Beam quality monitoring and multiple laser beam position registration for a high-speed laser motion system

Abstract

A system for analyzing a laser powder bed fusion (LPBF) system and other high-speed motion laser beam systems, the system comprising a plurality of lasers, each laser forming a field of view such that an overlap region is formed, and each laser generating an unsteady laser beam. A build platform disposed at a predetermined position with respect to the field of view of the lasers; and a plurality of portable measurement devices disposed on the build platform, each portable measurement device including a pinhole sensor that receives laser light generated by the unsteady laser beam, the plurality of portable measurement devices being electrically coupled to each other to form a modular array.

Description

Technical Field

[0001] The disclosed technology generally relates to a laser system having a high-speed motion function, and more specifically, to a system, device, and method for characterizing, analyzing, and verifying the appropriate functions and performance of a laser used in a laser processing system having a high-speed motion function.

Background Art

[0002] Laser processing typically involves using a laser beam to modify a workpiece in a predetermined manner. Laser processing ranges from high-intensity laser ablation processes to very low-intensity processes such as heat treatments where melting is avoided. Almost all laser processing techniques involve shaping the laser beam into a particular size and shape at a particular position or working distance from the laser system. Accurately specifying the position of the focus spot having the desired characteristics formed by the laser system is an important aspect in constituting efficient and optimized laser processing.

[0003] Laser processing technology includes laser beam welding (LBW). This is a fusion welding process used to join materials of various shapes. A laser beam welding system typically includes a laser light source, a laser light irradiation system, an optical device for irradiating the workpiece with the laser light, and often a motion system for moving either the laser or the workpiece. The LBW system can include a fiber irradiation beam or an open beam path, a fixed optical system or a galvanometer system that enables rapid deflection of the laser beam. The mechanical motion system can include a high-speed system or a low-speed system depending on the intended application. In the LBW process, the laser light is focused using an optical device that includes a collimating lens to stop the divergence of the laser light from the light source and irradiate the focusing lens with the light. The focusing lens then directs the high-intensity focused laser light at the workpiece to be welded. Then, the high-intensity laser light is used to melt the material of the workpiece and melt two or more parts or components together.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In manufacturing, the use of laser processing systems, particularly LBW systems, has become common, and such systems can be found in many manufacturing facilities around the world. The functional success of all laser processing systems depends on predetermined, stable, and repeatable laser beam characteristics, including the shape, distribution, and position of the focus. Therefore, there is a continuing need for accurate, user-friendly, and affordable systems, devices, and methods for analyzing the quality and dynamic accuracy of laser foci formed by laser processing systems with motion capabilities.

Means for Solving the Problems

[0005] The following provides a summary of certain embodiments of the disclosed technology. This summary is not an extensive overview and is not intended to identify key or critical aspects or elements of the disclosed technology or to delineate its scope. However, it should be understood that the use of indefinite articles in the language used to describe and claim the disclosed technology is not intended to limit the described technology. Rather, the use of "a" or "an" should be construed to mean "at least one" or "one or more".

[0006] One embodiment of the disclosed technology provides a system for analyzing a laser powder bed fusion (LPBF) system and other high-speed motion laser beam systems, the system comprising a plurality of lasers that form a field of view such that an overlap region is formed and generate an unsteady laser beam, a build platform disposed at a predetermined position with respect to the field of view of the lasers, and a plurality of portable measurement devices disposed on the build platform, each portable measurement device including a pinhole sensor that receives laser light generated by the unsteady laser beam, and the plurality of portable measurement devices being electrically coupled to each other to form a modular array.

[0007] The plurality of portable measurement devices are disposed at any position within the field of view of each laser on the build platform, within the overlap region, or a combination thereof. The plurality of portable measurement devices are disposed at the ends within the field of view of each laser. The plurality of portable measurement devices can be moved or reconfigured individually or collectively to form various modular arrays. Each pinhole sensor measures the quality of the unsteady laser beam generated from each laser. Each pinhole sensor measures the position of the respective portable measurement device. The measured positions of the portable measurement devices are used for measuring movement speed, position accuracy, and calibration. The plurality of lasers are used for manufacturing large parts.

[0008] Another embodiment of the disclosed technology provides a system for analyzing laser powder bed fusion (LPBF) systems and other high-speed motion laser beam systems, the system generating a field of view such that an overlap region is formed, a plurality of lasers generating an unsteady laser beam, a build platform disposed at a predetermined position with respect to the field of view of the lasers, and a plurality of portable measurement devices disposed on the build platform, each portable measurement device including a pinhole sensor that receives laser light generated by the unsteady laser beam, the plurality of portable measurement devices being electrically coupled to each other to form a modular array, and the plurality of portable measurement devices being capable of being repositioned and recombined to form a second modular array.

[0009] The plurality of portable measurement devices are disposed at any position within the field of view of each laser on the build platform, within the overlap region, or a combination thereof. The plurality of portable measurement devices are disposed at the ends within the field of view of each laser. Each pinhole sensor measures the quality of the unsteady laser beam generated from each laser, and each pinhole sensor measures the position of the respective portable measurement device. The measured positions of the portable measurement devices are used for motion speed measurement, position accuracy, and calibration.

[0010] Yet another embodiment of the disclosed technology provides a method for analyzing laser powder bed fusion (LPBF) systems and other high-speed motion laser beam systems, the method comprising generating a field of view such that an overlap region is created, providing a plurality of lasers that generate an unsteady laser beam, positioning a build platform at a predetermined position relative to the field of view of the lasers, positioning the plurality of portable measurement devices on the build platform, each of the portable measurement devices including a pinhole sensor that receives laser light generated by the unsteady laser beam, the plurality of portable measurement devices being electrically coupled to each other to form a modular array, and repositioning the plurality of portable measurement devices on the build platform to form a second modular array.

[0011] The plurality of portable measurement devices are positioned on the build platform at any position within the field of view of each laser, within the overlap region, or a combination thereof. The plurality of portable measurement devices are positioned at the ends within the field of view of each laser. Each pinhole sensor measures the quality of the unsteady laser beam generated from each laser. Each pinhole sensor measures the position of the respective portable measurement device. The measured position of the portable measurement device is used for measuring movement speed, position accuracy, and calibration. The plurality of lasers are used for manufacturing large parts.

[0012] All combinations of the above concepts and additional concepts described in more detail below (provided such concepts are not mutually inconsistent) are considered to be part of the technology disclosed herein and it should be understood that they can be implemented to achieve the advantages described herein. Additional features and aspects of the disclosed systems, devices, and methods will become apparent to those skilled in the art upon reading and understanding the following detailed description of the examples. As will be understood by those skilled in the art, further implementations are possible without departing from the scope and spirit of what is disclosed herein. Accordingly, the description provided herein is to be considered illustrative and not inherently limiting.

Brief Description of the Drawings

[0013] The accompanying drawings, which are incorporated in and constitute a part of this specification, schematically illustrate one or more embodiments of the disclosed technology and, together with the general description and the detailed description given below, serve to explain the principles of the disclosed subject matter.

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[0014] Implementation examples will be described with reference to the figures. Reference numerals are used throughout the detailed description to refer to various elements and structures. The following detailed description includes many details for purposes of explanation, but those skilled in the art will understand that many variations and modifications to the following details are within the scope of the disclosed technology. Accordingly, the following implementations are described without losing generality with respect to the claimed subject matter and without imposing limitations.

[0015] The examples described herein are merely examples and are provided to assist in the description of the apparatuses, devices, systems, and methods described herein. None of the features or components shown in the drawings or described below should be considered necessary for any particular implementation of these apparatuses, devices, systems, or methods, unless specifically specified. For ease of reading and clarity, certain components, modules, or methods may be described in relation to only a particular figure. It should not be understood that any combination or partial combination of components is shown to be impossible just because it is not specifically described. Also, for any method described, regardless of whether the method is described in relation to a flowchart, unless otherwise specified or required by the context, the explicit or implicit ordering of the steps executed in the execution of the method does not mean that those steps must be executed in the order in which they are presented. Instead, it should be understood that they may be executed in a different order or in parallel.

[0016] U.S. Patent No. 10,976,219 and U.S. Patent No. 10,627,311 are related to the disclosed technology, and the entire contents of each of these patents are hereby expressly incorporated by reference and made a part of this patent application for all purposes. These reference documents disclose systems for use in additive manufacturing, which is an industrial process for generating three-dimensional objects by adding successive ultrathin layers of material. Each successive layer is a molten or partially molten material for depositing material, including metal powders, thermoplastic plastics, ceramics, composite materials, glass, and other materials, and bonds or fuses to a previous layer of different material. Laser Powder Bed Fusion (L-PBF) is a specific process used in additive manufacturing to build three-dimensional articles or parts using a layer-by-layer approach with a high-power laser. L-PBF typically includes the steps of: (i) spreading a layer of powder material (e.g., metal) on a build platform or plate; (ii) using a laser to melt the first layer or first cross-section of the part; (iii) using a roller, recoater arm, coating blade, or similar device to spread a new layer of powder over the entire previous layer; (iv) using a laser to melt a new layer or new cross-section of the part; (v) adding and melting successive layers or cross-sections; and (vi) repeating the process until the entire part is created. Loose, unfused powder material remains in place but is removed during post-processing.

[0017] The functional success of an L-PBF system depends on having a known and stable laser focus on the powder bed working surface. The techniques disclosed in U.S. Patent No. 10,976,219 and U.S. Patent No. 10,627,311 provide a portable test apparatus for analyzing the quality and dynamic accuracy of laser focus in various L-PBF systems and devices. This test apparatus is used with a laser powder bed fusion device having at least one laser that generates an unsteady laser beam having known or predetermined characteristics and a build surface disposed at a predetermined position, and the unsteady laser beam is translated (i.e., traversed) across the build surface by a controlled method during the additive manufacturing process. This test apparatus has a support having an upper surface configured to receive and absorb the laser light generated by the unsteady laser beam, a plurality of pinhole defining structures each disposed to receive the laser light generated by the unsteady laser beam, each pinhole rising at a predetermined height above and parallel to the upper surface of the support, and an optical fiber cable disposed within each pinhole defining structure and having a proximal end through which the laser beam is received and a distal end to which the laser beam is delivered, and a photodetector disposed at the distal end of the optical fiber cable, the photodetector converting the laser light delivered to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole. FIGS. 1-4, FIGS. 5A-C, FIGS. 6A-6B, FIGS. 7A-F and FIGS. 8A-C provide various explanatory views of an exemplary test apparatus for analyzing the quality and dynamic accuracy of laser focus in various laser-based manufacturing systems including L-PBF systems and laser beam welding (LBW) systems.

[0018] As best shown in FIGS. 1-4, an example of a test apparatus 10 includes a support 100, a base 200, pinhole defining structures or pinhole sensors 300, 400, 500, and 600 mounted within the support 100, and a photodetector 700 disposed within the base 200. The support 100, which is generally square-shaped and referred to as a calibration plate, includes an absorptive upper surface 110 and may further include a series of concentric ridges or other raised structures (see FIG. 4) arranged to absorb and distribute heat generated by a laser beam to prevent damage to the upper surface 110 and the support 100. The support 100 further includes a first mounting recess 120 (for receiving the first pinhole defining structure 300), a first set screw opening 122 (for receiving a set screw to secure the first pinhole defining structure 300 within the first mounting recess 120), a second mounting recess 130 (for receiving the second pinhole defining structure 400), a second set screw opening 132 (for receiving a set screw to secure the second pinhole defining structure 400 within the second mounting recess 130), a third mounting recess 140 (for receiving the third pinhole defining structure 500), a third set screw opening 142 (for receiving a set screw to secure the third pinhole defining structure 500 within the third mounting recess 140), a fourth mounting recess 150 (for receiving the fourth pinhole defining structure 600), and a fourth set screw opening 152 (for receiving a set screw to secure the fourth pinhole defining structure 600 within the fourth mounting recess 150). The support 100 also includes a first opening 160 for receiving a first coolant fitting 162, a second opening 164 for receiving a second coolant fitting 166, and a channel 170 for receiving and transporting a liquid or gas coolant that carries away energy absorbed by the support 100 from the test apparatus 10.

[0019] Also, as best shown in FIGS. 1-4, the base 200 has a shape corresponding to that of the support 100 and cooperates with the support 100 to form a housing. The base 200 includes an outer wall 210 and an internal cavity 212, in which various optical fiber cables attached to a structure defining a photodetector 700 and a pinhole are disposed. The base 200 also includes an opening 214 for receiving a Bayonet Neill–Concelman (BNC) partition 216 to which a BNC connector 218 is attached, a second opening 220 for receiving a gas joint 222, and a third opening 224 for receiving a gas relief valve 226. In certain embodiments, a source of pressurized gas is connected to the gas joint 222 to deliver gas flowing outwardly to each pinhole and pass through each pinhole to prevent contamination by debris or other fragments generated during the test process.

[0020] Referring to FIGS. 1-4, FIGS. 5A-5C, and FIGS. 6A-6B, an exemplary embodiment of the test apparatus 10 shown in the figures includes four pinhole defining structures, also referred to as "pedestals". FIGS. 5A-5C and FIGS. 6A-6B show only the first pinhole defining structure 300. However, the remaining pinhole defining structures (400, 500, and 600) are configured similarly to the first pinhole defining structure 300. Accordingly, FIGS. 5A-5C and FIGS. 6A-6B are representative of all of the pinhole defining structures shown in the figures.

[0021] As shown in FIGS. 5A-5C and FIGS. 6A-6B, the first pinhole defining structure or pedestal 300 includes a first pinhole 302 formed at the tip 304 through which the channel 306 passes. The diameter of the pinhole 302 is typically 1 / 3 to 1 / 30 of the diameter of the laser beam characterized by the test apparatus 10 (e.g., pinhole diameter: 5-50 μm). The tip 304 typically includes a highly reflective material such as gold, copper, or other reflective metal to minimize damage to the pinhole and the pinhole defining structure caused by absorption of energy from the laser beam. The tip 304 is mounted within a body 310 that includes a tapered portion 312 and a cylindrical portion 326 through which the channel 328 passes. The first set screw opening 330 is adapted to receive a first set screw 332 that secures the first optical fiber cable 350 within the body 310. The first optical fiber 352 is inserted within the channel 306 and is proximate to the first pinhole 302. The first pinhole defining structure or pedestal 300 is mounted within the support 100 such that the pinhole is above the upper surface 110 at a height (e.g., 20 to 40 mm) that minimizes damage to the pinhole and the pedestal that may be caused by the energy of the non-steady laser beam.

[0022] FIGS. 7A-7F are views of a test apparatus 10 used to analyze the characteristics of a non-steady laser beam generated by a laser source present in a laser powder bed fusion system used for additive manufacturing. In these figures, a laser source or laser 800 generates a laser beam 802 that impinges on the upper surface 110 of the test apparatus 10 at a plurality of locations or positions including the location containing the aforementioned pinhole. During normal operation of the test apparatus 10, the laser beam 802 is continuously operated at normal operating power to enable detection of any misalignment of the laser beam 802 or loss of laser focus quality and to operate all laser beam delivery elements of the laser powder bed fusion apparatus or system at normal operating temperature and function.

[0023] FIG. 8A shows a cross-sectional view of a pinhole defining structure 300 that receives laser light from a laser beam 802 during normal operation of a laser powder bed fusion system to be analyzed, which is attached to a support 100. FIG. 8B is a detailed view of the upper part of FIG. 8A showing the laser light reflected by the pinhole defining structure 300. FIG. 8C is a view of a test apparatus 10 used to analyze the characteristics of an unsteady laser beam 802 generated by a laser source 800, and the laser beam 802 is shown to be reflected from a pinhole defining structure 400. In FIGS. 8A-8B, it is shown that light from the laser beam 802 passes through a pinhole 302 and enters an optical fiber 352, through which a signal is transmitted to a photodetector 700 (see FIG. 1). The laser light passing through the pinhole 302 is only a very small amount of the laser light generated by the laser beam 802. For example, in the case of a laser beam having an overall diameter of about 0.1 mm, the diameter of the portion of the beam passing through the pinhole 302 is about 0.025 mm. The laser light collected from each pinhole can be transmitted to one or more optical measurement devices via an optical fiber coupling. The test apparatus 10 includes a data collection device that communicates with the photodetector 700, and the data collection device receives, stores, organizes, and analyzes an electrical signal as a function of time or time and position with respect to the pinhole where the laser light is received. A data analysis algorithm associated with the data collection device calculates and determines the laser beam quality based on data obtained from multiple paths of the unsteady laser beam across multiple pinholes. The data collection device can also include hardware and / or software (such as Bluetooth, etc.) that enables the transmission of data to a receiver located outside the additive manufacturing apparatus.

[0024] The above-described systems, devices, and methods, as well as those described in U.S. Patent Publication No. 2021 / 0223140, which is hereby incorporated by reference in its entirety, are useful for analyzing many aspects of high-speed laser operating systems. In one embodiment, a plurality of pinhole test (measurement) devices are coupled and interconnected for analyzing a laser powder bed fusion (LPBF) system, including a multi-laser system, a multi-scanner system, and a large area remote laser welding system. The measurement devices are arranged precisely adjacent to each other, and various electrical connections are used to network the devices together. As will be understood by those skilled in the art, the measurement devices may be connected in many different configurations, thereby allowing for a more thorough investigation of the high-speed laser system by reconfiguring the measurement devices to cover different regions of the high-speed laser system. By connecting these measurement devices, a user having a plurality of measurement devices intended to measure machinery in smaller areas can combine the devices to measure larger areas.

[0025] Embodiments of the disclosed system include positional features of being attached to or formed on a first measurement device (e.g., a single pinhole sensor) for securing the measurement device to the high-speed laser operating system being analyzed. The first measurement device is then precisely attached to various other measurement devices (e.g., other single pinhole sensors) using certain registering features designed to connect and calibrate the second device to the first device. Each measurement device includes electrical connections and any other features necessary to "daisy-chain" the measurement devices together. These electrical connections enable the connected devices to communicate with each other and, via a wired or wireless central connection, communicate with one or more computers or other processors.

[0026] In an embodiment, the array of measurement devices is configured to inspect the overlap region of a laser scanner, the overlap region of four or more lasers at the intersection of all fields of view, the field of view of any one of a plurality of connected high-speed motion systems, or the ends of one or more high-speed laser motion systems. The exact positions of the plurality of devices enable (i) motion speed measurement, position accuracy, and calibration across a wide area and a plurality of high-speed laser motion systems. And (ii) position calibration between a plurality of laser scanners. Alignment and electrical connection functions, combined with various precision spacers and alignment devices, make it possible to create a single measurement device network and then configure them together to form various measurement device arrays (see FIG. 10A).

[0027] The main advantages and aspects of the disclosed technology are that (i) the design and added features enable the flexibility to configure the measurement device in many ways to meet any measurement need. (ii) By connecting multiple sensors and / or multiple measurement assemblies, it becomes possible to measure and analyze a wide area. (iii) The disclosed features enable linking multiple devices to each other and configuring multiple lasers with each other. Prior art systems, including Primes Scan Field Monitor and Ophir Beam Watch AM, have limited sampling capabilities and locations. Since these systems are used in-process, they have limited ability to sample the beam during operation, and these systems do not have the current ability to link sensors or cover a large surface area. Many enterprises are original equipment manufacturers, users, customizers, and analysts of laser processing systems, including laser powder bed fusion systems and remote laser welding systems. Commercially available analysis systems are not sufficient for analyzing laser processing systems due to design limitations that require a fixed beam and the limited field of view area that can be analyzed by large analysis systems. Furthermore, industry standards such as AMS 7003 create a demand for systems such as the disclosed technology that are not subject to the design limitations of existing systems.

[0028] Referring to FIG. 9, an exemplary laser system 900 includes two test devices 10 disposed on a build platform 930 within a housing 910. The test devices 10 are arranged together such that pinhole sensors 300, 600 on each test device 10 are disposed in an overlap region 1010. The overlap region 1010 is formed in an intersection region formed from the field of view 1000 of the laser 800. It will be appreciated that any of the pinhole sensors 300, 400, 500, 600 on the test device 10 can be disposed in the overlap region 1010. The laser 800 generates an unsteady laser beam 802 that contacts the pinhole sensors 300, 600 within the overlap region 1010. The pinhole sensors 300, 600 evaluate the characteristics of the unsteady laser beam 802 received within the overlap region 1010.

[0029] Referring to FIG. 10A, an exemplary laser system 900 includes a portable measurement device 1020 disposed on a construction platform 930 within a housing 910. Each measurement device 1020 includes a pinhole sensor 300 that receives laser light generated from the unsteady laser beam 802. The laser system 900 in this exemplary embodiment functions in a similar manner to the laser system 900 described and illustrated in FIG. 9, except that the laser system 900 in this embodiment includes portable measurement devices 1020 that can be interconnected and disposed at any predetermined position on the construction platform 930 to form various module configurations. Each measurement device 1020 can be disposed at any predetermined position within the field of view 1000 (including the edges of the field of view 1000, the overlap region 1010, or any combination of those positions) on the construction platform 930. The measurement devices 1020 are aligned, positioned relative to each other, and electrically coupled using precision spacers 1030 to form a module array 1040. The individual measurement devices 1020 equipped with the pinhole sensor 300 can be disposed on the build platform 930 at any position within the field of view 1000 including within the overlap region 1010 (shown in FIG. 10B).

[0030] All documents and similar materials cited in this application, including but not limited to patents, patent applications, papers, books, articles, and web pages, are hereby expressly incorporated by reference in their entirety, regardless of the form of such documents and similar materials. One or more of the incorporated references and similar materials include, but are not limited to, defined terms, usage of terms, described techniques, etc. If these are different from or conflict with this application, this application shall govern.

[0031] As described above, as used herein, the singular forms "a", "an", and "the" refer to both the singular and plural forms unless the context clearly indicates otherwise. The term "comprising" as used herein is synonymous with "including", "containing", or "characterized by", and is inclusive or open-ended and does not exclude additional, unrecited elements or method steps. Although many methods and materials similar or equivalent to those described herein can be used, particular suitable methods and materials are described herein. Unless the context clearly indicates otherwise, the recitation of a numerical range by endpoints includes all numbers subsumed within that range. Further, references to "one implementation" are not intended to be construed as excluding the existence of additional implementations that also incorporate the recited features. Further, unless the contrary is expressly stated, an implementation "comprising" or "having" an element or elements with a particular characteristic can include additional elements, whether or not it has that characteristic.

[0032] The terms "substantially" and "about", when used throughout this specification or when used, account for and describe minor variations, such as due to variations in processing. For example, these terms can refer to ±5% or less, such as ±2% or less, such as ±1% or less, such as ±0.5% or less, such as ±0.2% or less, such as ±0.1% or less, such as ±0.05% or less, and / or 0%.

[0033] Underlined and / or italic headings and subheadings are used only for convenience and do not limit the disclosed subject matter and are not to be referred to in connection with an interpretation of the description of the disclosed subject matter. All structural and functional equivalents to the elements of the various embodiments described throughout this disclosure, whether known now or later become known, are expressly incorporated herein by reference and are intended to be encompassed by the disclosed subject matter. Further, what is disclosed herein is not intended to be made available to the public regardless of whether such disclosure is expressly recited in the above description.

[0034] There may be many alternative ways to implement the disclosed technology. The various functions and elements described herein may be divided differently than shown without departing from the scope of the disclosed technology. The general principles defined herein may be applied to other implementations. Different numbers of predetermined modules or units may be used, different types of predetermined modules or units may be used, predetermined modules or units may be added, or predetermined modules or units may be omitted.

[0035] As used herein, the term "plurality" refers to two or more. Unless specifically defined otherwise, orientation or positional relationships indicated by terms such as "upper" and "lower" are only for facilitating the description of the disclosed technology and simplifying the description, and do not indicate or imply that the device or element being referred to must be in a particular orientation or must be constructed or operate in a particular orientation, and thus should not be construed as limiting the disclosed technology. Terms such as "connected", "attached", "fixed", etc. should be understood in a broad sense. For example, "connected" may be a fixed connection, a detachable connection, or an integral connection. A direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the disclosed technology can be understood according to specific circumstances.

[0036] To provide a complete understanding of the disclosed technology, specific details are given in the above description. However, it is understood that the disclosed embodiments and implementations can be carried out without these specific details. For example, circuits can be shown in block diagrams so as not to obscure the disclosed implementations with unnecessary details. In other examples, well-known circuits, processes, algorithms, structures, and technologies can be shown without unnecessary details so as not to obscure the disclosed implementations.

[0037] The implementation of the above-mentioned technologies, blocks, steps, and means can be achieved in various ways. For example, these technologies, blocks, steps, and means can be implemented in hardware, software, or a combination thereof. In the case of hardware implementation, the processing unit can be implemented within one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic units designed to perform the above functions, and / or combinations thereof.

[0038] The disclosed technology can be described as a process shown as a flowchart, flow diagram, data flow diagram, structure diagram, or block diagram. A flowchart can describe operations as a sequential process, but many of the operations can be performed in parallel or simultaneously. Furthermore, the order of operations can be rearranged. The process ends when its operations are completed, but it can have additional steps not included in the figure. The process can correspond to a method, function, procedure, subroutine, subprogram, etc. When the process corresponds to a function, its end corresponds to the return of the function to the calling function or main function.

[0039] Furthermore, the disclosed technology can be implemented by hardware, software, scripting languages, firmware, middleware, microcode, hardware description languages, and / or any combination thereof. When implemented in software, firmware, middleware, scripting languages, and / or microcode, program code or code segments for performing the necessary tasks can be stored in a machine-readable medium such as a storage medium. Code segments or machine-executable instructions can represent procedures, functions, subprograms, programs, routines, subroutines, modules, software packages, scripts, classes, or any combination of instructions, data structures, and / or program statements. A code segment can be coupled to another code segment or hardware circuit by passing and / or receiving information, data, arguments, parameters, and / or memory contents. Information, arguments, parameters, data, etc. can be passed, transferred, or transmitted via any suitable means including memory sharing, message passing, ticket passing, network transmission, etc.

[0040] It should be understood that all combinations of the foregoing concepts and additional concepts discussed in more detail herein (provided such concepts are not mutually inconsistent) are considered to be part of the disclosed technology. In particular, all combinations of the subject matter of the claims set forth at the end of this specification are considered to be part of the technology disclosed herein. The disclosed technology is illustrated by the description of the embodiments, and the embodiments are described in a certain level of detail, but there is no intention to limit the appended claims to such detail. Additional advantages and modifications will be readily apparent to those skilled in the art. Accordingly, the disclosed technology, in its broadest aspects, is not limited to any of the specific details, representative devices and methods, and / or exemplary examples shown and described. Thus, departures from such details can be made without departing from the spirit or scope of the general inventive concept.

Claims

1. A system for analyzing a laser powder bed fusion system and other high-speed motion laser beam systems, comprising: (a) a plurality of lasers, where (i) each laser forms a field of view such that an overlap region is formed, (ii) each laser generates a non-steady laser beam, (b) a build platform disposed at a predetermined position with respect to the fields of view of the lasers, and (c) a plurality of portable measurement devices disposed on the build platform, where (i) each portable measurement device includes a pinhole sensor that receives laser light generated by the non-steady laser beam, (ii) the plurality of portable measurement devices are electrically coupled to each other to form a modular array.

2. The system according to claim 1, wherein the plurality of portable measurement devices are disposed within any region of the field of view of each laser on the build platform, within the overlap region, or a combination thereof.

3. The system according to claim 2, wherein the plurality of portable measurement devices are disposed at the ends within the field of view of each laser.

4. The system according to claim 1, wherein the plurality of portable measurement devices can be moved or reconfigured individually or collectively to form various modular arrays.

5. The system according to claim 1, wherein each pinhole sensor measures the quality of the non-steady laser beam generated by each laser.

6. The system according to claim 1, wherein each pinhole sensor measures the position of each portable measurement device.

7. The system according to claim 6, wherein the measured position of the portable measurement device is used for motion speed measurement, position accuracy, and calibration.

8. The system according to claim 1, wherein the plurality of lasers are used for large part manufacturing.

9. A system for analyzing a laser powder bed fusion system and other high-speed motion laser beam systems, comprising: (a) a plurality of lasers, where (i) each laser forms a field of view such that an overlap region is formed, (ii) each laser generates a non-steady laser beam, (b) A build platform disposed at a predetermined position with respect to the field of view of the laser, and (c) A plurality of portable measuring devices disposed on the build platform, comprising: (i) Each of the portable measuring devices includes a pinhole sensor that receives laser light generated by the non-steady laser beam, (ii) The plurality of portable measuring devices are electrically coupled to each other to form a module array, (iii) The plurality of portable measuring devices are repositionable and recombinable to form a second module array, a system.

10. The system according to claim 9, wherein the plurality of portable measuring devices are disposed on the build platform at any position within the field of view of each laser, any position within the overlap region, or any position within a combination thereof.

11. The system according to claim 10, wherein the plurality of portable measuring devices are disposed at an end within the field of view of each laser.

12. The system according to claim 9, wherein each pinhole sensor measures the quality of the non-steady laser beam generated by each laser, and each pinhole sensor measures the position of the respective portable measuring device.

13. The system according to claim 12, wherein the measured position of the portable measuring device is used for motion speed measurement, position accuracy, and calibration.

14. A method for analyzing a laser powder bed fusion system and other high-speed motion laser beam systems, comprising: (a) Providing a plurality of lasers, (i) Each of the lasers forms a field of view such that an overlap region is formed, (ii) Each of the lasers generates a non-steady laser beam, (b) Positioning a build platform at a predetermined position with respect to the field of view of the laser, (c) Positioning a plurality of portable measuring devices on the build platform, and (i) Each of the portable measuring devices includes a pinhole sensor that receives laser light generated by the non-steady laser beam, (ii) The plurality of portable measuring devices are electrically coupled to each other to form a module array, (d) A method of repositioning the plurality of portable measuring devices on the build platform to form a second modular array.

15. The method according to claim 14, wherein the plurality of portable measuring devices are arranged on the build platform at any position within the field of view of each laser, at any position within the overlap region, or at any position within a combination thereof.

16. The method according to claim 15, wherein the plurality of portable measuring devices are arranged at the ends within the field of view of each laser.

17. The method according to claim 14, wherein each pinhole sensor measures the quality of the non-steady laser beam generated from each laser. The method according to claim 14.

18. The method according to claim 14, wherein each pinhole sensor measures the position of each portable measuring device.

19. The method according to claim 18, wherein the measured position of the portable measuring device is used for measuring moving speed, position accuracy, and calibration.

20. The system according to claim 14, wherein the plurality of lasers are used in large part manufacturing.

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