Display panel, display device, and splicing display device

Abstract

The display panel (10) comprises a substrate (1), a plurality of first binding electrodes (2), a plurality of connecting leads (3), an electrode carrier plate (4), and a plurality of second binding electrodes (5). The substrate (1) has opposing display and non-display surfaces (1a) and (1b), and a plurality of side surfaces (1c), at least one of which is a selected side surface (1cc). The display surface (1a) includes a first binding region (BB1), and the non-display surface (1b) includes a second binding region (BB2), both of which are located near and opposite the selected side surface (1cc). The plurality of first binding electrodes (2) are located in parallel and spaced apart within the first binding region (BB1). A plurality of connecting leads (3) are arranged in parallel and spaced apart, and each connecting lead (3) includes a first portion (31) located in the first binding region (BB1), a second portion (32) located on one side of the selected side (1cc), and a third portion (33) located in the second binding region (BB2). The first portion (31) of each connecting lead (3) is electrically connected to one first binding electrode (2). An electrode carrier plate (4) is disposed on one side of the non-display surface (1b), and a plurality of second binding electrodes (5) are disposed on the side of the electrode carrier plate (4) away from the substrate (1) and are arranged in parallel and spaced apart, and each second binding electrode (5) is electrically connected to the third portion (33) of one connecting lead (3).

Description

[Technical Field]

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel, a display device, and a splicing display device. [Background technology]

[0002] Micro LEDs (Micro Light Emitting Diodes) and Mini LEDs (Mini Light Emitting Diode Displays) have smaller particles, i.e., smaller volumes, than conventional LEDs. Summary of the Invention [Means for solving the problem]

[0003] In one embodiment, a display panel is provided. The display panel includes a substrate, a plurality of first binding electrodes, a plurality of connecting leads, an electrode carrier plate, and a plurality of second binding electrodes. The substrate includes opposing display and non-display surfaces and a plurality of side surfaces connecting the display and non-display surfaces, at least one of which is a selected side surface. The display surface includes a first binding region, and the non-display surface includes a second binding region, both of which are located near and opposite the selected side surface. The plurality of first binding electrodes are located in parallel and spaced apart within the first binding region. The plurality of connecting leads are located in parallel and spaced apart, each connecting lead having a first portion located in the first binding region, a second portion located on one side of the selected side surface, and a third portion located in the second binding region. The first portion of each connecting lead is electrically connected to one of the first binding electrodes. The electrode carrier plate is located on one side of the non-display surface of the substrate, and the plurality of second binding electrodes are located on a side of the electrode carrier plate facing away from the substrate. The second binding electrodes are arranged in parallel at intervals, and each second binding electrode is electrically connected to the third portion of one connecting lead wire.

[0004] In some embodiments, the display panel further comprises a plurality of connection pads arranged in parallel and spaced apart relation, the connection pads being located on sides of the second binding electrodes facing away from the substrate, and each connection pad being connected to one of the second binding electrodes and the third portion of one of the connecting leads.

[0005] In some embodiments, the bond pad comprises a metal and a conductive adhesive.

[0006] In some embodiments, the orthographic shape of the connection pad on the substrate includes a circle, an ellipse, a triangle, a star, a square, a heart, or a trapezoid.

[0007] In some embodiments, the electrode carrier plate has a plurality of parallel spaced-apart connection vias, the second binding electrode includes a first binding end and a second binding end, the first binding end of the second binding electrode is located on a side of the electrode carrier plate away from the substrate, and the second binding end of the second binding electrode is electrically connected to the third portion of the connection lead through one connection via.

[0008] In some embodiments, a second binding end of the second binding electrode is located on a side of the third portion of the connected connecting lead that faces away from the substrate, and the display panel further comprises an adhesive disposed in the connecting via and configured to connect the second binding end and the third portion of the connecting lead.

[0009] In some embodiments, the display panel further comprises an adhesive, the adhesive being disposed on a second binding end of the second binding electrode away from the selected side of the substrate, one side of the adhesive being connected to a side of the electrode carrier plate closer to the substrate, and the other side of the adhesive being facing the substrate, the adhesive being configured to connect the electrode carrier plate and the substrate.

[0010] The second binding end of the second binding electrode is located on the side of the third portion of the connected connecting lead away from the substrate, and the bonding agent is located between the electrode carrier plate and the substrate, and the dimension of the bonding agent in a direction perpendicular to the electrode carrier plate is the same as the dimension of the third portion of the connecting lead.

[0011] In some embodiments, the bonding agent is an insulating adhesive.

[0012] In some embodiments, the plurality of connecting leads are arranged in parallel and spaced apart along the first direction, and the plurality of second binding electrodes are arranged in parallel and spaced apart along the first direction. The display panel further includes a conductive adhesive, the conductive adhesive being disposed on a side of the plurality of connecting leads away from the non-display surface of the substrate and configured to connect the second binding electrodes and the connecting leads. The conductive adhesive extends along the first direction. The conductive adhesive covers at least a portion where the connecting leads and the second binding electrodes are connected.

[0013] In some embodiments, the material of the electrode carrier plate comprises an insulating material.

[0014] In some embodiments, the material of the electrode carrier plate includes glass and polyimide film.

[0015] In some embodiments, the material of the first binding electrode comprises a metal, and the materials of the connecting lead and the second binding electrode comprise a metal or a conductive metal colloid.

[0016] In some embodiments, the material of the first binding electrode includes at least one of copper, titanium, aluminum, molybdenum, and a nickel alloy.

[0017] In some embodiments, the material of the connecting lead and the second binding electrode includes at least one of copper, titanium, aluminum, molybdenum, nickel alloy, and conductive silver adhesive.

[0018] In some embodiments, the second binding region extends along a first direction and the third portion of the connection lead extends along a second direction, where the first direction intersects the second direction, and the dimension of the connection pad in the first direction is greater than one-third of the dimension in the first direction of the third portion of the connection lead connected to the connection pad.

[0019] In some embodiments, the sum of the dimension in the first direction of the third portion of the connecting lead wire connected to the second binding electrode and the distance in the first direction of the third portions of two adjacent connecting leads wires is greater than the dimension along the first direction of the connecting pad.

[0020] In some embodiments, the dimension of the connection pad in a direction perpendicular to the selected side is equal to or less than the distance between the selected side and the boundary of the connected second binding electrode on the substrate away from the selected side.

[0021] In some embodiments, the display panel further comprises a flexible circuit board, the flexible circuit board being disposed on a side of the plurality of second binding electrodes remote from the substrate, each second binding electrode extending along the second direction, each second binding electrode including a first binding end and a second binding end, the first binding end configured to be electrically connected to the flexible circuit board, and the second binding end configured to be electrically connected to a third portion of the connecting lead.

[0022] In some embodiments, the connected portion of the second binding end and the third portion of the connecting lead overlap, and the sum of the dimension of the third portion of the connecting lead in a direction perpendicular to the selected side and the dimension of the second binding electrode in a direction perpendicular to the selected side is equal to the sum of the distance between the boundary of the second binding electrode away from the selected side of the orthogonal projection on the substrate and the selected side, and the dimension of the overlapping portion of the second binding end and the third portion of the connecting lead in a direction perpendicular to the selected side.

[0023] In some embodiments, the dimension of the third portion of the connecting lead in a direction perpendicular to the selected side is equal to or less than the distance between the selected side and a boundary of the first electrode away from the selected side of the orthogonal projection on the substrate.

[0024] In some embodiments, the dimension of the first portion of the connecting lead wire connected to the first binding electrode in a direction perpendicular to the extension direction is 30% or more of the dimension of the first binding electrode in a direction perpendicular to the extension direction.

[0025] In some embodiments, the difference between the sum of the dimension of the first binding electrode in a direction perpendicular to the extension direction and the distance between two adjacent first binding electrodes in a direction perpendicular to the extension direction and the distance between the first portions of two adjacent connecting lead wires in a direction perpendicular to the extension direction is greater than or equal to the dimension of the first portions of the connecting lead wires connected to the first binding electrode in a direction perpendicular to the extension direction.

[0026] In another aspect, there is provided a display device, comprising a display panel provided by any of the above embodiments.

[0027] In another aspect, there is provided a splicing indicating device, comprising a indicating device provided by any of the above embodiments.

[0028] In another aspect, a method for manufacturing a display panel is provided, the method comprising:

[0029] providing a substrate, the substrate including opposing display and non-display surfaces and a plurality of side surfaces connecting the display and non-display surfaces, at least one of the plurality of side surfaces being a selected side, the display surface including a first binding region and the non-display surface including a second binding region, the first binding region and the second binding region both positioned adjacent to and facing the selected side;

[0030] forming a plurality of first binding electrodes arranged in parallel and spaced apart relation on one side of a display surface of the substrate, the plurality of first binding electrodes being located within a first binding region;

[0031] forming a plurality of spaced-apart parallel connecting leads, each connecting lead including a first portion located in the first binding region, a second portion located on one side of the selected side, and a third portion located in the second binding region, the first portion of each connecting lead being connected to one of the first binding electrodes;

[0032] providing an electrode carrier plate and forming a plurality of second binding electrodes arranged in parallel and spaced apart relation on the electrode carrier plate;

[0033] The method includes a step of placing an electrode carrier plate on which a plurality of second binding electrodes are arranged on one side of the non-display surface of the substrate, and connecting each second binding electrode to the third part of one connecting lead wire. [Brief explanation of the drawings]

[0034] In order to more clearly explain the technical solutions according to the present disclosure, the drawings used in some embodiments of the present disclosure will be briefly described below. It is clear that the drawings in the following description are only a portion of the drawings in some embodiments of the present disclosure. Those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings in the following description can be considered as schematic diagrams and do not limit the actual dimensions of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure. [Figure 1] 1 is a cross-sectional view of a display panel according to some embodiments. [Figure 2] 1 is a front structural view of a display panel according to some embodiments. [Figure 3] 10A and 10B are front structural views of display panels according to some other embodiments. [Figure 4]1 is a rear structural view of a display panel according to some embodiments. [Figure 5] 10A and 10B are rear structural views of display panels according to some other embodiments. [Figure 6] 1 is a cross-sectional view of a display panel according to some embodiments. [Figure 7] 4 is an enlarged view of the rear surface of an area C of the display panel shown in FIG. [Figure 8] 4 is an enlarged front view of an area C of the display panel shown in FIG. 3. FIG. [Figure 9] 10A to 10C are cross-sectional views of display panels according to some other embodiments. [Figure 10] 10 is a structural diagram of an electrode carrier plate and a second binding electrode of the display panel shown in FIG. 9. FIG. [Figure 11] 10 is another structural diagram of the electrode carrier plate and the second binding electrode of the display panel shown in FIG. 9. FIG. [Figure 12] FIG. 10 is a structural diagram of the adhesive of the display panel shown in FIG. [Figure 13] 10 is a diagram showing another structure of the bonding agent of the display panel shown in FIG. [Figure 14] 10 is a diagram showing still another structure of the adhesive of the display panel shown in FIG. 9. FIG. [Figure 15] 10A and 10B are cross-sectional views of display panels according to some other embodiments. [Figure 16] 16 is a structural diagram of an electrode carrier plate and a second binding electrode of the display panel shown in FIG. 15. FIG. [Figure 17] 16 is another structural diagram of the electrode carrier plate and the second binding electrode of the display panel shown in FIG. 15. FIG. [Figure 18] FIG. 16 is a structural diagram of the adhesive of the display panel shown in FIG. [Figure 19] 16 is another structural view of the bonding agent of the display panel shown in FIG. 15. FIG. [Figure 20] 16 is a diagram showing still another structure of the adhesive of the display panel shown in FIG. 15. FIG. [Figure 21] 10A to 10C are cross-sectional views of display panels according to some further embodiments. [Figure 22]1 is a front structural view of a display device according to some embodiments; [Figure 23] 1 is a structural diagram of a splicing display device according to some embodiments. [Figure 24] 10A and 10B are structural diagrams of splicing display devices according to some other embodiments. [Figure 25] 1 is a flowchart of a method for manufacturing a display panel according to some embodiments. DETAILED DESCRIPTION OF THE INVENTION

[0035] Hereinafter, technical solutions in several embodiments of the present disclosure will be clearly and completely described with reference to the drawings. Of course, the embodiments described herein are only a part of the embodiments of the present disclosure, and are not all of the embodiments. All other embodiments that can be obtained by those skilled in the art based on the embodiments in the present disclosure shall fall within the scope of protection of the present disclosure.

[0036] Unless the context indicates otherwise, in this specification and claims, the term "comprise" and other forms thereof, such as the third-person singular "comprises" and the present participle form "comprising," should be interpreted in an open, inclusive sense, i.e., "including, but not limited to." In the description, the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," "some examples," and the like, are intended to indicate that a particular feature, structure, material, or characteristic associated with this embodiment or examples is included in at least one embodiment or example of the present disclosure. General references to the above terms do not necessarily refer to the same embodiment or example. Furthermore, a described particular feature, structure, material, or characteristic may be included in any one or more embodiments or examples in any appropriate manner.

[0037] Hereinafter, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying the relative importance or quantity of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In describing the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more than two.

[0038] In describing some embodiments, terms such as "coupled," "connected," and derivatives thereof may be used. For example, in describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. Also, for example, in describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact with each other. However, the terms "coupled" or "communicatively coupled" may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the present specification.

[0039] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C," and all include combinations of A, B, and C such as A only, B only, C only, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0040] "A and / or B" includes three combinations: A only, B only, and a combination of A and B.

[0041] In this specification, the use of "applied to" or "configured to" is intended to mean open and inclusive language and does not exclude equipment that is adapted or arranged to perform additional tasks or steps.

[0042] As used herein, "about," "approximately," or "approximately" includes the stated value and the mean within an acceptable range of deviation of the specified value, where the acceptable range of deviation is determined by one of ordinary skill in the art considering the measurement and the error associated with measuring the specified quantity (i.e., limitations of the measurement system).

[0043] As used herein, "parallel," "perpendicular," and "equal" include the described situation and situations that are similar to the described situation, and this range of similar situations is within an acceptable deviation range, which is determined by taking into account the measurement considered by a person skilled in the art and the error associated with measuring a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes true parallel and approximately parallel, where an acceptable deviation range for approximately parallel may be, for example, a deviation within 5°, and "perpendicular" includes true perpendicular and approximately perpendicular, where an acceptable deviation range for approximately perpendicular may be, for example, a deviation within 5°. "Equal" includes absolutely equal and approximately equal, where, within the acceptable deviation range for approximately equal, for example, the difference between the two equals is 5% or less.

[0044] When a layer or element is referred to as being on another layer or substrate, it is understood that the layer or element may be located directly on the other layer or substrate, or there may be intermediate layers between the layer or element and the other layer or substrate.

[0045] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized illustrative drawings. In the drawings, thicknesses of layers and regions are exaggerated for clarity. As such, variations in shape relative to the drawings due, for example, to manufacturing techniques and / or tolerances are to be expected. Thus, exemplary embodiments of the present disclosure are not limited to the shapes of regions illustrated herein, but should be construed to include deviations in shape due to manufacturing or otherwise. For example, an etching region shown as a rectangle typically has curved features. Thus, regions shown in the drawings are exemplary in nature, and their shapes are not intended to represent the actual shape of regions of a facility, nor are they intended to limit the scope of exemplary embodiments.

[0046] In order to improve product reliability and reduce transportation and maintenance costs, a large display device may be assembled by using a splicing method to assemble multiple small displays.

[0047] To avoid the appearance of cracks on the display screen caused by splicing, it is necessary to reduce the frame dimensions of each small display device and the width of the splicing seam. A small display device includes a display panel, and for example, side wiring can be used to connect wiring located on one side of the display surface of the display panel to a circuit board (e.g., a flexible circuit board) located on one side of the non-display surface of the display panel. This allows the distance between adjacent small display devices to be reduced when multiple small display devices are spliced ​​together to form a larger display device, thereby improving the display quality of the large display device formed by splicing multiple small display devices together.

[0048] As shown in FIG. 1 , in some embodiments, a display panel 10 includes a substrate 1, a plurality of first binding electrodes 2, and a plurality of connecting leads 3. The substrate 1 includes opposing display and non-display surfaces 1a and 1b, and a plurality of side surfaces 1c connecting the display and non-display surfaces 1a and 1b. At least one of the side surfaces 1c of the substrate 1 is a selected side surface 1cc. Each connecting lead 3 includes a first portion 31 located on one side of the display surface 1a of the substrate 1, a second portion 32 located on the selected side surface 1cc of the substrate 1, and a third portion 32 located on one side of the non-display surface 1b of the substrate 1.

[0049] Here, one side of the display surface 1a of the substrate 1 is the front side of the display panel, and one side of the non-display surface 1b of the substrate 1 is the back side of the display panel. The display surface 1a of the substrate 1 includes a display area AA. The display area AA is provided with a film layer structure such as a drive line layer Q and a light-emitting element layer 6. First portions 31 of the multiple connection leads 3 are located on one side of the display surface 1a of the substrate 1, and third portions 33 of the multiple connection leads 3 are located on one side of the non-display surface 1b of the substrate 1. Both the first portions 31 and the third portions 33 of the connection leads 3 extend in a direction perpendicular to the selected side surface 1cc of the substrate 1, for example, along the Y direction shown in FIG. 1 .

[0050] The third portions 33 of the connecting leads 3 are configured to be connected to a circuit board located on one side of the non-display surface 1b of the substrate 1. For example, the ends of the third portions 33 of the connecting leads 3 away from the selected side 1cc serve as binding electrodes for connecting the flexible circuit board 7. That is, the rear wiring of the display panel needs to have a large area for binding external wiring. Therefore, along the direction perpendicular to the selected side 1cc, the length of the third portions 33 of the connecting leads 3 is longer than the length of the first portions 31 of the connecting leads 3. That is, the length d1 of the first portions 31 of the connecting leads 3 located on one side of the display surface 1a of the substrate 1 is shorter than the length d2 of the third portions 33 of the connecting leads located on one side of the non-display surface 1b of the substrate 1. It is understood that the orthographic projection of the third portions 33 of the connecting leads 3 on the substrate 1 overlaps with the area corresponding to the display area AA.

[0051] The length of third portions 33 of the plurality of connecting leads 3 located on one side of non-display surface 1b of substrate 1 may vary as follows.

[0052] In some embodiments, when a plurality of connection leads 3 are arranged in parallel at intervals along a first direction X, a second direction Y intersects with the first direction X, the third portions 33 of the connection leads 3 are linear, and extend along the Y direction, the length d2 of the third portions 33 of the connection leads 3 is the length of the third portions 33 of the connection leads 3 in the second direction Y.

[0053] In some other embodiments, the multiple connection leads 3 are arranged in parallel at intervals along the first direction X, the second direction Y intersects the first direction X, the third portions 33 of the connection leads 3 are non-linear, and the third portions of the connection leads 3 include multiple portions connected in sequence and extending in different directions, and each third portion 33 of the connection leads 3 includes multiple sub-portions extending in different directions. The third portion 33 of each connection lead 3 includes, for example, a first sub-portion, a second sub-portion, and a third sub-portion, and the first sub-portion, the second sub-portion, and the third sub-portion included in the third portion 33 of the connection lead 3 extend in different directions. The included angle between the multiple sub-portions included in the connection lead 3 and the second direction Y is 60° or less. The entire third part 33 of the connecting lead wire 3 is considered to extend approximately along the Y direction, and in this case, the length d2 of the non-linear third part 33 of the connecting lead wire 3 is the sum of the lengths along the second direction Y of the orthogonal projection on the substrate 1 of the multiple sub-parts included in the third part 33 of the connecting lead wire 3.

[0054] In some examples, the manufacturing process of the multiple connecting leads 3 is as follows: a connecting metal layer is formed over the entire surface of at least one side surface 1c of the substrate 1, for example, by a three-dimensional sputtering and coating process, specifically, the connecting metal layer is located on the display surface 1a of the substrate 1, the side surface 1c of the substrate 1, and one side of the non-display surface 1b of the substrate 1. Then, the connecting metal layer is patterned by laser etching to form multiple independent connecting leads 3.

[0055] It is understood that each connecting lead 3 includes a first portion 31 located on one side of the display surface 1a of the substrate 1, a third portion 33 located on the selected side 1cc of the substrate 1, and a third portion 33 located on one side of the non-display surface 1b of the substrate 1, and the length of the first portion 31 of the connecting lead 3 is shorter than the length of the third portion 33 of the connecting lead 3, and therefore the area of ​​the connecting metal layer located on the display surface 1a of the substrate 1 is smaller than the area of ​​the connecting metal layer located on the non-display surface 1b of the substrate 1. Thus, in the actual laser etching process, the length that needs to be laser etched on one side of the non-display surface 1b of the substrate 1 is longer, and in the process of obtaining the third portion 33 of the connecting lead 3 by etching, the laser may pass through the substrate 1 and enter the display area AA of the display surface 1a. Referring to FIG. 1, the laser is directed toward the substrate 1 along the "laser" direction shown in the figure, and since the orthogonal projection of the third part 33 of the connecting lead 3 on the substrate 1 overlaps with the area corresponding to the display area AA, some of the laser energy passes through the substrate 1 and reaches the display area AA, damaging the film layers and elements in that area and leading to reliability problems such as localized corrosion and the inability of the light-emitting elements to light up.

[0056] In some embodiments, the driving line layer Q may include a thin film transistor. When the third portion 33 of the connecting lead 3 is etched using a laser, the active layer of the thin film transistor in the front driving line layer Q is irradiated with the laser, and the characteristics of the thin film transistor change, for example, the threshold current for turning off the thin film transistor increases, thereby affecting the display effect. The above manufacturing processes, such as the sputtering and coating process and the laser etching process, are for illustrative purposes only and do not limit the actual manufacturing process.

[0057] The display panel, the display device, and the splicing display device provided by the present disclosure will be described below.

[0058] In the present disclosure, FIGS. 2, 3, 4, and 5 are planar structural diagrams of a display panel 10. FIG. 7 is an enlarged rear view of region C of the display panel 10 shown in FIG. 3. FIG. 8 is an enlarged front view of region C of the display panel 10 shown in FIG. 3. FIGS. 10, 11, 16, and 17 are structural diagrams of the side of an electrode carrier plate 4 away from the substrate 1 according to some embodiments. FIGS. 12, 13, 14, 18, 19, and 20 are structural diagrams of the side of an electrode carrier plate 4 closer to the substrate 1 according to some embodiments. FIG. 22 is a front structural diagram of a display device 100 according to some embodiments. FIGS. 23 and 24 are structural diagrams of a splicing display device according to some embodiments. FIG. 25 is a flowchart of a method for manufacturing a display panel according to some embodiments.

[0059] Hereinafter, one side of the display surface 1a of the display panel 10 will be referred to as the front side of the display panel 10, and correspondingly, one side of the non-display surface 1b of the display panel 10 will be referred to as the back side of the display panel 10.

[0060] Some embodiments of the present disclosure provide a display panel 10. As shown in Figures 2, 3, 4, and 5, the display panel 10 includes a substrate 1, a plurality of first binding terminals 2, a plurality of connecting leads 3, an electrode carrier plate 4, and a plurality of second binding electrodes 5. Here, the electrode carrier plate 4 is disposed on one side of the non-display surface 1b of the substrate 1, and the plurality of second binding electrodes 5 are disposed on the side of the electrode carrier plate 4 away from the substrate 1.

[0061] The substrate 1 includes a display surface 1a and a non-display surface 1b that face each other, and a plurality of side surfaces 1c that connect the display surface 1a and the non-display surface 1b. At least one of the side surfaces 1c is a selected side surface 1cc. The display surface 1a of the substrate 1 includes a first binding region BB1, and the non-display surface 1b of the substrate 1 includes a second binding region BB2. The first binding region BB1 and the second binding region BB2 are both located near and opposite the selected side surface 1cc of the substrate 1. Here, "facing" refers to the fact that the area of ​​the second binding region BB2 that corresponds to one side of the display surface 1a of the substrate 1 overlaps or nearly overlaps with the area that corresponds to the first binding region BB1.

[0062] The first binding electrodes 2 are disposed in the first binding region BB1 and are arranged in parallel with a gap therebetween. The boundaries of the first binding electrodes 2 on the side away from the selected side surface 1cc of the substrate 1 are flush or substantially flush with each other.

[0063] The second binding electrodes 5 are disposed on the side of the electrode carrier plate 4 that is away from the substrate 1, and the second binding electrodes 5 are arranged in parallel with a gap between them. The boundaries of the second binding electrodes 5 on the side that is away from the selected side surface 1cc of the substrate 1 are flush or approximately flush with each other.

[0064] The multiple connection leads 3 are arranged in parallel with a gap between them. Each connection lead 3 includes a first portion 31 located in the first binding region BB1, a second portion 32 located on one side of the selected side surface 1cc, and a third portion 33 located in the second binding region BB2. The first portion 31 of each connection lead 3 is electrically connected to one first binding electrode 2, and the third portion 33 of each connection lead 3 is electrically connected to one second binding electrode 5.

[0065] 3, 4, and 5, the first binding region BB1 and the second binding region BB2 both extend along a first direction X. A plurality of first binding electrodes 2 are arranged in parallel and spaced apart along the first direction X, and each first binding electrode 2 extends along a second direction Y. A plurality of second binding electrodes 5 are arranged in parallel and spaced apart along the first direction X, and each second binding electrode 5 extends along the second direction Y, where the first direction intersects with the second direction.

[0066] Exemplarily, the second direction Y is perpendicular to the first direction X.

[0067] Exemplarily, as shown in FIGS. 2 and 3, the display surface 1a of the substrate 1 includes a display area AA, and the first binding area BB1 is located on at least one side of the display area AA.

[0068] In some embodiments, as shown in FIG. 2, the substrate 1 includes two first binding areas BB1 disposed opposite each other, and the first binding areas BB1 are located on opposite sides of the display area AA.

[0069] In some other embodiments, as shown in FIG. 3, the substrate 1 includes one first binding area BB1, and the first binding area BB1 is located on one side of the display area AA.

[0070] The driving line layer Q is disposed on one side of the display surface 1a of the substrate 1, and is located in the display area AA. The light emitting element layer 6 is disposed on the side of the driving line layer Q that is away from the substrate 1. The light emitting element layer 6 includes a plurality of light emitting elements 61. The driving line layer Q also includes signal wiring. The signal wiring is connected to the light emitting elements 61 and is configured to transmit signals to the light emitting elements 61 and drive the light emission of the plurality of light emitting elements 61 in the light emitting element layer 6.

[0071] The front film layers of the display panel damaged by the laser mentioned above include the driving line layer Q and the light emitting element layer 6 and so on.

[0072] Exemplarily, the second binding electrode 5 includes a first binding end 51 and a second binding end 52. The first binding end 51 of the second binding electrode 5 is configured to be electrically connected to the flexible circuit board 7. The second binding end 52 of the second binding electrode 5 is configured to be electrically connected to the third portion 33 of the connecting lead 3.

[0073] Regarding the plurality of second binding electrodes 5, there are several cases as follows.

[0074] In some embodiments, the second binding electrodes 5 are linear, as shown in Fig. 4. The second binding electrodes 5 are arranged in parallel at intervals along the first direction X, and extend in a direction perpendicular to the selected side surface 1cc of the substrate 1. For example, the second binding electrodes 5 extend along the second direction Y shown in Fig. 4, and the length d6 of the second binding electrodes 5 is the length of the second binding electrodes 5 in the second direction Y.

[0075] For example, as shown in FIG. 4, the dimension k1 of the selected side surface 1cc of the substrate 1 along the first direction X is greater than the dimension k2 of the region covered by the plurality of second binding electrodes 5 along the first direction X.

[0076] 5 , the second binding electrode 5 has a non-linear shape. The second binding electrodes 5 are arranged in parallel at intervals along the first direction X, and each second binding electrode 5 includes a plurality of sub-portions whose connection directions differ sequentially. The second binding electrode 5 includes, for example, a first binding end 51, a connection portion 53, and a second binding end 52. The first binding end 51 is the portion where the second binding electrode 5 and the third portion 33 of the connection lead wire 3 contact each other. The connection portion 53 is the middle portion of the second binding electrode 5. The second binding end 52 is the portion of the second binding electrode 5 that is farthest from the selected side 1cc of the substrate 1.

[0077] The first binding end 51, the connection portion 53, and the second binding end 52 of the second binding electrode 5 extend in different directions, and the included angle between each sub-portion included in the second binding electrode 5 and the Y direction is less than 60°, but the entire second binding terminal 5 is considered to extend in a direction approximately perpendicular to the selected side 1cc of the substrate 1, for example, along the Y direction shown in Figure 5, and therefore the length d6 of the non-linear second binding electrode 5 is the sum of the lengths along the second direction Y of the orthogonal projections of the multiple sub-portions included in the second binding electrode 5 on the substrate 1.

[0078] 5 , the dimension k1 along the first direction X of the selected side 1cc of the substrate 1 is larger than the dimension k2 along the first direction X of the area covered by the plurality of first binding ends 51. The dimension k2 along the first direction X of the area covered by the plurality of first binding ends 51 is larger than the dimension k3 along the first direction X of the area covered by the flexible circuit board 7. The dimension k3 along the first direction X of the area covered by the flexible circuit board 7 is larger than the dimension k4 along the first direction X of the area covered by the plurality of second binding ends 52. The plurality of second binding ends 52 converge inward relative to the plurality of first binding ends 51, making this suitable for flexible circuit boards 7 with relatively small dimensions.

[0079] For example, as shown in FIG. 6, the first binding electrode 2 extends along the second direction Y, the first portion 31 of the connecting lead 3 extends along the second direction Y, the connected first binding electrode 2 and the first portion 31 of the connecting lead 3 have an overlapping portion in the second direction Y, and the dimension d4 along the second direction Y is greater than or equal to zero.

[0080] Illustratively, the dimension d1 of the first portion 31 of the connecting lead 3 in a direction perpendicular to the selected side surface 1cc of the substrate 1 is greater than zero.

[0081] In some embodiments, the dimension d1 of the first portion 31 of the connecting lead 3 in a direction perpendicular to the selected side surface 1cc of the substrate 1 is 60 μm or more.

[0082] The dimension d1 of the first portion 31 of the connecting lead 3 in the direction perpendicular to the selected side surface 1cc of the substrate 1 is, for example, 60 μm, 65 μm, or 70 μm.

[0083] Illustratively, the dimension e1 of the first binding region BB1 in a direction perpendicular to the selected side 1cc of the substrate 1 is the same as or approximately the same as the dimension e2 of the second binding region BB2 in a direction perpendicular to the selected side 1cc of the substrate 1.

[0084] For example, the dimension d3 of the third part 33 of the connecting lead 3 in a direction perpendicular to the selected side 1cc of the substrate 1 is less than the distance between the boundary of the first binding electrode 2 on the substrate 1 away from the selected side 1cc of the orthogonal projection thereof and the selected side 1cc.

[0085] In some embodiments, the distance between the boundary of the first binding electrode 2 on the substrate 1 away from the selected side surface 1cc and the selected side surface 1cc is the same as the dimension e1 of the first binding region BB1 in a direction perpendicular to the selected side surface 1cc of the substrate 1. That is, the distance between the boundary of the first binding electrode 2 on the substrate 1 away from the selected side surface 1cc and the selected side surface 1cc is e1. The dimension d3 of the third portion 33 of the connecting lead 3 in a direction perpendicular to the selected side surface 1cc of the substrate 1 (i.e., the second direction Y shown in FIG. 6 ) is less than or equal to the distance e1 between the boundary of the first binding electrode 2 on the substrate 1 away from the selected side surface 1cc and the selected side surface 1cc. That is, d3≦e1.

[0086] For example, the dimension d1 in the second direction Y of the first portion 31 of the connecting lead 3 is the same as or approximately the same as the dimension d3 in the second direction Y of the third portion 33 of the connecting lead 3.

[0087] In some embodiments, the dimension d1 of the first portion 31 of the connecting lead 3 in the second direction Y is larger than the dimension d3 of the third portion 33 of the connecting lead 3 in the second direction Y, and the dimension d3 of the third portion 33 of the connecting lead 3 in a direction perpendicular to the selected side surface 1cc of the substrate 1 (i.e., the second direction Y shown in FIG. 6 ) is equal to or smaller than the distance e1 between the selected side surface 1cc and the boundary of the orthogonal projection of the first binding electrode 2 on the substrate 1 away from the selected side surface 1cc. That is, d1>d3 and d3≦e1.

[0088] In some other embodiments, the dimension d1 of the first portion 31 of the connecting lead 3 in the second direction Y is equal to the dimension d3 of the third portion 33 of the connecting lead 3 in the second direction Y, and the dimension d3 of the third portion 33 of the connecting lead 3 in a direction perpendicular to the selected side surface 1cc of the substrate 1 (i.e., the second direction Y shown in FIG. 6 ) is equal to or less than the distance e1 between the selected side surface 1cc and the boundary of the orthogonal projection of the first binding electrode 2 on the substrate 1 away from the selected side surface 1cc, i.e., d1=d3≦e1.

[0089] In some other embodiments, the dimension d1 of the first portion 31 of the connecting lead 3 in the second direction Y is smaller than the dimension d3 of the third portion 33 of the connecting lead 3 in the second direction Y, and the dimension d3 of the third portion 33 of the connecting lead 3 in the direction perpendicular to the selected side surface 1cc of the substrate 1 (i.e., the second direction Y shown in FIG. 6) is equal to or smaller than the distance e1 between the boundary of the first binding electrode 2 on the substrate 1 away from the selected side surface 1cc in the orthogonal projection. That is, d1 <d3≦e1である。

[0090] It is understood that the orthogonal projection of the first portion 31 of the connecting lead 3 on the display surface 1a of the substrate 1 does not overlap with the display area AA, and the orthogonal projection of the third portion 33 of the connecting lead 3 on the non-display surface 1b of the substrate 1 does not overlap with the display area AA in the region corresponding to the display surface 1a of the substrate 1. That is, the orthogonal projection of the first portion 31 of the connecting lead 3 on the display surface 1a of the substrate 1 does not extend to the display area AA, and the orthogonal projection of the third portion 33 of the connecting lead 3 on the non-display surface 1b of the substrate 1 does not extend to the display area AA in the region corresponding to the display surface 1a of the substrate 1. Therefore, when fabricating the multiple connecting leads 3, a laser emitted from one side of the display surface 1a of the substrate 1 or one side of the non-display surface 1b of the substrate 1 will not damage film layers and devices in the display area AA, causing reliability problems such as localized corrosion.

[0091] Exemplarily, the display panel 10 further includes a flexible circuit board 7, one ends of the plurality of second binding electrodes 5 on the electrode carrier plate 4 are configured to be electrically connected to the flexible circuit board 7, and the other ends of the plurality of second binding electrodes 5 are configured to be electrically connected to the plurality of connecting lead wires 3. The flexible circuit board 7 is disposed on the side of the plurality of second binding electrodes 5 that is away from the substrate 1, and the flexible circuit board 7 is configured to transmit signals to the driving line layer Q and drive the plurality of light-emitting elements 61 in the light-emitting element layer 6 to emit light.

[0092] When manufacturing the display panel 10, the electrode carrier plate 4 and the plurality of second binding electrodes 5 disposed on the side of the electrode carrier plate 4 away from the substrate 1 are fixed to the substrate 1 as a single whole. For example, a connecting adhesive is disposed on the side of the electrode carrier plate 4 closer to the substrate 1, and the electrode carrier plate 4 is attached to one side of the non-display surface 1b of the substrate 1. Next, each second binding electrode 5 is connected to one connecting lead wire 3, thereby leading the front wiring of the display panel 10 to the back. The connecting adhesive is, for example, a bonding agent 92. The position and shape of the connecting adhesive may be determined by referring to the description of the bonding agent 92 described below.

[0093] By installing the electrode carrier plate 4, a plurality of second binding electrodes 5 are formed singly on the electrode carrier plate 4. When the plurality of second binding electrodes 5 are formed on the electrode carrier plate 4, the electrode carrier plate 4 is not yet connected to the substrate 1. Referring to Figures 1 and 6, by using such a design, the dimension of the third portion 33 of the connecting lead wire 3 in the second direction Y is shortened.

[0094] As shown in FIG. 1 , one end of the third portion 33 of the connecting lead 3, which is away from the selected side 1cc of the substrate 1, is configured to connect to the flexible circuit board 7. As shown in FIG. 6 , the dimension of the third portion 33 of the connecting lead 3 in the second direction Y is shortened from d2 to d3, and the second binding ends 52 of the plurality of second binding electrodes 5 realize connection with the flexible circuit board 7 in place of the shortened portion of the third portion 33 of the connecting lead 3. To ensure stable and effective signal transmission, the manufacturing of the plurality of connecting leads 3 avoids reliability issues such as laser damage and localized corrosion to film layers and devices in the display area AA, thereby improving the reliability of the display panel 10.

[0095] For example, as shown in FIGS. 2 and 3, the display surface 1a and the non-display surface 1b of the substrate 1 are rectangular in shape, for example, and the substrate 1 includes four side surfaces 1c.

[0096] In the following, a plurality of first binding electrodes 2 placed close to each selected side 1cc of the substrate 1 will be referred to as a set of first binding electrodes 2, a plurality of connecting lead wires 3 placed close to each selected side 1cc of the substrate 1 will be referred to as a set of a plurality of connecting lead wires 3, and a plurality of second binding electrodes 5 placed on each electrode carrier plate 4 will be referred to as a set of second binding electrodes 5, and a case will be described in which the substrate 1 includes different numbers of selected side surfaces 1cc.

[0097] 2, the substrate 1 includes two opposing selected sides 1cc. The display panel 10 further includes an electrode carrier plate 4 having two sets of first binding electrodes 2, two sets of connecting leads 3, and a plurality of second binding electrodes 5 formed on two surfaces thereof. Here, each set of first binding electrodes 2 is disposed adjacent to one selected side 1cc and connected to one set of second binding electrodes 5 via one set of connecting leads 3.

[0098] 3, the substrate 1 includes one selected side 1cc. The display panel 10 further includes an electrode carrier plate 4 having a set of first binding electrodes 2, a set of connecting leads 3, and a plurality of second binding electrodes 5 formed on one surface thereof. Each set of first binding electrodes 2 is disposed adjacent to the selected side 1cc and connected to a set of second binding electrodes 5 via a set of connecting leads 3.

[0099] Illustratively, the material of the substrate 1 is a rigid material such as glass, quartz, plastic, or the like.

[0100] It is understood that the above description of the material of substrate 1 is merely an example of one possible embodiment, and that the material of substrate 1 includes, but is not limited to, the above examples.

[0101] To ensure stable and effective transmission of signals, the first binding electrode 2, the connecting lead wire 3 and the second binding electrode 5 should have good conductive performance.

[0102] In some embodiments, the material of the first binding electrode 2, the connecting lead 3, and the second binding electrode 5 comprises a metal.

[0103] Illustratively, the material of the first binding electrode 2, the connecting lead 3, and the second binding electrode 5 includes at least one of copper, titanium, aluminum, molybdenum, and a nickel alloy.

[0104] In some other embodiments, the material of the connecting lead 3 and the second binding electrode 5 comprises a conductive metal colloid.

[0105] Illustratively, the material of the connecting lead 3 and the second binding electrode 5 includes a conductive silver adhesive, which may be doped with silver nanoparticles and colloids, for example.

[0106] In some examples, the conductive silver adhesive is an ICA (Isotropic Conductive Adhesive).

[0107] In some other examples, the conductive silver adhesives are ACAs (Anisotropic Conductive Adhesives).

[0108] In some other examples, the material of the connecting lead wire 3 and the second binding electrode 5 includes anisotropic conductive film (ACF).

[0109] It is understood that the above description of the materials of the first binding electrode 3, the connecting lead wire 3, and the second binding electrode 5 is merely an example as only one possible embodiment, and that the materials of the first binding electrode 3, the connecting lead wire 3, and the second binding electrode 5 include, but are not limited to, the above examples.

[0110] 4, 5, and 6, the display panel 10 further includes a flexible circuit board 7 disposed on a side of the plurality of second binding electrodes 5 that is away from the substrate 1. Each second binding electrode 5 extends along the second direction Y. Each second binding electrode 5 includes a first binding end 51 and a second binding end 52. The first binding end 51 of each second binding electrode 5 is configured to be electrically connected to the flexible circuit board 7. The second binding end 52 of each second binding electrode 5 is configured to be electrically connected to the third portion 33 of the connecting lead wire 3.

[0111] The flexible circuit board 7 and the first binding end 51 of the second binding electrode 5 overlap each other at their connection portions. The dimension of the overlapping portion between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5 in the second direction Y is referred to as the overlap distance of the flexible circuit board 7. If the overlap distance is too small, there is a risk that the connection between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5 may be broken, resulting in an unreliable connection between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5. If the connection between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5 is broken, control signals will not be transmitted normally, resulting in abnormal operation of the display panel 10. Therefore, to ensure stable and effective connection between the flexible circuit board 7 and the multiple second binding electrodes, the dimension d5 of the overlapping portion between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5 in the second direction Y should be sufficient to ensure stable and effective connection between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5.

[0112] In some embodiments, the dimension d5 of the overlapping portion between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5 in the second direction Y is 0.5 mm or more.

[0113] The dimension d5 in the second direction Y of the overlapping portion between the flexible circuit board 7 and the first binding end 51 of the second binding electrode 5 is, for example, 0.5 mm, 1 mm, or 2 mm.

[0114] In some embodiments, the plurality of second binding electrodes 5 disposed on the electrode carrier plate 4 are fabricated using, for example, a printing process.

[0115] Illustratively, the plurality of second binding electrodes 5 are fabricated using, for example, 3D printing, screen printing, pad printing / transfer printing, or stencil printing.

[0116] It is understood that when the multiple second binding electrodes 5 are fabricated, for example, using a printing process, the fabrication process of the multiple second binding electrodes 5 does not include a laser process, so there is no need to additionally install an electrode carrier plate 4, and the multiple second binding electrodes 5 can be fabricated directly on the non-display surface 1b side of the substrate 1, without affecting the film layer structure in the display area AA.

[0117] In some other embodiments, the plurality of second binding electrodes 5 are fabricated using processes such as sputtering and coating and laser etching, for example, by first forming a metal coating on the electrode carrier plate 4 through a sputtering and coating process, and then etching the metal coating through a laser etching process to form a conductive pattern, which is the plurality of second binding electrodes 5.

[0118] Since the material of the multiple second binding electrodes 5 installed on the electrode carrier plate 4 includes a conductive material, and the multiple second binding electrodes 5 arranged in parallel are electrically insulated from each other, the electrode carrier plate 4 should be made of an insulating material to avoid problems such as short circuits between the multiple second binding electrodes 5 through the electrode carrier plate 4, which could result in abnormal transmission of driving signals supplied from an external controller, such as a flexible circuit board 7 and / or a driving chip, to the display area AA and affecting the normal operation of the display panel 10.

[0119] A short circuit here refers to a situation in which at least two of the multiple second binding electrodes 5 that do not have an electrical connection are electrically connected via the electrode carrier plate 4, and a circuit is formed between the at least two second binding electrodes 5 that do not have an electrical connection via the electrode carrier plate 4, resulting in a short circuit.

[0120] When the multiple second binding electrodes 5 are fabricated using, for example, a coating and laser etching process, and then laser etched, the laser energy generates a large amount of heat, and the electrode carrier plate 4 is subjected to heat, so the electrode carrier plate 4 should have good high temperature resistance.

[0121] Exemplarily, the material of the electrode carrier plate 4 comprises an insulating material.

[0122] In some embodiments, the material of the electrode carrier plate 4 includes glass and polyimide film (PI).

[0123] In some other embodiments, the electrode carrier plate 4 includes a high-temperature resistant material. A large amount of heat is generated during the process of forming the second binding electrode 5 on the electrode carrier plate 4 using a sputtering and laser etching process. The high-temperature resistance mentioned here means that the performance, shape, etc. of the electrode carrier plate 4 are not affected by heat when the second binding electrode 5 is formed on the electrode carrier plate 4, and that the electrode carrier plate 4 and the second binding electrode 5 are prevented from being deformed when exposed to high temperatures, preventing them from being unable to be properly connected to the connecting lead wires 3, etc., thereby ensuring normal operation of the display panel 10.

[0124] It is understood that the above description of the material of the electrode carrier plate 4 is merely an example of one possible embodiment, and that the material of the electrode carrier plate 4 includes, but is not limited to, the above examples.

[0125] In some embodiments, the display panel 10 further includes a plurality of connection pads 8 located on the side of the plurality of second binding electrodes 5 away from the substrate 1, the plurality of connection pads 8 being arranged in parallel at intervals, and each connection pad 8 being connected to one second binding electrode 5 and the third portion 33 of one connection lead wire 3.

[0126] In some embodiments, the material of the connection pads 8 comprises a metal.

[0127] Illustratively, the material of the connection pad 8 includes at least one of copper, titanium, aluminum, molybdenum, nickel alloy, and conductive silver adhesive.

[0128] In some other embodiments, the material of the connection pads 8 comprises a conductive adhesive.

[0129] In some examples, the conductive adhesives are ICAs.

[0130] In some other examples, the conductive adhesive is ACA.

[0131] In some other examples, the conductive adhesive is ACF.

[0132] If the material of the connection pad 8 is, for example, ACA or ACF, the ACA or ACF may be conductive in only one direction, for example, the Y direction, and may have an adhesive effect as an adhesive, but is not conductive in the X and Z directions and only has an adhesive effect as an adhesive.

[0133] It is understood that the ACA or ACF may be conductive only in the Y direction, and therefore the ACA or ACF should be installed between the second binding terminal 5 and the third portion 33 of the connecting lead 3, with one end of the ACA or ACF connected to the second binding terminal 5 and the other end of the ACA or ACF connected to the third portion 33 of the connecting lead 3 along the Y direction, thereby achieving conductivity between the second binding terminal 5 and the third portion 33 of the connecting lead 3. At the same time, the ACA or ACF is not conductive in the X direction, and therefore multiple connection pads may contact each other in the X direction. It is understood that the above description of the material of the connection pad 8 is merely an example as only one possible embodiment, and that the material of the connection pad 8 includes, but is not limited to, the above example.

[0134] To ensure a stable connection between the connection lead wire 3 and the second binding electrode 5, the dimensions of the connection pad 8 connecting the second binding electrode 5 and the connection lead wire 3 are configured to meet connection requirements. The shape and dimensions of the connection pad 8 are described below.

[0135] 4 and 5, the shape of the connection pad 8 when orthogonally projected on the substrate 1 includes a circle, an ellipse, a triangle, a star, a rectangle, a heart, a trapezoid, etc. The connection pad 8 is required to establish electrical continuity between the second binding electrode 5 and the connection lead wire 3, and not cause a short circuit problem in at least two second binding electrodes 5 that are not electrically connected among the plurality of second binding electrodes, or in at least two connection lead wires 3 that are not electrically connected among the plurality of connection lead wires 3.

[0136] A short circuit here refers to the formation of a circuit and a short circuit between at least two second binding electrodes 5 among a plurality of second binding electrodes 5 that are not connected to each other, or at least two connecting lead wires 3 among a plurality of connecting lead wires 3 that are not connected to each other.

[0137] 7, the second binding region BB2 extends along the first direction X, and the third portion 33 of the connection lead 3 extends along the second direction Y, where the first direction X intersects with the second direction Y. The dimension r3 of the connection pad 8 along the first direction X is greater than one-third of the dimension r1 of the third portion 33 of the connection lead 3 connected to the connection pad 8 in the first direction X. That is, r3>(1 / 3)×r1.

[0138] 7, the sum of the dimension r1 in the first direction X of the third portion 33 of the connection lead 3 connected to the second binding electrode 5 and the distance r2 in the first direction X between the third portions 33 of two adjacent connection leads 3 is greater than the dimension r3 in the first direction X of the connection pad 8. That is, r1+r2>r3.

[0139] In some embodiments, the dimension r3 of the connection pad 8 along the first direction X is smaller than the dimension r1 of the third portion 33 of the connected connection lead 3 along the first direction X. That is, r3 <r1である。

[0140] In some other embodiments, the dimension r3 of the connection pad 8 along the first direction X is equal to the dimension r1 of the third portion 33 of the connected connection lead 3 along the first direction X, i.e., r3=r1.

[0141] In some other embodiments, the dimension r3 of the connection pad 8 along the first direction X is greater than the dimension r1 of the third portion 33 of the connected connection lead 3 along the first direction X. Also, the sum of the dimension r1 of the third portion 33 of the connection lead 3 connected to the second binding electrode 5 along the first direction X and the distance r2 of the third portions 33 of two adjacent connection leads 3 along the first direction X is greater than the dimension r3 of the connection pad 8 along the first direction X. That is, r3>r1, and r1+r2>r3.

[0142] 7, the dimension r4 of the connection pad 8 in the direction perpendicular to the selected side surface 1cc of the substrate 1 is equal to or less than the distance r5 between the selected side surface 1cc and the boundary of the second binding electrode 5 connected thereto, which is an orthogonal projection of the second binding electrode 5 on the substrate 1 and is away from the selected side surface 1cc. That is, r4≦r5.

[0143] In some embodiments, as shown in FIG. 7, the dimension r4 of the connection pad 8 in the direction perpendicular to the selected side surface 1cc of the substrate 1 is 30 μm or more.

[0144] The dimension r4 of the connection pad 8 in the direction perpendicular to the selected side surface 1cc of the substrate 1 is, for example, 30 μm, 35 μm, or 40 μm.

[0145] In some embodiments, as shown in FIG. 7, the distance r5 between the boundary of the multiple second binding electrodes 5 on the substrate 1 away from the selected side 1cc of the substrate 1 in the orthogonal projection and the selected side 1cc of the substrate 1 is 3 mm or more.

[0146] In some embodiments, as shown in FIG. 7, the distance r5 between the boundary of the multiple second binding electrodes 5 on the substrate 1 away from the selected side 1cc of the substrate 1 in the orthogonal projection and the selected side 1cc of the substrate 1 is 200 mm or less.

[0147] The distance r5 between the boundary of the plurality of second binding electrodes 5 on the substrate 1 on the side away from the selected side surface 1cc of the substrate 1 in the orthogonal projection thereof and the selected side surface 1cc of the substrate 1 is, for example, 3 mm, 60 mm, 100 mm, or 200 mm.

[0148] 8 , the dimension d11 of the first portion 31 of the connecting lead wire 3 connected to the first binding electrode 2 in the direction perpendicular to the extension direction is equal to or greater than 30 percent of the dimension d12 of the first binding electrode 2 in the direction perpendicular to the extension direction, i.e., d11≧d12×30%.

[0149] 8 , the difference between the sum of the dimension d12 of the first binding electrode 2 in the direction perpendicular to the extension direction and the distance d13 between two adjacent first binding electrodes 2 in the direction perpendicular to the extension direction and the distance d14 between the first portions 31 of two adjacent connecting lead wires 3 in the direction perpendicular to the extension direction is equal to or greater than the dimension d11 of the first portions 31 of the connecting lead wires 3 connected to the first binding electrode 2 in the direction perpendicular to the extension direction, i.e., d12+d13-d14≧d11.

[0150] 9 , the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead 3 overlap at their connected portions. The sum of the dimension d3 of the third portion 33 of the connecting lead 3 in a direction perpendicular to the selected side surface 1cc and the dimension d9 of the second binding electrode 5 in a direction perpendicular to the selected side surface 1cc is equal to the sum of the distance d10 between the boundary of the second binding electrode 5 on the substrate 1 away from the selected side surface 1cc and the selected side surface 1cc, and the dimension d7 of the overlapping portion of the second binding end 52 and the third portion 33 of the connecting lead 3 in a direction perpendicular to the selected side surface 1cc. That is, d3 + d9 = d10 + d7.

[0151] The overlapping mentioned above refers to overlapping of the orthogonal projections on the substrate 1. It is understood that the second binding end 52 of the second binding electrode 5 may or may not be in direct contact with the third portion 33 of the connecting lead 3.

[0152] 9, 10, 15, and 16, a plurality of connection vias 41 are formed in the electrode carrier plate 4 and arranged in parallel at intervals. The second binding electrode 5 includes a first binding end 51 and a second binding end 52, and the first binding end 51 of the second binding electrode 5 is located on the side of the electrode carrier plate 4 that is away from the substrate 1, and the second binding end 52 of the second binding electrode 5 is electrically connected to the third part 33 of one connection lead wire 3 through one connection via 41.

[0153] In this case, the cross-sectional shape of the second binding electrode 5 includes the following several cases.

[0154] 9, 10, and 11, a cross section of the second binding electrode 5 is formed along the cutting line DD shown in FIG. 10 or the cutting line EE shown in FIG. 11, and the cross section of the second binding electrode 5 has an L-shaped shape. The multiple second binding electrodes 5 are located on the side of the third portions 33 of the multiple connecting leads 3 that is away from the substrate 1. The third portions 33 of the multiple connecting leads 3 here refer to the portions of the multiple connecting leads 3 that are located on one side of the non-display surface 1b of the substrate 1.

[0155] Illustratively, the multiple second binding electrodes 5 are arranged in parallel at intervals along the first direction X, the second binding ends 52 of the second binding electrodes 5 are connected to the third portions 33 of the connection lead wires 3 through connection vias 41 on the electrode carrier plate 4, and the first binding ends 51 of the second binding electrodes 5 are located on the side of the third portions 33 of the connection lead wires 3 that is away from the substrate 1. The first binding ends 51 of the second binding electrodes 5 are configured to be connected to the flexible circuit board 7. The end of the second binding ends 52 of the second binding electrodes 5 that is connected to the third portions 33 of the connection lead wires 3 is flush or approximately flush with the surface of the electrode carrier plate 4 that is closer to the substrate 1.

[0156] The second binding end 52 of the second binding electrode 5 extends toward the third portion 33 of the connecting lead 3. In some examples, as shown in FIG. 9 , the second binding end 52 of the second binding terminal 5 includes a portion located within the connecting via 41, the second binding end 52 extends along the third direction Z, the first binding end 51 of the second binding terminal 5 is a portion connected to the flexible circuit board, the connecting portion 53 of the second binding terminal 5 is a portion between the first binding end 51 and the second binding end 52, and both the connecting portion 53 and the first binding end 51 extend in a plane perpendicular to the third direction Z. Illustratively, the dimension of the second binding end 52 of the second binding electrode 5 along the third direction Z is larger than the dimensions of the second binding end 52 and / or the connecting portion 53 of the second binding electrode 5 along the third direction Z.

[0157] In some other embodiments, as shown in Figures 15, 16, and 17, a cross section of the second binding electrode 5 is formed along the cutting line FF shown in Figure 16 or the cutting line GG shown in Figure 17, and the cross section of the second binding electrode 5 has a Z-shaped shape. A first binding end 51 of the second binding electrode 5 is located on the side away from the substrate 1 of the electrode carrier plate 4, and a second binding end 52 of the second binding electrode 5 includes a first portion located on the side closer to the substrate 1 of the electrode carrier plate 4 and a second portion located in the connection via. In the cross section shown in Figure 15, the second binding end 52 has an L-shaped shape. The second binding end 52 of the second binding electrode 5 is connected to the third portion 33 of the connection lead wire 3. The first binding end 51 of the second binding electrode 5 is a portion connected to the flexible circuit board, and the connection portion 53 of the second binding terminal 5 is a portion between the first binding end 51 and the second binding end 52. The connection portion 53 and the first binding end 51 both extend in a plane perpendicular to the third direction Z.

[0158] 15 , the first binding end 51 of the second binding electrode 5 and the first portion of the second binding end 52 both extend along the second direction Y. The sum of the dimensions of the first binding end 51 and the connection portion 53 of the second binding electrode 5 along the second direction Y is greater than the dimension of the second binding end 52 of the second binding electrode 5 along the second direction Y.

[0159] Illustratively, the display panel 10 further includes a plurality of connection structures 9, each configured to connect the first binding end 51 of the second binding electrode 5 and the third portion 33 of one connection lead wire 3. The connection structures 9 include an adhesive 91 and / or a bonding agent 92.

[0160] The position, shape, material, etc. of the connection structure 9 will be described below.

[0161] 9, 10, and 11, the connecting structure 9 includes an adhesive 91 configured to connect the second binding end 52 and the third portion 33 of the connecting lead 3. The second binding end 52 is located on the side of the third portion 33 of the connecting lead 3 connected thereto that faces away from the substrate 1. The adhesive 91 is disposed in the connecting via 41.

[0162] Since the adhesive 91 needs to be filled into the connection vias 41 on the electrode carrier plate 4, it must be fluid and able to harden after being filled into the connection vias 41 on the electrode carrier plate 4, thereby ensuring the stability of the connection between the second binding electrode 5 and the connection lead wire 3.

[0163] In some embodiments, the adhesive 91 includes a glue, and the glue colloid satisfies the binding resistance requirement. For example, the glue satisfies the requirement that the colloid does not deform or lose viscosity within 7 minutes at an ambient temperature of at least 200°C.

[0164] In some examples, the adhesive 91 is an insulating adhesive with good viscosity. In one possible design, the adhesive 91 is a curable liquid adhesive, and the thickness of the adhesive 91 after curing does not exceed the thickness of the second binding electrode 5. The thickness here refers to the dimension in the direction perpendicular to the display surface 1a of the substrate 1. The flow range of the adhesive 91 is less than 1 mm.

[0165] For example, if the orthogonal projection of connection via 41 on substrate 1 is circular, the radius of the orthogonal projection of connection via 41 on substrate 1 is R mm, and the center of the circular orthogonal projection of connection via 41 on substrate 1 is taken as the reference point, in a circle with the reference point as its center and a radius of (R+1) mm, the flow range of adhesive 91 being smaller than 1 mm means that the orthogonal projection of adhesive 91 on substrate 1 after hardening is within the circle of radius (R+1) mm.

[0166] It is understood that the above is an exemplary description for clearly explaining the flow range of the adhesive 91, and is not intended to limit the present disclosure. The shape of the orthogonal projection of the connection via 41 on the substrate 1 includes, but is not limited to, a circle, and may be an ellipse, a square, a polygon, or the like, as long as it is ensured that the flow range of the adhesive 91 after hardening does not exceed 1 mm from the edge of the connection via 41.

[0167] In some other examples, the glue is a conductive adhesive having good viscosity and conductivity. The orthogonal projection of the glue on the non-display surface 1b of the substrate 1 overlaps or nearly overlaps the orthogonal projection of the connection via 41 on the non-display surface 1b of the substrate 1, ensuring electrical connection between the second binding terminal 5 and the connection lead 3.

[0168] In one possible design, the glue is, for example, a silver adhesive.

[0169] It is understood that the electrical connection between the connecting lead wire 3 and the second binding electrode 5 may be achieved by direct contact, or may be achieved indirectly by the conductivity and adhesive properties of the adhesive 91.

[0170] In some embodiments, the adhesive 91 bonds the second binding end 52 of the second binding electrode 5 to the third portion 33 of the connecting lead wire 3, thereby maintaining a constant relative position between the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead wire 3 and ensuring a stable connection between the two.

[0171] In some other embodiments, an adhesive 91 with good electrical conductivity may be used to achieve electrical connection between the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead wire 3 by direct contact, or by indirect contact via the adhesive 91.

[0172] It is understood that whether the connection and conductivity between the second binding end 52 of the second binding electrode 5 and the third part 33 of the connecting lead wire 3 is achieved by direct contact or indirect conductivity by the adhesive 91, either can achieve effective conductivity between the second binding electrode 5 and the connecting lead wire 3, thereby ensuring that signals can be transmitted normally.

[0173] 9, 10, and 11, the cross section of the second binding electrode 5 is formed along the cutting line DD shown in FIG. 10 or the cutting line EE shown in FIG. 11, and the cross section of the second binding electrode 5 has an L-shaped shape. The connecting structure 9 includes an adhesive 92, which is disposed on the side of the second binding end 52 of the second binding electrode 5 away from the selected side 1cc of the substrate 1 and is configured to connect the electrode carrier plate 4 and the substrate 1. One side of the adhesive 92 is connected to the side of the electrode carrier plate 4 closer to the substrate 1, and the other side of the adhesive 92 faces the substrate 1.

[0174] Illustratively, the adhesive 92 is an insulating adhesive with good viscosity. In some examples, the adhesive 92 is a textured adhesive or a pressure-sensitive adhesive.

[0175] 9, the second binding end 52 of the second binding electrode 5 is located on the side of the third portion 33 of the connected connecting lead 3 that faces away from the substrate 1, and the bonding agent 92 is located between the electrode carrier plate 4 and the substrate 1. In a direction perpendicular to the electrode carrier plate 4 (e.g., the third direction Z shown in FIG. 9), the dimension f2 of the bonding agent 92 is the same as or approximately the same as the dimension f1 of the third portion 33 of the connecting lead 3.

[0176] In some embodiments, the thickness of the bonding agent 92 along the direction perpendicular to the non-display surface 1b of the substrate 1 is greater than 10 μm. The thickness of the bonding agent 92 along the direction perpendicular to the non-display surface 1b of the substrate 1 is, for example, 10 μm, 13 μm, or 17 μm.

[0177] The thickness of the adhesive 92 described herein is provided as one possible design only and is not intended to limit the dimensions of the adhesive 92 .

[0178] 9 , the adhesive 92 is disposed on the second binding end 52 of the second binding electrode 5 at a position on the side of the third portion 33 of the connected connecting lead 3 that faces away from the substrate 1. The distance between the adhesive 92 and the side of the connecting lead 3 facing the third portion 33 is equal to or greater than zero. That is, the adhesive 92 may or may not be in direct contact with the side of the connecting lead 3 facing the third portion 33.

[0179] As shown in Figure 9, at least a portion of the end of the third portion 33 of the connecting lead 3 that is away from the selected side 1cc of the substrate 1 is located between the electrode carrier plate 4 and the substrate 1, so in addition to the space occupied by the third portion 33 of the connecting lead 3, at least a gap area is generated in the portion between the electrode carrier plate 4 and the substrate 1. By installing the adhesive 92, the above-mentioned gap area is filled, thereby realizing a flat attachment of the electrode carrier plate 4 and further realizing a flat attachment of the second binding electrode 5, ensuring a stable and effective connection between the second binding electrode 5 and the connecting lead 3, and avoiding problems such as abnormal display of the display panel 10 due to abnormal transmission of control signals caused by the connection portion between the second binding electrode 3 and the connecting lead 3 being easily disconnected due to the large difference in distance between the side where the second binding electrode 3 and the connecting lead 3 are connected and the substrate 1.

[0180] For example, the orthogonal projection of the electrode carrier plate 4 on the substrate 1 partially overlaps with the orthogonal projection of the third portion 33 of the connecting lead 3 on the substrate 1, and the orthogonal projection of the bonding agent 92 on the substrate 1 does not overlap with the orthogonal projection of the third portion 33 of the connecting lead 3 on the substrate 1. It will be understood that the bonding agent 92 is provided on the side of the electrode carrier plate 4 closer to the substrate 1, other than the overlapping region between the second binding electrode 5 and the third portion 33 of the connecting lead 3.

[0181] It will be understood that providing the adhesive 92 ensures an effective and stable connection between the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead wire 3. By providing the adhesive 92, the electrode carrier plate 4 becomes parallel or approximately parallel to the surface facing the substrate 1, preventing a relatively large included angle from being formed between the electrode carrier plate 4 and the surface facing the substrate 1. This prevents an inability to achieve electrical connection due to the distance between the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead wire 3 exceeding a predetermined distance, for example, because the distance between the side of the electrode carrier plate 4 closer to the selected side 1 cc of the substrate 1 and the substrate 1 is greater than the distance between the side of the electrode carrier plate 4 away from the selected side 1 cc of the substrate 1 and the substrate 1.

[0182] When an electrode carrier plate 4 having a plurality of second binding electrodes 5 arranged thereon is placed on one side of the non-display surface 1b of the substrate 1, the second binding end 52 of each of the plurality of second binding electrodes 5 may pass through one connection via 41 to directly contact the third part 33 of one connection lead wire 3 to achieve electrical connection, or may make indirect contact via an adhesive 91 filled in the connection via 41 to achieve electrical connection.

[0183] When the second binding end 52 of the second binding electrode 5 is in direct contact with the third portion 33 of the connecting lead wire 3, the distance between them is zero. When the second binding end 52 of the second binding electrode 5 is in indirect contact with the third portion 33 of the connecting lead wire 3 through the adhesive 91, there is a certain distance between them. However, the adhesive 91 may be, for example, a conductive glue, and part of the adhesive 91 filled in the connecting via 41 on the electrode carrier plate 4 overflows toward one side of the substrate 1. After the adhesive 91 hardens, a stable connection is achieved between the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead wire 3.

[0184] It will be understood that providing the bonding agent 92 improves the connection stability between the electrode carrier plate 4 and the substrate 1. As shown in Figures 12, 13, and 14, the bonding agent 92 may include, for example, a plurality of long strips of bonding agent 92 arranged in parallel at intervals, or may have a network structure, or may be a single block structure. This increases the bonding area between the electrode carrier plate 4 and the substrate 1, making the connection therebetween more stable.

[0185] 15, 16, and 17, the cross section of the second binding electrode 5 is formed along the cutting line FF shown in FIG. 16 or the cutting line GG shown in FIG. 17, and the cross section of the second binding electrode 5 has a Z-shaped shape. The connecting structure 9 includes an adhesive 92, which is disposed on the side of the second binding end 52 of the second binding electrode 5 away from the selected side 1cc of the substrate 1 and is configured to connect the electrode carrier plate 4 and the substrate 1. One side of the adhesive 92 is connected to the side of the electrode carrier plate 4 closer to the substrate 1, and the other side of the adhesive 92 faces the substrate 1.

[0186] The first binding end 51 of the second binding electrode 5 is located on the side of the electrode carrier plate 4 that is away from the substrate 1, and the second binding end 52 of the second binding electrode 5 is located on the side of the electrode carrier plate 4 that is closer to the substrate 1. The first binding end 51 and the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead 3 all extend along the second direction Y.

[0187] The extension directions of the first binding end 51 and the second binding end 52 of the second binding electrode 5 and the third portion 33 of the connecting lead wire 3 described here refer to the extension directions of the entirety of these. That is, the entirety of any of the first binding end 51 and the second binding end 52 of the second binding electrode 5 or the third portion 33 of the connecting lead wire 3 may be linear or non-linear. For the specific shapes of the first binding end 51 and the second binding end 52 of the second binding electrode 5 or the third portion 33 of the connecting lead wire 3, please refer to the above description of the third portion 33 of the connecting lead wire 3 and the second binding electrode 5, and will not be repeated here.

[0188] 15, 18, 19, and 20, the bonding agent 92 is located between the electrode carrier plate 4 and the substrate 1. In a direction perpendicular to the electrode carrier plate 4, the dimension f2 of the bonding agent 92 is the same as or approximately the same as the dimension f3 of the first binding end 51 of the second binding electrode 5.

[0189] 18, 19, and 20, the bonding agent 92 may include, for example, a plurality of long strips of bonding agent 92 arranged in parallel at intervals, or may have a network structure, or may have a single block structure, thereby increasing the bonding area between the electrode carrier plate 4 and the substrate 1 and making the connection therebetween more stable.

[0190] For example, the orthogonal projection of the electrode carrier plate 4 on the substrate 1 does not overlap with the orthogonal projection of the third portion 33 of the connecting lead 3 on the substrate 1, and the orthogonal projection of the bonding agent 92 on the substrate 1 does not overlap with the orthogonal projection of the third portion 33 of the connecting lead 3 on the substrate 1. The bonding agent 92 is applied to a portion of the electrode carrier plate 4 on the side closer to the substrate 1, other than the region corresponding to the second binding end 52 of the second binding electrode 5 and the connecting via 41.

[0191] The function, effect, etc. of the bonding agent 92 are the same as those described above, and will not be repeated here.

[0192] In some embodiments, the multiple connection leads 3 are arranged in parallel at intervals along the first direction X, and the multiple second binding electrodes 5 are arranged in parallel at intervals along the first direction X. As shown in FIG. 21 , the display panel 10 further includes a conductive adhesive D, which is provided on the sides of the multiple connection leads 3 away from the non-display surface 1 b of the substrate 1 and is configured to connect the multiple second binding electrodes 5 to the multiple connection leads 3. The conductive adhesive D extends along the first direction X. A third portion 33 of each connection lead 3 located on one side of the non-display surface 1 b of the substrate 1 is electrically connected to one second binding electrode 5. The conductive adhesive D covers at least the portions where the multiple connection leads 3 and the multiple second binding electrodes 5 are connected.

[0193] Illustratively, the conductive adhesive D is, for example, ACF.

[0194] 21, the display panel 10 further includes an adhesive 92, which is located between the electrode carrier plate 4 and the substrate 1. In a direction perpendicular to the electrode carrier plate 4, the dimension f2 of the adhesive 92 is the same as the distance f4 between the surface of the conductive adhesive D facing away from the substrate 1 and the substrate 1.

[0195] Regarding the dimensional size, ratio, etc. between the second binding electrode 5 and the third part 33 of the connecting lead wire 3, the explanation of the dimensional relationship between the first binding electrode 2 and the first part 31 of the connecting lead wire 3 may be referred to, and will not be repeated here.

[0196] In some embodiments, the first binding electrodes 2 have the same size in the first direction X. In some other embodiments, the first binding electrodes 2 have different sizes in the first direction X.

[0197] In some embodiments, the second binding electrodes 5 have the same dimension in the first direction X. In some other embodiments, the second binding electrodes 5 have different dimensions in the first direction X.

[0198] In some embodiments, the first portions 31 of the connecting leads 3 have the same dimension in the first direction X. In some other embodiments, the first portions 31 of the connecting leads 3 have different dimensions in the first direction X.

[0199] In some embodiments, the third portions 33 of the connecting leads 3 have the same dimension in the first direction X. In some other embodiments, the third portions 33 of the connecting leads 3 have different dimensions in the first direction X.

[0200] 6, 9, and 15, the light-emitting element layer 6 includes a plurality of light-emitting elements 61, a plurality of pixel driving chips 62, and a protective film 63. It is understood that the pixel driving chips are used to provide driving signals to the light-emitting elements 61, but in some embodiments, the light-emitting element layer 6 does not have the pixel driving chips 62, and thin film transistors disposed in the driving circuit layer Q may be used to provide driving signals to the light-emitting elements 61, and the present disclosure is not limited thereto.

[0201] In some embodiments, as shown in FIGS. 2 and 3, the display panel 10 includes at least three color subpixels P, the multiple color subpixels including at least a first color subpixel, a second color subpixel, and a third color subpixel, and the first color, the second color, and the third color are three primary colors (e.g., red, green, and blue).

[0202] Exemplarily, each sub-pixel P includes at least one light-emitting element 61 .

[0203] 6, 9, and 15, the protective film 63 includes a portion that covers the plurality of light-emitting elements 61 and a portion that fills gaps between the plurality of light-emitting elements 61. Illustratively, the material of the protective film 63 may be black silica gel, black resin, or the like. The protective film 63 protects the plurality of light-emitting elements 61 in the light-emitting element layer 6 and can prevent the plurality of light-emitting elements 61 from being damaged in processes after the formation of the light-emitting elements 61.

[0204] Exemplarily, the light-emitting element 61 includes, but is not limited to, an OLED (Organic Light-Emitting Diode), a Mini LED (Mini Light-Emitting Diode), and a Micro LED (Micro Light-Emitting Diode).

[0205] In another aspect, there is provided a display device 100 comprising a display panel 10 provided according to any of the above-described embodiments.

[0206] The display device 100 may display moving images (e.g., video) or still images (e.g., still images), text or graphics, and may be any device. More specifically, it is anticipated that the described embodiments may be implemented in or associated with a variety of electronic devices. The various electronic devices include, but are not limited to, mobile phones, wireless devices, personal digital assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, video cameras, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automobile displays (e.g., odometer displays), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rear-view cameras in vehicles), electrophotography, electronic signs or instructions, projectors, architectural structures, and packaging and aesthetic structures (e.g., displays for displaying images of jewelry).

[0207] For example, the display device 100 may further include a frame and other electronic accessories, etc. Here, the display panel 10 may be installed in the frame, for example.

[0208] In another aspect, a splicing display device 100 is provided, comprising a display device 100 provided by any of the previous embodiments.

[0209] As shown in FIGS. 23 and 24, the splicing display device 1000 includes the display device 100 provided by a number of the above embodiments.

[0210] Illustratively, the plurality of display devices 100 in the splicing display device 1000 are arranged in an array.

[0211] Illustratively, as shown in FIGS. 23 and 24, the display device 100 is, for example, rectangular.

[0212] In the display panel 10, the multiple first binding electrodes 2 are arranged in parallel at intervals along the first direction X, and accordingly the multiple connection leads 3 are also arranged in parallel at intervals along the first direction X, and another direction parallel to the display surface of the display device 100 and perpendicular to the first direction X is referred to as the second direction Y. The display device 100 has multiple side surfaces, and hereinafter, of the multiple side surfaces of the display device 100, the side surface close to the first binding region BB1 of the substrate 1 is referred to as the selected side surface of the display device 100.

[0213] For example, as shown in FIG. 2, the substrate 1 includes a display area AA and two first binding areas BB1 located on opposite sides of the display area AA, and the display panel 10 includes two sets of first binding electrodes, each set of first binding electrodes including a plurality of first binding electrodes 2, and the two sets of first binding electrodes are respectively installed adjacent to the two first binding areas BB1 of the substrate 1.

[0214] 23, when splicing a plurality of display devices 100 each having the display panel 10 shown in FIG. 2, selected sides of two adjacent display devices 100 are both arranged along the first direction X, so that there is almost no splicing seam along the first direction X between two adjacent display devices 100 among the plurality of display devices 100 arranged in a row along the first direction X, and there is a splicing seam between two adjacent display devices 100 among the plurality of display devices 100 arranged in a row along the second direction Y. In other words, the dimension of the splicing seam between two adjacent display devices among the plurality of display devices 100 arranged in a row along the first direction X is smaller than the dimension of the splicing seam between two adjacent display devices 100 among the plurality of display devices 100 arranged in a row along the second direction Y.

[0215] However, since the dimension of the first binding region BB1 in the second direction Y is very small, when the splicing display device 1000 is actually viewed, the splicing seam between two adjacent display devices 100 is difficult to see within the viewing distance, which makes the display screen of the splicing display device 1000 more complete and can present a relatively good display effect.

[0216] For example, as shown in FIG. 3, the display panel 10 has a display area AA and a first binding area BB1 located on one side of the display area AA, and a plurality of first binding electrodes 2 are installed adjacent to the first binding area BB1 of the substrate 1.

[0217] 24, when splicing a plurality of display devices 100 each having the display panel 10 shown in FIG. 3, selected sides of two adjacent display devices 100 are both arranged along the first direction X, so that there is almost no splicing seam along the first direction X between two adjacent display devices 100 among the plurality of display devices 100 arranged in a row along the first direction X, and there is a splicing seam between two adjacent display devices 100 among the plurality of display devices 100 arranged in a row along the second direction Y. In other words, the dimension of the splicing seam between two adjacent display devices 100 among the plurality of display devices 100 arranged in a row along the first direction X is smaller than the dimension of the splicing seam between two adjacent display devices 100 among the plurality of display devices 100 arranged in a row along the second direction Y.

[0218] However, since the dimension of the first binding region BB1 in the second direction Y is very small, when the splicing display device 1000 is actually viewed, the splicing seam between two adjacent display devices 100 is difficult to see within the viewing distance, which makes the display screen of the splicing display device 1000 more complete and can present a relatively good display effect.

[0219] In another aspect, there is provided a method for manufacturing the display panel 10. As shown in Fig. 25, the method for manufacturing the display panel 10 includes the following steps.

[0220] S1, provide substrate 1;

[0221] Here, the substrate 1 includes a display surface 1a and a non-display surface 1b facing each other, and a plurality of side surfaces 1c connecting the display surface 1a and the non-display surface 1b, at least one of which is a selected side surface 1cc. The display surface 1a includes a first binding region BB1, and the non-display surface 1b includes a second binding region BB2, both of which are located close to and opposite the selected side surface 1cc.

[0222] S2, forming a plurality of first binding electrodes 2 arranged in parallel with a space therebetween.

[0223] As shown in FIGS. 2 and 3, a plurality of first binding electrodes 2 are disposed in the first binding region BB1.

[0224] S3, forming a plurality of connecting leads 3 arranged in parallel at intervals.

[0225] Here, as shown in Figures 6, 9, 15 and 21, each connecting lead wire 3 includes a first portion 31 located in the first binding region BB1, a second portion 32 located on one side of the selected side 1cc, and a third portion 33 located in the second binding region BB2, and the first portion 31 of each connecting lead wire 3 is connected to one first binding electrode 2.

[0226] S4: An electrode carrier plate 4 is provided, and a plurality of second binding electrodes 5 are formed on the electrode carrier plate 4 in parallel and spaced apart positions, as shown in FIGS. 10 to 14 and 16 to 20.

[0227] S5: An electrode carrier plate 4 having a plurality of second binding electrodes 5 arranged thereon is placed on one side of the non-display surface 1b of the substrate 1, and each second binding electrode 5 is connected to the third part 33 of one connecting lead wire 3.

[0228] As shown in FIGS. 6, 9, 15, and 21, the first binding region BB1 and the second binding region BB2 are disposed opposite each other, and both the first binding region BB1 and the second binding region BB2 extend along the first direction X.

[0229] In step S3, for example, a metal layer is first formed over the entire surface of the selected side 1cc of the substrate 1 by a three-dimensional sputtering and coating process, and then the metal layer is trimmed and patterned by laser etching, thereby forming a plurality of connecting leads 3 and realizing that the front wiring (e.g., the driving line layer Q) of the substrate 1 is bypassed to the back side via the selected side 1cc.

[0230] If the rear line length d2 of the connecting lead 3 is greater than the front line length d1, a longer line length must be laser-etched on the rear surface. That is, the third portion 33 of the connecting lead 3 located on one side of the non-display surface 1b of the substrate 1 is longer than the first portion 31 of the connecting lead 3 located on one side of the display surface 1a of the substrate 1. That is, in the rear surface etching process, the laser is irradiated into the front display area AA. As shown in FIG. 1, the laser is irradiated toward the substrate 1 along the "laser" direction, and the laser emitted from the rear side of the substrate 1 is irradiated into the display area AA. The remaining energy will damage the film layer in the display area AA, further affecting the characteristics of the light-emitting element and causing quality problems such as localized corrosion, poor reliability, and inability to light up.

[0231] The above fabrication processes, such as sputtering and coating processes and laser etching, are only illustrative and are not intended to limit the actual manufacturing process.

[0232] By adding step S4, a plurality of second binding electrodes 5 are added. As shown in FIGS. 4 and 5 , the plurality of second binding electrodes 5 replace the portion of the third portion 33 of the connecting lead 3 shown in FIG. 1 that extends into the region corresponding to the display area AA, and the plurality of second binding electrodes 5 are individually fabricated on the electrode carrier plate 4. In step S5, the plurality of second binding electrodes 5 and the electrode carrier plate 4 are connected to the plurality of connecting leads 3 as a whole and fixed to one side of the non-display surface 1 b of the substrate 1. It can be seen that the orthogonal projection of the third portion 33 of the connecting lead 3 on the substrate 1 does not overlap with the display area AA in the region corresponding to one side of the display surface 1 a of the substrate 1. Therefore, it can be understood that by using such a design, the problem of the laser passing through the substrate 1 and irradiating the film layer structure on the front side of the substrate 1 can be effectively avoided when forming the third portion 33 of the connecting lead 3 by laser etching.

[0233] In some embodiments, the plurality of second binding electrodes 5 disposed on the electrode carrier plate 4 are fabricated using, for example, a printing process.

[0234] Illustratively, the second binding electrode 5 is fabricated using, for example, 3D printing, screen printing, pad printing / transfer printing, or stencil printing.

[0235] It is understood that when the second binding electrode 5 is fabricated, for example, using a printing process, no laser is used in the fabrication process of the second binding electrode 5, so there is no need to use an electrode carrier plate 4, and the second binding electrode 5 can be fabricated directly on one side of the non-display surface 1b of the substrate 1, without affecting the film layer structure in the display area AA.

[0236] In some other embodiments, the second binding electrodes 5 are fabricated using processes such as sputtering and coating and laser etching, for example, by first forming a metal coating on the electrode carrier plate 4 through a sputtering and coating process, and then forming a conductive pattern on the metal coating through a laser etching process, the conductive pattern being, for example, a plurality of second binding electrodes.

[0237] The above are merely specific embodiments of the present disclosure, and the scope of protection of the present disclosure is not limited thereto. Any modifications or replacements that can be easily thought of by a person skilled in the art within the technical scope of the present disclosure are intended to be embraced within the technical scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be governed by the scope described in the claims.

Claims

1. A display panel, a substrate including a display surface and a non-display surface facing each other and a plurality of side surfaces connecting the display surface and the non-display surface, at least one side surface being a selected side surface, the display surface including a first binding region and the non-display surface including a second binding region, the first binding region and the second binding region both being disposed near and facing the selected side; a plurality of first binding electrodes disposed in parallel and spaced apart within the first binding region; a plurality of connecting leads arranged in parallel and spaced apart, each connecting lead including a first portion located in the first binding region, a second portion located on one side of the selected side, and a third portion located in a second binding region, each first portion of the connecting lead being electrically connected to one of the first binding electrodes; an electrode carrier plate disposed on one side of the non-display surface, the electrode carrier plate having a plurality of second binding electrodes disposed in parallel and spaced apart on a side of the electrode carrier plate facing away from the substrate, each second binding electrode being electrically connected to a third portion of one of the connecting lead wires; Equipped with Display panel.

2. The display panel includes: a plurality of connection pads located on the side of the plurality of second binding electrodes away from the substrate, the plurality of connection pads being arranged in parallel with a space therebetween, each of the connection pads being connected to one of the second binding electrodes and a third portion of one of the connection lead wires; The display panel according to claim 1 .

3. The material of the connection pad includes metal and conductive adhesive. The display panel according to claim 2 .

4. The shape of the connection pad as an orthogonal projection on the substrate includes a circle, an ellipse, a triangle, a star, a rectangle, a heart, and a trapezoid. The display panel according to claim 2 or 3.

5. The electrode carrier plate has a plurality of connecting vias arranged in parallel at intervals; the second binding electrode includes a first binding end and a second binding end, the first binding end of the second binding electrode being located on a side of the electrode carrier plate away from the substrate, and the second binding end of the second binding electrode being electrically connected to a third portion of one of the connecting leads through one connecting via; The display panel according to claim 1 .

6. the second binding end is located on a side of the third portion of the connected connecting lead that is away from the substrate; The display panel includes: and further comprising an adhesive disposed within the connection via and configured to connect the second binding end and a third portion of the connection lead. The display panel according to claim 5 .

7. The display panel includes: a bonding agent disposed on a side of the second binding end away from the selected side and configured to connect the electrode carrier plate and the substrate, one side of the bonding agent being connected to a side of the electrode carrier plate closer to the substrate and the other side of the bonding agent facing the substrate; the second binding end is located on a side of the third portion of the connected connecting lead wire that faces away from the substrate, the bonding agent is located between the electrode carrier plate and the substrate, and a dimension of the bonding agent in a direction perpendicular to the electrode carrier plate is the same as a dimension of the third portion of the connecting lead wire; 7. The display panel according to claim 5 or 6.

8. The bonding agent is an insulating adhesive. The display panel according to claim 7 .

9. the plurality of connection leads are arranged in parallel at intervals along a first direction, and the plurality of second binding electrodes are arranged in parallel at intervals along the first direction; The display panel includes: a conductive adhesive disposed on a side of the plurality of connecting leads away from the non-display surface and configured to connect the second binding electrode and the connecting leads, the conductive adhesive extending along a first direction; the conductive adhesive covers at least a portion where the connection lead wire and the second binding electrode are connected; The display panel according to claim 5 .

10. the material of the electrode carrier plate comprises an insulating material; The display panel according to any one of claims 1 to 9.

11. The material of the electrode carrier plate includes glass and polyimide film; The display panel according to claim 10.

12. the material of the first binding electrode includes a metal; the material of the connecting lead and the second binding electrode comprises a metal or a conductive metal colloid; The display panel according to any one of claims 1 to 11.

13. a material of the first binding electrode includes at least one of copper, titanium, aluminum, molybdenum, and a nickel alloy; the material of the connecting lead and the second binding electrode includes at least one of copper, titanium, aluminum, molybdenum, nickel alloy, and conductive silver adhesive; The display panel according to claim 12.

14. the second binding region extends along the first direction, the third portion of the connecting lead extends along a second direction, and the first direction intersects with the second direction; a dimension of the connection pad in the first direction that is greater than one-third of a dimension of the third portion of the connection lead wire connected to the connection pad in the first direction; The display panel according to any one of claims 1 to 4 and claims 10 to 13.

15. a sum of a dimension in the first direction of the third portion of the connection lead wire connected to the second binding electrode and a distance in the first direction between the third portions of the two adjacent connection leads is greater than a dimension of the connection pad along the first direction; The display panel according to claim 13.

16. a dimension of the connection pad in a direction perpendicular to the selected side surface is equal to or less than a distance between the selected side surface and a boundary of the second binding electrode connected to the connection pad on the substrate that is away from the selected side surface; The display panel according to any one of claims 1 to 4, 10, and 11 to 15.

17. The display panel includes: a flexible circuit board disposed on a side of the plurality of second binding electrodes that is away from the substrate; Each of the second binding electrodes extends along the second direction, the first binding end is configured to be electrically connected to the flexible circuit board, and the second binding end is configured to be electrically connected to a third portion of the connecting lead. The display panel according to any one of claims 1 to 16.

18. a portion of the second binding end connected to a third portion of the connecting lead overlaps; The sum of the dimension of the third portion of the connecting lead in a direction perpendicular to the selected side surface and the dimension of the second binding electrode in a direction perpendicular to the selected side surface is a distance equal to the sum of the distance between the boundary of the second binding electrode on the substrate away from the selected side surface and the selected side surface, and the dimension of the overlapping portion between the second binding end and the third portion of the connecting lead wire in a direction perpendicular to the selected side surface; The display panel according to any one of claims 1 to 17.

19. a dimension of the third portion of the connecting lead in a direction perpendicular to the selected side surface is equal to or less than a distance between the selected side surface and a boundary of the first binding electrode on the substrate that is away from the selected side surface; The display panel according to any one of claims 1 to 18.

20. a dimension of the first portion of the connection lead wire connected to the first binding electrode in a direction perpendicular to the extending direction of the first portion of the connection lead wire is 30% or more of a dimension of the first binding electrode in the direction perpendicular to the extending direction of the first portion of the connection lead wire; The display panel according to any one of claims 1 to 19.

21. a difference between a sum of a dimension of the first binding electrode in a direction perpendicular to the extension direction and a distance between the two adjacent first binding electrodes in a direction perpendicular to the extension direction and a distance between the first portions of the two adjacent connecting lead wires in a direction perpendicular to the extension direction is equal to or greater than a dimension of the first portions of the connecting lead wires connected to the first binding electrode in a direction perpendicular to the extension direction. The display panel according to claim 20.

22. A display panel according to any one of claims 1 to 21. Display device.

23. A display device according to claim 22, Splicing display device.

24. A method for manufacturing a display panel, comprising: providing a substrate, the substrate including opposing display and non-display surfaces and a plurality of side surfaces connecting the display and non-display surfaces, at least one of the plurality of side surfaces being a selected side surface, the display surface including a first binding region and the non-display surface including a second binding region, the first binding region and the second binding region both being disposed adjacent to and facing the selected side surface; forming a plurality of first binding electrodes arranged in parallel and spaced apart relation on one side of a display surface of the substrate, the plurality of first binding electrodes being located within the first binding region; forming a plurality of spaced-apart parallel connecting leads, each connecting lead including a first portion located in the first binding region, a second portion located on one side of the selected side, and a third portion located in the second binding region, the first portion of each connecting lead being connected to one first binding electrode; providing an electrode carrier plate and forming a plurality of second binding electrodes arranged in parallel and spaced apart relation on the electrode carrier plate; placing an electrode carrier plate on which the plurality of second binding electrodes are disposed on one side of the non-display surface, and connecting each second binding electrode to the third portion of one of the connecting lead wires; Including, A method for manufacturing a display panel.

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