fewer atomic ions may be trapped. The atomic ions may be, for example, ytterbium ions ( 171 Yb + ions, etc.) Atomic ions are 171 Yb + The atomic ions are illuminated with laser (light) radiation tuned to the resonance of the ytterbium atom, and the fluorescence of the atomic ions is imaged onto a camera or other type of detection device. In this example, the atomic ions may be spaced apart from each other by about 5 microns (μm), but the separation may be less than 5 μm or more than 5 μm. The separation of the atomic ions is determined by a balance between external confinement forces and Coulomb repulsion, and need not be uniform. Furthermore, in addition to ytterbium atomic ions, neutral atoms, Rydberg atoms, different atomic ions, or different species of atomic ions may be used. The trap may be a linear RF power trap, but other types of confinement may be used, including optical confinement. Thus, the confinement device may be based on a variety of technologies, e.g., may hold ions, neutral atoms, or Rydberg atoms, with an ion trap being one example of such a confinement device. The ion trap may be, for example, a surface trap.

[0030] 2, shown below, is a block diagram illustrating an example of a QIP system 200 in accordance with various aspects of the present disclosure. QIP system 200 may also be referred to as a quantum computing system, a quantum computer, a computing device, a trapped ion system, etc. QIP system 200 may be part of a hybrid computing system in which QIP system 200 is used to perform quantum computations and operations, and which also includes a classical computer for performing classical computations and operations.

[0031] As shown in Figure 2, a generic controller 205 is provided and configured to perform various control operations of the QIP system 200. Instructions for the control operations may be stored in a memory (not shown) within the generic controller 205 and may be updated over time via a communication interface (not shown). Although the generic controller 205 is shown separate from the QIP system 200, the generic controller 205 may be integrated with or be part of the QIP system 200. The generic controller 205 may include an automation and calibration controller 280 configured to perform various calibration, testing, and automation operations associated with the QIP system 200.

[0032] QIP system 200 may include an algorithm component 210 that may operate in conjunction with other parts of QIP system 200 to perform quantum algorithms or operations, including stacks or sequences of single qubit and / or multi-qubit (e.g., two qubit) operations and combinatorial extended quantum computations. Thus, algorithm component 210 may provide instructions to various components of QIP system 200 (e.g., optical and trap controller 220) to enable the implementation of quantum algorithms or operations. Algorithm component 210 may receive information resulting from implementing a quantum algorithm or operation, process the information, and / or forward the information to other components of QIP system 200 or other devices for further processing.

[0033] QIP system 200 may include an optics and trap controller 220, which controls various aspects of trap 270 in chamber 250, including generating signals to control trap 270, and controls the operation of a laser and optics that provide a light beam that interacts with atoms or ions in trap 270. Chamber 250 is one example of a vacuum chamber as described herein, having an improved vacuum level to minimize gas collision rates, and which is described in more detail below.

[0034] Trap 270 may be referred to as an ion trap when used to confine or trap ions. However, trap 270 may also be used to trap neutral atoms, Rydberg atoms, different atomic ions, or different species of atomic ions. The laser and optics may be located at least partially within optics and trapping controller 220 and / or within chamber 250. For example, optics within chamber 250 may refer to optical components or optical assemblies.

[0035] The QIP system 200 may include an imaging system 230. The imaging system 230 may include a high resolution imager (e.g., a CCD camera) or other type of detection device (e.g., a photomultiplier tube, or PMT) for monitoring the atomic ions while they are being provided to the trap 270 and / or after they have been provided to the trap 270. In one aspect, the imaging system 230 may be implemented separately from the optics and trap controller 220, although the use of fluorescence to detect, identify, and label atomic ions using image processing algorithms may need to be coordinated with the optics and trap controller 220.

[0036] In addition to the above-mentioned components, QIP system 200 may include a source 260 that provides atomic species (e.g., a plume or flux of neutral atoms) to a chamber 250 having a trap 270. Where atomic ions are the basis of quantum operations, trap 270 confines the ionized (e.g., photoionized) atomic species. Trap 270 may be part of the processor or processing portion of QIP system 200. That is, trap 270 may be considered to be the core of the processing operations of QIP system 200, since it holds the atomic-based qubits that are used to perform quantum operations or simulations. At least a portion of source 260 may be implemented separately from chamber 250.

[0037] It should be understood that the various components of the QIP system 200 described in Figure 2 are depicted at a high level for ease of understanding. Such components may include one or more subcomponents, details of which may be provided below as necessary to better understand certain aspects of the present disclosure.

[0038] Aspects of the present disclosure may be implemented, at least in part, using, for example, a chamber 250 configured as an ultra-high vacuum to enable the QIP system to perform high fidelity gating operations.

[0039] Referring now to FIG. 3 below, an example of a computer system or device 300 according to an aspect of the present disclosure is shown. The computer device 300 can represent, for example, a single computing device, multiple computing devices, or a distributed computing system. The computer device 300 may be configured as a quantum computer (e.g., a QIP system), a classical computer, or to perform a combination of quantum and classical computing functions, sometimes referred to as hybrid functions or operations. For example, the computer device 300 may be used to process information using quantum algorithms, classical computer data processing operations, or a combination of both. In some cases, the results of one set of operations (e.g., a quantum algorithm) are shared with another set of operations (e.g., classical computer data processing). A typical example of a computer device 300 implemented as a QIP system capable of performing quantum computations and simulations is, for example, the QIP system 200 shown in FIG. 2.

[0040] The computing device 300 may include a processor 310 for performing processing functions related to one or more of the functions described herein. The processor 310 may include one or more sets of processors or multi-core processors. Furthermore, the processor 310 may be implemented as an integrated processing system and / or a distributed processing system. The processor 310 may include one or more central processing units (CPUs) 310a, one or more graphics processing units (GPUs) 310b, one or more quantum processing units (QPUs) 310c, one or more intelligence processing units (IPUs) 310d (e.g., artificial intelligence or AI processors), or a combination of some or all of these types of processors. In one aspect, the processor 310 may refer to a general-purpose processor of the computing device 300, and the computing device 300 may also include additional processors 310 for performing further specific functions (e.g., including functions for controlling the operation of the computing device 300).

[0041] The computing device 300 may include a memory 320 for storing instructions executable by the processor 310 to perform operations. The memory 320 may also store data to be processed by the processor 310 and / or data resulting from processing by the processor 310. In one implementation, for example, the memory 320 may correspond to a computer-readable storage medium that stores code or instructions for performing one or more functions or operations. As with the processor 310, the memory 320 may refer to a general-purpose memory of the computing device 300, and the computing device 300 may also include additional memory 320 for storing instructions and / or data for further specific functions.

[0042] It will be appreciated that the processor 310 and memory 320 may be used in connection with various operations of the computing device 300, including, but not limited to, computing, calculation, simulation, control, calibration, system management, and other operations, including methods or processes described herein.

[0043] Additionally, the computing device 300 may include a communications component 330 that utilizes hardware, software, and services to provide for establishing and maintaining communications with one or more entities. The communications component 330 may also be used to communicate between components of the computing device 300 and between the computing device 300 and external devices, such as devices located across a communications network and / or devices serially or locally connected to the computing device 300. For example, the communications component 330 may include one or more buses and may further include transmit and receive chain components associated with transmitters and receivers, respectively, operable to interface with external devices. The communications component 330 may be used to receive updates regarding the operation or functionality of the computing device 300.

[0044] Additionally, computing device 300 may include data store 340, which may be any suitable combination of hardware and / or software that provides mass storage of information, databases, and programs used in connection with the operation of computing device 300 and / or any method or process described herein. For example, data store 340 may be a data repository for operating system 360 (e.g., a classical OS, a quantum OS, or both). In one implementation, data store 340 may include memory 320. In one implementation, processor 310 may execute operating system 360 and / or applications or programs, and memory 320 or data store 340 may store them.

[0045] The computing device 300 may also include a user interface component 350 configured to receive input from a user of the computing device 300 and further configured to generate output for presentation to the user or for provision (directly or indirectly) to a different system. The user interface component 350 may include one or more input devices, including but not limited to a keyboard, a numeric keypad, a mouse, a touch-sensitive display, a digitizer, navigation keys, function keys, a microphone, a voice recognition component, any other mechanism capable of receiving input from a user, or any combination thereof. Additionally, the user interface component 350 may include one or more output devices, including but not limited to a display, a speaker, a haptic feedback mechanism, a printer, any other mechanism capable of presenting output to a user, or any combination thereof. In one implementation, the user interface component 350 may send and / or receive messages corresponding to operations of the operating system 360. When the computing device 300 is implemented as part of a cloud-based infrastructure solution, the user interface component 350 may be used to enable a user of the cloud-based infrastructure solution to remotely interact with the computing device 300.

[0046] As described above, according to an exemplary embodiment, an ultra-high vacuum chamber for an ion trap package is provided. In particular, the inner walls of the enclosure of the vacuum chamber (e.g., lid, package, etc.) are prepared so that the inner walls become adsorption (or gettering) surfaces. For example, the inner walls can be prepared by sublimating a getter material (such as titanium or barium) on the inner surface while maintaining a pure condition until the vacuum chamber is completely sealed. In an exemplary embodiment, this is done by providing a source of such material in the process chamber, spreading the material on the inner walls, and providing a mechanism to "activate" the material. For example, a titanium sublimation pump can be configured such that such a getter material (e.g., titanium or barium) is provided in the enclosure and a mechanism is provided to periodically coat the inner walls, for example, by thermal sublimation or laser ablation.

[0047] 4 shows a flow chart 400 for manufacturing a vacuum chamber for a QIP system according to an exemplary embodiment of the present disclosure. Generally, a processing vacuum chamber is provided, which is larger (in size) than the vacuum chamber for which the vacuum chamber for the QIP system is to be prepared.

[0048] First, in step 405, a lid (configured for the final vacuum chamber) is inserted into the processing vacuum chamber. In this embodiment, the lid includes a shadow mask over one or more windows of the lid. Additionally, the lid may be optionally inserted into the processing vacuum chamber by load locking the lid without venting the processing vacuum chamber. The lid may also include an active ion pump integrated thereon, which may be configured to remove inert gas molecules from the vacuum chamber.

[0049] Next, in step 410, a getter material, such as simple metals like titanium (Ti) and barium (Ba), or a non-evaporable getter ("NEG") material, is applied to the inside wall of the lid (or other component of the vacuum vessel). That is, step 410 involves coating the inside of the lid with a getter material. During this step, a shadow mask is provided and configured to "cover" one or more optical windows while such material deposition (using evaporation, sublimation, ablation, etc.) is performed for the getter material. In an exemplary embodiment, the shadow mask is applied temporarily to the enclosure or is a permanent structure of the enclosure, but such material deposition is performed to ensure this protection. In an exemplary embodiment, the coating of the lid with the getter material effectively activates the getter material to spread on the inner surface of the lid, which becomes the adsorption surface, which then increases the vacuum pressure of the final vacuum chamber for the QIP system. Advantageously, the resulting vacuum chamber is configured as an ultra-high vacuum, enabling the QIP system to perform high fidelity gating operations at room temperature while reducing the collision rate to minimize ion chain rearrangement events and loss of ions from trapping.

[0050] Additionally, the method may include removing the inert gas molecules by ionizing the inert gas molecules and forcing the inert gas molecules into the inner surface of the lid coated with the getter material. Optionally, the method may also include applying at least one of a magnetic field and an electric field to the surface of the lid coated with the getter material (e.g., using an ion pump or an external component of the QIP system). Alternatively, or in addition, the method may include irradiating a local plasma using laser ablation (e.g., using the laser and optical system described above in connection with Figures 2 and 3) to force the inert gas molecules into the inner surface of the lid coated with the getter material.

[0051] In step 415, the one or more shadow masks may be removed from the one or more optical windows (assuming they are not permanent structures). The ion trap package may then be inserted into a processing vacuum chamber and a lid may be welded to the top of the ion trap package to prepare the vacuum chamber in step 420. In this regard, the ion trap package may be formed by mounting the ion trap on a ceramic package outside the processing vacuum chamber. The ion trap package is then inserted into the processing vacuum chamber. In an optional aspect, the method may further include surface treating the ion trap package before the lid is welded (or soldered or brazed) to the top of it to reduce abnormal heating as described.

[0052] In an exemplary embodiment, the lid may include a groove, and the lid may be attached to the ceramic package of the ion trap package by sealing (e.g., hermetically sealing) the groove in the lid to a ring frame on the ceramic package using a metal sealant (e.g., indium). The metal sealant in the groove creates a vacuum seal between the lid and the ion trap package in an ultra-high vacuum environment achieved by a larger processing vacuum chamber (i.e., vacuum assembly chamber) configured to seal the vacuum enclosure using thermal compression of the metal sealant in the groove that matches the ring frame. An active ion pump integrated with the lid (as described above) is used to remove inert gas molecules (such as He) from the chamber volume.

[0053] Finally, in step 425, the prepared vacuum chamber can be removed from the processing vacuum chamber and connected to a quantum computing system, for example, as an implementation of vacuum chamber 250 as described above with respect to Figure 2. Additionally, the prepared vacuum chamber can be configured as a ground connection for the ion trap package when installed as part of a larger QIP system.

[0054] Importantly, it is provided to improve vacuum enclosure performance. In an exemplary embodiment, to reduce outgassing from the interior surfaces of the vacuum chamber, materials with low outgassing surfaces such as titanium, ceramic materials such as aluminum oxide (single crystal form of sapphire), aluminum nitride, etc. can be used. These materials are designed to prevent molecules from penetrating through them, and in many cases (such as titanium), the surface is actually a getter material, which means that gas molecules are adsorbed to the surface.

[0055] Additionally, to reduce transmission of small gas molecules, one or more of the optical windows can, in an exemplary aspect, use low transmission glass or single crystal materials.

[0056] In an exemplary embodiment, the above-mentioned components can be fired at high temperatures in an ultra-high vacuum environment without damaging or cracking the welded or brazed seal between the optical window and the metal lid. This is accommodated by providing strain relief structures at the window-lid interface designed to withstand the thermal stresses associated with ramping up to the maximum bake temperature and ramping down to the package's operating temperature. It should be understood that the use of special materials such as NEG materials in the enclosure may require high temperature activation processes that may not be readily available in small form factor packages (e.g., final processing vacuum chambers for QIP systems). In these cases, the NEG materials should be activated in an ultra-high vacuum assembly chamber before the enclosure is fully assembled by welding the lid to the ion trap package.

[0057] 5 illustrates a block diagram 500 of a vacuum chamber integrated with a portion of a QIP system, according to an exemplary embodiment of the present disclosure. It should be understood that block diagram 500 illustrates the vacuum chamber after it has been processed (e.g., manufactured or prepared) according to the method described above with respect to FIG.

[0058] As shown, block diagram 500 generally includes a vacuum chamber that may be mounted to a vacuum package mount and / or a ceramic pin grid array (CPGA), which is shown, for example, as mounting structures 502 and 504. After processing is completed, an interposer chip 506 may be coupled to mounting structures 502 and 504, and an ion trap 508 may be mounted to the interposer chip 506 to provide an ion trap package. As shown, small hashes on the ion trap 508 represent trapped ions, which may correspond to ions 106a-106d as described above with respect to FIG.

[0059] Additionally, the vacuum chamber is created by a lid, shown as lid portions 514 and 516 having at least one window 520, which is coupled to the top of the ion trap package (e.g., trap 408 and interposer). Vertical cone 522 represents the detection light as described above passing through optical window 520. Additionally, exit horizontal cones 510 and 512 are light cones (e.g., generated by a Raman laser) for addressing ions in ion trap 508. Light cone 510 is focused (e.g., from the left) through an optical window (not shown) towards the ions to be addressed, and similarly, light cone 512 is focused (e.g., from the right) through an optical window (not shown) towards the ions to be addressed.

[0060] As described above, during processing, the coating material 518 can be activated to coat the inner surface of the lid (i.e., lid portions 514 and 516) facing the ion trap 408. Additionally, according to an exemplary embodiment, the coating material is a getter material that is at least one of a non-evaporable getter (NEG), titanium (Ti), and barium (Ba). Also, as described above, a metal sealant can be provided that seals the groove in the lid to a ring frame on the ion trap package. When the vacuum structure is mounted to the mounting structures 502 and 504 of the QIP system, the prepared vacuum chamber can be configured as a ground connection for the ion trap package (i.e., ion trap 508 and interposer 506). By providing the coating material 518 on the lid portions 414 and 416 of the entire inner surface of the lid, the prepared vacuum chamber (i.e., enclosure) configures the ion trap package to perform quantum computing operations at room temperature, eliminating the need for a cryogenic system.

[0061] The preceding description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the common principles defined herein can be applied to other variations without departing from the scope of the disclosure. Furthermore, although elements of the described aspects may be described or claimed in the singular, the plural is also contemplated unless limitation to the singular is expressly stated. Furthermore, unless otherwise stated, all or a portion of any aspect can be utilized with all or a portion of any other aspect. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. 1. A method for preparing a vacuum chamber for a quantum computing system, comprising: inserting a lid into a processing vacuum chamber, the lid having a shadow mask over at least one window of the lid; coating the inside of the lid with a getter material; removing the shadow mask from the at least one window; providing an ion trap package in a processing vacuum chamber and welding the lid to the top of the ion trap package to prepare the vacuum chamber; A method comprising:

2. 10. The method of claim 1, further comprising removing the prepared vacuum chamber from the processing vacuum chamber and connecting the prepared vacuum chamber to the quantum computing system.

3. The method of claim 1 , wherein inserting the lid into the processing vacuum chamber further comprises load locking the processing vacuum chamber without venting.

4. The method of claim 1 , further comprising the step of surface treating the ion trap package before the lid is welded to the top of it to reduce abnormal heating.

5. 2. The method of claim 1 , wherein providing the ion trap package further comprises mounting an ion trap on a ceramic package to provide the ion trap package outside the processing vacuum chamber, and inserting the ion trap package into the processing vacuum chamber.

6. The method of claim 5 further comprising sealing the lid groove to a ring frame on the ceramic package with a metal sealant.

7. The method of claim 1 , further comprising removing inert gas molecules from the vacuum chamber with an active ion pump integrated with the lid.

8. 8. The method of claim 7, wherein removing the inert gas molecules comprises ionizing the inert gas molecules and forcing the inert gas molecules into a surface of the lid coated with the getter material.

9. The method of claim 8 further comprising applying at least one of a magnetic field and an electric field to the surface of the lid coated with the getter material.

10. 9. The method of claim 8, further comprising using laser ablation to strike a local plasma to drive the inert gas molecules into the surface of the lid coated with the getter material.

11. 2. The method of claim 1, wherein coating the lid with the getter material comprises conditioning an inner surface of the lid to be an adsorbent surface by sublimating the getter material on the inner surface.

12. The method of claim 1 , wherein coating the lid with the getter material comprises activating the getter material so that it spreads over an inner surface of the lid that becomes an adsorbent surface.

13. 2. The method of claim 1, wherein the getter material is at least one of a non-evaporable getter (NEG), titanium (Ti), and barium (Ba).

14. The method of claim 1 , further comprising configuring the ion trap package to operate quantum computing operations at room temperature by providing the ion trap package to prepare the vacuum chamber.

15. The method of claim 1 , further comprising reducing the pressure in the processing vacuum chamber before coating the lid with the getter material.

16. 3. The method of claim 2, wherein connecting the prepared vacuum chamber to the quantum computing system further comprises configuring the prepared vacuum chamber as a ground connection for the ion trap package.

17. 1. A quantum information processing (QIP) system, comprising: An interposer chip; an ion trap mounted on the interposer chip to provide an ion trap package, the ion trap including a plurality of trapped ions; a vacuum chamber having a lid with at least one window, the lid being coupled to a top of the ion trap package facing the interposer chip; a coating material applied to the inner surface of the lid facing the ion trap package; The QIP system includes:

18. 20. The QIP system of claim 17, wherein the coating material is a getter material that is at least one of a non-evaporable getter (NEG), titanium (Ti), and barium (Ba).

19. 20. The QIP system of claim 17, further comprising a metal sealant that seals the lid groove to a ring frame on the ion trap package.

20. 20. The QIP system of claim 17, wherein the provided vacuum chamber is configured as a ground connection for the ion trap package.

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