Integrated multi-layer structure including optical function module and related manufacturing method - Patents.com

Abstract

An integrated functional multi-layer structure (100, 300, 500, 600, 700, 800, 900, 1000, 1100, 1300, 1400, 1500) comprising a flexible, preferably 3D formable, thermoplastic substrate film (102), and a lighting module (110, 400) disposed on the substrate film (102) and preferably electrically connected to a circuit design thereon, said lighting module (110, 400) comprising: a circuit board (112) for receiving electronics; and a circuit (114) disposed on the circuit board, the circuit (114) including at least one light source, and optionally including at least one LED. and a thermoplastic layer (108) comprising: a thermoplastic layer (108) at least laterally surrounding, and optionally also at least partially covering, a lighting module (110, 400), wherein a circuit (114) on a circuit board (112) of the lighting module (110, 400) including at least one light source is configured to be electrically and thermally connected by means of at least one connecting material (116A, 116B) disposed at some points to the remaining structure at the side or below the circuit board, between them, preferably disposed at least around the periphery of the circuit board (112). Related manufacturing methods are presented.

Description

[Technical field]

[0001] The present invention relates generally to functionally integrated structures incorporating various functional features such as electronic, mechanical, or optical elements. In particular, but not exclusively, the present invention relates to the provision of such structures that include several optoelectronic light sources. [Background technology]

[0002] In the context of various functional ensembles, for example in the field of electronics and electronic products, there are various different stacked assemblies and multi-layer structures. For example, the motivation behind integrating functionality including electronics, mechanical features, or optical features can be as diverse as the relevant use scenarios. Relatively often, when the resulting solution ultimately exhibits multi-layered nature, it is required to reduce the size, weight, cost, or even just efficient integration of components. And the relevant use scenarios may concern product packaging or casing, visual design of device housing, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, vehicle electronics, etc.

[0003] Electronic devices, such as electronic components, ICs (integrated circuits), and conductors, may generally be provided on substrate elements by several different techniques. For example, prefabricated electronic devices, such as various surface mounted devices (SMDs), may be attached onto substrate surfaces that ultimately form inner or outer interface layers of a multi-layer structure. Furthermore, techniques falling under the term "printed electronics" may be applied to actually manufacture electronic devices directly and additively on the substrates involved. The term "printed" in this context refers to various printing techniques (e.g., without limitation, screen printing, flexographic printing, and inkjet printing) that can manufacture electronic devices / electrical elements from printed matter through a substantially additive printing process. The substrates used may be, but are not necessarily, flexible, stretchable, organic printed materials.

[0004] Furthermore, the concept of injection molded structural electronics (IMSE) involves building functional devices and parts therefor in the form of multi-layered structures that encapsulate the electronic functions as seamlessly as possible. A feature for IMSE is also that the electronics are generally manufactured in true 3D (non-planar) form according to an overall 3D model of the target product, part, or general design. To achieve the desired 3D layout of the electronics on the 3D substrate and in the associated end product, the electronics may also be provided on an initially planar substrate (e.g., a film) using two-dimensional (2D) methods of electronics assembly, whereupon the substrate already housing the electronics may be formed into the desired three-dimensional (i.e., 3D) form and subjected to overmolding. This may be done, for example, with a suitable plastic material that covers and embeds the underlying elements (e.g., electronics), thus protecting and potentially hiding the elements from the environment. Of course, further layers and elements may be added to the configuration.

[0005] In connection with a monolithic structure packed with various optically functional features (eg, light sources), various problems are readily presented and advantageously addressed.

[0006] For example, one skilled in the art will readily appreciate that unwanted light spill or leakage from a structure or between different interior volumes and regions thereof can easily create both functional and aesthetic problems.

[0007] Furthermore, achieving high resolution control of the in-light and out-coupled light, e.g., in terms of the shape, size, or location of the illuminated surface area, can be difficult, at least at times, in highly integrated structures. To achieve the desired end result, one may need to sub-optimally position the light source near the desired exit or "out-coupling" surface of the light, while being forced to stick to a fairly limited number of orientations or types of light sources that are typically made available, e.g., for conventional top- or side-shooting (emission) light-emitting diodes (i.e., LEDs).

[0008] In various solutions, it has been found to be a burden to control or especially improve the uniformity, for example, on the light outcoupling surface. This can be a significant issue when the surface contains icons or symbols that should be uniformly illuminated, for example, to indicate to an observer outside the structure that the device function or status associated with the icon or symbol is active. Simply utilizing several light sources to more effectively illuminate a common target area or feature (e.g., an icon) can still result in illumination hotspots and leakage, while also requiring more (often valuable) power and space. Adding light guides or processing elements into the structure results in its own drawbacks, as already mentioned above.

[0009] Furthermore, light sources such as high power LEDs can consume quite significant power (easily on the order of magnitude of about 1 watt or more) and can eventually become so hot that they degrade or break, or can even damage adjacent heat-sensitive elements (e.g., plastic substrates).

[0010] Furthermore, providing conventional optical elements (e.g., lenses) within various integral structures has been a challenge because it is difficult to precisely position and align the elements with respect to the corresponding light source or, for example, sensing features with which the elements need to optically interact. For example, minor variations from the original specifications due to difficult-to-estimate material compression and stretching during material processing such as molding or thermoforming may compromise the applicability of the obtained integral structure.

[0011] Furthermore, many light sources or associated components (e.g., driver circuits) can generate high-pitched noise (or generally EMI (electromagnetic interference)) that can significantly disrupt the functioning of other nearby elements (e.g., capacitive sensing elements).

[0012] Furthermore, providing interconnections between the various subassemblies / components and a receiving surface (e.g., a substrate) has traditionally been problematic in terms of complex assembly, mounting, as well as element cracking, accidental removal, and other reliability issues. Summary of the Invention

[0013] It is an object of the present invention to at least alleviate one or more of the drawbacks associated with known solutions in the context of an optically functional integrated structure and related manufacturing methods.

[0014] This objective is achieved by various embodiments of an integrated functional multi-layer structure and associated manufacturing methods for providing the multi-layer structure.

[0015] According to one embodiment, the integrated functional multi-layer structure comprises: a flexible, preferably 3D formable and thermoplastic substrate film, advantageously provided with a circuit design including at least some electrical conductors, such as traces and / or contact pads, and more preferably additively printed thereon at least partially, if not completely; A lighting module disposed on a substrate film and preferably electrically connected to a circuit design thereon, said lighting module comprising: a circuit board for receiving the electronic device; a circuit disposed on a circuit board, the circuit including at least one light source, optionally including at least one LED or other optoelectronic light source, and optionally including a compatible driver circuit, e.g., an LED driver; and a thermoplastic layer comprising one or more thermoplastic materials molded onto a substrate film, the thermoplastic material at least laterally surrounding and optionally also at least partially covering the lighting module; The circuitry on the circuit board of the lighting module, including at least one light source, is configured to be electrically and thermally connected to and between the remaining structure at some locations beside or below the circuit board, preferably at least around the periphery of the circuit board, optionally including electrical traces and / or thermal conductors provided on the substrate film.

[0016] In a further aspect, a method for producing an integrated functional multi-layer structure comprises: obtaining a flexible, preferably 3D formable and thermoplastic substrate film, preferably providing said substrate film with a circuit design, optionally at least in part, comprising at least some electrical conductors, e.g. traces and / or contact pads, by means of a printed electronics technique, e.g. screen printing or inkjetting; Optionally, disposing a lighting module on the substrate film as an at least partially, if not essentially completely, prefabricated subassembly, said lighting module comprising: a circuit board for receiving electronic equipment, such as a rigid fiberglass reinforced epoxy laminate circuit board or a metal core circuit board; a circuit on a circuit board including at least one light source, optionally including at least one LED; disposing the circuitry in a manner that is configured to electrically and thermally connect to some of the remaining structure at the side or underneath the circuit board, optionally including electrical traces and / or thermal conductors disposed on or adjacent to the substrate film, utilizing at least one connecting material disposed therebetween; producing, preferably by molding, for example injection molding, a thermoplastic layer on the substrate film so as to at least laterally surround and optionally also at least partially cover the lighting module.

[0017] The present invention offers different advantages over the many different previously applied solutions, depending of course on each particular embodiment thereof.

[0018] For example, thermal management (e.g., heat dissipation or heat dissipation) between heat-generating circuitry (e.g., high-power LEDs) contained within the structure and the remaining structure potentially including specific heat conductors and heat transfer elements can be significantly improved by using a circuit board (including a lighting module for receiving the circuitry and thermal connections (there are many options, discussed in more detail below) disposed between the circuitry and several points of the remaining structure). Heat can be effectively transferred and dispersed away from its point of origin to avoid excessive hot spots, which may damage the heat source (e.g., the LEDs or other circuitry itself) in addition to adjacent elements (e.g., the underlying substrate film). The optimal heat transfer mechanism will of course depend on the particular embodiment in question, but generally includes conduction, among others, and in some embodiments also includes convection or radiation, for example.

[0019] However, by proposing appropriate configurations (e.g., feasible dimensions, shapes, materials, and element arrangements of the lighting module's circuit board), many previously troublesome assembly, installation, reliability, and interconnection issues with the associated circuitry, potentially other elements (e.g., optical elements), and the remaining (external) structure may be overcome or at least alleviated.

[0020] The circuit board may generally have a rounded or essentially circular planar shape with castellated edges that allow for convenient pad connections with the substrate film and elements thereon at the edges. Round shapes work well for overmolding, but also alleviate the associated need for, for example, mold flow simulations, so that the components do not need to be assembled in or at a certain orientation. However, angular shapes (e.g. rectangular shapes) may also be used alternatively. For example, since there is no need to provide pads under the module, the module can be assembled or provided directly on the film, and in many cases there is no need for underfill or additional protective layers (e.g. against thermal or mechanical damage), e.g. an ink layer between the substrate film and the module. Thus, the substrate may be kept thin as needed (e.g. 0.2-0.6 mm thickness may be applicable), since the substrate may be firmly attached directly to the substrate film. Thermal paths to the remaining structure are minimized. Different crossovers and passives may be performed within the module. The module may be assembled without using any grooves, for example in the mold for the module. The achievable bonds are still strong, and it may be possible to place the entire circuit board and module directly under the injection molding gate, or even on an adjacent area that is optionally 3D shaped by thermoforming. As a result of all this, the number of manufacturing phases required is kept low, process speeds are fast, and the resulting structures are reasonably simple, yet effective and versatile as required.

[0021] Considering the electromagnetic interference usually caused by, for example, electronic components (e.g., LEDs), various embodiments of the present invention provide a solution by at least partially encapsulating such EMI-causing components in an electrically conductive shielding structure to block the associated electromagnetic fields. This structure may be referred to as a Faraday cage. The shielding structure may be implemented in an articulated manner as an integral part of the lighting module or in cooperation with the lighting module. Separating the ground, power and signal layers increases the EMI avoidance. The associated ground plane may be located on the circuit board and may be connected to the sides by electrically conductive and preferably also optically reflective side walls. The materials used may therefore be advantageously both electrically conductive and optically reflective. Enclosures of the proposed type may additionally or instead be utilized to protect various EMI-sensitive components, such as capacitive sensing elements, e.g., drivers, or various wireless components.

[0022] In various embodiments, the light output coupling from the structure may also be improved, for example, in terms of precision, uniformity, and intensity, while undesired light leakage outside the structure or the desired internal light path is also reduced. Furthermore, by introducing a sidewall structure into the lighting module, through the use of a suitable light guide material (e.g., translucent resin), for example, as a thermoplastic overmolding material, the light emitted by the associated internal cavities, lenses or (micro)lens arrays, reflectors, diffusers, and tilted surfaces optionally arranged by the specific carrier elements, the light emitted by the included light sources may be effectively, reliably, and precisely controlled, and the overall optical performance of the solution may be improved, for example, in the aforementioned respects. The yield of the associated manufacturing process remains good or is increased. The options listed above, while having obvious synergistic effects, may be selectively used in each embodiment, depending on the details of each particular usage scenario and the associated constraints and requirements. The various embodiments of the present invention are suitable for a wide variety of lighting solutions, for example, high brightness spotlight applications, surface or graphic lighting applications, backlighting, UI (user interface) lighting, ambient lighting, interior, for example, vehicle or especially automotive interior lighting, etc.

[0023] With reference to the above, the light sources used may in fact be provided with carrier elements that allow the light sources to be oriented as desired, which allows for a considerable flexibility in the possibility of adjusting their emission direction and the resulting out-coupling area, for example with respect to their position and size. For example, a top-shooting light source may be tilted so that its beam is shifted laterally from directly above the light source towards the side(s). Many of the feasible thermoplastic materials (for example those used for light guides) have rather low injection molding temperatures, which may increase the reliability and yield, for example when using IMSE techniques. This is in contrast to materials that require high molding temperatures, which easily adversely affect the function and state of features already present on the substrate film or other elements exposed to such temperatures.

[0024] The selected thermoplastic overmolding material and / or other material(s) included within the structure, and optionally in particular within the modules, e.g., used as light guides, may be selected to be essentially transparent or translucent (i.e., scattering / diffuse, since multiple scattering can be considered as diffusion) so that, for example, the lighting effect obtained by a light source embedded on a selected target surface (e.g., exterior surface) of the structure (which may, for example, include an icon or other graphical element to be illuminated by the out-coupled light) is uniform, without obvious hot spots or dark areas, while still avoiding significant or at least excessive light leakage into adjacent areas that may optionally be associated with a different light source(s) and target feature (e.g., an icon) to be illuminated separately.

[0025] Generally, in various embodiments, selected optically attenuating (scattering (diffusing) and / or absorbing), semi-transparent, potentially pigmented or more strongly pigmented materials (e.g., thermoplastics) may be utilized as light carriers or "light guide" materials to control light propagation and confine it to desired areas and distances while avoiding substantial leakage to non-desired areas, referred to as no-light leak areas. Thus, different surfaces, icons, symbols, shapes, other features and structures may be effectively and controllably illuminated while not exposing non-target areas (even nearby or adjacent areas) to similar illumination. This facilitates providing highly integrated smaller sized structures, where different features can be placed close to each other without causing mutual problems (e.g., light leakage or electromagnetic interference) that arise due to their rather short distances.

[0026] The color, translucency, diffusion and generally the light attenuation properties of the material(s) used (e.g. thermoplastic material(s)) may be configured, for example, by mixing therein additives (e.g. selected masterbatches or pigment-based color additives). Furthermore, the material(s) of the thermoplastic layer or further layer(s) may differ locally, even within one and even monolithic layers or parts that are one and the same in terms of the relevant properties (e.g. attenuation or especially diffusion), obtained by varying the material properties (e.g. mixing ratios) during their manufacture or application.

[0027] Various embodiments of the invention may furthermore make it possible to provide a so-called "hide until lit" effect, for example in IMSE structures, by a clever combination of the materials used, the light sources, e.g. their mutual positioning, orientation and dimensions. The structures, the various components or the graphical symbols provided, for example in the conductive traces, can be hidden from external visual perception until the light source intended and targeted to illuminate them is activated. In such an embodiment of the invention, the output coupling areas, for example on the relevant film(s) (not just the openings), can have decorative surface printing, and by embedding features that would normally be masked from simple external visual perception, for example at a depth of a few millimeters in the light guide material, the relevant optical aspects become much more controllable than if very shallow layers were used. The proposed solution also saves time and costs process-wise.

[0028] Various other advantages that different embodiments of the present invention may offer will become apparent to those skilled in the art based on the following more detailed description.

[0029] The expression "several," as used herein, may refer to any positive integer number beginning with one (1).

[0030] The expression "plurality" may refer to any positive integer beginning with two (2), respectively.

[0031] The terms "first" and "second" are used herein, unless otherwise specified, to distinguish one element from another element(s) and are not used to specifically prioritize or order them.

[0032] The exemplary embodiments of the invention presented herein should not be construed as creating limitations on the applicability of the appended claims. The verb "comprise" is used herein as an open limitation that does not exclude the presence of unrecited features. The features recited in the various embodiments, such as the dependent claims, can be freely combined with each other unless otherwise specified.

[0033] The novel features which are believed to be characteristic of the invention are set forth with particularity in the appended claims, but the invention itself, both as to its organization and its method of operation, together with further objects and advantages thereof, will best be understood from the following description of several specific embodiments when read in connection with the accompanying drawings, in which:

[0034] Selected embodiments of the present invention are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings. [Brief description of the drawings]

[0035] [Figure 1] Various aspects of the present invention are illustrated through embodiments of a multi-layer structure according to the present invention. [Diagram 2] 1 illustrates an embodiment of a lighting module including a circuit board provided with a circuit according to the present invention. [Diagram 3] 1 illustrates an embodiment of a carrier element that can be used in conjunction with the present invention. [Figure 4] 13A-13C illustrate embodiments of sidewall structures for use with, for example, the lighting modules and multi-layer structures of the present invention. [Diagram 5] 1 is a sketch disclosing a module including a multi-layer structure and associated sidewall structure. [Figure 6] 1 shows an embodiment of a heat transfer element comprising 3D shaped sheets connected in a multi-layer structure. [Figure 7] 13 illustrates a further embodiment of a heat transfer element comprising a multi-layer structure and an associated heat sink. [Figure 8] 13 illustrates a further embodiment of a heat transfer element including a multi-layer structure and associated connectors. [Figure 9]1 illustrates an embodiment including a lens structure. [Figure 10] A further embodiment is shown that includes a lens structure, essentially a lens array. [Figure 11] 1 illustrates a further embodiment including a Fresnel lens. [Figure 12] FIG. 2 is a flow diagram of an embodiment of a method according to the present invention. [Figure 13] 13 illustrates an embodiment including a diffuser on the lighting module. [Figure 14] 4 shows a further embodiment of a lighting module. [Figure 15] 4 shows a further embodiment of a multi-layer structure, in particular an EMI shield, which is preferably provided in association with a lighting module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] FIG. 1 shows an embodiment of a multi-layer structure according to the present invention at 100.

[0037] The multi-layer structure includes at least one substrate film 102, which is preferably made of a flexible, 3D formable (3D moldable) material, such as a thermoformable (plastic) material. As will be readily understood by those skilled in the art, instead of a single, optionally monolithic film 102, the substrate film 102 can be of a multi-layer and / or multi-section construction, for example having layers that are different from one another, at least in places.

[0038] Item 108 refers to at least one thermoplastic (functionally establishing a light guide) layer, preferably provided by molding on substrate film 102, optionally essentially between substrate film 102 and element 120. This may be, for example, another (substrate) film, either different or similar to film 102.

[0039] The light guide layer 108 includes a first side and associated first surface 108A. The first surface 108A is advantageously directed to the environment of use of the structure, e.g., a user of the structure or a device that includes the structure therein. Additionally, the substrate film 102 includes an opposing second side and associated second surface 108B. The second surface 108B essentially faces, for example, the interior of the structure or a receiving device.

[0040] As previously mentioned, item 120 may refer to at least one additional film, coating, or other functional element. In many embodiments, multiple such may be deposited, at least locally, on surface 108A.

[0041] The substrate film 102 and / or the further film(s) 120 or generally the material layer(s) included in the multi-layer structure may comprise at least one material selected from the group consisting of polymers, thermoplastic materials, electrically insulating materials, PMMA (polymethyl methacrylate), polycarbonate (PC), flame retardant (FR) PC film, FR700 type PC, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneers, plywood, bark, tree bark, birch bark, cork, natural leather, natural fiber or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination.

[0042] The thickness of the film 102 and optionally further film(s) or layer(s) 120 may vary depending on the embodiment: it may be, for example, only a few tens or hundreds of millimeters, or it may be much thicker, on the order of one or several millimeters.

[0043] The thickness of the thermoplastic layer 108 may also be selected on an as-needed basis, but may be as much as a few millimeters (e.g., about 3-5 millimeters). In some embodiments, a thickness of merely about 2 millimeters may be sufficient, if not optimal, while in some other embodiments the thickness may be significantly thicker as well, e.g., about 1 cm or more, at least in places. The thickness may in fact vary locally. In addition to housing various elements (e.g., electronic or optical elements), the thermoplastic layer 108 may optionally include recesses or internal cavities, e.g., for light guiding, processing, and / or thermal management purposes.

[0044] Item 110 refers to a lighting module provided on substrate film 102 and preferably electrically connected to a circuit design thereon. Lighting module 110 includes at least a circuit board 112 for receiving electronics and a circuit 114 disposed on the circuit board, the circuit 114 including at least one light source and optionally including at least one LED (e.g., high power LED). Circuit 114 on substrate 112 preferably includes a circuit design with, for example, conductive traces or pads for connecting components (e.g., light sources) with other components or elements (e.g., control or communication circuitry) locally at least on substrate 112 in a desired manner.

[0045] The wattage of one or more of the at least one light source and / or some other high power components included may be, for example, about 1 W or more, or even significantly higher. Optionally, multiple light sources of similar or different characteristics (wavelength / color, power, emission direction, beam width, technology, etc.) may be present on the substrate 112. The included light sources (e.g. LEDs) may be independently adjusted, preferably, for example, with respect to their light emission intensity, via compatible control and driver circuits preferably included at least partially within the same multi-layer structure, more preferably within the same module 110, for example, using PWM (Pulse Width Modulation) or current control for this purpose.

[0046] Item 103 refers to circuit designs in the form of several electrical (optionally additionally printed, e.g. screen printed) conductors (e.g. traces) that may optionally also function as thermal conductors. They 103 may be used for example for power and data transfer purposes between elements of the structure 100 and / or with external elements. Item 104 refers to several thermal conductors (e.g. heat traces). Preferably, they may be at least partially provided as electrical conductors, with reference to printing and other applicable methods. Likewise, thermal conductors 104 may also optionally be electrically conductive.

[0047] Circuitry beyond the circuit design of the conductive traces or pads 103 (e.g., various components 115, e.g., light source(s), or other electronic or especially optoelectronic components) may also be outside the module 110. This circuitry may be provided on any of the films 102, 120 and / or other layers, potentially also at least partially embedded within the thermoplastic layer 108. Indeed, if the structure includes, for example, a further film 120, it 120 may be provided with circuitry including, for example, also light source(s) or sensor(s), and may be optionally electrically or electromagnetically connected to the electronics (e.g., traces and components) on the film 102, for example, via intermediate wiring or wirelessly through capacitive or inductive coupling.

[0048] In the illustrated case, the (first) light source emits light as indicated by the dotted line extending from the light source 104 to the target out-coupling area 118 on the layer 108. It 104 may be, for example, a top-shooting LED.

[0049] Generally, in various embodiments of the present invention, the light source(s) used, for example included in circuit 114, can be, for example, any of top-emitting, side-emitting, dual-emitting, and bottom-emitting light source(s) (e.g., LEDs). For example, when using a side-emitting light source, output coupling region 118 can be conveniently shifted laterally from the region directly above light source 104 on surface 108A.

[0050] Packaged semiconductor or chip-on-board semiconductor type light sources (preferably LEDs) may be used. Further with regard to packaging, the light sources may optionally be of flip-chip type. In some embodiments, the light sources may include multiple (2, 3, 4 or more) light-emitting units (e.g. LEDs) packaged or at least grouped together. For example, multi-color or specifically RGB LEDs consisting of multiple LED emitters may be provided in a single package.

[0051] In a preferred embodiment, the light transmittance of, for example, a translucent material selected for the thermoplastic layer 108 may be from about 25% to about 90% or more at a selected wavelength (e.g., at least a portion of the visible wavelengths), considering, for example, a material sample about 2 mm or 3 mm thick. The associated half-power angle may be from about 5 to about 75 degrees (on an intensity basis), for example, about 5, 10, 20, 30, 40, 50, 60, or 70 degrees. In different usage scenarios, the desired transmittance and scattering properties may of course further vary.

[0052] Thus, the thermoplastic layer 108 may comprise an optically at least translucent (optionally substantially transparent) material, and the light transmission of the entire thermoplastic layer may preferably be at least 50% in some use scenarios, although the desired transmission may in practice differ radically between all possible use scenarios. In some embodiments, a transmission of at least about 80% or 90% may be preferred to maximize the light output from the structure, while in some other embodiments, 10%, 20%, or 30% may be quite sufficient, if not even advantageous, for example, if problems related to light leakage are to be minimized. The transmission may be measured or defined in a selected direction, e.g., in the main direction of light propagation and / or transverse to the surface of the substrate film at the location of the lighting module on the substrate film, taking into account selected wavelengths of light emitted by the at least one light source (optionally including visible wavelengths).

[0053] Suitable translucency and attenuation of the thermoplastic layer 108 can be achieved, for example, by using scattering elements in the light guide material. As the amount of scattering elements increases, the light transmission through the layer generally decreases, while the scattering / diffusion and half-value angle also increase as one of the possible measurable indicators. Correspondingly, as the thickness of the layer increases, the scattering / diffusion properties (e.g., half-value angle) generally increase and the transmission decreases.

[0054] For example, taking into consideration the scattering / diffusion or other optical properties as discussed above, the thermoplastic layer 108 may generally include at least one material selected from the group consisting of, for example, polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastomeric resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanizate), and MS resin.

[0055] One example of a polycarbonate-based applicable material is Makrolon®, which is available in various grades, e.g., exhibiting different colors / shades (e.g., white / whitish and black / blackish or dark), transparency, and scattering properties.

[0056] As mentioned above, pigmented or more strongly pigmented resins may provide a viable option for the thermoplastic layer 108 to restrict unwanted light leakage in and out of the structure 100 to nearby elements or generally distances, hiding the interior (e.g. light source 104 or other circuitry) from outside perception. A base material (e.g. PC or other plastic resin) that is inherently optically substantially transparent may be doped with a pigmented masterbatch. In many use scenarios, the structure 100 must be, for example, merely a few millimeters or centimeters thick in total, on which the thermoplastic layer 108 must be even thinner, and a plastic resin layer about 2-4 mm (e.g. 3 mm) thick with a selected masterbatch (e.g. white or desired selected wavelength resin, optionally also IR (infrared) resin that may be used, for example, for IR remote control applications) in the desired concentration (e.g. about 1% let-down ratio) to establish the light guide layer 108 may provide very satisfactory results. Overall, in many embodiments in the context of the present invention, the achievable let-down (dosing or doping) ratio is in practice about 5%, 4%, 3%, 2%, 1% or less. For example, suitable for the purpose are industrial grade masterbatches provided by Lifocolor®.

[0057] The aforementioned "hidden until lit" effect may be achieved, for example, by adding a translucent (e.g., showing a selected color) masterbatch into the injection molding-based resin that constitutes the light guide layer 108. However, the substrate film 102 used may be opaque, black, and / or otherwise dark. Thus, for example, a "hidden until lit icon" may be provided on the surface 108A with reference to the printing element 122, the transparent or translucent film 120 with the printed icon, and / or an opaque / dark / color film arranged with one or more openings among other options. For example, using about 3% translucent, preferably black, masterbatch may be sufficient to visually hide the underlying module 110, components 115, traces 103, and / or other elements from outside perception. The embedded underlying elements (e.g., components and traces) may further be prepared from a material that provides a dark color (preferably highly optically attenuating or absorbing). Alternatively, a transparent material may be utilized. Different lighting effects may be achieved with different colors. The translucent material of layer 108 may generally or selectively match the color(s) used on surface 108A, for example the color(s) exhibited by an ink or film thereon.

[0058] As mentioned above, by using an essentially white resin as layer 108 and using a suitable configuration with embedded multi-color light sources (e.g. RGB-LEDs), essentially any color can be illuminated as desired on the (white) surface 108A.

[0059] Item 130 refers to an optional encapsulant, globe top, or other conformal coating (e.g., Illumabond® or Triggerbond®), for example, for light shaping or other processing, protective and / or fixturing purposes. The substance used may be dispensed onto the selected circuit 114 (e.g., light source). For example, it may be substantially clear (transparent). Alternatively, it may be tinted and / or translucent. In some embodiments, a particular optical function or feature (e.g., a lens) may be provided by the encapsulant. The lens may be, for example, diffusive, Fresnel, or, for example, collimating. Additionally or alternatively, off-the-shelf lenses or optical components in general may also be included in the structure. Various potential lens implementations are also described below.

[0060] As briefly mentioned above, item 122 may refer to at least one functional element, which may be attached and / or additionally manufactured in situ, for example printed (for example screen printed, inkjet or 3D printed) on a first surface 108A of the thermoplastic layer 108, which is optionally arranged adjacent to and / or on the out-coupling area 118. If there is also, for example, a film 120 on the surface 108A, the functional element 122 may be provided on any side thereof, i.e. on the side facing the layer 108 or on the opposite side, and therefore on the side facing the environment. On the side facing the layer 108, it 122 will be better protected from the environment.

[0061] The functional element(s) 122 may be selected from the group consisting of: light-blocking (masking) elements, graphical elements (e.g., icons, symbols, patterns, alphanumeric elements, images, etc., which may have indicative properties, e.g., status indicators of the receiving device or the connected device), light diffusers, reflectors, dispersive elements, and collimators. Optically, the functional element(s) 122, as well as, for example, the film(s) 102, 120, may be transparent, semi-transparent, or opaque, e.g., with respect to color printing or layers. Furthermore, the item 122 may refer to, for example, electrically and / or thermally conductive traces, electrodes, electrical insulators, electronic components, circuit elements, or connectors.

[0062] In some embodiments, the functional element(s) 122 may be monolithic with the layer 108, as described elsewhere herein.

[0063] Thus, the functional element(s) 122 may have, for example, a display function, an optical function, a connecting function, a thermal function, and / or an electrical (conductive, insulating, sensing, or other) function, among other options.

[0064] Based on the foregoing, it may therefore be said that in this and various other embodiments of the multi-layer structure and module 110, at least one cover element (optionally including at least one additional film and / or print element 120, 122 on the side 108A of the thermoplastic layer opposite the side 108B facing the circuit board) may be provided. The at least one cover element may receive or define one or more target elements 118, 118B (optionally including symbols, icons, textures, 3D surfaces, or surface (sub)areas) to be illuminated by at least one light source of the circuit 114 and / or 115.

[0065] As already mentioned above, the element(s) 122 may be located, for example, adjacent to the out-coupling area 112 or partially or completely overlapping therewith. The light source(s) included in the circuit 114 may be configured to illuminate the element(s) 122 (e.g., graphical elements) so as to be visually noticeable to a user in the environment of the structure 100. Further light sources potentially included in the structure 100 may have similar functionality with respect to their associated out-coupling area / functional element (which may be different or the same as the first light source 104), as already mentioned above. In some embodiments, the included multiple light sources may be configured to jointly establish an illuminated element (e.g., a figure, pattern, symbol, icon, or animation), optionally together with one or more of the elements 120, 122 and / or (selected features of) the thermoplastic layer 108 for external perception.

[0066] The circuits 103, 114, 115 included in the structure 100 (e.g., in the module 110 or elsewhere) may include, in addition to some light source(s) and, e.g., associated drivers, the aforementioned electrically conductive traces 103 or contact pads, optionally printed, e.g., using printed electronics techniques, on the film 102 and / or other material layers of the structure 100. The traces may be configured for the transfer of power and / or data (e.g., signaling data or other data) between elements (e.g., light sources and associated drivers, or generally controllers and / or power sources, etc.). Additionally, the circuits may include one or more electrodes, electrical connectors, electronic components, and / or integrated circuits (ICs) (e.g., control circuits or data transfer circuits). Such circuits may be directly fabricated in or for the structure 100 by selected method(s), e.g., by selected printed electronics techniques (optionally screen printing) or using selected coating techniques. Additionally or alternatively, the circuits may include some mounted components (e.g., surface mounted devices (SMD)). Thus, non-conductive and / or conductive adhesives may be utilized to secure the components onto the carrier, in some embodiments the mechanical fixation is implemented or at least reinforced by a non-conductive adhesive material, while solder or other electrically highly conductive (but less adhesive type) materials are used for the electrical connections.

[0067] Optionally, for example, if capacitive sensing of touch or touchless gestures on structure 100 is to be implemented, the sensing electrodes of the circuitry may be configured (dimensioned, positioned, etc.) such that, for example, their sensing areas or volumes defined by the associated electric or electromagnetic fields are positioned as needed to, for example, cover selected sidewall and / or top areas of the structure, and / or other areas that are to be sensitive to touch (and / or in some embodiments touchless gestures) or other sensing targets. This type of configuration may be achieved or performed, for example, by utilizing the necessary simulations or measurements.

[0068] Additionally, the circuitry may include, and / or the remaining multi-layer structure may include, at least one component or element selected from the group consisting of electronic components, electromechanical components, electro-optical components, radiation emitting components, light emitting components, LEDs (light emitting diodes), OLEDs (organic LEDs), side shooting LEDs or other light sources, top shooting LEDs or other light sources, bottom shooting LEDs or other light sources, radiation detecting components, light detecting or photosensitive components, photodiodes, phototransistors, photovoltaic devices, sensors, micromechanical components, switches, touch switches, touch panels, proximity switches, touch sensors, air sensors, temperature sensors, pressure sensors, moisture sensors, gas sensors, proximity sensors, capacitive switches, capacitance sensors, projected capacitive sensors or switches, single electrode capacitive switches or sensors, capacitive buttons, multi-electrode capacitive switches or sensors, self-capacitance sensors, mutual capacitance sensors, inductive sensors, sensor electrodes, micromechanical components, UI elements, user input elements, vibration elements, sound generating elements, communication elements, transmitters, receivers, transceivers, antennas, infrared (IR) receivers or transmitters, wireless communication elements, wireless tags, radio tags, tag readers, data processing elements, microprocessors, microcontrollers, digital signal processors, signal processors, programmable logic chips, ASICs (application specific integrated circuits), data storage elements, and electronic subassemblies.

[0069] The structure 100 may be, and in many use scenarios may be connected to, an external system or device (e.g., a receiving device or arrangement of the structure). The connection may be made by connectors, e.g., electrical connectors, or connector cables, which may be attached to the structure 100 and its elements (e.g., circuits) in a selected manner (e.g., for communication and / or power). Attachment points may be on the side or bottom of the structure, for example provided via through holes in the film 102. These aspects are also described further below.

[0070] Item 124 refers to a fastening element or material (eg, a structural adhesive) that may be disposed between the substrate film 102 and the circuit board 112 so as to enable the substrate 112, and thus the module 110 that includes the substrate 110, to be secured.

[0071] Item 116A refers to an electrical connection material, ie, a material that is at least electrically conductive, which may optionally also be thermally conductive.

[0072] Item 116B refers to a thermal interface material, ie, a material that is at least thermally conductive, which may optionally also be electrically conductive.

[0073] The electrical and thermal connection points and / or routes may be the same or different from one another in structure 100, for example, between module 110 (circuit board 112, circuit 114) and the remaining structures (e.g., traces 103 of the circuit design, thermal conductors 104, various other circuits 115, heat transfer elements, etc.) and / or locally (e.g., within module 110 or on film 102).

[0074] Typically, the materials 116A, 116B used may be both thermally and electrically conductive, and depending on the particular use case, one skilled in the art may determine whether, for example, a predominantly electrically conductive material with low thermal conductivity would still be sufficient as a thermal connection material, or vice versa, or else a different material or composite must be used to obtain the desired conductivity in both respects.

[0075] Thus, one or more connecting materials may be used to provide the desired electrical and thermal connections between the module 110 and the remaining structure (e.g., circuit designs / circuits 103, 115 on the film 102 or elsewhere, thermal conductor(s) 104, and / or potential additional heat transfer element(s) described below, e.g., with reference to Figures 6-8).

[0076] Thus, the at least one connecting material 116A, 116B advantageously comprises at least one material selected from the group consisting of: Electrically and thermally conductive materials (e.g. inks or adhesives) Thermally conductive and electrically insulating materials (e.g. adhesives), and Electrically conductive and heat insulating materials

[0077] At least the thermally conductive connecting material, the circuit board, and / or the heat transfer elements connected to the circuit board preferably have a thermal conductivity of at least about 1 W / mK, more preferably at least about 10 W / mK, and most preferably at least about 100 W / mK, again depending on the embodiment and at least locally, if not generally.

[0078] The electrical conductivity of the materials included in the structure may vary depending on the embodiment, taking into account various other elements that should be used, for example, as an electrically conductive connection material or generally at least as an electrical conductor (e.g., trace, pad, or electrode) due to their excellent electrical conductivity or due to a correspondingly low electrical resistance. When specified in terms of sheet resistivity, the sheet resistivity of the materials used may be, at least locally, if not generally, on the substrate material (e.g., polycarbonate film), for example, about 350 mΩ / sq. / mil or less, more preferably about 100 mΩ / sq. / mil or less, and most preferably about 35 mΩ / sq. / mil or less. One practical example of a suitable industrial grade material is, for example, Dupont® ME602 or ME603 silver conductor, which is also stretchable and therefore well suited for applications requiring 3D shaping by thermoforming.

[0079] At least one of the connecting materials 116A, 116B may define, for example, an angular or curved element ("edge connector") oriented on an edge of the circuit board 112. Alternatively or additionally, the connecting materials 116A, 116B, or the connecting element formed therebetween, may in some embodiments, pass through the circuit board 112, for example via a through hole in the circuit board 112. The elements may also generally be straight (for example, bar or pipe-like) or may exhibit a dome, ball, nodule, or other shape, for example, depending on the method of application (for example, distribution). For example, shapes reminiscent of the letters L, U, I, or O are possible. In some embodiments, any of the connecting elements formed by the connecting materials 116A, 116B may be at least partially integrally formed with some other element of the multi-layer structure (for example, the substrate 112, the circuit 114, the conductors 103, 104, or the castellations 212).

[0080] FIG. 2 illustrates at 200, via a top or plan view, an embodiment of a lighting module 110 including a circuit board 112 having circuitry 114 disposed thereon in accordance with the present invention.

[0081] The circuit board 112 may include at least one element selected from the group consisting of: flexible films or sheets, rigid sheets, rectangular sheets or films, rounded or essentially circular sheets or films, FR4 based circuit boards, metal core circuit boards, plastic boards, molded articles such as injection molded plastic boards, metal boards such as sheet metal boards optionally at least selectively provided with an electrically insulating layer, and ceramic circuit boards.

[0082] As also previously described, the circuit board 112 or, for example, the substrate film 102 may host various electrical and / or other elements, such as series resistors, thermistors, white solder mask, traces, antennas, sensors, electrodes such as capacitive sensing electrodes, contact pads, integrated circuits, controllers, processors, memory, transceivers, driver circuits, optionally optically transparent globe tops or other conformal coatings, and vias such as electrical, fluid, and / or thermal vias.

[0083] Series resistors may be used to stabilize undesired resistance variations resulting from, for example, printed electronics. Thermistors may prove useful in preventing overheating situations that may damage different components and materials (e.g., thermoplastic layer 108). White solder masks may be utilized to improve the reflectivity of the relevant surfaces. Additionally, exposed conductive areas with immersion silver or gold surface finishes may be utilized. For example, gold is a good reflector for IR applications, while silver works well for visible light. Exposed copper may be used, for example, at the bottom to enhance adhesion and thermal conductivity. Vias may be useful in several ways depending on their configuration, for example, with respect to forming thermal bridges for heat dissipation (heat dissipation), reducing the amount of air trapped under the relevant elements during injection molding, and enhancing adhesion of the relevant elements to the carrier surface (e.g., substrate film 102). Capacitors (or inductors) may be utilized, for example, for current control applications (e.g., drift control).

[0084] The circuit board 112 preferably includes several castellations 212. Among them, plated half holes or plated edges are feasible options. The number of desired castellations may vary, for example, from a few to several tens. Some additional castellations may be provided for redundancy, for example to meet safety compliance or failure rate requirements. The diameter of the castellated holes may be, for example, about 1 mm or less. The castellations 212 may then be provided with at least one connection material 116A, 116B (for example, an electrically / thermally conductive adhesive or ink). Thus, the castellations or castellated holes 212 may be configured to provide both electrical and thermal connectivity, taking into account the entire substrate 112 and module 110 versus the rest of the structure.

[0085] In general, the circuit board 112 may be planar and preferably round, if not essentially circular or elliptical in its general shape. The dimensions, shape, and thickness of the circuit may vary depending on the use case. Thus, for example, a rectangular shape is possible. The thickness may be, for example, a fraction or fraction of a millimeter (e.g., about 0.2 to about 0.6 mm), a millimeter, several millimeters, or more. However, the diameter may be several millimeters, about a centimeter, or several centimeters, among other options.

[0086] For example, to avoid CTE (coefficient of thermal expansion) related issues (e.g., cracks), it may be useful to keep the substrate 112 somewhat small or moderate in terms of its size and increase other heat dissipation areas / volumes within the structure, for example, by providing thermal elements therein (e.g., printing). Additionally, a thicker substrate 112 may facilitate locating the receiving circuitry 114 and / or other elements (e.g., optical components or touch sensors) closer to the surface 108A, which may improve light output coupling among other potential benefits, while a thinner substrate 112 may improve heat dissipation, at least to the elements below.

[0087] As discussed elsewhere herein, the circuitry 114 on the circuit board 112 may be configured to electrically and thermally connect to the remaining multi-layer structure at some point (e.g., to the side or underneath the circuit board 112). The connection may be made using at least one connecting material 116A, 116B disposed therebetween, preferably disposed at least around the periphery of the circuit board 112 (if present), and optionally through the circuit board 112.

[0088] As already discussed above, the use of the circuit board 112 may facilitate thermal management associated with heat-generating elements (e.g., high-power light sources, optionally high-power LEDs), in addition to various assembly-related issues. Damage to the substrate film 102 due to excessive heat buildup by the electronics may then be avoided or at least mitigated, among other benefits. The circuit board 112 itself may act as a heat sink, among other benefits that may be included within the structure 100 for the same purpose.

[0089] FIG. 3 illustrates an embodiment of a carrier element that can be used in conjunction with the present invention.

[0090] However, before describing the details of FIG. 3 and generally relating to the options available for, for example, positioning and orienting one or more of the light source(s) of the structure 100 as desired with respect to their illumination properties, the following should be stated: The light source may be tilted with respect to a reference (e.g., the top surface 108 of the arrangement or the original plane of the substrate film 102) by 3D shaping (optionally by thermoforming) the receiving substrate film 102 to establish at least a local 3D shape (e.g., a protrusion or recess at the location of the light source) and thus tilt the light source. Thus, the emission direction(s) of the light source may be adjusted in a desired manner. For example, a top-shooting light source may be adjusted to hit or fire further on the surface 108A (e.g., an icon or other graphical / functional element 122 may be conveniently illuminated from the side, while the volume directly below the illuminated feature may optionally be utilized for other purposes (e.g., electronics for sensing or other applications)). A side-shooting light source may additionally or instead be adjusted to illuminate a closer area thereon. Thus, depending on the embodiment, tilt may facilitate illuminating a larger or smaller area than would otherwise be possible and / or obtaining better uniformity for surface illumination.

[0091] However, in Figure 3 an alternative or complementary solution is shown at 300, where the circuit board 112 defines an optionally beveled surface that is inclined relative to the plane of the underlying substrate film 102 to receive at least a portion of a circuit 114, which preferably includes at least one light source.

[0092] A carrier element 113 for the circuit board 112 is disposed between the circuit board 112 and the substrate film 102. The carrier element 113 preferably includes a beveled carrier surface 113B for the circuit board that aligns the circuit board in an inclined position relative to the plane of the underlying substrate film. Alternatively, the carrier element 113 can be integrally formed with the circuit board 112 or even monolithic. As shown in FIG. 1, the circuit board 113 may optionally include at least one carrier element 113. The carrier element 113 is not essentially a complex 3D shape with an inclined or beveled receiving surface, but is instead, for example, a planar element.

[0093] The carrier surface 113B of the carrier element 113 may include holder elements (eg, protrusions or holes) that match with matching counterparts (eg, hole or protruding shapes, respectively) of the circuit board.

[0094] Additionally, the carrier element 113 may include electrically and / or thermally conductive materials, for example, to provide electrical connections and / or heat dissipation.

[0095] Indeed, the carrier element 113 may be utilized to artfully orient the light source / circuit 114 and, for example, its emission direction(s) or, in the case of a sensor type circuit 114, sensing direction(s) as required and as described above. The carrier element 113 may comprise a plastic material (e.g., thermoplastic, metal, ceramic, etc.). It may, for example, be (injection) molded or 3D printed. The element(s) 113 may be manufactured for different tilt angles depending on the use case.

[0096] When accommodating light sources, the angled surface 113B may improve the size and uniformity of the resulting more remote illumination area, but may also be used to accommodate sensors or various actuators, thereby improving the effective area of ​​these sensors or actuators. The illumination area, out-coupling area, or effective area on surface 108A may be shifted horizontally or laterally from the area 118 directly above light source 104, for example, associated with a top-emitting implementation, to further away 118B, or moved closer, for example, associated with a side-shooting implementation. Similar beneficial effects may be obtained with the 3D shaped substrate film 102 described above.

[0097] The carrier element 113 may include flat surface(s) and / or a top for convenient assembly (e.g., pick-and-place surface mounting process) and / or to receive further elements, such as one or more electrodes (e.g., for capacitive or other touch / gesture sensors) or other optional electronic, thermal, or optical elements or components. Indeed, it may be useful to utilize the top surface 113A of the element 113 for sensing purposes, for example, since the top surface 113A of the element 113 is closer to the environment of the structures on the surface 108A. Thus, the top surface 113A of the carrier element 113, facing away from the substrate film 112, may define or receive, for example, an electrically conductive sensing electrode (optionally configured to capture gestures, such as finger movements, performed thereon).

[0098] FIG. 4 illustrates an embodiment of a sidewall structure suitable for use with the lighting module of the present invention, generally at 400.

[0099] Preferably, as an integral part of the lighting module, there may be provided an optional plastic sidewall structure 402 (note the corresponding wall structure 902 in Figures 9-11), which defines therein a cavity 404 around at least one light source of the circuit 114, and which is preferably laterally surrounded by the thermoplastic layer 108. The structure 402 may be integral with the substrate 112, or in some cases may even be at least partially monolithic. Furthermore, the structure 402 and the substrate 112 may be attached to each other, for example, using adhesive and / or mechanical fastening features (e.g., screws or generally protrusion / recess type features).

[0100] The cavity 404 may, for example, contain air, other fluid, or solid material (optically at least translucent, optionally transparent, to the selected emission wavelength of at least one light source), which is optionally confined within the cavity, depending, for example, on whether the cavity is closed (-> confined) or open at any edge (e.g., at the top). Additionally, the material may contain a luminescent material (e.g., phosphor). In some embodiments, the refractive index of the material of the cavity 404 may be different from that of adjacent materials, such as, for example, the refractive index of a lens structure described in more detail with respect to Figures 9-11.

[0101] The sidewall structure 402 may, for example, at least approximately define a cylindrical or frusto-conical shape, although other shapes are possible.

[0102] The outer surface(s) of structure 402 may at least selectively be treated (e.g., roughened or provided with an adhesive), e.g., for better adhesion to adjacent (injection) molding materials, or for other potential uses.

[0103] The sidewall structure 402 may be substantially opaque and / or reflective, at least considering its surface area facing the cavity 404, and may optionally be diffusive to at least selected wavelengths of light emitted by the at least one light source of the circuit 114. To this end, the sidewall structure 402 may optionally include a reflective coating (e.g., aluminum or silver), a surface film, etc. In some embodiments, the materials used may be luminescent. Thus, the structure 402 may enhance light output coupling and significantly reduce light leakage when employed in / on the entire multi-layer structure and module 110, among other potential advantages.

[0104] The sidewall structure 402 may, for example, extend substantially completely or partially between the circuit board 112 and the opposing surface 108A of the thermoplastic layer 108.

[0105] 5, a sketch disclosing a sidewall structure-containing module 110 connected to and embedded within a multi-layer structure is disclosed at 500. Item 502 refers to several contact pads that may be electrically and / or thermally connected to the module and its circuit board 112 (having connecting material(s) 116A, 116B between them).

[0106] In some embodiments, an adhesive layer 506 may be provided on the sidewall structure 402 (eg, between the sidewall structure 402 and at least one cover element 120, 122 thereon).

[0107] In general, a heat transfer element, including a thermally conductive and optionally electrically insulating material at least thermally connected to the circuit board 112 and optionally extending through the substrate film via holes 102a in the substrate film, may be provided within the multi-layer structures described herein to improve heat dissipation.

[0108] 6 shows an embodiment of a heat transfer element at 600, which includes a 3D shaped sheet 602 in association with a multi-layer structure. The sheet 602 may include, for example, graphene or other thermally conductive materials. The graphene sheet may also include an electrically insulating layer that provides an associated shielding function.

[0109] 7 illustrates at 700 a further embodiment of a heat transfer element in association with a multi-layer structure, including a heat sink 702. The heat sink 702 may extend through the film 102. The heat sink 702 is, of course, particularly useful in the presence of air convection.

[0110] 8 illustrates at 800 a further embodiment of a heat transfer element including a connector 802. In fact, the connector and, for example, wires connecting thereto, may function as a heat sink in addition to other uses. The connector 802 may further be configured for mechanical, electrical, and / or optical connectivity with an external or receiving device, whereby the connector 802 may include, for example, both electrically insulating and electrically conducting portions (e.g., an insulated body or housing, and conductive traces or pins in addition to bonded or separate thermally conducting portions).

[0111] In various embodiments, and referring generally to Figures 9-11, the multi-layer structure may include a lens structure.

[0112] The lens structure may be a dedicated element or integral part of the lighting module 110, or may be an integral part (and optionally a monolithic part) of the thermoplastic layer 108 or e.g. the film 120 or other (cover) elements thereon. The lens structure may further have further elements thereon. It may not itself reach the outer surface of the receiving multi-layer structure. Thus, the integrated and embedded lens structure may be visually and / or tactilely hidden from the environment if this is deemed useful.

[0113] The lens structure may include one or more lenses, preferably integrated with each other (optionally a microlens array), which are preferably arranged along the optical path of at least one light source included in the structure (e.g. in the circuit 114). The lens structure is preferably connected to a sidewall structure 902, which may be similar or different to the sidewall structure 402 described above. The wall may optionally be configured with light blocking properties (e.g. light reflective and / or diffusive surfaces). The lenses holding or connecting the sidewall structure 902 may of course, in some embodiments, advantageously share at least partly with other features having the wall structure(s) (e.g. wall structure 402). The associated lenses may be, for example, plastic.

[0114] The solution proposed herein exploits, for example, the formability of the front / top film 120 or thermoplastic layer 108 to create an integrated lens structure or array directly on the surface of the relevant component. The lens structure may be coated with an appropriate coating to further tune its optical properties or simply protect it from abrasion and environmental chemicals.

[0115] FIG. 9 illustrates an embodiment at 900 that includes a lens structure with concave 904A and / or convex 904B lenses.

[0116] FIG. 10 shows a further embodiment at 1000 which includes a lens structure, essentially a lens array of several lenses 1004A (concave) and / or 1004B (convex).

[0117] FIG. 11 shows a further embodiment at 1100 that includes a Fresnel lens 1104 .

[0118] The lenses may additionally or alternatively be, for example, planar, meniscus, focusing, collimating, beamforming, and / or diverging in nature.

[0119] Depending on the usage scenario, a single lens or lens structure may be configured to process and transmit light from a single light source or from multiple light sources, whereas light emitted by a single light source may be transmitted through one or multiple lenses or lens structures, as also shown in the figures. The light sources may for example include individual (miniature) LEDs, or in particular high power LEDs, or large chip-on-board LEDs.

[0120] For example, lens structures may be utilized to shape or modify (typically enhance) the illumination uniformity of the illumination areas 108A, 118, 118B, or, for example, of an icon or other graphical element 122 thereon. Additionally, lenses may be utilized generally to control the light beam (e.g., its width or uniformity) of an optically connected light source(s), for example, in a spotlight type application. Additionally, lenses may be utilized to locally enhance a multi-layer structure, or the illumination module 110 in particular. The circuit board 114 may be configured with a reflective surface to improve optical efficiency.

[0121] For example, microlens arrays prepared as described herein can be used to effectively perform various beamforming (such as concentrating or diffusing light) applications. Furthermore, such microlens arrays may be used in light gathering and sensor solutions to make the sensor more or less directive, again depending of course on the exact application. In photonic and various other applications, the microlenses discussed herein and similar other lens structures may also be used to make the overall solution less sensitive to the angle of the incident light, and therefore less sensitive overall to the position or positioning accuracy of the different components (e.g., light sources and lenses) on the associated optical paths.

[0122] 13 illustrates at 1300 an embodiment including a diffuser within a multi-layer structure preferably disposed on the lighting module 110. Indeed, as briefly mentioned above, the multi-layer structure may optionally include the thermoplastic layer 108, or for example a film 120 or other element 122 on the thermoplastic layer, the diffuser 1302, either as a dedicated (cover) element or as an integral part of the lighting module 110. In terms of manufacturing, the diffuser 1302 may be printed or otherwise additively manufactured, molded, laser machined, milled, or otherwise subtractively manufactured. Various manufacturing options are described in more detail below.

[0123] For example, item 122 may refer herein to a printing (e.g., an icon) to be illuminated, potentially covering all or most of the out-coupling area 118, 118B, and / or item 122 may refer to a surrounding or at least adjacent opaque printing, light blocking coating or film. An additional film 120 may additionally or instead be provided on top for protection and / or other uses (e.g., to perform additional optical functions). Film 120 may be clear / substantially clear or colored with specular or diffuse transmission properties for the transmitted wavelengths. There may be cuts or holes in film 120 or element 122 to allow light transmission.

[0124] The diffuser 1302 may be utilized to provide more uniform illumination, for example, on the target out-coupling region 118, 118B, or generally on the surface 108A. Thus, the diffuser 1302 may prevent the occurrence of hot spots or dark spots, for example.

[0125] The diffuser 1302 may be of various thicknesses. The diffuser 1302 may be provided and positioned on the light path extending from at least one light source of the circuit 114 through the out-coupling region 112 of said light source to the environment of the structure. The diffuser 1302 may optionally be monolithic with the thermoplastic layer 108 and the (semi-transparent) material of, for example, the light guide layer 108. The diffuser 1302 may be additively manufactured on the layer 108 and / or subtractively manufactured from the layers 120, 122 on the layer 108. The prefabricated diffuser 1302 element or component included in the structure is a further option, and is optionally provided in association with or integral with a larger module (for example, module 110) including, for example, light sources, carrier elements, circuit boards, and / or associated wall structures 902. In this regard, FIG. 13 shows, by means of dashed lines, an example of an alternative wall configuration (bowl shape) from the cylindrical shape on the right. Additionally, these different manufacturing and configuration options may be selectively combined by one skilled in the art to come up with a desired diffuser arrangement. Optionally, the diffuser 1302 may include or be adjacent to an air cap or cavity filled with some other material (e.g., a diffusing material), as already discussed above in view of Figures 4 and 5.

[0126] The diffuser 1302 may be manufactured, for example, from a diffusing plastic, for example, by (injection) molding, 3D printing, or other additive methods, or by CNC (Computer Numerical Control) milling or laser processing. For example, a laser may be used to locally modify the transparency and translucency of, for example, the thermoplastic layer 108, from which the diffuser 1302 is implemented. On the other hand, the diffuser 1302 may be constructed from several stacked (optionally printed) layers. The filtering properties of the diffusing layer(s) of the diffuser 1302 may optionally differ from each other and may be utilized, for example, to block selected colors / wavelengths. Although not essentially transparent (colorless) diffusers 1302, diffusers 1302 that exhibit white, whitish, or single colors may be used as a default solution for general applications, while multi-color options may prove useful, for example, in area diffusers 1302 with various regions associated with certain colors. Light blocks or regions that appear black may be further integrated with and implemented in the diffuser 1302. Thus, diffuser 1302 may be used to block light from entering areas where it is not desired (e.g., on surface 108A), which may reduce the need for additional blocking (opaque) printing.

[0127] A further embodiment of a lighting module is shown at 1400 in FIG.

[0128] The substrate film 102 may at least locally assume an optionally thermoformed essentially non-planar 3D shape (e.g., a curve, a dome, a recess, or a protruding shape), as described in more detail elsewhere herein. The circuit board 112 may be disposed in such a recess 102B of the substrate film, for example of plastic or metal (e.g., sheet metal with insulating and conductive layers disposed thereon). Alternatively or additionally, the circuit board 112 may include a recess for receiving the circuit 114 (e.g., a light source) therein. For example, a conductive adhesive or a zero-ohm resistor may be applied to electrically and / or thermally connect the circuit 114 to the rest of the circuit design / circuitry or, for example, to a heat transfer element on the outside of the module 110. Thus, light leakage may be minimized and the module 110 may be conveniently and reliably connected mechanically, electrically, and / or thermally to the surrounding structure. In some embodiments, the recess 102B may have a light reflective surface for the purpose of guiding light.

[0129] FIG. 15 shows a further embodiment of a multi-layer structure, particularly preferably an EMI shield, at 1500, associated with a lighting module.

[0130] Selected or all elements (e.g., one or more light sources and, optionally, associated driver circuits, e.g., of the circuit 114 of the module 110) may be at least partially enclosed, e.g., from the side 1504 and / or bottom 1502, in an electrically conductive and optionally thermally conductive shielding structure to provide shielding of associated electromagnetic fields. Other elements to be shielded may include, e.g., wireless modules and components incorporating high frequency crystals that cause EMI interference. Associated preferred ground planes may be located in or on the circuit board 112 (inner layer, outer layer, etc.), and may be flanked by several further lateral walls or layers of wall material 1504 that are electrically connected, grounded, electrically conductive, and preferably also light reflective. For example, selected printing or plating processes may be used to establish the necessary conductive elements or layers, and / or prefabricated elements may be utilized. Enclosures of the proposed type may be utilized in addition to or instead of them to protect various EMI sensitive components.

[0131] As will be apparent based on the foregoing, the EMI shielding features described may be advantageously and flexibly combined with various other embodiments and features potentially present in embodiments of the present invention, with reference to different optical features, e.g., diffusers or reflectors, and with respect to structural features, e.g., with respect to sidewalls 402, 902, and module 110 generally.

[0132] FIG. 12 shows a flow diagram of an embodiment of a method in accordance with the present invention, generally at 1200.

[0133] At the beginning of the method for manufacturing a multi-layer structure, a start-up stage 1201 may be performed. During start-up, the necessary tasks may be performed (e.g., material, component and tool selection, acquisition, calibration and other configuration tasks). Special care must be taken to ensure that the individual elements and material selection work together to withstand the selected manufacturing and installation process. This is of course preferably checked in advance, e.g., based on the manufacturing process specifications and component data sheets, or by inspecting and testing manufactured prototypes. The equipment used (e.g., molding, IMD (in-mold decoration), lamination, bonding, (thermo)forming, electronics assembly, cutting, punching, printing and / or equipment providing measurements such as desired optical measurements, among others) may therefore be brought up to an operational state at this stage.

[0134] At 1202, at least one optionally flexible substrate film is obtained, for example of plastic or other material for housing electronic devices. The substrate film may be initially substantially planar or may be curved, for example. The substrate film may be at least primarily of electrically substantially insulating material(s). Prefabricated elements (e.g. rolls or sheets of plastic film) may be obtained for use as substrate material. In some embodiments, the substrate film itself may be manufactured in-house, by first shaping the selected starting material(s) using a mold or forming device or other method. Optionally, the substrate film may be further processed at this stage, for example by providing holes, notches, recesses, cuts, etc.

[0135] At 1204, several electrically conductive and / or thermally conductive elements, for example defining various conductor lines (traces), sensing elements (e.g. electrodes), and / or contact areas (e.g. pads) to build up the circuit design, are provided on one or both sides of one or more of the substrate film(s), preferably by one or more additive techniques, for example printed electronics technology or 3D printing. For example, screen, inkjet, flexographic, gravure, or offset lithographic printing may be applied by a suitable printing device or devices. In some cases, subtractive or semi-additive processes may also be utilized. For example, further actions of developing the substrate film(s) may be performed here, including printing or generally providing graphics, visual indicators, optical elements, etc.

[0136] In various embodiments, the electrically conductive and / or thermally conductive elements (traces, pads, connection elements, electrodes, etc.) may include at least one material selected from the group consisting of conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any components thereof. The conductive material used may be optically opaque, semi-transparent, and / or transparent at a desired wavelength (e.g., at least a portion of visible light), for example, to mask or reflect radiation (e.g., visible light) therefrom, absorb it therein, or pass it through. This aspect is described elsewhere herein. As a practical example of a possible conductive material, for example, Dupont® ME602 or ME603 conductive ink may be utilized.

[0137] In 1206, further circuitry (e.g., one or more typically prefabricated components including electronic components (e.g., various SMDs)) may be attached to the contact areas on the film(s), e.g., by solder and / or adhesive. For example, light source(s) (e.g., LEDs) of the selected technology and packaging may now be provided, as well as, for example, various elements of control electronics, communication, sensing, connection (e.g., connectors), reception (circuit board(s), carrier(s), etc.), and / or power supply (e.g., batteries), depending on the embodiment. For example, suitable pick-and-place or other attachment equipment may be utilized for this purpose. Alternatively or additionally, printed electronics techniques may be applied to actually manufacture at least some of the components (e.g., OLEDs (organic LEDs)) directly on the film(s). Thus, as one skilled in the art will appreciate, the performance of items 1204, 1206 for providing the desired circuitry in the multi-layer structure may overlap in time. Additionally, the components provided or installed herein may include various optical elements (e.g., lenses, reflectors, diffusers, masks, filters, etc.) or carrier elements, optionally having angled surfaces, for example, to accommodate circuit boards / illumination modules.

[0138] The various heat transfer elements described herein may also be installed, for example, at this stage or later.

[0139] Selected elements may be subjected to further processing (eg, encapsulation).

[0140] Item 1205 specifically refers to the preparation and installation of one or more at least partially pre-prepared modules (e.g., lighting modules) or other "subassemblies." A "subassembly" may incorporate an initially separate secondary board (e.g., circuit board) provided with circuit design and electronics, such as several light source(s), IC(s), and / or various other elements or components, such as optical or structural (e.g., wall structures, diffusers, lenses, carrier elements, etc.), also discussed in more detail earlier in this specification.

[0141] Thus, at least a portion of the electronics and / or other elements of the final multi-layer structure may be conveniently provided to the substrate film(s) via fully or partially prefabricated modules or subassemblies. Optionally, the modules or subassemblies may be at least partially overmolded with a protective plastic layer prior to attachment to the main substrate.

[0142] For example, adhesives, pressure, and / or heat may be used to mechanically bond the module or subassembly to the primary (receiving) board. Solder, traces, and conductive inks are examples of applicable options for providing electrical and / or thermal connections between the elements of the module or subassembly and with the remaining electrical and / or thermal elements on the main board. Item 1205 can also be performed, for example, at the time of item 1204 or 1208. Thus, the positions shown are largely representative.

[0143] Item 1208 refers to the provision of a connection material(s) (e.g., ink or adhesive) that electrically and thermally connects the circuitry of the (lighting) module to the remaining structure (e.g., electrical traces, pads, thermal conductors, and / or heat transfer elements of the remaining structure). There may be several associated connection points for receiving the connection material(s) between the circuitry of the module and the remaining structure, e.g., at the edge of the circuit board, with reference to the castellations discussed above. As discussed above, a single material (e.g., many metals (silver, copper, gold, etc.) and alloys) can be used for both purposes, while there are many materials available that are at least primarily either electrical or thermal conductors (e.g., diamond, boron arsenide, and various other thermally conductive insulators), but not both equally. Thus, one or more materials may be provided as connection material(s) herein, and any single material may be utilized primarily or solely for electrical conduction, thermal conduction, or both. The same generally applies when providing electrical and / or thermal conductors on the circuit board 110 and substrate film(s) 102, 120 between items 1204 and 1205. Any suitable dispensing, printing, or other tool or device may be utilized to place the connection material(s). Additionally, as previously discussed, in some embodiments, the connection element established from the connection material(s) may be integrally formed with some other element.

[0144] Additionally, at least some of the activities corresponding to item 1208 may be performed, for example, before or during items 1205, 1206, depending on each particular embodiment, and the process location of item 1208 should not be considered strictly fixed to that illustrated.

[0145] In some embodiments, before or during the forming stage 1212, the substrate film(s), optionally already including at least part of the circuit design, e.g. the (printed) conductive elements, and further elements (e.g. at least part of the electronic components, heat conductors or heat transfer elements), some optical elements and / or the described modules or subassemblies, may be formed 1210, e.g. using thermoforming or cold forming, to assume a desired shape, e.g. at least locally three-dimensional (essentially non-planar) shape. Appropriate forming equipment (e.g. thermoforming machines) may of course be utilized for this purpose. Additionally or alternatively, at least some forming can be performed after forming, if the already established multi-layer stack is designed to withstand such a treatment. In any case, at least some of the necessary 3D forming of the substrate film may already be performed before providing an element thereon (e.g. a lighting module), e.g. taking into account a scenario in which a module is to be placed in a formed recess, as described above. Alternatively, the recess for receiving the module may be formed subsequently in some embodiments after providing the module on the film.

[0146] However, generally it is preferred that the circuits, module(s) and optionally further elements to be included in the multi-layer structure are at least partially, if not completely, provided on the receiving film(s) prior to 3D shaping of the film(s) (i.e., when the film(s) are still essentially planar or at least more planar), to avoid redundant 3D assembly of the electronics on an already 3D shaped carrier.

[0147] In 1212, at least one plastic layer (preferably a thermoplastic layer, or in some embodiments optionally a thermosetting layer), which acts for example as a light guide and protective fixing layer on the lighting module, and possibly further circuits and elements to be embedded, are manufactured on the substrate(s), preferably by molding (e.g. injection molding), preferably to at least partially embed the aforementioned. Desired parts may remain transparent or may be made transparent later by mechanical or chemical treatment, for example considering cover parts of the lighting module or other modules intended to receive replaceable or generally accessible (e.g. inspectable or reprogrammable) components. And such modules may also include (removable) movable cover parts to provide access to their interiors.

[0148] The molding material(s) may be provided using multiple molding steps or shots, or via a single step. The molding material may optionally even flow, for example, through the substrate film from one side to the opposing side, through holes provided therein, or by penetrating the substrate material itself (e.g., through thinned / thinner portions). The molding material(s) may be, and in many embodiments preferably is, at least primarily electrically insulating.

[0149] In practice, at least one substrate film already provided with some features (e.g., circuits, module(s), optical features, etc.) may be used as an insert in an insert injection molding process applying at least one molding machine. If two films are used, both may be inserted in their own mold halves so that the plastic layer is injected at least between them. Alternatively, a second film may be attached later to the assembly of the first film and the plastic layer by a suitable lamination technique, for example utilizing an adhesive between them.

[0150] Some of the optical elements discussed above (e.g., lens structures or diffusers) may be at least partially established during molding from either thermoplastic materials and / or film inserts with appropriate mold geometry.

[0151] With regard to the resulting overall thickness of the resulting laminated multi-layer structure, the thickness will depend, for example, on the materials used and the associated minimum material thickness that provides the necessary strength in light of manufacturing and subsequent use. These aspects must be considered on a case-by-case basis. For example, the overall thickness of the structure can be on the order of magnitude of about a few millimeters, as noted elsewhere herein, although significantly thicker or thinner embodiments are also feasible.

[0152] Item 1214 refers to several potential further tasks (e.g. post-processing and installation operations). Further layers or general features may be added within the multi-layer structure by molding, lamination, or suitable coating (e.g. deposition) procedures, not to mention other possible positioning or fixing techniques. The layers may be of protective, displaying, and / or aesthetic value (graphics, colors, figures, text, numerical data, etc.) and may include, for example, textile, leather, or rubber materials instead of or in addition to (further) plastics.

[0153] Additional elements (e.g., electronics, modules, module internals or parts, and / or optical components) may be attached and secured, for example, to the exterior surface(s) of the structure (e.g., the exterior surface of an included film or molded layer, depending on the embodiment). Optical features (e.g., lens structures or diffusers) may now be constructed or completed, for example, by processing the thermoplastic layer or any additional layers or elements thereon, by adding material thereon or removing material therefrom (laser processing is one option).

[0154] Also, the aforementioned holes 102a can be provided in the substrate film 102 by laser or other cutting means to favor heat dissipation, and then the heat transfer elements can be connected therethrough to the circuit board 112. Alternatively, the holes 102a can be placed earlier in the process, for example once the circuit board 112 is provided. Thus, forming / cutting / adding / removing the necessary elements and materials may be done for various purposes.

[0155] If a connector is provided, the connector of the multi-layer structure may connect to a desired external connection element (e.g., an external device, system, or structure, such as an external connector of a receiving device). For example, the two connectors may together form a plug-and-socket type connection and interface. As used herein, the multi-layer structure may also be generally disposed and attached to a larger assembly (e.g., an electronic receiving device, optionally a personal communication device, a computer, a home device, an industrial device, or a vehicle, for example, in embodiments where the multi-layer structure forms part of the vehicle's exterior or interior (e.g., dashboard or panel)).

[0156] At 1215, execution of the method ends.

[0157] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will appreciate the fact that the disclosed embodiments have been constructed for illustrative purposes only, and that other configurations applying many of the principles set forth above can be readily prepared to best suit each potential usage scenario.

Claims

1. An integrated functional multi-layer structure (100, 300, 500, 600, 700, 800, 900, 1000, 1100, 1300, 1400, 1500), a flexible substrate film (102); A lighting module (110, 400) provided on the substrate film (102), the lighting module comprising: a circuit board (112) for receiving electronic equipment; a circuit (114) disposed on the circuit board, the circuit (114) including at least one light source; a lighting module (110, 400) including: a thermoplastic layer (108) comprising one or more thermoplastic materials molded onto the substrate film, the thermoplastic material at least laterally surrounding the lighting module (110, 400); An integrated functional multi-layer structure (100, 300, 500, 600, 700, 800, 900, 1000, 1100, 1300, 1400, 1500) in which the circuit (114) on the circuit board (112) of the lighting module (110, 400) including the at least one light source is configured to be electrically and thermally connected to the remaining structure at some locations to the side or below the circuit board using at least one connecting material (116A, 116B).

2. The at least one connecting material is an electrically and thermally conductive material; a thermally conductive, electrically insulating material; 10. The structure of claim 1, comprising at least one material selected from the group consisting of: an electrically conductive, thermally insulating material;

3. The structure of claim 1 , further comprising a heat transfer element (602, 702, 802) at least thermally connected to the circuit board, the heat transfer element comprising a thermally conductive material.

4. The heat transfer element comprises: a 3D shaped sheet comprising at least graphene or other thermally conductive sheet material; A heat sink; A connector for connecting the structure to an external device or structure.

5. 5. The structure of claim 1, wherein the connecting material, the circuit board, and / or the heat transfer element connected to the circuit board has, at least locally, a thermal conductivity of at least about 1 W / mK, at least about 10 W / mK, or at least about 100 W / mK.

6. 5. The structure of any one of claims 1 to 4, wherein the thermoplastic layer comprises an optically at least translucent material, and wherein the light transmittance of the thermoplastic layer is at least 50% in a direction transverse to a surface of the substrate film at the location of the lighting module on the substrate film, taking into account selected wavelengths of light emitted by the at least one light source.

7. 5. The structure of claim 1, wherein the circuit board defines a surface that is inclined relative to the plane of the underlying substrate film for receiving at least a portion of the circuit including the at least one light source.

8. A structure described in any one of claims 1 to 4, comprising a carrier element (113) for the circuit board arranged between the circuit board and the substrate film, the carrier element comprising an angled carrier surface (113B) for the circuit board that aligns the circuit board in an inclined position relative to the plane of the underlying substrate film.

9. The structure of claim 8 , wherein the carrier surface of the carrier element includes a holder element that mates with a matching counterpart on the circuit board.

10. The structure of claim 8 , wherein the carrier element comprises an electrically conductive material and / or a thermally conductive material.

11. 11. The structure of claim 10, wherein an upper portion (113A) of the carrier element facing away from the substrate film defines an electrically conductive sensing electrode.

12. A structure as described in any one of claims 1 to 4, comprising a sidewall structure (402, 902) defining a cavity (404) therein around the at least one light source (114), the cavity containing air, other fluid, or solid material that is at least optically translucent to the selected emission wavelength of the at least one light source, the air, other fluid, or solid material optionally being confined within the cavity.

13. The structure of claim 12 , wherein the sidewall structure at least approximately defines a cylindrical or frusto-conical shape.

14. 13. The structure of claim 12, wherein the sidewall structure is opaque and reflective to at least selected wavelengths of light emitted by the at least one light source.

15. The structure of claim 12, wherein the sidewall structure extends substantially between the circuit board (112) and an opposite surface of the thermoplastic layer (108).

16. 5. The structure of claim 1, further comprising at least one cover element (120, 122) on a side of the thermoplastic layer opposite the side facing the circuit board, the at least one cover element receiving or defining one or more target elements (118, 118B), symbols, icons, textures, 3D surfaces, or surface areas, etc., to be illuminated by the at least one light source.

17. The structure of claim 12, including an adhesive layer (506) between the sidewall structure and the at least one cover element (120).

18. A structure as described in any one of claims 1 to 4, comprising a lens structure (904A, 904B, 1004A, 1004B, 1104) of one or more lenses arranged along the optical path of the at least one light source, the lens structure being connected to the sidewall structure, the lens structure comprising one or more concave lenses (904A, 1004A), convex lenses (904B, 1004B), planar lenses, meniscus lenses, Fresnel lenses (1104), focusing lenses, collimating lenses, beamforming lenses, and / or diverging lenses.

19. A structure described in any one of claims 1 to 4, including a diffuser (1302).

20. A structure described in any one of claims 1 to 4, including an electromagnetic interference shielding structure (1502, 1504) of electrically conductive material that at least partially surrounds one or more elements of the circuit 114.

21. 5. The structure of any one of claims 1 to 4, comprising at least one circuit or other element selected from the group consisting of a series resistor, a thermistor, a white solder mask, a capacitor, an inductor, a trace, an antenna, a sensor, an electrode such as a capacitive sensing electrode, a contact pad, an integrated circuit, a controller, a processor, a memory, a transceiver, a driver circuit, optionally an optically transparent globe top or other conformal coating, and a via.

22. The structure according to any one of claims 1 to 4, wherein the circuit board comprises several castellations (212) provided with the at least one connecting material.

23. The structure of any one of claims 1 to 4, wherein the at least one connecting material defines an angular or curved element oriented on an edge of the circuit board.

24. The structure of any one of claims 1 to 4, wherein the substrate film exhibits at least locally a non-planar 3D shape, and the lighting module is arranged in a recess (102B) in the substrate film.

25. The structure of any one of claims 1 to 4, including a structural adhesive (124) between the substrate film and the circuit board.

26. The structure of any one of claims 1 to 4, wherein the at least one light source comprises a packaged semiconductor type or a chip-on-board semiconductor type light source.

27. 5. The structure of any one of claims 1 to 4, wherein the circuit board comprises at least one member selected from the group consisting of flexible films or sheets, rigid sheets, rectangular sheets or films, rounded or essentially circular sheets or films, FR4-based circuit boards, metal core circuit boards, plastic substrates, molded articles such as injection-molded plastic substrates, metal substrates at least selectively provided with an electrically insulating layer, and ceramic circuit boards.

28. 5. The structure of any one of claims 1 to 4, wherein the substrate film and / or further film or material layers comprise at least one material selected from the group consisting of polymers, thermoplastic materials, electrically insulating materials, PMMA (polymethyl methacrylate), polycarbonate (PC), copolyesters, copolyester resins, polyimides, copolymers of methyl methacrylate and styrene (MS resins), glass, polyethylene terephthalate (PET), carbon fibers, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneers, plywood, bark, tree bark, birch bark, cork, natural leather, natural fiber or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination thereof.

29. 5. The structure of any one of claims 1 to 4, wherein the thermoplastic layer comprises at least one thermoplastic material selected from the group consisting of polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermoset materials, elastomeric resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), PP (polypropylene), TPU (thermoplastic polyurethane), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanizate), and MS resin.

30. A method (1200) for manufacturing an integrated functional multi-layer structure, comprising: Obtaining (1202) a flexible substrate film (102); disposing (1206) a lighting module on the substrate film, the lighting module comprising: a circuit board for receiving electronic devices; a circuit on the circuit board including at least one light source; disposing (1206) the circuitry configured to be electrically and thermally connected to some portion of the remaining structure beside or below the circuit board using at least one connecting material disposed therebetween (1208); and fabricating a thermoplastic layer on the substrate film to at least laterally surround the lighting module.

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