Dual Laser Assist Processing System

Abstract

The present invention provides a dual laser-assisted processing system, including a tool, a first laser emitting device, and a second laser emitting device. The first laser emitting device can emit a laser onto the processing surface of the workpiece to form a first irradiation region. The second laser emitting device can emit a laser onto the processing surface of the workpiece to form a second irradiation region. The first irradiation region and the second irradiation region have an overlapping region, and the processing point on the processing surface of the tool is within the overlapping region. Moreover, the included angle between the projection on the processing surface of the line connecting the first laser emitting device and the tool and the projection on the processing surface of the line connecting the second laser emitting device and the tool is not 0°. The dual laser-assisted processing system disclosed by the present invention installs two laser generating devices, so that the two laser irradiation regions overlap and complement each other, greatly reducing the dead angle region, realizing the softening of the processing target region, and completing the high-precision processing of hard and brittle materials.

Description

Technical Field

[0001] The present invention relates to the field of machining technology, and particularly to a dual laser assisted machining system.

Background Art

[0002] Hard and brittle materials such as cemented carbide have a low density, high strength, and excellent properties such as heat resistance and wear resistance, and thus have great potential for extensive applications in fields such as aerospace, space technology, medicine, and precision manufacturing. Important components made from these materials have very long service lives and adaptation characteristics compared to conventional materials due to their excellent mechanical properties.

[0003] Hard and brittle materials can meet high-precision requirements for size and shape through precision machining. However, due to their high hard and brittle characteristics and low fracture toughness, the difficulty of machining in the process of precision machining is very high. Laser-assisted cutting machining uses a high-energy laser beam to heat and locally generate high temperatures to thermally soften the workpiece in the machining target area, reducing the hardness of the material and improving its plasticity, thereby improving the cutting performance of the material.

[0004] However, the assist laser is blocked by the tool. Therefore, a non-irradiable dead angle area is formed on the side of the tool away from the laser light source. The part within the dead angle area cannot be heated and softened by the laser. In the process of high-precision and complex machining, the movement direction of the tool is flexible and the movement trajectory is diverse, and the dead angle area that cannot receive laser irradiation affects the machining of the tool on the workpiece.

Summary of the Invention

[0005] In order to solve the above problems, the present invention provides a dual laser assisted machining system.

[0006] A dual-laser assisted machining system, comprising a tool, a first laser emitting device, and a second laser emitting device, wherein the first laser emitting device can emit a laser onto the machining surface of a workpiece to form a first irradiation region, the second laser emitting device can emit a laser onto the machining surface of the workpiece to form a second irradiation region, the first irradiation region and the second irradiation region have an overlapping region, the machining point on the machining surface of the tool is within the overlapping region, and the included angle between the projection of the line connecting the first laser emitting device and the tool on the machining surface and the projection of the line connecting the second laser emitting device and the tool on the machining surface is not 0°.

[0007] Furthermore, the first laser emitting device and the second laser emitting device are respectively provided on both sides of the tool, and the first laser emitting device and the second laser emitting device are in the same plane as the axis of the tool.

[0008] Furthermore, the mounting heights of the first laser emitting device and the second laser emitting device are different. Let the location of the first laser emitting device be point p1, the location of the second laser emitting device be point p2, the center of the tool be point o, the radius of the tool be r, the distance between the first laser emitting device and the second laser emitting device be l, the distance between point p1 and point o be l1, the distance between point p2 and point o be l2, the angle c be the angle of p1op2, the distance from p1 to the machining surface be h1, and the distance from p2 to the machining surface be h2.

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[0009] Furthermore, the mounting heights of the first laser emission device and the second laser emission device are different. Let the location of the first laser emission device be point p1, the location of the second laser emission device be point p2, the center of the tool be point o, the radius of the tool be r, the distance between the first laser emission device and the second laser emission device be l, l1 be the distance between point p1 and point o, l2 be the distance between point p2 and point o, angle c be the angle of p1op2, h1 be the distance from p1 to the machining surface, and h2 be the distance from p2 to the machining surface.

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[0010] Furthermore, the laser emitted from the first laser emission device is used to heat the workpiece, and the laser emitted from the second laser emission device is used to heat-treat the workpiece surface.

[0011] Furthermore, the first laser emission device is used to detect the wear amount of the tool.

[0012] Furthermore, the first laser emission device is used to dress the tool.

[0013] The dual-laser assist machining system disclosed by the present invention installs two laser generation devices, so that the two laser irradiation areas overlap and complement each other, greatly reducing the dead angle area, realizing the softening of the machining target area, and completing the high-precision machining of hard and brittle materials.

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings necessary for describing the embodiments or the prior art are briefly explained below. The drawings shown below are only some embodiments of the present invention, and it is obvious that those skilled in the art can obtain other related drawings based on these drawings without creative efforts.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Modes for Carrying Out the Invention

[0016] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts belong to the protection scope of the present invention.

[0017] As shown in FIGS. 1 to 3, a dual laser assist machining system includes a tool 1, a first laser emitting device 2, and a second laser emitting device 3. The first laser emitting device 2 can emit a laser onto the machining surface of the workpiece to form a first irradiation region 4, and the second laser emitting device 3 can emit a laser onto the machining surface of the workpiece to form a second irradiation region 5. The first irradiation region 4 and the second irradiation region 5 have an overlapping region. The machining point of the tool 1 on the workpiece is within the overlapping region, and the included angle between the projection of the line connecting the first laser emitting device 2 and the tool 1 on the machining surface and the projection of the line connecting the second laser emitting device 3 and the tool 1 on the machining surface is not 0°.

[0018] The laser irradiation position is controlled by a machine tool control system, whereby the laser is irradiated onto the machining target region of the workpiece. By irradiating the laser before machining with the tool, the temperature of the machining target region of the workpiece is raised and softened. In this embodiment, two laser emitting devices, namely a first laser emitting device 2 and a second laser emitting device 3, are installed. The line connecting the first laser emitting device 2 and the tool 1 is the line connecting the laser emitting point of the first laser emitting device 2 and the cutting edge point of the tool 1. The line connecting the second laser emitting device 3 and the tool 1 is the line connecting the laser emitting point of the second laser emitting device 2 and the cutting edge point of the tool 1. The machining surface is the machining target surface of the workpiece. The projections of the two connecting lines on the machining surface are still two straight lines. The included angle between the two straight lines is not 0°. The laser emitting device has a dead angle region where it cannot irradiate on the side away from the laser emitting device of the tool. The included angle between the projections of the two connecting lines is not 0°. The dead angle regions that cannot be irradiated by the two laser emitting devices are different. When the tool machines the workpiece, when the next machining point is located in the dead angle region of one laser emitting device, the other laser emitting device heats the machining point, thereby raising and softening the temperature of the machining target region where the next machining point is located, and the machining can be continued.

[0019] In this embodiment, both the first laser emission device 2 and the second laser emission device 3 are attached to the ram 6, move using the coordinate system of the machine tool, and are simultaneously controlled by the numerical control system of the machine tool, and the angle of the emitted laser can be changed.

[0020] Furthermore, the first laser emission device 2 and the second laser emission device 3 are respectively provided on both sides of the tool 1, and the first laser emission device 2 and the second laser emission device 3 are in the same plane as the axis of the tool 1.

[0021] The laser emission device moves using the coordinate system of the machine tool, and the relative position with the tool is fixed. When the first laser emission device 2 and the second laser emission device 3 are in the same plane as the axis of the tool 1, the projection of the first laser emission device 2 on the machining surface, the projection of the second laser emission device 3 on the machining surface, and the projection of the tool 1 on the machining surface are collinear. When the heights from the machining surfaces of the first laser emission device and the second laser emission device are the same, the dead angle area of the first laser emission device 2 is maximally compensated by the second laser emission device 3. As shown in FIG. 2, both the first irradiation area 4 and the second irradiation area 5 form a dead angle area shown shaded in the figure on the side away from the laser emission device of the tool 1, but the dead angle areas formed by each of the two laser emission devices are covered by the other laser emission device.

[0022] Furthermore, in order to adapt to different structures of different machine tools, the mounting heights of the first laser emission device 2 and the second laser emission device 3 are different.

[0023] Let the location of the first laser emission device (2) be point p1, the location of the second laser emission device (3) be point p2, the center of the tool be point o, the radius of the tool be r, the distance between the first laser emission device (2) and the second laser emission device (3) be l, l1 be the distance between point p1 and point o, l2 be the distance between point p2 and point o, angle c be the angle of p1op2, h1 be the distance from p1 to the machining surface, and h2 be the distance from p2 to the machining surface.

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[0024]

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[0025] The maximum dead angle region area is, that is, in the machining process of the machine tool, the maximum area where the laser is not irradiated and the tool can operate normally. When the dead angle region area is smaller than the maximum dead angle region area, the machine tool can operate normally.

[0026] When c > (π - (c1 + c2)), the dead angle region exists on both sides of the tool, and the conditions satisfied in this case are as follows.

[0027]

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[0028] The maximum dead angle region area is, that is, in the machining process of the machine tool, the maximum area where the laser is not irradiated and the tool can operate normally. When the dead angle region area is smaller than the maximum dead angle region area, the machine tool can operate normally.

[0029] As shown in FIG. 3, this embodiment further discloses a milling machine with dual laser assist machining. The tool 1 is a milling cutter. The laser emitted from the first laser emitting device 2 is irradiated onto the machining target area of the workpiece along the first optical path 7 and is used to heat the workpiece. The laser emitted from the second laser emitting device 3 is irradiated onto the machined completed area along the second optical path 8 and is used to heat-treat the workpiece surface. When the tool moves to the dead angle area of the first laser emitting device 2, the second laser emitting device 3 irradiates and heats the machining target area.

[0030] The first laser emitting device 2 may select a laser measuring device or a laser dressing device. When the laser measuring device is selected for the first laser emitting device 2, it may be used to detect the wear amount of the tool 1. When the laser dressing device is selected for the first laser emitting device 2, it may be used to dress the tool 1. A third laser emitting device may be further provided for detecting the wear amount of the tool 1 or for dressing the tool 1.

[0031] Embodiment 2 As shown in FIG. 4, the differences between this embodiment and Embodiment 1 are as follows. This embodiment discloses a lathe with dual laser assist machining. The laser emitted from the first laser emitting device is irradiated onto the machining target area of the workpiece along the optical path 7 and is used to heat the workpiece. The laser emitted from the second laser emitting device 3 is irradiated onto the machined completed area along the second optical path 8 and is used to heat-treat the workpiece surface. The first laser emitting device may select a laser measuring device used to detect the wear amount of the tool 1.

[0032] The points to be finally explained are as follows. Each of the above embodiments is merely for explaining the technical solution of the present invention and does not limit it. Although the present invention has been described in detail with reference to each of the above embodiments, those skilled in the art should understand the following. It is still possible to modify the technical solutions described in each of the above embodiments, or perform equivalent substitution on some or all of their technical features, and these modifications or substitutions do not deviate from the essence of the corresponding technical solutions from the scope of the technical solutions of each embodiment of the present invention.

Explanation of Reference Numerals

[0033] 1 tool, 2 first laser emission device, 3 second laser emission device, 4 first irradiation region, 5 second irradiation region, 6 ram, 7 first optical path, 8 second optical path, 9 detection optical path

Claims

Claim 1 A tool (1), a first laser emitting device (2), and a second laser emitting device (3), wherein the first laser emitting device (2) can emit a laser onto a processing surface of a workpiece to form a first irradiation region (4), the second laser emitting device (3) can emit a laser onto the processing surface of the workpiece to form a second irradiation region (5), the first irradiation region (4) and the second irradiation region (5) have an overlapping region, a processing point on the processing surface of the tool (1) is within the overlapping region, and an included angle between a projection on the processing surface of a line connecting the first laser emitting device (2) and the tool (1) and a projection on the processing surface of a line connecting the second laser emitting device (3) and the tool (1) is not 0°, a dual laser assisted processing system characterized thereby. Claim 2 The first laser emitting device (2) and the second laser emitting device (3) are respectively provided on both sides of the tool (1), and the first laser emitting device (2) and the second laser emitting device (3) are in the same plane as the axis of the tool (1), the dual laser assisted processing system according to claim 1, characterized thereby. Claim 3 The mounting heights of the first laser emitting device (2) and the second laser emitting device (3) are different. Let the location of the first laser emitting device (2) be point p1, the location of the second laser emitting device (3) be point p2, the center of the tool be point o, the radius of the tool be r, the distance between the first laser emitting device (2) and the second laser emitting device (3) be l, the distance between point p1 and point o be l1, the distance between point p2 and point o be l2, the angle c be the angle of p1op2, the distance from p1 to the processing surface be h1, and the distance from p2 to the processing surface be h2. 【Number 10】 When c ≦ (pi - (c1 + c2)), 【Number 11】 wherein pi is π and a is the maximum dead angle region area, the dual laser assisted processing system according to claim 1, characterized thereby. Claim 4 The mounting heights of the first laser emitting device (2) and the second laser emitting device (3) are different. Let the location of the first laser emitting device (2) be point p1, the location of the second laser emitting device (3) be point p2, the center of the tool be point o, the radius of the tool be r, the distance between the first laser emitting device (2) and the second laser emitting device (3) be l, l1 be the distance between point p1 and point o, l2 be the distance between point p2 and point o, angle c be the angle of p1op2, h1 be the distance from p1 to the machining surface, and h2 be the distance from p2 to the machining surface. 【Number 12】 When c > (π - (c1 + c2)), 【Number 13】 and 【Number 14】 where π is pi, and a is the maximum dead angle area. The dual laser assist machining system according to claim 1 is characterized by this.

5. The laser emitted from the first laser emitting device (2) is used to heat the workpiece, and the laser emitted from the second laser emitting device (3) is used to heat-treat the workpiece surface. The dual laser assist machining system according to claim 1 is characterized by this.

6. The first laser emitting device (2) is used to detect the wear amount of the tool (1). The dual laser assist machining system according to claim 1 is characterized by this.

7. The first laser emitting device (2) is used to dress the tool (1). The dual laser assist machining system according to claim 1 is characterized by this.

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