Open Type Earphones

Abstract

The open-type earphone according to an embodiment of the present application includes an acoustic generating unit including a transducer including a diaphragm and a housing that accommodates the transducer, and an ear hook that, when worn, has a first portion that is hung between the user's auricle and head and a second portion that extends to the side of the auricle away from the head and is connected to the acoustic generating unit, and fixes the acoustic generating unit at a position near the auditory canal so as not to block the auditory canal, and a sound emission hole is formed on the inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the auditory canal, and at least two decompression holes are formed on another side wall of the housing, and the at least two decompression holes include a first decompression hole and a second decompression hole, and the distance between the center of the first decompression hole and the center of the second decompression hole is 13.0 mm to 15.2 mm.

Description

[Technical field]

[0001] The present application relates to the field of acoustics, and in particular to open earphones.

[0002] [Incorporated by reference] This application claims priority to a Chinese application with application number 202211336918.4 filed on October 28, 2022, priority to a Chinese application with application number 202223239628.6 filed on December 1, 2022, and priority to an international application with application number PCT / CN2022 / 144339 filed on December 30, 2022, the entire contents of which are incorporated herein by reference. [Background technology]

[0003] With the development of audio output technology, audio devices (e.g., earphones) are widely applied in people's daily lives, and by using them with electronic devices such as mobile phones and computers, users can enjoy a feast of hearing. An open-type earphone is a portable audio output device that realizes acoustic conduction in a specific range. Compared with traditional canal-type earphones and headphones, an open-type earphone has the characteristic of not blocking or covering the ear canal, allowing users to obtain audio information from the external environment while listening to music, thereby improving safety and comfort. The output performance of an open-type earphone has a great impact on the user's comfort when using it.

[0004] Therefore, there is a need to provide an open earphone that improves the output performance of an open earphone. Summary of the Invention [Means for solving the problem]

[0005] An open-type earphone according to one embodiment of the present application includes an acoustic generating unit including a transducer including a diaphragm and a housing that accommodates the transducer, and an ear hook that, when worn, has a first portion that is hung between the user's auricle and head and a second portion that extends to the side of the auricle away from the head and is connected to the acoustic generating unit, and fixes the acoustic generating unit at a position near the auditory canal so as not to block the auditory canal, and a sound emission hole is formed on the inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the auditory canal, and at least two decompression holes are formed on another side wall of the housing, and the at least two decompression holes include a first decompression hole and a second decompression hole, and the distance between the center of the first decompression hole and the center of the second decompression hole is 13.0 mm to 15.2 mm.

[0006] In some embodiments, the distance from the center of the sound emission hole to the perpendicular bisector of the connection line between the center of the first decompression hole and the center of the second decompression hole is between 0 mm and 2 mm.

[0007] In some embodiments, the first vacuum hole is formed in an upper surface of the housing and the second vacuum hole is formed in a lower surface of the housing.

[0008] In some embodiments, when worn, the housing is at least partially inserted into the cavity of the concha, and the distance from the center of the second vacuum hole to the rear side of the housing is greater than the distance from the center of the first vacuum hole to the rear side.

[0009] In some embodiments, the distance from the center of the first decompression hole to the inner surface of the housing facing the pinna ranges from 4.24 mm to 6.38 mm.

[0010] In some embodiments, the range of the distance from the center of the first decompression hole to the rear side is between 10.44 mm and 15.68 mm.

[0011] In some embodiments, the transducer includes a magnetic circuit assembly that provides a magnetic field, and a distance from a center of the first vacuum hole to a bottom surface of the magnetic circuit assembly ranges from 1.31 mm to 1.98 mm.

[0012] In some embodiments, the transducer includes a magnetic circuit assembly that provides a magnetic field, and a distance from a center of the first vacuum hole to a longitudinal center plane of the magnetic circuit assembly ranges from 5.45 mm to 8.19 mm.

[0013] In some embodiments, the distance from the center of the second decompression hole to the inner surface of the housing facing the pinna ranges from 4.24 mm to 6.36 mm. In some embodiments, the distance from the center of the second decompression hole to the rear surface ranges from 13.51 mm to 20.27 mm.

[0014] In some embodiments, the transducer includes a magnetic circuit assembly that provides a magnetic field, and a distance from the center of the second vacuum hole to a bottom surface of the magnetic circuit assembly ranges from 1.31 mm to 1.98 mm.

[0015] In some embodiments, the transducer includes a magnetic circuit assembly that provides a magnetic field, and the distance from the center of the second vacuum hole to the longitudinal center plane of the magnetic circuit assembly ranges from 5.46 mm to 8.20 mm.

[0016] In some embodiments, in the worn state, the housing is at least partially inserted into the cavity of the concha and the area of ​​the second vacuum hole is smaller than the area of ​​the first vacuum hole.

[0017] In some embodiments, the area of ​​the first vacuum hole ranges from 3.78 mm 2 ~22.07mm 2 and the area of ​​the second decompression hole is 2.78 mm 2 ~16.07mm 2 It is.

[0018] In some embodiments, the ratio of the area of ​​the first decompression hole to the area of ​​the upper side surface is 0.036 to 0.093, and the ratio of the area of ​​the second decompression hole to the area of ​​the lower side surface is 0.018 to 0.051.

[0019] In some embodiments, the transducer includes a magnetic circuit assembly that provides a magnetic field, and an overlap area of ​​a projection of the first vacuum hole and the second vacuum hole on a longitudinal center plane of the magnetic circuit assembly is 10.77 mm 2 The following is the result.

[0020] In some embodiments, the length of a connecting line between the projected points of the center of the first decompression hole and the center of the second decompression hole on a plane on which the bottom surface of the magnetic circuit assembly is located is in the range of 8.51 mm to 15.81 mm.

[0021] In some embodiments, the angle range of the included angle between the connecting line and the minor axis direction of the housing is 12.85° to 23.88°.

[0022] In some embodiments, when worn, the housing at least partially covers the antihelix, and the difference between the distance from the center of the second vacuum hole on the lower surface to the posterior surface of the housing and the distance from the center of the first vacuum hole on the upper surface to the posterior surface is less than 10%.

[0023] In some embodiments, the range of the distance from the center of the first decompression hole to the inner surface of the housing facing the auricle is 4.43 mm to 7.96 mm, or the range of the distance from the center of the second decompression hole to the inner surface is 4.43 mm to 7.96 mm.

[0024] In some embodiments, the range of the distance from the center of the first decompression hole to the rear side is between 8.60 mm and 12.92 mm, or the range of the distance from the center of the second decompression hole to the rear side is between 8.60 mm and 12.92 mm.

[0025] In some embodiments, the ratio of the major axis dimension of the first vacuum hole to the minor axis dimension of the first vacuum hole is in the range of 1 to 8, or the ratio of the major axis dimension of the second vacuum hole to the minor axis dimension of the second vacuum hole is in the range of 1 to 8.

[0026] In some embodiments, there is a first distance between a center of the first decompression hole and a center of the sound emission hole, and there is a second distance between a center of the second decompression hole and the sound emission hole, and the difference between the first distance and the second distance is less than 10%.

[0027] In some embodiments, the first distance is between 5.12 mm and 15.11 mm.

[0028] In some embodiments, the range of distance from the projection of the center of the first decompression hole onto the sagittal plane to the projection of the midpoint of the upper boundary of the medial surface onto the sagittal plane is less than or equal to 2 mm.

[0029] In some embodiments, the range of distance from the projection of the midpoint of the upper boundary of the medial surface onto the sagittal plane to the projection of the center of the ear canal opening onto the sagittal plane is between 12 mm and 18 mm.

[0030] In some embodiments, the range of the distance from the projection of the center of the first decompression hole onto the sagittal plane to the projection of the center of the ear canal opening onto the sagittal plane is 12 mm to 18 mm.

[0031] In some embodiments, the range of the distance from the projection of the center of the second decompression hole onto the sagittal plane to the projection of the center of the ear canal opening onto the sagittal plane is 6.88 mm to 10.32 mm.

[0032] In some embodiments, the range of the distance from the projection of the center of the second decompression hole onto the sagittal plane to the projection of the midpoint of the upper boundary of the medial surface onto the sagittal plane is 14.4 mm to 21.6 mm.

[0033] In some embodiments, the range of the distance from the projection of the center of the first decompression hole onto the sagittal plane to the projection of the 1 / 3 point of the lower boundary of the medial surface onto the sagittal plane is 13.76 mm to 20.64 mm.

[0034] In some embodiments, the range of the distance from the projection of the center of the second decompression hole onto the sagittal plane to the projection of the 1 / 3 point of the lower boundary of the medial surface onto the sagittal plane is 8.16 mm to 12.24 mm.

[0035] In some embodiments, the range of the distance from the projection of the 1 / 3 point of the lower boundary of the medial surface onto the sagittal plane to the projection of the center of the ear canal opening onto the sagittal plane is 1.76 mm to 2.64 mm.

[0036] In some embodiments, in a worn state, the distance between the first decompression hole and any point on the second portion of the earhook along the longitudinal axis of the sound-generating portion ranges from 5.28 mm to 13.02 mm.

[0037] The open-type earphone according to the embodiment of the present specification includes an acoustic generating unit including a transducer including a diaphragm and a housing that accommodates the transducer, and an ear hook that, when worn, has a first portion that is hung between the user's auricle and head and a second portion that extends to the side of the auricle away from the head and is connected to the acoustic generating unit, and fixes the acoustic generating unit at a position near the auditory canal so as not to block the auditory canal, and a sound emission hole is formed on the inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the auditory canal, and at least two decompression holes are formed on another side wall of the housing, and the at least two decompression holes include a first decompression hole and a second decompression hole, and the distance from the center of the sound emission hole to the perpendicular bisector of the connection line between the center of the first decompression hole and the center of the second decompression hole is 0 mm to 2 mm.

[0038] An open-type earphone according to an embodiment of the present specification includes an acoustic generating unit including a transducer including a diaphragm and a housing that accommodates the transducer, and an ear hook that, when worn, has a first part that is hung between the user's auricle and head and a second part that extends to the side of the auricle away from the head and is connected to the acoustic generating unit, fixing the acoustic generating unit at a position near the auditory canal so as not to block the auditory canal, and a sound emission hole is formed on the inner surface of the housing facing the auricle, which guides sound generated in front of the diaphragm out of the housing and transmits it to the auditory canal, and at least two decompression holes are formed on another side wall of the housing, the at least two decompression holes including a first decompression hole and a second decompression hole, the housing is at least partially inserted into the concha cavity, and the area of ​​the second decompression hole is smaller than the area of ​​the first decompression hole.

[0039] The present application will be further illustrated by exemplary embodiments, which are not limiting and will be described in detail with reference to the drawings, in which like reference numerals indicate like structures. [Brief description of the drawings]

[0040] [Figure 1] 1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. [Diagram 2] FIG. 1 is an exemplary diagram of an open-type earphone according to some embodiments of the present application. [Diagram 3] FIG. 2 is a schematic diagram of two point sound sources and a listening position according to some embodiments of the present application. [Figure 4] FIG. 10 is a comparison diagram of sound leakage index at different frequencies for a single point sound source and dual point sound sources, in accordance with some embodiments of the present application. [Diagram 5] FIG. 2 is an exemplary distribution diagram of a dipole sound source in which a baffle is placed between two sources, according to some embodiments of the present application; [Figure 6] FIG. 13 illustrates a sound leakage index when a baffle is installed between two dipole sound sources and when no baffle is installed, according to some embodiments of the present application. [Figure 7] 1 is an exemplary schematic diagram of an open-type earphone according to some embodiments of the present application; FIG. [Figure 8] FIG. 8 is a schematic diagram of the open-type earphone shown in FIG. 7, showing the side facing the ear. [Figure 9] FIG. 9 is a schematic configuration diagram of the housing shown in FIG. 8. [Figure 10] FIG. 2 is an exemplary schematic distribution diagram of a cavity structure placed around one of the dipole sound sources according to some embodiments of the present application. [Figure 11A] 1 is a schematic diagram of a dipole source structure and a listening principle when a cavity structure is built around one of the dipole sources according to some embodiments of the present application; FIG. [Figure 11B]FIG. 1 is a schematic diagram of a dipole sound source structure and a sound leakage principle when a cavity structure is constructed around one of the dipole sound sources according to some embodiments of the present application; [Figure 12A] 1 is a schematic diagram of a cavity structure with two horizontal openings according to some embodiments of the present application. FIG. [Figure 12B] FIG. 2 is a schematic diagram of a cavity structure with two vertical openings according to some embodiments of the present application. [Figure 13] FIG. 10 is a comparison diagram of the listening index curves of a two-opening cavity structure and a one-opening cavity structure according to some embodiments of the present application. [Figure 14] 1 is an exemplary schematic diagram of an open-type earphone according to some other embodiments of the present application; FIG. [Figure 15] FIG. 15 is a schematic diagram of the open-type earphone shown in FIG. 14 from the ear side. [Figure 16] FIG. 1 is a schematic diagram of a housing of an open-type earphone according to some embodiments of the present application. [Figure 17] FIG. 11 is a frequency response curve diagram of an open-type earphone corresponding to different areas of the first decompression holes according to some embodiments of the present application. [Figure 18] FIG. 11 is a frequency response curve diagram of an open-type earphone corresponding to different areas of the second decompression holes according to some embodiments of the present application. [Figure 19] FIG. 1 is a schematic diagram of an open-type earphone according to some embodiments of the present application projected onto a sagittal plane in a worn state. [Figure 20A] FIG. 2 is an exemplary internal configuration diagram of a sound generating unit according to some embodiments of the present application. [Figure 20B] FIG. 2 illustrates an example configuration of a second acoustic cavity in accordance with certain embodiments of the present disclosure. [Figure 20C] FIG. 11 illustrates frequency response curves of a rear cavity corresponding to different magnitudes of included angle α, in accordance with certain embodiments herein. [Figure 21] FIG. 2 is an exemplary internal block diagram of a transducer according to some embodiments of the present application. [Figure 22]FIG. 1 is a schematic diagram of the housing of an open-type earphone along the Z direction on the plane on which the bottom surface of the magnetic circuit assembly is located. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0041] In order to more clearly describe the technical means of the embodiments of the present application, the drawings necessary for the description of the embodiments are briefly described below. Obviously, the drawings described below are only some examples or embodiments of the present application, and those skilled in the art can apply the present application to other similar scenarios based on these drawings without creative efforts. Unless otherwise clear from the context or described otherwise, the same numbers in the drawings indicate the same structures or operations.

[0042] It should be understood that the terms "system," "apparatus," "unit," and / or "module" used herein are ways of distinguishing between different levels of assemblies, elements, components, parts, or structures, however, other terms may be used in place of the above terms if they can achieve the same purpose.

[0043] As used in this application and the claims, unless the context clearly dictates otherwise, terms such as "a," "one," "one kind," and / or "the" do not specifically refer to the singular but may include the plural. In general, the terms "comprise" and "containing" are merely intended to indicate the inclusion of explicitly identified steps and elements, and these steps and elements are not intended to be an exclusive listing, and a method or apparatus may include other steps or elements.

[0044] It should be noted that in the present description, the terms "first", "second", "third", "fourth", etc. are for explanatory purposes only and should not be understood as indicating or suggesting the relative importance or quantity of the technical features shown. Thus, a feature defined by "first", "second", "third", "fourth" may explicitly or implicitly indicate that it includes at least one of the feature. In the present description, unless otherwise clearly and specifically limited, "plurality" means at least two, e.g., two, three, etc.

[0045] In the present application, unless otherwise clearly specified and limited, the terms "connected", "fixed", etc. should be understood in a broad sense. For example, unless otherwise clearly limited, the term "connected" may be a fixed connection, a detachable connection, or an integral connection, may be a mechanical connection or an electrical connection, may be a direct connection, may be an indirect connection via an intermediate medium, may be an internal communication between two elements, or may be an interactive relationship between two elements. Those skilled in the art can understand the specific meaning of the above terms in the present application according to the specific situation.

[0046] FIG. 1 is a schematic diagram of an exemplary ear according to some embodiments of the present application. As shown in FIG. 1, the ear 100 (also called the pinna) may include an ear canal 101, a concha cavity 102, a concha navicular 103, a triangular fossa 104, an antihelix 105, a scapha 106, a helix 107, an earlobe 108, a tragus 109, and a helical crus 1071. In some embodiments, the stability of the fitting of the audio device can be achieved by supporting the audio device by one or more parts of the ear 100. In some embodiments, parts such as the ear canal 101, the concha cavity 102, the concha navicular 103, and the triangular fossa 104 have a certain depth and volume in three-dimensional space, and can realize the fitting needs of the audio device. For example, an audio device (e.g., a canal-type earphone) may be fitted in the ear canal 101. In some embodiments, the fitting of the audio device (e.g., an open-type earphone) can be realized by a part of the ear 100 other than the ear canal 101. For example, the acoustic device can be fitted by the concha 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, and the helix 107, or a combination thereof. In some embodiments, the user's earlobe 108 can be further utilized to improve the comfort and reliability of the acoustic device. The acoustic device can be fitted and the sound can be transmitted by other parts of the ear unit 100 other than the ear canal 101, and the user's ear canal 101 can be "opened up". When the user is wearing an acoustic device (e.g., an open-type earphone), the acoustic device does not block the user's ear canal 101 (or the ear canal or ear canal opening), and the user can hear the sound from the acoustic device as well as the sound from the environment (e.g., the sound of a horn, the sound of a bicycle bell, the voices of people around, the sound of traffic control, etc.), thereby reducing the probability of a traffic accident. In some embodiments, depending on the structure of the ear portion 100, the acoustic device can be designed to have a structure that fits the ear portion 100, thereby enabling the sound generating portion of the acoustic device to be worn at different positions on the ear portion.For example, when the acoustic device is an open-type earphone, the open-type earphone may include a suspension structure (e.g., an ear hook) and a sound-generating unit, the sound-generating unit and the suspension structure are physically connected, and the suspension structure may conform to the shape of the pinna so as to place the entire or partial structure of the sound-generating unit in front of the tragus 109 (e.g., the area J surrounded by the dashed line in FIG. 1). Also, for example, when a user wears an open-type earphone, the entire or partial structure of the sound-generating unit may contact the upper part of the ear canal 101 (e.g., a position where one or more parts such as the concha navicular 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, and the crus helix 1071 are located). Furthermore, for example, when a user is wearing an open-type earphone, the structure of all or part of the sound generating unit is located within a cavity formed by one or more parts of the ear unit 100 (e.g., the concha cavity 102, the concha scapha 103, and the triangular fossa 104, etc.) (e.g., the region M surrounded by the dashed line in Figure 1, which includes at least the concha scapha 103 and the triangular fossa 104). 1 and an area M including at least the concha cavity 102. 2 ) may be located.

[0047] Since there may be individual differences among different users, there are dimensional differences such as different shapes and sizes of the ears. For ease of explanation and understanding, unless otherwise specified, the present application mainly uses an ear model having a "standard" shape and size as a reference, and further describes the mounting method of the acoustic device to the ear model in different embodiments. For example, a simulator including a head and its (left and right) ears manufactured according to ANSI: S3.36, S3.25 and IEC: 60318-7 standards, such as GRAS 45BC KEMAR, can be used as a reference for mounting the acoustic device, thereby presenting a scenario in which most users normally mount the acoustic device. By way of example only, the reference ear may be characterized in that the dimension of the projection of the pinna onto the sagittal plane in the vertical axis direction is within the range of 49.5 mm to 74.3 mm, and the dimension of the projection of the pinna onto the sagittal plane in the sagittal axis direction is within the range of 36.6 mm to 55 mm. Therefore, the descriptions "worn by a user", "in a worn state" and "in a worn state" in this application may refer to the acoustic device described in this application being worn on the ear of the simulator. Naturally, considering the existence of individual differences among different users, the structure, shape, size, thickness, etc. of one or more parts of the ear part 100 may have certain differences, and in order to meet the needs of different users, a differentiated design can be made for the acoustic device, and these differentiated designs can be expressed to be adapted to different ear parts by having characteristic parameters of one or more parts of the acoustic device (e.g., the sound generating part, ear hook, etc. described below) have different ranges of values.

[0048] In addition, in the fields of medicine, anatomy, and the like, three basic cutting planes of the human body, the sagittal plane, the coronal plane, and the horizontal plane, and three basic axes, the sagittal axis, the coronal axis, and the vertical axis, can be defined. The sagittal plane is a cutting plane perpendicular to the ground along the front-back direction of the body, dividing the human body into two parts, the left and right, the coronal plane is a cutting plane perpendicular to the ground along the left-right direction of the body, dividing the human body into two parts, the front and the back, and the horizontal plane is a cutting plane parallel to the ground along the up-down direction perpendicular to the body, dividing the human body into two parts, the top and the bottom. Accordingly, the sagittal axis is an axis perpendicular to the coronal plane along the front-back direction of the body, the coronal axis is an axis perpendicular to the sagittal plane along the left-right direction of the body, and the vertical axis is an axis perpendicular to the horizontal plane along the up-down direction of the body. Furthermore, the "front side of the ear" described in this application is a concept opposite to the "rear side of the ear", the former being the side of the ear away from the head and the latter being the side of the ear facing the head. When the ear of the simulator is viewed from the direction in which the coronal axis of the human body is located, a schematic diagram of the front profile of the ear is obtained as shown in FIG.

[0049] FIG. 2 is an exemplary diagram of an open-type earphone according to some embodiments of the present application.

[0050] In some embodiments, the open earphone 10 may include, but is not limited to, air conduction earphones, bone conduction earphones, etc. In some embodiments, the open earphone 10 may be combined with products such as glasses, headphones, head mounted displays, AR / VR helmets, etc.

[0051] As shown in FIG. 2, the open-type earphone 10 may include a sound generating unit 11 and an ear hook 12.

[0052] The sound generating unit 11 may be used to be worn on the user's body, and the sound generating unit 11 can generate sound and input it to the user's ear canal. In some embodiments, the sound generating unit 11 may include a transducer (e.g., the transducer 116 shown in FIG. 20A ) and a housing 111 that accommodates the transducer. The housing 111 may be connected to the ear hook 12. The transducer is used to convert an electrical signal into a corresponding mechanical vibration to generate sound. In some embodiments, a sound emission hole 112 is formed on the side of the housing facing the auricle, and the sound emission hole 112 is used to guide the sound generated by the transducer out of the housing 111 and then transmit it to the ear canal so that the user can hear the sound. In some embodiments, the transducer (e.g., diaphragm) may partition the housing 111 to form a front cavity (e.g., front cavity 114 shown in FIG. 20A ) and a rear cavity of the earphone, and the sound emission hole 112 communicates with the front cavity and can guide sound generated in the front cavity out of the housing 111 and transmit it to the ear canal. In some embodiments, the sound guided through the sound emission hole 112 can be partially propagated to the ear canal to be heard by the user, and the other part of the sound can be propagated to the outside of the open-type earphone 10 and the ear unit through a gap between the sound generating unit 11 and the ear unit (e.g., a part of the concha cavity that is not covered by the sound generating unit 11) together with the sound reflected in the ear canal, thereby forming a first sound leakage in the far field, and at the same time, the sound can be propagated to the outside of the open-type earphone 10 and the ear unit through another side of the housing 111 (e.g., a part of the concha cavity that is not covered by the sound generating unit 11). The first sound leakage and the second sound leakage (the side facing the earphone 10) are generally formed with one or more decompression holes 113, which are farther from the ear canal than the sound emission hole 112. Sound propagating from the decompression holes 113 generally forms a second sound leakage in the far field. Since the intensity of the first sound leakage and the intensity of the second sound leakage are equal and the phases of the first sound leakage and the second sound leakage are (substantially) opposite to each other, the two can be offset in opposite phase in the far field, which helps to reduce sound leakage in the far field of the open-type earphone 10.In some embodiments, in addition to the side of the housing 111 facing the auricle, at least two decompression holes 113 may be formed on the other side of the housing 111. By providing at least two decompression holes 113, not only can the sound generated in the rear cavity be guided out of the housing 111, but also the high-pressure region of the sound field in the rear cavity can be destroyed, thereby shortening the wavelength of the standing wave in the rear cavity and making the resonance frequency of the sound guided out of the housing 111 from the decompression holes 113 as high as possible, for example, higher than 4 kHz. At this time, the sound guided out of the sound output hole 112 and the sound guided out of the decompression holes 113 can maintain a high degree of agreement in a wider frequency range, and the effect of interference cancellation between the two in the far field is higher, thereby achieving a higher sound leakage reduction effect. For convenience of explanation, in this specification, an example in which two decompression holes are provided in the sound generating unit 11 is described as an example. As a mere example, the at least two decompression holes 113 may include a first decompression hole and a second decompression hole (for example, the first decompression hole 1131 and the second decompression hole 1132 in FIG. 7), and the two decompression holes 113 may be located on two opposing sides of the housing 111, respectively, for example, arranged back to back in the short axis direction Y, in order to maximally destroy the high pressure area of ​​the sound field in the rear cavity. In simple terms, when a user wears the open-type earphone 10, the user mainly hears the sound transmitted to the ear canal through the sound emission hole 112, and the decompression hole 113 is mainly arranged to balance the pressure of the rear cavity, so that the sound can be sufficiently vibrated at low frequency and large amplitude, thereby making the sound sound as clear as possible with bass extension and treble, and reducing the sound leaking into the environment through the sound emission hole 112. For more information on the sound generating unit 11, please refer to other parts of this application, such as FIG. 7, FIG. 14, FIG. 20A, etc. and their descriptions.

[0053] The ear hook 12 may have one end connected to the sound generating unit 11 and the other end extending along the boundary between the user's ear and head. In some embodiments, the ear hook 12 may have an arc-shaped structure that fits the user's auricle so as to be suspended from the user's auricle. For example, the ear hook 12 may have an arc-shaped structure that fits the boundary between the user's head and ear so as to be hung between the user's ear and head. In some embodiments, the ear hook 12 may have a clamping structure that fits the user's auricle so as to be clamped to the user's auricle. Exemplarily, the ear hook 12 may include a hook-shaped portion (first portion 121 shown in FIG. 7) and a connecting portion (second portion 122 shown in FIG. 7) that are connected in order. The connecting portion connects the hook-shaped portion and the sound generating unit 11 so that the open-type earphone 10 is curved in three-dimensional space when it is in a non-worn state (i.e., natural state). In other words, in three-dimensional space, the hook-shaped portion, the connecting portion, and the sound generating unit 11 are not on the same plane. When the open-type earphone 10 is installed in this manner, the hook-shaped portion is mainly hooked between the rear side of the user's ear and the head, and the sound generating unit 11 mainly contacts the front side of the user's ear, so that the sound generating unit 11 and the hook-shaped portion can cooperate to hold the ear. As an example, the connection portion may extend from the head to the outside of the head, and further cooperate with the hook-shaped portion to provide the sound generating unit 11 with a pressing force toward the front side of the ear. The sound generating unit 11 can be pressed against the area where the concha cavity 102, the concha navicularis 103, the triangular fossa 104, the antihelix 105, etc. are located by the action of the pressing force, so that the ear canal 101 of the ear is not blocked when the open-type earphone 10 is installed.

[0054] In some embodiments, in order to improve the stability of the open-type earphone 10 in the worn state, the open-type earphone 10 can use any of the following methods or a combination thereof. First, at least a part of the ear hook 12 is installed as an imitation structure that fits at least one of the rear side of the ear part 100 and the head, and the contact area between the ear hook 12 and the ear part 100 and / or the head is increased, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear part 100. Second, at least a part of the ear hook 12 is installed as an elastic structure to have a certain amount of deformation in the worn state, and the positive pressure of the ear hook 12 on the ear part and / or the head is increased, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear part. Third, at least a part of the ear hook 12 is installed so as to generate a reaction force that abuts against the head and presses the ear part in the worn state, and the sound generating unit 11 is pressed to the front side of the ear part, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear part. Fourth, the sound generating unit 11 and the ear hook 12 are arranged to clamp the area where the antihelix is ​​located, the area where the concha cavity is located, etc. from both the front and back of the ear part when worn, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear part. Fifth, the sound generating unit 11 or the auxiliary structure connected thereto is arranged to be inserted at least partially into a cavity such as the concha cavity, the concha navicularis, the triangular fossa, and the navicular fossa, thereby increasing the resistance of the open-type earphone 10 to falling off from the ear part.

[0055] In some embodiments, the ear hook 12 may include, but is not limited to, an ear hook, an elastic band, etc., so as to better secure the open earphone 10 to the user's body and prevent it from falling off during use by the user. In some embodiments, the open earphone 10 may not include the ear hook 12, and the sound generating unit 11 may be fixed near the user's ear 100 in a hanging or clamping manner.

[0056] In some embodiments, the sound generating unit 11 may have a regular or irregular shape, such as a circular ring, an ellipse, a racetrack, a polygon, a U-shape, a V-shape, a semicircle, etc., so that the sound generating unit 11 can be directly hung on the ear unit 100 of a user. In some embodiments, the sound generating unit 11 may have a long axis direction X and a short axis direction Y that are perpendicular to the thickness direction Z and perpendicular to each other. The long axis direction X may be defined as the direction in which the extension dimension is the largest in the shape of a two-dimensional projection plane of the sound generating unit 11 (e.g., a projection onto a plane on which the outer surface of the sound generating unit 11 is located, or a projection onto a sagittal plane) (e.g., when the projection shape is a rectangle or an approximately rectangular shape, the long axis direction is the length direction of the rectangle or approximately rectangular shape). The short axis direction Y may be defined as the direction perpendicular to the long axis direction X in the shape of the projection of the sound generating unit 11 onto the sagittal plane (e.g., when the projection shape is a rectangle or an approximately rectangular shape, the short axis direction is the width direction of the rectangle or approximately rectangular shape). The thickness direction Z may be defined as a direction perpendicular to the two-dimensional projection plane, for example coinciding with the direction of the coronal axis, both of which point in the left-right direction of the body.

[0057] In some embodiments, when the user wears the open-type earphone 10, the sound generating unit 11 may be fixed at a position near the user's ear canal 101 so as not to block the ear canal. In some embodiments, the projection of the open-type earphone 10 onto the sagittal plane may not cover the ear canal of the user when worn. For example, the projection of the sound generating unit 11 onto the sagittal plane may be at a position on both the left and right sides of the head, located in front of the tragus on the sagittal axis of the human body (for example, the position indicated by the solid line frame A in FIG. 2). In this case, the sound generating unit 11 may be located in front of the user's tragus, the long axis of the sound generating unit 11 may be in a vertical or approximately vertical state, the projection of the short axis direction Y onto the sagittal plane coincides with the direction of the sagittal axis, the projection of the long axis direction X onto the sagittal plane coincides with the direction of the vertical axis, and the thickness direction Z is perpendicular to the sagittal plane. Also, for example, the projection of the sound generating unit 11 onto the sagittal plane may be located at the antihelix 105 (for example, the position indicated by the dashed line frame C in FIG. 2). In this case, the sound generating unit 11 is at least partially located in the antihelix 105, the long axis of the sound generating unit 11 is horizontal or approximately horizontal, the long axis direction X of the sound generating unit 11 projected onto the sagittal plane coincides with the direction of the sagittal axis, the short axis direction Y projected onto the sagittal plane coincides with the vertical axis direction, and the thickness direction Z is perpendicular to the sagittal plane. This prevents the sound generating unit 11 from covering the ear canal, freeing both ears of the user, increasing the contact area between the sound generating unit 11 and the ear unit 100, and improving the wearing comfort of the open-type earphone 10.

[0058] In some embodiments, in the worn state, the projection of the open-type earphone 10 onto the sagittal plane may cover or at least partially cover the user's ear canal, for example, the projection of the sound-generating unit 11 onto the sagittal plane may be located within the cavity of the concha 102 (for example, the position shown in the dashed frame B in FIG. 2) and may contact the crus helix 1071 and / or the helix 107. In this case, the sound-generating unit 11 is at least partially located within the cavity of the concha 102, the sound-generating unit 11 is in an inclined state, the projection of the short axis direction Y of the sound-generating unit 11 onto the sagittal plane may have a certain included angle with the direction of the sagittal axis, i.e., the short axis direction Y is also installed with a corresponding inclination, the projection of the long axis direction X onto the sagittal plane may have a certain included angle with the direction of the sagittal axis, i.e., the long axis direction X is also installed with a inclination, and the thickness direction Z is perpendicular to the sagittal plane. In this case, since the cavity of the concha 102 has a certain volume and depth, there is a certain distance between the inner surface IS of the open-type earphone 10 and the cavity of the concha, and the ear canal communicates with the outside through the gap between the inner surface IS and the cavity of the concha, so that both ears of the user can be released. In addition, the sound generating unit 11 and the cavity of the concha can cooperate to form an auxiliary cavity (for example, a cavity structure described later) that communicates with the ear canal. In some embodiments, the sound emission hole 112 may be at least partially located in the auxiliary cavity, and the sound derived from the sound emission hole 112 is restricted by the auxiliary cavity, that is, the auxiliary cavity can converge the sound and propagate more of the sound into the ear canal, thereby improving the volume and quality of the sound heard by the user in the near field and improving the acoustic effect of the open-type earphone 10.

[0059] The above description of the open-type earphone 10 is for illustrative purposes only and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, the open-type earphone 10 may include a battery assembly, a Bluetooth® assembly, etc., or a combination thereof. The battery assembly is used to power the open-type earphone 10. The Bluetooth® assembly can wirelessly connect the open-type earphone 10 to other devices (e.g., mobile phones, computers, etc.). These changes and modifications are still within the scope of protection of the present application.

[0060] FIG. 3 is a schematic diagram of two point sound sources and a listening position according to some embodiments of the present application. In some embodiments, as shown in FIG. 3, sound can be transmitted to the outside of the open-type earphone 10 through the sound emission hole 112, which can be regarded as a monopole sound source (or a point sound source) A1, and a first sound can be generated; sound can be transmitted to the outside of the open-type earphone 10 through the decompression hole 113, which can be regarded as a monopole sound source (or a point sound source) A2, and a second sound can be generated; the second sound and the first sound may be in opposite or nearly opposite phases and can be cancelled in the far field, i.e., form an "acoustic dipole" to reduce sound leakage. In some embodiments, the connection lines of the two monopole sound sources may be directed to the ear canal (denoted as "listening position") in a worn state so that the user can hear a sufficiently loud sound. The magnitude of the sound pressure (denoted as Pear) at the listening position can represent the strength or weakness of the sound heard by the user (i.e., the listening sound pressure in the near field). Furthermore, the magnitude of sound pressure (denoted as Pfar) on a sphere centered on the user's listening position (or on a sphere with a radius of r and a circle centered at the center of the dipole sound source (A1 and A2 shown in FIG. 3)) can be statistically calculated, and the strength of sound leakage into the far field of the open-type earphone 10 (i.e., the sound pressure of sound leakage into the far field) can be expressed. Pfar can be obtained using various statistical methods, for example, by finding the average value of sound pressure at each point on the sphere, and further, for example, by finding the sound pressure distribution at each point on the sphere and performing a surface integral, etc.

[0061] It should be noted that the measurement method of sound leakage in this application is merely an illustrative explanation of the principle and effect, and is not limited thereto, and the measurement method and calculation method of sound leakage may be reasonably adjusted according to the actual situation. For example, the center of the dipole sound source is set as the center of a circle, and the sound pressure amplitudes of two or more points are evenly selected and averaged based on a certain spatial angle in the far field. In some embodiments, the measurement method of listening may be to select one position point near the point sound source as the listening position, and the sound pressure amplitude measured at the listening position is set as the listening value. In some embodiments, the listening position may be on the connecting line of the two point sound sources, or may not be on the connecting line of the two point sound sources. The measurement method and calculation method of listening may be reasonably adjusted according to the actual situation, for example, to average the sound pressure amplitudes of other points or one or more points in the near field position. Also, for example, a certain point sound source is set as the center of a circle, and the sound pressure amplitudes of two or more points are evenly selected and averaged based on a certain spatial angle in the near field. In some embodiments, the distance between the near-field listening position and the point sound source is much smaller than the distance between the point sound source and the far-field sound leakage measurement sphere.

[0062] Obviously, the sound pressure Pear transmitted from the open-type earphone 10 to the user's ear should be large enough to improve the listening effect. The sound pressure Pfar in the far field should be small enough to improve the sound leakage reduction effect. Therefore, the sound leakage index α can be used as an index to evaluate the sound leakage reduction ability of the open-type earphone 10.

[0063]

number

[0064] As can be seen from equation (1), the smaller the sound leakage index, the higher the sound leakage reduction capability of the open-type earphones, and the smaller the far-field sound leakage will be when the near-field listening volume at the listening position is the same.

[0065] FIG. 4 is a comparison diagram of the sound leakage index at different frequencies of a single point sound source and a dual point sound source according to some embodiments of the present application. The dual point sound source (also called a dipole sound source) in FIG. 4 may be a typical dual point sound source, that is, the interval is constant, the amplitude of the two point sound sources is the same, and the phase of the two point sound sources is opposite. It should be noted that the selection of a typical dual point sound source is only for illustrating the principle and effect, and the parameters of each point sound source can be adjusted according to actual needs to have a certain difference from the typical dual point sound source. As shown in FIG. 4, when the interval is constant, the sound leakage generated by the dual point sound source increases with the increase of frequency, and the sound leakage reduction ability becomes weaker with the increase of frequency. When the frequency is greater than a certain frequency value (for example, about 8000Hz as shown in FIG. 4), the generated sound leakage is greater than that of a single point sound source, and this frequency (for example, 8000Hz) is the upper limit frequency at which the dual point sound source can reduce sound leakage.

[0066] In some embodiments, a baffle may be installed between the sound outlet 112 and the decompression outlet 113 to improve the acoustic output effect of the open-type earphone 10, i.e., to increase the sound intensity at the near-field listening position and reduce the volume of far-field sound leakage.

[0067] 5 is an exemplary distribution diagram of a dipole sound source according to some embodiments of the present application when a baffle is installed between two sound sources. As shown in FIG. 5, when a baffle is installed between a point sound source A1 and a point sound source A2, in the near field, the sound wave of the point sound source A2 can only interfere with the sound wave of the point sound source A1 at the listening position by bypassing the baffle, which corresponds to an increase in the acoustic distance from the point sound source A2 to the listening position. Therefore, assuming that the point sound source A1 and the point sound source A2 have the same amplitude, the amplitude difference between the sound waves of the point sound source A1 and the point sound source A2 at the listening position increases compared to when the baffle is not installed, thereby decreasing the degree to which the sounds of the two paths are offset at the listening position, and increasing the volume at the listening position. In the far field, the sound waves generated by the point sound source A1 and the point sound source A2 can interfere with each other in a wide spatial range without going around the baffle (similar to the case where there is no baffle), so the far field sound leakage does not increase significantly compared to the case where there is no baffle. Therefore, by installing a baffle structure around one of the point sound sources A1 and A2, the sound volume at the near field listening position can be significantly increased without a significant increase in the far field sound leakage volume.

[0068] FIG. 6 is a diagram showing the sound leakage index when a baffle is installed between two sound sources of a dipole sound source according to some embodiments of the present application and when a baffle is not installed between the two sound sources. After adding a baffle to the double point sound source, in the near field, it corresponds to increasing the distance between the two point sound sources, and the sound volume at the near field listening position corresponds to that generated by the double point sound source with a large distance, and the listening sound volume in the near field is obviously increased compared to the case without a baffle, and in the far field, the sound field of the two point sound sources is less affected by the baffle, and the generated sound leakage corresponds to that generated by the double point sound source with a small distance. Therefore, as shown in FIG. 6, after adding the baffle, the sound leakage index is significantly smaller than that without the baffle, that is, at the same listening volume, the sound leakage in the far field is smaller than that without the baffle, and the sound leakage reduction ability is obviously stronger.

[0069] Fig. 7 is an exemplary schematic diagram of an open-type earphone according to some embodiments of the present application. Fig. 8 is a schematic diagram of the ear-facing side of the open-type earphone shown in Fig. 7. Fig. 9 is a schematic diagram of the housing of the open-type earphone shown in Fig. 7.

[0070] As shown in Fig. 7, the ear hook 12 has an arc-shaped structure that fits the boundary between the user's head and the ear unit 100. The sound generating unit 11 (or the housing 111 of the sound generating unit 11) may have a connection end CE connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. When the open-type earphone 10 is in a worn state, the first part 121 of the ear hook 12 (e.g., the hook-shaped part of the ear hook 12) is hooked between the user's auricle (e.g., the helix 107) and the head, and the second part 122 of the ear hook 12 (e.g., the connection part of the ear hook) extends to the side of the auricle away from the head and is connected to the connection end CE of the sound generating unit 11, fixing the sound generating unit 11 at a position near the ear canal so as not to block the ear canal.

[0071] As shown in Fig. 7 and Fig. 8, the sound generating unit 11 may have an inner side surface IS (also referred to as the inner side surface of the housing 111) facing the ear portion along the thickness direction Z in the worn state, an outer side surface OS (also referred to as the outer side surface of the housing 111) facing away from the ear portion, and a connection surface connecting the inner side surface IS and the outer side surface OS. In addition, when viewed from the direction in which the coronal axis is located (i.e., the thickness direction Z) in the worn state, the sound generating unit 11 may be installed in a shape such as a circle, an ellipse, a rounded square, or a rounded rectangle. When the sound generating unit 11 is installed in a shape such as a circle or an ellipse, the above connection surface may be an arc-shaped side surface of the sound generating unit 11, and when the sound generating unit 11 is installed in a shape such as a rounded square or a rounded rectangle, the above connection surface may include a lower side surface LS (also referred to as the lower side surface of the housing 111), an upper side surface US (also referred to as the upper side surface of the housing 111), and a rear side surface RS (also referred to as the rear side surface of the housing 111) described later. The upper side surface US and the lower side surface LS may be the side surface where the sound generating unit 11 is away from the ear canal 101 along the short axis direction Y in the worn state and the side surface where the sound generating unit 11 is close to the ear canal 101, respectively, and the rear side surface RS may be the side surface where the sound generating unit 11 is toward the back of the head along the length direction X in the worn state. For convenience of explanation, in this specification, an example is given in which the sound generating unit 11 is set to a rounded rectangle. The length of the sound generating unit 11 in the long axis direction X may be greater than the width of the sound generating unit 11 in the short axis direction Y. In some embodiments, the rear side surface RS of the earphone may be an arc surface to improve the aesthetics and wearing comfort of the earphone.

[0072] A transducer capable of converting an electric signal into a corresponding mechanical vibration to generate sound may be installed in the sound generating unit 11. The transducer (e.g., a diaphragm) may partition the housing 111 to form a front cavity and a rear cavity of the earphone. The sounds generated in the front cavity and the rear cavity are in opposite phase. The inner side surface IS is formed with a sound output hole 112 communicating with the front cavity, and the sound generated in the front cavity is guided out of the housing 111 and transmitted to the ear canal so that the user can hear the sound. One or more decompression holes 113 communicating with the rear cavity may be formed on other sides (e.g., the outer side surface OS, the upper side surface US, or the lower side surface LS, etc.) of the housing 111, whereby the sound generated in the rear cavity is guided out of the housing 111 and then interferes with and cancels out the sound leaking through the sound output hole 112 in the far field. In some embodiments, the decompression hole 113 is farther from the ear canal than the sound output hole 112, reducing anti-phase cancellation at the listening position (e.g., ear canal) between the sound output through the decompression hole 113 and the sound output through the sound output hole 112, and increasing the volume of the sound at the listening position.

[0073] In some embodiments, in addition to the inner surface IS, at least two decompression holes 113 may be formed on other sides of the housing 111 (e.g., the outer surface OS, the upper surface US, or the lower surface LS, etc.). By providing at least two decompression holes 113, standing waves in the rear cavity can be destroyed, and the resonance frequency of the sound guided from the decompression holes 113 to the outside of the housing 111 can be made as high as possible, so that the frequency response of the rear cavity has a wide flat region (e.g., the region before the resonance peak) and achieves a higher sound leakage reduction effect in the mid-high frequency range (e.g., 2kHz to 6kHz). By way of example only, the decompression holes 113 may include a first decompression hole 1131 and a second decompression hole 1132. The second decompression hole 1132 may be closer to the sound emission hole 112 than the first decompression hole 1131. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 may be located on the same side of the housing 111, for example, the first decompression hole 1131 and the second decompression hole 113 may be located simultaneously on the outer side OS, the upper side US, or the lower side LS. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 may be located on two different sides of the housing 111, for example, the first decompression hole 1131 may be located on the outer side OS and the second decompression hole 1132 may be located on the upper side US, or the first decompression hole 1131 may be located on the outer side OS and the second decompression hole 1132 may be located on the lower side LS. In some embodiments, in order to maximally destroy standing waves in the rear cavity, the two decompression holes 113 may be located on opposite sides of the housing 111, for example, the first decompression hole 1131 may be located on the upper side US, and the second decompression hole 1132 may be located on the lower side LS. For convenience of explanation, the present specification will exemplarily explain that the first decompression hole 1131 is located on the upper side US, and the second decompression hole 1132 is located on the lower side LS.

[0074] In some embodiments, in order to prevent the sound output from the first decompression hole 1131 and the second decompression hole 1132 from affecting the volume of the sound output from the sound output hole 112 at the listening position, the first decompression hole 1131 and the second decompression hole 1132 should be as far away from the sound output hole 112 as possible, for example, the center of the sound output hole 112 may be located on or near the perpendicular bisecting plane of the connecting line between the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, the center of the sound output hole 112 may be 0 mm to 2 mm away from the perpendicular bisecting plane of the connecting line between the center of the first decompression hole 1131 and the center of the second decompression hole 1132. In some embodiments, to further prevent the sound emanating from the second decompression hole 1132 from being cancelled out in phase with the sound emanating from the sound emission hole 112 in the ear canal (i.e., the listening position) and reducing the listening volume, the area of ​​the second decompression hole 1132 may be reduced to reduce the intensity of the sound emitted from the second decompression hole 1132 and transmitted to the ear canal, in which case the area of ​​the second decompression hole 1132 may be smaller than the area of ​​the first decompression hole 1131 (shown in FIG. 16 ).

[0075] In some embodiments, as shown in Fig. 7, when the open-type earphone 10 is in a worn state, the long axis direction X of the sound-generating unit 11 may be set horizontally or approximately horizontally (similar to position C shown in Fig. 2), in which case the sound-generating unit 11 is at least partially located in the antihelix 105, and the free end FE of the sound-generating unit 11 may be directed toward the back of the head. The sound-generating unit 11 may be in a horizontal or approximately horizontal state, and the projection of the long axis direction X of the sound-generating unit 11 onto the sagittal plane may coincide with the direction of the sagittal axis, the projection of the short axis direction Y onto the sagittal plane may coincide with the direction of the vertical axis, and the thickness direction Z may be perpendicular to the sagittal plane.

[0076] In some embodiments, to improve the fit between the open-type earphone 10 and the ear portion 100 and to improve the stability of the open-type earphone 10 when worn, the inner surface IS of the housing 111 may be pressed against a surface of the ear portion 100 (e.g., the antihelix 105) to increase the resistance of the open-type earphone 10 to falling out of the ear portion 100.

[0077] In some embodiments, as shown in Fig. 7 and Fig. 8, when the open-type earphone 10 is pressed against the ear part 100, the projection of the sound emission hole 112 on the sagittal plane may overlap with the projection of a structure (e.g., the concha naval 103) that is partially or entirely recessed inwardly of the ear part so that the sound emission hole 112 on the inner surface IS is not blocked by the tissue of the ear part. In some embodiments, since the concha naval 103 communicates with the concha cavity 102 and the ear canal is located within the concha cavity 102, when at least a portion of the projection of the sound emission hole 112 on the sagittal plane is located within the concha naval 103, the sound output from the sound emission hole 112 can reach the ear canal without hindrance, and the sound volume received by the ear canal is high. In some embodiments, the major axis dimension of the sound generating unit 11 should not be too long. If it is too long, the projection of the free end FE on the sagittal plane exceeds the projection of the ear part on the sagittal plane, which affects the fitting effect between the sound generating unit 11 and the ear part. Therefore, the major axis dimension of the sound generating unit 11 can be designed so that the projection of the free end FE onto the sagittal plane does not exceed the projection of the helix 107 onto the sagittal plane.

[0078] In addition, the sound output hole 112 and the decompression hole 113 (for example, the first decompression hole 1131 and the second decompression hole 1132) are installed in the housing 111, and since each side wall of the housing 111 has a constant thickness, the sound output hole 112 and the decompression hole 113 are holes with a constant depth. In this case, the sound output hole 112 and the decompression hole 113 may each have an inner opening and an outer opening. For convenience of explanation, in this application, the center O of the sound output hole 112 described above and below may be the centroid of the outer opening of the sound output hole 112, and the center of the decompression hole 113 described above and below may be the centroid of the outer opening of the decompression hole 113 (for example, the center O of the first decompression hole 1131). 1 may be the centroid of the outer opening of the first decompression hole 1131, and the center O of the second decompression hole 1132. 2may be the centroid of the outer opening of the second decompression hole 1132). In this specification, for convenience of explanation, the area of ​​the sound output hole 112 and the decompression hole 113 (for example, the first decompression hole 1131 and / or the second decompression hole 1132) may be the area of ​​the outer opening of the sound output hole 112 and the decompression hole 113 (for example, the outer opening area on the inner side IS of the sound output hole 112, the outer opening area on the upper side US of the first decompression hole 1131, and the outer opening area on the lower side LS of the second decompression hole 1132). Note that, in some other embodiments, the area of ​​the sound output hole 112 and the decompression hole 113 may be other cross-sectional areas of the sound output hole 112 and the decompression hole 113, for example, the area of ​​the inner opening of the sound output hole 112 and / or the decompression hole 113, or the average value of the inner opening area and the outer opening area of ​​the sound output hole 112 and / or the decompression hole 113, etc.

[0079] In some embodiments, the sound emission hole 112 communicating with the front cavity can be regarded as a point sound source A1 shown in Fig. 5, the decompression hole 113 (e.g., the first decompression hole 1131 and / or the second decompression hole 1132) communicating with the rear cavity can be regarded as a point sound source A2 shown in Fig. 5, and the ear canal can be regarded as a listening position shown in Fig. 5. At least a part of the housing of the sound generating unit 11 and / or at least a part of the pinna can be regarded as a baffle shown in Fig. 5, which increases the difference in acoustic distance between the sound emission hole 112 and the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal, increases the intensity of the sound in the ear canal, and maintains the sound leakage reduction effect in the far field. When the open-type earphone 10 uses the structure shown in FIG. 7, that is, when at least a part of the housing 111 is located at the antihelix 105, in terms of the listening effect, the sound waves of the sound output hole 112 can reach the ear canal directly, in this case, the sound output hole 112 may be located in the inner side IS close to the lower side LS, and at least one decompression hole may be located away from the sound output hole 112, for example, the first decompression hole 1131 may be located away from the sound output hole 112 on the outer side OS or the upper side US. The sound waves of the first decompression hole 1131 must bypass the outside of the sound generating unit 11 so as to interfere with the sound waves of the sound output hole 112 in the ear canal. In addition, the structure of the pinna that is convex upward and concave downward (for example, the antihelix, the tragus, etc. in its propagation path) also increases the acoustic distance that the sound of the first decompression hole 1131 is conducted to the ear canal. Therefore, the sound generating unit 11 itself and / or at least a part of the pinna corresponds to a baffle between the sound output hole 112 and the first decompression hole 1131, and the baffle increases the acoustic distance of the sound from the first decompression hole 1131 to the ear canal, reduces the intensity of the sound wave of the first decompression hole 1131 in the ear canal, thereby reducing the degree of cancellation in the ear canal of the sound emitted by the sound output hole 112 and the first decompression hole 1131, and increases the volume in the ear canal. As for the sound leakage effect, the sound waves generated by the sound output hole 112 and the first decompression hole 1131 and / or the second decompression hole 1132 can interfere with each other within a wide spatial range without bypassing the sound generating unit 11 itself (similar to the case where there is no baffle), so there is no obvious increase in sound leakage.Therefore, by setting appropriate positions for the sound emission hole 112, the first decompression hole 1131 and the second decompression hole 1132, the sound volume in the ear canal can be significantly increased without significantly increasing the sound leakage volume.

[0080] In some embodiments, when the projection of the free end FE onto the sagittal plane does not exceed the projection of the helix 107 onto the sagittal plane, in order to facilitate production and manufacturing, the first decompression hole 1131 and the second decompression hole 1132 may be distributed approximately symmetrically with respect to the long axis central plane of the sound generating unit 11 (e.g., the back surface NN' perpendicular to the paper surface shown in FIG. 8). In some embodiments, the center O of the second decompression hole 1132 on the lower surface LS may be approximately symmetrically distributed with respect to the long axis central plane of the sound generating unit 11 (e.g., the back surface NN' perpendicular to the paper surface shown in FIG. 8). 2 Distance a from the rear side RS 2 and the center O of the first decompression hole 1131 on the upper surface US 1 Distance a from the rear side RS 1 The difference between the center O of the second decompression hole 1132 of the lower surface LS is less than 10%. 2 Distance a from the rear side RS 2 and the center O of the first decompression hole 1131 on the upper surface US 1 Distance a from the rear side RS 1 In some embodiments, the difference between the center O of the second decompression hole 1132 of the lower surface LS is less than 5%. 2 Distance a from the rear side RS 2 and the center O of the first decompression hole 1131 on the upper surface US 1 Distance a from the rear side RS 1 The difference between the two is less than 2%. In some embodiments, the rear side surface RS of the earphone may be an arcuate surface to improve the aesthetics and wearing comfort of the earphone. When the rear side surface RS is an arcuate surface, 1 ) to the posterior side surface RS may be the distance from that position to a tangent plane parallel to the minor axis of the posterior side surface RS.

[0081] In some embodiments, the sound output hole 112 should be located close to the ear canal, and the second decompression hole 1132 on the lower side LS should be located as far away from the sound output hole 112 as possible, so as to reduce the effect of the sound emitted from the second decompression hole 1132 canceling out the sound emitted from the sound output hole 112 at the listening position (i.e., the ear canal), and further increase the volume at the listening position. Therefore, when the sound output hole 112 is located close to the lower side LS and the connecting end CE, the second decompression hole 1132 can be located close to the rear side RS to maximize the distance between the sound output hole 112 and the second decompression hole 1132. In some embodiments, when the projection of the free end FE on the sagittal plane does not exceed the projection of the helix 107 on the sagittal plane, the center O of the second decompression hole 1132 is located close to the rear side RS. 2 Distance a from the rear side RS 2 The range of the center O of the second decompression hole 1132 may be 8.60 mm to 20.27 mm. 2 Distance a from the rear side RS 2 The range of the center O of the second decompression hole 1132 may be 8.60 mm to 12.92 mm. 2 Distance a from the rear side RS 2 The range of may be 9.60 mm to 11.92 mm. In some embodiments, when the open-type earphone 10 is in a worn state, the free end FE may come into contact with the ear part (e.g., the helix 107), and a part of the upper surface US and / or the lower surface LS may be blocked by the ear part. In this case, in order to avoid the second decompression hole 1132 of the lower surface LS (or the first decompression hole 1131 of the upper surface US) being blocked by the ear part 100 and affecting the acoustic performance of the open-type earphone 10, the center O of the second decompression hole 1132 may be set to 0.5 mm. 2 Distance a from the rear side RS 2 The range of the center O of the second decompression hole 1132 may be 10.10 mm to 11.42 mm. 2 Distance a from the rear side RS 2 The range may be 10.30 mm to 11.12 mm. More preferably, the center O of the second decompression hole 1132 may be 10.30 mm to 11.12 mm. 2 Distance a from the rear side RS 2The range may be 10.60 mm to 11.82 mm.

[0082] In some embodiments, the center O of the second decompression hole 1132 2 Distance a from the rear side RS 2 and the center O of the first decompression hole 1131 1 Distance a from the rear side RS 1 If the difference between the center O of the first decompression hole 1131 and the center O of the first decompression hole 1131 is less than 10%, 1 Distance a from the rear side RS 1 The range of the center O of the first decompression hole 1131 may be 8.60 mm to 15.68 mm. 1 Distance a from the rear side RS 1 In some embodiments, the center O of the first decompression hole 1131 is adjusted so that the projection of the first decompression hole 1131 on the sagittal plane substantially overlaps with the projection of the inwardly recessed structure of the ear on the sagittal plane. 1 Distance a from the rear side RS 1 The range of the center O of the first decompression hole 1131 may be 9.60 mm to 11.92 mm. 1 Distance a from the rear side RS 1 The range may be 10.10 mm to 11.42 mm. More preferably, the center O of the first decompression hole 1131 may be 1 Distance a from the rear side RS 1 The range may be 10.30 mm to 11.12 mm. More preferably, the center O of the first decompression hole 1131 may be 10.30 mm to 11.12 mm. 1 Distance a from the rear side RS 1 The range may be 10.60 mm to 11.82 mm.

[0083] In some embodiments, the first decompression hole 1131 may be farther from the sound output hole 112 than the second decompression hole 1132, and the gap between the ear portion 100 and the inner surface IS is smaller, so that sound generated at the first decompression hole 1131 is less likely to be transmitted to the ear canal than the second decompression hole 1132. Therefore, in some embodiments, the center O of the first decompression hole 1131 may be farther from the sound output hole 112 than the center O of the second decompression hole 1132. 1The distance from the center O of the second decompression hole 1132 to the rear side surface RS is 2 For example, the distance from the center O of the first decompression hole 1131 to the rear side surface RS may be smaller than the distance from the center O of the first decompression hole 1131 to the rear side surface RS. 1 The range of the distance from the center O of the second decompression hole 1132 to the rear side surface RS is 10.44 mm to 15.68 mm. 2 The range of distance from the to the posterior surface RS is 13.51 mm to 20.27 mm.

[0084] In some embodiments, as shown in FIG. 9, the sound generating efficiency of the open-type earphone 10 (i.e., the listening volume at the listening position) can be improved by increasing the dimension in the thickness direction Z of the open-type earphone 10 to increase the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal. Furthermore, by locating the first decompression hole 1131 and / or the second decompression hole 1132 away from the inner surface IS, the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal can be further increased, and the sound generating efficiency of the open-type earphone 10 can be improved. In addition, the overall dimension of the sound generating unit 11 should not be too large (e.g., the dimension of the sound generating unit 11 in the Z direction should not be too large), otherwise the overall mass of the open-type earphone 10 will increase, affecting the user's wearing comfort. In some embodiments, the center O of the first decompression hole 1131 is located at a position closer to the center O of the first decompression hole 1131 than the center O of the second decompression hole 1132. 1 Distance d from the inner surface IS 1 In some embodiments, the center O of the first decompression hole 1131 is in the range of 4.24 mm to 7.96 mm. 1 Distance d from the inner surface IS 1 In some embodiments, the center O of the first decompression hole 1131 is in the range of 4.43 mm to 7.96 mm. 1 Distance d from the inner surface IS 1The range of is 5.43 mm to 6.96 mm. In some embodiments, the first decompression hole 1131 and / or the second decompression hole 1132 may be installed away from the inner surface IS in order to achieve the purpose of making the projection of the first decompression hole 1131 on the horizontal plane slightly overlap or not overlap with the projection of the ear unit 100 on the horizontal plane in the worn state, so that the sound output from the first decompression hole 1131 and / or the second decompression hole 1132 can be transmitted to the ear canal or reflected by a part of the structure of the ear unit 100 (e.g., the pinna) and refracted to be transmitted to the ear canal, and can be radiated more outward. By installing in this way, the acoustic distance from the first decompression hole 1131 and / or the second decompression hole 1132 to the ear canal can be further increased, and the sound generation efficiency of the open-type earphone 10 can be improved. In some embodiments, the center O of the first decompression hole 1131 is located at a position away from the inner surface IS. 1 Distance d from the inner surface IS 1 In some embodiments, the center O of the first decompression hole 1131 is in the range of 5.63 mm to 7.96 mm. 1 Distance d from the inner surface IS 1 The range is 6.25mm to 7.56mm.

[0085] In some embodiments, the center O of the second decompression hole 1132 2 Distance d from the inner surface IS 2 is the center O of the first decompression hole 1131 1 Distance d from the inner surface IS 1 In some embodiments, the center O of the second decompression hole 1132 may be the same as 2 Distance d from the inner surface IS 2 In some embodiments, the center O of the second decompression hole 1132 is in the range of 4.43 mm to 7.96 mm. 2 Distance d from the inner surface IS 2 In some embodiments, the center O of the second decompression hole 1132 is in the range of 5.43 mm to 6.96 mm. 2 Distance d from the inner surface IS 2 In some embodiments, the center O of the second decompression hole 1132 is in the range of 5.63 mm to 7.96 mm. 2 Distance d from the inner surface IS2 The range is 6.25mm to 7.56mm.

[0086] In some embodiments, in order to bring the sound emitting hole 112 closer to the ear canal to enlarge the listening position, it is necessary to bring the sound emitting hole 112 closer to the lower surface LS. In this case, the second decompression hole 1132 is closer to the inner surface IS than the first decompression hole 1131. In order to reduce the effect that the sound emitted from the second decompression hole 1132 is offset by the sound emitted from the sound emitting hole 112 at the listening position (i.e., the ear canal) and to further increase the volume at the listening position, the second decompression hole 1132 may be farther from the inner surface IS than the first decompression hole 1131 in the Z direction, i.e., the center O of the second decompression hole 1132 may be closer to the lower surface LS than the first decompression hole 1131. 2 Distance d from the inner surface IS 2 is the center O of the first decompression hole 1131 1 Distance d from the inner surface IS 1 For example, the center O of the first decompression hole 1131 may be different from the center O of the first decompression hole 1131. 1 Distance d from the inner surface IS 1 The range is 5.63 mm to 6.5 mm, and the center O of the second decompression hole 1132 2 Distance d from the inner surface IS 2 The range is 6.5mm to 7.56mm.

[0087] The above description of the open-type earphone 10 is merely for the purpose of explanation and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, when only one decompression hole is provided in the sound generating unit 11, the decompression hole may be either the first decompression hole 1131 or the second decompression hole 1132. For example, the decompression hole may be the first decompression hole 1131, that is, the decompression hole may be provided on the upper side surface US. The distance from the center of the decompression hole to the inner side surface IS may range from 4.24 mm to 7.96 mm, and the distance from the center of the decompression hole to the rear side surface RS may range from 8.60 mm to 15.68 mm. These changes and modifications are still within the scope of protection of the present application.

[0088] In some embodiments, a cavity structure can be constructed around one of the dual point sound sources to increase the listening volume, especially the listening volume of the mid-low frequency, while still retaining the effect of far-field sound leakage cancellation. Figure 10 is an exemplary distribution schematic diagram of a cavity structure installed around one of the dipole sound sources according to some embodiments of the present application.

[0089] As shown in FIG. 10, when a cavity structure 41 is installed between dipole sound sources, one of the dipole sound sources and the listening position are inside the cavity structure 41, and the other dipole sound source is outside the cavity structure 41. The sound derived from the dipole sound source inside the cavity structure 41 is restricted by the cavity structure 41, that is, the cavity structure 41 can converge the sound and propagate more of the sound into the listening position, thereby improving the volume and quality of the sound at the listening position. In the present application, the "cavity structure" may be understood as a semi-closed structure surrounded by the side wall of the sound generating unit 11 and the concha structure, and the semi-closed structure has a leak structure 42 (e.g., an opening, a gap, a duct, etc.) that acoustically communicates with the outside environment, rather than completely sealing and blocking the inside from the outside environment. Exemplary leak structures may include, but are not limited to, an opening, a gap, a duct, etc., or any combination thereof.

[0090] In some embodiments, the cavity structure 41 may include a listening position and at least one sound source. Here, "including" may indicate that the listening position and / or the sound source are inside the cavity, or that the listening position and / or the sound source are located at an edge of the interior of the cavity. In some embodiments, the listening position may be the entrance of the ear canal or the acoustic reference point of the ear.

[0091] Fig. 11A is a schematic diagram of the listening principle when a cavity structure is constructed around one of a dipole sound source and a dipole sound source according to some embodiments of the present application. Fig. 11B is a schematic diagram of the sound leakage principle when a cavity structure is constructed around one of a dipole sound source and a dipole sound source according to some embodiments of the present application.

[0092] For near-field listening, in a dipole in which a cavity structure is constructed around one of the sound sources as shown in FIG. 11A, since one of the sound sources A is surrounded by the cavity structure, most of the radiated sound reaches the listening position in a direct or reflected manner. In contrast, if there is no cavity structure, most of the sound radiated from the sound source does not reach the listening position. Therefore, by installing a cavity structure, the sound volume reaching the listening position can be significantly increased. Also, only a small part of the anti-phase sound radiated from the anti-phase sound source B outside the cavity structure enters the cavity structure through the leakage structure of the cavity structure. This corresponds to the secondary sound source B' being generated in the leakage structure, and its intensity is significantly smaller than that of the sound source B and significantly smaller than that of the sound source A. The sound generated by the secondary sound source B' has a weak effect of anti-phase cancellation generated for the sound source A in the cavity, thereby significantly increasing the listening volume at the listening position.

[0093] Regarding sound leakage, as shown in Fig. 11B, sound source A radiates sound to the outside through the leaking structure of the cavity, which is equivalent to secondary sound source A' being generated in the leaking structure, and since almost all of the sound radiated from sound source A is output from the leaking structure and the structural scale of the cavity is much smaller (at least one order of magnitude smaller) than the spatial scale for evaluating sound leakage, it is considered that the strength of secondary sound source A' is equivalent to the strength of sound source A. The sound cancellation effect generated by secondary sound source A' and sound source B in the external space is equivalent to the sound cancellation effect generated by sound source A and sound source B. In other words, the cavity structure still maintains a considerable sound leakage reduction effect.

[0094] It should be noted that the above leakage structure with one opening is merely exemplary, and the leakage structure of the cavity structure may include one or more openings, and may achieve a good listening index, and the listening index may be the inverse of the sound leakage index α, 1 / α. Taking a structure with two openings as an example, the following will analyze the cases of equal openings and equal opening ratios. Compared with a structure with only one hole, the "equal openings" here means that two openings of the same size as the structure with only one hole are installed, and the "equal opening ratio" means that the sum of the opening areas of the two installed holes is the same as the structure with only one hole. The equal openings correspond to a structure with only one hole having a relative opening size (i.e., the ratio between the opening area S of the leakage structure in the cavity structure and the area S0 directly affected by the sound source included in the cavity structure) doubled, and as mentioned above, the overall listening index is reduced. Even if the S / S0 ratio is the same as that of a structure with only one hole in the case of equal aperture ratio, the distances from the two openings to the external sound source are different, resulting in different listening indices.

[0095] Fig. 12A is a schematic diagram of a cavity structure with two horizontal openings according to some embodiments of the present application. Fig. 12B is a schematic diagram of a cavity structure with two vertical openings according to some embodiments of the present application. As shown in Fig. 12A, when the connecting line of the two openings is parallel to the connecting line of the two sound sources (i.e., two horizontal openings), the distances from the two openings to the external sound source are maximum and minimum, respectively, and as shown in Fig. 12B, when the connecting line of the two openings is perpendicular to the connecting line of the two sound sources (i.e., two vertical openings), the distances from the two openings to the external sound source are equal and take an intermediate value.

[0096] FIG. 13 is a comparison diagram of the listening index curves of a cavity structure having two openings and a cavity structure having one opening according to some embodiments of the present application. As shown in FIG. 13, the cavity structure with equal openings has a lower overall listening index than the cavity structure with one opening. For the cavity structure with equal opening ratio, the distances from the two openings to the external sound source are different, resulting in different listening indexes. As can be seen from FIG. 12A, FIG. 12B, and FIG. 13, the listening index of the leak structure with equal opening ratio is higher than that of the leak structure with equal opening ratio, whether it is a horizontal opening or a vertical opening. This is because the relative opening size S / S0 of the leak structure with equal opening ratio is reduced to 1 / 2 compared to the leak structure with equal opening ratio, resulting in a higher listening index. Also, as can be seen from FIG. 12A, FIG. 12B, and FIG. 13, the listening index of the horizontal opening is higher whether it is a leak structure with equal opening ratio or a leak structure with equal opening ratio. This is because, in the leakage structure of the horizontal openings, the distance from one of the openings to the external sound source is smaller than the distance between the two sound sources, and the distance between the secondary sound source thus formed and the external sound source is closer than the original two sound sources, so that the listening index is higher and the sound leakage reduction effect is further improved. Therefore, in order to improve the sound leakage reduction effect, the distance from at least one opening to the external sound source may be made smaller than the distance between the two sound sources.

[0097] Also, as shown in FIG. 13, the cavity structure using two openings can better improve the resonance frequency of the air sound in the cavity structure compared to the cavity structure with one opening, so that the whole device has a better listening index in the high frequency band (e.g., sound with a frequency close to 10000Hz) compared to the cavity structure with only one opening. The high frequency band is the frequency band where the human ear is more sensitive, so there is a greater need for sound leakage reduction. Therefore, in order to improve the sound leakage reduction effect in the high frequency band, a cavity structure with the number of openings greater than one may be selected.

[0098] Fig. 14 is an exemplary schematic view of an open-type earphone according to some other embodiments of the present application. Fig. 15 is a schematic view of the ear side of the open-type earphone shown in Fig. 14.

[0099] The open-type earphone 10 shown in FIG. 14 has a structure similar to that of the open-type earphone 10 shown in FIG. 7, and for example, the ear hook 12 has an arc-shaped structure that fits the boundary between the user's head and the ear part 100. The sound generating unit 11 (or the housing 111 of the sound generating unit 11) may have a connection end CE connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. When the open-type earphone 10 is in a worn state, the first part 121 of the ear hook 12 (for example, the hook-shaped part of the ear hook 12) is hooked between the user's auricle (for example, the helix 107) and the head, and the second part 122 of the ear hook 12 (for example, the connection part of the ear hook) extends to the side of the auricle away from the head and is connected to the connection end CE of the sound generating unit 11, fixing the sound generating unit 11 at a position near the ear canal so as not to block the ear canal. 14 is similar in structure to the open-type earphone 10 shown in FIG 7, and the main difference is that the sound generating unit 11 is installed at an angle, and the housing 111 of the sound generating unit 11 is at least partially inserted into the concha cavity 102, and for example, the free end FE of the sound generating unit 11 may be inserted into the concha cavity 102. The ear hook 12 and sound generating unit 11 having such a structure are highly compatible with the user's ear part 100, and can improve the wearing stability of the open-type earphone 10 by increasing the resistance of the open-type earphone 10 to falling off from the ear part 100.

[0100] In some embodiments, when worn, the connection end CE of the sound generating unit 11 is closer to the vertex than the free end FE, as viewed from the thickness direction Z, so that the free end FE is inserted into the cavity of the concha. Based on this, the included angle between the short axis direction Y and the direction in which the sagittal axis of the human body is located may be 30° to 40°. If the included angle is too small, it is likely that the free end FE cannot be inserted into the cavity of the concha and the sound output hole 112 of the sound generating unit 11 is too far from the ear canal, and if the included angle is too large, it is likely that the sound generating unit 11 cannot be inserted into the cavity of the concha and the ear canal is blocked by the sound generating unit 11. In other words, by installing in this manner, the sound generating unit 11 can be inserted into the cavity of the concha, and the sound output hole 112 of the sound generating unit 11 has an appropriate distance from the ear canal, so that the ear canal is not blocked and the user can hear more of the sound generated by the sound generating unit 11.

[0101] In some embodiments, the sound generating unit 11 and the ear hook 12 may clamp the ear region corresponding to the cavity of the concha from both the front and rear sides, thereby increasing the resistance of the open-type earphone 10 against falling off from the ear and improving the stability of the open-type earphone 10 when worn. For example, the free end FE of the sound generating unit 11 is pressed into the cavity of the concha in the thickness direction Z. Also, for example, the free end FE abuts against the cavity of the concha in the long axis direction X and the short axis direction Y.

[0102] In some embodiments, both ends of the second portion 122 of the earhook 12 may be connected to the first portion 121 of the earhook 12 and the connection end CE of the sound-generating unit 11, respectively (as shown in FIG. 15 ). In some embodiments, the second portion 122 of the earhook 12 may have a lowest point P and a highest point Q along the short-axis direction Y of the sound-generating unit 11. When the open-type earphone 10 is in a worn state, in order to prevent the first decompression hole 1131 from being blocked by an ear structure (e.g., the helix or the tragus), the distance h between the center of the first decompression hole 1131 and the lowest point P in the long-axis direction X of the sound-generating unit 11 may be set to 1 / 2. 1In some embodiments, the distance h between the center of the first decompression hole 1131 and the highest point Q in the long axis direction X of the sound generating unit 11 is set to 5.28 mm to 7.92 mm so that the open-type earphone 10 can fit to the user's ear when the user wears the earphone. 2 may be 8.68 mm to 13.02 mm. In some embodiments, when a user wears an open-type earphone, the range of the distance between the center of the first decompression hole 1131 and any point in the second part 122 of the ear hook 12 in the long axis direction X of the sound generating unit 11 is 5.28 mm to 14 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point in the second part 122 of the ear hook in the long axis direction X of the sound generating unit 11 is 5.28 mm to 13.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point in the second part 122 of the ear hook in the long axis direction X of the sound generating unit 11 is 6.58 mm to 12.02 mm. In some embodiments, the range of the distance between the center of the first decompression hole 1131 and any point in the second part 122 of the ear hook in the long axis direction X of the sound generating unit 11 is 7.58 mm to 10.02 mm. In some embodiments, the range of the distance in the long axis direction X of the sound generating unit 11 between the center of the first decompression hole 1131 and any point in the second earhook portion 122 is 8.58 mm to 9.02 mm.

[0103] As shown in FIG. 14, when a user wears the open-type earphone 10, the housing 111 of the sound-generating unit 11 is positioned so as to be at least partially inserted into the concha cavity 102, so that the cavity surrounded by the inner surface IS of the sound-generating unit 11 and the concha cavity 102 can be regarded as the cavity structure 41 shown in FIG. 10, and the gap formed between the inner surface IS and the concha cavity (for example, the first leakage structure UC formed between the inner surface IS and the concha cavity near the top of the head, and the second leakage structure LC formed between the inner surface IS and the ear part near the ear canal) can be regarded as the leakage structure 42 shown in FIG. 10. The sound emission hole 112 installed on the inner surface IS can be regarded as a point sound source inside the cavity structure 41 shown in Fig. 10, and the decompression holes 113 (for example, the first decompression hole 1131 and the second decompression hole 1132) installed on the other side (for example, the upper side US and / or the lower side LS) of the sound generating unit 11 can be regarded as a point sound source outside the cavity structure 41 shown in Fig. 10. Thus, according to the related description of Figs. 10 to 13, when the open type earphone 10 is worn in a manner in which it is at least partially inserted into the concha cavity, that is, when it is worn in a manner as shown in Fig. 14, in terms of the listening effect, most of the sound radiated from the sound emission hole 112 can reach the ear canal in a direct or reflected manner, and the volume of the sound reaching the ear canal, especially the listening volume of the mid-low frequency can be significantly increased. Also, only a small portion of the antiphase sound radiated from the decompression holes 113 (e.g., the first decompression holes 1131 and the second decompression holes 1132) enters the concha cavity through the gaps (the first leakage structure UC and the second leakage structure LC), and the antiphase cancellation effect generated for the sound output hole 112 is weak, thereby significantly increasing the listening volume in the ear canal. As for the sound leakage effect, the sound output hole 112 outputs sound to the outside through the gaps and can be cancelled out in the far field with the sound generated by the decompression holes 113 (e.g., the first decompression holes 1131 and the second decompression holes 1132), thereby ensuring the sound leakage reduction effect.

[0104] In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 are offset in the X direction so as not to be blocked by the tragus. 1 and the center O of the second decompression hole 1132 2 In some embodiments, the distance between the center O of the first decompression hole 1131 and the center O of the first decompression hole 1131 may be 7 mm to 15.2 mm. 1 and the center O of the second decompression hole 1132 2 In some embodiments, the distance between the center O of the first decompression hole 1131 and the center O of the first decompression hole 1131 may be 8 mm to 13 mm. 1 and the center O of the second decompression hole 1132 2 In some embodiments, the distance between the center O of the first decompression hole 1131 and the center O of the first decompression hole 1131 may be 12.64 mm. 1 and the center O of the second decompression hole 1132 2 In some embodiments, the distance between the center O of the first decompression hole 1131 and the center O of the first decompression hole 1131 may be 7.5 mm to 14 mm. 1 and the center O of the second decompression hole 1132 2 In some embodiments, the distance between the center O of the first decompression hole 1131 and the center O of the first decompression hole 1131 may be 12 mm to 13 mm. 1 and the center O of the second decompression hole 1132 2 The distance between them may be 13 mm to 15.2 mm.

[0105] In some embodiments, in order to avoid the sound output from the first decompression hole 1131 and the second decompression hole 1132 affecting the volume of the sound output from the sound output hole 112 at the listening position, the first decompression hole 1131 and the second decompression hole 1132 should be as far away from the sound output hole 112 as possible, for example, the center of the sound output hole 112 may be located on the perpendicular bisector or near the perpendicular bisector of the connecting line between the center of the first decompression hole 1131 and the center of the second decompression hole 1132.

[0106] In some embodiments, the center O of the first decompression hole 1131 1 and the center O of the sound emission hole 112 (also called the first distance), and the center O of the second decompression hole 1132 2and the distance (also called the second distance) between the center O of the sound emitting hole 112, the center O of the sound emitting hole 112 is determined to be approximately the same as the connecting line O 1 O 2 In some embodiments, the difference between the first distance and the second distance is less than 10%. In some embodiments, the difference between the first distance and the second distance is less than 8%. In some embodiments, the difference between the first distance and the second distance is less than 5%. In some embodiments, the difference between the first distance and the second distance is less than 2%.

[0107] In some embodiments, in order to avoid that the sound waves emitted by the decompression holes (e.g., the first decompression hole 1131 and the second decompression hole 1132) and the sound emission hole 112 are offset in the near field and affect the user's listening quality, the distance between the first decompression hole 1131 and the second decompression hole 1132 and the sound emission hole 112 should not be too close. In some embodiments, the center O of the first decompression hole 1131 is set to 0.5 mm. 1 The distance between the center O of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 4 mm to 15.11 mm. 1 The distance between the center O of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 4 mm to 15 mm. 1 The distance between the center O of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 5.12 mm to 15.11 mm. 1 The distance between the center O of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 5 mm to 14 mm or more. 1 The distance between the center O of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 6 mm to 13 mm or more. 1 The distance between the center O of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 7 mm to 12 mm or more. 1 The distance between the center O of the first decompression hole 1131 and the center O of the sound emission hole 112 may be 8 mm to 10 mm or more.1 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 9.55 mm. 2 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 4 mm to 16.1 mm. 2 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 4 mm to 15 mm or more. 2 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 5 mm to 14 mm or more. 2 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 5.12 mm to 16.1 mm. 2 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 6 mm to 13 mm or more. 2 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 7 mm to 12 mm or more. 2 The distance between the center O of the second decompression hole 1132 and the center O of the sound emission hole 112 may be 8 mm to 10 mm or more. 2 and the center O of the sound emission hole 112 may be 9.15 mm.

[0108] In some embodiments, in order to maximize the distance between the first decompression hole 1131 and the second decompression hole 1132 and the sound emission hole 112, the center O of the first decompression hole 1131 is 1 and the center O of the sound emission hole 112 1 O and the center O of the second decompression hole 1132 2 and the center O of the sound emission hole 112 2 In some embodiments, the angle between the connecting line O and the connecting line O can be reduced. 1 O and connecting line O 2 The angle range between the connecting line O and the connecting line O is 46.40° to 114.04°. 1 O and connecting line O 2The angle range between the connecting line O and the connecting line O is 46.40° to 90.40°. 1 O and connecting line O 2 The angle range between the connecting line O and the connecting line O is 46.40° to 70.04°. 1 O and connecting line O 2 The angle range between the center O of the first decompression hole 1131 and the center O of the first decompression hole 1131 is 46.40° to 60.04°. 1 and the center O of the second decompression hole 1132 2 Connection line with O 1 O 2 and connecting line O 2 The angle range between the connecting line O and the connecting line O is 19.72° to 101.16°. 1 O 2 and connecting line O 2 The angle range between O and is 19.71° to 97.75°.

[0109] In some embodiments, the first decompression hole 1131 is farther from the connection end CE than the second decompression hole 1132. Since the center of the sound emission hole 112 is located on or near the perpendicular bisecting plane of the connection line between the center of the first decompression hole 1131 and the center of the second decompression hole 1132, the sound emission hole 112 is located on the side of the housing 111 close to the second decompression hole 1132 in the Y direction, rather than at the middle position (as shown in FIG. 16). Since the sound emission hole 112 is installed close to the ear canal, the second decompression hole 1132 is close to the ear canal, and the first decompression hole 1131 is far from the ear canal. Compared to the first decompression hole 1131, the sound waves emitted from the second decompression hole 1132 are more likely to be canceled out by the sound waves emitted from the sound emission hole 112 in the near field. Therefore, compared with the first decompression hole 1131, the size of the second decompression hole 1132 may be smaller to reduce the sound leakage of the second decompression hole 1132, that is, the area of ​​the second decompression hole 1132 may be smaller than the area of ​​the first decompression hole 1131. In some embodiments, in order to ensure that the frequency response curves of the first decompression hole 1131 and the second decompression hole 1132 are as close as possible to achieve a high sound deadening effect, it is not preferable that the difference in area between the first decompression hole 1131 and the second decompression hole 1132 is too large. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 and the first decompression hole 1131 is 0.9 or less. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 and the first decompression hole 1131 is 0.8 or less. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 to the first decompression hole 1131 is less than or equal to 0.7. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 to the first decompression hole 1131 is less than or equal to 0.6. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 to the first decompression hole 1131 may be 0.55.

[0110] In some embodiments, for example, in the configuration of Fig. 14, in order to bring the sound output hole 112 closer to the user's ear canal, the sound output hole 112 can be closer to the lower end of the sound generating unit 11 in the Y direction, i.e., the lower side surface LS (shown in Fig. 16) where the second decompression hole 1132 is located. At this time, the distance between the sound output hole 112 and the first decompression hole 1131 in the Y direction is larger than the distance between the sound output hole 112 and the second decompression hole 1132 in the Y direction, thereby avoiding the sound waves propagated through the sound output hole 112 and the first decompression hole 1131 from being offset in the near field, thus helping to increase the volume of the sound propagated through the sound output hole 112 that is heard by the user. Accordingly, the second decompression hole 1132 is closer to the connection end CE than the sound emission hole 112, and the distance between them in the X direction is increased, thereby avoiding the sound waves propagating through the sound emission hole 112 and the second decompression hole 1132 from being canceled in the near field, and thus helping to increase the volume of the sound propagated through the sound emission hole 112 that is heard by the user. In some embodiments, the center O of the sound emission hole 112 and the center O of the first decompression hole 1131 in the Y direction are 1 and the distance between the center O of the sound emission hole 112 and the center O of the second decompression hole 1132. 2 The difference between the distance between the center O of the second decompression hole 1132 in the X direction and the distance between the center O of the second decompression hole 1132 in the X direction may be 2 mm to 10 mm. 2 The difference between the distance between the center O of the sound emitting hole 112 and the connection end CE and the distance between the center O of the sound emitting hole 112 and the connection end CE may be 2 mm to 15 mm. 1 and the distance between the center O of the sound emission hole 112 and the center O of the second decompression hole 1132. 2 The difference between the distance between the center O of the second decompression hole 1132 in the X direction and the distance between the center O of the second decompression hole 1132 in the X direction may be 3 mm to 9 mm. 2 The difference between the distance between the center O of the sound emitting hole 112 and the connection end CE and the distance between the center O of the sound emitting hole 112 and the connection end CE may be 4 mm to 12 mm. 1 and the distance between the center O of the sound emission hole 112 and the center O of the second decompression hole 1132. 2The difference between the distance between the center O of the second decompression hole 1132 in the X direction and the distance between the center O of the second decompression hole 1132 in the X direction may be 5 mm to 7 mm. 2 The difference between the distance between the center O of the sound emitting hole 112 and the connection end CE and the distance between the center O of the sound emitting hole 112 and the connection end CE may be 6 mm to 8 mm. When the side surface of the housing 111 corresponding to the connection end CE is an arcuate surface, 1 Or the center O of the second decompression hole 1132 2 The distance from the position to the connection end CE (or the side surface) may be the distance from the position to a tangent plane parallel to the minor axis of the connection end CE.

[0111] In some embodiments, as shown in Figs. 14 and 15, in order to insert the sound generating unit 11 at least partially into the concha cavity, the major axis dimension of the sound generating unit 11 must not be too long. On the premise of ensuring that the sound generating unit 11 is at least partially inserted into the concha cavity, the distance from the first decompression hole 1131 and the second decompression hole 1132 to the rear side surface RS of the sound generating unit 11 must not be too short, otherwise the area of ​​the first decompression hole 1131 and / or the second decompression hole 1132 may be entirely or partially blocked in the X direction by the abutment between the free end FE and the wall surface of the concha cavity, thereby reducing the effective area of ​​the first decompression hole 1131 and / or the second decompression hole 1132. Therefore, in some embodiments, the center O of the first decompression hole 1131 may be too short. 1 Distance a from the rear side RS 3 In some embodiments, the center O of the first decompression hole 1131 is in the range of 8.60 mm to 15.68 mm. 1 Distance a from the rear side RS 3 In some embodiments, the center O of the first decompression hole 1131 is in the range of 10.44 mm to 15.68 mm. 1 Distance a from the rear side RS 3 In some embodiments, the center O of the first decompression hole 1131 is in the range of 11.00 mm to 14.55 mm. 1 Distance a from the rear side RS 3 The range is 12.15mm to 13.25mm.

[0112] Furthermore, as shown in FIG. 16, in order to prevent the area of ​​the first decompression hole 1131 and / or the second decompression hole 1132 from being entirely or partially blocked in the Z direction and the effective area of ​​the first decompression hole 1131 and / or the second decompression hole 1132 from being reduced, the center O of the first decompression hole 1131 is preferably 1 / 2 mm or more. 1 The distance along the Z direction from the center O of the first decompression hole 1131 to the inner surface IS of the sound generating unit 11 should not be too small. 1 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 3 In some embodiments, the center O of the first decompression hole 1131 is in the range of 4.24 mm to 6.38 mm. 1 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 3 In some embodiments, the center O of the first decompression hole 1131 is in the range of 4.50 mm to 5.85 mm. 1 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 3 In some embodiments, the center O of the first decompression hole 1131 is in the range of 4.80 mm to 5.50 mm. 1 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 3 The range is 5.20mm to 5.55mm.

[0113] In some embodiments, in order to bring the sound output hole 112 closer to the ear canal to improve listening efficiency, it is necessary to bring the sound output hole 112 closer to the free end FE. In this case, in order to prevent the sound emitted from the second decompression hole 1132 from canceling out the sound emitted from the sound output hole 112 in the ear canal (i.e., the listening position) and reducing the listening volume, the second decompression hole 1132 may be located away from the rear side surface RS (or the free end FE). Furthermore, since the first decompression hole 1131 is located on the upper side surface US and is farther away from the sound output hole 112 than the second decompression hole 1132, and the gap between the ear portion 100 and the inner side surface IS is smaller, the sound generated at the first decompression hole 1131 is less likely to be transmitted to the ear canal than the second decompression hole 1132. Therefore, in some embodiments, the distance from the center of the first decompression hole 1131 to the rear side surface RS may be smaller than the distance from the center of the second decompression hole 1132 to the rear side surface RS. In some embodiments, the distance from the center of the first decompression hole 1131 to the rear side RS may be equal to or greater than the distance from the center of the second decompression hole 1132 to the rear side RS. 2 Distance a from the rear side RS 4 In some embodiments, the center O of the second decompression hole 1132 is in the range of 13.51 mm to 20.27 mm. 2 Distance a from the rear side RS 4 In some embodiments, the center O of the second decompression hole 1132 is in the range of 15.00 mm to 19.55 mm. 2 Distance a from the rear side RS 4 The range is 17.15mm to 18.25mm.

[0114] Further, in some embodiments, the center O of the first decompression hole 1131 1 and the center O of the second decompression hole 1132 2 The distance along the Z direction to the inner surface IS of the sound generating unit 11 may be the same. 2 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 4In some embodiments, the center O of the second decompression hole 1132 is in the range of 4.24 mm to 6.38 mm. 2 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 4 In some embodiments, the center O of the second decompression hole 1132 is in the range of 4.50 mm to 5.85 mm. 2 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 4 In some embodiments, the center O of the second decompression hole 1132 is in the range of 4.80 mm to 5.50 mm. 2 Distance d along the Z direction from the inner surface IS of the sound generating unit 11 4 The range of is 5.20 mm to 5.55 mm. In some embodiments, in order to improve listening efficiency by bringing the sound emitting hole 112 closer to the ear canal, it is necessary to bring the sound emitting hole 112 closer to the lower side surface LS. In this case, in order to prevent the sound emitted from the second decompression hole 1132 from being offset by the sound emitted from the sound emitting hole 112 in the ear canal (i.e., the listening position) and reducing the listening volume, the second decompression hole 1132 may be farther from the inner side surface IS than the first decompression hole 1131 in the Z direction, i.e., the center O of the second decompression hole 1132 may be closer to the lower side surface IS than the first decompression hole 1131. 2 The distance from the center O of the first decompression hole 1131 to the inner surface IS is 1 For example, the distance from the center O of the first decompression hole 1131 to the inner surface IS may be different. 1 The distance from the center O of the second decompression hole 1132 to the inner surface IS is 2.24 mm to 5.57 mm. 2 The distance from the to the inner surface IS is 5.57 mm to 6.36 mm.

[0115] In some embodiments, the shape of the first decompression hole 1131 and the second decompression hole 1132 also affects their acoustic mass. The acoustic resistance of the elongated first decompression hole 1131 and the second decompression hole 1132 is large, so the sound intensity of the rear cavity is reduced. Therefore, in order to ensure the sound intensity output from the first decompression hole 1131 and the second decompression hole 1132, the ratio of the long axis dimension to the short axis dimension of the first decompression hole 1131 and the second decompression hole 1132 (also called the aspect ratio of the decompression hole 113) should not be too large. In addition, due to the dimensional limit in the thickness direction Z of the sound generating unit 11, the maximum dimension in the thickness direction Z of the first decompression hole 1131 and the second decompression hole 1132 should not be too large. Therefore, when the area of ​​the decompression hole 113 is constant, the ratio of the long axis dimension to the short axis dimension of the first decompression hole 1131 and the second decompression hole 1132 should not be too small. In some embodiments, the shapes of the first decompression hole 1131 and the second decompression hole 1132 may include, but are not limited to, a circle, an ellipse, a racetrack shape, etc. For convenience of explanation, the following will exemplify the first decompression hole 1131 and the second decompression hole 1132 being set in a racetrack shape.

[0116] Fig. 16 is a schematic diagram of the housing of an open-type earphone according to some embodiments of the present application. As shown in Fig. 16, the first decompression hole 1131 and the second decompression hole 1132 may be racetrack-shaped, and both ends of the racetrack shape may be minor arc-shaped or semicircular. In this case, the maximum dimension in the thickness direction Z of the first decompression hole 1131 and the second decompression hole 1132 is defined as the corresponding minor axis dimension, and the minor axis dimension of the first decompression hole 1131 is W 1 and the minor axis dimension of the second decompression hole 1132 is W 2 The maximum dimensions of the first decompression hole 1131 and the second decompression hole 1132 in the long axis direction X are defined as corresponding long axis dimensions, and the long axis dimension of the first decompression hole 1131 is L 1 and the major axis dimension of the second decompression hole 1132 is L 2Based on the above principle, the ratio of the major axis dimension to the minor axis dimension of the first decompression hole 1131 and the second decompression hole 1132 should not be too large or too small, and in some embodiments, the major axis dimension L 1 and the minor axis dimension W of the first decompression hole 1131 1 The ratio of the major axis dimension L of the first decompression hole 1131 may range from 1 to 8. 1 and the minor axis dimension W of the first decompression hole 1131 1 The ratio of the major axis dimension L of the first decompression hole 1131 to the major axis dimension L of the first decompression hole 1131 may be in the range of 1.33 to 8. 1 and the minor axis dimension W of the first decompression hole 1131 1 The ratio of the major axis dimension L of the first decompression hole 1131 to the major axis dimension L of the first decompression hole 1131 may be in the range of 3 to 7. 1 and the minor axis dimension W of the first decompression hole 1131 1 The ratio of the major axis dimension L of the second decompression hole 1132 may range from 4 to 6. 2 and the minor axis dimension W of the second decompression hole 1132 2 The ratio of the major axis dimension L of the second decompression hole 1132 may range from 1 to 8. 2 and the minor axis dimension W of the second decompression hole 1132 2 The ratio of the major axis dimension L of the second decompression hole 1132 may range from 3 to 7. 2 and the minor axis dimension W of the second decompression hole 1132 2 The ratio of the major axis dimension L of the second decompression hole 1132 may range from 4 to 6. 2 and the minor axis dimension W of the second decompression hole 1132 2 The ratio may be in the range of 1-6.

[0117] In some embodiments, when the first decompression hole 1131 and the second decompression hole 1132 are both of a straight cylindrical structure, that is, the dimensions of the corresponding inner opening and the outer opening are the same, the long axis dimension L of the first decompression hole 1131 is 1 The range of values ​​may be 1.43 mm to 16.38 mm, and the minor axis dimension W 1The value of the major axis dimension L of the first decompression hole 1131 may range from 1.43 mm to 5.7 mm. 1 The range of values ​​may be 4.10 mm to 16.38 mm, and the minor axis dimension W 1 The value of the major axis dimension L of the first decompression hole 1131 may range from 1.43 mm to 5.7 mm. 1 The range of values ​​may be 6.14 mm to 10.92 mm, and the minor axis dimension W 1 The value of the major axis dimension L of the second decompression hole 1132 may range from 2.14 mm to 3.80 mm. 2 The range of values ​​may be 1.00 mm to 10.38 mm, and the minor axis dimension W 2 The value of may range from 1.00 mm to 4.05 mm. In some embodiments, the major axis dimension L of the second decompression hole 1132 is 2 The range of values ​​may be 2.59 mm to 10.38 mm, and the minor axis dimension W 2 The value of the major axis dimension L of the second decompression hole 1132 may range from 1.52 mm to 4.05 mm. 2 The range of values ​​may be 3.89 mm to 6.92 mm, and the minor axis dimension W 2 The value may range from 2.28 mm to 4.05 mm.

[0118] In some embodiments, in order to facilitate processing and manufacturing and reduce the difficulty of the process, the first decompression hole 1131 and the second decompression hole 1132 may both use a trumpet-shaped structure, for example, the area of ​​the inner opening is smaller than the area of ​​the corresponding outer opening, or the area of ​​the outer opening is smaller than the area of ​​the corresponding inner opening.

[0119] In some embodiments, when the first decompression hole 1131 and the second decompression hole 1132 both use a trumpet-shaped structure, the range of the major axis dimension of the outer opening of the first decompression hole 1131 along the X direction may be 4.10 mm to 16.38 mm, the range of the minor axis dimension of the outer opening of the first decompression hole 1131 along the Z direction may be 1.43 mm to 5.7 mm, and the range of the outer opening area of ​​the first decompression hole 1131 may be 5.39 mm. 2 ~86.21mm 2 The range of the major axis dimension of the inner opening of the first decompression hole 1131 along the X direction may be 3.92 mm to 15.68 mm, the range of the minor axis dimension of the inner opening of the first decompression hole 1131 along the Z direction may be 1.29 mm to 5.14 mm, and the range of the inner opening area of ​​the first decompression hole 1131 may be 4.58 mm. 2 ~73.32mm 2 The range of the major axis dimension of the outer opening of the second decompression hole 1132 along the X direction may be 2.59 mm to 10.38 mm, the range of the minor axis dimension of the outer opening of the second decompression hole 1132 along the Z direction may be 1.52 mm to 4.05 mm, and the range of the outer opening area of ​​the second decompression hole 1132 may be 3.42 mm. 2 ~54.68mm 2 The range of the major axis dimension of the inner opening of the second decompression hole 1132 along the X direction may be 2.28 mm to 9.1 mm, the range of the minor axis dimension of the inner opening of the second decompression hole 1132 along the Z direction may be 1.26 mm to 5.04 mm, and the range of the inner opening area of ​​the second decompression hole 1132 may be 2.56 mm. 2 ~40.90mm 2 In some embodiments, when the first decompression hole 1131 and the second decompression hole 1132 both use a trumpet-shaped structure, the range of the long axis dimension of the outer opening of the first decompression hole 1131 along the X direction may be 6.14 mm to 10.92 mm, the range of the short axis dimension of the outer opening of the first decompression hole 1131 along the Z direction may be 2.14 mm to 3.80 mm, and the range of the outer opening area of ​​the first decompression hole 1131 may be 12.12 mm. 2 ~38.32mm 2The range of the major axis dimension of the inner opening of the first decompression hole 1131 along the X direction may be 5.88 mm to 10.45 mm, the range of the minor axis dimension of the inner opening of the first decompression hole 1131 along the Z direction may be 1.93 mm to 3.43 mm, and the range of the inner opening area of ​​the first decompression hole 1131 may be 10.31 mm. 2 ~32.59mm 2 The range of the major axis dimension of the outer opening of the second decompression hole 1132 along the X direction may be 3.89 mm to 6.92 mm, the range of the minor axis dimension of the outer opening of the second decompression hole 1132 along the Z direction may be 2.28 mm to 4.05 mm, and the range of the outer opening area of ​​the second decompression hole 1132 may be 7.69 mm. 2 ~24.30mm 2 The range of the major axis dimension of the inner opening of the second decompression hole 1132 along the X direction may be 3.41 mm to 6.61 mm, the range of the minor axis dimension of the inner opening of the second decompression hole 1132 along the Z direction may be 1.89 mm to 3.36 mm, and the range of the inner opening area of ​​the second decompression hole 1132 may be 5.75 mm. 2 ~18.18mm 2 In some embodiments, when the first decompression hole 1131 and the second decompression hole 1132 both use a trumpet-shaped structure, the long axis dimension value of the outer opening of the first decompression hole 1131 along the X direction may be 8.19 mm, the short axis dimension value of the outer opening of the first decompression hole 1131 along the Z direction may be 2.85 mm, and the outer opening area value of the first decompression hole 1131 may be 21.55 mm. 2 The value of the long axis dimension of the inner opening of the first decompression hole 1131 along the X direction may be 7.84 mm, the value of the short axis dimension of the inner opening of the first decompression hole 1131 along the Z direction may be 2.57 mm, and the value of the inner opening area of ​​the first decompression hole 1131 may be 18.33 mm 2 The major axis dimension of the outer opening of the second decompression hole 1132 along the X direction may be 5.19 mm, the minor axis dimension of the outer opening of the second decompression hole 1132 along the Z direction may be 3.04 mm, and the outer opening area of ​​the second decompression hole 1132 may be 13.67 mm. 2The value of the long axis dimension of the inner opening of the second decompression hole 1132 along the X direction may be 4.55 mm, the value of the short axis dimension of the inner opening of the second decompression hole 1132 along the Z direction may be 2.52 mm, and the value of the inner opening area of ​​the second decompression hole 1132 may be 10.23 mm. 2 It is.

[0120] In some embodiments, the ratio of the area of ​​the inner opening of the first decompression hole 1131 to the sound output hole 112 may be 0.1 to 15. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 to the sound output hole 112 may be 0.1 to 3. In some embodiments, the ratio of the area of ​​the inner opening of the first decompression hole 1131 to the sound output hole 112 may be 0.2 to 10. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 to the sound output hole 112 may be 0.1 to 2. In some embodiments, the ratio of the area of ​​the inner opening of the first decompression hole 1131 to the sound output hole 112 may be 0.3 to 5. In some embodiments, the ratio of the area of ​​the inner opening of the second decompression hole 1132 to the sound output hole 112 may be 0.2 to 1.

[0121] In some embodiments, when the first decompression hole 1131 and the second decompression hole 1132 form a Helmholtz resonant cavity model together with the rear cavity 115 as acoustic holes, as can be seen from equation (2) described below, the larger the area of ​​the first decompression hole 1131 and the second decompression hole 1132, the higher the resonant frequency of the rear cavity 115, thereby shifting the resonant frequency of the corresponding sound leakage to a frequency band as high as possible (e.g., a frequency range greater than 4 kHz), which helps to improve the flat area in the frequency response curve and helps to prevent the sound leakage.

[0122] Fig. 17 is a frequency response curve diagram of an open-type earphone corresponding to a first decompression hole of different areas according to some embodiments of the present application. Fig. 18 is a frequency response curve diagram of an open-type earphone corresponding to a second decompression hole of different areas according to some embodiments of the present application.

[0123] As shown in FIG. 17, curves 171, 172, 173, 174, and 175 have areas of 0, 2.52 mm, respectively. 2 , 5.52mm 2 , 8.52mm 2 and 11.52 mm 2 18, curves 181, 182, 183, 184, and 185 represent frequency response curves corresponding to the first decompression hole 1131 having an area of ​​0, 4.02 mm, respectively. 2 , 5.52mm 2 , 7.02mm 2 and 8.52 mm 2 11 illustrates a frequency response curve corresponding to the second decompression hole 1132, where

[0124] 17, when other structures (e.g., sound emission hole 112, second decompression hole 1132, etc.) are fixed, as the area of ​​first decompression hole 1131 gradually increases, the resonance frequency corresponding to the rear cavity in the frequency response curve of the open-type earphone 10 (i.e., the frequency corresponding to the resonance peak at dashed circle G1) gradually shifts to a higher frequency, and the flat region of the frequency response curve becomes wider. 2 17, the resonance frequency corresponding to the rear cavity changes gradually to a higher frequency. The frequency response curve in FIG. 17 is a frequency response curve at a location 15 mm immediately before the center O of the sound emission hole, obtained by simulating under the condition that the position and dimensions of the second decompression hole 1132 do not change. Similarly, as can be seen from FIG. 18, when other structures (e.g., the sound emission hole 112, the first decompression hole 1131, etc.) are fixed, as the area of ​​the second decompression hole 1132 gradually increases, the resonance frequency corresponding to the rear cavity in the frequency response curve of the open-type earphone 10 (i.e., the frequency corresponding to the resonance peak at the dashed circle G2) gradually moves to a higher frequency, and the flat region of the frequency response curve becomes wider. The frequency response curve in FIG. 18 is a frequency response curve at a location 15 mm immediately before the center O of the sound emission hole, obtained by simulating under the condition that the position and dimensions of the first decompression hole 1131 do not change.

[0125] In some embodiments, the area of ​​the first decompression hole 1131 and / or the area of ​​the second decompression hole 1132 should not be too small to ensure that the flat area (e.g., the area before the resonance peak) of the frequency response curve of the open-type earphone is wide, and to obtain a better sound leakage reduction effect in the mid-high frequency range (e.g., 2kHz to 6kHz), and to ensure that the high-pressure area of ​​the sound field in the rear cavity is destroyed, and the strength of the sound generated in the rear cavity is sufficient in the far field. In addition, in practical applications, if the area of ​​the first decompression hole 1131 and / or the area of ​​the second decompression hole 1132 is too large, it will have a certain impact on other aspects such as the appearance, structural strength, waterproofing, and dustproofing of the open-type earphone 10, so the area of ​​the first decompression hole 1131 and / or the area of ​​the second decompression hole 1132 should not be too large. In some embodiments, the area range of the first decompression hole 1131 is 3.78 mm 2 ~86.21mm 2 and the area of ​​the second decompression hole 1132 is 2.78 mm 2 ~54.68mm 2 In some embodiments, the area of ​​the first vacuum hole 1131 is 3.78 mm 2 ~22.07mm 2 and the area of ​​the second decompression hole 1132 is 2.78 mm 2 ~16.07mm 2 In some embodiments, the area of ​​the first vacuum hole 1131 is 6.78 mm 2 ~20.07mm 2 and the area of ​​the second decompression hole 1132 is 4.78 mm 2 ~13.07mm 2 It is.

[0126] In some embodiments, the decompression holes 113 (including the first decompression hole 1131 and the second decompression hole 1132) installed in the housing 111 and the rear cavity can be regarded as a Helmholtz resonant cavity model, so that the size of the openings of the first decompression hole 1131 and the second decompression hole 1132 affects the resonant frequency of the rear cavity, and the resonant frequency of the rear cavity is at a high frequency, for example, in a frequency range of 2000 Hz to 6000 Hz, which can be achieved by designing the range of the ratio between the size of the openings of the first decompression hole 1131 and the second decompression hole 1132 and the volume of the rear cavity. In some embodiments, the dimension of the sound generating unit 11 along the Y direction may be determined based on the dimension of the concha cavity so that the sound generating unit 11 can form the first leak structure and / or the second leak structure described elsewhere in this application together with the concha cavity when the sound generating unit 11 is at least partially inserted into the concha cavity. At this time, when the distance from the sound emission hole 112 to the bottom surface of the transducer (for example, the bottom surface of the magnetic circuit assembly 1164 of the transducer 116 in FIG. 20A) is constant, the volume of the rear cavity may be related to the area of ​​the upper side US and / or the lower side LS of the sound generating unit 11. In order to sufficiently increase the resonant frequency of the rear cavity, the ratio of the area of ​​the decompression hole 113 to the volume of the rear cavity should not be too small, in other words, the ratio of the area of ​​the decompression hole 113 to the area of ​​the upper side US and / or the lower side LS should not be too small. Also, in order to ensure the stability of the physical structure of the housing 111 and thereby ensure the service life of the open-type earphone 10, the ratio of the area of ​​the decompression hole 113 to the area of ​​the upper side US and / or the lower side LS should not be too large. In some embodiments, the ratio of the area of ​​the first decompression hole 1131 to the area of ​​the upper side surface US is 0.036 to 0.093, and the ratio of the area of ​​the second decompression hole 1132 to the area of ​​the lower side surface LS is 0.018 to 0.051. In some embodiments, the ratio of the area of ​​the first decompression hole 1131 to the area of ​​the upper side surface US is 0.046 to 0.083, and the ratio of the area of ​​the second decompression hole 1132 to the area of ​​the lower side surface LS is 0.028 to 0.041.In some embodiments, the ratio of the area of ​​the first decompression hole 1131 to the area of ​​the upper side surface US is 0.056 to 0.073, and the ratio of the area of ​​the second decompression hole 1132 to the area of ​​the lower side surface LS is 0.031 to 0.038. In some embodiments, the ratio of the area of ​​the first decompression hole 1131 to the area of ​​the upper side surface US is 0.061 to 0.068, and the ratio of the area of ​​the second decompression hole 1132 to the area of ​​the lower side surface LS is 0.033 to 0.036.

[0127] FIG. 19 is a schematic diagram of an open-type earphone according to some embodiments of the present application projected onto a sagittal plane in a worn state.

[0128] In some embodiments, as shown in Fig. 14 and Fig. 19, the sound generating unit 11 can be stably attached to the user's ear, the cavity structure as shown in Fig. 10 can be easily formed, and at least two leak structures can be provided in the cavity structure, so that the free end FE can abut in the long axis direction X and the short axis direction Y, and at this time, the inner surface IS of the sound generating unit 11 is inclined with respect to the sagittal plane, and at this time, at least a first leak structure UC (i.e., a gap formed between the concha cavity and the upper boundary of the inner surface IS) close to the vertex and a second leak structure LC (i.e., a gap formed between the concha cavity and the lower boundary of the inner surface IS) close to the ear canal are provided between the inner surface IS of the sound generating unit and the concha cavity. This can increase the listening volume, especially the listening volume of the mid-low range, while still retaining the effect of canceling far-field sound leakage, thereby improving the sound output performance of the open-type earphone 10.

[0129] In some embodiments, when the open-type earphone 10 is worn in the manner shown in Fig. 14, the first leakage structure UC and the second leakage structure LC formed between the inner surface IS of the sound generating part and the concha cavity have a certain scale in both the longitudinal axis direction X and the thickness direction Z. In some embodiments, in order to easily understand the positions of the first leakage structure UC and the second leakage structure LC, when the open-type earphone 10 is worn, the midpoint of two points formed by intersecting the upper boundary / lower boundary of the inner surface IS with the ear part (e.g., the side wall of the concha cavity, the helical crus) may be set as the position reference point of the first leakage structure UC and the second leakage structure LC, and the center of the ear canal opening of the ear canal may be set as the position reference point of the ear canal. In some embodiments, in order to easily understand the positions of the first leak structure UC and the second leak structure LC, when the open-type earphone 10 is in a worn state, the midpoint of the upper boundary of the inner surface IS may be set as the position reference point of the first leak structure UC, and the trisection point close to the free end FE of the lower boundary of the inner surface IS (hereinafter, abbreviated as the 1 / 3 point of the lower boundary of the inner surface IS) may be set as the position reference point of the second leak structure LC. In this specification, when the boundary between the inner surface IS and the upper surface US and / or the lower surface LS is arc-shaped, the upper boundary of the inner surface IS may be the intersection line between the inner surface IS and the upper surface US, and the lower boundary of the inner surface IS may be the intersection line between the inner surface IS and the lower surface LS. In some embodiments, when one or more side surfaces (e.g., the inner surface IS, the upper surface US and / or the lower surface LS) of the sound generating unit 11 are arc surfaces, the intersection line between the two side surfaces may be the intersection line between the tangent planes of the two side surfaces that are farthest from the center of the sound generating unit and parallel to the major axis or minor axis of the sound generating unit.

[0130] As a mere example, in this specification, the midpoint of the upper boundary of the inner surface IS and the 1 / 3 point of the lower boundary are respectively taken as the position reference points of the first leakage structure UC and the second leakage structure LC. Note that the midpoint of the upper boundary of the selected inner surface IS and the 1 / 3 point of the lower boundary are only used as exemplary reference points for describing the positions of the first leakage structure UC and the second leakage structure LC. In some embodiments, other reference points may be selected to describe the positions of the first leakage structure UC and the second leakage structure LC. For example, due to differences in the ear parts of different users, the first leakage structure UC / second leakage structure LC formed when the open-type earphone 10 is in a wearing state is a gap whose width gradually changes, and at this time, the reference position of the first leakage structure UC / second leakage structure LC may be a position adjacent to the region where the width of the gap at the upper boundary / lower boundary of the inner surface IS is maximum. For example, the 1 / 3 point adjacent to the free end FE of the upper boundary of the inner surface IS may be the position of the first leakage structure UC, and the midpoint of the lower boundary of the inner surface IS may be the position of the second leakage structure LC.

[0131] In some embodiments, as shown in FIG. 19, the projection of the upper boundary of the inner surface IS onto the sagittal plane may overlap with the projection of the upper surface US onto the sagittal plane, and the projection of the lower boundary of the inner surface IS onto the sagittal plane may overlap with the projection of the lower surface LS onto the sagittal plane. The projection of the position reference point of the first leakage structure UC (i.e., the midpoint of the upper boundary of the inner surface IS) onto the sagittal plane is point A, and the projection of the position reference point of the second leakage structure LC (i.e., 1 / 3 point of the lower boundary of the inner surface IS) onto the sagittal plane is point B, and the "projection point A of the midpoint of the upper boundary of the inner surface IS onto the sagittal plane" may be a projection point of the intersection of the upper boundary of the inner surface IS and the short-axis central plane of the magnetic circuit assembly of the transducer (e.g., the magnetic circuit assembly 1144 described later) onto the sagittal plane. The short-axis central plane of the magnetic circuit assembly is a plane that is parallel to the short-axis direction of the sound generating unit 11 and passes through the geometric center of the magnetic circuit assembly. "Projection point B of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane" may be the projection point of the trisection point adjacent to the free end FE of the lower boundary of the medial surface IS onto the sagittal plane.

[0132] 19, in some embodiments, in the worn state, the projection of the sound generating unit 11 of the open-type earphone 10 onto the sagittal plane can at least partially cover the user's ear canal, but the ear canal can communicate with the outside via the concha cavity, thereby realizing the release of both ears of the user. In some embodiments, the sound of the decompression hole 113 can be transmitted to the cavity structure via the leak structure (e.g., the first leak structure UC or the second leak structure LC) and offset with the sound of the sound emission hole 112, so the first decompression hole 1131 and the second decompression hole 1132 should not be too close to the upper and lower leak structures.

[0133] In some embodiments, the center O of the first decompression hole 1131 1 Projection point O onto the sagittal plane 1 The center O′ of the first decompression hole 1131 may substantially overlap with the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane. 1 Projection point O onto the sagittal plane 1 The distance from the center O′ of the first decompression hole 1131 to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is in the range of 2 mm or less. 1 Projection point O onto the sagittal plane 1 The distance from the center O′ of the first decompression hole 1131 to the projection A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is in the range of 1 mm or less. 1 Projection point O onto the sagittal plane 1 The distance from ' to point A, the projection of the midpoint of the upper border of the medial surface IS onto the sagittal plane, ranges from 0.5 mm or less.

[0134] The relative positions of the sound emission hole 112 and the first decompression hole 1131 do not change (i.e., the center O of the sound emission hole 112 and the center O of the first decompression hole 1131 do not change). 1and the distance between the cavity structure and the pressure reducing hole 113 does not change), the larger the volume V of the cavity structure, the smaller the listening index of the entire open-type earphone 10 (within the entire frequency band). This is because, due to the influence of air-borne sound resonance in the cavity structure, air-borne sound resonance occurs in the cavity structure at the resonant frequency of the cavity structure, radiating a sound far louder than the decompression hole 113 outward, greatly increasing sound leakage, and further, the listening index becomes significantly smaller near the resonant frequency.

[0135] In some embodiments, the center O of the second decompression hole 1132 2 Projection point O onto the sagittal plane 2 The greater the distance from point O' to point A, the larger the volume V of the cavity structure. Therefore, in some embodiments, assuming that the sound generating unit 11 is at least partially inserted into the cavity of the concha, the greater the volume V of the cavity structure is determined so as to increase the sound collection effect of the ear canal. 2 The range of distance from point O′ to point A is 14.4 mm to 21.6 mm. 2 The range of distance from point O to point A is 16.4 mm to 19.6 mm. 2 The range of distance from point O to point A is 17.4 mm to 18.6 mm. 2 The range of distance from ' to point A is 17.8 mm to 18.2 mm.

[0136] In some embodiments, in order to ensure that the sound generating unit 11 is inserted into the concha cavity and that there is an appropriate gap (forming an opening of the cavity structure) between the upper boundary of the medial surface IS and the concha cavity, a projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is projected from the center O of the ear canal opening. 3 Projection point O onto the sagittal plane 3 The distance ranges from 12mm to 18mm, and the center of the second pressure reduction hole O 2 Projection point O onto the sagittal plane 2 From the center of the ear canal 3 Projection point O onto the sagittal plane 3In some embodiments, the distance from the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane to the center O of the ear canal opening is in the range of 6.88 mm to 10.32 mm. 3 Projection point O onto the sagittal plane 3 The distance ranges from 14mm to 16mm, and the center of the second pressure reduction hole O 2 Projection point O onto the sagittal plane 2 From the center of the ear canal 3 Projection point O onto the sagittal plane 3 The distance from the center of the ear canal O to the projection point A of the midpoint of the upper boundary of the medial surface IS onto the sagittal plane is in the range of 7.88 mm to 9.32 mm. 3 Projection point O onto the sagittal plane 3 The distance ranges from 14.5mm to 15.5mm, and the center of the second pressure reduction hole O 2 Projection point O onto the sagittal plane 2 From the center of the ear canal 3 Projection point O onto the sagittal plane 3 The range of distances to the target is 7.88mm to 8.32mm.

[0137] In some embodiments, the sound generating unit 11 is inserted into the concha cavity, and the center O of the first decompression hole 1131 is aligned with the center O of the first decompression hole 1131 to ensure that there is a suitable gap (forming an opening of the cavity structure) between the upper boundary of the inner surface IS and the concha cavity. 1 Projection point O onto the sagittal plane 1 From the center of the ear canal 3 Projection point O onto the sagittal plane 3 The distance from the center O of the first decompression hole 1131 to the center O of the first decompression hole 1131 may range from 12 mm to 18 mm. 1 Projection point O onto the sagittal plane 1 From the center of the ear canal 3 Projection point O onto the sagittal plane 3 The distance from the center O of the first decompression hole 1131 to the center O of the first decompression hole 1131 may range from 14 mm to 16 mm. 1 Projection point O onto the sagittal plane 1 From the center of the ear canal 3 Projection point O onto the sagittal plane 3 The range of distance to is 14.5mm to 15.5mm.

[0138] In some embodiments, the center O of the first decompression hole 1131 1 Projection point O onto the sagittal plane 1 The greater the distance from the center O of the first decompression hole 1131 to the projection point B of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane, the greater the volume V of the cavity structure. Therefore, in some embodiments, assuming that the sound generating unit 11 is at least partially inserted into the cavity of the concha, in order to appropriately determine the volume V of the cavity structure so as to enhance the sound collection effect of the ear canal, 1 Projection point O onto the sagittal plane 1 The distance from the center O of the first decompression hole 1131 to the projection point B of the lower third point of the medial surface IS onto the sagittal plane ranges from 13.76 mm to 20.64 mm. 1 Projection point O onto the sagittal plane 1 The distance from the center O′ of the first decompression hole 1131 to the projection point B of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane ranges from 15.76 mm to 18.64 mm. 1 Projection point O onto the sagittal plane 1 The distance from ' to point B, the projection of 1 / 3 of the inferior border of the medial surface IS onto the sagittal plane, ranges from 16.16 mm to 18.24 mm.

[0139] In some embodiments, in order to reduce the sound of the second decompression hole 1132 being transmitted to the cavity structure through the second leakage structure LC and offsetting the sound of the sound emission hole 112, the center O of the second decompression hole 1132 is 2 Projection point O onto the sagittal plane 2 The distance from the center O′ to the projection B of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane ranges from 8.16 mm to 12.24 mm. 2 Projection point O onto the sagittal plane 2 The distance from the center O of the second decompression hole 1132 to the projection point B of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane ranges from 9.16 mm to 11.24 mm. 2 Projection point O onto the sagittal plane 2The distance from ' to point B, the projection of 1 / 3 of the inferior border of the medial surface IS onto the sagittal plane, ranges from 9.66 mm to 10.74 mm.

[0140] In some embodiments, in order to ensure that the sound generating unit 11 is inserted into the concha cavity and that there is a suitable gap (forming an opening of the cavity structure) between the upper boundary of the medial surface IS and the concha cavity, the center O of the ear canal opening is measured from the projection B of the 1 / 3 point of the lower boundary of the medial surface IS onto the sagittal plane. 3 Projection point O onto the sagittal plane 3 In some embodiments, the distance from the projection point B of the 1 / 3 point of the lower border of the medial surface onto the sagittal plane to the center O of the ear canal opening is in the range of 1.76 mm to 2.64 mm. 3 Projection point O onto the sagittal plane 3 In some embodiments, the distance from the projection point B of the 1 / 3 point of the lower border of the medial surface onto the sagittal plane to the center O of the ear canal opening is in the range of 1.96 mm to 2.44 mm. 3 Projection point O onto the sagittal plane 3 The range of distance to is 2.16mm~2.24mm.

[0141] FIG. 20A is an exemplary internal configuration diagram of a sound generating unit according to some embodiments of the present application.

[0142] 20A, the sound generating unit 11 may include a housing 111 connected to the ear hook 12 and a transducer 116 disposed within the housing 111. In some embodiments, the sound generating unit 11 may further include a main control circuit board 13 disposed within the housing 111 and a battery (not shown) disposed at one end of the ear hook 12 remote from the sound generating unit 11, and the battery and the transducer 116 are each electrically connected to the main control circuit board 13, such that the battery can power the transducer 116 under the control of the main control circuit board 13. Of course, both the battery and the transducer 116 may be disposed within the sound generating unit 11, and the battery may be closer to the connection end CE, while the transducer 116 may be closer to the free end FE.

[0143] In some embodiments, the open-type earphone 10 may include an adjustment mechanism connecting the sound-generating unit 11 and the ear hook 12, and different users can adjust the relative position of the sound-generating unit 11 in the ear part by the adjustment mechanism while wearing it, so that the sound-generating unit 11 and the concha cavity form a cavity structure. In addition, the existence of the adjustment mechanism allows the user to adjust the earphone 10 to wear it in a more stable and comfortable position.

[0144] Since the cavity of the concha has a certain volume and depth, after the free end FE is inserted into the cavity of the concha, there may be a certain distance between the inner surface IS of the sound generating unit 11 and the cavity of the concha. In other words, the sound generating unit 11 may cooperate with the cavity of the concha to form a cavity structure communicating with the ear canal in a worn state, and the sound emitting hole 112 may be provided in the sound generating unit 11 (e.g., the inner surface IS), and the sound emitting hole 112 may be at least partially located within the cavity structure. In this way, in a worn state, the sound waves propagated from the sound emitting hole 112 are restricted by the cavity structure, that is, the cavity structure may converge the sound waves and allow the sound waves to propagate better into the ear canal, thereby improving the volume and sound quality of the sound heard by the user in the near field, and thus helping to improve the acoustic effect of the earphone 10. Furthermore, since the sound generating unit 11 may be provided so as not to block the ear canal in a worn state, the cavity structure may be provided as a semi-open type. In this way, a part of the sound wave propagating from the sound emission hole 112 propagates into the ear canal to allow the user to hear the sound, and the other part propagates to the outside of the earphone 10 and the ear through the gap between the sound generating unit 11 and the ear unit (for example, a part of the concha not covered by the sound generating unit 11) together with the sound reflected in the ear canal, thereby forming a first sound leakage in the far field. At the same time, the sound wave propagating through the decompression hole 113 (for example, the first decompression hole 1131 and the second decompression hole 1132) formed in the sound generating unit 11 generally forms a second sound leakage in the far field. Since the intensity of the first sound leakage and the intensity of the second sound leakage are equal and the phases of the first sound leakage and the second sound leakage are (substantially) opposite to each other, the two can be offset in the far field, thus helping to reduce sound leakage in the far field of the open-type earphone 10.

[0145] In some embodiments, a front cavity 114 may be formed between the transducer 116 and the housing 111, and the sound emission hole 112 is disposed in an area of ​​the housing 111 that surrounds and forms the front cavity 114, and the front cavity 114 is in communication with the outside via the sound emission hole 112.

[0146] In some embodiments, the front cavity 114 is installed between the diaphragm of the transducer 116 and the housing 111, and the front cavity 114 may have a large depth dimension (i.e., the distance dimension between the diaphragm of the transducer 116 and the housing 111 facing it) to ensure that the diaphragm has a sufficient vibration space. In some embodiments, as shown in FIG. 20A, the sound emission hole 112 is installed on the inner surface IS in the thickness direction Z, and at this time, the depth of the front cavity 114 may be the dimension of the front cavity 114 in the Z direction. However, if the depth of the front cavity 114 is too large, the dimension of the sound generating unit 11 becomes large, which affects the wearing comfort of the open-type earphone 10. In some embodiments, the depth of the front cavity 114 may be 0.55 mm to 1.00 mm. In some embodiments, the depth of the front cavity 114 may be 0.66 mm to 0.99 mm. In some embodiments, the depth of the front cavity 114 may be between 0.76 mm and 0.99 mm. In some embodiments, the depth of the front cavity 114 may be between 0.96 mm and 0.99 mm. In some embodiments, the depth of the front cavity 114 may be 0.97 mm.

[0147] In order to improve the sound emission effect of the open-type earphone 10, the resonant frequency of the Helmholtz resonant cavity-like structure consisting of the front cavity 114 and the sound emission hole 112 is made as high as possible, so that the overall frequency response curve of the sound generating part has a wide flat region. In some embodiments, the resonant frequency f 1 In some embodiments, the resonant frequency f of the front cavity 114 may be 3 kHz or more. 1The resonant frequency of the front cavity 114 may be 4 kHz or greater. In some embodiments, the resonant frequency of the front cavity 114 may be 6 kHz or greater. In some embodiments, the resonant frequency of the front cavity 114 may be 7 kHz or greater. In some embodiments, the resonant frequency of the front cavity 114 may be 8 kHz or greater.

[0148] As shown in FIG. 20A, in some embodiments, an acoustic resistance mesh 118 may be installed at a position corresponding to the first decompression hole 1131 and / or the second decompression hole 1132. The acoustic resistance mesh 118 can adjust the amplitude at the resonance frequency of the rear cavity, and can also perform dustproof and waterproof functions. When other parameters of the acoustic resistance mesh 118 are constant, the magnitude of its acoustic resistance is related to its thickness, and acoustic resistance meshes of different thicknesses have a certain effect on the acoustic output performance of the corresponding acoustic hole. Therefore, the thickness of the acoustic resistance mesh 118 has a certain limit. In some embodiments, the thickness range of the acoustic resistance mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may be 35 μm to 300 μm. In some embodiments, the thickness range of the acoustic resistance mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may be 40 μm to 150 μm. In some embodiments, the thickness of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may be in the range of 50 μm to 65 μm. In some embodiments, the thickness of the acoustic resistive mesh 118 installed in the first decompression hole 1131 and the second decompression hole 1132 may be in the range of 55 μm to 62 μm. Meanwhile, the greater the distance between the end of the acoustic resistive mesh 118 facing the outside of the housing 111 (i.e., the upper surface of the acoustic resistive mesh 118) and the outer surface of the housing 111, the closer the installation position of the corresponding acoustic resistive mesh 118 is to the rear cavity, and the smaller the volume of the rear cavity. In some embodiments, the distance between the upper surface of the acoustically resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 1111 may be 0.8 mm to 0.9 mm, and the distance between the upper surface of the acoustically resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 1111 may be 0.7 mm to 0.8 mm.In some embodiments, the distance between the upper surface of the acoustically resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 1111 may be 0.82mm to 0.88mm, and the distance between the upper surface of the acoustically resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 1111 may be 0.72mm to 0.76mm. In some embodiments, the distance between the upper surface of the acoustically resistive mesh 118 installed in the first decompression hole 1131 and the outer surface of the housing 1111 may be 0.86mm, and the distance between the upper surface of the acoustically resistive mesh 118 installed in the second decompression hole 1132 and the outer surface of the housing 1111 may be 0.73mm.

[0149] FIG. 20B is an example diagram of a second acoustic cavity according to some embodiments of the present disclosure.

[0150] 20A and 20B, in some embodiments, a bracket 117 may be installed in the housing 111, and a cavity 115 may be formed between the bracket 117 and the transducer 116, thereby isolating the cavity 115 from other structures (e.g., the main control circuit board 13, etc.) in the housing 111, thus helping to improve the acoustic expressiveness of the sound generating unit 11. Note that the rear cavity described elsewhere in this specification may not only include the cavity 115, but also include other regions (e.g., the space between the diaphragm and the magnetic circuit assembly) located behind the diaphragm and communicating with the cavity 115. A decompression hole 113 (e.g., a first decompression hole 1131 and / or a second decompression hole 1132) is provided in the housing 111, and an acoustic passage connecting the decompression hole 113 and the cavity 115 is provided in the bracket 117, so that the cavity 115 is connected to the external environment, i.e., air can freely enter and exit the rear cavity, which helps to reduce the resistance in the vibration process of the vibrating membrane of the transducer 116.

[0151] In some embodiments, the frequency response curve of the rear cavity needs to have a wide flat region for the acoustic output performance of the open-type earphone 10, so the resonance frequency of the rear cavity may be set large. Furthermore, in order to better offset the second sound leakage formed by the decompression hole 113 with the first sound leakage, in some embodiments, the resonance frequency of the rear cavity may be equal to the resonance frequency of the front cavity 114. In some embodiments, the difference between the resonance frequency of the rear cavity and the resonance frequency of the front cavity 114 may be 1 kHz or less. In some embodiments, the difference between the resonance frequency of the rear cavity and the resonance frequency of the front cavity 114 may be 500 Hz or less. In some embodiments, the difference between the resonance frequency of the rear cavity and the resonance frequency of the front cavity 114 may be 200 Hz or less. In some embodiments, the resonance frequency of the rear cavity may be 4.5 kHz or more. In some embodiments, the resonance frequency of the rear cavity may be 6 kHz or more. In some embodiments, the resonance frequency of the rear cavity may be 8 kHz.

[0152] In some embodiments, the combination of the rear cavity and the decompression hole 113 installed in the housing 111 can be regarded as a Helmholtz resonant cavity model. The rear cavity can be a cavity of the Helmholtz resonant cavity model, and the decompression hole can be a neck of the Helmholtz resonant cavity model, and the resonant frequency of the Helmholtz resonant cavity model is the resonant frequency of the rear cavity. In the Helmholtz resonant cavity model, the dimension of the neck (e.g., the first decompression hole 1131 or the second decompression hole 1132) can affect the resonant frequency f of the cavity (e.g., the rear cavity), and the specific relationship is shown in Equation (2).

[0153]

number

[0154] Here, c represents the speed of sound, S represents the area of ​​the neck portion (e.g., the first decompression hole 1131 or the second decompression hole 1132), V represents the volume of the cavity (e.g., the rear cavity), and L represents the depth of the neck portion (e.g., the first decompression hole 1131 or the second decompression hole 1132).

[0155] As can be seen from equation (2), when the volume V of the rear cavity becomes smaller, the resonant frequency f 2 Therefore, in order to make the resonance frequency of the rear cavity sufficiently large, it is necessary to make the volume of the rear cavity sufficiently small.

[0156] However, the volume of the rear cavity also affects the acoustic capacitance Ca of the rear cavity, and when the acoustic capacitance Ca of the rear cavity changes, the capacitive reactance characteristics of the rear cavity change, which further affects the vibration characteristics of the rear cavity. The specific relationship between the volume of the rear cavity and the acoustic capacitance Ca of the rear cavity is shown in Equation (3).

[0157]

number

[0158] where ρ represents the air density, c represents the speed of sound, and V represents the volume of the rear cavity.

[0159] As can be seen from equations (2) and (3), when the volume V of the rear cavity increases, the acoustic capacitance Ca of the rear cavity increases, but the corresponding resonance frequency of the rear cavity decreases. In order to increase the resonance frequency of the rear cavity and also increase the acoustic capacitance Ca of the rear cavity, it is necessary to appropriately set the range of the value of the volume V of the rear cavity.

[0160] As shown in FIG. 20B, in some embodiments, the cross section of the cavity 115 may be composed of two perpendicular sides and one curved side, and the two end points of the curved side may be connected to form the cross section (e.g., cross section C1C2C3) into a substantially triangular shape. The hypotenuse C1C3 is composed of a connecting line between the curved surface formed on the bracket 117 and the two end points formed by the contact of the two straight sides, and the two straight sides C1C2 and C2C3 are composed of the frame of the transducer 116, and an included angle α is formed between the hypotenuse C1C3 and the straight side C2C3. In some embodiments, the frame of the sound generating unit 11 needs to have an acoustic hole (e.g., a sound hole) in the area where the straight side C2C3 is located, so that the sound generated by the vibration of the diaphragm 1161 can be radiated to the cavity 115, providing a good sound radiation path between the rear side of the diaphragm 1161 and the cavity 115. In order to ensure the acoustic performance, the length of the straight side C1C2 can be adjusted to adjust the size of the included angle α, and the area of ​​the triangle C1C2C3 can be changed to adjust the volume of the cavity 115, thereby changing the volume of the rear cavity. In some embodiments, due to the limitations of the sound vents, the length of the straight side C2C3 is 0.67 mm or more. In some embodiments, the length of the straight side C2C3 may be 0.7 mm. In some embodiments, the value of the included angle α has a range limit, so the value of the volume V of the cavity 115 also has a range limit.

[0161] 20C is a frequency response curve diagram of the rear cavity corresponding to different magnitudes of the included angle α according to some embodiments of the present disclosure. As shown in FIG. 20C, when the length of the straight side BC is reduced to reduce the included angle α from 67.6° to 45°, the volume V of the rear cavity is reduced, and the corresponding acoustic capacitance Ca of the rear cavity is reduced by 7×10 -12 m 3 / Pa to 2.88 x 10 -12 m 3 / Pa, but the resonant frequency of the rear cavity increases from about 4.5 kHz to about 6 kHz. When the length of the straight side BC is increased to increase the included angle α from 67.6° to 79.11°, the volume V of the rear cavity increases and the corresponding acoustic capacitance Ca of the rear cavity becomes 7×10-12 m 3 / Pa to 15 x 10 -12 m 3 / Pa, the resonance frequency of the rear cavity decreases from about 4.5 kHz to about 3 kHz. -12 m 3 / Pa, 15×10 -12 m 3 Parameters such as / Pa represent only theoretical acoustic capacitance values ​​corresponding to the volume of the rear cavity, and may differ from actual data.

[0162] In some embodiments, the value of the included angle α of the cavity 115 may range from 45° to 79.11°. In some embodiments, the value of the included angle α of the cavity 115 may range from 60° to 70°. In some embodiments, the value of the included angle α of the cavity 115 may be 67.6°. In some embodiments, the value of the included angle α of the cavity 115 may range from 67° to 68°.

[0163] FIG. 21 is an exemplary internal block diagram of a transducer according to some embodiments of the present application.

[0164] As shown in FIG. 21, the housing 111 accommodates the transducer 116, which includes a vibrating membrane 1161, a voice coil 1162, a frame 1163, and a magnetic circuit assembly 1164. The frame 1163 is installed to surround the vibrating membrane 1161, the voice coil 1162, and the magnetic circuit assembly 1164, and is used to provide a mounting and fixing platform, the transducer 116 can be connected to the housing 111 through the frame 1163, the vibrating membrane 1161 covers the voice coil 1162 and the magnetic circuit assembly 1164 in the Z direction, the voice coil 1162 is inserted into the magnetic circuit assembly 1164, and is connected to the vibrating membrane 1161, and the magnetic field generated after the voice coil 1162 is energized interacts with the magnetic field formed by the magnetic circuit assembly 1164 to drive the vibrating membrane 1161 to generate mechanical vibration, and further generates sound by propagation through a medium such as air, and the sound is output through the sound output hole 112.

[0165] In some embodiments, the magnetic circuit assembly 1164 includes a magnetic flux conducting plate 11641, a magnet 11642, and a housing member 11643, where the magnetic flux conducting plate 11641 and the magnet 11642 are connected to each other, the side of the magnet 11642 away from the magnetic flux conducting plate 11641 is attached to a bottom wall of the housing member 11643, and there is a gap between the peripheral side of the magnet 11642 and the inner peripheral wall of the housing member 11643. In some embodiments, the outer peripheral wall of the housing member 11643 is connected and fixed to the frame 1163. In some embodiments, both the housing member 11643 and the magnetic flux conducting plate 11641 may use a magnetically permeable material (e.g., iron, etc.).

[0166] In some embodiments, the periphery of the diaphragm 1161 may be connected to the frame 1163 via a fixing ring 1155. In some embodiments, the material of the fixing ring 1165 may include stainless steel or other metal materials to accommodate the manufacturing process of the diaphragm 1161.

[0167] 20A and 21, in some embodiments, in order to improve the acoustic output (especially low frequency output) effect of the sound generating unit 11 and improve the ability of the vibrating membrane 1161 to push air, the larger the projected area of ​​the vibrating membrane 1161 along the Z direction, the more preferable it is. However, if the area of ​​the vibrating membrane 1161 is too large, the dimensions of the transducer 116 will be too large, which will make the housing 111 excessively large and easily cause collision friction between the housing 111 and the auricle, affecting the wearing comfort of the sound generating unit 11. For this reason, it is necessary to design the dimensions of the housing 111. For example, the short axis dimension (also called width dimension) of the housing 111 in the Y direction (e.g., 17 mm) is determined based on the dimension of the concha cavity along the Y direction, and then, by selecting an appropriate long-short ratio (i.e., the ratio of the dimension of the housing 111 in the X direction to the dimension of the housing 111 in the Y direction) based on wearing comfort, the long axis dimension (also called length dimension) of the housing 111 in the X direction (e.g., 21.49 mm) can be determined to match the dimension of the concha cavity along the X direction.

[0168] In some embodiments, the dimensions of the housing 111 can use a value in a predetermined range in order to make it easier for most users to wear the earphone (for example, the sound generating unit 11 can be inserted into the concha or abut against the antihelix region when most users wear the open-type earphone 10), form a cavity structure with high acoustic effect, and improve the acoustic performance of the earphone by forming the first leakage structure UC and the second leakage structure LC between the ear part of the user when the open-type earphone 10 is worn, for example. In some embodiments, based on the range of the width dimension of the concha along the Y direction, the width dimension of the housing 111 along the Y direction may be in the range of 11 mm to 16 mm. In some embodiments, the width dimension of the housing 111 along the Y direction may be 11 mm to 15 mm. In some embodiments, the width dimension of the housing 111 along the Y direction may be 14 mm to 15 mm. In some embodiments, the value of the ratio between the dimension of the housing 111 in the X direction and the dimension of the housing 111 in the Y direction may be 1.2 to 5. In some embodiments, the ratio between the X-direction dimension and the Y-direction dimension of the housing 111 may be 1.4 to 4. In some embodiments, the ratio between the X-direction dimension and the Y-direction dimension of the housing 111 may be 1.5 to 2. In some embodiments, the length dimension of the housing 111 along the X-direction may be in the range of 15 mm to 30 mm. In some embodiments, the length dimension of the housing 111 along the X-direction may be 16 mm to 28 mm. In some embodiments, the length dimension of the housing 111 along the X-direction may be 19 mm to 24 mm. In some embodiments, in order to avoid the housing 111 being too large in volume and affecting the wearing comfort of the open-type earphone 10, the thickness dimension of the housing 111 along the Z-direction may be in the range of 5 mm to 20 mm. In some embodiments, the thickness dimension of the housing 111 along the Z-direction may be 5.1 mm to 18 mm. In some embodiments, the thickness dimension of the housing 111 along the Z-direction may be 6 mm to 15 mm. In some embodiments, the thickness dimension of the housing 111 along the Z direction may be between 7 mm and 10 mm.In some embodiments, the area of ​​the inner surface IS of the housing 111 (equal to the product of the length and width dimensions of the housing 111 if the inner surface IS is rectangular) is 90 mm. 2 ~560mm 2 In some embodiments, the area of ​​the inner surface IS may be considered to be approximately the projected area of ​​the diaphragm 1161 along the Z direction. For example, the area of ​​the inner surface IS may differ from the projected area of ​​the diaphragm 1161 along the Z direction by 10%. In some embodiments, the area of ​​the inner surface IS may be approximately 150 mm 2 ~360mm 2 In some embodiments, the area of ​​the inner surface IS is 160 mm 2 ~240mm 2 In some embodiments, the area of ​​the inner surface IS is 180 mm 2 ~200mm 2 10 to 13, the open-type earphone 10 is worn in the manner shown in Fig. 14, and the dimensions of the open-type earphone 10 may be smaller than those of a conventional open-type earphone, on the premise that the dimensional design satisfies wearing comfort and the acoustic performance is superior to that of a conventional open-type earphone, that is, the same excellent acoustic performance is achieved.

[0169] In some embodiments, the volume V of the rear cavity needs to have an appropriate range of values ​​in order to increase the resonance frequency of the rear cavity and to have a large acoustic capacitance Ca of the rear cavity. In some embodiments, in order to set the range of values ​​of the volume of the rear cavity appropriately, the center O of the first decompression hole 1131 is set to 0.5 mm. 1 20A and 21, when the thickness of the sound generating unit 11 in the Z direction is constant, the distance from the center O of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164 can be reasonably designed. 1The smaller the distance along the Z direction from the center O of the first decompression hole 1131 to the bottom surface of the magnetic circuit assembly 1164, the larger the volume of the rear cavity may be. In this case, as can be seen from the above formula (3), the acoustic capacitance Ca of the rear cavity increases, but the corresponding resonance frequency of the rear cavity decreases. In order to ensure that the sound generation efficiency of the sound generating unit 11 is sufficiently high, the resonance frequency of the rear cavity is within an appropriate frequency range (e.g., 2000 Hz to 6000 Hz), and the user's wearing is sufficiently comfortable, when the structural strength, the difficulty of realizing the process, and the thickness of the entire housing 111 are comprehensively considered, 1 A distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 (i.e., the side surface of the housing member 11643 that is away from the sound emission hole 112 along the Z direction) 5 In some embodiments, the center O of the first decompression hole 1131 is in the range of 1.31 mm to 1.98 mm. 1 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 5 In some embodiments, the center O of the first decompression hole 1131 is in the range of 1.31 mm to 1.98 mm. 1 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 5 In some embodiments, the center O of the first decompression hole 1131 is in the range of 1.41 mm to 1.88 mm. 1 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 5 In some embodiments, the center O of the first decompression hole 1131 is in the range of 1.51 mm to 1.78 mm. 1 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 5 Similarly, in some embodiments, the center O of the second decompression hole 1132 may range from 1.56 mm to 1.72 mm. 2 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 6 In some embodiments, the center O of the second decompression hole 1132 is in the range of 1.31 mm to 1.98 mm. 2 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 6In some embodiments, the center O of the second decompression hole 1132 is in the range of 1.41 mm to 1.88 mm. 2 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 6 In some embodiments, the center O of the second decompression hole 1132 is in the range of 1.51 mm to 1.78 mm. 2 Distance d along the Z direction from the bottom surface of the magnetic circuit assembly 1164 6 The range is 1.56mm to 1.72mm.

[0170] In some embodiments, the dimension of the sound generating unit 11 along the Y direction can be limited to match the dimension of the cavity of the concha. In some embodiments, the dimension of the sound generating unit 11 along the Y direction can be limited to the center O of the first decompression hole 1131. 1 21 to the longitudinal center plane of the magnetic circuit assembly 1164 (e.g., the back surface NN′ perpendicular to the paper surface shown in FIG. 21 ). In some embodiments, for ease of design, the center O of the first decompression hole 1131 may be determined by the distance from the center O of the first decompression hole 1131 to the longitudinal center plane of the magnetic circuit assembly 1164 (e.g., the back surface NN′ perpendicular to the paper surface shown in FIG. 21 ). 1 21 to the longitudinal center plane of the magnetic circuit assembly 1164 (e.g., the back surface NN′ perpendicular to the paper surface shown in FIG. 21 ). 1 The distance from the center O of the first decompression hole 1131 to the long axis central plane of the magnetic circuit assembly 1164 is in the range of 5.45 mm to 8.19 mm. In the present application, the long axis central plane of the magnetic circuit assembly 1164 is a plane that is parallel to the lower side surface LS of the sound generating unit 11 and passes through the center of gravity of the magnetic circuit assembly 1164. In other words, the long axis central plane of the magnetic circuit assembly 1164 may divide the magnetic circuit assembly 1164 into two equal parts along the direction X. 1 The distance from the center O of the first decompression hole 1131 to the long axis center plane of the magnetic circuit assembly 1164 is 1 The distance along the minor axis Y from the center O of the first decompression hole 1131 to the major axis center plane. 1 The range of the distance from the center O of the first decompression hole 1131 to the long axis center plane of the magnetic circuit assembly 1164 is 5.95 mm to 8.69 mm.1 The range of the distance from the center O of the first decompression hole 1131 to the long axis center plane of the magnetic circuit assembly 1164 is 6.45 mm to 7.19 mm. 1 The range of the distance from the center O of the second decompression hole 1132 to the long axis center plane of the magnetic circuit assembly 1164 is 6.65 mm to 6.99 mm. 2 The range of the distance from the center O of the second decompression hole 1132 to the long axis center plane of the magnetic circuit assembly 1164 is 5.46 mm to 8.20 mm. 2 The range of the distance from the center O of the second decompression hole 1132 to the long axis center plane of the magnetic circuit assembly 1164 is 5.96 mm to 8.70 mm. 2 The range of the distance from the center O of the second decompression hole 1132 to the long axis center plane of the magnetic circuit assembly 1164 is 6.46 mm to 7.20 mm. 2 The range of the distance from the longitudinal center plane of the magnetic circuit assembly 1164 is 6.66 mm to 7.00 mm.

[0171] In some embodiments, due to the presence of the decompression holes 113 (e.g., the first decompression hole 1131 and the second decompression hole 1132), the air pressure in the rear cavity 115 at a position close to the decompression hole 113 is close to the external air pressure, and the air pressure at a position away from the decompression hole 113 is higher than the external air pressure. Since the frame 1163 is provided with a sound vent hole (not shown) that communicates the rear side of the diaphragm 1161 with the cavity 115, in order to balance the air pressure between the rear side of the diaphragm 1161 and the cavity 115, the sound vent hole in the frame may be provided asymmetrically to better balance the airflow. Specifically, at a position far from the first decompression hole 1131 and / or the second decompression hole 1132, the air pressure is relatively high, so the size of the sound vent hole may be large, and at a position close to the first decompression hole 1131 and / or the second decompression hole 1132, the air pressure is low, so the size of the sound vent hole may be small. In some embodiments, the low-frequency vibration of the open-type earphone 10 can be made more stable by adjusting the dimensions (e.g., the size of the cross-sectional area) of the first decompression hole 1131, the second decompression hole 1132, and / or the sound-passing hole. In some embodiments, the first decompression hole 1131 and the second decompression hole 1132 can be installed with a shift in the X direction in order to make the air pressure in the rear cavity more stable and thereby make the vibration of the diaphragm more stable. At this time, the first decompression hole 1131 and the second decompression hole 1132 are installed so that their projections onto the long axis central plane partially overlap or do not overlap. In some embodiments, the overlapping area of ​​the projections of the first decompression hole 1131 and the second decompression hole 1132 on the long axis central plane is 10.77 mm 2 In some embodiments, the overlap area of ​​the projections of the first decompression hole 1131 and the second decompression hole 1132 on the longitudinal center plane is 6.77 mm 2 In some embodiments, the overlap area of ​​the projections of the first decompression hole 1131 and the second decompression hole 1132 on the longitudinal center plane is 4.77 mm 2 In some embodiments, the overlap area of ​​the projections of the first decompression hole 1131 and the second decompression hole 1132 on the longitudinal center plane is 2.77 mm 2 The following is the result.

[0172] FIG. 22 is a schematic diagram of the housing of an open-type earphone along the Z direction on the plane on which the bottom surface of the magnetic circuit assembly is located.

[0173] In some embodiments, the center O of the first decompression hole 1131 in the plane on which the bottom surface of the magnetic circuit assembly 1164 lies 1 The projection point of along the Z direction is O 1 '', and the center O of the second decompression hole 1132 in the plane on which the bottom surface of the magnetic circuit assembly 1164 is located 2 The projection point of along the Z direction is O 2 In order to displace the first decompression hole 1131 and the second decompression hole 1132 in the X direction, the connecting line O 1 ''O 2 The length range of the connecting line O'' may be greater than the minor axis dimension of the sound-generating unit 11. 1 ''O 2 The length of the connecting wire O'' ranges from 11 mm to 16 mm. 1 ''O 2 The length of the connecting wire O'' may range from 8.51 mm to 15.81 mm. 1 ''O 2 The length of the connecting wire O'' ranges from 10.51 mm to 15.81 mm. 1 ''O 2 The length of the connecting wire O'' ranges from 11.51 mm to 14.81 mm. 1 ''O 2 The length of the connecting wire O'' ranges from 12.51 mm to 13.81 mm. 1 ''O 2 The ratio of the length of the sound generating portion 11 to the width of the sound generating portion 11 may be between 1 and 1.88.

[0174] In some embodiments, the degree of misalignment in the X direction between the first decompression hole 1131 and the second decompression hole 1132 cannot be made too large. If the degree of misalignment is too large, the first decompression hole 1131 and the second decompression hole 1132 are likely to be close to the free end FE or the connection end CE in the X direction, so that the first decompression hole 1131 and / or the second decompression hole 1132 are blocked by the structure of the ear (e.g., the side wall of the concha cavity, the tragus, etc.) when the open-type earphone 10 is worn. In some embodiments, the degree of misalignment in the X direction between the first decompression hole 1131 and the second decompression hole 1132 is made too large. If the degree of misalignment is too large, the first decompression hole 1131 and the second decompression hole 1132 are likely to be close to the free end FE or the connection end CE in the X direction, so that the first decompression hole 1131 and / or the second decompression hole 1132 are blocked by the structure of the ear (e.g., the side wall of the concha cavity, the tragus, etc.) when the open-type earphone 10 is worn. 1 ''O 2 The included angle β may be related to the included angle β between the minor axis direction Y and the minor axis direction Y. In some embodiments, the included angle β may be in the angular range of 12.85° to 23.88°. In some embodiments, the included angle β may be in the angular range of 14.85° to 21.88°. In some embodiments, the included angle β may be in the angular range of 16.85° to 19.88°. In some embodiments, the included angle β may be in the angular range of 18.85° to 29.88°.

[0175] The above description of the open-type earphone 10 is merely for the purpose of explanation and is not intended to limit the scope of the present application. Those skilled in the art can make various changes and modifications based on the description of the present application. For example, when only one decompression hole is provided in the sound generating unit 11, the decompression hole may be either the first decompression hole 1131 or the second decompression hole 1132. For example, the decompression hole may be the first decompression hole 1131, that is, the decompression hole may be provided on the upper side surface US. The distance from the center of the decompression hole to the inner side surface IS may range from 4.24 mm to 6.38 mm, and the distance from the center of the decompression hole to the rear side surface RS may range from 10.44 mm to 15.68 mm. These changes and modifications are still within the scope of protection of the present application.

[0176] Although the basic concept has been described above, it is clear to those skilled in the art that the above detailed disclosure is merely given as an example and does not limit the present application. Although not explicitly described in this specification, those skilled in the art can make various changes, improvements and modifications to the present application. These changes, improvements and modifications are intended to be suggested by the present application and therefore still fall within the spirit and scope of the exemplary embodiments of the present application. [Explanation of symbols]

[0177] 10 Open-type earphones 11 Sound generating unit 12 Ear hooks 100 ears 101 External auditory canal 102 Concha cavity 103 Concha navicular 104 Triangular fossa 105 Antihelix 106 Scaphoid fossa 107 Earrings 108 Earlobe 109 Tragus 111 Housing 112 Sound emission hole 113 Pressure reduction hole 114 Front Cavity 115 Cavity 116 Transducer 117 Bracket 118 Acoustic Resistance Mesh 1161 Vibrating membrane 1164 Magnetic Circuit Assembly 1131 First decompression hole 1132 Second decompression hole 1071 Helical foot

Claims

1. A sound generating unit including a transducer including a vibrating membrane and a housing that accommodates the transducer; an ear hook, in a worn state, having a first portion that is hung between a user's auricle and the head, and a second portion that extends to a side of the auricle away from the head and is connected to the sound generating unit, for fixing the sound generating unit at a position near the ear canal so as not to block the ear canal; An open-type earphone, wherein an inner surface of the housing facing the auricle is formed with a sound emission hole for guiding sound generated in front of the diaphragm out of the housing and transmitting it to the ear canal, and at least two decompression holes are formed in another side wall of the housing, the at least two decompression holes including a first decompression hole and a second decompression hole, and the distance between the center of the first decompression hole and the center of the second decompression hole is 13.0 mm to 15.2 mm.

2. The open-type earphone according to claim 1, wherein a distance from the center of the sound emission hole to a perpendicular bisector of a connection line between the center of the first decompression hole and the center of the second decompression hole is 0 mm to 2 mm.

3. The open-type earphone according to claim 2 , wherein the first decompression hole is formed in an upper side surface of the housing, and the second decompression hole is formed in a lower side surface of the housing.

4. 4. The open-type earphone according to claim 3, wherein, in a worn state, the housing is at least partially inserted into the cavity of the concha, and a distance from the center of the second decompression hole to a rear side surface of the housing is greater than a distance from the center of the first decompression hole to the rear side surface.

5. The open-type earphone according to claim 4 , wherein the range of the distance from the center of the first decompression hole to the inner surface of the housing toward the pinna is 4.24 mm to 6.38 mm.

6. The open-type earphone according to claim 4 , wherein a range of a distance from the center of the first decompression hole to the rear side surface is 10.44 mm to 15.68 mm.

7. The open-type earphone according to claim 5 or 6, wherein the transducer includes a magnetic circuit assembly that provides a magnetic field, and a range of a distance from the center of the first decompression hole to a bottom surface of the magnetic circuit assembly is 1.31 mm to 1.98 mm.

8. The open-type earphone according to claim 5 or 6, wherein the transducer includes a magnetic circuit assembly that provides a magnetic field, and the range of the distance from the center of the first decompression hole to the longitudinal center plane of the magnetic circuit assembly is 5.45 mm to 8.19 mm.

9. The open-type earphone according to claim 4 , wherein the range of the distance from the center of the second decompression hole to the inner surface of the housing toward the pinna is 4.24 mm to 6.36 mm.

10. The open-type earphone according to claim 4 , wherein the range of the distance from the center of the second decompression hole to the rear side surface is 13.51 mm to 20.27 mm.

11. The open-type earphone according to claim 9 or 10, wherein the transducer includes a magnetic circuit assembly that provides a magnetic field, and a range of a distance from the center of the second decompression hole to a bottom surface of the magnetic circuit assembly is 1.31 mm to 1.98 mm.

12. The open-type earphone according to claim 9 or 10, wherein the transducer includes a magnetic circuit assembly that provides a magnetic field, and the range of the distance from the center of the second decompression hole to the longitudinal center plane of the magnetic circuit assembly is 5.46 mm to 8.20 mm.

13. The open-type earphone according to claim 3 , wherein, in a worn state, the housing is at least partially inserted into the cavity of the concha, and an area of ​​the second decompression hole is smaller than an area of ​​the first decompression hole.

14. The area of ​​the first decompression hole is 3.78 mm ２ ~22.07mm ２ and the area of ​​the second decompression hole is 2.78 mm ２ ~16.07mm ２ The open-type earphone according to claim 13,

15. The open-type earphone according to claim 14, wherein the ratio of the area of ​​the first decompression hole to the area of ​​the upper side surface is 0.036 to 0.093, and the ratio of the area of ​​the second decompression hole to the area of ​​the lower side surface is 0.018 to 0.

051.

16. The transducer includes a magnetic circuit assembly that provides a magnetic field, and the overlap area of ​​the projections of the first and second decompression holes on the longitudinal center plane of the magnetic circuit assembly is 10.77 mm ２ 14. The open-type earphone according to claim 13, wherein:

17. The open-type earphone according to claim 16, wherein the length of a connecting line of a projected point between the center of the first decompression hole and the center of the second decompression hole on a plane on which the bottom surface of the magnetic circuit assembly is located is in the range of 8.51 mm to 15.81 mm.

18. The open-type earphone according to claim 17, wherein an angle range of the included angle between the connecting line and the minor axis direction of the housing is 12.85° to 23.88°.

19. 4. The open-type earphone according to claim 3, wherein, in a worn state, the housing at least partially covers the antihelix, and a difference between a distance from the center of the second decompression hole on the lower surface to the rear side of the housing and a distance from the center of the first decompression hole on the upper surface to the rear side is less than 10%.

20. The open-type earphone according to claim 19, wherein the range of the distance from the center of the first decompression hole to the inner surface of the housing toward the auricle is 4.43 mm to 7.96 mm, or the range of the distance from the center of the second decompression hole to the inner surface is 4.43 mm to 7.96 mm.

21. The open-type earphone according to claim 19, wherein the range of the distance from the center of the first decompression hole to the rear side surface is 8.60 mm to 12.92 mm, or the range of the distance from the center of the second decompression hole to the rear side surface is 8.60 mm to 12.92 mm.

22. The open-type earphone according to claim 3, wherein a ratio of the major axis dimension of the first decompression hole to the minor axis dimension of the first decompression hole is in a range of 1 to 8, or a ratio of the major axis dimension of the second decompression hole to the minor axis dimension of the second decompression hole is in a range of 1 to 8.

23. 4. The open-type earphone of claim 3, wherein there is a first distance between the center of the first decompression hole and the center of the sound emission hole, and there is a second distance between the center of the second decompression hole and the sound emission hole, and a difference between the first distance and the second distance is less than 10%.

24. 24. The open-type earphone of claim 23, wherein the first distance is between 5.12 mm and 15.11 mm.

25. The open-type earphone according to claim 3 , wherein a range of a distance from a projection point of the center of the first decompression hole onto the sagittal plane to a projection point of a midpoint of an upper boundary of the inner surface onto the sagittal plane is 2 mm or less.

26. The open-type earphone according to claim 25, wherein a range of a distance from a projection point of a midpoint of the upper boundary of the inner surface onto the sagittal plane to a projection point of a center of an ear canal opening of the ear canal onto the sagittal plane is 12 mm to 18 mm.

27. The open-type earphone according to claim 25, wherein a range of a distance from a projection point of the center of the first decompression hole onto the sagittal plane to a projection point of a center of an ear canal opening of the ear canal onto the sagittal plane is 12 mm to 18 mm.

28. The open-type earphone according to claim 25, wherein a range of a distance from a projection point of the center of the second decompression hole onto the sagittal plane to a projection point of a center of an ear canal opening of the ear canal onto the sagittal plane is 6.88 mm to 10.32 mm.

29. The open-type earphone according to claim 25, wherein a range of a distance from a projection point of the center of the second decompression hole onto the sagittal plane to a projection point of a midpoint of an upper boundary of the inner surface onto the sagittal plane is 14.4 mm to 21.6 mm.

30. The open-type earphone according to claim 3, wherein the range of the distance from the projection point of the center of the first decompression hole onto the sagittal plane to the projection point of 1 / 3 of the lower boundary of the inner surface onto the sagittal plane is 13.76 mm to 20.64 mm.

31. The open-type earphone according to claim 30, wherein a range of a distance from a projection point of the center of the second decompression hole onto the sagittal plane to a projection point of the ⅓ point of the lower boundary of the inner surface onto the sagittal plane is 8.16 mm to 12.24 mm.

32. The open-type earphone according to claim 31, wherein a range of a distance from a projection point of the ⅓ point of the lower boundary of the inner surface onto the sagittal plane to a projection point of a center of the ear canal opening of the ear canal onto the sagittal plane is 1.76 mm to 2.64 mm.

33. 4. The open-type earphone according to claim 3, wherein, in a worn state, a range of a distance in a long axis direction of the sound generating unit between the first decompression hole and any point in the second part of the earhook is 5.28 mm to 13.02 mm.

34. A sound generating unit including a transducer including a vibrating membrane and a housing that accommodates the transducer; an ear hook, in a worn state, having a first portion that is hung between a user's auricle and the head, and a second portion that extends to a side of the auricle away from the head and is connected to the sound generating unit, for fixing the sound generating unit at a position near the ear canal so as not to block the ear canal; An open-type earphone, wherein an inner surface of the housing facing the auricle is formed with a sound emission hole that guides sound generated in front of the diaphragm out of the housing and transmits it to the ear canal, and another side wall of the housing is formed with at least two decompression holes, the at least two decompression holes including a first decompression hole and a second decompression hole, and the distance from the center of the sound emission hole to the perpendicular bisector of the connection line between the center of the first decompression hole and the center of the second decompression hole is 0 mm to 2 mm.

35. A sound generating unit including a transducer including a vibrating membrane and a housing that accommodates the transducer; an ear hook, in a worn state, having a first portion that is hung between a user's auricle and the head, and a second portion that extends to a side of the auricle away from the head and is connected to the sound generating unit, for fixing the sound generating unit at a position near the ear canal so as not to block the ear canal; an open-type earphone, wherein an inner surface of the housing facing the auricle is formed with a sound emission hole for guiding sound generated in front of the diaphragm out of the housing and transmitting it to the ear canal, and another side wall of the housing is formed with at least two decompression holes, the at least two decompression holes including a first decompression hole and a second decompression hole, the housing is at least partially inserted into the concha cavity, and an area of ​​the second decompression hole is smaller than an area of ​​the first decompression hole.

Images