Automatic placement of the substrate towards the chamber center
The use of pyrometers to automate substrate centering within a semiconductor chamber addresses human error and inefficiencies, enabling precise and efficient substrate positioning without manual recalibration.
JP2025522049AActive Publication Date: 2025-07-10APPLIED MATERIALS INC
Patent Information
- Application Number
- JP2025501379
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-07-15
- Filing Date
- 2023-06-15
- Publication Date
- 2025-07-10
- Estimated Expiration
- 2043-06-15
AI Technical Summary
Technical Problem
Existing methods for centering a substrate at the center within a semiconductor chamber are prone to human error and require manual recalibration, leading to inefficiencies and downtime due to the need for opening the chamber.
Method used
A method using pyrometers within the chamber to detect the presence of the substrate, calculate offset values, and adjust the robotic arm to center the substrate without opening the chamber, utilizing a processor to automate the centering process in both X and Y directions.
Benefits of technology
Achieves precise substrate centering with reduced human error and minimizes downtime by automating the centering process, ensuring accurate positioning and improving processing uniformity.
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Smart Images
Figure 2025522049000001_ABST
Abstract
Multiple embodiments of the present disclosure include a method of placing a substrate at the center within a chamber. In one embodiment, the method includes inserting the substrate into the chamber using a robotic arm, obtaining a delta time value of a second thermometer relative to a first thermometer, where the delta time value is the duration between the time when the first thermometer is covered by the substrate and the time when the second thermometer is covered by the substrate, obtaining the delta time value, calculating a time offset value of the delta time value relative to an ideal delta time value, where the ideal delta time value is the delta time value when the substrate is perfectly centered in a first direction perpendicular to the movement of the substrate, calculating the time offset value, and comparing the time offset value with a graph or look-up table that correlates the time offset value with a distance offset value.
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Citation Information
Patent Citations
Method and apparatus for detecting deviation of semiconductor wafer position
JP1999220007A
Method and device for detecting wafer misregistration
JP2002043231A
Abnormality detection method and abnormality detection apparatus for substrate supporting part in heat treatment equipment for substrate
JP2002203802A