Implant Delivery Device

JP2025526412APending Publication Date: 2025-08-13TERUMO KK
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Patent Information

Application Number
JP2025504428
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-07-25
Filing Date
2023-07-24
Publication Date
2025-08-13

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Abstract

The delivery device may include a support structure to provide desired stiffness, resilience, and kink resistance. The delivery device may include a core wire and / or one or more electrical wires electrically connected to a detachment mechanism. A medical device, such as an implant, may be attached to the delivery device via the detachment mechanism. The support structure may extend alongside or around the core wire to provide support to the delivery device, particularly when pushing a relatively large implant through a relatively small catheter. The support structure may include a support wire alongside the core wire, a hypotube surrounding the core wire, a braid braided around the core wire, and / or a coil coiled around the core wire. The core wire may be formed from a non-shape memory material, such as stainless steel, and the support structure may be formed from a shape memory material, such as nitinol.
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