Heat sink structure

Abstract

Provided is a heat sink structure that can quickly condense the vapor-phase refrigerant heat-exchanged with the heat generated from the heating element and quickly dissipate the heat generated from the heating element. 【Solution means】The heat sink structure includes a heat sink main body portion in which a printed circuit board provided with a heating element is mounted on one surface, a cover plate that receives the heat of the heating element, and the cover plate divides the internal space into a housing space for housing the printed circuit board and a refrigerant chamber filled with a refrigerant. A plurality of refrigerant condensation grooves are formed on at least one surface of the refrigerant chamber, in which the vapor-phase refrigerant heat-exchanged with the cover plate condenses while flowing.

Description

Technical Field

[0001] The present invention relates to a heat sink structure, and more particularly to a heat sink structure for dissipating heat generated from a heat source such as an antenna element mounted on a printed circuit board.

Background Art

[0002] Wireless communication technologies, such as MIMO (Multiple Input Multiple Output) technology, are technologies that epochally increase data transmission capacity using multiple antennas. In a transmitter, different data is transmitted via each transmission antenna, and in a receiver, it is a Spatial multiplexing method that separates the transmitted data by appropriate signal processing.

[0003] Therefore, by simultaneously increasing the number of transmit and receive antennas, the channel capacity increases, enabling more data to be transmitted. For example, when the number of antennas is increased to 10, approximately 10 times the channel capacity is ensured using the same frequency band compared to the current single-antenna system.

[0004] In 4G LTE-advanced, up to 8 antennas are used, and in the 5G stage, base station devices having 64 or more than 128 antennas are used, which is called Massive MIMO technology. Since the current Cell operation is two-dimensional, while Massive MIMO technology enables 3D-Beamforming, it is also called FD-MIMO (Full Dimension).

[0005] In massive MIMO technology, as the number of ANTs (antennas) increases, the numbers of the associated transmitters and filters also increase together. Nevertheless, due to the lease cost of the installation location and spatial constraints, it is realistic to make RF components (Antenna / Filter / Power Amplifier / Transceiver etc.) small, light, and inexpensive. Massive MIMO requires high output for coverage expansion, but the power consumption and heat generation caused by such high output act as negative factors for reducing weight and size.

[0006] In particular, when installing a MIMO antenna in which modules with RF elements and digital elements realized are combined in a stacked structure in a limited space, in order to maximize the ease of installation and space utilization, the need for a compact and miniaturized design for multiple layers constituting the MIMO antenna emerges. In this case, a design regarding a new heat dissipation structure for heat generated by communication components mounted on multiple layers is required.

[0007] Korean Patent Publication No. 10-2019-0118979 (published on October 21, 2019) (hereinafter referred to as the "prior art") discloses a "multiple input and output antenna device" to which a heat dissipation structure for a compact and miniaturized design for multiple layers constituting a MIMO antenna is applied.

[0008] The prior art includes a heat dissipation body provided with protruding heat dissipation fins and a plurality of unit heat dissipation bodies provided on the heat dissipation body. The plurality of unit heat dissipation bodies are provided such that one end is in contact with a heat generating element of an antenna substrate, and the other end is provided with a plurality of sub heat dissipation fins for dissipating heat conducted from the heat generating element to the outside.

[0009] However, since the structure for dissipating the heat of the heating element in the prior art consists only of a mechanical structure which is an air-cooling heat dissipation structure by heat exchange with external air, not only is it difficult to dissipate heat quickly, but also more mechanical heat dissipation structures are required for rapid heat dissipation, resulting in a problem of increased size.

Summary of the Invention

Problems to be Solved by the Invention

[0010] The technical problem of the present invention is to quickly condense the vapor-phase refrigerant heat-exchanged with the heat generated from the heating element, quickly dissipate the heat generated from the heating element, and provide a heat sink structure that improves heat dissipation performance while minimizing size.

[0011] The technical problem of the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0012] To achieve the above problems, the heat sink structure according to the present invention includes a cover plate and a heat sink main body. A printed circuit board provided with a heating element is mounted on one surface of the cover plate. The cover plate receives the heat of the heating element. The internal space of the heat sink main body is partitioned into a housing space and a refrigerant chamber by the cover plate. The printed circuit board is housed in the housing space. The refrigerant chamber is filled with a refrigerant. A plurality of refrigerant condensation grooves are formed on at least one surface of the refrigerant chamber. In the plurality of refrigerant condensation grooves, the vapor-phase refrigerant heat-exchanged with the cover plate condenses while flowing.

[0013] The plurality of refrigerant condensation grooves may be formed on the surface of the refrigerant chamber facing the other surface of the cover plate.

[0014] The cover plate may be composed of a first cover portion and a second cover portion. The first cover portion may be a portion corresponding to the heating element. The second cover portion may be formed to extend from one side of the first cover portion. The plurality of refrigerant condensation grooves may be formed in a portion corresponding to the second cover portion.

[0015] A plurality of heat exchange grooves for exchanging heat with the refrigerant may be formed on a surface of the first cover portion facing the refrigerant chamber.

[0016] The width of the refrigerant chamber may be formed smaller than the width of the accommodation space. The cover plate can cover an open surface of the refrigerant chamber that communicates with the accommodation space.

[0017] A surface of the refrigerant chamber facing the other surface of the cover plate may be composed of a first facing surface and a second facing surface. The first facing surface can face the first cover portion. The second facing surface can face the second cover portion. The plurality of refrigerant condensation grooves may be formed on the second facing surface. The side of the plurality of refrigerant condensation grooves facing the first facing surface may be formed as an inclined portion.

[0018] The inclined portion may be formed as a plurality of first stepped portions.

[0019] A second stepped portion may be formed on the periphery of the refrigerant chamber. The periphery of the cover plate can be placed on the second stepped portion. The other surface of the cover plate can be spaced apart from the surface of the refrigerant chamber facing the other surface of the cover plate.

[0020] A third stepped portion may be formed on the periphery of the cover plate. The third stepped portion can be placed on the second stepped portion.

[0021] A plurality of support protrusions may be formed on the other surface of the cover plate. The plurality of support protrusions can support the other surface of the cover plate while spacing it apart from the surface of the refrigerant chamber facing the other surface of the cover plate.

[0022] A surface of the coolant chamber facing the other surface of the cover plate may be formed with a plurality of support grooves, into which the plurality of support protrusions are respectively insertable.

[0023] A surface of the cover plate may be formed with a plurality of mounting grooves, the printed circuit board may be mounted in the mounting grooves, and the mounting grooves may extend into the support protrusions, respectively.

[0024] A plurality of welding grooves may be formed in the outer surface of the heat sink body at portions corresponding to the plurality of support protrusions. The plurality of welding grooves may be for laser welding each of the plurality of support protrusions to the heat sink body.

[0025] A plurality of welding point protrusions may be further formed on an outer surface of the heat sink body, and the plurality of welding grooves may be formed in the plurality of welding point protrusions, respectively.

[0026] A plurality of welded joints may be protrudingly formed on an outer surface of the heat sink body. Ends of a plurality of heat dissipation fins may be laser-welded to the plurality of welded joints. The plurality of welded joints may be elongated in a width direction of the coolant chamber. The plurality of weld point protrusions may extend from one side of the plurality of welded joints.

[0027] Other specific details of the embodiments are included in the detailed description and drawings. Effect of the Invention

[0028] In the heat sink structure according to the present invention, a plurality of refrigerant condensation grooves are formed on at least one side of the refrigerant chamber, through which the gas-phase refrigerant that has exchanged heat with the cover plate passes and condenses. This allows the gas-phase refrigerant to be quickly condensed, and the heat generated from the heat-generating element to be quickly dissipated, thereby minimizing the size and improving the heat dissipation performance.

[0029] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Brief Description of the Drawings

[0030]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0031] Hereinafter, a heat sink structure according to an embodiment of the present invention will be described with reference to the drawings.

[0032] FIG. 1 is a perspective view showing a heat sink structure according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of FIG. 1.

[0033] In the following description, one surface may be the upper surface on the drawing shown in FIGS. 1 and 2, and the other surface may be the lower surface on the drawing shown in FIGS. 1 and 2.

[0034] Referring to FIGS. 1 and 2, a heat sink structure according to an embodiment of the present invention can include a cover plate 100 and a heat sink main body 200.

[0035] On one side of the cover plate 100, a printed circuit board (not shown) equipped with a heating element can be mounted.

[0036] The heating element can be an element that is mounted on the printed circuit board and generates heat. The heating element can include electronic components that generate predetermined heat while driving when power is supplied. For example, the heating element may be Rx elements and Tx elements that are responsible for signal output and transmission in an antenna device.

[0037] Since the printed circuit board is mounted on one side of the cover plate 100, the heat generated from the heating element can be transmitted to the cover plate 100, and the cover plate 100 can receive the heat of the heating element.

[0038] The cover plate 100 may be made of aluminum or an aluminum alloy material, and in addition, it can be manufactured in various ways using known metal materials with excellent heat dissipation performance.

[0039] The heat sink main body 200 can have an internal space. The heat sink main body 200 can be a part of a housing having a sealed internal space. One side of the internal space of the heat sink main body 200 can be open. The heat sink main body 200 is formed in a substantially hexahedral shape and one side can be opened, and the internal space of the heat sink main body 200 is also formed in a hexahedral shape and one side can be opened.

[0040] The internal space of the heat sink main body 200 can be partitioned into a housing space 210 and a refrigerant chamber 220 by the cover plate 100. That is, the cover plate 100 is disposed inside the heat sink main body 200 and can partition the internal space of the heat sink main body 200 into the housing space 210 and the refrigerant chamber 220. Here, the housing space 210 may be a space for housing the printed circuit board, and the refrigerant chamber 220 may be a space filled with refrigerant.

[0041] When the cover plate 100 divides the internal space of the heat sink main body 200 into an accommodation space 210 and a refrigerant chamber 220, the accommodation space 210 may be a space disposed on one side of the cover plate 100, and the refrigerant chamber 220 may be a space disposed on the other side of the cover plate 100.

[0042] The refrigerant chamber 220 may be formed on the bottom surface of the accommodation space 210. However, the refrigerant chamber 220 does not necessarily have to be formed on the bottom surface of the accommodation space 210, and may be formed on at least one of the bottom surface and the four side surfaces of the accommodation space 210. A plurality of refrigerant chambers 220 may be formed. In this case, the cover plate 100 may be provided as a plurality of cover plates 100, and the plurality of cover plates 100 can divide the plurality of refrigerant chambers 220 from the accommodation space 210 respectively.

[0043] The width of the refrigerant chamber 220 may be formed smaller than the width of the accommodation space 210. The cover plate 100 can cover the open surface of the refrigerant chamber 220 that communicates with the accommodation space 210. The cover plate 100 can cover the open surface of the refrigerant chamber 220 to divide the internal space of the heat sink main body 200 into the accommodation space 210 and the refrigerant chamber 220.

[0044] However, the width of the refrigerant chamber 220 does not necessarily have to be formed smaller than the width of the accommodation space 210, and may be formed the same as or larger than the width of the accommodation space 210. In this case as well, the cover plate 100 can divide the internal space of the heat sink main body 200 into the accommodation space 210 and the refrigerant chamber 220.

[0045] The cover plate 100 may include a first cover portion 110 and a second cover portion 120.

[0046] The width of the first cover portion 110 may be formed narrower than the width of the second cover portion 120, and the width of the second cover portion 120 may be formed wider than the width of the first cover portion 110. The length of the first cover portion 110 may be formed the same as the length of the second cover portion 120.

[0047] The first cover part 110 may be a part corresponding to the heating element. That is, on one surface of the first cover part 110, the part of the printed circuit board where the heating element is mounted is mounted, and the first cover part 110 can receive the heat of the heating element. The printed circuit board may be formed to have the same size as one surface of the cover plate 100 or a size larger than one surface of the cover plate 100, and can be mounted on the entire one surface of the cover plate 100. In this case, the heating element may be mounted on the part of the printed circuit board that is mounted on the first cover part 110, and may not be mounted on the part of the printed circuit board that is mounted on the second cover part 120. Alternatively, the printed circuit board may be formed to have a size smaller than one surface of the cover plate 100 and may be mounted on one surface of the first cover part 110, and may not be mounted on one surface of the second cover part 120.

[0048] The second cover part 120 can be formed to extend from one side of the first cover part 110. The first cover part 110 may be formed in a plate shape that forms one side part of the cover plate 100, and the second cover part 120 may be formed in a plate shape that forms the other side part that is the remaining part of the cover plate 100.

[0049] The heat sink main body part 200 can be manufactured from an aluminum material or an aluminum alloy material, and in addition, it can be manufactured in various ways from known metal materials with excellent heat dissipation performance.

[0050] The bottom surface of the refrigerant chamber 220 can include a first opposing surface 221 and a second opposing surface 222. The bottom surface of the refrigerant chamber 220 may be a surface facing the other surface of the cover plate 100. Here, the first opposing surface 221 can face the first cover part 110 of the cover plate 100, and the second opposing surface 222 can face the second cover part 120 of the cover plate 100.

[0051] The width of the first opposing surface 221 may be formed narrower than the width of the second opposing surface 222, or the width of the second opposing surface 222 may be formed wider than the width of the first opposing surface 221. The length of the first opposing surface 221 may be formed the same as the length of the second opposing surface 222.

[0052] The width of the first opposing surface 221 may be formed to be the same as the width of the first cover portion 110, and the length of the first opposing surface 221 may be formed to be the same as the length of the first cover portion 110. The width of the second opposing surface 222 may be formed to be the same as the width of the second cover portion 120, and the length of the second opposing surface 222 may be formed to be the same as the length of the second cover portion 120.

[0053] A plurality of refrigerant condensation grooves 250 may be formed on the second opposing surface 222 of the refrigerant chamber 220. However, the plurality of refrigerant condensation grooves 250 do not necessarily have to be formed on the second opposing surface 222 of the refrigerant chamber 220, and may be formed on at least one of the bottom surface and the four side surfaces of the refrigerant chamber 220. That is, the plurality of refrigerant condensation grooves 250 may be formed on at least one surface of the refrigerant chamber 220.

[0054] The plurality of refrigerant condensation grooves 250 may be formed on the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100.

[0055] The plurality of refrigerant condensation grooves 250 may be formed on the portion of the cover plate 100 that corresponds to the second cover portion 120.

[0056] In the plurality of refrigerant condensation grooves 250, the vapor-phase refrigerant that has exchanged heat with the cover plate 100 can condense while flowing. However, in the present embodiment, since the plurality of refrigerant condensation grooves 250 are formed on the second opposing surface 222, in the plurality of refrigerant condensation grooves 250, after the vapor-phase refrigerant that has exchanged heat with the first cover portion 110 on the first opposing surface 221 flows to the second opposing surface 222, it can condense while flowing.

[0057] The plurality of refrigerant condensation grooves 250 may be formed long in the width direction of the cover plate 100. The plurality of refrigerant condensation grooves 250 may be formed long in the direction in which the first cover portion 110 and the second cover portion 120 are arranged. The plurality of refrigerant condensation grooves 250 may be formed long in the width direction of the refrigerant chamber 220. The plurality of refrigerant condensation grooves 250 may be formed long in the direction in which the first opposing surface 221 and the second opposing surface 222 are arranged.

[0058] FIG. 3 is a bottom perspective view and a partial enlarged view showing the cover plate shown in FIG. 2, FIG. 4 is a cutaway perspective view and a partial enlarged view showing the cover plate shown in FIG. 2, FIG. 5 is a cutaway perspective view and a partial enlarged view showing the heat sink main body shown in FIG. 2, FIG. 6 is a bottom perspective view and a partial enlarged view showing the heat sink main body shown in FIG. 2, and FIG. 7 is a side cross-sectional view of the combined state of the heat sink structure according to the embodiment of the present invention.

[0059] Referring to FIGS. 2 to 7, a plurality of heat exchange grooves 150 for exchanging heat with the refrigerant may be formed on the other surface of the first cover portion 110. Here, the other surface of the first cover portion 110 may be the surface facing the refrigerant chamber 220. That is, a plurality of heat exchange grooves 150 for exchanging heat with the refrigerant may be formed on the surface of the first cover portion 110 facing the refrigerant chamber 220.

[0060] The plurality of heat exchange grooves 150 may be formed in a circular shape. However, the plurality of heat exchange grooves 150 may be formed in a polygonal shape such as a triangle or a quadrilateral.

[0061] Since the cover plate 100 must be modified in the form of the portion where the component is placed on the cover plate 100 according to the form of the component mounted on the printed circuit board, the thickness of the cover plate 100 must be formed thick. Thus, when the thickness of the cover plate 100 is formed thick, due to the thick thickness of the cover plate 100, the heat of the heating element mounted on the printed circuit board may not be quickly transmitted to the refrigerant chamber 220 through the cover plate 100. Even if the thickness of the cover plate 100 is formed thick, since a plurality of heat exchange grooves 150 are formed in the first cover portion 110, the contact area with the refrigerant disposed on the first opposing surface 221 can be widened. Therefore, the heat of the heating element mounted on the printed circuit board is quickly transmitted to the refrigerant in the refrigerant chamber 220 through the first cover portion 110 and can exchange heat with the refrigerant.

[0062] A plurality of refrigerant condensation grooves 250 may be formed such that the side facing the first opposing surface 221 is an inclined portion 255. The refrigerant heat-exchanged with the heat of the heating element through the first cover portion 110 on the first opposing surface 221 can be easily moved to the plurality of refrigerant condensation grooves 250 through the inclined portions 255 respectively formed in the plurality of refrigerant condensation grooves 250.

[0063] The inclined portion 255 may be formed as a plurality of first stepped portions 255A. The plurality of first stepped portions 255A widen the contact area with the refrigerant disposed in the plurality of refrigerant condensation grooves 250 so that the refrigerant can be quickly condensed.

[0064] A second stepped portion 226 may be formed at the periphery of the refrigerant chamber 220. The periphery of the cover plate 100 is placed on the second stepped portion 226, and the other surface of the cover plate 100 can be spaced apart from the surface of the refrigerant chamber 220 facing the other surface of the cover plate 100. That is, the cover plate 100 can be spaced apart from the bottom surface of the refrigerant chamber 220 with the surface facing the bottom surface of the refrigerant chamber 220. The second stepped portion 226 widens the contact area with the periphery of the cover plate 100 so that the heat of the heating element can be transmitted to the second stepped portion 226 as much as possible through the periphery of the cover plate 100.

[0065] A third step portion 106 that is placed on the second step portion 226 of the refrigerant chamber 220 may be formed at the periphery of the cover plate 100. The third step portion 106 widens the contact area with the second step portion 226, enabling the heat of the heating element to be maximally transferred to the second step portion 226 through the third step portion 106 of the cover plate 100.

[0066] A plurality of support protrusions 131 and 132 may be formed on the other surface of the cover plate 100. The plurality of support protrusions 131 and 132 can support the other surface of the cover plate 100 while separating it from the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100. The plurality of support protrusions 131 and 132 are formed on the surface of the cover plate 100 that faces the bottom surface of the refrigerant chamber 220, and can support the surface of the cover plate 100 that faces the bottom surface of the refrigerant chamber 220 while separating it from the bottom surface of the refrigerant chamber 220.

[0067] The plurality of support protrusions 131 and 132 can include a plurality of first support protrusions 131 formed on the other surface of the first cover portion 110 and a plurality of second support protrusions 132 formed on the other surface of the second cover portion 120.

[0068] The plurality of first support protrusions 131 may be formed on the surface of the first cover portion 110 that faces the first opposing surface 221, and the plurality of second support protrusions 132 may be formed on the surface of the second cover portion 120 that faces the second opposing surface 222.

[0069] The plurality of first support protrusions 131 may be arranged in two rows in the width direction of the first cover portion 110, and the plurality of second support protrusions 132 may be arranged in three rows in the width direction of the second cover portion 120.

[0070] The plurality of first support protrusions 131 and the plurality of second support protrusions 132 may be formed in the same shape as each other. However, the plurality of first support protrusions 131 and the plurality of second support protrusions 132 may be formed in different shapes from each other. In the present embodiment, the plurality of first support protrusions 131 and the plurality of second support protrusions 132 are formed in a circular shape that is the same as each other, but may be formed in a polygon such as a triangle or a quadrilateral.

[0071] And, on the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100, a plurality of support grooves 231 and 232 into which the plurality of support protrusions 131 and 132 are respectively inserted may be formed. The plurality of support grooves 231 and 232 are formed on the bottom surface of the refrigerant chamber 220, and the ends of the plurality of support protrusions 131 and 132 can be respectively inserted therein.

[0072] The plurality of support grooves 231 and 232 can include a plurality of first support grooves 231 formed on the first opposing surface 221 and a plurality of second support grooves 232 formed on the second opposing surface 222.

[0073] The ends of the plurality of first support protrusions 131 can be respectively inserted into the plurality of first support grooves 231, and the ends of the plurality of second support protrusions 132 can be respectively inserted into the plurality of second support grooves 232.

[0074] The plurality of first support grooves 231 may be formed on the surface of the refrigerant chamber 220 that faces the other surface of the first cover portion 110, and the plurality of second support grooves 232 may be formed on the surface of the refrigerant chamber 220 that faces the other surface of the second cover portion 120.

[0075] The plurality of first support grooves 231 may be formed at positions corresponding to the plurality of first support protrusions 131 respectively, and the plurality of second support grooves 232 may be formed at positions corresponding to the plurality of second support protrusions 132 respectively. That is, the plurality of first support grooves 231 may be arranged in two rows in the width direction of the first opposing surface 221, and the plurality of second support grooves 232 may be arranged in three rows in the width direction of the second opposing surface 222.

[0076] The plurality of first support grooves 231 and the plurality of second support grooves 232 may be formed in different shapes from each other. However, the plurality of first support grooves 231 and the plurality of second support grooves 232 may also be formed in the same shape as each other. In the present embodiment, the plurality of first support grooves 231 and the plurality of second support grooves 232 are formed in different shapes from each other, the plurality of first support grooves 231 are formed in a circular shape, and the plurality of second support grooves 232 are formed in a square shape. However, the plurality of first support grooves 231 and the plurality of second support grooves 232 may be variously formed in a circular shape or a polygon such as a triangle or a square.

[0077] A part of the plurality of refrigerant condensation grooves 250 can be communicated with each other by the plurality of second support grooves 232. The depth of the plurality of second support grooves 232 may be the same as the maximum depth of the plurality of refrigerant condensation grooves 250.

[0078] When the refrigerant in the refrigerant chamber 220 is vaporized by heat exchange with the first cover portion 110, the pressure in the refrigerant chamber 220 rises. However, since the plurality of support protrusions 131 and 132 are inserted into the plurality of support grooves 231 and 232, it is possible to prevent the cover plate 100 from expanding laterally due to the increased pressure in the refrigerant chamber 220.

[0079] A plurality of mounting grooves 141 and 142 may be formed on one surface of the cover plate 100. That is, a plurality of mounting grooves 141 and 142 may be formed on the surface of the cover plate 100 where the printed circuit board is mounted. The printed circuit board can be mounted in the plurality of mounting grooves 141 and 142. That is, the printed circuit board can be mounted on one surface of the cover plate 100 via a fastening member such as a screw fastened to the plurality of mounting grooves 141 and 142.

[0080] The plurality of mounting grooves 141 and 142 can respectively extend inside the plurality of support protrusions 131 and 132. Therefore, since the depth of the plurality of mounting grooves 141 and 142 can be formed deep, the printed circuit board can be firmly mounted on the cover plate 100.

[0081] The plurality of mounting grooves 141 and 142 can include a plurality of first mounting grooves 141 formed on one surface of the first cover portion 110 and a plurality of second mounting grooves 142 formed on one surface of the second cover portion 120.

[0082] The plurality of first mounting grooves 141 can each extend inside the plurality of first support protrusions 131, and the plurality of second mounting grooves 142 can each extend inside the plurality of second support protrusions 132.

[0083] The plurality of first mounting grooves 141 may be formed at positions corresponding to the plurality of first support protrusions 131, and the plurality of second mounting grooves 142 may be formed at positions corresponding to the plurality of second support protrusions 132. That is, the plurality of first mounting grooves 141 may be arranged in two rows in the width direction of the first cover portion 110, and the plurality of second mounting grooves 142 may be arranged in three rows in the width direction of the second cover portion 120.

[0084] The plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 may be formed in the same shape as each other. However, the plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 may be formed in different shapes from each other. In the present embodiment, the plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 are formed in a circular shape that is the same as each other, but may be formed in a polygon such as a triangle or a quadrilateral.

[0085] On the other surface of the heat sink main body portion 200, a plurality of welding grooves 281 and 282 may be formed at portions corresponding to the plurality of support protrusions 131 and 132. That is, on the outer surface of the heat sink main body portion 200, a plurality of welding grooves 281 and 282 may be formed at portions corresponding to the plurality of support protrusions 131 and 132.

[0086] The plurality of welding grooves 281 and 282 may be for laser-welding each of the plurality of support protrusions 131 and 132 to the heat sink main body 200. That is, after the ends of the plurality of support protrusions 131 and 132 are brought into contact with the bottom surface of the refrigerant chamber 220, the plurality of welding grooves 281 and 282 can be irradiated with laser respectively, and the ends of the plurality of support protrusions 131 and 132 can be laser-welded to the bottom surface of the refrigerant chamber 220.

[0087] When a plurality of support grooves 231 and 232 are formed on the surface of the refrigerant chamber 220 facing the other surface of the cover plate 100, the plurality of welding grooves 281 and 282 may be formed at portions corresponding to the plurality of support grooves 231 and 232.

[0088] The plurality of welding grooves 281 and 282 can include a plurality of first welding grooves 281 formed at portions corresponding to the plurality of first support protrusions 131 on the outer surface of the heat sink main body 200, and a plurality of second welding grooves 282 formed at portions corresponding to the plurality of second support protrusions 132 on the outer surface of the heat sink main body 200.

[0089] When a plurality of support grooves 231 and 232 are formed on the surface of the refrigerant chamber 220 facing the other surface of the cover plate 100, the plurality of first welding grooves 281 may be formed at portions corresponding to the plurality of first support grooves 231 on the outer surface of the heat sink main body 200, and the plurality of second welding grooves 282 may be formed at portions corresponding to the plurality of second support grooves 232 on the outer surface of the heat sink main body 200.

[0090] The plurality of first welding grooves 281 may be for laser-welding the plurality of first support protrusions 131 to the heat sink main body 200, and the plurality of second welding grooves 282 may be for laser-welding the plurality of second support protrusions 132 to the heat sink main body 200.

[0091] That is, after the ends of the plurality of first support protrusions 131 are brought into contact with the first opposing surface 221 of the refrigerant chamber 220, the plurality of first welding grooves 281 are respectively irradiated with a laser, and the ends of the plurality of first support protrusions 131 can be laser welded to the first opposing surface 221. Then, after the ends of the plurality of second support protrusions 132 are brought into contact with the second opposing surface 222 of the refrigerant chamber 220, the plurality of second welding grooves 282 are respectively irradiated with a laser, and the ends of the plurality of second support protrusions 132 can be laser welded to the second opposing surface 222 of the refrigerant chamber 220.

[0092] Also, when a plurality of support grooves 231 and 232 are formed on the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100, after the ends of the plurality of first support protrusions 131 are respectively brought into contact with the plurality of first support grooves 231, the plurality of first welding grooves 281 are respectively irradiated with a laser, and the ends of the plurality of first support protrusions 131 can be laser welded to the plurality of first support grooves 231 respectively. Then, after the ends of the plurality of second support protrusions 132 are respectively brought into contact with the plurality of second support grooves 232, the plurality of second welding grooves 282 are respectively irradiated with a laser, and the ends of the plurality of second support protrusions 132 can be laser welded to the plurality of second support grooves 232 respectively.

[0093] The plurality of first welding grooves 281 and the plurality of second welding grooves 282 may be formed in the same shape as each other. However, the plurality of first welding grooves 281 and the plurality of second welding grooves 282 may be formed in different shapes from each other. In the present embodiment, the plurality of first welding grooves 281 and the plurality of second welding grooves 282 are formed in a circular shape that is the same as each other, but may be formed in a polygon such as a triangle or a quadrilateral.

[0094] A plurality of welding point protrusions 271 and 272 may be further formed on the other surface of the heat sink main body 200. That is, a plurality of welding point protrusions 271 and 272 may be further formed on the outer surface of the heat sink main body 200. The plurality of welding grooves 281 and 282 may be respectively formed on the plurality of welding point protrusions 271 and 272.

[0095] The plurality of welding point protrusions 271 and 272 can facilitate the operator to find the laser welding position, reinforce the thickness of the heat sink main body 200, and prevent the heat sink main body 200 from deforming due to the heat generated during laser welding.

[0096] The plurality of welding point protrusions 271 and 272 can include a plurality of first welding point protrusions 271 in which a plurality of first welding grooves 281 are respectively formed, and a plurality of second welding point protrusions 272 in which a plurality of second welding grooves 282 are respectively formed.

[0097] The plurality of first welding point protrusions 271 and the plurality of second welding point protrusions 272 may be formed in the same shape as each other. However, the plurality of first welding point protrusions 271 and the plurality of second welding point protrusions 272 may be formed in different shapes from each other.

[0098] On the other surface of the heat sink main body 200, a plurality of welding joints 260 to which a plurality of heat dissipation fins (not shown) are respectively joined by laser welding can be formed to protrude. That is, on the outer surface of the heat sink main body 200, a plurality of welding joints 260 to which the plurality of heat dissipation fins are respectively joined by laser welding can be formed to protrude. Here, the heat dissipation fins may be formed in a thin plate shape to ensure a contact area with the external air, and may be for facilitating the dissipation of the heat of the heat generating element.

[0099] The plurality of welding joints 260 may be formed long in the width direction of the refrigerant chamber 220. The ends of the plurality of heat dissipation fins can be respectively joined to the plurality of welding joints 260 by laser welding. The plurality of welding point protrusions 271 and 272 can extend from one side of the plurality of welding joints 260.

[0100] Specifically, each of the plurality of welding joints 260 can include a first heat dissipation fin support portion 261 and a second heat dissipation fin support portion 262. The first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262 may be formed long in the width direction of the refrigerant chamber 220. The first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262 can be separated from each other in the longitudinal direction of the refrigerant chamber 220. The second heat dissipation fin support portion 262 can be arranged opposite to the first heat dissipation fin support portion 261 at a distance from the first heat dissipation fin support portion 261 in the longitudinal direction of the refrigerant chamber 220. The ends of the plurality of heat dissipation fins can be inserted between the separated first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262, and then can be laser welded to at least one of the first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262.

[0101] The plurality of welding point protrusions 271, 272 can extend from one side of the first heat dissipation fin support portion 261. However, the plurality of welding point protrusions 271, 272 may extend from one side of either the first heat dissipation fin support portion 261 or the second heat dissipation fin support portion 262.

[0102] As described above, in the heat sink structure according to the embodiment of the present invention, a refrigerant chamber 220 is formed which is covered by a cover plate 100 to which the printed circuit board is attached to the heat sink main body portion 200 and is filled with refrigerant. On the bottom surface 222 of the refrigerant chamber 220, a plurality of refrigerant condensation grooves 250 are formed in which the vapor-phase refrigerant that has exchanged heat with the heat generated from the heat generating element attached to the printed circuit board condenses while passing through. Therefore, the vapor-phase refrigerant that has exchanged heat with the heat generated from the heat generating element can be quickly condensed, and the heat generated from the heat generating element can be quickly dissipated, and the heat dissipation performance can be improved while minimizing the size.

[0103] Those with ordinary knowledge in the technical field to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing its technical idea and essential features. Therefore, it must be understood that the embodiments described above are illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the claims described later rather than the above detailed description, and all changes or modified forms derived from the meaning and scope of the claims and the equivalent concept thereof must be construed as being included in the scope of the present invention.

Industrial Applicability

[0104] The present invention provides a heat sink structure capable of quickly condensing a vapor-phase refrigerant heat-exchanged with heat generated from a heating element and quickly dissipating the heat generated from the heating element, and improving heat dissipation performance while minimizing the size.

Explanation of Reference Numerals

[0105] 100: Cover plate, 106: Third step portion 110: First cover portion, 120: Cover portion 131, 132: Support protrusions, 141, 142: Mounting grooves 150: Heat exchange groove, 200: Heat sink main body portion 210: Accommodation space, 220: Refrigerant chamber 221: First opposing surface, 222: Second opposing surface 226: Second step portion, 231, 232: Support grooves 250: Refrigerant condensation groove, 255: Inclined portion 255A: First step portion, 271, 272: Welding point protrusions 281, 282: Welding grooves

Claims

1. A printed circuit board equipped with a heating element is mounted on one side, a cover plate that receives the heat of the heating element, and a heat sink main body portion in which the internal space is partitioned by the cover plate into a housing space for housing the printed circuit board and a refrigerant chamber filled with refrigerant. A heat sink structure in which a plurality of refrigerant condensation grooves are formed on at least one surface of the refrigerant chamber, where the vapor-phase refrigerant heat-exchanged with the cover plate condenses while flowing.

2. The heat sink structure according to claim 1, wherein the plurality of refrigerant condensation grooves are formed on a surface of the refrigerant chamber facing the other surface of the cover plate.

3. The cover plate includes a first cover portion that is a portion corresponding to the heating element, and a second cover portion formed by extending from one side of the first cover portion, The heat sink structure according to claim 2, wherein the plurality of refrigerant condensation grooves are formed in a portion corresponding to the second cover portion.

4. The heat sink structure according to claim 3, wherein a plurality of heat exchange grooves for heat-exchanging with the refrigerant are formed on a surface of the first cover portion facing the refrigerant chamber.

5. The width of the refrigerant chamber is formed smaller than the width of the housing space, The heat sink structure according to claim 1, wherein the cover plate covers an open surface of the refrigerant chamber communicating with the housing space.

6. The surface of the refrigerant chamber facing the other surface of the cover plate includes a first facing surface facing the first cover portion, and a second facing surface facing the second cover portion and having the plurality of refrigerant condensation grooves formed thereon, The heat sink structure according to claim 3, wherein a side of the plurality of refrigerant condensation grooves facing the first facing surface is formed as an inclined portion.

7. The heat sink structure according to claim 6, wherein the inclined portion is formed as a plurality of first stepped portions.

8. A second stepped portion is formed at the periphery of the refrigerant chamber, The heat sink structure according to claim 1, wherein the periphery of the cover plate is placed on the second stepped portion, and the other surface of the cover plate is spaced apart from the surface of the refrigerant chamber facing the other surface of the cover plate.

9. The heat sink structure according to claim 8, wherein a third stepped portion for being placed on the second stepped portion is formed at the periphery of the cover plate.

10. The heat sink structure according to claim 1, wherein a plurality of support protrusions are formed on the other surface of the cover plate to support the other surface of the cover plate while being separated from the surface of the refrigerant chamber facing the other surface of the cover plate.

11. The heat sink structure according to claim 10, wherein a plurality of support grooves into which the plurality of support protrusions are respectively inserted are formed on the surface of the refrigerant chamber facing the other surface of the cover plate.

12. A plurality of mounting grooves for mounting the printed circuit board are formed on one surface of the cover plate. The heat sink structure according to claim 10, wherein the plurality of mounting grooves respectively extend inside the plurality of support protrusions.

13. The heat sink structure according to claim 10, wherein a plurality of welding grooves for laser-welding the plurality of support protrusions to the heat sink body portion are formed on the outer surface of the heat sink body portion at portions corresponding to the plurality of support protrusions.

14. A plurality of welding point protrusions are further formed on the outer surface of the heat sink body portion. The heat sink structure according to claim 13, wherein the plurality of welding grooves are respectively formed on the plurality of welding point protrusions.

15. On the outer surface of the heat sink body portion, a plurality of welding connection portions to which the ends of the plurality of heat dissipation fins are respectively joined by laser welding protrude. The plurality of welding connection portions are formed long in the width direction of the refrigerant chamber. The heat sink structure according to claim 14, wherein the plurality of welding point protrusions extend from one side of the plurality of welding connection portions.

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