Heat dissipation structure, vehicle-mounted device, and terminal device

Abstract

Embodiments of the present application provide a heat dissipation structure, a vehicle-mounted device, and a terminal device used in the field of heat dissipation technology. The heat dissipation structure includes a heat sink, a circuit board, a fixed connection structure, and an elastic connection structure. A chip mounting area and a first position are provided on the circuit board. The first position is positioned outside the chip mounting area. The fixed connection structure is positioned at the first position and fastens the circuit board to the heat sink. The elastic connection structure is configured to apply an elastic force toward the heat sink in the chip mounting area. In an embodiment of the present application, the elastic force provided by the elastic connection structure can significantly reduce the thermal resistance between the chip and the housing of the heat sink, thereby improving the heat dissipation efficiency. Further, the fixed connection structure can fasten the circuit board to the heat sink to avoid overall sliding of the circuit board and improve stability. Therefore, the present application can improve the heat dissipation efficiency while ensuring the stability of the heat dissipation structure, and is particularly applicable to the stable heat dissipation of high-power consumption chips.

Description

Technical Field

[0001] This application claims the priority of Chinese Patent Application No. 202210592066.9, titled "Heat Dissipation Structure, Vehicle-mounted Device and Terminal Device", filed with the State Intellectual Property Office of China on May 28, 2022, which is incorporated herein by reference in its entirety.

[0002] This application relates to the field of heat dissipation technology, and in particular, to a heat dissipation structure, a vehicle-mounted device, and a terminal device.

Background Art

[0003] With the continuous development of intelligent technology, various electronic devices are used in terminal devices, such as vehicles. In particular, autonomous vehicles are associated with many intelligent devices / systems. Therefore, the problem of heat dissipation of these electronic devices in the working process is emphasized.

[0004] A large tolerance is set between a conventional vehicle-mounted heat sink and a chip. Therefore, a thick heat-conducting material (such as a gel or a thermal pad) needs to be filled between the chip and the heat sink. Since the heat-conducting material is thick and has a large thermal resistance, when the power consumption of the chip is large, the heat dissipation efficiency is low. However, due to the intelligence of electronic devices, the power consumption of electronic devices in the terminal device increases by dozens of times, and such a heat dissipation method cannot meet the heat dissipation requirements.

Summary of the Invention

Means for Solving the Problems

[0005] Embodiments of this application provide a heat dissipation structure, a vehicle-mounted device, and a terminal device to improve the heat dissipation efficiency of high-power consumption components.

[0006] According to a first aspect, an embodiment of the present application provides a heat dissipation structure including a heat sink, a circuit board, at least one fixed connection structure, and at least one elastic connection structure. At least one chip mounting area and at least one first position are provided on the circuit board, and at least one first position is positioned outside the chip mounting area. At least one fixed connection structure is positioned at at least one first position and fastens the circuit board to the heat sink. At least one elastic connection structure is configured to apply an elastic force toward the heat sink in the chip mounting area.

[0007] In one aspect, the elastic force applied to the elastic connection structure can significantly reduce the thermal resistance between the chip and the housing of the heat sink, thereby improving the heat dissipation efficiency. For example, the elastic connection structure enables the generation of elastic deformation in the chip mounting area, and this elastic deformation may absorb assembly tolerances, whereby the chip positioned within the chip mounting area is attached in close contact with the heat sink (where the attachment may be direct attachment or attachment by using a medium). In this way, the thermal resistance between the chip and the housing of the heat sink is significantly reduced.

[0008] In another aspect, the fixed connection structure can fasten the circuit board to the heat sink to prevent the circuit board from integral sliding, thereby improving the stability. In conclusion, in this embodiment of the present application, while the temperature of the chip can be effectively reduced, the overall structure maintains stability, the overheating risk of the chip can be reduced, and the safety can be improved.

[0009] In a possible solution, in an embodiment of the present application, the heat dissipation device provided can be configured to dissipate the heat of a chip in an intelligent mobile terminal. With the popularization of intelligent mobile terminals, more and more chips are used in fields such as intelligent driving vehicles, unmanned aerial vehicles, and mobile robots. However, since a mobile intelligent terminal needs to move in an external environment or be carried to move in an external environment, the mobile intelligent terminal often encounters scenarios such as vibration or bumps. In these scenarios, when the chip is in unstable contact with the heat sink and the chip is in unstable contact with the circuit board, not only the heat dissipation efficiency of the chip is affected, but also electrical connection failures may be caused. This affects the normal operation of the intelligent terminal and poses a danger to personal safety. However, according to the heat dissipation structure provided in the embodiment of the present application, the circuit board on which the chip is located and the heat sink can be firmly fastened, and longitudinal deformation is generated only within the safe range of the chip, whereby the chip is attached to the heat sink. In other words, stable and high heat dissipation efficiency can be achieved, the stability of the overall structure is enhanced, and the safety of the intelligent mobile terminal is improved.

[0010] It should be noted that in an embodiment of the present application, a plurality of fixed connection structures and / or elastic connection structures may exist.

[0011] When a plurality of fixed connection structures are arranged, the plurality of fixed connection structures may provide a uniform and reliable fixed connection to the circuit board, and the overall service life of the fixed connection structure may be improved.

[0012] When a plurality of elastic connection structures are arranged, the plurality of elastic connection structures can improve the overall service life of the elastic connection structures. Further, the plurality of elastic connection structures can evenly disperse the elastic force around the chip mounting area, thereby improving the flatness of the chip mounting area. This can improve the reliability of the connection between the chip and the circuit board and further ensure the consistency and balance of the elastic top holding force applied between the chip and the heat sink.

[0013] In still another possible implementation form of the first aspect, at least one fixed connection structure is configured to perform positioning of the circuit board in the horizontal direction. In this way, the possibility of the circuit board sliding in the horizontal direction is reduced, and the structural stability is improved.

[0014] Optionally, at least one fixed connection structure includes a fastening screw. The fastening screw has sufficient fastening force, whereby the circuit board and the heat sink can be securely fastened.

[0015] In a possible implementation form of the first aspect, at least one elastic connection structure includes a fastener and an elastic member. The circuit board is provided with a through hole, the fastener passes through the through hole and is fastened to the heat sink. The elastic member is sleeved on the fastener and is elastically connected to the fastener and the surface of the circuit board away from the heat sink.

[0016] In the foregoing implementation form, the fastener is fastened to the heat sink through the through hole of the circuit board, and the elastic member with a sleeve on the fastener can be fastened in the horizontal direction (or the direction parallel to the circuit board). Therefore, most of the deformation of the elastic member is in the vertical direction (or the direction perpendicular to the circuit board), whereby the direction of the elastic force applied by the elastic member is stabilized. In other words, through the fastening of the fastener, the elastic member can stably apply an elastic force toward the heat sink for the circuit board. According to the solution provided in the foregoing implementation form, the chip positioned within the chip mounting area is more stably attached to the heat sink, thereby improving the heat dissipation efficiency.

[0017] In yet another possible implementation form of the first aspect, at least one elastic connection structure includes a spring screw, an elastic sheet, and the like. The spring screw or the elastic sheet has sufficient support strength and can be elastically deformed to apply an elastic force, whereby the chip is attached in close contact with the heat sink.

[0018] In yet another possible implementation form of the first aspect, at least one elastic connection structure is an elastic body, and the elastic body is elastically connected between the circuit board and the support.

[0019] In the foregoing implementation form, the elastic force is provided by using an elastic body positioned between the circuit board and the support. In this case, no additional modification needs to be made to the circuit board and the heat sink, thereby reducing the complexity of the design of the circuit board and the heat sink and reducing the design cost and the manufacturing cost.

[0020] In yet another possible implementation of the first aspect, the support is positioned on the side of the circuit board away from the heat sink. An elastic body is compressed between the circuit board and the support, whereby the elastic body applies a "pressing force" to the circuit board. Correspondingly, the circuit board is "pressed" against the heat sink, whereby the chip positioned in the chip mounting area is stably attached to the heat sink. This improves the heat dissipation efficiency.

[0021] Optionally, the elastic body may be fastened by using a groove provided in the support. In this case, it is not necessary to provide a through hole in the circuit board, thereby reducing the complexity of the circuit design on the circuit board.

[0022] In yet another possible implementation of the first aspect, the support is positioned on the side of the circuit board facing the heat sink. The elastic body is stretched between the circuit board and the support, whereby the elastic body applies a "tensile force" to the circuit board. Correspondingly, the circuit board is "pulled" by the heat sink, whereby the chip positioned in the chip mounting area is stably attached to the heat sink. This improves the heat dissipation efficiency.

[0023] In yet another possible implementation of the first aspect, the support is the housing of the heat dissipation structure.

[0024] Optionally, the heat dissipation structure may be housed within the housing. Further optionally, the housing of the heat sink includes an upper housing and a lower housing (also referred to as a bottom housing), and the support may specifically be the lower housing of the heat sink structure.

[0025] In yet another possible implementation of the first aspect, the circuit board of the heat dissipation structure is connected to a stress-sensitive component, and the distance between the stress-sensitive component and the first fixed connection structure is smaller than the distance between the stress-sensitive component and any elastic connection structure, and the first fixed connection structure belongs to at least one fixed connection structure.

[0026] In this embodiment of the present application, the stress-sensitive component is disposed at a position close to the fixed connection structure. In this way, damage or poor connection of the stress-sensitive component connected to the circuit board due to the deformation of the circuit board under the elastic force applied by the elastic connection structure can be avoided.

[0027] In yet another possible implementation form of the first aspect, the heat dissipation structure further includes a connector and a main board. One end of the connector is connected to the circuit board, and the other end of the connector is connected to the main board. The connector can enable electrical connection of the circuit board to the main board.

[0028] This setting meets the requirements of different customers for different types of chips and has high applicability. Furthermore, when the performance of the chip needs to be upgraded, only the chip and the circuit board need to be replaced. Therefore, it has strong evolution ability and low upgrade and replacement costs. Additionally, the above-described implementation form can further meet the requirements for adding or deleting chips, thereby improving the flexibility of the components.

[0029] In yet another possible solution, the connector may be a flexible conductive member, and the signal interconnection between the connector and the main board is implemented by using the flexible conductive member. The flexible conductive member includes a flexible circuit board, a flexible connector, a cable, etc. The flexible conductive member may implement the signal interconnection between the circuit board and the main board, and the flexible characteristics of the flexible conductive member can ensure the reliability of the electrical connection when the circuit board floats up and down.

[0030] In a possible solution, the connector may be a BTB connector.

[0031] In yet another possible implementation of the first aspect, the distance between the connector and the second fixed connection structure is smaller than the distance between the connector and any elastic connection structure, and the second fixed connection structure belongs to at least one fixed connection structure.

[0032] In this embodiment of the present application, it should be understood that the "first fixed connection structure" and the "second fixed connection structure" are merely for ease of explanation, and there is no limitation that the two must surely be two different fixed connection structures. That is, the second fixed connection structure and the aforementioned first fixed connection structure may be two different fixed connection structures or the same fixed connection structure.

[0033] In yet another possible implementation of the first aspect, there is one chip mounting area on the circuit board, the first position is positioned at the edge of the circuit board, and the chip mounting area is positioned in the central area of the circuit board.

[0034] In yet another possible implementation of the first aspect, there are at least two chip mounting areas on the circuit board, and the first position is positioned between the at least two chip mounting areas.

[0035] In yet another possible implementation of the first aspect, the chip mounting area is positioned on one side of the circuit board, and the first position is positioned on the other side of the circuit board.

[0036] In yet another possible implementation of the first aspect, the heat dissipation structure further includes a support, the support is fastened to the circuit board, the elastic force of at least one elastic connection structure acts on the support, and the elastic force of the elastic connection structure is applied to the circuit board by using the support.

[0037] Support can improve the rigidity of the chip mounting area. In this way, the elastic force of the elastic connection structure acts on the chip mounting area, whereby the overall form of the chip mounting area can be ensured, the flatness of the chip mounting area is not affected, the reliability of the connection between the chip and the circuit board is ensured, and the consistency and balance of the elastic top holding force applied between the chip and the heat sink can be ensured.

[0038] In yet another possible implementation form of the first aspect, the heat dissipation structure is used in an autonomous driving controller, a cockpit domain controller, or a vehicle domain controller.

[0039] Since the structure of the vehicle is complex and the intelligence level is getting higher and higher, the power consumption of the chips in the vehicle controller is also increasing. According to this embodiment of the present application, the heat dissipation structure can provide stable and efficient heat dissipation for the chips in the vehicle, thereby reducing the risk of overheating of the chips and improving safety.

[0040] In yet another possible implementation form of the first aspect, the heat sink is provided with bosses, and the bosses are for heat conduction to the heat radiation components (such as chips) in the chip mounting area. The bosses are arranged, whereby heat dissipation can be carried out on the chips in a targeted manner, and the heat dissipation efficiency is improved.

[0041] In yet another possible implementation form of the first aspect, a heat conduction medium is arranged between the heat sink and the heat radiation components (such as chips) in the chip mounting area.

[0042] Optionally, the heat conduction medium is silicone grease or a heat pad (such as a phase change heat conduction film). The thermal resistance of the thermally conductive silicone grease and the phase change heat conduction film is low, and an extremely thin thickness can be implemented in the process. This helps to reduce the temperature of the chips.

[0043] In yet another possible implementation of the first aspect, the thickness of the thermal pad is 0.3 millimeters or less.

[0044] Under the influence of the elastic fastening structure, the heat radiation component (e.g., the chip) is attached in close contact with the heat sink, and the thickness of the heat conduction layer can be significantly reduced. As a result, the thermal resistance of the heat conduction layer can be significantly reduced, and the temperature of the chip can be effectively reduced.

[0045] In a possible implementation of the first aspect, the heat sink may dissipate heat in different forms, such as air cooling or water cooling. In other words, the heat dissipation device provided in this embodiment of the present application is applicable to an air-cooled heat sink or a liquid-cooled heat sink.

[0046] In yet another possible implementation of the first aspect, the heat sink includes a pipeline, the pipeline is configured to be filled with a liquid, and the liquid includes water or a cooling material.

[0047] According to the second aspect, an embodiment of the present application provides a vehicle-mounted device. This vehicle-mounted device includes the aforementioned heat dissipation structure and at least one chip, and at least one chip is disposed in at least one chip mounting area on the circuit board of the heat dissipation structure.

[0048] In one aspect, the fixed connection structure can fasten the circuit board to the heat sink to prevent the circuit board from integral sliding, thereby improving stability. In another aspect, the elastic force provided by the elastic connection structure can enable elastic deformation to be generated in the chip mounting area, whereby the chip is attached in close contact with the heat sink. This can significantly reduce the thermal resistance between the chip and the housing of the heat sink and improve the heat dissipation efficiency. In conclusion, in this embodiment of the present application, while the temperature of the chip can be effectively reduced, the overall structure maintains stability, and the risk of overheating of the chip can be reduced.

[0049] Note that the heat dissipation assembly is applicable not only to the aforementioned vehicle-mounted devices, but also to one or more devices having heat dissipation requirements. For example, the heat dissipation assembly is used in devices such as intelligent terminal devices, network devices, equipment room devices, industrial devices, transportation devices, or recreational devices. Intelligent terminal devices are, for example, mobile phones, tablet computers, notebook computers, smart bands, smart watches, or smart glasses. Network devices are, for example, metro routers, central routers, or base stations. Equipment room devices are, for example, data center servers, or data center switches. Industrial devices are, for example, industrial robots and robot arms. Transportation devices are, for example, vehicles, ships, aircraft, railway transportation (e.g., subways or high-speed railways), or logistics robots. Recreational devices are, for example, virtual reality (VR) devices, mixed reality (MR) devices, massage chairs, or 4D cinema cockpits. This is not strictly limited in the embodiments of the present application.

[0050] In a possible implementation of the second aspect, at least one elastic connection structure in the heat sink is configured to maintain a heat conduction connection between at least one chip and the heat sink in the heat dissipation structure.

[0051] In a possible implementation of the second aspect, the vehicle-mounted device further includes a main board, there are a plurality of chips, and there are at least two heat dissipation structures.

[0052] The plurality of chips are mounted on the chip mounting areas on the circuit board in at least two heat dissipation structures, and the main board is electrically connected to the circuit boards in the plurality of heat dissipation structures.

[0053] A plurality of heat dissipation structures are arranged, whereby a plurality of high-power consumption chips conduct and dissipate heat separately from the heat sink. Furthermore, a plurality of circuit boards (or heat dissipation devices) are arranged, whereby not only can different customer requirements for different types of chips be satisfied, but also the applicability is high. Furthermore, when it is necessary to upgrade the performance of the chips, only the chips and the circuit boards need to be replaced. Therefore, it has strong evolutionary ability and low replacement cost. Furthermore, the above-described implementation form can further meet the requirements for adding or deleting chips, thereby improving the flexibility of the components.

[0054] In a possible implementation form of the second aspect, the vehicle-mounted device has an integrated plate-shaped structure.

[0055] In a possible implementation form of the second aspect, the vehicle-mounted device is used in an electronic control unit (ECU) module that uses high-power consumption chips. The ECU module includes, but is not limited to, an autonomous driving controller, a cockpit domain controller (CDC), a vehicle domain controller (VDC), a vehicle integration / integration unit (VIU), etc. The autonomous driving controller may be, for example, a mobile data center (MDC).

[0056] According to the third aspect, the present application further provides a terminal device. The terminal device includes the heat dissipation structure or the vehicle-mounted device described above.

[0057] In a possible implementation form of the third aspect, the terminal device may be a transportation tool such as a vehicle, a drone, a robot, a handheld terminal, or a wearable device.

Brief Description of the Drawings

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[0059] With the development of computer technology, the functions of electronic devices are becoming more and more intelligent and diversified. The diversified intelligent functions are implemented by a computing module having high computing power (hereinafter, a chip is used as an example for explanation). As the computing power of the chip increases, the power consumption of the chip increases. A high-power consumption chip generates a large amount of heat during operation and forms a hot zone. The hot zone has a high temperature and needs to dissipate heat in a timely manner.

[0060] Currently, when the chip dissipates heat, a large tolerance exists between the heat sink and the chip. Therefore, a thick heat-conducting material (such as a gel or a thermal pad) needs to be filled between the chip and the heat sink to implement heat dissipation.

[0061] Note that the calculation formula for thermal resistance is as follows: Thermal resistance = filling thickness / (thermal conductivity * chip coating area) Formula 1

[0062] The calculation formula for the temperature difference is as follows: Temperature difference = chip power consumption * thermal resistance Formula 2

[0063] For example, when a heat conduction medium with a thickness of 0.001 m (meter) is filled between a chip and a heat sink, for example, if the thermal conductivity of the heat conduction medium is 8 W / mk (watt / meter kelvin) and the effective heat transfer area of the chip is 0.024 m * 0.024 m, the thermal resistance of the thermal gel is 0.217 °C / W. For example, when the power consumption of the chip is 66 W (watt), the temperature difference generated on the surface of the heat conduction medium is 14 °C. The foregoing is only an example where the thickness of the heat conduction medium is 1 mm (millimeter). In reality, the heat conduction medium coated between the heat sink and the chip is usually thick.

[0064] Since the heat conduction material is thick and has a large thermal resistance, the heat dissipation performance may rapidly decrease when the power consumption of the chip increases, and there is a tendency for the chip to overheat. Overheating not only damages the chip but also causes safety risks. This threatens the life and property of the user.

[0065] Therefore, embodiments of the present application provide a heat dissipation structure, a vehicle-mounted device, and a vehicle to improve the heat dissipation efficiency of high-power consumption components. In this embodiment of the present application, a chip mounting area and a first position are provided on a circuit board. The heat sink is fastened to the circuit board at the first position by using a fixed connection structure to avoid sliding of the circuit board. The elastic connection structure in the heat dissipation structure applies an elastic force toward the heat sink with respect to the chip mounting area on the circuit board, thereby reducing the thermal resistance between the chip and the heat sink and improving the heat dissipation efficiency.

[0066] The following specifically describes the heat dissipation structure and the vehicle-mounted device provided in the embodiments of the present application with reference to the accompanying drawings and specific embodiments. It should be noted that in the embodiments of the present application, the heat dissipation of the chip by using the heat dissipation structure is used as an example for explanation. In a specific implementation process, the chip may be replaced with various heat radiation components. Similarly, the heat radiation components mounted in the chip mounting area may include not only the chip but also other heat radiation components.

[0067] Figure 1 is a schematic diagram of a partial structure of a heat dissipation structure according to an embodiment of the present application. The heat dissipation structure may include a heat sink 101, a circuit board 102, a fixed connection structure 104, and an elastic connection structure 103.

[0068] The heat sink 101 is a structure having heat conduction and heat dissipation functions. The heat dissipation method of the heat sink may be air-cooled heat dissipation, liquid-cooled heat dissipation, natural heat dissipation, etc.

[0069] In a possible solution, the heat sink may be a water-cooled heat sink. A pipeline is arranged in the heat sink, and the pipeline may be filled with a liquid, whereby heat is dissipated to the outside by flowing the liquid. The liquid in the pipeline may be water or another refrigerant.

[0070] In yet another possible solution, the heat sink may be an air-cooled heat sink. For example, a plurality of heat dissipation fins are arranged on the heat sink, and the plurality of heat dissipation fins are arranged at intervals, whereby a heat dissipation surface having a large area can be provided. After the heat of the heat radiation component is transmitted to the heat sink, the heat is dissipated to the outside through radiation and convection.

[0071] For targeted heat dissipation on the area where the chip is located, bosses may be arranged on the heat sink 101. The bosses are in thermal conductive connection with heat radiation components (such as chips) within the chip mounting area. The bosses are arranged, whereby heat dissipation can be carried out by the chips in a targeted manner, and the heat dissipation efficiency is improved.

[0072] The chip mounting area and the first position are provided on the circuit board 102. A chip (for example, the chip 105 shown in FIG. 1) may be mounted on the chip mounting area. The first position is positioned outside the chip mounting area. Optionally, there may be one or more chip mounting areas and the first position.

[0073] Optionally, the circuit board 102 may be a printed circuit board (PCB).

[0074] The elastic connection structure 103 is configured to apply an elastic force toward the heat sink 101 with respect to the chip mounting area. The elastic connection structure applies the elastic force, whereby the chip within the chip mounting area can be attached in close contact with the heat sink 101.

[0075] It should be understood that the elastic connection structure 103 may absorb tolerances, whereby the chip 105 is attached in close contact with the heat sink 101 in order to effect efficient conduction and heat dissipation of the chip 105.

[0076] For example, the chip 105 has a thickness tolerance, the heat sink 101 has a height tolerance, and the circuit board 102 also has a thickness tolerance. Due to the existence of the tolerances, the distance between the chip 105 and the heat sink 101 is not a fixed value. FIG. 2 is a schematic diagram of possible deformations of a circuit board according to an embodiment of the present application. The elastic connection structure 103 applies an upward elastic force to the chip mounting area, absorbs as much as possible the tolerances between the chip and the heat sink, implements a close attachment between the chip 105 and the heat sink 101, and effects efficient conduction and heat dissipation of the chip 105.

[0077] In this embodiment of the present application, the elastic connection structure 103 generates elastic deformation under an external force, and the generated elastic force is related to the amount of deformation. When the distance between the chip 105 and the heat sink 101 is small, the degree of deformation of the elastic connection structure 103 is small. When the distance between the chip 105 and the heat sink 101 is large, the degree of deformation of the elastic connection structure 103 is large. In this way, the elastic connection structure 103 implements the floating of the chip 105, so that the chip 105 can always be pressed against the heat sink 101, ensuring that the chip 105 and the heat sink 101 can maintain good heat conduction contact. By appropriately setting the compression amount of the elastic connection structure 103, it can be ensured that the pressure supported by the chip 105 falls within a safe range tolerated by the chip 105, thereby avoiding damage to the chip.

[0078] Under the influence of the elastic connection structure 103, the chip 105 is attached to the heat sink 101 in close contact, and the gap between the heat sink 101 and the chip 105 may be close to 0. However, in some scenarios, when the chip 105 is directly attached to the heat sink 101, the thermal resistance between the chip 105 and the heat sink 101 is large.

[0079] In a possible solution to improve the heat dissipation efficiency, a heat conduction medium (or a heat conduction layer) is filled between the chip 105 and the heat sink 101, and the heat conduction medium is used to reduce the thermal contact resistance between the chip 105 and the heat sink 101.

[0080] The heat conduction medium may include a conductive material such as thermally conductive silicone grease or a heat pad (for example, a phase change heat conduction film). Thermally conductive silicone grease and the phase change heat conduction film have a low thermal conductivity and can be implemented with a very thin thickness, for example, 0.3 mm or less, in the process. The thin thickness of the heat conduction medium indicates a small thermal resistance and a high heat dissipation efficiency between the chip 105 and the heat sink 101.

[0081] In a possible implementation form, the thickness of the heat conduction medium may be less than 0.2 mm. For example, the heat conduction medium may be an ultra-thin heat pad with a thickness of 0.2 mm or less. For example, when a thermally conductive silicone grease is used as the heat conduction medium, the thickness of the thermally conductive silicone grease reaches 0.1 mm.

[0082] Optionally, there are multiple possible cases of the positional relationship between the elastic member and the circuit board in the elastic connection structure. For example, the elastic connection structure may be positioned on the side of the circuit board away from the heat sink. When the elastic connection structure 103 is in a compressed state, an upward pressure (or called a pressing force) is applied to the circuit board 102, whereby the chip in the circuit board is closely attached to the heat sink 101. Alternatively, the elastic connection structure may be positioned on the side of the circuit board close to the heat sink. When the elastic connection structure 103 is in an extended state, an upward tensile force is applied to the circuit board 102, whereby the chip in the circuit board is closely attached to the heat sink 101.

[0083] The fixed connection structure 104 is positioned at the first position and fastens the circuit board 102 to the heat sink 101. For example, the fixed connection structure 104 may be a fastening screw (for example, a threaded screw). In order to implement the heat dissipation of the heat radiation component, the circuit board 102 and the heat sink 101 are arranged facing each other, and the side of the circuit board where the chip mounting area is provided faces the heat sink.

[0084] Since the direction of the force provided by the elastic connection structure 103 is perpendicular to the circuit board, the heat dissipation device may slide horizontally under an external force. Horizontal sliding may cause electrical connection failures, damage to the pins of the chip, etc. FIG. 3 is a schematic diagram of a possible usage scenario of the heat dissipation structure according to an embodiment of the present application. The heat dissipation device is used in a vehicle to dissipate the heat of a vehicle-mounted chip. The vehicle vibrates during movement. For example, when the vehicle passes over an obstacle, the vehicle may bump. The elastic connection structure 103 may generate large elastic deformations when the vehicle bumps. The elastic deformation needs to be recovered within a specific period of time. Therefore, there is a gap between the elastic connection structure 103 and the circuit board 102, whereby the circuit board 102 has a risk of sliding horizontally. When the circuit board slides horizontally, the electrical connection between the circuit board and another device may fail. Furthermore, since there is a frictional force between the chip 105 and the heat sink 101, the pins of the chip may be damaged by friction.

[0085] However, in this embodiment of the present application, the fixed connection structure 104 may firmly fasten the circuit board 102 and the heat sink 101 to implement the horizontal positioning of the circuit board 102 (the horizontal direction in this specification refers to the horizontal direction on the plane where the circuit board 102 is positioned). Even if the elastic connection structure 103 is affected by vibration and floats up and down, the fixed connection structure 104 may also fasten the circuit board 102 to prevent integral sliding, improve stability, and avoid threats to the safety of the user's person and property. Furthermore, when there is no fixed connection structure 104, during the vibration process, when there is a gap between the elastic connection structure 103 and the circuit board 102, the gap may also exist between the chip and the heat sink, and as a result, an ideal heat dissipation effect may not be achieved. In other words, when the elastic connection structure floats, the fixed connection structure 104 can control the distance between the chip and the heat sink and maintain the heat conduction connection between the chip and the heat sink, whereby the heat dissipation device can provide stable heat dissipation.

[0086] In conclusion, in the embodiments of the present application, while the temperature of the chip can be effectively reduced, the overall structure can maintain stability, the overheating risk of the chip can be reduced, and the safety can be improved.

[0087] For example, a thermally conductive silicone grease having a thickness of 0.00001 m (i.e., 0.1 mm) is used as the heat transfer medium. The thermal conductivity of the thermally conductive silicone grease is about 6 W / mk, and the coating area of the chip remains 0.024 m * 0.024 m. The filling thickness, thermal conductivity, and coating area of the chip are substituted into the aforementioned formula 1, and the thermal resistance of the thermally conductive silicone grease is obtained as 0.029 °C / W.

[0088] In the case of a chip with a power consumption of 66 W, the power consumption of the chip and the thermal resistance of the thermally conductive silicone grease are substituted into formula 2, and the temperature difference between the upper and lower surfaces of the thermally conductive silicone grease is obtained as 1.9 °C. Therefore, the heat dissipation efficiency is high, and the temperature of the chip can be effectively reduced.

[0089] When a heat transfer medium having a thermal conductivity of 8 W / mk is used, the temperature difference generated by the heat transfer medium is about 1.4 °C. Compared with the temperature difference of 14 °C in the aforementioned related art, the temperature difference is reduced by about 12 °C, and thus the heat dissipation effect is extremely obvious.

[0090] In this embodiment of the present application, there may be one or more elastic connection structures 103. When a plurality of elastic connection structures are arranged, the overall service life of the elastic connection structures can be improved. Further, the plurality of elastic connection structures can evenly disperse the elastic force around the chip mounting area, thereby improving the flatness of the chip mounting area. This can improve the reliability of the connection between the chip and the circuit board, and further ensure the consistency and balance of the elastic top holding force applied between the chip and the heat sink.

[0091] Similarly, there may be one or more fixed connection structures 104. When multiple fixed connection structures are arranged, the multiple fixed connection structures may provide uniform and reliable fixed connections to the circuit board, and the overall service life of the fixed connection structures may be improved.

[0092] Based on the embodiment shown in FIG. 1, the following describes some possible designs of the embodiments of the present application. It should be noted that the following multiple designs may be implemented separately or combined for implementation. Cases where multiple designs are combined for implementation will not be described again in the embodiments of the present application.

[0093] [Design 1] In the heat dissipation structure provided in this embodiment of the present application, there may be one or more chip mounting areas and / or a first position on the circuit board.

[0094] Since the elastic connection structure 103 and the fixed connection structure 104 have different functions on the circuit board, in some possible implementation forms, there is a gap between the chip mounting area and the first position. In other words, the gap between the elastic connection structure 103 and the fixed connection structure is indirectly implemented. In this case, the chip mounting area on the circuit board is prone to deformation, thereby improving the heat dissipation effect and extending the life of the elastic connection structure.

[0095] To facilitate the understanding of the relationship between the chip mounting area and the first position, the following lists three possible cases.

[0096] Example 1: The chip mounting area is positioned in the central area of the circuit board, and the first position is positioned at the edge of the circuit board. FIG. 4 is a schematic diagram of a possible chip mounting area and the first position according to an embodiment of the present application. The chip mounting area 1021 is close to the geometric center on the plane of the circuit board 102. There are four first positions: position 1022a, position 1022b, position 1022c, and position 1022d. These positions are closer to the edge of the circuit board than the geometric center. It should be noted that there may be multiple possible cases arranged near the edge. This is not strictly limited in the present application. For example, the multiple first positions shown in FIG. 4(a) are provided at the multiple corners of the circuit board. In the case of another example, the multiple first positions shown in FIG. 4(b) are provided near the midpoints of the multiple edges of the circuit board. In the case of another example, the design of the first position may be further related to the circuits and electronic elements on the circuit board (for example, the first position is close to the electronic element).

[0097] Example 2: The chip mounting area is positioned on one side of the circuit board, and the first position is positioned on the other side of the circuit board. FIG. 5A is a schematic diagram of another possible chip mounting area and the first position according to an embodiment of the present application. FIG. 5B is a schematic diagram of a partial structure of another heat dissipation structure according to an embodiment of the present application. For example, the first position includes four positions (these are position 1022a, position 1022b, and position 1022c). The chip mounting area 1021 and the first position are respectively positioned on two sides of the circuit board, and there is a specific interval between the chip mounting area 1021 and the first position. The fixed connection structure 104 is positioned at the first position and fastens the circuit board 102 to the heat sink 101. The elastic connection structure 103 applies an elastic force to the heat sink 101 towards the chip mounting area.

[0098] Case 3: There are multiple chip mounting areas, and the first position includes positions positioned between the multiple chip mounting areas. FIG. 6A is a schematic diagram of still another possible chip mounting area and the first position according to an embodiment of the present application. FIG. 6B is a schematic diagram of a partial structure of still another heat dissipation structure according to an embodiment of the present application. For example, the first position includes six positions (which are position 1022a, position 1022b, position 1022c, position 1022d, position 1022e, and position 1022f), and there are two chip mounting areas, which are chip mounting areas 1021a and 1021b. The elastic connection structure 103 is close to the chip mounting area and applies an elastic force toward the heat sink 101 for each chip mounting area. The fixed connection structure 104 is disposed at the first position and fastens the circuit board 102 to the heat sink 101.

[0099] The fixed connection structure 104 is disposed in the middle of the plurality of chip mounting areas, whereby the floating amplitude of the circuit board 102 can be reduced, the excessive deformation amount in the chip mounting area can be avoided, and the life of the circuit board can be extended.

[0100] It should be noted that in the above-described multiple cases, in cases where the multiple cases are not mutually exclusive, they may be combined with each other. Details regarding the combined cases are not described in this specification.

[0101] [Design 2] The elastic connection structure 103 may include a spring screw, an elastic body, an elastic body, etc. The position of the elastic connection structure is not strictly limited in the present application. For example, the elastic connection structure 103 may be disposed around the chip mounting area of the circuit board. Here, the fact that the elastic connection structure 103 may be disposed around the chip mounting area of the circuit board means that the elastic connection structure 103 is positioned at the edge of the chip mounting area. In another example, the distance between the elastic connection structure 103 and the center of the chip mounting area is smaller than the distance between the fixed connection structure 104 and the center of the chip mounting area. For example, the elastic connection structure 103 may correspond to the range of the chip mounting area and may be alternatively disposed in the area of the circuit board on the side away from the heat sink.

[0102] In some scenarios, the position of the elastic connection structure 103 is related to the structure of the elastic connection structure 103. For example, when the elastic connection structure 103 needs to penetrate the circuit board or is positioned on the side of the circuit board close to the heat sink, the elastic connection structure is dispersed around the chip mounting area and forms a gap with the chip mounting area (to avoid damage to the circuits within the chip mounting area). When the elastic connection structure is positioned on the side of the circuit board away from the heat sink, the elastic connection structure 103 may be arranged on the circuit board in an area corresponding to the range of the chip mounting area.

[0103] FIG. 7 is a schematic diagram of a partial structure of a possible heat dissipation structure according to an embodiment of the present application. The elastic connection structure 103 includes a fastener 1031 and an elastic member 1032. The circuit board is provided with a through hole, and the fastener 1031 penetrates the through hole and is fastened to the heat sink 101. The elastic member 1032 has a sleeve attached to the fastener 1031 and elastically connects the fastener 1031 to the circuit board 102.

[0104] The fastener 1031 is fastened to the heat sink 101 through the through hole of the circuit board 102, and the elastic member 1032 with a sleeve attached to the fastener 1031 can be fastened in the horizontal direction (or a direction called parallel to the circuit board). Therefore, most of the deformation of the elastic member 1032 is in the vertical direction (or a direction called perpendicular to the circuit board 102), whereby the direction of the elastic force exerted by the elastic member 1032 is stabilized. In other words, through the fastening of the fastener, the elastic member can stably exert an elastic force towards the heat sink for the circuit board. According to the solution provided in the foregoing implementation form, the chip positioned within the chip mounting area is more stably attached to the heat sink, thereby improving the heat dissipation efficiency.

[0105] In order to further stabilize the elastic member 1032, in a possible solution, the end of the elastic member 1032 away from the circuit board 102 may be fixed to the fastener 1031. Of course, the elastic member 1032 may alternatively not be fastened to the fastener. For example, the fastener 1031 has a protrusion at the end away from the circuit board 102, and the end of the elastic member 1032 away from the circuit board 102 may press against the protrusion of the fastener 1031 to prevent the elastic member 1032 from slipping off the fastener.

[0106] It should be understood that since the chip mounting area of the circuit board floats up and down via the elastic member 1032, there is a space between the hole wall of the through hole of the circuit board and the fastener. For example, when the cross section of the fastener and the cross section of the through hole are cylindrical, the outer diameter of the portion of the fastener positioned in the through hole is smaller than the inner diameter of the through hole.

[0107] Optionally, in the embodiment shown in FIG. 7, the elastic connection structure 103 may be a spring screw. In this case, the fastener is a screw and the elastic member is a spring. One end of the spring faces the circuit board, and the other end of the spring presses against the protrusion of the screw. The spring is in a compressed state and applies an elastic force toward the heat sink 101 for the chip mounting area.

[0108] [Design 3] The elastic connection structure 103 may include an elastic body. The elastic body refers to a material that deforms when subjected to an external force and can be restored to its original state and original size after the external force is removed. For example, the elastic body is a spring or a polymer material that deforms greatly under a weak stress and can quickly recover to its original state and size after the stress is released. Optionally, there may be one or more elastic bodies.

[0109] FIG. 8 is a schematic diagram of a partial structure of still another possible heat dissipation structure according to an embodiment of the present application. The elastic connection structure 103 includes an elastic body 1033, and the number of the elastic bodies 1033 is 2 (this is just an example). The elastic body 1033 elastically connects the circuit board 102 to the support 106. In other words, one end of the elastic body 1033 faces the circuit board 102, and the other end of the elastic body 1033 presses against the support 106. The distance between the circuit board 102 and the support 106 is smaller than the length of the elastic body in the natural state. In other words, the elastic body is in a compressed state and can apply a "pressing force" to the circuit board 102. Correspondingly, the chip mounting area on the circuit board is "pressed" against the heat sink, whereby the chip positioned in the chip mounting area is stably attached to the heat sink. This improves the heat dissipation efficiency.

[0110] Optionally, the support 106 may be a housing or a partial housing of the heat dissipation structure. The housing surrounds to form an accommodation space, and the heat sink 101 and the circuit board 102 are positioned in the accommodation space. Further, optionally, the housing includes an upper housing and a lower housing (also called a bottom housing), and the support may specifically be the lower housing of the heat sink structure.

[0111] The above example has been described by using an example in which the support is positioned on the side of the circuit board 102 away from the heat sink 101. In a specific implementation process, the support may be positioned on the side of the circuit board close to the heat sink.

[0112] FIG. 9 is a schematic diagram of a partial structure of yet another possible heat dissipation structure according to an embodiment of the present application. The fixed boss 106b protrudes from the side wall of the housing 106a, and the fixed boss 106b is disposed on the side of the circuit board close to the heat sink. One end of the elastic body 1033 is fastened to the fixed boss 106b, and the other end of the elastic body 1033 is connected to the circuit board 102. The length of the elastic body 1033 in the natural state is smaller than the distance between the circuit board 102 and the fixed boss 106b. In this way, the elastic body 1033 is in an extended state, and a tensile force is applied to the chip mounting region of the circuit board 102 toward the heat sink 101, whereby the chip 105 can be attached in close contact with the heat sink 101.

[0113] In some possible cases, the function of the support 106 may be implemented by using the heat sink 101. In this way, a part of the heat dissipation structure is simplified, and the manufacturing cost is reduced.

[0114] FIG. 10 is a schematic diagram of yet another heat dissipation structure according to an embodiment of the present application. One end of the elastic body 1033 is fastened to the heat sink 101, and the other end of the elastic body 1033 is connected to the circuit board 102. The length of the elastic body 1033 in the natural state is smaller than the distance between the circuit board 102 and the heat sink 101. In this way, the elastic body 1033 is in an extended state, and a tensile force is applied to the chip mounting region of the circuit board 102 toward the heat sink 101, whereby the chip 105 can be attached in close contact with the heat sink 101.

[0115] It should be noted that the elastic body may be horizontally fastened by using a fastening screw, a fastening hook, a fastening groove, welding, adhesion, etc.

[0116] For example, as shown in FIG. 8, the elastic body may be fastened by using a groove provided in the support. In this mounting form, it is not necessary to provide a through hole in the circuit board, thereby reducing the complexity of the circuit design on the circuit board.

[0117] [Design 4] In some possible designs, the heat dissipation structure further includes a mainboard, which is electrically connected to the circuit board 102. The mainboard, also known as the main circuit board, system board, or motherboard, is the basic circuit board in a device (or controller). Each of the circuit board 102 and the mainboard may be a printed circuit board (PCB).

[0118] Generally, when the heat dissipation structure includes both the mainboard and the circuit board, the area of the mainboard is larger than the area of the circuit board 102. Of course, in some scenarios, due to the simplified design of the mainboard, the area of the mainboard may alternatively be smaller than the area of the circuit board 102. When the heat dissipation structure includes both the mainboard and the circuit board 102, the circuit board 102 may alternatively be called a transfer circuit board or an expansion circuit board.

[0119] The electrical connection between the mainboard and the circuit board 102 may be implemented by using a connector. The connector may include a board-to-board (BTB) connector, a flexible circuit board, a flexible connector, a cable, etc. This setting meets the different customer requirements for different types of chips and has high applicability. Furthermore, when the performance of the chip needs to be upgraded, only the chip 105 and the circuit board 102 need to be replaced. Therefore, it has strong evolutionary ability and low upgrade and replacement costs. Additionally, the above implementation form can further meet the requirements for adding or deleting chips, thereby improving the flexibility of components.

[0120] FIG. 11 is a schematic diagram of a partial structure of yet another possible heat dissipation structure according to an embodiment of the present application. The main board 107 is connected to the circuit board 102 by using a connector 108. One end of the connector 108 is connected to the circuit board 102, and the other end of the connector 108 is connected to the main board 107. This setting can meet the user's requirements for different types of chips and has high applicability. When the chip is replaced, only the chip 105 and the circuit board 102 need to be replaced.

[0121] Furthermore, the embodiment shown in FIG. 11 can meet the requirements for adding or removing chips, thereby improving the flexibility of components. For example, vehicle-mounted chips are used. If the chips need to be installed in a specific type of vehicle, only a plurality of circuit boards 102 need to be connected to the main board 107, thereby implementing control with high convenience of computing power.

[0122] In some scenarios, the connector may be a flexible conductive member, such as the aforementioned flexible circuit board, flexible connector, or cable. The flexible conductive member may implement signal interconnection between the circuit board 102 and the main board 107, and the flexible characteristics of the flexible conductive member can ensure the reliability of electrical connection when the circuit board floats up and down.

[0123] Since the connector needs to implement an electrical connection between the circuit board and the main board to improve signal connection stability, the connector may be arranged at a position close to the fixed connection structure.

[0124] In a possible implementation form, the distance between the connector and the first fixed connection structure is smaller than the distance between the connector and any elastic connection structure. The first fixed connection structure in this specification belongs to at least one fixed connection structure.

[0125] [Design 5] A plurality of electronic components may be arranged on a circuit board, or the circuit board may be connected to a plurality of electronic components. Different electronic components can withstand different stresses. Stress includes, but is not limited to, internal forces per unit cross-sectional area of an object caused by factors such as external forces, non-uniform temperature fields, and permanent deformation of the object. Stress may be used to describe the structural strength of an electronic component.

[0126] For example, in the case of an electronic component connected to a circuit board, when the circuit board 102 floats in an arbitrary region, a large stress is generated in the floating process, and the stress affects the electronic components in that region. If the stress exceeds the stress that the electronic component can withstand, failures or damages of the electronic component may be caused.

[0127] In this embodiment of the present application, the stress-sensitive component is arranged at a position close to the fixed connection structure. For example, the stress-sensitive component includes a BTB connector, a crystal oscillator, a ceramic capacitor, a microphone component, or an electronic component packaged by using a ball grid array (BGA) packaging technology.

[0128] Since the fixed connection structure implements a fixed connection, in a vibration scenario, the deformation of the circuit board around the fixed connection structure 104 is small. The stress-sensitive component is arranged at a position close to the fixed connection structure 104 to prevent the circuit board 102 from deformation caused by the elastic force provided by the elastic connection structure 103, and to prevent the stress-sensitive component connected to the circuit board 102 from damage or poor connection.

[0129] The following lists several possible implementation forms in which the stress-sensitive component is arranged near the fixed connection structure.

[0130] Embodiment 1: The distance between the stress-sensitive component and the first fixed connection structure is smaller than the distance between the stress-sensitive component and any elastic fastening structure, and the first fixed connection structure is one of at least one fixed connection structure. That is, the stress-sensitive component is close to the fixed connection structure.

[0131] Embodiment 2: The distance between the stress-sensitive component and the fixed connection structure is less than or equal to N millimeters (mm), where N is a positive number. For example, N is 10 mm, 30 mm, 50 mm, or 100 mm. Optionally, N is related to the rigidity of the circuit board and / or the strength of the fixed connection structure.

[0132] Embodiment 3: The distance between the stress-sensitive component and the elastic connection structure is greater than or equal to M millimeters (mm), where M is a positive number. For example, M is 5 mm, 10 mm, or 50 mm. In this way, it is equivalent to having a component-free region provided around the elastic connection structure, whereby the stress-sensitive component maintains a specific and reliable distance from the elastic connection structure 103. Optionally, N is related to the rigidity of the circuit board and / or the strength of the fixed connection structure.

[0133] Note that the stress-sensitive components listed above are merely examples. In a specific implementation process, the determination of the stress-sensitive component is related to the stress sensitivity of the electronic component or the allowable deformation amount of the electronic component (the more sensitive the electronic device is to stress, the smaller the allowable deformation amount of the electronic device). Alternatively, whether an electronic component belongs to the stress-sensitive component is determined by using a predefined and preconfigured decision rule. Alternatively, a stress measurement device may be used to determine the stress that the electronic component can withstand. When the stress that can be withstood is less than or equal to a threshold value, the electronic component belongs to the stress-sensitive component.

[0134] In yet another possible solution, the deformation range of each position on the circuit board is related to the elastic connection structure and the fixed connection structure on the circuit board. The closer to the position of the fixed connection structure, the lower the upper limit of the deformation amount. The closer to the position of the elastic connection structure, the higher the upper limit of the deformation amount.

[0135] Therefore, when the positions of the electronic elements are designed, the deformation range of each position on the circuit board and the allowable deformation amount of the electronic elements may be designed. When the allowable deformation amount of the electronic element is smaller than the maximum deformation amount of the circuit board at position A, the electronic element is a stress-sensitive component with respect to position A, and the electronic device cannot be arranged at position A. When the allowable deformation amount of the electronic element is larger than the maximum deformation amount of the circuit board at position B, the electronic device can be arranged at position B.

[0136] In yet another possible solution, the stress at different positions on the circuit board can be determined by a simulation test or a simulation test. In this case, the arrangement of the electronic elements on the circuit board may be determined based on the allowable stress of the electronic elements and the stress distribution on the circuit board.

[0137] [Design 6] To improve the balance of the elastic force, the heat dissipation device may further include a support, and the support is configured to withstand the elastic force provided by the elastic connection structure 103.

[0138] FIG. 12 is a schematic diagram of a partial structure of yet another possible heat dissipation structure according to an embodiment of the present application. The support 109 is fastened to the circuit board 102. The elastic force of the elastic connection structure 103 acts on the support 109 and is applied to the circuit board 102 through the support 109.

[0139] The support 109 can improve the rigidity of the chip mounting area. The elastic force of the elastic connection structure 103 is applied to the chip mounting area by using the support 109. As a result, the overall shape of the chip mounting area can be ensured, the flatness of the chip mounting area is not affected, the reliability of the connection between the chip 105 and the circuit board 102 is ensured, and the consistency and balance of the elastic top holding force applied between the chip 105 and the heat sink 101 can be ensured.

[0140] Optionally, the support may be rectangular, square, frame type, etc.

[0141] For example, the support 109 may be of a frame type. The frame type support 109 is surrounded so as to form a plane. The elastic force of the elastic connection structure 103 acts on the support 109 and is uniformly applied to the circuit board 102. This prevents the force applied by the elastic connection structure from directly acting on the circuit board and damaging the circuit board. The support 109 is particularly applicable to mobile terminals or wearable terminals. In a vibration scenario, the support 109 can effectively increase the stress area of the circuit board and ensure the consistency and balance of the elastic top holding force applied between the chip 105 and the heat sink 101. Furthermore, the hollow part of the frame type support is used to arrange protrusions or electronic elements having a specific height, thereby increasing the usable area of the circuit board.

[0142] Optionally, the support may be fastened to the circuit board. Optionally, the support may be fastened by using the elastic connection structure 103. Alternatively, optionally, the support may be fastened by using fastening screws, fastening connectors, etc.

[0143] In a possible implementation form, as shown in the embodiment of FIG. 7 and the like, when the elastic connection structure 103 includes a fastener 1031, the fastener may be alternatively configured to fasten the support to the circuit board.

[0144] Of course, if the elastic connection structure does not include fasteners, another connector may alternatively be used to fasten the support to the circuit board.

[0145] The embodiments shown in FIGS. 1 to 12 include many possible implementation solutions. The following will describe some of the implementation solutions by using examples with reference to FIGS. 13A, 13B, 14, 15A, 15B, and 16. It should be noted that for related concepts, connection relationships, and functional effects not described below, refer to the corresponding descriptions of the foregoing embodiments.

[0146] The heat dissipation structure in the embodiments of the present application may be used in a plurality of devices having heat dissipation requirements. For example, the heat dissipation structure may be used in devices such as intelligent terminal devices, network devices, equipment room devices, industrial devices, transportation devices, or recreation and entertainment devices. Intelligent terminal devices are, for example, mobile phones, tablet computers, notebook computers, smart bands, smart watches, or smart glasses. Network devices are, for example, metro routers, central routers, or base stations. Equipment room devices are, for example, data center servers or data center switches. Industrial devices are, for example, industrial robots and robot arms. Transportation devices are, for example, vehicles, ships, aircraft, railway transportation (e.g., subways or high-speed railways), or logistics robots. Recreation and entertainment devices are, for example, virtual reality (VR) devices, mixed reality (MR) devices, massage chairs, or 4D cinema cockpits. This is not strictly limited in the embodiments of the present application.

[0147] The following uses, as an example for explanation, the heat dissipation structure used in a vehicle.

[0148] One embodiment of the present application further provides a vehicle-mounted device including a chip and the heat dissipation structure provided in the foregoing embodiment. The heat dissipation structure includes a heat sink 101, a circuit board 102, an elastic connection structure 103, and a fixed connection structure 104. The chip is disposed in a chip mounting region on the circuit board 102. The heat dissipation structure is configured to provide stable heat dissipation to the chip in the vehicle-mounted device.

[0149] Specifically, the elastic connection structure 103 of the heat sink may apply an elastic force toward the heat sink 101 with respect to the chip mounting region to maintain a thermally conductive connection between the chip and the heat sink in the heat dissipation structure. The fixed connection structure 104 can fasten the circuit board on which the chip is positioned, thereby improving the stability of the vehicle-mounted device and implementing heat dissipation of the chip.

[0150] The foregoing vehicle-mounted device may be, for example, an intelligent driving calculation module, a cockpit domain controller, a vehicle domain controller (VDC), a vehicle integrated unit, or a power module. The vehicle-mounted device may be mounted at a position such as an engine room, a cockpit, a glove box of a relief driver, or a front part of an electric vehicle. These positions have a high ambient temperature and an insufficient heat dissipation environment. With the development of intelligent vehicles, the power consumption of vehicle-mounted chips continues to increase, and the requirement for heat dissipation efficiency is also increasing. Furthermore, bumps are often generated during the driving process of the vehicle, and thus the vehicle-mounted device often generates vibrations. In this case, the structure of the vehicle-mounted device needs to be stable. In short, the vehicle-mounted device requires a stable structure and a heat dissipation structure with high heat dissipation efficiency.

[0151] For example, the vehicle-mounted device is an intelligent driving module. Intelligent driving in this specification may be assisted driving, driverless driving, etc. For example, the Advanced Driving Assistance System (ADAS) is an assisted driving system. ADAS can use various sensing devices (including visual system sensors such as cameras, camera lenses, and radar system sensors) installed in the vehicle to sense the surrounding environment, detect, and recognize objects (including pedestrians). ADAS can perform systematic calculations and analyses of the driving environment based on map data, etc., and plan driving routes and driving operations. It can be known that ADAS needs to perform calculations and analyses on a large amount of data and output a large amount of calculation data and / or control signals. When the intelligent driving chip has a risk of overheating, the lives of passengers are extremely likely to be endangered. Therefore, stable and efficient heat dissipation needs to be provided for the intelligent driving chip.

[0152] FIGS. 13A and 13B are schematic diagrams of a partial structure of a vehicle-mounted device according to an embodiment of the present application. As shown in FIGS. 13A and 13B, the vehicle-mounted device includes a chip 105, a heat sink 101, a circuit board 102, an elastic connection structure 103, a fixed connection structure 104, a main board 107, a connector 108, a support 109, and a heat conduction medium.

[0153] The fixed connection structure 104 fastens the circuit board 102 to the heat sink 101 to prevent the circuit board 102 from sliding in the horizontal direction. The pressure applied to the elastic connection structure 103 acts on the support 109, whereby the heat dissipation bosses 1011 of the chip 105, the heat conduction medium, and the heat sink 101 are in close contact. The assembly tolerance between the chip 105 and the heat sink 101 is absorbed by the deformation of the chip mounting area of the circuit board 102. During operation, the heat generated by the chip 105 is transmitted to the heat sink 101 by using the heat conduction medium, and the heat is taken away by using the refrigerant flowing inside the heat sink 101.

[0154] The heat dissipation structure used in a vehicle-mounted device significantly reduces the thermal resistance between the chip and the heat sink, effectively improves the heat dissipation efficiency, improves the structural stability of the vehicle-mounted device by using fastening screws, and implements stable heat dissipation for high-power consumption chips.

[0155] In the vehicle-mounted device shown in FIGS. 13A and 13B, it should be understood that the liquid cooling heat dissipation method is just an example. Heat sinks using other heat dissipation methods are also used.

[0156] In a possible solution, the fixed connection structure 104 may be replaced with a fastening screw, the elastic connection structure 103 may be replaced with a spring screw, the connector 108 may be replaced with a BTB connector, and the support 109 is a frame-type support.

[0157] Optionally, the signal interconnection (or called electrical connection) is implemented between the main board and the circuit board by using a BTB connector. The BTB connector is arranged close to the fixed connection structure 104 to reduce the possibility of failure of the BTB connector caused by displacement.

[0158] Optionally, the stress-sensitive component is arranged in a region close to the fastening screw to avoid damage to the stress-sensitive component, extend the life of the vehicle-mounted device, and meet the reliability requirements.

[0159] Optionally, the main board may be fastened to the heat sink, thereby improving the stability of the overall structure.

[0160] Optionally, the vehicle-mounted device further includes a bottom housing 110. The bottom housing 110 is arranged on the side of the main board 107 away from the circuit board 102. The bottom housing 110 is arranged to meet the dust-proof and waterproof design requirements, and further fasten the main board, thereby improving the stability of the main board and the entire vehicle-mounted device.

[0161] Optionally, the heat sink and the bottom housing of the vehicle-mounted structure are sealed and connected so as to form an integrated plate shape.

[0162] Optionally, there may be a plurality of chips. The plurality of chips are mounted on chip mounting areas on a plurality of circuit boards, and one or more chips may be mounted on each circuit board.

[0163] The assembly process of the vehicle-mounted device is as follows: First, the heat conduction medium is installed on the heat dissipation boss 1011, and then the circuit board 102 is assembled to the heat sink 101. When the components on the circuit board 102 are installed, the fixed connection structure 104 is first installed around the circuit board 102. Second, the elastic connection structure 103 and the support 109 are integrally installed on the circuit board 102, and the elastic connection structure 103 is fastened, whereby the support 109 can be fastened to the circuit board 102. The pressure provided by the elastic connection structure 103 enables the chip 105, the heat dissipation medium, and the heat dissipation boss 1011 to be in close contact. The assembly tolerance between the chip 105 and the heat sink 101 is absorbed through the deformation of the central region of the circuit board 102. Next, the main board 107 is installed on the heat sink 101, and the main board 107 and the heat sink 101 are in signal and electrical connection via the connector 108. Finally, the bottom housing 110 is installed.

[0164] FIG. 14 is a schematic diagram of a partial structure of yet another possible vehicle-mounted device according to an embodiment of the present application. The vehicle-mounted device includes a heat sink 101, a circuit board 102, an elastic connection structure 103, a fixed connection structure 104, a chip 105, and a main board 107. In the vehicle-mounted device shown in FIG. 14, there are two heat dissipation structures. The circuit boards in the two heat dissipation structures are electrically connected to the main board. Each circuit board is connected to the main board 107 by using a connector 108.

[0165] In a possible solution, the vehicle-mounted device further includes a support 109, and the support 109 is disposed on part or all of the circuit board to provide a balanced elastic force to the chip mounting area within the circuit board. For related explanations, please refer to the foregoing description. Details are not repeated here again.

[0166] In a possible solution, a heat dissipation boss 1011 is disposed on the heat sink 101. The elastic connection structure 103 provides an elastic force to the chip mounting area to implement a close attachment between the chip 105, the heat conduction medium, and the heat dissipation boss 1011, thereby specifically dissipating the heat of the chip and improving the heat dissipation efficiency.

[0167] In a possible solution, a fixing boss 1012 is disposed on the side wall of the heat sink 101, and the main board 107 within the vehicle-mounted device is fastened to the fixing boss 1012. For example, the main board 107 is fastened to the fixing boss 1012 by using a fastening member 111.

[0168] In a possible solution, the heat dissipation device further includes a bottom housing 110. It should be noted that the bottom housing 110 specifically refers to the housing (or a part of the housing) on the side of the circuit board away from the heat sink.

[0169] Optionally, the bottom housing 110 may meet the dust-proof and waterproof design requirements and be attached to the heat sink 101 to improve the stability of the vehicle-mounted device. Optionally, the attachment in this specification may be an attachment in a manner such as adhesion, engagement, or fastening by using a connector.

[0170] The foregoing describes the heat dissipation structure in which the circuit board is connected to the main board. The following describes a case where the circuit board 102 is the main board.

[0171] Figures 15A and 15B are schematic diagrams of the partial structure of yet another vehicle-mounted device according to an embodiment of the present application. As shown in Figures 15A and 15B, the vehicle-mounted device includes a chip 105, a heat sink 101, a circuit board 102, an elastic connection structure 103, a fixed connection structure 104, a support 109, and a heat conduction medium.

[0172] The fixed connection structure 104 fastens the circuit board 102 to the heat sink 101 to prevent the circuit board 102 from sliding horizontally. The pressure applied by the spring screw acts on the support, whereby the heat dissipation bosses 1011 of the chip 105, the heat conduction medium, and the heat sink 101 are in close contact. The assembly tolerance between the chip 105 and the heat sink 101 is absorbed by the deformation of the chip mounting area of the circuit board 102. During operation, the heat generated by the chip 105 is transferred to the heat sink 101 by using the heat conduction medium, and the heat is taken away by using the refrigerant flowing inside the heat sink 101.

[0173] The heat dissipation structure used in the vehicle-mounted device greatly reduces the thermal resistance between the chip and the heat sink, effectively improves the heat dissipation efficiency, improves the structural stability of the vehicle-mounted device by using the fixed connection structure 104, and implements stable heat dissipation for high-power consumption chips.

[0174] It should be understood that in the vehicle-mounted device shown in Figures 15A and 15B, the liquid cooling heat dissipation method is only an example. Heat sinks using other heat dissipation methods are also used.

[0175] Optionally, the stress-sensitive component is arranged in the area near the fixed connection structure 104 to avoid damage to the stress-sensitive component, extend the life of the vehicle-mounted device, and meet the reliability requirements.

[0176] Optionally, the vehicle-mounted device further includes a bottom housing 110. The bottom housing 110 is disposed on the side of the circuit board 102 away from the heat sink 101. The bottom housing is disposed, whereby the design requirements for dust and water protection can be satisfied, and the stability of the vehicle-mounted device is improved.

[0177] The assembly process of the vehicle-mounted device is as follows: First, a heat conduction medium is installed on the heat dissipation boss 1011, and the circuit board 102 may be configured on the heat sink 101 by using the fixed connection structure 104. Next, the support 109 and the elastic connection structure 103 are installed on the circuit board 102 and the heat sink 101, and the elastic connection structure 103 is fastened. The pressure provided by the elastic connection structure 103 enables the chip 105, the heat dissipation medium, and the heat dissipation boss 1011 to be in close contact. The assembly tolerance between the chip 105 and the heat sink 101 is absorbed through the deformation of the central region of the circuit board 102. Finally, the bottom housing 110 is installed.

[0178] The foregoing describes an elastic connection structure including a spring screw. The following describes a vehicle-mounted device using an elastic body as the elastic connection structure.

[0179] FIG. 16 is a schematic diagram of a partial structure of still another vehicle-mounted device according to an embodiment of the present application. As shown in FIG. 16, the vehicle-mounted device includes a chip 105, a heat sink 101, a circuit board 102, an elastic body 1033, a fixed connection structure 104, a support 109, a bottom housing 110, and a heat conduction medium.

[0180] The fixed connection structure 104 fastens the circuit board 102 to the heat sink 101 to prevent the circuit board 102 from sliding horizontally. The elastic body 1033 may be pre-installed in the bottom housing 110 or installed on the support 109. The pressure applied by the elastic body 1033 acts on the support 109, whereby the chip 105, the heat conduction medium, and the heat dissipation boss 1011 are in close contact. The assembly tolerance between the chip 105 and the heat sink 101 is absorbed by the deformation of the chip mounting area of the circuit board 102. During operation, the heat generated by the chip 105 is transmitted to the heat sink 101 by using the heat conduction medium, and the heat is taken away by using the refrigerant flowing inside the heat sink 101.

[0181] The heat dissipation structure used in the vehicle-mounted device greatly reduces the thermal resistance between the chip and the heat sink, effectively improves the heat dissipation efficiency, improves the structural stability of the vehicle-mounted device by using fastening screws, and implements stable heat dissipation for high-power consumption chips. In this implementation form, the bottom housing not only participates in providing the accommodation space but also has the function of supporting the elastic body. The elastic connection structure arranged in this way does not need to be abutted against the circuit board, thereby reducing the complexity of the circuit design on the circuit board.

[0182] It should be understood that in the vehicle-mounted device shown in FIG. 16, the liquid cooling heat dissipation method is just an example. Heat sinks using other heat dissipation methods are also used.

[0183] Optionally, the stress-sensitive component is arranged in the area near the fixed connection structure 104 to avoid damage to the stress-sensitive component, extend the life of the vehicle-mounted device, and meet the reliability requirements.

[0184] Optionally, the vehicle-mounted device further includes a bottom housing 110. The bottom housing 110 is disposed on the side of the circuit board 102 away from the heat sink 101. The bottom housing is disposed, whereby the design requirements for dust and water protection can be satisfied, and the stability of the vehicle-mounted device is improved.

[0185] One embodiment of the present application further provides a terminal. The terminal includes the heat dissipation structure or the vehicle-mounted device described above.

[0186] Optionally, the terminal may be a mobile terminal (e.g., a vehicle), a handheld terminal, a wearable device, a transportation tool, a recreational device, or another intelligent device or transportation tool.

[0187] It should be noted that the foregoing embodiments are only used to illustrate the technical solutions of the embodiments of the present application and do not limit the technical solutions. Although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand the following: The technical solutions described in the foregoing embodiments may still be modified, or some or all of their technical features may be equivalently replaced. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

[0188] In the description of the present application, the directions or positional relationships indicated by terms such as "center", "above", "below", "vertical", "horizontal", "inside", "outside", etc. are the directions or positional relationships based on the accompanying drawings, and are only intended to facilitate and simplify the description of the present application, and do not indicate or imply that the device or element needs to have a specific direction, be configured and operated in a specific direction, and thus cannot be understood as a limitation to the present application.

[0189] In the description of this application, unless otherwise specifically stated or limited, the term "connection" should be understood in a broad sense. For example, "connection" may be a fixed connection, a removable connection, an integral connection, a pressing connection or an integral connection. The contact of the connection may be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in this application can be understood based on specific situations.

[0190] In the embodiments of this application, terms such as "example" and "for example" are used to give examples, illustrative examples, or explanations. Any embodiment or design method described as an "example" or "for example" in this application should not be described as being more preferable than another embodiment or design method, or having more advantages than another embodiment or design method. Strictly speaking, the use of terms such as "example" and "for example" is intended to present related concepts in a specific way.

[0191] In the embodiments of this application, "at least one" means one or more, and "a plurality of" means two or more. "At least one of the following items (parts)" or similar expressions refer to any combination of these items, including a single item (part) or any combination of a plurality of items (parts). For example, at least one of a, b, or c may indicate a, b, c, (a and b), (a and c), (b and c), or (a, b, and c), and a, b, and c may be singular or plural. The term "and / or" describes the association relationship between related objects and indicates that three relationships may exist. For example, A and / or B may indicate the following three cases, namely, the case where only A exists, the case where both A and B exist, and the case where only B exists, and A and B may be singular or plural. The character " / " usually indicates an "or" relationship between related objects.

[0192] Furthermore, unless otherwise specified, ordinal numbers such as "first" and "second" in the embodiments of the present application are for distinguishing between a plurality of objects, and are not intended to limit the order, time series, priority, or importance of the plurality of objects. For example, the first fastening structure and the second fastening structure are merely for facilitating explanation, and do not indicate a difference between the first fastening structure and the second fastening structure in terms of items such as material, installation order, importance, etc. In some embodiments, the first fastening structure and the second fastening structure may alternatively be the same optical signal.

Explanation of Reference Numerals

[0193] 101 Heat sink 1011 Heat dissipation boss 1012 Fixed boss 102 Circuit board 1021 (and 1021x) Chip mounting area 1022x First position 103 Elastic connection structure 1031 Fastener 1032 Elastic member 1033 Elastic body 104 Fixed connection structure 105 Chip 106 Support 106a Housing 106b Fixed boss on the housing 107 Main board 108 Connector 109 Support 110 Bottom housing 111 Main board fastening member

Claims

1. A heat dissipation structure comprising a heat sink, a circuit board, at least one fixed connection structure, and at least one elastic connection structure, at least one chip mounting area and at least one first position are provided on the circuit board, and the at least one first position is positioned outside the chip mounting area, the at least one fixed connection structure is positioned at the at least one first position to fasten the circuit board to the heat sink, and the at least one elastic connection structure is configured to apply an elastic force toward the heat sink with respect to the chip mounting area. A heat dissipation structure.

2. The at least one elastic connection structure includes a fastener and an elastic member, a through hole is provided in the circuit board, and the fastener passes through the through hole and is fastened to the heat sink, and The elastic member is sleeved on the fastener and is elastically connected to the fastener and the surface of the circuit board away from the heat sink. The heat dissipation structure according to claim 1.

3. The at least one fixed connection structure is configured to position the circuit board in the horizontal direction. The heat dissipation structure according to claim 2.

4. The at least one elastic connection structure is an elastic body, and the elastic body is elastically connected between the circuit board and a support. The heat dissipation structure according to claim 1.

5. The support is positioned on the side of the circuit board away from the heat sink. The heat dissipation structure according to claim 4.

6. The support is the housing of the heat dissipation structure. The heat dissipation structure according to claim 4 or 5.

7. The circuit board of the heat dissipation structure is connected to a stress-sensitive component, and the distance between the stress-sensitive component and the first fixed connection structure is smaller than the distance between the stress-sensitive component and any elastic connection structure, and the first fixed connection structure belongs to the at least one fixed connection structure. The heat dissipation structure according to any one of claims 1 to 6.

8. The heat dissipation structure further includes a board-to-board BTB connector and a main board. One end of the BTB connector is connected to the circuit board, and the other end of the BTB connector is connected to the main board. The heat dissipation structure according to any one of claims 1 to 7.

9. The distance between the BTB connector and the second fixed connection structure is smaller than the distance between the BTB connector and any elastic connection structure, and the second fixed connection structure belongs to the at least one fixed connection structure. The heat dissipation structure according to claim 8.

10. There is one chip mounting area on the circuit board, the first position is positioned at the edge of the circuit board, the chip mounting area is positioned in the central area of the circuit board, or, There are at least two chip mounting areas on the circuit board, the first position is positioned between the at least two chip mounting areas, or, The chip mounting area is positioned on one side of the circuit board, and the first position is positioned on another side of the circuit board. The heat dissipation structure according to any one of claims 1 to 9.

11. The heat dissipation structure further includes a support, the support is fastened to the circuit board, the elastic force of the at least one elastic connection structure acts on the support, and the elastic force of the at least one elastic connection structure is applied to the circuit board by using the support. The heat dissipation structure according to any one of claims 1 to 10.

12. The heat dissipation structure according to any one of claims 1 to 11, which is used in an automatic driving controller, a cockpit domain controller, or a vehicle domain controller.

13. A vehicle-mounted device, comprising the heat dissipation structure according to any one of claims 1 to 12, and at least one chip, wherein the at least one chip is disposed in at least one chip mounting area on a circuit board of the heat dissipation structure.

14. The vehicle-mounted device according to claim 13, wherein at least one elastic connection structure in a heat sink is configured to maintain a heat conduction connection between the at least one chip and the heat sink in the heat dissipation structure.

15. The vehicle-mounted device further comprises a main board, there are a plurality of chips, and there are at least two heat dissipation structures. The plurality of chips are mounted in chip mounting areas on a circuit board in the at least two heat dissipation structures, and The main board is electrically connected to the circuit boards in the plurality of heat dissipation structures. The vehicle-mounted device according to claim 13 or 14.

16. The vehicle-mounted device according to any one of claims 13 to 15, wherein the vehicle-mounted device is an integrated plate-shaped structure.

17. The vehicle-mounted device according to claim 13 or 14, which is used in an automatic driving controller, a cockpit domain controller, or a vehicle domain controller.

18. A terminal device, comprising the heat dissipation structure according to any one of claims 1 to 12, or the vehicle-mounted device according to any one of claims 13 to 17.

19. The terminal device according to claim 18, wherein the terminal device is a vehicle, a robot, or a drone.

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