Ultra-High-Speed High-Temperature Sintering (UHS) System and Method for Manufacturing an Environment-Thermal Barrier Coating

Abstract

One or more precursors can be provided on the surface of the component. The heating element can be provided on the one or more precursors such that the heating element substantially conforms to the shape of the surface of the component. The precursor can be sintered by exposing the precursor to a temperature of 500 to 3273 K for a duration of 10 minutes or less to form a layer of an environmental-thermal barrier (ETB) coating. The temperature can be generated by passing an electric current through the heating element to Joule heat the heating element.

Description

Technical Field

[0001] (Cross - Reference to Related Applications) This application claims the benefit of U.S. Provisional Application No. 63 / 358,063, entitled "Design, Manufacture, and Use of Environment - Thermal Barrier Coatings by Ultra - High - Speed High - Temperature Sintering," filed on July 1, 2022, the entire disclosure of which is incorporated herein by reference. (Statement Regarding Federally Sponsored Research) This invention was made with government support under DE - AR0001424 awarded by the U.S. Department of Energy, Advanced Research Projects Agency - Energy (ARPA - E). The U.S. government has certain rights in this invention. (Technical Field) This disclosure generally relates to component coatings and, more particularly, to systems and methods for manufacturing coatings via ultra - high - speed high - temperature sintering (UHS), such as environment - thermal barrier (ETB) coatings.

Background Art

[0002] Environment - thermal barrier (ETB) coatings are used to protect components in high - temperature environments from corrosion and oxidation, such as gas turbines, jet engines, or components for industrial applications that are exposed to high temperatures and / or corrosive gases. In gas turbine engines, further improvements in energy efficiency and thrust - to - weight ratio may require the development of new ETB coatings that can operate at higher temperatures (e.g., ≥1300°C, e.g., ≥1700°C). Such new ETB coatings should meet a series of requirements at higher temperatures, such as low thermal conductivity, high thermal stability, and a close match with the coefficient of thermal expansion (CTE) of the underlying substrate (e.g., an alloy such as a superalloy). However, existing ETB coatings, such as yttria - stabilized zirconia (YSZ) deposited on Ni - based superalloys and similar coatings on SiC / SiC ceramic matrix composites (CMCs), have temperature capabilities well below 1700°C.

[0003] In conventional manufacturing processes, the ETB coating is deposited by air plasma spraying (APS) or electron beam physical vapor deposition (EBPVD). However, such conventional manufacturing processes require expensive equipment and can make the discovery of new ETB coatings using such processes cost-prohibitive. Additionally, conventional manufacturing processes may have limited ability to form certain coatings. For example, the α-alumina phase, which is the most stable high-temperature phase for alumina, cannot be directly deposited by the APS or EBPVD methods. Conventional manufacturing processes may also be unable to deposit composite coatings having mixed oxides or two-phase oxides, which may have CTE matching with certain substrates or other physical properties that are more desirable than those of single-phase coatings. Spark plasma sintering (SPS), which can be used to sinter dense coatings, can be difficult to apply to non-planar or contoured surfaces (e.g., components having curvature). SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0004] Embodiments of the disclosed subject matter can, among other things, address one or more of the problems and disadvantages described above. MEANS FOR SOLVING THE PROBLEMS

[0005] Embodiments of the disclosed subject matter can form a coating by ultra-high speed high temperature sintering (UHS) and can provide a component having such a coating. In some embodiments, UHS heats one or more precursors (e.g., powders) on the surface of a component (e.g., a turbine blade, a combustor, etc.) at a high temperature (e.g., 500K or more, e.g., at least 1500K) for a short time (e.g., 10 minutes to 2 minutes, etc., 10 minutes or less) to convert them into one or more layers (e.g., a sintered layer) for a coating (e.g., an environmental-thermal barrier (ETB) coating) without thermal degradation of the underlying component. For example, UHS can be provided by one or more Joule heating elements. In some embodiments, the surface of the component can be non-planar or contoured (e.g., curved or having adjacent portions at an angle such that it is difficult to coat otherwise). The heating element can be sufficiently flexible to conform to the shape of the surface of the component. Alternatively, in some embodiments, the heating element can be a layer conformally formed over or above one or more precursors. After UHS, the conformal layer can be removed, for example, by heating in an oxygen atmosphere, and the conformal layer can be combusted off.

[0006] In one or more embodiments, the method can include providing one or more first precursors on the surface of a component to be coated and providing a heating element on the one or more first precursors. The heating element can be substantially conformable to the shape of the surface of the component. The method can further include subjecting the one or more first precursors to a sintering temperature in the range of 500 - 3273K (inclusive) for a duration of 10 minutes or less to sinter the one or more first precursors to form a first layer of an ETB coating on the surface of the component. The sintering temperature can be generated by passing an electric current through the heating element to cause its Joule heating.

[0007] Any of the various innovations of the present disclosure can be used in combination or separately. This summary is provided to introduce, in a simplified form, a selection of concepts that are further described in the detailed description below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. The foregoing and other objects, features, and advantages of the disclosed technology will become more apparent from the following detailed description, which proceeds with reference to the accompanying drawings.

Brief Description of the Drawings

[0008] Embodiments will now be described with reference to the accompanying drawings, which are not necessarily drawn to scale. Where applicable, some elements may be simplified or not illustrated to assist in the illustration and description of underlying features. Throughout the drawings, like reference numerals indicate like elements.

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[0009] General Considerations For the purposes of this specification, specific aspects, advantages, and novel features of the embodiments of the present disclosure are described herein. The disclosed methods and systems should in no way be construed as limiting. Instead, the present disclosure is directed to all novel and non-obvious features and aspects of the various embodiments disclosed, alone and in various combinations and sub-combinations with each other. The methods and systems are not limited to any specific aspect, feature, or combination thereof, and the disclosed embodiments do not require the presence of any one or more specific advantages or the solution of any problems. The techniques from any embodiment or example can be combined with the techniques described in any one or more of the other embodiments or examples. Considering the many possible embodiments to which the principles of the disclosed techniques can be applied, it should be recognized that the illustrated embodiments are merely exemplary and should not be construed as limiting the scope of the disclosed techniques.

[0010] Some of the operations of the disclosed methods are described in a particular order for the sake of presentation convenience. However, it should be understood that this description method includes permutations unless a particular ordering is required by the specific language described below. For example, the operations described consecutively may, in some cases, be permuted or executed simultaneously. Further, for the sake of simplicity, the accompanying drawings may not show various ways in which the disclosed method can be used in combination with other methods. Further, the description may use terms such as "provide" or "achieve" to describe the disclosed method. These terms are a high-level abstraction of the actual operations performed. The actual operations corresponding to these terms may vary depending on the specific implementation form and are easily recognizable by those skilled in the art.

[0011] The disclosure of a numerical range should be understood to refer to each discrete point within the range including the endpoints, unless otherwise specified. Unless otherwise indicated, all numbers representing amounts of components, molecular weights, percentages, temperatures, times, etc., used in this specification or the claims should be understood to be modified by the term "about". Thus, unless otherwise implicitly or explicitly indicated, or unless the context is appropriately understood by those skilled in the art to have a more definite configuration, the numerical parameters described are approximate values that may depend on the desired properties required and / or the limits of detection under standard test conditions / methods known to those skilled in the art. When distinguishing embodiments directly and explicitly from the prior art discussed, the numerical values in the embodiments are not approximate unless the words "about", "substantially", or "approximately" are listed. When the words "substantially", "approximately", "about", or similar language are explicitly used in combination with a particular value, a variation of up to 10% of that value is always intended, unless otherwise explicitly specified.

[0012] Directions and other relative references may be used to facilitate the description of the drawings and principles herein, but are not intended to be limiting. For example, specific terms such as "inner", "outer", "upper", "lower", "top", "bottom", "inside", "outside", "left", "right", "front", "rear", "rear side", etc. may be used. Such terms are used, where applicable, to provide some clarity in the description when dealing with relative relationships, particularly with respect to the specifically illustrated embodiments. However, such terms are not intended to imply absolute relationships, positions, and / or orientations. For example, with respect to an object, the "upper" portion can simply become the "lower" portion by turning the object over. Nevertheless, it is still the same portion and the object remains the same.

[0013] As used herein, "comprising" means "including", and the singular forms "a", "an", or "the" include references to the plural unless the context clearly indicates otherwise. The term "or" refers to a single element of the recited alternative elements or a combination of two or more elements, unless the context clearly indicates otherwise.

[0014] There are alternatives for the various components, parameters, operating conditions, etc. described in the specification, but those alternatives are not necessarily equivalent and / or do not necessarily function equally well. Also, unless otherwise specified, it does not mean that the options are listed in a preferred order. Unless otherwise specified, any of the bases defined below may or may not be substituted.

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present disclosure, suitable methods and materials are described below. The materials, methods, and examples are illustrative only and not intended to be limiting. The features of the subject matter of the present disclosure will become apparent from the following detailed description and the appended claims.

[0016] Glossary of Terms The following is provided to facilitate the description of the various aspects of the disclosed subject matter and to guide one of ordinary skill in the art in the practice of the disclosed subject matter.

[0017] Ultra-High-Speed High-Temperature Sintering (UHS) Period: The period during which a temperature in the range of 500 - 3273 K (including both ends) is applied for a duration of 10 minutes or less. In some embodiments, the duration can be 5 minutes or less, for example, in the range of 10 seconds to 2 minutes, including both ends. In some embodiments, UHS can be repeated one or more times, and each repetition of UHS has a duration within a predetermined range, for example, 10 seconds to 2 minutes (including both ends). Alternatively, in some embodiments, UHS can be repeated as one or more pulses (e.g., application of a temperature in the range of 500 - 3273 K), and each pulse has a duration within a first predetermined range (e.g., less than 60 seconds, for example, including 1 - 10 seconds). In some embodiments, the combined duration of such pulses can be within a second predetermined range (e.g., 10 seconds to 2 minutes, including both ends). In some embodiments, the duration of the UHS period can be defined by controlling the operation of one or more heating elements, for example, by heating to a peak temperature or temperature in the range of 500 - 3273 K (including both ends) and / or cooling from the peak temperature. For example, UHS is at least 10 3 °C / s (e.g., about 10 3 ~10 5 °C / s) of heating at a ramp rate, and / or at least 10 3 °C / s (e.g., about 10 3 ~10 5It can include cooling at a ramp rate of (e.g., in °C / s). Alternatively or additionally, in some embodiments, the duration of the UHS period can be defined, for example, by moving one or more heating elements and / or the component(s) undergoing UHS such that different portions of the component(s) are exposed to heating by one or more heating elements.

[0018] Sintering temperature: The temperature at the surface of one or more heating elements when (e.g., by application of an electric current pulse) energized and / or when the surface of the component being heated (e.g., the precursor layer on the component) is heated. In some embodiments, the sintering temperature is at least 500 K (˜227 °C), for example, at least 1000 K (˜727 °C). In some embodiments, the sintering temperature is 1500 K (˜1227 °C) to 3273 K (˜3000 °C). In some embodiments, the sintering temperature is the temperature that the material being sintered (e.g., the precursor) experiences. In some embodiments, the temperature in the material being sintered (e.g., the precursor) can be equal to or substantially match (e.g., within 10%) the temperature of at least one heating element. In some embodiments, the sintering temperature is not static (e.g., changing) during the UHS period.

[0019] Refractory high-entropy alloy (RHEA): An alloy formed from five or more elements in substantially equal proportions, at least some of which are refractory metals.

[0020] C103 alloy: A solid-solution strengthened alloy formed from approximately 90% niobium, approximately 8% hafnium, and approximately 2% titanium.

[0021] Mullite: A substance formed from alumina and silica. In some embodiments, mullite can include other oxide materials such as barium oxide and strontium oxide (e.g., barium strontium aluminum silicate (BSAS)).

[0022] Felt: A thin, flexible, and porous structure. In some embodiments, the felt has a thickness of 1 mm or less. In some embodiments, the felt can be formed from carbon or graphite. In some embodiments, the felt has a density of (i) 0.1 to 0.5 g / cm 3 (including both end values), a porosity of (ii) 80 to 95% (including both end values), a conductivity of (iii) 100 to 1000 S / m (including both end values), a thermal conductivity of (iv) 100 to 1000 W / m-K (including both end values), or any combination of (i) to (iv) above. In some embodiments, the carbon felt can be formed by carbonizing polyacrylonitrile (PAN) or rayon fibers.

[0023] Oxygen atmosphere: A pure oxygen gas or an atmosphere containing oxygen gas, such as ambient air (e.g., having an oxygen concentration of about 21% by volume).

[0024] Inert atmosphere: An atmosphere of one or more gases that do not undergo a chemical reaction when exposed to the sintering temperature. In some embodiments, each gas in the inert atmosphere is selected from the group consisting of nitrogen, argon, helium, neon, krypton, xenon, radon, and oganesson.

[0025] Introduction A method for forming a coating on a component via ultra-high speed high temperature sintering (UHS) is disclosed herein. Since UHS is a non-equilibrium thermal process, a precursor layer (e.g., powder) on the component can be rapidly heated and densified without the underlying component being exposed to the same temperature as the precursor layer. Thus, the transient nature of UHS avoids exposing the underlying component to temperatures that would otherwise melt or significantly degrade the component. In some embodiments, the coating or a layer thereof can be configured as a bond coat (e.g., an adhesion promoting layer, e.g., a metal layer or an intermetallic layer). Alternatively or additionally, in some embodiments, the coating or a layer thereof can be configured as an environmental barrier coating (e.g., providing environmental protection (e.g., from oxidation and / or corrosion), e.g., providing a metal layer). Alternatively or additionally, in some embodiments, the coating or a layer thereof can be configured as an environmental-thermal barrier (ETB) coating (e.g., providing both environmental protection and thermal insulation).

[0026] In some embodiments, the coating can be formed by subjecting one or more layers of a precursor (e.g., powder) to UHS. In some embodiments, the precursor layer can be continuously deposited on or above the surface of the component (e.g., by spray painting, slurry dipping, and / or tape casting) and then subjected to simultaneous UHS. Alternatively or additionally, the precursor layer can be continuously deposited on or above the surface of the component and subjected to successive UHS (e.g., after each layer deposition). In some embodiments, the UHS-generated coating can withstand thermal cycling, e.g., by chemically adhering to the surface of the component.

[0027] In some embodiments, the methods disclosed herein can be used to test and identify novel coatings, for example, by providing easy execution, high-speed iteration efficiency (e.g., by simultaneous or sequential UHS of different layer compositions, different layer configurations, and / or different substrate compositions), temperature testing (e.g., by coating cycles and / or torch testing), relatively low cost (e.g., for capital equipment), and good material compatibility (e.g., for producing two-phase materials of different porosities, layers, α-alumina, etc.). In some embodiments, the selection of a coating or its components can be based on factors such as thermal conductivity, long-term thermal stability, recession rate, substrate-coating compatibility, coefficient of thermal expansion (CTE) compatibility, fracture resistance, and / or calcium-magnesium-aluminosilicate (CMAS) resistance, but is not limited thereto.

[0028] For example, in some embodiments, the coating or its component layer can be selected to have a CTE that substantially matches the CTE of the underlying substrate (e.g., the surface of the component in contact with the coating). Alternatively or additionally, in some embodiments, the coating or its component layer can be formed from a mixed oxide or a two-phase oxide (e.g., a two-phase material formed from yttria-stabilized zirconia (YSZ) and α-alumina, or a two-phase material formed from zirconia and mullite) to shift the CTE of the coating to substantially match, for example, the CTE of the underlying substrate. In some cases, the mismatch in thermal expansion between the coating and the substrate material can generate stress when the temperature changes (e.g., during cooling from normal operating temperature or due to a rapid change in temperature). Such a thermal expansion mismatch can be expressed as strain and can be calculated as the integral of the difference in CTE between the coating and the substrate over the temperature change. The thermal expansion stress is the product of the thermal expansion strain and the corresponding modulus of elasticity. By forming a coating having a CTE that substantially matches the CTE of the substrate, such thermal expansion stress can be minimized or at least reduced, thereby improving the protective performance and / or reliability of the coating.

[0029] Alternatively or additionally, in some embodiments, the coating or its component layers can be selected to have a customized porosity, for example, by controlling the temperature at which the UHS is performed. For example, UHS performed at a lower sintering temperature can result in a sintered layer with a higher porosity. In some embodiments, the porosity in different layers of the coating can be adjusted to achieve the best, or at least improved, insulation and / or modulus of elasticity match, for example, by using a staged UHS run with different temperatures and / or durations. In some embodiments, the coating can have a dense top layer (e.g., the outermost or exposed layer) and a porous intermediate layer (e.g., between the top layer and the substrate) to, for example, enhance the heat insulation properties of the coating and / or reduce the volatilization of SiO2 and the formation of glass. Alternatively, in some embodiments, the top layer of the coating can be porous, for example, a porous Gd2Zr2O7 layer. Indeed, the UHS-based methods disclosed herein can provide unprecedented flexibility and efficiency in the manufacture and development of high-quality coatings with different layer arrangements, thicknesses, and / or porosity levels, as well as novel layer compositions.

[0030] In some embodiments, UHS can provide rapid heating to sintering temperatures, which can avoid or at least reduce undesirable phase changes typically encountered with conventional coating techniques. For example, a coating having one or more layers of α-alumina can be formed from γ-alumina via UHS. By air plasma spraying or electron beam physical vapor deposition, a coating of a metastable or amorphous alumina phase is produced. During the phase transition from the metastable phase to the stable α-alumina phase, a large volume shrinkage occurs that exceeds the strength of the coating. These volume shrinkages can lead to cracking, which in turn exposes the underlying material (e.g., the surface of the component) to oxidation. Alternatively or additionally, in some embodiments, the rapid heating and high temperatures enabled by UHS can enable the formation of novel coating compositions that were not possible with conventional coating techniques. For example, CoAl2O4 can be produced by UHS of a mixture of constituent oxides such as CoO and Al2O3.

[0031] In some embodiments, a multilayer coating can be produced on a complex (e.g., non-planar or contoured) surface of a component (e.g., a three-dimensional turbine blade shape) using UHS, for example, by using a flexible heating element (e.g., a heating film or felt) that conforms to the surface of the component or by using a sacrificial heating member (e.g., a carbon film) conformally deposited over the surface of the component. In some embodiments, a multilayer coating can be produced from a multilayer tape cast, followed by one or more UHS iterations to densify the tape cast.

[0032] Coating of Components As described above, in some embodiments, an environmental-thermal barrier (ETB) coating can be formed via UHS on a substantially non-planar surface of a component. For example, FIG. 1A shows a UHS-formed ETB coating 104 formed on a curved surface portion 102 of a coated component 100. The ETB coating 104 can include a single layer or multiple layers (e.g., two or more distinct layers), and can have an overall thickness t1 (e.g., measured in a direction substantially perpendicular to the adjacent surface portion 102) within 2 mm, e.g., in the range of 100 μm to 2 mm. In some embodiments, a bond coat (e.g., an adhesion promoting layer such as, but not limited to, a nickel-chromium-aluminum alloy or a platinum nickel aluminide alloy) can be provided between the ETB coating 104 and the surface portion 102 (e.g., when the bond coat is not formed by UHS), or as a component layer of the ETB coating in contact with the surface portion 102 (e.g., when the bond coat is formed by UHS).

[0033] In some embodiments, the ETB coating material can have a coefficient of thermal expansion (CTE) that substantially matches the CTE of the underlying substrate 102, and thus, the ETB coating 104a formed by UHS can include, for example, as shown in FIG. 1B, a single layer 106 (e.g., a top coat formed directly on the substrate surface). In some embodiments, the substrate 102 can be formed from SiC, and the layer 106 can be formed from mullite, yttrium disilicate (YDS), hafnium silicate (Hf4SiO4), yttrium phosphate (YPO4), or any combination thereof. Alternatively, in some embodiments, the substrate 102 can be formed from alumina (e.g., α-alumina), and the layer 106 can be yttrium aluminum perovskite (YAP), yttrium aluminum garnet (YAG), barium zirconate (BaZrO3), ytterbium phosphate (YbPO4), yttrium monosilicate (YMS), Er4Hf3O 12, can be formed from ytterbium oxide (Yb2O3), mullite, gadolinium zirconate (Gd2Zr2O7), or any combination thereof. Alternatively, in some embodiments, the substrate 102 can be a NbSi2-coated C103 alloy substrate, and the layer 106 can be alumina (e.g., α-alumina), mullite, BaZrO3, Er4Hf3O 12 , YMS, or any combination thereof.

[0034] Alternatively, in some embodiments, there may be a relatively large CTE mismatch between the substrate and one or more ETB coating materials, and thus the ETB coating can include, for example, one or more additional layers having an intermediate CTE and / or modulus of elasticity. Alternatively or additionally, the additional layer can have a different porosity, for example, being more porous than the top layer of the ETB coating, thereby further improving the heat insulation and / or reducing the volatilization and glass formation of SiO2. Alternatively or additionally, the additional layer can be used to minimize or at least reduce volatilization in high-speed steam (e.g., by adding an outer layer with low intrinsic volatility), improve adhesion to the underlying substrate (e.g., by adding a bond coat), and / or provide gas barrier (e.g., by acting as an airtight layer to minimize or at least reduce air ingress at high temperatures), etc., although not limited thereto. Alternatively or additionally, the additional layer can be used to provide radiation reflection characteristics, for example, by providing an alternating arrangement of layers having different refractive indices.

[0035] For example, in some embodiments, the two-layer ETB coating 104b formed by UHS can include a bottom layer 108 and a top layer 110, as shown in FIG. 1C. The bottom layer 108 can be formed on and in direct contact with the substrate 102, and the top layer 110 can be formed on and in direct contact with the bottom layer 108, with the top surface of the top layer 110 being exposed. In some embodiments, the substrate 102 can be formed from SiC, the bottom layer 108 can be formed from mullite and / or Hf4SiO4, and the top layer 110 can be formed from YMS. Alternatively, in some embodiments, the substrate 102 can be formed from a C103 alloy, the bottom layer 108 can be formed from niobium silicide (NbSi2), and the top layer 110 can be formed from alumina (e.g., α-alumina), mullite, BaZrO3, Er4Hf3O 12 , YMS, or any combination thereof. Alternatively, in some embodiments, the substrate 102 can be formed from alumina (e.g., α-alumina), the bottom layer 108 can be formed from mullite, and the top layer 110 can be formed from YMS.

[0036] For example, in some embodiments, the three-layer ETB coating 104c formed by UHS can include a bottom layer 112, an intermediate layer 114, and an upper layer 116, as shown in FIG. 1D. The bottom layer 112 can be formed in direct contact on the substrate 102, and the intermediate layer 114 can be formed in direct contact on the bottom layer 112. The top layer 116 is formed on and in direct contact with the intermediate layer 114, and the upper surface of the top layer 116 is exposed. In some embodiments, the substrate 102 can be formed from SiC, the bottom layer 112 can be formed from mullite and / or Hf4SiO4, the intermediate layer 114 can be formed from mullite and / or YDS, and the upper layer can be formed from YMS. For example, the ETB coating formed on the SiC substrate can have a laminate of YMS, mullite, and Hf4SiO4 in order from top to bottom. In another example, the ETB coating formed on the SiC substrate can have a multilayer stack of YMS, YDS, and mullite in order from top to bottom.

[0037] In some embodiments, the substrate 102 can be formed from a C103 alloy, the bottom layer 112 can be formed from NbSi2, the intermediate layer 114 can be formed from BaZrO3, alumina (e.g., α-alumina), mullite, Er4Hf3O 12 , or a combination thereof, and the upper layer can be formed from YMS. For example, the ETB coating formed on the C103 alloy substrate can have a laminate of YMS, BaZrO3, and NbSi2 in order from top to bottom. For example, the ETB coating formed on the C103 alloy can have a laminate of YMS, alumina, and NbSi2 in order from top to bottom. In yet another embodiment, the ETB coating formed on the C103 alloy substrate can have a laminate of YMS, mullite, and NbSi2 in order from top to bottom. In yet another embodiment, the ETB coating formed on the C103 alloy substrate can have a laminate of YMS, Er4Hf3O 12 , and NbSi2 in order from top to bottom.

[0038] For example, in some embodiments, the four-layer ETB coating 104d formed by UHS can include a bottom layer 118, a lower intermediate layer 120, an upper intermediate layer 122, and an upper layer 124, as shown in FIG. 1E. The bottom layer 118 can be formed in direct contact on the substrate 102, and the lower intermediate layer 120 can be formed in direct contact on the bottom layer 118. The upper intermediate layer 122 can be formed in direct contact on the lower intermediate layer 120, and the upper layer 124 can be formed in direct contact on the upper intermediate layer 122, with the upper surface of the upper layer 124 being exposed. In some embodiments, the substrate 102 can be formed from SiC, the bottom layer 118 can be formed from mullite, the lower intermediate layer 120 can be formed from YDS, the upper intermediate layer 122 can be formed from YMS, and the upper layer 124 can be formed from gadolinium zirconate (Gd2Zr2O7), yttria (Y2O3), ytterbium oxide (Yb2O3), or any combination thereof. For example, the ETB coating formed on the SiC substrate can have a laminate of porous Gd2Zr2O7, YMS, YDS, and mullite in order from top to bottom. In another embodiment, the ETB coating formed on the SiC substrate can have a multi-layer laminate of Y2O3, YMS, YDS, and mullite in order from top to bottom. In yet another embodiment, the ETB coating formed on the SiC substrate can have a multi-layer laminate of Yb2O3, YMS, YDS, and mullite in order from top to bottom.

[0039] In some embodiments, the substrate 102 can be formed from a C103 alloy, the bottom layer 118 can be formed from NbSi2, the lower intermediate layer 120 can be formed from mullite, the upper intermediate layer 122 can be formed from YMS, and the upper layer 124 can be formed from gadolinium zirconate (Gd2Zr2O7), yttria (Y2O3), ytterbium oxide (Yb2O3), or any combination thereof. For example, an ETB coating formed on a C103 alloy substrate can have a laminate of porous Gd2Zr2O7, YMS, mullite, and NbSi2 in order from top to bottom. In another embodiment, an ETB coating formed on a C103 alloy substrate can have a laminate of Y2O3, YMS, mullite, and NbSi2 in order from top to bottom. In yet another embodiment, an ETB coating formed on a C103 alloy substrate can have a laminate of Yb2O3, YMS, mullite, and NbSi2 in order from top to bottom.

[0040] Figures 1A - 1E show an ETB coating in direct contact with a substrate (e.g., via the bottommost layer of the coating), but according to one or more contemplated embodiments, one or more intervening layers (e.g., a bond coat) can be provided between the ETB coating and the substrate. In some embodiments, the intervening layer can be formed on the substrate by a method other than UHS. Alternatively or additionally, the intervening layer can be considered as part of the substrate (e.g., as a surface layer). For example, FIG. 1F shows a substrate 102 having a substrate 128 with a surface layer 126 formed thereon, while a three - layer ETB coating 104e is formed on the surface layer 126 (e.g., via the bottommost layer of the coating 104e) and is in direct contact with that surface layer 126. In some embodiments, the substrate 128 can be formed of a C103 alloy and the intervening layer 126 can be formed of NbSi2.

[0041] A coating having one to four layers is shown in FIGS. 1B - 1F, but embodiments of the disclosed subject matter are not limited thereto. Rather, for coatings according to one or more contemplated embodiments, any number of layers are possible. Additionally, although FIG. 1F shows a substrate 102 including a single surface layer 126, according to one or more contemplated embodiments, any number of layers for the substrate (or between the substrate and the UHS - forming coating, whether single - layer or multi - layer) are also possible.

[0042] In some embodiments, the coating formed by UHS may be other than an ETB coating. For example, the single layer 106 in FIG. 1B can be configured as a bond coat (e.g., a metal layer or an intermetallic layer) on which no other layer (e.g., a ceramic (oxide) coating) is formed. In another example, the single layer 106 in FIG. 1B can be an environmental barrier coating (e.g., a metal layer) without other layers (e.g., a ceramic (oxide) coating) formed thereon. Other configurations and variations for the coating formed by UHS are also possible according to one or more contemplated embodiments.

[0043] Configuration of Ultra - High - Speed High - Temperature Sintering (UHS) Referring to FIG. 2A, an exemplary UHS process for forming one or more layers of a coating 230 on a component 202 is shown. During a first deposition stage 200, one or more first precursors (e.g., powders) can be provided on the exposed surface of the component 202. In the example shown in FIG. 2A, a print head 204 is used to deposit a first precursor layer 206, but any deposition method, such as spray coating, dip coating, printing, tape casting, and slip casting, etc., can be used to form the first precursor layer 206, but is not limited thereto.

[0044] In the first heater positioning step 210, one or more joule heating elements 208 can be positioned relative to the first precursor layer 206. In some embodiments, the joule heating element 208 can be flexible (e.g., as a thin film having a thickness ≦ 1 mm), and the joule heating element can be arranged to conform to the shape of the surface of the component 202. For example, in some embodiments, the heating element can be arranged such that each of its parts is in contact with a corresponding opposing part of the precursor layer. Alternatively, in some embodiments, the heating element can be arranged such that only a portion of it is in contact with the precursor layer. Alternatively or additionally, in some embodiments, the heating element can be initially arranged in contact with the precursor layer (e.g., at one or several points), but then removed from contact, for example, during UHS (e.g., carbide formation) and / or melting of the component 202, in order to avoid undesirable interactions between the heating element and the precursor. Alternatively or additionally, in some embodiments, the heating element can be spaced from the component 202 in the first heater positioning step and arranged, for example, at least adjacent to the first precursor layer 206 (e.g., at a distance ≦ 1 cm). In some embodiments, the joule heating element spaced from the component conforms to the shape of the surface of the component, for example, each part of the heating element is substantially equidistant from the corresponding opposing part of the precursor layer and / or the surface of the underlying component.

[0045] In some embodiments, the Joule heating element 208 can be formed of a conductive carbon (e.g., carbon felt or film, graphite felt or film, carbon film, graphite film, carbon nanotube film). Alternatively or additionally, in some embodiments, the Joule heating element 208 can be formed of other conductive materials such as metals and carbides, but is not limited thereto. In some embodiments, the heater positioning step 210 can include moving the Joule heating element 208 from a previous position above or on the component 202 to provide continuous sintering across the surface of the component 202 (e.g., by gradually or periodically moving the Joule heating element while it is energized).

[0046] In a first UHS step 220, the power supply 212 can direct a current 214 through the Joule heating element 208 to cause Joule heating thereof. In some embodiments, the direction of the current through the heating element(s) can be substantially parallel to the surface of the component 202 and / or the precursor layer 206, e.g., from an electrical connection at one end of the heating element 208 to an electrical connection at the opposite end of the heating element 208. The Joule heating of the heating element 208 can expose the precursor layer 206 to a sintering temperature for a limited time (e.g., 10 seconds to 2 minutes), which is effective to convert the first precursor layer 206 (e.g., powder) to a first sintered layer 216 (e.g., a continuous porous or dense layer) without thermal degradation of the underlying component.

[0047] After the first UHS stage 220, additional layers can optionally be formed over the first sintered layer 216, for example, to provide a multi-layer coating (e.g., an ETB coating). For example, in a second deposition stage 224, one or more second precursors (e.g., powders) can be provided on the exposed surface of the first sintered layer 216. In the example shown in FIG. 2A, a separate printhead 218 is used to deposit the second precursor layer 222, but in some embodiments, the same printhead 204 used in the first deposition stage 200 can be used. Further, any deposition method can be used to provide the second precursor layer 222, such as, but not limited to, pre-coating, dip coating, printing, tape casting, and slip casting.

[0048] One or more joule heating elements 208 can then be positioned relative to the second precursor layer 222 and energized in a manner similar to that described above for the first heater positioning stage 210 and the first UHS stage 220, respectively, via an electric current 214. Joule heating of the heating element 208 can expose the precursor layer 222 to the sintering temperature for a limited time, which is effective to convert the second precursor layer 222 (e.g., powder) to a second sintered layer 228 (e.g., a continuous porous or dense layer) without thermal degradation of the underlying components, thereby forming a coated component 232. In some embodiments, the sintering temperature and / or the UHS duration of the second UHS stage 226 can be different from that of the first UHS stage 220. In the example shown in FIG. 2A, the same joule heating element and power supply 212 are used for the first UHS stage 220 and the second UHS stage 226, but different joule heating elements and / or power supplies can be used for each stage. In some embodiments, stages 224-226 can be repeated to add additional layers for coating above the first and second sintered layers.

[0049] In the example shown in FIG. 2A, the first and second sintered layers are formed by successive application of UHS. Alternatively or additionally, in some embodiments, as shown, for example, in FIG. 2B, multiple layers can be simultaneously formed on the component via a single UHS application. During the first deposition step 240, the first precursor layer 206 can be provided on the exposed surface of the component 202 in a manner similar to that described above for the first deposition step 200 of FIG. 2A. After the first deposition step 240 and prior to UHS, one or more additional layers can be formed on the first precursor layer 206, for example, to provide a multilayer coating (e.g., an ETB coating). For example, in the second deposition step 242, one or more second precursors (e.g., powders) can be provided above the exposed surface of the first precursor layer 206. In the example shown in FIG. 2B, a separate printhead 244 is used to deposit the second precursor layer 246, but in some embodiments, the same printhead 204 as in the first deposition step 240 can be used. Further, any deposition method can be used to provide the second precursor layer 246, such as, but not limited to, spray coating, dip coating, printing, tape casting, and slip casting.

[0050] In the heater positioning step 248, one or more joule heating elements 208 can be positioned to contact or at least be adjacent to (e.g., at a distance of ≤ 1 cm) the top layer, e.g., the second precursor layer 246, in a manner similar to that described above for the first heater positioning step 210 of FIG. 2A. In the UHS step 250, the power supply 212 passes an electric current 214 through the joule heating element 208 in a manner similar to that described above for the first UHS step 220 or the second UHS step 226 of FIG. 2A, causing joule heating thereof, thereby enabling the simultaneous sintering of the layers 206 and 246 without thermal degradation of the underlying components. Thus, the resulting coated component 252 can have a multilayer coating 256 (e.g., an ETB coating) formed by the first sintered layer 216 and the second sintered layer 254. In some embodiments, steps 240, 242, 248, and / or 250 can be repeated to add additional layers for coating above the first and second sintered layers.

[0051] In some embodiments, the Joule heating element may have a size (e.g., surface area) that is smaller than the size of the surface of the component to be coated, such that at least a portion of the component extends beyond the heating zone and / or is exposed from the heating element. In some embodiments, the region of the component outside the heating zone can be cooled during the application of the UHS, for example, to minimize or at least reduce the thermal degradation of the component underlying in the UHS. For example, FIG. 2C shows an exemplary configuration 260 for processing a precursor layer 264 on a component 262 (e.g., a long and / or thick SiC substrate) via a UHS (e.g., via a current 214 from a power source 212 through the Joule heating element 208). At least a portion 266 of the component 262 can be exposed from the heating element 208 during sintering, and the portion 266 can be in thermal communication with a cooling mechanism 268 (e.g., for conductive, convective, and / or radiative heat transfer) (e.g., via an active and / or passive cooling mechanism). Other configurations for cooling the coated component during UHS application are also possible according to one or more contemplated embodiments.

[0052] Flexible Joule heating elements (e.g., flexible membranes such as carbon felt) can be bent to conform to various surfaces, but some components can have complex surface shapes that make it difficult to conform using separate heating elements. In some embodiments, the heating element can instead be a layer deposited over the component (e.g., the outermost precursor layer), which can be energized to provide a UHS (e.g., by passing an electric current) and then removed once the underlying precursor is sintered (e.g., by heating in an oxygen atmosphere).

[0053] For example, FIG. 2D shows an exemplary UHS process for forming a layer of coating (e.g., an ETB coating) on a component 270 using an in-situ heating element. In the illustrated example, the component 270 is configured as a turbine blade, although the disclosed method can also be applied to other types of components. The turbine blade includes an airfoil 271 having a leading edge 277 and a trailing edge 279. The airfoil 271 is disposed on and extends from one side of a platform 273, while a dovetail 275 on the opposite side of the platform 273 is used to secure the blade to a turbine disk. In some embodiments, the surfaces of the airfoil 271 and the platform 273 can be provided with an ETB coating, and the curvature of the airfoil 271 and / or the intersection between the platform 273 and the airfoil 271 can provide a complex surface 272 that can be difficult for a heating element to conform to.

[0054] In the precursor deposition step 276, one or more first precursors can be deposited (e.g., via spray coating, dip coating, printing, tape casting, slip casting, etc.) on the surfaces of the platform 273 and the airfoil 271 to form a first precursor layer 274. After the first precursor layer 274 is formed, in the heating film deposition step 280, a Joule heating film 278 can be formed on or above the first precursor layer 274 (e.g., via spray coating, dip coating, printing, tape casting, slip casting, etc.). In some embodiments, the Joule heating film 278 can be formed from a conductive carbon such as carbon black, carbon nanotubes, graphite, or any combination thereof. For example, the Joule heating film 278 can have a thickness (t2) of 1 mm or less and / or a resistivity of 0.02 - 1 Ω·m.

[0055] In UHS stage 282, power supply 284 can conduct current 286 through joule heating film 278 to cause the joule heating thereof. The joule heating during the UHS process (e.g., at least UHS stage 282, as well as any of the above-described UHS stages 220, 226, 250) can be carried out in an inert atmosphere 283 or in a vacuum. In some embodiments, the direction of the current through the heating film can be substantially parallel to the surface of component 271 and / or precursor layer 274, for example, from the electrical connection at one end of heating film 278 to the electrical connection at the opposite end of heating film 278. The joule heating of heating film 278 can expose precursor layer 274 to the sintering temperature for a limited time (e.g., 10 seconds to 2 minutes), which is effective to convert the first precursor layer 274 (e.g., powder) into sintered layer 290 (e.g., continuous porous or dense layer) without thermal degradation of the underlying components.

[0056] After UHS stage 282, heating film 278 can be removed in removal stage 288, thereby exposing layer 290 within coated component 292. In some embodiments, heating film 278 can be heated (e.g., at 1000 °C or lower, e.g., 400 - 500 °C) in an oxygen atmosphere 285 so as to be combusted and removed, for example, by converting the carbon of film 278 into vapor (e.g., gaseous carbon dioxide). Other mechanisms for removing the deposited heating film 278 are also possible according to one or more contemplated embodiments.

[0057] Manufacturing method Figure 3A shows a method 300 for the manufacture and use of a component to be coated. Method 300 can start with a processing step 302 where a component to be coated can be selected. In some embodiments, the selection of the component can include selecting a material of the component (e.g., a coating substrate). In some embodiments, the material for the component can be a metal, a metal alloy, a metal oxide, and / or a ceramic matrix composite. For example, the component can be formed from a refractory high-entropy superalloy. In some embodiments, the component can include silicon carbide (SiC), niobium (Nb), hafnium (Hf), titanium (Ti), molybdenum (Mo), silicon (Si), boron (B), alumina (Al2O3), or any combination or alloy thereof. For example, the component can be formed from an alloy or cermet including SiC, a Mo-Si-B alloy, Nb silicide, a C103 alloy, alumina, or a nickel-based superalloy. In some embodiments, the component can be part of a gas turbine, such as a turbine blade or a combustor. However, embodiments of the disclosed subject matter are not limited to coating gas turbine engine components. Rather, in some embodiments, the selected component can be for any environment where high temperature and environmental resistance are desirable, such as, but not limited to, jet engines, rocket engines, nuclear reactors, etc.

[0058] Method 300 can proceed to a processing step 304 where one or more precursors (e.g., a first precursor such as a powder) can be selected. In some embodiments, the selection of the precursor can be based on thermal conductivity, thermal stability, recession rate, substrate-coating compatibility, CTE compatibility, fracture resistance, CMAS corrosion resistance, material cost, material availability, and / or any other desired selection criteria. In some embodiments, the precursor selected in processing step 304 can include a plurality of materials incorporated into a single layer, for example, to form a two-phase layer.

[0059] Method 300 can proceed to process step 306, where the selected precursor can be provided on or can cover the surface of the component. In some embodiments, the provision of process step 306 can include spray coating, dip coating, printing, tape casting, slip casting, and / or any other deposition method. In some embodiments, the provision of process step 306 can include one or more pre-sintering steps such as, but not limited to, drying and / or pre-treatment (e.g., firing) of the deposited slurry.

[0060] Method 300 can proceed to decision step 308, where it is determined whether an additional precursor layer (e.g., a second precursor) should be provided and simultaneously sintered (e.g., co-sintered). If co-sintering of the layers is desired (e.g., if sintering of the first and second precursors is possible at the same sintering temperature and duration), method 300 can return to process step 304, select a precursor in process step 306, and then provide the selected precursor.

[0061] If co-sintering of the layers is not desirable, or if all desired additional layers have been provided in the determination step 308, method 300 can proceed to determination step 310, where it is determined whether the surface of the component has a complex non-planar or contoured shape. In some embodiments, if the surface of the component has a complex non-planar or contoured shape, an in-situ heating film can be used to provide UHS. In such a case, method 300 can proceed from determination step 310 to processing step 312, where a heating film can be formed on the exposed precursor(s) (e.g., the uppermost precursor layer). In some embodiments, the heating film can be a conductive carbon film (e.g., formed from carbon nanotubes or carbon black) formed on the surface of the component by spray coating, dip coating, printing, tape casting, slip casting, or any other deposition method. In some embodiments, providing processing step 312 can include processing the heating film (e.g., to dry the deposited film) and / or electrically connecting to the heating film (e.g., by attaching electrical connections to both ends of the film).

[0062] If the surface of the component does not have a complex non-planar or contoured shape, or if it can be otherwise accommodated by the flexibility of separate heating elements in determination step 310, method 300 can proceed to processing step 314, where separate Joule heating elements (e.g., a conductive felt, film, or sheet formed from metal, carbide, or carbon) can be provided in contact with, or adjacent to (e.g., at a certain distance from), the exposed precursor(s) (e.g., the uppermost precursor layer). In some embodiments, providing processing step 314 can include shaping the heating elements to conform to the shape of the surface of the component.

[0063] Method 300 can proceed to process step 316, where a heating element can be used to subject the precursor to UHS. For example, a current can pass through the heating element (e.g., an in-situ heating film deposited on the precursor(s), or a separate heating element provided on or adjacent to the precursor(s)) to cause its Joule heating. In some embodiments, Joule heating can be effective to produce a sintering temperature in the range of 500 - 3273 K, e.g., at least 2000 K, and the sintering temperature of UHS can be maintained for a duration of 10 minutes or less (e.g., in the range of 10 seconds to 2 minutes). In some embodiments, process step 316 can include heating to the sintering temperature and / or cooling from the sintering temperature at a ramp rate of, for example, at least 10 2 K / s (e.g., 10 3 ~10 5 K / s). In some embodiments, UHS can be carried out under an inert environment or in a vacuum. Alternatively, in some embodiments, UHS can be carried out in different environments and / or at different temperatures.

[0064] Method 300 can proceed to process step 318, where the heating element can be removed. In some embodiments, when the heating element is an in-situ heating film, the removal in process step 318 can include burning the heating film, for example, by exposing it to a high temperature of 400 - 500 °C in an oxygen atmosphere to convert the carbon in the film to vapor (e.g., gaseous carbon dioxide). Alternatively, when the heating element is a separate heating element, the removal in process step 318 can include moving the heating element away from the surface of the component for disposal and / or reuse (e.g., for UHS of another part of the component or for UHS of another component).

[0065] Method 300 can proceed to decision step 320, where it is determined whether an additional precursor layer (e.g., a second precursor) is to be provided and sequentially sintered. If continuous sintering of the layers is desired (e.g., if the sintering of the first and second precursors is at different sintering temperatures and / or durations), method 300 can return to processing step 304 for precursor selection and subsequent precursor supply 306, heating element supply 312 or 314, UHS 316, and heating element removal 318.

[0066] If continuous sintering of additional layers is not desired, or if all desired additional layers have been provided in decision step 320, method 300 can proceed to processing step 322, where the coated component can be used or processed for use. In some embodiments, the coated component can be used alone or with other coated or uncoated components in high-temperature applications (e.g., at least 1300 °C, e.g., about 1700 °C), such as in a gas turbine. Alternatively or additionally, in some embodiments, the use in processing step 322 can include tests (e.g., thermal cycling and / or torch tests) to determine, for example, the suitability of the coating for a particular application.

[0067] Steps 302 - 322 of method 300 have been described as being performed once, but in some embodiments, multiple repetitions of a particular processing step can be used before proceeding to the next decision or processing step. Additionally, although steps 302 - 322 of method 300 are shown and described separately, in some embodiments, the processing steps can be combined and performed together (simultaneously or sequentially). Further, although FIG. 3A shows a particular order of steps 302 - 322, embodiments of the disclosed subject matter are not limited thereto. Indeed, in particular embodiments, the steps can occur in an order different from that shown or simultaneously with other steps. In some embodiments, method 300 can comprise only some of steps 302 - 322 of FIG. 3A.

[0068] Computer Implementation Figure 3B shows a generalized example of a suitable computing environment 330 in which the innovations described can be implemented, such as, for example, a power supply 212, a cooling mechanism 268, a controller for a UHS and / or coating process, and / or aspects of method 300, but is not limited thereto. Since the computing environment 330 can implement innovations in a variety of general-purpose or special-purpose computing systems, it is not intended to suggest any limitation with respect to the scope of use or functionality. For example, the computing environment 330 can be any of a variety of computing devices (e.g., desktop computer, laptop computer, server computer, tablet computer, etc.).

[0069] Referring to Figure 3B, the computing environment 330 includes one or more processing units 334, 336 and memories 338, 340. In Figure 3B, this basic configuration 350 is included within the dashed lines. The processing units 334, 336 execute computer-executable instructions. The processing unit can be a central processing unit (CPU), a processor within an application specific integrated circuit (ASIC), or any other type of processor (e.g., a hardware processor, a graphics processing unit (GPU), a virtual processor, etc.). In a multi-processing system, multiple processing units execute computer-executable instructions to increase processing power. For example, Figure 3B shows a central processing unit 334 and a graphics processing unit or coprocessing unit 336. The tangible memories 338, 340 can be volatile memory (e.g., registers, cache, RAM), non-volatile memory (e.g., ROM, EEPROM, flash memory, etc.), or some combination of the two accessible by the processing unit(s). The memories 338, 340 store software 332 that implements one or more of the innovations described herein in the form of computer-executable instructions suitable for execution by the processing unit(s).

[0070] The computing system can have additional features. For example, the computing environment 330 includes a storage device 360, one or more input devices 370, one or more output devices 380, and one or more communication connections 390. An interconnect mechanism (not shown), such as a bus, a controller, or a network, interconnects the components of the computing environment 330. Typically, an operating system software (not shown) provides an operating environment for other software executing in the computing environment 330 and coordinates the operation of the components of the computing environment 330.

[0071] The tangible storage device 360 may be removable or non-removable and can include a magnetic disk, magnetic tape or cassette, CD-ROM, DVD, or any other medium that can be used to store information in a non-transitory manner and can be accessed within the computing environment 330. The storage device 360 can store instructions for the software 332 that implements one or more of the innovations described herein.

[0072] (One or more) input devices 370 can be a touch input device such as a keyboard, mouse, pen, or trackball, a voice input device, a scanning device, or any other device that provides input to the computing environment 330. The output device 380 can be a display, printer, speaker, CD writer, or any other device that provides output from the computing environment 330.

[0073] The communication connection 390 enables communication to another computing entity via a communication medium. The communication medium conveys information such as computer-executable instructions, audio or video input or output, or other data in a modulated data signal. A modulated data signal is a signal in which one or more of its characteristics are set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, the communication medium can use electrical, optical, radio frequency (RF), or other carrier.

[0074] Any of the disclosed methods may be implemented as computer-executable instructions stored on one or more computer-readable storage media (e.g., one or more optical media disks, volatile memory components (such as DRAM or SRAM), or non-volatile memory components (such as flash memory or hard drive)) and executed on a computer (e.g., any commercially available computer including a smartphone or other mobile device including computing hardware). The term computer-readable storage media does not include communication connections such as signals and carrier waves. Any computer-executable instructions for implementing the disclosed techniques, as well as any data created and used during the implementation of the disclosed embodiments, may be stored on one or more computer-readable storage media. The computer-executable instructions may be, for example, a dedicated software application or a part of a software application that is accessed or downloaded via a web browser or other software application (such as a remote computing application). Such software may be executed, for example, on a single local computer (e.g., any suitable commercially available computer) or in a network environment (e.g., via the Internet, a wide area network, a local area network, a client-server network (such as a cloud computing network), or any other such network) using one or more networked computers.

[0075] For clarity, only some selected aspects of the software-based implementation form are described. Other details well known in the art are omitted. For example, it should be understood that the disclosed technology is not limited to any particular computer language or program. For example, aspects of the disclosed technology can be implemented by software written in C++, Java™, Python®, and / or any other suitable computer language. Similarly, the disclosed technology is not limited to any particular computer or hardware type. Specific details of suitable computers and hardware are well known and need not be described in detail in this disclosure.

[0076] It should also be fully understood that any function described herein can be executed, at least in part, by one or more hardware logic components instead of software. For example, by way of non-limiting example, exemplary types of hardware logic components that can be used include field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system on a chip systems (SOCs), complex programmable logic devices (CPLDs), and the like.

[0077] Furthermore, any of the software-based embodiments (e.g., including computer-executable instructions for causing a computer to execute any of the disclosed methods) can be uploaded, downloaded, or remotely accessed via suitable communication means. Such suitable communication means include, for example, the Internet, the World Wide Web, an intranet, a software application, a cable (including an optical fiber cable), magnetic communication, electromagnetic communication (including high-frequency, microwave, and infrared communication), electronic communication, or other such communication means. In any of the above examples and embodiments, the provision of requests (e.g., data requests), instructions (e.g., data signals), commands (e.g., control signals), or any other communication between systems, components, devices, etc. can be by the generation and transmission of suitable electrical signals by a wired connection or a wireless connection.

[0078] Fabrication Examples and Experimental Results A database of thermal expansion coefficients (CTEs) at various temperatures for various substrate materials and coating candidates was developed. Potential coating materials were analyzed with respect to representative substrates having different CTEs (e.g., SiC, C103 alloy, and α-alumina). Based on the CTE calculations, a plurality of potential coating compositions having relatively acceptable CTE compatibility were identified for each substrate. High-throughput ultra-high-speed sintering (UHS) followed by trial-and-error experiments (e.g., coating cycles and torch tests) were performed to select coating-substrate compositions having better thermomechanical stability.

[0079] To form a coating on a substrate for testing, continuous spray coatings of different particle inks were used, enabling the high-throughput and cost-effective formation of multilayer coatings with different compositions, layer stacking orders, and layer thicknesses. UHS enables the sintering of multilayer ETB coatings in a single run in less than one minute to achieve high throughput, using multiple samples in each run. A carbon felt strip was used as a heating element and placed on top of the coating to be sintered. A DC power supply (with adjustable current and voltage) was used to raise the temperature of the heating element via self-induced Joule heating. The temperature of the heating element was measured from the UV-Vis spectrum captured by a high-speed camera. The sintering temperature depends on the material of the precursor (e.g., powder) for the coating, but generally ranged from 1500 to 3000 °C. The duration of the applied sintering temperature generally ranged from 10 seconds to 2 minutes.

[0080] ETB coatings with different compositions, thicknesses, and layer arrangements were fabricated on alternative alloy substrates such as Nb silicide alloys, polycrystalline SiC, and high-melting-point high-entropy superalloys. The coated substrates were then tested for thermal conductivity, thermal stability, and resistance to thermal cycling and calcium-magnesium-aluminosilicate (CMAS).

[0081] Figure 4A shows an example of a two-layer coating formed on a SiC substrate via UHS. The two-layer coating of Figure 4A includes a top layer formed of barium strontium aluminum silicate (BSAS) and a bottom layer of alumina. Figure 4B shows another example of a two-layer coating formed on a C103 alloy substrate via UHS. The two-layer coating of Figure 4B includes a top layer formed from yttrium monosilicate (YMS) and a bottom layer of niobium disilicide (NbSi2) layer. The two-layer coatings of Figures 4A-4B exhibit good uniformity, and each top coat exhibits good density (e.g., substantially non-porous) so as to minimize volatile SiO2 in the coating. Energy-dispersive X-ray spectroscopy (EDS) line scans of the two-layer coating of Figure 4B show a distinct chemically distinguishable boundary between the layers of the coating, and thus, even at the very high temperatures (e.g., ≧1500 °C) reached during the UHS process, the interlayer reaction is minimal and there is good interface stability.

[0082] The UHS process was used to customize the coating with respect to the CTE of the underlying substrate material. In some cases, a two-phase material with an adjusted CTE can be fabricated for the coating. For example, two-phase oxide coatings (e.g., yttria-stabilized zirconia (YSZ) and α-alumina) were formed by UHS at various sintering temperatures (e.g., 1800 °C for 10 seconds and 2500 °C for 10 seconds). Figure 7A shows a coating formed via UHS at 1800 °C, and Figures 7B-7C show coatings formed via UHS at 2500 °C, where the light phase corresponds to YSZ. As shown in the EDS mapping of Figure 7C, the coating retains a two-phase structure even at higher sintering temperatures. The coating also exhibits good adhesion to the underlying substrate.

[0083] Alternatively or additionally, as shown, for example, for the coated component 600 of FIG. 6A, a coating 604 including multiple layers (e.g., a periodic stack) can be used to customize the coating with respect to the CTE of the underlying substrate material 602. For example, using UHS, a coating of alternating layers of YSZ and α-alumina (e.g., a total of 7 layers) was produced. FIGS. 6B - 6C show the initial layers of YSZ and alumina (e.g., precursor tape layers) provided on a substrate via tape casting prior to sintering, and FIG. 6D shows the resulting structure having a multilayer coating after UHS.

[0084] In some cases, UHS can be used to produce coatings that are not currently possible with conventional manufacturing techniques. For example, a coating of α-alumina, the most stable phase of alumina, cannot be formed using conventional thermal spraying techniques. In contrast, UHS was used to convert a precursor powder of γ-alumina on a substrate (as shown by X-ray diffraction (XRD) analysis in FIG. 7A) to an α-alumina coating without phase transformation-induced cracking from sintering (as shown by XRD analysis in FIG. 7B).

[0085] A thermal cycle test system was used to test the stability of UHS-processed coatings at 1300 °C, particularly single-layer coatings of α-alumina on SiC substrates. A camera was used to image the coating during / after the cycle to detect spalling. An automated program was used to control the movement of the coated sample into and out of the furnace at specified time intervals (e.g., each cycle included 30 minutes in the furnace at 1300 °C and 25 minutes outside the furnace at room temperature). After repeating 500 times at 1300 °C, the α-alumina coating remained adhered to the underlying SiC substrate.

[0086] The examples of FIGS. 4A - 7B include components having a substantially flat surface to be coated, but by using a flexible heating element (e.g., flexible carbon felt), it may be possible to apply UHS to a sintered coating for a component having an irregular shape (e.g., a non - planar or contoured surface). The flexible heating element can be bent, shaped, or otherwise arranged to conform to (e.g., follow) the surface to be coated (e.g., in contact with or at a substantially constant distance from a precursor disposed on the surface of the component). To demonstrate this approach, a wing - shaped component derived from a portion of a niobium tube was used as a sample substrate. YMS was tape - cast onto the outer surface of the substrate as shown in FIG. 8A. Then, as shown in FIG. 8B, firing (e.g., at 200 °C for 0.5 h followed by 400 °C for 1.5 h) was performed, and thereafter, the coating remained adhered to the substrate. Next, as shown in FIG. 8C, UHS was performed by adaptively heating the YMS tape - coated substrate using a curved carbon felt heater. After UHS, as shown in FIG. 8D, the YMS coating was deposited onto and chemically adhered to the substrate.

[0087] Further examples of the disclosed technology In view of the above implementations of the disclosed subject matter, this application discloses additional examples in the appended claims listed below. Note that one feature of an appended claim alone, or two or more features of appended claims taken in combination, and optionally, further examples in combination with one or more features of one or more additional appended claims are also within the scope of the disclosure of this application.

[0088] Appended claim 1. (a) providing one or more first precursors above the surface of the component to be coated, (b) providing a heating element above the one or more first precursors, (c) sintering one or more first precursors by subjecting the one or more first precursors to a sintering temperature in the range of 500 to 3273 K (including both ends) for a duration of 10 minutes or less to form a first layer above the surface of the component, The sintering temperature is generated by passing an electric current through a heating element to cause Joule heating of the heating element. Method.

[0089] Appendix 2. Any item or example in this specification, particularly the method described in Appendix 1, wherein the provision in (b) is such that the heating element substantially conforms to the shape of the surface of the component.

[0090] Appendix 3. Any item or example in this specification, particularly the method described in any one of Appendices 1 to 2, wherein the first layer formed by (c) includes or is a layer of an environmental - thermal barrier (ETB) coating, an environmental barrier coating, or a bond coat.

[0091] Appendix 4. Any item or example in this specification, particularly the method described in any one of Appendices 1 to 3, wherein the provision in (a) includes spray coating, dip coating, printing, tape casting, slip casting, or any combination thereof.

[0092] Appendix 5. Any item or example in this specification, particularly the method described in any one of Appendices 1 to 4, wherein the heating element comprises a flexible membrane through which an electric current passes, the provision in (b) includes disposing the flexible membrane in contact with one or more first precursors or disposing the flexible membrane such that each part of the flexible membrane is spaced apart from the respective opposing part of the surface of the component by a substantially constant distance.

[0093] Appendix 6. Any item or example in this specification, in particular, the method described in any one of Appendices 1 to 5, wherein the heating element is formed of conductive carbon.

[0094] Appendix 7. Any item or example in this specification, in particular, the method described in Appendix 6, wherein the heating element comprises carbon felt, graphite felt, carbon film, graphite film, carbon nanotube film, or any combination of the foregoing.

[0095] Appendix 8. Any item or example in this specification, in particular, the method described in any one of Appendices 1 to 5, wherein the heating element is formed of metal or carbide.

[0096] Appendix 9. Any item or example in this specification, in particular, the method described in any one of Appendices 1 to 8, further comprising removing the heating element from or with respect to the component after (c).

[0097] Appendix 10. Any item or example in this specification, in particular, the method described in any one of Appendices 1 to 6, wherein the heating element comprises a conductive carbon film, and providing (b) comprises forming a conductive carbon film on one or more first precursors.

[0098] Appendix 11. Any item or example in this specification, in particular, the method described in any one of Appendices 1 to 7, 9, and 10, wherein the heating element comprises carbon black, carbon nanotubes, graphite, or any combination of the foregoing.

[0099] Appendix 12. Any item or example in this specification, in particular, the method described in any one of Appendices 1 to 11, wherein the thickness of the heating element is 1 mm or less.

[0100] Supplementary Note 13. A method according to any item or example in this specification, particularly any one of the methods in Supplementary Notes 1 to 12, wherein the resistivity of the heating element is in the range of 0.02 to 1 Ω·m.

[0101] Supplementary Note 14. A method according to any item or example in this specification, particularly the method described in any one of Supplementary Notes 10 to 13, further comprising heating the conductive carbon film in an oxygen atmosphere to convert the carbon film into vapor after (c).

[0102] Supplementary Note 15. A method according to any item or example in this specification, particularly the method described in Supplementary Note 14, wherein the heating for burning the carbon film is at a temperature of 1000 °C or lower, or a temperature lower than the sintering temperature.

[0103] Supplementary Note 16. A method according to any item or example in this specification, particularly the method described in any one of Supplementary Notes 1 to 15, wherein the sintering in (c) is performed in an inert gas environment or a vacuum environment.

[0104] Supplementary Note 17. A method according to any item or example in this specification, particularly the method described in any one of Supplementary Notes 1 to 16, wherein the component is a metal, a metal alloy, a metal oxide, a ceramic matrix composite, or any combination of the foregoing.

[0105] Supplementary Note 18. A method according to any item or example in this specification, particularly the method described in any one of Supplementary Notes 1 to 17, wherein the component is formed from a refractory high-entropy superalloy.

[0106] Supplementary Note 19. Any term or example in this specification, particularly the method described in any one of Appendices 1 to 18, wherein the component comprises silicon carbide (SiC), niobium (Nb), hafnium (Hf), titanium (Ti), molybdenum (Mo), silicon (Si), boron (B), alumina (Al2O3), or any combination or alloy thereof.

[0107] Appendix 20. Any term or example in this specification, particularly the method described in any one of Appendices 1 to 19, wherein the component is formed from an alloy or cermet comprising SiC, Mo-Si-B alloy, Nb silicide, C103 alloy, alumina, or a nickel-based superalloy.

[0108] Appendix 21. Any term or example in this specification, particularly the method described in any one of Appendices 1 to 20, wherein the surface of the component has a non-planar or contoured shape.

[0109] Appendix 22. Any term or example in this specification, particularly the method described in any one of Appendices 1 to 21, wherein the component is a component for a gas turbine engine.

[0110] Appendix 23. Any term or example in this specification, particularly the method described in any one of Appendices 1 to 22, wherein the component is a turbine blade or a combustor.

[0111] Appendix 24. Any term or example in this specification, particularly the method described in any one of Appendices 1 to 23, wherein the first layer comprises or is a coating layer configured to withstand and protect against an ambient temperature of at least 1300°C.

[0112] Appendix 25. A method according to any item or example in this specification, in particular, any one of Appendices 1 to 24, wherein the first layer comprises a coating layer configured to withstand a gas and ambient temperature of about 1700 °C and to protect the component from the gas and ambient temperature, or is the coating layer.

[0113] Appendix 26. A method according to any item or example in this specification, in particular, any one of Appendices 1 to 25, wherein after (a) and before (b), providing one or more second precursors above the surface of the component, the sintering in (c) comprises simultaneously sintering one or more second precursors to form a second layer, and the first layer is between the surface of the component and the second layer along a direction substantially perpendicular to the surface of the component.

[0114] Appendix 27. A method according to any item or example in this specification, in particular, the method described in Appendix 26, wherein the first layer and the second layer formed by (c) comprise or are layers of an environmental-thermal barrier (ETB) coating, an environmental barrier coating, or a bond coat.

[0115] Appendix 28. A method according to any item or example in this specification, in particular, any one of Appendices 26 to 27, wherein after (a) and before (b), providing one or more third precursors above the surface of the component, the sintering in (c) comprises simultaneously sintering one or more third precursors to form a third layer, and the second layer is between the first layer and the third layer along a direction substantially perpendicular to the surface of the component.

[0116] Appendix 29. A method according to any item or example in this specification, in particular, the method described in Appendix 28, wherein A method in which the first, second, and third layers formed by (c) include or are layers of an environmental - thermal barrier (ETB) coating, an environmental barrier coating, or a bond coat.

[0117] Appendix 30. Any item or example in this specification, particularly, the method described in any one of Appendices 26 - 29, including providing one or more fourth precursors above the surface of the component after (a) and before (b), wherein the sintering in (c) includes simultaneously sintering one or more fourth precursors to form a fourth layer, and the third layer is between the second layer and the fourth layer along a direction substantially perpendicular to the surface of the component.

[0118] Appendix 31. Any item or example in this specification, particularly the method described in Appendix 30, wherein the first, second, third, and fourth layers formed by (c) include or are layers of an environmental - thermal barrier (ETB) coating, an environmental barrier coating, or a bond coat.

[0119] Appendix 32. Any item or example in this specification, particularly, the method described in any one of Appendices 1 - 25, after (c), providing one or more second precursors above the first layer, forming a second layer by subjecting the one or more second precursors to a sintering temperature in the range of 500 - 3273 K (including both ends) for a duration of 10 minutes or less, wherein the sintering temperature is generated by passing an electric current through a heating element to cause Joule heating of the heating element, and the first layer is between the surface of the component and the second layer along a direction substantially perpendicular to the surface of the component.

[0120] Appendix 33. Any item or example in this specification, in particular the method described in Appendix 32, wherein the first layer and the second layer comprise or are layers of an environment-thermal barrier (ETB) coating, an environmental barrier coating, or a bond coat.

[0121] Appendix 34. Any item or example in this specification, in particular the method described in any one of Appendices 32 to 33, wherein after (c), providing one or more third precursors on the second layer; forming a third layer by subjecting the one or more third precursors to a sintering temperature in the range of 500 to 3273 K (including both ends) for a duration of 10 minutes or less; the sintering temperature is generated by passing an electric current through a heating element to cause Joule heating of the heating element; the second layer is between the first layer and the third layer along a direction substantially perpendicular to the surface of the component.

[0122] Appendix 35. Any item or example in this specification, in particular the method described in Appendix 34, wherein the first layer, the second layer, and the third layer comprise or are layers of an environment-thermal barrier (ETB) coating, an environmental barrier coating, or a bond coat.

[0123] Appendix 36. Any item or example in this specification, in particular the method described in any one of Appendices 34 to 36, wherein after (c), providing one or more fourth precursors above the third layer; forming a fourth layer by subjecting the one or more fourth precursors to a sintering temperature in the range of 500 to 3273 K (including both ends) for a duration of 10 minutes or less; the sintering temperature is generated by passing an electric current through the heating element to cause Joule heating of the heating element; The method wherein the third layer is between the second layer and the fourth layer along a direction substantially perpendicular to the surface of the component.

[0124] Appendix 37. Any item or example in this specification, in particular the method described in Appendix 36, wherein the first layer, the second layer, the third layer, and the fourth layer comprise or are layers of an environmental - thermal barrier (ETB) coating, an environmental barrier coating, or a bond coat.

[0125] Appendix 38. Any item or example in this specification, in particular the method described in any one of Appendices 1 to 37, wherein the first layer is formed on the surface of the component and in contact with the surface of the component, the component contains silicon carbide (SiC), and the first layer contains mullite, yttrium disilicate (YDS), hafnium silicate (Hf4SiO4), yttrium phosphate (YPO4), or any combination thereof.

[0126] Appendix 39. Any item or example in this specification, in particular the method described in any one of Appendices 26 to 38, wherein (i) the second layer is formed on and in contact with the first layer, and the second layer contains yttrium monosilicate (YMS), YDS, mullite, α - alumina, or any combination thereof, (ii) the third layer is formed on and in contact with the second layer, and the third layer contains YMS, (iii) the fourth layer is formed on and in contact with the third layer, and the fourth layer contains gadolinium zirconate (Gd2Zr2O7), yttria (Y2O3), ytterbium oxide (Yb2O3), or any combination thereof, or (iv) includes any combination of (i) to (iii) above, method.

[0127] Appendix 40. Any item or example in this specification, in particular, the method according to any one of Appendices 1 to 39, wherein the first layer is formed on and in contact with the surface of the component, the component contains a C103 alloy, and the first layer contains niobium silicide (NbSi2).

[0128] Appendix 41. Any item or example in this specification, in particular, the method according to that described in Appendix 40, wherein (i) the second layer is formed on and in contact with the first layer, and the second layer contains α-alumina, mullite, barium zirconate (BaZrO3), Er4Hf3O 12 , yttrium monosilicate (YMS), or any combination of the above; (ii) the third layer is formed on and in contact with the second layer, and the third layer contains YMS; (iii) the fourth layer is formed on and in contact with the third layer, and the fourth layer contains gadolinium zirconate (Gd2Zr2O7), yttria (Y2O3), ytterbium oxide (Yb2O3), or any combination of these; or (iv) any combination of (i) to (iii) above, Method.

[0129] Appendix 42. Any item or example in this specification, in particular, the method according to any one of Appendices 1 to 39, wherein the first layer is formed on and in contact with the surface of the component, the component contains alumina, and the first layer contains yttrium aluminum perovskite (YAP), yttrium aluminum garnet (YAG), barium zirconate (BaZrO3), yttrium phosphate (YbPO4), yttrium monosilicate (YMS), Er4Hf3O 12 , ytterbium oxide (Yb2O3), mullite, gadolinium zirconate (Gd2Zr2O7), or any combination of these.

[0130] Appendix 43. A method according to any term or example herein, particularly the method described in Appendix 42, wherein a second layer is formed on and in contact with a first layer, and the second layer contains YMS.

[0131] Appendix 44. A method according to any term or example herein, particularly the method described in any one of Appendices 1 to 43, wherein the first layer is a bonding layer and is a metal or intermetallic compound.

[0132] Appendix 45. A method according to any term or example herein, particularly the method described in any one of Appendices 26 to 44, wherein one of the first to fourth layers of the ETB coating has a porosity smaller than that of at least another layer of the first to fourth layers of the ETB coating.

[0133] Appendix 46. A method according to any term or example herein, particularly the method described in any one of Appendices 1 to 45, wherein the provision of each of the one or more precursors includes spray coating, dip coating, printing, tape casting, slip casting, or any combination of the foregoing.

[0134] Appendix 47. A method according to any term or example herein, particularly the method described in any one of Appendices 1 to 46, wherein each sintering is carried out in an inert gas environment or a vacuum environment.

[0135] Appendix 48. A method according to any term or example herein, particularly the method described in any one of Appendices 1 to 47, wherein one or more first precursors contain γ-alumina and the first layer is formed of α-alumina.

[0136] Appendix 49. A method according to any item or example in this specification, in particular, any one of the methods described in Appendices 1 to 47, wherein one or more first precursors include cobalt oxide (CoO) and alumina, and the first layer is formed from CoAl2O4.

[0137] Appendix 50. A method according to any item or example in this specification, in particular, any one of the methods described in Appendices 1 to 47, wherein the first layer is formed as a two-phase material.

[0138] Appendix 51. A method according to any item or example in this specification, in particular, the method described in Appendix 50, wherein the two-phase material is a two-phase material of yttria-stabilized zirconia (YSZ) and alumina, or a two-phase material of zirconia and mullite.

[0139] Appendix 52. A method according to any item or example in this specification, in particular, any one of the methods described in Appendices 1 to 51, The provision of (b) is such that a part of the component is exposed from the heating element, and the method further includes passively or actively cooling the component through the exposed part during the sintering of (c).

[0140] Appendix 53. A method according to any item or example in this specification, in particular, any one of the methods described in Appendices 1 to 52, wherein the coefficient of thermal expansion of the first layer is substantially the same as that of the surface of the component.

[0141] Appendix 54. A component having a coating thereon by a method according to any item or example in this specification, in particular, any one of the methods described in Appendices 1 to 53.

[0142] Appendix 55. A component according to any item or example in this specification, in particular, the component described in Appendix 54, The coating is an environmental - thermal barrier (ETB) coating, an environmental - thermal barrier coating, or a bond coat, and / or, The component is a component configured as part for a gas turbine engine (e.g., a turbine blade or a combustor).

[0143] Conclusion For example, with respect to FIGS. 1A - 8D and Appendices 1 - 55, any of the features illustrated or described herein can be combined with any other features illustrated or described herein, e.g., with respect to FIGS. 1A - 8D and Appendices 1 - 55, to provide materials, systems, devices, structures, methods, and embodiments not otherwise illustrated or specifically described herein. All features described herein are independent of each other and can be used in combination with any other features described herein, except where structurally impossible. Considering the many possible embodiments to which the principles of the disclosed technology can be applied, it should be recognized that the illustrated embodiments are merely examples and should not be construed as limiting the scope of the disclosed technology. Rather, the scope is defined by the following claims. Accordingly, the inventors claim all that falls within the scope and spirit of these claims.

Claims

1. (a) providing one or more first precursors above the surface of the component to be coated; (b) providing a heating element substantially conforming to the shape of the surface of the component above the one or more first precursors; (c) sintering the one or more first precursors by subjecting the one or more first precursors to a sintering temperature in the range of 500 to 3273 K (including both ends) for a duration of 10 minutes or less to form a first layer of an environmental - thermal barrier (ETB) coating on the surface of the component, wherein the sintering temperature is generated by passing an electric current through the heating element to cause Joule heating of the heating element, method.

2. The method according to claim 1, wherein the providing in (a) includes spray coating, dip coating, printing, tape casting, slip casting, or any combination thereof.

3. The heating element comprises a flexible film through which the electric current passes, and the providing in (b) includes disposing the flexible film in contact with the one or more first precursors, or disposing the flexible film such that each part of the flexible film is spaced apart from the respective opposing part of the surface of the component by a substantially constant distance, the method according to claim 1.

4. The method according to claim 1, wherein the heating element is formed of conductive carbon.

5. The method according to claim 4, wherein the heating element includes carbon felt, graphite felt, carbon film, graphite film, carbon nanotube film, or any combination thereof.

6. The method according to claim 4, further comprising removing the heating element from the component after (c).

7. The method according to claim 1, wherein the heating element includes a conductive carbon film, and the providing in (b) includes forming the conductive carbon film on the one or more first precursors.

8. The method according to any one of claims 4 to 7, wherein the heating element includes carbon black, carbon nanotubes, graphite, or any combination thereof.

9. The method according to any one of claims 4 to 7, wherein the thickness of the heating element is 1 mm or less.

10. The method according to any one of claims 4 to 7, wherein the resistivity of the heating element is 0.02 to 1 Ω·m.

11. The method according to claim 7, further comprising heating the conductive carbon film in an oxygen atmosphere after (c) to convert the carbon film into vapor.

12. The method according to claim 11, wherein the heating for burning the carbon film is at a temperature of 1000 °C or lower.

13. The method according to claim 1, wherein the sintering in (c) is performed in an inert gas environment or a vacuum environment.

14. The method according to claim 1, wherein the component is a metal, a metal alloy, a metal oxide, a ceramic matrix composite, or any combination thereof.

15. The method according to claim 14, wherein the component is formed from a refractory high-entropy superalloy.

16. The component is silicon carbide (SiC), niobium (Nb), hafnium (Hf), titanium (Ti), molybdenum (Mo), silicon (Si), boron (B), alumina (Al ２ O ３ ), or any combination or alloy thereof, according to the method of claim 1.

17. The method according to claim 16, wherein the component is formed from an alloy or cermet comprising SiC, a Mo—Si—B alloy, Nb silicide, a C103 alloy, alumina, or a nickel-based superalloy.

18. The method according to claim 1, wherein the surface of the component has a non-planar or contoured shape.

19. The method according to claim 1, wherein the component is part of a gas turbine engine.

20. The method according to claim 19, wherein the component is a turbine blade or a combustor.

21. The method according to claim 1, wherein the ETB coating is configured to withstand an ambient temperature of at least 1300 °C and protect the component from the ambient temperature.

22. The method according to claim 21, wherein the ETB coating is configured to withstand a gas and ambient temperature of about 1700 °C and protect the component from the gas and ambient temperature.

23. Further comprising providing one or more second precursors above the surface of the component after (a) and before (b), wherein the sintering in (c) includes sintering the one or more second precursors simultaneously to form a second layer of the ETB coating, The method according to claim 1, wherein the first layer is between the surface of the component and the second layer along a direction substantially perpendicular to the surface of the component.

24. Further comprising providing one or more third precursors above the surface of the component after (a) and before (b), wherein the sintering in (c) includes sintering the one or more third precursors simultaneously to form a third layer of the ETB coating. The method according to claim 23, wherein the second layer is between the first layer and the third layer along a direction substantially perpendicular to the surface of the component.

25. further comprising providing one or more fourth precursors above the surface of the component after (a) and before (b); the sintering in (c) includes simultaneously sintering the one or more fourth precursors to form a fourth layer of the ETB coating; The method according to claim 24, wherein the third layer is between the second layer and the fourth layer along a direction substantially perpendicular to the surface of the component.

26. after (c), providing the one or more second precursors above the first layer; sintering the one or more second precursors by subjecting the one or more second precursors to a sintering temperature in the range of 500 to 3273 K (including both ends) for a duration of 10 minutes or less to form a second layer of the ETB coating; the sintering temperature is generated by passing an electric current through the heating element to cause Joule heating of the heating element; The method according to claim 1, wherein the first layer is between the surface of the component and the second layer along a direction substantially perpendicular to the surface of the component.

27. after (c), providing one or more third precursors above the second layer; sintering the one or more third precursors by subjecting the one or more third precursors to a sintering temperature in the range of 500 to 3273 K (including both ends) for a duration of 10 minutes or less to form a third layer of the ETB coating; the sintering temperature is generated by passing an electric current through the heating element to cause Joule heating of the heating element; The method according to claim 26, wherein the second layer is between the first layer and the third layer along a direction substantially perpendicular to the surface of the component.

28. after (c), providing one or more fourth precursors above the third layer; sintering the one or more fourth precursors by subjecting the one or more fourth precursors to a sintering temperature in the range of 500 to 3273 K (including both ends) for a duration of 10 minutes or less to form a fourth layer of the ETB coating; the sintering temperature is generated by passing an electric current through the heating element to cause Joule heating of the heating element; The method according to claim 27, wherein the third layer is between the second layer and the fourth layer along a direction substantially perpendicular to the surface of the component. **Claim 29** The first layer is formed on and in contact with the surface of the component, the component includes silicon carbide (SiC), and the first layer includes mullite, yttrium disilicate (YDS), hafnium silicate (Hf ４ SiO ４ ), yttrium phosphate (YPO ４ ), or any combination thereof. The method according to any one of claims 1 to 28. **Claim 30** (i) The second layer is formed on and in contact with the first layer, and the second layer contains yttrium monosilicate, YDS, mullite, α-alumina, or any combination thereof. (ii) The third layer is formed on and in contact with the second layer, and the third layer contains YMS. (iii) The fourth layer is formed on and in contact with the third layer, and the fourth layer contains gadolinium zirconate (Gd ２ Zr ２ O ７ ), yttria (Y ２ O ３ ), ytterbium oxide (Yb ２ O ３ ), or any combination thereof, or (iv) including any combination of (i) to (iii). The method according to claim 29. **Claim 31** The first layer is formed on and in contact with the surface of the component, the component includes a C103 alloy, and the first layer includes niobium silicide (NbSi ２ ), the method according to any one of claims 1 to 28. **Claim 32** (i) The second layer is formed on and in contact with the first layer, and the second layer comprises α-alumina, mullite, barium zirconate (BaZrO ３ ), Er ４ Hf ３ O １２ , yttrium monosilicate (YMS), or any combination thereof, (ii) The third layer is formed on and in contact with the second layer, and the third layer contains YMS. (iii) The fourth layer is formed on and in contact with the third layer, and the fourth layer contains gadolinium zirconate (Gd ２ Zr ２ O ７ ), yttria (Y ２ O ３ ), ytterbium oxide (Yb ２ O ３ ), or any combination thereof, or (iv) including any combination of (i) to (iii). The method according to claim 31. **Claim 33** The first layer is formed on and in contact with the surface of the component, the component includes alumina, and the first layer is yttrium aluminum perovskite (YAP), yttrium aluminum garnet (YAG), barium zirconate (BaZrO ３ ), yttrium phosphate (YbPO ４ ), yttrium monosilicate (YMS), Er ４ Hf ３ O １２ , ytterbium oxide (Yb ２ O ３ ), mullite, gadolinium zirconate (Gd ２ Zr ２ O ７ ), or any combination thereof, the method according to any one of claims 1 to 28. **Claim 34** The method according to claim 33, wherein the second layer is formed on and in contact with the first layer, and the second layer contains YMS. **Claim 35** The method according to any one of claims 23 to 28, wherein the first layer is a bond layer and is a metal or an intermetallic compound. **Claim 36** The method according to any one of claims 23 to 28, wherein one of the first to fourth layers of the ETB coating has a porosity smaller than that of at least another layer of the first to fourth layers of the ETB coating. **Claim 37** The method according to any one of claims 23 to 28, wherein the providing of each of the one or more precursors includes spray coating, dip coating, printing, tape casting, slip casting, or any combination of the foregoing. **Claim 38** The method according to any one of claims 26 to 28, wherein each sintering is performed in an inert gas environment or a vacuum environment. **Claim 39** The method according to claim 1, wherein the one or more first precursors contain γ-alumina, and the first layer is formed from α-alumina. **Claim 40** The first precursor contains cobalt oxide (CoO) and alumina, and the first layer is CoAl ２ O ４ The method for manufacturing a semiconductor device according to claim 1, which is formed by **Claim 41** The method according to claim 1, wherein the first layer is formed as a two-phase material. **Claim 42** The method according to claim 41, wherein the two-phase material is a yttria-stabilized zirconia (YSZ) and alumina two-phase material, or a zirconia and mullite two-phase material. **Claim 43** The provision of (b) is such that a part of the component is exposed from the heating element, The method according to claim 1, further comprising passively or actively cooling the component through the exposed portion during sintering of (c).

44. The method according to claim 1, wherein the coefficient of thermal expansion of the first layer is substantially the same as the coefficient of thermal expansion of the surface of the component.

45. A component having an environment-thermal barrier coating formed thereon by the method according to any one of claims 1 to 44.

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