Inductive charging unit and energy transfer system including the same - Patents.com

Abstract

The invention relates to an inductive charging unit (1) for an energy transmission system, comprising a cooling device (3) defining a mounting surface (2) and configured for dissipating thermal energy, at least one power component (4) and a clamping device (5). It is important here that the at least one power component (4) is clamped to the mounting surface (2) of the cooling device (3) by means of the clamping device (5). The invention also relates in particular to an energy transmission system for inductively charging a battery electric vehicle with electric energy, comprising such an inductive charging unit (1).

Description

[Technical field]

[0001] The invention relates to an inductive charging unit for an energy transmission system according to the subject matter of claim 1. The invention also relates in particular to an energy transmission system for inductively charging a battery electric vehicle with electric energy, comprising such an inductive charging unit.

[0002] To inductively charge a battery electric vehicle with electric energy, an energy transmission system is usually used, which comprises an inductive charging unit arranged on the ground side, also called in practice the ground assembly (GA for short), and an opposing inductive charging unit arranged on the vehicle side. These inductive charging units and opposing inductive charging units are arranged to transmit energy contactlessly on the basis of magnetic coupling. Due to local magnetic flux density hotspots and hysteresis losses, electromagnetic power components arranged in the inductive charging unit, for example those whose thermal power to be dissipated is in the range of 0.1-5% of the power transmitted between the inductive charging unit and the opposing inductive charging unit, need to be cooled. However, in known inductive charging units, the power components are only poorly thermally coupled with the cooling device of the inductive charging unit, so that optimal cooling cannot be achieved. In particular, the presses on the cooling device are not detachable or can only be attached or detached with difficulty, which is disadvantageous, especially in the prototype stage.

[0003] It is therefore an object of the present invention to provide an improved or at least one alternative embodiment of an inductive charging unit for an energy transmission system. In particular, this embodiment should be manufactured at low cost, be structured as compact as possible and provide an optimal thermal coupling between the power components of the inductive charging unit and the cooling device. Furthermore, this embodiment should allow connection to different types of power components, such as, in particular, transistors, diodes, MOSFETs, etc.

[0004] According to the invention, these problems are solved in particular by the subject matter of the independent claims. Advantageous embodiments are the subject matter of the dependent claims and the description.

[0005] The basic consideration of the present invention is that the performance of an inductive charging unit or an energy transfer system can be improved based on an optimal thermal coupling between the power components of the inductive charging unit, which functionally heat up during operation of the inductive charging unit or the energy transfer system, and a cooling device of the inductive charging unit.

[0006] Therefore, an inductive charging unit for an energy transmission system is proposed, which comprises a cooling device defining a mounting surface and configured to dissipate thermal energy, at least one power component, and a clamping device. It is important here that the at least one power component is clamped to the mounting surface of the cooling device by means of the clamping device. As a result, the at least one power component is clamped or pressed to the cooling device, whereby an optimal, particularly gap-free, thermal coupling between the at least one power component and the cooling device is achieved. This has the advantage that a relatively large thermal energy flow from the at least one power component can be transferred to the cooling device, for example by thermal conduction, and dissipated by means of the cooling device. As a result, the at least one power component can be cooled very well, so that an energy transmission system with an inductive charging unit according to the invention can for example transmit a relatively high power, i.e. between its own inductive charging unit and an opposing inductive charging unit.

[0007] The cooling device may for example be realized by a cooling plate, for example the at least one power component may be pressed or clamped to the cooling device directly, i.e. in direct contact, or indirectly, i.e. in indirect contact.

[0008] Expediently, the inductive charging unit has a printed circuit board facing the cooling device in the direction of a vertical axis perpendicular to the mounting surface and optionally oriented parallel to the mounting surface. Here, at least one power component may be positioned between the printed circuit board and the cooling device in the direction of the vertical axis and arranged on the printed circuit board. Here, the clamping device is expediently engaged through an opening arranged on the printed circuit board. This shows a preferred embodiment in which the clamping device is engaged through an opening arranged on the printed circuit board. This has the advantage that in order to clamp the at least one power component on the cooling device, the clamping device does not have to be positioned between the printed circuit board and the cooling device, but rather only has to be engaged through it. This allows the printed circuit board and the cooling device to be positioned relatively close to each other, whereby the thermal energy from the at least one power component, possibly also together with the thermal energy from the printed circuit board, can be optimally transferred to the cooling device and dissipated therefrom. The printed circuit board is expediently a printed circuit board printed with electrical conductor tracks, a so-called PCB printed circuit board (Printed Circuit Board). At least one power component is connected, for example, for electrical communication with these electrical conductor paths and / or is fixed, for example by soldering, to the printed circuit board body of the printed circuit board. Furthermore, it may be envisaged that the clamping device is arranged, for example at least section-wise or substantially, on the opposite side of the printed circuit board to the cooling device.

[0009] It may furthermore be expedient to provide that the opening passes completely through the printed circuit board in the direction of the vertical axis. Furthermore, the opening and the at least one power component may be located in a line that is optionally parallel to the vertical axis. This allows the opening to be located, so to speak, directly above the at least one power component, so that the clamping device can particularly easily cooperate with the at least one power component via a clamping action.

[0010] Expediently, the clamping device is further realized by at least one clamping spring or at least one clamping spring arrangement. This shows a preferred embodiment of the clamping device, where according to a first variant, the at least one clamping spring clamps the at least one power component directly to the cooling device without additional components. Expediently, two or more such clamping springs can be assigned to the at least one power component. Furthermore, the at least one power component can be clamped to the cooling device individually by the at least one clamping spring. Expediently, it is furthermore conceivable that the clamping device realized by the at least one clamping spring arrangement clamps the at least one power component to the cooling device. Here, the at least one power component can possibly be assigned two or more clamping spring devices. The realization of the clamping device by the at least one clamping spring arrangement has the advantage that the at least one power component is optimally clamped to the cooling device. For example, the spring force of the at least one clamping spring or the at least one clamping spring device may be selected or set such that the at least one power component is clamped to the cooling device according to a preset or predefinable pressing force.

[0011] Expediently, at least one clamping spring or at least one clamping spring device penetrates and engages the opening of the printed circuit board at least section by section in order to clamp the at least one power component to the cooling device. Here, it can be advantageous if the at least one clamping spring or at least one clamping spring device acts exclusively on the at least one power component and not on the printed circuit board, i.e., the printed circuit board is not exposed to a spring force load, which can reduce the mechanical load on the printed circuit board.

[0012] It may further be expedient to provide that the at least one clamping spring device has a base body that is stationary with respect to the cooling device, a clamping element that defines a clamping element central axis in its main extension direction, and an adjusting spring arranged on the clamping element.

[0013] Here, the adjusting spring can clamp the clamping element axially to the at least one power component with respect to the clamping element central axis, whereby the at least one power component is clamped to the mounting surface of the cooling device by means of the clamping element. Furthermore, the adjusting spring can be arranged, for example completely or at least section-wise, on the side of the printed circuit board opposite the cooling device. Furthermore, the clamping element can be supported on the base so as to be longitudinally adjustable in the direction of the clamping element central axis. It is also possible for the clamping element central axis to be oriented parallel to an up-down axis perpendicular to the mounting surface. Furthermore, the clamping element can be engaged through the above-mentioned opening in the printed circuit board. Thus, an embodiment for a clamping spring device is shown, according to which at least one power component can be clamped to the mounting surface of the cooling device. In this case, the above-mentioned components of the clamping spring device are relatively inexpensive and are available on the market, for example in large quantities, so that an inductive charging unit with the above-mentioned clamping spring device can be produced relatively inexpensively.

[0014] Expediently, the clamping elements may be made of or coated with a non-conductive material, and furthermore, it may be expedient if the clamping elements and / or the openings in the printed circuit board for the clamping elements are configured according to the error-proofing principle in order to allow the at least one power component and / or the clamping element to be mounted without any mix-up.

[0015] It is also expedient if the clamping element and / or the opening in the printed circuit board for the clamping element are shaped in such a way that the clamping element and possibly at least one power component can be securely pre-attached to the inductive charging unit or to the printed circuit board by means of soldering before the electrical connection to the conductor tracks of the printed circuit board, which simplifies the installation. In this case, detachable positive-locking connections, such as, for example, locking lugs arranged on the clamping element, which can temporarily fasten the clamping element to the printed circuit board, or additional components, such as clips or snap rings, which can temporarily fasten the clamping element to the printed circuit board, are expedient.

[0016] In particular, it may be proposed that the adjustment spring is realized by a compression spring supported and guided in the base body and the clamping element. Alternatively, it may be envisaged that the adjustment spring is realized by a leaf spring that is integrally configured with the base body. This gives two embodiments for the adjustment spring, where the compression spring can be procured in large quantities, for example, at low cost, and the leaf spring that is integrally configured with the base body can reduce the costs, in particular for the installation of the clamping spring arrangement.

[0017] Furthermore, the clamping element can be connected, for example glued, in particular positively and / or frictionally and / or materially to the at least one power component, for example using a thermally conductive adhesive material which is applied with a material thickness in the range of 5 μm to 150 μm in the direction of the upper and lower axes and / or has a thermal conductivity in the range of 0.2 W / mK to 50 W / mK.

[0018] It is expedient here if at least one clamping spring device further comprises a holding device consisting of a retaining pole fastened to the cooling device, by means of which the base body is or can be connected to the cooling device in a detachable positive and / or frictional manner. The retaining pole can have a positive-locking contour, for example a locking protrusion, by means of which the base body is or can be fastened detachably or non-detachably to the respective retaining pole in a detachable positive and / or frictional manner. The base body can also be detachably fixed to the respective retaining pole in a positive and / or frictional manner by means of fastening means, for example a fastening screw and / or a fastening nut. The retaining pole can furthermore be fastened to the cooling device in a material-fastening manner, for example by means of soldering or welding. In this case, the retaining pole can be through-engaged, in particular for itself, through a retaining pole opening arranged on the printed circuit board. Alternatively, the retention poles may surround the printed circuit board, i.e. in particular surround and engage the board edge of the printed circuit board, so that the printed circuit board does not have to have openings designated for the retention poles. In an expedient embodiment, it may be envisaged that the at least one retention pole of the holding device reinforces the cooling device, in particular at the point where the at least one power component is clamped to the cooling device in an intended manner.

[0019] In a further expedient embodiment, the base body is realized by a flat plate or a housing cover, in which case it may be provided that the flat plate or the housing cover is arranged on the opposite side of the printed circuit board from the cooling device.

[0020] It may furthermore be expedient if, in the direction of an up-down axis perpendicular to the mounting surface of the cooling device, a bonding layer is arranged between the mounting surface and the flat component surface defined by the at least one power component, in particular sandwiched between the mounting surface and the component surface. This bonding layer may here be in contact with the at least one power component and / or the cooling device. The bonding layer may here be fixed to the component surface of the at least one power component. In this case, a material-bonding connection by brazing, for example, with the aid of a suitable brazing material and / or a brazing coating applied to the bonding layer, is suitable. The bonding layer may thus be material-bondingly connected to the at least one power component. Furthermore, the bonding layer may be in contact with the mounting surface and releasably clamped thereto. The bonding layer is expediently realized from a ceramic material, which optionally has a material thickness in the range of 0.2 mm to 2 mm in the direction of the vertical axis and / or a thermal conductivity in the range of 0.2 W / mK to 50 W / mK and / or an electrical breakdown strength in the range of 500 V DC or more. Alternatively, the bonding layer can be realized from a composite material, for example by a plastic-based heat-conducting film or by a plastic-based heat-conducting pad or by a graphite film with an electrically insulating layer made of plastic, and can have a material thickness in the range of 0.05 mm to 1 mm in the direction of the vertical axis and / or a thermal conductivity in the range of 0.1 W / mK to 5 W / mK, for example perpendicular to the material thickness, and / or an electrical breakdown strength in the range of 200 V DC or more. On the basis of the bonding layer, at least one power component can be optimally thermally and / or mechanically bonded to the mounting surface of the cooling device.

[0021] Appropriately, between the bonding layer and the component surface of the at least one power component in the direction of the vertical axis, a fastening layer is arranged for connecting or contacting the bonding layer to the at least one power component, the fastening layer being particularly present in sandwich form between the bonding layer and the component surface. The fastening layer has a double function: it should provide for as good a thermal conduction as possible to the bonding layer and for a sufficiently good electrical insulation between the at least one power component and the printed circuit board or the cooling device. Here, it may be provided that the fastening layer is thin in the direction of the vertical axis with respect to the bonding layer and is preferably realized from a thermally conductive adhesive material, for example as an adhesive layer. It may also be provided that the fastening layer, in particular as an adhesive layer, has a material thickness in the range of 5 μm to 150 μm and / or a thermal conductivity in the range of 0.2 W / mK to 50 W / mK in the direction of the vertical axis. The fastening layer allows the bonding layer to be fixed to the component surface of the at least one power component. Furthermore, the fixing layer can provide an optimal thermal and / or mechanical connection between the bonding layer and the at least one power component, where in particular the indicated thermal conductivity of the fixing layer can positively influence the transfer of thermal energy from the at least one power component to the bonding layer.

[0022] Furthermore, the clamping element can be connected in a form-fitting manner with the at least one power component or the connecting layer, which can in particular be realized on the basis of clips or locking projections, which has the advantage that the clamping element does not necessarily have to be connected in a material-fitting manner with the at least one power component or the connecting element, so that, for example, the above-mentioned brazing process for material-fittingly connecting the connecting layer to the at least one power component can be omitted.

[0023] Furthermore, the clamping element is expediently electrically insulating the at least one power component, in particular from the printed circuit board and from the cooling device. Expediently, a connecting layer, as described below, is used to achieve the electrical insulation of the at least one power component, and in particular a fastening layer, as described below, can be used for a gap-free connection between the clamping element or the holder and the connecting layer. For example, the clamping element can be designed to achieve an electrical insulation, in particular with an electrical breakdown strength in the range of 200 V DC or more, in particular with respect to the printed circuit board. Expediently, it is provided for the clamping element to surround the at least one power component at least section-wise for this purpose. This makes it possible, in particular, to prevent short circuits that endanger the at least one power component and thus to improve the operational safety of the inductive charging unit.

[0024] Furthermore, it may be expedient if a contact-connection layer is arranged between the bonding layer and the mounting surface of the cooling device in the direction of the vertical axis, which is designed to contact-connect the bonding layer to the cooling device. In this case, this contact-connection layer is in particular present here in sandwich form between the bonding layer and the mounting surface. Furthermore, the contact-connection layer may be realized by an oil film made of heat-conducting oil and may also be expediently designed to be non-adhesive and / or non-hardening. On the basis of this contact-connection layer, on the one hand, an optimal thermal and / or mechanical connection between the bonding layer and / or the at least one power component and the cooling device may be realized and, on the other hand, a relatively easy removal of the at least one power component from the cooling device may be realized. Expediently, the contact-connection layer may have a suitable thermal conductivity for this purpose.

[0025] Expediently, furthermore, the mounting surface of the cooling device, i.e. in particular the mounting surface at which the bonding layer or at least one power component may be clamped, is provided with an improved surface quality compared to the remaining surface qualities of the cooling device. This can be achieved, for example, in that the mounting surface of the cooling device is treated by special production techniques, such as embossing, milling, grinding, polishing, brushing, cleaning, etc. Here, in particular the surface properties, such as, for example, the flatness and / or the surface roughness, of the mounting surface of the cooling device may be optimized.

[0026] A further basic idea of ​​the present invention is to provide an energy transmission system with an inductive charging unit according to the above description. A corresponding energy transmission system for inductively charging a battery electric vehicle with electric energy therefore comprises an inductive charging unit according to the above description and a counter-inductive charging unit arranged on the vehicle side, where the inductive charging unit and the counter-inductive charging unit are configured to transmit energy contactlessly based on magnetic coupling. This represents an advantageous energy transmission system with an inductive charging unit according to the above description, which can transmit a relatively high power based on the improved cooling capacity of the inductive charging unit.

[0027] Advantageously, the clamping device can be used, for example, within the housing of an electrical device.

[0028] In summary, it should be understood that the invention relates to an inductive charging unit for an energy transmission system, which comprises a cooling device, which defines a mounting surface and is adapted to dissipate thermal energy, at least one power component, and a clamping device. What is important is that the at least one power component is clamped to the mounting surface of the cooling device by means of the clamping device. The invention also relates in particular to an energy transmission system for inductively charging a battery electric vehicle with electric energy, which comprises such an inductive charging unit.

[0029] Important further features and advantages of the invention emerge from the dependent claims, the drawings and the associated drawing description based on the drawings.

[0030] It will be understood that the features mentioned above and those to be further described below can be used not only in the respective combinations described, but also in other combinations or alone, without departing from the scope of the present invention.

[0031] Preferred embodiments of the present invention are illustrated in the drawings and will be explained in more detail in the following description, where like reference numbers refer to identical or similar or functionally identical components. [Brief description of the drawings]

[0032] [Figure 1] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Diagram 2] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Diagram 3] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Figure 4] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Diagram 5] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Figure 6] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Figure 7] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Figure 8] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment. [Figure 9] FIG. 2 is a symbolic cross-sectional view that illustrates a schematic representation of an inductive charging unit according to a preferred embodiment.

[0033] 1 to 9 show an embodiment of an inductive charging unit generally designated by reference number 1, which cooperates or can cooperate on the basis of magnetic coupling with an opposing inductive charging unit of an energy transmission system, not shown, for contactless energy transmission, for inductive charging of a battery electric vehicle, also not shown. The inductive charging unit 1 is in this embodiment arranged in or on the ground on which said battery electric vehicle rests, whereas the opposing inductive charging unit is attached to the vehicle bottom of the battery electric vehicle. However, it is also conceivable that the above-mentioned inductive charging unit 1 forms the opposing inductive charging unit on the vehicle side, or that both the inductive charging unit 1 and the opposing inductive charging unit of the energy transmission system have the features of the inductive charging unit 1 according to the following description.

[0034] 1 to 9 show an embodiment of an inductive charging unit 1 for an energy transmission system, each having a cooling device 3, at least one power component 4 and a clamping device 5. The cooling device 3 is exemplarily realized by a cooling plate through which a cooling medium flow 26 from a cooling medium, indicated by arrows in FIGS. 1 to 9, flows. By means of this cooling medium flow 26, thermal energy can be dissipated from the cooling device 3, so that the cooling device 3 can be regarded simply as a simple heat sink. The cooling device 3 forms a flat mounting surface 2, in this case perpendicular to which stands a vertical axis 7, indicated by a dashed line. The inductive charging unit 1 also has, by way of example, a flat printed circuit board 6, for example a PCB board (Printed Circuit Board), which faces the cooling device 3 in the direction of a top-bottom axis 7 and is at the same time oriented parallel to the mounting surface 2, so that between the cooling device 3 and the printed circuit board 6 an installation space 28 is defined for the at least one power component 4 and possibly further components of the inductive charging unit 1. The at least one power component 4 is realized in the present embodiment by a transistor, a diode or a MOSFET, and in this case could also be realized, at least in theory, by any other electrical component. The at least one power component 4 is positioned within the installation space 28 and is fixed by means of its electrical connection pins 27 to the printed circuit board body of the printed circuit board 6 and is electrically connected in communication with not shown electrical conductor paths of the printed circuit board 6 on the basis of the connection pins 27. In practice, the connection pins 27 may each be bent over and the free legs may be inserted through not shown pin openings provided in the printed circuit board 6 especially for this purpose. The at least one power component 4 defines a planar component face 25 which in this embodiment is oriented parallel to the mounting face 2 and faces said mounting face 2 in the direction of the top-bottom axis 7. The at least one power component 4 further has a counter component face 29 which is located opposite the component face 25 and extends parallel to the mounting face 2.The at least one power component 4 further has a component face 25, a counter-component face 29 and side faces which are oriented transversely with respect to the mounting face 2, but which are not numbered in this embodiment. The component face 25 and the counter-component face 29 exemplarily form a large area, whereas the side faces form a smaller area.

[0035] In known inductive charging units, these power components are only insufficiently thermally coupled to the cooling device of the inductive charging unit, so that optimal cooling cannot be achieved. To overcome this drawback, it is essential that the at least one power component 4 is fixedly clamped on the mounting surface 2 of the cooling device 3 in the direction of the vertical axis 7 or possibly at a slight angle to the vertical axis 7 on the basis of the above-mentioned clamping device 5 of the inductive charging unit 1. As a result, the at least one power component 4 is clamped or pressed onto the cooling device 3 in a particularly tight manner, whereby a very good thermal coupling between the at least one power component 4 and the cooling device 3 is achieved. This has the advantage that a relatively large thermal energy flow can be transferred from the at least one power component 4 to the cooling device 3 and dissipated from this cooling device 3, so that the at least one power component 4 is or can be cooled very well.

[0036] The clamping device 5 described above can be implemented on the basis of different constructional measures, whereby in Figs. 1 to 9 seven such constructional measures are proposed.

[0037] According to Fig. 1, it is envisaged that the clamping device 5 is realised by a clamping spring device 10, which resiliently clamps the at least one power component 4 in the direction of the top-bottom axis 7 to the cooling device 3, i.e. perpendicular to the mounting surface 2, so that a component surface 25 of the at least one power component 4 is mechanically and thermally connected to the mounting surface 2 or to the cooling device 3. This connection can be achieved here by the at least one power component 4 being clamped with its component surface 25 in direct contact with the mounting surface 2 (this is not shown in Fig. 1) or by the at least one power component 4 being clamped with its component surface 25 indirectly to the mounting surface 2, in particular with the intervening connection of a layer assembly 30 consisting of the individual layers 22, 23, 24. According to Fig. 1, it can be seen that a first individual layer of the layer assembly 30 is provided, which will be referred to below as the connecting layer 22. The bonding layer 22 is arranged in the direction of the vertical axis 7 between the mounting surface 2 of the cooling device 3 and the component surface 25 of the at least one power component 4, the bonding layer 22 being sandwiched between the mounting surface 2 and the component surface 25. The bonding layer 22 is permanently fixed on the entire surface to the component surface 25 by means of a second individual layer, called fixing layer 23, of the layer assembly 30, which will be described further below, or by brazing, for example, with a suitable brazing material or by brazing on the basis of a brazing coating applied to the bonding layer 22. The bonding layer 22 may be realized from a ceramic material, so that in this case the bonding layer 22 has a material thickness in the direction of the vertical axis 7 in the range of 0.2 mm to 2 mm and / or a thermal conductivity, for example perpendicular to the material thickness, in the range of 0.2 W / mK to 50 W / mK and / or an electrical breakdown strength in the range of 500 V DC or more. Alternatively, the bonding layer 22 may be realized from a composite material, for example by a plastic-based heat-conducting film or by a plastic-based heat-conducting pad or by a graphite film provided with an electrically insulating layer made of plastic.In this case, the bonding layer 22 has a material thickness in the direction of the vertical axis 7 in the range of 0.05 mm to 1 mm and / or a thermal conductivity, for example perpendicular to the material thickness, in the range of 0.1 W / mK to 5 W / mK and / or an electrical breakdown strength in the range of 200 V DC or more. Due to the bonding layer 22, the at least one power component 4 can be optimally mechanically and thermally bonded to the cooling device 3.

[0038] With regard to the mentioned fastening layer 23, it is to be noted that this fastening layer 23 is arranged in the direction of the vertical axis 7 between the described connection layer 22 and a component surface 25 of the at least one power component 4, and is formed in such a way that the connection layer 22 is permanently and non-detachably connected to the at least one power component 4. Here, the fastening layer 23 can in particular be present in a sandwich-like manner between the connection layer 22 and the component surface 25. The fastening layer 23, in relation to the connection layer 22, is thin in the direction of the vertical axis 7 and is realized, for example, as an adhesive layer realized from a thermally conductive adhesive material, in which case the fastening layer 23 has a material thickness in the range of 5 μm to 150 μm and / or a thermal conductivity in the range of 0.2 W / mK to 50 W / mK in the direction of the vertical axis 7. With the fastening layer 23, in particular an optimal thermal and / or mechanical connection between the connection layer 22 and the at least one power component 4 can be realized.

[0039] In FIG. 1 it can furthermore be seen that the layer assembly 30 has a third individual layer 22, 23, 24, referred to below as contact-connection layer 24. The contact-connection layer 24 is arranged between the bonding layer 22 and the mounting surface 2 of the cooling device 3 in the direction of the top-bottom axis 7 and is designed to contact-connect the bonding layer 22 with the cooling device 3. The contact-connection layer 24 is in particular sandwiched between the bonding layer 22 and the mounting surface 2 and is realized, for example, by a relatively thin oil film of heat-conducting oil. In particular, the contact-connection layer 24 is designed to be non-adhesive and non-hardening, so that the bonding layer 22 and the at least one power component 4 are not permanently connected to the mounting surface 2 or the cooling device 3 but are removable. Due to the contact-connection layer 24, an optimal thermal and / or mechanical connection of the bonding layer 22 with the cooling device 3 is possible and, as described above, a relatively easy removal of the at least one power component 4 from the cooling device 3 is possible.

[0040] The above-mentioned clamping spring arrangement 10 according to FIG. 1 can also be realized by a flat plate or a housing cover and has a base body 11 arranged on the side of the printed circuit board 6 facing away from the cooling device 3, which is stationary with respect to the cooling device 3, and a holding device 17 fixed to the cooling device 3 and consisting of detent poles 18 which project away from the cooling device 3 in the form of fingers in the direction of the upper-lower axis 7, by means of which the base body 11 is releasably fixed to the cooling device 3. By way of example only, the detent poles 18 are here fastened to the cooling device 3 by soldering, the printed circuit board 6 having a through-engagement in the detent pole openings 21 arranged for this in the printed circuit board 6 and having mutually opposing form-locking contours at the free end 33 of the printed circuit board 6 for fixedly clipping the base body 11. In this case, these are by way of example a pair of locking lugs 19. For example, the base body 11 can be inserted between two retaining poles 18 in the direction of the vertical axis 7, in which case the base body 11 first slides along the inclined portions of the retaining projections 19, the retaining poles 18 being elastically displaced laterally to the vertical axis 7 until the base body 11 passes over the inclined portions of the retaining projections 19, and then the retaining poles 18 elastically return to their initial position and abut against the base body 11.

[0041] The clamping spring device 10 further comprises a clamping element 13, which defines a clamping element central axis 12 in its main extension direction, which is displaceably supported in the base body 11 in a bearing receptacle 32 of the base body 11 in a longitudinally adjustable manner in the direction of the clamping element central axis 12, for example in a sliding bearing receptacle which is realized by a simple opening in the base body 11, and which can perform an adjustment movement 31, which is indicated by a double arrow in Fig. 1. The clamping element 13 or the clamping element central axis 12 of the clamping element 13 here stands perpendicularly to the base body 11. Furthermore, the clamping spring device 10 is arranged in the cooling device 3 in such a way that the vertical axis 7 and the clamping element central axis 12 are mutually parallel. The clamping element 13 has a circular shaft 34 extending in the direction of the clamping element central axis 12, which is divided into a first shaft section 35 with a first diameter and a second shaft section 36 with a second diameter, which is integrally connected to the first shaft section 35. By way of example, the first diameter is smaller than the second diameter, so that in a transition area 37 between the first shaft section 35 and the second shaft section 36 a support shoulder 38 for the adjustment spring 14, which will be described in detail below, is formed. In addition, in the transition area 37, shaft locking projections 39 with projection ramps are provided, which are arranged on the second shaft section 36 and are distributed evenly around its circumference. Furthermore, at the shaft section free end opposite the transition area 37, the first shaft section 35 forms a bearing section 40 which cooperates with the bearing receptacle 32 of the basic body 11. The second shaft portion 36 of the clamping element 13, like the retention pole 18, engages through an opening 8 in the printed circuit board 6, which passes completely through the printed circuit board 6 in the direction of the vertical axis 7 and is flush with the bearing receptacle 32, so that the second shaft portion 36 or the clamping element projects into the mounting space 28. The opening 8 and the at least one power component 4 here lie exemplarily on a flush line 9 which is parallel to the vertical axis 7 and which in this embodiment is identical with the clamping element central axis 12.At the free shaft end 41, which is located in the mounting space 28 and is opposite the transition area 37, the second shaft part 36 has an integral plate-like holding part 42 for holding the at least one power component 4. By way of example, the holding part 42 surrounds the at least one power component 4 at least section-wise, for example the opposite component surface 29 of the at least one power component 4 and at least one of the above-mentioned side surfaces of the at least one power component 4. In particular, it is envisaged that the holding part 42 is connected to the at least one power component 4, for example by using an adhesive or by realising a form-fitting connection by means of a clip. This makes it possible to ensure that the clamping element 13 electrically insulates the at least one power component 4 from the printed circuit board 6, in particular to achieve an electrical breakdown strength in the range of, for example, 200 V DC or more.

[0042] The clamping spring arrangement 10 further comprises an adjustment spring 14 arranged on the circular axis 34 of the clamping element 13, which in the present embodiment is realized by a helical compression spring 15, which is supported axially on the one hand on the support shoulder 38 of the clamping element 13 and on the other hand on the base body 11 in the region of the bearing receptacle 32. Here, the helical compression spring 15 axially clamps the clamping element 13 with respect to the clamping element central axis 12 to the at least one power component 4, whereby the power component 4 is clamped by means of the clamping element 13 to the mounting surface 2 of the cooling device 3. Furthermore, the helical compression spring 15 simultaneously clamps the base body 11 axially with respect to the clamping element central axis 12 to the retention pole 18, whereby the base body 11 is immovably fixed to the retention pole 18. The spring force of the helical compression spring 15 can here be set according to a preferred achieved pressing force of the at least one power component 4 against the mounting surface 2. In this case, the inductive charging unit 1 with the above-mentioned clamping spring arrangement 10 can be produced at relatively low cost, since the above-mentioned components of the clamping spring arrangement 10 are relatively low-cost and are available on the market, for example in large quantities.

[0043] It may be provided, for example, that at least one power component 4 is connected to said connection layer 22, i.e. in particular thermally and / or mechanically contact-connected. Expediently, the connection layer 22 is connected in a material-bonding manner with the at least one power component 4. At the same time, the holding part 42 and the clamping element 13 together with the connection layer 22 can form, in particular a circumferentially closed electrical insulation for the at least one power component 4 in the form of an encapsulation or housing. Said electrical insulation may be realized, for example, by the holding part 42 and / or the clamping element 13 engaging over the edge of the connection layer 22 and / or by surrounding engagement with the connection layer 22. In Figs. 8 and 9, possible variants of the clamping device 5 shown in Fig. 1 are shown, in which at least one power component 4 is glued to the holding part 42 or sealed by suitable means to the at least one power component 4 in order to realize said electrical insulation. The adhesive layer is therein respectively designated with the reference number 47. A form-locking connection is also possible. It may further be envisaged that the assembly formed from the holding part 42, the clamping element 13, the at least one power component 4 and the bonding layer 22 is tested with regard to the effect of the realized electrical insulation before the final mounting on the substrate 6 or on the cooling device 3. This makes it possible to check the electrical insulating effect and thereby to protect sensitive components of the assembly. Furthermore, the quality of the thermally conductive fastening layer 23 could also be tested already before the final mounting.

[0044] 2 shows a further embodiment of an inductive charging unit 1 for an energy transmission system. In contrast to the embodiment shown in FIG. 1, it is envisaged that the retention pole 18 is laid in a planar manner on the mounting surface 2 of the cooling device 3 and is connected thereto with a reinforcing component 44, which is for example soldered thereto. This allows the cooling device 3 to be strengthened, for example reinforced, in a targeted manner at the point where the at least one power component 4 is clamped to the cooling device 3 by means of the clamping device 5.

[0045] 3 shows a further embodiment of an inductive charging unit 1 for an energy transmission system. In contrast to the embodiment shown in FIG. 1, it is assumed that the base body 11 has an integral hook arm 45 with a hook arm locking projection 46 that can be clipped onto the retention pole 18. This allows the retention pole 18 to be designed relatively compact. Furthermore, it is assumed here, similar to the embodiment shown in FIG. 2, that the retention pole 18 is placed in a planar manner on the mounting surface 2 of the cooling device 3 and is connected thereto, for example by soldering, with a reinforcing component 44. This allows the cooling device 3 to be strengthened, for example reinforced, in a targeted manner at the point where the at least one power component 4 is clamped to the cooling device 3 by means of the clamping device 5.

[0046] Figure 4 shows a further embodiment of an inductive charging unit 1 for an energy transmission system. In contrast to the embodiment shown in Figure 1, the retention pole 18 is not equipped with a locking lug 19 but forms a fastening screw 43, whereby the base body 11 is inserted into the retention pole 18 and fixed thereto by means of a fastening nut 20.

[0047] FIG. 5 shows a further embodiment of an inductive charging unit 1 for an energy transmission system. In contrast to the embodiment shown in FIG. 1, it is assumed that the adjustment spring 14 is realized here by a leaf spring 16, which is configured integrally with the base body 11, instead of a compression spring 15. As a result, the adjustment spring 14 is configured integrally with the base body 11, whereby the mounting is simplified and components are saved. Furthermore, it is assumed here, similar to the embodiment shown in FIG. 2, that the retention pole 18 is placed in a planar manner on the mounting surface 2 of the cooling device 3 and is connected thereto by a reinforcing component 44, which is for example soldered. As a result, the cooling device 3 can be strengthened, for example reinforced, in a targeted manner at the point where the at least one power component 4 is clamped to the cooling device 3 by means of the clamping device 5.

[0048] FIG. 6 shows a further embodiment of an inductive charging unit 1 for an energy transmission system. In contrast to the embodiment shown in FIG. 1, it is assumed that the adjustment spring 14 is realized here instead of a compression spring 15 by a leaf spring 16 which is configured integrally with the base body 11. As a result, the adjustment spring 14 is configured integrally with the base body 11, whereby the installation is simplified and components are saved. In contrast to the embodiment shown in FIG. 5, the leaf spring 16 simultaneously forms a section of the clamping element 13, expediently also the first shaft part 35. As in the case of the embodiment shown in FIG. 2, it is also assumed here that the retention pole 18 rests in a planar manner on the mounting surface 2 of the cooling device 3 and is connected thereto with a reinforcing component 44 which is, for example, soldered. This allows the cooling device 3 to be strengthened, for example reinforced, in a targeted manner at the point where at least one power component 4 is clamped to the cooling device 3 by means of the clamping device 5.

[0049] 7 shows a further embodiment of an inductive charging unit 1 for an energy transmission system. In contrast to the embodiment shown in FIG. 1, it is assumed that the second shaft portion 36 of the clamping element 13 is shorter in the axial direction in the direction of the clamping element central axis 12 than the first shaft portion 35 of the clamping element 13 or is completely omitted. As in the embodiment shown in FIG. 2, it is also assumed here that the retention pole 18 rests planarly on the mounting surface 2 of the cooling device 3 and is connected thereto, for example by soldering, with a reinforcing component 44. This allows the cooling device 3 to be strengthened, for example reinforced, in a targeted manner at the point where at least one power component 4 is clamped to the cooling device 3 by means of the clamping device 5.

Claims

1. An inductive charging unit (1) for an energy transfer system, comprising: a cooling device (3) defining a mounting surface (2) and configured to dissipate thermal energy; At least one power component (4); A clamping device (5); Equipped with The at least one power component (4) is clamped to the mounting surface (2) of the cooling device (3) by means of the clamping device (5).

2. a printed circuit board (6) facing the cooling device (3) in a direction of an up-down axis (7) perpendicular to the mounting surface (2) and optionally oriented parallel to the mounting surface (2); the at least one power component (4) is positioned between the printed circuit board (6) and the cooling device (3) in the direction of the vertical axis (7) and is disposed on the printed circuit board (6); 2. The inductive charging unit (1) according to claim 1, wherein the clamping device (5) is engaged through an opening (8) arranged in the printed circuit board (6) and / or the clamping device (5) is arranged on an opposite side of the printed circuit board (6) from the cooling device (3).

3. said opening (8) completely passes through said printed circuit board (6) in the direction of said vertical axis (7); and / or 3. The inductive charging unit (1) of claim 2, wherein the opening (8) and the at least one power component (4) are on a line (9) that is optionally parallel to the vertical axis (7).

4. 4. The inductive charging unit (1) according to any one of claims 1 to 3, wherein the clamping device (5) is realized by at least one clamping spring or at least one clamping spring device (10).

5. 5. The inductive charging unit (1) according to claim 4, wherein the at least one clamping spring device (10) comprises a base body (11) that is stationary with respect to the cooling device (3), a clamping element (13) that defines a clamping element central axis (12) in its main extension direction, and an adjusting spring (14) arranged on the clamping element (13).

6. The at least one clamp spring device (10) comprises: the adjusting spring (14) tightens the clamping element (13) axially relative to the clamping element central axis (12) to the at least one power component (4), whereby the at least one power component (4) is clamped to the mounting surface (2) of the cooling device (3) by means of the clamping element (13). The adjustment spring (14) is disposed on the opposite side of the printed circuit board (6) from the cooling device (3). The clamping element (13) is supported on the base body (11) so as to be longitudinally adjustable in the direction of the clamping element central axis (12). The clamp element central axis (12) is parallel to an up-down axis (7) perpendicular to the mounting surface (2). The clamping element (13) engages through an opening (8) in the printed circuit board (6) according to claim 2.

6. An inductive charging unit (1) according to claim 5, characterized in that it has at least one of the following features.

7. the adjusting spring (14) is realized by a compression spring (15) supported on the base body (11) and on the clamping element (13) and guided in the clamping element (13), or 7. An inductive charging unit (1) according to claim 5 or 6, wherein the adjusting spring (14) is realized by a leaf spring (16) which is constructed integrally with the base body (11).

8. 8. Inductive charging unit (1) according to any one of claims 5 to 7, characterized in that the clamping element (13) is connected, in particular glued, to the at least one power component (4).

9. the at least one clamping spring device (10) has a holding device (17) consisting of a retaining bar (18) fixed to the cooling device (3), by means of which the base body (11) is or can be connected to the cooling device (3) in a detachable, form-locking and / or friction-locking manner, and / or the retaining poles (18) have a form-locking contour, for example a locking projection (19), by means of which the base body (11) is or can be releasably fixed form-lockingly and / or frictionally to the respective retaining pole (18), or the base body (11) is or can be removably fixed to the respective anchoring pole (18) in a form-locking and / or friction-locking manner by means of fastening means, and / or the retention pole (18) is materially fastened to the cooling device (3), for example by means of soldering or welding, and / or 9. An inductive charging unit (1) according to claim 5, wherein the retention pole (18) is engaged with the printed circuit board (6) either through a retention pole opening (21) arranged for this purpose in the printed circuit board (6) or the retention pole (18) is engaged with the printed circuit board (6) around its outer edge.

10. a bonding layer (22) is arranged in the direction of a vertical axis (7) perpendicular to the mounting surface (2) of the cooling device (3) between the mounting surface (2) and a flat component surface (25) defined by the at least one power component (4); and / or The bonding layer (22) is The bonding layer (22) is in contact with the at least one power component (4). The bonding layer (22) is in contact with the cooling device (3). the bonding layer (22) is fixed, for example by material bonding, to the component surface (25) of the at least one power component (4); The bonding layer (22) is in contact with the mounting surface (2) and is removably clamped thereto. The bonding layer (22) is made of a ceramic material. the bonding layer (22) has, in the direction of the vertical axis (7), a material thickness in the range of 0.2 mm to 2 mm and / or a thermal conductivity in the range of 0.2 W / mK to 50 W / mK and / or an electrical breakdown strength in the range of 500 V DC or more; the bonding layer (22) is made of a composite material and has, in the direction of the vertical axis (7), a material thickness in the range of 0.05 mm to 1 mm and / or a thermal conductivity in the range of 0.1 W / mK to 5 W / mK and / or an electrical breakdown strength in the range of 200 V DC or more; 10. An inductive charging unit (1) according to any one of the preceding claims, characterized in that it has at least one of the following features:

11. and / or a fastening layer (23) is arranged between the bonding layer (22) and the component surface (25) of the at least one power component (4) in the direction of the vertical axis (7) for connecting the bonding layer (22) to the at least one power component (4); The fixing layer (23) is the fixing layer (23) is thin in the direction of the vertical axis (7) with respect to the bonding layer (22); The fixing layer (23) is made of a thermally conductive adhesive material. the fixing layer (23) has a material thickness in the direction of the vertical axis (7) in the range of 5 μm to 150 μm and / or a thermal conductivity in the range of 0.2 W / mK to 50 W / mK; 11. The inductive charging unit (1) according to claim 10, further comprising at least one of:

12. 12. The inductive charging unit (1) according to any one of claims 5 to 11, wherein the clamping element (13) is connected to the at least one power component (4) in a form-locking and / or friction-locking and / or material-locking manner.

13. The inductive charging unit (1) according to any one of claims 5 to 12, wherein the clamping element (13) electrically insulates the at least one power component (4), in particular with respect to the printed circuit board (6) according to claim 2, as well as with respect to the cooling device (3).

14. and / or a contact-connection layer (24) is arranged between the bonding layer (22) and the mounting surface (2) of the cooling device (3) in the direction of the vertical axis (7), the contact-connection layer (24) being adapted for contact-connecting the bonding layer (22) with the cooling device (3); the contact layer (24) is realized by a film of heat-conducting oil, and / or 14. The inductive charging unit (1) according to any one of claims 10 to 13, wherein the contact connection layer (24) is non-adhesive and / or non-hardening.

15. 1. An energy transfer system for inductively charging a battery electric vehicle with electrical energy, comprising: An inductive charging unit (1) according to any one of claims 1 to 14, an opposing inductive charging unit disposed on the vehicle side; Equipped with The energy transfer system, wherein the inductive charging unit (1) and the opposing inductive charging unit are configured to transfer energy contactlessly based on magnetic coupling.

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