Liquid supply device and substrate cleaning method

Abstract

The present invention proposes a liquid supply apparatus and a substrate cleaning method. The liquid supply apparatus has a nozzle, and the liquid inlet of the nozzle can employ a tangential liquid suction method to promote gas-liquid separation through centrifugal force. A plate-shaped or cylindrical separator can be provided above the liquid outlet of the nozzle, thereby suppressing the release of gas bubbles from the liquid outlet. The interior of the nozzle can employ a structure having an upper chamber and a lower chamber, with exhaust ports provided in both the upper and lower chambers for secondary exhaust. Liquid inlets are provided in both the upper and lower chambers, allowing the processing liquid to be mixed twice. This reduces the amount and rate of gas generation compared to mixing the processing liquid once. The liquid supply apparatus further includes a controller and a liquid level sensor. Based on a liquid level detection signal in the nozzle obtained from the liquid level sensor, the controller adjusts the opening of an adjustment valve on the nozzle's discharge line to maintain a stable liquid level in the nozzle. The above-described cleaning method helps reduce flow fluctuations when the liquid is supplied to the substrate from the nozzle, improving the uniformity and reliability of liquid processing.

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor devices, and more particularly to a liquid supply system and a method for cleaning a substrate. [Background technology]

[0002] Chip manufacturing processes have many cleaning steps for polymer removal. SPM (a mixture of H2SO4 and H2O2) is commonly used to remove polymers. The mixture of H2SO4 and H2O2 reacts quickly with organic residues on the wafer surface to form H2SO4, CO2, and H2O, forming Caro's acid, a very strong oxidizing agent that quickly removes organic residues on the wafer surface.

[0003] The temperature and volume ratio of SPM are the two main factors that determine the organic removal efficiency. In single-wafer SPM process, H2SO4 and H2O2 are usually mixed in the supply line, or H2SO4 and H2O2 are mixed in the supply nozzle to achieve higher reaction temperature and activity.

[0004] When exposed to high-temperature H2SO4, H2O2 decomposes and produces O2. The mixture of H2SO4 and H2O2 undergoes an exothermic reaction, and the temperature of the SPM after mixing typically reaches 180°C to 220°C. This causes part of the mixture to vaporize. The oxygen produced by the decomposition and the water vapor produced by high-temperature evaporation cause the sprayed SPM to carry gas masses, making the liquid more susceptible to scattering and affecting the stability and uniformity of the liquid supply. Summary of the Invention

[0005] An object of the present invention is to provide a liquid supply apparatus and a substrate cleaning method that solves the problems associated with conventional methods for achieving stable liquid supply of gas-containing liquid.

[0006] To achieve the above and other related objects, the present invention provides a liquid dispensing device including a nozzle having a cavity therein, the nozzle comprising: a liquid inlet for introducing liquid into the cavity; a liquid outlet provided at a lower portion of the cavity for discharging liquid from the cavity; an exhaust port provided at the top of the cavity for exhausting gas from the cavity; a cylindrical separation part provided above the liquid outlet and within the cavity, the separation part having a cylinder body with a plurality of inclined holes provided in the side wall, the plurality of inclined holes being inclined upward when viewed from the inside to the outside of the cylinder body, the bottom of the cylinder body being open and connected to the liquid outlet.

[0007] The present invention further provides another liquid supply device comprising a nozzle having a cavity therein, the nozzle comprising: a first liquid inlet tangential to a side wall of the cavity, allowing the first liquid to enter the nozzle of the cavity in a tangential direction; a second liquid inlet tangential to the side wall of the cavity, allowing the second liquid to enter the nozzle of the cavity in a tangential direction, and after entering the cavity, the first liquid and the second liquid rotate in the same direction; a liquid outlet provided at a lower portion of the cavity for discharging the mixture of the first liquid and the second liquid from the cavity; An exhaust port is provided at the top of the cavity for exhausting gas from the cavity.

[0008] The present invention further provides another liquid supply device comprising a nozzle having a cavity therein, the nozzle comprising: a mixture inlet tangential to a sidewall of the cavity for allowing a mixture of at least two liquids to enter a nozzle of the cavity in a tangential direction; a liquid outlet provided at a lower portion of the cavity for discharging the mixture from the cavity; An exhaust port is provided at the top of the cavity for exhausting gas from the cavity.

[0009] The present invention further provides another liquid supply device including a nozzle having an upper chamber and a lower chamber therein. The upper chamber comprises: an upper liquid inlet for introducing liquid into the upper chamber; an upper exhaust port provided at an upper portion of the upper chamber for discharging gas from the upper chamber; an upper liquid outlet provided between the upper chamber and the lower chamber and used to introduce liquid in the upper chamber into the lower chamber; The lower chamber comprises: a lower exhaust port provided at an upper portion of the lower chamber for exhausting gas from the lower chamber; and a lower liquid discharge port provided at a bottom of the lower chamber for discharging liquid from the lower chamber.

[0010] As described above, the present invention provides a liquid supply device that has the following beneficial effects. (1) A plate-shaped or cylindrical separator is provided above the liquid outlet of the gas-liquid separation nozzle. The cylindrical separator has a plurality of inclined holes in the side wall of the cylinder body, so that gas-liquid separation is achieved by the obstruction effect of the inclined holes when the liquid flows from the outside to the inside of the cylinder body. (2) The liquid suction port of the nozzle adopts a tangential liquid suction method, and centrifugal force is used to promote gas-liquid separation, so that the gas inside the nozzle is quickly discharged and stable liquid supply is realized. (3) Based on the liquid level detection signal from the liquid level sensor, the controller adjusts the opening of the adjustment valve on the nozzle's discharge line to maintain a stable liquid level in the nozzle, reducing flow fluctuations when the liquid is delivered from the nozzle to the substrate, improving the uniformity and reliability of liquid processing. (4) The inside of the nozzle has a structure with an upper chamber and a lower chamber, and exhaust ports are provided in both the upper chamber and the lower chamber to achieve secondary exhaust. (5) The nozzle has an internal structure with an upper chamber and a lower chamber, and both the upper and lower chambers are provided with liquid inlets, allowing the processing liquid to be mixed twice. Compared with mixing the processing liquid once, this reduces the amount and rate of gas generation, making it easier to remove bubbles. (6) The nozzle has an upper and lower chamber, and the exhaust port of the upper chamber is connected to a negative pressure generator. During the SPM cleaning process, the pressure in the upper chamber decreases after the upper chamber stops suctioning liquid, allowing the remaining liquid in the upper chamber to be slowly discharged to the lower chamber. This allows for a smooth transition from the H2SO4 and H2O2 mixture supply stage to the H2O2 supply stage, avoiding disruption of the liquid flow due to a sudden increase in the H2O2 concentration in the lower chamber. [Brief explanation of the drawings]

[0011] The features and performance of the present invention are further illustrated by the following embodiments and accompanying drawings. [Figure 1] FIG. 1 is a schematic diagram showing the overall structure of a substrate processing apparatus. [Figure 2] FIG. 2 is a schematic diagram showing the structure of the liquid supply device and nozzle according to the first embodiment of the present invention. [Figure 3] FIG. 3 shows an enlarged view of a portion of position A in FIG. [Figure 4] Figures 4(a) to 4(d) show schematic diagrams of different cylinder body structures. [Figure 5] FIG. 5 is a schematic diagram showing another liquid supply device and nozzle structure according to the first embodiment of the present invention. [Figure 6] 6(a) and 6(b) are schematic diagrams showing the structure of a liquid supply device and a nozzle according to a second embodiment of the present invention. [Figure 7] 7 is a schematic diagram showing the structure of a liquid supply device and a nozzle according to embodiment 3 of the present invention. The nozzle is substantially cylindrical and has a first liquid suction port and a second liquid suction port. [Figure 8] FIG. 8 shows a cross-sectional view taken along the line AA in FIG. [Figure 9] FIG. 9 shows a top view of a nozzle according to a third embodiment of the present invention. [Figure 10] FIG. 10 shows a three-dimensional cross-sectional view in the direction BB of FIG. 9, in which the separating portion is a plate-shaped separating portion. [Figure 11] FIG. 11 shows a three-dimensional cross-sectional view in the direction BB of FIG. 9, in which the separating portion is a cylindrical separating portion. [Figure 12] FIG. 12 is a schematic diagram showing the structure of another liquid supply device and nozzle according to the third embodiment of the present invention, in which the nozzle is substantially conical and has a plurality of mixed liquid suction ports. [Figure 13] FIG. 13 is a schematic diagram showing the structure of a liquid supply device and a nozzle according to a fourth embodiment of the present invention. [Figure 14] FIG. 14 is a schematic diagram showing the structure of another liquid supply device and nozzle according to the fourth embodiment of the present invention. [Figure 15] FIG. 15 is a schematic diagram showing the structure of another liquid supply device and nozzle according to the fourth embodiment of the present invention. [Figure 16] FIG. 16 is a schematic diagram showing the structure of another liquid supply device and nozzle according to the fourth embodiment of the present invention. [Figure 17] FIG. 17 is a schematic diagram showing the structure of a liquid supply device and a nozzle according to a fifth embodiment of the present invention. [Figure 18] FIG. 18 is a schematic diagram showing the structure of a liquid supply device and a nozzle according to a sixth embodiment of the present invention. [Figure 19] FIG. 19 shows a timing diagram of the on and off of the nozzle liquid inlet valve and the ratio of the mixed liquid inlets in the lower chamber in the fifth and sixth embodiments of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] By describing the embodiments of the present invention in terms of certain specific embodiments, those skilled in the art will readily understand other advantages and benefits of the present invention from the content disclosed herein. The present invention may be implemented or applied in a variety of other specific embodiments. The details of this specification may be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0013] Please refer to Figures 1 to 19. The drawings provided in the embodiments are merely schematic diagrams for explaining the basic concept of the present invention. The drawings show only components related to the present invention, and are not drawn according to the number, shape, or size of the components when implemented. The shape, number, and ratio of the components may be arbitrarily changed in actual implementation, and the arrangement of the components may be more complicated.

[0014] As shown in FIG. 1, a substrate processing apparatus 10 includes a chamber 11, a substrate holding device 12, and a liquid supply device 13. The substrate holding device 12 is disposed within the chamber 11 and is used to hold and rotate a substrate. The substrate holding device 12 typically includes a carrier table 121 for holding a substrate. A rotation shaft 122 is used to rotate the carrier table 121. A collection cup 123 for collecting a processing liquid is disposed around the carrier table 121. The liquid supply device 13 is provided to supply a processing liquid to a substrate for liquid processing of the substrate.

[0015] Commonly used processing liquids include SC-1, SC-2, DHF, SPM, and hot phosphoric acid solution. Among these, SPM and hot phosphoric acid solution typically contain gas during the liquid supply process. If the gas is not injected in a timely manner and is not discharged from the nozzle along with the processing liquid, the gas may splash the liquid, affecting the stability of the liquid supply. For liquid supply devices that supply processing liquids with a gas filler, the present invention improves the stability of liquid supply by modifying the nozzle structure of the liquid supply device to properly discharge the gas in the processing liquid before the processing liquid is supplied to the substrate. Liquid supply devices with different nozzle structures are described.

[0016] First embodiment 2 and 3, this embodiment provides a liquid supply device having a nozzle for supplying a processing liquid, such as SPM, filled with a gas that affects the stability of the fluid supply to a substrate. A cavity 101 is provided inside the nozzle, and the nozzle further has a liquid inlet 102 for introducing the liquid into the cavity 101. A liquid outlet 103 for discharging the liquid from the cavity 101 is provided at the bottom of the cavity 101. An exhaust port 104 for discharging gas from the cavity 101 is provided at the top of the cavity 101.

[0017] The liquid inlets 102 allow for the introduction of at least one type of liquid into the cavity 101. A separate liquid inlet may be provided for each type of liquid, or a mixture of at least two types of liquid may be introduced into the cavity 101 through a single liquid inlet.

[0018] In this embodiment, two types of liquids, a first liquid and a second liquid, are introduced into the cavity 101 using the liquid inlet 102. For example, the first liquid is H2O2 and the second liquid is H2SO4.

[0019] In the embodiment shown in FIG. 2 , a separate inlet is provided for each liquid. Specifically, the liquid inlet 102 has a first liquid inlet 1021 and a second liquid inlet 1022. The first liquid inlet 1021 is used to introduce the first liquid into the cavity 101, and the second liquid inlet 1022 is used to introduce the second liquid into the cavity 101. The first liquid and the second liquid are mixed in the cavity 101. In other embodiments, two or more separate liquid inlets may be provided for each type of liquid. For example, two or more first liquid inlets 1021 may be provided to introduce the first liquid into the cavity 101. Two or more second liquid inlets 1022 may be provided to introduce the second liquid into the cavity 101.

[0020] In the embodiment shown in FIG. 5, a mixture of at least two types of liquids is introduced into the cavity 101 through the liquid inlet. The liquid inlet 102 has a mixed liquid inlet 1023 for introducing a mixture of a first liquid and a second liquid into the cavity 101. FIG. 5 shows only one example and does not limit the number of mixed liquid inlets 1023. That is, two or more mixed liquid inlets 1023 may be provided. The first liquid and the second liquid may be mixed in a liquid supply line outside the nozzle, and then supplied to the cavity 101 of the nozzle. Furthermore, a mixer may be provided in the supply line, and the first liquid and the second liquid may be mixed in this mixer and supplied to the cavity 101 of the nozzle.

[0021] Depending on the requirements of the process, the liquid inlet 102 may be provided as both an individual liquid inlet for supplying one type of liquid and a liquid inlet for supplying a mixture of at least two types of liquids. For example, the liquid inlet 102 may simultaneously include a first liquid inlet 1021, a second liquid inlet 1022, and a mixed liquid inlet 1023.

[0022] A cylindrical separator 105 is disposed above the liquid outlet 103. The separator 105 is located within the cavity 101 and is used to achieve gas-liquid separation. Specifically, the separator 105 has a cylinder body 1051, and a plurality of inclined holes 1052 are formed in the sidewall of the cylinder body 1051. The bottom 1051b of the cylinder body 1051 is open and connected to the liquid outlet 103. When viewed from the inside to the outside of the cylinder body 1051, the inclined holes 1052 in the sidewall of the cylinder body 1051 are inclined upward, and the angle between the inclined holes 1052 and the vertical direction is 15° to 75°, for example, 30° to 60°. The shape of the cylinder body 1051 is not limited to the cylindrical shape shown in FIG. 2 but may also be conical, rectangular, or prismatic. In other words, the cross section of the cylinder body 1051 may be polygonal, rounded, elliptical, or any other shape, and is not particularly limited.

[0023] When the first and second liquids are supplied to the nozzle cavity 101, they first enter the outer region of the cylinder body 1051 and then enter the inside of the cylinder body 1051 through the inclined holes 1052 in the side wall of the cylinder body 1051. As the liquids flow into the inside of the cylinder body 1051 at a downward inclined angle along the inclined holes 1052, most of the gas rises upward due to the resistance of the inclined holes 1052 and cannot enter the inside of the cylinder body 1051. The gas escapes from the liquids through the exhaust port 104 and is discharged from the cavity 101. When gas-liquid separation is completed, the gas content in the mixture is reduced and the stability of liquid supply is improved.

[0024] Figure 3 shows an enlarged partial view of position A in Figure 2. A deflector surface 1011 is provided at the bottom of the cavity 101 in the nozzle, sloping downward toward the cylinder body 1051. Specifically, the deflector surface 1011 slopes downward toward the wall of the cylinder body 1051 along the wall of the nozzle. The lowest row of inclined holes 1052 in the cylinder body 1051 is connected to the lowest part of the deflector surface 1011 to prevent liquid from pooling in the nozzle.

[0025] The structure of the ceiling portion 1051a of the cylinder body 1051 may be changed as follows: Schematic diagrams of cylinder bodies having different ceiling portion structures are shown in Figures 4(a) to 4(d).

[0026] In FIG. 4(a), the ceiling portion 1051a of the cylinder body 1051 is sealed.

[0027] In Figure 4(b), the ceiling 1051a of the cylinder body 1051 is open. When some of the gas is forced into the inside of the cylinder body 1051 by the liquid, the gas inside the cylinder body 1051 is discharged upward from the opening in the ceiling 1051a and then discharged from the nozzle through the exhaust port 104. This further reduces the gas content in the mixture and improves the stability of the liquid supply.

[0028] 4(c), at least one through-hole 1053 is provided in the ceiling portion 1051a of the cylinder body 1051. Gas inside the cylinder body 1051 is discharged from the cylinder body 1051 through the through-hole 1053 in the ceiling portion 1051a of the cylinder body 1051, and is further discharged from the nozzle through the exhaust port 104.

[0029] In FIG. 4(c), a plurality of through-holes 1053 are provided in the ceiling portion 1051a of the cylinder body 1051, but these may be vertical through-holes 1053. In FIG. 4(d), a plurality of through-holes 1053 are provided in the ceiling portion 1051a of the cylinder body 1051. These through-holes 1053 are inclined toward the exhaust port 104, so that gas in the cylinder body 1051 is discharged through the through-holes 1053 and converges toward the exhaust port 104. This promotes the rapid discharge of air bubbles. In order to converge the gas in the cylinder body 1051 toward the exhaust port 104, the ceiling portion 1051a of the cylinder body 1051 may be formed in a herringbone or arch shape.

[0030] Second embodiment This embodiment presents a liquid supply device with reference to FIGS. 6(a) and 6(b). The difference between this embodiment and Embodiment 1 is that a buffer plate 106 is provided in the cavity 101 to block the liquid inlet 102, and there is a gap between the buffer plate 106 and the liquid inlet 102. As shown in FIG. 6(a), the buffer plate 106 may be provided near the liquid inlet 102. In this embodiment, the buffer plate 106 is provided between the cylinder body 1051 and the liquid inlet 102 to block the liquid inlet 102, blocking and buffering the liquid introduced through the liquid inlet 102, reducing the liquid flow rate and preventing gas-filled liquid from entering the cavity 101 and entering the cylinder body 1051 before being discharged through the liquid outlet 103. This reduces the gas content of the liquid discharged from the liquid outlet 103 and ensures stable liquid supply.

[0031] Furthermore, the buffer plate 106 not only blocks the liquid suction port 102, but also serves to restrict the flow direction of the liquid entering the cavity 101. In particular, as shown in FIG. 6(b), the buffer plate 106 is installed in the cavity 101 and blocks the liquid suction port 102. The buffer plate 106 is provided along the axial direction of the cylinder body 1051, and the liquid entering the cavity 101 from the liquid suction port 102 flows from bottom to top outside the cylinder body 1051 (see the arrows in FIG. 6(b)).

[0032] In the second embodiment, the same structures as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0033] Third embodiment 7 to 12, this embodiment provides a liquid supply device having a nozzle for supplying a processing liquid to a substrate surface. The processing liquid contains a gas such as SPM, which affects the stability of the liquid supply. The nozzle has a cavity 401 therein and further has a liquid inlet tangential to the sidewall of the cavity 401, allowing the liquid to enter the nozzle in a tangential direction. A liquid outlet 403 is provided at the bottom of the cavity 401 for discharging the liquid from the nozzle. An exhaust port 404 is provided at the top of the cavity 401 for discharging the gas from the nozzle.

[0034] The liquid inlets may introduce at least one type of liquid into cavity 401, each type of liquid may have its own liquid inlet, or a mixture of at least two types of liquid may be introduced into cavity 401 through a single liquid inlet.

[0035] In this embodiment, the liquid inlet is used to introduce two kinds of liquids, namely a first liquid and a second liquid, into the cavity 401. For example, the first liquid is H2O2 and the second liquid is H2SO4.

[0036] Two methods for configuring the liquid inlet are described below using an embodiment in which a first liquid and a second liquid are introduced into cavity 401.

[0037] Liquid suction port setting method 1 A separate liquid inlet is provided for each type of liquid, as shown in Figures 7 and 8. The liquid inlet has a first liquid inlet 4021 and a second liquid inlet 4022. The first liquid inlet 4021 is tangential to the side wall of the cavity 401, allowing the first liquid to enter the nozzle in a tangential direction. The second liquid inlet 4022 is tangential to the side wall of the cavity 401, allowing the second liquid to enter the nozzle in a tangential direction. As shown by the dashed arrows in Figure 8, the first and second liquids rotate in the same direction after entering the nozzle.

[0038] Liquid suction port setting method 2 12, a mixture of at least two liquids is introduced into cavity 401 through a liquid inlet. The liquid inlet has a mixed liquid inlet 4023 tangential to the sidewall of cavity 401, allowing the mixture of the first and second liquids to enter the nozzle tangentially. The first and second liquids may be mixed in a liquid supply line outside the nozzle before being supplied to nozzle cavity 401. Furthermore, a mixer may be provided in the supply line, and the first and second liquids may be mixed in the mixer before being supplied to nozzle cavity 401.

[0039] Furthermore, depending on process requirements, the liquid inlet may simultaneously include a first liquid inlet 4021, a second liquid inlet 4022, and a mixed liquid inlet 4023. In this embodiment, the liquid inlet adopts a tangential liquid suction method, in which the liquid enters the cavity 401 and rotates along the wall of the cavity 401. On the one hand, the tangential liquid suction method promotes better mixing of the first liquid and the second liquid. On the other hand, the centrifugal force generated by the rotational movement of the liquid can be used to achieve gas-liquid separation and reduce the gas content of the liquid discharged from the nozzle. The shape of the cavity 401 is approximately cylindrical (see FIG. 7) or approximately conical (see FIG. 12). The conical shape of the cavity 401 promotes the rotational movement of the liquid in the cavity 401, which is more conducive to gas-liquid separation.

[0040] The cavity 401 includes a separator located above the liquid outlet 403, which traps and separates air bubbles in the liquid, reducing the gas content in the liquid discharged from the nozzle. Figures 10 and 11 illustrate two separators with different structures, shown as a plate-shaped separator 405 and a cylindrical separator 406, and the structures of these two separators are described below respectively.

[0041] Plate-shaped separation part 405 As shown in FIG. 10 , the separation unit 405 is plate-shaped and includes a plate body 4051 disposed above the liquid outlet 403. The plate body 4051 is disposed at a distance from the liquid outlet 403 in the height direction. When viewed from above, the plate body 4051 at least partially blocks the liquid outlet 403, thereby playing a role in capturing and separating air bubbles trapped in the liquid and preventing the air bubbles from being discharged together with the liquid through the liquid outlet 403. In this embodiment, as shown in FIG. 8 , the plate body 4051 faces the liquid outlet 403 and completely covers it. A gap that functions as a flow path for liquid circulation exists between a part of the edge of the plate body 4051 and the inner wall of the cavity 401, allowing the liquid in the cavity 401 to bypass the plate body 4051 and be discharged through the liquid outlet 403.

[0042] Cylindrical separation section 406 As shown in FIG. 11, the separation section 406 has the shape of a cylinder including a cylinder body 1051. The sidewall of the cylinder body 1051 is provided with a plurality of inclined holes 1052. The bottom 1051b of the cylinder body 1051 is open and connected to the liquid outlet 403. The ceiling 1051a of the cylinder body 1051 may have a number of different configurations, as shown in FIGS. 4(a) to 4(d). The ceiling 1051a of the cylinder body 1051 may be sealed (see FIG. 4(a)) or open (see FIG. 4(b)). The ceiling 1051a of the cylinder body 1051 is provided with at least one through-hole 1053 (see FIGS. 4(c) and 4(d)). This through-hole is either a vertical hole or a through-hole 1053 inclined toward the exhaust port 404.

[0043] It is desirable that the ceiling of the cylinder body 1051 be located below the liquid suction port, thereby reducing interference between the cylinder body and the rotational movement of the liquid.

[0044] When the separation section is a cylindrical separation section 406, as shown in the partially enlarged view of FIG. 11 , a guide surface 4011 is provided at the bottom of the cavity 401 to prevent liquid from accumulating in the cavity 401. The guide surface 4011 is inclined downward toward the wall surface of the cylinder body 1051 along the nozzle wall, so that the guide surface 4011 can divert liquid accumulated at the bottom of the cavity 401 toward the base of the cylinder body 1051. The bottom row of inclined holes 1052 in the cylinder body 1051 is connected to the bottom of the guide surface 4011. When liquid flows to the base of the cylinder body 1051, it enters the inside of the cylinder body 1051 through the inclined holes 1052 and is discharged from the liquid outlet 403. This eliminates the problem of liquid remaining in the region of the cavity 401 outside the cylinder body 1051.

[0045] 7, to further stabilize the liquid supply, the liquid supply device includes a liquid level sensor 407, a discharge line 4041, and a controller. The liquid level sensor 407 is used to detect the liquid level in the nozzle cavity 401. The discharge line 4041 is connected to the exhaust port 404 to release gas from the cavity 401, and an adjustment valve 4042 is provided in the discharge line 4041. The controller is connected to the liquid level sensor 407 and the adjustment valve 4042 by signals, forming a closed-loop control to maintain the liquid level in the cavity 401 at a predetermined height. By stabilizing the liquid level in the nozzle at a predetermined height, the flow rate at the liquid discharge port 403 can be maintained approximately constant, resulting in better cleaning and etching results.

[0046] Specifically, when the liquid level sensor 407 detects that the liquid level in the cavity 401 is higher than a predetermined height and sends a signal to the controller, the controller sends an instruction to decrease the valve opening to the adjusting valve 4042. When the liquid level sensor 407 detects that the liquid level in the cavity 401 is lower than a predetermined height and sends a signal to the controller, the controller sends an instruction to the adjusting valve 4042 to increase the valve opening.

[0047] The liquid level sensor 407 may be a contact type liquid level sensor, such as a differential pressure type liquid level sensor or a float type liquid level sensor, fixedly disposed on the nozzle as shown in Fig. 7. The liquid level sensor 407 may also be a non-contact type liquid level sensor, such as an optical liquid level sensor or a capacitive liquid level sensor.

[0048] In one embodiment, the predetermined height of the liquid level in cavity 401 is set higher than the liquid inlet, so that fresh liquid supplied from the liquid inlet mixes with the existing liquid in cavity 401. This reduces fluctuations in the liquid level, contributes to maintaining a stable liquid level, and helps achieve a stable liquid supply.

[0049] In another embodiment, the predetermined height of the liquid level in the cavity 401 is set lower than the liquid inlet, so that the fresh liquid supplied from the liquid inlet enters the gas at the top of the cavity 401. Because some of the gas in the fresh liquid does not participate in the liquid phase, this part of the gas does not need to overcome the escape resistance at the gas-liquid interface, which contributes to separating the gas and the liquid and achieving a better pumping effect.

[0050] In a preferred embodiment, the predetermined liquid level in cavity 401 is controlled to be higher or lower than the liquid suction port. However, the predetermined height of the liquid level in cavity 401 is not limited and can be reasonably set in combination with the process, nozzle structure, and other parameters. For example, the predetermined height of the liquid level in cavity 401 can also be basically controlled to be approximately the same height as the liquid suction port.

[0051] Fourth embodiment 13 to 16, this embodiment proposes a liquid supply device having a nozzle and a controller. The nozzle is hollow and divided into an upper chamber 501 and a lower chamber 502. The structures of the upper chamber 501 and the lower chamber 502 will be described below with reference to the accompanying Figures 13 to 16.

[0052] Upper chamber 501 The upper chamber 501 is provided with an upper liquid suction port 5011 , an upper exhaust port 5012 , an upper liquid discharge port 5014 , and an upper liquid level sensor 5015 .

[0053] The upper liquid inlet 5011 is connected to a liquid supply line for introducing liquid into the upper chamber 501. The upper liquid inlet 5011 allows at least one type of liquid to be introduced into the upper chamber 501. A separate upper liquid inlet may be provided for each type of liquid, or a mixture of at least two types of liquid may be introduced into the upper chamber 501 through a single upper liquid inlet.

[0054] In this embodiment, two types of liquid, a first liquid and a second liquid, are introduced into the upper chamber 501 using the upper liquid inlet 5011. For example, the first liquid is H2O2 and the second liquid is H2SO4. Various methods for setting the upper liquid inlet 5011 will be described below with reference to Figures 13 to 15 using an example in which the first liquid and the second liquid are introduced into the upper chamber 501.

[0055] Upper liquid suction port 5011 setting method 1 As shown in FIG. 13, the upper liquid suction port 5011 has a first upper liquid suction port 50111 and a second upper liquid suction port 50112. The first upper liquid suction port 50111 and the second upper liquid suction port 50112 may be located at the same height or at different heights. In FIG. 13, the first upper liquid suction port 50111 is located at a higher position than the second upper liquid suction port 50112. In FIG. 14, the first upper liquid suction port 50111 and the second upper liquid suction port 50112 are located at the same height. In Method 1, the first liquid and the second liquid are suctioned independently, and a mixture of the first liquid and the second liquid is formed in the nozzle. This shortens the distance between the mixing position and the liquid outlet, reduces temperature loss, and enables higher reaction temperature and reaction activity.

[0056] The first upper liquid suction port 50111 is connected to a first liquid supply line S1 for introducing a first liquid such as H2O2 into the upper chamber 501. A first valve V1 is provided in the first liquid supply line S1 for switching the first liquid supply line S1 between supplying and stopping the supply of the first liquid.

[0057] The second upper liquid suction port 50112 is connected to a second liquid supply line S2 for introducing a second liquid such as H2SO4 into the upper chamber 501. The second liquid supply line S2 is provided with a second valve V2 for switching the second liquid supply line S2 between supplying and stopping the supply of the second liquid.

[0058] Upper liquid suction port 5011 setting method 2 As shown in FIG. 15 , the upper liquid suction port 5011 has a mixed liquid suction port 50113. The first liquid and the second liquid are mixed outside the nozzle and then enter the nozzle. Specifically, as shown in FIG. 15 , the mixed liquid suction port 50113 is connected to a liquid mixing line S3 for introducing the mixture of the first liquid and the second liquid into the upper chamber 501. The first liquid and the second liquid may be mixed in the liquid mixing line S3 and then supplied to the upper chamber 501. Furthermore, a mixer (not shown) may be disposed in the liquid mixing line S3, and the first liquid and the second liquid are mixed by the mixer before being supplied to the upper chamber 501. The liquid mixing line S3 includes a fourth valve V4 for switching on and off the supply of the mixture of the first liquid and the second liquid in the liquid mixing line S3.

[0059] Upper liquid suction port 5011 setting method 3 The upper liquid suction port 5011 may adopt a tangential liquid suction method based on Method 1 or Method 2. That is, the upper liquid suction port 5011 is disposed tangentially to the side wall of the upper chamber 501. When the first liquid and the second liquid enter the upper chamber 501 tangentially, the liquids undergo a rotational movement within the upper chamber 501. The centrifugal force can achieve a better mixing and exhaust effect.

[0060] 13 and 14, the first upper liquid suction port 50111 and the second upper liquid suction port 50112 are tangent to the side wall of the upper chamber 501. The first liquid and the second liquid respectively enter the upper chamber 501 in a tangential direction, and after entering the upper chamber 501, the first liquid and the second liquid rotate in the same direction. As another example, as shown in FIG. 15, the mixed liquid suction port 50113 is tangent to the side wall of the upper chamber 501, thereby causing the mixture of the first liquid and the second liquid to enter the upper chamber 501 in a tangential direction.

[0061] The upper exhaust port 5012 is provided at the top of the upper chamber 501 and is connected to the first discharge line L1 to discharge gas from the upper chamber 501. The first discharge line L1 is provided with an upper adjustment valve 5013, and the liquid level in the upper chamber 501 can be adjusted by changing the opening degree of the upper adjustment valve 5013.

[0062] The upper liquid level sensor 5015 is used to detect the liquid level in the upper chamber 501 and send a detection signal to the controller. The controller, the upper liquid level sensor 5015, and the upper regulating valve 5013 form a first closed-loop control for maintaining the liquid level in the upper chamber 501 at a predetermined height. Here, the upper liquid level sensor 5015 may be selected from a contact-type liquid level sensor or a non-contact-type liquid level sensor, but a non-contact-type liquid level sensor such as an optical liquid level sensor or a capacitive liquid level sensor is more preferable. As shown in Figures 13 to 16, the upper liquid level sensor 5015 is a non-contact-type liquid level sensor removably provided on one side of the nozzle.

[0063] The predetermined height of the liquid level in the upper chamber 501 is used as an input parameter that can be reasonably set according to process requirements and nozzle structure. In embodiment 1, the predetermined height of the liquid level in the upper chamber 501 is set higher than the upper liquid inlet 5011. Therefore, when fresh liquid supplied from the upper liquid inlet 5011 enters the upper chamber 501, the fresh liquid flows directly into the existing liquid in the upper chamber 501, contributing to maintaining a stable liquid level and realizing stable liquid supply. In another embodiment, the predetermined height of the liquid level in the upper chamber 501 is set lower than the upper liquid inlet 5011. Therefore, when fresh liquid supplied from the upper liquid inlet 5011 enters the upper chamber 501, the fresh liquid directly contacts the gas phase above the liquid level in the upper chamber 501. Because a portion of the gas generated in the fresh liquid does not participate in the liquid phase, this gas does not need to overcome the escape resistance at the gas-liquid interface. This is more favorable for gas-liquid separation and achieves a better pumping effect.

[0064] The upper liquid outlet 5014 is provided between the upper chamber 501 and the lower chamber 502 and is used to introduce a mixture of the first liquid and the second liquid in the upper chamber 501 into the lower chamber 502.

[0065] Lower chamber 502 13 to 16, the lower chamber 502 has a lower exhaust port 5022, a lower liquid outlet 5024, and a lower liquid level sensor 5025. The lower chamber 502 is located below the upper chamber 501, and the upper chamber 501 and the lower chamber 502 are connected via an upper liquid outlet 5014. A lower liquid outlet 5024 is provided at the bottom of the lower chamber 502, and the mixture of the first liquid and the second liquid is discharged from the lower chamber 502 for substrate processing.

[0066] The lower exhaust port 5022 is provided at the top of the lower chamber 502 and is connected to the second exhaust line L2 to discharge gas from the lower chamber 502. The second exhaust line L2 is provided with a lower adjustment valve 5023, and the liquid level in the lower chamber 502 can be adjusted by changing the opening degree of the lower adjustment valve 5023.

[0067] The lower liquid level sensor 5025 is used to detect the liquid level in the lower chamber 502 and send a detection signal to the controller. The controller, the lower liquid level sensor 5025, and the lower regulating valve 5023 form a second closed-loop control for maintaining the liquid level in the lower chamber 502 at a predetermined height. Similarly, the lower liquid level sensor 5025 may be selected from a contact-type liquid level sensor or a non-contact-type liquid level sensor, with the non-contact-type liquid level sensor being preferred. The predetermined height of the liquid level in the lower chamber 502 is used as an input parameter that can be reasonably set according to process requirements and nozzle structure.

[0068] In this embodiment, the nozzle employs a dual-chamber design that achieves two-stage exhaust, thereby achieving a better exhaust effect and more reliable and stable liquid supply. Specifically, when the first and second liquids are supplied to the upper chamber 501, some of the gas in the liquids is exhausted through the upper exhaust port 5012, completing the first exhaust. Subsequently, the mixture of the first and second liquids enters the lower chamber 502, and another portion of the gas in the liquids is exhausted through the lower exhaust port 5022, completing the second exhaust. These two exhausts significantly reduce the amount of gas exhausted from the liquids through the nozzle, achieving stable liquid supply.

[0069] Furthermore, at least one of the upper chamber 501 and the lower chamber 502 is provided with a separator. This separator is provided above a liquid outlet located in the chamber. The separator promotes gas-liquid separation on the one hand and prevents gas from being discharged through the liquid outlet of the corresponding chamber on the other hand. In this embodiment, the separator is either a plate-shaped separator 5031 or a cylindrical separator 5032, and separators of both structures will be described below. As shown in FIGS. 13 to 16 , the cylindrical separator 5032 is provided in the upper chamber 501, and the plate-shaped separator 5031 is provided in the lower chamber 502. It should be noted that the specific arrangement of the separators in the upper chamber 501 and the lower chamber 502 is not limited to the examples shown in FIGS. 13 to 16 . For example, both the upper and lower chambers may be provided with a cylindrical separator 5032. Alternatively, both the upper and lower chambers may be provided with a plate-shaped separator 5031. Alternatively, a cylindrical separator 5032 is provided in the upper chamber 501 and no separator is provided in the lower chamber 502 .

[0070] Plate-shaped separation part 5031 The plate-shaped separating portion 5031 has a plate 50311 provided above a liquid outlet located in the chamber. In this embodiment, as shown in Figures 13 to 16, the lower chamber 502 is provided with the plate-shaped separating portion 5031, and the plate 50311 is provided above the lower liquid outlet 5024 of the lower chamber 502. The plate 50311 is disposed at a distance in the height direction from the lower liquid outlet 5024, and when viewed from above, the plate 50311 at least partially blocks the lower liquid outlet 5024, thereby exerting a certain effect of capturing and separating air bubbles contained in the liquid and preventing the air bubbles from being discharged from the lower liquid outlet 5024 together with the liquid.

[0071] Cylindrical separation section 5032 The cylindrical separation section 5032 has a cylinder body 1051 shown in FIGS. 4(a) to 4(d). A plurality of inclined holes 1052 are formed in the side wall of the cylinder body 1051, and the bottom 1051b of the cylinder body 1051 is open and connected to the liquid outlet of the chamber in which the cylinder body 1051 is located. When viewed from the inside to the outside of the cylinder body 1051, the plurality of inclined holes 1052 are formed at an upward inclination. The angle between the inclined holes 1052 and the vertical direction is 15° to 75°, for example, 30° to 60°. When liquid flows from the outside of the cylinder body 1051 into the inside of the cylinder body 1051 through the inclined holes 1052, most of the gas floats upward due to the resistance of the inclined holes 1052 and does not enter the inside of the cylinder body 1051. After escaping from the liquid, the gas is discharged through the exhaust port of the chamber, thereby realizing gas-liquid separation and improving the stability of liquid supply.

[0072] 13 to 16, a diversion surface 501a is provided at the bottom of the chamber in which the cylinder body 1051 is disposed, and this diversion surface 501a is inclined downward toward the cylinder body 1051. The lowest row of inclined holes 1052 in the cylinder body 1051 is connected to the lowest part of the diversion surface 501a to prevent accumulation of liquid in the nozzle.

[0073] The ceiling 1051a of the cylinder body 1051 may have a number of different configurations, as shown in Figures 4(a) to 4(d). The ceiling 1051a of the cylinder body 1051 may be sealed (see Figure 4(a)), open (see Figure 4(b)), or have at least one through-hole 1053 (see Figures 4(c) and 4(d)). The through-hole 1053 may be either a vertical hole or a hole angled toward the exhaust port.

[0074] In this embodiment, as shown in FIGS. 13 to 16 , a cylindrical separator 5032 is provided in the upper chamber 501. The bottom 1051b of the cylinder body 1051 is open and connected to the upper liquid outlet 5014. A plate-shaped separator 5031 is provided in the lower chamber 502 above the lower liquid outlet 5024. The first and second liquids enter the upper chamber 501 through the upper liquid inlet 5011. Then, the mixture of the first and second liquids enters the inside of the cylinder body 1051 through a plurality of inclined holes 1052 in the side wall of the cylinder body 1051. During the process, the mixture flows downward along the inclined holes 1052 and enters the inside of the cylinder body 1051, and the gas trapped in the mixture floats upward and is discharged through the upper exhaust port 5012, completing the first discharge. The mixture flows from inside the cylinder body 1051 through the upper liquid outlet 5014 into the lower chamber 502, and then flows to the lower liquid outlet 5024. During the process, residual gas (or newly generated gas) trapped in the mixture is captured by the plate 50311 and moves backward relative to the mixture. The gas rises and is again exhausted through the lower exhaust port 5022, completing the second exhaust. The mixture is sprayed downward onto the surface of the substrate through the lower liquid outlet 5024.

[0075] 16, a buffer plate 5016 that blocks the upper liquid suction port 5011 is provided in the upper chamber 501. The buffer plate 5016 is positioned away from the upper liquid suction port 5011. The buffer plate 5016 can serve to buffer the first liquid and the second liquid that enter the upper chamber 501 through the upper liquid suction port 5011, thereby improving the stability and reliability of the liquid supply to the nozzle.

[0076] Fifth embodiment 17, this embodiment describes a liquid supply device different from that of the fourth embodiment in that the lower chamber 502 further includes a lower liquid suction port 5021 provided on a side wall of the lower chamber 502. The lower liquid suction port 5021 functions as a refill port and is connected to a third liquid supply line S3 for introducing liquids such as the first liquid and / or the second liquid. The third liquid supply line S3 is provided with a third valve V3 for switching the third liquid supply line S3 between supplying and stopping the supply of the first liquid and / or the second liquid. In this embodiment, the lower liquid suction port 5021 may be arranged tangentially to the side wall of the lower chamber 502 so that the first liquid and / or the second liquid enters the lower chamber 502 tangentially. Alternatively, in this embodiment, the upper chamber 501 and / or the lower chamber 502 may be provided with a buffer plate (not shown in FIG. 17) that blocks the liquid suction port of the corresponding chamber, and the buffer plate is arranged away from the liquid suction port of the corresponding chamber.

[0077] In the fifth embodiment, the same structures as those in the fourth embodiment are given the same reference numerals, and the description thereof will be omitted.

[0078] In embodiment 1, the first liquid is H2O2 and the second liquid is H2SO4, and the lower liquid inlet 5021 is used to introduce H2O2 into the lower chamber 502. During processing, H2SO4 and H2O2 need to be mixed in a predetermined ratio and supplied to the surface of the substrate to clean the substrate. In this embodiment, H2SO4 and H2O are supplied to the upper chamber 501 in a first ratio to obtain a premixed liquid of H2SO4 and H2O2 in a first ratio. The premixed liquid enters the lower chamber 502 and is mixed again with the H2O2 supplied to the lower chamber 502 to obtain a mixture of H2SO4 and H2O2 in a predetermined ratio. The mixture is then sprayed onto the surface of the substrate through the lower liquid outlet 5024.

[0079] This embodiment employs a double-mixing mode. Compared with the single-mixing mode, the double-mixing mode can reduce H2O2 consumption and bubble generation rate, and is more effective at expelling bubbles and reducing the gas content in the liquid sprayed from the nozzle. Furthermore, the double-mixing mode can increase the temperature of the mixture and the concentration of carboxylic acid, which helps achieve higher reaction temperature and reaction activity and improves etching efficiency.

[0080] Furthermore, in this embodiment, a second closed-loop control constituted by the controller, the lower liquid level sensor 5025, and the lower regulating valve 5023 maintains the liquid level in the lower chamber 502 at a predetermined height and sets this height as the predetermined liquid level in the upper chamber 501. The predetermined liquid level in the lower chamber 502 is used as an input parameter that can be reasonably set according to process requirements and nozzle structure. In this embodiment, the predetermined liquid level in the lower chamber 502 is set higher than the lower liquid suction port 5021. In another embodiment, the predetermined liquid level in the lower chamber 502 is set lower than the lower liquid suction port 5021. To balance exhaust efficiency and stable liquid supply, in one embodiment, the predetermined liquid level in the upper chamber 501 is set lower than the upper liquid suction port 5011, and the predetermined liquid level in the lower chamber 502 is set higher than the lower liquid suction port 5021.

[0081] The implementation of the SPM cleaning process for a substrate using the liquid supply device proposed in this embodiment will be described in detail with reference to Figure 17. SPM is a mixture of H2SO4 and H2O2.

[0082] Step S1, H2O2 pre-supply stage (pre-H2O2): The third valve V3 is turned on, and the first valve V1 and the second valve V2 are turned off. H2O2 is supplied to the lower chamber 502 of the nozzle, and H2O2 is supplied to the surface of the substrate to clean the substrate, and a stable liquid level in the lower chamber 502 is maintained. In response to the detection signal of the lower liquid level sensor 5025, the controller adjusts the opening of the lower adjustment valve 5023 to maintain a stable liquid level in the lower chamber 502. Step S2, SPM supply stage (SPM): The first valve V1, the second valve V2, and the third valve V3 are turned on, and H2SO4 and H2O2 are supplied to the upper chamber 501 of the nozzle on the one hand, and H2O2 is supplied to the lower chamber 502 of the nozzle on the other hand. The liquid levels in the upper chamber 501 and the lower chamber 502 are maintained at stable levels. The liquid in the upper chamber 501 is mixed with the liquid in the lower chamber 502 and then supplied to the surface of the substrate for cleaning. In response to the detection signal from the upper liquid level sensor 5015, the controller adjusts the opening of the upper adjustment valve 5013 to maintain the stability of the liquid level in the upper chamber 501. In response to the detection signal from the lower liquid level sensor 5025, the controller adjusts the opening of the lower adjustment valve 5023 to maintain the stability of the liquid level in the lower chamber 502. Step S3, post-H2O2 supply stage (post-H2O2): The first valve V1 and the second valve V2 are turned off, and the third valve V3 remains on. That is, the supply of H2SO4 and H2O2 from the upper chamber 501 of the nozzle is cut off, while H2O2 continues to be supplied to the lower chamber 502 of the nozzle. H2O2 is supplied to the surface of the substrate to replace the mixture of H2SO4 and H2O2 on the substrate surface. After the supply of H2SO4 and H2O2 to the upper chamber 501 is cut off, control of the liquid level in the upper chamber 501 is stopped while maintaining stability of the liquid level in the lower chamber 502 of the nozzle. At this time, the upper adjustment valve 5013 is normally in the on state. In response to the detection signal from the lower liquid level sensor 5025, the controller adjusts the opening of the lower adjustment valve 5023 to maintain stability of the liquid level in the lower chamber 502.

[0083] FIG. 19 shows a timing diagram of the nozzle liquid inlet valve operation during the SPM cleaning process and a timing diagram of the change in the ratio of the mixed liquid in the lower chamber 502. For clarity, the residual liquid depletion period is defined as the time from when the liquid inlet port is disconnected from the upper chamber 501 to when the upper chamber 501 is emptied of the remaining liquid. In FIG. 19, t0 is the time when the upper chamber 501 is disconnected from the liquid inlet port, at which point the first valve V1 and the second valve V2 are turned off. t1 is the time when the residual liquid in the upper chamber 501 is emptied without controlling the residual liquid discharge rate. The time t0 to t1 is the residual liquid depletion period during which the residual liquid discharge rate is not controlled. During this period, the concentrations of H2SO4 and HO2 in the lower chamber 502 are temporarily maintained at the same concentrations as during the SPM supply stage. This is indicated by the thick solid line from t0 to t1 in FIG. 19. After the residual liquid is drained from the upper chamber 501, the concentration of HO in the lower chamber 502 rapidly changes from the initial concentration (e.g., 33%) to 100% in a very short time. This is shown by the thick solid line from time t1 to t2 in Figure 19. Therefore, if no intervention is made to drain the residual liquid from the upper chamber 501, the concentration of HO in the lower chamber 502 may increase rapidly. If a large amount of gas is generated, the liquid may be sprayed from the nozzle all at once, and the liquid containing bubbles may collide with the surface of the substrate, causing splashing of the liquid or damage to the surface of the substrate.

[0084] Sixth embodiment As shown in FIG. 18 , this embodiment provides a liquid supply device that solves the problem mentioned in the fifth embodiment, in which the failure to control the discharge rate of residual liquid from the upper chamber 501 during the residual liquid deficiency period leads to liquid splashing and damage to the substrate surface. This embodiment differs from the fifth embodiment in that the liquid supply device also includes a suction line L4 connecting the upper exhaust port 5012 to a negative pressure generator that reduces the pressure in the upper chamber 501 after the upper chamber 501 is disconnected from the liquid inlet. The discharge rate of residual liquid from the upper chamber 501 to the lower chamber 502 is primarily affected by gravity and the pressure difference between the upper and lower chambers. Therefore, reducing the pressure in the upper chamber 501 increases the pressure difference between the upper and lower chambers, which increases the resistance to the descent of residual liquid in the upper chamber 501 and further reduces the discharge rate of residual liquid from the upper chamber 501 flowing to the lower chamber 502. A pressure detector P may be provided in the suction line L4 to detect the pressure in the upper chamber 501 in real time.

[0085] In FIG. 19, the time period from t0 to t3 is the residual liquid deficiency time period when the residual liquid discharge rate is controlled. The dashed line between t0 and t3 represents the relationship between the concentrations of H2SO4 and H2O2 in the lower chamber 502 when the residual liquid discharge rate is controlled over time. Δt1 is the time it takes for the H2O2 concentration to increase from the initial 33% to 100% when the residual liquid discharge rate from the upper chamber 501 is not controlled. Δt2 is the time it takes for the H2O2 concentration to increase from the initial 33% to 100% when the residual liquid discharge rate from the upper chamber 501 is controlled. Δt2 is longer than Δt1. In this embodiment, the residual liquid discharge time is extended by controlling the slow release of residual liquid from the upper chamber 501 to the lower chamber 502. By extending the time for the change in the concentration of H2O2, the change in the concentration of H2O2 in the lower chamber 502 becomes more gradual, and problems such as splashing of liquid caused by a sudden increase in the concentration of H2O2 are avoided.

[0086] The SPM cleaning process of a substrate using the liquid supply device proposed in this embodiment is detailed below: SPM is a mixture of H2SO4 and H2O2.

[0087] Step S1, H2O2 pre-supply stage (pre-H2O2): The third valve V3 is turned on, and the first valve V1 and the second valve V2 are turned off. When H2O2 is supplied to the lower chamber 502 of the nozzle, H2O2 is supplied to the surface of the substrate, thereby cleaning the substrate. At the same time, the controller adjusts the aperture of the lower adjustment valve 5023 in response to the detection signal of the lower liquid level sensor 5025, thereby maintaining the stability of the liquid level in the lower chamber 502.

[0088] Step S2, SPM supply stage (SPM): The first valve V1, the second valve V2, and the third valve V3 are turned on, and H2SO4 and H2O2 are supplied to the upper chamber 501 of the nozzle on the one hand, and H2O2 is supplied to the lower chamber 502 of the nozzle on the other hand. The liquid levels in the upper chamber 501 and the lower chamber 502 are maintained stable. The liquid in the upper chamber 501 is mixed with the liquid in the lower chamber 502. The mixture is then supplied to the surface of the substrate, and the substrate is cleaned. In response to the detection signal of the upper liquid level sensor 5015, the controller adjusts the opening of the upper adjustment valve 5013 to maintain the stability of the liquid level in the upper chamber 501. In response to the detection signal of the lower liquid level sensor 5025, the controller adjusts the opening of the lower adjustment valve 5023 to maintain the stability of the liquid level in the lower chamber 502.

[0089] Step S3, post-H2O2 supply stage (post-H2O2): The first valve V1 and the second valve V2 are turned off, and the third valve V3 remains on. That is, the supply of H2SO4 and H2O2 from the upper chamber 501 of the nozzle is cut off, and H2O2 continues to be supplied to the lower chamber 502 of the nozzle. H2O2 is supplied to the surface of the substrate to replace the mixture of H2SO4 and H2O2 on the substrate surface. At the same time, the opening of the lower adjustment valve 5023 is adjusted according to the detection signal of the lower liquid level sensor 5025 to maintain the stability of the liquid level in the lower chamber 502. Control of the liquid level in the upper chamber 501 is stopped. The upper adjustment valve 5013 is turned off, and the negative pressure generator is turned on to reduce the pressure in the upper chamber 501 and maintain it at a predetermined pressure. Compared to not controlling the discharge rate of the residual liquid in the upper chamber, controlling the pressure in the upper chamber 501 after cutting off the suction of liquid into the upper chamber 501 slows the rate at which the residual liquid in the upper chamber 501 descends, thereby extending the time for the concentration of the mixture in the lower chamber 502 to change. As shown in FIG. 19, the time for the concentration of H2O2 to change in the lower chamber changes from Δt1 to Δt2, thereby extending the time for the concentration of H2O2 to change in the lower chamber. This results in a more gradual change in the concentration of H2O2, which helps prevent liquid splashing and damage to the substrate surface caused by sudden changes in concentration, thereby reducing the cleaning effect.

[0090] Step S4, supply stop phase (end of process): The first valve V1, the second valve V2, and the third valve V3 are turned off. The control of the liquid level in the lower chamber 502 is stopped. The negative pressure generator is turned off. The pressure control of the upper chamber is stopped. The upper exhaust valve 5013 is turned off. The upper regulating valve 5013 and the lower regulating valve 5014 are normally maintained in the on state.

[0091] The above-described embodiments are merely for illustrating the principles and efficiency of the present invention and are not intended to limit the present invention. Those skilled in the art may modify or change the above-described embodiments without violating the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention are included in the scope of the claims of the present invention.

Claims

1. 1. A liquid supply device comprising a nozzle having a cavity therein, the nozzle comprising: a liquid inlet for introducing liquid into the cavity; a liquid outlet provided at a lower portion of the cavity for discharging liquid from the cavity; an exhaust port provided at the top of the cavity for exhausting gas from the cavity; a cylindrical separation part provided within the cavity above the liquid outlet, the separation part having a cylinder body with a plurality of inclined holes provided in the side wall, the plurality of inclined holes being inclined upward when viewed from the inside to the outside of the cylinder body, the separation part having an open bottom and connected to the liquid outlet.

2. 2. The liquid supply device according to claim 1, wherein the ceiling of the cylinder body is sealed, the ceiling of the cylinder body is open, or the ceiling of the cylinder body is provided with at least one through-hole.

3. 3. The liquid supply device of claim 2, wherein at least one through-hole is a vertical hole or is inclined towards the exhaust port.

4. The liquid inlet is a first liquid inlet for introducing a first liquid into the cavity; 10. The liquid supply apparatus of claim 1, further comprising: a second liquid inlet for introducing a second liquid into the cavity.

5. The liquid inlet is 2. The liquid supply device according to claim 1, further comprising a mixed liquid inlet for introducing a mixture of the first liquid and the second liquid into the cavity.

6. 2. The liquid supply device according to claim 1, further comprising a buffer plate provided in the cavity for blocking the liquid inlet, and a gap provided between the buffer plate and the liquid inlet.

7. 2. The liquid supply device according to claim 1, wherein a deflector surface is provided at the bottom of the cavity, the deflector surface being inclined downward toward the cylinder body, and the lowest row of inclined holes in the cylinder body are connected to the lowest part of the deflector surface.

8. 1. A liquid supply device comprising a nozzle having a cavity therein, the nozzle comprising: a first liquid inlet tangential to a side wall of the cavity, allowing the first liquid to enter the nozzle of the cavity in a tangential direction; a second liquid inlet tangential to the side wall of the cavity, allowing the second liquid to enter the nozzle of the cavity in a tangential direction, and after entering the cavity, the first liquid and the second liquid rotate in the same direction; a liquid outlet provided at a lower portion of the cavity for discharging the mixture of the first liquid and the second liquid from the cavity; An exhaust port is provided at the top of the cavity for exhausting gas from the cavity.

9. a liquid level sensor that detects the height of the liquid level in the cavity; an exhaust line connected to the exhaust port for releasing gas from the cavity, the exhaust line being provided with an adjustable valve; 9. The liquid supply system of claim 8, further comprising a controller signal-coupled to the liquid level sensor and the regulating valve to form a closed-loop control to maintain the liquid level in the cavity at a predetermined height.

10. 10. The liquid supply device according to claim 9, wherein the liquid level in the cavity is maintained at a position higher than the liquid inlet.

11. 10. The liquid supply device according to claim 9, wherein the liquid level in the cavity is maintained at a position lower than the liquid inlet.

12. 9. The liquid supply device of claim 8, wherein the nozzle further comprises a separation portion disposed within the cavity, the separation portion being located above the liquid outlet.

13. The liquid supply device according to claim 12 , wherein the separating portion is plate-shaped and has a plate body provided above the liquid discharge port.

14. 13. The liquid supply device according to claim 12, wherein the separation section has a cylindrical cylinder body having a plurality of inclined holes formed in a side wall, the plurality of inclined holes being formed at an upward incline when viewed from the inside to the outside of the cylinder body, and the bottom of the cylinder body is open and connected to the liquid discharge port.

15. 15. The liquid supply device according to claim 14, wherein the ceiling of the cylinder body is sealed, the ceiling of the cylinder body is open, or the ceiling of the cylinder body is provided with at least one through-hole.

16. 16. A liquid supply apparatus according to claim 15, wherein at least one through-hole is a vertical hole or is inclined towards the exhaust port.

17. 15. The liquid supply device according to claim 14, wherein the bottom of the cavity is provided with a deflector surface that slopes downward toward the cylinder body, and the lowest row of inclined holes in the cylinder body are connected to the lowest part of the deflector surface.

18. 1. A liquid supply device comprising a nozzle having a cavity therein, the nozzle comprising: a mixture inlet tangential to a sidewall of the cavity for allowing a mixture of at least two liquids to enter a nozzle of the cavity in a tangential direction; a liquid outlet provided at a lower portion of the cavity for discharging the mixture from the cavity; An exhaust port is provided at the top of the cavity for exhausting gas from the cavity.

19. a liquid level sensor that detects the height of the liquid level in the cavity; an exhaust line connected to the exhaust port for releasing gas from the cavity, the exhaust line being provided with an adjustable valve; 20. The liquid supply apparatus of claim 18, further comprising a controller signal-coupled to the liquid level sensor and the regulating valve to form a closed loop control to maintain the liquid level in the cavity at a predetermined height.

20. 20. The liquid supply apparatus of claim 19, wherein the liquid level in the cavity is maintained at a level higher than the liquid inlet.

21. 20. The liquid supply apparatus of claim 19, wherein the liquid level in the cavity is maintained at a level lower than the liquid inlet.

22. 20. The liquid supply device of claim 18, wherein the nozzle further comprises a separation portion disposed within the cavity, the separation portion being located between the mixed liquid inlet and the liquid outlet.

23. 23. The liquid supply device according to claim 22, wherein the separating portion is plate-shaped and has a plate body, and the plate body is provided above the liquid discharge port.

24. 23. The liquid supply device according to claim 22, wherein the separation section has a cylindrical cylinder body having a plurality of inclined holes formed in a side wall, the plurality of inclined holes being formed at an upward incline when viewed from the inside to the outside of the cylinder body, and the bottom of the cylinder body is open and connected to the liquid discharge port.

25. 25. The liquid supply device according to claim 24, wherein the ceiling of the cylinder body is sealed, the ceiling of the cylinder body is open, or the ceiling of the cylinder body is provided with at least one through-hole.

26. 26. A liquid supply apparatus according to claim 25, wherein at least one through-hole is a vertical hole or is angled towards the exhaust port.

27. 25. The liquid supply device of claim 24, wherein the bottom of the cavity is provided with a deflector surface that slopes downward toward the cylinder body, and the lowest row of sloped holes in the cylinder body are connected to the lowest part of the deflector surface.

28. 1. A liquid supply device comprising a nozzle having a cavity therein, the nozzle comprising: a liquid inlet tangential to a side wall of the cavity, which allows liquid to enter the nozzle of the cavity tangentially; a liquid outlet provided at a lower portion of the cavity for discharging liquid from the cavity; An exhaust port is provided at the top of the cavity for exhausting gas from the cavity.

29. 29. A liquid supply device according to claim 28, wherein the liquid comprises at least one type of liquid, and a liquid inlet port is provided for each type of liquid, or a mixture of at least two types of liquid is introduced into the cavity via the liquid inlets.

30. 1. A liquid supply device having a nozzle with an upper chamber and a lower chamber therein, The upper chamber comprises: an upper liquid inlet for introducing liquid into the upper chamber; an upper exhaust port provided at an upper portion of the upper chamber for discharging gas from the upper chamber; an upper liquid outlet provided between the upper chamber and the lower chamber and used to introduce liquid in the upper chamber into the lower chamber; The lower chamber is a lower exhaust port provided at an upper portion of the lower chamber for exhausting gas from the lower chamber; and a lower liquid discharge port provided at a bottom of the lower chamber for discharging liquid from the lower chamber.

31. The upper liquid inlet is a first upper liquid inlet for introducing a first liquid into the upper chamber; a second upper liquid inlet for introducing a second liquid into the upper chamber.

32. The upper liquid inlet is 31. A liquid supply apparatus according to claim 30, comprising a mixture inlet for introducing a mixture of the first liquid and the second liquid into the upper chamber.

33. 31. A liquid supply apparatus according to claim 30, wherein the upper liquid inlet is tangent to a side wall of the upper chamber such that liquid enters the upper chamber tangentially through the upper liquid inlet.

34. 31. A liquid supply device according to claim 30, wherein the upper chamber and / or the lower chamber has a separation portion located above the liquid outlet of the chamber having the separation portion.

35. 35. The liquid supply device according to claim 34, wherein the separator is plate-shaped and has a plate body, the plate body being provided above a liquid outlet of a chamber in which the plate is located.

36. 35. The liquid supply device of claim 34, wherein the separation portion has a cylindrical cylinder body having a plurality of inclined holes formed in a side wall, the plurality of inclined holes being formed at an upward incline when viewed from the inside to the outside of the cylinder body, and the bottom of the cylinder body is open and connected to a liquid outlet of a chamber in which the cylinder body is located.

37. 37. The liquid supply device according to claim 36, wherein the ceiling of the cylinder body is sealed, the ceiling of the cylinder body is open, or the ceiling of the cylinder body is provided with at least one through-hole.

38. 38. A liquid supply apparatus according to claim 37, wherein at least one through-hole is a vertical hole or is angled towards the exhaust port.

39. 37. A liquid supply device as described in claim 36, wherein a deflector surface is provided at the bottom of the chamber in which the cylinder body is located, the deflector surface being inclined downward toward the cylinder body, and the lowest row of inclined holes in the cylinder body being connected to the lowest part of the deflector surface.

40. 31. The liquid supply apparatus according to claim 30, wherein the upper chamber is provided with a buffer plate for blocking the upper liquid inlet, and a gap is provided between the buffer plate and the upper liquid inlet.

41. an upper liquid level sensor that detects the height of the liquid level in the upper chamber; an upper exhaust line connected to the upper exhaust port for releasing gas from the upper chamber, the upper exhaust line being provided with an adjustment valve; a lower liquid level sensor that detects the height of the liquid level in the lower chamber; a lower exhaust line connected to the lower exhaust port for releasing gas from the lower chamber, the lower exhaust line being provided with an adjustable valve; 31. The liquid supply apparatus of claim 30, further comprising: a controller signal-coupled to the upper liquid level sensor and the upper regulating valve to form a first closed loop control for maintaining the liquid level in the upper chamber at a predetermined height; and a controller signal-coupled to the lower liquid level sensor and the lower regulating valve to form a second closed loop control for maintaining the liquid level in the lower chamber at a predetermined height.

42. 42. The liquid supply apparatus of claim 41, wherein the lower chamber further comprises a lower liquid inlet for introducing liquid into the lower chamber.

43. 43. A liquid supply device as described in claim 42, wherein the upper chamber and / or the lower chamber is provided with a buffer plate for blocking the liquid inlet of the corresponding chamber, and a gap is provided between the buffer plate and the liquid inlet of the corresponding chamber.

44. 43. A liquid supply apparatus according to claim 42, wherein the upper liquid inlet is used to introduce the first liquid and the second liquid into the upper chamber, and the lower liquid inlet is used to introduce the first liquid into the lower chamber.

45. The first liquid is H ２ O ２ and the second liquid is H ２ SO ４ 45. A liquid supply device according to claim 44, wherein:

46. 43. A liquid supply apparatus according to claim 42, wherein the lower liquid inlet is tangent to a side wall of the lower chamber such that liquid enters the lower chamber tangentially through the lower liquid inlet.

47. The liquid level in the upper chamber is maintained at a level lower than the upper liquid inlet; 43. A liquid supply apparatus according to claim 42, wherein the liquid level in the lower chamber is maintained above the lower liquid inlet.

48. 43. A liquid supply apparatus according to claim 42, further comprising a suction line connecting the upper exhaust port to a negative pressure generator that reduces the pressure in the upper chamber after cutting off the liquid supply to the upper chamber.

49. 49. A method for cleaning a substrate, comprising: an SPM cleaning process performed on a substrate using the liquid supply apparatus according to claim 48, wherein the SPM is H ２ SO ４ and H ２ O ２ and the SPM cleaning step is H in the lower chamber of the nozzle ２ O ２ is supplied to the surface of the substrate, and H ２ O ２ to clean the substrate and maintain a stable liquid level in the lower chamber; ２ O ２ Step S1, which is a pre-supply stage; H ２ O ２ into the lower chamber of the nozzle while H ２ SO ４ and H ２ O ２ and step S2, an SPM supplying stage, in which the SPM is supplied to an upper chamber of the nozzle, maintaining a stable liquid level in the upper and lower chambers, mixing the liquids in the upper and lower chambers, and then supplying the mixture to the surface of the substrate to clean the substrate; H ２ SO ４ and H ２ O ２ The supply of H to the upper chamber of the nozzle is cut off, and the supply of H to the lower chamber of the nozzle is continued. ２ O ２ The liquid level in the lower chamber is kept stable, and H is applied to the surface of the substrate. ２ O ２ While supplying H ２ SO ４ and H ２ O ２ Remove the mixture of H ２ O ２ and step S3, which is a post-supply stage.

50. In step S3, H ２ SO ４ and H ２ O ２ 50. The substrate cleaning method of claim 49, wherein after shutting off the supply from the nozzle of the upper chamber, the control of the liquid level in the upper chamber is stopped while maintaining the stability of the liquid level in the lower chamber, and the upper adjustment valve is closed to reduce the pressure in the upper chamber to a predetermined pressure.

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