Vapor chamber, radiator, and electronic device

Abstract

Embodiments of the present application provide a vapor chamber, a radiator, and an electronic device. The vapor chamber includes a bottom plate, a top plate, side plates, and a reflux member. The bottom plate includes a first heat dissipation region and a second heat dissipation region provided around the first heat dissipation region. The first heat dissipation region is provided corresponding to a heating element. The top plate is provided at an interval from the bottom plate. The side plates are wound around the second heat dissipation region of the bottom plate to connect the bottom plate and the top plate. The bottom plate, the top plate, and the side plates form an evaporation chamber used to accommodate a fluid medium. The reflux member is provided in the evaporation chamber to connect the bottom plate and the top plate. At least a first capillary structure layer is provided on the side of the first heat dissipation region close to the top plate, and at least a second capillary structure layer is provided on the side of the second heat dissipation region close to the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that of the fluid medium in the first capillary structure layer.

Description

Technical Field

[0001] (Cross - reference to Related Applications) This application claims the priority of a Chinese patent application with the application number 202210750928.6, filed on June 29, 2022.

[0002] This application relates to the technical field of heat dissipation of electronic devices, and particularly relates to a vapor chamber, a radiator, and an electronic device.

Background Art

[0003] Currently, an IC chip is the core of an electronic device for computing and is also one of the main heat - generating elements of an electronic device. With the development of 5G communication technology, communication products are pursuing large capacity and high performance. In particular, the integration degree of some multi - functional IC chips is becoming increasingly high, the power consumption and heat flux of IC chips are increasing, posing a great challenge to heat dissipation technology.

[0004] Currently, liquid cooling technology is not yet mature, and the solution to the heat dissipation problem of chips mainly depends on air - cooling heat dissipation technology. Vapor chamber heat dissipation technology is an important technology for air - cooling heat dissipation. A vapor chamber (VC: Vapor Chamber) mainly includes a housing, a capillary structure, and a working medium (also referred to as a fluid medium). The VC forms a sealed chamber body, the inside of the chamber body is evacuated and filled with a working medium, so that the working medium undergoes a phase change to transfer heat.

[0005] However, the conventional vapor chamber has a poor heat dissipation effect. When the electronic device operates, it cannot timely dissipate the heat of the heat - generating element of the electronic device, resulting in an excessive heat generation amount of the electronic device.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The main objective of the embodiments of this application is to provide a vapor chamber, a radiator, and an electronic device for effectively conducting and dissipating the heat of a heating element.

Means for Solving the Problem

[0007] In a first aspect, the embodiments of this application provide a vapor chamber, and the vapor chamber includes a first heat dissipation region and a second heat dissipation region provided around the first heat dissipation region, a bottom plate provided corresponding to a heating element in the first heat dissipation region, a top plate provided at an interval from the bottom plate, a side plate wound around the periphery of the second heat dissipation region of the bottom plate and connecting the bottom plate and the top plate, and the side plate, together with the bottom plate and the top plate, forms an evaporation chamber used to accommodate a fluid medium; a reflux member provided in the evaporation chamber and connecting the bottom plate and the top plate. At least a first capillary structure layer is provided on the side of the first heat dissipation region close to the top plate, and at least a second capillary structure layer is provided on the side of the second heat dissipation region close to the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that of the fluid medium in the first capillary structure layer.

[0008] In a second aspect, the embodiments of this application provide a radiator including a heat dissipation structure and the above vapor chamber, and the heat dissipation structure is connected to the vapor chamber.

[0009] In a third aspect, the embodiments of this application provide an electronic device including the above radiator.

[0010] This application provides a vapor chamber, a radiator, and an electronic device. The vapor chamber includes a bottom plate, a top plate, side plates, and a reflux member. The bottom plate includes a first heat dissipation region and a second heat dissipation region provided around the first heat dissipation region. The first heat dissipation region is provided corresponding to a heating element. The top plate is provided at an interval from the bottom plate. The side plates are wound around the second heat dissipation region of the bottom plate to connect the bottom plate and the top plate. The bottom plate, the top plate, and the side plates form an evaporation chamber used to accommodate a fluid medium. The reflux member is provided in the evaporation chamber to connect the bottom plate and the top plate. At least a first capillary structure layer is provided on the side of the first heat dissipation region close to the top plate, and at least a second capillary structure layer is provided on the side of the second heat dissipation region close to the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that of the fluid medium in the first capillary structure layer. In the embodiments of this application, by arranging two types of capillary structures on the bottom plate, the first capillary structure layer can improve the capillary force and heat conduction efficiency, and the second capillary structure layer can reduce the reflux resistance of the condensed liquid. Therefore, the heat conduction and heat dissipation capabilities of the vapor chamber are improved, and the heat dissipation problem of the vapor chamber in high-power consumption and high heat flux chip application scenarios is solved.

[0011] To more clearly explain the technical solutions of the embodiments of this application, the attached drawings required for the description of the embodiments will be briefly described below. It is obvious that the attached drawings in the following description are some embodiments of this application, and those skilled in the art can obtain other attached drawings based on these attached drawings without creative labor.

Brief Description of the Drawings

[0012]

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Embodiments for Carrying Out the Invention

[0013] Hereinafter, in combination with the drawings in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. It is obvious that the described embodiments are only some embodiments of the present application, not all embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the present application.

[0014] The flowchart shown in the drawings is only an exemplary illustration and does not necessarily have to include all contents and operations / steps, nor does it have to be executed in the described order. For example, there are also operations / steps that can be disassembled, combined, or partially combined, so the actual execution order may vary according to the actual situation.

[0015] It should be noted that the terms used in the embodiments of the present application are only used to explain specific embodiments and are not intended to limit the present application. As used in the embodiments of the present application and the appended claims, the singular forms "a", "one", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be noted that the term "and / or" used in this specification refers to and includes any combination of one or more of the listed related items.

[0016] Currently, the IC chip is the core for computing in electronic devices and is also one of the main heat-generating elements of electronic devices. With the development of 5G communication technology, communication products are pursuing large capacity and high performance. In particular, the integration degree of some multi-functional IC chips is becoming increasingly high, and the power consumption and heat flux of IC chips are rising, posing a great challenge to heat dissipation technology.

[0017] Currently, the liquid cooling technology is not yet mature, and the solution to the heat dissipation problem of the chip mainly depends on the air-cooling heat dissipation technology. The vapor chamber heat dissipation technology is an important technology for air-cooling heat dissipation. The vapor chamber (VC) mainly includes a housing, a capillary structure, and a working medium (also referred to as a fluid medium). The VC forms a sealed chamber body, the inside of the chamber body is evacuated, and the working medium is filled, so that the working medium undergoes a phase change to transfer heat.

[0018] However, since the conventional vapor chamber has a poor heat dissipation effect, when the electronic device operates, the heat of the heating element of the electronic device cannot be dissipated in a timely manner, and the heat generation amount of the electronic device becomes excessive.

[0019] Based on this, the present application provides a vapor chamber, a radiator, and an electronic device for providing a vapor chamber that effectively conducts and dissipates the heat of the heating element. When the electronic device operates, in order to realize timely heat dissipation of the heating element, it is possible to avoid failures or accidents caused by excessive heat generation of the electronic device.

[0020] Hereinafter, several embodiments of the present application will be described in detail in combination with the drawings. As long as there is no contradiction, the following examples and the features in the examples may be combined with each other.

[0021] Referring to FIG. 1, FIG. 1 is a schematic cross-sectional structure diagram of a vapor chamber provided by an embodiment of the present application.

[0022] As shown in FIG. 1, the vapor chamber 10 is adapted to the heating element 20 and used to dissipate the heat of the heating element 20. This vapor chamber 10 includes a bottom plate 11, a top plate 12, side plates 13, and a reflux member 14. The bottom plate 11 includes a first heat dissipation region 111 and a second heat dissipation region 112 provided around the first heat dissipation region 111. The first heat dissipation region 11 is provided corresponding to the heating element 20. The top plate 12 is provided at an interval from the bottom plate 11. The side plates 13 are wound around the second heat dissipation region 112 of the bottom plate 11 to connect the bottom plate 11 and the top plate 12. The bottom plate 11, the top plate 12, and the side plates 13 form an evaporation chamber 15 used to accommodate a fluid medium. This fluid medium includes at least one of water, propanol, acetone, fluoride, liquid ammonia, or ethanol.

[0023] Here, the statement that the first heat dissipation region 11 is provided corresponding to the heat generating element 20 means that the first heat dissipation region 111 may be bonded to the heat generating element 20, or the first heat dissipation region 111 may be connected to the heat generating element 20 via a connection medium. The connection medium includes, but is not limited to, bonding agents such as thermally conductive silicone grease. There are a plurality of reflux members 14, and the plurality of reflux members 14 are arranged at intervals in the evaporation chamber 15. By connecting the bottom plate 11 and the top plate 12, the top plate 12 is supported, and a flow guiding path for the fluid medium to reflux from the top plate 12 to the bottom plate 11 is provided.

[0024] At least a first capillary structure layer 113 is provided on the side of the first heat dissipation region 111 close to the top plate 12, and at least a second capillary structure layer 114 is provided on the side of the second heat dissipation region 112 close to the top plate 12. The capillary force of the first capillary structure layer 113 is greater than that of the second capillary structure layer 114, and the flow resistance of the fluid medium in the second capillary structure layer 114 is smaller than the flow resistance of the fluid medium in the first capillary structure layer 113. The heat generating element 20 includes, but is not limited to, an IC chip.

[0025] In the embodiments of the present application, the fluid medium may be other working media capable of phase change as long as it is a working medium capable of generating a state change of the corresponding substance by heat absorption and heat dissipation.

[0026] In the embodiments of the present application, the bottom plate 11 and the side plate 13 may be integrally formed, for example, by a process such as pressing, molding, or casting. Alternatively, the bottom plate 11 and the side plate 13 may be formed separately and then fixed and connected by welding, but this is not limited in this specification.

[0027] In this embodiment, by providing a first capillary structure layer 113 in the first heat dissipation region 111 of the bottom plate 11 and a second capillary structure layer 114 in the second heat dissipation region 112 of the bottom plate 11, since the capillary structure has a pore structure and the pore structure generates a strong capillary force, all the fluid medium injected into the evaporation chamber 15 is adsorbed into these pore structures. When the heating element 20 starts to operate, the heating element 20 starts to generate heat, and heats the fluid medium in the pore structure of the first capillary structure layer 113 covered by the first heat dissipation region 111 located above the heating element 20, and the temperature of the fluid medium begins to rise.

[0028] When the temperature rises and exceeds the evaporation temperature of the fluid medium itself, the fluid medium changes from a liquid state to a gaseous state. Since the gaseous fluid medium is not restricted by the structure, it can fill the entire evaporation chamber 15. When the fluid medium in the pore structure of the first capillary structure layer 113 covered by the first heat dissipation region 111 above the heating element 20 decreases, due to capillary action, the fluid medium in the pore structure of the second capillary structure layer 114 covered by the second heat dissipation region 112 of the bottom plate 11 that does not correspond to the heating element 20 is drawn into the first heat dissipation region 111 corresponding to the heating element 20, and the newly replenished fluid medium absorbs the heat generated by the heating element 20 and continues to increase in temperature and evaporate.

[0029] When the vapor hits the top plate 12 of the vapor chamber 10, the external air or the external heat dissipation structure can take away part of the heat and rapidly reduce the temperature of the vapor. When the temperature drops below the condensation temperature of the fluid medium, the vapor condenses into a liquid state. Then, the fluid medium in the liquid state is refluxed onto the bottom plate 11 of the vapor chamber 10 through the reflux member 14, and by repeating this way, the heat of the heating element 20 is efficiently transmitted and dissipated into the air.

[0030] In one embodiment, since the capillary force of the first capillary structure layer 113 is greater than that of the second capillary structure layer 114, the suction force of the first heat dissipation region 111 located on the bottom plate 11 with respect to the fluid medium is greater than that of the second heat dissipation region 112 with respect to the fluid medium. Also, since the flow resistance of the fluid medium in the first capillary structure layer 113 is greater than that of the fluid medium in the second capillary structure layer 114, the fluid medium is likely to stay in the first heat dissipation region 111, and the condensed fluid medium easily flows from the second heat dissipation region 112 to the first heat dissipation region 111. Furthermore, the heat conduction efficiency of the first heat dissipation region 111 is improved, and heat dissipation by the vapor chamber 10 of the heat generating element 20 is realized.

[0031] At least one of the bottom plate 11, the top plate 12, or the side plate 13 of the vapor chamber 10 is provided with a liquid injection port communicating with the evaporation chamber 15. The evaporation chamber 15 can be evacuated through this liquid injection port, and a predetermined amount of fluid medium can be injected into the evaporation chamber 15 through this liquid injection port. After the injection of the fluid medium is completed, the liquid injection port is sealed. Note that the method of sealing the liquid injection port may be sealing with a sealing member, or may be electric welding, cold pressure welding, ultrasonic welding, etc., and is not limited here.

[0032] As shown in FIG. 1, in some embodiments, the first heat dissipation region 111 includes a core region 1111 provided corresponding to the heat generating element 20 and a connection region 1112. For example, the core region 1111 and the heat generating element 20 are bonded together, or the core region 1111 is connected to the heat generating element 20 through a connection medium. The connection region 1112 is provided around the core region 1111 and is connected to the second heat dissipation region 112.

[0033] The first capillary structure layer 113 at least partially covers the core region 1111. If the distance between the core region 1111 and the top plate 12 is the first distance, and the distance between the second heat dissipation region 112 and the top plate 12 is the second distance, then the first distance is greater than the second distance.

[0034] In some embodiments, both the first capillary structure layer 113 and the second capillary structure layer 114 cover the connection region 1112. When both the first capillary structure layer 113 and the second capillary structure layer 114 cover the connection region 1112, the second capillary structure layer 114 is disposed on the surface of the connection region 1112, and the first capillary structure layer 113 partially covers the second capillary structure layer 114. For example, the second capillary structure layer 114 is provided on the surface of the connection region 1112, and the first capillary structure layer 113 covers 10% to 90% of the region of the second capillary structure layer 114 closer to the core region 1111.

[0035] Since the flow resistance of the fluid medium in the first capillary structure layer 113 is greater than that of the fluid medium in the second capillary structure layer 114, covering the connection region 1112 with the second capillary structure layer 114 makes it easier for the condensed fluid medium to flow from the second heat dissipation region 112 to the first heat dissipation region 111.

[0036] In some embodiments, the first capillary structure layer 113 includes a capillary structure formed by sintering at least one of metal powder and diamond powder. The metal powder includes, but is not limited to, at least one of copper powder, gold powder, and silver powder.

[0037] The second capillary structure layer 114 includes at least one of a copper mesh structure layer, a groove structure layer, a heat conductive fiber layer, and a nanofiber layer. This second capillary structure layer 114 may cover the second heat dissipation region 112 by processes such as sintering, welding, and etching.

[0038] Referring to FIGS. 2A to 2B, as an example, when the second capillary structure layer 114 is a copper mesh structure layer, the copper wires in the copper mesh structure may be arranged to intersect as an array of a plurality of copper wires. For example, as shown in FIG. 2A, a plurality of copper wires are arranged to intersect as an orthogonal array, or as shown in FIG. 2B, a plurality of copper wires are arranged to intersect as an oblique array at a non-right angle.

[0039] In one embodiment, the copper mesh of the copper mesh structure layer may be a single-layer copper mesh, or may be a stack of multiple layers of copper meshes at different angles, and is not limited herein.

[0040] Referring to FIG. 3A, for example, taking the second capillary structure layer 114 as a groove structure layer as an example, a groove structure is provided on the side of the second heat dissipation region 112 close to the top plate 12. The groove structure includes a first groove that is radially outward centered on the first heat dissipation region 111, and a second groove that connects two adjacent first grooves. The communication arrangement of the first groove and the second groove can effectively promote the reflux of the condensed liquid to the first heat dissipation region 111. The shape of the first groove and the shape of the second groove may each be any one or at least a combination of two of a polygon, an arc shape, a circular shape, or an irregular shape, and is not limited herein.

[0041] As shown in FIGS. 3B to 3E, the shape of either the first groove and / or the second groove is triangular, rectangular, trapezoidal, or arc-shaped.

[0042] Referring to FIG. 4, in some embodiments, the core region 1111 is covered by a third capillary structure layer 115 provided on the surface of the core region 1111. The first capillary structure layer is provided on the side of the third capillary structure layer 115 close to the top plate 12. The flow resistance of the fluid medium in the third capillary structure layer 115 is smaller than the flow resistance of the fluid medium in the first capillary structure layer 113.

[0043] In one embodiment, the third capillary structure layer 115 includes at least one of a copper mesh structure layer, a heat-conductive fiber layer, a nanofiber layer, and a groove structure layer.

[0044] Since the flow resistance of the fluid medium in the third capillary structure layer 115 is smaller than the flow resistance of the fluid medium in the first capillary structure layer 113, covering the core region 1111 with the third capillary structure layer 115 makes it easier for the condensed fluid medium to flow from the second heat dissipation region 112 to the first heat dissipation region 111.

[0045] Referring to FIG. 5, in some embodiments, a fourth capillary structure layer 116 is further provided in the second heat dissipation region 112 and the connection region 1112. The fourth capillary structure layer 116 is provided on the surfaces of the second heat dissipation region 112 and the connection region 1112. The second capillary structure layer 114 is provided on the surface of the fourth capillary structure layer 116. The flow resistance of the fluid medium in the fourth capillary structure layer 116 is smaller than the flow resistance of the fluid medium in the second capillary structure layer 114.

[0046] Since the flow resistance of the fluid medium in the fourth capillary structure layer 116 is smaller than the flow resistance of the fluid medium in the second capillary structure layer 114, by covering the second heat dissipation region 112 and the connection region 1112 with the fourth capillary structure layer 116, the condensed fluid medium can flow more easily from the second heat dissipation region 112 to the first heat dissipation region 111.

[0047] In one embodiment, the fourth capillary structure layer 116 includes at least one of a copper mesh structure layer, a heat conductive fiber layer, a nanofiber layer, and a groove structure layer.

[0048] In one embodiment, the fourth capillary structure layer 116 is a groove structure layer, and the second capillary structure layer 114 is a copper mesh structure layer.

[0049] As shown in FIG. 1, in some embodiments, a fifth capillary structure layer 121 is provided on the side of the top plate 12 close to the bottom plate 11, and / or a sixth capillary structure layer 141 is provided on the surface of the reflux member 14.

[0050] In one embodiment, the flow resistance of the fluid medium in the fifth capillary structure layer 121 and the sixth capillary structure layer 141 is smaller than the flow resistance of the fluid medium in the first capillary structure layer 113.

[0051] For example, the fifth capillary structure layer 121 includes at least one of a copper mesh structure layer, a groove structure layer, a heat conductive fiber layer, a nanofiber layer, and a capillary structure formed by powder sintering. The sixth capillary structure layer 141 includes at least one of a copper mesh structure layer, a groove structure layer, a heat conductive fiber layer, a nanofiber layer, and a capillary structure formed by powder sintering.

[0052] For example, a case where a capillary structure layer is provided on both the surface of the top plate 12 and the surface of the reflux member 14 will be described as an example.

[0053] Since a capillary structure layer is provided on both the surface of the top plate 12 and the surface of the reflux member 14, when the vapor hits the top plate 12 of the vapor chamber 10 and condenses into a liquid state, the liquid fluid medium adhering to the surfaces of the top plate 12 and the reflux member 14 is refluxed onto the bottom plate 11 of the vapor chamber 10 by capillary force through the capillary structure layer provided on the bottom plate 11. That is, providing a capillary structure layer on the surfaces of the reflux member 14 and the top plate 12 is advantageous for the reflux of the condensed fluid medium to the bottom plate 11.

[0054] In some embodiments, a seventh capillary structure layer is further provided on the inner surface of the side plate 13, and the seventh capillary structure layer includes at least one of a copper mesh structure layer, a groove structure layer, a heat conductive fiber layer, a nanofiber layer, and a capillary structure formed by powder sintering. Referring to FIG. 6, the present application further provides a radiator 100 used for dissipating heat of the heating element 20, and this radiator 100 includes a heat dissipation structure 30 and a vapor chamber 10 connected to the heat dissipation structure 30. Regarding the configuration of the vapor chamber 10, any one of the above-described embodiments can be referred to, so a detailed description is omitted here.

[0055] In one embodiment, the heat dissipation structure 30 is connected to the top plate 12 of the vapor chamber 10 and is used to dissipate heat from the vapor chamber 10. For example, the heat dissipation structure 30 is provided with a plurality of heat dissipation fins 301 arranged at intervals. By arranging the heat dissipation fins 301 at intervals, the contact area between the heat dissipation structure 30 and air can be increased, so that the heat dissipation of the vapor chamber 10 can be made easier.

[0056] Referring to FIG. 7, the present application further provides an electronic device 200, which includes a processor 201, a memory 202, and a radiator 100. The processor 201 and the memory 202 are connected via a bus 203, and this bus is, for example, an I2C (Inter-integrated Circuit) bus. The radiator 100 is used to dissipate heat from the processor 201.

[0057] In one embodiment, the processor 201 is used to provide the computing power and control power to support the operation of the entire electronic device 200. The processor 201 may be a central processing unit (CPU), or this processor 201 may be other general-purpose processors, digital signal processors (DSPs), application specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, individual gates, or transistor logic devices, individual hardware components. Among them, the general-purpose processor may be a microprocessor or any conventional processor or the like.

[0058] In one embodiment, the memory 202 may be a Flash chip, a read-only memory (ROM), a magnetic disk, an optical disk, a USB memory, or a removable hard disk, etc.

[0059] The electronic device 200 includes, but is not limited to, a base station, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, a wearable device, etc.

[0060] As used in the specification of this application and the appended claims, the term "and / or" means any combination and all possible combinations of one or more of the listed related items, and it should be understood that these combinations are included. In this specification, the terms "include", "include in" or any other variation cover non-exclusive inclusion, so that a process, method, article or system of a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent in this type of process, method, article or system. In a situation without further limitations, the element limited by the sentence "including one..." does not exclude the further existence of other same elements in the process, method, article or system including the element.

[0061] In the above-described embodiments, the descriptions of the respective embodiments have different focuses. For parts not described in detail in a certain embodiment, reference can be made to the related descriptions of other embodiments.

[0062] The numbers of the embodiments of the present application above are only for the purpose of explanation and do not represent the superiority or inferiority of the embodiments. The above description is only a specific embodiment of the present application, and the protection scope of the present application is not limited thereto. A person skilled in the art can easily conceive of various equivalent changes or substitutions within the technical scope disclosed by the present application, and all of these changes or substitutions should be included within the protection scope of the present application. Therefore, the protection scope of the present application shall be in accordance with the scope of the claims.

Claims

1. A vapor chamber including a first heat dissipation region and a second heat dissipation region provided around the first heat dissipation region, the first heat dissipation region including a bottom plate provided corresponding to a heat generating element, a top plate provided at a distance from the bottom plate, a side plate wound around the periphery of the second heat dissipation region of the bottom plate and connecting the bottom plate and the top plate, the side plate forming an evaporation chamber used to accommodate a fluid medium together with the bottom plate, the top plate, and the side plate, and a reflux member provided in the evaporation chamber and connecting the bottom plate and the top plate. At least a first capillary structure layer is provided on the side of the first heat dissipation region close to the top plate, and at least a second capillary structure layer is provided on the side of the second heat dissipation region close to the top plate. The capillary force of the first capillary structure layer is greater than that of the second capillary structure layer, and the flow resistance of the fluid medium in the second capillary structure layer is smaller than that of the fluid medium in the first capillary structure layer. The vapor chamber.

2. The first heat dissipation region includes a core region provided corresponding to the heat generating element and a connection region provided around the core region and connected to the second heat dissipation region. The first capillary structure layer at least partially covers the core region. Taking the distance between the core region and the top plate as a first distance and the distance between the second heat dissipation region and the top plate as a second distance, the first distance is greater than the second distance. The vapor chamber according to claim 1.

3. Both the first capillary structure layer and the second capillary structure layer cover the connection region. When both the first capillary structure layer and the second capillary structure layer cover the connection region, the second capillary structure layer is disposed on the surface of the connection region, and the first capillary structure layer partially covers the second capillary structure layer. The vapor chamber according to claim 2.

4. The core region is covered by a third capillary structure layer provided on the surface of the core region. The first capillary structure layer is provided on the side of the third capillary structure layer close to the top plate. The flow resistance of the fluid medium in the third capillary structure layer is smaller than that of the fluid medium in the first capillary structure layer. The vapor chamber according to claim 3.

5. The first capillary structure layer includes a capillary structure formed by sintering at least one of metal powder and diamond powder. The second capillary structure layer includes at least one of a copper mesh structure layer, a groove structure layer, a heat conductive fiber layer, and a nanofiber layer. The third capillary structure layer includes at least one of a copper mesh structure layer, a groove structure layer, a heat conductive fiber layer, and a nanofiber layer. The vapor chamber according to claim 4.

6. A fourth capillary structure layer is further provided in the second heat dissipation region and the connection region. The fourth capillary structure layer is provided on the surfaces of the second heat dissipation region and the connection region. The second capillary structure layer is provided on the surface of the fourth capillary structure layer. The flow resistance of the fluid medium in the fourth capillary structure layer is smaller than the flow resistance of the fluid medium in the second capillary structure layer. The vapor chamber according to claim 3.

7. A fifth capillary structure layer is provided on the side of the top plate close to the bottom plate, and / or a sixth capillary structure layer is provided on the surface of the reflux member. The vapor chamber according to any one of claims 1 to 6.

8. The fluid medium includes at least one of water, propanol, acetone, fluoride, liquid ammonia, or ethanol. The vapor chamber according to any one of claims 1 to 6.

9. A radiator including a heat dissipation structure and the vapor chamber according to any one of claims 1 to 8, wherein the heat dissipation structure and the vapor chamber are connected. Radiator.

10. including the radiator according to claim 9 Electronic device.

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