Chip mounting jig and chip mounting process

The chip mounting jig addresses the challenge of chip removal by incorporating wire grooves and magnetic attraction, enhancing the efficiency and precision of chip processing operations.

JP2025528581AActive Publication Date: 2025-08-28SHENZHEN GREPOW BATTERY CO LTD

Patent Information

Application Number
JP2025514686
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-09-23
Filing Date
2023-01-17
Publication Date
2025-08-28
Estimated Expiration
2043-01-17

AI Technical Summary

Technical Problem

Existing chip mounting jigs face difficulties in efficiently removing chips after processing due to their design, which complicates the removal process.

Method used

A chip mounting jig with uniformly distributed chip grooves, inwardly recessed wire grooves, and a stopper piece with magnetic attraction, along with solder paste grooves and needle grooves, facilitates easy chip removal by allowing external access through wire grooves and precise solder paste application.

Benefits of technology

Enables convenient and efficient removal of machined chips and improves the accuracy and quality of chip mounting by allowing precise solder paste application and needle insertion.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025528581000001_ABST
    Figure 2025528581000001_ABST
Patent Text Reader

Abstract

The present invention relates to a chip mounting jig, which comprises a jig body having uniformly distributed chip grooves for receiving chips, and wire grooves recessed inward at the locations of the chip grooves, the wire grooves extending to the outside of the chip grooves. The present invention facilitates the removal of chip products after processing and has a convenient operation method.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] The present invention relates to the technical field of chip jigs, and more particularly to chip mounting jigs. [Background technology]

[0002] During the chip processing process, pins must usually be attached to the chip. Therefore, a jig must be designed to attach the chip and pins. A typical jig has an upper and lower cover plate, which is used to secure the chip during processing. However, this jig presents a technical challenge: it is difficult to remove the chip after processing. Therefore, improvements are needed. Summary of the Invention [Problem to be solved by the invention]

[0003] The technical problem that the present invention aims to solve is to provide a chip mounting jig that solves the problems proposed in the background art, in contrast to the defects existing in the prior art. [Means for solving the problem]

[0004] In order to solve the above technical problems, the technical solutions adopted by the present invention are as follows:

[0005] A chip mounting jig includes a jig body, the jig body having uniformly distributed chip grooves for receiving chips, and wire grooves recessed inward at the positions of the chip grooves, the wire grooves extending to the outside of the chip grooves. Furthermore, the wire grooves between the chip grooves on the same straight line communicate with each other.

[0006] The jig further includes a stopper piece attached to the jig body, the stopper piece having one or more solder paste grooves that fit into the chip grooves.

[0007] Furthermore, there are two solder paste grooves corresponding to the position of the chip groove, and the two solder paste grooves are provided with a misalignment, and the two solder paste grooves form a pressing belt spanning the chip groove. Furthermore, the stopper piece is magnetically attracted to and fixed to the jig body by magnetic attraction.

[0008] The stopper jig further includes one or more needle grooves that fit into the tip grooves and into which straight needles or square needles are placed.

[0009] The chip mounting process includes the steps of placing the chip in the chip groove of the jig body, providing a magnetic member on the stopper piece, magnetically attaching the stopper piece to the jig body, applying solder paste to the pad surface of the chip through the solder paste groove of the stopper piece to form a solder paste belt, and pressing the chip with the pressing belt formed between the solder paste grooves, placing the stopper jig on the stopper piece, placing straight needles / square needles in the needle grooves to mount them on the solder paste belt, and removing the chip from the jig after the above operations are completed.

[0010] Furthermore, the straight or square needles are attached to the solder paste belt of the chip by surface mounting technology.

[0011] Furthermore, the step of arranging the straight needle / square needle in the needle groove and mounting it to the solder paste belt includes a step of designing the needle groove to have a structure that gradually opens its opening.

[0012] Furthermore, pins are provided at the four corners of the stopper jig, pin holes corresponding to the four corners of the stopper piece are provided, positioning pillars are provided at the four corners of the jig body, the pins of the stopper jig pass through the pin holes of the stopper piece and engage with and are fixed to the positioning pillars of the jig body, and one or more concave hand grooves are opened in the jig body. [Effects of the Invention]

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: By designing a wire groove at the position of the chip groove of the jig body, after the chip machining is completed, the machined chip can be removed from the chip groove position through the position of the wire groove with the help of an external object, which has the advantage of convenient removal operation. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a schematic diagram showing the structure of a chip mounting jig in the embodiment. [Figure 2] FIG. 2 is a schematic diagram of the structure of the jig body in the embodiment. [Figure 3] FIG. 3 is a schematic diagram of a partially enlarged structure of FIG. [Figure 4] FIG. 4 is a schematic diagram of the structure of the stopper piece in the embodiment. [Figure 5] FIG. 5 is a schematic diagram of a partially enlarged structure of FIG. [Figure 6] FIG. 6 is a schematic diagram showing the structure of the stopper jig in the embodiment. [Figure 7] FIG. 7 is a schematic diagram of a partially enlarged structure of FIG. [Figure 8] FIG. 8 is a schematic exploded view of the mounting jig according to the embodiment. [Figure 9] FIG. 9 is a structural schematic diagram of a chip product. DETAILED DESCRIPTION OF THE INVENTION

[0015] The present invention will now be described in more detail with reference to the drawings.

[0016] The embodiments described with reference to the drawings are merely illustrative for interpreting the present application and should not be understood as limiting the present application. It should be understood that in the description of the present application, the orientations or positional relationships indicated by terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. are orientations or positional relationships based on the drawings and are intended merely for the convenience and simplification of the description of the present application, and do not indicate or suggest that the devices or elements shown must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be understood as limiting the present application.

[0017] Additionally, the terms "first" and "second" are for descriptive purposes only and should not be understood as indicating or suggesting the relative importance or quantity of the indicated technical features. Thus, a feature qualified as "first" or "second" may explicitly or implicitly include one or more of the feature.

[0018] In the description of this application, unless otherwise clearly and specifically limited, "several" and "plurality" mean two or more than two. In this application, unless otherwise clearly defined and limited, the terms "attached," "coupled," "connected," "fixed," etc. should be understood broadly, and may refer to, for example, a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or internal communication between two elements.

[0019] Those skilled in the art will understand the specific meanings of the above terms in this application depending on the specific circumstances.

[0020] In this application, unless otherwise clearly defined and limited, a first feature being "above" or "below" a second feature may mean that the first feature and the second feature are in direct contact with each other, or may mean that the first feature and the second feature are not in direct contact with each other but are in contact with each other via another feature therebetween.

[0021] Furthermore, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above or diagonally above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below or diagonally below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0022] In view of the technical problems existing in the background art, a chip mounting jig is provided as shown in Figures 1 to 3, which includes a jig body 1, in which chip grooves 2 are provided that are uniformly distributed in an array for accommodating chips, and inwardly recessed wire grooves 3 are provided at the positions of the chip grooves 2, and the wire grooves 3 extend to the outside of the chip grooves 2.

[0023] In this embodiment, the chip groove 2 is recessed to a certain depth along the end face of the jig body 1, the depth of this recess being based on the thickness of the chip, and the chip grooves 2 are arranged on the jig body 1 so as to be distributed in an array. At the same time, the four corners of the chip groove 2 are designed to have rounded corners, thereby preventing the four corners of the chip from being damaged during processing.

[0024] To facilitate removal of the chips after machining, wire grooves 3 are designed at the positions of the chip grooves 2, and each chip groove 2 is designed with a wire groove 3, the length of the wire groove 3 extending to the outside of the chip groove 2. Alternatively, the wire grooves 3 between the chip grooves 2 on the same line can be connected.

[0025] 4 and 5, the chip mounting jig includes a stopper piece 4 attached to the jig body 1, and the stopper piece 4 is provided with one or more solder paste grooves 5 that fit into the chip grooves 2. The stopper piece 4 is used to apply solder paste to specific positions on the chip to form a solder paste belt, and is therefore added to improve the accuracy and quality of the solder paste application.

[0026] In the following embodiment, there are two solder paste grooves 5 corresponding to the position of the chip groove 2, and the two solder paste grooves 5 are arranged adjacent to each other and are offset from each other, i.e., the solder paste grooves 5 are arranged front to back with a certain distance between adjacent solder paste grooves 5. A pressing belt 6 is formed on the upper surface of the stopper piece 4, and during use, the pressing belt 6 is arranged across the chip groove 2, thereby applying pressure to the chip on the chip groove 2 and further fixing the chip in the chip groove 2.

[0027] The stopper piece 4 is magnetically attracted and fixed to the jig body 1 by magnetic attraction. A magnetic attraction structure can be designed on the stopper piece 4 and the jig body 1, and the stopper piece 4 can be quickly attached to the jig body 1 by magnetic attraction, improving work efficiency.

[0028] As shown in Figures 6 to 8, the chip mounting jig includes a stopper jig 7, which is provided with one or more needle grooves 8 that fit into the chip groove 2 and into which straight or square needles are placed.

[0029] In practice, the stopper jig 7 restricts the straight or square needle, and the needle groove 8 has a through structure. In use, the square or straight needle moves into the designated needle groove 8 through the action of surface mount technology (SMT), and the square or straight needle passes through the needle groove 8 to engage with the chip coated with solder paste below. As shown in FIG. 9, the chip product is produced in the above jig.

[0030] The following provides an actual operating process using the above-mentioned chip mounting jig, which includes a jig body 1, a stopper piece 4, and a stopper jig 7. The jig body 1, the stopper piece 4, and the stopper jig 7 have positioning holes drilled in their four corners, pins are provided in the four corners of the stopper jig 7, pin holes corresponding to the four corners of the stopper piece 4 are provided, positioning posts are provided in the four corners of the jig body 1, and the pins of the stopper jig 7 pass through the pin holes in the stopper piece 4 and engage with the positioning posts of the jig body 1 to be fixed.

[0031] A magnetic member having magnetic properties is attached to the jig body 1, and the stopper piece 4 can be engaged with the jig body 1 by magnetic fixation, and the jig body has four concave hand grooves to facilitate movement.

[0032] During use, the chip is placed in chip groove 2 on jig body 1, stopper piece 4 is magnetically attached to jig body 1, solder paste is applied to the chip pad surface through solder paste groove 5 in stopper piece 4 to form a solder paste belt, and pressure belt 6 formed between solder paste grooves 5 presses against the chip (since the solder paste belt for this chip includes two solder paste belts, two solder paste grooves 5 are required). Stopper jig 7 is then placed on stopper piece 4, and a straight or square needle is placed in needle groove 8 using surface mount technology (SMT) to adhere to the solder paste belt and complete the mounting. The completed chip is then removed from the jig. Needle groove 8 is designed to open gradually, making it easy to attach the straight or square needle.

[0033] The above operation process is different from the traditional mounting process, which allows for more accurate application of solder paste, more accurate mounting position, and improved overall quality of the processed chips.

[0034] The above does not limit the technical scope of the present invention, and any modifications, equivalent substitutions and alterations made to the above embodiments based on the technical essence of the present invention belong to the scope of the technical solutions of the present invention. [Explanation of symbols]

[0035] 1. Jig body, 2. Chip groove, 3. Wire groove, 4. Stopper piece, 5. Solder paste groove, 6.Pressing belt, 7.Stopper jig, 8. Needle groove, 9. Chip, 10. Square needle, 11. Straight needle.

Claims

1. A chip mounting jig comprising a jig body, the jig body having uniformly distributed chip grooves for accommodating chips, and inwardly recessed wire grooves formed at the positions of the chip grooves, the wire grooves extending to the outside of the chip grooves.

2. 2. The chip mounting jig according to claim 1, wherein the wire grooves between the chip grooves on the same straight line communicate with each other.

3. 2. The chip mounting jig according to claim 1, further comprising a stopper piece attached to the jig body, the stopper piece having one or more solder paste grooves that fit into the chip grooves.

4. 4. The chip mounting jig according to claim 3, wherein there are two solder paste grooves corresponding to the position of the chip groove, the two solder paste grooves being misaligned, and a pressure belt spanning the chip groove formed by the two solder paste grooves.

5. 5. The chip mounting jig according to claim 3, wherein the stopper piece is fixed to the jig body by magnetic attraction.

6. The chip mount jig according to any one of claims 1 to 4, further comprising a stopper jig, wherein the stopper jig is provided with one or more needle grooves that fit into the chip grooves and into which straight needles or square needles are placed.

7. A chip mounting process comprising: A chip mounting process comprising the steps of: placing a chip in the chip groove of a jig body; providing a magnetic member on a stopper piece, magnetically attaching the stopper piece to the jig body, applying solder paste to the pad surface of the chip through the solder paste groove of the stopper piece to form a solder paste belt, and pressing the chip with the pressure belt formed between the solder paste grooves; placing the stopper jig on the stopper piece, placing straight needles / square needles in the needle groove to mount it on the solder paste belt, and removing the chip from the jig after the above operation is completed.

8. The chip mounting process according to claim 7, wherein the straight or square needle is attached to the solder paste belt of the chip by surface mounting technology.

9. The chip mounting process of claim 7, wherein the step of arranging the straight needle / square needle in the needle groove and mounting it with the solder paste belt includes a step of designing the needle groove opening to have a structure that gradually opens.

10. 8. The chip mounting process according to claim 7, wherein the stopper jig has pins at four corners, the stopper piece has corresponding pin holes at four corners, the jig body has positioning posts at four corners, the pins of the stopper jig pass through the pin holes of the stopper piece to engage with and fix the positioning posts of the jig body, and the jig body has one or more recessed hand grooves.

Citation Information

Patent Citations

  • Chip ball-planting fixture

    CN201402800Y

  • Method for transporting and for manufacturing semiconductor device

    JP2005197628A

  • Method of transporting semiconductor device and method of manufacturing semiconductor device

    US20050147488A1

  • Solder ball mounting tool

    US20130140344A1

  • Tray to ship ceramic substrates and ceramic BGA packages

    US5957293A

Cited By

  • Method for Manufacturing an Intrabody Microneedle Assembly

    KR102969461B1