Implant Delivery Device
JP2025526412APending Publication Date: 2025-08-13TERUMO KK
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Patent Information
- Application Number
- JP2025504428
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-07-25
- Filing Date
- 2023-07-24
- Publication Date
- 2025-08-13
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Figure 2025526412000001_ABST
Abstract
The delivery device may include a support structure to provide desired stiffness, resilience, and kink resistance. The delivery device may include a core wire and / or one or more electrical wires electrically connected to a detachment mechanism. A medical device, such as an implant, may be attached to the delivery device via the detachment mechanism. The support structure may extend alongside or around the core wire to provide support to the delivery device, particularly when pushing a relatively large implant through a relatively small catheter. The support structure may include a support wire alongside the core wire, a hypotube surrounding the core wire, a braid braided around the core wire, and / or a coil coiled around the core wire. The core wire may be formed from a non-shape memory material, such as stainless steel, and the support structure may be formed from a shape memory material, such as nitinol.
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