Combining a plurality of ultrasonic beam skews

Abstract

Techniques for ultrasonic inspection using different beam skews arranged within a group are described. For example, the techniques described herein can group multiple different beam skews within a single group as part of a single channel, resulting in simpler processing and calibration. The techniques also describe a new scan image that shows different beam skews together so that an analyst can easily select and switch between different beam skews.

Description

Technical Field

[0001] Claims of Priority This patent application was filed on May 20, 2022, and claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 365,047, entitled "METHOD FOR COMBINING MULTIPLE PHASED ARRAY ULTRASONIC BEAM SKEW FOCAL LAWS INTO A SINGLE GROUP", which is hereby incorporated by reference in its entirety.

[0002] This application relates to ultrasonic inspection.

Background Art

[0003] Phased Array Ultrasonic Testing (PAUT) is an advanced non-destructive testing technique that utilizes a set of ultrasonic testing (UT) probes consisting of a large number of small elements, each of which is individually pulsed at computer-calculated timings and can be used to inspect more complex shapes that are difficult and much slower to inspect with a single probe. PAUT can be used to inspect almost all materials for which conventional UT methods such as weld inspection, crack detection, and corrosion monitoring are utilized, and can be used in a wide range of industries including aerospace, power generation, petrochemical, metal billet and tubular product suppliers, pipeline construction and maintenance, structural metals, and general manufacturing.

[0004] Compared to other forms of UT, PAUT has several advantages. (i) PAUT can be performed more quickly than other forms of UT. (ii) Since it has high reproducibility, it can be easily used for repeated scans. (iii) By sequentially emitting beams at different angles, PAUT can create detailed and accurate cross-sections of components. (iv) PAUT inspections can sweep the beam without moving the probe, which is particularly useful when there is little room for mechanical scanning.

Summary of the Invention

[0005] Examples described herein relate to a method, system, and computer program product for ultrasonic inspection having different beam skews. The examples include receiving scan control parameters including a beam skew configuration for a plurality of beam skews arranged in a group, performing calibration for each beam skew of the plurality of beam skews, establishing a calibration value for at least one other beam skew of the plurality of beam skews based on the calibration performed for each beam skew, receiving data indicative of an electrical response signal induced by scanning an object, wherein scanning is based on the scan control parameters, and generating data for presentation based on data indicative of electrical response signals corresponding to the plurality of beam skews within a channel.

Brief Description of the Drawings

[0006] The subject matter of this specification may be better understood by reference to the following description taken in conjunction with the accompanying drawings. The drawings are not meant to limit the scope of the claims included herein. For clarity, not all elements may be labeled in all figures. The drawings are not necessarily to scale; instead, emphasis is placed on illustrating embodiments, principles, and concepts. Accordingly, the features and advantages of the present disclosure will become more apparent from the following detailed description of its embodiments taken in conjunction with the accompanying drawings.

[0007]

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DETAILED DESCRIPTION OF THE INVENTION

[0008] Phased array ultrasonic testing (PAUT) inspection data (e.g., indicators) typically include geometric echoes, which can complicate the search for genuine defect echoes. In practice, the inspection analyst faces a difficult task that may include balancing performance. There can be a trade-off between the inspection throughput performed by an individual analyst and the thoroughness of the inspection.

[0009] This specification describes techniques for performing PAUT using beam steering. Beam steering involves generating a beam for investigating an object to search for defects where the beam is projected from the probe at different angles, and thus, defects at different positions and orientations within the object can be detected. The techniques described in this specification can simplify the inspection process for an analyst (e.g., an operator). For example, the techniques described in this specification can group multiple different beam skews within a single group as part of a single channel, resulting in simpler processing and calibration. The techniques also describe a new scan image that shows different beam skews together so that an analyst can easily select and switch between different beam skews. Thus, the techniques can enable an analyst to perform inspections in a simple and straightforward manner. Therefore, the techniques can provide savings in reducing the time associated with the inspection process and improve accuracy by reducing the likelihood of missed or mis-characterized indicators.

[0010] FIG. 1A is a block diagram illustrating a system 100 for ultrasonic inspection defect screening according to an exemplary embodiment of the present subject matter. The system 100 includes several functional units such as a processor 110, a pulser 115, a receiver 145, a probe (e.g., a transducer) 125, and a display device 150. As illustrated in FIG. 1A, the system 100 includes an instrument 105 having a processor 110, a pulser 115, a receiver 145, a display 150, and a memory 155. The pulser 115 can generate high voltage electrical pulses. Driven by a trigger 120 from the pulser 115 under the control of the processor 110, the probe (e.g., a transducer) 125 generates high frequency ultrasonic energy. The acoustic energy is introduced and propagates through the target 130 in the form of an incident wave 127. When there is a discontinuity or other indicator 135 (e.g., a crack) in the wave path, a portion of the energy is reflected back from the defect surface as a reflected wave 137. The reflected wave 137 is converted by the probe 125 into an electrical response signal 140 and received by the receiver 145, which may convert the response signal 140 into scan data 140' (e.g., A-scan data and scan axis position data). The processor 110 may then receive the scan data 140' for analysis. In some embodiments, the scan data 140' is analyzed in real time using the display 150 when received from the probe 125, and in other embodiments, the scan data 140' may be stored in the memory 155 for offline analysis using the instrument display 150 or an external computer (not shown).

[0011] Figure 1B shows different probe types of probe 125. The linear probe includes a series of elements (e.g., carbon steel) distributed along a length corresponding to the active axis of the probe. The matrix probe includes elements arranged on both the active axis and the secondary axis of the probe. Using the delayed emission of the elements, the beam can be steered. The matrix probe can be provided in a rectangular arrangement (1.5D) where the number of rows and columns of elements is different, or a square arrangement (2D) where the number of rows and columns of elements is equal. In a single probe configuration, the probe transmits the incident wave 127 and also receives the reflected wave 137. In a dual probe configuration, transmission and reception are separated, one probe transmits the incident wave 127, and another probe also arranged on the surface of the target 130 receives the reflected wave 137. The wedge structure can also be coupled to the bottom surface of the probe to improve the acoustic propagation of the ultrasonic wave. The wedge structure can include a rigid thermosetting polymer having known acoustic propagation characteristics (e.g., Rexolite® available from C-Lec Plastics Inc.).

[0012] Figure 1C shows a graphical representation of different types of scan data 140'. The scan data 140' can include information regarding different scan axis positions 180 and ultrasonic axis positions 185. The scan axis can refer to a common axis shared by the probe 125 and the target 130 (e.g., the portion being inspected) along an inspection path, for example, the path along which the probe 125 traverses along the target 130. For example, in the case of weld inspection, the scan axis can be defined as an axis parallel to the major axis of the weld line, and the scan axis defines the inspection path of the probe. The ultrasonic axis can refer to the propagation direction of the ultrasonic wave (e.g., the propagation of the incident wave 127 and the reflected wave 137), represented as a ray directed towards or extending from an echo generation feature within the target 130 being inspected.

[0013] An A scan 160 can refer to the amplitude value of the reflected wave (amplitude axis) along the ultrasonic axis. A B scan 165 can refer to the combined amplitude values (A scan values) along the scan axis. An S scan 170 can refer to a sector scan of the amplitude values (A scan values) along the ultrasonic axis for a sector at a given scan axis position. Other scans can be included, such as a C scan that can refer to the combined amplitude values of each beam along the scan axis.

[0014] FIG. 2A illustrates an example of a probe that performs beam steering in a top view and an isometric view. The probe 202 can generate a plurality of beams at different angles using the delay of the active elements. For example, the probe 202 can generate a first beam 204 at a nominal angle, a second beam 206 at -15°, and a third beam 208 at +15°. FIG. 2B shows exemplary B scan images from different beams. As shown, the B scan images for different angle beams can reveal different information about the target. Image 210 is the B scan result corresponding to the first beam 204 at the nominal angle. Image 210 shows the weld root within the target. Image 212 is the B scan result corresponding to the second beam 206 at -15°. Image 210 shows different characteristics of the target. Image 214 is the B scan result corresponding to the third beam 208 at +15°. Image 214 shows different characteristics of the target. For example, orientation-defect flaws (or flaws of different orientations) such as distorted ID cracks are better detected and sized with the third beam 208 at +15° compared to the first beam 204 at the nominal angle.

[0015] In some conventional systems, different beam skews are managed separately as their own individual skew groups, also referred to as beam sets. In these conventional systems, each beam skew is a separate channel and requires its own handling, simulation, and calibration. This can lead to a number of steps for the operator to perform. For example, in these conventional systems, the operator needs to set a separate channel for each beam skew angle and calibrate each channel separately.

[0016] The subject matter of the present invention includes a single group / beam set that includes a plurality of different beam skew angles, each having a plurality of beam angles, which can simplify setup and management. The plurality of beam skews can be arranged in the same group, called a "3D sector scan" (also referred to as a "3D composite scan"). A 3D sector scan can support regular sector scans as well as composite S-sector scans, and can further reduce the number of groups.

[0017] Also, calibration can be performed at one of the beam skew angles from a plurality of different beam skew angles within the group, and the calibration result of one beam skew angle can be used for the other beam skew angles within the group. In other words, calibration of one beam skew angle or a subset of beam skew angles within the group is performed in contrast to individual calibration for each beam skew angle.

[0018] FIG. 3 illustrates a flowchart of a method 300 for performing an inspection using beam steering. At operation 302, as described above, a probe or a set of probes in a dual-probe configuration is placed on the object under test. At operation 304, scan plan control parameters are received from a user (e.g., engineer, operator). The scan plan control parameters may include identification of primary axis elements, including a first element, a last element, and an amount of elements associated with the primary axis. The primary axis is associated with steering of the beam angle. The scan plan control parameters may include identification of secondary axis elements, including a first element, a last element, and an amount of elements associated with the secondary axis. The secondary axis is associated with the steering skew angle. The scan plan control parameters may include primary axis control such as angle start, angle stop, and angle step.

[0019] In connection with beam skew, the scan plan control parameters include a beam skew configuration of the secondary axis, such as skew start, skew stop, and skew step. FIG. 4 illustrates an exemplary illustration of a beam skew configuration. Skew start may represent the angle of the first beam skew relative to the nominal skew (0°). In the example of FIG. 4, skew start is set to -15°. Skew stop may represent the angle of the last beam skew relative to the nominal skew. In the example of FIG. 4, skew stop is set to +15°. Skew step may represent the step size of the angle between beam skews. In the example of FIG. 4, skew step is set to 5° such that there is a beam skew every 5° between the start skew and the stop skew (e.g., -15°, -10°, -5°, 0°, +5°, +10°, +15°). Each of these beam skews is placed in one group / beam set. That is, since it is part of a group / beam set, one channel is used for different beam skews. A single channel corresponds to a single group (beam set).

[0020] Multiple active elements within the probe can be used to steer the beam on different axes. This can be applicable to both the primary and secondary axes of the probe. For example, two or more elements on the primary axis can be used to steer the angle, and two or more elements on the secondary axis can be used to steer the beam skew. In this example, at least four elements (2×2) are used for steering on both the primary and secondary axes.

[0021] Returning to FIG. 3, in operation 306, calibration can be performed for a group of beam skews. The calibration can include determining a time correction gain (TCG) value for a beam skew angle selected from the group of beam skews. The TCG value for the selected beam skew angle can be extrapolated for other beam skew angles within the group of beam skews. That is, the calibration for one beam skew can be used for the entire group of beam skews, and individual calibrations for each beam skew are not required. For example, the TCG value can be calculated for a nominal beam skew and extrapolated for other beam skews within the group.

[0022] In some examples, two or more beam skews within the group (but less than the total amount of beam skews within the group) can be calibrated. In these examples, interpolation can be used to provide calibration data for other beam skews within the group.

[0023] In operation 308, a scan of the test object is performed based on scan control parameters. For example, the probe can generate an incident wave based on the scan control parameters and penetrate the object under test. The reflected wave from the test object's indicator can be received by the probe. The reflected wave can be converted into an electrical response signal.

[0024] In operation 310, scan data can be generated based on the response signal. The scan data can include A-scan, B-scan, C-scan, and S-scan data, as described above. The scan data can also include T-scan data associated with the beam skew result. T-scan can refer to a secondary axis sector scan (beam steering) of the amplitude values (A-scan values) along the ultrasonic axis for a sector at a given scan axis position. In T-scan, instead of a volume, a slice of data is displayed. T-scan is related to the probe rather than the object under test. T-scan represents the 2D beam skew for each beam with respect to the UT axis and the scan axis. In some examples, the nominal skew representing 0° beam skew can be placed at the center of the display.

[0025] S-scan and T-scan are similar in that they represent the amplitudes from two or more beams with respect to the ultrasonic axis for a given scan axis position. However, the difference between S-scan and T-scan is that S-scan represents beams at different angles for a given beam skew, while T-scan represents beams at different beam skews for a given beam angle. Each PAUT beam emitted in a 3D scan contains a unique set of refraction beam skew parameters. Consider an example: It is possible to emit 30 refraction angles from a primary axis with 5 beam skews. That is, 30 (refraction angle beams) × 5 (beam skews) = 150 different beams are generated. S-scan can show 30 refraction beams for a given beam skew, and T-scan can show 5 beam skews for a given refraction angle. Therefore, T-scan provides a different perspective and information compared to other scans.

[0026] Figure 5 illustrates an example of a T-scan. As shown, the horizontal axis is the UT axis and the vertical axis is the scan axis. The scan axis can be updated at the scan position. Each beam skew is represented in 2D. A data cursor can select the active beam skew. In the example of Figure 5, a -5° beam skew is selected. The weld overlay can be refreshed from the data cursor value (skew angle). A T-scan can display a slice of the data selected by the corresponding angle of the data cursor. A T-scan shows an uncorrected technique that presents different beam skews in a single display. As explained above, a T-scan can be 90° perpendicular to an S-scan.

[0027] Different beam skews are grouped into a single group and can thus be displayed in a single channel. Thus, multiple scans can be displayed with a T-scan, enabling an operator to select a particular beam skew and change other scan displays accordingly.

[0028] Figure 6 illustrates examples of display layouts. Display layout 602 includes sections for A-scan, B-scan, T-scan, and S-scan (A-B-T-S). Display layout 604 includes sections for A-scan, B-scan, S-scan, and T-scan (A-C-S-T). Display layout 606 includes sections for C-scan, B-scan, T-scan, and S-scan (C-B-T-S). As mentioned above, in response to a user selecting a particular beam skew in the T-scan section, the information in the other scan sections can be changed or updated corresponding to the selected beam skew.

[0029] FIG. 7 illustrates an example of a display layout. The display layout includes sections of A-scan, B-scan, S-scan, and T-scan (A-C-S-T). Section 702 shows a T-scan using a selected distorted beam 704 indicated by a data cursor. Section 706 shows A-scan data corresponding to the selected skew beam. Section 708 shows C-scan data corresponding to the selected skew beam. Section 710 shows S-scan data.

[0030] The processing (e.g., performing one or more of the methods described herein) can be implemented in hardware, software, or a combination of both. Performing can be implemented in a computer program executed on a programmable computer / machine that includes a processor, a storage medium, or other product readable by a processor (including volatile and non-volatile memory and / or storage elements), at least one input device, and one or more output devices. Program code can be applied to data input using an input device to perform the processing and generate output information. The memory can include a machine-readable medium storing one or more sets of data structures or instructions (e.g., software) that embody or are utilized by any one or more of the techniques or functions described herein.

[0031] In some embodiments, the system can be embodied by one or more programmable processors executing one or more computer programs to perform the functions of the system. In some other embodiments, all or part of the system can be implemented as special-purpose logic circuitry (e.g., field programmable gate arrays (FPGAs) and / or application specific integrated circuits (ASICs)). In some other embodiments, all or part of the system can be implemented using an electronic hardware circuit that includes at least one of, for example, a processor, a memory, a programmable logic device, or a logic gate.

[0032] In one embodiment, the methods described herein are not limited to the specific examples described. In further embodiments, rather, any of the method steps may be rearranged, combined or deleted, or executed in parallel or sequentially, as necessary, to achieve the above results.

[0033] In some embodiments, the system may be implemented, at least in part, via a computer program product (e.g., a non-transitory machine-readable storage medium such as a non-transitory computer-readable medium) to be executed by a data processing apparatus (e.g., a programmable processor, a computer, or multiple computers), or to control the operation of a data processing apparatus (e.g., a programmable processor, a computer, or multiple computers). In certain embodiments, each such program may be implemented in a high-level procedural or object-oriented programming language to communicate with a computer system. However, in certain other embodiments, the program may be implemented in assembly or machine language. In some embodiments, the language may be a compiled or interpreted language and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment. In some other embodiments, the computer program may be deployed to be executed on one computer or multiple computers at one site, or distributed across multiple sites and interconnected by a communication network.

[0034] The methods and apparatuses of the present disclosure may at least partially take the form of program code (i.e., instructions) embodied in a tangible non-transitory medium such as a floppy disk, CD-ROM, hard drive, random access or read-only memory, or any other machine-readable storage medium. When the program code is loaded and executed on a machine such as the computer of FIG. 4, the machine becomes an apparatus for practicing examples of the subject matter of the present invention. When implemented on one or more general-purpose processors, the program code, in combination with such processors, provides a unique apparatus that operates similarly to a specific logic circuit. Thus, a general-purpose digital machine can be converted into a dedicated digital machine. In some other embodiments, the non-transitory machine-readable medium may include, but is not limited to, a hard drive, a compact disk, a flash memory, a non-volatile memory, a volatile memory, a magnetic diskette, etc., but does not include a transient signal itself.

[0035] The terms "machine-readable medium" or "machine-readable storage medium" can include any medium that can store, encode, or hold instructions for execution by a machine, and that can cause a machine to execute any one or more of the techniques of the present disclosure, or that can be used by or associated with such instructions to store, encode, or hold a data structure. Examples of non-limiting machine-readable media can include solid-state memory, as well as optical and magnetic media. Thus, a machine-readable medium is not a transient propagation signal. Specific examples of aggregating machine-readable media can include non-volatile memories such as semiconductor memory devices (e.g., electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)) and flash memory devices, magnetic or other phase change or state change memory circuits, magnetic disks such as internal hard disks and removable disks, magneto-optical disks, and CD-ROM and DVD-ROM disks.

[0036] The above examples have been described in some detail for purposes of clarity, but it will be apparent that certain changes and modifications can be made within the scope of the appended claims. The scope of the present invention is limited only by the claims, and the invention encompasses numerous alternatives, modifications, and equivalents. To provide a complete understanding of the invention, many specific details have been set forth in the foregoing specification. These details are provided for illustrative purposes only and the invention may be practiced in accordance with the claims without some or all of these specific details. For clarity, technical material known in the relevant art to the present invention has not been described in detail so as not to obscure the invention needlessly. Accordingly, the above-described embodiments are to be considered illustrative and not restrictive, and the invention is not limited to the details given herein but may be modified within the scope and equivalents of the appended claims.

[0037] With reference to the accompanying drawings, various embodiments of the present disclosure are described. It is to be understood that these exemplary embodiments are provided only to enable those skilled in the art to better understand the present disclosure and then to further practice the invention, and are not intended to limit the scope of the present disclosure in any way. These drawings and descriptions are presented only as examples of embodiments, and based on this description, alternative embodiments having the structures and methods as disclosed herein may be envisioned, and it should be noted that such alternative embodiments may be used without departing from the principles of the present disclosure claimed herein.

[0038] It should be noted that the flowcharts and block diagrams in the figures can illustrate the apparatus, methods, and architectures, functions, and operations executable by a computer program product according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagram can represent a module, program segment, or part of the code, which can include one or more executable instructions for performing the specified logical function. It should be further noted that in some alternative implementations, the functions indicated by the blocks can occur in an order different from the order illustrated in the figures. For example, two consecutive blocks shown can be executed substantially in parallel or in the reverse order, depending on the functions involved. It should be further noted that each block and combination of blocks in the block diagram or flowchart can be implemented by a dedicated hardware-based system for performing the specified function or operation, or by a combination of dedicated hardware and computer instructions.

[0039] As used herein, the terms "comprise", "include" and their derivatives and similar expressions are to be understood as open (i.e., "comprising / including" does not mean limited to these). The term "based on" means "at least partially based on", the term "one embodiment" means "at least one embodiment", and the term "another embodiment" indicates "at least one further embodiment". Related definitions of other terms are provided.

[0040] In this document, the terms "a" or "an" are used to include one or more, independent of any other instance or usage of "at least one" or "one or more", as is common in patent documents. In this document, the term "or" is used to refer to non-exclusive "or", unless otherwise indicated, such that "A or B" includes "A but not B", "B but not A", and "A and B". In this document, the terms "including" and "in which" are used as plain English synonyms of the respective terms "comprising" and "wherein". Also, in the following claims, the terms "comprising" and "including" are not limiting, i.e., a system, device, article, composition, formulation, or process that includes elements in addition to those recited after such terms in the claims is still considered to fall within the scope of those claims. Further, in the following claims, terms such as "first", "second", and "third" are used merely as labels and are not intended to impose numerical requirements on their objects.

[0041] Examples of the methods described herein can be implemented, at least in part, on a machine or computer. Some examples can include a computer-readable medium or machine-readable medium encoded with instructions operable to configure an electronic device to perform the methods described in the above examples. Implementations of such methods can include code such as microcode, assembly language code, higher level language code, and the like. Such code can include computer-readable instructions for performing various methods. The code can form part of a computer program product. Further, in one example, the code can be tangibly stored on one or more volatile, non-transitory, or non-volatile tangible computer-readable media, such as during execution or at other times. Examples of such tangible computer-readable media can include, but are not limited to, hard disks, removable magnetic disks, removable optical disks (e.g., compact disks and digital video disks), magnetic cassettes, memory cards or sticks, random access memory (RAM), read only memory (ROM), and the like.

[0042] The above description is intended to be illustrative and not restrictive. For example, the examples described above (or one or more aspects thereof) may be used in combination with each other. Other implementations may be used by those skilled in the art upon consideration of the above description. The abstract is provided to enable the reader to quickly ascertain the nature of the technical disclosure. The abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above detailed description, various features may be grouped together in order to streamline the disclosure. This should not be interpreted as intending that the disclosed features not claimed are essential to any of the claims. Rather, the subject matter of the invention may lie in less than all of the features of a particular disclosed implementation. For this reason, the following claims are incorporated as examples or implementations into the detailed description, and each claim exists separately as a distinct implementation, and such implementations are intended to be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. An ultrasonic inspection method using different beam skews, comprising: Receiving scan control parameters including a beam skew configuration for a plurality of beam skews arranged in a group; Performing calibration for each of the plurality of beam skews; Establishing a calibration value for at least one other beam skew among the plurality of beam skews based on the calibration performed for each of the respective beam skews; Receiving data indicating an electrical response signal induced by scanning an object, wherein the scanning is based on the scan control parameters; Generating data for presentation based on the data indicating the electrical response signals corresponding to the plurality of beam skews within a channel.

2. The method according to claim 1, further comprising generating a scan image indicating the group of the plurality of beam skews.

3. The method according to claim 2, wherein the scan image includes a horizontal axis corresponding to an ultrasonic test axis and a vertical axis corresponding to a scan axis.

4. The method according to claim 2, wherein the scan image represents each of the plurality of beam skews of the group two-dimensionally.

5. The method according to claim 4, further comprising receiving a selection of an active beam skew based on the scan image.

6. The method according to claim 5, further comprising refreshing the scan data and displaying a slice of data corresponding to the selected active beam skew.

7. The method according to claim 6, wherein the display includes a layout having a plurality of scans associated with the selected active beam skew.

8. A system comprising: One or more processors of a machine; and A memory storing instructions which, when executed by the one or more processors, cause the machine to: Receive scan control parameters including a beam skew configuration for a plurality of beam skews arranged in a group; Perform calibration for each of the plurality of beam skews; Based on the calibration performed for each of the beam skews, establishing a calibration value for at least one other beam skew among the plurality of beam skews; Receiving data indicative of an electrical response signal induced by scanning an object, wherein the scanning is based on the scan control parameters, receiving, and Generating data for presentation based on the data indicative of the electrical response signals corresponding to the plurality of beam skews within the channel, a system for performing operations including.

9. The operations being, The system according to claim 8, further comprising generating a scan image indicative of the group of the plurality of beam skews.

10. The system according to claim 9, wherein the scan image includes a horizontal axis corresponding to an ultrasonic test axis and a vertical axis corresponding to a scan axis.

11. The system according to claim 9, wherein the scan image represents each of the plurality of beam skews of the group two-dimensionally.

12. The operations being, The system according to claim 11, further comprising receiving a selection of an active beam skew based on the scan image.

13. The operations being, The system according to claim 12, further comprising refreshing the scan data and displaying a slice of data corresponding to the selected active beam skew.

14. The system according to claim 13, wherein the operations include the display including a layout having a plurality of scans associated with the selected active beam skew.

15. A machine-readable storage medium which, when executed by a machine, causes the machine to, Receive scan control parameters including a beam skew configuration for a plurality of beam skews arranged in a group, Perform calibration for each of the plurality of beam skews, Based on the calibration performed for each of the beam skews, establish a calibration value for at least one other beam skew among the plurality of beam skews, Receive data indicative of an electrical response signal induced by scanning an object, wherein the scanning is based on the scan control parameters, receiving, and A machine-readable storage medium that causes execution of generating data for presentation based on the data indicating an electrical response signal corresponding to the plurality of beam skews within a channel. **Claim 16** The machine-readable storage medium according to claim 15, further comprising generating a scan image indicating the group of the plurality of beam skews. **Claim 17** The machine-readable storage medium according to claim 16, wherein the scan image includes a horizontal axis corresponding to an ultrasonic test axis and a vertical axis corresponding to a scan axis. **Claim 18** The machine-readable storage medium according to claim 16, wherein the scan image represents each of the plurality of beam skews of the group two-dimensionally. **Claim 19** The machine-readable storage medium according to claim 18, further comprising receiving a selection of an active beam skew based on the scan image. **Claim 20** The machine-readable storage medium according to claim 19, further comprising refreshing the scan data and displaying a slice of data corresponding to the selected active beam skew.

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