Light Guide Housing for Micro Spectrometer

Abstract

A spectrometer housing (116) configured to at least partially surround at least one detector (112) and at least one emitter (114) of a spectrometer module (110) is disclosed. The spectrometer housing (116) includes the following: - A frame element (130); - A lid element (132) connected to the frame element (130); - A separation element (134) disposed within the frame element (130); - A reflector element (136) disposed on at least a part of one or both of the lid element (132) and the frame element (130) and - An interface element (144). An inlet opening (138) is formed by at least the lid element (132) and the frame element (130). On the side opposite to the inlet opening (138), at least two mounting openings (124) are formed by at least the lid element (132) and the frame element (130). The at least two mounting openings (124) are separated by the separation element (134). The frame element (130) and the separation element (134) are integrally formed from the same material, and the interface element (144) is configured to cover the inlet opening (138). Further, a method of manufacturing a spectrometer module (110), a method of manufacturing a spectrometer housing (116), and a method of manufacturing a spectrometer module (110) are disclosed.

Description

Technical Field

[0001] The present invention relates to a spectrometer housing, a spectrometer module, a method for manufacturing at least one spectrometer housing, and a method for manufacturing a spectrometer module. Generally, such devices and methods can be employed in various applications. Specifically, they can be used for the purpose of investigation or monitoring in the infrared (IR) spectral region, more specifically in the near-infrared (NIR) spectral region. However, further types of applications are also possible.

Background Art

[0002] Commercially available complete spectrometer modules in which an emitter, a detector, and all electronic circuits are integrated are generally still larger than 10 cm 3 in size. Such spectrometer modules are generally far from being incorporated into consumer electronic devices such as smartphones and wearables that require a much smaller form factor, for example less than 1 cm 3 . Specifically, mirrors that maximize the irradiance of the sample and are compatible with spectrometers less than 1 cm 3 in size are not yet commercially available. Miniaturized spectrometer modules can be classified into mini-, micro-, and chip-size spectrometer modules based on volume. Currently, the volume of "chip-size" spectrometer modules is usually less than 1 cm 3 . However, chip-size spectrometer modules are still subsystems and their design cannot include an emitter or electronic devices. Integrating an emitter and a detector into a small form factor less than 1 cm 3 in size is generally difficult and not yet commercially available. The following are some examples that are available but bulky and expensive.

[0003] Miniaturized spectrometer modules are commercially available, for example, from Spectral Engines GmbH in Steinbach, Germany, and Insion GmbH in Oberursel, Germany. Thus, as an example, a spectrometer module with a housing that uses a tungsten lamp as a light source and has an interchangeable reflective optical system is available. Other modules use, for example, micro-injection molding technology for the manufacture of optical diffraction gratings. However, these commercially available spectrometer modules generally have a size much larger than 1 cm 3 or much larger than 10 cm 3 and are generally difficult to integrate into smartphones or tablet computers. Furthermore, Apple in Cupertino, USA, has adopted integrated light guiding in smartphones equipped with dot projectors. Microprisms are used for light guiding. However, microprisms are additional and expensive components that increase the cost of the spectrometer module.

[0004] Despite the advantages implied by the above-described devices and methods, there is still a need for improvement. Specifically, the above examples are still too bulky to be incorporated into a form factor suitable for consumer electronics such as smartphones or tablet computers. Furthermore, there is still a need to reduce manufacturing costs and component costs. SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0005] Therefore, it is desirable to provide a spectrometer module and a method for manufacturing the same that at least substantially avoid the disadvantages of this type of known device and method. Specifically, it is desirable to provide a miniaturized, cost-effective spectrometer housing for at least partially surrounding the spectrometer module, specifically for incorporation into consumer electronics such as smartphones, wearables, or tablets.

[0006] This problem is solved by a spectrometer housing having the features of the independent claims, a spectrometer module, a method for manufacturing at least one spectrometer housing, and a method for manufacturing a spectrometer module. Advantageous embodiments that can be realized in an independent manner or in any combination are described in the dependent claims and throughout the specification.

Means for Solving the Problem

[0007] In a first aspect of the present invention, a spectrometer housing is disclosed. As used herein, the term "spectrometer" is a broad term and should be given its ordinary and customary meaning to those skilled in the art and should not be limited to a special or customized meaning. Specifically, this term may represent, without limitation, an apparatus or system configured to record at least one measurement value for at least one signal intensity associated with at least one corresponding signal wavelength of optical radiation and to evaluate at least one measurement signal associated with the signal intensity to determine spectral information such as information regarding at least one spectrum of at least one object. As used herein, the term "spectrum" is a broad term including its grammatical variations and should be given its ordinary and customary meaning to those skilled in the art and should not be limited to a special or customized meaning. Specifically, this term may, without limitation, represent a partitioning of optical radiation, and a spectrum is composed of optical signals defined by signal wavelengths and corresponding signal intensities. In particular, a spectrum may include spectral information related to at least one measurement object, for example, the type and composition of at least one material forming at least one measurement object, which can be determined by recording at least one spectrum related to at least one measurement object. As used herein, the term "spectrometer module" is a broad term and should be given its ordinary and customary meaning to those skilled in the art and should not be limited to a special or customized meaning. Specifically, this term may, without limitation, represent a spectrometer that is part of a system, specifically, part of a modular system, such as a smartphone, and a modular system includes a plurality of interacting and / or autonomous functional modules. The spectrometer module may be configured for at least one of performing at least one specific task within the system and communicating with further elements of the system. Further options may also be realizable.

[0008] As used herein, the term "system" is a broad term, given its ordinary and customary meaning to those of ordinary skill in the art, and is not limited to a special or customized meaning. Without particular limitation, this term may represent any set of interacting or interdependent components or parts that form a whole. Specifically, these components may interact with each other to perform at least one common function. At least two components may be handled independently or may be combinable or connectable. As used herein, the term "module", including its grammatical variations, is a broad term and should be given its ordinary and customary meaning to those of ordinary skill in the art, and is not limited to a special or customized meaning. Without particular limitation, this term may represent at least one element of a system, for example, exactly one element of a system. This element may be a subsystem including at least one further element. At least two modules of a system may share elements of an electronic device such as a circuit board. As an example, the system may be a smartphone and / or wearable, i.e., a smartwatch, including a spectrometer module, a touch display module, and a circuit board, and both the spectrometer module and the touch display module may be controlled using the circuit board. Various further options are possible, which are generally known to those of ordinary skill in the art. A modular system can, in particular, facilitate the manufacture and maintenance of the system. A module may be replaceable within the system, for example, by another module of the same type. Thus, specifically, the term "module" may represent a functional unit that forms part of a system and can perform at least one function, by itself and / or in interaction with one or more other modules, as understood by those of ordinary skill in the art, and may, as an example, be formed as a unit.

[0009] As used herein, the term "housing" is a broad term and is given its ordinary and customary meaning to those of ordinary skill in the art and is not limited to a special or customized meaning. Specifically, without limitation, this term may represent a mechanical cover configured to at least partially shield elements therein. The housing may specifically be configured to at least partially shield elements therein from external influences of a mechanical nature such as collision with a further object and / or vibration. The housing may include at least one wall, specifically at least one rigid and non-deformable wall. The housing may more specifically be configured to at least partially shield electromagnetic radiation such as light radiation or heat radiation. The housing, specifically at least one wall of the housing, may include at least one opening such as an opening through which light radiation can pass. As an example, the housing may be made entirely or partially of at least one rigid material such as at least one plastic material and / or at least one metal material. As will be outlined in more detail below, the housing may specifically be made entirely or partially of at least one molded plastic material.

[0010] As used herein, the term "spectrometer housing" is a broad term and should be given its ordinary and customary meaning to those of ordinary skill in the art and is not limited to a special or customized meaning. Specifically, but not limited to, this term may represent a housing for at least one spectrometer, specifically for at least one spectrometer module. The spectrometer housing may be configured to cover the spectrometer module within a system such as within a smartphone. The spectrometer housing may be configured to cover the spectrometer module outside the system, for example, under ambient conditions, for example, when removing the spectrometer module for maintenance purposes. As will be outlined in more detail below, the spectrometer housing may specifically be configured to guide light radiation within the spectrometer module, for example, by using reflector elements, such as for defining the radiation intensity angle, specifically for maximizing the irradiance of the measurement object. Also, as will be outlined in more detail below, the spectrometer housing may specifically be a miniaturized spectrometer housing, for example, a miniaturized spectrometer housing configured to be incorporated into at least one of a smartphone and a tablet.

[0011] The spectrometer housing is configured to at least partially surround at least one detector and at least one emitter of the spectrometer module. Specifically, the spectrometer housing may be configured to surround the entire spectrometer module. The spectrometer housing may be configured to surround the entire detector of the spectrometer module. The spectrometer housing may be configured to surround the entire emitter of the spectrometer module. The spectrometer housing may be configured to surround only a part of the detector of the spectrometer module. The spectrometer housing may be configured to surround only a part of the emitter of the spectrometer module. The spectrometer housing may be configured to surround at least one further optional component of the spectrometer module or at least a part thereof.

[0012] As used herein, the term "detector" is a broad term and is given its ordinary and customary meaning to those skilled in the art and is not limited to a special or customized meaning. Specifically, this term may be used to represent, without limitation, a photosensor configured to detect or measure light radiation, such as for detecting illumination and / or a light spot generated by at least one light beam. The detector may specifically include at least one light-receiving region. The light-receiving region may be configured to be illuminated, that is, to receive light radiation, and to generate at least one signal, such as an electrical signal, in response to the illumination. The light-receiving region may be disposed on the surface of the photodetector. The light-receiving region may specifically be a single, closed, uniform light-receiving region. However, other options may also be feasible.

[0013] As used herein, the term "illumination" is a broad term and should be given its ordinary and customary meaning to those skilled in the art and should not be limited to a special or customized meaning. Specifically, this term may represent, without limitation, light radiation within at least one of the visible, ultraviolet, or infrared spectral ranges. The term "ultraviolet" generally represents electromagnetic radiation having a wavelength of 1 nm to 380 nm, preferably 100 nm to 380 nm. Further, the term "visible" generally represents a wavelength of 380 nm to 760 nm. Further, the term "infrared", abbreviated as "IR", generally represents a wavelength of 760 nm to 1000 μm, and a wavelength of 760 nm to 3 μm is usually referred to as "near infrared", abbreviated as "NIR". Preferably, the illumination used for typical purposes of the present invention is IR radiation, more preferably NIR radiation, particularly radiation having a wavelength of 760 nm to 3 μm, preferably 1 μm to 3 μm. The illumination may specifically be light radiation incident on the photodetector, more specifically the light-receiving region. In this specification, the term "illumination" may also be referred to as "light radiation" or "light".

[0014] Illumination may be provided by at least one object to be measured, and the provision may include at least one of reflection, transmission, and radiation. Specifically, before interacting with the object to be measured, the light radiation may be emitted, for example, by at least one emitter. The term "emitter" as used herein is a broad term and is given its ordinary and customary meaning to those skilled in the art and is not limited to a special or customized meaning. This term specifically, but not limited to, may represent a device configured to emit or send out light radiation. The emitter may be configured to emit light radiation towards the object to be measured, such as in the form of a light beam. The emitter may be configured to emit the light radiation isotropically, for example, uniformly in all spatial directions, and only a part of the emitted light radiation may impinge on the object to be measured. The emitter may include at least one of a semiconductor-based emitter or a thermal emitter. At least one semiconductor-based emitter may be selected from at least one of a light-emitting diode (LED) or a laser, particularly a laser diode. The LED may include at least one fluorescent material and / or phosphorescent material. The thermal emitter may include at least one of an incandescent lamp, a blackbody emitter, and a microelectromechanical system (MEMS) emitter. The emitter may be a modulated emitter. Further types of emitters may also be feasible.

[0015] The spectrometer housing includes the following: - A frame element; - A lid element connected to the frame element; - A separation element disposed within the frame element; - A reflector element disposed on at least a part of one or both of the lid element and the frame element and - An interface element.

[0016] As used herein, the term "frame element" is a broad term and should be given its ordinary and customary meaning to one of ordinary skill in the art and is not limited to a special or customized meaning. Specifically, without limitation, this term may represent a mechanical cover configured to at least partially shield at least one element, such as at least one adjacent element, from at least one side. The frame element may specifically be configured to at least partially shield at least one element from external influences of a mechanical nature, such as a collision with a further object and / or vibrations. The frame element may include at least one wall, specifically at least one rigid and non-deformable wall. The wall may specifically completely or partially surround at least one internal space in which at least one element may be arranged. The frame element may be configured to at least partially shield electromagnetic radiation, specifically light radiation or heat radiation. The frame element may be a support structure configured to hold at least one further element, such as a reflector element, or may include such a support structure.

[0017] As used herein, the term "lid element" is a broad term and should be given its ordinary and customary meaning to one of ordinary skill in the art and should not be limited to a special or customized meaning. Specifically, without limitation, this term may represent a mechanical cover configured to at least partially shield at least one element, such as at least one adjacent element, from at least one side. The lid element may specifically be configured to at least partially shield at least one element from external influences of a mechanical nature, such as collisions with additional objects and / or vibrations. The lid element may include at least one wall, specifically at least one rigid and non-deformable wall. The wall may specifically completely or partially surround at least one internal space in which at least one element may be disposed. The lid element may be configured to at least partially shield electromagnetic radiation, specifically light radiation or heat radiation. The lid element may be a support structure configured to hold at least one additional element, such as a reflector element, or may include such a support structure.

[0018] As shown, the frame element and the lid element may be at least one of completely or partially identical, completely or partially integrated with each other, separate from each other, and completely or partially of the same type. The frame element and the lid element may form one upper element, such as a wall, a part of a wall, an enclosing wall, or an outer wall of a spectrometer housing, configured to at least partially surround the spectrometer module, for example, two or three or more sides of the spectrometer module. As an example, the frame element may cover the left and back sides of the spectrometer module, and the lid element may cover the right and front sides of the spectrometer module, such that the interior of the spectrometer module is covered laterally from all sides. Further options are possible.

[0019] As shown, the lid element is connected to the frame element. The term "connecting", including its grammatical variations, as used herein, is a broad term and should be given its ordinary and customary meaning to those of ordinary skill in the art and should not be limited to a special or customized meaning. This term may specifically, but not limited to, represent at least one of the joining, combining, fitting, and assembling of at least two elements, specifically the lid element and the frame element. The connection between the lid element and the frame element may be at least one of a form-fit connection, an adhesive connection, and a force-fit connection. The connection between the lid element and the frame element may be a fixed connection, a rigid connection, or a permanent connection, except at least by destructive means. The connection between the lid element and the frame element may be a loose connection or a flexible connection. The lid element may be connected to the frame element at at least one point and / or in at least one region of the spectrometer housing. As an example, the lid element may be connected to the frame element at at least one corner and / or at least one edge of the spectrometer housing.

[0020] As used herein, the term "separating element" is a broad term and should be given its ordinary and customary meaning to those of ordinary skill in the art and should not be limited to a special or customized meaning. Specifically, but not limited to, this term may represent an element configured to disconnect, or decouple, or separate at least two entities (presences), specifically at least two regions within a spectrometer module. Specifically, the separating element may be configured to completely or partially separate at least one first internal space of the spectrometer module or the housing of the spectrometer module from at least one second internal space of the spectrometer module. Specifically, the separating element may be configured to at least partially prevent light from at least one region of the first internal space from entering at least one region of the second internal space, or vice versa. Thus, specifically, the separating element may be completely or partially optically opaque, absorptive, or non-transmissive in the spectral range of the sensitivity of the spectrometer module, for example, in the visible and / or near-infrared spectral ranges defined above. Specifically, the separating element may be configured to separate the emitter of the spectrometer module from the detector module. The separating element may be configured to block, for example, absorb, the optical radiation emitted by the emitter, specifically the direct optical radiation emitted by the emitter. The separating element may be configured to shield the detector from the direct optical radiation from the emitter. The separating element may be configured to shield the detector from stray light, specifically stray light generated within the spectrometer module. Thus, the separating element may be configured to ensure that the detector is illuminated at least primarily by the optical radiation that has interacted with the measurement object.

[0021] As used herein, the term "reflector element" is a broad term and should be given its ordinary and customary meaning to those of ordinary skill in the art and should not be limited to a special or customized meaning. Without particular limitation, this term may represent an element configured to reflect or deflect light radiation. The reflector element may be configured to diffusely reflect and / or regularly reflect light radiation, for example, light in one or more spectral ranges of the above-described spectral range of the spectrometer module, specifically light, more specifically light in the visible spectral range and / or the near-infrared spectral range. The reflector element may be configured to deflect an incident light beam into a new propagation direction different from the propagation direction of the incident light beam. The reflector element may have a reflection characteristic with respect to the incident light radiation. The reflector element may include at least one reflecting surface such as a metal surface. Specifically, the reflector element may have a reflectivity of at least 50%, more specifically at least 60%, more specifically at least 80%, and most specifically at least 90% in the visible spectral range and / or the near-infrared spectral range. The reflector element may be configured to at least partially guide the light radiation, specifically toward the object to be measured and / or around the separation element, by at least partially reflecting the light radiation. The reflector element may be configured to define an irradiance angle, such as to maximize the irradiance of the object to be measured. The reflector element can have any shape, such as a planar shape or a parabolic shape.

[0022] The entrance opening is formed by at least a lid element and a frame element. On the side opposite to the entrance opening, at least two mounting openings are formed by at least a lid element and a frame element. The at least two mounting openings are separated by a separation element. The frame element and the separation element are integrally formed from the same material.

[0023] As used herein, the term "entrance aperture" is a broad term, given its ordinary and customary meaning to one of ordinary skill in the art, and is not limited to a special or customized meaning. Specifically, without limitation, this term may represent an aperture or hole that allows at least one of light radiation entering and exiting an element or system. The aperture or hole may be entirely open, or may be filled and / or covered, in whole or in part, with at least one transparent material. The entrance aperture may include, or be, an aperture or hole formed in a spectrometer housing, such as in at least one wall of the spectrometer housing. The entrance aperture can enable light radiation to enter the interior of the spectrometer housing, specifically to impinge on a detector. Additionally or alternatively, the entrance aperture may enable light radiation to exit the interior of the spectrometer housing, specifically, for example, light radiation emitted by an emitter such as to impinge on an object under measurement. As an example, a lid element and a frame element may laterally surround an emitter and a detector such that an entrance aperture is formed above the emitter and the detector. The detector and the emitter may each be disposed at the bottom of the spectrometer housing, specifically, in one of two mounting apertures.

[0024] As used herein, the term "mounting opening" is a broad term and should be given its ordinary and customary meaning to one of ordinary skill in the art and should not be limited to a special or customized meaning. Specifically, without limitation, this term may represent a port or hole configured for at least one of receiving and holding at least one element or system. The mounting opening may be configured to allow at least one element to be added to or inserted into the system. The mounting opening may be at least one of a plug-in location and a slot, or may be provided. The mounting opening may be configured to receive and / or hold a detector of a spectrometer module. The mounting opening may be adapted to the shape and / or size of the detector. The mounting opening may be configured to receive and / or hold an emitter of the spectrometer module. The mounting opening may have a shape and / or size adapted to the shape and / or size of the emitter. The spectrometer housing may include a mounting opening for receiving and / or holding a detector and a further mounting opening for receiving and / or holding an emitter. The mounting openings of the spectrometer housing may be the same, such as having the same shape and / or size. Alternatively, the mounting openings may have different shapes and / or sizes. As an example, the mounting opening may be covered by an optical window, such as a window made of glass and / or SI, and may further include a coating for controlling at least one optical property of the optical window, for example.

[0025] As described above, the frame element and the separation element are integrally formed from the same material. Further, as shown earlier, the separation element is disposed within the frame element. The separation element may be connected to the frame element at at least one point, specifically either permanently or inseparably, and separately from at least a destructive measure. The separation element and the frame element may be formed from the same material in one common manufacturing process, such as a molding process, for example an injection molding process, or a printing process, for example 3D printing. The frame element and the separation element may form one upper element. Accordingly, the frame element and the separation element may each correspond to a part of the upper element. Specifically, for example, when viewed from the outside, the frame element and the separation element may form one element. In other words, specifically when viewed from the outside, the frame element and the separation element may be one element or may appear as one element.

[0026] The reflector element may be fixed to one or both of the lid element and the frame element, specifically, to the inner surface of one or both of the lid element and the frame element. The reflector element may be fixed by one or more of a form-fit connection, an adhesive connection, and a force-fit connection. The term "securing" as used herein is a broad term including its grammatical variations and should be given its ordinary and customary meaning to one of ordinary skill in the art and should not be limited to a special or customized meaning. This term may, without limitation, represent at least one of fixing, attaching, mounting, and fastening at least one element to at least one further element. This term may further represent at least one of connecting, joining, and merging at least one element with at least one further element. Various different options for fixing the reflector element to one or both of the lid element and the frame element are possible and are generally known to those of ordinary skill in the art. Additionally or alternatively, the reflector element may be, or may include, a metallized surface applied to the lid element and / or the frame element using one or more deposition techniques such as sputtering, coating, evaporation, etc.

[0027] The lid element and the frame element may be integrally formed from the same material. The lid element may be connected to the frame element at at least one point, specifically either permanently or inseparably, and specifically separately from at least destructive means. The lid element and the frame element may be formed from the same material in a common manufacturing process, such as a molding process, for example an injection molding process, or a printing process, for example a 3D printing process. The frame element and the lid element may form one upper element. Thus, the frame element and the lid element may each correspond to a part of the upper element. Specifically, for example, when viewed from the outside, the frame element and the lid element may form one element. In other words, specifically when viewed from the outside, the frame element and the lid element may be one element or may appear as one element. The lid element and the frame element may form one element or cover configured to at least partially cover the spectrometer module. As an example, the lid element and the frame element may form one element or cover configured to cover the spectrometer from all side surfaces away from the inlet opening and at least two mounting openings.

[0028] The lid element may comprise at least one metallic material. The metallic material may include at least one surface configured to at least partially reflect light radiation. Accordingly, the lid element may be configured to at least partially reflect light radiation. Thus, the lid element may be configured to guide light radiation, in other words, to provide a light guiding function. As an example, at least one region of at least one surface of the lid element may be configured to reflect light radiation. The lid element may include a reflector element. The lid element and the reflector element may be the same element. As an example, the lid element may be at least partially metallized to form a reflector element. Specifically, at least one surface of the lid element may be metallized to form a mirror element. The mirror element may include at least one metallic material selected from the group consisting of gold, silver, aluminum, and other metals suitable for the production of metallized surfaces, such as any alloy. Specifically, the reflector element may be any metallic material having a high reflectivity of at least 50%, more specifically at least 60%, more specifically at least 80%, and most specifically at least 90% in the visible spectrum range and / or the near-infrared spectrum range. As an example, the metallic material forming the reflector element may be applied to the lid element using one or more deposition techniques such as sputtering, coating, evaporation, etc.

[0029] The spectrometer housing further comprises an interface element, which is configured to cover the entrance aperture. As used herein, the term "interface element" is a broad term and should be given its ordinary and customary meaning to those of ordinary skill in the art and is not limited to a special or customized meaning. Specifically, but not limited to, this term may represent an element configured for at least one of coupling optical radiation from and to the spectrometer module. Specifically, the interface element may be configured to transmit optical radiation at least in the spectral range emitted by the emitter of the spectrometer module. The interface element may be one or more of, or include, a completely or partially transparent material, a glass material, a silicon material, a material having non-absorbing properties in the infrared spectrum, a long-pass filter material, a material having filtering properties in one or more of the visible and ultraviolet spectra. Other options are also possible.

[0030] The frame element, the separation element, and optionally the lid element may comprise at least one material selected from the group consisting of a polycarbonate material, an epoxy resin material, a metal material, and any other material that can be manufactured to form the element by a molding or printing technique. At least one surface of the frame element, the separation element, and optionally the lid element may be configured to reflect less than 6% of the light emitted by the emitter and impinging on the surface. At least one surface may in particular exhibit or have black color. As an example, the element or at least one surface may be coated or dyed to resemble black. The separation element may be configured to block the light emitted from the emitter from passing through the separation element, specifically, the direct optical path between the emitter and the detector may be blocked such that the transmittance spectrum is within a measurable noise level, i.e., within a measurable noise level, and more specifically, the transmittance T is ≤ 10 -1 , more specifically 10 -1 , ≤ T ≤ 10 -5 , more specifically 10-2 0 ≤ T ≤ 10 -4 This may be the case. In particular, the transmittance T may represent the quotient of the light beam behind the separation element, i.e., on the detector side of the separation element, and the light beam in front of the separation element, i.e., on the emitter side of the separation element. The separation element may be arranged so as to block the direct beam path between the emitter and the detector. Therefore, the separation element may prevent the light radiation from reaching the detector before the interaction with the measurement object, such as before the reflection at the measurement object. The reflector element may be configured to at least partially reflect the light emitted by the emitter. The reflector element may be configured and / or arranged to at least partially reflect the light emitted by the emitter towards the interface element and further towards the measurement object. The reflector element may be configured to assist the light radiation emitted by the emitter to reach the detector by bypassing the separation element. The reflector element may be configured to at least partially guide the light radiation, specifically around the separation element.

[0031] At least one first opening of at least two mounting openings may be configured to form part of a detector compartment for receiving a detector, and at least one second opening of at least two mounting openings may be configured to form part of an emitter compartment for receiving an emitter. As used herein, the term "compartment" is a broad term and should be given its ordinary and customary meaning to one of ordinary skill in the art and is not limited to a special or customized meaning. This term, without particular limitation, may represent a space configured to receive at least one element. A compartment may include at least one cavity for receiving at least one element or at least a portion of an element. The geometric form of the compartment can be adapted to the geometric form of the element or at least a portion of the element to be received. By way of example, a compartment may be, or may include, a partially open chamber, such as a chamber open at the top and / or bottom. As used herein, the term "detector compartment" is a broad term and should be given its ordinary and customary meaning to one of ordinary skill in the art and is not limited to a special or customized meaning. This term, without particular limitation, may represent a compartment configured to receive at least one detector. The detector compartment may include a geometric form adapted to the geometric form of at least one detector such that at least one detector is particularly firmly incorporated into the detector compartment. As used herein, the term "emitter compartment" is a broad term and should be given its ordinary and customary meaning to one of ordinary skill in the art and is not limited to a special or customized meaning. This term, without particular limitation, may represent a compartment configured to receive at least one emitter. The emitter compartment may include a geometric shape adapted to the geometric shape of at least one emitter such that at least one emitter can be particularly closely incorporated into the emitter compartment by such a shape.

[0032] The spectrometer housing has a volume v ≦ 1.5 cm 3 , specifically v ≦ 1.125 cm 3, more specifically, v ≤ 0.9 cm 3 , more specifically, v ≤ 0.5 cm 3 It may also have dimensions that fit within a cube having [these conditions]. As an example, the spectrometer housing can have dimensions of 1.5 cm × 1.5 cm × 0.5 cm or 1 cm × 1 cm × 0.5 cm. Thus, the spectrometer housing may be a miniaturized spectrometer housing. Such dimensions may enable the integration of the spectrometer housing into consumer electronic devices such as smartphones, wearables, or tablets. The spectrometer housing may be configured to be integrated into consumer electronic devices such as smartphones, wearables, or tablets.

[0033] In a further aspect of the present invention, a spectrometer module is disclosed. The spectrometer module comprises at least one detector, at least one emitter, and at least one spectrometer housing according to any one of the embodiments disclosed above or below in more detail with reference to the spectrometer housing.

[0034] The spectrometer module may further include at least one substrate (circuit board), specifically a circuit carrier, more specifically a printed circuit board. Specifically, one or more of the corresponding ICs such as emitters, detectors, drivers, filters, passive components, etc., and the spectrometer housing may be arranged on the substrate. The emitter may be enclosed within a first opening of at least two mounting openings of the spectrometer housing. The detector may be enclosed within a second opening of at least two mounting openings of the spectrometer housing. The term "substrate (circuit board)" as used herein is a broad term and is given the ordinary and customary meaning to those skilled in the art and is not limited to a special or customized meaning. This term may represent, without particular limitation, any element designed to carry one or more other elements disposed thereon and / or therein. The substrate may be a planar substrate. The substrate may specifically have a planar shape such as a rectangular plate, for example, a printed circuit board, and may be made entirely or partially of at least one electrical insulating material, for example, at least one plastic material, for example, a resin and / or a fiber-reinforced plastic material. The substrate may generally have a thickness of 1 mm or less, for example, 0.6 mm or less, or 0.4 mm or less. The substrate may include one or more thin layers, specifically layers having a thickness of 0.5 mm or less. Other sizes and / or forms are also feasible.

[0035] The term "circuit carrier" as used herein is a broad term and should be given the ordinary and customary meaning to those skilled in the art and is not limited to a special or customized meaning. This term may specifically represent, without limitation, a substrate configured to carry conductive elements. The circuit carrier may specifically include at least partially or completely at least one electrical insulating material to avoid unwanted currents between the conductive elements carried by the circuit carrier. As an example, the electrical insulating material may be selected from polyethylene terephthalate (PET) or polycarbonate (PC), but other types of electrical insulating materials are also feasible.

[0036] As used herein, the term "printed circuit board", typically abbreviated as "PCB", is a broad term with the ordinary and customary meaning given to those skilled in the art and is not limited to a special or customized meaning. Specifically, but not limited to, this term may represent an electrically non-conductive planar substrate, also denoted as "board", onto which at least one sheet of conductive material such as a copper layer is applied, specifically laminated, and further includes one or more electronic, electrical, and / or optical components. The substrate may also be, or include, at least one substrate and / or at least one circuit carrier as defined above, and one or more conductive paths, also called tracks or traces, optionally disposed thereon and / or therein, and / or one or more vias. Other terms representing this type of circuit carrier are printed circuit assembly, abbreviated as "PCA", printed circuit board assembly, abbreviated as "PCB assembly" or "PCBA", circuit card assembly, abbreviated as "CCA", or simply "card". In a PCB, the electrical insulating substrate may include glass epoxy, and cotton paper impregnated with phenolic resin, typically brown or tan, may also be used as the substrate material. Depending on the number of sheets, the printed circuit board may be a single-sided PCB, a two-layer or double-sided PCB, or a multi-layer PCB, and different sheets may be connected to each other using so-called "vias". A double-sided PCB may have metal on both sides, and a multi-layer PCB may be designed by sandwiching additional metal layers between further layers of electrical insulating material. Furthermore, by using two double-sided PCBs, a four-layer PCB or more PCB layers may be generated. In a multi-layer PCB, the layers can be alternately laminated together in the order of metal, substrate, metal, substrate, metal, etc., and each metal layer is etched individually, and any internal vias may be plated through before the multiple layers are laminated together. Furthermore, the via may preferably be a copper-plated hole that can be designed as an electrical tunnel passing through the electrical insulating substrate, or may include a copper-plated hole. For this purpose, through-hole components may be used, which are typically attached by wire leads passing through the substrate and soldered to the opposite track or trace.

[0037] The spectrometer module may be sized to fit within a rectangular parallelepiped having a volume v≤1.5 cm 3 , specifically v≤1.125 cm 3 , more specifically v≤0.9 cm 3 , more specifically v≤0.864 cm 3 , more specifically v≤0.5 cm 3 For example, the spectrometer housing may have dimensions of 1.5 cm×1.5 cm×0.5 cm or 1 cm×1 cm×0.5 cm. In this way, the spectrometer module may be a miniaturized spectrometer module. With such dimensions, it may be possible to incorporate the spectrometer module into consumer electronic devices such as smartphones, wearables, tablets, etc. The spectrometer module may be configured to be integrated into a consumer electronic device such as a smartphone, wearable, or tablet.

[0038] The spectrometer may include at least one optical filter element. The optical filter element may be configured to filter light radiation, and more specifically, may be configured to filter at least one selected spectral range of the light radiation. The at least one optical filter element may specifically be disposed in the optical path in front of the detector.

[0039] For further definitions and embodiments regarding the spectrometer module, reference may be made to the above description of the spectrometer housing.

[0040] In a further aspect of the present invention, a method for manufacturing at least one spectrometer housing configured to at least partially surround the detector and emitter of a spectrometer module is disclosed. The method includes the following steps: a) Integrally forming a frame element and a separation element; b) Providing a lid element, where the lid element and the frame element form an inlet opening and at least two mounting openings, and the mounting openings are separated by the separation element; c) depositing a reflector element on at least a part of one or both of the lid element and the frame element.

[0041] The method steps may be performed in the order shown. However, it should be noted that different orders are also possible. The method may include further method steps not enumerated. Further, one or more method steps may be performed once or repeatedly. Further, two or more method steps may be performed simultaneously or may be performed repeatedly in due course.

[0042] In step a), the frame element and the separation element may be formed as one element. In other words, the frame element and the separation element may be integrally formed. The separation element and the frame element may be formed from the same material in one common manufacturing process, such as a molding process or a printing process, for example, an injection molding process or a 3D printing process, as will be outlined in more detail below. In step b), the lid element may be arranged relative to the frame element such that the lid element and the frame element form an inlet opening and at least two mounting openings. Further, the lid element may be arranged relative to the separation element such that the mounting openings are separated by the separation element. As an example, the lid element may be arranged such that the separation element is located essentially at the center of the spectrometer housing. In step c), the reflector element may specifically be deposited on at least one surface of one or both of the lid element and the frame element.

[0043] Step c) may further include fixing the reflector element to the inner surface of one or both of the lid element and the frame element. Step c) may include one or more of molding, attaching, and adhering the reflector element to one or both of the lid element and the frame element, specifically to the inner surface of one or both of the lid element and the frame element. Step c) may include at least partially metallizing the inner surface of one or both of the lid element and the frame element. Specifically, step c) may include selectively metallizing at least a part of the inner surface of one or both of the lid element and the frame element. Metallizing may include coating with at least one metal or alloy material. Metallizing may include applying an external voltage or heat. Metallizing may include vacuum deposition, such as chemical vapor deposition or physical vapor deposition. Various deposition methods are possible and are generally known to those skilled in the art.

[0044] The lid element and the frame element may be integrally formed, specifically by a molding process. The term "molding process" as used herein is a broad term and should be given its ordinary and customary meaning to those skilled in the art and is not limited to a special or customized meaning. This term may specifically, but not limited to, represent the process of molding a liquid, liquefied or paste-like material by inserting, for example injecting, the liquid, liquefied or paste-like material into a rigid frame, where the rigid frame is typically referred to as a mold or matrix. As an example, the mold may be a punched block, filled with a liquid material such as a synthetic plastic material or a metal material, and the liquid hardens within the mold to assume the corresponding shape. Various molding methods may be possible and these are generally known to those skilled in the art. One or more of steps a) and b) may include performing a molding process selected from the group consisting of an injection molding process, a low-pressure molding process, a compression molding process, a transfer molding process, a film-assisted molding process, i.e., a film-assisted selective molding process, a thermoforming process, and a rotational molding process. As an example, at least one of the frame element, the separation element and the lid element may be formed using an injection molding process, such as a plastic injection molding process or a metal injection molding process. Step b) may further include providing a reflector element. The reflector element and the lid element may be the same element, may be completely or partially the same, or may be completely or partially integrated with each other. As shown, at least one surface of the lid element may be metallized, for example.

[0045] The method may further include the following steps: d) Providing an interface element and covering the inlet opening with the interface element. The method may be configured to manufacture a spectrometer housing according to any one of the embodiments disclosed above or below in more detail with reference to the spectrometer housing.

[0046] For further definitions and embodiments of the method, reference should be made to the description of the spectrometer housing or spectrometer module above.

[0047] In a further aspect of the present invention, a method of manufacturing a spectrometer module is disclosed. The method includes the following steps: i) Executing a method of manufacturing at least one spectrometer housing according to any one of the embodiments described above or below with reference to the method of manufacturing a spectrometer housing; ii) Providing at least one emitter and at least one detector on at least one substrate, specifically on a circuit carrier, more specifically on a printed circuit board; iii) Placing the spectrometer housing on at least one substrate such that the emitter is enclosed (sealed) within the first of at least two mounting openings of the spectrometer housing, specifically within the emitter compartment, and the detector is enclosed within the second of at least two mounting openings of the spectrometer housing, specifically within the detector compartment.

[0048] The method steps may be executed in the order shown. However, it should be noted that different orders are also possible. The method may include further method steps not enumerated. Further, one or more method steps may be performed once or repeatedly. Further, two or more method steps may be performed simultaneously or repeatedly in due course.

[0049] Step iii) may specifically include fixing the spectrometer housing to the substrate by engaging the materials. Specifically, step iii) may further include fixing the spectrometer housing to the substrate by performing a joining process selected from the group consisting of adhesion and soldering. As used herein, the term "joining process" is a broad term and should be given its ordinary and customary meaning to those of ordinary skill in the art and should not be limited to a special or customized meaning. This term may specifically, but not limited to, represent a method for joining or connecting at least two elements. The joining process may include inserting at least one filler, such as soldering tin, an adhesive or a brazing material, into the joint of the elements. The joining process may include heating the elements. The joining step may include at least one pretreatment of the elements, such as surface modification, e.g., cleaning and drying, before joining the elements. Various different joining processes are feasible and these are generally known to those of ordinary skill in the art.

[0050] The method may be configured to manufacture a spectrometer module according to any one of the embodiments disclosed above or below in further detail with reference to the spectrometer module.

[0051] For further definitions and embodiments regarding the method of manufacturing a spectrometer module, reference is made to the above description of the spectrometer housing, the spectrometer housing or the method of manufacturing a spectrometer module.

[0052] The devices and methods disclosed herein have significant advantages over the prior art. Specifically, the disclosed devices and methods enable the integration of a spectrometer module into consumer electronics such as smartphones, wearables, or tablets. The spectrometer module may be a miniaturized spectrometer module. The spectrometer housing of the spectrometer module may be a miniaturized spectrometer housing. The spectrometer housing may be suitable for a chip-sized spectrometer module. The spectrometer housing including a reflector element may be further configured to guide light radiation, such as to maximize the irradiance of the measurement object, and to define the radiation intensity angle. The spectrometer housing may be manufactured using mass production techniques such as a molding process, for example, an injection molding process. Thus, the spectrometer module is cost-effective and has a high degree of design freedom.

[0053] As used herein, the terms "have", "comprise", "include", or any grammatical variations thereof are used in a non-exclusive sense. Thus, these terms may represent both situations where there are no additional features in the entity described in this context other than the features introduced by these terms, and situations where there are one or more additional features. As an example, the expressions "A has B", "A comprises B", and "A includes B" may represent both situations where there are no other elements in A other than B (i.e., situations where A is composed only of B), and situations where there are one or more additional elements such as element C, elements C and D, or still other elements in entity A in addition to B.

[0054] Furthermore, it should be noted that the terms "at least one", "one or more", or similar expressions indicating that a feature or element may be present once or multiple times are usually used only once when introducing each respective feature or element. In most cases, when referring to each respective feature or element, the expressions "at least one" or "one or more" are not repeated, regardless of the fact that each respective feature or element may be present once or multiple times.

[0055] Furthermore, as used herein, the terms "preferably", "more preferably", "especially", "more especially", "specifically", "more specifically" or similar terms are used in combination with any feature without limiting the alternatives. Accordingly, the features introduced by these terms are optional features and are not intended to limit the claims in any way. The present invention may be practiced using alternative features, as will be recognized by those skilled in the art. Similarly, features introduced by expressions such as "in an embodiment of the present invention" or similar expressions are without any limitation regarding alternative embodiments of the present invention, without any limitation regarding the scope of the present invention, and without any limitation regarding the possibility of combining such introduced features with any other optional or non-optional features of the present invention, and are intended to be optional features.

[0056] In summary, the following embodiments may be envisioned without further excluding possible embodiments: Embodiment 1: A spectrometer housing configured to at least partially surround at least one detector and at least one emitter of a spectrometer module, the spectrometer housing comprising: - a frame element; - a lid element connected to the frame element; - a separation element disposed within the frame element; - a reflector element disposed on at least a part of one or both of the lid element and the frame element; and - an interface element, wherein an inlet opening is formed by at least the lid element and the frame element, on the side opposite to the inlet opening, at least two mounting openings are formed by at least the lid element and the frame element, the at least two mounting openings are separated by the separation element, the frame element and the separation element are integrally formed from the same material, and the interface element is configured to cover the inlet opening.

[0057] Embodiment 2: The spectrometer housing according to Embodiment 1, wherein the reflector element is fixed to one or both of the lid element and the frame element, specifically, fixed to the inner surface of one or both of the lid element and the frame element.

[0058] Embodiment 3: The spectrometer housing according to Embodiment 1 or 2, wherein the reflector element is fixed by one or more of a form-fit connection, an adhesive connection, and a force-fit connection.

[0059] Embodiment 4: The spectrometer housing according to any one of Embodiments 1 to 3, wherein the lid element and the frame element are integrally formed from the same material.

[0060] Embodiment 5: The spectrometer housing according to any one of Embodiments 1 to 3, wherein the lid element includes at least one metal material.

[0061] Embodiment 6: The spectrometer housing according to Embodiment 5, wherein the lid element and the reflector element are the same element.

[0062] Embodiment 7: The spectrometer housing according to any one of Embodiments 1 to 6, wherein the reflector element includes a metal material selected from the group consisting of gold, silver, aluminum, and other metals suitable for the production of metallized surfaces, such as any alloy. Embodiment 8: The spectrometer housing according to any one of Embodiments 1 to 7, wherein the frame element and the separation element, and optionally the lid element, include at least one material selected from the group consisting of a polycarbonate material, an epoxy resin material, a metal material, and any other material that can be manufactured to form the element by a molding technique or a printing technique.

[0063] Embodiment 9: The spectrometer housing according to any one of Embodiments 1 to 8, wherein at least one surface of the frame element and the separation element, and optionally the lid element, is configured to reflect less than 6% of the light emitted by the emitter and impinging on the surface.

[0064] Embodiment 10: The separation element is configured to block the light emitted from the emitter from passing through the separation element, specifically, to block the direct optical path between the emitter and the detector such that the transmittance spectrum is at a measurable noise level, and more specifically, the transmittance T is ≤ 10 -1 , more specifically 10 -1 , ≤ T ≤ 10 -5 , more specifically 10 -2 , ≤ T ≤ 10 -4 The spectrometer housing according to any one of Embodiments 1 to 9, wherein it is so. Embodiment 11: The reflector element is configured to at least partially reflect the light emitted by the emitter. The spectrometer housing according to any one of Embodiments 1 to 10.

[0065] Embodiment 12: The first mounting opening of the at least two mounting openings is configured to form part of a detector compartment for receiving the detector, and the second mounting opening of the at least two mounting openings is configured to form part of an emitter compartment for receiving the emitter. The spectrometer housing according to any one of Embodiments 1 to 11.

[0066] Embodiment 13: The spectrometer housing has a volume v ≤ 1.5 cm 3 , specifically v ≤ 1.125 cm 3 , more specifically v ≤ 0.9 cm 3 , more specifically v ≤ 0.5 cm 3 The spectrometer housing according to any one of Embodiments 1 to 12, which is dimensioned to fit within a cube having it. Embodiment 14: A spectrometer module comprising at least one detector, at least one emitter, and at least one spectrometer housing according to any one of the embodiments referred to in the spectrometer housing.

[0067] Embodiment 15: The spectrometer module further comprises at least one substrate, specifically a circuit carrier, more specifically a printed circuit board, on which an emitter, a detector and a spectrometer housing are arranged, the emitter being enclosed within a first mounting opening of at least two mounting openings of the spectrometer housing, and the detector being enclosed within a second mounting opening of at least two mounting openings of the spectrometer housing, the spectrometer module according to Embodiment 14.

[0068] Embodiment 16: The spectrometer module has a volume v ≤ 1.5 cm 3 , specifically v ≤ 1.125 cm 3 , more specifically v ≤ 0.9 cm 3 , more specifically v ≤ 0.5 cm 3 and is dimensioned to fit within a cube having a volume v ≤ 1.5 cm, the spectrometer module according to any one of the previous embodiments referring to the spectrometer module.

[0069] Embodiment 17: A method of manufacturing at least one spectrometer housing configured to at least partially surround a detector and a light emitter of a spectrometer module, comprising the following: a) integrally forming a frame element and a separating element; b) providing a lid element, wherein the lid element and the frame element form an inlet opening and at least two mounting openings, the mounting openings being separated by the separating element; c) depositing a reflector element on at least a part of one or both of the lid element and the frame element. A method comprising the steps of.

[0070] Embodiment 18: The method according to Embodiment 17, wherein step c) further comprises fixing the reflector element to the inner surface of one or both of the lid element and the frame element.

[0071] Embodiment 19: A method according to Embodiment 18, wherein step c) comprises one or more of molding, attaching, and adhering a reflector element to one or both of the lid element and the frame element, specifically to the inner surface of one or both of the lid element and the frame element.

[0072] Embodiment 20: A method according to any one of the preceding embodiments of the method, wherein the lid element and the frame element are integrally formed, specifically by a molding process.

[0073] Embodiment 21: A method according to any one of the preceding embodiments of the method, wherein one or more of steps a) and b) comprises performing a molding process selected from the group consisting of an injection molding process, a low-pressure molding process, a compression molding process, a transfer molding process, a film-assisted molding process, i.e., a film-assisted selective molding process, a thermoforming process, and a rotational molding process.

[0074] Embodiment 22: A method according to any one of Embodiments 18 to 20, wherein step b) further comprises providing a reflector element, and the reflector element and the lid element are the same element.

[0075] Embodiment 23: A method according to any one of the preceding embodiments of the method, the method further comprising the following step: d) Providing an interface element and covering the inlet opening with the interface element.

[0076] Embodiment 24: A method according to any one of the preceding embodiments of the method, wherein the method is configured to manufacture a spectrometer housing according to any one of the embodiments referring to the spectrometer housing.

[0077] Embodiment 25: A method of manufacturing a spectrometer module, comprising: i) Performing a method of manufacturing at least one spectrometer housing according to any one of the embodiments of the method; ii) providing at least one emitter and at least one detector on at least one substrate, specifically on a circuit carrier, more specifically on a printed circuit board; iii) arranging the spectrometer housing on at least one substrate such that the emitter is enclosed within a first mounting opening of at least two mounting openings of the spectrometer housing, specifically within an emitter compartment, and the detector is enclosed within a second mounting opening of at least two mounting openings of the spectrometer housing, specifically within a detector compartment; A method comprising the above steps.

[0078] Embodiment 26: The method according to Embodiment 25, wherein step iii) further comprises fixing the spectrometer housing to the substrate by performing a joining process selected from the group consisting of adhesion and soldering.

[0079] Embodiment 27: The method according to Embodiment 25 or 26, wherein the method is configured to manufacture the spectrometer module according to any one of the embodiments referring to the spectrometer module.

Brief Description of the Drawings

[0080] Any further optional features and embodiments are disclosed in more detail in the description of the subsequent embodiments, preferably in combination with the dependent claims. Therein, each optional feature may be realized not only in any feasible combination but also in an isolated manner, as will be understood by those skilled in the art. The scope of the present invention is not limited by the preferred embodiments. The embodiments are schematically depicted in the figures. Here, the same reference numerals in these figures represent the same or functionally equivalent elements.

[0081] In the figures:

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

DETAILED DESCRIPTION OF THE INVENTION

[0082] FIG. 1 shows a schematic diagram of an exemplary embodiment of a spectrometer module 110. The spectrometer module 110 includes at least one detector 112, at least one emitter 114, and at least one spectrometer housing 116 according to any one of the embodiments described above or below in more detail with reference to the spectrometer housing 116. With respect to the spectrometer housing 116 of the spectrometer module 110, reference may also be made in particular to FIG. 3, which shows an exemplary embodiment of the spectrometer housing 116 in a separated state. FIG. 2 shows a schematic diagram of a further exemplary embodiment of the spectrometer module 110. Thus, in at least many aspects, FIGS. 1 and 2 can be described together. Further, in particular with respect to the spectrometer housing 116, in at least many aspects, FIGS. 1 to 3 can be described in relation to each other and will be described in relation to each other below.

[0083] The spectrometer module 110 may further include at least one substrate 118, specifically a circuit carrier 120, more specifically a printed circuit board 122. The emitter 114, the detector 112, and optionally the spectrometer housing 116 may be disposed on the substrate 118. The emitter 114 may be enclosed within a first mounting opening 124 of at least two mounting openings 124 of the spectrometer housing 116, and the detector 112 may be enclosed within a second mounting opening 124 of at least two mounting openings 124 of the spectrometer housing 116. The spectrometer module 110 may include at least one optical filter element 126 and / or any other type of wavelength selection element. The optical filter element 126 may be configured to filter the light 128, more specifically, may be configured to filter at least one selected spectral range of the light 128. The at least one optical filter element 126 may specifically be disposed in the optical path in front of the detector 112. Thus, the optical filter element 126 may at least partially cover the detector 112. The spectrometer module 110 has a volume v≦1.5 cm 3 , specifically v≦1.125 cm 3 , more specifically v≦0.9 cm 3 , more specifically v≦0.5 cm 3 and may be dimensioned to fit within a cube. As an example, the spectrometer housing may have dimensions of 1.5 cm×1.5 cm×0.5 cm or 1 cm×1 cm×0.5 cm. Thus, the spectrometer module 110 can be miniaturized. Such dimensions may particularly enable the integration of the spectrometer module 110 into consumer electronic devices such as smartphones, wearables, or tablets.

[0084] The spectrometer housing 116 is configured to at least partially surround at least one detector 112 and at least one emitter 114 of the spectrometer module 110. The spectrometer housing 116 includes a frame element 130. The spectrometer housing 116 comprises a lid element 132 connected to the frame element 130. The spectrometer housing 116 comprises a separation element 134 disposed within the frame element 130. The spectrometer housing 116 comprises a reflector element 136 disposed on at least a portion of one or both of the lid element 132 and the frame element 130. An inlet opening 138 is formed by at least the lid element 132 and the frame element 130. On the side opposite to the inlet opening 138, at least two mounting openings 124 are formed by at least the lid element 132 and the frame element 130. The at least two mounting openings 124 are separated by the separation element 134. The frame element 130 and the separation element 134 are integrally formed from the same material.

[0085] The cover element 132 and the frame element 130 may be integrally formed from the same material. For example, as shown in FIG. 3, the frame element 130, the cover element 132, and the separation element 134 may be integrally formed from the same material using a molding process such as an injection molding process, as will be described later. The frame element 130 and the separation element 134, and optionally the cover element 132, may include at least one material selected from the group consisting of a polycarbonate material, an epoxy resin material, a metal material, or any other material that can be manufactured to form elements by molding techniques or printing techniques. At least one surface of the frame element 130 and the separation element 134, and optionally the cover element 132, may be configured to reflect less than 6% of the light 128 emitted by the emitter 114 and impinging on the surface. The frame element 130 and the cover element 132 may laterally surround the detector 112 and the emitter 114 of the spectrometer module 110. Thus, the frame element 130 and the cover element 132 may at least partially mechanically cover the spectrometer module 110. The separation element 134 may be disposed at the center of the spectrometer module 110, specifically, between the detector 112 and the emitter 114, as shown in FIGS. 1 and 2. The separation element 134 is specifically configured to block the light 128 emitted from the emitter 114 from passing through the separation element 130, specifically to block the direct optical path between the emitter 114 and the detector 112, for example, so that the transmittance spectrum falls within a measurable noise level, for example, the transmittance T is from 10 -2 to 10 -4 of the order, that is, 10 -2 ≦T≦10 -4 and may be configured as such.

[0086] At least two mounting openings 124 may be formed by the frame element 130, the lid element 132, and the separation element 134, for example, by using the arrangement described above. The first mounting opening 124 of the at least two mounting openings 124 may be configured to form part of a detector compartment 140 for receiving the detector 112, and the second mounting opening 124 of the at least two mounting openings 124 may be configured to form part of an emitter compartment 142 for receiving the emitter 114. The spectrometer housing 116 has a volume v ≤ 1.5 cm 3 , specifically v ≤ 1.125 cm 3 , more specifically v ≤ 0.9 cm 3 , more specifically v ≤ 0.5 cm 3 and may be dimensioned to fit within a cube. As an example, the spectrometer housing 116 may have dimensions of 1.5 cm × 1.5 cm × 0.5 cm or 1 cm × 1 cm × 0.5 cm. Thus, the spectrometer housing 116 may be miniaturized, especially for integrating the spectrometer module 110 into consumer electronics. The spectrometer housing 116 further comprises an interface element 144 configured to cover the inlet opening 138. In particular, the interface element may be arranged in direct contact with the frame element 130, as exemplarily shown in FIG. 1, or may be arranged at a distance from the frame element 130, as exemplarily shown in FIG. 2. As an example, the interface element 144 may be part of the spectrometer module 110, such as part of a cover glass of a smartphone, a tablet, or a wearable, in addition to being part of the spectrometer housing 116.

[0087] As described above, the spectrometer housing 116 includes a reflector element 136. The reflector element 136 may be configured to at least partially reflect the light 128 emitted by the emitter 114. The reflector element 136 may include a metallic material selected from the group consisting of gold, silver, aluminum, and any alloy. The reflector element 136 may be fixed to one or both of the lid element 132 and the frame element 130, specifically, may be fixed to the inner surface of one or both of the lid element 132 and the frame element 130. The reflector element 136 may be fixed by one or more of a form-fit connection, an adhesive connection, and a force-fit connection. As shown in FIG. 1, the reflector element 136 may be connected to, for example, the inner surface of the lid element 132. Further, the lid element 132 and the reflector element 136 may be the same element, for example, as shown in FIG. 2. In this case, for example, the lid element 132 and the frame element 130 do not have to be integrally formed from the same material. The lid element 132 may include at least one metallic material. As an example, the lid element 132 may be formed using a molding process with a metallic material, and the frame element 130 may be formed using a molding process with a synthetic plastic material. As a further example, the inner surface of the lid element 132 may be metallized.

[0088] Regarding FIGS. 1 and 2, the optical path of light 128 will be described below. Light 128 may be irradiated, using emitter 114, specifically at least partially towards reflector element 136. As already explained, the direct optical path to detector 112 may be blocked by separation element 134. From reflector element 136, light 128 may be reflected at least partially towards interface element 144. Light 128 may pass at least partially through interface element 144. Light 128 may be reflected at least partially by interface element 144. Specifically, light 128 may interact with a measurement object that may be disposed on interface element 144, i.e., on the surface of interface element 144 facing away from detector 112 and emitter 114. Specifically, light 128 that has at least partially interacted with the measurement object may indicate at least one physical property of the measurement object. As an example, the spectral absorption of light 128 may indicate the chemical composition of the measurement object. The measurement object may at least partially reflect light 128, specifically at least partially towards detector 112 covered by optical filter element 126. Detector 112 may transmit a corresponding signal, such as an electrical signal, to printed circuit board 122 for further processing, evaluation, and / or transmission to a further device.

[0089] FIG. 4 shows a flowchart of an embodiment of a method for manufacturing spectrometer housing 116 configured to at least partially surround detector 112 and emitter 114 of spectrometer module 110. The method includes the following: a) forming integrally frame element 130 and separation element 134 (shown by reference numeral 148); b) providing lid element 132 (shown by reference numeral 150), wherein lid element 132 and frame element 130 form inlet opening 138 and at least two mounting openings 124, and the mounting openings 124 are separated by separation element 134; c) depositing reflector element 136 on at least a part of one or both of lid element 132 and frame element 130 (shown by reference numeral 152).

[0090] The method steps may be executed in the order shown. However, it should be noted that different orders are also possible. The method may include additional method steps that are not listed. Further, one or more of the method steps may be performed once or repeatedly. Further, two or more of the method steps may be performed simultaneously or may be performed with appropriate overlap.

[0091] Step c) may further include fixing the reflector element 136 to one or both of the inner surfaces of the lid element 132 and the frame element 130. Step c) may include one or more of molding, attaching, and adhering the reflector element 136 to one or both of the lid element 132 and the frame element 130, specifically to one or both of the inner surfaces of the lid element 132 and the frame element 130. Further, the lid element 132 and the frame element 130 may be integrally formed, specifically by a molding process. One or more of steps a) and b) may include performing a molding process selected from the group consisting of an injection molding process, a low-pressure molding process, a compression molding process, a transfer molding process, a film-assisted molding process, i.e., a film-assisted selective molding process, a thermoforming process, and a rotational molding process. Step b) may further include providing the reflector element 136, where the reflector element 136 and the lid element 132 are the same element. The method may be configured to manufacture the spectrometer housing 116 according to any one of the embodiments described above or below in more detail with reference to the spectrometer housing 116. The method may further have the following steps: d) providing an interface element 144 (shown by reference numeral 154) and covering the inlet opening 138 with the interface element 144.

[0092] FIG. 5 shows a flowchart showing an embodiment of a method for manufacturing a spectrometer module 110. The method includes the following configuration: i) Referring more particularly to the method of manufacturing the spectrometer housing 116 (indicated by reference numeral 156), performing the method of manufacturing the spectrometer housing 116 according to any one of the embodiments disclosed above or below; ii) Providing at least one emitter 114 and at least one detector 112 on at least one substrate 118, specifically on a circuit carrier 120, more specifically on a printed circuit board 122 (indicated by reference numeral 158); iii) By disposing the spectrometer housing 116 on at least one substrate 118, the emitter 114 is surrounded within at least two mounting openings 124 of the spectrometer housing 116, specifically within the emitter compartment 142, and the detector 112 is surrounded within at least two mounting openings 124 of the spectrometer housing 116, specifically within the detector compartment 140 (indicated by reference numeral 160).

[0093] The method steps may be performed in the order shown. However, it should be noted that different orders are also possible. The method may include additional method steps not enumerated. Further, one or more method steps may be performed once or repeatedly. Further, two or more method steps may be performed simultaneously or at appropriate times with repetition.

[0094] Step iii) may further include fixing the spectrometer housing 116 to the substrate 118 by performing a joining process selected from the group consisting of adhesion and soldering. The method may be configured to manufacture the spectrometer module 110 according to any one of the embodiments described above or below in more detail with reference to the spectrometer module 110.

[0095] List of reference numerals 110 Spectrometer module 112 Detector 114 Emitter 116 Spectrometer housing 118 Substrate 120 Circuit carrier 122 Printed circuit board 124 Mounting opening 126 Optical filter element 128 Light 130 Frame element 132 Cover element 134 Separation element 136 Reflective element 138 Inlet opening 140 Detector section 142 Emitter section 144 Interface element 148 Method step a) 150 Method step b) 152 Method step c) 154 Method step d) 156 Method step i) 158 Method step ii) 160 Method step iii)

Claims

1. A spectrometer housing (116) configured to at least partially surround at least one detector (112) and at least one emitter (114) of a spectrometer module (110), the following, - a frame element (130); - a lid element (132) connected to the frame element (130); - a separation element (134) disposed within the frame element (130); - a reflector element (136) disposed on at least a part of one or both of the lid element (132) and the frame element (130), the reflector element (136) including a metal material selected from the group consisting of gold, silver, aluminum, and other metals suitable for the production of metallized surfaces, and - an interface element (144) comprising, An inlet opening (138) is formed by at least the lid element (132) and the frame element (130), the frame element (130) and the lid element (132) being exactly the same, and on the side opposite to the inlet opening (138), at least two mounting openings (124) are formed by at least the lid element (132) and the frame element (130), the at least two mounting openings (124) being separated by the separation element (134), and the frame element (130) and the separation element (134) being integrally formed from the same material, the interface element (144) being configured to cover the inlet opening (138), the spectrometer housing (116).

2. The spectrometer housing (116) according to claim 1, wherein the reflector element (136) is fixed to one or both of the lid element (132) and the frame element (130).

3. The first of the at least two mounting openings (124) is configured to form part of a detector compartment (140) for receiving the detector (112), and the second of the at least two mounting openings (124) is configured to form part of an emitter compartment (142) for receiving the emitter (114). The spectrometer housing (116) according to claim 1 or 2.

4. Volume v ≦ 1.5 cm ３ The spectrometer housing (116) according to claim 1 or 2, dimensioned to fit within a cube having

5. A spectrometer module (110) comprising at least one detector (112), at least one emitter (114), and at least one spectrometer housing (116) according to claim 1 or 2.

6. The spectrometer module (110) further comprises at least one substrate (118), wherein the emitter (114), the detector (112) and the spectrometer housing (116) are arranged on the substrate (118), the emitter (114) is enclosed within a first mounting opening of the at least two mounting openings (124) of the spectrometer housing (116), and the detector (112) is enclosed within a second mounting opening of the at least two mounting openings (124) of the spectrometer housing (116). The spectrometer module (110) according to claim 5.

7. The spectrometer module (110) is dimensioned to fit within a rectangular parallelepiped having a volume v ≦ 1.5 cm ３ The spectrometer module (110) according to claim 5, wherein the spectrometer module (110) is dimensioned to fit within a rectangular parallelepiped having a volume v ≦ 1.5 cm.

8. A method of manufacturing at least one spectrometer housing (116) configured to at least partially surround a detector (112) and an emitter (114) of a spectrometer module (110), the following steps: a) Integrally forming a frame element (130) and a separating element (134); b) Providing a lid element (132), wherein the lid element (132) and the frame element (130) form an inlet opening (138) and at least two mounting openings (124), and the mounting openings (124) are separated by the separating element (134), where the frame element (130) and the lid element (132) are completely identical; c) Depositing a reflector element (136) on at least a part of one or both of the lid element (132) and the frame element (130), the reflector element (136) comprising a metal material selected from the group consisting of gold, silver, aluminum, and other metals suitable for the production of metallized surfaces. A method comprising.

9. The method according to claim 8, wherein step c) further comprises fixing the reflector element (136) to the inner surface of one or both of the lid element (132) and the frame element (130).

10. The method according to claim 9, wherein step c) comprises one or more of molding, attaching, and adhering the reflector element (136) to one or both of the lid element (132) and the frame element (130).

11. The method according to any one of claims 8 to 10, wherein the lid element (132) and the frame element (130) are integrally formed.

12. Furthermore, the following steps: d) providing an interface element (144) and covering the inlet opening (138) with the interface element (144); The method according to claim 8 or 9, comprising: **Claim 13** A method of manufacturing a spectrometer module (110), the method comprising the following steps: i) performing the method of manufacturing at least one spectrometer housing (116) according to claim 8 or 9; ii) providing at least one emitter (114) and at least one detector (112) on at least one substrate (118); iii) placing the spectrometer housing (116) on the at least one substrate (118) such that the emitter (114) is enclosed within a first mounting opening of the at least two mounting openings (124) of the spectrometer housing (116) and the detector (112) is enclosed within a second mounting opening of the at least two mounting openings (124) of the spectrometer housing (116); A method comprising: **Claim 14** The method according to claim 13, wherein step iii) further comprises fixing the spectrometer housing (116) to the substrate (118) by performing a bonding process selected from the group consisting of adhesion and soldering.

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